WO2012076166A1

WO2012076166A1 - Printed circuit board

Info

Publication number: WO2012076166A1
Application number: PCT/EP2011/006143
Authority: WO
Inventors: Markus Wille
Original assignee: Schoeller-Electronics Gmbh
Priority date: 2010-12-07
Filing date: 2011-12-07
Publication date: 2012-06-14
Also published as: DE202010016256U1; EP2649864A1

Abstract

The invention relates to a printed circuit board (1) having at least one rigid region (2) and at least one flexible region (3), having at least one rigid layer (6) laminated with copper (9) or provided with conductive tracks on one or both sides, and having at least one flexible layer (7) laminated with copper (9) or provided with conductive tracks on one or both sides, wherein the rigid layer (6) and the flexible layer (7) are connected to each other, wherein a rigid region of the printed circuit board (1) has at least one cut-out (12, 12', 12''), into which a molding (5) for dissipating heat losses is pressed.

Description

circuit board

The invention relates to a printed circuit board in which a derivative of heat loss is ensured, according to claim 1.

In the prior art printed electrical circuits are known in which rigid circuit boards are equipped with electronic components. Such printed circuit boards may consist of one or more individual layers of glass-fiber reinforced, cured epoxy resin plates which are copper-clad on one or both sides for the formation of printed conductors.

A printed circuit board is subjected to a high heat development because of the relatively high power loss of the electronic components arranged thereon. In the prior art printed circuit boards are known in which a heat-conducting element in the form of a metal body are provided, which is provided in a recess of the printed circuit board. Such a metal body usually consists of a bolt of copper or a comparable material, which has a good thermal conductivity. The heat conducting element provided in the printed circuit board ensures sufficient dissipation of the lost heat from the electronic components and thus prevents a critical temperature range for the components and the printed circuit board.

In the prior art, printed circuit boards, which have a heat conducting element as explained above, are known from DE 10 2004 036 960 A1, EP 1 276 357 A2, DE 195 32 992 A1 or also US Pat. No. 6,295,200 Bl. In this case, the heat-conducting element is accommodated in a recess or bore formed in the printed circuit board, and glued, soldered and / or pressed therein. The printed circuit boards according to the cited prior art have the disadvantage that they are usually rigid and thus are not flexible or adaptable in their spatial arrangement.

Also known in the prior art are so-called rigid-flexible circuit boards which have at least one rigid area and at least one flexible area. Such a printed circuit board is known, for example, from EP 0 408 773 B1 or DE 102 58 090 A1. Such rigid-flexible circuit boards are usually made up of superimposed rigid and flexible individual layers.

CONFIRMATION COPY which extend over the entire circuit and are glued together and pressed together with the aid of an adhesive film or with a flowable adhesive. The rigid individual layers form the respective rigid region of the printed circuit board. The flexible regions of the printed circuit boards result from the fact that at least some of the rigid individual layers are removed in these regions, wherein these flexible regions can consist of thin polyimide films, for example. In the flexible regions, for example, a copper layer or the like may be contained, by means of which an electrical connection of assemblies takes place.

In the case of rigid-flexible printed circuit boards, the reliability of electronic assemblies is increased because the electrical connection is made by the flexible layers of the rigid-flexible printed circuit board and thus plugs, cables and solder joints are avoided, which are often the cause of failures. Further, the flexible areas may mechanically and electrically interconnect a larger number of rigid printed circuit boards in a predetermined spatial arrangement without the need for power strips or wiring.

The rigid-flexible printed circuit boards have a more complex structure than conventional rigid printed circuit boards because of the flexible regions introduced therein. For this reason, it has hitherto not been known for rigid-flexible printed circuit boards to provide additional heat-conducting elements in order to be able to better derive the lost heat from electronic components.

Accordingly, the invention has for its object to provide a circuit board in which the dissipation of heat loss is improved.

This object is achieved by a printed circuit board having the features of claim 1 and by a printed circuit board having the features of claim 5. Advantageous developments of the invention are defined in the dependent claims.

A printed circuit board according to the invention comprises at least one rigid region and at least one flexible region, and at least one on one and both sides copper-clad or provided with conductor tracks rigid layer and at least a single-sided or double-sided copper-clad or provided with strip conductors flexible position, wherein the rigid layer and the flexible layer are interconnected. A rigid region of the printed circuit board has at least one recess into which a molded part for dissipating heat loss is pressed.

The invention is based on the essential finding that the molded part to dissipate heat losses can be introduced into the rigid region of the circuit board, namely in the recess provided therein. Due to the rigid position, the rigid area has sufficient strength so that the molding of the molded part is possible and reliable or secure fit of the molded part is ensured. The desired flexibility of the rigid-flexible circuit board in its flexible area is not affected by the provision of the molded part in the rigid area.

The pressing of a molded part in the rigid region of the circuit board can be inexpensively and in particular perform with short cycle times, resulting in low manufacturing costs. The molded part replaces conventional externally applied, fullfiächige heat sink, so that there are no restrictions in the assembly of the circuit board with at least one molding. The integration of the at least one molded part in the structure of the printed circuit board results in a greater reliability compared to externally mounted elements for heat dissipation. Furthermore, the pressing of the at least one molded part into the printed circuit board advantageously leads to a lower weight compared with the use of conventional heat sinks.

In an advantageous embodiment of the invention, the recess for the molded part may be in a range in which the circuit board has both at least one rigid layer and at least one flexible layer. In this case, the recess penetrates both the at least one rigid layer and the at least one flexible layer at least in part, or completely. The provision of the recess in the region of the printed circuit board in which both at least one rigid and at least one flexible layer are arranged expands the possibilities for attaching the molded article to the printed circuit board. In other words, the pressing of the molded part in a rigid area of the printed circuit board is also possible if the flexible layer is adjacent to the rigid layer. The increased spatial flexibility for attaching the molding on the Lei terplatte has the advantage of better adaptation to the position of respective electronic components on the circuit board, resulting in improved heat dissipation.

In an advantageous development of the invention, the pressed-in molded part can displace part of the flexible layer in the region of the recess. The pressure between the molded part and the recess can be increased by enclosing at least part of the flexible layer between an edge of the recess and the molded part when the molded part is pressed in. This results in an improved interference fit of the molded part in the recess, so that the use of additional adhesive, solder or the like is not necessary.

In an advantageous embodiment of the invention, the edge region of the recess may be at least partially provided with a metallization prior to the pressing of the molded part. In the same way, the edge region of the recess can be provided with a further metallization even after the molding has been pressed in. As a result, the adhesion between the printed circuit board and the molded part pressed in the recess is further improved because any possible detachment of parts of the printed circuit board (eg epoxy resin particles) is prevented by the metallization and the metallic layer produced thereby.

The molded part, which is intended to be pressed into the recess of the rigid area, may be made of any material which has a good thermal conductivity and has a suitable strength, so that the pressing into the recess is possible. For example, the molded part of copper or copper alloy, brass or brass alloys, or aluminum or aluminum alloys. Alternatively, the molded part can also consist of a non-metallic material, for example ceramic. In any case, it is important that the material used for the molding has a thermal conductivity that is greater than the thermal conductivity of the circuit board to ensure the desired dissipation of heat loss. In an advantageous embodiment of the invention, the molding can be configured substantially flat, wherein in the pressed state, an outwardly directed surface of the molded part can be aligned substantially parallel to the surface area of the circuit board associated with the recess. By flush closing the outwardly directed surface of the molded part with the adjacent thereto surface region of the circuit board, it is possible to equip the circuit board in the region of the molded part by means of SMD technology. The flush transition of the outwardly facing surface of the molding with the adjoining surface region of the printed circuit board makes it possible to coat the surface of the molding with the same end surface as is used in the remaining region of the printed circuit board.

The recess in the circuit board may be formed as a through hole, so that a height of the circuit board is completely penetrated by the recess. A pressed-in in such a recess molding can then complete to both outer layers of the circuit boards. In other words, the molded part in the pressed state has two outwardly directed surfaces, which can each be aligned parallel to the surface area of the printed circuit board assigned to the recess. This leads to the advantage that either an outer layer or optionally both outer layers of the circuit board can be equipped with components, for example, the type of SMD technology.

In an advantageous development of the invention, the molded part can protrude with at least one outwardly directed surface from a surface region of the printed circuit board assigned to the recess. In this way, the free surface of the molding is increased from the environment, so that a larger amount of heat loss can be derived.

In an advantageous embodiment of the invention, the molded part may have a substantially serrated or wavy outer contour. In the same way, the recess may have a substantially serrated or wavy inner contour, which is designed to be complementary to the outer contour of the molded part. The non-linear configuration of the outer contour of the molded part or the inner contour of the recess ensures that the contact surface between the molded part and the recess is larger than in the case of a linear profile of the outer or inner contour. Accordingly, this results in an improved introduction of the Molded part in the recess, since at least the adhesion between the molding and the recess is increased.

In an advantageous development of the invention, the connection between the molded part and the printed circuit board can be made such that the pressed-in molded part withstands an extrusion force of at least 30 N, preferably 100 N, and more preferably an extrusion force of at least 200 N. Such a firm connection can be achieved for example by the serrated or corrugated configuration of the outer contour of the molded part or the inner contour of the recess, and / or by metallizing the edge region of the recess before and / or after the pressing of the molded part.

In an advantageous development of the invention, the molded part can have at least one cavity on at least one outwardly directed surface. Such a cavity is suitable for mounting therein an electronic component or a semiconductor die. The cavity causes a positive connection between a surface of the circuit board and the component, so that in addition to a soldering of the component results in a better connection with the circuit board. Furthermore, an opening can be provided on the surface of the molded part. This opening serves in the same way as the cavity for mounting a component or the like. The opening may be part of a through hole, which passes through the molding in its height. In this case, the bore for passing a conduit, e.g. an RF line, serve.

In an advantageous embodiment of the invention, the molding may be provided on at least one outwardly directed surface with a predetermined geometric shape. In other words, the molded part is additionally provided on its upper side with a predetermined geometric body, for the purpose of improved heat dissipation to the surroundings of the printed circuit board.

A particularly good dissipation of heat loss results when the molding is adapted in size and shape to a connected to the circuit board component. In this case, the loss of heat generated by a component due to a small spatial distance to the molded part can pass directly to the molded part, so that subsequently the heat loss of the molding is derived to the outside. By adapting the molded part to the size and shape of a component no additional lateral space for the dissipation of the heat loss is taken from the components. Due to the high thermal conductivity of the molded parts no lateral heating of the circuit takes place. As a result, components can be arranged closer to each other without heating each other.

In an advantageous development of the invention, the molded part is pressed into the recess of the rigid region of the printed circuit board without the use of connecting means, in particular without adhesive. This means that the pressing of the molding into the recess is purely mechanical, so that the manufacturing process for the circuit board is inexpensive and can be done with fast cycle times.

In an advantageous embodiment of the invention, the recess may be formed flat, for example in the manner of a trough-shaped depression. As a result, a robust receptacle for the molded part is ensured within the recess, in addition to the pressure between the edge surfaces of the recess and the molding.

It is understood that the features mentioned above and those yet to be explained below can be used not only in the particular combination given, but also in other combinations or in isolation, without departing from the scope of the present invention.

The invention is illustrated schematically below with reference to preferred embodiments in the drawing and will be described in detail with reference to the drawings.

Show it:

1 is a plan view of a printed circuit board according to the invention with moldings pressed therein,

2 is a partial side cross-sectional view of a first embodiment of the circuit board according to the invention, 3 is a partial side cross-sectional view of a second embodiment of the inventive circuit board,

4 shows a lateral partial cross-sectional view of a third embodiment of the printed circuit board according to the invention,

5 is a perspective partial cross-sectional view of a fourth embodiment of the circuit board according to the invention,

Fig. 6 is a plan view of the circuit board according to the invention of Fig. 5 in

Area of a molding pressed in,

7 is a partial perspective cross-sectional view of a fifth embodiment of the circuit board according to the invention,

Fig. 8 is a partial side cross-sectional view of a sixth embodiment of the circuit board according to the invention, and

9-12 perspective views of molded parts, which are provided for a press-fitting into the printed circuit board according to the invention.

1 shows a plan view of a rigid-flexible printed circuit board 1. The printed circuit board 1 has two rigid regions 2, which are interconnected by a flexible region 3 arranged therebetween. At an edge region of the rigid areas 2 each electrical connections 4 are provided with which the circuit board can be contacted.

In the rigid areas 2 of the circuit board 1 molded parts 5 are pressed. The molded parts 5 serve to dissipate heat loss from components which are arranged on the printed circuit board 1. The mold parts 5 can have a different contour, for example square or round as shown in FIG. 1, or triangular, rectangular or in the form of a polygon (not shown in FIG. 1). In any case, the shape or contour of a molded part is adapted to an adjacent thereto component, so that a good dissipation of the heat loss is ensured by the components. FIGS. 2 to 8 each show different embodiments of the printed circuit board 1 according to the invention. These embodiments illustrate various possibilities according to which a molded part 5 is pressed into the printed circuit board 1.

The lateral partial cross-sectional view of Figure 2 illustrates that the circuit board 1 is constructed in the manner of a sandwich. The printed circuit board 1 comprises a rigid layer 6, which is connected to a flexible layer 7. The connection of the rigid layer 6 with the flexible layer 7 is carried out by a bonding layer 8, which may consist of an adhesive film, a tacky prepreg or a liquid or flowable adhesive. On their respective outer side, the rigid layer 6 and the flexible layer 7 with a copper lining

9 provided. The copper cladding 9 serves - as usual in the prior art - for the formation of conductor tracks, which can be connected to each other via (not shown) metallized holes.

The cross-sectional area of the printed circuit board 1 shown in FIG. 2 has two rigid areas 10 and a flexible area 11 arranged therebetween. The flexible region 1 1 is achieved in that in this section, the rigid layer 6, possibly in conjunction with the connecting layer 8, has been removed. The flexibility of the printed circuit board 1 in this section is thus ensured by the remaining flexible layer 7. The copper cladding 9 is dimensioned sufficiently thin, so that the flexibility of the printed circuit board 1 in the flexible region 1 1 is not impaired. In the adjacent rigid areas

10 causes the provision of the rigid layer 6, which superimposes the flexible layer 7, a structural rigidity of the circuit board first

In the rigid region 10 of the printed circuit board 1, a recess 12 is formed which extends from a surface of the printed circuit board 1 through the rigid layer 6 to the connecting layer 8. The recess 12 can be mechanically introduced into the rigid layer 6, for example by drilling, punching, milling or the like. In the recess 12, a molded part 5 is pressed, wherein a surface 13 of the molding 5 is flush with an adjoining surface region 14 of the circuit board 1. Thus, a device (not shown) may be applied to both the surface 13 of the molding 5 and the surface area 14 of the circuit board, for example by soldering or the like. Notwithstanding the illustration shown in Figure 2, it is also possible that the upferkaschierung 9 covers the surface 13 of the molding 5. This is the case when the molded part is pressed into the recess 12, before subsequently the copper cladding 9 is applied to the rigid layer 6.

The formation of the recess 12 in the rigid region 10 of the printed circuit board 1, d. H. at least in the rigid layer 6, causes an inner peripheral surface of the recess 12 has a sufficient dimensional stability and dimensional stability, so that the molded part 5 can be pressed into the recess 12. By choosing a suitable tolerance, i. H. an oversize between an outer diameter of the molding 5 and the inner diameter of the recess 12, a suitable interference between the molding 5 and the recess 12 is ensured, so that a tight fit of the molding 5 is achieved in the recess 12 and an automatic release of the molding. 5 from the recess 12 is not possible.

Figure 3 shows a partial cross-sectional view of a second embodiment of the circuit board according to the invention 1. The second embodiment corresponds in its construction largely the first embodiment of Figure 2, wherein the same features are each provided with the same reference numerals. With regard to the structure of this second embodiment of the circuit board 1, reference is made to the explanation of Figure 2 to avoid repetition. The second embodiment of the circuit board 1 of Figure 3 differs from the first embodiment of Figure 2 in that the recess 12 ^' extends not only through the rigid layer 6, but also through the connection layer 8 and partially through the flexible layer 7 therethrough. Corresponding to this, the molded part 5 has a greater length, namely in the direction of a height of the printed circuit board 1. The greater height and the associated larger volume of the molded part 5 lead to an improved dissipation of heat loss from the circuit board 1 to the environment.

FIG. 4 shows a third embodiment of the printed circuit board 1 in a partial cross-sectional view. The structure of the printed circuit board 1 of Figure 4 is identical except for the configuration of the recess 12 with the circuit boards of Figure 2 and Figure 3, wherein like features are provided with the same reference numerals. The third embodiment of Figure 4 differs from the previously described embodiments in that the recess 12 "is formed as a through hole over the entire height of the printed circuit board 1. This means that the recess 12" through all layers or layers of the Printed circuit board 1 extends therethrough, that is, by the respective outer copper cladding 9, the rigid layer 6, the flexible layer 7 and the connecting layer 8. The axial length of the molding 5 is adapted to a height or thickness of the printed circuit board 1, so that the molded part 5 passes through the recess 12 in its entire length. A secure fit of the molding 5 in the circuit board 1 is ensured by the interference fit in interaction with the rigid layer 6. The two outer surfaces 13 of the molded part 5 are flush with the adjoining surface region 14 of a respective outer side of the printed circuit board 1 from. Accordingly, an attachment of components on both sides of the circuit board 1 in the region of the molded part 5 and its outwardly directed surface 13 is possible.

The pressing of the molding 5 in the recess can be made from the direction of the arrow A (Fig. 4), wherein the molding 5 is first passed through the rigid layer 6 and then through the flexible layer 7. The tight fit of the molded part in the printed circuit board 1 is effected by the bond between the molded part 5 and the recess 12 "in the (vertical) region of the rigid layer 6.

In the manufacture of the printed circuit board 1, the molded part 5 can be introduced into the recess 12 also from the direction of the arrow B (FIG. 4). This means that when inserted into the recess 12 ", the molded part 5 first penetrates the flexible layer 7 before the molded part 5 subsequently penetrates the bonding layer 8 and the rigid layer 6. When passing the molding 5 first through the flexible layer 7 and then through the rigid layer 6 particles can be detached from the flexible layer 7 and / or from the bonding layer 8, so that these particles are deposited between an edge surface of the recess 12 in the region of the rigid layer 6 and an outer peripheral surface of the molding 5. Stated another way parts of the flexible layer, ie the flexible layer 7 and / or the bonding layer 8, may be enclosed between an edge of the recess 12 "and the molded part 5 when the molded part is pressed in. As a result, the pressure between the molded part 5 and the savings 12 "increases in the area of the rigid layer 6, which causes an even firmer fit of the molding 5.

Figure 5 shows a fourth embodiment of the circuit board 1 according to the invention in a cutaway partial perspective view. Compared to the aforementioned embodiments, the same features are provided with the same reference numerals. The perspective view of Figure 5 illustrates that the recess 12 ", which also extends here over the entire height of the circuit board 1, has a corrugated inner contour 15. In addition, the recess 12" in the region of its inner contour 15 and in the edge regions adjacent to the outer surface region 14 of the circuit board 1 is provided with a metallization 16 which can be applied by a known electrochemical process. Such a metallization 16 increases the strength of the recess 12 "in the region of its inner contour 15 and at its edge regions, which leads to a better adhesion with the molded part 5 pressed into the recess 12. In addition, such a metallization enhances the adhesive bond between the molded part 5 and a The metallization 16 further prevents breakage of particles from the rigid layer 6 and improves the dimensional stability of the inner circumference of the recess 12 "in the region of the connecting layer 8 and the flexible layer 7. This gives the inner contour 15 of the recess 12th "a uniform inside diameter with a precise tolerance.

In the embodiment according to FIG. 5, an outer contour 17 of the molded part 5 is substantially smooth. The arrow shown in Figure 5 illustrates the direction of a pressing of the molding 5 in the recess 12. The molding 5 penetrates first the recess 12 "in the region of the rigid layer 6, wherein during further pressing of the molding 5, the recess 12" in the area flexible layer 7 is penetrated.

Figure 6 shows a plan view of the recess 12 according to the embodiment of Figure 5, when the molding 5 is completely pressed therein. Clearly visible is the corrugated inner contour 15 of the recess 12, which comes with their respective tips in contact with the smooth outer contour 17 of the molding 5. Furthermore, it is made clear by FIG. 5 that the recess 12 is provided with the metallization 16 along its edge region. FIG. 7 shows a fifth embodiment of the printed circuit board 1 in a perspective view, similar to FIG. 5. In contrast to the embodiment of FIG. 5, the inner contour 15 of the recess 12 "is smooth in the embodiment according to FIG. 7, the outer contour 17 of the molded part 5 being smooth In the pressed-in state of the molded part 5, the same effect results as in the embodiment according to FIG 5, namely an improved Haftsehl uss between the molding 5 and the recess 12 ". In the embodiment according to FIG. 7, the recess 12 "is likewise provided with a metallization 16, to the advantages of which reference is made to the explanations of FIG. 5 in order to avoid repetition.

In a modification of the embodiments according to Figure 5 and Figure 7, it is possible in another embodiment (not shown), both the inner contour 15 of the recess 12 and the outer contour 17 of the molding 5 each corrugated form. As an alternative to a wavy contour, a serrated contour is also possible. It is also expedient to form the corrugated or serrated inner contour 15 complementary to the corrugated or serrated outer contour 17. This results in an enlarged contact surface between the recess 12 and the molded part 5 pressed therein, which leads to an improved adhesion.

FIG. 8 shows a sixth embodiment of the printed circuit board 1 in a partial cross-sectional view. The structure of this embodiment of the circuit board 1 differs from the previous embodiments. Specifically, in a rigid region 10, two superposed rigid layers 6 are provided, which are interconnected by an adhesive film 8 or the like. The superposition of the rigid layers 6 forms the rigid region 10 of the circuit board 1. 8, the recess 12 "is formed approximately centrally in the rigid region 10 and extends over the entire height of the printed circuit board 1 in the same way as in the embodiments according to FIGS. 4-6 "provided at its edge region with a metallization 16. After the recess 12 has been provided with the metallization 16, the molding 5, as shown in Figure 8, can be in the recess 12 "press. In the embodiment according to FIG. 8, the flexible region 11 is shown on the left in the illustration. For this purpose, the rigid individual layers 6 are separated, so that the printed circuit board 1 from this point only consists of the flexible layer 7 and a copper layer 18 grounded or received therein. By removing the rigid individual layers 6, the flexible region 1 1 is correspondingly flexible or elastic. Not shown in FIG. 8 is a transition of the flexible region 11 to a renewed rigid region 10, in which the flexible layer 7 is then enclosed at the top and bottom by a respective rigid layer 6.

With regard to the embodiments of the printed circuit board 1 according to FIGS. 2-7, it is understood that in the same way as in the embodiment according to FIG. 8 adjacent to or within the connecting layer 8, a copper layer or the like can be accommodated, by means of which an electrical connection of components takes place , Such a copper layer is dimensioned sufficiently thin so that the flexibility or flexibility of the flexible portion 3 of the printed circuit board 1 is not impaired.

With regard to all of the abovementioned embodiments of the circuit board 1 according to the invention, it will be understood that metallization of the edge region of the recess is possible even after the molding 5 has been pressed in, whereby the adhesion between the circuit board and the molded part pressed therein is further improved. Furthermore, with regard to the embodiments of the printed circuit board 1 according to FIGS. 2-4, it is understood that the recess 12, 12 'or 12 "can likewise be provided with a metallization, as explained with respect to the embodiment of FIG. 5.

FIGS. 9-12 show various molded parts which can be pressed into a recess 12, 12 ^' , 12 ^"of a printed circuit board 1.

Figure 9 shows a perspective view of a molded part 5, the outer contour 17 is formed wavy. Such a molded part 5 can be pressed into the recess 12 "in the same way as explained with reference to Figure 7. The surface 13 of the molded part has a planar or smooth design and can be flush with the surface region 14 of the printed circuit board 1 in the pressed-in state. FIG. 10 shows an alternative shaped part 5 for pressing into a recess 12 of the printed circuit board 1. This molded part 5 likewise has a corrugated outer contour 17. In contrast to the molding according to FIG. 9, the molding of FIG. 10 has a cavity 19 in a central area. The cavity 19 is provided for mounting at least one component or for direct mounting of at least one chip. Thus, a component or a chip can be attached by means of this molding 5 on a surface of the circuit board 1.

The molded part 5 according to FIG. 10 has two mounting holes 20. The bores 20 are suitable for receiving a component, or serve for the passage of lines, e.g. an RF line, or for assembly purposes.

Figure 1 1 shows a perspective view of another molded part 5, which is provided in its central region with a mounting hole 20. As explained above, this mounting hole 20 is suitable for receiving an electronic component, for the passage of lines, or for assembly purposes.

Finally, FIG. 12 shows a perspective view of a further molded part 5.

This molded part 5 has a corrugated outer contour 17. At the two end faces of this molding 5 each mounting holes 20 are formed, which serve the same purpose as explained above for Fig. 11, are suitable. In a central region 5 a survey 21 is provided in this molding. This elevation 21 increases the free surface of the molding 5 on the outside thereof and thus improves dissipation of heat loss to the environment.

Claims

claims

1. printed circuit board (1) having at least one rigid region (2) and at least one flexible region (3), with at least one on one or both sides copper-clad or provided with conductor tracks rigid layer (6) and at least one or both sides copper-clad or strip-provided flexible layer (7), wherein the rigid layer (6) and the flexible layer (7) are interconnected, wherein a rigid portion of the printed circuit board (1) has at least one recess (12, 12 ', 12 ") has, in which a molded part (5) is pressed to dissipate heat loss.

2. Printed circuit board (1) according to claim 1, characterized in that the recess (12) for the molded part (5) lies in an area in which the circuit board (1) both at least one rigid layer (6) and at least one flexible Layer (7), and that the recess (12 ', 12 ") at least partially penetrates both the at least one rigid layer (6) and the at least one flexible layer (7).

3. Printed circuit board (1) according to claim 2, characterized in that the pressed-in molded part (5) in the region of the recess (12 ") a part of the flexible

Position (7) displaced.

4. printed circuit board (1) according to claim 3, characterized in that with pressed-molded part (5) at least a part of the flexible layer (7) between an edge of the recess (12 ") and the molding (5) is enclosed, whereby the pressure between the molding (5) and the recess (12 ") is increased.

5. printed circuit board (1) with at least one rigid region (2) having at least one on one or both sides copper-clad or provided with conductor tracks rigid layer (6), wherein a rigid portion of the printed circuit board (1) at least one recess (12, 12 ', 12 ") into which a molding (5) is pressed to dissipate heat loss.

6. printed circuit board (1) according to any one of the preceding claims, characterized in that the edge region of the recess (12, 12 ', 12 ") prior to pressing of the molding (5) has been at least partially provided with a metallization (16).

7. Printed circuit board (1) according to any one of the preceding claims, characterized in that the edge region of the recess (12, 12 ', 12 ") has been provided after pressing the molding (5) with a further metallization (16).

8. Printed circuit board (1) according to any one of the preceding claims, characterized in that the molded part (5) made of copper or copper alloys, brass or brass alloys, aluminum or aluminum alloys, or of a suitable material whose thermal conductivity is greater than that Thermal conductivity of the printed circuit board (1), consists.

9. printed circuit board (1) according to one of the preceding claims, characterized in that the molded part (5) is configured substantially flat, wherein in the pressed state an outwardly directed surface (13) of the molded part (5) substantially parallel to the Recess (12, 12 ', 12 ") associated surface area (14) of the circuit board (1) is aligned.

10. printed circuit board (1) according to claim 9, characterized in that the molded part (5) in the pressed state has two outwardly directed surfaces (13), each parallel to the said recess (12, 12 ', 12 ") associated surface area (14) of the printed circuit board (1) are aligned.

1 1. printed circuit board (1) according to one of claims 1 to 8, characterized in that the molded part (5) protrudes with at least one outwardly directed surface of one of the recess (12) associated surface area of the printed circuit board (1).

12. Printed circuit board (1) according to any one of the preceding claims, characterized in that the molded part (5) has a substantially serrated or wavy outer contour (17) and / or that the recess (12) has a substantially serrated or wavy inner contour (15 ) having.

13. Printed circuit board (1) according to claim 12, characterized in that the inner contour of the recess (12, 12 12 ") to the outer contour (17) of the molded part (5) is complementary.

14. Printed circuit board (1) according to one of the preceding claims, characterized in that the connection between the molded part (5) and the printed circuit board (1) is made such that the pressed-in molded part (5) of an extrusion force of at least 30 N, preferably of at least 100N, more preferably at least 200N, withstands.

15. Circuit board (1) according to one of the preceding claims, characterized in that the shaped part (5) on at least one outwardly directed surface (13) at least one avitat (19) and / or at least one opening (20).

16. Printed circuit board (1) according to one of the preceding claims, characterized in that the shaped part (5) is provided on at least one outwardly directed surface (13) with a predetermined geometric shape (21).

17. Printed circuit board (1) according to one of the preceding claims, characterized in that the shaped part (5) is adapted in its size and shape to a with the circuit board (1) connected component.

18. Printed circuit board (1) according to any one of the preceding claims, characterized in that the molded part (5) in the recess (12, 12 ', 12 ") free of connecting means, in particular free of adhesive, is pressed.

19, printed circuit board (1) according to one of the preceding claims, characterized in that the recess (12, 12 ', 12 ") is formed flat.

20. Printed circuit board (1) according to any one of the preceding claims, characterized in that the recess (12 "), the circuit board (1) completely penetrated in their height.

21. The printed circuit board (1) according to claim 1 or any one of claims 5 to 19, characterized in that the recess (12 ") for the molded part (5) is formed only in a region of the printed circuit board (1) in which the printed circuit board (1) only a rigid layer (6).