WO2021184480A1 - 一种平面零件全口径确定性抛光的摇臂式抛光装置和方法 - Google Patents

一种平面零件全口径确定性抛光的摇臂式抛光装置和方法 Download PDF

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Publication number
WO2021184480A1
WO2021184480A1 PCT/CN2020/085342 CN2020085342W WO2021184480A1 WO 2021184480 A1 WO2021184480 A1 WO 2021184480A1 CN 2020085342 W CN2020085342 W CN 2020085342W WO 2021184480 A1 WO2021184480 A1 WO 2021184480A1
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Prior art keywords
polishing pad
polishing
surface shape
distribution function
dressing
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Ceased
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PCT/CN2020/085342
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English (en)
French (fr)
Inventor
周平
耿志超
闫英
王林
王凯
郭东明
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Dalian University of Technology
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Dalian University of Technology
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Priority to JP2021529467A priority Critical patent/JP7112142B2/ja
Priority to US17/289,718 priority patent/US11945070B2/en
Publication of WO2021184480A1 publication Critical patent/WO2021184480A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines

Definitions

  • the invention relates to the technical field of polishing, in particular to a rocker type polishing device and method suitable for full-caliber deterministic polishing of planar parts.
  • Optical systems are widely used in aerospace, national defense and military, space exploration, and astronomical optical observations.
  • field of engineering optics such as ultraviolet optics, strong light optics, short-wave optics, far-infrared optics, etc.
  • plane parts are usually used as imaging elements such as transmission elements, reflective elements, diffractive elements, or other functional elements.
  • imaging elements such as transmission elements, reflective elements, diffractive elements, or other functional elements.
  • the processing of traditional flat optical elements includes process processes such as grinding, lapping, polyurethane polishing, asphalt polishing, and partial modification.
  • Polyurethane polishing can effectively remove grinding damage, but the edge effect is significant during the processing process, and the phenomenon of collapse is prone to occur.
  • the uneven wear of the polyurethane polishing pad can also easily lead to a convex surface, which is difficult to obtain high surface accuracy.
  • Asphalt disc ring polishing is currently the most popular full-diameter high-precision surface processing method, which can obtain high surface accuracy.
  • the removal rate of the ring polishing material of the asphalt disk is low, and the trimming of the asphalt disk surface is highly dependent on manual experience, and the uncertainty is high, resulting in low processing efficiency, and it is difficult to achieve stable and efficient processing of large quantities of optical components. For this reason, a device and method for full-aperture deterministic polishing is needed. Through accurate analysis of the material removal rate and precise control of the surface shape of the polishing pad, the surface shape of the planar part can be quickly converged, and the stable and efficient processing of a large number of optical components can be realized.
  • high-precision planar processing can be achieved by smoothing the tool disk to make the surface of the flat part surface uneven and generating pressure differences, resulting in a differential material removal rate, and gradually copying the surface shape of the tool disk to the surface of the flat part (Zhang, C.
  • polishing pad dressing device and polishing system In order to realize the surface dressing of the polishing pad and ensure the stability of the material removal rate during the polishing process, in the patent "Polishing pad dresser and its manufacturing method, polishing pad dressing device and polishing system” (CN104209863A), increase the grinding surface of the dresser base Surface roughness, and choose regular shaped and polyhedral abrasive particles; in the patent “Closed-loop control for effective pad conditioning” (US20090318060A1), closed-loop control is used to automatically adjust the force of the dresser on the polishing pad.
  • the above polishing pad dressing device has a single function, and only realizes the removal of the glaze layer generated during the operation.
  • the present invention is to design a flat part that can achieve fast surface convergence of flat parts, low equipment cost, high processing efficiency, deterministic trimming of the polishing pad surface shape, and high level of automation.
  • a rocker-arm type polishing device and method for deterministic caliber polishing is to design a flat part that can achieve fast surface convergence of flat parts, low equipment cost, high processing efficiency, deterministic trimming of the polishing pad surface shape, and high level of automation.
  • the basic idea of the present invention is to add a base to the traditional ring polishing equipment, install a rocker mechanism on the base with the help of a column, and install a diamond dressing that maintains a constant pressure on the rocker side of the rocker mechanism.
  • a linear guide rail and a laser displacement sensor are installed on the other side of the rocker arm. The rocker arm is adjusted to make the laser displacement sensor probe move radially along the polishing tool disk, and the original surface shape of the polishing pad is collected by the movement of the laser displacement sensor along the linear guide rail.
  • a polishing pad surface dressing mechanism is adopted to smooth the polishing pad by adjusting the dressing time of each position and polish the flat parts.
  • the material removal rate distribution function is obtained by the difference between the surface shape of the flat part before and after polishing.
  • the polishing pad surface shape design is adopted. The method determines the ideal surface shape of the polishing pad and its finishing parameters that can make the surface shape of the plane part converge quickly.
  • the polishing pad surface trimming mechanism is used to trim the surface shape of the polishing pad to the calculated ideal surface shape of the polishing pad, and the flat part is polished by using the polishing pad.
  • the mechanical arm mechanism sends the polished plane parts to the plane part surface profile automatic measuring device for cleaning and drying, and then measures at the measuring station to determine whether the polishing result meets the requirements. If it does not meet the requirements, repeat the above complete process until Obtain high-precision flat parts that meet the requirements.
  • a rocker-arm type polishing device for full-caliber deterministic polishing of planar parts including a control system, a base, a lifting plate, a polishing module, and a measurement module;
  • the control system is used to control the posture of the mechanical arm, the swing of the rocker arm, the movement of the guide rail slider, the start of the laser displacement sensor, the lifting of the lifting plate, the start of the motor connected to the diamond dresser, and the ring polishing equipment
  • the control panel of the control system is located on the side of the entire device;
  • the polishing module and the measurement module are both located on the base; the lifting plate is located between the polishing module and the measurement module;
  • the polishing module includes a rocker mechanism, a polishing pad surface dressing mechanism, a polishing pad surface shape measuring device, and an annular polishing tool disk mechanism;
  • the rocker arm mechanism includes a stepping motor, a column and a rocker arm, the column is mounted on a base, one end of the rocker arm is hinged on the column, and the other end of the rocker arm is suspended in the circular polishing tool plate mechanism Above
  • the polishing pad surface dressing mechanism includes a cylindrical shaft, a linear bearing, a motor, and a diamond dresser; the cylindrical shaft is fixed on the rear side of the rocker arm, and the motor is installed on the cylindrical shaft through a linear bearing.
  • the diamond dresser is installed on the shaft of the motor and located above the polishing pad;
  • the polishing pad surface profile measuring device includes a linear guide rail and a laser displacement sensor; the linear guide rail is fixed on the front side of the rocker arm, the laser displacement sensor is slidably connected to the linear guide rail through a slider, and the laser displacement The sensor is fixed under the slider;
  • the ring polishing tool plate mechanism includes a polishing pad, a fixing bolt, a driven wheel, a shift fork, a driving wheel motor, a fixing frame, a driving wheel, and a turntable;
  • the polishing pad is pasted on the turntable, the fixing frame is installed on the base by screws, the driving wheel motor is installed on the side wall of the fixing frame, and the shift fork is installed on the side wall of the fixing frame and located on the driving wheel.
  • the driven wheel and the driving wheel are respectively installed at both ends of the shift fork and suspended above the polishing pad;
  • the measurement module includes an automatic measurement device for the surface profile of a planar part and a mechanical arm mechanism, and the automatic measurement device for the surface profile of a planar part includes a cleaning station, a drying station and a measuring station;
  • the cleaning station, the drying station and the measuring station are sequentially installed on the base from left to right; the base of the mechanical arm mechanism is fixed on the side wall of the entire device and is located above the drying station;
  • the stepping motor controls the angle and speed of the rocker arm rotating along the column through the control system
  • the polishing pad surface shape measuring device is driven by a rocker arm to make the measurement track of the laser displacement sensor pass through the center of the polishing pad, adjust the posture of the laser displacement sensor and the height from the polishing pad to meet the measurement data collection requirements, and control the laser
  • the displacement sensor moves along the linear guide, that is, moves along the radial direction of the polishing pad to obtain the radial surface shape of the polishing pad;
  • the polishing pad surface dressing mechanism is connected with the rocker arm through a linear bearing.
  • the diamond dresser relies on its own weight and the weight of the motor to maintain a constant pressure on the surface of the polishing pad, and controls the diamond dressing by controlling the swing speed of the rocker arm.
  • the residence time of the polishing pad at different radial positions of the polishing pad can realize deterministic trimming of the polishing pad.
  • the cleaning station includes deionized water spray equipment and a sewage storage container
  • the drying station includes a shelf with a flat part clamping and positioning device and a powerful blower
  • the measuring station Includes a flatness measuring instrument.
  • a rocker-arm type polishing method for full-caliber deterministic polishing of plane parts which uses a rocker-arm type polishing device for full-caliber deterministic polishing of plane parts for polishing, including the following steps:
  • the guide rail and the laser displacement sensor make the slider of the guide rail drive the laser displacement sensor to move along the radial direction of the polishing pad, and measure the original surface shape of the polishing pad.
  • start the swing arm and the motor connected to the diamond dresser to make the diamond dresser move along The polishing pad is used to dress the polishing pad at a uniform speed in the radial direction, and then the surface shape data of the polishing pad is measured again.
  • the distribution function of the removal rate of polishing pad dressing is obtained as follows:
  • MRR pi represents the removal rate of polishing pad at the i-th discrete point
  • It represents the surface shape of the polishing pad after trimming at the i-th discrete point
  • t p represents the trimming time of the polishing pad
  • n represents the number of radial discrete points of the polishing pad.
  • the surface shape is the height data of all discrete points on the surface of the polishing pad.
  • the difference between the original polishing pad surface shape and the horizontal plane is processed to determine the removal amount distribution function of the polishing pad surface.
  • the dressing pressure remains constant during the dressing process.
  • the dressing removal rate distribution function of the polishing pad is known. Determine the diameter of the diamond dresser in the polishing pad.
  • the dwell time at the position, after the polishing pad is leveled, the flat part is polished on the flat polishing pad, and the material removal rate distribution function MRR c (r, ⁇ ) of the flat part is obtained by the difference between the surface shape of the flat part before and after polishing as follows:
  • MRR c (r, ⁇ ) represents the material removal rate distribution function planar elements
  • u c (r, ⁇ ) represents the surface profile of the front part of the polished plane
  • u 'c (r, ⁇ ) represents the polishing surface of the rear part of the plane Surface shape
  • r represents the distance from a point on the planar part to the center of the planar part
  • ⁇ represents the angle of a point on the planar part in the coordinate system with the center of the planar part as the coordinate origin
  • t c represents the polishing time.
  • the polishing pad surface shape design method is used to determine the ideal surface shape and the ideal surface shape of the polishing pad that can quickly converge the surface shape of the flat part
  • the trimming parameters include the following steps:
  • K(r, ⁇ ) represents the Princeton coefficient
  • P(r, ⁇ ) represents the contact pressure in the polishing operation
  • V(r, ⁇ ) represents the rotational speed of the planar part relative to the polishing pad
  • the material removal rate distribution function MRR c (r, ⁇ ) of plane parts when the polishing pad is leveled is calculated according to formula (2);
  • the relative movement speed V(r, ⁇ ) of the planar part and the polishing pad at each position is obtained by kinematic analysis as follows:
  • u x (r, ⁇ ) represents the speed component of the relative movement speed of the planar part and the polishing pad on the x-axis of the planar part
  • v y (r, ⁇ ) represents the relative movement speed of the planar part and the polishing pad in the planar part y
  • the speed component on the shaft, ⁇ p represents the revolution speed of the polishing pad, and ⁇ c represents the rotation speed of the plane part;
  • K represents the stiffness coefficient
  • ⁇ represents the penetration depth
  • u(r, ⁇ ) represents the thickness of the elastic layer
  • v represents the Poisson’s ratio
  • E represents the elastic modulus
  • L represents the thickness of the polishing pad
  • u p (r, ⁇ ) represents The surface shape of the polishing pad in the polishing operation range is homogenized in the circumferential direction.
  • F represents the positive pressure, that is, the weight of the planar part and the counterweight
  • A represents the area of the area represented by the discrete points of the planar part;
  • the method for obtaining the ideal surface shape of the polishing pad is as follows:
  • the surface shape of the plane part obtained in step B is normalized and mirrored, and treated as the normalized result of the material removal rate distribution function MRR c (r, ⁇ ) of the plane part corresponding to the ideal polishing pad.
  • the specific formula is as follows :
  • step B Based on the assumption of elastic foundation, when the surface shape of the planar part obtained in step B is known, the contact pressure corresponding to the surface shape of any polishing pad is obtained, and the ideal contact pressure distribution function P′(r, ⁇ ) is normalized The result is regarded as the optimization goal, the corresponding ideal surface shape of the polishing pad required for full-aperture deterministic polishing is obtained, and the ideal contact pressure distribution function P′(r, ⁇ ) of the surface of the plane part is obtained;
  • polishing pad dressing parameters the ideal surface shape of the polishing pad and the flat polishing pad surface shape have been measured separately, the dressing pressure remains constant during the dressing process, and the polishing pad dressing removal rate distribution function is known according to step B. Confirm that the diamond dresser is in The dwell time at the radial position of the polishing pad is as follows:
  • T pi represents the residence time of the diamond dresser at the i-th discrete point of the polishing pad
  • u pi represents the surface shape of the flat polishing pad at the i-th discrete point
  • u′ pi represents the polishing pad at the i-th discrete point Ideal face shape at the point
  • step B to obtain the surface shape of the flat part and the surface material removal distribution function MRR′ c (r, ⁇ ) of the flat part corresponding to the ideal polishing pad to derive the evolution of the surface shape of the flat part during the polishing process, and select the surface shape of the flat part
  • the maximum peak-to-valley value that is, the corresponding polishing time when the PV value is the lowest, is used as the predicted polishing time
  • step B to test the material removal rate distribution function of the flat part under the flat polishing pad with the same process parameters to polish the flat part.
  • the process parameters include the respective rotational speeds of the flat part and the polishing pad, the composition of the polishing liquid, and the supply position of the polishing liquid. , Polishing fluid flow rate and polishing load;
  • the mechanical arm mechanism sends the polished flat parts to the cleaning station, and cleans the polishing liquid and other impurities on the surface of the flat parts with deionized water at 20-26°C; then sends the flat parts to the clamping and positioning device in the drying station , Use a powerful blower with a room temperature of 20-26°C to quickly dry the flat parts; after the surface of the flat parts is cleaned, move to the measuring station, measure the surface shape of the flat parts, and judge whether the polishing result meets the requirements, if not If yes, go to step A until the surface of the high-precision flat part that meets the requirements is obtained.
  • the present invention has the following beneficial effects:
  • the present invention fully considers the specific surface shape of the plane part, by controlling the material removal rate distribution function on the surface of the plane part, the material removal rate distribution function of the plane part and the plane part surface form a normalized mirror symmetry relationship.
  • the deterministic polishing of flat parts ensures the efficient convergence of the surface shape of the flat parts during the polishing process.
  • the present invention trims the surface shape of the polishing pad by controlling the residence time of the diamond dresser on the polishing pad, a low-cost operation method is adopted to complete the high-precision polishing process, and the equipment cost is reduced;
  • the present invention does not damage the polishing pad during the dressing process, the use times of the polishing pad are increased, the service life of the consumables is prolonged, and the cost of full-aperture deterministic polishing is reduced.
  • polishing pad surface dressing mechanism of the present invention can realize the polishing pad surface shape dressing and the removal of the surface glaze layer at the same time, this dual function design promotes the simplification of the equipment structure and low cost.
  • the present invention uses the mechanical arm mechanism to grasp the plane parts to ensure the integration of processing and measurement, it is of great significance to the high-level polishing operation of enhancing automation, realizing mass production, promoting productivity, and improving yield, and improves the automation of optical components. Mass manufacturing capability.
  • the lifting plate of the present invention is located between the polishing module and the measurement module. During the polishing operation, in order to prevent the polishing liquid of the polishing module from affecting the measurement module, the lifting plate rises. During the measurement operation, in order to prevent the mechanical arm from being obstructed, The lifting plate landed.
  • Figure 1 is a schematic diagram of the device structure of the present invention.
  • Figure 2 is a perspective view of Figure 1.
  • Figure 3 is a schematic diagram of a polishing pad surface trimming mechanism.
  • Figure 4 is a schematic diagram of a ring-shaped polishing tool disk mechanism.
  • Fig. 5 is a schematic diagram of the relative speed of the planar part relative to the polishing pad.
  • Figure 6 is a flow chart of the full-aperture deterministic polishing process.
  • the present invention is mainly aimed at the processing of plane parts 88. Through accurate analysis of the material removal rate and precise control of the surface profile of the polishing pad, the surface profile of the plane parts 88 can be quickly converged, and stable and efficient processing of a large number of plane parts 88 can be realized.
  • a base 1 is added to the traditional ring polishing equipment.
  • a rocker mechanism 3 is installed on the base 1 by means of a column 32, and a diamond dresser 74 that can maintain a constant pressure is installed on the rocker 31 side of the rocker mechanism 3.
  • a linear guide 22 is mounted on the other side of the rocker arm 31 and a laser displacement sensor 21 is mounted.
  • control system uses the control system to control the posture of the robot arm 4, the swing of the rocker arm 31, the movement of the guide rail 22, the activation of the laser displacement sensor 21, the lifting of the lifting plate 6, the activation of the motor connected to the diamond dresser 74, and the ring polishing equipment
  • the control system adopts industrial control computer and PLC control technology.
  • the rocker arm 31 is adjusted to a position that enables the probe of the laser displacement sensor 21 to move radially along the polishing pad 81, and the original surface shape of the polishing pad 81 is collected by the movement of the laser displacement sensor 21 along the linear guide 22.
  • the measurement data of the surface profile of 81 uses the polishing pad surface dressing mechanism 7, and the polishing pad 81 is smoothed by adjusting the dressing time of each position, and the plane part 88 is polished.
  • the material removal rate distribution function is obtained by the difference between the surface shape of the flat part 88 before and after polishing.
  • the The polishing pad surface shape design method determines the ideal surface shape and trimming parameters of the polishing pad 81 that can quickly converge the surface shape of the planar part 88.
  • the polishing pad surface dressing mechanism 7 is used to dress the surface shape of the polishing pad 81 to the calculated ideal surface shape of the polishing pad 81, and the flat part 88 is polished by the polishing pad 81.
  • the mechanical arm mechanism 4 sends the polished plane part 88 to the plane part surface profile automatic measuring device 5 for cleaning and drying, and then measures and determines whether the polishing result meets the requirements at the measuring station 51. If it does not meet the requirements, repeat the above Complete the process until the high-precision flat part 88 that meets the requirements is obtained.
  • FIG 1-2 shows a schematic diagram of the full-aperture deterministic polishing device of the present invention.
  • the device includes: a base 1, an annular polishing tool disk mechanism 8 located at the center of the base 1 (see Figure 4 for details), installed on the base
  • the column 32 on 1 is hinged to the column 32 and the rocker arm 31 above the ring polishing tool plate mechanism 8, a stepping motor 32 used to control the swing of the rocker arm 31, and is fixed to the linear guide 22 on the front side of the rocker arm 31, and
  • the laser displacement sensor 21 slidably connected to the linear guide 22, the polishing pad surface trimming mechanism 7 fixed on the back side of the rocker arm 31 (see Figure 3 for details), and the lifting plate 6 located at the boundary line of the polishing module and the measurement module on the base 1,
  • the cleaning station 53, the drying station 52, and the measuring station 51 are sequentially installed on the base 1 from left to right, and the mechanical arm mechanism 4 fixed on the side wall of the entire device and located above the drying station 52.
  • the polishing pad surface shape measuring device 2 is driven by the rocker 31 to make the measurement track of the laser displacement sensor 21 pass through the center position of the polishing pad 81, and adjust the posture and distance of the laser displacement sensor 21 from the polishing pad.
  • the height of 81 is sufficient to meet the measurement data collection requirements, and the laser displacement sensor 21 is controlled to move along the linear guide 22, that is, along the radial direction of the polishing pad 81, to obtain the radial surface shape of the polishing pad 81;
  • the lifting plate 6 When it is necessary to measure the surface shape of the plane part 88, the lifting plate 6 is dropped, and the mechanical arm mechanism 4 sends the polished plane part 88 to the cleaning station 53 for cleaning. After the polishing liquid and other impurities are washed away, it is sent to the drying station 52. After the surface of the plane part 88 is cleaned, it is moved to the measuring station 51 to measure the surface shape of the plane part 88.
  • Figure 3 shows a schematic diagram of the polishing pad surface dressing mechanism 7.
  • the device includes: a cylindrical shaft 73, a linear bearing 72 that is slidingly fitted with the cylindrical shaft 73, a motor 71 mounted on the side of the linear bearing 73, and installed on the side of the linear bearing 73 through a coupling The diamond dresser 74 on the shaft of the motor 71.
  • Figure 4 shows a schematic diagram of the ring polishing tool disk mechanism 8.
  • the device includes: a turntable 89 mounted on the spindle of the ring polishing equipment through a fixing bolt 82, a polishing pad 81 attached to the turntable 89, and a fixing frame mounted on the base 86, the driving wheel motor 85 installed on the side wall of the fixed frame 86, the shift fork 84 installed on the side wall of the fixed frame 86 and located below the driving wheel motor 85, are respectively installed at both ends of the shift fork 84 and suspended above the polishing pad 81 The driven wheel 87 and the driving wheel 83, and the flat parts 88 to be polished close to the driving wheel 83 and the driven wheel 87.
  • the driving wheel motor 85 is activated to rotate the driving wheel 83, the plane part 88 rotates with the driving wheel 83, and a counterweight is placed on the plane part 88 to keep the plane part 88 in constant pressure contact with the polishing pad 81 during processing , So as to realize the rapid convergence of the surface shape of the plane part 88.
  • Figure 5 shows the principle diagram of the relative speed of the planar part relative to the polishing pad, and the equation (5) in step C1 can be referred to this figure.
  • Figure 6 shows the flow chart of full-aperture deterministic polishing, which mainly includes the following steps:
  • Step 1 Measure the original surface shape of the polishing pad 81 and the flat part 88, smooth the polishing pad 81 and process the flat part 88, obtain the material removal rate distribution function through the difference between the front and back surface shapes of the flat part 88, according to the flat part 88 and The surface shape of the flat polishing pad 81 and the removal rate distribution function of the flat part 88 during the processing of the flat polishing pad 81.
  • the polishing pad surface shape design method is used to determine the ideal surface shape of the polishing pad that can quickly converge the surface shape of the flat part and its Trimming parameters, trim the polishing pad 81 to the ideal surface shape, and polish the plane part 88;
  • Step 2 Measure and judge whether the plane part 88 meets the machining accuracy requirements, and if it meets the requirements, stop machining;
  • Step 3 If not satisfied, continue to cycle step 1.
  • the diameter of the plane part 88 to be processed is ⁇ 200mm, and the diameter of the polishing pad 81 is ⁇ 610mm.
  • Step 1 Stick the polishing pad 81 on the turntable 89 with a diameter of 610mm, and install the turntable 89 on the main shaft of the annular polishing equipment.
  • Step 2 Collect the original surface shape of the polishing pad 81 by the polishing pad surface shape measuring device 2, and use the rocker mechanism 3 to control the dressing time of the diamond dresser 74 at each position to smooth the polishing pad 81 according to the surface shape measurement data. And process plane parts 88.
  • the material removal rate distribution function is obtained by the difference between the surface shape of the flat part 88 before and after the processing. According to the surface shape of the flat part 88 and the flat polishing pad 81, and the removal rate distribution function of the flat part 88 during the flat polishing pad 81 processing, adopt The polishing pad surface shape design method determines the ideal surface shape and trimming parameters of the polishing pad 81 that can quickly converge the surface shape of the planar part 88.
  • Step 3 The diamond dresser 74 is brought into contact with the polishing pad 81, and the linear bearing 72 is directly slidably fitted with the cylindrical shaft 73, so that the diamond dresser 74 and the polishing pad 81 maintain a constant contact pressure, and the motor 71 is started to make the diamond dresser 74 rotates, the stepping motor 33 is started, and the dressing time of the diamond dresser 74 at each position is adjusted by controlling the swing speed of the rocker arm 31 to dress the polishing pad 81 to the ideal surface shape.
  • Step 4 Polish the flat part 88 by the obtained ideal polishing pad 81.
  • the lifting plate 6 will drop down, and the mechanical arm mechanism 4 will send the polished flat part 88 to the cleaning station 53 for cleaning, waiting to be polished
  • the drying station 52 for drying treatment.
  • the surface of the flat part 88 is cleaned, move to the measuring station 51 to measure the surface shape of the flat part 88 and determine whether the processing result meets the requirements. If it meets the requirements, the above-mentioned complete process is repeated until the surface of the high-precision flat part 88 that meets the requirements is obtained.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
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Abstract

一种平面零件全口径确定性抛光的摇臂式抛光装置和方法，平面零件全口径确定性抛光的摇臂式抛光装置包括控制系统、基座（1）、升降板（6）、抛光模块和测量模块；抛光模块和测量模块均位于基座（1）上；升降板（6）位于抛光模块和测量模块之间；抛光模块包括摇臂机构（3）、抛光垫表面修整机构（7）、抛光垫面形测量装置（2）和环形抛光工具盘机构（8）；测量模块包括平面零件面形自动化测量装置（5）和机械臂机构（4）。

Description

一种平面零件全口径确定性抛光的摇臂式抛光装置和方法 技术领域
本发明涉及抛光技术领域，特别是一种适用于平面零件全口径确定性抛光的摇臂式抛光装置和方法。
背景技术
光学系统在航空航天、国防军事、空间探测以及天文光学观测等方面被广泛应用。在紫外光学、强光光学、短波光学、远红外波光学等方面的工程光学领域，平面零件通常被作为透射元件、反射元件、衍射元件等成像元件或其它功能元件。随着光学技术的不断发展及应用，对光学元件的制造技术水平要求不断提高。一方面，光学元件的精度要求不断提高，另一方面，随着光学系统的需求增加，对光学元件的需求数量日益增大，提高光学元件的加工效率成为光学技术发展的迫切要求之一。
为了实现光学元件的高精度和高表面质量加工，传统平面光学元件的加工包括磨削、研磨、聚氨酯抛光、沥青抛光和局部修形等工艺流程。聚氨酯抛光能够有效去除磨削损伤，但是，加工过程中边缘效应显著，容易出现塌边现象，聚氨酯抛光垫的非均匀磨损也容易导致中凸面形，难以获得高的面形精度。沥青盘环抛是当前最为流行的全口径高精度平面加工方法，可以获得高的面形精度。但是，沥青盘环抛材料去除率低，且沥青盘面形的修整高度依赖人工经验，不确定性高，造成了加工效率低下，难以实现大批量光学元件的稳定高效加工。为此，需要一种全口径确定性抛光的装置与方法，通过材料去除率的准确分析和抛光垫面形的精准控制，使平面零件面形快速收敛，实现大批量光学元件的稳定高效加工。
目前，诸多学者对全口径抛光加工的方法及装置等方面进行了一些研究。在加工方法领域，可以通过将工具盘修平使得平面零件表面凹凸位置产生压力差异进而产生差异性材料去除率，逐步将工具盘面形复制到平面零件表面，来实现高精度平面加工(Zhang,C.,Zhao,H.,Gu,Y.,Ban,X.,&Jiang,C.2017.Design of an ultra-precision CNC chemical mechanical polishing machine and its implementation.Optifab 2017,104482Q.)；也可以通过调整修整轴的倾斜角度，将抛光垫面形修 整为与平面零件面形近似相反的形状，借助增大平面零件凹、凸位置接触压力的差异性来实现更高的抛光效率(谢瑞清,李亚国,王健,陈贤华,黄浩,&许乔.2010.光学加工中抛光垫特征对工件面形的影响分析.光电工程,37.)；在专利“一种平面零件全局修形加工装置和方法”(CN108381331A)中，根据平面零件面形将抛光垫修整为带特定沟槽的图案抛光垫，进而控制平面零件表面的材料去除率分布函数，使该材料去除率分布函数与平面零件面形呈归一化后的镜像对称关系，实现平面零件的确定性加工。
为了实现平面零件的高精度平面加工，保证工具盘的平面度并将其复制给被加工的平面零件，在抛光作业前需要将抛光垫修平，在专利“一种精密丝杠驱动式环型气体静压导轨”(CN106736612A)中，通过一种精密丝杠驱动式环型气体静压导轨，来保证气体静压导轨具有更小的气膜间隙、更高刚度和精度，但是，该装置配备的高精度静压导轨成本较高。
为了实现平面零件的确定性加工，即确定性控制平面零件表面的材料去除率分布函数，可以通过采用开槽装置在抛光垫上开设沟槽的方式来实现。在专利“一种平面零件全局修形加工装置和方法”(CN108381331A)中，通过在传统研磨或抛光机床上增加抛光垫表面车平机构和表面沟槽车削机构，加工出具有高平面度及沟槽结构的抛光垫，但每次作业前需要对抛光垫重新开槽，导致对抛光垫耗损严重。
为了实现抛光垫的表面修整，保证抛光过程中材料去除率的稳定，在专利“抛光垫修整器及其制造方法、抛光垫修整装置及抛光系统”(CN104209863A)中，增加修整器基体研磨面的表面粗糙度，并选用形状规则且为多面体的研磨颗粒；在专利“Closed-loop control for effective pad conditioning”(US20090318060A1)中，通过闭环控制来自动调整修整器对抛光垫的作用力。但是上述抛光垫修整装置功能单一，仅实现作业过程中产生的釉化层的去除。
综上所述，目前在全口径抛光加工的方法与装置方面的研究仍然存在以下问题：
(1)未充分考虑平面零件具体的面形，只是将工具盘修平，导致平面零件面形在抛光过程中的收敛速度较慢；
(2)抛光垫的修平设备采用静压装置，导致设备成本较高；
(3)采用在抛光垫上开设沟槽的方式来进行全口径确定性抛光对抛光垫的 利用率较低，造成加工成本较高；
(4)部分装置对抛光垫的修整仅实现了釉化层的去除，缺乏对抛光垫整体面形的控制能力；
(5)当前抛光设备没有实现加工-测量一体化设计，导致平面零件的自动化批量制造能力不足。
发明内容
为了解决现有技术存在的上述问题，本发明要设计一种能实现平面零件面形收敛速度快、设备成本低、加工效率高、可确定性修整抛光垫面形、自动化水平高的平面零件全口径确定性抛光的摇臂式抛光装置和方法。
为了实现上述目的，本发明的基本思路是：在传统环形抛光设备基础上增设基座，在基座上借助立柱安装摇臂机构，在摇臂机构的摇臂一侧安装保持恒压的金刚石修整器，在摇臂的另一侧安装直线导轨并搭载激光位移传感器。将摇臂调整至使激光位移传感器测头沿着抛光工具盘径向移动位置，通过激光位移传感器沿着直线导轨的移动采集抛光垫的原始面形。根据该抛光垫面形的测量数据，采用抛光垫表面修整机构，通过调整每个位置的修整时间将抛光垫修平，并抛光平面零件。通过平面零件抛光前后表面面形差值获得材料去除率分布函数，根据平面零件和平整抛光垫的表面面形，以及平面零件在平整抛光垫抛光时的去除率分布函数，采用抛光垫面形设计方法确定能够使平面零件面形快速收敛的抛光垫理想面形及其修整参数。采用抛光垫表面修整机构将抛光垫面形修整为计算获得的抛光垫理想面形，利用此抛光垫对平面零件进行抛光。机械臂机构将抛光后的平面零件送至平面零件面形自动化测量装置中进行清洗和干燥，然后在测量工位测量并判断抛光结果是否符合要求，如果不符合要求，则重复上述完整流程，直至获得符合要求的高精度平面零件。
本发明的技术方案如下：
一种平面零件全口径确定性抛光的摇臂式抛光装置，包括控制系统、基座、升降板、抛光模块和测量模块；
所述的控制系统用于控制机械臂的位姿、摇臂的摆动、导轨滑块的移动、激光位移传感器的启动、升降板的升降、与金刚石修整器相连接的电机的启动及环抛设备的作业，所述的控制系统的控制面板位于整个装置的侧边；
所述的抛光模块和测量模块均位于基座上；所述的升降板位于抛光模块和 测量模块之间；
所述的抛光模块包括摇臂机构、抛光垫表面修整机构、抛光垫面形测量装置和环形抛光工具盘机构；
所述的摇臂机构包括步进电机、立柱和摇臂，所述的立柱安装在基座上，所述的摇臂的一端铰接于立柱上，摇臂的另一端悬空于环形抛光工具盘机构上方；
所述的抛光垫表面修整机构包括圆柱轴、直线轴承、电机和金刚石修整器；所述的圆柱轴固定于摇臂的后侧，所述的电机通过直线轴承安装在圆柱轴上，所述的金刚石修整器安装于电机的转轴上并位于在抛光垫上方；
所述的抛光垫面形测量装置包括直线导轨和激光位移传感器；所述的直线导轨固定于摇臂的前侧，所述的激光位移传感器通过滑块与直线导轨滑动连接，所述的激光位移传感器固定在滑块的下方；
所述的环形抛光工具盘机构包括抛光垫、固定螺栓、从动轮、拨叉、主动轮电机、固定架、主动轮和转台；所述的转台通过固定螺栓安装到环形抛光设备的主轴上，所述的抛光垫粘贴在转台上，所述的固定架通过螺钉安装在基座上，所述的主动轮电机安装在固定架侧壁，所述的拨叉安装在固定架侧壁并位于主动轮电机下方，所述的从动轮及主动轮分别安装在拨叉两端并悬空于抛光垫上方；
所述的测量模块包括平面零件面形自动化测量装置和机械臂机构，所述的平面零件面形自动化测量装置包括清洗工位、干燥工位和测量工位；
所述的清洗工位、干燥工位和测量工位从左至右依序安装于基座上；所述的机械臂机构的底座固定在整个装置的侧壁并位于干燥工位上方；
所述的步进电机通过控制系统控制摇臂沿立柱转动的角度及速度；
所述的抛光垫面形测量装置由摇臂带动至使得激光位移传感器的测量轨迹穿过抛光垫中心的位置，调整激光位移传感器的姿态及距离抛光垫的高度至满足测量数据采集要求，控制激光位移传感器沿直线导轨移动，即沿抛光垫径向方向移动，获得抛光垫的径向面形；
所述的抛光垫表面修整机构通过直线轴承与摇臂相连，在修整抛光垫过程中，金刚石修整器依靠自重及电机重量保持恒定压力接触于抛光垫表面，通过控制摇臂的摆动速度控制金刚石修整器在抛光垫不同径向位置处的驻留时间， 实现对抛光垫的确定性修整。
进一步地，所述的清洗工位包括去离子水喷淋设备与污水存储容器，所述的干燥工位包括一个带平面零件夹紧定位装置的搁物架和强力吹风机，所述的测量工位包括一个平面度测量仪。
一种平面零件全口径确定性抛光的摇臂式抛光方法，利用平面零件全口径确定性抛光的摇臂式抛光装置进行抛光，包括以下步骤：
A、测量抛光垫及平面零件原始面形
将摇臂调整至使激光位移传感器测头沿着抛光垫径向移动位置，通过激光位移传感器沿着直线导轨移动采集抛光垫的原始面形，采用机械臂机构将平面零件送至测量工位获得平面零件原始面形；
B、获得采用平整抛光垫时的平面零件材料去除率分布函数
启动导轨及激光位移传感器，使导轨的滑块带动激光位移传感器沿抛光垫径向移动，测得抛光垫原始面形，启动摆臂及与金刚石修整器相连接的电机，使金刚石修整器沿着抛光垫径向匀速修整抛光垫，然后，再次测得该抛光垫面形数据，根据抛光垫修整前后的面形之差与修整时间，获得抛光垫修整去除率分布函数如下：
Figure PCTCN2020085342-appb-000001
其中，MRR pi表示抛光垫在第i个离散点处的修整去除率，
Figure PCTCN2020085342-appb-000002
表示抛光垫在第i个离散点处的原始面形，
Figure PCTCN2020085342-appb-000003
表示抛光垫在第i个离散点处修整后的面形，t p表示抛光垫的修整时间，n表示抛光垫径向离散点的个数。所述的面形为抛光垫表面所有离散点的高度数据。
将原始抛光垫面形与水平面进行求差处理，确定抛光垫表面的去除量分布函数，修整过程中修整压力保持恒定，抛光垫修整去除率分布函数已知，确定金刚石修整器在抛光垫各径向位置处的驻留时间，将抛光垫修平后在该平整抛光垫抛光平面零件，通过平面零件抛光前后表面面形差值获得平面零件材料去除率分布函数MRR c(r，θ)如下：
Figure PCTCN2020085342-appb-000004
其中，MRR c(r，θ)表示平面零件材料去除率分布函数，u c(r，θ)表示平面零 件抛光前的表面面形，u′ c(r，θ)表示平面零件抛光后的表面面形，r表示平面零件上一点到平面零件中心的距离，θ表示以平面零件中心为坐标原点的坐标系下平面零件上一点所在的角度，t c表示抛光时间。
C、确定使平面零件面形快速收敛的抛光垫理想面形及其修整参数
根据平面零件和平整抛光垫的表面面形，以及平面零件在平整抛光垫抛光时的去除率分布函数，采用抛光垫面形设计方法确定使平面零件面形快速收敛的抛光垫理想面形及其修整参数，具体包括以下步骤：
C1、求得普林斯顿系数K(r,θ)：平面零件材料去除率分布函数满足普林斯顿方程：
MRR c(r，θ)＝K(r，θ)P(r，θ)V(r，θ)         (3)
其中，K(r，θ)表示普林斯顿系数，P(r，θ)表示抛光作业中的接触压力，V(r，θ)表示平面零件相对于抛光垫的转速；
为求得普林斯顿系数K(r,θ)，将普林斯顿方程(3)变换为式(4)：
Figure PCTCN2020085342-appb-000005
平整抛光垫时的平面零件材料去除率分布函数MRR c(r，θ)按式(2)计算；
根据抛光过程中使用的转速工艺参数，借助运动学分析获得每个位置平面零件和抛光垫的相对运动速度V(r，θ)如下：
Figure PCTCN2020085342-appb-000006
其中，u x(r，θ)表示平面零件和抛光垫的相对运动速度在平面零件x轴上的速度分量，v y(r，θ)表示平面零件和抛光垫的相对运动速度在平面零件y轴上的速度分量，ω p表示抛光垫的公转速度，ω c表示平面零件的自转速度；
基于弹性地基假设计算接触压力分布函数模型如下：
Figure PCTCN2020085342-appb-000007
其中，K表示刚度系数，δ表示侵入深度，u(r，θ)表示弹性层厚度，v表示泊松比，E表示弹性模量，L表示抛光垫的厚度，u p(r，θ)表示抛光作业范围内的抛光垫周向均化面形，F表示正压力，即平面零件及配重块的重量，A表示平面零件离散点所代表区域的面积；
基于弹性地基假设，在平面零件面形和平整抛光垫面形已知情况下，借助力学分析获各点的抛光压力P(r，θ)；
综上，由于MRR c(r，θ)、V(r，θ)和P(r，θ)均已求得，根据式(4)求得平面零件的普林斯顿系数K(r，θ)；
C2、获得抛光垫理想面形：基于抛光过程中普林斯顿系数不变的假设和弹性地基假设，将步骤B获得的平面零件的面形进行归一化及镜像对称处理，将其视为理想抛光垫对应的平面零件材料去除率分布函数MRR′ c(r，θ)的归一化结果，结合计算平面零件材料去除率分布函数的模型分析获得进行全口径确定性抛光所需要的抛光垫理想面形；
所述的获得抛光垫理想面形的方法如下：
将步骤B获得平面零件的面形进行归一化及镜像对称处理，将其视为理想抛光垫对应的平面零件材料去除率分布函数MRR c(r，θ)的归一化结果，具体公式如下：
Figure PCTCN2020085342-appb-000008
即
Figure PCTCN2020085342-appb-000009
基于抛光过程中普林斯顿系数K(r，θ)不变的假设，考虑由于抛光过程中使 用的转速工艺参数不变则V(r，θ)不变的实况，结合计算平面零件材料去除率分布函数的模型分析获得平面零件表面理想接触压力分布函数P′(r，θ))归一化的结果；
基于弹性地基假设，在步骤B获得平面零件的面形已知的情况下，任意抛光垫的面形对应的接触压力均求得，将理想接触压力分布函数P′(r，θ)的归一化结果视为优化目标，获得相应的进行全口径确定性抛光所需要的抛光垫理想面形，并求得该平面零件表面理想接触压力分布函数P′(r，θ)；
C3、确定抛光垫修整参数：抛光垫理想面形与平整抛光垫面形已分别测得，修整过程中修整压力保持恒定，抛光垫修整去除率分布函数根据步骤B已知，确定金刚石修整器在抛光垫径向位置处的驻留时间如下：
Figure PCTCN2020085342-appb-000010
其中，T pi表示金刚石修整器在抛光垫第i个离散点处的驻留时间，u pi表示平整抛光垫在第i个离散点处的面形，u′ pi表示抛光垫在第i个离散点处的理想面形；
C4、预测抛光时间：获得理想抛光垫对应的平面零件材料去除率分布函数MRR′ c(r，θ)如下：
Figure PCTCN2020085342-appb-000011
结合步骤B获得平面零件的面形与理想抛光垫对应的平面零件表面材料去除分布函数MRR′ c(r，θ)来推演抛光过程中平面零件面形演化，择选平面零件的表面面形的最大峰谷值即PV值最低时的对应的抛光时间作为预测的抛光时间；
D、修整抛光垫
控制抛光垫表面修整机构将抛光垫面形修整为计算获得的抛光垫理想面形；
E、抛光平面零件
采用步骤B在平整抛光垫下测试平面零件材料去除率分布函数时同样的工艺参数对平面零件进行抛光，所述的工艺参数包括平面零件和抛光垫各自的转速、抛光液成分、抛光液供应位置、抛光液流速和抛光载荷；
F、测量平面零件表面面形
机械臂机构将抛光后的平面零件送至清洗工位，用20-26℃的去离子水清洗 平面零件表面的抛光液及其余杂质；然后将平面零件送至干燥工位内的夹紧定位装置，用输出20-26℃的室温风的强力吹风机对平面零件进行快速干燥处理；待平面零件表面处理干净后移至测量工位，测量平面零件表面面形，判断抛光结果是否符合要求，如果不符合，转步骤A，直至获得符合要求的高精度平面零件的表面。
与现有技术相比，本发明具有以下有益效果：
1、由于本发明充分考虑了平面零件的具体面形，通过控制平面零件表面的材料去除率分布函数，使平面零件材料去除率分布函数和平面零件面形成归一化后的镜像对称关系，实现平面零件的确定性抛光，保证了平面零件面形在抛光过程中的高效收敛。
2、由于本发明通过控制金刚石修整器在抛光垫上的驻留时间来修整抛光垫面形，采用了低成本的作业方式完成了高精度的抛光过程，降低了设备成本；
3、由于本发明在修整过程中未对抛光垫造成破坏，提高了抛光垫的利用次数，延长了该耗材的使用寿命，降低了全口径确定性抛光的成本。
4、由于本发明中的抛光垫表面修整机构可以同时实现抛光垫面形的修整及表面釉化层的去除，这种一举两全的功能设计促进了设备的结构精简，成本低廉。
5、由于本发明借助机械臂机构抓取平面零件保证了加工-测量一体化，对增强自动化、实现批量化、促进生产率、提高成品率的高水平抛光作业有着重要意义，提高了光学元件的自动化批量制造能力。
6、本发明的升降板位于抛光模块和测量模块之间，在抛光作业期间，为了防止抛光模块的抛光液影响到测量模块，升降板升起，在测量作业期间，为防止机械臂受到阻碍，升降板降落。
附图说明
图1是本发明的装置结构示意图。
图2是图1的轴测图。
图3是抛光垫表面修整机构示意图。
图4是环形抛光工具盘机构示意图。
图5是平面零件相对于抛光垫的相对速度原理图。
图6是全口径确定性抛光加工流程图。
图中：1、基座，2、抛光垫面形测量装置，3、摇臂机构，4、机械臂机构，5、平面零件面形自动化测量装置，6、升降板，7、抛光垫表面修整机构，8、环形抛光工具盘机构，21、激光位移传感器，22、直线导轨，31、摇臂，32、立柱，33、步进电机，51、测量工位，52、干燥工位，53、清洗工位，71、电机，72、直线轴承，73、圆柱轴，74、金刚石修整器，81、抛光垫，82、固定螺栓，83、从动轮，84、拨叉，85、主动轮电机，86、固定架，87、主动轮，88、平面零件，89、转台。
具体实施方式
下面结合附图和具体实施方法对本发明作进一步说明。
本发明主要针对平面零件88加工，能够通过对材料去除率的准确分析和抛光垫面形的精准控制，使平面零件88的面形快速收敛，实现大批量平面零件88的稳定高效加工。本发明在传统环形抛光设备基础上增设基座1，在基座1上借助立柱32安装摇臂机构3，在摇臂机构3的摇臂31一侧安装可保持恒压的金刚石修整器74，在摇臂31的另一侧安装直线导轨22并搭载激光位移传感器21。利用控制系统控制机械臂4的位姿、摇臂31的摆动、导轨22的移动、激光位移传感器21的启动、升降板6的升降、与金刚石修整器74相连接的电机的启动及环抛设备的作业，所述控制系统采用工业控制计算机和PLC控制技术。将摇臂31调整至能使激光位移传感器21的测头沿着抛光垫81径向移动位置，通过激光位移传感器21沿着直线导轨22的移动采集抛光垫81的原始面形，根据该抛光垫81面形的测量数据，采用抛光垫表面修整机构7，通过调整每个位置的修整时间将抛光垫81修平，并抛光平面零件88。通过平面零件88抛光前后表面面形差值获得材料去除率分布函数，根据平面零件88和平整抛光垫81的表面面形，以及平面零件88在平整抛光垫81抛光时的去除率分布函数，采用抛光垫面形设计方法确定能够使平面零件88面形快速收敛的抛光垫81的理想面形及其修整参数。采用抛光垫表面修整机构7将抛光垫81的面形修整为计算获得的抛光垫81的理想面形，利用抛光垫81对平面零件88进行抛光加工。机械臂机构4将抛光后的平面零件88送至平面零件面形自动化测量装置5中进行清洗和干燥，然后在测量工位51测量并判断抛光结果是否符合要求，如果不符合要求，则重复上述完整流程，直至获得符合要求的高精度平面零件88。
图1-2所示为本发明的全口径确定性抛光装置示意图，该装置包括：基座1， 位于基座1中心位置的环形抛光工具盘机构8(详见图4)，安装在基座1上的立柱32，铰接于立柱32并位于环形抛光工具盘机构8上方的摇臂31，用于控制摇臂31摆动的步进电机32，固定于摇臂31前侧的直线导轨22，与直线导轨22滑动连接的激光位移传感器21，固定于摇臂31后侧的抛光垫表面修整机构7(详见图3)，位于基座1上抛光模块与测量模块交界线处的升降板6，从左至右依序安装于基座1上的清洗工位53、干燥工位52和测量工位51，及固定在整个装置的侧壁并位于干燥工位52上方的机械臂机构4。
需要修整作业时，启动位于立柱32顶端的步进电机33和电机71通过控制摇臂31的摆动速度，调整抛光垫表面修整机构7中的金刚石修整器74在每个位置的修整时间，将抛光垫81修整至理想面形；
需要测量抛光垫81面形时，抛光垫面形测量装置2由摇臂31带动至使得激光位移传感器21的测量轨迹穿过抛光垫81的中心位置，调整激光位移传感器21的姿态及距离抛光垫81的高度至满足测量数据采集要求，控制激光位移传感器21沿直线导轨22移动，即沿抛光垫81径向方向移动，获得抛光垫81的径向面形；
需要测量平面零件88面形时，升降板6落下，机械臂机构4将抛光后的平面零件88送至清洗工位53下清洗，待抛光液及其余杂质被冲洗尽后送至干燥工位52内进行干燥处理，待平面零件88表面处理干净后移至测量工位51测量平面零件88的表面面形。
图3所示为抛光垫表面修整机构7示意图，该装置包括：圆柱轴73，与圆柱轴73采用滑动配合的直线轴承72，安装在直线轴承73侧面的电机71，及通过联轴器安装在电机71转轴上的金刚石修整器74。
需要修整作业时，先使得金刚石修整器74与抛光垫81接触，借助直线轴承72与圆柱轴73直接的滑动配合，使金刚石修整器74与抛光垫81保持恒定的接触压力，启动电机71，使金刚石修整器74旋转，从而实现对抛光垫81的修整。
图4所示为环形抛光工具盘机构8示意图，该装置包括：通过固定螺栓82安装到环形抛光设备主轴上的转台89，贴在转台89上的抛光垫81，安装在基座上的固定架86，安装在固定架86侧壁的主动轮电机85，安装在固定架86侧壁并位于主动轮电机85下方的拨叉84，分别安装在拨叉84两端并悬空于抛光 垫81上方的从动轮87及主动轮83，以及紧贴在主动轮83与从动轮87的待抛光平面零件88。
需要抛光作业时，启动主动轮电机85，使主动轮83旋转，平面零件88随着主动轮83旋转，平面零件88上方放置配重块，使得加工时平面零件88与抛光垫81保持恒压接触，从而实现平面零件88的面形快速收敛。
图5所示为平面零件相对于抛光垫的相对速度原理图，步骤C1中的式(5)可参照该图。
图6所示为全口径确定性抛光流程图，主要包括以下步骤：
步骤1：测量抛光垫81和平面零件88的原始面形，将抛光垫81修平并加工平面零件88，通过平面零件88加工前后表面面形差值获得材料去除率分布函数，根据平面零件88和平整抛光垫81的表面面形，以及平面零件88在平整抛光垫81加工时的去除率分布函数，采用抛光垫面形设计方法确定能够使平面零件面形快速收敛的抛光垫理想面形及其修整参数，修整抛光垫81至理想面形，对平面零件88进行抛光加工；
步骤2：测量并判断平面零件88是否满足加工精度要求，满足，则停止加工；
步骤3：不满足，继续循环步骤1。
根据本发明的实施案例，待加工平面零件88的直径为Φ200mm，抛光垫81的直径为Φ610mm。
如图2所示，本发明的实施案例的具体过程如下：
步骤1、将抛光垫81贴到直径为Φ610mm的转台89上，将转台89安装到环形抛光设备的主轴上。
步骤2、通过抛光垫面形测量装置2采集抛光垫81的原始面形，根据该面形测量数据，使用摇臂机构3控制金刚石修整器74在每个位置的修整时间将抛光垫81修平，并加工平面零件88。通过平面零件88加工前后表面面形差值获得材料去除率分布函数，根据平面零件88和平整抛光垫81的表面面形，以及平面零件88在平整抛光垫81加工时的去除率分布函数，采用抛光垫面形设计方法确定能够使平面零件88面形快速收敛的抛光垫81的理想面形及其修整参数。
步骤3、使得金刚石修整器74与抛光垫81接触，借助直线轴承72与圆柱 轴73直接的滑动配合，使得金刚石修整器74与抛光垫81保持恒定的接触压力，启动电机71，使金刚石修整器74旋转，启动步进电机33，通过控制摇臂31的摆动速度，调整金刚石修整器74在每个位置的修整时间，将抛光垫81修整至理想面形。
步骤4、由获得的理想抛光垫81对平面零件88进行抛光加工，抛光作业完成后，升降板6落下，机械臂机构4将抛光后的平面零件88送至清洗工位53下清洗，待抛光液及其余杂质被冲洗尽后送至干燥工位52内进行干燥处理，待平面零件88表面处理干净后移至测量工位51测量平面零件88的面形并判断加工结果是否符合要求，如果不符合，则重新进行上述完整流程，直至获得符合要求的高精度平面零件88的表面。
本发明不局限于本实施例，任何在本发明披露的技术范围内的等同构思或者改变，均列为本发明的保护范围。

Claims (3)

  1. 一种平面零件全口径确定性抛光的摇臂式抛光装置，其特征在于：包括控制系统、基座(1)、升降板(6)、抛光模块和测量模块；
    所述的控制系统用于控制机械臂的位姿、摇臂(31)的摆动、导轨滑块的移动、激光位移传感器(21)的启动、升降板(6)的升降、与金刚石修整器(74)相连接的电机(71)的启动及环抛设备的作业，所述的控制系统的控制面板位于整个装置的侧边；
    所述的抛光模块和测量模块均位于基座(1)上；所述的升降板(6)位于抛光模块和测量模块之间；
    所述的抛光模块包括摇臂机构(3)、抛光垫表面修整机构(7)、抛光垫面形测量装置(2)和环形抛光工具盘机构(8)；
    所述的摇臂机构(3)包括步进电机(33)、立柱(32)和摇臂(31)，所述的立柱(32)安装在基座(1)上，所述的摇臂(31)的一端铰接于立柱(32)上，摇臂(31)的另一端悬空于环形抛光工具盘机构(8)上方；
    所述的抛光垫表面修整机构(7)包括圆柱轴(73)、直线轴承(72)、电机(71)和金刚石修整器(74)；所述的圆柱轴(73)固定于摇臂(31)的后侧，所述的电机(71)通过直线轴承(72)安装在圆柱轴(73)上，所述的金刚石修整器(74)安装于电机(71)的转轴上并位于抛光垫(81)上方；
    所述的抛光垫面形测量装置(2)包括直线导轨(22)和激光位移传感器(21)；所述的直线导轨(22)固定于摇臂(31)的前侧，所述的激光位移传感器(21)通过滑块与直线导轨(22)滑动连接，所述的激光位移传感器(21)固定在滑块的下方；
    所述的环形抛光工具盘机构(8)包括抛光垫(81)、固定螺栓(82)、从动轮(83)、拨叉(84)、主动轮电机(85)、固定架(86)、主动轮(87)和转台(89)；所述的转台(89)通过固定螺栓(82)安装到环形抛光设备的主轴上，所述的抛光垫(81)粘贴在转台(89)上，所述的固定架(86)通过螺钉安装在基座(1)上，所述的主动轮电机(85)安装在固定架(86)侧壁，所述的拨叉(84)安装在固定架(86)侧壁并位于主动轮电机(85)下方，所述的从动轮(83)及主动轮(87)分别安装在拨叉(84)两端并悬空于抛光垫(81)上 方；
    所述的测量模块包括平面零件面形自动化测量装置(5)和机械臂(4)，所述的平面零件面形自动化测量装置(5)包括清洗工位(53)、干燥工位(52)和测量工位(51)；
    所述的清洗工位(53)、干燥工位(52)和测量工位(51)从左至右依序安装于基座(1)上；所述的机械臂机构(4)的底座固定在整个装置的侧壁并位于干燥工位(52)上方；
    所述的步进电机(33)通过控制系统控制摇臂(31)沿立柱(32)转动的角度及速度；
    所述的抛光垫面形测量装置(2)由摇臂(31)带动至使得激光位移传感器(21)的测量轨迹穿过抛光垫(81)中心的位置，调整激光位移传感器(21)的姿态及距离抛光垫(81)的高度至满足测量数据采集要求，控制激光位移传感器(21)沿直线导轨(22)移动，即沿抛光垫(81)径向方向移动，获得抛光垫(81)的径向面形；
    所述的抛光垫表面修整机构(7)通过直线轴承(72)与摇臂(31)相连，在修整抛光垫(81)过程中，金刚石修整器(74)依靠自重及电机(71)重量保持恒定压力接触于抛光垫(81)表面，通过控制摇臂(31)的摆动速度控制金刚石修整器(74)在抛光垫(81)不同径向位置处的驻留时间，实现对抛光垫(81)的确定性修整。
  2. 根据权利要求1所述的一种平面零件全口径确定性抛光的摇臂式抛光装置，其特征在于：所述的清洗工位(53)包括去离子水喷淋设备与污水存储容器，所述的干燥工位(52)包括一个带平面零件(88)夹紧定位装置的搁物架和强力吹风机，所述的测量工位(51)包括一个平面度测量仪。
  3. 一种平面零件全口径确定性抛光的摇臂式抛光方法，其特征在于：利用平面零件全口径确定性抛光的摇臂式抛光装置进行抛光，包括以下步骤：
    A、测量抛光垫(81)及平面零件(88)原始面形
    将摇臂(31)调整至使激光位移传感器(21)测头沿着抛光垫(81)径向移动位置，通过激光位移传感器(21)沿着直线导轨(22)移动采集抛光垫(81)的原始面形，采用机械臂机构(4)将平面零件(88)送至测量工位(51)获得平面零件(88)原始面形；
    B、获得采用平整抛光垫时的平面零件材料去除率分布函数
    启动导轨及激光位移传感器(21)，使导轨的滑块带动激光位移传感器(21)沿抛光垫(81)径向移动，测得抛光垫(81)原始面形，启动摆臂及与金刚石修整器(74)相连接的电机(71)，使金刚石修整器(74)沿着抛光垫(81)径向匀速修整抛光垫(81)，然后，再次测得该抛光垫(81)面形数据，根据抛光垫(81)修整前后的面形之差与修整时间，获得抛光垫(81)修整去除率分布函数如下：
    Figure PCTCN2020085342-appb-100001
    其中，MRR pi表示抛光垫(81)在第i个离散点处的修整去除率，
    Figure PCTCN2020085342-appb-100002
    表示抛光垫(81)在第i个离散点处的原始面形，
    Figure PCTCN2020085342-appb-100003
    表示抛光垫(81)在第i个离散点处修整后的面形，t p表示抛光垫(81)的修整时间，n表示抛光垫(81)径向离散点的个数；所述的面形为抛光垫(81)表面所有离散点的高度数据；
    将原始抛光垫(81)面形与水平面进行求差处理，确定抛光垫(81)表面的去除量分布函数，修整过程中修整压力保持恒定，抛光垫修整去除率分布函数已知，确定金刚石修整器(74)在抛光垫(81)各径向位置处的驻留时间，将抛光垫(81)修平后在该平整抛光垫抛光平面零件(88)，通过平面零件(88)抛光前后表面面形差值获得平面零件材料去除率分布函数MRR c(r，θ)如下：
    Figure PCTCN2020085342-appb-100004
    其中，MRR c(r，θ)表示平面零件材料去除率分布函数，u c(r，θ)表示平面零件(88)抛光前的表面面形，u′ c(r，θ)表示平面零件(88)抛光后的表面面形，r表示平面零件(88)上一点到平面零件(88)中心的距离，θ表示以平面零件(88)中心为坐标原点的坐标系下平面零件(88)上一点所在的角度，t c表示抛光时间；
    C、确定使平面零件(88)面形快速收敛的抛光垫(81)理想面形及其修整参数
    根据平面零件(88)和平整抛光垫的表面面形，以及平面零件(88)在平整抛光垫抛光时的去除率分布函数，采用抛光垫面形设计方法确定使平面零件(88)面形快速收敛的抛光垫理想面形及其修整参数，具体包括以下步骤：
    C1、求得普林斯顿系数K(r,θ)：平面零件材料去除率分布函数满足普林斯顿 方程：
    MRR c(r，θ)＝K(r，θ)P(r，θ)V(r，θ)   (3)
    其中，K(r，θ)表示普林斯顿系数，P(r，θ)表示抛光作业中的接触压力，V(r，θ)表示平面零件(88)相对于抛光垫(81)的转速；
    为求得普林斯顿系数K(r,θ)，将普林斯顿方程(3)变换为式(4)：
    Figure PCTCN2020085342-appb-100005
    平整抛光垫(81)时的平面零件(88)材料去除率分布函数MRR c(r，θ)按式(2)计算；
    根据抛光过程中使用的转速工艺参数，借助运动学分析获得每个位置平面零件(88)和抛光垫(81)的相对运动速度V(r，θ)如下：
    Figure PCTCN2020085342-appb-100006
    其中，v x(r，θ)表示平面零件(88)和抛光垫(81)的相对运动速度在平面零件(88)x轴上的速度分量，v y(r，θ)表示平面零件(88)和抛光垫(81)的相对运动速度在平面零件(88)y轴上的速度分量，ω p表示抛光垫(81)的公转速度，ω c表示平面零件(88)的自转速度；
    基于弹性地基假设计算接触压力分布函数模型如下：
    Figure PCTCN2020085342-appb-100007
    Figure PCTCN2020085342-appb-100008
    u(r，θ)＝u c(r，θ)-u p(r，θ)
    Figure PCTCN2020085342-appb-100009
    其中，K表示刚度系数，δ表示侵入深度，u(r，θ)表示弹性层厚度，v表示泊松比，E表示弹性模量，L表示抛光垫(81)的厚度，u p(r，θ)表示抛光作业范围内的抛光垫(81)周向均化面形，F表示正压力，即平面零件(88)及配重块的重量，A表示平面零件(88)离散点所代表区域的面积；
    基于弹性地基假设，在平面零件(88)面形和平整抛光垫面形已知情况下， 借助力学分析获各点的抛光压力P(r，θ)；
    综上，由于MRR c(r，θ)、V(r，θ)和P(r，θ)均已求得，根据式(4)求得平面零件(88)的普林斯顿系数K(r，θ)；
    C2、获得抛光垫理想面形：基于抛光过程中普林斯顿系数不变的假设和弹性地基假设，将步骤B获得的平面零件(88)的面形进行归一化及镜像对称处理，将其视为理想抛光垫对应的平面零件材料去除率分布函数MRR′ c(r，θ)的归一化结果，结合计算平面零件材料去除率分布函数的模型分析获得进行全口径确定性抛光所需要的抛光垫理想面形；
    所述的获得抛光垫理想面形的方法如下：
    将步骤B获得平面零件(88)的面形进行归一化及镜像对称处理，将其视为理想抛光垫对应的平面零件材料去除率分布函数MRR′ c(r，θ)的归一化结果，具体公式如下：
    Figure PCTCN2020085342-appb-100010
    即
    Figure PCTCN2020085342-appb-100011
    基于抛光过程中普林斯顿系数K(r，θ)不变的假设，考虑由于抛光过程中使用的转速工艺参数不变则V(r，θ)不变的实况，结合计算平面零件材料去除率分布函数的模型分析获得平面零件表面理想接触压力分布函数P′(r，θ))归一化的结果；
    基于弹性地基假设，在步骤B获得平面零件(88)的面形已知的情况下，任意抛光垫(81)的面形对应的接触压力均求得，将理想接触压力分布函数P′(r，θ)的归一化结果视为优化目标，获得相应的进行全口径确定性抛光所需要的抛光垫理想面形，并求得该平面零件(88)表面理想接触压力分布函数P′(r，θ)；
    C3、确定抛光垫(81)修整参数：抛光垫理想面形与平整抛光垫面形已分别测得，修整过程中修整压力保持恒定，抛光垫修整去除率分布函数根据步骤B已知，确定金刚石修整器(74)在抛光垫(81)径向位置处的驻留时间如下：
    Figure PCTCN2020085342-appb-100012
    其中，T pi表示金刚石修整器(74)在抛光垫(81)第i个离散点处的驻留时间，u pi表示平整抛光垫在第i个离散点处的面形，u′ pi表示抛光垫(81)在第i个离散点处的理想面形；
    C4、预测抛光时间：获得理想抛光垫对应的平面零件材料去除率分布函数MRR′ c(r，θ)如下：
    Figure PCTCN2020085342-appb-100013
    结合步骤B获得平面零件(88)的面形与理想抛光垫对应的平面零件材料去除分布函数MRR′ c(r，θ)来推演抛光过程中平面零件(88)面形演化，择选平面零件(88)的表面面形的最大峰谷值即PV值最低时的对应的抛光时间作为预测的抛光时间；
    D、修整抛光垫(81)
    控制抛光垫表面修整机构(7)将抛光垫(81)面形修整为计算获得的抛光垫理想面形；
    E、抛光平面零件(88)
    采用步骤B在平整抛光垫下测试平面零件材料去除率分布函数时同样的工艺参数对平面零件(88)进行抛光，所述的工艺参数包括平面零件(88)和抛光垫(81)各自的转速、抛光液成分、抛光液供应位置、抛光液流速和抛光载荷；
    F、测量平面零件(88)表面面形
    机械臂机构(4)将抛光后的平面零件(88)送至清洗工位(53)，用20-26℃的去离子水清洗平面零件(88)表面的抛光液及其余杂质；然后将平面零件(88)送至干燥工位(52)内的夹紧定位装置，用输出20-26℃的室温风的强力吹风机对平面零件(88)进行快速干燥处理；待平面零件(88)表面处理干净后移至测量工位(51)，测量平面零件(88)表面面形，判断抛光结果是否符合要求，如果不符合，转步骤A，直至获得符合要求的高精度平面零件(88)的表面。
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CN118204897A (zh) * 2024-04-25 2024-06-18 华侨大学 双面研磨磨盘面型测量及修整工艺优化系统及优化方法
CN119328593A (zh) * 2024-12-23 2025-01-21 西安航晨机电科技股份有限公司 一种基于抛光组合加工的球面抛光参数优化方法及系统

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