WO2021174588A1 - Mems麦克风 - Google Patents

Mems麦克风 Download PDF

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Publication number
WO2021174588A1
WO2021174588A1 PCT/CN2020/079625 CN2020079625W WO2021174588A1 WO 2021174588 A1 WO2021174588 A1 WO 2021174588A1 CN 2020079625 W CN2020079625 W CN 2020079625W WO 2021174588 A1 WO2021174588 A1 WO 2021174588A1
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Prior art keywords
base
metal shell
peripheral wall
shell
mems microphone
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PCT/CN2020/079625
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English (en)
French (fr)
Inventor
胡恒宾
曾鹏
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瑞声声学科技(深圳)有限公司
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Publication of WO2021174588A1 publication Critical patent/WO2021174588A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the utility model belongs to the technical field of acousto-electric transducers, and particularly relates to a MEMS microphone.
  • MEMS microphone is an acousto-electric transducer made by micro-machining technology, which has the characteristics of small size, good frequency response characteristics, and low noise. With the development of smaller and thinner electronic devices, MEMS microphones are more and more widely used in these devices.
  • a MEMS microphone usually includes a substrate, an ASIC chip and a MEMS chip arranged on one side of the substrate, and a shell covering the substrate and surrounding the ASIC chip and the MEMS chip.
  • Some MEMS microphone shells have two or more layers.
  • a gap with air is formed between adjacent layers, and MEMS microphones are generally processed by reflow soldering. During the reflow soldering process, the air in the gap will be heated and expand to squeeze the outer shell, resulting in the outer shell Falling off affects the processing yield of the MEMS microphone.
  • the purpose of the utility model is to provide a MEMS microphone, which can prevent the outer shell from falling off during the processing of the MEMS microphone, thereby improving the processing yield.
  • a MEMS microphone including a base, an inner metal shell covering one side of the base and forming a protective space with the base, fixed on the base and housed in the protective
  • the MEMS chip and the ASIC chip in the space, the outer metal shell fixed to the substrate and covering the inner metal shell, the outer metal shell and the inner metal shell are spaced apart to form a shell gap
  • the base is provided with a pickup hole corresponding to the MEMS chip
  • the inner metal shell includes a first top plate directly opposite to the base and a first top plate that is bent from the periphery of the first top plate and extends to the base.
  • the base is recessed from the side connected with the inner metal shell in a direction away from the inner metal shell to form a first vent groove, and the first peripheral wall is partially covered by the first vent A groove, the first venting groove communicates the protection space and the shell gap.
  • a first connecting piece corresponding to the first peripheral wall is provided on one side of the base, and an end surface of the first peripheral wall close to the base is connected to the first connecting piece.
  • the first connecting piece is made of gold.
  • the outer metal shell includes a second top plate directly opposite to the first top plate and a second peripheral wall curved and extending from the periphery of the second top plate to the base; the base is arranged with the first top plate.
  • the second connecting piece corresponding to the two peripheral walls, and the end surface of the second peripheral wall is connected with the second connecting piece.
  • an end of the second peripheral wall close to the base extends along the end surface of the base in a direction away from the inner metal shell to form an extension edge, and the extension edge is close to the base and the first The two connecting pieces are connected.
  • the second connecting piece is made of gold.
  • the inner metal shell is sequentially covered with at least two layers of the outer metal shell, and the adjacent outer metal shells are arranged at intervals to form a shell gap, and the base recess forms a gap between the adjacent shells.
  • the outer metal shells in between correspond to second vent grooves, and the second vent grooves communicate with adjacent shell gaps.
  • the air in the shell gap between the inner metal shell and the outer metal shell is heated and expanded and flows into the protective space through the first ventilation groove, and then the air in the protective space passes through the MEMS chip and the corresponding pickup
  • the outflow of the hole prevents the air in the shell gap from being thermally expanded to squeeze the outer metal shell, thereby preventing the outer metal shell from falling off the substrate, improving the production yield of MEMS microphones and reducing the defective rate of customers.
  • Figure 1 is a schematic diagram of the overall structure of the utility model MEMS microphone
  • Fig. 2 is a schematic view of the sectional structure of the MEMS microphone of the present invention along the direction A-A in Fig. 1;
  • Fig. 3 is a schematic diagram of the three-dimensional exploded structure of the MEMS microphone of the present invention.
  • a MEMS microphone which includes a base 1, an inner metal shell 2 covering a side of the base 1 and forming a protective space 6 with the base 1, fixed to the base 1 and contained in the protective space
  • the MEMS chip 3 and the ASIC chip 4 in 6, the outer metal shell 5 fixed to the substrate 1 and covering the inner metal shell 2, the outer metal shell 5 and the inner metal shell 2 are spaced apart to form a shell gap 7,
  • the base 1 is provided with a pickup hole 11 corresponding to the MEMS chip 3
  • the inner metal shell 2 includes a first top plate 21 directly opposite to the base 1 and a first peripheral wall 22 bent and extended from the periphery of the first top plate 21 to the base 1.
  • the connecting side of the base 1 and the inner metal shell 2 is recessed in a direction away from the inner metal shell 2 to form a first vent 12, and the first peripheral wall 22 is partially covered above the notch of the first vent 12, specifically, the first The peripheral wall 22 is arranged in the middle of the notch of the first ventilation groove 12, so that the first ventilation groove 12 communicates with the protective space 6 and the shell gap 7.
  • the air in the shell gap 7 between the inner metal shell 2 and the outer metal shell 5 is heated and expanded and flows into the protective space 6 through the first vent 12, and then the air in the protective space 6 passes through the MEMS
  • the outflow of the chip 3 and the corresponding pickup hole 11 prevents the air in the shell gap 7 from being thermally expanded to squeeze the outer metal shell 5, thereby preventing the outer metal shell 5 from falling off the substrate 1 and improving the production yield of MEMS microphones. Reduce the bad use rate of customers.
  • at least two outer metal shells 5 may be sequentially covered outside the inner metal shell 2.
  • it may have two layers, Three-layer, four-layer, etc. outer layer metal shells 5, adjacent outer layer metal shells 5 are arranged at intervals to form shell gaps 7, and the base 1 is recessed to form a second layer corresponding to the outer layer metal shells 5 located between adjacent shell gaps 7.
  • Two venting grooves (not shown), the second venting groove is connected to the adjacent shell gap 7.
  • each outer layer metal shell 5 sequentially surrounds the inner layer metal shell 2 or the outer layer metal shell 5 located on the inner side, and the inner layer metal The shell 2 and the outer metal shell 5 are not in contact, and the adjacent outer metal shells 5 are not in contact.
  • each second venting groove communicates with adjacent shell gaps 7, so that the air between the shell gaps 7 can flow into the protective space 6 and pass through
  • the sound pickup hole 11 flows out to prevent the air in the shell gap 7 from being thermally expanded to squeeze the outer metal shell 5 to ensure the stability of the connection between each outer metal shell 5 and the substrate 1 and improve the production yield of MEMS microphones. Reduce the bad use rate of customers.
  • the inner metal shell 2 and the outer metal shell 5 can be made of metal materials such as copper, aluminum, titanium, etc., as long as they are metal materials.
  • one side of the base 1 is provided with a first connecting piece 13 corresponding to the first peripheral wall 22, and an end surface of the first peripheral wall 22 close to the base 1 is connected to the first connecting piece 13, and the first connecting piece 13
  • the size, shape, number, and position of the first ventilation groove 12 are not limited here, as long as it can ensure that the air in the shell gap 7 can flow into the protection space 6.
  • the outer metal shell 5 includes a second top plate 51 directly opposite to the first top plate 21 and a second peripheral wall 52 bent from the periphery of the second top plate 51 to the base 1; the base 1 is provided with a second connection corresponding to the second peripheral wall 52 Sheet 14, the end surface of the second peripheral wall 52 is connected to the second connecting sheet 14.
  • the second connecting sheet 14 is made of gold.
  • the second connecting sheet 14 can realize the electrical connection between the outer metal shell 5 and the substrate 1.
  • the end of the second peripheral wall 52 close to the base 1 extends outward along the end surface of the base 1 to form an extension edge 521.
  • the connecting piece 14 is connected.
  • the substrate 1 can be a PCB.
  • the inner metal shell 2 and the outer metal shell 5 need to be fixed on the substrate 1 and connected to the substrate 1.
  • the connection method can be surface-to-surface contact connection (physical connection), conductive material connection, and non-conductive material The connection and other methods and the combination of the methods, as long as the inner metal shell 2 and the outer metal shell 5 can be fixed on the base 1 and connected to the base 1.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

本实用新型提供了一种MEMS麦克风，包括基底、盖设在基底的一侧并与基底形成保护空间的内层金属壳、固定于基底的MEMS芯片和ASIC芯片、盖设于基底的外层金属壳，内层金属壳与外层金属壳之间形成壳间隙，基底开设拾音孔，内层金属壳包括与基底正对的第一顶板及自第一顶板的周缘弯曲延伸至基底的第一周壁，基底的与内层金属壳相连侧凹陷形成第一通气槽，第一周壁部分盖设于所述第一通气槽，第一通气槽连通保护空间和壳间隙。在回流焊的过程中，壳间隙内的空气受热膨胀后通过第一通气槽流入到保护空间内并从拾音孔流出，避免了壳间隙内的空气受热膨胀而挤压外层金属壳，从而防止外层金属壳与基底脱落，提高了MEMS麦克风的生产良率。

Description

MEMS麦克风 技术领域
本实用新型属于声电换能器技术领域，尤其涉及MEMS麦克风。
 背景技术
MEMS麦克风是一种用微机械加工技术制作出来的声电换能器，其具有体积小、频响特性好、噪声低等特点。随着电子设备的小巧化、薄型化发展，MEMS麦克风被越来越广泛地运用到这些设备上。
MEMS麦克风通常包括基底、设置在基底的一侧的ASIC芯片和MEMS芯片、盖设在基底上并将ASIC芯片和MEMS芯片包围的壳体，一些MEMS麦克风的壳体具有两层或两层以上，相邻层之间形成存在空气的间隙，而MEMS麦克风一般是通过回流焊的方式加工的，回流焊加工过程中，间隙内的空气会受热膨胀而挤压外层壳体，导致外层壳体脱落，影响MEMS麦克风的加工良率。
 技术问题
本实用新型的目的在于提供一种MEMS麦克风，能够防止MEMS麦克风加工过程中外层壳体脱落，从而提高加工良率。
 技术解决方案
本实用新型的技术方案如下：一种MEMS麦克风，包括基底、盖设在所述基底的一侧并与所述基底形成保护空间的内层金属壳、固定于所述基底且收容于所述保护空间内的MEMS芯片和ASIC芯片、固定于所述基底且盖设于所述内层金属壳外的外层金属壳，所述外层金属壳与所述内层金属壳间隔设置形成壳间隙，所述基底开设与所述MEMS芯片对应的拾音孔，所述内层金属壳包括与所述基底正对的第一顶板及自所述第一顶板的周缘弯曲延伸至所述基底的第一周壁，所述基底自与所述内层金属壳相连的一侧朝远离所述内层金属壳的方向凹陷形成第一通气槽，所述第一周壁部分盖设于所述第一通气槽，所述第一通气槽连通所述保护空间和所述壳间隙。
进一步地，所述基底一侧设置与所述第一周壁对应的第一连接片，所述第一周壁靠近所述基底的端面与所述第一连接片相连。
进一步地，所述第一连接片与所述第一通气槽正对处具有缺口。
进一步地，所述第一连接片由金制成。
进一步地，所述外层金属壳包括与所述第一顶板正对的第二顶板及自所述第二顶板的周缘弯曲延伸至所述基底的第二周壁；所述基底设置与所述第二周壁对应的第二连接片，所述第二周壁的端面与所述第二连接片相连。
进一步地，所述第二周壁靠近所述基底的一端沿所述基底的端面朝远离所述内层金属壳的方向延伸形成延伸缘，所述延伸缘的靠近所述基底侧与所述第二连接片相连。
进一步地，所述第二连接片由金制成。
进一步地，所述内层金属壳外依次盖设有至少两层所述外层金属壳，相邻的所述外层金属壳间隔设置形成壳间隙，所述基底凹陷形成与位于相邻壳间隙之间的所述外层金属壳对应的第二通气槽，所述第二通气槽连通相邻的所述壳间隙。
 有益效果
本实用新型的有益效果在于：
在回流焊的过程中，内层金属壳和外层金属壳间壳间隙内的空气受热膨胀后通过第一通气槽流入到保护空间内，之后保护空间内的空气通过MEMS芯片和对应的拾音孔流出，避免了壳间隙内的空气受热膨胀而挤压外层金属壳，从而防止外层金属壳与基底脱落，提高了MEMS麦克风的生产良率，降低了客户使用不良率。
 附图说明
图1为本实用新型MEMS麦克风的整体结构示意图；
图2为本实用新型MEMS麦克风沿图1中A-A方向的剖开结构示意图；
图3为本实用新型MEMS麦克风的立体分解结构示意图。
 本发明的实施方式
下面结合附图和实施方式对本实用新型作进一步说明。
实施例：
如图1-3所示，提供一种MEMS麦克风，包括基底1、盖设在基底1的一侧并与基底1形成保护空间6的内层金属壳2、固定于基底1且收容于保护空间6内的MEMS芯片3和ASIC芯片4、固定于基底1且盖设于内层金属壳2外的外层金属壳5，外层金属壳5与内层金属壳2间隔设置形成壳间隙7，基底1开设与MEMS芯片3对应的拾音孔11，内层金属壳2包括与基底1正对的第一顶板21及自第一顶板21的周缘弯曲延伸至基底1的第一周壁22，基底1与内层金属壳2相连侧朝远离内层金属壳2的方向凹陷形成第一通气槽12，第一周壁22部分盖设于第一通气槽12的槽口上方，具体的，第一周壁22盖设于第一通气槽12的槽口中间，从而使得第一通气槽12连通保护空间6和壳间隙7。
在回流焊的过程中，内层金属壳2和外层金属壳5间壳间隙7内的空气受热膨胀后通过第一通气槽12流入到保护空间6内，之后保护空间6内的空气通过MEMS芯片3和对应的拾音孔11流出，避免了壳间隙7内的空气受热膨胀而挤压外层金属壳5，从而防止外层金属壳5与基底1脱落，提高MEMS麦克风的生产良率，降低客户使用不良率。
本实施例以内层金属壳2外仅有一层外层金属壳5为例，在其他实施例中，内层金属壳2外可以依次盖设至少两外层金属壳5，例如可以具有两层、三层、四层等的外层金属壳5，相邻的外层金属壳5间隔设置形成壳间隙7，基底1凹陷形成与位于相邻壳间隙7之间的外层金属壳5对应的第二通气槽（未示出），第二通气槽连通相邻的壳间隙7，具体的，各外层金属壳5依次包围位于内侧的内层金属壳2或外层金属壳5，内层金属壳2和外层金属壳5不接触，相邻的外层金属壳5之间也不接触，外层金属壳5的数量大于等于两层时，除了最外侧的外层金属壳5外，基底1的与其余外层金属壳5对应处均凹陷形成第二通气槽，各第二通气槽连通相邻的壳间隙7，使得各壳间隙7之间的空气能够流到保护空间6内并通过拾音孔11流出，防止壳间隙7内的空气受热膨胀而挤压外层金属壳5，以保证各外层金属壳5与基底1之间的连接稳定性，提高MEMS麦克风的生产良率，降低客户使用不良率。
在本实施例中，内层金属壳2和外层金属壳5可以由铜、铝、钛等金属材料制成，只要是金属材料即可。
在本实施例中，基底1的一侧设置与第一周壁22对应的第一连接片13，第一周壁22的靠近基底1的端面与第一连接片13相连，第一连接片13由金制成，通过第一连接片13可以实现内层金属壳2和基底1之间的电连接，第一连接片13与第一通气槽12正对处具有缺口。第一通气槽12的尺寸、形状、数量、位置在此不作限制，只要能保证壳间隙7内的空气能流到保护空间6内即可。
外层金属壳5包括与第一顶板21正对的第二顶板51及自第二顶板51的周缘弯曲延伸至基底1的第二周壁52；基底1设置与第二周壁52对应的第二连接片14，第二周壁52的端面与第二连接片14相连，第二连接片14由金制成，通过第二连接片14可以实现外层金属壳5和基底1之间的电连接，为了提高外层金属壳5和基底1之间的连接稳定性，第二周壁52的靠近基底1端沿基底1的端面朝外延伸形成延伸缘521，延伸缘521的靠近基底1侧与第二连接片14相连。
基底1可以是PCB，内层金属壳2和外层金属壳5需要固定在基底1上并与基底1导通，连接方式可以采用面面接触连接（物理连接）、导电材料连接、非导电材料连接等等方式及各方式的组合，只要能将内层金属壳2和外层金属壳5固定在基底1上并与基底1导通即可。
以上所述的仅是本实用新型的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本实用新型创造构思的前提下，还可以做出改进，但这些均属于本实用新型的保护范围。

Claims (8)

  1. 一种MEMS麦克风，包括基底、盖设在所述基底的一侧并与所述基底形成保护空间的内层金属壳、固定于所述基底且收容于所述保护空间内的MEMS芯片和ASIC芯片、固定于所述基底且盖设于所述内层金属壳外的外层金属壳，所述外层金属壳与所述内层金属壳间隔设置形成壳间隙，所述基底开设与所述MEMS芯片对应的拾音孔，其特征在于，所述内层金属壳包括与所述基底正对的第一顶板及自所述第一顶板的周缘弯曲延伸至所述基底的第一周壁，所述基底自与所述内层金属壳相连的一侧朝远离所述内层金属壳的方向凹陷形成第一通气槽，所述第一周壁部分盖设于所述第一通气槽，所述第一通气槽连通所述保护空间和所述壳间隙。
  2. 根据权利要求1所述的MEMS麦克风，其特征在于，所述基底一侧设置与所述第一周壁对应的第一连接片，所述第一周壁靠近所述基底的端面与所述第一连接片相连。
  3. 根据权利要求2所述的MEMS麦克风，其特征在于，所述第一连接片与所述第一通气槽正对处具有缺口。
  4. 根据权利要求2所述的MEMS麦克风，其特征在于，所述第一连接片由金制成。
  5. 根据权利要求1所述的MEMS麦克风，其特征在于，所述外层金属壳包括与所述第一顶板正对的第二顶板及自所述第二顶板的周缘弯曲延伸至所述基底的第二周壁；
    所述基底设置与所述第二周壁对应的第二连接片，所述第二周壁的端面与所述第二连接片相连。
  6. 根据权利要求5所述的MEMS麦克风，其特征在于，所述第二周壁靠近所述基底的一端沿所述基底的端面朝远离所述内层金属壳的方向延伸形成延伸缘，所述延伸缘的靠近所述基底侧与所述第二连接片相连。
  7. 根据权利要求5所述的MEMS麦克风，其特征在于，所述第二连接片由金制成。
  8. 根据权利要求5所述的MEMS麦克风，其特征在于，所述内层金属壳外依次盖设有至少两层所述外层金属壳，相邻的所述外层金属壳间隔设置形成壳间隙，所述基底凹陷形成与位于相邻壳间隙之间的所述外层金属壳对应的第二通气槽，所述第二通气槽连通相邻的所述壳间隙。
PCT/CN2020/079625 2020-03-05 2020-03-17 Mems麦克风 WO2021174588A1 (zh)

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US20100195864A1 (en) * 2007-08-02 2010-08-05 Nxp B.V. Electro-acoustic transducer comprising a mems sensor
CN110662149A (zh) * 2019-09-06 2020-01-07 歌尔股份有限公司 Mems麦克风
CN210112277U (zh) * 2019-09-10 2020-02-21 苏州敏芯微电子技术股份有限公司 硅麦克风封装结构

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US20100195864A1 (en) * 2007-08-02 2010-08-05 Nxp B.V. Electro-acoustic transducer comprising a mems sensor
CN110662149A (zh) * 2019-09-06 2020-01-07 歌尔股份有限公司 Mems麦克风
CN210112277U (zh) * 2019-09-10 2020-02-21 苏州敏芯微电子技术股份有限公司 硅麦克风封装结构

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