WO2021168596A1 - 一种手扶梯扶手紫外线灭菌模组 - Google Patents
一种手扶梯扶手紫外线灭菌模组 Download PDFInfo
- Publication number
- WO2021168596A1 WO2021168596A1 PCT/CN2020/076325 CN2020076325W WO2021168596A1 WO 2021168596 A1 WO2021168596 A1 WO 2021168596A1 CN 2020076325 W CN2020076325 W CN 2020076325W WO 2021168596 A1 WO2021168596 A1 WO 2021168596A1
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- WO
- WIPO (PCT)
- Prior art keywords
- heat dissipation
- sterilization module
- escalator handrail
- substrate
- ultraviolet sterilization
- Prior art date
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- 230000001954 sterilising effect Effects 0.000 title claims abstract description 54
- 238000004659 sterilization and disinfection Methods 0.000 title claims abstract description 53
- 230000017525 heat dissipation Effects 0.000 claims abstract description 47
- 239000000758 substrate Substances 0.000 claims abstract description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052802 copper Inorganic materials 0.000 claims abstract description 22
- 239000010949 copper Substances 0.000 claims abstract description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 15
- 239000010936 titanium Substances 0.000 claims abstract description 14
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 14
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000004806 packaging method and process Methods 0.000 claims description 12
- 230000005496 eutectics Effects 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 claims 1
- 239000003973 paint Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 19
- 239000000463 material Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 13
- 239000000919 ceramic Substances 0.000 description 9
- 229910010272 inorganic material Inorganic materials 0.000 description 5
- 239000011147 inorganic material Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 5
- 229910052753 mercury Inorganic materials 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 239000005022 packaging material Substances 0.000 description 3
- 229920006375 polyphtalamide Polymers 0.000 description 3
- SWPMTVXRLXPNDP-UHFFFAOYSA-N 4-hydroxy-2,6,6-trimethylcyclohexene-1-carbaldehyde Chemical compound CC1=C(C=O)C(C)(C)CC(O)C1 SWPMTVXRLXPNDP-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 241000894006 Bacteria Species 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 241000700605 Viruses Species 0.000 description 2
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004954 Polyphthalamide Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 244000052616 bacterial pathogen Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009395 breeding Methods 0.000 description 1
- 230000001488 breeding effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000001595 contractor effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229920006336 epoxy molding compound Polymers 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 208000015181 infectious disease Diseases 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002574 poison Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000012414 sterilization procedure Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910021341 titanium silicide Inorganic materials 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66B—ELEVATORS; ESCALATORS OR MOVING WALKWAYS
- B66B31/00—Accessories for escalators, or moving walkways, e.g. for sterilising or cleaning
- B66B31/02—Accessories for escalators, or moving walkways, e.g. for sterilising or cleaning for handrails
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
Definitions
- the invention relates to an ultraviolet sterilization module for escalator handrails, in particular to a sterilization module for ultraviolet light emitting diodes encapsulated by all inorganic materials.
- Escalators are usually installed in public spaces to transport people from one place to another. People who come to this space, whether it is a leisurely walk, shopping or hurrying on the road, when standing on the escalator, they will naturally place their hands on the handrails of the escalator to maintain personal safety and stability. When all kinds of people put their hands on the handrails, it is easy to leave the bacteria or even viruses on the hands of each person on the handrails of the escalator, and when the next person steps on the escalator, And when the hand is placed on the handrail, it is easy to infect the bacteria and virus left by the previous person, and then cause physical discomfort, or even get sick.
- mercury lamps were almost always used as sterilization tools.
- mercury lamps contain mercury, which is called the poison of the century, they are always used.
- ultraviolet light will have an absolute impact on organic compounds, that is, it will destroy the bonds between organic compounds, and cause the formation of split or decomposition between the compounds; due to the above reasons, the current packaging structure for UV chips is in use After a period of time, reliability and safety problems will occur, and this is also because ultraviolet light destroys the current packaging structure, causing the ultraviolet light chip to be corroded by water vapor, which shortens the service life and affects Electrical performance.
- the current packaging materials for light-emitting diodes on the market are almost all about cost considerations, and most of them are PPA (Polyphthalamide, thermoplastic).
- PPA Polyphthalamide, thermoplastic
- EMC epoxy Molding Compound, epoxy molded resin
- EMC wires have gradually established themselves in the market position of 1-3 watts of medium and high power LEDs, but EMC lead frames Restricted by its own material characteristics, it is impossible to enter higher-power LEDs.
- UVC deep ultraviolet
- mW microwatts
- LTCC Low Temperature Co-fired Ceramic
- HTCC High Temperature Co-fired Ceramic
- alumina ceramic components with a thermal conductivity of 2-25W/mK correspond to 30mW deep ultraviolet light-emitting diode components should be sufficient; but in the future of higher power development, the heat dissipation of traditional LTCC, HTCC, and alumina ceramic components has reached its limit, not to mention organic materials such as EMC and other plastic materials are not applicable In this field, a ceramic substrate with higher thermal conductivity is required to correspond to the ultraviolet field.
- the entire packaging structure is within the range of ultraviolet radiation for a long time, whether it is the material of the lead frame itself, or even between the upper frame of the lead frame and the ceramic circuit carrier board
- the bonding layer may cause material embrittlement or peeling of the bonding layer under long-term UV exposure, especially if the body uses organic materials (such as organic materials such as PPA or EMC) or uses organic colloids to bond the upper frame and ceramics. Under the condition of the circuit board (the adhesive layer on the market uses UV glue, but even the UV glue will still be brittle), it needs to be avoided as much as possible.
- the die-bonding process of the LED packaging industry is a high-temperature process above 300°C for the die, and when the lead frame is made by processes such as indium and high-temperature tin, the packaging die-bonding process is often due to The temperature is higher than the bonding temperature of indium and high-temperature tin, which easily causes the subsequent production stability to be insufficient to meet the needs of the industry.
- the packaging materials should be inorganic materials, but they still suffer from the lack of effective methods to combine inorganic materials.
- the purpose of the present invention is to provide an escalator handrail ultraviolet sterilization module that uses the strength of the metal eutectic structure to resist the thermal expansion and contraction effects between different materials caused by the accumulation of heat energy when using this product, and solves the problem of peeling off the metal bonding layer , And then improve the product yield.
- the purpose of the present invention is to provide an escalator handrail ultraviolet sterilization module, which is made of inorganic materials, so that the whole product will be in the ultraviolet irradiation range for a long time without material embrittlement and adhesion layer peeling.
- Another object of the present invention is to provide an escalator handrail ultraviolet sterilization module, wherein the sterilization module is a sterilization module containing titanium.
- Another object of the present invention is to provide an escalator handrail ultraviolet sterilization module, which includes: a substrate, a titanium layer formed on the side of the substrate, a patterned copper layer formed on the surface of the titanium layer, and An ultraviolet light chip fastened to one side of the patterned copper layer, an upper frame, and a quartz glass bonded to one side of the upper frame; in addition, a layer is fixed on one side of the ceramic substrate
- the aluminum substrate (MCPCB), and a heat dissipation structure is added to one side of the aluminum substrate; a shell can wrap the above-mentioned components, and the structure can be set at one end of the escalator handrail,
- the ultraviolet light emitted by the ultraviolet light chip can be shielded to avoid leakage. In this way, the aforementioned ultraviolet light chip can be used to continuously emit ultraviolet light on the handrail of the escalator for sterilization.
- Another object of the present invention is to provide an escalator handrail ultraviolet sterilization module, wherein the difference in thermal expansion coefficient between the substrate and the upper frame is between 75% and 80%.
- Another object of the present invention is to provide an escalator handrail ultraviolet sterilization module, wherein the heat dissipation structure includes a heat dissipation plate, a heat dissipation fin fixed on one side of the heat dissipation plate, and a heat dissipation plate.
- the fan on the side of the shank can strengthen the flow of the airflow and take the initiative to quickly remove the heat.
- Another object of the present invention is to provide an escalator handrail ultraviolet sterilization module, wherein the heat sink is a copper plate, and the heat sink is a metal heat sink.
- Another object of the present invention is to provide an escalator handrail ultraviolet sterilization module, wherein the heat dissipation plate is a copper plate, and the heat dissipation plate is an aluminum heat dissipation plate.
- Another object of the present invention is to provide an escalator handrail ultraviolet sterilization module, wherein the heat dissipation plate is a copper plate, and the heat dissipation plate is a copper heat dissipation plate.
- Another object of the present invention is to provide an escalator handrail ultraviolet sterilization module, wherein the heat dissipation plate is a copper plate, and the heat dissipation plate is a heat dissipation plate made of aluminum and copper alloy.
- the present invention has the following beneficial effects due to the adoption of the above technical solutions: through the use of background concepts in the semiconductor and micro-electromechanical fields, the metal eutectic structure of the metal diffusion effect improved by ICH technology (Inorganic Ceramic Heterogeneity) makes its structure
- ICH technology Inorganic Ceramic Heterogeneity
- the strength is enough to resist the thermal expansion and contraction stress caused by use, and because the substrate, the upper frame, the quartz glass cover plate, or the aluminum substrate, the heat dissipation structure and other materials are all inorganic materials, they can be exposed to the ultraviolet radiation range for a long time. Without being damaged by ultraviolet rays, the material will not become brittle and the adhesive layer will not peel off, so the current technical problems faced by the industry can be avoided.
- Fig. 1 is a packaging structure with a chip built into the ultraviolet sterilization module of the escalator handrail of the present invention.
- Fig. 2 is a three-dimensional appearance view of an ultraviolet sterilization module for an escalator handrail of the present invention.
- FIG. 3 is a schematic diagram of a three-dimensional appearance embodiment of the escalator handrail ultraviolet sterilization module of the present invention forming an array arrangement.
- FIG. 4 is a perspective view of another embodiment when the ultraviolet sterilization modules of the escalator handrail of the present invention are arranged in an array.
- FIG. 5 is a schematic side view of the ultraviolet sterilization module of the escalator handrail of the present invention arranged at the end of the escalator.
- the sixth is a schematic diagram of the ultraviolet sterilization module of the escalator handrail of the present invention being arranged at the end of the escalator.
- Fig. 7 shows the internal position and arrangement method of the escalator handrail ultraviolet sterilization module of the present invention after being installed at the end of the escalator.
- Figure 8 is an end view of the escalator handrail ultraviolet sterilization module of the present invention arranged at the end of the escalator.
- Module module
- 1-package structure 11-ultraviolet chip, 12-substrate, 121-titanium-containing compound layer, 13-titanium layer, 14-patterned copper layer, 15-upper frame, 16-cover board, 2-system board, 3 -Heat dissipation structure, 31- heat sink, 32- heat sink, 33- fan, 4- shell, 41- top cover, 5- escalator, 51- handrail, 52- fence.
- the present invention is an escalator handrail ultraviolet sterilization module, which can mainly use this ultraviolet sterilization module to emit continuous ultraviolet light from the escalator handrail, so as to keep the escalator handrail clean and sterile, and avoid The breeding and infection of germs.
- the escalator handrail ultraviolet sterilization module mainly includes: a packaging structure 1 containing an ultraviolet light chip 11 inside it, a system board 2, and It is called an aluminum substrate, a heat dissipation structure 3, and a housing 4 (as shown in Figure 7).
- a substrate 12 in the package structure 1 a titanium layer 13 formed on one side of the substrate 12, and a patterned copper layer formed on one side of the titanium layer 13.
- An upper frame 15 formed on a free surface of the patterned copper layer 14 and capable of surrounding and protecting the ultraviolet light chip 11, and a cover plate 16 with high transmittance.
- the material of the substrate 12 can be selected from copper, copper alloy, aluminum, aluminum alloy, iron-cobalt-nickel alloy, aluminum nitride, aluminum oxide, silicon nitride, or silicon carbide; and after the substrate 12 material is selected, as described above , An intermediate titanium layer 13 is formed on one side of the substrate 12, and after the titanium layer 13 is processed with the substrate 12 through the manufacturing process, a titanium-containing compound layer 121 is generated therebetween.
- the material of the predetermined substrate 12 has different compositions, such as titanium oxide, titanium aluminum alloy, aluminum titanium nitride, titanium silicide, etc.
- the material of the upper frame 15 can be Selected from copper, copper alloy, aluminum, aluminum alloy, iron-cobalt-nickel alloy, aluminum nitride, aluminum oxide, silicon nitride or silicon carbide; that is, the substrate 12 and the upper frame 15 can be selected from each other
- the materials of the substrate 12 and the upper frame 15 are preferably corresponding, that is, the coefficient of expansion between the materials is between 75 and 80%.
- the thermal expansion coefficient difference is too large, resulting in a situation of shedding and separation.
- the eutectic bonding technique is used like the cover plate 16 to firmly and airtightly seal the ultraviolet light chip 11 in the packaging structure 1 in.
- the package structure 1 is fixed on a system board (called aluminum substrate) 2 for control by an external control module (not shown); then, each package is provided with
- the system board 2 of structure 1 is arranged on a heat dissipation structure 3 in an array arrangement to enhance the heat dissipation from the system board 2; wherein, the heat dissipation structure 3 includes generally copper
- the radiating plate 31 and the radiating fin 32 provided on the side of the radiating plate 31 are known from the above-mentioned radiating plate 31 and radiating fin 32 that the two components mentioned above are used to conduct heat in a passive manner.
- a fan 33 can be arranged on one side of the heat dissipation plate 31 to blow air to the heat dissipation fins 32 to actively strengthen the heat dissipation.
- the two and two heat dissipation structures 3 can be hingedly joined (as shown in the embodiment), linked (not shown) or connected in any suitable manner to form a size that meets the size of the construction site.
- the escalator handrail ultraviolet sterilization module provided by the present invention can be installed between the escalator 5 and the floor (not labeled)
- the ultraviolet sterilization module of the escalator handrail of the present invention can also be arranged in other positions, so the embodiment shown in the drawings is only to show one of various different embodiments, not to limit The scope of the present invention when it is implemented or its usage mode are defined only for reference, and should not be interpreted as a restrictive presentation.
- the outermost part of the escalator 5 handrail 51 ultraviolet sterilization module of the present invention is provided with the casing 4, and the casing 4 is mainly used for the ultraviolet sterilization module
- the ultraviolet light emitted by the escalator is shielded to prevent the ultraviolet light from leaking or may cause the person using the escalator to be injured by the ultraviolet light. Therefore, the housing essentially wraps the entire sterilization module, leaving only two opposite sides for the passage of the armrest 51; what can be seen is that the system board 2 will be provided.
- the cover plate 16 in each package structure 1 directly faces the side of the handrail 51, so that the ultraviolet light chip 11 located inside the package structure 1 can be transparent.
- the cover plate 16 with high transmittance is used to emit ultraviolet light toward the handrail 51 to carry out the sterilization procedure; and the best one is at the upper end of the housing 4, close to the fence of the escalator 5.
- Each of the two sides of 52 has a top cover 41 slanting toward the fence 52, so as to keep the ultraviolet light in the housing 4 as much as possible without leaking out.
- the escalator handrail ultraviolet sterilization module provided by the present invention can also be provided with a reflector (not numbered) on the inner side wall of the housing 4, or coated with a reflector. coating.
- the heat dissipation plate 31 of the heat dissipation structure 3 With the heat dissipation plate 31 of the heat dissipation structure 3, the heat dissipation plate 32 provided on the side of the heat dissipation plate 31, and the optional fan 33, although more than 90% of the energy of the ultraviolet light chip 11 is converted into heat And then exudes, in order to continuously provide the effect of sterilizing the handrails of the escalator, the above-mentioned enhanced heat dissipation structure 3 can fully meet the needs of the market; at the same time, because the packaging structure 1 uses eutectic bonding technology, Therefore, a terminal product with high safety factor and excellent product stability can be provided.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Apparatus For Disinfection Or Sterilisation (AREA)
Abstract
一种手扶梯扶手紫外线灭菌模组，包括一基板（12）、一形成于基板（12）侧面的钛层（13）、一形成于钛层（13）表面的图案化铜层（14）、一紧固于图案化铜层（14）一侧的紫外光芯片（11）、一上框（15）及一结合于上框（15）一侧的石英玻璃；于基板（12）的一侧固设有一层的铝基板（2），并在铝基板（2）的一侧设有一散热结构（3）；一壳体（4），可将各组件予以包覆起来，并设置在一手扶梯扶手一端，将紫外光芯片（11）所发出的紫外光遮蔽，以避免外泄。如此，利用紫外光芯片（11）不断地对手扶梯扶手发出紫外光进行灭菌。
Description
本发明是有关于一种手扶梯扶手紫外线灭菌模组，尤其是关于一种以全无机材料封装的紫外线发光二极管的灭菌模组。
手扶梯通常是设置在些公众的空间中,来将到此空间的人们从一地运送到另一地的装置。而到此空间的人们,不论是闲散的散步、购物或是急忙地赶路,当站在手扶梯上时,很自然地会将手放置在手扶梯的扶手上,以维持个人安全以及稳定。在各式各样的人都把手放置在扶手上的情形下,很容易地会将各人手上所带有的细菌,甚至是病毒等留置在手扶梯的扶手,而当下一个人踏上手扶梯,且又将手放置在扶手上时,很容易地会感染上前一个人所留下的细菌、病毒,并进而产生生理上的不适,甚或是生病。
为了能提供给大众一个干净,舒适的空间,对于手扶梯扶手的清洁、灭菌应是一不可间断,且持续的工作。而众所周知的一件事实就是目前在市场上已应用相当广泛的灭菌手法-利用紫外线光来作灭菌。
之前,尤其是在医疗设备的灭菌上,几乎都是使用了汞灯来作为灭菌的工具,然而,由于汞灯内含有世人称之为世纪之毒的汞,所以在使用上总是令人感到了不安,再加上于2017年世界上多国所签署的水葆公约,于此公约内明令禁止各国于2020年后再生产、制造以及使用含有汞的制品；因此,利用紫外光芯片来发出紫外光线的制品势必会替代现有的汞制品,并为整个人文的环境带来更为舒适,安全的生活空间。
经由上述的说明后,当可知利用紫外光芯片来作为市场上灭菌的主流似已成为一股不可挡的趋势；不过有关于紫外光芯片的一些延伸的问题也应一并的予以解决,如此才能提供一可靠度高,安全系数高的制品。目前有关于紫外光芯片的制作,世上多国均已上紧发条的研发中,故而在此并不多作说明以及解释；在此欲说明的主要是因为紫外光芯片在发出紫外光时,有絶大一部份能量(90％以上)是转换成为热能并散溢掉,而仅有少部份的能量是用于发出紫外光。而由于紫外光线对于有机化合物会产生绝对 的影响,也就是它会破坏有机化合物间的键结,而致造成化合物间形成分裂或分解；由于上述的原因,现行对于紫外光芯片的封装结构在使用了一段时间后都会发生信赖性以及安全性上的问题,而这也都是因为紫外光破坏了现行的封装结构,造成了紫外光芯片受到水汽的侵蚀而致缩短了使用寿命,并进行影响了电性的效能。
以下则就现行的封装材料以及结构作更深入的说明:现行市场上发光二极管的封装材料,几乎都围绕着成本在考虑,传统大多是PPA(Polyphthalamide,热塑性塑料)。近年来LED封装厂逐渐采用耐热性更高的EMC(Epoxy Molding Compound,环氧模压树脂)导线架,EMC导线逐渐站稳用在1-3瓦的中高功率LED的市场地位,但是EMC导线架受制于本身材料特性,无法再往更高功率的LED跨入。
然而,当发光二极管切入紫外线领域时,将会有60％～70％的光电效能转换成热能,甚至在深紫外线(UVC)领域仅只有不到10％电力转换成光,90％以上都转换成热能,且目前发光二极管的制造厂商所制造出来的LED在功率上顶多在30微瓦(mW)的领域,若未来持续往更高功率的紫外线发光二极管研发时,将会受限于散热材料、后制加工、整体构装的重重限制；而且热能累积过多易造成光衰。传统低温共烧陶瓷(Low Temperature Co-fired Ceramic；LTCC)、高温共烧多层陶瓷(High Temperature Co-fired Ceramic；HTCC)、以热导率2～25W/mK的氧化铝陶瓷组件来对应于30mW的深紫外线发光二极管组件应足以应付；但再往更高功率发展的未来,传统LTCC、HTCC、氧化铝陶瓷组件的散热已经到达其极限,更不用说有机材质的EMC等塑料材料是无法适用于此领域的,因此需要更高热导率的陶瓷基板来对应紫外线领域。
另外,以现有的材料以及封装制程用于紫外线发光二极管的领域而言,当整个封装结构长期处于紫外线照射范围内,无论是导线架本身材料,甚至连导线架上框与陶瓷电路载板间的黏合层,都可能在紫外线长期曝晒下,产生材料脆化或是黏合层剥离的状况发生,尤其是本体采用有机材料(例如PPA或是EMC等有机物)或是采用有机胶体黏合上框与陶瓷电路载板的状况下(市场上有黏合层采用UV胶,但即使是UV胶还是会脆化),是需要尽量避免的。
更进一步的说,LED封装产业的固晶制程对于晶粒而言是属于300℃以上的高温制程,并采用铟、高温锡等制程来施做的导线架时,在封装固 晶制程往往会因为温度高于铟、高温锡键合时的温度,则容易造成后续生产稳定性不足以符合产业界的需求。
因此,若封装本体材料无法抵抗紫外线侵袭,黏合层强度不够或是工艺未顾虑到后续制程,则产品迅速劣化、损坏、妥善率低是可以想见的；然而,业界为能克服上述的各项缺失,在经过多次实验后发觉了封装材料理应采用无机材料,但仍苦于没有让无机材料结合的有效方法。
发明内容
本发明的目的在于提供一种手扶梯扶手紫外线灭菌模组,利用金属共晶结构的强度,以抵抗使用本产品时热能累积造成不同材料间的热涨冷缩效应,解决金属结合层剥离议题,进而提升产品良率。
本发明的目的在于提供一种手扶梯扶手紫外线灭菌模组,利用无机物材料施做,让整体产品长期在紫外线照射范围内,也不会发生材料脆化与黏合层剥离。
本发明的再一目的在于提供一种手扶梯扶手紫外线灭菌模组,其中,所述的灭菌模组为一含钛的灭菌模组。
本发明的另一目的是提供一种手扶梯扶手紫外线灭菌模组,其包括：一基板、一形成于所述基板侧面的钛层、一形成于上述钛层表面的图案化铜层、一紧固于所述图案化铜层一侧的紫外光芯片、一上框及一结合于所述上框一侧的石英玻璃；再者,于所述陶瓷基板的一侧则是固设有一层的铝基板(MCPCB),并在所述铝基板的一侧是加有一散热结构；一壳体,则是可将上述的各组件予以包覆起来,并结构是可设置在一手扶梯扶手一端,以能将所述紫外光芯片所发出的紫外光遮蔽,以避免外泄。如此,则可利用前述的紫外光芯片不断地对手扶梯扶手发出紫外光,以进行灭菌。
本发明的再一目的是提供一种手扶梯扶手紫外线灭菌模组,其中,所述的基板以及上框的热膨胀系数差异介于75～80％之间。
本发明的再一目的是提供一种手扶梯扶手紫外线灭菌模组,其中,所述的散热结构是包括了一散热板、一固设于散热板一侧的散热鯺片以及一设置在散热鯺片一侧的风扇,以可加强气流的流动,以主动将热迅速导出。
本发明的再一目的是提供一种手扶梯扶手紫外线灭菌模组,其中,所述的散热板为铜板,且所述的散热鯺片为金属制的散热鯺片。
本发明的再一目的是提供一种手扶梯扶手紫外线灭菌模组,其中,所述的散热板为铜板,且所述的散热鯺片为铝制散热鯺片。
本发明的再一目的是提供一种手扶梯扶手紫外线灭菌模组,其中,所述的散热板为铜板,且所述的散热鯺片为铜制散热鯺片。
本发明的再一目的是提供一种手扶梯扶手紫外线灭菌模组,其中,所述的散热板为铜板,且所述的散热鯺片为铝、铜合金制散热鯺片。
本发明由于采用了以上技术方案，使其具有以下有益效果：通过运用半导体与微机电领域的背景概念,透过ICH技术(Inorganic Ceramic Heterogeneity)改良的金属扩散效应的金属共晶结构,使其结构强度足以抵抗使用时造成的热涨冷缩应力,且因为不论是基板、上框或是石英玻璃盖板板,甚或是铝基板、散热结构等材料皆为无机物,可以长期曝晒于紫外线照射范围而不被紫外线破坏,材料不会脆化且黏合层也不会剥离,因此可以避免掉目前产业所面临的技术问题。
图1为本发明手扶梯扶手紫外线灭菌模组中内置有芯片的封装结构。
图2为本发明一种手扶梯扶手紫外线灭菌模组的立体外观图。
图3为本发明手扶梯扶手紫外线灭菌模组形成数组排列的立体外观实施例示意图。
图4为本发明手扶梯扶手紫外线灭菌模组形成数组排列时另一实施例的立体外观示意图。
图5为本发明手扶梯扶手紫外线灭菌模组设置于手扶梯端部位置的侧视示意图。
第6为本发明手扶梯扶手紫外线灭菌模组设置于手扶梯端部位置的示意图。
图7为本发明手扶梯扶手紫外线灭菌模组设置于手扶梯端部后的内部位置以及设置方式。
图8为本发明手扶梯扶手紫外线灭菌模组设置于手扶梯端部的端视图。模组模组
附图中标识说明如下：
1-封装结构、11-紫外光芯片、12-基板、121-含钛化合物层、13-钛层、14-图案化铜层、15-上框、16-盖板、2-系统板、3-散热结构、31-散热板、 32-散热鯺片、33-风扇、4-壳体、41-顶盖、5-手扶梯、51-扶手、52-围栏。
下面结合附图和具体实施例对本发明做进一步详细的说明。
本发明为一种手扶梯扶手紫外线灭菌模组,主要是可通过此一紫外线灭菌模组来对手扶梯扶手发射出持续不断的紫外光,以保持手扶梯扶手的干净、无菌,并避免病菌的滋生以及传染。
请参阅附图的图1,其中可见及本发明所提供的手扶梯扶手紫外线灭菌模组主要是包括了:一内含有紫外光芯片11于其内部的封装结构1、一系统板2,亦称铝基板,一散热结构3,以及一壳体4(如图7所示)。其中,值得注意的是在封装结构1中则又具备了有一基板12,一层形成于所述基板12一侧面的钛层13,一层形成于所述钛层13一侧面的图案化铜层14,一形成于所述图案化铜层14一自由面上,且可将所述紫外光芯片11围绕且保护起来的上框15,还有一具有高穿透率的盖板16。
基板12的材料可选自铜、铜合金、铝、铝合金、铁钴镍合金、氮化铝、氧化铝、氮化硅或碳化硅；而在选定的基板12材料后,如上所述的,会在基板12的一面形成一中介的钛层13,而此钛层13在和基板12经过制程的加工后,则会在其间产生一含钛化合物层121,此含钛化合物层121因为选定的基板12材料不同而会有不同的组成,例如是氧化钛、钛铝合金、氮化铝钛、硅化钛…等。所述的上框15在和基板12利用纯无机的共晶结合(eutectic bond)技艺稳固地结合后,若欲强化彼此间的结合力,则需要注意的是,所述上框15的材料可选自铜、铜合金、铝、铝合金、铁钴镍合金、氮化铝、氧化铝、氮化硅或碳化硅；亦即,所述的基板12以及所的上框15彼此间所可选择的材料相同；而为了能加强彼此间的结合力,所述基板12和上框15的材料最好是对应,亦即,其间材料间的膨胀系数是介于75～80％之间才不致于在制程中或是操作过程中因为不断的热胀冷缩而因为热膨胀系数差异过大而形成脱落,分离的情形。在所述的上框15与基板12结合后,则是将所述的盖板16一样利用共晶结合的技艺来将所述的紫外光芯片11稳固且气密地密封于所述的封装结构1中。
于图2、图3所示,封装结构1是固设在一系统板(抑称铝基板)2上,以可供外界的控制模组(未显示)来加以控制；而后,各个设置有封装结构1的系统板2则是以数组排列的方式设在一散热结构3之上,以加强来自所述系统 板2所传导热的散发；其中,所述的散热结构3包括了一般是铜制的散热板31板,以及设置在散热板31一侧的散热鯺片32,由上述的散热板31、散热鯺片32得知,上述的二个组件都是以被动方式来将热利用传导来散发出去；而为了能增加对热的散发,可在所述散热板31的一侧设置一风扇33来将空气吹向散热鯺片32,以主动地强化对热的散发。
请参看图4所示,其中可见到二,二散热结构3可以铰接合实施例所示)、链接(未示)或是任何适用的方式连结起来,以形成符合施工现地规格大小的尺寸。
请再参看附图所示的图5、图6、图7以及图8；其中可见到本发明所提供的手扶梯扶手紫外线灭菌模组是可设置在手扶梯5和地板(未标示)间的空间处,当然,本发明的手扶梯扶手紫外线灭菌模组也可设置在其它位置,故而附图所示的实施例仅是在于显示各种不同实施例中的一种,并不在于限制本发明于实施时的范围或是其使用方式,其所界定的亦仅是作为参考,而不应解释为是一种限制的呈现。
由附图中可见到本发明的手扶梯5扶手51紫外线灭菌模组的最外部是设置了所述的壳体4,所述的壳体4主要是在将所述的紫外线灭菌模组中所发出的紫外光予以屏蔽起来,以避免紫外光外泄时或有可能造成使用手扶梯人因为受到紫外光的照射而受到伤害。因此,所述的壳体实质上是将整个的灭菌模组予以包覆起来,而仅留下相对二侧,以供扶手51的通过；其中可见到的是将设有各系统板2的散热结构放在扶手51的一侧面时,各个封装结构1中的盖板16是直接的面向着所述扶手51的一面,如此,位在所述封装结构1内部的紫外光芯片11则可透过具高穿透率的盖板16来朝向所述的扶手51发射紫外光,以进行灭菌的程序；而最好的,是在所述的壳体4的上端,靠近于手扶梯5围栏52的二侧各有一朝向所述围栏52斜向的顶盖41,以尽可能地将紫外光留置在壳体4之内,而不致外泄出去。
为了能加强紫外光对于扶手51的灭菌效果,本发明所提供的手扶梯扶手紫外线灭菌模组亦可在壳体4的内侧壁处设置有反光镜(未标号),或涂布有反光涂料。借着在散热结构3的散热板31、设置在所述散热板31一侧的散热鯺片32,以及选项设置的风扇33,虽然紫外光芯片11的能量有超过90％的能量被转换成为热并进而散发出来,为能持续不断地对手扶梯扶手提供灭菌的功效,上述强化的散热结构3能够完全地符合市场所需；同时,也因为封装结构1中是采用了共晶结合的技术,所以能提供一安全系数高,产 品稳定性优良的终端产品。
当不能以此限定本发明的实施范围,即依照本发明申请专利范围及发明说明书内容所做的等效果修饰与变化,仍应属于本发明专利涵盖范围之内。
Claims (12)
- 一种手扶梯扶手紫外线灭菌模组，其特征在于，其包括：一含有基板以及一形成于所述基板侧面的含钛化合物层的封装结构；一铝基板,固设于所述基板的一侧；以及一壳体,其将所述封装结构、铝基板予以覆盖起来,以防止紫外线的外泄,其中,所述的封装结构发出紫外光光束。
- 如权利要求1所述的手扶梯扶手紫外线灭菌模组,其特征在于,所述的封装结构还包括一形成于上述含钛化合物层表面的图案化铜层、一紧固于所述图案化铜层一侧,且可发出所述紫外光光束的紫外光芯片、一上框以及一结合于所述上框一侧的盖板,以可将所述的紫外光芯片封装于其中。
- 如权利要求1所述的手扶梯扶手紫外线灭菌模组,其特征在于,所述的铝基板一侧设置有一散热结构,以主动将所述紫外光芯片所产生,并传导到所述铝基板的热散发掉。
- 如权利要求所述的手扶梯扶手紫外线灭菌模组,其特征在于,所述的基板具有一第一热膨胀系数,且所述的上框具有一第二热膨胀系数,所述的第一热膨胀系数和所述的热膨胀系数差异是介于75％～80％之间。
- 如权利要求3所述的手扶梯扶手紫外线灭菌模组,其特征在于,所述的散热结构是包括了一散热板、一固设于散热板一侧的散热鯺片以及一设置在散热鯺片一侧的风扇。
- 如权利要求5所述的手扶梯扶手紫外线灭菌模组,其特征在于,所述的散热板为铜板,且所述的散热鯺片为铝制的散热鯺片。
- 如权利要求5所述的手扶梯扶手紫外线灭菌模组,其特征在于,所述的散热板为铜板,且所述的散热鯺片为铜制的散热鯺片。
- 如权利要求5所述的手扶梯扶手紫外线灭菌模组,其特征在于,所述的散热板为铜板,且所述的散热鯺片为铝、铜合金制散热鯺片。
- 如权利要求1所述的手扶梯扶手紫外线灭菌模组,其特征在于,所述的基板和所述的上框是利用共晶加以结合。
- 如权利要求1所述的手扶梯扶手紫外线灭菌模组,其特征在于,所述的壳体内侧面是设置有反光镜,或反光涂料。
- 如权利要求1所述的手扶梯扶手紫外线灭菌模组,其特征在于,所 述的基板是氧化铝、氮化铝、氮化硅或碳化硅中的一种。
- 如权利要求11所述的手扶梯扶手紫外线灭菌模组,其特征在于,所述的上框是氧化铝、氮化铝、氮化硅或碳化硅中的一种。
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