WO2021153153A1 - Procédé de fabrication de résistance, et résistance - Google Patents

Procédé de fabrication de résistance, et résistance Download PDF

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Publication number
WO2021153153A1
WO2021153153A1 PCT/JP2020/049196 JP2020049196W WO2021153153A1 WO 2021153153 A1 WO2021153153 A1 WO 2021153153A1 JP 2020049196 W JP2020049196 W JP 2020049196W WO 2021153153 A1 WO2021153153 A1 WO 2021153153A1
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Prior art keywords
resistor
electrode body
recess
base material
present
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PCT/JP2020/049196
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English (en)
Japanese (ja)
Inventor
航児 江藤
陽平 常盤
玲那 金子
純平 山本
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Koa株式会社
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Publication of WO2021153153A1 publication Critical patent/WO2021153153A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C13/00—Resistors not provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals

Definitions

  • the present invention relates to a method for manufacturing a resistor and a resistor.
  • JP2009-071123A discloses a resistor in which a pair of electrodes are welded to both end faces of the resistor as a resistor for current detection.
  • the resistance value is adjusted by trimming a part of the resistor, but when trimming is performed at an arbitrary position on the resistor, the heat distribution of the resistor is designed.
  • the heat distribution will be different from that of the above, and there is a risk that the resistor after mounting and the circuit board at the mounting destination will be adversely affected.
  • an object of the present invention is to provide a method for manufacturing a resistor whose resistance value can be adjusted while reducing changes in heat distribution, and a resistor.
  • a resistor comprising a resistor and a pair of electrodes connected to the resistor, and the resistance value can be adjusted by trimming a part of the resistor.
  • a recess is formed as a trimming in the resistor at the boundary between the resistor and the electrode.
  • FIG. 1 is a perspective view of the resistor of the present embodiment.
  • FIG. 2 is a perspective view of the resistor of the present embodiment as viewed from the mounting surface side on the circuit board.
  • FIG. 3 is a diagram showing a mounting surface of a resistor and is a diagram for explaining a recess.
  • FIG. 4 is a side view of the resistor shown in FIG. 3 and a diagram showing the heat distribution of the resistor.
  • FIG. 5 is a side view of a modified example of the recess.
  • FIG. 6 is a schematic view when a recess is formed in the resistor of the present embodiment.
  • FIG. 7 is a cross-sectional photograph of the resistor of the present embodiment solder-mounted.
  • FIG. 8 is a side view showing a modified example of the resistor of the present embodiment.
  • FIG. 9 is a plan view showing a modified example of the resistor of the present embodiment.
  • FIG. 10 is a schematic view illustrating a method for manufacturing a resistor according to the present embodiment.
  • FIG. 11 is a front view of the die used in the step (c) shown in FIG. 10 as viewed from the upstream side in the drawing direction F.
  • FIG. 12 is a cross-sectional view taken along the line BB of FIG. 11 and is a schematic view illustrating a step of processing a shape in the method for manufacturing a resistor according to the present embodiment.
  • FIG. 1 is a perspective view of the resistor 1 of the present embodiment.
  • FIG. 2 is a perspective view of the resistor 1 of the present embodiment as viewed from the mounting surface side on the circuit board.
  • the resistor 1 includes a resistor 10, a first electrode body 11 (electrode), and a second electrode body 12 (electrode), and the first electrode body 11, the resistor 10, and the second electrode body 12 are formed. It is joined in this order.
  • the resistor 1 is mounted on a circuit board or the like not shown in FIG.
  • the resistor 1 is arranged on a pair of electrodes formed on a land pattern of a circuit board.
  • the resistor 1 is used as a current detection resistor (shunt resistor).
  • the direction in which the first electrode body 11 and the second electrode body 12 are arranged is the X direction (the first electrode body 11 side is the + X direction, and the second electrode body 12 side is the second electrode body 12 side).
  • the width direction of the resistor 1 is the Y direction (the front side of the paper surface in FIG. 1 is the + Y direction, and the back side of the paper surface in FIG. 1 is the -Y direction).
  • the thickness direction of the resistor 1 is set to the Z direction (the direction toward the circuit board is the ⁇ Z direction, and the direction away from the circuit board is the + Z direction), and the X direction, the Y direction, and the Z direction are orthogonal to each other.
  • the mounting surface of the resistor 1 means a surface on which the resistor 1 faces the circuit board when the resistor 1 is mounted on the circuit board, and the first electrode body 11, the resistor 10, and the second electrode body. Includes a surface facing the 12 circuit boards.
  • the surface opposite to the mounting surface is referred to as the upper surface.
  • the resistor 10 is formed in a rectangular parallelepiped (or cubic) shape.
  • the resistor 10 it is possible to use a material having a low resistance to a high resistance according to the application.
  • the resistor 10 is preferably a resistor material having a small resistivity and a small temperature coefficient of resistance (TCR) from the viewpoint of accurately detecting a large current.
  • TCR temperature coefficient of resistance
  • copper / manganese / nickel alloys, copper / manganese / tin alloys, nickel / chromium alloys, copper / nickel alloys and the like can be used.
  • the first electrode body 11 includes a body portion 21 joined to the resistor body 10 and a leg portion 22 formed integrally with the body portion 21 and extending toward the circuit board.
  • the second electrode body 12 includes a body portion 31 joined to the resistor body 10 and a leg portion 32 formed integrally with the body portion 31 and extending toward the circuit board.
  • the first electrode body 11 (body portion 21, leg portion 22) and the second electrode body 12 (body portion 31, leg portion 32) have good electrical conductivity and thermal conductivity from the viewpoint of ensuring stable detection accuracy. It is preferably a conductive material.
  • copper, a copper-based alloy, or the like can be used as the first electrode body 11 and the second electrode body 12.
  • oxygen-free copper C1020
  • the same ones can be used.
  • the body portion 21 of the first electrode body 11 has an end face having substantially the same shape as the end face of the resistor 10 in the + X direction, and is joined to the end face of the resistor 10 so as to be abutted against the end face of the resistor 10 in the + X direction. ..
  • the joint portion 13 which is the boundary portion between the body portion 21 and the resistor portion 10
  • the boundary between the resistor portion 10 and the body portion 21 is flat without a step, and the resistor 10 and the body portion 21 are smoothly continuous. There is. That is, the surface of the joint portion 13 is formed flat (without a step) over the entire boundary between the resistor 10 and the body portion 21.
  • the body portion 31 of the second electrode body 12 has an end face having substantially the same shape as the end face of the resistor 10 in the ⁇ X direction, and is joined in such a manner that the end face is abutted with the end face of the resistor 10 in the ⁇ X direction. ing.
  • the joint portion 14 which is the boundary portion between the body portion 31 and the resistor portion 10
  • the boundary between the resistor portion 10 and the body portion 31 is flat without a step, and the resistor 10 and the body portion 31 are smoothly continuous.
  • the surface of the joint portion 14 is formed flat (without a step) over the entire boundary between the resistor 10 and the body portion 31.
  • the leg portion 22 is a member extending from the mounting surface of the resistor 1, that is, the circuit board side of the body portion 21 in the ⁇ Z direction.
  • the leg portion 22 has a shorter length in the X direction than the body portion 21, but the side surface in the + X direction forms the same plane as the side surface in the + X direction of the body portion 21.
  • the leg portion 32 is a member extending from the mounting surface of the resistor 1, that is, the circuit board side of the body portion 31 toward the ⁇ Z direction.
  • the leg portion 32 has a shorter length in the X direction than the body portion 31, but the side surface in the ⁇ X direction forms the same plane as the side surface in the ⁇ X direction of the body portion 31.
  • each of the bonding surfaces is a diffusion bonding surface in which the metal atoms of the resistor 10 and the first electrode body 11 are diffused with each other, and a diffusion bonding surface in which the metal atoms of the resistor 10 and the second electrode body 12 are diffused with each other. ing.
  • the resistor 1 is mounted on the circuit board so that the legs 22 and 32 project toward the circuit board, so that the resistor 10 is mounted on the circuit board in a state of being separated from the circuit board.
  • the portion protruding from the body portion 21 in the ⁇ X direction is the protruding portion 211, and the protruding portion 211 is joined to the resistor 10.
  • the portion protruding from the body portion 31 toward the + X direction is the protruding portion 311, and the protruding portion 311 is joined to the resistor 10.
  • the length L (see FIG. 1) in the longitudinal direction (X direction) of the resistor 1 is constant, the length L1 (length of the body portion 21, see FIG. 1) of the protruding portion 211 in the X direction, or the protrusion.
  • the length L0 of the resistor 10 in the longitudinal direction (X direction) of the resistor 10 the length L1 of the first electrode body 11 in the X direction, and the length L2 of the second electrode body 12 in the X direction.
  • the resistor 1 has a streak-like unevenness 15 (see the enlarged view of FIG. 1 and the enlarged view of FIG. 2) on the surface.
  • the streak-like unevenness 15 is formed so as to extend along the Y direction on the side surface of the resistor 1 facing the + Y direction and the side surface other than the side surface facing the ⁇ Y direction.
  • the surface roughness due to the concave and convex portions of the streak-like unevenness 15 can be 0.2 to 0.3 ⁇ m in arithmetic average roughness (Ra).
  • the length L of the resistor 1 in the X direction is formed to be 3.2 mm or less. Further, the resistance value of the resistor 1 is adjusted to be 2 m ⁇ or less.
  • the length L of the resistor 1 in the X direction is 3.2 mm or less
  • the length (width) W of the resistor 1 in the Y direction is 1.6 mm.
  • the following (product standard 3216 size) can be used. Therefore, as the size of the resistor 1 of the present embodiment, the product standard 2012 size (L: 2.0 mm, W: 1.2 mm), the product standard 1608 size (L: 1.6 mm, W: 0.8 mm), It is also applicable to product standard 1005 size (L: 1.0 mm, W: 0.5 mm).
  • the length L of the resistor 1 of the present embodiment is the above-mentioned product standard from the viewpoint of handleability in the manufacturing method described later, for example, prevention of breakage of the resistor base material 100 (see FIG. 14) which is the base of the resistor 1.
  • the size can be 1005 or more.
  • the resistance value of the resistor 1 can be adjusted to be 2 m ⁇ or less in any of the above sizes from the viewpoint of realizing small size and low resistance, for example, 0.5 m ⁇ or less. It is adjustable.
  • the low resistance here is a concept including a resistance value lower than the resistance value assumed from the dimensions of a general resistor (for example, a resistor of the type of JP-A-2002-57009).
  • the corner portions P which are the edges extending in the Y direction of the resistor 1, all have a chamfered shape.
  • the mounting surface side of the resistor 1 of the present embodiment (not only the mounting surface but also the side surface of the resistor 1 facing the Y direction and including a region near the mounting surface).
  • a recess 6 is formed in the hole.
  • the recess 6 is formed to adjust the resistance value of the resistor 1.
  • the recess 6 is formed along the joint portion 13 and the joint portion 14 on the mounting surface side of the resistor 1. This will be described later with reference to FIGS. 3 to 5.
  • FIG. 3 is a diagram showing a mounting surface of the resistor 1 and is a diagram for explaining the recess 6.
  • FIG. 4 is a side view of the resistor 1 shown in FIG. 3 and a diagram showing the heat distribution of the resistor 1.
  • FIG. 5 is a side view of a modified example of the recess 6.
  • the recess 6 (6a) is arranged so as to straddle the joint portion 13 on the mounting surface side of the resistor 1, and the resistor 10 and the first electrode body 11 extend in the Y direction. Is formed in.
  • the recess 6 (6b) is arranged so as to straddle the joint portion 14 on the mounting surface side of the resistor 1, and is formed in the resistor 10 and the second electrode body 12 so as to extend in the Y direction.
  • the + Y-direction end of the recess 6 (6a, 6b) is open to the side surface of the resistor 1 facing the + Y direction
  • the ⁇ Y-direction end of the recess 6 (6a, 6b) is the resistor 1. It is open to the side surface facing the ⁇ Y direction of.
  • the recesses 6 (6a, 6b) are groove-shaped recesses, and the cross section seen from the Y direction is substantially semicircular (or rectangular, amorphous).
  • the recess 6 (6c, 6d) as a modification is formed so as to extend the resistor 1 in the Y direction like the recess 6 (6a, 6b) shown in FIGS. 4 and 5. However, all of them are formed so as to be grooved in the Y direction in the region of only the resistor 10.
  • the end portion of the recess 6 (6c) in the + X direction overlaps with the joint portion 13.
  • the end portion of the recess 6 (6d) in the ⁇ X direction overlaps with the joint portion 14.
  • the cross section of the recess 6 (6c, 6d) seen from the Y direction is also substantially semicircular (or rectangular, amorphous).
  • the heat distribution of the resistor 1 when the current is supplied is as shown in FIG. That is, the maximum temperature is the highest in the central portion of the resistor 10 in the X direction, and the temperature gradient is inclined to the low temperature side while the temperature is lowered each time the resistor 10 is separated from the central portion in the X direction. After that, the heat distribution reaches the inflection point (inflection point a, inflection point b) where the temperature gradient becomes maximum, and then the temperature decreases as the temperature approaches the electrode, but the temperature gradient becomes smaller.
  • the resistance value is generally adjusted in such a manner that the resistance value is shifted to the high resistance side by cutting (trimming) a part of the resistor 10.
  • a part of the resistor 10 is cut off at the center of the resistor 10 in the X direction and its vicinity, or at the above-mentioned inflection point and its vicinity, the heat distribution of the entire resistor 10 is designed. There is a risk of significant changes from the heat distribution.
  • the resistor 10 when electric power is applied to the resistor 1, the resistor 10 generates heat, but the central portion of the resistor 10 in the longitudinal direction (X direction) has the highest temperature, and the characteristic of the central portion is the heat distribution of the entire resistor 1. Has the greatest impact on.
  • the heat distribution of the resistor 1 changes significantly. Therefore, when a resistor including such a resistor 10 is mounted on a circuit board and used, not only the resistor 1 but also the heat distribution of the circuit board changes from the design heat distribution, and the resistor and the circuit board have the same heat distribution. There is a risk of adverse effects.
  • the recesses 6 (6a, 6c), which are trimming marks are located near the joint portion 13 in the resistor 10, that is, the first electrode is located at the inflection point a. It is formed on the body 11 side.
  • the recesses 6 (6b, 6d), which are trimming marks are formed in the resistor 10 in the vicinity of the joint portion 14, that is, on the second electrode body 12 side of the above-mentioned inflection point b. This makes it possible to adjust the resistance value while suppressing changes in the heat distribution.
  • trimming is performed by irradiating at least the resistor 10 (and the first electrode body 11 and the second electrode body 12) with a laser, and a recess 6 is formed as a trimming mark thereof.
  • a recess 6 is formed by this method, an oxide film is formed on the inner wall of the recess 6, the inner wall of the recess 6, and the periphery thereof.
  • the oxide film is a thermal oxide film formed by irradiating the surface of any one of the resistor 10, the first electrode body 11, and the second electrode body 12 with a laser and heating the surface. It is known that this oxide film has low wettability with respect to solder.
  • the resistor 1 of the present embodiment is mounted on the circuit board by the reflow process, and at that time, the solder easily crawls up the legs 22 and 32.
  • the recess 6 extends in the Y direction and opens the side surface of the resistor 1 facing the + Y direction and the side surface facing the ⁇ Y direction of the resistor 10 (and). It is formed in the first electrode body 11 and the second electrode body 12).
  • the oxide film can block the path through which the solder that has crawled up the legs 22 and 32 in the reflow process climbs up to the resistor 10. Therefore, it is possible to prevent the solder from coming into contact with the resistor 10 in the reflow process, and to avoid a decrease in current detection accuracy using the resistor 1.
  • the solder that crawls up the leg 22 is the resistor 10 from the joint position (joint 13) of the first electrode body 11 on the mounting surface with the resistor 10. Crawling to the side (-X direction side) is prevented. Then, the solder that crawls up the leg portion 32 prevents the solder that crawls up from the joint position (joint portion 14) of the second electrode body 12 of the mounting surface to the resistor 10 to the resistor 10 side ( ⁇ X direction side). Will be done.
  • FIG. 6 is a schematic view in the case where the recess 6 is formed in the resistor 1 of the present embodiment.
  • a recess 6 is formed as a trimming mark, and an oxide film is formed on the inner wall of the recess 6, the inner wall of the recess 6, and the periphery thereof. Is formed. Therefore, in the trimming by laser irradiation, the resistance value can be adjusted and the solder can be prevented from creeping up at the same time.
  • the laser is irradiated to a predetermined range including the joint portion 13 and a predetermined range including the joint portion 14 on the mounting surface side of the resistor 1.
  • the resistor 1 of the present embodiment is clad-bonded (solid-phase bonded) with the resistor base material 10A sandwiched between the electrode body base materials 11A and 12A. It is formed by inserting the resistor base material 100 into the die 300 to reduce the cross-sectional area, transforming the cross-sectional shape into the cross-sectional shape of the resistor 1, and cutting the resistor base material 100 after being inserted into the die 300. .. Therefore, the joint portion 13 (boundary portion) and the joint portion 14 (boundary portion) are usually flat surfaces (straight lines), but may meander slightly. In this case, it is difficult to irradiate the laser only at the joint portion 13 and the joint portion 14.
  • the resistor 10 and the first electrode body 11 are irradiated with the laser at the joint portion 13.
  • the laser is, for example, + Y from a position at the end of the irradiation area 51 in the ⁇ X direction and separated from the resistor 1 in a plan view. It moves in the direction, irradiates the resistor 1, and moves to a position away from the resistor 1 in a plan view. After that, the laser moves slightly in the + X direction (the amount of movement is smaller than the spot diameter on the resistor 1 of the laser), moves in the ⁇ Y direction, irradiates the resistor 1 and irradiates the resistor 1 in a plan view. Move to a position away from. After that, the same operation is repeated to irradiate the entire irradiation area 51 with the laser.
  • the laser may not be stable because its output becomes excessive or too small immediately after oscillation. Therefore, as described above, it is possible to start oscillating the laser from a position separated from the resistor 1 in a plan view (a position where the laser is not irradiated to the resistor 1) and irradiate the resistor 1 with a laser having a stable output. desirable.
  • the resistance value is not stable. Therefore, the resistance value is measured after the laser irradiation, and the laser irradiation and the measurement of the resistance value are alternately performed until the resistance value reaches the desired resistance value. You can repeat it.
  • FIG. 7 is a cross-sectional photograph of the resistor 1 of the present embodiment solder-mounted.
  • the resistor 1 shown in FIG. 7 is formed by clad bonding by abutting the end face of the resistor 10 and the end face of the first electrode body 11 and abutting the end face of the resistor 10 and the end face of the second electrode body 12 in the same manner as described above. It was done.
  • an oxide film is formed at the boundary portion straddling the joint portion 14 between the second electrode body 12 and the resistor 10, but the first electrode body 11 and the resistor 10 are formed. No oxide film is formed at the boundary portion straddling the joint portion 13.
  • the resistor 1 was mounted on the circuit board 7 via the solder 9 by the reflow process.
  • the solder 9 that has come into contact with the leg portion 22 of the first electrode body 11 on the right side crawls up the leg portion 22, crawls up to the resistor 10 via the protrusion 211 on the mounting surface, and contacts the resistor 10. It is in a state of being.
  • the solder 9 in contact with the leg portion 32 of the second electrode body 12 crawls up the leg portion 32 and crawls up to the protruding portion 311 on the mounting surface, but the crawl up is prevented at a position in contact with the oxide film. ..
  • the boundary portion straddling the joint portion 14 between the second electrode body 12 and the resistor 10 and the boundary portion straddling the joint portion 13 between the first electrode body 11 and the resistor 10 are oxidized.
  • Each of the recesses 6 having a film is formed. It can be easily understood that this makes it possible to prevent the solder 9 from climbing up to the resistor 10.
  • FIG. 8 is a side view showing a modified example of the resistor 1 of the present embodiment.
  • FIG. 9 is a plan view showing a modified example of the resistor 1 of the present embodiment.
  • the leg portion 22 of the first electrode body 11 and the leg portion 32 of the second electrode body 12 are not provided, and the mounting surface of the resistor 1 is flat.
  • the electrodes 71 and 72 are arranged on the circuit board 7, and the electrodes 71 and 72 are arranged so as to project from the circuit board 7.
  • the first electrode body 11 is mounted on the electrode 71 by solder (not shown), and the second electrode body 12 is mounted on the electrode 72 by solder (not shown).
  • the resistor 10 is arranged slightly separated from the circuit board 7.
  • a recess 6 (6e) is formed so as to straddle the joint portion 13
  • a recess 6 (6f) is formed so as to straddle the joint portion 14.
  • the recesses 6 (6e, 6f) extend in the Y direction by laser irradiation as described above, and resist so as to open the side surface of the resistor 1 facing the + Y direction and the side surface of the resistor 1 facing the ⁇ Y direction. It is formed in the vessel 1, and an oxide film is formed on the inner wall and its periphery.
  • the reflow step it is possible to prevent the solder that has crawled up the first electrode body 11 from crawling up to the resistor 10 beyond the recess 6 (6e) (oxide film) formed in the joint portion 13. Further, it is possible to prevent the solder crawling up on the second electrode body 12 from crawling up to the resistor 10 beyond the recess 6 (6f) (oxide film) formed in the joint portion 14.
  • a recess 6 (6 g) is formed so as to straddle the joint portion 13
  • a recess 6 (6 h) is formed so as to straddle the joint portion 14.
  • the recesses 6 (6 g) are formed at both ends in the Y direction (may be other places) in a manner of trimming a part of the joint portion 13 on the upper surface.
  • the recesses 6 (6h) are formed at both ends in the Y direction (may be other places) in a manner of trimming a part of the joint portion 14 on the upper surface.
  • the recess 6 (6g, 6h) is formed to adjust the resistance value. Therefore, the recesses 6 (6g, 6h) need not be formed on the upper surface of the resistor 1 in a manner that reaches from end to end in the Y direction, and the inner wall may not have an oxide film.
  • the recess 6 (6g, 6h) is an effective component when the resistance value is not sufficiently adjusted only by the recess 6 (6e, 6f) formed on the mounting surface side.
  • the recess 6 (6 g) may be formed at a position on the side surface of the resistor 1 in the + Y direction and / or the side surface in the ⁇ Y direction and overlapping the joint portion 13.
  • the recess 6 (6h) may be formed at a position on the side surface of the resistor 1 in the + Y direction and / or the side surface in the ⁇ Y direction and overlapping the joint portion 14.
  • the recesses 6 (6a, 6b, 6c, 6d, 6e, 6f) formed on the mounting surface side can be formed without an oxide film.
  • the opening 301 (outlet opening 303) It can also be formed by inserting the resistor base material 100 into the opening 301 with a shape that follows the outer shape of the recess 6 added to the recess 6.
  • the resistor 10 includes a resistor 10 and a pair of electrodes (first electrode body 11, second electrode body 12) connected to the resistor 10.
  • This is a method for manufacturing a resistor 1 whose resistance value can be adjusted by trimming a part of the resistor 1, and is a boundary portion (joint portion) between the resistor 10 and an electrode (first electrode body 11, second electrode body 12).
  • a recess 6 is formed in the resistor 10 at the joint portion 14) as a trimming.
  • the resistor 10 generates heat when a current is applied, but the resistor 10 has a boundary portion (joint portion 13, joint portion 14) between the resistor 10 and the electrodes (first electrode body 11, second electrode body 12). Is the lowest temperature. Therefore, by forming the recess 6 as a trimming in the boundary portion (joint portion 13, joint portion 14), the resistance value can be adjusted while reducing the change in the heat distribution of the resistor 1.
  • the recess 6 when the recess 6 is mounted on the substrate (circuit board) with the resistor 10 and the pair of electrodes (first electrode body 11, second electrode body 12) both facing the substrate (circuit board). It is formed on the mounting surface of the resistor 1 of. As a result, the recess 6 is not formed on the opposite surface (upper surface) of the resistor 1 on the mounting surface side, and the opposite surface can maintain flatness. Therefore, when the resistor 1 is mounted, the resistor 1 is subjected to negative pressure. This makes it possible to secure the adsorptivity of the nozzle that sucks and holds.
  • the recess 6 when the recess 6 is formed by laser irradiation, an oxide film is formed on the inner wall of the recess 6, the inner wall of the recess 6, and the peripheral edge thereof, and the oxide film can prevent the solder from creeping up during mounting. Therefore, it is possible to prevent the resistor 10 from coming into contact with the solder and avoid a decrease in detection accuracy in the current measurement using the resistor 1.
  • the electrodes project from the body portions 21 and 31 connected to the resistor 10 and the body portions 21 and 31 toward the substrate (circuit board). It has legs 22 and 32.
  • the oxide film is formed in the recess 6, it is possible to prevent the solder from creeping up to the resistor 10 while ensuring the bonding between the legs 22 and 32 and the solder.
  • the resistor 10 and the electrodes are joined so that their end faces are abutted against each other.
  • a small and low resistance resistor 1 can be realized because it is composed of a pair of electrodes (first electrode body 11, second electrode body 12) that sandwich the resistor 10 and the resistor 10.
  • the recess 6 is formed from the resistor 10 to the electrodes (first electrode body 11, second electrode body 12). Thereby, trimming can be performed stably.
  • a resistor 10 and a pair of electrodes (first electrode body 11, second electrode body 12) connected to the resistor 10 are provided, and a part of the resistor 10 is provided. It is a resistor 1 whose resistance value can be adjusted by trimming the resistor 1, and is a boundary portion (joint portion 13, joint portion 14) between the resistor 10 and an electrode (first electrode body 11, second electrode body 12).
  • a recess 6 is formed in the resistor 10 as trimming, and the recess 6 is formed by laser irradiation.
  • the resistor 10 generates heat when a current is applied, but the resistor 10 has a boundary portion (joint portion 13, joint portion 14) between the resistor 10 and the electrodes (first electrode body 11, second electrode body 12). Is the lowest temperature. Therefore, by forming the recess 6 as a trimming in the boundary portion (joint portion 13, joint portion 14), the resistance value can be adjusted while reducing the change in the heat distribution of the resistor 1. Further, when the recess 6 is formed by laser irradiation, an oxide film is formed on the inner wall of the recess 6, the inner wall of the recess 6, and the peripheral edge thereof, and the oxide film can prevent the solder from creeping up during mounting. Therefore, it is possible to prevent the resistor 10 from coming into contact with the solder and avoid a decrease in detection accuracy in the current measurement using the resistor 1.
  • the resistor 1 of the present embodiment has the following configurations, actions, and effects.
  • the resistor 1 includes the resistor 10 and a pair of electrodes (first electrode body 11, second electrode body 12) connected to the resistor 10.
  • the end face of the resistor 10 and the end face of the electrode (first electrode body 11, second electrode body 12) are butted and joined, and the electrode (first electrode body 11, second electrode body 12) is a body portion.
  • the length dimension of the long side of the resistor 1 is 3.2 mm or less, and the resistance value is 2 m ⁇ or less. be.
  • the resistor 10 and the pair of electrodes (first electrode body 11, second electrode body 12) connected to the resistor 10 constitute legs 22 and 32 protruding from the body portions 21 and 31 to the mounting surface. Will be done.
  • the resistor 1 can be realized because it can be pulled out from the detection terminal between the legs 22 and 23.
  • electrodes (first electrode body 11, second electrode body 12) are joined to both ends of the resistor 10, and the dimensions (in the X direction) of the resistor 10 are (in the X direction) of the resistor 1. It is smaller than the dimension. Therefore, it is possible to realize a resistor 1 having a lower resistance than a type of resistor in which a pair of electrodes are bonded to the lower surface of the resistor 10. From the above, it becomes a resistor 1 that can realize a smaller resistance (2 m ⁇ or less) that is not found in general resistors while realizing miniaturization (long side dimension 3.2 mm or less, 3216 size or less).
  • the resistor is formed by welding the resistor and the electrode body with an electron beam or the like, it is necessary to consider the influence of the bead due to the welding on the resistance value at this size.
  • the resistor 10 and the first electrode body 11 and the resistor 10 and the second electrode body 12 can be joined by diffusion bonding, respectively. Even if it is designed to be compact, characteristics such as resistance can be stabilized.
  • the boundary portion (joint portion 13, 14) between the resistor 10 and the body portions 21, 31 is flat.
  • the boundary between the resistor 10 and the body portions 21 and 31 becomes clear, and a good or bad judgment can be easily performed.
  • the resistor 1 is used as a shunt resistor, it is possible to suppress a decrease in the detection accuracy of the current generated due to a step at the boundary (joint portions 13 and 14) between the resistor 10 and the body portions 21 and 31. .. Further, the stability of resistance value and thermal characteristics can be improved.
  • the resistor 10 and the body portions 21 and 31 are joined by solid phase bonding.
  • the resistor 10 and the first electrode body 11 and the resistor 10 and the second electrode body 12 are firmly bonded to each other, so that good electrical characteristics can be obtained.
  • welding such as an electron beam is not used for joining the resistor 10 and the first electrode body 11 and the resistor 10 and the second electrode body 12, the joining portions 13 and 14 are joined. Has no welding beads (welded marks with uneven shape). Therefore, the bondability is not impaired when wire bonding or the like is applied to the surface of the resistor 1.
  • the body portions 21 and 31 have protruding portions 211 and 311 protruding toward the resistor 10.
  • the length L of the resistor 1 in the longitudinal direction (X direction) is constant, the length L1 of the protruding portion 211 in the X direction (the length of the body portion 21) or the length L of the protruding portion 311 in the X direction
  • the ends of the legs 22 and 32 on the mounting surface side in the arrangement direction (X direction) of the resistor 10 of the resistor 1 and the electrodes (first electrode body 11, second electrode body 12) are chamfered. It has a shape.
  • the corner portion P is chamfered, the bias of the current density in the corner portion P is alleviated. As a result, the occurrence of electromigration can be suppressed. Similarly, since the thermal stress concentration can be relaxed, the heat cycle resistance can be improved.
  • the alignment direction (X direction) of the resistor 10 and the electrodes (first electrode body 11, second electrode body 12) of the resistor 1 and the direction perpendicular to the mounting direction of the resistor 1 (Z direction) are set.
  • the width direction (Y direction) the surface of the resistor 10 and / or the surface of the electrodes (first electrode body 11, second electrode body 12) has streaky irregularities extending along the width direction (Y direction).
  • a surface (streak-like unevenness 15) is formed.
  • the surface area of the resistor 1 can be increased to improve heat dissipation, and when formed on the electrodes (first electrode body 11, second electrode body 12), solder for fixing the resistor 1 to the circuit board. It is possible to increase the joint strength of.
  • the resistor 10 is formed in a rectangular parallelepiped (or a cube).
  • the resistor 10 is formed from the first electrode body 11 and the second electrode body 12 which are formed in substantially the same shape as the end face of the resistor 10 and are joined to the end face of the resistor 10. Since the path of the current flowing through the is linear, the resistance value can be stabilized. Further, in the resistor 1, since the resistor 10 is joined between the first electrode body 11 and the second electrode body 12, the resistance value can be adjusted by minimizing the volume of the resistor 10. Is.
  • FIG. 10 is a schematic view illustrating a method for manufacturing the resistor 1 of the present embodiment.
  • the method for manufacturing the resistor 1 of the present embodiment includes a step of preparing the material (a), a step of joining the materials (b), a step of processing the shape (c), and cutting into individual resistors 1 ( It includes a step (d) of individualizing) and a step (e) of adjusting the resistance value of the resistor 1 using a laser.
  • the resistor base material 10A and the electrode body base materials 11A and 12A are prepared.
  • a copper / manganese / tin alloy or a copper / manganese / nickel alloy is used as the material of the resistor base material 10A (resistor 10) from the viewpoint of the size, resistance value and workability of the resistor 1.
  • oxygen-free copper C1020
  • the material of the electrode body base materials 11A and 12A first electrode body 11, second electrode body 12.
  • the electrode body base material 11A, the resistor base material 10A, and the electrode body base material 12A are stacked in this order, and pressure is applied in the stacking direction to join the resistor base material 100. To form.
  • step (b) so-called clad bonding (solid phase bonding) between dissimilar metal materials is performed.
  • the joint surface between the electrode body base material 11A and the resistor base material 10A that have been clad-bonded, and the joint surface between the electrode body base material 12A and the resistor base material 10A are the diffusion joint surfaces in which both metal atoms are diffused from each other. It has become.
  • the joint surface between the resistor base material 10A and the electrode body base material 11A and the joint surface between the resistor base material 10A and the electrode body base material 12A can be brought into contact with each other without welding with a general electron beam or the like. Can be firmly joined. Further, the joint surface between the resistor base material 10A (resistor 10) and the electrode body base material 11A (first electrode body 11) and the resistor base material 10A (resistor body 10) and the electrode body base material 12A (second electrode) Good electrical characteristics can be obtained at the joint surface with the body 12).
  • FIG. 11 is a schematic diagram illustrating a step (c) of processing a shape in the manufacturing method of the resistor 1 of the present embodiment.
  • the die 300 is used in the step (c).
  • the resistor base material 100 obtained by clad bonding is passed through the die 300.
  • An opening 301 is formed in the die 300.
  • the opening 301 has an inlet opening 302 set to a size into which the resistor base material 100 can be inserted, an outlet opening 303 set to a size smaller than the external dimension of the resistor base material 100, and an outlet from the inlet opening 302. It has an insertion portion 304 formed in a tapered shape toward the opening 303.
  • the resistor base material 100 By passing the resistor base material 100 through the die 300 having such a shape, the resistor base material 100 can be compressed and deformed from all directions. As a result, the cross-sectional shape of the resistor base material 100 becomes a shape that follows the outer shape of the die 300 (outlet opening 303).
  • the pull-out method is applied in which the resistor base material 100 is pulled out by the gripping tool 400.
  • a plurality of dies 300 having different sizes of the openings 301 may be prepared and subjected to a drawing process in which the plurality of dies 300 are passed in stages.
  • the resistor 1 of the present embodiment can be manufactured by changing the shape of the opening 301 of the die 300.
  • a die 300 having a shape protruding rectangularly toward the center of the opening is applied to a part of one side of the opening 301 (inlet opening 302, outlet opening 303). ..
  • a rectangular groove 105 continuous in the pulling direction is formed by the protruding shape provided in the rectangular outlet opening 303.
  • the rectangular groove 105 forms the body portion 21 and the leg portion 22 of the resistor 10 and the first electrode body 11, and the body portion 31 and the leg portion 32 of the second electrode body 12. Consists of a recess surrounded by.
  • the resistor 1 is cut out from the resistor base material 100 so as to have the designed length W in the Y direction. Further, in the present embodiment, in the step (d), from the surface 100a (mounting surface of the resistor 1) on which the rectangular groove 105 is formed in the resistor base material 100 to the opposite surface 100b (upper surface of the resistor 1). It is preferable to cut. As a result, the metal burr is formed so as to extend upward from the upper surface of the resistor 1, and the burr (toward the circuit board) extending in the ⁇ Z direction (FIGS. 1 and 2) at the legs 22 and 32. Burrs that extend) do not occur. As a result, the resistor 1 can be reliably mounted on the circuit board.
  • a piece of resistor 1 can be obtained from the resistor base material 100.
  • the resistor 10 is trimmed by laser irradiation to set the resistance value of the resistor 1 to a desired resistance value. The details of trimming are as described above (see FIGS. 8 to 10).
  • the corner portion P shown in FIGS. It is a streak-like sliding mark formed when sliding in a state.
  • the electrode body base material 11A, the resistor base material 10A, and the electrode body base material 12A are overlapped and pressure is applied to perform clad bonding (solid phase). It is integrated by joining).
  • the bonding strength between the resistor base material 10A (resistor 10) and the electrode body base material 11A (first electrode body 11) and the resistor base material 10A (resistor body 10) can be achieved without using welding with an electron beam or the like.
  • the electrode body base material 12A (second electrode body 12) can be increased.
  • the outer shape of the resistor base material 100 can be molded by passing the resistor base material 100 through the die 300 and compressing it from all directions. Therefore, after the resistor base material 100 is formed, the individual resistor 1 can be manufactured only by going through the step (d). Therefore, individual differences caused by the manufacture of the resistor 1 can be suppressed.
  • the bonding strength between the resistor 10 and the first electrode body 11 and the bonding strength between the resistor 10 and the second electrode body 12 are further increased. Can be enhanced.
  • the first stage is performed by a pair of rollers that pressurize the resistor base material 100 from the thickness direction (Z).
  • pressure welding is performed and then pressure welding is performed in the second stage by a pair of rollers that pressurize from the width direction (Y).
  • the resistor base material 100 in the first-stage pressure welding step, is compressed in the thickness direction Z, but expands in the width direction (Y). Further, in the subsequent pressure welding step of the second stage, the resistor base material 100 is compressed in the width direction Y, but expands in the thickness direction (Z). As a result, the dimensional accuracy is lowered, and the variation of individual resistors and the variation of temperature distribution when power is applied to the resistors become large.
  • the resistor base material 100 is pulled out through the die 300 to allow the resistor base material 100 to pass in the length direction (X) and the thickness direction (X). It can be uniformly compressed to Z).
  • the resistor base material 100 forms an electrically advantageous bonding interface as compared with the resistor base material obtained by repeating compression from one direction and compression from the other direction using a roller. It is thought that it will be done. Therefore, it is possible to suppress the characteristic difference of the resistor 1 as a finished product.
  • a plurality of dies 300 having different openings 301 are used stepwise, and the size of the resistor base material 100 is compression-molded so as to be stepwise reduced. While reducing the load on the base material 100 and the die 300, the resistor base material 100 can be uniformly compressed in the length direction (X) and the thickness direction (Z). As a result, it is possible to suppress variations in the characteristics of the resistor 1 as a finished product.
  • the accuracy of the finished product is improved as compared with the extrusion method by applying the drawing step in the step (c) of passing the resistor base material 100 through the die 300.
  • this manufacturing method it is possible to realize stabilization of the characteristics of the resistor 1.
  • At least the outlet opening 303 of the opening 301 of the die 300 is continuously formed by a curved line.
  • the corner portion of the resistor 1 obtained by passing through the die 300 is chamfered. As a result, the electromigration that occurs in the resistor 1 at the corner portion P can be suppressed. In addition, the heat cycle resistance of the resistor 1 can be increased.
  • the resistor 10 and the second electrode body 12 are bonded to each other by diffusion bonding (solid phase bonding), there is no welding bead.
  • the welding bead may have a non-negligible effect on the resistance value characteristics as the resistor becomes smaller.
  • the resistor 1 obtained by the above-mentioned manufacturing method of the present embodiment does not have such a concern.
  • the resistor base material 100 obtained by clad bonding (solid phase bonding) the resistor base material 10A and the electrode body base materials 11A and 12A is passed through a die 300 and molded. do. Therefore, it is possible to increase the bonding strength between materials without using welding with an electron beam or the like, and it is possible to secure high dimensional accuracy, which is suitable for manufacturing a small resistor 1.
  • the resistor base material 100 In manufacturing the resistor 1, in the step (d), it is preferable to cut the resistor base material 100 from the surface 100a on which the rectangular groove 105 is formed toward the opposite surface 100b. As a result, burrs generated by cutting can be accommodated in the space of the groove (recess) on the mounting surface side.
  • a step of adjusting the size of the clad-bonded resistor base material 100 to a size that can be inserted into the die 300 is included in the first stage of the step (c) of processing the shape. You may.
  • laser irradiation is used for forming an oxide film, but the present invention is not limited to a laser as long as an oxide film having a modified metal surface can be formed, and for example, an oxidizing agent is supplied. As a result, an oxide film may be formed.
  • the embodiments of the present invention have been described above, the above embodiments are only a part of the application examples of the present invention, and the technical scope of the present invention is limited to the specific configurations of the above embodiments. do not have.
  • the resistor 1 in which the resistor base material 100 is passed through the die 300 and separated into individual pieces has been described, but a resistor in which the resistor and the electrode body are clad-bonded without passing through the die 300, or a press. It can also be applied to resistors molded by processing.
  • the resistor 10 is a rectangular parallelepiped, but may have a trapezoidal shape in which the length in the X direction (see FIG. 1) becomes shorter toward the + Z direction (see FIG. 1). Further, the present embodiment can also be applied to a resistor in which electrodes are joined to both ends in the X direction on the mounting surface of the resistor 10, for example.
  • the recesses 6 are formed in pairs between the pair of electrodes, but in the X direction. It may be formed in the vicinity of the electrodes so as to be symmetrical with each other. Further, the recess 6 (6a-6f) does not have to be formed so as to reach from end to end in the Y direction. Even in this case, the change in heat distribution can be suppressed.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Details Of Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'une résistance (1) qui comprend un corps de résistance (10) et une paire d'électrodes (premier corps d'électrode (11), second corps d'électrode (12)) reliée au corps de résistance (10), et dans lequel la valeur de résistance peut être ajustée par rognage d'une section du corps de résistance (10). Dans ce procédé de fabrication, le corps de résistance (10) est coupé au niveau des sites de limite (section de jonction (13), section de jonction (14)) du corps de résistance (10) et des électrodes (premier corps d'électrode (11), second corps d'électrode (12)), et des évidements (6) sont formés.
PCT/JP2020/049196 2020-01-27 2020-12-28 Procédé de fabrication de résistance, et résistance WO2021153153A1 (fr)

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JP2020011198A JP2021118281A (ja) 2020-01-27 2020-01-27 抵抗器の製造方法及び抵抗器
JP2020-011198 2020-01-27

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56119602U (fr) * 1980-02-14 1981-09-11
JPH01209703A (ja) * 1988-02-18 1989-08-23 Mitsubishi Electric Corp 厚膜抵坑体の抵抗値制御装置
JPH11162720A (ja) * 1997-11-21 1999-06-18 Hokuriku Electric Ind Co Ltd チップ抵抗器とその調整方法
JP2008512872A (ja) * 2004-09-13 2008-04-24 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 抵抗器へのレーザートリミングの間の熱電気ポテンシャルの解析方法
JP2015065197A (ja) * 2013-09-24 2015-04-09 コーア株式会社 ジャンパー素子または電流検出用抵抗素子

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56119602U (fr) * 1980-02-14 1981-09-11
JPH01209703A (ja) * 1988-02-18 1989-08-23 Mitsubishi Electric Corp 厚膜抵坑体の抵抗値制御装置
JPH11162720A (ja) * 1997-11-21 1999-06-18 Hokuriku Electric Ind Co Ltd チップ抵抗器とその調整方法
JP2008512872A (ja) * 2004-09-13 2008-04-24 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 抵抗器へのレーザートリミングの間の熱電気ポテンシャルの解析方法
JP2015065197A (ja) * 2013-09-24 2015-04-09 コーア株式会社 ジャンパー素子または電流検出用抵抗素子

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