WO2021135135A1

WO2021135135A1 - Piezoelectric drive structure and imaging module

Info

Publication number: WO2021135135A1
Application number: PCT/CN2020/099644
Authority: WO
Inventors: 桂珞
Original assignee: 中芯集成电路（宁波）有限公司
Priority date: 2019-12-31
Filing date: 2020-07-01
Publication date: 2021-07-08
Also published as: CN113130734A

Abstract

Disclosed are a piezoelectric drive structure and an imaging module, the piezoelectric drive structure comprising: a support layer; a piezoelectric element, adhesively bonded to the upper surface of the support layer; the piezoelectric element is separated into a plurality of sub-piezoelectric elements by an electrical isolation structure in the length direction, each sub-piezoelectric element being equipped with an independent electrode lead-out terminal, individually energizing each sub-piezoelectric element, the sub-piezoelectric element expanding and contracting, pulling the support layer to generate deformation; energizing each sub-piezoelectric element, such that the piezoelectric element can drive the support layer to produce a variety of warping changes. The imaging module comprises: a piezoelectric drive structure, comprising a movable end and a fixed end; a support block, used for supporting and fixing the fixed end; moved elements connected to the movable end, the moved elements comprising a lens group, an imaging sensor element, an aperture, a mirror, or a lens sheet; an external signal connection terminal, electrically connected to the piezoelectric drive structure; in the energized state, the movable end moves up or down with respect to the fixed end, moving the moved elements.

Description

Piezoelectric drive structure and imaging module

Technical field

The invention relates to the technical field of motion control, in particular to a piezoelectric driving structure and an imaging module.

Background technique

In some electronic terminals, it is usually necessary to make some parts of them translate, move or tilt vertically to realize some special functions. For example, in some electronic terminals such as cameras, cameras, and mobile phones with lens modules, a driving mechanism such as a VCM motor (Voice Coil Actuator/Voice Coil Motor) is usually used to make the lens or image sensor moveable. , Displace in the direction of the optical axis to focus or zoom, or in the direction perpendicular to the direction of the optical axis to prevent optical jitter. However, unlike traditional SLR cameras, it is a huge engineering challenge to implement this function in electronic terminals such as mobile phones, miniature cameras, and cameras in a small space. Moreover, as the imaging systems of electronic terminals such as mobile phones become more and more complex, and lens modules become heavier, the driving capability of traditional driving mechanisms such as VCM motors is gradually insufficient.

technical problem

In addition, in some cases, the driven parts need to be flexibly changed, such as curved motion, or other irregular motions, which is difficult to achieve with the existing drive structure, especially it is more difficult to achieve a flexible drive structure on the order of micrometers. .

Therefore, it is expected that a driving structure can be applied to different driving occasions to meet the movement requirements of the moved components.

Technical solutions

The purpose of the present invention is to provide a piezoelectric driving structure and an imaging module, which can utilize the electrostrictive effect of the piezoelectric element to control the displacement of the moved element in a predetermined direction.

In order to achieve the above objective, the present invention provides a piezoelectric driving structure, including:

Support layer

The piezoelectric element is located on the support layer. The piezoelectric element is separated into a plurality of sub-piezoelectric elements by an electrical isolation structure in the length direction. Each of the sub-piezoelectric elements is provided with an independent electrical connection structure. Each of the sub-piezoelectric elements is individually energized, and the sub-piezoelectric elements are stretched, which drives the support layer to deform, and a plurality of the sub-piezo-electric elements are energized at the same time, and the piezoelectric elements can drive the support layer Produce warpage.

The present invention also provides an imaging module, including the above-mentioned piezoelectric driving structure, the piezoelectric driving structure includes a movable end and a fixed end, and the imaging module includes:

A supporting block for supporting and fixing the fixed end;

The moved element is connected to the movable end, and the moved element includes a lens group, an imaging sensor element, an aperture, a mirror or a lens sheet;

The external signal connection terminal is electrically connected to the piezoelectric driving structure;

In the energized state, the movable end moves upward or downward relative to the fixed end to move the moved element.

Beneficial effect

The beneficial effect of the present invention is that the piezoelectric element is divided into a plurality of isolated sub-piezoelectric elements, a plurality of isolated sub-piezoelectric elements share a support layer, and each independent sub-piezoelectric element can apply a voltage separately, A plurality of sub-piezoelectric elements jointly control the deformation of the support layer. Through different parameter settings (such as the piezoelectric material, the thickness of the piezoelectric film, the applied voltage, the length of each sub-piezoelectric element), the flexible deformation of the piezoelectric drive structure can be realized. To drive the component's linear motion or curved motion or other irregular motion.

In addition, the fixed end of the piezoelectric driving structure is fixed by a supporting block, and the movable end is connected to the moved element. By supplying power to the piezoelectric driver, each sub-piezoelectric element is warped upward or downward to move the moved element. This can meet the movement requirements of the moved components, and compared with traditional drive mechanisms such as VCM motors, the combination of the piezoelectric drive structure and the support block is light in weight, small in size, simple in structure, low in cost, and can achieve multi-dimensional Movement, suitable for imaging modules with a small space, and the piezoelectric drive structure is purely voltage driven, without electromagnetic interference.

Further, when the surface of the moved element is provided with a limiting groove, and the end of the movable end of the piezoelectric driving structure extends into the limiting groove to drive the moved element, the end of the movable end of the piezoelectric actuator is in contact with the limiting groove The angle can be small (the end of the movable end is set almost horizontally) to avoid the problem of the piezoelectric driver and the limit slot being stuck.

Further, when the surface of the moved element is provided with a connecting piece, the movable end of the piezoelectric driving structure is connected to the connecting piece, and the end of the movable end is in an almost horizontal position to avoid fatigue damage caused by the large-angle bending of the connecting piece , Improve the reliability of the device.

Description of the drawings

Fig. 1 shows a schematic diagram of a piezoelectric driving structure according to an embodiment of the present invention.

Fig. 2 shows a schematic structural diagram of a sub-piezoelectric element with a multilayer structure according to an embodiment of the present invention.

FIG. 3 shows a schematic diagram of the structure of an imaging module according to an embodiment of the present invention.

Fig. 4 is a cross-sectional view of Fig. 3 taken along the line A-A'.

Fig. 5 shows a schematic diagram of the piezoelectric driving structure driving the moved element in an example.

Fig. 6 shows a schematic diagram of a piezoelectric driving structure driving a moved element according to an embodiment of the present invention.

Fig. 7 shows a schematic diagram of an imaging module according to another embodiment of the present invention.

8-10 show the positional relationship diagrams of the piezoelectric driving structure and the moved element according to different embodiments of the present invention.

FIG. 11 shows a schematic diagram of an imaging module according to another embodiment of the present invention.

FIG. 12 shows a schematic diagram of an imaging module according to another embodiment of the present invention.

FIG. 13 shows a schematic diagram of an imaging module according to another embodiment of the present invention.

FIG. 14 shows a schematic diagram of an imaging module with a supporting block located under a moved component according to an embodiment of the present invention.

Fig. 15 shows a schematic structural diagram of a connector according to an embodiment of the present invention.

Fig. 16 shows a partial top view of connecting the piezoelectric driver and the moved element through the connecting member structure according to an embodiment of the present invention.

FIG. 17 shows a schematic diagram of the structure of an imaging module according to an embodiment of the present invention.

FIG. 18 shows a schematic structural diagram of an imaging module according to an embodiment of the present invention.

FIG. 19 shows a schematic diagram of electrically connecting a moved element and an external signal through a wiring layer of a piezoelectric driving structure according to an embodiment of the present invention.

FIG. 20 shows a schematic diagram of connecting a moved element and an external signal through a wiring layer of a piezoelectric driving structure according to an embodiment of the present invention.

FIG. 21 shows a schematic diagram of an imaging module according to an embodiment of the present invention.

Description of reference signs:

10-circuit board; 200-piezoelectric drive structure; 20-piezoelectric element; 20A-first sub-piezoelectric element; 20B-second sub-piezoelectric element; 21A-first electrode; 21B-first electrode; 211- Odd-numbered electrode; 22A-second electrode; 22B-second electrode; 221-even-numbered electrode; 23-piezoelectric film; 23A-first piezoelectric film; 23B-second piezoelectric film, 24-support layer; 25 -Wiring layer; 251A-first electrode lead-out terminal; 252A-second electrode lead-out terminal; 251B-first electrode lead-out terminal; 252B-second electrode lead-out terminal; 26-conductive structure; 27-electric isolation structure; 30-by Moving element; 40-limit slot; 40B-flexible connector; 41-first film layer; 42-second film layer; 43-third film layer; 50-support block; 51-first layer support block; 52 -Second layer support block; 61-third electrical connection end; 62-fourth electrical connection end; 63-conductive plug; 71-first electrical connection end; 72-second electrical connection end; 73-flexible electrical connection Structure; 74-fifth electrical connection terminal; 75-interconnect line; 77-sixth electrical connection terminal.

Embodiments of the present invention

The technical solution of the present invention will be further described in detail below with reference to the drawings and specific embodiments. According to the following description and drawings, the advantages and features of the present invention will be clearer. However, it should be noted that the concept of the technical solution of the present invention can be implemented in many different forms and is not limited to the specific implementation set forth herein. example. The drawings all adopt a very simplified form and all use imprecise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

It should be understood that when an element or layer is referred to as being "on", "adjacent to", "connected to" or "coupled to" other elements or layers, it can be directly on the other elements or layers. On a layer, adjacent to, connected or coupled to other elements or layers, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on", "directly adjacent to", "directly connected to" or "directly coupled to" other elements or layers, there are no intervening elements or layers. Floor. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Therefore, without departing from the teachings of the present invention, the first element, component, region, layer or section discussed below may be represented as a second element, component, region, layer or section.

Spatial relationship terms such as "under", "below", "below", "below", "above", "above", etc., in It can be used here for the convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that in addition to the orientations shown in the figures, the spatial relationship terms are intended to include different orientations of devices in use and operation. For example, if the device in the drawing is turned over, then elements or features described as "below" or "below" or "under" other elements will be oriented "on" the other elements or features. Therefore, the exemplary terms "below" and "below" can include both an orientation of above and below. The device can be otherwise oriented (rotated by 90 degrees or other orientation) and the spatial descriptors used here are interpreted accordingly.

The purpose of the terms used here is only to describe specific embodiments and not as a limitation of the present invention. When used herein, the singular forms "a", "an" and "the/the" are also intended to include plural forms, unless the context clearly dictates otherwise. It should also be understood that the terms "composition" and/or "including", when used in this specification, determine the existence of the described features, integers, steps, operations, elements and/or components, but do not exclude one or more other The existence or addition of features, integers, steps, operations, elements, parts, and/or groups. As used herein, the term "and/or" includes any and all combinations of related listed items.

If the method herein includes a series of steps, and the order of these steps presented herein is not necessarily the only order in which these steps can be performed, and some steps may be omitted and/or some other steps not described herein may be added to this method. If the components in a certain drawing are the same as those in other drawings, although these components can be easily identified in all the drawings, in order to make the description of the drawings more clear, this specification will not describe all the same components. The reference numbers are shown in each figure.

An embodiment of the present invention provides a piezoelectric driving structure. FIG. 1 shows a piezoelectric driving structure according to an embodiment of the present invention. Referring to FIG. 1, the piezoelectric driving structure 200 includes:

Support layer 24;

The piezoelectric element 20 is adhered to the upper surface of the support layer 24. The piezoelectric element 20 is isolated into a plurality of sub-piezoelectric elements by an electrical isolation structure in the length direction (in this embodiment, the piezoelectric element 20 is isolated into two sub-piezoelectric elements). Element, the first sub-piezoelectric element 20A, the second sub-piezoelectric element 20B), each of the sub-piezoelectric elements is provided with an independent electrode lead-out end, and each of the sub-piezoelectric elements is individually energized, and the sub-piezoelectric elements are individually energized. The piezoelectric element expands and contracts, and the support layer 24 is pulled to produce deformation;

The plurality of sub-piezoelectric elements are respectively energized, and the piezoelectric elements can drive the supporting layer to produce various warping changes.

1, the sub-piezoelectric element includes:

At least one layer of piezoelectric film 23 (in this embodiment, it includes two sub-piezoelectric elements, the first sub-piezoelectric element 20A includes the first piezoelectric film 23A, and the second sub-piezoelectric element 20B includes the first piezoelectric film 23B, The first piezoelectric film 23A and the second piezoelectric film 23B are collectively referred to as the piezoelectric film 23), and the electrodes located on the upper and lower surfaces of each layer of the piezoelectric film 23, and the two adjacent layers of the piezoelectric film 23 are shared between the two. Between the electrodes;

The electrodes are counted sequentially from bottom to top, and are divided into odd-numbered layers of electrodes and even-numbered layers of electrodes;

The first electrode lead-out end is located on the top surface of the piezoelectric element and is electrically connected to the even-numbered electrode layer; in this embodiment, the first sub-piezoelectric element 20A is provided with a first electrode lead-out end 251A, and the second sub-piezoelectric element 20A is provided with a first electrode lead-out end 251A. The element 20A is provided with a second electrode lead-out terminal 251B

The second electrode lead-out end is located on the top surface of the piezoelectric element and is electrically connected to the odd electrode layer. In this embodiment, the first sub-piezoelectric element 20A is provided with a second electrode lead-out end 252A, and the second sub-piezoelectric element 20B is provided with a second electrode lead-out end 252B.

Specifically, referring to FIG. 1, in this embodiment, the piezoelectric element 20 is isolated from the movable end to the fixed end by the electrical isolation structure 27 into two sub-piezoelectric elements, which are the first sub-piezoelectric element 20A and the second sub-piezoelectric element, respectively. The electric element 20B (as shown in the dashed box, the left side is the first sub-piezoelectric element 20A, and the right side is the second sub-piezoelectric element 20B), and the two sub-piezoelectric elements share the same support layer 24. The first sub-piezoelectric element 20A includes a piezoelectric laminate structure on the support layer 24. The piezoelectric laminate structure includes stacking a first electrode 21A, a piezoelectric film 23A, and a second electrode 22A in order from top to bottom. The first electrode 21A and the second electrode 22A are respectively connected to the first electrode lead-out end 251A and the second electrode lead-out end 252A. The second sub-piezoelectric element 20B includes a piezoelectric laminate structure on the support layer 24. The piezoelectric laminate structure includes stacking a first electrode 21B, a piezoelectric film 23B, and a second electrode 22B in order from top to bottom. 21B and the second electrode 22B are respectively connected to the first electrode lead-out end 251B and the second electrode lead-out end 252B.

In this embodiment, a wiring layer 25 is further provided above the first sub-piezoelectric element 20A and the second sub-piezoelectric element 20B, the first electrode lead-out terminal 251A, the second electrode lead-out terminal 252A, the first lead-out terminal 251B, and the second The lead terminals 252B are all located in the wiring layer 25 and exposed on the upper surface of the wiring layer 25, and the four electrode lead terminals are electrically isolated from each other. The four electrode lead-out ends are all located at one end of the piezoelectric element to facilitate the introduction of electrical signals. In this embodiment, they are all located at the end of the first sub-piezoelectric element 20A.

The first sub-piezoelectric element 20A and the second sub-piezo element 20B are isolated by an electrical isolation structure 27. In this solution, the electrical isolation structure 27 is an insulating dielectric layer, the bottom of which extends to the upper surface of the support layer 24, and the top to the wiring In the layer 25, in other examples, the electrical isolation structure 27 may be formed by an air gap. When the electrical isolation structure 27 is composed of an air gap, the process steps for filling the insulating material in the air gap can be reduced. At this time, the width of the air gap cannot be too small. When the element is deformed, the two close ends do not contact.

The piezoelectric laminate structure of the sub-piezoelectric element is not limited to only one piezoelectric film. Refer to Fig. 2, which is a sub-piezoelectric element with three layers of piezoelectric film. The upper and lower surfaces of each piezoelectric film 23 are distributed. There are electrodes, and two adjacent layers of piezoelectric films 23 share the electrodes between them. Therefore, the three layers of piezoelectric films 23 have 4 layers of electrodes. The electrodes are counted from bottom to top. The odd-numbered layers of electrodes 211 are electrically connected to each other by the conductive structure 26. At the same time, the even-numbered electrodes 221 are electrically connected together by another conductive structure 26. The part of the conductive structure 26 extending into the piezoelectric laminate structure is located in the wiring layer 25, and only the ends are in contact with the electrodes that need to be electrically connected. The tops of the two conductive structures 26 can be respectively used as the first electrode lead-out end and the second electrode lead-out end, so that the first electrode lead-out end and the second electrode lead-out end are both located on the top surface of the sub-piezoelectric element.

In the present invention, the piezoelectric laminate structure is not limited to include three layers of piezoelectric films, but can also include two layers, four layers, five layers, or six layers. By increasing the number of piezoelectric films, the warpage ability of the piezoelectric actuator can be improved. , So that the piezoelectric actuator can move a larger mass of the moved element.

It should be understood that in order to ensure that the warping directions of the three piezoelectric films are the same, the polarities of the two adjacent piezoelectric films are opposite, and the opposite polarity means that the crystal directions (polarization directions) of the piezoelectric films are opposite. That is, the two piezoelectric films apply voltages in opposite directions to achieve bending in the same direction.

The piezoelectric film 23 needs to be made of a piezoelectric material that can be deformed when energized, such as quartz crystal, aluminum nitride, zinc oxide, lead zirconate titanate, barium titanate, lithium gallate, lithium germanate, or titanium germanate, etc. Materials. In this example, the piezoelectric film 23A and the piezoelectric film 23B have the same material and thickness. In other examples, the piezoelectric film 23A and the piezoelectric film 23B can also have different materials and thicknesses. Different materials are applied with the same voltage and warped. The degree of curvature is different. In a certain range, the thickness of the piezoelectric film is large, and the degree of warpage is large. The choice of thickness can be obtained through calculation and experiment. By setting unused materials, different thicknesses can control the deformation of the entire piezoelectric element more flexibly. The material of the support layer 24 is a non-conductive dielectric material, such as silicon oxide, silicon nitride, and the like.

In this embodiment, the thickness of the piezoelectric film and the support layer is less than 10 microns.

In this embodiment, two sub-piezoelectric elements share a support layer 24. By setting different parameters for the sub-piezoelectric elements (such as the material of the piezoelectric film, the thickness of the piezoelectric film, the magnitude and direction of the applied voltage, each sub-pressure The length of the electrical element), the support layer 24 is deformed, and the flexible deformation of the piezoelectric driving structure is realized. The piezoelectric driving structure can be used to drive the linear motion or the curved motion of the component. An embodiment of the present invention provides an imaging module. FIG. 3 is a schematic diagram of an imaging module according to an embodiment of the present invention. FIG. 4 is a cross-sectional view of FIG. 3 along the AA' direction. Please refer to FIGS. 3 and 4. The imaging module includes the aforementioned piezoelectric driving structure, wherein the piezoelectric driving structure 200 includes a movable end and a fixed end, and the imaging module further includes:

The supporting block 50 is used to support and fix the fixed end;

The moved element 30 is connected to the movable end, and the moved element 30 includes a lens group, an imaging sensor element, an aperture, a mirror or a lens sheet;

The external signal connection terminal is electrically connected to the piezoelectric driving structure 200;

In the energized state, the movable end moves upward or downward relative to the fixed end to move the moved element 30.

4, the fixed end of the piezoelectric driving structure 200 (shown in the dashed frame, to simplify the figure, the dashed frame is not drawn in the following figure) is located on the support block 50, and the movable end extends out of the support block 50 to form a cantilever Structure. In other examples, the entire piezoelectric driving structure 200 may be located on the supporting block 50. When the piezoelectric driving structure 200 is entirely located on the supporting block 50, it is suitable for occasions where the moving element 30 needs to be lifted upwards. When the movable end of the piezoelectric driving structure 200 extends out of the supporting block 50, it can be applied to When the moved component 30 is lifted up or moved down. The supporting block 50 and the fixed end of the piezoelectric driving structure 200 are connected by glue or by an organic cured film. Organic curing film bonding is a wafer-level process. In wafer factories or packaging plants, organic curing film bonding is generally used, which has high efficiency and relatively high cost. Adhesive connection is suitable for board-level crafts and suitable for module factories. Its price is low and efficiency is low.

Further, the material of the support block 50 is a dielectric material, which can be in a ring shape and arranged around the moved element 30 to better support the piezoelectric driving structure 200; or, the support block 50 includes a plurality of sub-support blocks distributed in the circumferential direction, A plurality of sub-support blocks are spaced apart or in contact with each other, thereby saving materials and reducing weight. When the plurality of piezoelectric driving structures 200 are not in the same plane, the height of the support block 50 may not be consistent. In the present invention, the supporting block 50 may not be ring-shaped, for example, only located on two sides or four sides of the moved element 30.

Referring to FIG. 4, a limiting groove 40 is provided on the lower surface of the moved component 30, and the limiting groove 40 is surrounded by three film layers: a first film layer 41, a second film layer 42, and a third film layer 43. The limiting groove 40 is not limited to being located on the lower surface of the moved element 30, and may also be located on the upper surface of the moved element 30 or on the side surface of the moved element 30. In the present invention, the limiting groove 40 is not limited to being surrounded by the additionally provided film layer, and the limiting groove 40 may also be formed by the moving element 30 itself. For example, a recess is formed on the side surface of the moving element 30 to serve as The limiting groove 40, or when the limiting groove is located on the lower surface, the lower surface of the moved component can be used as the upper film layer of the limiting groove 40, when the limiting groove 40 is located on the upper surface, the upper surface of the moved component 30 As the lower film layer of the limit slot.

After the piezoelectric driving structure 200 is energized, the end of the movable end of the piezoelectric driving structure 200 extends into the limiting slot 40. In this embodiment, the end of the second sub-piezoelectric element 20B extends into the limiting slot 40. The moving end is warped upwards or downwards, so that the moved element 30 can be moved up or down as a whole, so as to change the vertical position of the moved element 30 to realize optical autofocus. After the autofocus is completed, when necessary, the voltage applied to the piezoelectric driving structure 200 on the side of the moved element 30 can be changed, so that the moved element 30 is tilted, thereby changing the angle of the moved element 30, and correcting the The optical warping angle of the element 30 is moved, thereby realizing optical anti-shake.

Referring to FIG. 5, in an example, the piezoelectric element of the piezoelectric driving structure 200 is a continuous whole without being divided into a plurality of sub-piezoelectric elements. The fixed end of the piezoelectric driving structure 200 is fixed on the support block 50, and the movable end is connected In the limiting groove 40, when the movable end of the piezoelectric driving structure 200 is upwardly warped, the contact angle between the end extending into the limiting groove 40 and the limiting groove 40 is relatively large, and the frictional force with the limiting groove 40 Increase, it will be stuck in severe cases.

Referring to FIG. 6, in this embodiment, the piezoelectric element of the piezoelectric driving structure is divided into a first sub-piezoelectric element 20A and a second sub-piezoelectric element 20B that are isolated from each other. Two sub-piezoelectric elements 20B are applied with a voltage, and when the moved element 30 is moved the same distance, the end of the second sub-piezo element 20B that extends into the limiting groove 40 has a relatively large contact angle with the limiting groove 40 smooth. In this way, the problem of the end of the piezoelectric driver 200 and the limiting groove 40 jamming can be avoided. It should be understood that the piezoelectric element of the piezoelectric driving structure 200 can be divided into a plurality of sub-piezoelectric elements, and the desired deformation curve of the piezoelectric driving structure can be obtained by separately controlling the respective voltages. In this embodiment, a positive voltage is applied to the first sub-piezoelectric element 20A, one end of the first sub-piezoelectric element 20A is warped upward, and a reverse voltage is applied to the second sub-piezoelectric element 20B, so that the second sub-piezoelectric element 20B is applied with a reverse voltage. The end of the piezoelectric sub-element 20B close to the first piezoelectric sub-element 20A is warped downward, and the end area of the second piezoelectric sub-element 20B in contact with the limiting groove 40 is horizontally arranged. Get the desired radian by setting the voltage.

For the case where the piezoelectric element includes multiple sub-piezoelectric elements, the flexible deformation of the piezoelectric element can be obtained by calculation or experiment. Continuing to refer to FIGS. 1 and 4, the piezoelectric driving structure is located on the top surface of the supporting block 50. The first electrode lead-out end 251A and the second electrode lead-out end 252A of the first sub-piezoelectric element 20A, the first electrode lead-out end 251B and the second electrode lead-out end 252B of the second sub-piezoelectric element 20B directly serve as external signal connection ends, The circuit board 10 is electrically connected to the circuit board 10 through a lead wire (not shown), so that the circuit board 10 can apply a voltage to the piezoelectric driving structure 200 so that the upper and lower surfaces of the piezoelectric film 23A and the piezoelectric film 23B are separated from each other. A pressure difference is generated, so that the piezoelectric film 23A and the piezoelectric film 23B expand and contract, and because the support layer 24 cannot expand or contract, the first sub-piezoelectric element 20A and the second sub-piezoelectric element 20B warp upward or downward after being energized. The warpage (the direction of warpage and the degree of warpage depend on the voltage applied to the upper and lower surfaces of the piezoelectric film 23A and the piezoelectric film 23B), so that the piezoelectric driving structure 200 is bent upward or downward as a whole.

It should be understood that the present invention is not limited to directly electrically connecting the piezoelectric driving structure 200 and the circuit board 10 through a lead wire, and an electrical connection terminal may also be provided on the top surface of the support block 50 to connect two of the sub piezoelectric element 20A and the sub piezoelectric element 20B. The lead-out ends of the electrodes are electrically connected to the electrical connection ends by lead wires, and then another interconnection structure (such as lead wires or conductive plugs) is used to electrically connect the electrical connection ends on the top surface of the support block 50 to the circuit board 10, which can be shortened The length of the lead.

It should be noted that the first electrode lead-out end 251A and the second electrode lead-out end 251B of the first sub-piezoelectric element 20A, and the first electrode lead-out end 251B and the second electrode lead-out end 252B of the second sub-piezoelectric element 20B are both used To connect to external circuit signals and are located on one side of the piezoelectric drive structure, for the convenience of description, the first electrode lead-out end and the second electrode lead-out end referred to hereinafter mean that the first electrode lead-out includes two sub-piezoelectric elements. The two sub-piezoelectric components are no longer distinguished between the terminal and the second electrode lead-out terminal.

Please refer to FIG. 7, the external signal connection end of the imaging module includes a third electrical connection end 61 and a fourth electrical connection end 62. The support block 50 includes a first layer support block 51 and a second layer support block 52, and the fixed end of the piezoelectric driving structure is located between the first layer support block 51 and the second layer support block 52. The third electrical connection end 61 and the fourth electrical connection end 62 are located on the top surface of the support block 50 and directly above the piezoelectric driving structure. The third electrical connection end 61 is electrically connected to the first electrode lead-out end of the piezoelectric drive structure through the conductive plug 63, and the fourth electrical connection end 62 is electrically connected to the second electrode lead-out end of the piezoelectric drive structure through the conductive plug 63, Two conductive plugs 63 are located in the second layer support block 52. The third electrical connection end 61 and the fourth electrical connection end 62 are electrically connected to the circuit board 10 through lead wires, respectively.

It should be understood that when the third electrical connection end 61 and the fourth electrical connection end 62 are not directly facing the electrode lead-out ends of the piezoelectric driving structure, the third electrical connection end 61 and the fourth electrical connection end 62 may also adopt rewiring and compression. The first electrode leading end and the second electrode leading end of the electric drive structure are electrically connected,

Please continue to refer to FIG. 3, the piezoelectric driving structure 200 is a pair, and the pair of piezoelectric driving structures 200 are symmetrically distributed on both sides of the moved element 30. When the two piezoelectric driving structures 200 warp upward or downward at the same time, they can make The moved element 30 moves up or down. When one of the piezoelectric driving structures 200 is working, or one of the piezoelectric driving structures 200 is warped upward, and the other piezoelectric driving structure 200 is warped downward, the angle of the moved element can be changed in one direction.

Please refer to FIG. 8, there are four piezoelectric driving structures, which are distributed on the four sides of the moved element 30. When the four piezoelectric driving structures warp upward or downward at the same time, the moved element 30 can be moved upward or downward. A set of two opposing piezoelectric driving structures can change the angle of the moved element in one direction, and the other set of opposing piezoelectric driving structures can change the angle of the moved element in the other direction.

Please refer to FIG. 9, there are three pairs of piezoelectric driving structures, and the three pairs of piezoelectric driving structures are evenly distributed in the circumferential direction. The three pairs of piezoelectric driving structures can change the inclination angle of the moved element from three directions.

Please refer to FIG. 10, two piezoelectric driving structures are connected on opposite sides of the moved element 30, so that the two piezoelectric driving structures are simultaneously warped upward or downward (and the warping amplitude is the same), so that the two piezoelectric The driving structure supports one side of the moved element 30 together, which can be suitable for situations where the piezoelectric driving structure has a small size and the moved element 30 has a large size, or is suitable for situations where the mass of the moved element 30 is large. In the present invention, the two opposite sides of the moved element 30 are not limited to connecting two piezoelectric driving structures, and three, four, five, etc. can also be connected.

Of course, the piezoelectric driving structure can also be four pairs, five pairs, or six pairs. Each pair of piezoelectric driving structures is not limited to being symmetrically arranged along the center of the moved element 30, and can also be arranged asymmetrically. The more, the rotation axis of the moved element 30 can be increased to realize multi-dimensional rotation. The moved element 30 is not limited to a square or round shape, and can also have other shapes, which is not limited in the present invention.

It can be understood that the paired piezoelectric driving structures are beneficial to control the movement of the moved element 30. In fact, the piezoelectric driving structures may also appear unpaired. For example, three piezoelectric driving structures are arranged along the circumference of the moved element 30. To be uniformly distributed, etc., this embodiment will not be illustrated one by one.

In the present invention, one piezoelectric driving structure corresponds to one limiting slot 40, and the two limiting slots 40 are not limited to being fixed on the lower surface of the moved element 30. As shown in FIG. 11, the two limiting slots 40 are both fixed. On the upper surface of the moved element 30; as shown in Figure 12, one pair of the two limit grooves 40 is fixed on the upper surface of the moved element 30, and the other pair is fixed on the lower surface of the moved element 30. The height of the support block 50 supporting the two piezoelectric driving structures is different, that is, in order to support the piezoelectric driving structure, the height of the support block 50 can be adjusted according to the position of the piezoelectric driving structure.

Please refer to FIG. 12, two piezoelectric driving structures in a pair are distributed on both sides of the center of the moved element 30. However, it should be understood that, as shown in FIG. 13, the two piezoelectric driving structures in a pair may be located under the moved element 30 and overlapped. In other words, the movable end of the piezoelectric driving structure is selected in the limit slot 40 on the side farther from the moved element 30 (each piezoelectric driving structure is used to move the opposite side of the moved element 30). When the length of the piezoelectric driving structure can be increased, it can also be easily lifted when the mass of the moved element 30 is large. In this example, the fixed end of the sub-piezoelectric driving structure is located outside the moved element 30. In an example, the fixed end of the piezoelectric driving structure may also be located below the moved element 30.

Further, as shown in FIG. 13, the fixed position of the supporting block 50 and the piezoelectric driving structure is located outside the moved element 30. As shown in FIG. 14, the fixed position of the supporting block 50 and the piezoelectric driving structure can also be located in the space below the moved element 30, so that the fixed end of the piezoelectric driving structure is closer to the center of the moved element 30 than the movable end. Of course, the support block 50 is not limited to being completely located directly under the moved element 30, and can also be partially located directly under the moved element 30. In this way, the support block 50 can be completely or partially covered by the moving element 30, which can save The area occupied by the support block 50 reduces the area of the entire imaging module, which is conducive to reducing the size.

In addition to connecting the movable end of the piezoelectric driving structure with the moved element 30 through the limiting slot 40, it can also be connected by a flexible connecting piece. As shown in FIG. 15, the flexible connecting piece 40B includes: a first part 41B and a second part 42B , Located in the middle part between the first part 41B and the second part 42B, the first end is at least a part of the first part 41B, the second part 42B is a part of the second end, the middle part 43B is a horizontal strip structure, the first part 41B The second part 42B also has a vertical beam, and the first end and the second end are connected with the middle part 43B through the vertical beam. The width and thickness of the middle part 43B meet the set values, so that the middle part 43B has flexibility. When the first end and the second end are subjected to different pulling or pushing forces, the middle part 43B can be deformed.

It should be understood that the setting values of the width and thickness of the middle part 43B are related to the material of the middle part 43B. When the middle part 43B is made of different materials, the setting values will change accordingly. The setting values only need to be able to ensure the middle part 43B. Just have flexibility.

In the present invention, the middle part 43B is not limited to a strip structure, but can also be arc-shaped, wave-shaped, etc.; the first part 41B and the second part 42B are not limited to using vertical beams to connect with the middle part 43B, and the present invention is not limited. Furthermore, the first part 41B and the second part 42B may also have flexibility, so that the flexible connecting member 40B is flexible as a whole, which can increase the deformability of the flexible connecting member 40B.

The movable end of the piezoelectric driving structure is glued to the flexible connecting member 40B, or connected through an organic curing film; the flexible connecting member 40B is glued to the moved element 30, or connected through an organic curing film.

It should be noted that, in other examples, if the piezoelectric driving structure is driven by the flexible connecting member to move the moving part up and down, the part connecting the flexible connecting member and the piezoelectric driving structure may be bent repeatedly at a large angle, which is likely to cause structural fatigue. In this embodiment, when the end of the piezoelectric drive structure is connected to the flexible connector, the end is almost in a horizontal state, which will not bend the flexible connector, increase the life of the flexible connector, and improve the reliability of the device. .

To facilitate the understanding of the difference between the flexible connecting member 40B and the limiting groove 40 in the connection mode, FIGS. 16 and 17 exemplarily show a plan view and a cross-sectional view of connecting the piezoelectric driving structure through the flexible connecting member 40B. It should be understood that the flexible connecting piece 40B is used to connect and connect the moved element 30 and the movable end of the piezoelectric drive structure through the limit slot 40. In addition to the different connection methods, other electrical connection relationships, support block structure distribution or piezoelectric actuators For the position relationship, please refer to the previous text, so I won't repeat it here.

18, when the moved element 30 needs to be connected to an external electrical signal, if the moved element 30 is an imaging sensor element, the top surface of the support block 50 is provided with a first electrical connection terminal 71, and the edge of the imaging sensor element has a first electrical connection terminal 71. Two electrical connection ends 72. The closer the first electrical connection end 71 is to the imaging sensor element, the better. The first electrical connection end 71 and the second electrical connection end 72 are electrically connected by the flexible electrical connection structure 73. The first electrical connection end 71 can be It is electrically connected to the circuit board 10 through leads, so that the circuit board 10 supplies power or signals to the imaging sensor element.

Further, when the fixed end of the piezoelectric driving structure is located on the top surface of the support block 50, as shown in FIG. 19, the first electrical connection terminal 71 is located in the wiring layer 25 on the top surface of the piezoelectric driving structure. Specifically, the wiring layer 25 of the piezoelectric driving structure is further provided with an interconnection line 75, and both ends have a first electrical connection terminal 71 and a fifth electrical connection terminal 74 exposing the wiring layer 25, respectively. The first electrical connection end 71 is closer to the moved component 30 than the fifth electrical connection end 74. The first electrical connection end 71 and the second electrical connection end 72 are electrically connected through a flexible connector 73, and then the first electrical connection end 71 and the second electrical connection end 72 are electrically connected through a lead 78. The five electrical connection terminal 74 is electrically connected to the circuit board 10 so that the circuit board 10 supplies power or signals to the imaging sensor element.

Compared with the method of directly using wires to electrically connect the second electrical connection end 72 of the imaging sensor element to the circuit board 10, the length of the flexible connector 73 in this embodiment can be shorter (the first electrical connection end 71 The closer to the imaging sensor element, the shorter the length of the flexible connecting member 73), and when the moved element 30 moves up or down, the flexible connecting member 73 will not be pulled.

In the present invention, the first electrical connection terminal 71 is not limited to being electrically connected to the circuit board 10 through a lead wire. As shown in FIG. 20, a sixth electrical connection terminal 77 and a fifth electrical connection terminal may be directly formed on the top surface of the support block 50. 74 is electrically connected to the sixth electrical connection terminal 77 through the lead 78. Another interconnection structure is also provided in the support block 50. The interconnection structure is electrically connected to the sixth electrical connection terminal 77 and the circuit board 10, so that the circuit board 10 can be The mobile element 30 supplies power or transmits signals. The flexible connector 73 in this embodiment is a flexible interconnection wire, and the interconnection structure is a conductive plug.

In the present invention, the sixth electrical connection terminal 77 can also be electrically connected to the circuit board 10 through other interconnection methods, for example, the sixth electrical connection terminal 77 and the circuit board 10 are directly electrically connected with a lead wire, which is not limited by the present invention.

As shown in FIG. 21, the moved element 30 is a mirror.

There is one piezoelectric drive structure. The movable end of a piezoelectric drive structure is connected to one side of the reflector, and the opposite side of the reflector is rotatably connected to a supporting surface. When the piezoelectric element 20 is energized, it tilts upward or downward. When curved, the mirror is tilted to achieve the purpose of changing the reflection angle.

In the present invention, one side of the reflector is not limited to one piezoelectric driving structure, and two, three, four, or five can also be provided.

It should be understood that the reflector is not limited to the piezoelectric driving structure distributed on only one side, and the piezoelectric driving structure may also be distributed on two sides, four sides, or in the circumferential direction.

It should be noted that the various embodiments in this specification are described in a related manner, and the same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on the differences from other embodiments. . In particular, for the structural embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the part of the description of the method embodiment.

The above description is only a description of the preferred embodiments of the present invention and does not limit the scope of the present invention in any way. Any changes or modifications made by a person of ordinary skill in the field of the present invention based on the above disclosure shall fall within the protection scope of the claims.

Claims

A piezoelectric driving structure is characterized in that it comprises:

Support layer

The piezoelectric element is adhered to the upper surface of the support layer. The piezoelectric element is separated into a plurality of sub-piezoelectric elements in the length direction by an electrical isolation structure, and each of the sub-piezoelectric elements is provided with an independent electrode lead At the end, each of the sub-piezoelectric elements is individually energized, the sub-piezoelectric elements are stretched, and the support layer is pulled to produce deformation;

The plurality of sub-piezoelectric elements are respectively energized, and the piezoelectric elements can drive the supporting layer to produce various warping changes.
The piezoelectric driving structure according to claim 1, wherein the sub-piezoelectric element comprises:

At least one layer of piezoelectric film, and electrodes on the upper and lower surfaces of each layer of the piezoelectric film, and two adjacent layers of the piezoelectric film share the electrodes between the two;

The electrodes are counted sequentially from bottom to top, and are divided into odd-numbered layers of electrodes and even-numbered layers of electrodes;

The first electrode lead-out end is located on the top surface of the piezoelectric element and is electrically connected to the even-numbered electrode layer;

The second electrode lead-out end is located on the top surface of the piezoelectric element and is electrically connected to the odd electrode layer.
The piezoelectric driving structure according to claim 2, further comprising a wiring layer covering the top surface of the piezoelectric element, and the first electrode lead-out end of each of the sub-piezoelectric elements and the second The electrode lead-out end is provided at one end of the piezoelectric element through the wiring layer.
The piezoelectric driving structure according to claim 2, wherein the piezoelectric film materials of the different piezoelectric sub-elements are the same or different; the piezoelectric film thicknesses of the different piezoelectric sub-elements are the same or different.
The piezoelectric driving structure according to claim 1, wherein the electrical isolation structure comprises an insulating material layer or an air gap provided between adjacent sub-piezoelectric elements.
An imaging module, comprising the piezoelectric driving structure according to any one of claims 1 to 5, the piezoelectric driving structure comprising a movable end and a fixed end, and is characterized in that it further comprises:

A supporting block for supporting and fixing the fixed end;

The moved element is connected to the movable end, and the moved element includes a lens group, an imaging sensor element, an aperture, a mirror or a lens sheet;

The external signal connection terminal is electrically connected to the piezoelectric driving structure;

In the energized state, the movable end moves upward or downward relative to the fixed end to move the moved element.
The imaging module according to claim 6, further comprising a flexible connector, the flexible connector comprising a first end and a second end, the first end is connected to the moved element; the The second end is connected to the movable end of the piezoelectric driving structure.
8. The imaging module according to claim 6, further comprising a limiting groove disposed on the surface of the moved element, and the movable end of the piezoelectric driving structure is placed in the limiting groove Inside.
8. The imaging module of claim 8, wherein the limiting groove is surrounded by at least one film layer;

Or, the limiting groove is surrounded by at least one film layer and the surface of the moving element;

Alternatively, the limiting groove is formed by recessing the side surface of the moved element inward.
8. The imaging module of claim 8, wherein the film layer is distributed on the edge of the moved element;

Alternatively, the film layer is distributed on the entire surface of the moved element.
The imaging module of claim 9 or 10, wherein the surface of the moved element is provided with a first film layer, a second film layer, and a third film layer stacked sequentially from top to bottom. The two sides of the first film layer and the third film layer protrude outward relative to the second film layer to form a protruding portion, and the protruding portion and the end of the second film layer enclose the limit Bit slot.
8. The imaging module of claim 6, wherein the piezoelectric driving structure comprises at least one pair, and each pair of the piezoelectric driving structure is symmetrically distributed around the moved element.
The imaging module of claim 12, wherein each pair of the piezoelectric driving structure is connected to the upper surface or the lower surface of the moved element;

Alternatively, one of the piezoelectric driving structures of each pair is connected to the upper surface of the moved element, and the other is connected to the lower surface of the moved element.
7. The imaging module of claim 6, wherein the piezoelectric driving structure is at least a pair, and the piezoelectric driving structure is located in a space below the moved element.
15. The imaging module of claim 6, wherein the two piezoelectric driving structures in a pair are distributed on both sides of the center of the moved element;

Or, the two piezoelectric driving structures in a pair are overlapped.
The imaging module according to claim 14, wherein the fixed position of the support block and the piezoelectric driving structure is located in a space below the moved element, or located outside.
The imaging module of claim 6, wherein the moved element comprises a reflector; the piezoelectric element is distributed on one side of the reflector, and the opposite side of the reflector is connected to a mirror. The supporting surface is connected by rotation.
The imaging module according to claim 6, wherein the supporting block has a ring shape, a space is enclosed in the center of the ring shape, and the moved element is suspended above the space;

Alternatively, the support block includes a plurality of sub-support blocks distributed along a circumferential direction, and the plurality of sub-support blocks are spaced apart or in contact with each other.
7. The imaging module of claim 6, wherein the piezoelectric driving structure is entirely located on the supporting block, or the movable end of the piezoelectric driving structure extends out of the supporting block.
The imaging module according to claim 6, wherein the piezoelectric driving structure is located on the top surface of the supporting block, or the supporting block comprises a first layer of supporting blocks and a second layer of supporting blocks that are sequentially stacked from bottom to top. Layer support block, the fixed end of the piezoelectric drive structure is fixed between the first layer support block and the second layer support block.

To