CN112311977B

CN112311977B - Imaging module, forming method thereof and lens assembly

Info

Publication number: CN112311977B
Application number: CN201911036533.4A
Authority: CN
Inventors: 桂珞
Original assignee: Ningbo Semiconductor International Corp
Current assignee: Ningbo Semiconductor International Corp
Priority date: 2019-07-26
Filing date: 2019-10-28
Publication date: 2022-04-01
Anticipated expiration: 2039-10-28
Also published as: CN112311977A

Abstract

The invention provides an imaging module, a forming method thereof and a lens component, wherein a support block supports a piezoelectric element, one end of the piezoelectric element is connected with a moved element, the other end of the piezoelectric element extends out of the moved element, an external signal connecting end is electrically connected with an electrode in the piezoelectric element to electrify the piezoelectric element, so that one end of the piezoelectric element is warped upwards or downwards relative to the other end to move the moved element, and therefore the moving requirement of the moved element can be met.

Description

Imaging module, forming method thereof and lens assembly

Technical Field

The invention relates to the technical field of motion control, in particular to an imaging module, a forming method thereof and a lens assembly.

Background

In some electronic terminals, it is often necessary to translate, vertically move or tilt some of the components to achieve some specific functions. For example, in various electronic terminals such as video cameras, still cameras, and mobile phones having a lens module, a movable lens or an image sensor is usually moved in an optical axis direction to focus or zoom or in a direction perpendicular to the optical axis direction to prevent optical shake by a driving mechanism such as a VCM Motor. However, unlike the conventional single lens reflex camera, it is a great engineering challenge to implement the function in electronic terminals such as mobile phones, micro video cameras, and cameras with a small spatial volume. Moreover, as imaging systems of electronic terminals such as mobile phones are more and more complex, the lens modules are heavier, and the driving capability of the conventional driving mechanisms such as the VCM motors is gradually insufficient.

Therefore, a solution is needed that can facilitate the reduction of the occupied space and can provide sufficient driving capability for the moved element to meet the moving requirement of the moved element.

Disclosure of Invention

The invention aims to provide an imaging module, a forming method thereof and a lens assembly, which can control the displacement of a moved element along a preset direction by utilizing the electrostrictive effect of a piezoelectric element and are beneficial to reducing the occupied space.

In order to achieve the above object, the present invention provides an imaging module, comprising:

a moved element comprising a lens group, an imaging sensor element, a mirror, a lens sheet, or an aperture;

a flexible connector, said connector comprising a first end and a second end, said first end being connected to said moved element;

the piezoelectric element comprises a movable end and a fixed end, and the movable end is connected with the second end; when the piezoelectric element is in a power-on state, the movable end warps upwards or downwards relative to the fixed end so as to move the moved element;

the supporting block is used for supporting and fixing the piezoelectric element, and the fixed end is fixed on the supporting block;

and the external signal connecting end is electrically connected with the electrode in the piezoelectric element.

The invention also provides a forming method of the imaging module, which comprises the following steps:

providing a first substrate, wherein a first dielectric layer is formed on the first substrate;

forming at least one first groove and an annular second groove in the first medium layer, wherein the first groove extends into the first medium layer from the surface of the first medium layer, the second groove is communicated with the first groove and penetrates through the first medium layer to divide the first medium layer into a first lug and a second lug surrounding the first lug, and the second lug is a supporting block;

providing a piezoelectric element, a flexible connecting piece and a moved element, wherein a fixed end of the piezoelectric element is combined with the bottom surface of the first groove, a first end of the connecting piece is combined with a movable end of the piezoelectric element, and the moved element is combined with a second end of the connecting piece;

forming an external signal connection terminal electrically connected to an electrode in the piezoelectric element;

and peeling the first substrate and the first bump.

providing a third substrate, and sequentially forming a second dielectric layer and at least one connecting piece on the third substrate, wherein part of the second dielectric layer is exposed out of the connecting piece;

providing a piezoelectric element and a moved element, combining a fixed end of the piezoelectric element on the second medium layer, combining a first end of the connecting piece on a movable end of the piezoelectric element, and combining the moved element on a second end of the connecting piece;

and removing at least the third substrate and the second medium layer at the bottom of the connecting piece and the moved element.

The present invention also provides a lens assembly, comprising:

a circuit board;

the imaging module is positioned on the circuit board, and the external signal connecting end is electrically connected with the corresponding connecting end on the circuit board.

In the imaging module, the forming method thereof and the lens component provided by the invention, the support block supports a piezoelectric element, one end of the piezoelectric element is connected with the moved element, the other end of the piezoelectric element extends out of the moved element, the external signal connecting end is electrically connected with the electrode in the piezoelectric element to electrify the piezoelectric element, so that one end of the piezoelectric element is warped upwards or downwards relative to the other end to move the moved element, and therefore, the moving requirement of the moved element can be met.

Drawings

Fig. 1 is a schematic cross-sectional view of a first imaging module having a pair of piezoelectric elements according to an embodiment of the present invention;

fig. 2 is a schematic cross-sectional view of a piezoelectric element according to an embodiment of the present invention, wherein the piezoelectric element has a first lead-out and a second lead-out on a top surface thereof;

FIG. 3a is a schematic structural diagram of a connector according to an embodiment of the present invention;

FIG. 3b is a schematic diagram of a piezoelectric element and a connecting member according to an embodiment of the present invention;

FIG. 3c is a top view of FIG. 3b according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of FIG. 1 illustrating the upward warping of the piezoelectric element of the same magnitude according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of FIG. 1 illustrating a difference in the magnitude of upward warping of the piezoelectric element according to an embodiment of the present invention;

fig. 6 is a top view of an imaging module having two pairs of piezoelectric elements according to an embodiment of the present invention;

fig. 7 is a top view of an imaging module having three pairs of piezoelectric elements according to an embodiment of the present invention;

fig. 8 is a top view of an imaging module having two piezoelectric elements on one side of a moved element according to an embodiment of the present invention;

fig. 9 is a schematic cross-sectional view of a second imaging module having a pair of piezoelectric elements according to an embodiment of the invention;

fig. 10 is a schematic cross-sectional view of a third imaging module with a pair of piezoelectric elements according to an embodiment of the invention;

fig. 11 is a schematic cross-sectional view of a fourth imaging module having a pair of piezoelectric elements according to an embodiment of the invention;

fig. 12 is a schematic cross-sectional view of a fifth imaging module having a pair of piezoelectric elements according to an embodiment of the invention;

FIG. 13 is a top view of the imaging module of FIG. 12 according to an embodiment of the present invention;

fig. 14 is a schematic cross-sectional view of a sixth imaging module with a pair of piezoelectric elements according to an embodiment of the invention;

FIG. 15 is a schematic cross-sectional view of a third electrical connection end and a fourth electrical connection end on the top surface of the support block according to the second embodiment of the present invention;

FIG. 16 is a cross-sectional view of a third electrical connection end and a fourth electrical connection end at a bottom surface of a backing block according to a second embodiment of the present invention;

FIG. 17 is a schematic cross-sectional view of a third electrical connection end and a fourth electrical connection end on the top surface and the bottom surface of the support block, respectively, according to a second embodiment of the present invention;

fig. 18 is a schematic cross-sectional view of an imaging module in which a moved element is an imaging sensor according to a third embodiment of the present invention;

fig. 19a is a schematic cross-sectional view of an imaging module in which a first electrical connection terminal is located on a top surface of a piezoelectric element according to a third embodiment of the present invention;

fig. 19b is a schematic cross-sectional view of a piezoelectric element according to a third embodiment of the present invention, wherein a wiring layer is disposed on a top surface of the piezoelectric element;

fig. 20 is a schematic cross-sectional view of a piezoelectric element having three piezoelectric films according to a fourth embodiment of the present invention;

fig. 21 is a schematic cross-sectional view of an imaging module in which the moved element is a mirror according to a fifth embodiment of the present invention;

FIG. 22 is a cross-sectional view of a fifth embodiment of the present invention showing the piezoelectric element in FIG. 21 being warped;

fig. 23 is a flowchart of a method for forming an imaging module according to a sixth embodiment of the invention;

23-40 are schematic views of a semiconductor structure formed using the method of forming an imaging module according to the sixth embodiment;

fig. 41 is a flowchart of a method for forming an imaging module according to a seventh embodiment of the invention;

42-48 are schematic diagrams of semiconductor structures formed using the method of forming an imaging module according to the seventh embodiment;

wherein the reference numbers are as follows:

10-a circuit board; 20-a piezoelectric element; 21-a first electrode; 22-a second electrode; 23-a piezoelectric film; 24-a substrate; 25-an insulating layer; 251-a first lead-out terminal; 252-a second terminal; 30-a moved element; 40-a connector; 41-a first part; 42-a second portion; 43-a middle portion; 50-a support block; 51-a first layer support block; 52-second tier support block; 61-a third electrical connection; 62-a fourth electrical connection; 63-a conductive plug; 71-a first electrical connection; 72-a second electrical connection; 73-a flexible electrical lead; 74-a fifth electrical connection; 75-a wiring layer; 76-lead wires; 77-a sixth electrical connection;

211-odd layer electrodes; 221-even layer electrodes; 26-a conductive structure;

110-a first substrate; 200-a first dielectric layer; 210-a first groove; 220-a second groove; 230-a first bump; 240-second bump;

120-a second substrate; 121-a third groove; 400-a layer of connector material; 130-temporary bonding substrate;

140-a third substrate; 141-opening; 410-a layer of connector material; 500-a second dielectric layer; 80-glue layer.

Detailed Description

The technical solution of the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention. Similarly, if the method described herein comprises a series of steps, the order in which these steps are presented herein is not necessarily the only order in which these steps may be performed, and some of the described steps may be omitted and/or some other steps not described herein may be added to the method. Although elements in one drawing may be readily identified as such in other drawings, the present disclosure does not identify each element as being identical to each other in every drawing for clarity of description.

Example one

As shown in fig. 1, the present embodiment provides an imaging module, including:

a moved element 30, the moved element 30 being a lens group, a lens sheet or an aperture;

a flexible connecting member 40, the connecting member 40 including a first end and a second end, the first end being connected to the moved element 30;

a piezoelectric element 20 including a movable end and a fixed end, the movable end being connected to the second end; in the energized state of the piezoelectric element 20, the movable end is warped upward or downward with respect to the fixed end to move the moved element 30;

the supporting block 50 is used for supporting and fixing the piezoelectric element 20, and the fixed end is fixed on the supporting block 50;

and an external signal connection terminal electrically connected to the electrode of the piezoelectric element 20.

Specifically, as shown in fig. 2, the piezoelectric element 20 includes a piezoelectric stack structure in which a support layer 24 is located on the support layer 24, the piezoelectric stack structure includes a piezoelectric film 23 and an insulating layer 25 that are stacked in sequence from bottom to top, a first electrode 21 and a second electrode 22 are respectively provided on upper and lower surfaces of the piezoelectric film 23, the first electrode 21 and the second electrode 22 are respectively connected to a first terminal 251 and a second terminal 252, and the first terminal 251 and the second terminal 252 are both located in the insulating layer 25.

In the present invention, the first lead 251 and the second lead 252 may be both located on the bottom surface of the piezoelectric element 20, that is, in the support layer 24, or the first lead 251 and the second lead 252 may be located on the top surface and the bottom surface of the piezoelectric element 20, respectively, which is not limited in the present invention. The piezoelectric element 20 is not limited to an integral structure having the first and second terminals, but may be a structure in which the first and second terminals are not formed, that is, the piezoelectric element 20 includes a support layer 24, a piezoelectric film 23, an insulating layer 25, and first and

second electrodes

21 and 22 on upper and lower surfaces of the piezoelectric film 23, and the external signal connection terminal needs to be connected to the first and

second electrodes

21 and 22 by additionally manufacturing a conductive plug.

Further, as shown in fig. 2, the first terminal 251 and the second terminal 252 are both located on the top surface of the piezoelectric element 20 and serve as the external signal connection terminals. The first lead-out terminal 251 and the second lead-out terminal 252 are electrically connected to the circuit board 10 by a lead wire 76, respectively, so that the circuit board 10 can apply a voltage to the first electrode 21 and the second electrode 22 of the piezoelectric element 20 to generate a voltage difference between the upper surface and the lower surface of the piezoelectric film 23, thereby causing the piezoelectric film 23 to contract, and since the support layer 24 cannot stretch, the entire piezoelectric element 20 may be warped upwards or downwards when energized (the warping direction, the warping degree depends on the voltage applied to the upper surface and the lower surface of the piezoelectric film 23). The piezoelectric film 23 is made of a piezoelectric material that can be deformed when energized, such as quartz crystal, aluminum nitride, zinc oxide, lead zirconate titanate, barium titanate, lithium gallate, lithium germanate, or titanium germanate.

It should be understood that the present invention is not limited to directly connecting the first and

second terminals

251 and 252 to the circuit board 10 by means of the leads 76, but an electrical connection terminal may be provided on the top surface of the supporting block 50, the first and

second terminals

251 and 252 and the electrical connection terminal are electrically connected by means of leads, and then the electrical connection terminal on the top surface of the supporting block 50 and the circuit board 10 are electrically connected by means of another interconnection structure (e.g., a lead or a conductive plug), so that the length of the leads 76 can be shortened.

As shown in fig. 3a, the upper surface of the movable end of the piezoelectric element 20 is connected to the moved element 30 through a flexible connecting member 40. The connecting member 40 includes: a first portion 41, a second portion 42, and a middle portion between the first portion 41 and the second portion 42, wherein the first end is at least a portion of the first portion 41, the second portion 42 is a portion of the second end, the middle portion 43 is a horizontal strip structure, and the first portion 41 and the second portion 42 further have a vertical beam, and the first end and the second end are connected to the middle portion 43 through the vertical beam. The width and thickness of the middle portion 43 satisfy predetermined values, so that the middle portion 43 has flexibility, and the middle portion 43 can be deformed when the first end and the second end are subjected to different pulling or pushing forces.

It will be understood that the values of the width and thickness of the intermediate portion 43 are related to the material of the intermediate portion 43, and that, when a different material is chosen for the intermediate portion 43, the values will vary accordingly, as long as flexibility of the intermediate portion 43 is ensured.

In the present invention, the middle portion 43 is not limited to a strip-shaped structure, but may also be an arc shape, a wave shape, etc.; the first and second portions 41 and 42 are not limited to the connection of the middle portion 43 with the vertical beams, and the invention is not limited thereto. Further, the first and second portions 41 and 42 may also have flexibility, so that the connecting member 40 has flexibility as a whole, and the deformation capability of the connecting member 40 may be increased.

As shown in fig. 3b and 3c, the connecting member 40 is not limited to be a separate structure from the piezoelectric element 20, and the connecting member 40 and the piezoelectric element 20 may be an integral structure, that is, the connecting member 40 and the piezoelectric element 20 are made of the same material, are located at the same height, and are left and right parts of the same structure, and are separated by an insulating structure, so that the connecting member 40 is not affected when a voltage is applied to the electrodes of the piezoelectric element 20.

It should be understood that the connecting member 40 and the piezoelectric element 20 may be located at different heights when they are a unitary structure, and the invention is not limited thereto.

As shown in fig. 4, when the piezoelectric element 20 is powered on, the fixed end of the piezoelectric element 20 disposed on the supporting block 50 is fixed, and the movable end is warped upwards or downwards, so that the moved element 30 can be raised or lowered integrally, thereby changing the vertical position of the moved element 30 and realizing optical auto-focusing.

As shown in fig. 5, after the autofocus is completed, when necessary, the voltage applied to the piezoelectric element 20 on the side of the moved element 30 may be changed, so as to tilt the imaging sensor element 30, thereby changing the angle of the moved element 30, and correcting the optical warping angle of the moved element 30, thereby achieving optical anti-shake.

The piezoelectric element 20 and the moved element 30 are flexibly connected through the connecting member 40, so that the risk of deformation of the moved element 30 due to an external force or delamination from the piezoelectric element 20 is reduced (if the movable end of the piezoelectric element 20 is directly connected to the moved element 30, when the movable end of the piezoelectric element 20 is warped, if the connection between the piezoelectric element 20 and the moved element 30 is not firm, there is a risk of delamination, and if the connection is too firm, there is a risk of deformation of the moved element 30).

Referring to fig. 1, the edge of the moved element 30 is connected to the movable end of the piezoelectric element 20, so that the piezoelectric element 20 can control the movement of the moved element 30 more easily, and the movement of the moved element 30 is more stable. In the present invention, the movable end of the piezoelectric element 20 is not limited to be located at the edge of the moved element 30, and may be connected to the center or the center-to-edge region of the moved element 30.

The supporting block 50 is connected with the fixed end of the piezoelectric element 20 by adhesive or through a dry film; the movable end of the piezoelectric element 20 is connected with the connecting piece 40 by adhesive or through a dry film; the connecting member 40 is bonded to the moved member 30 by an adhesive or by a dry film.

Referring to fig. 1, the moved element 30 is, for example, a square, the piezoelectric elements 20 are a pair, a connecting line between the pair of piezoelectric elements 20 is used as a rotation axis, and the moved element 30 can rotate along the rotation axis to change the inclination angle in one direction. Referring to fig. 6, the moved element 30 is, for example, square, two pairs of the piezoelectric elements 20 are distributed on four sides of the moved element 30, a connecting line between each pair of the piezoelectric elements 20 is used as a rotation axis, and the total of two rotation axes is two, and the moved element 30 can rotate along the two rotation axes to change the inclination angles in two directions.

As shown in fig. 7, the moved element 30 is, for example, circular, the piezoelectric elements 20 are in three pairs, the three pairs of piezoelectric elements 20 are evenly distributed in the circumferential direction, the connecting line between each pair of piezoelectric elements 20 is used as a rotation axis, the total of three rotation axes are provided, and the moved element 30 can rotate along the three rotation axes to change the inclination angles in three directions. Of course, the piezoelectric elements 20 may also be four pairs, five pairs or six pairs, each pair of piezoelectric elements 20 is not limited to be symmetrically arranged along the center of the moved element 30, and may also be asymmetrically arranged, the more the number of pairs of piezoelectric elements 20, the more the rotation axis of the moved element 30 may be increased, so as to implement multi-dimensional rotation, the moved element 30 is also not limited to be square or circular, and may also be in other shapes, and the present invention is not limited.

It is understood that the paired piezoelectric elements 20 are beneficial to control the movement of the moved element 30, and in fact, the piezoelectric elements 20 may also be unpaired, for example, three piezoelectric elements 20 are uniformly distributed along the circumference of the moved element 30, and the embodiment is not illustrated.

As shown in fig. 8, the moved element 30 is, for example, square, and two opposite sides of the moved element 30 are connected to two piezoelectric elements 20, so that the two piezoelectric elements 20 are synchronously warped upwards or downwards (and the warping amplitudes are the same), so that the two piezoelectric elements 20 together support one side of the moved element 30, which can be applied to the case where the piezoelectric elements 20 are small in size and the moved element 30 is large in size, or the case where the moved element 30 is large in mass. In the present invention, the two opposite sides of the moved element 30 are not limited to the connection of two piezoelectric elements 20, and may be connected to three, four, five, or the like.

Further, with reference to fig. 1, the piezoelectric element 20 and the moved element 30 are located on opposite sides of the connecting member 40 in the thickness direction. As shown in fig. 9, the piezoelectric element 20 and the moved element 30 are located on the same side of the connecting member 40 in the thickness direction.

As shown in fig. 1, a pair of piezoelectric elements 20 are connected to the lower surface of the moved element 30, and as shown in fig. 10, a pair of piezoelectric elements 20 are connected to the upper surface of the moved element 30; as shown in fig. 11, one of a pair of piezoelectric elements 20 is connected to the upper surface of the moved element 30 and the other is connected to the lower surface of the moved element 30, and at this time, the heights of the supporting blocks 50 supporting the two piezoelectric elements 20 are different, but it should be understood that, when the piezoelectric elements 20 and the moved element 30 are located on the same side of the connecting member 40 (one is located on the upper side and one is located on the lower side), even though the two piezoelectric elements 20 are connected to the upper and lower surfaces of the moved element 30, respectively, the heights of the supporting blocks 50 may be the same, that is, in order to support the piezoelectric elements 20, the heights of the supporting blocks 50 may be adjusted according to the positions of the piezoelectric elements 20.

As shown in fig. 12 and 13, the piezoelectric element 20 has a pair, and two piezoelectric elements 20 of the pair of piezoelectric elements 20 are arranged to overlap. That is, the movable end of the piezoelectric element 20 is selectively connected to the side of the moved element 30 that is farther away (each piezoelectric element 20 is used to move the opposite side of the moved element 30), so that the length of the piezoelectric element 20 can be increased, and the movable end can be easily lifted even when the mass of the moved element 30 is large.

Further, as shown in fig. 14, the piezoelectric elements 20 are a pair, and the supporting block 50 corresponding to a pair of piezoelectric elements 20 is located in a space below the moved element 30. In this embodiment, the supporting block 50 and the fixed positions of the supporting block 50 and the piezoelectric element 20 are located right below the moved element 30, so that the fixed end of the piezoelectric element 20 is closer to the center of the moved element 30 than the movable end. Of course, the supporting fence 50 is not limited to be completely located under the moved element 30, but may also be partially located under the moved element 30, so that the supporting block 50 may be completely or partially covered by the moved element 30, the area occupied by the supporting block 50 may be saved, the area of the whole imaging module may be reduced, and the size reduction may be facilitated.

In the present invention, the piezoelectric element 20 is integrally located on the supporting block 50, and the movable end of the piezoelectric element extends out of the supporting block 50 to form a cantilever structure, which can be applied to the occasion that the moved element 30 needs to be lifted up or down. The piezoelectric element 20 may also be integrally located on the supporting block 50, and the movable end does not extend out of the supporting block 50, forming a solid structure, which may be used in the case of lifting only the moved element 30.

Further, the material of the supporting block 50 is a dielectric material, which may be annular and disposed around the moved element 30, and may better support the piezoelectric element 20; alternatively, the support block 50 includes a plurality of sub-support blocks (not shown) distributed along the circumferential direction, and the plurality of sub-support blocks are spaced apart from or in contact with each other, so that material and weight can be saved. In the present invention, the supporting block 50 may not be annular, for example, only located on two sides or four sides of the moved element 30.

In the present invention, the first lead-out terminal 251 and the second lead-out terminal 252 are not limited to be the external signal connection terminals. For example, when the first lead-out terminal 251 and the second lead-out terminal 252 are both located on the bottom surface of the piezoelectric element 20, the third electrical connection terminal and the fourth electrical connection terminal may be located on the bottom surface of the supporting block 50 and directly face the piezoelectric element 20, and the first lead-out terminal 251 and the second lead-out terminal 252 are electrically connected to the third electrical connection terminal and the fourth electrical connection terminal by using a conductive plug. When the first lead-out terminal 251 and the second lead-out terminal 252 are respectively located on the top surface and the bottom surface of the piezoelectric element 20, the third electrical connection terminal is located on the bottom surface of the supporting block 50 and faces the piezoelectric element 20, a conductive plug is used to electrically connect the lead-out terminal (for example, the second lead-out terminal 252) located on the bottom surface with the fourth electrical connection terminal, and the first lead-out terminal 251 is used as the third electrical connection terminal.

It is to be understood that when the third and fourth electrical connection terminals are not directly facing the piezoelectric element 20, the third and fourth electrical connection terminals may also be electrically connected to the first and

second terminals

251 and 252 using rewiring and conductive plugs.

Example two

The difference from the first embodiment is that, in the present embodiment, as shown in fig. 15, the piezoelectric element 20 is inserted into the supporting block 50 to be fixed, that is, the supporting block 50 includes a first layer supporting block 51 and a second layer supporting block 52 stacked in sequence from bottom to top, and the fixed end of the piezoelectric element 20 is fixed between the first layer supporting block 51 and the second layer supporting block 52.

The supporting block 50 of the present invention is not limited to include only two layers of supporting blocks, and may include one layer, three layers, four layers, 5 layers, etc., as long as the fixing end of the piezoelectric element 20 is inserted into the supporting block 50 to be fixed.

Referring to fig. 15 and 2, the external signal connection end includes a third electrical connection end 61 and a fourth electrical connection end 62, the first lead-out end 251 and the second lead-out end 252 are both located on the top surface of the piezoelectric element 20, the third electrical connection end 61 and the fourth electrical connection end 62 are located on the top surface of the supporting block 50 and directly above the piezoelectric element 20, the third electrical connection end 61 is electrically connected to the first lead-out end 251 of the piezoelectric element 20 through a conductive plug 63, the fourth electrical connection end 62 is electrically connected to the second lead-out end 252 of the piezoelectric element 20 through a conductive plug 63, and the conductive plug 63 is located in the second layer of supporting block 52.

Referring to fig. 16, the first lead-out end 251 and the second lead-out end 252 are both located on the bottom surface of the piezoelectric element 20, the third electrical connection end 61 and the fourth electrical connection end 62 are located on the bottom surface of the supporting block 50 and are located right below the piezoelectric element 20, the third electrical connection end 61 is electrically connected to the first lead-out end 251 of the piezoelectric element 20 through a conductive plug 63, the fourth electrical connection end 62 is electrically connected to the second lead-out end 252 of the piezoelectric element 20 through a conductive plug 63, and the conductive plug 63 is located in the first layer of supporting block 51.

Referring to fig. 17, the first lead-out terminal 251 and the second lead-out terminal 252 are respectively located on the top surface and the bottom surface of the piezoelectric element 20, the third electrical connection terminal 61 and the fourth electrical connection terminal 62 are located on the top surface and the bottom surface of the supporting block 50 and are located right above and right below the piezoelectric element 20, the third electrical connection terminal 61 is electrically connected to the first lead-out terminal 251 of the piezoelectric element 20 through a conductive plug 63, the fourth electrical connection terminal 62 is electrically connected to the second lead-out terminal 252 of the piezoelectric element 20 through a conductive plug 63, and the conductive plugs 63 are respectively located in the first layer supporting block 51 and the second layer supporting block 52.

In the present invention, when the third electrical connection terminal 61 and the fourth electrical connection terminal 62 are not located directly above or below the piezoelectric element 20, the first lead-out terminal 251 and the second lead-out terminal 252 may be led out to the top surface or the bottom surface of the supporting block 50 by using the conductive plug 63, and the conductive plug 63 may be connected to the third electrical connection terminal 61 and the fourth electrical connection terminal 62 by using rewiring.

EXAMPLE III

The difference from the first and second embodiments is that, in the present embodiment, the moved element 30 is an imaging sensor element.

As shown in fig. 18 and 19a, the top surface of the piezoelectric element 20 is further provided with a wiring layer 75, the wiring layer 75 is located in the insulating layer 25, and both ends of the wiring layer have a first electrical connection end 71 and a fifth electrical connection end 74 exposing the insulating layer 25. The first electrical connection end 71 is closer to the moved element 30 than the fifth electrical connection end 74, the second electrical connection end 72 is disposed on the upper surface of the moved element 30, the first electrical connection end 71 and the second electrical connection end 72 are electrically connected through a flexible electrical guide 73, and the fifth electrical connection end 74 is electrically connected to the circuit board 10 through a lead 76, so that the circuit board 10 supplies power or provides signals for the imaging sensor. Compared with the method of directly electrically connecting the second electrical connection end 72 of the imaging sensor element and the circuit board 10 by using a lead wire, the length of the flexible electrical guide 73 in this embodiment can be shorter (the closer the first electrical connection end 71 is to the imaging sensor element, the shorter the length of the flexible electrical guide 73), and the movable element 30 does not pull the flexible electrical guide 73 when moving up or down. In the present invention, the first electrical connection end 71 is not limited to be located on the top surface of the piezoelectric element 20, for example, when the supporting block 50 includes a first layer supporting block 51 and a second layer supporting block 52 stacked in sequence from bottom to top, and the fixed end of the piezoelectric element 20 is fixed between the first layer supporting block 51 and the second layer supporting block 52, the first electrical connection end 71 may be located on the top of the supporting block 50 and electrically connected to the circuit board by a lead.

It should be understood that, in the present invention, the first electrical connection end 71 is not limited to be electrically connected to the circuit board 10 through a lead 76, as shown in fig. 19b, a sixth electrical connection end 77 may be directly formed on the top surface of the supporting block 50, the fifth electrical connection end 74 is electrically connected to the sixth electrical connection end 77 through a lead 76, and another interconnection structure is further disposed in the supporting block 50 and electrically connects the sixth electrical connection end 77 and the circuit board 10, so that the circuit board 10 can supply power or transmit signals to the moved element 30. The flexible electrical conductors 73 in this embodiment are flexible interconnect lines and the interconnect structure is a conductive plug.

In the present invention, the sixth electrical connection terminal 77 may also be electrically connected to the circuit board 10 by other interconnection methods, and the flexible electrical conductor 73 and the interconnection structure may also be of other structures, which is not limited in the present invention.

Example four

As shown in fig. 20, the difference from the first embodiment and the second embodiment is that in the present embodiment, the piezoelectric element 20 includes a piezoelectric stack structure in which a support layer 24 is located on the support layer 24, and the piezoelectric stack structure includes three piezoelectric films 23.

Electrodes are distributed on the upper surface and the lower surface of each piezoelectric film 23, and two adjacent piezoelectric films 23 share the electrode positioned between the two piezoelectric films, so that the three piezoelectric films 23 are 4 layers of electrodes, the electrodes are counted from bottom to top, the electrodes 211 on the odd layers are electrically connected together by using the conductive structure 26, the electrodes 221 on the even layers are electrically connected together by using the conductive structure 26, the part of the conductive structure 26 extending into the piezoelectric laminated structure needs to be positioned in the insulating layer 25, and only the end part of the conductive structure is in contact with the electrode needing to be electrically connected. The top of the conductive structure 26 may serve as a first and second terminal such that the first and second terminals are located on the top surface of the piezoelectric element 20.

In the present invention, the piezoelectric stack structure is not limited to include three piezoelectric films, and may also include two, four, five, or six piezoelectric films, and the like, and the ability of warping the piezoelectric element 20 may be improved by increasing the number of piezoelectric films, so that the piezoelectric element 20 may move an imaging sensing element with a higher mass.

Further, the manner in which the odd-numbered layer electrodes 211 and the even-numbered layer electrodes 221 are electrically connected is not limited to the conductive structure 26 as shown in fig. 10, and may be electrically connected by means of a conductive plug and an interconnection line, for example. The conductive structure 26 may also lead the odd-numbered layer electrodes 211 and the even-numbered layer electrodes 221 to the bottom surface of the support layer 24, so that the first lead terminals and the second lead terminals are located on the bottom surface of the piezoelectric element 20, or lead the odd-numbered layer electrodes 211 and the even-numbered layer electrodes 221 to the top surface of the piezoelectric element 20 and the bottom surface of the support layer 24, respectively, so that the first lead terminals and the second lead terminals are located on the top surface and the bottom surface of the piezoelectric element 20, respectively, which is not illustrated herein.

It is to be understood that, in order to ensure that the warping directions of the three piezoelectric films are the same, the polarities of the adjacent two piezoelectric films are opposite.

EXAMPLE five

The difference from the first, second, third and fourth embodiments is that in this embodiment, the moved element 30 is a mirror.

As shown in fig. 21, the piezoelectric element 20 is one, the movable end of one piezoelectric element 20 is connected to one side of the mirror, and the other side of the mirror opposite to the movable end is rotatably connected to a supporting surface, as shown in fig. 22, when the piezoelectric element 20 is powered on and warped upwards or downwards, the mirror is tilted, so as to change the reflection angle.

In the present invention, one side of the mirror is not limited to one piezoelectric element 20, and two, three, four, or 5 mirrors may be provided.

It should be understood that the mirror is not limited to having the piezoelectric elements 20 distributed on only one side, and the piezoelectric elements 20 may also be distributed on two sides, four sides, and circumferentially.

EXAMPLE six

As shown in fig. 23, the present embodiment provides a method for forming an imaging module, including:

s11: providing a first substrate, wherein a first dielectric layer is formed on the first substrate;

s12: forming at least one first groove and an annular second groove in the first medium layer, wherein the first groove extends into the first medium layer from the surface of the first medium layer, the second groove is communicated with the first groove and penetrates through the first medium layer to divide the first medium layer into a first lug and a second lug surrounding the first lug, and the second lug is a supporting block;

s13: providing a piezoelectric element, a flexible connecting piece and a moved element, wherein a fixed end of the piezoelectric element is combined with the bottom surface of the first groove, a first end of the connecting piece is combined with a movable end of the piezoelectric element, and the moved element is combined with a second end of the connecting piece;

s14: forming an external signal connection terminal electrically connected to an electrode in the piezoelectric element;

s15: and peeling the first substrate and the first bump.

Specifically, please refer to fig. 24-40, which are schematic views of a semiconductor structure formed by the method for forming an imaging module according to the present embodiment, and the method for forming an imaging module according to the present embodiment will be described in detail with reference to fig. 24-40.

As shown in fig. 24, step S11 is performed to provide a first substrate 110, wherein a pyrolytic film (not shown) and a first dielectric layer 200 are sequentially formed on the first substrate 110, and the first dielectric layer 200 covers the pyrolytic film. In the present invention, the formation of the pyrolytic film on the first substrate 110 is not limited, and other bonding layers may be formed.

Continuing to refer to fig. 24, step S12 is performed to etch the first dielectric layer 200 to form a first recess 210. The transverse length and depth of the first groove 210 may be the same as the transverse length and thickness of the piezoelectric element so as to accommodate the piezoelectric element, and the transverse length of the first groove 210 may be greater than the transverse length of the piezoelectric element.

As shown in fig. 25, the first dielectric layer 200 is continuously etched down along the bottom of the first groove 210 and the etching is stopped after the first substrate 110 is exposed, so as to form a second groove 220 in the first dielectric layer 200. The second groove 220 is located at the bottom of the first groove 210 and is communicated with the first groove 210, and the bottom of the second groove 220 exposes the first substrate 110.

As shown in fig. 26, the first groove 210 and the second groove 220 are both annular in a direction perpendicular to the surface of the first substrate 110. The second groove 220 is communicated with the first groove 210 and penetrates through the first dielectric layer 200, so that the first dielectric layer 200 has been split into two parts, namely, a first bump 230 and a second bump 240 surrounding the first bump 230. Of course, if only one pair of piezoelectric elements is required, the shape of the first groove 210 may not be circular, such as two straight grooves.

As shown in fig. 27, step S13 is performed to provide a piezoelectric element 20, where the piezoelectric element 20 has a first terminal and a second terminal on the top surface thereof, and two piezoelectric elements 20 are symmetrically disposed in the first recess 210 and are used to combine the fixed end of the piezoelectric element 20 with the second bump 240.

As shown in fig. 28, two connectors 40 are provided, the two connectors 40 are respectively placed on the first protrusion 230 and the piezoelectric element 20, and the second end of the connector 40 is coupled to the movable end of the piezoelectric element 20.

Then, as shown in fig. 30, a moved member 30 is provided, and an edge of the moved member 30 is combined with the first end of the connecting member 40.

Alternatively, as shown in fig. 29, after the fixed end of the piezoelectric element 20 is coupled to the second protrusion 240, the moved element 30 is coupled to the first end of the connecting member 40, and then the moved element 30 is moved above the first protrusion 230 together with the connecting member 40.

Then, as shown in fig. 30, the second end of the connecting member 40 is combined with the movable end of the piezoelectric element 20.

Of course, if the piezoelectric element 20 and the connecting member 40 are of an integral structure, it is only necessary to combine the edge of the moved element 30 and the first end of the connecting member 40 after the fixed end of the piezoelectric element 20 is combined with the second protrusion 240.

The combination of the supporting block and the fixed end of the piezoelectric element, the combination of the movable end of the piezoelectric element and the connecting member, and the combination of the connecting member and the moved element are all combined by using an adhesive, but not limited thereto, and they may all be combined by using a dry film, or partially combined by using an adhesive, and partially combined by using a dry film.

As shown in fig. 31, steps S14 and S15 are performed to debond the first dielectric layer 200 and the first substrate 110 to separate the first dielectric layer 200 and the first substrate 110. After the first dielectric layer 200 is separated from the first substrate 110, a suction cup or a UV film with a steel ring may be attached to the upper surface of the moved element 30, and then upwardly applied, since the moved element 30 is coupled to the piezoelectric element 20 through the connection member 40, the piezoelectric element 20 is combined with the second bump 240, and the first bump 230 is not connected with any component (has a supporting function), when the moved element 30 is forced to lift upward, the moved element 30, the connecting member 40, the piezoelectric element 20 and the second protrusion 240 move upward in synchronization, thereby peeling the first substrate 110 from the first bump 230, the second bump 240 attached to the piezoelectric element 20 may serve as a supporting block for supporting the piezoelectric element 20, the first and second terminals of the top surface of the piezoelectric element 20 serve as the external signal connection terminals.

The present invention is not limited to the imaging module in which the first and second terminals of the piezoelectric element 20 are formed on the top surface thereof, and when the first and second terminals of the piezoelectric element 20 are formed on the bottom surface thereof, as shown in fig. 32, it is only necessary to form two conductive plugs 63 in the second bump 240 before the piezoelectric element 20 is placed in the first groove, then electrically connect the first and second terminals of the piezoelectric element 20 to one of the conductive plugs 63, and then form third and fourth electrical connection terminals at the bottom of the second bump 240, and electrically connect the third and fourth electrical connection terminals to one of the conductive plugs 63. When the first lead-out end and the second lead-out end of the piezoelectric element 20 are respectively located on the top surface and the bottom surface thereof, before the piezoelectric element 20 is placed in the first groove, it is necessary to form a conductive plug 63 in the second bump 240, then electrically connect the second lead-out end of the piezoelectric element 20 with one of the conductive plugs 63, then form a fourth electrical connection end at the bottom of the second bump 240, electrically connect the third electrical connection end with the conductive plug 63, and use the first lead-out end as the fourth electrical connection end.

It is to be understood that the interconnection structure that leads out the first and second terminals is not limited to the conductive plug, but may be a combination of a rewiring and a conductive plug.

Further, as shown in fig. 33 to 40, this embodiment also shows a forming process of the connecting member 40.

As shown in fig. 33, a second substrate 120 is provided, and the second substrate 120 is etched to form at least one third groove 121 in the second substrate 120, wherein the number and size of the third grooves 121 are consistent with the number and size of the connectors 40 to be formed.

As shown in fig. 34, the connecting member 40 in this embodiment has a Z-shape, and the third groove 121 has a Z-shape.

As shown in fig. 35, a connector material layer 400 is formed on the second substrate 120, and the connector material layer 400 fills the third groove 121 and extends to cover the third groove 121. In this embodiment, the bonding process is used to form the connector material layer 400 on the second substrate 120, but not limited thereto.

As shown in fig. 36, the connector material layer 400 is peeled off from the second substrate 120, rotated by 180 degrees, and then placed on a temporary bonding substrate 130. In order to facilitate demolding, a pyrolytic film may be formed between the second substrate 120 and the connector material layer 400 in advance, then the temporary bonding substrate 130 forms a pyrolytic film between the connector material layer 400, and after the second substrate 120 and the connector material layer 400 are unbonded, the connector material layer 400 may be bonded on the temporary bonding substrate 130 by rotating 180 degrees.

It should be understood that the bonding layers formed between the second substrate 120 and the connector material layer 400 and between the temporary bonding substrate 130 and the connector material layer 400 are not limited to the pyrolytic film, but may be other bonding layers.

As shown in fig. 37 to 38, the connector material layer 400 is etched to remove the excess connector material layer 400, so that the remaining connector material layer 400 constitutes the connector 40, and the shape of the connector 40 is the same as that of the third recess 121 in fig. 34.

Finally, the temporary bonding substrate 130 is debonded from the connecting members 40 to obtain at least one connecting member 40, and then the connecting member 40 may be placed on the second bump 240 as shown in fig. 28.

Further, as shown in fig. 37, before the temporary bonding base 130 is unbonded to the connection member 40, the moved element 30 is bonded to the second end of the connection member 40, and then the temporary bonding base 130 is unbonded to the connection member 40. The moved element 30 and the connecting member 40 can be integrated by sucking the moved element 30 with a suction cup or a UV film with a band.

EXAMPLE seven

As shown in fig. 41, the present embodiment provides another method for forming an imaging module, including:

s21: providing a third substrate, and sequentially forming a second dielectric layer and at least one connecting piece on the third substrate, wherein part of the second dielectric layer is exposed out of the connecting piece;

s22: providing a piezoelectric element and a moved element with flexibility, combining a fixed end of the piezoelectric element on the second medium layer, combining a first end of the connecting piece on a movable end of the piezoelectric element, and combining the moved element on a second end of the connecting piece;

s23: forming an external signal connection terminal electrically connected to an electrode in the piezoelectric element;

s24: and removing at least the third substrate and the second medium layer at the bottom of the connecting piece and the moved element.

Specifically, please refer to fig. 42-48, which are schematic views of a semiconductor structure formed by the method for forming an imaging module according to the present embodiment, and the method for forming an imaging module according to the present embodiment will be described in detail with reference to fig. 42-48.

As shown in fig. 42, step S21 is performed to provide a third substrate 140, and a second dielectric layer 500 and a connector material layer 410 are sequentially formed on the third substrate 140.

As shown in fig. 43, the connector material layer 410 is etched to pattern the connector material layer 410. After the etching is completed, two connection members 40 are formed on the third substrate 140, and as can be seen from fig. 44, the connection members 40 expose a portion of the second dielectric layer 500.

As shown in fig. 45, step S23 is performed to provide a piezoelectric element 20, where the piezoelectric element 20 has a first terminal and a second terminal on the top surface thereof, and two piezoelectric elements 20 are symmetrically disposed on the connecting member 40, and the fixed end of the piezoelectric element 20 is coupled to the third substrate 140 and the movable end is coupled to the second end of the connecting member 40. Specifically, a groove is formed in a corresponding position of the second dielectric layer 500, and then the fixed ends of the piezoelectric elements 20 are combined by using an adhesive layer 80, wherein the adhesive layer 80 has a certain thickness, so that the upper surface of the piezoelectric elements 20 can be ensured to be flat.

As shown in fig. 46, a member to be moved 30 is provided, and an edge of the member to be moved 30 is coupled to a first end of the connecting member 40.

The movable end of the piezoelectric element is bonded to the connecting member, and the connecting member is bonded to the moved element by using an adhesive, but not limited thereto, and the movable end of the piezoelectric element and the connecting member may be bonded by using a dry film, or a part of the movable end of the piezoelectric element and the connecting member may be bonded by using an adhesive, and a part of the movable end of the piezoelectric element and the connecting member may be bonded by using a dry film.

Referring to fig. 47, step S24 and step S25 are performed to etch a side of the third substrate 140 opposite to the connection member 40 to form an opening 141.

As shown in fig. 48, the second dielectric layer 500 is removed by a wet etching process or a dry etching process. While the third substrate 140 remaining at the bottom of the piezoelectric element 20 may serve as a support block for supporting the piezoelectric element 20, and the first and second terminals at the top of the piezoelectric element 20 serve as third and fourth electrical connection terminals, it is understood that a cantilever structure or a solid structure may be formed by the size of the opening 141.

Example eight

As shown in fig. 1 and fig. 2, the present embodiment provides a lens assembly, which includes a circuit board 10 and the imaging module, where the imaging module is located on the circuit board 10. The first terminal 251 and the second terminal 252 of the piezoelectric element 20 of the imaging module are both located on the top surface of the piezoelectric element 20, and the first terminal 251 and the second terminal 252 are used as external signal connection terminals and are electrically connected to corresponding connection terminals on the circuit board 10 through a lead wire 76.

Of course, the present invention is not limited to the piezoelectric element 20 and the circuit board 10 being electrically connected by the lead wire 76, and as shown in fig. 15, when the external signal connection terminal includes a third electrical connection terminal and a fourth electrical connection terminal, the third electrical connection terminal and the fourth electrical connection terminal may be electrically connected to the circuit board 10 by a lead wire, a conductive plug, a combination of a conductive plug and a lead wire, or a combination of a conductive plug and a rewiring, which is selected according to the positions of the third electrical connection terminal and the fourth electrical connection terminal.

It should be understood that the moved element 30 may also be a lens group, a lens sheet, a mirror, an aperture, or other elements.

It will be apparent to those skilled in the art that various changes and modifications may be made in the invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. An imaging module, comprising:

2. The imaging module of claim 1, wherein said connector comprises: a first portion, a second portion, an intermediate portion between the first portion and the second portion, the first end being at least a portion of the first portion, the second portion being at least a portion of the second end;

the width and the thickness of the middle part meet set values, so that the middle part has flexibility.

3. The imaging module of claim 1, wherein the connecting member and the piezoelectric element are made of the same material and are of an integral structure.

4. The imaging module of claim 1, wherein the support block is adhesively attached to the fixed end of the piezoelectric element or attached thereto by a dry film; the movable end of the piezoelectric element is connected with the connecting piece through adhesive or a dry film; the connecting piece is connected with the moved element through adhesive or through a dry film.

5. The imaging module of claim 1, wherein said piezoelectric elements comprise at least one pair, each pair being symmetrically disposed about a periphery of said moved element.

6. The imaging module of claim 5, wherein said piezoelectric element and said moved element are located on the same side or on opposite sides of said connecting member in the thickness direction.

7. The imaging module of claim 5, wherein each pair of piezoelectric elements is disposed on both sides of the moved element, and movable ends of each pair of piezoelectric elements are located on the same side or on the opposite side of the connecting member in the thickness direction.

8. The imaging module of claim 5, wherein each pair of piezoelectric elements is connected to an upper or lower surface of the moved element;

alternatively, one of the piezoelectric elements of each pair is connected to the upper surface of the moved element and the other is connected to the lower surface of the moved element.

9. The imaging module of claim 8, wherein said support blocks supporting each of said piezoelectric elements are of the same height; alternatively, the heights of the supporting blocks supporting each of the piezoelectric elements are not all the same.

10. The imaging module of claim 1 wherein said at least one pair of piezoelectric elements is located in a space below said moved element.

11. The imaging module of claim 10, wherein the fixed position of the support block to the piezoelectric element is located in a space below the moved element or outside.

12. The imaging module of claim 10 wherein the two piezoelectric elements in a pair are distributed on opposite sides of the center of the moved element;

alternatively, two piezoelectric elements in a pair are disposed to overlap.

13. The imaging module of claim 1, wherein the moved element comprises a mirror; the piezoelectric elements are distributed on one side of the reflector, and the other side, opposite to the reflector, of the reflector is rotatably connected with a supporting surface.

14. The imaging module of claim 1, wherein said support block is an annular support block enclosing a space over which said moved element is suspended;

or the supporting block comprises a plurality of sub-supporting blocks distributed along the circumferential direction, and the plurality of sub-supporting blocks are mutually spaced or contacted.

15. An imaging module according to claim 1 or 10, wherein the piezoelectric element is integrally located on the support block or the movable end of the piezoelectric element protrudes from the support block.

16. The imaging module of claim 1, wherein said piezoelectric element is located on a top surface of said backing block.

17. The imaging module of claim 1, wherein said support blocks comprise a first layer of support blocks and a second layer of support blocks stacked in sequence from bottom to top, and said fixed end of said piezoelectric element is fixed between said first layer of support blocks and said second layer of support blocks.

18. The imaging module of claim 1 wherein said support block material comprises a dielectric material.

19. The imaging module of claim 1, wherein when said moved element is an imaging sensor element, said imaging module further comprises a first electrical connection terminal disposed on said support block, an edge of said imaging sensor element has a second electrical connection terminal, and said first electrical connection terminal and said second electrical connection terminal are electrically connected through a flexible electrical conductor.

20. The imaging module of claim 1, wherein when the moved element is an imaging sensing element, the imaging module further comprises a wiring layer disposed on the piezoelectric element, the wiring layer having a first electrical connection terminal and a fifth electrical connection terminal at two ends thereof, respectively, and a second electrical connection terminal at an edge of the imaging sensing element;

the first electric connection end and the second electric connection end are electrically connected through a flexible electric conduction piece;

the first electrical connection terminal and the fifth electrical connection terminal are electrically connected through the wiring layer.

21. The imaging module of claim 1, wherein said piezoelectric element comprises: the piezoelectric actuator comprises a support layer and a piezoelectric laminated structure positioned on the support layer, wherein the piezoelectric laminated structure comprises: the upper surface of each piezoelectric film is distributed with electrodes, and two adjacent piezoelectric films share the electrode positioned between the two piezoelectric films;

the electrodes are counted from bottom to top in sequence, the electrodes of the odd layers are electrically connected together, and the electrodes of the even layers are electrically connected together.

22. The imaging module of claim 21, wherein said piezoelectric element further comprises: the first leading-out end is electrically connected with the odd layer electrode; the second leading-out terminal is electrically connected with the even layer electrode;

the first leading-out end and the second leading-out end are both positioned on the top surface or the bottom surface of the piezoelectric element, or one of the first leading-out end and the second leading-out end is positioned on the top surface and the other one is positioned on the bottom surface.

23. The imaging module of claim 22, wherein the first and second terminals are located on a top surface of the piezoelectric element and on a top surface of the support block;

the first leading-out end and the second leading-out end are used as the external signal connecting end.

24. The imaging module of claim 22, wherein said first and second terminals are located between said piezoelectric element and said backing block;

the external signal connection terminal includes: the third electric connection end is electrically connected with the first leading-out end; the fourth electric connection end is electrically connected with the second leading-out end;

the third electric connection end and the first leading-out end are positioned on the same side of the piezoelectric element;

and the fourth electric connection end and the second leading-out end are positioned on the same side of the piezoelectric element.

25. The imaging module of claim 22, wherein one of said first and second terminals is located on a bottom surface of said piezoelectric element, and the other is located on a top surface of said piezoelectric element and a top surface of said support block;

the external signal connecting end comprises a third electric connecting end and a fourth electric connecting end, and the fourth electric connecting end is positioned on the bottom surface of the supporting block and is electrically connected with a leading-out end positioned on the bottom surface; and the leading-out end positioned on the top surface of the piezoelectric element is used as a third electric connection end.

26. The imaging module of claim 21 wherein the material of the piezoelectric film comprises quartz crystal, aluminum nitride, zinc oxide, lead zirconate titanate, barium titanate, lithium gallate, lithium germanate, or titanium germanate.

27. A method of forming an imaging module as claimed in claim 1, comprising:

and peeling the first substrate and the first bump.

28. The method of forming an imaging module of claim 27, wherein a bonding layer is formed on the first substrate prior to forming the first dielectric layer;

and stripping the first substrate and the first bump in a pyrolysis mode.

29. The method of forming an imaging module of claim 27, wherein said bonding comprises: the bonding is performed by using an adhesive or a dry film.

30. The method of claim 27, wherein the fixed end of the piezoelectric element is bonded to the bottom surface of the first recess; then, combining the second end of the connecting piece with the movable end of the piezoelectric element;

and then combining the moved element with the first end of the connecting piece.

31. The method of claim 27, wherein the fixed end of the piezoelectric element is bonded to the bottom surface of the first recess; then, the moved element is combined with the first end of the connecting piece;

and combining the second end of the connecting piece with the movable end of the piezoelectric element.

32. The method of claim 27, wherein the connecting member and the piezoelectric element are made of the same material and are integrally formed, and are insulated from each other;

and combining the fixed end of the piezoelectric element with the bottom surface of the first groove, and then combining the moved element with the second end of the connecting piece.

33. The method of forming an imaging module of claim 27, wherein the step of forming the connector comprises:

providing a second substrate, wherein at least one third groove is formed in the second substrate, and the shape of the third groove is the same as that of the connecting piece;

forming a connector material layer on the second substrate, wherein the connector material layer is at least filled in the third groove;

removing the connector material layer outside the third groove;

and peeling off the second substrate, wherein the rest of the connecting piece material layer forms the corresponding connecting piece.

34. The method of claim 33, wherein the moved element is coupled to the first end of the connector before the second substrate is peeled, and the moved element and the connector are moved onto the first bump synchronously after the second substrate is peeled.

35. The method of forming an imaging module of claim 27, wherein the first and second terminals of the piezoelectric element are located on a top surface of the piezoelectric element, and the first and second terminals serve as the external signal connection terminals.

36. The method of forming an imaging module of claim 27, wherein the first and second terminals of the piezoelectric element are located on a bottom surface of the piezoelectric element;

the method further comprises the following steps:

forming an interconnect structure within the second bump prior to placing the piezoelectric element within the first recess;

and peeling the first substrate and the first bump, forming a third electric connection end and a fourth electric connection end at the bottom of the first bump, and electrically connecting the first lead-out end and the second lead-out end with the third electric connection end and the fourth electric connection end through the interconnection structure respectively.

37. A method of forming an imaging module as claimed in claim 1, comprising:

38. The method of claim 37, wherein forming at least one of the connectors on the third substrate comprises:

covering a connecting piece material layer on the second medium layer;

patterning the layer of connector material to form at least one of the connectors.

39. The method of claim 37, wherein said bonding comprises: the bonding is performed by using an adhesive or a dry film.

40. The method of forming an imaging module of claim 37, wherein the first and second terminals of the piezoelectric element are located on a top surface of the piezoelectric element, and the first and second terminals serve as the external signal connection terminals.

41. A lens assembly, comprising:

a circuit board;

the imaging module of any of claims 1-26, being located on the wiring board, the external signal connection terminals being electrically connected to corresponding connection terminals on the wiring board.