CN113126278B - Scanning mechanism and method for forming scanning mechanism - Google Patents
Scanning mechanism and method for forming scanning mechanism Download PDFInfo
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- CN113126278B CN113126278B CN201911422685.8A CN201911422685A CN113126278B CN 113126278 B CN113126278 B CN 113126278B CN 201911422685 A CN201911422685 A CN 201911422685A CN 113126278 B CN113126278 B CN 113126278B
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0858—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting means being moved or deformed by piezoelectric means
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
Abstract
The invention provides a scanning mechanism and a forming method thereof, comprising the following steps: the scanning element is provided with a signal transmitting end and is used for providing a transmitting signal; slewing mechanism, slewing mechanism include at least one piezoelectric structure, and piezoelectric structure includes the supporting shoe and is located the piezoelectric element on the supporting shoe, and piezoelectric element includes: the scanning element is positioned at the movable end, the fixed end is fixed on the supporting block, and the piezoelectric element warps in an electrified state so as to drive the scanning element to move; and the electric connection structure is positioned on the rotating structure, is electrically connected with the piezoelectric structure and the scanning element and is provided with an external signal connection end. The device has the advantages of light weight, small volume, simple structure and low cost, can realize multi-dimensional movement, and is suitable for equipment with narrow space volume.
Description
Technical Field
The present invention relates to the field of semiconductor device manufacturing, and more particularly, to a scanning mechanism and a method for forming the scanning mechanism.
Background
In some electronic terminals, the rise of wearable devices, especially AR, VR, MR, has put more and more high requirements on wearable video display, including heavy size and weight, power consumption, field angle, etc. Conventional displays, including LCOS, suffer from the disadvantages of large size, weight, and high power consumption. Represented by the HoloLens2 of Microsoft, a proposal of MEMS galvanometer laser scanning projection is provided.
The existing MEMS galvanometer structure comprises a piezoelectric element and a supporting block, a reflecting mirror or a reflecting film with a specific micro-nano structure on the surface is formed on the surface of a movable end of the piezoelectric element, and the change of the reflection angle of a light source can be realized through the reflection of the movable end to the light source so as to realize projection or the scanning of a detected object.
However, the MEMS galvanometer structure has the disadvantages of small field of view, complex process, high cost, and low separation and integration of the light source, the reflector, and the detector.
Disclosure of Invention
The invention aims to provide a scanning mechanism and a forming method of the scanning mechanism, which can combine a movable end with a scanning element by utilizing the characteristics of a piezoelectric element to realize the scanning function, have the advantages of light weight, small volume, simple structure, low cost, capability of realizing multi-dimensional motion, suitability for equipment with narrow space volume, pure voltage drive of the piezoelectric element and no electromagnetic interference.
In order to achieve the above object, the present invention provides a scanning mechanism comprising:
the scanning element is provided with a signal transmitting end and is used for providing a transmitting signal;
the slewing mechanism, slewing mechanism includes at least one piezoelectric structure, piezoelectric structure includes the supporting shoe and is located the piezoelectric element on the supporting shoe, piezoelectric element includes: the scanning element is positioned at the movable end, the fixed end is fixed on the supporting block, and the piezoelectric element warps in an electrified state so as to drive the scanning element to move;
and the electric connection structure is positioned on the rotating structure, is electrically connected with the piezoelectric structure and the scanning element, and is provided with an external signal connection end.
Optionally, the piezoelectric element comprises:
a support layer;
the piezoelectric laminated structure is positioned on the supporting layer and at least comprises a layer of piezoelectric film and electrodes positioned on the upper surface and the lower surface of each layer of piezoelectric film, and two adjacent layers of piezoelectric films share the electrode positioned between the two piezoelectric films;
the electrodes are counted from bottom to top in sequence and are divided into odd-numbered layers of electrodes and even-numbered layers of electrodes;
a first electrode leading-out terminal which is positioned on the top surface or the bottom surface of the piezoelectric element and is electrically connected with the even electrode layer;
and the second electrode leading-out end is positioned on the top surface or the bottom surface of the piezoelectric element and is electrically connected with the odd electrode layer.
Optionally, the rotating structure has an initial surface, the surface of the piezoelectric element being parallel to the initial surface when the piezoelectric element is not energized;
the rotating mechanism includes: the piezoelectric element of the first piezoelectric structure is in a first direction from the fixed end to the movable end when not electrified; the scanning element is positioned at the movable end of the first piezoelectric structure, and the first piezoelectric element generates warping parallel to the first direction and perpendicular to the direction of the initial plane in an electrified state to drive the scanning element to rotate along the warping direction.
Optionally, the rotating structure further comprises:
a second piezoelectric structure, wherein the direction from the fixed end to the movable end of the piezoelectric element of the first piezoelectric structure is a second direction when the piezoelectric element is not electrified, and the second direction is not parallel to the first direction; the supporting block of the first piezoelectric structure is fixedly arranged on the movable end of the second piezoelectric structure,
the second piezoelectric structure generates warping parallel to the second direction and perpendicular to the direction of the initial plane in the electrified state, the first piezoelectric element is driven to move along the warping direction, and the scanning element is driven to move by the first piezoelectric element.
Optionally, the first direction is perpendicular to the second direction.
Optionally, the length of the piezoelectric element of the second piezoelectric structure is greater than or equal to the width of the piezoelectric element of the first piezoelectric structure in the second direction.
Optionally, the rotating structure further includes a plurality of piezoelectric structures located between the first piezoelectric structure and the second piezoelectric structure, the plurality of piezoelectric structures are stacked in a third direction, in two adjacent layers of piezoelectric structures, the support block of the upper layer of piezoelectric structure is located on the movable end of the lower layer of piezoelectric structure, the third direction is perpendicular to the initial plane, the piezoelectric element of each piezoelectric structure has a direction from the fixed end to the movable end when not powered, and the directions of the piezoelectric structures are not parallel.
Optionally, the first electrode lead-out and the second electrode lead-out of the first piezoelectric structure are both located on a top surface of the piezoelectric element; the first piezoelectric structure further comprises a scanning element electric connecting end and a scanning element electric input end, the scanning element electric connecting end is electrically connected with the scanning element electric input end, and the scanning element electric connecting end and the scanning element electric input end are located on the top surface of the piezoelectric element.
Optionally, the first piezoelectric structure further comprises a scanning element electrical connection end and a scanning element electrical input end, and the scanning element electrical connection end is electrically connected with the scanning element electrical input end;
the first electrode leading-out end, the second electrode leading-out end and the scanning element electrical input end of the first piezoelectric structure are all positioned on the bottom surface of the piezoelectric element, and the scanning element electrical connection end is positioned on the top surface of the piezoelectric element;
the supporting block of the first piezoelectric structure is internally provided with a first plug, a second plug and a third plug, the first plug is connected with a first electrode leading-out end, the second plug is connected with a second electrode leading-out end, and the third plug is connected with an electric input end of a scanning element;
the surface of the piezoelectric element of the second piezoelectric structure is provided with an electric connection structure, and the electric connection structure of the second piezoelectric element is connected with the first plug, the second plug and the third plug.
Optionally, the scanning element further has a signal receiving end, and the signal receiving end receives a feedback signal reflected by the scanned object.
Optionally, the transmitting signal comprises: optical signals or ultrasonic signals.
The invention also provides a method for forming the scanning mechanism, which comprises the following steps:
providing a substrate and a scanning element, wherein the scanning element is provided with a signal transmitting end and is used for providing a transmitting signal;
forming a rotation mechanism on the substrate, the rotation mechanism including at least one piezoelectric structure, the piezoelectric structure including a support block and a piezoelectric element on the support block, the piezoelectric element including: the scanning element is positioned at the movable end, the fixed end is fixed on the supporting block, and the piezoelectric element warps in an electrified state so as to drive the scanning element to move;
and forming an electric connection structure, wherein the electric connection structure is positioned on the rotating structure, is electrically connected with the piezoelectric structure and the scanning element, and is provided with an external signal connection end.
Optionally, the piezoelectric element comprises:
a support layer;
the piezoelectric laminated structure is positioned on the supporting layer and at least comprises a layer of piezoelectric film and electrodes positioned on the upper surface and the lower surface of each layer of piezoelectric film, and two adjacent layers of piezoelectric films share the electrode positioned between the two piezoelectric films;
the electrodes are counted from bottom to top in sequence and are divided into odd-numbered layers of electrodes and even-numbered layers of electrodes;
a first electrode leading-out terminal which is positioned on the top surface or the bottom surface of the piezoelectric element and is electrically connected with the even electrode layer;
and the second electrode leading-out end is positioned on the top surface or the bottom surface of the piezoelectric element and is electrically connected with the odd electrode layers.
Optionally, when there is one piezoelectric structure, forming a rotation mechanism on the substrate includes:
forming a supporting block and a sacrificial layer on the periphery of the supporting block on the substrate;
and providing a piezoelectric element, and bonding the fixed end to the supporting block to form a piezoelectric structure.
Optionally, when there is one piezoelectric structure, the method of forming the electrical connection structure includes:
forming an electrical connection structure on the top surface of the piezoelectric element;
forming an insulating layer on the electrical connection structure;
forming a first electrode leading-out end, a second electrode leading-out end, a scanning element electrical input end and a scanning element electrical connection end of the electrical connection structure in the insulating layer, wherein the scanning element electrical connection end is positioned at the movable end;
and electrically connecting the pin of the scanning element with the electric connection end of the scanning element by a bonding wire or flip chip bonding process.
Optionally, when the piezoelectric structure is plural, the rotating mechanism includes: the piezoelectric structure comprises a second supporting block and a second piezoelectric element positioned on the second supporting block, the first piezoelectric structure comprises a first supporting block and a first piezoelectric element positioned on the first supporting block, and the first supporting block is positioned on the movable end of the second piezoelectric element;
forming a rotation mechanism on the substrate includes:
forming a second supporting block and a sacrificial layer on the periphery of the second supporting block on the substrate;
forming a second piezoelectric element on the second backing block and the sacrificial layer;
forming a first support block on a movable end of the second piezoelectric element;
and forming a first piezoelectric element on the first support block, so that an included angle is formed between the first piezoelectric element and the second piezoelectric element in the length direction.
Optionally, the forming a second supporting block and a sacrificial layer on the periphery of the second supporting block on the substrate includes:
forming a first dielectric layer on the substrate;
carrying out imaging processing on the first dielectric layer, removing part of the first dielectric layer, and forming the second supporting block on the substrate;
filling a sacrificial material at the periphery of the second supporting block to form a sacrificial layer.
Optionally, forming a first support block on the movable end of the second piezoelectric element comprises:
forming a second dielectric layer on the sacrificial layer and the second piezoelectric element;
and carrying out patterning treatment on the second medium layer, removing part of the second medium layer except for the movable end of the second piezoelectric element, and forming the first support block on the movable end of the second piezoelectric element.
Optionally, forming a rotation mechanism on the substrate includes: bonding the second piezoelectric element to the second backing block; bonding the first piezoelectric element to the first support block.
Optionally, when the electrical connection structure is plural, before forming the first support block, forming the electrical connection structure includes:
forming a second electrical connection structure on the top surface of the second piezoelectric element;
forming a second insulating layer on the second electrical connection structure;
forming a first electrode lead-out and a second electrode lead-out of a second piezoelectric element and a scanning element electrical input in the second insulating layer;
after forming the first support block, forming the electrical connection structure includes:
forming a first electrical connection structure on the top surface of the first piezoelectric element;
forming a first insulating layer on the first electrical connection structure;
forming a scanning element electrical connection end in the first insulating layer of the movable end of the first piezoelectric element;
forming a first plug, a second plug, and a third plug in the first support block;
the bottom end of the first plug is connected with a first electrode leading-out end of the second piezoelectric structure through the second electric connection structure, and the top end of the first conductive plug is connected with a first electrode leading-out end of the first piezoelectric structure;
the bottom end of the second plug is connected with a second electrode leading-out end of the second piezoelectric structure through the second electric connection structure, and the top end of the second plug is connected with a second electrode leading-out end of the first piezoelectric structure;
the bottom end of the third plug is connected with the electrical input end of the scanning element through the second electrical connection structure, and the top end of the third plug is connected with the electrical connection end of the scanning element through the first electrical connection structure;
and electrically connecting the pin of the scanning element with the electric connection end of the scanning element by a bonding wire or flip chip bonding process.
Optionally, after the forming the electrical connection structure, further comprising: and removing the sacrificial layer by wet etching.
In summary, in the scanning mechanism and the forming method of the scanning mechanism provided by the present invention, the movable end of the piezoelectric element in the rotating mechanism is connected to the moved scanning element, the fixed end of the piezoelectric element is fixed to a supporting block, and the external signal connection end electrically connected to the piezoelectric element is used to energize the piezoelectric element, so that the movable end of the piezoelectric element is warped upwards or downwards relative to the fixed end to move the scanning element, thereby satisfying the moving requirement of the scanning element.
Furthermore, the rotating mechanism can be composed of a plurality of stacked piezoelectric structures, so that the requirements of various moving tracks and moving amplitudes of the scanning element can be met, and the requirements of various scanning ranges can be further met.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a conventional MEMS galvanometer;
fig. 2A to 2B are schematic diagrams of a scanning mechanism according to an embodiment of the invention;
FIG. 2C is a diagram of a scanning mechanism according to an embodiment of the present invention;
FIG. 2D is a schematic diagram of a scanning mechanism according to another embodiment of the present invention;
FIG. 2E is an electrical schematic diagram of a scanning mechanism according to an embodiment of the present invention;
FIG. 2F is a diagram of a scanning mechanism according to another embodiment of the present invention;
FIG. 2G is a schematic diagram of an overall structure of a scanning mechanism including two piezoelectric structures according to another embodiment of the present invention;
FIG. 2H is a cross-sectional view taken along dashed line x-x' in FIG. 2G;
FIG. 2I is a schematic view of a galvanometer structure according to another embodiment of the present disclosure;
fig. 3A to 3I are structural diagrams corresponding to steps in a method for forming a scanning mechanism according to an embodiment of the invention;
FIGS. 4A to 4H are structural diagrams corresponding to steps of another method for forming a scanning mechanism according to an embodiment of the invention;
description of reference numerals:
in fig. 1:
001. a piezoelectric element; 002. a light source; 003. an image plane.
In fig. 2A to 2F, fig. 2I, and fig. 3A to 3I:
1. a piezoelectric element; 2. a support block; 3. a scanning element; a 3' signal transmitting end; 3', a signal receiving end; 4. a first plug; 5. a second plug; 6. a third plug; 7. a light-reflecting film; 101. a support layer; 102. a second electrode; 103. a first electrode; 104; a passivation layer; 105. a piezoelectric film; 106. a first electrode lead-out terminal; 107. a second electrode lead-out terminal; 108. an electrical connection structure; 109. a scan element electrical input; 110. the scanning element is electrically connected with the terminal; 301. a substrate; 302. a sacrificial layer; 304. an insulating layer.
In fig. 2G to 2H and fig. 4A to 4H:
1. a first piezoelectric element; 1', a second piezoelectric element; 2. a first support block; 2', a second support block; 3. a scanning element; 4. a first plug; 5. a second plug; 6. a third plug; 101. a support layer; 102. a second electrode; 103. a first electrode; 104; an insulating layer; 105. a layer of piezoelectric material; 106. a first electrode lead-out of the first piezoelectric structure; 106', a first electrode lead-out of the second piezoelectric structure; 107. a second electrode terminal of the first piezoelectric structure; 107', a second electrode lead-out of the second piezoelectric structure; 108. a first electrical connection structure; 109. a scan element electrical input; 110. the scanning element is electrically connected with the terminal; 301. a substrate; 301', a first dielectric layer; 302. a sacrificial layer; 303. a second electrical connection structure; 304. an insulating layer; 305. a second dielectric layer.
Detailed Description
As shown in fig. 1, the existing MEMS galvanometer structure includes a galvanometer 001 and a light source 002, a movable end surface of the galvanometer of the piezoelectric element structure is formed with a reflector or a reflective film having a specific micro-nano structure on the surface, and the reflection of the movable end to the light source 002 can change the reflection angle of the light source 002 to realize the projected imaging plane 003 or scan the detected object.
The galvanometer structure has the defects of small field of view (about + -35 degrees), complex process and low separation and integration degree of a light source, a reflector and a detector.
To solve the above problems, the present invention provides a scanning mechanism and a method for forming the scanning mechanism. Compared with traditional driving mechanisms such as MENS galvanometer schemes, the piezoelectric element and supporting block combination is light in weight, small in size, simple in structure, low in cost, capable of achieving multi-dimensional movement and suitable for equipment with narrow space size, and the piezoelectric element is purely driven by voltage and does not have electromagnetic interference. Meanwhile, the rotating mechanism can be composed of a plurality of stacked piezoelectric structures, so that the requirements of various moving tracks and moving amplitudes of the scanning element can be met, and the requirements of various scanning ranges can be further met.
The scanning mechanism and the method for forming the scanning mechanism according to the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more apparent from the following description and drawings, it being understood, however, that the concepts of the present invention may be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. The drawings are in a very simplified form and are not to scale, merely for convenience and clarity in describing embodiments of the invention.
The terms "first," "second," and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein are, for example, capable of operation in other sequences than described or illustrated herein. Similarly, if a method described herein comprises a series of steps, the order in which these steps are presented herein is not necessarily the only order in which these steps can be performed, and some of the described steps may be omitted and/or some other steps not described herein may be added to the method. In order to make the description of the drawings clearer, the present specification does not mark every drawing with a reference numeral that is the same for every drawing, although the same elements may be easily recognized in all drawings.
Example one
Referring to fig. 2A and 2B, the present embodiment provides a scanning mechanism including:
a scanning element 3, the scanning element 3 having a signal emitting end for providing an emission signal;
slewing mechanism, slewing mechanism include at least one piezoelectric structure, and piezoelectric structure includes supporting shoe 2 and the piezoelectric element 1 that is located supporting shoe 2, and piezoelectric element 1 includes: the scanning device comprises a movable end and a fixed end, wherein the scanning element 3 is positioned at the movable end, the fixed end is fixed on a supporting block 2, and the piezoelectric element 1 is warped in an electrified state so as to drive the scanning element 3 to move;
and the electric connection structure is positioned on the rotating structure, is electrically connected with the piezoelectric structure and the scanning element 3, and is provided with an external signal connection end.
Specifically, referring to fig. 2A and 2B, the rotation structure has an initial surface, and when the piezoelectric element 1 is not energized, the surface of the piezoelectric element 1 is parallel to the initial surface; the rotating mechanism comprises: the piezoelectric element 1 of the piezoelectric structure is in a first direction from the fixed end to the movable end when not electrified; the scanning element 3 is located at the movable end of the first piezoelectric structure, and the piezoelectric element 1 generates a warp parallel to the first direction and perpendicular to the direction of the initial plane in the electrified state, and drives the scanning element 3 to rotate along the warp direction. The characteristic that the piezoelectric element 1 can deform and warp in the electrified state is utilized, one end of the piezoelectric element 1 is fixed on the supporting block 2 to form a fixed end, the other end of the piezoelectric element is used as a movable end to form a rotating mechanism, the movable end is integrated with a scanning element 3 with a transmitting signal, the scanning element 3 comprises a signal transmitting end 3 'and a signal receiving end 3' (the signal transmitting end 3 'and the signal receiving end 3' can be integrated together), an electric connection structure is arranged on the rotating mechanism to supply power to the piezoelectric element 1 and the scanning element 3, the scanning mechanism is realized, and two-dimensional plane scanning can be realized by designing the number of the piezoelectric structures.
Referring to fig. 2C, the piezoelectric element 1 includes: a support layer 101; the piezoelectric stack structure is positioned on the support layer 101 and at least comprises one layer of piezoelectric film and electrodes positioned on the upper surface and the lower surface of each layer of piezoelectric film, and two adjacent layers of piezoelectric films share the electrodes positioned between the two layers of piezoelectric films; the electrodes are counted from bottom to top in sequence and are divided into odd-numbered layers of electrodes and even-numbered layers of electrodes; an isolation layer on the piezoelectric stack structure; a first electrode lead 106 located on the top or bottom surface of the piezoelectric element 1 and electrically connected to the even-numbered electrode layers; and a second electrode lead 107 located on the top surface or the bottom surface of the piezoelectric element 1 and electrically connected to the odd electrode layers.
Specifically, as shown in fig. 2C, the piezoelectric element 1 includes a piezoelectric stack structure in which a support layer 101 is located on the support layer 101, the piezoelectric stack structure includes piezoelectric films stacked in sequence from bottom to top, the upper and lower surfaces of the piezoelectric films respectively have a first electrode 103 and a second electrode 102, a piezoelectric film 105 is located between the first electrode 103 and the second electrode 102, the first electrode 103 and the second electrode 102 are respectively connected to a first electrode leading end 106 and a second electrode leading end 107, the first electrode leading end 106, the second electrode leading end 107, a scanning element electrical input end 109, and a scanning element electrical connection end 110 are located on a top surface of the piezoelectric element 1, and the top surface of the piezoelectric element is a passivation layer 104.
Referring to fig. 2D, the first electrode lead out 106, the second electrode lead out 107 and the scanning element electrical input 109 may also all be located on the bottom surface of the piezoelectric element 1, i.e., in the support layer 101, with the scanning element electrical connection 110 located on the top surface of the piezoelectric element 1. Alternatively, the first electrode tap 106 and the second electrode tap 107 may be respectively located on the top surface and the bottom surface of the piezoelectric element 1, and the present invention is not limited when there is only one piezoelectric structure. The piezoelectric element 1 is not limited to the integral structure in which the first electrode lead 106 and the second electrode lead 107 are formed, and may be a structure in which the first electrode lead 106 and the second electrode lead 107 are not formed, that is, the piezoelectric element 1 includes the support layer 101, the piezoelectric film 105, the passivation layer 104 (insulating layer), and the first electrode 103 and the second electrode 102 on the upper and lower surfaces of the piezoelectric film 105, and the external signal connection terminal needs to be connected to the first electrode 103 and the second electrode 102 by additionally manufacturing a conductive plug.
Referring to fig. 2D, when the first electrode terminal 106, the second electrode terminal 107, and the electrical input terminal of the scanning element 3 are located on the bottom surface of the piezoelectric element 1, the first electrode terminal 106, the second electrode terminal 107, and the electrical input terminal of the scanning element 3 are electrically connected to an external signal connection terminal (e.g., a circuit board) using the first plug 4, the second plug 5, and the third plug 6. It is to be understood that when the first electrode terminal 106, the second electrode terminal 107 and the scanning element electrical input terminal 109 are located at the top surface and the bottom surface of the piezoelectric element 1, respectively, the electrode terminal located at the bottom surface may be electrically connected using a conductive plug, and the electrode terminal located at the top surface may be electrically connected using a lead wire.
Further, as shown in fig. 2E, the first electrode lead 106, the second electrode lead 107 and the scanning element electrical input terminal 109 are located on the top surface of the piezoelectric element 1 and serve as external signal connection terminals. The first electrode leading-out end 106 and the second electrode leading-out end 107 are electrically connected with the circuit board through a lead respectively, so that the circuit board can apply voltage to the first electrode and the second electrode of the piezoelectric element 1, so that a voltage difference is generated between the upper surface and the lower surface of the piezoelectric film 105, the piezoelectric film 105 is contracted, and the supporting layer 101 cannot stretch and contract, so that the whole piezoelectric element 1 can warp upwards or downwards (the warping direction and the warping degree are determined by the voltage applied to the upper surface and the lower surface of the piezoelectric film) when being electrified, and the scanning element 3 is driven to move. The piezoelectric film 105 is made of a piezoelectric material that can be deformed by being energized, such as quartz crystal, aluminum nitride, zinc oxide, lead zirconate titanate, barium titanate, lithium gallate, lithium germanate, or titanium germanate. The material of the support layer 101 is a dielectric material that is not electrically conductive, such as silicon oxide, silicon nitride, etc.
Referring to fig. 2E, when the scanning mechanism has only one piezoelectric structure, the first electrode lead 106 and the second electrode lead 107 of the piezoelectric structure are both located on the top surface of the piezoelectric element 1; the piezoelectric structure further comprises a scanning element electrical connection terminal 110 and a scanning element electrical input terminal 109, the scanning element electrical connection terminal 110 and the scanning element electrical input terminal 109 being electrically connected, the scanning element electrical connection terminal 110 and the scanning element electrical input terminal 109 being located on the top surface of the piezoelectric element 1. The rotary structure has an initial surface, and when the piezoelectric element 1 is not energized, the surface of the piezoelectric element 1 is parallel to the initial surface. The rotating mechanism comprises: the piezoelectric element 1 of the piezoelectric structure is in a first direction from a fixed end to a movable end when not electrified; the scanning element 3 is located at the movable end of the first piezoelectric structure, and the piezoelectric element 1 generates a warp parallel to the first direction and perpendicular to the direction of the initial plane in an electrified state, so as to drive the scanning element 3 to rotate along the warp direction.
Referring to fig. 2G and 2H, wherein fig. 2H is a cross-sectional view taken along a dotted line x-x 'in fig. 2G, when there are two piezoelectric structures of the rotating structure, the rotating structure is taken as a first piezoelectric structure, and the rotating structure further includes, on the basis of the first piezoelectric structure, a second piezoelectric structure including a second supporting block 2' and a second piezoelectric element 1', a direction from the fixed end to the movable end of the second piezoelectric structure when the second piezoelectric element 1' is not energized is a second direction, and the second direction is not parallel to the first direction; the first support block 2 of the first piezoelectric structure is fixedly arranged on the movable end of the second piezoelectric element 1' of the second piezoelectric structure, the second piezoelectric structure generates warping parallel to the second direction and perpendicular to the direction of the initial plane in the electrified state, the first piezoelectric element 1 is driven to move along the warping direction, and the first piezoelectric element 1 drives the scanning element to move. The first direction is perpendicular to the second direction. In the second direction, the length of the second piezoelectric element 1 'of the second piezoelectric structure is equal to or greater than the width of the first piezoelectric element 1 of the first piezoelectric structure, and the width of the second piezoelectric element 1' is less than the length of the first piezoelectric element 1.
The first electrode leading-out end 106, the second electrode leading-out end and the scanning element electrical input end 109 of the first piezoelectric structure are all positioned on the bottom surface of the piezoelectric element, and the scanning element electrical connection end 110 is positioned on the top surface of the piezoelectric element; the supporting block of the first piezoelectric structure is provided with a first plug 4, a second plug 5 and a third plug 6, the first plug 4 is connected with a first electrode leading-out end, the second plug 5 is connected with a second electrode leading-out end, and the third plug 6 is connected with an electric input end 109 of the scanning element; the surface of the piezoelectric element of the second piezoelectric structure has electrical connections, and the electrical connections of the second piezoelectric element 1' are connected to a first plug 4, a second plug 5 and a third plug 6. The electrical connection structure of the second piezoelectric element 1 'includes the wiring of the top layer and the first electrode lead-out, the second electrode lead-out and the electrical input terminal of the scanning element formed on the top surface of the second piezoelectric element 1'.
In other embodiments of the present invention, the rotating structure may further include a plurality of piezoelectric structures located between the first piezoelectric structure and the second piezoelectric structure, the plurality of piezoelectric structures are stacked along a third direction, the third direction is perpendicular to the initial plane, in two adjacent layers of piezoelectric structures, the supporting block of the upper layer of piezoelectric structure is located on the movable end of the lower layer of piezoelectric structure, the piezoelectric element of each piezoelectric structure has a direction from the fixed end to the movable end when not powered, and the directions of the piezoelectric structures are not parallel. The technical personnel in the field can set up the number that a plurality of piezoelectric structure pile up according to actual need, and the stiff end of the piezoelectric element on upper strata is connected in the movable end of the piezoelectric element of adjacent lower floor, piles up in proper order, can realize the plane scanning of different angles, different scope through piling up of a plurality of piezoelectric element, and under general condition, the plane scanning can be realized to two-layer slewing mechanism that two piezoelectric element formed. It should be noted that to ensure the overall strength and rotational flexibility of multiple piezoelectric structures, the size of the piezoelectric elements in subsequently formed piezoelectric structures needs to be smaller than the size of the piezoelectric elements in previously formed piezoelectric structures.
The electrical connection structure in this embodiment is a wiring located on the top layer of the first piezoelectric element 1 and the second piezoelectric element 1'. In other embodiments of the present invention, when there are two or more piezoelectric structures, the connection manner of the multiple piezoelectric structures is the same as the connection manner between the two piezoelectric structures, which is easy to be implemented by those skilled in the art and is not described herein again.
Referring to fig. 2C, the connection of the scanning element to the scanning element electrical connection terminal 110 on the piezoelectric element can be a wire connection. In another embodiment of the present invention, referring to fig. 2F, the connection mode of the scanning element and the scanning element electrical connection terminal 110 on the piezoelectric element can also be a flip-chip connection mode.
In one example, the scanning element also has a signal receiving end that receives a feedback signal reflected back by the scanned object. The transmission signal comprises: optical signals or ultrasonic signals. The scanning element 3 in this embodiment may be a laser, a photodetector or a combination of a laser and a photodetector, when the scanning element is single, only one set of scanning element electrical input terminals 109 and one set of electrical connection terminals need to be arranged on the top surface (or bottom surface) of the first piezoelectric element, and when the scanning element is multiple, for example, a combination of a laser and a photodetector, two sets of scanning element electrical input terminals 109 and two sets of electrical connection terminals need to be arranged on the top surface (and/or bottom surface) of the first piezoelectric element.
In other embodiments of the present invention, referring to fig. 2I, a scanning element is not disposed at the movable end of the piezoelectric structure, but a mirror surface or a reflective film 7 with a specific micro-nano structure on the surface is formed at the movable end, so as to implement a galvanometer structure.
Example two
The embodiment of the invention also provides a forming method of the scanning mechanism, which comprises the following steps:
providing a substrate 301 and a scanning element having a signal transmitting terminal for providing a transmission signal;
forming a rotation mechanism on the substrate 301, the rotation mechanism comprising at least one piezoelectric structure, the piezoelectric structure comprising a support block and a piezoelectric element located on the support block, the piezoelectric element comprising: the scanning element is positioned at the movable end, the fixed end is fixed on the supporting block, and the piezoelectric element is warped under the power-on state so as to drive the scanning element to move;
and forming an electric connection structure, wherein the electric connection structure is positioned on the rotating structure, is electrically connected with the piezoelectric structure and the scanning element and is provided with an external signal connection end.
Fig. 3A to 4H are schematic structural diagrams corresponding to respective steps of a thinning method of a bonded wafer structure provided in this embodiment, and the thinning method of the bonded wafer structure provided in this embodiment will be described in detail below with reference to fig. 3A to 4H.
Referring to fig. 3A, a substrate 301 is provided, and a first dielectric layer 301' is formed on the substrate 301; the dielectric layer is made of a non-conductive dielectric material, such as silicon oxide, silicon nitride, etc.
Referring to fig. 3B, the first dielectric layer 301 'is patterned to remove a portion of the first dielectric layer 301', and a supporting block is formed on the substrate 301.
Referring to FIG. 3C, the periphery of the backing block is filled with a sacrificial material, forming a sacrificial layer 302.
Referring to FIG. 3D, a piezoelectric element is provided and the fixed end is bonded to the backing block to form a piezoelectric structure.
Referring to fig. 3E, an electrical connection structure is formed on the top surface of the piezoelectric element through a wiring process.
Referring to fig. 3F, an insulating material is filled on the electrical connection structure to cover the electrical connection structure.
Referring to fig. 3G, the insulating layer 304 is etched away except for the piezoelectric element, and the insulating layer 304 is formed on the electrical connection structure.
Referring to fig. 3H, a first electrode lead-out, a second electrode lead-out, a scanning element electrical input terminal 109, and a scanning element electrical connection terminal 110 of the piezoelectric structure are formed in the insulating layer 304, the scanning element electrical connection terminal 110 being located at the movable terminal;
referring to fig. 3I, the leads of the scan element are electrically connected to the scan element electrical connection terminals 110 by a wire bonding or flip chip bonding process.
In another embodiment of the present invention, when there are two piezoelectric structures, a second piezoelectric structure is first fabricated according to the above method and the process of fig. 3A to 3G:
forming a second supporting block and a sacrificial layer 302 on the periphery of the second supporting block on the substrate 301;
and providing a second piezoelectric element comprising a movable end and a fixed end, and bonding the fixed end to the supporting block to form a second piezoelectric structure.
Forming a second electrical connection structure 303 on the top surface of the second piezoelectric element; a second insulating layer 304 is formed on the second electrical connection structure 303. Finally, the second piezoelectric structure of fig. 4A (same as fig. 3G) is formed.
Referring to fig. 4B to 4C, a second dielectric layer 305 is formed on the sacrificial layer 302 and the second piezoelectric element; the second medium layer 305 is subjected to patterning processing, a part of the second medium layer 305 other than the movable end of the second piezoelectric element is removed, and a first support block is formed on the movable end of the second piezoelectric element.
Referring to fig. 4D, the first support block is etched to form a first plug, a second plug and a third plug in the first support block, the bottom end of the first plug is connected to the first electrode lead-out 106 'of the second piezoelectric structure through the second electrical connection structure 303, the bottom end of the second plug is connected to the second electrode lead-out 107' of the second piezoelectric structure through the second electrical connection structure 303, and the bottom end of the third plug is connected to the electrical input 109 of the scanning element through the second electrical connection structure 303; at the same time, the insulating layer 304 on the second piezoelectric element is etched to form a first electrode lead, a second electrode lead, and a scanning element input.
Referring to fig. 4E, a first piezoelectric element is provided, including a movable end and a fixed end, the fixed end of the first piezoelectric element is bonded to the first support block, and the tip of the first conductive plug is connected to the first electrode terminal 106 of the first piezoelectric structure, and the tip of the second plug is connected to the second electrode terminal 107 of the first piezoelectric structure. Meanwhile, an included angle is formed between the first piezoelectric element and the second piezoelectric element in the length direction.
Referring to fig. 4F, a first electrical connection structure 108 is formed on the top surface of the first piezoelectric element through a wiring process, and the top end of the third plug is connected to the scanning element electrical connection terminal 110 through the first electrical connection structure 108.
Referring to fig. 4G, a first insulating layer 304 is formed on the first electrical connection structure 108, and the scanning element electrical connection terminal 110 is formed in the first insulating layer 304 of the movable terminal of the first piezoelectric element; the pins of the scan element are electrically connected to the scan element electrical connection terminals 110 by a wire bonding or flip chip bonding process.
Referring to fig. 4H, after the electrical connection structure is formed, the method further includes: the sacrificial layer 302 is removed by wet etching, and finally a scanning mechanism including two layers of piezoelectric structures is formed. When a scanning mechanism comprising more than two layers of piezoelectric structures is manufactured, the method is easy to realize, and details are not described here. In other embodiments of the present invention, the piezoelectric elements may also be formed by depositing, for example, after forming the supporting block and filling the sacrificial layer around the supporting block, a supporting layer is sequentially deposited on the sacrificial layer, then an electrode layer is deposited on the supporting layer and patterned to form an electrode, then a piezoelectric material is deposited on the electrode layer to form a piezoelectric stack structure, another electrode layer is deposited on the piezoelectric stack structure and patterned to form an electrode, then an insulating material is deposited on the electrode layer to form a passivation layer, and after the multilayer structure of the piezoelectric elements is formed, a first electrode lead-out terminal or a second electrode lead-out terminal of the piezoelectric element is respectively formed from any one side surface or both side surfaces of the piezoelectric element.
The working principle of the scanning mechanism of the invention is as follows:
when the piezoelectric element 1 is powered by dc power (i.e., the external signal connection terminal is connected to the dc power supply), the piezoelectric element 1 may warp (up or down) as shown in fig. 2B, and the scanning element disposed at the movable end of the piezoelectric element 3 may be a laser in this case, so as to scan an external scene.
When the piezoelectric element 1 is powered by alternating current (i.e., the external signal connection end is connected to an alternating current power supply), the movable end of the piezoelectric element 3 vibrates up and down at a certain frequency, the vibration frequency is the same as the frequency of the alternating current power supply, and the scanning element arranged at the movable end of the piezoelectric element 3 under the condition can be a light detector, so that the function of detecting an external scene can be realized.
Compared with traditional driving mechanisms such as MENS galvanometer schemes and the like, the scanning mechanism and the forming method of the scanning mechanism provided by the embodiment of the invention have the advantages that the combination of the piezoelectric element and the supporting block is light in weight, small in size, simple in structure and low in cost, can realize multi-dimensional movement, and are suitable for equipment with narrow space volume, and the piezoelectric element is driven by pure voltage and has no electromagnetic interference. Meanwhile, the rotating mechanism can be composed of a plurality of stacked piezoelectric structures, so that the requirements of various moving tracks and moving amplitudes of the scanning element can be met, and the requirements of various scanning ranges can be further met.
It should be noted that, in the present specification, all the embodiments are described in a related manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the structural embodiment, since it is substantially similar to the method embodiment, the description is relatively simple, and for the relevant points, reference may be made to the partial description of the method embodiment.
The above description is only for the purpose of describing the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are intended to fall within the scope of the appended claims.
Claims (19)
1. A scanning mechanism, comprising:
a scanning element having a signal transmitting end for providing a transmission signal;
the slewing mechanism, slewing mechanism includes two at least piezoelectric structure, piezoelectric structure includes the supporting shoe and is located the piezoelectric element on the supporting shoe, piezoelectric element includes: the scanning element is positioned at the movable end, the fixed end is fixed on the supporting block, and the piezoelectric element is warped under the electrified state so as to drive the scanning element to move;
the electric connection structure is positioned on the rotating mechanism, is electrically connected with the piezoelectric structure and the scanning element, and is provided with an external signal connection end;
the rotating mechanism comprises: the scanning device comprises a second piezoelectric structure and a first piezoelectric structure positioned on the movable end of the second piezoelectric structure, wherein the scanning element is positioned on the movable end of the first piezoelectric structure.
2. The scanning mechanism as claimed in claim 1, wherein said piezoelectric element comprises:
a support layer;
the piezoelectric laminated structure is positioned on the supporting layer and at least comprises a layer of piezoelectric film and electrodes positioned on the upper surface and the lower surface of each layer of piezoelectric film, and two adjacent layers of piezoelectric films share the electrode positioned between the two piezoelectric films;
the electrodes are counted from bottom to top in sequence and are divided into odd-numbered layers of electrodes and even-numbered layers of electrodes;
the first electrode leading-out end is positioned on the top surface or the bottom surface of the piezoelectric element and is electrically connected with the even electrode layers;
and the second electrode leading-out end is positioned on the top surface or the bottom surface of the piezoelectric element and is electrically connected with the odd electrode layer.
3. The scanning mechanism of claim 2, wherein the rotating mechanism has an initial surface, the surface of the piezoelectric element being parallel to the initial surface when the piezoelectric element is not energized;
the direction from the fixed end to the movable end of the piezoelectric element of the first piezoelectric structure is a first direction when the piezoelectric element is not electrified; the first piezoelectric structure generates warping in a direction parallel to the first direction and perpendicular to the initial plane in an electrified state, and drives the scanning element to rotate along the warping direction.
4. The scanning mechanism according to claim 3, wherein the direction from the fixed end to the movable end of the piezoelectric element of the first piezoelectric structure when not energized is a second direction, the second direction being non-parallel to the first direction; the supporting block of the first piezoelectric structure is fixedly arranged on the movable end of the second piezoelectric structure,
the second piezoelectric structure generates warping parallel to the second direction and perpendicular to the direction of the initial plane in the electrified state, the first piezoelectric element is driven to move along the warping direction, and the scanning element is driven to move by the first piezoelectric element.
5. The scanning mechanism of claim 4, wherein the first direction is perpendicular to the second direction.
6. A scanning mechanism according to claim 4, wherein the length of the piezoelectric element of the second piezoelectric structure in the second direction is equal to or greater than the width of the piezoelectric element of the first piezoelectric structure.
7. The scanning mechanism as claimed in claim 4, wherein the rotation mechanism further comprises a plurality of piezoelectric structures disposed between the first piezoelectric structure and the second piezoelectric structure, the plurality of piezoelectric structures are stacked along a third direction, in two adjacent piezoelectric structures, the supporting block of the upper piezoelectric structure is located on the movable end of the lower piezoelectric structure, the third direction is perpendicular to the initial plane, the piezoelectric element of each piezoelectric structure has a direction from the fixed end to the movable end when not powered, and the directions of the piezoelectric structures are all non-parallel.
8. A scanning mechanism according to claim 3, wherein the first and second electrode leads of the first piezoelectric structure are each located on a top surface of the piezoelectric element; the first piezoelectric structure further comprises a scanning element electric connecting end and a scanning element electric input end, the scanning element electric connecting end is electrically connected with the scanning element electric input end, and the scanning element electric connecting end and the scanning element electric input end are located on the top surface of the piezoelectric element.
9. The scanning mechanism of claim 4, wherein the first piezoelectric structure further comprises a scanning element electrical connection and a scanning element electrical input, the scanning element electrical connection and the scanning element electrical input being electrically connected;
the first electrode leading-out end, the second electrode leading-out end and the scanning element electrical input end of the first piezoelectric structure are all positioned on the bottom surface of the piezoelectric element, and the scanning element electrical connection end is positioned on the top surface of the piezoelectric element;
the supporting block of the first piezoelectric structure is provided with a first plug, a second plug and a third plug, the first plug is connected with the first electrode leading-out end, the second plug is connected with the second electrode leading-out end, and the third plug is connected with the electrical input end of the scanning element;
the surface of the piezoelectric element of the second piezoelectric structure is provided with an electric connection structure, and the electric connection structure of the second piezoelectric structure is connected with the first plug, the second plug and the third plug.
10. The scanning mechanism of claim 1, wherein said scanning element further has a signal receiving end that receives a feedback signal reflected back by the scanned object.
11. The scanning mechanism of claim 1, wherein the transmit signal comprises: optical signals or ultrasonic signals.
12. A method of forming a scanning mechanism, comprising:
providing a substrate and a scanning element, wherein the scanning element is provided with a signal transmitting end and is used for providing a transmitting signal;
forming a rotating mechanism on the substrate, wherein the rotating mechanism comprises at least two piezoelectric structures, each piezoelectric structure comprises a supporting block and a piezoelectric element positioned on the supporting block, and each piezoelectric element comprises: the scanning element is positioned at the movable end, the fixed end is fixed on the supporting block, and the piezoelectric element is warped under the electrified state so as to drive the scanning element to move;
forming an electric connection structure, wherein the electric connection structure is positioned on the rotating mechanism, is electrically connected with the piezoelectric structure and the scanning element, and is provided with an external signal connection end;
the rotating mechanism includes: the scanning device comprises a second piezoelectric structure and a first piezoelectric structure positioned on the movable end of the second piezoelectric structure, wherein the scanning element is positioned on the movable end of the first piezoelectric structure.
13. The method of claim 12, wherein the piezoelectric element comprises:
a support layer;
the piezoelectric laminated structure is positioned on the support layer and at least comprises a layer of piezoelectric film and electrodes positioned on the upper surface and the lower surface of each layer of piezoelectric film, and the two adjacent layers of piezoelectric films share the electrode positioned between the two layers of piezoelectric films;
the electrodes are counted from bottom to top in sequence and are divided into odd-numbered layers of electrodes and even-numbered layers of electrodes;
a first electrode leading-out terminal which is positioned on the top surface or the bottom surface of the piezoelectric element and is electrically connected with the even electrode layer;
and the second electrode leading-out end is positioned on the top surface or the bottom surface of the piezoelectric element and is electrically connected with the odd electrode layers.
14. The method of claim 13, wherein the second piezoelectric structure comprises a second support block and a second piezoelectric element on the second support block, and the first piezoelectric structure comprises a first support block and a first piezoelectric element on the first support block, the first support block being located on a movable end of the second piezoelectric element;
forming a rotation mechanism on the substrate includes:
forming a second supporting block and a sacrificial layer on the periphery of the second supporting block on the substrate;
forming a second piezoelectric element on the second backing block and the sacrificial layer;
forming a first support block on a movable end of the second piezoelectric element;
and forming a first piezoelectric element on the first support block, so that an included angle is formed between the first piezoelectric element and the second piezoelectric element in the length direction.
15. The method of claim 14, wherein forming a second support block and a sacrificial layer on the substrate at the periphery of the second support block comprises:
forming a first dielectric layer on the substrate;
carrying out patterning treatment on the first medium layer, removing part of the first medium layer, and forming the second supporting block on the substrate;
filling a sacrificial material at the periphery of the second supporting block to form a sacrificial layer.
16. The method of forming a scanning mechanism according to claim 15, wherein forming a first support block on the movable end of the second piezoelectric element includes:
forming a second dielectric layer on the sacrificial layer and the second piezoelectric element;
and carrying out patterning treatment on the second medium layer, removing part of the second medium layer except for the movable end of the second piezoelectric element, and forming the first support block on the movable end of the second piezoelectric element.
17. The method of claim 15, wherein forming a rotation mechanism on the substrate comprises: bonding the second piezoelectric element to the second backing block; bonding the first piezoelectric element to the first support block.
18. The method of claim 14, wherein when the electrical connection structure is plural, before forming the first support block, forming the electrical connection structure comprises:
forming a second electrical connection structure on the top surface of the second piezoelectric element;
forming a second insulating layer on the second electrical connection structure;
forming a first electrode lead-out and a second electrode lead-out of a second piezoelectric element and a scanning element electrical input in the second insulating layer;
after forming the first support block, forming the electrical connection structure includes:
forming a first electrical connection structure on the top surface of the first piezoelectric element;
forming a first insulating layer on the first electrical connection structure;
forming a scanning element electrical connection end in the first insulating layer of the movable end of the first piezoelectric element;
forming a first plug, a second plug, and a third plug in the first support block;
the bottom end of the first plug is connected with a first electrode leading-out end of the second piezoelectric structure through the second electric connection structure, and the top end of the first plug is connected with a first electrode leading-out end of the first piezoelectric structure;
the bottom end of the second plug is connected with a second electrode leading-out end of the second piezoelectric structure through the second electric connection structure, and the top end of the second plug is connected with a second electrode leading-out end of the first piezoelectric structure;
the bottom end of the third plug is connected with the electrical input end of the scanning element through the second electrical connection structure, and the top end of the third plug is connected with the electrical connection end of the scanning element through the first electrical connection structure;
and electrically connecting the pin of the scanning element with the electric connection end of the scanning element by a bonding wire or flip chip bonding process.
19. The method for forming a scanning mechanism according to claim 14, further comprising, after forming the electrical connection structure: and removing the sacrificial layer by wet etching.
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