WO2021128554A1 - 一种导电泡棉 - Google Patents

一种导电泡棉 Download PDF

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Publication number
WO2021128554A1
WO2021128554A1 PCT/CN2020/076165 CN2020076165W WO2021128554A1 WO 2021128554 A1 WO2021128554 A1 WO 2021128554A1 CN 2020076165 W CN2020076165 W CN 2020076165W WO 2021128554 A1 WO2021128554 A1 WO 2021128554A1
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WO
WIPO (PCT)
Prior art keywords
conductive
contact surface
foam
conductive foam
adhesive layer
Prior art date
Application number
PCT/CN2020/076165
Other languages
English (en)
French (fr)
Inventor
陈卫
白松
罗伟东
Original Assignee
惠州Tcl移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 惠州Tcl移动通信有限公司 filed Critical 惠州Tcl移动通信有限公司
Priority to US17/758,009 priority Critical patent/US20230089152A1/en
Publication of WO2021128554A1 publication Critical patent/WO2021128554A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/04—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by at least one layer folded at the edge, e.g. over another layer ; characterised by at least one layer enveloping or enclosing a material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/245—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it being a foam layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/02—Coating on the layer surface on fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0276—Polyester fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/16—Structural features of fibres, filaments or yarns e.g. wrapped, coiled, crimped or covered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/105—Metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Definitions

  • This application relates to the technical field of conductive foam, and in particular to a conductive foam.
  • Conductive foam is a flame-retardant sponge wrapped with conductive cloth on the outer surface. It has good surface conductivity and can be easily fixed on the device to be shielded with adhesive tape.
  • a layer of conductive foam is provided on some devices inside the mobile terminal, which can play the role of conducting electricity, preventing static electricity and reducing electromagnetic radiation.
  • Conductive foam is a flame-retardant sponge wrapped with a conductive cloth on the outer surface. It has good surface conductivity and can be easily fixed on the device to be shielded with adhesive tape. Therefore, conductive foam is widely used in electronic chassis and cabinets. , Indoor chassis, industrial equipment, notebook computers and mobile communication equipment, etc. Sometimes, a layer of conductive foam is set on some devices inside the mobile terminal, which can play the role of conducting electricity, preventing static electricity and reducing electromagnetic radiation.
  • the conductive foam designed in the prior art because the conductive foam often has the problem of offset and falling, which makes the assembly process consume a long time. .
  • the present application provides a conductive foam, which effectively solves the problem that the conductive foam is prone to deviation and falling when the conductive foam is assembled to the device of the mobile terminal.
  • an embodiment of the present application provides a conductive foam, and the conductive foam includes:
  • the conductive cloth wraps the outer surface of the foam body, the conductive cloth includes a device contact surface, and the device contact surface is used to contact an external device for assembly;
  • the conductive adhesive layer is arranged on the contact surface of the device.
  • the conductive adhesive layer is centrally disposed on the device contact surface, and the area of the conductive adhesive layer is smaller than the area of the device contact surface.
  • the ratio between the area of the conductive adhesive layer and the area of the device contact surface is any value from 1/3 to 1/2.
  • the material of the conductive cloth includes nickel-plated fiber cloth, gold-plated fiber cloth, carbon-plated fiber cloth or aluminum foil fiber cloth.
  • the conductive adhesive layer is doped with metal conductive particles, and the metal conductive particles include one or more of gold, silver, copper, aluminum, zinc, iron, and nickel combination.
  • the concentration of the metal conductive particles is inversely proportional to the area of the conductive adhesive layer.
  • the conductive adhesive layer includes a plurality of conductive adhesive sheets arranged at intervals, and at least two of the conductive adhesive sheets are doped with different metal conductive particles.
  • the conductive foam further includes a plurality of through holes distributed in an array for providing heat dissipation channels for devices in contact with the conductive foam.
  • the conductive foam further includes a dust ring for preventing dust from entering after the external device is assembled with the conductive foam, and the dust ring is located in contact with the device. It is arranged around the peripheral edge of the contact surface of the device.
  • the shape of the longitudinal section of the conductive foam includes a rectangle, a triangle, or a trapezoid.
  • an embodiment of the present application also provides a conductive foam, the conductive foam includes:
  • the conductive cloth wraps the outer surface of the foam body, the conductive cloth includes a device contact surface, and the device contact surface is used to contact an external device for assembly;
  • a conductive adhesive layer, the conductive adhesive layer is disposed on the contact surface of the device;
  • the conductive adhesive layer is centrally disposed on the device contact surface, and the area of the conductive adhesive layer is smaller than the area of the device contact surface.
  • the ratio between the area of the conductive adhesive layer and the area of the device contact surface is any value from 1/3 to 1/2.
  • the material of the conductive cloth includes nickel-plated fiber cloth, gold-plated fiber cloth, carbon-plated fiber cloth or aluminum foil fiber cloth.
  • the conductive adhesive layer is doped with metal conductive particles, and the metal conductive particles include one or more of gold, silver, copper, aluminum, zinc, iron, and nickel combination.
  • the concentration of the metal conductive particles is inversely proportional to the area of the conductive adhesive layer.
  • the conductive adhesive layer includes a plurality of conductive adhesive sheets arranged at intervals, and at least two of the conductive adhesive sheets are doped with different metal conductive particles.
  • the conductive foam further includes a plurality of through holes distributed in an array for providing heat dissipation channels for devices in contact with the conductive foam.
  • the conductive foam further includes a dust ring for preventing dust from entering after the external device is assembled with the conductive foam, and the dust ring is located in contact with the device. It is arranged around the peripheral edge of the contact surface of the device.
  • the shape of the longitudinal section of the conductive foam includes a rectangle, a triangle, or a trapezoid.
  • the conductive foam provided in the present application includes: a foam body; a conductive cloth wrapping the outer surface of the foam body, and the conductive cloth includes a device contact surface, which is used to contact an external device. Assemble; conductive adhesive layer placed on the contact surface of the device.
  • the conductive foam provided by the present invention is provided with a conductive adhesive layer on the device contact surface of the conductive cloth, so that when the device contact surface of the conductive foam contacts the external device for assembly, the conductive foam The cotton will not deviate and fall, thus shortening the time consumed in the assembly process and improving the assembly efficiency of the conductive foam.
  • FIG. 1 is a schematic diagram of a three-dimensional structure of a conductive foam provided by an embodiment of the application
  • FIG. 2 is another three-dimensional schematic diagram of the conductive foam provided by the embodiment of the application.
  • FIG. 3 is another three-dimensional schematic diagram of the conductive foam provided by the embodiment of the application.
  • FIG. 4 is a schematic diagram of another three-dimensional structure of the conductive foam provided by an embodiment of the application.
  • Conductive foam is formed by compounding metal fiber cloth and foam together, and undergoes a series of treatments to make it have good surface conductivity and compressibility, making it suitable for use in tight spaces and limited closing pressure. Realize electromagnetic shielding on occasion.
  • the conductive foam designed in the prior art, during the process of assembling the conductive foam to the mobile terminal device, the conductive foam often has the problem of offset and falling, which makes the assembly process consume a long time. .
  • the present application provides a conductive foam, which effectively solves the problem that the conductive foam is prone to deviation and falling when the conductive foam is assembled to the device of the mobile terminal.
  • FIG. 1 is a schematic diagram of a three-dimensional structure of a conductive foam provided by an embodiment of the present application. From the figure, each component of the present invention and the relative positional relationship of each component can be seen intuitively.
  • the conductive foam 10 includes a foam body 11, a conductive cloth 12, and a conductive adhesive layer 13, wherein the conductive cloth 12 wraps the outer surface of the foam body 11, and the conductive cloth 12 includes devices
  • the contact surface 121, the device contact surface 121 is used for contacting with external devices for assembly; the conductive adhesive layer 13 is disposed on the device contact surface 121.
  • the conductive adhesive is formed by doping a certain proportion of metal conductive particles into the ordinary adhesive to form a conductive adhesive that can achieve conductivity. Under this manufacturing process, because the concentration of metal conductive particles in the conductive adhesive is not large Therefore, the gap between the metal conductive particles is also large.
  • the conductive adhesive is in contact with the metal device, its on-resistance is small, which makes its conductive effect very poor and affects the overall performance of the mobile terminal.
  • the adhesive layer 13 completely covers the device contact surface 121, and the overall performance of the mobile terminal deteriorates due to its low conduction resistance when in contact with the metal device.
  • the conductive adhesive is smaller than the area of the device contact surface 121, and the conductive adhesive layer 13 is centrally disposed on the device contact surface 121.
  • the ratio between the area of the conductive adhesive layer 13 and the area of the device contact surface 121 is any value from 1/3 to 1/2.
  • the material of the conductive cloth 12 includes nickel-plated fiber cloth, gold-plated fiber cloth, carbon-plated fiber cloth or aluminum foil fiber cloth.
  • the conductive adhesive layer 13 is mainly used for bonding with external devices to fix the conductive foam 10 on the external devices as a whole, the conductive foam 10 mainly relies on the conductive cloth 12 to conduct electricity.
  • Conductive cloth is made of fiber cloth (usually polyester fiber cloth) as the base material. After pretreatment, electroplating metal plating is applied to make it have metallic characteristics and become conductive fiber cloth. For example, the above-mentioned nickel-plated fiber cloth is electroplated with nickel on the polyester fiber cloth to make it conductive.
  • the conductive adhesive layer 13 is doped with metal conductive particles (not shown in the figure), and the metal conductive particles include gold, silver, copper, aluminum, zinc, One or more combinations of iron and nickel.
  • the conductive adhesive layer 13 can be prepared on the conductive cloth 12 by coating, or the conductive adhesive layer 13 can be made into a double-sided tape and stuck on the conductive cloth 12.
  • the conductive foam 10 includes multiple device contact surfaces.
  • the metal conductive particles doped in the conductive adhesive layer 13 disposed on the contact surface 121 of each device may also be different.
  • the conductive foam 10 includes a first device contact surface 1211 and a second device contact surface 1212, the first device contact surface 1211 and the second device contact surface 1212 respectively contact the same external device
  • the first conductive adhesive layer 131 disposed on the first device contact surface 1211 can be doped with silver (Ag), which has better conductivity and is more expensive, while the second The area of the metal cross-section is relatively large, so the second conductive adhesive layer 132 on the contact surface of the second device can be doped with iron (Fe), which has the second highest conductivity and is cheaper. In this way, while reducing production costs, it also The conductivity of the conductive foam 10 is ensured.
  • the conductive foam 10 includes a third device contact surface (not shown in the figure) and a fourth device contact surface (not shown in the figure), the third device contact surface and the fourth device contact surface Respectively contact the metal cross section of the first external device (not shown in the figure) and the metal cross section of the second external device (not shown in the figure), wherein the area of the metal cross section of the first external device is smaller, and the second external device The area of the metal cross-section is larger. Because the area of the metal cross section of the first external device is small, the third conductive adhesive layer (not shown in the figure) on the contact surface of the third device can be made of silver (Ag) with better conductivity and more expensive price.
  • the fourth conductive adhesive layer (not shown in the figure) on the contact surface of the fourth device can be made of iron (Fe ) Doping, so that while reducing the production cost, the conductivity of the conductive foam 10 is also ensured.
  • the conductive foam 10 may also include a trunk through hole (not shown in the figure) that penetrates its longitudinal section.
  • the longitudinal cross-sectional shape of the through hole includes rectangle, triangle, circle, arch, or trapezoid.
  • the concentration of the metal conductive particles is inversely proportional to the area of the conductive adhesive layer 13.
  • the shape of the longitudinal section of the conductive foam includes a rectangle, a triangle, or a trapezoid.
  • the conductive foam 10 further includes a plurality of through holes (not shown in the figure) distributed in an array, which are used to provide heat dissipation for devices in contact with the conductive foam 10 aisle.
  • the number of through holes is proportional to the area of the device contact surface 121, that is, the larger the area of the device contact surface 121, the greater the number of through holes, and the smaller the area of the device contact surface 121, the greater the number of through holes. less.
  • the conductive foam 10 provided in this application includes: a foam body 11; a conductive cloth 12 wrapping the outer surface of the foam body 11, and the conductive cloth 12 includes a device contact surface 121, which is used for Contact with an external device for assembly; a conductive adhesive layer 13 disposed on the device contact surface 121.
  • the conductive foam 10 is provided with a conductive adhesive layer 13 on the device contact surface 121 of the conductive cloth 12, so that when the device contact surface 121 of the conductive foam 10 is in contact with external devices for assembly, the conductive foam 10 will not Offset and drop, thereby shortening the time consumed in the assembly process, and improving the assembly efficiency of the conductive foam 10.
  • Fig. 2 is another three-dimensional schematic diagram of the conductive foam provided by the embodiment of the present application. From the figure, each component of the present invention and the relative positional relationship of each component can be seen intuitively.
  • the conductive foam 10 includes a foam body 11, a conductive cloth 12, a conductive adhesive layer 13, and a dust ring 14.
  • the conductive cloth 12 wraps the outer surface of the foam body 11, and the
  • the conductive cloth 12 includes a device contact surface 121, which is used to contact an external device for assembly;
  • the conductive adhesive layer 13 is disposed on the device contact surface 121, and the conductive adhesive layer 13 includes a plurality of spaced apart Conductive adhesive film (not shown in the figure);
  • the dust ring 14 is used to prevent dust from entering the external device and the conductive foam 10 after being assembled.
  • the dust ring 14 is located on the device contact surface 121 and surrounds the device contact surface 121 The surrounding edges of the setting.
  • the conductive adhesive is formed by doping a certain proportion of metal conductive particles into the ordinary adhesive to form a conductive adhesive that can achieve conductivity. Under this manufacturing process, because the concentration of metal conductive particles in the conductive adhesive is not large Therefore, the gap between the metal conductive particles is also large.
  • the conductive adhesive is in contact with the metal device, its on-resistance is small, which makes its conductive effect very poor and affects the overall performance of the mobile terminal.
  • the adhesive layer 13 completely covers the device contact surface 121, and the overall performance of the mobile terminal deteriorates due to its low conduction resistance when in contact with the metal device.
  • the conductive adhesive is smaller than the area of the device contact surface 121, and the conductive adhesive layer 13 is centrally disposed on the device contact surface 121.
  • the ratio between the area of the conductive adhesive layer 13 and the area of the device contact surface 121 is any value from 1/3 to 1/2.
  • the material of the conductive cloth 12 includes nickel-plated fiber cloth, gold-plated fiber cloth, carbon-plated fiber cloth or aluminum foil fiber cloth.
  • the conductive adhesive layer 13 is mainly used for bonding with external devices to fix the conductive foam 10 on the external devices as a whole, the conductive foam 10 mainly relies on the conductive cloth 12 to conduct electricity.
  • Conductive cloth is made of fiber cloth (usually polyester fiber cloth) as the base material. After pretreatment, electroplating metal plating is applied to make it have metallic characteristics and become conductive fiber cloth. For example, the above-mentioned nickel-plated fiber cloth is electroplated with nickel on the polyester fiber cloth to make it conductive.
  • the conductive adhesive layer 13 is doped with metal conductive particles (not shown in the figure), and the metal conductive particles include gold, silver, copper, aluminum, zinc, One or more combinations of iron and nickel.
  • the conductive adhesive layer 13 can be prepared on the conductive cloth 12 by coating, or the conductive adhesive layer 13 can be made into a double-sided tape and stuck on the conductive cloth 12.
  • the conductive foam 10 includes multiple device contact surfaces.
  • the metal conductive particles doped in the conductive adhesive layer 13 disposed on the contact surface 121 of each device may also be different.
  • the conductive foam 10 includes a first device contact surface (not shown in the figure) and a second device contact surface (not shown in the figure).
  • the first device contact surface and the second device contact surface are respectively The first metal cross section (not shown in the figure) and the second metal cross section (not shown in the figure) contacting the same external device, wherein the area of the first metal cross section is smaller, and the area of the second metal cross section is larger. Because the area of the first metal cross-section is small, the first conductive adhesive layer (not shown in the figure) on the contact surface of the first device can be made of metal conductive particles (such as silver or copper) with better conductivity and more expensive price.
  • the second conductive adhesive layer (not shown in the figure) on the contact surface of the second device can be made of metal conductive particles ( For example, aluminum or iron) is doped. In this way, while reducing the production cost, the conductivity of the conductive foam 10 is also ensured.
  • the conductive foam 10 includes a third device contact surface (not shown in the figure) and a fourth device contact surface (not shown in the figure), the third device contact surface and the fourth device contact surface Respectively contact the metal cross section of the first external device (not shown in the figure) and the metal cross section of the second external device (not shown in the figure), wherein the area of the metal cross section of the first external device is smaller, and the second external device The area of the metal cross-section is larger.
  • the third conductive adhesive layer (not shown in the figure) on the contact surface of the third device can be made of metal conductive particles with better conductivity and more expensive price (such as Silver or copper), and the area of the metal cross-section of the second external device is larger. Therefore, the fourth conductive adhesive layer (not shown in the figure) on the contact surface of the fourth device can adopt the conductive performance second, and more Inexpensive metal conductive particles (such as aluminum or iron) are doped, so that while reducing production costs, the conductivity of the conductive foam 10 is also ensured.
  • the conductive adhesive layer 13 includes a plurality of conductive adhesive sheets (not shown in the figure) arranged at intervals, and at least two conductive adhesive sheets are doped with different metal conductive particles.
  • one of the conductive adhesive sheets adopts conductive properties. Better and more expensive metal conductive particles (such as silver or copper) are doped, and the rest of the conductive adhesive film is doped with metal conductive particles (such as aluminum or iron) that are second in conductivity and cheaper. While reducing the production cost, the conductivity of the conductive foam 10 is also ensured.
  • the shape of the conductive adhesive sheet may be rectangular or disc shape.
  • the conductive adhesive sheet may be arranged on the device contact surface 121 at intervals.
  • the shape of the conductive adhesive sheet is a disc shape At this time, the conductive adhesive sheet can be arranged on the device contact surface 121 in an array.
  • the conductive foam 10 includes a fifth device contact surface 1211 and a sixth device contact surface 1212, and the fifth conductive adhesive layer 131 disposed on the fifth contact surface 1211 is formed by It is composed of six wafer-shaped conductive adhesive sheets.
  • the sixth conductive adhesive layer 132 disposed on the sixth contact surface 1212 is composed of two rectangular conductive adhesive sheets. Among them, one of the fifth conductive adhesive layers 131
  • the conductive adhesive sheet is doped with silver (Ag), which has better conductivity and is more expensive, and the rest of the conductive adhesive sheet is doped with iron (Fe), which has the second and cheaper conductivity.
  • the sixth conductive adhesive layer 132 is doped with silver (Ag), which has better conductivity and is more expensive, and the other conductive adhesive sheet, is doped with iron (Fe), which has the second and cheaper conductivity. While reducing the production cost, the conductivity of the conductive foam 10 is also ensured.
  • the conductive foam 10 may also include a trunk through hole (not shown in the figure) that penetrates its longitudinal section.
  • the longitudinal cross-sectional shape of the through hole includes rectangle, triangle, circle, arch, or trapezoid.
  • the concentration of the metal conductive particles is inversely proportional to the area of the conductive adhesive layer 13.
  • the shape of the longitudinal section of the conductive foam includes a rectangle, a triangle, or a trapezoid.
  • the conductive foam 10 further includes a plurality of through holes (not shown in the figure) distributed in an array, which are used to provide heat dissipation for devices in contact with the conductive foam 10 aisle.
  • the number of through holes is proportional to the area of the device contact surface 121, that is, the larger the area of the device contact surface 121, the greater the number of through holes, and the smaller the area of the device contact surface 121, the greater the number of through holes. less.
  • the conductive foam 10 provided in this application includes: a foam body 11; a conductive cloth 12 wrapping the outer surface of the foam body 11, and the conductive cloth 12 includes a device contact surface 121, which is used for Contact with an external device for assembly; a conductive adhesive layer 13 disposed on the device contact surface 121.
  • the conductive foam 10 is provided with a conductive adhesive layer 13 on the device contact surface 121 of the conductive cloth 12, so that when the device contact surface 121 of the conductive foam 10 is in contact with external devices for assembly, the conductive foam 10 will not Offset and drop, thereby shortening the time consumed in the assembly process, improving the assembly efficiency of the conductive foam 10, and because the conductive foam 10 also includes a dust ring 14 on the device contact surface 121, and the The dust-proof ring 14 is arranged around the peripheral edge of the device contact surface 121, so as to prevent dust from entering the device in contact with the conductive foam 10.

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Abstract

本申请提供了一种导电泡棉，包括：泡棉主体；包裹泡棉主体外表面的导电布，且该导电布包括器件接触面，器件接触面用于与外部器件接触以进行组装；设置于器件接触面上的导电黏胶层。

Description

一种导电泡棉
本申请要求于2019年12月27日提交中国专利局、申请号为201911377001.7、发明名称为“一种导电泡棉”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及导电泡棉技术领域，尤其涉及一种导电泡棉。
 背景技术
随着社会的不断发展，导电泡棉在各行各业中得到了广泛的运用。导电泡棉是外表面包裹有导电布的阻燃海绵，它具有良好的表面导电性，可以很容易用胶粘带固定在需屏蔽器件上。在移动终端内部的一些器件上设置一层导电泡棉，可以起到导电、防静电和减少电磁辐射的效果。导电泡棉是外表面包裹有导电布的阻燃海绵，它具有良好的表面导电性，可以很容易用胶粘带固定在需屏蔽器件上，所以，导电泡棉广泛应用于电子机箱、机壳、室内机箱、工业设备、笔记本电脑以及移动通讯设备等。有时，在移动终端内部的一些器件上设置一层导电泡棉，可以起到导电、防静电和减少电磁辐射的效果。
但是，现有技术下设计的导电泡棉，在给移动终端的器件组装导电泡棉的过程中，经常会出现导电泡棉偏位以及掉落的问题，从而使组装的过程消耗较长的时间。
 技术问题
本申请提供了一种导电泡棉，有效地解决了在给移动终端的器件组装导电泡棉时，导电泡棉容易出现偏位以及掉落的问题。
 技术解决方案
第一方面，本申请实施例提供一种导电泡棉，所述导电泡棉包括：
泡棉主体；
导电布，所述导电布包裹所述泡棉主体的外表面，所述导电布包括器件接触面，所述器件接触面用于与外部器件接触以进行组装；
导电黏胶层，所述导电黏胶层设置于所述器件接触面上。
在本申请提供的导电泡棉中，所述导电黏胶层居中设置于所述器件接触面上，且所述导电黏胶层的面积小于所述器件接触面的面积。
在本申请提供的导电泡棉中，所述导电黏胶层的面积与所述器件接触面的面积之间的比值为1/3至1/2中的任一数值。
在本申请提供的导电泡棉中，所述导电布的材料包括镀镍纤维布、镀金纤维布、镀炭纤维布或铝箔纤维布。
在本申请提供的导电泡棉中，所述导电黏胶层中掺杂有金属导电粒子，所述金属导电粒子包括金、银、铜、铝、锌、铁以及镍中的一种或多种组合。
在本申请提供的导电泡棉中，所述金属导电粒子的浓度与所述导电黏胶层的面积成反比。
在本申请提供的导电泡棉中，所述导电黏胶层包括多个间隔设置的导电黏胶片，且至少两个所述导电黏胶片掺杂不同的金属导电粒子。
在本申请提供的导电泡棉中，所述导电泡棉还包括阵列分布的多个通孔，用于给与所述导电泡棉接触的器件提供散热通道。
在本申请提供的导电泡棉中，所述导电泡棉还包括防尘圈，用于防止所述外部器件与所述导电泡棉组装后有灰尘进入，所述防尘圈位于所述器件接触面上，且环绕所述器件接触面的四周边缘设置。
在本申请提供的导电泡棉中，所述导电泡棉纵截面的形状包括长方形、三角形或梯形。
第二方面，本申请实施例还提供一种导电泡棉，所述导电泡棉包括：
泡棉主体；
导电布，所述导电布包裹所述泡棉主体的外表面，所述导电布包括器件接触面，所述器件接触面用于与外部器件接触以进行组装；
导电黏胶层，所述导电黏胶层设置于所述器件接触面上；
主干通孔，所述主干通孔贯穿所述导电泡棉的纵截面。
在本申请提供的导电泡棉中，所述导电黏胶层居中设置于所述器件接触面上，且所述导电黏胶层的面积小于所述器件接触面的面积。
在本申请提供的导电泡棉中，所述导电黏胶层的面积与所述器件接触面的面积之间的比值为1/3至1/2中的任一数值。
在本申请提供的导电泡棉中，所述导电布的材料包括镀镍纤维布、镀金纤维布、镀炭纤维布或铝箔纤维布。
在本申请提供的导电泡棉中，所述导电黏胶层中掺杂有金属导电粒子，所述金属导电粒子包括金、银、铜、铝、锌、铁以及镍中的一种或多种组合。
在本申请提供的导电泡棉中，所述金属导电粒子的浓度与所述导电黏胶层的面积成反比。
在本申请提供的导电泡棉中，所述导电黏胶层包括多个间隔设置的导电黏胶片，且至少两个所述导电黏胶片掺杂不同的金属导电粒子。
在本申请提供的导电泡棉中，所述导电泡棉还包括阵列分布的多个通孔，用于给与所述导电泡棉接触的器件提供散热通道。
在本申请提供的导电泡棉中，所述导电泡棉还包括防尘圈，用于防止所述外部器件与所述导电泡棉组装后有灰尘进入，所述防尘圈位于所述器件接触面上，且环绕所述器件接触面的四周边缘设置。
在本申请提供的导电泡棉中，所述导电泡棉纵截面的形状包括长方形、三角形或梯形。
 有益效果
相较于现有技术，本申请提供的导电泡棉，包括：泡棉主体；包裹泡棉主体外表面的导电布，且该导电布包括器件接触面，器件接触面用于与外部器件接触以进行组装；设置于器件接触面上的导电黏胶层。区别于现有技术，本发明提供的导电泡棉，通过在导电布的器件接触面上设置导电黏胶层，使得导电泡棉的器件接触面在与外部器件接触以进行组装时，该导电泡棉不会偏位以及掉落，从而缩短了组装过程所消耗的时间，提高了导电泡棉的组装效率。
 附图说明
图1为本申请实施例提供的导电泡棉的立体结构示意图；
图2为本申请实施例提供的导电泡棉的另一立体结构示意图；
图3为本申请实施例提供的导电泡棉的另一立体结构示意图；
图4为本申请实施例提供的导电泡棉的另一立体结构示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例，且所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明的是，本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。并且，本申请附图中的厚度和形状不反映真实比例，目的只是示意说明本申请实施例内容。
导电泡棉是通过将金属纤维布和泡棉复合在一起而形成，并经过一系列的处理，使其具有良好的表面导电性和可压缩性能，使得其适用于在空间狭小、闭合压力有限的场合实现电磁屏蔽。
但是，现有技术下设计的导电泡棉，在给移动终端的器件组装导电泡棉的过程中，经常会出现导电泡棉偏位以及掉落的问题，从而使组装的过程消耗较长的时间。本申请提供了一种导电泡棉，有效地解决了在给移动终端的器件组装导电泡棉时，导电泡棉容易出现偏位以及掉落的问题。
请参阅图1，图1是本申请实施例所提供的导电泡棉的立体结构示意图，从图中可以很直观的看到本发明的各组成部分，以及各组成部分的相对位置关系。
如图1所示，该导电泡棉10包括：泡棉主体11、导电布12和导电黏胶层13，其中，该导电布12包裹泡棉主体11的外表面，且该导电布12包括器件接触面121，器件接触面121用于与外部器件接触以进行组装；导电黏胶层13设置于器件接触面121上。
进一步地，导电黏胶是通过在普通黏胶中掺杂一定比例的金属导电粒子以形成能够实现导电的导电黏胶，在这种制作工艺下，因为导电黏胶中金属导电粒子的浓度不大，所以金属导电粒子之间的空隙也较大，在导电黏胶与金属器件进行接触的时候，其导通阻抗小，使得其导电效果非常差，影响移动终端的整机性能，所以，如果导电黏胶层13完全覆盖器件接触面121，会因为其与金属器件进行接触时导通阻抗小而使移动终端的整机性能变差，故本申请实施例提供的导电泡棉10中，导电黏胶层13的面积小于器件接触面121的面积，且导电黏胶层13居中设置于器件接触面121上。最优地，导电黏胶层13的面积与器件接触面121的面积之间的比值为1/3至1/2中的任一数值。
进一步地，本申请实施例提供的导电泡棉10中，导电布12的材料包括镀镍纤维布、镀金纤维布、镀炭纤维布或铝箔纤维布。具体地，因为导电黏胶层13的作用主要是用来与外部器件进行粘接以将导电泡棉10整体固定在外部器件上，导电泡棉10主要还是靠导电布12进行导电。导电布是以纤维布（一般常用聚酯纤维布）为基材，经过前置处理后施以电镀金属镀层使其具有金属特性而成为导电纤维布。比如，上述镀镍纤维布，是在聚酯纤维布上电镀镍，以使其具有导电性。
进一步地，本申请实施例提供的导电泡棉10中，导电黏胶层13中掺杂有金属导电粒子（图中未示出），该金属导电粒子包括金、银、铜、铝、锌、铁以及镍中的一种或多种组合。
进一步地，导电黏胶层13可以通过涂覆的方式制备于导电布12上，也可以将导电黏胶层13制作成双面胶的形式黏贴在导电布12上。
具体地，因为外部器件的形状各不相同，有时外部器件会有多个截面需要与导电泡棉10进行接触，或者一个导电泡棉10需要与多个外部器件进行接触，所以为了满足不同形状以及不同数量的外部器件的组装需要，导电泡棉10包括多个器件接触面。另外，设置于每个器件接触面121上的导电黏胶层13中掺杂的金属导电粒子也可以不同。
在一个具体实施例中，请参阅图2，导电泡棉10包括第一器件接触面1211和第二器件接触面1212，第一器件接触面1211与第二器件接触面1212分别接触同一外部器件的第一金属截面（图中未示出）和第二金属截面（图中未示出），其中，第一金属截面的面积较小，第二金属截面的面积较大。因为第一金属截面的面积较小，故设置于第一器件接触面1211上的第一导电黏胶层131可以采用导电性能较好、价格较贵的银（Ag）进行掺杂，而第二金属截面的面积较大，故第二器件接触面上的第二导电黏胶层132可以采用导电性能其次、且更加便宜的铁（Fe）进行掺杂，如此，在降低生产成本的同时，也保证了导电泡棉10的导电性。
在另一个具体实施例中，导电泡棉10包括第三器件接触面（图中未示出）和第四器件接触面（图中未示出），第三器件接触面与第四器件接触面分别接触第一外部器件的金属截面（图中未示出）和第二外部器件的金属截面（图中未示出），其中，第一外部器件的金属截面的面积较小，第二外部器件的金属截面的面积较大。因为第一外部器件的金属截面的面积较小，故第三器件接触面上的第三导电黏胶层（图中未示出）可以采用导电性能较好、价格较贵的银（Ag）进行掺杂，而第二外部器件的金属截面的面积较大，故第四器件接触面上的第四导电黏胶层（图中未示出）可以采用导电性能其次、且更加便宜的铁（Fe）进行掺杂，如此，在降低生产成本的同时，也保证了导电泡棉10的导电性。
进一步地，本申请实施例提供的导电泡棉10中，因为导电泡棉10在完成组装后会处于压缩状态，且在部分情况下，在导电泡棉10与外部器件进行接触的时候，预留给导电泡棉10的空间也很狭小，所以为了节约导电泡棉的组装空间以及节省生产成本，导电泡棉10还可以包括贯穿其纵截面的主干通孔（图中未示出），该主干通孔的纵截面形状包括矩形、三角形、圆形、拱形或梯形。
进一步地，本申请实施例提供的导电泡棉10中，为了保证导电黏胶的导电性和黏性，金属导电粒子的浓度与导电黏胶层13的面积成反比。
进一步地，本申请实施例提供的导电泡棉10中，导电泡棉纵截面的形状包括长方形、三角形或梯形。
进一步地，本申请实施例提供的导电泡棉10中，导电泡棉10还包括阵列分布的多个通孔（图中未示出），用于给与该导电泡棉10接触的器件提供散热通道。其中，通孔的数量和器件接触面121的面积成正比关系，也即，器件接触面121的面积越大，通孔的数量越多，器件接触面121的面积越小，通孔的数量越少。
区别于现有技术，本申请提供的导电泡棉10包括：泡棉主体11；包裹泡棉主体11外表面的导电布12，且该导电布12包括器件接触面121，器件接触面121用于与外部器件接触以进行组装；设置于器件接触面121上的导电黏胶层13。该导电泡棉10通过在导电布12的器件接触面121上设置导电黏胶层13，使得导电泡棉10的器件接触面121在与外部器件接触以进行组装时，该导电泡棉10不会偏位以及掉落，从而缩短了组装过程所消耗的时间，提高了导电泡棉10的组装效率。
请参阅图3，图2是本申请实施例所提供的导电泡棉的另一立体结构示意图，从图中可以很直观的看到本发明的各组成部分，以及各组成部分的相对位置关系。
如图3所示，该导电泡棉10包括：泡棉主体11、导电布12、导电黏胶层13和防尘圈14，其中，该导电布12包裹泡棉主体11的外表面，且该导电布12包括器件接触面121，器件接触面121用于与外部器件接触以进行组装；该导电黏胶层13设置于器件接触面121上，且该导电黏胶层13包括多个间隔设置的导电黏胶片（图中未示出）；该防尘圈14用于防止外部器件与导电泡棉10组装后有灰尘进入，该防尘圈14位于器件接触面121上，且环绕器件接触面121的四周边缘设置。
进一步地，导电黏胶是通过在普通黏胶中掺杂一定比例的金属导电粒子以形成能够实现导电的导电黏胶，在这种制作工艺下，因为导电黏胶中金属导电粒子的浓度不大，所以金属导电粒子之间的空隙也较大，在导电黏胶与金属器件进行接触的时候，其导通阻抗小，使得其导电效果非常差，影响移动终端的整机性能，所以，如果导电黏胶层13完全覆盖器件接触面121，会因为其与金属器件进行接触时导通阻抗小而使移动终端的整机性能变差，故本申请实施例提供的导电泡棉10中，导电黏胶层13的面积小于器件接触面121的面积，且导电黏胶层13居中设置于器件接触面121上。最优地，导电黏胶层13的面积与器件接触面121的面积之间的比值为1/3至1/2中的任一数值。
进一步地，本申请实施例提供的导电泡棉10中，导电布12的材料包括镀镍纤维布、镀金纤维布、镀炭纤维布或铝箔纤维布。具体地，因为导电黏胶层13的作用主要是用来与外部器件进行粘接以将导电泡棉10整体固定在外部器件上，导电泡棉10主要还是靠导电布12进行导电。导电布是以纤维布（一般常用聚酯纤维布）为基材，经过前置处理后施以电镀金属镀层使其具有金属特性而成为导电纤维布。比如，上述镀镍纤维布，是在聚酯纤维布上电镀镍，以使其具有导电性。
进一步地，本申请实施例提供的导电泡棉10中，导电黏胶层13中掺杂有金属导电粒子（图中未示出），该金属导电粒子包括金、银、铜、铝、锌、铁以及镍中的一种或多种组合。
进一步地，导电黏胶层13可以通过涂覆的方式制备于导电布12上，也可以将导电黏胶层13制作成双面胶的形式黏贴在导电布12上。
具体地，因为外部器件的形状各不相同，有时外部器件会有多个截面需要与导电泡棉10进行接触，或者一个导电泡棉10需要与多个外部器件进行接触，所以为了满足不同形状以及不同数量的外部器件的组装需要，导电泡棉10包括多个器件接触面。另外，设置于每个器件接触面121上的导电黏胶层13中掺杂的金属导电粒子也可以不同。
在一个具体实施例中，导电泡棉10包括第一器件接触面（图中未示出）和第二器件接触面（图中未示出），第一器件接触面与第二器件接触面分别接触同一外部器件的第一金属截面（图中未示出）和第二金属截面（图中未示出），其中，第一金属截面的面积较小，第二金属截面的面积较大。因为第一金属截面的面积较小，故第一器件接触面上的第一导电黏胶层（图中未示出）可以采用导电性能较好、价格较贵的金属导电粒子（比如银或者铜）进行掺杂，而第二金属截面的面积较大，故第二器件接触面上的第二导电黏胶层（图中未示出）可以采用导电性能其次、且更加便宜的金属导电粒子（比如铝或者铁）进行掺杂，如此，在降低生产成本的同时，也保证了导电泡棉10的导电性。
在另一个具体实施例中，导电泡棉10包括第三器件接触面（图中未示出）和第四器件接触面（图中未示出），第三器件接触面与第四器件接触面分别接触第一外部器件的金属截面（图中未示出）和第二外部器件的金属截面（图中未示出），其中，第一外部器件的金属截面的面积较小，第二外部器件的金属截面的面积较大。因为第一外部器件的金属截面的面积较小，故第三器件接触面上的第三导电黏胶层（图中未示出）可以采用导电性能较好、价格较贵的金属导电粒子（比如银或者铜）进行掺杂，而第二外部器件的金属截面的面积较大，故第四器件接触面上的第四导电黏胶层（图中未示出）可以采用导电性能其次、且更加便宜的金属导电粒子（比如铝或者铁）进行掺杂，如此，在降低生产成本的同时，也保证了导电泡棉10的导电性。
进一步地，导电黏胶层13包括多个间隔设置的导电黏胶片（图中未示出），且至少两个导电黏胶片掺杂不同的金属导电粒子，比如，其中一个导电黏胶片采用导电性能较好、价格较贵的金属导电粒子（比如银或者铜）进行掺杂，其余的导电黏胶片采用导电性能其次、且更加便宜的金属导电粒子（比如铝或者铁）进行掺杂，如此，在降低生产成本的同时，也保证了导电泡棉10的导电性。
进一步地，导电黏胶片的形状可为矩形或圆片形，当导电黏胶片的形状为矩形时，该导电黏胶片可以间隔设置于器件接触面121上，当导电黏胶片的形状为圆片形时，该导电黏胶片可以阵列设置于器件接触面121上。
在另一个具体的实施例中，请参阅图4，导电泡棉10包括第五器件接触面1211和第六器件接触面1212，设置于第五接触面1211上的第五导电黏胶层131由六个圆片形的导电黏胶片组成，设置于第六接触面上1212的第六导电黏胶层132由两个矩形的导电黏胶片组成，其中，第五导电黏胶层131中，其中一个导电黏胶片采用导电性能较好、价格较贵的银（Ag）进行掺杂，其余的导电黏胶片采用导电性能其次、且更加便宜的铁（Fe）进行掺杂，第六导电黏胶层132中，其中一个导电黏胶片采用导电性能较好、价格较贵的银（Ag）进行掺杂，另外一个导电黏胶片采用导电性能其次、且更加便宜的铁（Fe）进行掺杂，如此，在降低生产成本的同时，也保证了导电泡棉10的导电性。
进一步地，本申请实施例提供的导电泡棉10中，因为导电泡棉10在完成组装后会处于压缩状态，且在部分情况下，在导电泡棉10与外部器件进行接触的时候，预留给导电泡棉10的空间也很狭小，所以为了节约导电泡棉的组装空间以及节省生产成本，导电泡棉10还可以包括贯穿其纵截面的主干通孔（图中未示出），该主干通孔的纵截面形状包括矩形、三角形、圆形、拱形或梯形。
进一步地，本申请实施例提供的导电泡棉10中，为了保证导电黏胶的导电性和黏性，金属导电粒子的浓度与导电黏胶层13的面积成反比。
进一步地，本申请实施例提供的导电泡棉10中，导电泡棉纵截面的形状包括长方形、三角形或梯形。
进一步地，本申请实施例提供的导电泡棉10中，导电泡棉10还包括阵列分布的多个通孔（图中未示出），用于给与该导电泡棉10接触的器件提供散热通道。其中，通孔的数量和器件接触面121的面积成正比关系，也即，器件接触面121的面积越大，通孔的数量越多，器件接触面121的面积越小，通孔的数量越少。
区别于现有技术，本申请提供的导电泡棉10包括：泡棉主体11；包裹泡棉主体11外表面的导电布12，且该导电布12包括器件接触面121，器件接触面121用于与外部器件接触以进行组装；设置于器件接触面121上的导电黏胶层13。该导电泡棉10通过在导电布12的器件接触面121上设置导电黏胶层13，使得导电泡棉10的器件接触面121在与外部器件接触以进行组装时，该导电泡棉10不会偏位以及掉落，从而缩短了组装过程所消耗的时间，提高了导电泡棉10的组装效率，并且，因为该导电泡棉10还包括位于器件接触面121上的防尘圈14，且该防尘圈14环绕器件接触面121的四周边缘设置，从而可以防止与导电泡棉10接触的器件中有灰尘进入。
除上述实施例外，本申请还可以有其他实施方式。凡采用等同替换或等效替换形成的技术方案，均落在本申请要求的保护范围。
综上所述，虽然本申请已将优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种导电泡棉，其中，所述导电泡棉包括：
    泡棉主体；
    导电布，所述导电布包裹所述泡棉主体的外表面，所述导电布包括器件接触面，所述器件接触面用于与外部器件接触以进行组装；
    导电黏胶层，所述导电黏胶层设置于所述器件接触面上。
  2. 根据权利要求1所述的导电泡棉，其中，所述导电黏胶层居中设置于所述器件接触面上，且所述导电黏胶层的面积小于所述器件接触面的面积。
  3. 根据权利要求2所述的导电泡棉，其中，所述导电黏胶层的面积与所述器件接触面的面积之间的比值为1/3至1/2中的任一数值。
  4. 根据权利要求1所述的导电泡棉，其中，所述导电布的材料包括镀镍纤维布、镀金纤维布、镀炭纤维布或铝箔纤维布。
  5. 根据权利要求1所述的导电泡棉，其中，所述导电黏胶层中掺杂有金属导电粒子，所述金属导电粒子包括金、银、铜、铝、锌、铁以及镍中的一种或多种组合。
  6. 根据权利要求5所述的导电泡棉，其中，所述金属导电粒子的浓度与所述导电黏胶层的面积成反比。
  7. 根据权利要求5所述的导电泡棉，其中，所述导电黏胶层包括多个间隔设置的导电黏胶片，且至少两个所述导电黏胶片掺杂不同的金属导电粒子。
  8. 根据权利要求1所述的导电泡棉，其中，所述导电泡棉还包括阵列分布的多个通孔，用于给与所述导电泡棉接触的器件提供散热通道。
  9. 根据权利要求1所述的导电泡棉，其中，所述导电泡棉还包括防尘圈，用于防止所述外部器件与所述导电泡棉组装后有灰尘进入，所述防尘圈位于所述器件接触面上，且环绕所述器件接触面的四周边缘设置。
  10. 根据权利要求1所述的导电泡棉，其中，所述导电泡棉纵截面的形状包括长方形、三角形或梯形。
  11. 一种导电泡棉，其中，所述导电泡棉包括：
    泡棉主体；
    导电布，所述导电布包裹所述泡棉主体的外表面，所述导电布包括器件接触面，所述器件接触面用于与外部器件接触以进行组装；
    导电黏胶层，所述导电黏胶层设置于所述器件接触面上；
    主干通孔，所述主干通孔贯穿所述导电泡棉的纵截面。
  12. 根据权利要求11所述的导电泡棉，其中，所述导电黏胶层居中设置于所述器件接触面上，且所述导电黏胶层的面积小于所述器件接触面的面积。
  13. 根据权利要求12所述的导电泡棉，其中，所述导电黏胶层的面积与所述器件接触面的面积之间的比值为1/3至1/2中的任一数值。
  14. 根据权利要求11所述的导电泡棉，其中，所述导电布的材料包括镀镍纤维布、镀金纤维布、镀炭纤维布或铝箔纤维布。
  15. 根据权利要求11所述的导电泡棉，其中，所述导电黏胶层中掺杂有金属导电粒子，所述金属导电粒子包括金、银、铜、铝、锌、铁以及镍中的一种或多种组合。
  16. 根据权利要求15所述的导电泡棉，其中，所述金属导电粒子的浓度与所述导电黏胶层的面积成反比。
  17. 根据权利要求15所述的导电泡棉，其中，所述导电黏胶层包括多个间隔设置的导电黏胶片，且至少两个所述导电黏胶片掺杂不同的金属导电粒子。
  18. 根据权利要求11所述的导电泡棉，其中，所述导电泡棉还包括阵列分布的多个通孔，用于给与所述导电泡棉接触的器件提供散热通道。
  19. 根据权利要求11所述的导电泡棉，其中，所述导电泡棉还包括防尘圈，用于防止所述外部器件与所述导电泡棉组装后有灰尘进入，所述防尘圈位于所述器件接触面上，且环绕所述器件接触面的四周边缘设置。
  20. 根据权利要求11所述的导电泡棉，其中，所述导电泡棉纵截面的形状包括长方形、三角形或梯形。
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