WO2021128463A1

WO2021128463A1 - Display panel and preparation method therefor

Info

Publication number: WO2021128463A1
Application number: PCT/CN2020/070575
Authority: WO
Inventors: 孙洋
Original assignee: 深圳市华星光电半导体显示技术有限公司
Priority date: 2019-12-25
Filing date: 2020-01-07
Publication date: 2021-07-01
Also published as: CN111128985A

Abstract

The present application provides a display panel and a preparation method therefor. The display panel comprises an array substrate, first chips, second chips, and color conversion layers, wherein the first chips are provided on the array substrate and emit blue light, and a part of the first chips are excitation chips; the second chips are provided on the array substrate; the color conversion layers are provided on the excitation chips a one-to-one correspondence manner; and the excited color light of the color conversion layers, the color light emitted by the first chips, and the color light emitted by the second chips are different from each other.

Description

Display panel and preparation method thereof

Technical field

This application relates to the field of display technology, in particular to a display panel and a manufacturing method thereof.

Background technique

Miniature light-emitting diodes, a new technology regarded by many manufacturers as the next generation of display, have the advantages of much lower power consumption than liquid crystal displays, better brightness than organic light-emitting displays, and self-luminescence. Its main feature is to reduce the existing LED (Light Emitting Diode, light emitting diode) from millimeter to micron level size (generally less than 50 microns in size), and then carry out the new technology of array arrangement.

Because it is a self-luminous technology, it is necessary to transfer the chips of different colors to the backplane according to the pixel design when it is used as a full-color display. Great difficulty.

technical problem

The embodiment of the present application provides a display panel and a manufacturing method thereof, so as to solve the technical problem of low efficiency in the transfer process of the existing miniature light emitting diode.

Technical solutions

An embodiment of the present application provides a display panel, which includes:

Array substrate

A plurality of first chips, the plurality of first chips are arranged on the array substrate, the plurality of first chips emit blue light, and some of the first chips are excitation chips;

A plurality of second chips, the plurality of second chips are disposed on the array substrate; and

A plurality of color conversion layers, the plurality of color conversion layers are arranged on the excitation chip in a one-to-one correspondence; the color light excited by the plurality of color conversion layers, the color light emitted by the plurality of first chips, and The color lights emitted by the plurality of second chips are different from each other;

The second chip emits red light or green light, and the color conversion layer is excited to emit green light or red light;

The material of the color conversion layer includes one of quantum dots, phosphors and perovskite.

In the display panel of the embodiment of the present application, the color conversion layer has a single-layer structure.

In the display panel of the embodiment of the present application, the color conversion layer includes a first light-transmitting sub-layer, a second light-transmitting sub-layer, and a color conversion sub-layer that are sequentially disposed on the excitation chip; The light-transmitting sub-layer has a first refractive index, the second light-transmitting sub-layer has a second refractive index, and the color conversion sub-layer has a third refractive index;

The second refractive index is greater than the first refractive index, and the second refractive index is greater than the third refractive index.

In the display panel of the embodiment of the present application, the first refractive index is less than or equal to the third refractive index.

In the display panel of the embodiment of the present application, the thickness of the color conversion sublayer is between 190 nanometers and 240 nanometers.

An embodiment of the present application provides another display panel, which includes:

Array substrate

A plurality of color conversion layers, the plurality of color conversion layers are arranged on the excitation chip in a one-to-one correspondence; the color light excited by the plurality of color conversion layers, the color light emitted by the plurality of first chips, and The color lights emitted by the plurality of second chips are different from each other.

In the display panel of the embodiment of the present application, the second chip emits red light or green light, and the color conversion layer is excited to emit green light or red light.

In the display panel of the embodiment of the present application, the material of the color conversion layer includes one of quantum dots, phosphors, and perovskite.

This application also relates to a method for manufacturing a display panel, which includes the following steps:

Provide an array substrate;

Sequentially transferring a plurality of first chips and a plurality of second chips onto the array substrate, the plurality of first chips emit blue light, and some of the first chips are excitation chips;

A color conversion layer is formed on the excitation chip, and the color light excited by the color conversion layer, the color light emitted by the plurality of first chips, and the color light emitted by the plurality of second chips are different from each other.

In the manufacturing method of the display panel of the embodiment of the present application, the forming a color conversion layer on the excitation chip includes the following steps:

Forming a photoresist layer on the array substrate, the photoresist layer covering the plurality of first chips, the plurality of second chips and the array substrate;

Exposing and developing the photoresist layer, and forming an opening corresponding to the excitation chip in the photoresist layer to expose the excitation chip;

Forming a color conversion layer in the openings, and curing the color conversion layer;

Peel off the photoresist layer.

In the manufacturing method of the display panel of the embodiment of the present application, the depth of the opening is greater than the thickness of the color conversion layer.

In the manufacturing method of the display panel of the embodiment of the present application, the second chip emits red light or green light, and the color conversion layer is excited to emit green light or red light.

In the manufacturing method of the display panel of the embodiment of the present application, the material of the color conversion layer includes one of quantum dots, phosphors, and perovskites.

In the manufacturing method of the display panel of the embodiment of the present application, the color conversion layer has a single-layer structure.

In the method for manufacturing the display panel according to another embodiment of the present application, the forming a color conversion layer on the excitation chip includes the following steps:

Sequentially forming a first light-transmitting sub-layer, a second light-transmitting sub-layer, and a color conversion sub-layer in the openings to form the color conversion layer, and cure the color conversion layer;

Peel off the photoresist layer.

In the manufacturing method of the display panel according to another embodiment of the present application, the first light-transmitting sub-layer has a first refractive index, the second light-transmitting sub-layer has a second refractive index, and the color converter The layer has a third refractive index;

In the manufacturing method of the display panel according to another embodiment of the present application, the first refractive index is less than or equal to the third refractive index.

In the manufacturing method of the display panel according to another embodiment of the present application, the thickness of the color conversion sub-layer is between 190 nanometers and 240 nanometers.

Beneficial effect

The display panel and the manufacturing method thereof of the present application provide a first chip and a second chip on an array substrate, and a color conversion layer on part of the first chip (excitation chip), so that the structure of the excitation chip combined with the color conversion layer emits the first chip and the second chip. Three colors of light; this method only needs to transfer the first chip and the second chip twice, and then form a color conversion layer on the excitation chip, so that the excitation chip emits light and the color conversion layer emits another color light. This method does not require Three chip transfers are performed to improve the preparation effect.

Description of the drawings

In order to explain the embodiments of the present application or the technical solutions in the prior art more clearly, the following briefly introduces the drawings that need to be used in the embodiments. The drawings in the following description are only part of the embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work.

FIG. 1 is a schematic diagram of the structure of a display panel according to the first embodiment of the application;

2 is a schematic structural diagram of a display panel according to a second embodiment of the application;

FIG. 3 is a flowchart of a manufacturing method of the display panel according to the first embodiment of the application;

4A is a schematic structural diagram of step S2 of the manufacturing method of the display panel according to the first embodiment of the application;

4B is a schematic structural diagram of step S3 of the manufacturing method of the display panel according to the first embodiment of the application;

5 is a flowchart of step S3 of the manufacturing method of the display panel according to the second embodiment of the application;

FIG. 5A is a schematic structural diagram of step S31 of the manufacturing method of the display panel according to the first embodiment of the application; FIG.

5B is a schematic structural diagram of step S32 of the manufacturing method of the display panel according to the first embodiment of the application;

5C is a schematic structural diagram of step S33 of the manufacturing method of the display panel according to the first embodiment of the application;

5D is a schematic structural diagram of step S34 of the manufacturing method of the display panel according to the first embodiment of the application;

FIG. 6 is a flowchart of step S3' of the manufacturing method of the display panel according to the second embodiment of the application;

FIG. 6A is a schematic structural diagram of step S33' of the manufacturing method of the display panel according to the second embodiment of the application.

Embodiments of the present invention

The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work shall fall within the protection scope of this application.

In the description of this application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " "Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise" and other directions or The positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it cannot be understood as a restriction on this application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present application, "multiple" means two or more than two, unless otherwise specifically defined.

In the description of this application, it should be noted that the terms "installation", "connection", and "connection" should be understood in a broad sense, unless otherwise clearly specified and limited. For example, it can be a fixed connection or a detachable connection. Connected or integrally connected; it can be mechanically connected, or electrically connected or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction of two components relationship. For those of ordinary skill in the art, the specific meanings of the above-mentioned terms in this application can be understood according to specific circumstances.

In this application, unless expressly stipulated and defined otherwise, the "above" or "below" of the first feature of the second feature may include direct contact between the first and second features, or may include the first and second features Not in direct contact but through other features between them. Moreover, "above", "above" and "above" the second feature of the first feature include the first feature being directly above and obliquely above the second feature, or it simply means that the level of the first feature is higher than that of the second feature. The "below", "below" and "below" the first feature of the second feature include the first feature directly below and obliquely below the second feature, or it simply means that the level of the first feature is smaller than the second feature.

The following disclosure provides many different embodiments or examples for realizing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are only examples, and are not intended to limit the application. In addition, the present application may repeat reference numerals and/or reference letters in different examples. Such repetition is for the purpose of simplification and clarity, and does not indicate the relationship between the various embodiments and/or settings discussed. In addition, this application provides examples of various specific processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and/or the use of other materials.

Please refer to FIG. 1, which is a schematic structural diagram of a display panel according to a first embodiment of the application.

An embodiment of the present application provides a display panel 100 that includes an array substrate 11, a plurality of first chips 12, a plurality of second chips 13 and a plurality of color conversion layers 14. The array substrate 11 is used to drive the first chip 12 and the second chip 13 to emit light.

A plurality of first chips 12 are provided on the array substrate 11. The plurality of first chips 12 emit blue light. Part of the first chip 12 is an excitation chip 12a. The excitation chip 12a is a chip for illuminating the color conversion layer 14 with light, and exciting the color conversion layer 14 to emit light. A plurality of second chips 13 are provided on the array substrate 11. In addition, the number of the first chips 12 is more than the number of the second chips 13 because part of the first chips 12 are used as excitation chips 12a to ensure the balance of the full-color display. Optionally, the number of the first chips 12 is twice that of the second chips 13.

A plurality of color conversion layers 14 are arranged on the excitation chip 12a in a one-to-one correspondence. The color light emitted by the plurality of color conversion layers 14, the color light emitted by the plurality of first chips 12 and the color light emitted by the plurality of second chips 13 are different from each other.

In the display panel 100 of the first embodiment, the first chip 12 and the second chip 13 are arranged on the array substrate 11, and the color conversion layer 14 is arranged on part of the first chip 12 (the excitation chip 12a), so that the excitation chip 12a is combined The structure of the color conversion layer 14 emits light of the third color. This method only needs to transfer the first chip 12 and the second chip 13 twice, and then form the color conversion layer 14 on the excitation chip 12a, so that the excitation chip 12a emits light and the color conversion layer 14 emits another color light. Three chip transfers are performed to improve the preparation effect.

In the display panel 100 of the first embodiment, the second chip 13 emits red light or green light. The color conversion layer 14 is excited to emit green light or red light. That is, when the second chip 13 emits red light, the color conversion layer 14 is excited to emit green light. When the second chip 13 emits green light, the color conversion layer 14 is excited to emit red light.

In the prior art, since the red chip manufacturing process is different from that of the green and blue chips and needs to be grown on different substrates, the process of transferring the chips to the array substrate is very difficult. At present, the red chip of the micro LED has problems such as poor luminous efficiency and fragility. Therefore, in the display panel 100 of the first embodiment, the second chip 13 emits green light, and the color conversion layer 14 is excited to emit red light. That is, the second chip 13 is a green chip. In addition, the first chip 12 combined with the red color conversion layer 14 is used to replace the red chip. On the one hand, the manufacturing efficiency of the display panel 100 is improved, and on the other hand, the luminous efficiency of red light is improved.

In the display panel 100 of the first embodiment, the material of the color conversion layer 14 includes one of quantum dots, phosphors, and perovskite. Optionally, the color conversion layer 14 is a quantum dot layer.

In the display panel 100 of the first embodiment, the color conversion layer 14 has a single-layer structure.

Please refer to FIG. 2, which is a schematic structural diagram of a display panel according to a second embodiment of the application.

The embodiment of the present application provides two types of display panels 200, which include an array substrate 21, a plurality of first chips 22, a plurality of second chips 23, and a plurality of color conversion layers 24. Part of the first chip 22 is an excitation chip 22a.

The difference between the display panel 200 of the second embodiment and the display panel 100 of the first embodiment is that the color conversion layer 24 includes a first light-transmitting sub-layer 241 and a second light-transmitting sub-layer 241 and a second light-transmitting sub-layer sequentially disposed on the excitation chip 22a. A sub-layer 242 and a color conversion sub-layer 243. The first light-transmitting sub-layer 241 has a first refractive index, the second light-transmitting sub-layer 242 has a second refractive index, and the color conversion sub-layer 243 has a third refractive index.

The second refractive index is set to be greater than the third refractive index. When the incident angle of the light is greater than the critical angle of total internal reflection, total internal reflection of the light occurs at the interface between the second light-transmitting sub-layer 242 and the color conversion sub-layer 243. But in fact, before the light radiates to the color conversion sub-layer 243 and is reflected, its light energy enters the color conversion sub-layer 243 to a certain depth, and the light waves propagating in the color conversion sub-layer 243 are evanescent waves. At this time, the evanescent wave will excite the color conversion sub-layer 243, which causes the color conversion sub-layer 243 to radiate fluorescence. For example, the color conversion sub-layer 243 is formed of a red material and emits red light.

Of course, when the incident angle of the light is less than or equal to the critical angle of total internal reflection, the light directly enters the color conversion sub-layer 243.

Optionally, the material of the color conversion sub-layer 243 is one of quantum dots, phosphors, or perovskite. In the color conversion sub-layer 243 of this embodiment, the material of the color conversion sub-layer 243 is quantum dots. The depth range of the evanescent wave in the quantum dot film (color conversion sub-layer 243) is about 200 nanometers. Therefore, the thickness of the quantum dot film layer (color conversion sub-layer 243) can be set to be between 190 nanometers and 240 nanometers. Preferably, the thickness of the color conversion sub-layer 243 is 200 nanometers.

Therefore, compared with the quantum dot film layer used in the display field in the prior art, the second refractive index is set to be greater than the third refractive index in the second embodiment, which reduces the required thickness of the quantum dot film layer.

In addition, in the second embodiment, the remaining light after light conversion with the color conversion sub-layer 243 will return to the second light-transmitting sub-layer 242 according to the law of reflection, and since the second refractive index is set to be greater than the first light-transmitting sub-layer 242 A refractive index, so the reflected light undergoes total internal reflection at the interface between the second light-transmitting sub-layer 242 and the first light-transmitting sub-layer 241, and the light is directed to the color conversion sub-layer 243 again, and the color conversion sub-layer 243 is twice Secondary excitation improves the utilization rate of light.

Further, the first refractive index is less than or equal to the third refractive index. This arrangement prevents a very small portion of the light reflected from the interface between the second light-transmitting sub-layer 242 and the color conversion sub-layer 243 from passing through the first light-transmitting sub-layer 241. That is to say, it is ensured that the light reflected from the interface of the second light-transmitting sub-layer 242 and the color conversion sub-layer 243 undergoes total internal reflection at the interface of the second light-transmitting sub-layer 242 and the first light-transmitting sub-layer 241, and forms The light guiding effect similar to the slab waveguide further improves the utilization rate of light.

Please refer to FIGS. 3 and 4A-4B. FIG. 3 is a flowchart of the method for manufacturing the display panel according to the first embodiment of the application; FIG. 4A is a schematic diagram of the structure of step S2 of the method for manufacturing the display panel according to the first embodiment of the application. 4B is a schematic structural diagram of step S3 of the method for manufacturing a display panel according to the first embodiment of the application.

The manufacturing method of the display panel of the first embodiment of the present application includes the following steps:

Step S1: Provide an array substrate 11;

Step S2: sequentially transfer a plurality of first chips 12 and a plurality of second chips 13 onto the array substrate 11, the plurality of first chips 12 emit blue light, and some of the first chips 12 are excitation chips 12a;

Step S3: forming a color conversion layer 14 on the excitation chip 12a, the color light excited by the color conversion layer 14, the color light emitted by the plurality of first chips 12, and the color light emitted by the plurality of second chips 13 The color of light varies.

The manufacturing method of the display panel of the first embodiment only needs to transfer the first chip 12 and the second chip 13 twice, and then form the color conversion layer 14 on the excitation chip 12a, so that the excitation chip 12a emits light and stimulates the color conversion layer 14 to emit light. Another kind of color light, this method does not require three chip transfers, which improves the preparation effect.

The manufacturing method of the display panel of the first embodiment will be described below.

In step S1, an array substrate 11 is provided. The array substrate 11 includes a circuit structure electrically connected to the first chip 12 and the second chip 13 for driving the first chip 12 and the second chip 13 to emit light. Then go to step S2.

In step S2, please refer to FIG. 4A. The plurality of first chips 12 and the plurality of second chips 13 are sequentially transferred onto the array substrate 11.

Specifically, the plurality of first chips 12 emit blue light, and some of the first chips 12 are excitation chips 12a. The excitation chip 12a is a chip for illuminating the color conversion layer 14 with light, and exciting the color conversion layer 14 to emit light. In the first embodiment, the number of the first chips 12 is more than the number of the second chips 13, because part of the first chips 12 are used as excitation chips 12a to ensure the balance of the full-color display. Optionally, the number of the first chips 12 is twice that of the second chips 13. Then go to step S3.

In step S3, please refer to FIG. 4B. A color conversion layer 14 is formed on the excitation chip 12a. Wherein, the color light emitted by the color conversion layer 14, the color light emitted by the plurality of first chips 12, and the color light emitted by the plurality of second chips 13 are different, so as to realize the full color of the display panel. display.

Among them, please refer to Figure 5. Step S3 includes the following steps:

S31: forming a photoresist layer 15 on the array substrate 11, the photoresist layer 15 covering the plurality of first chips 12, the plurality of second chips 13, and the array substrate 11;

S32: Expose and develop the photoresist layer 15 to form an opening 151 corresponding to the excitation chip in the photoresist layer 15 to expose the excitation chip 12a;

S33: forming a color conversion layer 14 in the opening 151, and curing the color conversion layer 14;

S34: Peel off the photoresist layer 15.

Specifically, in step S31, please refer to FIG. 5A. A photoresist layer 15 is formed on the array substrate 11. The photoresist layer 15 covers the plurality of first chips 12, the plurality of second chips 13 and the array substrate 11. The photoresist layer 15 can be a positive photoresist or a negative photoresist. In the manufacturing method of the first embodiment, the photoresist layer 15 is a negative photoresist.

Optionally, the photoresist layer 15 may be formed on the array substrate 11 by coating. Then go to step S32.

In step S32, please refer to FIG. 5B. The photoresist layer 15 is exposed and developed. An opening 151 corresponding to the excitation chip is formed in the photoresist layer 15 to expose the excitation chip 12a. Wherein, the photoresist layer 15 is exposed by a mask, the light-shielding part of the mask is set corresponding to the excitation chip 12a to block the photoresist layer 15 on the excitation chip 12a, and the light-transmitting part of the mask corresponds to the photoresist layer in other positions 15; Then the photoresist layer 15 is developed to form an opening 151 that exposes the excitation chip 12a.

In step S32, an undercut structure is provided on the peripheral side of the opening 151 to facilitate the formation of the non-continuous color conversion layer 14 in the subsequent steps. In addition, the depth of the opening 151 is greater than the thickness of the color conversion layer 14 in the subsequent steps, which facilitates the formation of the non-continuous color conversion layer 14. Then go to step S33.

In step S33, please refer to FIG. 5C. A color conversion layer 14 is formed in the opening 151, and the color conversion layer 14 is cured. The color conversion layer 14 has a single-layer structure.

Wherein, the color conversion material layer is formed by coating the entire surface of the array substrate 11. When the color conversion material layer is located at the position of the opening 151, due to the depth of the opening 151 and the undercut structure, the color conversion material layer and other color conversion material layers in the opening 151 are disconnected, thereby forming a one-time formation The color conversion layer 14 improves the production efficiency. Subsequently, the color conversion layer 14 is cured by exposure or heating.

Optionally, the second chip 13 emits red light or green light, and the color conversion layer 14 is excited to emit green light or red light. That is, when the second chip 13 emits red light, the color conversion layer 14 is excited to emit green light. When the second chip 13 emits green light, the color conversion layer 14 is excited to emit red light.

In the prior art, since the red chip manufacturing process is different from that of the green and blue chips and needs to be grown on different substrates, the process of transferring the chips to the array substrate is very difficult. At present, the red chip of the micro LED has problems such as poor luminous efficiency and fragility. Therefore, in the manufacturing method of the first embodiment, the second chip 13 emits green light, and the color conversion layer 14 is excited to emit red light. That is, the second chip 13 is a green chip. In addition, the first chip 12 combined with the red color conversion layer 14 is used to replace the red chip, which improves the manufacturing efficiency of the display panel on the one hand, and improves the luminous efficiency of red light on the other hand.

In addition, the material of the color conversion layer 14 includes one of quantum dots, phosphors, and perovskite. Optionally, the color conversion layer 14 is a quantum dot layer. Then go to step S34.

In step S34, please refer to FIG. 5D. The photoresist layer 15 is peeled off. Specifically, the photoresist layer 15 is stripped off using a photoresist stripping solution to obtain a display panel.

This completes the manufacturing process of the display panel of the first embodiment.

6 and 6A, the manufacturing method of the display panel of the second embodiment is different from the manufacturing method of the display panel of the first embodiment in that step S3' includes the following steps:

Step S31': forming a photoresist layer 25 on the array substrate 21, the photoresist layer 25 covering the plurality of first chips 22, the plurality of second chips 23 and the array substrate 21;

Step S32': Expose and develop the photoresist layer 25, and form an opening 251 in the photoresist layer 25 corresponding to the excitation chip 22a to expose the excitation chip 22a;

Step S33': sequentially form a first light-transmitting sub-layer 241, a second light-transmitting sub-layer 242, and a color conversion sub-layer 243 in the opening 251 to form the color conversion layer 24, and cure the color conversion Layer 24;

Step S34': peel off the photoresist layer 25.

Among them, steps S31', S32', and S34' correspond to steps S31, S32, and S34 of the preparation method of the first embodiment one-to-one. For details, please refer to the steps S31, S32, and S34 of the preparation method of the first embodiment. The content will not be repeated here.

In step S33', please refer to FIG. 6A. A first light-transmitting sub-layer 241, a second light-transmitting sub-layer 242, and a color conversion sub-layer 243 are sequentially formed in the opening 251 to form the color conversion layer 24, and the color conversion layer 24 is cured. The first light-transmitting sub-layer 241 and the second light-transmitting sub-layer 242 may also be formed by coating.

In the manufacturing method of the second embodiment, the first light-transmitting sub-layer 241 has a first refractive index, the second light-transmitting sub-layer 242 has a second refractive index, and the color conversion sub-layer 243 has a third refractive index.

In addition, other steps of the preparation method of the second embodiment except step S3' are similar or the same as the corresponding steps of the preparation method of the first embodiment. For details, please refer to the preparation method of the first embodiment, which will not be repeated here. .

The above describes in detail a display panel provided by the embodiments of the present application and the preparation method thereof. Specific examples are used in this article to illustrate the principles and implementations of the present application. The descriptions of the above embodiments are only used to help understand the present application. The applied technical solutions and their core ideas; those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or equivalently replace some of the technical features; and these modifications or replacements, The essence of the corresponding technical solutions does not deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

A display panel, which includes:

Array substrate

A plurality of first chips, the plurality of first chips are arranged on the array substrate, the plurality of first chips emit blue light, and some of the first chips are excitation chips;

A plurality of second chips, the plurality of second chips are disposed on the array substrate; and

A plurality of color conversion layers, the plurality of color conversion layers are arranged on the excitation chip in a one-to-one correspondence; the color light excited by the plurality of color conversion layers, the color light emitted by the plurality of first chips, and The color lights emitted by the plurality of second chips are different from each other;

The second chip emits red light or green light, and the color conversion layer is excited to emit green light or red light;

The material of the color conversion layer includes one of quantum dots, phosphors and perovskite.
The display panel of claim 1, wherein the color conversion layer has a single-layer structure.
The display panel according to claim 1, wherein the color conversion layer comprises a first light-transmitting sub-layer, a second light-transmitting sub-layer and a color conversion sub-layer that are sequentially disposed on the excitation chip; the first The light-transmitting sub-layer has a first refractive index, the second light-transmitting sub-layer has a second refractive index, and the color conversion sub-layer has a third refractive index;

The second refractive index is greater than the first refractive index, and the second refractive index is greater than the third refractive index.
The display panel of claim 3, wherein the first refractive index is less than or equal to the third refractive index.
3. The display panel of claim 3, wherein the color conversion sub-layer has a thickness between 190 nanometers and 240 nanometers.
A display panel, which includes:

Array substrate

A plurality of first chips, the plurality of first chips are arranged on the array substrate, the plurality of first chips emit blue light, and some of the first chips are excitation chips;

A plurality of second chips, the plurality of second chips are disposed on the array substrate; and

A plurality of color conversion layers, the plurality of color conversion layers are arranged on the excitation chip in a one-to-one correspondence; the color light excited by the plurality of color conversion layers, the color light emitted by the plurality of first chips, and The color lights emitted by the plurality of second chips are different from each other.
7. The display panel of claim 6, wherein the second chip emits red light or green light, and the color conversion layer is excited to emit green light or red light.
7. The display panel of claim 6, wherein the material of the color conversion layer includes one of quantum dots, phosphors, and perovskite.
7. The display panel of claim 6, wherein the color conversion layer has a single-layer structure.
7. The display panel of claim 6, wherein the color conversion layer comprises a first light-transmitting sublayer, a second light-transmitting sublayer, and a color conversion sublayer that are sequentially disposed on the excitation chip; the first The light-transmitting sub-layer has a first refractive index, the second light-transmitting sub-layer has a second refractive index, and the color conversion sub-layer has a third refractive index;

The second refractive index is greater than the first refractive index, and the second refractive index is greater than the third refractive index.
10. The display panel of claim 10, wherein the first refractive index is less than or equal to the third refractive index.
10. The display panel of claim 10, wherein the color conversion sub-layer has a thickness between 190 nanometers and 240 nanometers.
A method for manufacturing a display panel includes the following steps:

Provide an array substrate;

Sequentially transferring a plurality of first chips and a plurality of second chips onto the array substrate, the plurality of first chips emit blue light, and some of the first chips are excitation chips;

A color conversion layer is formed on the excitation chip, and the color light excited by the color conversion layer, the color light emitted by the plurality of first chips, and the color light emitted by the plurality of second chips are different from each other.
The method for manufacturing a display panel according to claim 13, wherein the forming a color conversion layer on the excitation chip comprises the following steps:

Forming a photoresist layer on the array substrate, the photoresist layer covering the plurality of first chips, the plurality of second chips and the array substrate;

Exposing and developing the photoresist layer, and forming an opening corresponding to the excitation chip in the photoresist layer to expose the excitation chip;

Forming a color conversion layer in the openings, and curing the color conversion layer;

Peel off the photoresist layer.
14. The method for manufacturing the display panel according to claim 14, wherein the depth of the opening is greater than the thickness of the color conversion layer.
The method for manufacturing the display panel according to claim 13, wherein the second chip emits red light or green light, and the color conversion layer is excited to emit green light or red light.
The method for manufacturing the display panel according to claim 13, wherein the material of the color conversion layer includes one of quantum dots, phosphors, and perovskites.
The method for manufacturing a display panel according to claim 13, wherein the forming a color conversion layer on the excitation chip comprises the following steps:

Forming a photoresist layer on the array substrate, the photoresist layer covering the plurality of first chips, the plurality of second chips and the array substrate;

Exposing and developing the photoresist layer, and forming an opening corresponding to the excitation chip in the photoresist layer to expose the excitation chip;

Sequentially forming a first light-transmitting sub-layer, a second light-transmitting sub-layer, and a color conversion sub-layer in the openings to form the color conversion layer, and cure the color conversion layer;

Peel off the photoresist layer.
18. The method of manufacturing a display panel according to claim 18, wherein the first light-transmitting sub-layer has a first refractive index, the second light-transmitting sub-layer has a second refractive index, and the color conversion sub-layer has Third refractive index

The second refractive index is greater than the first refractive index, and the second refractive index is greater than the third refractive index.
18. The method of manufacturing a display panel according to claim 19, wherein the first refractive index is less than or equal to the third refractive index.