WO2020258898A1 - Display panel, display device, and manufacturing method for display panel - Google Patents

Display panel, display device, and manufacturing method for display panel Download PDF

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Publication number
WO2020258898A1
WO2020258898A1 PCT/CN2020/076548 CN2020076548W WO2020258898A1 WO 2020258898 A1 WO2020258898 A1 WO 2020258898A1 CN 2020076548 W CN2020076548 W CN 2020076548W WO 2020258898 A1 WO2020258898 A1 WO 2020258898A1
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Prior art keywords
light
emitting diode
display panel
conversion film
primary color
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PCT/CN2020/076548
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French (fr)
Chinese (zh)
Inventor
董小彪
李之升
郭恩卿
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成都辰显光电有限公司
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Priority to KR1020217039018A priority Critical patent/KR20210153134A/en
Publication of WO2020258898A1 publication Critical patent/WO2020258898A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/505Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0041Processes relating to semiconductor body packages relating to wavelength conversion elements

Definitions

  • This application relates to the field of display technology, and in particular to a display panel, a display device, and a manufacturing method of the display panel.
  • Micro-Light Emitting Diode (Micro-LED) display technology uses a high-density integrated micro-light-emitting diode array as pixels on the backplane to realize light-emitting display.
  • Micro-LED technology has gradually become a research hot spot, and the industry is looking forward to high-quality Micro-LED products entering the market.
  • High-quality Micro-LED display products are expected to become very promising display solutions such as Liquid Crystal Display (LCD) and Organic Light-Emitting Diode (OLED) displays already on the market.
  • LCD Liquid Crystal Display
  • OLED Organic Light-Emitting Diode
  • the first aspect of the present application provides a display panel, including:
  • LED array layer located on the drive backplane, the light emitting diode array layer includes a plurality of light emitting diodes
  • barrier wall located on the drive backplane, the barrier wall defines a plurality of accommodating parts, the accommodating part is used to accommodate the light emitting diodes
  • the light conversion film is arranged on the side of the light-emitting diode array layer away from the driving backplane.
  • the light conversion film includes a variety of primary color units, each primary color unit is isolated by a light blocking layer, the primary color units and the light-emitting diodes are arranged correspondingly, and the light-emitting diode array layer
  • the emitted light can be mixed into white light in the light conversion film; wherein, at least part of the primary color units are distributed with hollow holes.
  • an embodiment of the present application provides a display device, including the display panel of any one of the foregoing embodiments in the first aspect of the present application.
  • an embodiment of the present application provides a method for manufacturing a display panel, including:
  • the light conversion film and the light-emitting diode array are aligned and bonded in a way that the primary color unit and the light-emitting diode correspond to each other, so that the light emitted from the light-emitting diode array layer can be mixed in the light conversion film into white light and emitted;
  • forming a light conversion film with a plurality of hollow cavities distributed inside at least part of the primary color unit includes:
  • the photonic crystal microspheres in the color film are removed to obtain a light conversion film including multiple primary color units with a plurality of hollow cavities distributed inside.
  • the display panel of the embodiment of the present application after the light emitted by the light emitting diode reaches the light conversion film with a plurality of hollow holes, it can be reflected and refracted multiple times in the light conversion film, thereby extending the light path in the light conversion film , The light emitted by the light-emitting diode is fully converted and utilized in the light conversion film, and the light emitted by the light-emitting diode is prevented from directly passing through the light conversion film before being fully converted. Furthermore, while realizing colorization, the light leakage from the light emitting diode can be reduced, and the light utilization efficiency can be improved.
  • FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the present application.
  • FIG. 2 is a schematic top view of the structure of a light conversion film provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a display panel with a light-transmitting substrate added to the embodiment of FIG. 1 of the present application;
  • FIG. 4 is a schematic structural diagram of a display panel with a photonic crystal collimation layer added to the embodiment of FIG. 1 of the present application;
  • FIG. 5 is a schematic top view of the structure of a photonic crystal collimation layer provided by an embodiment of the present application.
  • FIG. 6 is a schematic flowchart of a manufacturing method of a display panel provided by an embodiment of the present application.
  • FIG. 7a to 7e are schematic diagrams of the preparation process of the light conversion film and the light blocking layer provided by an embodiment of the present application.
  • 8a to 8c are schematic diagrams of the preparation process of the photonic crystal alignment layer provided by an embodiment of the present application.
  • FIG. 1 is a schematic diagram of the structure of a display panel provided by an embodiment of the present application.
  • the display panel of the present application includes a driving backplane 10, a light emitting diode array layer on the driving backplane 10, and the light emitting diode array layer includes a plurality of light emitting diodes 20.
  • the retaining wall 40 is located on the driving backplane 10, and the retaining wall 40 defines a plurality of accommodating parts, and the accommodating parts are used to accommodate the light emitting diode 20.
  • the light conversion film 30 disposed on the side of the light emitting diode array layer away from the driving backplane 10 includes a plurality of primary color units, and each primary color unit is isolated by the light blocking layer 50, and the primary color units are arranged corresponding to the light emitting diode 20,
  • the light emitted from the light emitting diode array layer can be mixed into white light in the light conversion film 30; wherein, at least part of the primary color cells are distributed with a plurality of hollow holes 32.
  • the display panel of the embodiment of the present application after the light emitted by the light-emitting diode reaches the light conversion film with a plurality of hollow holes, the light conversion film with the hollow holes can change the original path of the light and make the light emitted by the light-emitting diode in Multiple reflections and refraction occur in it, thereby extending the path of light in the light conversion film, so that the light emitted by the light-emitting diode is fully converted in the light conversion film, and the light emitted by the light-emitting diode is prevented from directly passing through the light before being fully converted. Conversion film. Furthermore, the display panel can reduce the leakage of light emitted by the light-emitting diodes while achieving colorization, and improve the light utilization rate.
  • the light emitted from the light emitting diode array layer can be mixed into white light in the light conversion film 30.
  • the light-emitting quantity of each light-emitting diode can be controlled to control the ratio of the light output of each primary color unit, so that the The corresponding color is displayed under the mixed light to achieve color display.
  • a certain pixel unit is composed of three primary color units, and the three primary color units emit red light, green light and blue light respectively. When the light output amounts of red light, green light and blue light are equal, the pixel unit displays white light.
  • the retaining wall 40 defines a plurality of receiving parts, and the receiving parts have an inverted trapezoidal structure.
  • the side wall of the retaining wall 40 has a reflective layer at least on the surface facing the receiving portion, and the surface of the reflective layer facing the receiving portion is a roughened surface.
  • the material of the retaining wall 40 may be photoresist, such as SU-8.
  • the side wall of the retaining wall 40 has a reflective layer which may be formed of metal, for example, Al, Ag, etc.
  • a retaining wall is arranged between adjacent light-emitting diodes to prevent crosstalk of light emitted by the light-emitting diodes.
  • a reflective layer with a roughened surface is arranged on the side wall of the retaining wall to improve the light reflection of the light emitting diode, so as to increase the light emission in the vertical direction, and further improve the light utilization rate.
  • the light blocking layer 50 may be a black matrix or metal to prevent light crosstalk between the primary color units.
  • the driving backplane 10 includes a driving circuit, and the driving circuit is used to drive the corresponding light emitting diode to emit light.
  • the light emitting diode may be a Micro-LED.
  • Micro-LED has the advantages of low power consumption, high brightness, long life, fast response time, etc., so that the display panel with Micro-LED has good display performance.
  • the driving circuit includes at least a thin film transistor, and the Micro-LED is electrically connected to the thin film transistor.
  • the driving backplane 10 is a silicon-based driving backplane. Silicon-based drive backplanes are easier to achieve excellent features such as high pixel per inch (PPI), high integration, small size, easy portability, good earthquake resistance, and ultra-low power consumption.
  • the driving backplane 10 is a Low Temperature Poly-silicon (LTPS) driving backplane, so that the thin film transistors in the driving backplane have better reliability.
  • LTPS Low Temperature Poly-silicon
  • a photonic crystal base film formed by stacking photonic crystal microspheres may be used as the structural frame, so that the photoluminescent material is filled in the gaps of the photonic crystal microspheres, and the photonic crystal microspheres are removed to form a light conversion film 30 .
  • the hollow cavity 32 is formed after removing the photonic crystal microspheres, which are inorganic nanometer microspheres whose composition can be any one or more of SiO 2 , TiO 2 , Al 2 O 3 , ZrO 2, etc. kind.
  • the light conversion film has an inverse opal structure, and the hollow cavity 32 may be a spherical air hole as shown in FIG. 2 or a lattice structure air hole.
  • the photoluminescent material in the light conversion film 30 is located outside the hollow cavity 32.
  • the photonic crystal microspheres are removed to form air holes with spherical or lattice structure, and the ratio of the refractive index of the medium around the air holes to the refractive index of the air holes is controlled, so that the light conversion film 30 has a complete photonic band gap, so that the light conversion film 30 has Inverse opal structure.
  • the photonic band gap of the light conversion film 30 with the inverse opal structure matches the frequency of the light emitted by the light emitting diode, that is, the frequency of the light emitted by the light emitting diode is within the range of the photonic band gap, and the light emitted by the light emitting diode is in the light conversion film 30
  • the unconverted light will be emitted and refracted multiple times until the light emitted by the light-emitting diode is completely converted and used in the light conversion film 30, which further improves the utilization rate of light.
  • the light emitting diode array is a blue light emitting diode array
  • the corresponding primary color units of the light conversion film 30 are the red unit 311, the green unit 312, and the transparent unit 313, respectively.
  • a plurality of hollow cavities 32 are distributed in both the red cell 311 and the green cell 312, and there is no hollow cavities 32 in the transparent cell 313.
  • the red unit 311 includes a photoluminescent material for generating red light, for example, a material formed by mixing red quantum dots and photoresist or a material formed by mixing red organic photoluminescence material and photoresist.
  • the green unit 312 includes a photoluminescence material for generating green light, for example, a material formed by mixing green quantum dots and photoresist or a material formed by mixing a green organic photoluminescence material and photoresist.
  • the photoresist is a negative glue
  • the quantum dot component can be inorganic nanoparticles such as ZnS, ZnO, CdS, etc.
  • the transparent unit 313 includes a transparent material or a hollow structure, for example, a transparent photoresist, a transparent polymer (for example, polymethyl methacrylate (PMMA)), etc.
  • the transparent unit 313 does not need to convert the blue light emitted by the blue light emitting diode, but is used to directly transmit the blue light emitted by the blue light emitting diode.
  • the light emitting diode array is an ultraviolet light emitting diode array
  • the corresponding primary color units of the light conversion film 30 are the red unit 311, the green unit 312, and the blue unit 313, respectively.
  • a plurality of hollow holes 32 are distributed in the red cell 311, the green cell 312, and the blue cell 313.
  • the red unit 311 includes a photoluminescent material for generating red light, for example, a material formed by mixing red quantum dots and photoresist or a material formed by mixing red organic photoluminescence material and photoresist.
  • the green unit 312 includes a photoluminescence material for generating green light, for example, a material formed by mixing green quantum dots and photoresist or a material formed by mixing a green organic photoluminescence material and photoresist.
  • the blue unit 313 includes a photoluminescence material for generating blue light, for example, a material formed by mixing blue quantum dots and photoresist or a material formed by mixing blue organic photoluminescence material and photoresist.
  • the photoresist is a negative glue
  • the quantum dot component can be inorganic nanoparticles such as ZnS, ZnO, CdS, etc.
  • Each primary color unit converts the light emitted by the LED into the target color light or directly transmits the light emitted by the LED, and the light emitted by the LED array layer can be mixed into white light in the light conversion film to realize color display.
  • FIG. 3 is a schematic structural diagram of a display panel provided by another embodiment of the present application.
  • the display panel further includes a light-transmitting substrate 70 on the light conversion film 30.
  • the light-transmitting substrate 70 may be a high-transmittance glass for supporting the light conversion film 30 and the light blocking layer 50.
  • the light conversion film 30 is formed by a plurality of repeating units repeatedly arranged on a light-transmitting substrate 70 according to a predetermined rule, and each repeating unit includes at least a first primary color unit, a second primary color unit, and a third primary color unit.
  • the first primary color unit is a red unit
  • the second primary color unit is a green unit
  • the third primary color unit is a unit for transmitting or converting into blue light.
  • each repeating unit may include a combination of primary color units of different colors. For example, in two adjacent repeating units, only the primary color units of red, green and blue and green may be included respectively. When the image is actually displayed , Each repeating unit will borrow a primary color unit of another color in the adjacent repeating unit to form three primary colors to achieve color display. It is understandable that each repeating unit contains only two-color primary color units, the process is simple during manufacture, and the area of each primary color unit can be increased.
  • the repeating unit may also include other combinations, so that the display panel has a higher resolution.
  • each primary color unit corresponds to at least one light emitting diode.
  • the number of light emitting diodes corresponding to each primary color unit is the same.
  • the multiple light-emitting diodes are arranged in a positive matrix, and the number of rows and columns of the light-emitting diodes can be specifically set according to actual conditions.
  • the multiple primary color units of the light conversion film 30 are also arranged in a positive matrix.
  • the multiple light-emitting diodes are arranged in an oblique matrix, for example, the light-emitting diodes are arranged obliquely by 45 degrees on the basis of the original positive matrix arrangement.
  • the multiple primary color units of the light conversion film 30 are also arranged in an oblique matrix. The oblique arrangement can further reduce the spacing between the primary color units, thereby increasing the PPI.
  • FIG. 4 is a schematic structural diagram of a display panel provided by another embodiment of the present application.
  • the display panel may further include: a photonic crystal alignment layer 60 located between the light emitting diode array layer and the light conversion film 30; wherein, the photonic crystal alignment layer 60 has a plurality of defect channels 61, and a plurality of defect channels 61 is perpendicular to the driving backplane 10, and the light emitted by each light emitting diode 20 reaches the light conversion film 30 through the corresponding defect channel.
  • the photonic crystal collimating layer 60 may be formed by stacking photonic crystal microspheres in a certain regular arrangement, and the photonic crystal collimating layer 60 has a photonic band gap.
  • the photonic crystal microspheres can be SiO 2 microspheres, polystyrene microspheres, TiO 2 microspheres, and the like.
  • the defective channel may be a prismatic structure perpendicular to the driving back plate 10, or a cylindrical structure.
  • the prismatic structure may include a hexagonal prism structure, a pentagonal prism structure, and the like.
  • the number of defective channels corresponding to each light-emitting diode can be set according to actual requirements.
  • the light-emitting direction of the light-emitting diode is non-anisotropic.
  • This application uses a photonic crystal collimation layer.
  • the frequency of the light emitted by the light-emitting diode is within the photonic band gap of the photonic crystal collimation layer.
  • the photonic crystal collimation layer prohibits direct light from the light-emitting diode.
  • the photonic crystal collimation layer Through the photonic crystal collimation layer, the light emitted by each light emitting diode can only reach the light conversion film through the corresponding defect channel. The problem of light crosstalk and light leakage of the light emitting diode is prevented, and the light utilization rate is further improved.
  • the embodiment of the present application also provides a display device, including the above-mentioned display panel.
  • the display device can be applied to virtual reality equipment, mobile phones, tablet computers, televisions, displays, notebook computers, digital photo frames, navigators, wearable watches, Any product or component with display function such as IoT node. Since the principle of solving the problems of the display device is similar to that of the above-mentioned display panel, the implementation of the display device can refer to the implementation of the above-mentioned display panel, and the repetition will not be repeated.
  • FIG. 6 is a schematic flowchart of a method for manufacturing a display panel provided by an embodiment of the present application. As shown in FIG. 6, the manufacturing method of the display panel of the embodiment of the present application includes the following steps:
  • step S20 includes:
  • the hollow cavity includes spherical air holes or air holes with a lattice structure, and the method further includes:
  • the ratio of the refractive index of the medium around the air hole to the refractive index of the air hole is controlled, so that the light conversion film has a complete photonic band gap, and the light conversion film has an inverse opal structure.
  • the photonic crystal microspheres are inorganic nanometer microspheres.
  • the material of the photonic crystal microspheres includes any one or more of SiO 2 , TiO 2 , Al 2 O 3 , and ZrO 2
  • the light conversion film with the hollows can change the original path of the light and make the light emitting diode
  • the emitted light is reflected and refracted multiple times in it, thereby extending the path of the light in the light conversion film, so that the light emitted by the light emitting diode is fully converted and utilized in the light conversion film, and the light emitted by the light emitting diode is prevented from being directly converted before being converted. Pass through the light conversion film. While realizing colorization, the light leakage from the light emitting diode can be reduced, and the light utilization rate can be improved.
  • step S20 includes:
  • a layer of red quantum dot photoresist (negative glue) is spin-coated on a base film 80 formed by photonic crystal microspheres (the base film is set on a transparent substrate 70) to fill the photonic crystal The gaps between the microspheres are then soft-baked, exposed, developed, cured, and other processes to form the red unit 311.
  • a layer of green quantum dot photoresist (negative glue) is spin-coated on the base film 80 formed by photonic crystal microspheres to fill the gaps between the photonic crystal microspheres, and then through soft baking and exposure , Developing, cure and other processes to form the green unit 312.
  • the photonic crystal microspheres are removed by an etchant (such as alkali), then washed and dried to form a red unit 311 and a green unit 312 distributed with a plurality of hollow cavities 32.
  • the red unit 311 and the green unit 312 have reverse With opal structure, the photonic band gap falls in the blue region.
  • a layer of transparent photoresist (negative adhesive) is spin-coated on the light-transmitting substrate 70, and then the blue unit 313 is formed through processes such as soft baking, exposure, development, and cure, and the resulting light conversion film 30 has multiple primary color units.
  • a black matrix material is filled between the primary color cells to form a light blocking layer 50 to reduce light crosstalk between pixels.
  • the method may further include: forming a photonic crystal collimating layer with multiple defect channels; aligning the photonic crystal collimating layer with the light emitting diode array layer, so that each light emitting diode The emitted light reaches the light conversion film through the corresponding defect channel.
  • the light-emitting direction of the light-emitting diode is non-anisotropic.
  • the photonic crystal collimation layer is prepared in this application, so that the frequency of the light emitted by the light-emitting diode is within the photonic forbidden band of the photonic crystal collimation layer, and the photonic crystal collimation layer prohibits the light emitted by the light-emitting diode It directly passes through the photonic crystal collimation layer, but the light emitted by each light emitting diode can only reach the light conversion film through the corresponding defect channel. The problem of light crosstalk and light leakage of the light emitting diode is prevented, and the light utilization rate is improved.
  • the process of preparing the photonic crystal collimation layer includes the following steps:
  • a layer of thick photoresist is spin-coated on the drive backplane 10, and the patterned photoresist forms a retaining wall 40.
  • the retaining wall 40 defines a plurality of accommodating parts, which are in an inverted trapezoidal structure, and The surface of the side wall of the retaining wall is roughened; then a metal reflective layer (for example, Al, Ag, etc.) is formed on the side wall of the retaining wall by thermal evaporation or Sputter process; then the cathode and anode of the driving back plate are selectively etched Between the metal to prevent short circuit when the LED chip is working.
  • a metal reflective layer for example, Al, Ag, etc.
  • the LED chip 30 and the driving backplane 10 are bonded by using the mass transfer technology to realize electrical connection.
  • the photonic crystal quasi-layer 60 with a plurality of defective microcavities 61 is aligned and bonded to the LED chip, so that the light emitted by the LED chip is emitted along the defective microcavity.

Abstract

The present application discloses a display panel, a display device and a manufacturing method for the display panel. The display panel comprises: a drive backplane, and a light-emitting diode array layer located on the drive backplane, the light-emitting diode array layer comprising a plurality of light-emitting diodes; and a retaining wall arranged between adjacent light-emitting diodes, and a light conversion film arranged on one side of a light-emitting diode array layer away from the drive backplane; the light conversion film comprises a plurality of primary color units, the primary color units are isolated from one another by means of light blocking columns, each primary color unit is arranged corresponding to a light-emitting diode, and light emitted by the light-emitting diode array layer can be mixed into white light on the light conversion film; and hollow cavities are distributed in the light conversion film. According to the display panel in the embodiments of the present application, light leakage of light emitted by the light-emitting diodes can be reduced while achieving colorization, and the utilization rate of light can be improved.

Description

显示面板、显示装置及显示面板的制备方法Display panel, display device and preparation method of display panel
相关申请的交叉引用Cross references to related applications
本申请要求享有于2019年06月25日提交的名称为“显示面板、显示装置及显示面板的制备方法”的中国专利申请第201910556323.1号的优先权,该申请的全部内容通过引用并入本文中。This application claims the priority of the Chinese Patent Application No. 201910556323.1 filed on June 25, 2019, entitled "Display Panel, Display Device, and Display Panel Preparation Method", the entire content of which is incorporated herein by reference .
技术领域Technical field
本申请涉及显示技术领域,尤其涉及一种显示面板、显示装置及显示面板的制备方法。This application relates to the field of display technology, and in particular to a display panel, a display device, and a manufacturing method of the display panel.
背景技术Background technique
微发光二极管(Micro-Light Emitting Diode,Micro-LED)显示技术在背板上以高密度集成的微小发光二极管阵列为像素实现发光显示。目前,Micro-LED技术逐渐成为研究热门,工业界期待有高品质的Micro-LED产品进入市场。高品质Micro-LED显示产品可望成为市场上已有的诸如液晶显示器(Liquid Crystal Display,LCD)、有机发光二极管(Organic Light-Emitting Diode,OLED)显示器等之后非常有希望的显示解决方案。Micro-Light Emitting Diode (Micro-LED) display technology uses a high-density integrated micro-light-emitting diode array as pixels on the backplane to realize light-emitting display. Currently, Micro-LED technology has gradually become a research hot spot, and the industry is looking forward to high-quality Micro-LED products entering the market. High-quality Micro-LED display products are expected to become very promising display solutions such as Liquid Crystal Display (LCD) and Organic Light-Emitting Diode (OLED) displays already on the market.
但是,Micro-LED彩色显示中,发光二极管射出的光线出射至彩膜过程仍然存在漏光现象,导致Micro-LED显示面板光利用率低。However, in the Micro-LED color display, there is still light leakage in the process of the light emitted by the light emitting diode exiting to the color film, resulting in low light utilization of the Micro-LED display panel.
发明内容Summary of the invention
本申请的第一方面提供了一种显示面板,包括:The first aspect of the present application provides a display panel, including:
驱动背板;发光二极管阵列层,位于驱动背板上,发光二极管阵列层包括多个发光二极管;挡墙,位于驱动背板上,挡墙限定出多个容纳部,容纳部用于容纳发光二极管;光转换膜,设置于发光二极管阵列层远离驱动背板的一侧,光转换膜包括多种基色单元,各基色单元通过光阻挡层隔 离,基色单元与发光二极管对应设置,由发光二极管阵列层出射的光线能够在光转换膜混合成白光;其中,至少部分基色单元中分布有中空空洞。Drive backplane; LED array layer, located on the drive backplane, the light emitting diode array layer includes a plurality of light emitting diodes; barrier wall, located on the drive backplane, the barrier wall defines a plurality of accommodating parts, the accommodating part is used to accommodate the light emitting diodes The light conversion film is arranged on the side of the light-emitting diode array layer away from the driving backplane. The light conversion film includes a variety of primary color units, each primary color unit is isolated by a light blocking layer, the primary color units and the light-emitting diodes are arranged correspondingly, and the light-emitting diode array layer The emitted light can be mixed into white light in the light conversion film; wherein, at least part of the primary color units are distributed with hollow holes.
第二方面,本申请实施例提供了一种显示装置,包括本申请第一方面前述任一实施方式的显示面板。In the second aspect, an embodiment of the present application provides a display device, including the display panel of any one of the foregoing embodiments in the first aspect of the present application.
第三方面,本申请实施例提供了一种显示面板的制备方法,包括:In a third aspect, an embodiment of the present application provides a method for manufacturing a display panel, including:
提供绑定有发光二极管阵列的驱动背板;Provide a drive backplane bound with a light-emitting diode array;
形成至少部分基色单元内部分布有多个中空空洞的光转换膜;Forming a light conversion film with a plurality of hollow cavities distributed in at least part of the primary color unit;
将光转换膜与发光二极管阵列按照基色单元与发光二极管相对应的方式进行对位贴合,以使由发光二极管阵列层出射的光线能够在光转换膜混合成白光出射;The light conversion film and the light-emitting diode array are aligned and bonded in a way that the primary color unit and the light-emitting diode correspond to each other, so that the light emitted from the light-emitting diode array layer can be mixed in the light conversion film into white light and emitted;
其中,形成至少部分基色单元内部分布有多个中空空洞的光转换膜,包括:Wherein, forming a light conversion film with a plurality of hollow cavities distributed inside at least part of the primary color unit includes:
在基底上涂覆光子晶体微球以形成基膜,按照预定的工序依次旋涂不同颜色的颜料至预定单元图案内,以使颜料渗透至光子晶体微球之间的间隙,以形成具有多种基色单元的彩色膜;Coating photonic crystal microspheres on the substrate to form a base film, and spin-coating pigments of different colors into the predetermined unit pattern according to a predetermined process, so that the pigment penetrates into the gap between the photonic crystal microspheres to form a variety of Color film of primary color unit;
去除彩色膜中的光子晶体微球,得到内部分布有多个中空空洞的包括多种基色单元的光转换膜。The photonic crystal microspheres in the color film are removed to obtain a light conversion film including multiple primary color units with a plurality of hollow cavities distributed inside.
根据本申请实施例的显示面板,发光二极管出射的光到达分布有多个中空空洞的光转换膜后,能够在光转换膜内发生多次反射折射,从而延长了光在光转换膜内的路径,使发光二极管出射的光在光转换膜内被充分转换利用,阻止发光二极管出射的光未经过充分转换之前直接穿过该光转换膜。进而,在实现彩色化的同时,能够减少发光二极管发出的光漏光,提高光的利用率。According to the display panel of the embodiment of the present application, after the light emitted by the light emitting diode reaches the light conversion film with a plurality of hollow holes, it can be reflected and refracted multiple times in the light conversion film, thereby extending the light path in the light conversion film , The light emitted by the light-emitting diode is fully converted and utilized in the light conversion film, and the light emitted by the light-emitting diode is prevented from directly passing through the light conversion film before being fully converted. Furthermore, while realizing colorization, the light leakage from the light emitting diode can be reduced, and the light utilization efficiency can be improved.
附图说明Description of the drawings
图1是本申请一个实施例提供的显示面板的结构示意图;FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the present application;
图2是本申请一个实施例提供的光转换膜的俯视结构示意图;2 is a schematic top view of the structure of a light conversion film provided by an embodiment of the present application;
图3是本申请图1的实施例基础上增加透光基底的显示面板的结构示意图;FIG. 3 is a schematic structural diagram of a display panel with a light-transmitting substrate added to the embodiment of FIG. 1 of the present application;
图4是本申请图1的实施例基础上增加光子晶体准直层的显示面板的 结构示意图;4 is a schematic structural diagram of a display panel with a photonic crystal collimation layer added to the embodiment of FIG. 1 of the present application;
图5是本申请一个实施例提供的光子晶体准直层的俯视结构示意图;FIG. 5 is a schematic top view of the structure of a photonic crystal collimation layer provided by an embodiment of the present application;
图6是本申请一个实施例提供的显示面板的制备方法的流程示意图;FIG. 6 is a schematic flowchart of a manufacturing method of a display panel provided by an embodiment of the present application;
图7a至图7e是本申请一个实施例提供的光转换膜及光阻挡层的制备流程示意图;7a to 7e are schematic diagrams of the preparation process of the light conversion film and the light blocking layer provided by an embodiment of the present application;
图8a至图8c是本申请一个实施例提供的光子晶体准直层的制备流程示意图。8a to 8c are schematic diagrams of the preparation process of the photonic crystal alignment layer provided by an embodiment of the present application.
具体实施方式Detailed ways
下面将详细描述本申请的各个方面的特征和示例性实施例,为了使本申请的目的、技术方案及优点更加清楚明白,以下结合附图及具体实施例,对本申请进行进一步详细描述。应理解,此处所描述的具体实施例仅意在解释本申请,而不是限定本申请。对于本领域技术人员来说,本申请可在不需要这些具体细节中的一些细节的情况下实施。下面对实施例的描述仅仅是为了通过示出本申请的示例来提供对本申请更好的理解。The features and exemplary embodiments of each aspect of the present application will be described in detail below. In order to make the purpose, technical solutions, and advantages of the present application clearer, the following further describes the present application in detail with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only intended to explain the application, but not to limit the application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by showing examples of the present application.
下面将详细描述本申请的各个方面的特征和示例性实施例。此外,下文中所描述的特征、结构或特性可以以任何合适的方式结合在一个或更多实施例中。The features and exemplary embodiments of various aspects of the present application will be described in detail below. In addition, the features, structures or characteristics described below may be combined in one or more embodiments in any suitable manner.
图1是本申请一个实施例提供的显示面板的结构示意图。如图1所示,本申请的显示面板包括驱动背板10,位于驱动背板10上的发光二极管阵列层,发光二极管阵列层包括多个发光二极管20。挡墙40,位于驱动背板10上,挡墙40限定出多个容纳部,容纳部用于容纳发光二极管20。设置于发光二极管阵列层上远离驱动背板10的一侧的光转换膜30,光转换膜30包括多个基色单元,各基色单元通过光阻挡层50隔离,基色单元与发光二极管20对应设置,由发光二极管阵列层出射的光线能够在光转换膜30混合成白光;其中,至少部分基色单元中分布有多个中空空洞32。FIG. 1 is a schematic diagram of the structure of a display panel provided by an embodiment of the present application. As shown in FIG. 1, the display panel of the present application includes a driving backplane 10, a light emitting diode array layer on the driving backplane 10, and the light emitting diode array layer includes a plurality of light emitting diodes 20. The retaining wall 40 is located on the driving backplane 10, and the retaining wall 40 defines a plurality of accommodating parts, and the accommodating parts are used to accommodate the light emitting diode 20. The light conversion film 30 disposed on the side of the light emitting diode array layer away from the driving backplane 10 includes a plurality of primary color units, and each primary color unit is isolated by the light blocking layer 50, and the primary color units are arranged corresponding to the light emitting diode 20, The light emitted from the light emitting diode array layer can be mixed into white light in the light conversion film 30; wherein, at least part of the primary color cells are distributed with a plurality of hollow holes 32.
根据本申请实施例的显示面板,发光二极管出射的光到达分布有多个中空空洞的光转换膜后,分布有中空空洞的光转换膜能够改变光的原始路径,能够使发光二极管出射的光在其内发生多次反射折射,从而延长了光 在光转换膜内的路径,使发光二极管出射的光在光转换膜内充分转换,阻止发光二极管出射的光未经过充分转换之前直接穿过该光转换膜。进而,显示面板在实现彩色化的同时,能够减少发光二极管发出的光漏光,提高光的利用率。According to the display panel of the embodiment of the present application, after the light emitted by the light-emitting diode reaches the light conversion film with a plurality of hollow holes, the light conversion film with the hollow holes can change the original path of the light and make the light emitted by the light-emitting diode in Multiple reflections and refraction occur in it, thereby extending the path of light in the light conversion film, so that the light emitted by the light-emitting diode is fully converted in the light conversion film, and the light emitted by the light-emitting diode is prevented from directly passing through the light before being fully converted. Conversion film. Furthermore, the display panel can reduce the leakage of light emitted by the light-emitting diodes while achieving colorization, and improve the light utilization rate.
可选地,由发光二极管阵列层出射的光线能够在光转换膜30混合成白光,例如,可以通过控制各个发光二极管的点亮数量,从而控制各个基色单元的出光量的比例,使得在不同颜色的光混合下显示出相应的颜色,以实现彩色化显示。例如,某像素单元由三个基色单元组成,三个基色单元分别出射红光、绿光和蓝光,红光、绿光和蓝光的出光量相等时,该像素单元显示白光。Optionally, the light emitted from the light emitting diode array layer can be mixed into white light in the light conversion film 30. For example, the light-emitting quantity of each light-emitting diode can be controlled to control the ratio of the light output of each primary color unit, so that the The corresponding color is displayed under the mixed light to achieve color display. For example, a certain pixel unit is composed of three primary color units, and the three primary color units emit red light, green light and blue light respectively. When the light output amounts of red light, green light and blue light are equal, the pixel unit displays white light.
可选地,挡墙40限定出多个容纳部,容纳部呈倒梯形结构。挡墙40的侧壁至少在朝向容纳部的表面上具有反射层,反射层朝向容纳部的表面为粗化表面。其中,挡墙40的材料可以为光刻胶,例如SU-8。挡墙40的侧壁上具有反射层可以由金属形成,例如,Al、Ag等。Optionally, the retaining wall 40 defines a plurality of receiving parts, and the receiving parts have an inverted trapezoidal structure. The side wall of the retaining wall 40 has a reflective layer at least on the surface facing the receiving portion, and the surface of the reflective layer facing the receiving portion is a roughened surface. The material of the retaining wall 40 may be photoresist, such as SU-8. The side wall of the retaining wall 40 has a reflective layer which may be formed of metal, for example, Al, Ag, etc.
在相邻的发光二极管之间设置挡墙,可以防止发光二极管出射的光串扰。在挡墙的侧壁上设置具有粗化表面的反射层,提高发光二极管的光的反射,以提高沿垂直方向的出光,进一步提高光的利用率。A retaining wall is arranged between adjacent light-emitting diodes to prevent crosstalk of light emitted by the light-emitting diodes. A reflective layer with a roughened surface is arranged on the side wall of the retaining wall to improve the light reflection of the light emitting diode, so as to increase the light emission in the vertical direction, and further improve the light utilization rate.
可选地,光阻挡层50可以是黑矩阵或者金属,以防止各基色单元间的光串扰。Optionally, the light blocking layer 50 may be a black matrix or metal to prevent light crosstalk between the primary color units.
可选地,驱动背板10包括驱动电路,驱动电路用于驱动对应的发光二极管发光。发光二极管可以是Micro-LED。Micro-LED具有低功耗、高亮度、寿命长、响应时间快等优点,使得具有Micro-LED的显示面板具有良好的显示性能。对于Micro-LED,驱动电路至少包括薄膜晶体管,Micro-LED与薄膜晶体管电连接。Optionally, the driving backplane 10 includes a driving circuit, and the driving circuit is used to drive the corresponding light emitting diode to emit light. The light emitting diode may be a Micro-LED. Micro-LED has the advantages of low power consumption, high brightness, long life, fast response time, etc., so that the display panel with Micro-LED has good display performance. For the Micro-LED, the driving circuit includes at least a thin film transistor, and the Micro-LED is electrically connected to the thin film transistor.
进一步地,驱动背板10为硅基驱动背板。硅基驱动背板更容易实现高每英寸具有的像素数目(pixel per inch,PPI)、高度集成、体积小、易于携带、抗震性能好、超低功耗等优异特性。或者,驱动背板10为低温多晶硅(Low Temperature Poly-silicon,LTPS)驱动背板,使得驱动背板中的薄膜晶体管具有较佳的可靠性。Further, the driving backplane 10 is a silicon-based driving backplane. Silicon-based drive backplanes are easier to achieve excellent features such as high pixel per inch (PPI), high integration, small size, easy portability, good earthquake resistance, and ultra-low power consumption. Alternatively, the driving backplane 10 is a Low Temperature Poly-silicon (LTPS) driving backplane, so that the thin film transistors in the driving backplane have better reliability.
可选地,可以是以光子晶体微球堆积而成的光子晶体基膜为结构框架,令光致发光材料填充在光子晶体微球的缝隙中,并去除光子晶体微球,形成光转换膜30。其中,中空空洞32是去除光子晶体微球后形成的,光子晶体微球为无机纳米微球,其成分可以是SiO 2、TiO 2、Al 2O 3、ZrO 2等中的任意一种或多种。光转换膜具有反蛋白石结构,中空空洞32可以是如图2所示的球形的空气孔,也可以是晶格结构的空气孔。光转换膜30中的光致发光材料位于中空空洞32之外。 Optionally, a photonic crystal base film formed by stacking photonic crystal microspheres may be used as the structural frame, so that the photoluminescent material is filled in the gaps of the photonic crystal microspheres, and the photonic crystal microspheres are removed to form a light conversion film 30 . Among them, the hollow cavity 32 is formed after removing the photonic crystal microspheres, which are inorganic nanometer microspheres whose composition can be any one or more of SiO 2 , TiO 2 , Al 2 O 3 , ZrO 2, etc. Kind. The light conversion film has an inverse opal structure, and the hollow cavity 32 may be a spherical air hole as shown in FIG. 2 or a lattice structure air hole. The photoluminescent material in the light conversion film 30 is located outside the hollow cavity 32.
去除光子晶体微球形成球形的或者晶格结构的空气孔,控制空气孔周围介质的折射率与空气孔的折射率的比值,使光转换膜30出现完全光子带隙,令光转换膜30具备反蛋白石结构。具备反蛋白石结构的光转换膜30的光子带隙与发光二极管出射光的频率相匹配,即发光二极管出射光的频率在该光子带隙的范围内,发光二极管出射的光在光转换膜30内未被转换利用的光会被多次发射折射,直至发光二极管出射光在光转换膜30内被完全转换利用,进一步提高了光的利用率。The photonic crystal microspheres are removed to form air holes with spherical or lattice structure, and the ratio of the refractive index of the medium around the air holes to the refractive index of the air holes is controlled, so that the light conversion film 30 has a complete photonic band gap, so that the light conversion film 30 has Inverse opal structure. The photonic band gap of the light conversion film 30 with the inverse opal structure matches the frequency of the light emitted by the light emitting diode, that is, the frequency of the light emitted by the light emitting diode is within the range of the photonic band gap, and the light emitted by the light emitting diode is in the light conversion film 30 The unconverted light will be emitted and refracted multiple times until the light emitted by the light-emitting diode is completely converted and used in the light conversion film 30, which further improves the utilization rate of light.
可选地,发光二极管阵列为蓝光发光二极管阵列,对应的光转换膜30的基色单元分别为红色单元311、绿色单元312及透明单元313。红色单元311及绿色单元312中均分布有多个中空空洞32,透明单元313中无中空空洞32。Optionally, the light emitting diode array is a blue light emitting diode array, and the corresponding primary color units of the light conversion film 30 are the red unit 311, the green unit 312, and the transparent unit 313, respectively. A plurality of hollow cavities 32 are distributed in both the red cell 311 and the green cell 312, and there is no hollow cavities 32 in the transparent cell 313.
其中,红色单元311包括用于产生红光的光致发光材料,例如,红色量子点与光刻胶混合形成的材料或者红色有机光致发光材料与光刻胶混合形成的材料。绿色单元312包括用于产生绿光的光致发光材料,例如,绿色量子点与光刻胶混合形成的材料或者绿色有机光致发光材料与光刻胶混合形成的材料。其中,光刻胶为负性胶,量子点成分可以为ZnS、ZnO、CdS等无机纳米颗粒。透明单元313包括透明材料或者为中空结构,例如,透明光刻胶、透明聚合物(例如聚甲基丙烯酸甲酯(poly methyl meth acrylate,PMMA))等。The red unit 311 includes a photoluminescent material for generating red light, for example, a material formed by mixing red quantum dots and photoresist or a material formed by mixing red organic photoluminescence material and photoresist. The green unit 312 includes a photoluminescence material for generating green light, for example, a material formed by mixing green quantum dots and photoresist or a material formed by mixing a green organic photoluminescence material and photoresist. Among them, the photoresist is a negative glue, and the quantum dot component can be inorganic nanoparticles such as ZnS, ZnO, CdS, etc. The transparent unit 313 includes a transparent material or a hollow structure, for example, a transparent photoresist, a transparent polymer (for example, polymethyl methacrylate (PMMA)), etc.
透明单元313无需将蓝光发光二极管出射的蓝光进行转化,而是用于将蓝光发光二极管出射的蓝光直接透过。The transparent unit 313 does not need to convert the blue light emitted by the blue light emitting diode, but is used to directly transmit the blue light emitted by the blue light emitting diode.
可选地,发光二极管阵列为紫外光发光二极管阵列,对应的光转换膜 30的基色单元分别为红色单元311、绿色单元312及蓝色单元313。红色单元311、绿色单元312及蓝色单元313中均分布有多个中空空洞32。Optionally, the light emitting diode array is an ultraviolet light emitting diode array, and the corresponding primary color units of the light conversion film 30 are the red unit 311, the green unit 312, and the blue unit 313, respectively. A plurality of hollow holes 32 are distributed in the red cell 311, the green cell 312, and the blue cell 313.
其中,红色单元311包括用于产生红光的光致发光材料,例如,红色量子点与光刻胶混合形成的材料或者红色有机光致发光材料与光刻胶混合形成的材料。绿色单元312包括用于产生绿光的光致发光材料,例如,绿色量子点与光刻胶混合形成的材料或者绿色有机光致发光材料与光刻胶混合形成的材料。蓝色单元313包括用于产生蓝光的光致发光材料,例如,蓝色量子点与光刻胶混合形成的材料或者蓝色有机光致发光材料与光刻胶混合形成的材料。其中,光刻胶为负性胶,量子点成分可以为ZnS、ZnO、CdS等无机纳米颗粒。The red unit 311 includes a photoluminescent material for generating red light, for example, a material formed by mixing red quantum dots and photoresist or a material formed by mixing red organic photoluminescence material and photoresist. The green unit 312 includes a photoluminescence material for generating green light, for example, a material formed by mixing green quantum dots and photoresist or a material formed by mixing a green organic photoluminescence material and photoresist. The blue unit 313 includes a photoluminescence material for generating blue light, for example, a material formed by mixing blue quantum dots and photoresist or a material formed by mixing blue organic photoluminescence material and photoresist. Among them, the photoresist is a negative glue, and the quantum dot component can be inorganic nanoparticles such as ZnS, ZnO, CdS, etc.
各基色单元将发光二极管出射的光转换成目标颜色光或直接透过发光二极管出射的光,由发光二极管阵列层出射的光线能够在光转换膜混合成白光,以实现彩色化显示。Each primary color unit converts the light emitted by the LED into the target color light or directly transmits the light emitted by the LED, and the light emitted by the LED array layer can be mixed into white light in the light conversion film to realize color display.
图3是本申请另一个实施例提供的显示面板的结构示意图。如图3所示,显示面板还包括透光基底70,位于光转换膜30上。透光基底70可以是一种高透的玻璃,用来承载光转换膜30及光阻挡层50。光转换膜30由多个重复单元在透光基底70上按照预定的规律重复排列形成,各重复单元至少包括第一基色单元、第二基色单元及第三基色单元。FIG. 3 is a schematic structural diagram of a display panel provided by another embodiment of the present application. As shown in FIG. 3, the display panel further includes a light-transmitting substrate 70 on the light conversion film 30. The light-transmitting substrate 70 may be a high-transmittance glass for supporting the light conversion film 30 and the light blocking layer 50. The light conversion film 30 is formed by a plurality of repeating units repeatedly arranged on a light-transmitting substrate 70 according to a predetermined rule, and each repeating unit includes at least a first primary color unit, a second primary color unit, and a third primary color unit.
可选地,第一基色单元为红色单元,第二基色单元为绿色单元,第三基色单元为用于透过或转换成蓝光的单元。Optionally, the first primary color unit is a red unit, the second primary color unit is a green unit, and the third primary color unit is a unit for transmitting or converting into blue light.
可选地,每个重复单元可以包括不同颜色的基色单元的组合,例如在两个相邻的重复单元中,可分别仅包括红绿以及蓝绿两种颜色的基色单元,在实际显示图像时,每个重复单元会借用相邻重复单元中一个另一种颜色的基色单元来构成三基色,以实现彩色化显示。可以理解地,每个重复单元中仅包含两种颜色的基色单元,在制成时工艺简单,并且可以增大每个基色单元的面积。Optionally, each repeating unit may include a combination of primary color units of different colors. For example, in two adjacent repeating units, only the primary color units of red, green and blue and green may be included respectively. When the image is actually displayed , Each repeating unit will borrow a primary color unit of another color in the adjacent repeating unit to form three primary colors to achieve color display. It is understandable that each repeating unit contains only two-color primary color units, the process is simple during manufacture, and the area of each primary color unit can be increased.
重复单元也可以包括其他组合方式,以使显示面板具有较高的分辨率。The repeating unit may also include other combinations, so that the display panel has a higher resolution.
可选地,每个基色单元至少对应一个发光二极管,较佳地,每个基色单元对应的发光二极管的数量相同。多个发光二极管呈正矩阵排列,发光 二极管的行数和列数可以根据实际情况具体设定。对应的,光转换膜30的多个基色单元也呈正矩阵排列。Optionally, each primary color unit corresponds to at least one light emitting diode. Preferably, the number of light emitting diodes corresponding to each primary color unit is the same. The multiple light-emitting diodes are arranged in a positive matrix, and the number of rows and columns of the light-emitting diodes can be specifically set according to actual conditions. Correspondingly, the multiple primary color units of the light conversion film 30 are also arranged in a positive matrix.
或者,多个发光二极管呈斜矩阵排列,例如,发光二极管在原有正矩阵排列的基础上倾斜45度斜向排列。对应的,光转换膜30的多个基色单元也呈斜矩阵排列。采用倾斜排列可以进一步减小基色单元之间的间距,从而提高PPI。Alternatively, the multiple light-emitting diodes are arranged in an oblique matrix, for example, the light-emitting diodes are arranged obliquely by 45 degrees on the basis of the original positive matrix arrangement. Correspondingly, the multiple primary color units of the light conversion film 30 are also arranged in an oblique matrix. The oblique arrangement can further reduce the spacing between the primary color units, thereby increasing the PPI.
图4是本申请再一个实施例提供的显示面板的结构示意图。如图4所示,显示面板还可以包括:光子晶体准直层60,位于发光二极管阵列层和光转换膜30之间;其中,光子晶体准直层60具有多个缺陷通道61,多个缺陷通道61垂直于驱动背板10,每个发光二极管20出射的光通过对应的缺陷通道到达光转换膜30。FIG. 4 is a schematic structural diagram of a display panel provided by another embodiment of the present application. As shown in FIG. 4, the display panel may further include: a photonic crystal alignment layer 60 located between the light emitting diode array layer and the light conversion film 30; wherein, the photonic crystal alignment layer 60 has a plurality of defect channels 61, and a plurality of defect channels 61 is perpendicular to the driving backplane 10, and the light emitted by each light emitting diode 20 reaches the light conversion film 30 through the corresponding defect channel.
光子晶体准直层60可以由光子晶体微球按照一定的规律排列堆积形成,光子晶体准直层60具有光子带隙。光子晶体微球可以SiO 2微球、聚苯乙烯微球、TiO 2微球等。如图5所示,缺陷通道可以是垂直于驱动背板10的棱柱结构,也可以是圆柱结构,棱柱结构可以包括六棱柱结构、五棱柱结构等。每个发光二极管对应的缺陷通道的数量可以根据实际需求设置。 The photonic crystal collimating layer 60 may be formed by stacking photonic crystal microspheres in a certain regular arrangement, and the photonic crystal collimating layer 60 has a photonic band gap. The photonic crystal microspheres can be SiO 2 microspheres, polystyrene microspheres, TiO 2 microspheres, and the like. As shown in FIG. 5, the defective channel may be a prismatic structure perpendicular to the driving back plate 10, or a cylindrical structure. The prismatic structure may include a hexagonal prism structure, a pentagonal prism structure, and the like. The number of defective channels corresponding to each light-emitting diode can be set according to actual requirements.
发光二极管的发光方向具有非各向异性,本申请利用光子晶体准直层,发光二极管出射光的频率在光子晶体准直层的光子带隙内,光子晶体准直层禁止发光二极管出射的光直接穿过该光子晶体准直层,而是使每个发光二极管出射的光只能通过对应的缺陷通道到达光转换膜。防止发光二极管的光串扰、漏光的问题,进一步提高了光的利用率。The light-emitting direction of the light-emitting diode is non-anisotropic. This application uses a photonic crystal collimation layer. The frequency of the light emitted by the light-emitting diode is within the photonic band gap of the photonic crystal collimation layer. The photonic crystal collimation layer prohibits direct light from the light-emitting diode. Through the photonic crystal collimation layer, the light emitted by each light emitting diode can only reach the light conversion film through the corresponding defect channel. The problem of light crosstalk and light leakage of the light emitting diode is prevented, and the light utilization rate is further improved.
本申请实施例还提供了一种显示装置,包括上述显示面板,该显示装置可以应用于虚拟现实设备、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪、可穿戴手表、物联网节点等任何具有显示功能的产品或部件。由于该显示装置解决问题的原理与上述显示面板相似,因此该显示装置的实施可以参见上述显示面板的实施,重复之处不再赘述。The embodiment of the present application also provides a display device, including the above-mentioned display panel. The display device can be applied to virtual reality equipment, mobile phones, tablet computers, televisions, displays, notebook computers, digital photo frames, navigators, wearable watches, Any product or component with display function such as IoT node. Since the principle of solving the problems of the display device is similar to that of the above-mentioned display panel, the implementation of the display device can refer to the implementation of the above-mentioned display panel, and the repetition will not be repeated.
请参阅图6,本申请实施例还提供一种显示面板的制备方法。图6是本申请实施例提供的一种显示面板的制备方法的流程示意图。如图6所示,本申请实施例的显示面板的制备方法包括以下步骤:Please refer to FIG. 6, an embodiment of the present application also provides a method for manufacturing a display panel. FIG. 6 is a schematic flowchart of a method for manufacturing a display panel provided by an embodiment of the present application. As shown in FIG. 6, the manufacturing method of the display panel of the embodiment of the present application includes the following steps:
S10,提供绑定有发光二极管阵列的驱动背板;S10, providing a drive backplane bound with a light-emitting diode array;
S20,形成至少部分基色单元内部分布有多个中空空洞的光转换膜;S20, forming a light conversion film with a plurality of hollow cavities distributed in at least part of the primary color unit;
S30,将光转换膜与发光二极管阵列按照基色单元与发光二极管对应的方式进行对位贴合,以使由发光二极管阵列层出射的光线能够在光转换膜混合成白光出射。S30, aligning and bonding the light conversion film and the light emitting diode array in a manner corresponding to the primary color unit and the light emitting diode, so that the light emitted from the light emitting diode array layer can be mixed in the light conversion film into white light and emitted.
其中,步骤S20包括:Wherein, step S20 includes:
S21,在基底上涂覆光子晶体微球以形成基膜,按照预定的工序依次旋涂不同颜色的颜料至预定单元图案内,以使颜料渗透至光子晶体微球之间的间隙,以形成具有多种基色单元的彩色膜;S21, coating photonic crystal microspheres on a substrate to form a base film, and spin-coating pigments of different colors into a predetermined unit pattern according to a predetermined process, so that the pigment penetrates into the gap between the photonic crystal microspheres to form a Color films with multiple primary color units;
S22,去除彩色膜中的光子晶体微球,得到内部分布有多个中空空洞的包括多种基色单元的光转换膜。S22, removing the photonic crystal microspheres in the color film to obtain a light conversion film including multiple primary color units with a plurality of hollow cavities distributed inside.
进一步的,中空空洞包括球形的空气孔或者晶格结构的空气孔,该方法还包括:Further, the hollow cavity includes spherical air holes or air holes with a lattice structure, and the method further includes:
控制空气孔周围介质的折射率与空气孔的折射率的比值,使光转换膜出现完全光子带隙,令光转换膜具备反蛋白石结构。The ratio of the refractive index of the medium around the air hole to the refractive index of the air hole is controlled, so that the light conversion film has a complete photonic band gap, and the light conversion film has an inverse opal structure.
可选地,光子晶体微球为无机纳米微球。光子晶体微球的材料包括SiO 2、TiO 2、Al 2O 3、ZrO 2中的任意一种或多种 Optionally, the photonic crystal microspheres are inorganic nanometer microspheres. The material of the photonic crystal microspheres includes any one or more of SiO 2 , TiO 2 , Al 2 O 3 , and ZrO 2
根据本申请实施例提供的显示面板的制备方法,发光二极管出射的光到达分布有多个中空空洞的光转换膜后,分布有中空空洞的光转换膜能够改变光的原始路径,能够使发光二极管出射的光在其内发生多次反射折射,从而延长了光在光转换膜内的路径,使发光二极管出射的光在光转换膜内充分转换利用,阻止发光二极管出射的光未被转换前直接穿过该光转换膜。在实现彩色化的同时,能够减少发光二极管发出的光漏光,提高光的利用率。According to the manufacturing method of the display panel provided by the embodiment of the present application, after the light emitted by the light emitting diode reaches the light conversion film with a plurality of hollows, the light conversion film with the hollows can change the original path of the light and make the light emitting diode The emitted light is reflected and refracted multiple times in it, thereby extending the path of the light in the light conversion film, so that the light emitted by the light emitting diode is fully converted and utilized in the light conversion film, and the light emitted by the light emitting diode is prevented from being directly converted before being converted. Pass through the light conversion film. While realizing colorization, the light leakage from the light emitting diode can be reduced, and the light utilization rate can be improved.
请参阅图7a至图7e,在一些可选的实施例中,步骤S20包括:Referring to FIGS. 7a to 7e, in some optional embodiments, step S20 includes:
如图7a所示,在光子晶体微球形成的基膜80(该基膜设置在透光基底70上)上旋涂一层红色量子点光刻胶(负性胶),使其充满光子晶体微球间的缝隙,然后通过软烘、曝光、显影、cure等工艺,形成红色单元311。As shown in Figure 7a, a layer of red quantum dot photoresist (negative glue) is spin-coated on a base film 80 formed by photonic crystal microspheres (the base film is set on a transparent substrate 70) to fill the photonic crystal The gaps between the microspheres are then soft-baked, exposed, developed, cured, and other processes to form the red unit 311.
如图7b所示,在光子晶体微球形成的基膜80上旋涂一层绿色量子点光刻胶(负性胶),使其充满光子晶体微球间的缝隙,然后通过软烘、曝光、显影、cure等工艺,形成绿色单元312。As shown in Figure 7b, a layer of green quantum dot photoresist (negative glue) is spin-coated on the base film 80 formed by photonic crystal microspheres to fill the gaps between the photonic crystal microspheres, and then through soft baking and exposure , Developing, cure and other processes to form the green unit 312.
如图7c所示,利用腐蚀剂(例如碱)去除光子晶体微球,然后清洗、干燥,形成分布有多个中空空洞32的红色单元311和绿色单元312,该红色单元311和绿色单元312具有反蛋白石结构,光子禁带落在蓝光区域。As shown in FIG. 7c, the photonic crystal microspheres are removed by an etchant (such as alkali), then washed and dried to form a red unit 311 and a green unit 312 distributed with a plurality of hollow cavities 32. The red unit 311 and the green unit 312 have reverse With opal structure, the photonic band gap falls in the blue region.
如图7d所示,在透光基底70上旋涂一层透明光刻胶(负性胶),然后通过软烘、曝光、显影、cure等工艺,形成蓝色单元313,得到的光转换膜30具有多个基色单元。As shown in Figure 7d, a layer of transparent photoresist (negative adhesive) is spin-coated on the light-transmitting substrate 70, and then the blue unit 313 is formed through processes such as soft baking, exposure, development, and cure, and the resulting light conversion film 30 has multiple primary color units.
如图7e所示,在基色单元间填充黑矩阵材料,形成光阻挡层50,以减少像素间的光串扰。As shown in FIG. 7e, a black matrix material is filled between the primary color cells to form a light blocking layer 50 to reduce light crosstalk between pixels.
可选择的,在S30之前,所述方法还可以包括:形成具有多个缺陷通道的光子晶体准直层;将光子晶体准直层与发光二极管阵列层进行对位贴合,使得每个发光二极管出射的光通过对应的缺陷通道到达光转换膜。Optionally, before S30, the method may further include: forming a photonic crystal collimating layer with multiple defect channels; aligning the photonic crystal collimating layer with the light emitting diode array layer, so that each light emitting diode The emitted light reaches the light conversion film through the corresponding defect channel.
发光二极管的发光方向具有非各向异性,本申请制备光子晶体准直层,使发光二极管出射光的频率在光子晶体准直层的光子禁带内,光子晶体准直层禁止发光二极管出射的光直接穿过该光子晶体准直层,而是使每个发光二极管出射的光只能通过对应的缺陷通道到达光转换膜。防止发光二极管的光串扰、漏光的问题,提高了光的利用率。The light-emitting direction of the light-emitting diode is non-anisotropic. The photonic crystal collimation layer is prepared in this application, so that the frequency of the light emitted by the light-emitting diode is within the photonic forbidden band of the photonic crystal collimation layer, and the photonic crystal collimation layer prohibits the light emitted by the light-emitting diode It directly passes through the photonic crystal collimation layer, but the light emitted by each light emitting diode can only reach the light conversion film through the corresponding defect channel. The problem of light crosstalk and light leakage of the light emitting diode is prevented, and the light utilization rate is improved.
具体地请参阅图8a至图8c,光子晶体准直层制备的流程包括以下步骤:Specifically, referring to FIGS. 8a to 8c, the process of preparing the photonic crystal collimation layer includes the following steps:
如图8a所示,在驱动背板10上旋涂一层厚光刻胶,图形化光刻胶形成挡墙40,挡墙40限定出多个容纳部,容纳部呈倒梯形结构,并将挡墙侧壁的表面进行粗化;然后通过热蒸镀或者Sputter工艺在挡墙侧壁形成一层金属反射层(例如,Al、Ag等);再通过选择性刻蚀掉驱动背板阴阳极之间的金属,以防LED芯片工作时短路。As shown in Figure 8a, a layer of thick photoresist is spin-coated on the drive backplane 10, and the patterned photoresist forms a retaining wall 40. The retaining wall 40 defines a plurality of accommodating parts, which are in an inverted trapezoidal structure, and The surface of the side wall of the retaining wall is roughened; then a metal reflective layer (for example, Al, Ag, etc.) is formed on the side wall of the retaining wall by thermal evaporation or Sputter process; then the cathode and anode of the driving back plate are selectively etched Between the metal to prevent short circuit when the LED chip is working.
如图8b所示,利用巨量转移技术将LED芯片30与驱动背板10进行邦定(bonding)键合,实现电学连接。As shown in FIG. 8b, the LED chip 30 and the driving backplane 10 are bonded by using the mass transfer technology to realize electrical connection.
如图8c所示,将具有多个缺陷微腔61的光子晶体准层60与LED芯 片进行对位贴合,使LED芯片发射的光沿着缺陷微腔进行出射。As shown in Fig. 8c, the photonic crystal quasi-layer 60 with a plurality of defective microcavities 61 is aligned and bonded to the LED chip, so that the light emitted by the LED chip is emitted along the defective microcavity.
本申请可以以其他的具体形式实现,而不脱离其精神和本质特征。因此,当前的实施例在所有方面都被看作是示例性的而非限定性的,本申请的范围由所附权利要求而非上述描述定义,并且,落入权利要求的含义和等同物的范围内的全部改变从而都被包括在本申请的范围之中。并且,在不同实施例中出现的不同技术特征可以进行组合,以取得有益效果。本领域技术人员在研究附图、说明书及权利要求书的基础上,应能理解并实现所揭示的实施例的其他变化的实施例。This application can be implemented in other specific forms without departing from its spirit and essential characteristics. Therefore, the current embodiments are regarded as illustrative rather than restrictive in all aspects, and the scope of this application is defined by the appended claims rather than the foregoing description, and falls within the meaning and equivalents of the claims. All changes within the scope are thus included in the scope of this application. Moreover, different technical features appearing in different embodiments can be combined to achieve beneficial effects. Those skilled in the art should be able to understand and implement other modified embodiments of the disclosed embodiments on the basis of studying the drawings, description, and claims.

Claims (17)

  1. 一种显示面板,包括:A display panel including:
    驱动背板;Drive backplane
    发光二极管阵列层,位于所述驱动背板上,所述发光二极管阵列层包括多个发光二极管;The light emitting diode array layer is located on the driving backplane, and the light emitting diode array layer includes a plurality of light emitting diodes;
    挡墙,位于所述驱动背板上,所述挡墙限定出多个容纳部,所述容纳部用于容纳所述发光二极管;A retaining wall is located on the drive backplane, the retaining wall defines a plurality of accommodating parts, and the accommodating parts are used to accommodate the light-emitting diodes;
    光转换膜,设置于所述发光二极管阵列层远离所述驱动背板的一侧,所述光转换膜包括多个基色单元,各所述基色单元通过光阻挡层隔离,所述基色单元与所述发光二极管对应设置,由所述发光二极管阵列层出射的光线能够在所述光转换膜混合成白光,其中,至少部分所述基色单元中分布有多个中空空洞。The light conversion film is arranged on the side of the light emitting diode array layer away from the driving backplane, the light conversion film includes a plurality of primary color units, each of the primary color units is isolated by a light blocking layer, and the primary color unit is The light-emitting diodes are arranged correspondingly, and the light emitted from the light-emitting diode array layer can be mixed into white light in the light conversion film, wherein at least part of the primary color units are distributed with a plurality of hollow holes.
  2. 根据权利要求1所述的显示面板,其中,所述光转换膜具有反蛋白石结构,所述中空空洞为球形的空气孔或者晶格结构的空气孔。The display panel of claim 1, wherein the light conversion film has an inverse opal structure, and the hollow cavity is a spherical air hole or a lattice structure air hole.
  3. 根据权利要求1所述的显示面板,其中,所述发光二极管阵列为蓝光发光二极管阵列,对应的所述光转换膜的所述基色单元分别为红色单元、绿色单元及透明单元;所述红色单元和所述绿色单元均分布有多个所述中空空洞,其中,所述红色单元包括用于产生红光的光致发光材料,所述绿色单元包括用于产生绿光的光致发光材料,所述透明单元包括透明材料或者所述透明单元为中空结构。4. The display panel of claim 1, wherein the light emitting diode array is a blue light emitting diode array, and the primary color units of the corresponding light conversion film are red units, green units, and transparent units, respectively; the red unit And the green cell are both distributed with a plurality of said hollow holes, wherein the red cell includes a photoluminescent material for generating red light, the green cell includes a photoluminescent material for generating green light, so The transparent unit includes a transparent material or the transparent unit has a hollow structure.
  4. 根据权利要求1所述的显示面板,其中,所述发光二极管阵列为紫外光发光二极管阵列,对应的所述光转换膜的所述基色单元分别为红色单元、绿色单元及蓝色单元;所述红色单元、绿色单元及蓝色单元均分布有多个所述中空空洞,其中,所述红色单元包括用于产生红光的光致发光材料,所述绿色单元包括用于产生绿光的光致发光材料,所述蓝色单元包括用于产生蓝光的光致发光材料。3. The display panel of claim 1, wherein the light emitting diode array is an ultraviolet light emitting diode array, and the primary color units of the corresponding light conversion film are red units, green units, and blue units, respectively; The red unit, the green unit and the blue unit are all distributed with a plurality of the hollow holes, wherein the red unit includes a photoluminescent material for generating red light, and the green unit includes a photoluminescent material for generating green light. Luminescent material, the blue unit includes a photoluminescent material for producing blue light.
  5. 根据权利要求3或4所述的显示面板,其中,所述光致发光材料包括量子点与光刻胶混合形成的材料,或者,所述光致发光材料包括有机光致发光材料与光刻胶形成的材料;The display panel according to claim 3 or 4, wherein the photoluminescence material comprises a material formed by mixing quantum dots and photoresist, or the photoluminescence material comprises an organic photoluminescence material and photoresist Formed material
    其中,所述光刻胶为负性胶。Wherein, the photoresist is a negative glue.
  6. 根据权利要求1所述的显示面板,其中,所述光转换膜由多个重复单元在透光基底上按照预定的规律重复排列形成,各所述重复单元至少包括第一基色单元、第二基色单元及第三基色单元。The display panel according to claim 1, wherein the light conversion film is formed by repeatedly arranging a plurality of repeating units on a light-transmitting substrate according to a predetermined rule, and each repeating unit includes at least a first primary color unit and a second primary color unit. Unit and the third primary color unit.
  7. 根据权利要求1所述的显示面板,其中,每个所述基色单元至少对应一个所述发光二极管,多个所述发光二极管呈正矩阵排列,对应的多个所述基色单元呈正矩阵排列。2. The display panel of claim 1, wherein each of the primary color units corresponds to at least one light emitting diode, a plurality of the light emitting diodes are arranged in a positive matrix, and the corresponding plurality of primary color units are arranged in a positive matrix.
  8. 根据权利要求1所述的显示面板,其中,每个所述基色单元至少对应一个所述发光二极管,多个所述发光二极管呈斜矩阵排列,对应的多个所述基色单元呈斜矩阵排列。3. The display panel of claim 1, wherein each of the primary color units corresponds to at least one light emitting diode, a plurality of the light emitting diodes are arranged in an oblique matrix, and the corresponding plurality of primary color units are arranged in an oblique matrix.
  9. 根据权利要求1所述的显示面板,其中,所述显示面板还包括:The display panel of claim 1, wherein the display panel further comprises:
    光子晶体准直层,位于所述发光二极管阵列层和所述光转换膜之间,所述光子晶体准直层具有多个缺陷通道,所述多个缺陷通道垂直于所述驱动背板,每个所述发光二极管出射的光通过对应的缺陷通道到达所述光转换膜。The photonic crystal collimation layer is located between the light-emitting diode array layer and the light conversion film. The photonic crystal collimation layer has a plurality of defect channels, and the plurality of defect channels are perpendicular to the drive backplane. The light emitted by each of the light-emitting diodes reaches the light conversion film through the corresponding defect channel.
  10. 根据权利要求1所述的显示面板,其中,所述容纳部呈倒梯形结构;The display panel according to claim 1, wherein the receiving portion has an inverted trapezoidal structure;
    所述挡墙的侧壁至少在朝向所述容纳部的表面上形成有反射层,所述反射层朝向所述容纳部的表面为粗化表面。A reflective layer is formed on the side wall of the retaining wall at least on the surface facing the receiving portion, and the surface of the reflective layer facing the receiving portion is a roughened surface.
  11. 根据权利要求1所述的显示面板,其中,所述显示面板还包括:The display panel of claim 1, wherein the display panel further comprises:
    透光基底,位于所述光转换膜上。The transparent substrate is located on the light conversion film.
  12. 根据权利要求1-11任一项所述的显示面板,其中,所述发光二极管包括微发光二极管。The display panel according to any one of claims 1-11, wherein the light emitting diode comprises a micro light emitting diode.
  13. 一种显示装置,其中,包括如权利要求1-12任一项所述的显示面板。A display device comprising the display panel according to any one of claims 1-12.
  14. 一种显示面板的制备方法,包括:A method for manufacturing a display panel includes:
    提供绑定有发光二极管阵列的驱动背板;Provide a drive backplane bound with a light-emitting diode array;
    形成至少部分基色单元内部分布有多个中空空洞的光转换膜;Forming a light conversion film with a plurality of hollow cavities distributed in at least part of the primary color unit;
    将所述光转换膜与所述发光二极管阵列按照基色单元与发光二极管相对应的方式进行对位贴合,以使由所述发光二极管阵列层出射的光线能够在所述光转换膜混合成白光出射;The light conversion film and the light-emitting diode array are aligned and bonded in such a way that the primary color unit corresponds to the light-emitting diode, so that the light emitted from the light-emitting diode array layer can be mixed into white light in the light conversion film Shoot out
    其中,所述形成至少部分基色单元内部分布有多个中空空洞的光转换膜,包括:Wherein, the formation of a light conversion film with a plurality of hollow cavities distributed in at least part of the primary color unit includes:
    在透光基底上涂覆光子晶体微球以形成基膜,按照预定的工序依次旋涂不同颜色的颜料至预定单元图案内,以使所述颜料渗透至所述光子晶体微球之间的间隙,以形成具有多种基色单元的彩色膜;Coating photonic crystal microspheres on a light-transmitting substrate to form a base film, and spin-coating pigments of different colors into a predetermined unit pattern according to a predetermined process, so that the pigment can penetrate into the gap between the photonic crystal microspheres , To form a color film with multiple primary color units;
    去除所述彩色膜中的光子晶体微球,得到内部分布有多个中空空洞的包括多种基色单元的光转换膜。The photonic crystal microspheres in the color film are removed to obtain a light conversion film including multiple primary color units with a plurality of hollow cavities distributed inside.
  15. 根据权利要求14所述的显示面板的制备方法,其中,在所述将所述光转换膜与所述发光二极管阵列进行对位贴合之前,所述方法还包括:14. The method for manufacturing a display panel according to claim 14, wherein, before the alignment and bonding of the light conversion film and the light emitting diode array, the method further comprises:
    形成具有多个缺陷通道的光子晶体准直层;Forming a photonic crystal collimation layer with multiple defect channels;
    将所述光子晶体准直层与所述发光二极管阵列层进行对位贴合,使得每个所述发光二极管出射的光通过对应的缺陷通道到达所述光转换膜。The photonic crystal collimation layer and the light emitting diode array layer are aligned and bonded, so that the light emitted by each light emitting diode reaches the light conversion film through a corresponding defect channel.
  16. 根据权利要求14所述的显示面板的制备方法,其中,所述中空空洞包括球形的空气孔或者晶格结构的空气孔,所述方法还包括:14. The method of manufacturing a display panel according to claim 14, wherein the hollow cavity comprises spherical air holes or lattice structure air holes, and the method further comprises:
    控制所述空气孔周围介质的折射率与所述空气孔的折射率的比值,使所述光转换膜出现完全光子带隙,令所述光转换膜具备反蛋白石结构。The ratio of the refractive index of the medium around the air hole to the refractive index of the air hole is controlled so that the light conversion film has a complete photonic band gap, so that the light conversion film has an inverse opal structure.
  17. 根据权利要求14所述的显示面板的制备方法,其中,所述光子晶体微球为无机纳米微球,所述光子晶体微球的材料包括SiO 2、TiO 2、Al 2O 3、ZrO 2中的任意一种或多种。 The method for manufacturing a display panel according to claim 14, wherein the photonic crystal microspheres are inorganic nanometer microspheres, and the material of the photonic crystal microspheres includes SiO 2 , TiO 2 , Al 2 O 3 , and ZrO 2 Any one or more of.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113990997A (en) * 2021-10-09 2022-01-28 武汉华星光电半导体显示技术有限公司 Display panel and preparation method thereof
WO2023089565A1 (en) * 2021-11-18 2023-05-25 Hyperlume, Inc. Micro-led display co-packaged with optics and method of fabrication

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112885823B (en) * 2021-01-18 2024-04-16 深圳市华星光电半导体显示技术有限公司 Display panel, preparation method thereof and display device
CN113659058B (en) * 2021-08-20 2023-10-20 京东方科技集团股份有限公司 Light-emitting device, preparation method thereof and display device
CN114122297A (en) * 2021-11-30 2022-03-01 京东方科技集团股份有限公司 Display panel and display device
CN115483327B (en) * 2022-11-09 2023-03-24 镭昱光电科技(苏州)有限公司 Micro LED Micro display chip and manufacturing method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001233611A (en) * 2000-02-24 2001-08-28 Catalysts & Chem Ind Co Ltd Silica-based microparticle, method for producing dispersion with the same, and base material with coating film
CN1860828A (en) * 2003-10-01 2006-11-08 出光兴产株式会社 Color conversion layer and light-emitting element
US20150171372A1 (en) * 2012-07-04 2015-06-18 Sharp Kabushiki Kaisha Fluorescent material, fluorescent coating material, phosphor substrate, electronic apparatus, and led package
CN107195654A (en) * 2017-06-02 2017-09-22 南京迈智芯微光电科技有限公司 A kind of full-color semiconductor light emitting micro-display and its manufacturing process

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006013055A1 (en) * 2006-03-22 2007-09-27 Merck Patent Gmbh Gas-phase infiltration of phosphors into the pore system of inverse opals
US8415691B2 (en) * 2008-08-18 2013-04-09 Tsmc Solid State Lighting Ltd. Omnidirectional reflector
CN103456764B (en) * 2013-09-09 2016-01-20 京东方科技集团股份有限公司 OLED array and manufacture method, display unit
US10442987B2 (en) * 2017-08-31 2019-10-15 Nichia Corporation Fluorescent member, optical component, and light emitting device
KR102476136B1 (en) * 2017-09-05 2022-12-09 삼성전자주식회사 Display device using light emitting diode
CN107705713B (en) * 2017-10-13 2019-12-27 上海天马微电子有限公司 Display panel and display device
CN108615822A (en) * 2018-04-28 2018-10-02 武汉华星光电半导体显示技术有限公司 Flexible OLED display panel and preparation method thereof, display device
CN109004078B (en) * 2018-07-27 2020-08-25 上海天马微电子有限公司 Miniature LED display panel, manufacturing method thereof and display device
CN108807719A (en) * 2018-09-04 2018-11-13 京东方科技集团股份有限公司 Oled display substrate, display device and preparation method thereof
TWI683157B (en) * 2018-10-19 2020-01-21 友達光電股份有限公司 Display panel and manufacturing method thereof
CN109541813B (en) * 2019-01-03 2022-05-24 京东方科技集团股份有限公司 Display substrate, display device and display method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001233611A (en) * 2000-02-24 2001-08-28 Catalysts & Chem Ind Co Ltd Silica-based microparticle, method for producing dispersion with the same, and base material with coating film
CN1860828A (en) * 2003-10-01 2006-11-08 出光兴产株式会社 Color conversion layer and light-emitting element
US20150171372A1 (en) * 2012-07-04 2015-06-18 Sharp Kabushiki Kaisha Fluorescent material, fluorescent coating material, phosphor substrate, electronic apparatus, and led package
CN107195654A (en) * 2017-06-02 2017-09-22 南京迈智芯微光电科技有限公司 A kind of full-color semiconductor light emitting micro-display and its manufacturing process

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113990997A (en) * 2021-10-09 2022-01-28 武汉华星光电半导体显示技术有限公司 Display panel and preparation method thereof
WO2023089565A1 (en) * 2021-11-18 2023-05-25 Hyperlume, Inc. Micro-led display co-packaged with optics and method of fabrication

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