WO2021124922A1 - Dispositif de conversion de puissance électrique - Google Patents

Dispositif de conversion de puissance électrique Download PDF

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Publication number
WO2021124922A1
WO2021124922A1 PCT/JP2020/045175 JP2020045175W WO2021124922A1 WO 2021124922 A1 WO2021124922 A1 WO 2021124922A1 JP 2020045175 W JP2020045175 W JP 2020045175W WO 2021124922 A1 WO2021124922 A1 WO 2021124922A1
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WO
WIPO (PCT)
Prior art keywords
flow path
heat radiation
recess
power module
radiation surface
Prior art date
Application number
PCT/JP2020/045175
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English (en)
Japanese (ja)
Inventor
志村　隆弘
祥一 堺
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日立Astemo株式会社
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Publication of WO2021124922A1 publication Critical patent/WO2021124922A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode

Definitions

  • the present invention relates to a power conversion device, and particularly to a power conversion device including a plurality of circuits.
  • Patent Document 1 Conventionally, as such a technical field, for example, there is one described in Patent Document 1.
  • the power conversion device described in Patent Document 1 includes three power semiconductor modules as a circuit body, and the three power semiconductor modules are linearly arranged. Inside the power conversion device, a cooling flow path for cooling the power semiconductor module is provided so as to extend in the arrangement direction of the power semiconductor modules (that is, the longitudinal direction of the power conversion device). Then, the refrigerant sequentially cools each power semiconductor module along the cooling flow path to protect the power semiconductor module from heat.
  • the present invention has been made to solve such a technical problem, and an object of the present invention is to provide a power conversion device capable of miniaturization while ensuring cooling performance.
  • the power conversion device has a first circuit body having a first heat radiation surface, a second circuit body having a second heat radiation surface parallel to the first heat radiation surface, and a second circuit body facing the first heat radiation surface.
  • a first flow path having one facing wall and a second facing wall facing the second heat radiating surface, and a refrigerant flowing between the first facing wall and the first heat radiating surface, and the second facing wall.
  • the first circuit body and the flow path forming body to which the second circuit body is attached are provided so that a second flow path through which the refrigerant flows is formed between the second heat radiation surface and the second heat radiation surface.
  • the second circuit body overlaps the first circuit body in the normal direction of the first heat radiation surface so that the second heat radiation surface faces the first heat radiation surface, and the normal line of the first heat radiation surface.
  • the first flow path and the second flow path are arranged at positions shifted in a direction orthogonal to the direction, and the first flow path and the second flow path are communicated by a communication flow path portion formed between them, and are viewed from the normal direction of the first heat radiation surface.
  • the communication flow path portion is characterized in that it overlaps a part of the first heat radiation surface and a part of the second heat radiation surface, respectively.
  • the second circuit body overlaps the first circuit body in the normal direction of the first heat radiation surface so that the second heat radiation surface faces the first heat radiation surface, and the first heat radiation surface. Since they are arranged at positions that are offset in the direction orthogonal to the normal direction of the surface, the normals are compared with the case where the first and second circuits are arranged in a straight line in the direction orthogonal to the normal direction. The dimensions in the direction orthogonal to the direction can be reduced.
  • the refrigerant flows between the first facing wall of the flow path forming body and the first heat radiating surface, and the refrigerant flows between the second facing wall of the flow path forming body and the second heat radiating surface.
  • each of the second flow paths to flow is formed, it is possible to form a flow path through which the refrigerant flows by using a part of the flow path forming body. In this way, even if the first circuit body and the second circuit body are overlapped in the normal direction of the first heat radiation surface, it is possible to suppress an increase in the dimensions in the normal direction, and the height of the power conversion device is reduced. It becomes possible to plan.
  • the communication flow path portion overlaps a part of the first heat radiation surface and a part of the second heat radiation surface, respectively, so that a part of the first heat radiation surface Since the refrigerant flow path can be substituted by a part of the second heat radiation surface, the refrigerant flow path of the power conversion device can be shortened and the pressure loss can be reduced. Further, since the second circuit body is arranged at a position deviated from the first circuit body in the direction orthogonal to the normal direction of the first heat radiation surface, the refrigerant is placed in the first flow path and the second flow path. It flows sequentially, and the cooling performance of the circuit body can be ensured. As a result, the cooling performance of the power conversion device can be maintained, and the dimensions of the entire power conversion device can be reduced.
  • FIG. 1 is a perspective view showing the power conversion device according to the first embodiment
  • FIG. 2 is an exploded perspective view showing the power conversion device according to the first embodiment
  • FIG. 3 is an exploded perspective view showing the power conversion device according to the first embodiment. It is sectional drawing which shows the apparatus.
  • the power conversion device 10 of the present embodiment is, for example, a device mounted on an electric vehicle and used to convert DC power supplied from a battery into AC power to drive a motor or the like.
  • the power converter 10 has a substantially rectangular shape, and has a first power module (first circuit body) 101A, a second power module (second circuit body) 101B, and a third power module (third circuit body). ) 101C and an accommodating body 100 accommodating these three power modules.
  • the first power module 101A, the second power module 101B, and the third power module 101C each have a structure having two heat dissipation surfaces, that is, these power modules adopt a double-sided cooling system. Since the first power module 101A, the second power module 101B, and the third power module 101C have the same structure, the second power module 101B will be described here with reference to FIGS. 4 and 5.
  • the second power module 101B has a rectangular tubular shape that surrounds the circuit unit 200 having a plurality of power semiconductor elements and terminals and exposes the terminals of the circuit unit 200 to the outside. It has a frame body 201, a first heat radiating plate 202 that closes one opening of the frame body 201, and a second heat radiating plate 203 that closes the other opening of the frame body 201.
  • the first heat radiating plate 202 and the second heat radiating plate 203 are fitted inside the frame body 201 and a stepped portion provided inside the frame body 201 so as to ensure watertightness between the first heat radiating plate 202 and the second heat radiating plate 203, respectively. Is supported by.
  • the frame body 201 is provided with peripheral grooves 201A for accommodating the ring-shaped seal member 104 on one opening side and the other opening side, respectively. Further, one of the peripheral walls of the frame body 201 is provided with an opening 201B in order to expose the terminals of the circuit unit 200 to the outside. Further, among the peripheral walls of the frame body 201, the pair of peripheral walls facing each other are provided with a plurality of through holes 201C extending in the height direction of the frame body 201 (two each in the present embodiment). These through holes 201C have a structure that plays a role of circulating a refrigerant.
  • the first heat radiating plate 202 and the second heat radiating plate 203 are formed in a flat plate shape by a material having good thermal conductivity, for example, aluminum or copper.
  • a plurality of heat radiation fins 204 are provided on the outer surface 202A of the first heat radiation plate 202. Each of these heat radiation fins 204 is formed in a pin shape and is evenly arranged on the outer surface 202A of the first heat radiation plate 202 according to a predetermined regularity.
  • a plurality of heat radiation fins 205 are provided on the outer surface 203A of the second heat radiation plate 203.
  • the plurality of heat radiation fins 205 are each formed in a pin shape and are evenly arranged on the outer surface 203A of the second heat radiation plate 203 according to a predetermined regularity.
  • the heat radiation fins 204 and 205 do not necessarily have to be evenly arranged according to a predetermined regularity, and the arrangement may be appropriately changed as necessary.
  • the circuit unit 200 contains a power semiconductor element, a diode, and the like.
  • the circuit unit 200 is housed in the frame body 201 via a pair of upper and lower insulating sheets 206 in a state of being sealed in the resin sealing body 207. Therefore, in the state of being housed in the frame body 201, the circuit unit 200 is insulated from the first heat radiating plate 202 and the second heat radiating plate 203 by a pair of insulating sheets 206 in addition to the resin sealing body 207.
  • the power semiconductor element of the circuit unit 200 has an emitter electrode and a collector electrode.
  • the circuit unit 200 shown in FIG. 4 is viewed from the collector electrode side
  • the circuit unit 200 shown in FIG. 5 is viewed from the emitter electrode side.
  • the upper arm control terminal 327U is formed of a conductive material and is electrically connected to the power semiconductor element 328 via, for example, a metal wire.
  • the lower arm control terminal 327L is made of a conductive material and is electrically connected to the power semiconductor element 330 via, for example, a metal wire.
  • the DC positive electrode terminal 200A may be formed integrally with the upper arm base plate 315, or may be formed separately from the upper arm base plate 315 and electrically connected to the upper arm base plate 315 by soldering or the like. good.
  • the AC terminal 200C may be formed integrally with the lower arm base plate 320, may be formed separately from the lower arm base plate 320, and may be electrically connected to the lower arm base plate 320 by soldering or the like. You may.
  • the DC negative electrode terminal 200B may be formed integrally with the N plate 319, or may be formed separately from the N plate 319 and electrically connected to the N plate 319 by soldering or the like. In the present embodiment, the DC negative electrode terminal 200B is formed separately from the N plate 319, and is electrically connected to the N plate connecting portion 319A of the N plate 319.
  • the DC positive electrode terminal 200A, the DC negative electrode terminal 200B, and the AC terminal 200C are each made of a conductive material.
  • the upper arm base plate 315 is made of a conductive material and is electrically connected to the power semiconductor element 328 and the diode 256.
  • the lower arm base plate 320 is made of a conductive material and is electrically connected to the power semiconductor element 330 and the diode 266.
  • the AC plate 318 is formed of a conductive material, and is electrically connected to the power semiconductor element 328 and the diode 256 on the surface facing the upper arm base plate 315.
  • the AC plate connecting portion 318A is electrically connected to the lower arm base plate 320 by soldering or the like at a portion where the lower arm base plate 320 and the plate surface overlap when viewed in a direction orthogonal to the plate surface.
  • the N plate 319 is formed of a conductive material, and is electrically connected to the power semiconductor element 330 and the diode 266 on a surface facing the lower arm base plate 320.
  • the power semiconductor element 328 may be one or more, and is sandwiched between the upper arm base plate 315 and the AC plate 318, and both sides thereof are electrically connected by soldering or the like.
  • the power semiconductor element 330 may be one or more, and is sandwiched between the lower arm base plate 320 and the N plate 319, and both sides thereof are electrically connected by soldering or the like.
  • the diode 256 may be one or more, and is sandwiched between the upper arm base plate 315 and the AC plate 318, and both sides thereof are electrically connected by soldering or the like.
  • the diode 266 may be one or more, and is sandwiched between the lower arm base plate 320 and the N plate 319, and both sides thereof are electrically connected by soldering or the like.
  • the accommodating body 100 has a flow path forming body 102 having a plurality of (here, three) recesses, an upper cover 103A covering the upper opening of the flow path forming body 102, and a lower opening of the flow path forming body 102. It has a lower cover 103B to cover.
  • FIG. 6 is a cross-sectional view showing a flow path forming body.
  • the flow path forming body 102 is recessed from, for example, one main surface (here, the lower main surface) of the plate member toward the other main surface (here, the upper main surface).
  • a second recess located between a pair of left and right recesses (first recess 106 and third recess 108), the first recess 106 and the third recess 108, and recessed from the other main surface toward one main surface. It has 107 and. That is, the first recess 106 and the third recess 108 are arranged symmetrically with respect to the central axis of the flow path forming body 102 and are opened in the same direction.
  • the second recess 107 is located between the first recess 106 and the third recess 108, and opens in the direction opposite to the first recess 106 and the third recess 108.
  • the first recess 106 when viewed from the height direction of the flow path forming body 102, the first recess 106 partially overlaps with the second recess 107, and the third recess 108 also partially overlaps with the second recess 107. It is formed so as to overlap. Then, in the portion where the first recess 106 and the second recess 107 overlap, the first recess 106 and the second recess 107 communicate with each other. Similarly, in the portion where the third recess 108 and the second recess 107 overlap, the third recess 108 and the second recess 107 communicate with each other.
  • the flow path forming body 102 is provided with a refrigerant inlet 102A and a refrigerant outlet 102B.
  • the refrigerant inlet 102A is arranged on the side adjacent to the first recess 106, for example, and communicates with the first recess 106.
  • the refrigerant outlet 102B is arranged on the side adjacent to, for example, the third recess 108, and communicates with the third recess 108.
  • the refrigerant flows into the flow path forming body 102 through the refrigerant inlet 102A, sequentially passes through the first recess 106, the second recess 107, and the third recess 108, and further flows out through the refrigerant outlet 102B.
  • the flow direction of the refrigerant in the flow path forming body 102 is the longitudinal direction of the flow path forming body 102.
  • the first recess 106 has a space in which a part of the first power module 101A can be inserted, more specifically, a space in which the heat radiation fin 204 of the first power module 101A is inserted.
  • the second recess 107 has a space into which a part of the second power module 101B can be inserted, more specifically, a space into which the heat radiation fins 204 of the second power module 101B are inserted.
  • the third recess 108 has a space into which a part of the third power module 101C can be inserted, more specifically, a space into which the heat radiation fins 204 of the third power module 101C are inserted.
  • the upper cover 103A is presented in a flat plate shape and is fixed to the flow path forming body 102 by a plurality of screws 105 so as to close the opening of the second recess 107.
  • the lower cover 103B is presented in a flat plate shape, and is fixed to the flow path forming body 102 by a plurality of screws 105 so as to close the opening of the first recess 106 and the opening of the third recess 108.
  • the first power module 101A is attached to the flow path forming body 102 so that the emitter electrode side of the power semiconductor elements 328 and 330 faces the first flow path 120 and the collector electrode side faces the fourth flow path 121. .. More specifically, the first power module 101A is inserted into the first recess 106 so that the outer surface 202A of the first heat radiation plate 202 faces the bottom of the first recess 106, and the flow path forming body 102 and the lower side thereof. It is sandwiched by the cover 103B (see FIG. 3).
  • the first power module 101A by arranging the first power module 101A so that the emitter electrode side of the power semiconductor elements 328 and 330 faces the first flow path 120, the effect of improving the heat dissipation of the emitter electrode can be expected. Further, since the collector electrode side faces the fourth flow path 121, the heat dissipation of the collector electrode can be ensured.
  • the second power module 101B is attached to the flow path forming body 102 so that the emitter electrode side of the power semiconductor elements 328 and 330 faces the second flow path 122 and the collector electrode side faces the fifth flow path 123.
  • the second power module 101B is inserted into the second recess 107 so that the outer surface 202A of the first heat radiation plate 202 faces the bottom of the second recess 107, and the flow path forming body 102 and the upper cover are covered. It is sandwiched by 103A.
  • the third power module 101C is attached to the flow path forming body 102 so that the emitter electrode side of the power semiconductor elements 328 and 330 faces the third flow path 124 and the collector electrode side faces the sixth flow path 125. .. More specifically, the third power module 101C is inserted into the third recess 108 so that the outer surface 202A of the first heat radiation plate 202 faces the bottom of the third recess 108, and the flow path forming body 102 and the lower side thereof. It is sandwiched by the cover 103B. As described above, by arranging the third power module 101C so that the emitter electrode side of the power semiconductor elements 328 and 330 faces the third flow path 124, the effect of improving the heat dissipation of the emitter electrode can be expected. Further, since the collector electrode side faces the sixth flow path 125, the heat dissipation of the collector electrode can be ensured.
  • the outer surface 202A of the first heat radiating plate 202 constitutes the upper heat radiating surface 110A of the first power module 101A, and is outside the second heat radiating plate 203.
  • the surface 203A constitutes the lower heat dissipation surface 110B of the first power module 101A.
  • the outer surface 202A of the first heat radiating plate 202 constitutes the lower heat radiating surface 110C of the second power module 101B, and the outer surface 203A of the second heat radiating plate 203. Consists of the upper heat dissipation surface 110D of the second power module 101B.
  • the outer surface 202A of the first heat radiating plate 202 constitutes the upper heat radiating surface 110E of the third power module 101C, and the outer surface of the second heat radiating plate 203 is formed.
  • the 203A constitutes the lower heat dissipation surface 110F of the third power module 101C.
  • the upper heat radiation surface 110A of the first power module 101A is the "first heat radiation surface” described in the claims
  • the lower heat radiation surface 110C of the second power module 101B is the “second heat radiation surface” described in the claims.
  • “Surface” the upper heat radiation surface 110E of the third power module 101C corresponds to the "third heat radiation surface” described in the claims.
  • the upper heat radiating surface 110A of the first power module 101A is The upper heat radiating surface 110E of the third power module 101C faces parallel to the lower heat radiating surface 110C of the second power module 101B, and the upper heat radiating surface 110E of the third power module 101B faces parallel to the lower heat radiating surface 110C of the second power module 101B. It has become like.
  • the second power module 101B is the first with respect to the first power module 101A.
  • the power module 101A overlaps in the normal direction of the upper heat radiation surface 110A (in other words, the height direction of the flow path forming body 102) and is orthogonal to the normal direction of the upper heat radiation surface 110A (in other words, the flow path forming body). They are arranged at offset positions in the longitudinal direction of 102).
  • the first recess 106 when viewed from the height direction of the flow path forming body 102, the first recess 106 partially overlaps with the second recess 107, so that the heat radiation fin 204 becomes the second recess 107.
  • the heat radiation fin 204 overlaps with a part of the first power module 101A inserted in the first recess 106.
  • the third recess 108 when viewed from the height direction of the flow path forming body 102, the third recess 108 also partially overlaps the second recess 107, so that the second power module 101B in which the heat radiation fin 204 is inserted into the second recess 107 Overlaps a part of the third power module 101C in which the heat radiation fin 204 is inserted into the third recess 108.
  • the bottom portion of the first recess 106 faces the upper heat radiation surface 110A of the first power module 101A in which the heat radiation fin 204 is inserted into the first recess 106, so that the flow path forming body 102
  • the first facing wall 102C is formed. Since the heat radiation fin 204 faces the lower heat radiation surface 110C of the second power module 101B inserted in the second recess 107, the bottom portion of the second recess 107 forms the second facing wall 102D of the flow path forming body 102. ..
  • the bottom portion of the third recess 108 faces the upper heat radiation surface 110E of the third power module 101C in which the heat radiation fin 204 is inserted into the third recess 108, the third facing wall 102E of the flow path forming body 102 is formed. To do.
  • a first flow path 120 through which the refrigerant flows is formed between the first facing wall 102C and the upper heat radiating surface 110A of the first power module 101A, and the heat radiating fin 204 provided on the upper heat radiating surface 110A is the first. It protrudes into one flow path 120.
  • a second flow path 122 through which the refrigerant flows is formed between the second facing wall 102D and the lower heat radiation surface 110C of the second power module 101B, and the heat radiation fins 204 provided on the lower heat radiation surface 110C are formed. Protrudes into the second flow path 122.
  • a third flow path 124 through which the refrigerant flows is formed between the third facing wall 102E and the upper heat radiating surface 110E of the third power module 101C, and the heat radiating fin 204 provided on the upper heat radiating surface 110E is a third flow. It protrudes into the road 124.
  • a fourth flow path 121 through which the refrigerant flows is formed between the lower cover 103B and the lower heat radiation surface 110B of the first power module 101A, and the heat radiation fin 205 provided on the lower heat radiation surface 110B is provided. It protrudes into the fourth flow path 121.
  • a fifth flow path 123 through which the refrigerant flows is formed between the upper cover 103A and the upper heat radiation surface 110D of the second power module 101B, and the heat radiation fin 205 provided on the upper heat radiation surface 110D is the fifth flow path 123. It protrudes into.
  • a sixth flow path 125 through which the refrigerant flows is formed between the lower cover 103B and the lower heat radiation surface 110F of the third power module 101C, and the heat radiation fin 205 provided on the lower heat radiation surface 110F is a sixth. It projects into the flow path 125.
  • the communication flow path portion 130 is provided with one flow adjusting member 140 for adjusting the flow of the refrigerant flowing from the first flow path 120 and the fourth flow path 121 to the second flow path 122 and the fifth flow path 123 side.
  • the flow adjusting member 140 has, for example, a rectangular cross section, and is integrally formed with the flow path forming body 102.
  • Part 131 is formed. Then, the refrigerant flowing through the second flow path 122 and the refrigerant flowing through the fifth flow path 123 merge at the communication flow path portion 131.
  • the communication flow path portion 131 is provided with one flow adjusting member 141 for adjusting the flow of the refrigerant flowing from the second flow path 122 and the fifth flow path 123 to the third flow path 124 and the sixth flow path 125 side. There is.
  • the flow adjusting member 141 has, for example, a rectangular cross section, and is integrally formed with the flow path forming body 102.
  • the communication flow path portion 130 When viewed from the normal direction of the upper heat radiation surface 110A of the first power module 101A (in other words, the height direction of the flow path forming body 102), the communication flow path portion 130 is above the first power module 101A.
  • a part of the heat radiating surface 110A and a part of the lower heat radiating surface 110C of the second power module 101B are overlapped with each other, and the communication flow path portion 131 is a part of the lower heat radiating surface 110C of the second power module 101B and the second power module 101B. 3 It overlaps with a part of the upper heat radiation surface 110E of the power module 101C.
  • the refrigerant flows into the inside of the flow path forming body 102 from the refrigerant inlet 102A, a part of the flowing refrigerant is with the upper heat radiation surface 110A of the first power module 101A.
  • the second power module 101B flows through the first flow path 120 formed between the flow path forming body 102 and the first facing wall 102C, absorbs heat from the heat radiation fins 204 protruding from the first flow path 120, and absorbs heat. Flow to the side.
  • the rest of the inflowing refrigerant flows through the fourth flow path 121 formed between the lower heat radiation surface 110B and the lower cover 103B of the first power module 101A via the through hole 201C of the first power module 101A.
  • Heat is absorbed from the heat radiation fin 205 protruding from the fourth flow path 121 and flows to the second power module 101B side.
  • the refrigerant flowing through the first flow path 120 and the refrigerant flowing through the fourth flow path 121 merge at the communication flow path portion 130 between the first power module 101A and the second power module 101B, and one of the merged refrigerants.
  • the portion flows through the second flow path 122 formed between the lower heat radiation surface 110C of the second power module 101B and the second facing wall 102D of the flow path forming body 102.
  • the rest of the merged refrigerant flows through the through hole 201C of the second power module 101B and flows through the fifth flow path 123 formed between the upper heat radiation surface 110D and the upper cover 103A of the second power module 101B.
  • the flow adjusting member 140 is provided in the communication flow path portion 130, the flow direction and the flow velocity of the refrigerant flowing to the fifth flow path 123 side can be controlled by using the flow adjusting member 140. , It is possible to prevent the problem that the refrigerant is difficult to flow to the fifth flow path 123 side.
  • the refrigerant flowing through the second flow path 122 absorbs heat from the heat radiation fins 204 protruding from the second flow path 122 and flows to the third power module 101C side.
  • the refrigerant flowing through the fifth flow path 123 absorbs heat from the heat radiation fin 205 protruding from the fifth flow path 123 and flows to the third power module 101C side.
  • the rest of the merged refrigerant passes through the through hole 201C of the third power module 101C and passes through the sixth flow path 125 formed between the lower heat radiation surface 110F and the lower cover 103B of the third power module 101C. It flows.
  • the flow adjusting member 141 is provided in the communication flow path portion 131, the flow direction and the flow velocity of the refrigerant flowing to the sixth flow path 125 side can be controlled by using the flow adjusting member 141. , It is possible to prevent the problem that the refrigerant is difficult to flow to the sixth flow path 125 side.
  • the refrigerant flowing through the third flow path 124 absorbs heat from the heat radiation fins 204 protruding from the third flow path 124 and flows to the refrigerant outlet 102B side.
  • the refrigerant flowing through the sixth flow path 125 absorbs heat from the heat radiation fin 205 projecting from the sixth flow path 125 and flows to the refrigerant outlet 102B side. Then, the refrigerant flowing through the third flow path 124 and the refrigerant flowing through the sixth flow path 125 merge on the refrigerant outlet 102B side and flow out to the outside of the housing 100 via the refrigerant outlet 102B.
  • the second power module 101B has a normal direction (in other words, paraphrase) of the upper heat radiation surface 110A so that the lower heat radiation surface 110C faces the upper heat radiation surface 110A with respect to the first power module 101A.
  • they are arranged at positions that overlap in the height direction of the flow path forming body 102) and deviate in the direction orthogonal to the normal direction of the upper heat radiation surface 110A (in other words, the longitudinal direction of the flow path forming body 102).
  • the lower heat radiation surface 110C overlaps the third power module 101C in the normal direction of the upper heat radiation surface 110A so as to face the upper heat radiation surface 110E, and is orthogonal to the normal direction of the upper heat radiation surface 110A. Since they are arranged at offset positions, the dimensions in the direction orthogonal to the normal direction are compared with the case where the first, second, and third power modules are arranged in a straight line in the direction orthogonal to the normal direction. Can be made smaller.
  • the flow path is formed between the first facing wall 102C of the flow path forming body 102 and the upper heat radiating surface 110A of the first power module 101A, the first flow path 120, and the lower side of the second facing wall 102D and the second power module 101B. Since the second flow path 122 is formed between the heat radiating surface 110C and the third flow path 124 is formed between the third facing wall 102E and the upper heat radiating surface 110E of the third power module 101C, the flow path is formed. A part of the body 102 can be used to form a flow path through which the refrigerant flows.
  • the communication flow path portion 130 overlaps a part of the upper heat radiation surface 110A and a part of the lower heat radiation surface 110C, respectively, so that the upper heat radiation surface 110A
  • the flow path of the refrigerant can be substituted by a part and a part of the lower heat radiation surface 110C.
  • the communication flow path portion 131 overlaps a part of the lower heat radiation surface 110C and a part of the upper heat radiation surface 110E, respectively, a part of the lower heat radiation surface 110C and a part of the upper heat radiation surface 110E are used as a refrigerant. Can be substituted for the flow path of. Therefore, the refrigerant flow path of the power conversion device 10 can be shortened, and the pressure loss can be reduced.
  • the second power module 101B is arranged at a position deviated from the first power module 101A or the third power module 101C in a direction orthogonal to the normal direction of the upper heat radiation surface 110A, the refrigerant flows in each flow. It flows sequentially through the road, and the cooling performance of each power module can be ensured. As a result, the cooling performance of the power conversion device 10 can be maintained, and the dimensions of the entire power conversion device 10 can be reduced.
  • the size of the overlapping portion between the second power module 101B and the first power module 101A, or the size of the overlapping portion between the second power module 101B and the third power module 101C, ensuring cooling performance and power It may be set appropriately in consideration of the dimensions in the longitudinal direction and the height direction of the conversion device 10.
  • the flow adjusts member 140 flows through the communication flow path portion 130 between the first power module 101A and the second power module 101B, and flows through the communication flow path portion 131 between the second power module 101B and the third power module 101C. Since the adjusting members 141 are provided respectively, the heat dissipation effect of the power conversion device 10 can be enhanced as compared with the case where the adjusting members are not provided.
  • the second flow path of the second flow path 122 and the fifth flow path 123 around the second power module 101B is provided. Since the fifth flow path 123 is farther from the communication flow path portion 130 than the 122, the refrigerant easily flows to the second flow path 122 side, which is relatively close to the communication flow path portion 130, and is relatively far from the communication flow path portion 130. It is difficult to flow to the 5th flow path 123 side. Therefore, the flow rate of the refrigerant flowing through the second flow path 122 is large (see the thick arrow in FIG. 7A), and the flow rate of the refrigerant flowing through the fifth flow path 123 is small (see the thin arrow in FIG. 7A).
  • the flow adjusting member 140 in the communication flow path portion 130, for example, by controlling the flow direction and the flow velocity of the refrigerant flowing through the fifth flow path 123, the refrigerant flowing through the fifth flow path 123 Since it is possible to equalize the flow rate of the refrigerant flowing through the second flow path 122 (see FIG. 7B), it is possible to secure the flow rate of the refrigerant flowing through the fifth flow path 123. , It is possible to prevent the above-mentioned variation in the heat dissipation effect and obtain a sufficient heat dissipation effect.
  • the flow adjusting member 141 in the communication flow path portion 131, it becomes possible to equalize the flow rate of the refrigerant flowing through the sixth flow path 125 and the flow rate of the refrigerant flowing through the third flow path 124. Therefore, the flow rate of the refrigerant flowing through the sixth flow path 125 can be secured, and the above-mentioned variation in the heat dissipation effect can be prevented.
  • the location where the flow adjusting member is provided, the shape of the flow adjusting member, etc. are not limited to the above-mentioned contents, and various deformations can be considered.
  • Modification example 1 of flow adjusting member For example, in the modified example 1 shown in FIG. 8, two flow adjusting members (flow adjusting member 140 and flow adjusting member 142) are provided in the communication flow path portion 130. That is, in addition to the flow adjusting member 140, a flow adjusting member 142 is further provided. Like the flow adjusting member 140, the flow adjusting member 142 has a rectangular cross section and is arranged at a place away from the flow adjusting member 140, and controls the flow direction and the flow velocity of the refrigerant in cooperation with the flow adjusting member 140. By doing so, the flow rate of the refrigerant flowing to the fifth flow path 123 side is adjusted.
  • the communication flow path portion 131 is also provided with two flow adjusting members (flow adjusting member 141 and flow adjusting member 143).
  • flow adjusting member 141 and flow adjusting member 143 are provided at two places in each communication flow path portion, it becomes easier to adjust the flow rate of the refrigerant flowing through the fifth flow path 123 or the sixth flow path 125, so that the heat dissipation effect is further secured. It can be made easier.
  • flow adjusting member 144 is provided in the communication flow path portion 130.
  • the flow adjusting member 144 is provided in the vicinity of the second facing wall 102D so as to prevent the refrigerant flowing through the fourth flow path 121 from flowing to the second flow path 122, and flows through the fourth flow path 121. It is formed to have a tapered portion so as to guide the refrigerant to the fifth flow path 123.
  • the flow adjusting member 144 is integrally formed with the flow path forming body 102.
  • the flow adjusting member 146 is formed by extending the end portion of the first facing wall 102C to the communicating flow path portion 130 so as to narrow the communicating flow path portion 130.
  • the communication flow path portion 131 is also provided with two flow adjusting members (flow adjusting member 145 and flow adjusting member 147).
  • the flow adjusting member 145 is provided in the vicinity of the second facing wall 102D, and is a tapered portion so as to guide the refrigerant to the sixth flow path 125 (in other words, to facilitate the flow to the sixth flow path 125 side). Is formed with.
  • the flow adjusting member 145 is integrally formed with the flow path forming body 102.
  • the flow adjusting member 147 is formed by extending the end portion of the third facing wall 102E to the communication flow path portion 131 and narrowing the communication flow path portion 131 so as to prevent the flow to the third flow path 124. ing.
  • the flow adjusting member 144 and the flow adjusting member 145 are not provided with the tapered portion, and the flow adjusting member 146 has a tapered portion and a flow adjusting member for facilitating the flow of the refrigerant to the fifth flow path 123 side.
  • the 147 may be provided with tapered portions for facilitating the flow of the refrigerant to the sixth flow path 125 side.
  • the flow adjusting member 146 and the flow adjusting member 147 may also be provided with the tapered portion.
  • the flow adjusting members described in the first embodiment, the first modification and the second embodiment may be provided in combination.
  • the power conversion device 20 of the present embodiment is different from the above-described first embodiment in that each power module has one heat dissipation surface (a so-called single-sided cooling method is adopted).
  • a so-called single-sided cooling method is adopted.
  • the power conversion device 20 includes a first power module (first circuit body) 301A, a second power module (second circuit body) 301B, and a third power module (third circuit body) 301C. And an accommodating body 300 for accommodating these three power modules. Since the first power module 301A, the second power module 301B, and the third power module 301C have the same structure, an example of the second power module 301B will be described here.
  • the second power module 301B is a rectangular tubular frame that surrounds a circuit unit 200 having a plurality of power semiconductor elements and terminals and exposes the terminals of the circuit unit 200 to the outside. It has a 302 and a first heat radiating plate 202 that closes one opening of the frame body 302. The first heat radiating plate 202 is fitted inside the frame body 302 and supported by a step portion provided inside the frame body 302 so as to ensure watertightness with the frame body 302.
  • the housing body 300 is composed of only the flow path forming body 102 described in the first embodiment.
  • the first power module 301A is inserted into the first recess 106 so that the outer surface 202A of the first heat radiation plate 202 faces the bottom of the first recess 106, and the flow path forming body is formed by the screw 105. It is attached to 102.
  • the second power module 301B is inserted into the second recess 107 so that the outer surface 202A of the first heat radiation plate 202 faces the bottom of the second recess 107, and is attached to the flow path forming body 102 by a screw 105.
  • the third power module 301C is inserted into the third recess 108 so that the outer surface 202A of the first heat radiation plate 202 faces the bottom of the third recess 108, and is attached to the flow path forming body 102 by a screw 105.
  • the outer surface 202A of the first heat radiating plate 202 constitutes the upper heat radiating surface 110A of the first power module 301A.
  • the outer surface 202A of the first heat radiating plate 202 constitutes the lower heat radiating surface 110C of the second power module 301B.
  • the outer surface 202A of the first heat radiating plate 202 constitutes the upper heat radiating surface 110E of the third power module 301C.
  • a communication flow path portion 132 that communicates the first flow path 120 and the second flow path 122 is formed between the first power module 301A and the second power module 301B.
  • a communication flow path portion 133 that communicates the second flow path 122 and the third flow path 124 is formed between the second power module 301B and the third power module 301C.
  • the flow adjusting member is not provided in the communication flow path portion 132 and the communication flow path portion 133, but the flow adjustment member is provided according to the size of the communication flow path portion 132 and the communication flow path portion 133. It may be provided.
  • the flowing refrigerant forms a flow path with the upper heat radiation surface 110A of the first power module 101A.
  • the first flow path 120, the communication flow path portion 132, the lower heat radiation surface 110C of the second power module 301B, and the second facing wall 102D of the flow path forming body 102 formed between the first facing wall 102C of the body 102.
  • the second flow path 122 formed between the two, the communication flow path portion 133, and the upper heat radiation surface 110E of the third power module 301C and the third facing wall 102E of the flow path forming body 102. It flows through the three flow paths 124 in order, and flows out from the refrigerant outlet 102B to the outside of the flow path forming body 102.
  • the same operation and effect as those of the first embodiment can be obtained.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Inverter Devices (AREA)

Abstract

La présente invention concerne un dispositif de conversion d'énergie électrique qui permet de réduire la taille tout en améliorant les performances de refroidissement. Le dispositif de conversion d'énergie électrique 10 comprend : un premier module de puissance 101A ayant une surface de dissipation de chaleur supérieure 110A ; un second module de puissance 101B ayant une surface de dissipation de chaleur inférieure 110C en parallèle à la surface de dissipation de chaleur supérieure 110A ; et un corps de formation de canal d'écoulement 102 sur lequel le premier module de puissance 101A et le second module de puissance 101B sont montés de telle sorte qu'un premier canal d'écoulement 120 par lequel s'écoule un fluide frigorigène est formé entre une première paroi opposée 102C et la surface de dissipation de chaleur supérieure 110A et un second canal d'écoulement 122 par lequel s'écoule le fluide frigorigène est formé entre une seconde paroi opposée 102D et la surface de dissipation de chaleur inférieure 110C. Le second module de puissance 101B est disposé dans une position qui chevauche le premier module de puissance 101A dans une direction de ligne normale de la surface de dissipation de chaleur supérieure 110A et qui est déplacée dans une direction orthogonale à la direction de ligne normale de la surface de dissipation de chaleur supérieure 110A.
PCT/JP2020/045175 2019-12-20 2020-12-04 Dispositif de conversion de puissance électrique WO2021124922A1 (fr)

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JP2019-230161 2019-12-20

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023063087A1 (fr) * 2021-10-15 2023-04-20 株式会社デンソー Dispositif de conversion de puissance
WO2023179873A1 (fr) * 2022-03-25 2023-09-28 Hitachi Energy Switzerland Ag Dispositif d'alimentation et procédé d'assemblage de dispositif d'alimentation

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7464183B1 (ja) 2023-09-20 2024-04-09 富士電機株式会社 電力変換装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013229983A (ja) * 2012-04-25 2013-11-07 Denso Corp 電力変換装置
JP2019134528A (ja) * 2018-01-29 2019-08-08 東芝三菱電機産業システム株式会社 電力変換装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013229983A (ja) * 2012-04-25 2013-11-07 Denso Corp 電力変換装置
JP2019134528A (ja) * 2018-01-29 2019-08-08 東芝三菱電機産業システム株式会社 電力変換装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023063087A1 (fr) * 2021-10-15 2023-04-20 株式会社デンソー Dispositif de conversion de puissance
WO2023179873A1 (fr) * 2022-03-25 2023-09-28 Hitachi Energy Switzerland Ag Dispositif d'alimentation et procédé d'assemblage de dispositif d'alimentation

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