WO2021124724A1 - Ruban adhésif pour le découpage en dés et procédé de production de puce semiconductrice - Google Patents

Ruban adhésif pour le découpage en dés et procédé de production de puce semiconductrice Download PDF

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Publication number
WO2021124724A1
WO2021124724A1 PCT/JP2020/041705 JP2020041705W WO2021124724A1 WO 2021124724 A1 WO2021124724 A1 WO 2021124724A1 JP 2020041705 W JP2020041705 W JP 2020041705W WO 2021124724 A1 WO2021124724 A1 WO 2021124724A1
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Prior art keywords
silicone
mass
pressure
resin
sensitive adhesive
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PCT/JP2020/041705
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English (en)
Japanese (ja)
Inventor
晃良 増田
敬之 下田
貴広 酒井
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マクセルホールディングス株式会社
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Priority to KR1020227020562A priority Critical patent/KR20220117234A/ko
Priority to JP2021565362A priority patent/JPWO2021124724A1/ja
Priority to CN202080088643.XA priority patent/CN114868229A/zh
Publication of WO2021124724A1 publication Critical patent/WO2021124724A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents

Definitions

  • the present invention relates to an adhesive tape for dicing used for dicing a semiconductor material used as a material for a semiconductor chip, and a method for manufacturing a semiconductor chip using the adhesive tape for dicing.
  • an adhesive tape for dicing used for manufacturing a semiconductor chip having an LED (Light Emitting Diode) or the like an adhesive tape having an adhesive layer made of an acrylic resin is known (see Patent Document 1). .. Further, as an adhesive tape for dicing used for producing a semiconductor chip having an LED or the like, an adhesive tape having an adhesive layer made of a silicone-based resin is known (see Patent Documents 2 and 3). Further, as a method of manufacturing a semiconductor chip using an adhesive tape for dicing, an adhesive tape is attached to the substrate side of a semiconductor element substrate in which a plurality of semiconductor elements are formed on the substrate, and the semiconductor element substrate is cut by a dicer. A method is known (see Patent Document 4).
  • Japanese Unexamined Patent Publication No. 2013-388408 Japanese Unexamined Patent Publication No. 2015-05216 Japanese Unexamined Patent Publication No. 2016-122812 Japanese Unexamined Patent Publication No. 2005-93503
  • an adhesive tape is attached to a semiconductor material in which a plurality of semiconductor elements are coated with a coating material such as a sealing resin or a phosphor, and dicing is performed.
  • a coating material such as a sealing resin or a phosphor
  • technologies corresponding to so-called wafer level CSP (chip scale package) processes have been proposed.
  • the adhesive tape is attached to the semiconductor material in which the semiconductor element is coated with the coating material, the adhesive strength is insufficient depending on the composition of the adhesive layer in the adhesive tape, the material of the coating material, etc.
  • the fragmented semiconductor chip may scatter.
  • the ball tack and adhesive strength of the adhesive layer are designed to be high in order to suppress the scattering of the semiconductor chip, when the obtained semiconductor chip is peeled from the adhesive tape, the adhesive remains attached to the semiconductor chip. So-called adhesive residue may occur.
  • the present invention has good adhesive force and tack force to a semiconductor material having a plurality of semiconductor elements coated with a coating material, and glue to the semiconductor chip when the semiconductor chip separated by dicing is peeled off. It is an object of the present invention to provide an adhesive tape for dicing in which the remainder is suppressed, and a method for manufacturing a semiconductor chip using the adhesive tape.
  • the present inventors have diligently studied the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape for dicing, and as a result, the pressure-sensitive adhesive layer is a silicone gum composed of at least (1) an organopolysiloxane containing a silicon atom-bonded alkenyl group.
  • the pressure-sensitive adhesive layer of the adhesive tape for dicing is thermally polymerized with a cross-linking agent on a silicone-based resin in which silicone gum and silicone resin are mixed in a predetermined ratio and have a predetermined amount of silicon atom-bonded alkenyl groups. It has been found that the following effects can be obtained by composing the pressure-sensitive adhesive composition to which the agent and the photosensitizing platinum (Pt) catalyst are added. First, when a semiconductor material having a plurality of semiconductor elements coated with a coating material is divided into a plurality of semiconductor chips, the pressure-sensitive adhesive layer is a heating / drying step for forming the pressure-sensitive adhesive layer on a substrate.
  • the adhesive layer Since a part of the silicone-based resin is cross-linked and cured (first-stage cross-linking reaction) by the thermal polymerization initiator, the adhesive layer is stable and has an appropriate cohesive force. It has been found that good tacking force and adhesive force suppress the scattering of the fragmented semiconductor chips during dicing.
  • the pressure-sensitive adhesive layer is irradiated with light such as ultraviolet rays, so that the light-sensitive platinum in the pressure-sensitive adhesive composition ( Pt)
  • the catalyst is activated, and the second-step cross-linking reaction (addition reaction) between the silicon atom-bonded alkenyl group of the silicone gum in the silicone-based resin and the silicon atom-bonded hydrogen atom (SiH group) of the cross-linking agent. Is promoted and the crosslink density is further increased, so that the cohesive force of the pressure-sensitive adhesive composition is further increased as compared with that before light irradiation.
  • the tack force of the pressure-sensitive adhesive layer is appropriately reduced, and the fracture mode in the holding force test is "interfacial peeling" or “does not fall” in the holding force test.
  • the pick-up property of the semiconductor chip from the adhesive tape for dicing is improved, and the adhesive residue on the semiconductor chip is suppressed.
  • the adhesive tape for dying of the present invention includes a base material and an adhesive layer laminated on the base material, and when a semiconductor material having a plurality of semiconductor elements coated with a coating material is divided into a plurality of semiconductor chips.
  • the pressure-sensitive adhesive layer is a silicone-based resin in which silicone gum (G) and silicone resin (R) are mixed, and is contained in one molecule as a cross-linking agent for the silicone-based resin.
  • the silicone-based resin comprises an organopolysiloxane having at least two or more silicon atom-bonded hydrogen atoms (SiH groups), a peroxide as a thermal polymerization initiator, and a light-sensitive platinum (Pt) catalyst.
  • the mixing ratio ((G) / (R)) of the silicone gum (G) and the silicone resin (R) in the whole is in the range of 40.0 / 60.0 to 56.0 / 44.0 in terms of mass ratio.
  • the silicone gum (G) contains a silicone gum (G alk ) made of an organopolysiloxane containing a silicon atom-bonded alkenyl group, and the content of the silicon atom-bonded alkenyl group in the entire silicone-based resin is 7. It is an adhesive tape for dying characterized in that it is in the range of 0 ⁇ 10 -7 mol / g or more and 5.5 ⁇ 10 -6 mol / g or less.
  • the pressure-sensitive adhesive layer is the silicon of the cross-linking agent contained in the pressure-sensitive adhesive composition with respect to the content (total amount) of the silicon atom-bonded alkenyl groups in the entire silicone-based resin contained in the pressure-sensitive adhesive composition. It can be characterized in that the molar ratio (SiH group / silicon atom-bonded alkenyl group) of the content (total amount) of the atomic-bonded hydrogen atom (SiH group) is in the range of 2.0 or more and 10.0 or less.
  • the content of the peroxide in the pressure-sensitive adhesive composition is 0.10 parts by mass or more and 3.00 parts by mass in terms of solid content with respect to 100 parts by mass of solid content of the entire silicone-based resin. It can be characterized by having a range of less than a part. Further, the pressure-sensitive adhesive layer can be characterized in that the peroxide is a diacyl peroxide. Further, in the pressure-sensitive adhesive layer, the content of the photosensitive platinum (Pt) catalyst in the pressure-sensitive adhesive composition is 0.10 parts by mass or more in terms of solid content with respect to 100 parts by mass of solid content of the entire silicone-based resin. It can be characterized in that it is in the range of 3.00 parts by mass or less.
  • the content of the silicon atom-bonded alkenyl group in the entire silicone-based resin is in the range of 2.9 ⁇ 10 -6 mol / g or more and 4.1 ⁇ 10 -6 mol / g or less. It can be characterized by being. Further, it can be characterized in that all of the following conditions (a) to (c) are satisfied in the adhesive characteristics conforming to JIS Z 0237 (2009).
  • (A) The adhesive strength of the BA-SUS test plate before light irradiation is in the range of 2.8 N / 10 mm or more and 5.5 N / 10 mm or less.
  • the ball number values in the tilted ball tack test are the ball number value before light irradiation as BN0 and the ball number value after light irradiation. Is BN1, and the relationship is BN0> BN1.
  • C In the holding power test after light irradiation (temperature 40 ° C., relative humidity 33% RH, leaving time 2880 minutes), the fracture phenomenon at the time of dropping is the interface peeling between the adhesive layer and the BA-SUS test plate. There is, or it does not fall in the holding force test.
  • a plurality of the semiconductor elements in which the above-mentioned adhesive tape for dicing is sealed with a sealing resin made of a silicone resin are mounted on a substrate.
  • a method for manufacturing a semiconductor chip which includes an irradiation step of irradiating the dicing adhesive tape of the semiconductor element substrate with light, and a peeling step of peeling the dicing adhesive tape from the plurality of semiconductor chips.
  • a semiconductor material in which a plurality of semiconductor elements are coated with a coating material has good adhesive force and tack force before light irradiation, and is individualized by dicing after light irradiation. It is possible to provide an adhesive tape for dicing, which has good pick-up property of the semiconductor chip when the semiconductor chip is peeled off and suppresses adhesive residue on the semiconductor chip, and a method for manufacturing the semiconductor chip using the adhesive tape. it can.
  • FIG. 1 It is a figure which showed an example of the structure of the adhesive tape for dicing to which this embodiment is applied.
  • (A) to (e) are diagrams showing a method of manufacturing a semiconductor chip using the adhesive tape of the present embodiment. It is a schematic diagram which showed the relationship between the crosslink density of the silicone resin in the pressure-sensitive adhesive layer, and the result (drop time) of the holding force test of the pressure-sensitive adhesive tape 1.
  • FIG. 1 is a diagram showing an example of a configuration of a dicing adhesive tape 1 (hereinafter, simply referred to as an adhesive tape 1) to which the present embodiment is applied.
  • the adhesive tape 1 of the present embodiment is used for dicing a semiconductor material that is a source of a semiconductor chip in a process of manufacturing a semiconductor chip having a semiconductor element such as an LED (Light Emitting Diode) or a power semiconductor.
  • the adhesive tape 1 has a structure in which the pressure-sensitive adhesive layer 3 is laminated on the base material 2.
  • the adhesive tape 1 has an anchor coat layer between the base material 2 and the pressure-sensitive adhesive layer 3 to improve the adhesion between the base material 2 and the pressure-sensitive adhesive layer 3, if necessary. You may have it.
  • the surface of the base material 2 (the surface opposite to the surface facing the pressure-sensitive adhesive layer 3) may be surface-treated.
  • a release liner may be provided on the surface of the pressure-sensitive adhesive layer 3 (the surface opposite to the surface facing the base material 2).
  • the base material 2 of the present embodiment is made of a material that transmits light such as ultraviolet rays.
  • the material of the base material 2 is not particularly limited as long as it can transmit light such as ultraviolet rays, and for example, a plastic or the like that can transmit light such as ultraviolet rays can be used.
  • the fact that light such as ultraviolet rays can be transmitted does not mean that the transmittance of light such as ultraviolet rays is 100%, and at least the light-sensitive platinum (Pt) contained in the pressure-sensitive adhesive layer 3 will be described later. ) It is sufficient that the catalyst can transmit light to the extent that the addition reaction between the silicone resin and the cross-linking agent can be promoted.
  • the material of the base material 2 resin films such as polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, biaxially stretched polypropylene, aliphatic polyimide (transparent polyimide), polycycloolefin, fluororesin, and polyolefin resin are used. Can be used.
  • the base material 2 includes, for example, a composite film obtained by laminating polyethylene terephthalate and a polyolefin resin film, a composite film obtained by further laminating these composite films with a resin film, and a resin formed into a multi-layer by coextrusion. A film or the like may be used.
  • the base material 2 it is preferable to use a material containing polyethylene terephthalate as a main component.
  • the pressure-sensitive adhesive layer 3 of the present embodiment contains at least two or more silicon atom-bonded hydrogen atoms (SiH groups) in one molecule of a silicone-based resin in which silicone gum (G) and silicone resin (R) are mixed. It is composed of a pressure-sensitive adhesive composition containing a cross-linking agent for a silicone-based resin, a peroxide as a thermal polymerization initiator, and a photosensitive platinum (Pt) catalyst.
  • the silicone-based resin is defined as "a silicone gum (G ) containing a silicone gum (G alk ) made of an organopolysiloxane containing a silicon atom-bonded alkenyl group” and "a silicone resin (R) made of an organopolysiloxane”. It consists of a mixed resin blended in the ratio of.
  • a silicone gum (G ) containing a silicone gum (G alk ) made of an organopolysiloxane containing a silicon atom-bonded alkenyl group and "a silicone resin (R) made of an organopolysiloxane”. It consists of a mixed resin blended in the ratio of.
  • the silicone-based resin of the present embodiment includes "silicone gum (G) containing silicone gum (G alk ) made of organopolysiloxane containing a silicon atom-bonded alkenyl group” and "silicone resin (R) made of organopolysiloxane”. ) ”Is composed of a mixed resin blended so as to be in the range of 40.0 / 60.0 to 56.0 / 44.0. That is, the mixing ratio ((G) / (R)) of the silicone gum (G) and the silicone resin (R) is in the range of 40.0 / 60.0 to 56.0 / 44.0 in terms of mass ratio. It consists of a mixed resin formulated as described above.
  • the silicone-based resin is configured such that the content of the silicon atom-bonded alkenyl group in the entire silicone-based resin is in the range of 7.0 ⁇ 10 -7 mol / g or more and 5.5 ⁇ 10 -6 mol / g or less. It is more preferably configured so as to have a range of 2.9 ⁇ 10 -6 mol / g or more and 4.1 ⁇ 10 -5 mol / g or less.
  • mol / g means "amount of substance per 1 g of solid content of the entire silicone-based resin".
  • the silicon atom bond possessed by the silicone gum when the adhesive tape 1 is irradiated with light such as ultraviolet rays When the content of the silicon atom-bonded alkenyl group in the entire silicone-based resin is less than 7.0 ⁇ 10 -7 mol / g, the silicon atom bond possessed by the silicone gum when the adhesive tape 1 is irradiated with light such as ultraviolet rays.
  • the improvement of the cross-linking density by the second-stage cross-linking reaction (addition reaction) between the alkenyl group and the silicon atom-bonded hydrogen atom (SiH group) of the cross-linking agent becomes insufficient, the adhesive is hard to cure, and the cohesive force is increased. It becomes difficult to improve.
  • the desired reduction in tack force and the breaking mode in the holding force test cannot be obtained, and after the adhesive tape 1 is used for dicing the semiconductor element substrate or the like, when the obtained semiconductor chip or the like is peeled off from the adhesive tape 1. , There is a risk that the pickability of the individualized semiconductor chip will deteriorate, and there is a risk that adhesive residue will easily occur on the semiconductor chip or the like.
  • the silicone-based resin of the pressure-sensitive adhesive composition constituting the pressure-sensitive adhesive layer 3 contains silicone gum (G).
  • the silicone-based resin may be cured (first-step cross-linking reaction) by the thermal polymerization initiator before irradiation with light such as ultraviolet rays.
  • the pressure-sensitive adhesive layer 3 may become too hard due to excessive progress. In this case, if the adhesive tape 1 is used for dicing the semiconductor element substrate or the like, when the semiconductor element substrate or the like is cut, the semiconductor chip or the like which is a cut piece may be peeled off from the adhesive tape 1 and easily scattered.
  • the silicone-based resin of the present embodiment has "mixing ratio of silicone gum (G) and silicone resin (R) ((G) / (R))” and "content of silicon atom-bonded alkenyl group".
  • a silicone gum (G 0 ) made of an organopolysiloxane containing no silicon atom-bonded alkenyl group may be contained. That is, the silicone gum (G) may be a single substance of "silicone gum (G alk ) composed of an organopolysiloxane containing a silicon atom-bonded alkenyl group" or a mixture of two or more thereof, or "silicon".
  • sicone gum composed of an organopolysiloxane containing a silicon atom-bonded alkenyl group (G alk ) and "silicone gum composed of an organopolysiloxane containing no silicon atom-bonded alkenyl group (G 0)" contained in a silicone-based resin )
  • Silicone resin (R) composed of an organopolysiloxane containing no silicon atom-bonded alkenyl group will be described in more detail.
  • the silicone gum (G alk ) composed of an organopolysiloxane containing a silicon atom-bonded alkenyl group is referred to as a silicone gum (G alk ) containing a silicon atom-bonded alkenyl group, or simply a silicone gum (G). It may be written as alk).
  • a silicone gum (G 0 ) composed of an organopolysiloxane containing no silicon atom-bonded alkenyl group is referred to as a silicone gum (G 0 ) containing no silicon atom-bonded alkenyl group, or simply a silicone gum (G 0 ). May be done.
  • the silicone resin (R) composed of organopolysiloxane may be simply referred to as silicone resin (R).
  • the silicone gum (G alk ) composed of organopolysiloxane containing a silicon atom-bonded alkenyl group in the present embodiment is generally used as an addition reaction type silicone resin, that is, in one molecule on average. It is not particularly limited as long as it contains at least two silicon atom-bonded alkenyl groups. Specifically, as the silicone gum (G alk), those content of silicon-bonded alkenyl groups is in the range below 1.0 ⁇ 10 -6 mol / g or more 1.0 ⁇ 10 -1 mol / g Can be used.
  • the content of the silicon atom-bonded alkenyl group is 1.7 ⁇ 10 -6 mol from the viewpoint of controlling the adhesive properties of the pressure-sensitive adhesive layer 3 or making it easily available when a commercially available product is used. It is preferable to use one having a range of / g or more and 1.0 ⁇ 10 ⁇ 2 mol / g or less.
  • This silicone gum (G alk ) has an alkenyl group content of 7.0 ⁇ 10 -7 mol / g or more in the entire silicone-based resin in which the above-mentioned silicone gum (G) and silicone resin (R) are mixed 5
  • One type may be used alone or two or more types may be used in combination so as to have a range of .5 ⁇ 10 -6 mol / g or less.
  • the molecular structure of the organopolysiloxane containing the silicon atom-bonded alkenyl group constituting the silicone gum ( Galk ) is, for example, a linear structure in which the main chain portion is a repetition of diorganosiloxane units, and one of the molecular structures. Examples thereof include a structure containing a branched chain, a branched chain structure, and an annular structure. Of these, an organopolysiloxane having a linear structure is preferable from the viewpoint of mechanical strength and physical properties of the pressure-sensitive adhesive after irradiation with light such as ultraviolet rays.
  • the silicone gum (Galk ) made of an organopolysiloxane containing a silicon atom-bonded alkenyl group may be in the form of oil or raw rubber, but is preferably in the form of raw rubber. If it is oily, viscosity of the silicone gum (G alk) consisting of organopolysiloxane at 25 ° C., or higher 1,000 mPa ⁇ s is preferable. If the viscosity is less than 1,000 mPa ⁇ s, the pressure-sensitive adhesive before and after irradiation with light such as ultraviolet rays may not exhibit the desired pressure-sensitive adhesive properties, or the adhesion between the pressure-sensitive adhesive layer 3 and the base material 2 may be inferior.
  • the viscosity of silicone gum ( Galk ) made of organopolysiloxane when dissolved in toluene so as to have a concentration of 30% by mass is preferably 100,000 mPa ⁇ s or less at 25 ° C. If the viscosity exceeds 100,000 mPa ⁇ s, it may be difficult to stir when preparing the pressure-sensitive adhesive composition.
  • the viscosity of the silicone gum ( Galk ) made of organopolysiloxane can be measured using a B-type rotational viscometer (using a BM type rotor, the same applies hereinafter).
  • silicone gum (Galk ) made of an organopolysiloxane containing a silicon atom-bonded alkenyl group examples include those represented by the following general formula (1) or general formula (2), but are not limited thereto. Absent.
  • R 1 is a monovalent hydrocarbon group independently of each other and does not have an aliphatic unsaturated bond
  • X is an alkenyl group-containing organic group.
  • a is an integer of 0 to 3
  • m is an integer of 0 or more
  • n is an integer of 100 or more, where a and m do not become 0 at the same time, and m is 2 only when a is 0. It is the above integer.
  • m + n is a value at which the viscosity becomes 1,000 mPa ⁇ s or higher at 25 ° C. of the silicone gum (G alk) consisting of the organopolysiloxane.
  • R 1 a monovalent hydrocarbon group having 1 to 10 carbon atoms, preferably 1 to 7 carbon atoms and having no aliphatic unsaturated bond is preferable.
  • examples thereof include alkyl groups such as methyl group, ethyl group, propyl group and butyl group; cycloalkyl group such as cyclohexyl group; and aryl group such as phenyl group and tolyl group, and in particular, methyl group or phenyl group. Is preferable.
  • an alkenyl group-containing organic group having 2 to 10 carbon atoms is preferable.
  • a lower alkenyl group such as a vinyl group and an allyl group is preferable, and a vinyl group is particularly preferable from an industrial point of view.
  • the bonding position of the alkenyl group is not particularly limited, and may be a molecular chain end, a molecular chain side chain, or both a molecular chain end and a molecular chain side chain.
  • the appropriate range of the number of alkenyl groups varies depending on the content of the silicone resin (R) composed of organopolysiloxane contained in the silicone-based pressure-sensitive adhesive, the type and amount of the cross-linking agent, and the balance with other additive components. Although it cannot be said unconditionally, for example, it is preferably in the range of 0.1 or more and 3.0 or less with respect to 100 organogroups of the organopolysiloxane. Then, within this ratio range, the molecular weight may be adjusted so as to be within the above-mentioned viscosity range so that the number of the alkenyl groups in one molecule of organopolysiloxane is at least 2 on average. preferable.
  • the improvement of the cross-linking density by the second-step cross-linking reaction (addition reaction) between the silicon atom-bonded hydrogen atom (SiH group) of the cross-linking agent for the alkenyl group and the silicone-based resin becomes insufficient, and the adhesive is difficult to cure. , It becomes difficult to improve the cohesive force.
  • the mixing ratio of the silicone gum (G) in the silicone-based resin of the pressure-sensitive adhesive composition constituting the pressure-sensitive adhesive layer 3 If the value is high, depending on the type and content of the thermal polymerization initiator, the curing of the silicone-based resin (first-step cross-linking reaction) may proceed too much due to the thermal polymerization initiator before irradiation with light such as ultraviolet rays. The pressure-sensitive adhesive layer 3 may become too hard. In this case, if the adhesive tape 1 is used for dicing the semiconductor element substrate or the like, when the semiconductor element substrate or the like is cut, the semiconductor chip or the like which is a cut piece may be peeled off from the adhesive tape 1 and easily scattered.
  • silicone gums containing such silicon-bonded alkenyl groups dimethylpolysiloxane with both molecular chain terminals blocked with dimethylvinylsiloxy groups at both molecular chain terminals with dimethylvinylsiloxy groups dimethylsiloxane-methylvinyl Siloxane copolymer, dimethylvinylsiloxy group-blocked dimethylsiloxane / methylphenylsiloxane copolymer at both ends of the molecular chain, dimethylvinylsiloxy group-blocked methylphenylpolysiloxane at both ends of the molecular chain, trimethylsiloxy group-blocked dimethylsiloxane / methyl at both ends of the molecular chain Vinylsiloxane copolymer, trimethylsiloxy group-blocking at both ends of the molecular chain dimethylsiloxane / methylvinylsiloxane / methylphenylsilox
  • the silicone gum (G 0 ) made of an organopolysiloxane containing no silicon atom-bonded alkenyl group in the present embodiment is generally used as a peroxide-curable silicone-based resin, that is, a silicon atom-bonded alkenyl group. It is not particularly limited as long as it does not contain.
  • the molecular structure of the organopolysiloxane constituting such a silicone gum (G 0 ) is, for example, a linear structure in which the main chain portion is a repetition of diorganosiloxane units, and a branched chain in a part of the molecular structure. Examples thereof include a structure containing a siloxane, a branched chain structure, or an annular structure.
  • the silicone gum (G 0 ) made of an organopolysiloxane containing no silicon atom-bonded alkenyl group may be in the form of oil or raw rubber, but is preferably in the form of raw rubber.
  • the viscosity of the silicone gum (G 0 ) made of organopolysiloxane is preferably 1,000 mPa ⁇ s or more at 25 ° C. If the viscosity is less than 1,000 mPa ⁇ s, the pressure-sensitive adhesive before and after irradiation with light such as ultraviolet rays may not exhibit the desired pressure-sensitive adhesive properties, or the adhesion between the pressure-sensitive adhesive layer 3 and the base material 2 may be inferior.
  • the viscosity of silicone gum (G 0 ) made of organopolysiloxane when dissolved in toluene so as to have a concentration of 30% by mass is preferably 100,000 mPa ⁇ s or less at 25 ° C. If the viscosity exceeds 100,000 mPa ⁇ s, it may be difficult to stir when preparing the pressure-sensitive adhesive composition.
  • the viscosity of the silicone gum (G 0 ) made of organopolysiloxane can be measured using a B-type rotational viscometer.
  • silicone gum (G 0 ) made of an organopolysiloxane containing no silicon atom-bonded alkenyl group examples include those represented by the following general formula (3) or general formula (4), but are not limited thereto. Absent.
  • R 4 is a monovalent hydrocarbon group which is independent of each other and does not have an aliphatic unsaturated bond, and t is an integer of 100 or more.
  • the viscosity of the silicone gum (G 0 ) made of the above diorganopolysiloxane at 25 ° C. is a value of 1,000 mPa ⁇ s or more.
  • R 4 a monovalent hydrocarbon group having 1 to 10 carbon atoms, preferably 1 to 7 carbon atoms and having no aliphatic unsaturated bond is preferable.
  • examples thereof include alkyl groups such as methyl group, ethyl group, propyl group and butyl group; cycloalkyl group such as cyclohexyl group; and aryl group such as phenyl group and tolyl group, and methyl group is particularly preferable.
  • the silicone resin (R) composed of the organopolysiloxane in the present embodiment is an organopolysiloxane having R 2 3 SiO 0.5 unit (M unit) and SiO 2 unit (Q unit), and is generally a silicone-based pressure-sensitive adhesive. It is a so-called MQ resin used in the above.
  • the silicone resin (R) composed of this organopolysiloxane basically does not have an alkenyl group in the molecule, and conventionally known ones can be used.
  • R 2 is a monovalent hydrocarbon group having 1 to 10 carbon atoms, and examples thereof include those exemplified as R 1 described above.
  • the organopolysiloxane constituting the silicone resin (R) has R 2 3 SiO 0.5 units and SiO 2 units in the range of 0.5 or more and 1.7 or less in a molar ratio of R 2 3 SiO 0.5 units / SiO 2 units. It is preferable to contain it so as to become. If the molar ratio of R 2 3 SiO 0.5 unit / SiO 2 unit is less than 0.5, the adhesive strength and tack strength of the obtained pressure-sensitive adhesive layer 3 may decrease. On the other hand, if the molar ratio of R 2 3 SiO 0.5 unit / SiO 2 unit exceeds 1.7, the adhesive strength and holding power of the obtained pressure-sensitive adhesive layer 3 may decrease.
  • the organopolysiloxane constituting the silicone resin (R) may have an OH group.
  • the content of the OH group is preferably 4.0% by mass or less with respect to the total mass of the organopolysiloxane. If the content of OH groups exceeds 4.0% by mass, the curability of the pressure-sensitive adhesive may decrease.
  • organopolysiloxane Two or more kinds of the above-mentioned organopolysiloxane may be used in combination. Further, the organopolysiloxane may have R 2 SiO 1.5 units (T units) and / or R 2 2 SiO units (D units) as long as the characteristics of the present invention are not impaired.
  • Silicone gum (G alk ) composed of an organopolysiloxane containing a silicon atom-bonded alkenyl group
  • Silicone gum (G 0 ) composed of an organopolysiloxane containing no silicon atom-bonded alkenyl group
  • Consists of an organopolysiloxane The “silicone resin (R)” may usually be simply mixed and used.
  • a silicone gum ( Galk ) composed of an organopolysiloxane containing a silicon atom-bonded alkenyl group a case where the organopolysiloxane represented by the above general formula (2) is contained, or an organo without a silicon atom-bonded alkenyl group is contained.
  • the silicone gum (G 0 ) composed of polysiloxane contains the organopolysiloxane represented by the above general formula (4)
  • the silicone gum (G alk ) and silicone are provided as long as the characteristics of the present invention are not impaired.
  • the resin (R) or the silicone gum (G 0 ) and the silicone resin (R) may be reacted in advance to be used as a (partial) condensation reaction product.
  • the mixing ratio ((G) / (R)) of the silicone gum (G) and the silicone resin (R) in the entire silicone-based resin contained in the pressure-sensitive adhesive layer 3 of the present embodiment is 40.0 / by mass ratio. It is in the range of 60.0 to 56.0 / 44.0.
  • the total amount of each silicone gum (G) is regarded as the mass of the silicone gum (G) in the entire silicone-based resin.
  • silicone gum (G alk ) and silicone gum (G 0 ) are used in combination as the silicone gum (G)
  • the mass of the silicone gum (G) in the entire silicone-based resin is the mass of the silicone gum (G alk ). It is the total amount with the mass of silicone gum (G 0).
  • the total amount of each silicone resin is regarded as the mass of the silicone resin (R) in the entire silicone resin.
  • the mixing ratio ((G) / (R)) of the silicone gum (G) and the silicone resin (R) is less than the lower limit of the above range.
  • the silicon atom-bonded alkenyl group of the silicone gum (G) and the silicon atom-bonded hydrogen atom (SiH group) of the cross-linking agent for the silicone-based resin when the adhesive tape 1 is irradiated with light such as ultraviolet rays when the adhesive tape 1 is irradiated with light such as ultraviolet rays.
  • the contribution of the improvement of the cross-linking density by the second-stage cross-linking reaction (addition reaction) becomes insufficient, the adhesive is hard to cure, and the cohesive force is hard to improve.
  • the mixing ratio ((G) / (R)) of the silicone gum (G) and the silicone resin (R) has an upper limit value in the above range. If it exceeds the limit, the curing of the silicone-based resin (first-stage cross-linking reaction) may proceed too much due to the thermal polymerization initiator before irradiation with light such as ultraviolet rays, and the pressure-sensitive adhesive layer 3 may become too hard. In this case, if the adhesive tape 1 is used for dicing the semiconductor element substrate or the like, when the semiconductor element substrate or the like is cut, the semiconductor chip or the like which is a cut piece may be peeled off from the adhesive tape 1 and easily scattered.
  • the mixing ratio ((G) / (R)) of the silicone gum (G) and the silicone resin (R) was set to 40.
  • the range from 0 / 60.0 to 56.0 / 44.0 the following effects can be realized. That is, in the stage before irradiation with light such as ultraviolet rays, the pressure-sensitive adhesive layer 3 is in a state in which a part of the silicone-based resin is crosslinked / cured (first-stage crosslinking reaction) by the thermal polymerization initiator.
  • the silicone-based resin of the pressure-sensitive adhesive layer 3 has a silicon atom-bonded alkenyl group content of 7.0 ⁇ 10 -7 mol / g or more in the entire silicone-based resin as described above.
  • the silicon atom-bonded alkenyl group of the silicone gum (G) and the silicon atom-bonded hydrogen atom of the cross-linking agent for the silicone-based resin proceeds sufficiently.
  • the curing of the pressure-sensitive adhesive layer 3 further progresses, so that the crosslink density is increased and the cohesive force is further improved, so that a desired decrease in tack force and a fracture mode in the holding force test can be obtained.
  • the content of the silicon atom-bonded alkenyl group in the entire silicone-based resin is preferably in the range of 2.9 ⁇ 10 -6 mol / g or more and 4.1 ⁇ 10 -6 mol / g or less.
  • the pressure-sensitive adhesive tape 1 having more stable dicing characteristics can be realized.
  • silicone-based resin in which the silicone gum (G) and the silicone resin (R) of the present invention are mixed those prepared by appropriately combining commercially available materials exemplified below can also be used.
  • a mixture prepared by appropriately combining means "the content of the silicon atom-bonded alkenyl group in the entire silicone-based resin of the pressure-sensitive adhesive layer 3 is 7.0 ⁇ 10 -7 mol / g or more 5.5 ⁇ .
  • the mixing ratio ((G) / (R)) of silicone gum (G) and silicone resin (R) is 40.0 / 60.0 to 56.0 / 44.0. It means "a product prepared by appropriately combining and mixing individual materials so as to fall within the range of.” Examples of individual commercially available materials for mixing and preparing in appropriate combinations include the following materials (1) to (4).
  • silicone-based resin containing a silicon atom-bonded alkenyl group examples include (1) a commercially available addition-reaction silicone-based pressure-sensitive adhesive in which silicone gum (Galk ) and silicone resin (R) are mixed in a predetermined ratio, and (2). ) An addition-reaction type silicone-based mold release agent containing silicone gum (G alk) as a main component can be mentioned. Further, as the silicone-based resin containing no silicon atom-bonded alkenyl group, (3) a commercially available peroxide-curable silicone-based adhesive in which silicone gum (G 0 ) and silicone resin (R) are mixed in a predetermined ratio. Examples thereof include agents and (4) a single product of a commercially available silicone resin (R).
  • the silicone-based resin containing the silicon atom-bonded alkenyl group includes (1) a commercially available addition-reaction silicone-based adhesive in which silicone gum (Galk ) and silicone resin (R) are mixed in a predetermined ratio.
  • Agents (2) commercially available addition-reaction type silicone-based mold release agents containing silicone gum (G alk) as a main component, and the like can be used.
  • specific commercially available materials will be illustrated.
  • the commercially available addition reaction silicone adhesive is not particularly limited as long as it is generally used as a silicone adhesive for silicone adhesive tapes.
  • a type in which a cross-linking agent is added can also be used, but if the content of the silicon atom-bonded hydrogen atom (SiH group) contained in the cross-linked agent is unknown, the content is determined by the content. It can be obtained by analysis of 1 H-NMR (nuclear magnetic resonance) spectrum measurement described later.
  • the commercially available addition-reaction type silicone-based mold release agent is as long as it is generally used as a release treatment agent for a silicone-based mold release film for adhesive tapes.
  • either a type without a cross-linking agent or a type with a cross-linking agent may be used, and the silicon atom-bonded hydrogen atom (SiH group) of the cross-linked agent contained therein may be used.
  • the content can be determined by analysis of 1 H-NMR (nuclear magnetic resonance) spectrum measurement or the like.
  • silicone-based resin that does not contain a silicon atom-bonded alkenyl group
  • examples of the silicone-based resin that does not contain a silicon atom-bonded alkenyl group include a commercially available peroxide-curable silicone-based pressure-sensitive adhesive in which silicone gum (G 0) and silicone resin (R) are mixed in a predetermined ratio.
  • a commercially available silicone resin (R) alone can be used.
  • specific commercially available materials will be illustrated.
  • peroxide Curable Silicone Adhesive The above-mentioned commercially available peroxide curable silicone adhesive is particularly limited as long as it is generally used as a silicone adhesive for silicone adhesive tapes. Not done. Specifically, for example, KR-100, KR-101-10 (all trade names) manufactured by Shin-Etsu Chemical Co., Ltd., YR3340, YR3286, PSA610-SM, XR37-B6722 manufactured by Momentive Performance Materials Co., Ltd. , YF3897 (all trade names), SH4280, SH4282, SE4200, BY24-717, BY24-715, Q2-7735 (all trade names) manufactured by Dow Toray Co., Ltd. and the like.
  • Silicone Resin As a single product of the commercially available silicone resin (R), specifically, for example, YF3800, XF3905, YF3057, YF3807, YF3802, YF3897, XC96-723, manufactured by Momentive Performance Materials Co., Ltd. 2D SILANOL FLUID (both are trade names) and the like can be mentioned.
  • these commercially available silicone-based resins have a silicon atom-bonded alkenyl group content of 7.0 ⁇ 10 -7 mol / g or more in the entire silicone-based resin of the pressure-sensitive adhesive layer 3 of 5.5 ⁇ 10 -6.
  • the mixing ratio ((G) / (R)) of silicone gum (G) and silicone resin (R) is in the range of 40.0 / 60.0 to 56.0 / 44.0. It may be used in a state of being mixed and prepared by appropriately combining them so as to be.
  • silicone-based resins include (a) a silicone-based resin obtained by adding an addition-reaction type silicone-based release agent to an addition-reaction type silicone-based pressure-sensitive adhesive. (B) A silicone-based resin to which a peroxide-curable silicone-based pressure-sensitive adhesive and / or a silicone resin (R) is further added may be used as the main component of the pressure-sensitive adhesive composition constituting the pressure-sensitive adhesive layer 3.
  • "as the main component” means that the pressure-sensitive adhesive composition occupies 75 parts by mass or more when the solid content is 100 parts by mass, and preferably 90 parts by mass. The above is more preferably 95 parts by mass or more.
  • the cross-linking agent in the present embodiment exhibits a function as a cross-linking agent for the silicone-based pressure-sensitive adhesive by irradiating the pressure-sensitive adhesive layer 3 with light such as ultraviolet rays. That is, the cross-linking agent in the present embodiment is a silicone-based resin when the light-sensitive platinum (Pt) catalyst in the silicone-based pressure-sensitive adhesive is activated by irradiating the pressure-sensitive adhesive layer 3 with light such as ultraviolet rays. by addition reaction against silicon-bonded alkenyl groups silicone gum (G alk) have contained, used to crosslink the pressure-sensitive adhesive layer 3.
  • Pt light-sensitive platinum
  • G alk silicon-bonded alkenyl groups silicone gum
  • an organopolysiloxane (organohydrogenpolysiloxane) having at least two, preferably three or more silicon atom-bonded hydrogen atoms (SiH groups) in one molecule is used.
  • an organopolysiloxane having a silicon atom-bonded hydrogen atom (SiH group) may be simply referred to as an organohydrogenpolysiloxane.
  • Examples of the molecular structure of the organohydrogenpolysiloxane used as a cross-linking agent include linear, linear with partial branches, branched chain, and network.
  • the organohydrogenpolysiloxane preferably has a viscosity at 25 ° C. of 1 mPa ⁇ s or more and 5,000 mPa ⁇ s or less. The viscosity can be measured using a B-type rotational viscometer.
  • organohydrogenpolysiloxane used as a cross-linking agent conventionally known ones can be used.
  • examples of this organohydrogenpolysiloxane include those represented by the following general formula (5) or general formula (6), but are not limited thereto.
  • R 3 is a monovalent hydrocarbon group having 1 to 10 carbon atoms
  • b is 0 or 1
  • p and q are integers. This is a value at which the viscosity of the organohydrogenpolysiloxane at 25 ° C. is 1 mPa ⁇ s or more and 5,000 mPa ⁇ s or less.
  • r is an integer of 2 or more
  • s is an integer of 0 or more
  • the organohydrogenpolysiloxane may be a mixture of two or more.
  • R 3 is a monovalent hydrocarbon group having 1 to 10 carbon atoms, preferably 1 to 7 carbon atoms.
  • alkyl groups such as methyl group, ethyl group, propyl group and butyl group; cycloalkyl group such as cyclohexyl group; and aryl group such as phenyl group and trill group, and alkenyl group such as vinyl group and allyl group can be mentioned.
  • a methyl group or a phenyl group is preferable.
  • the content of the organohydrogenpolysiloxane used as the cross-linking agent in the pressure-sensitive adhesive layer 3 of the present embodiment is the content of the silicon atom-bonded alkenyl group of the silicone gum (Galk ) and the silicon contained in the organohydrogenpolysiloxane. Since the appropriate range changes depending on the content of the atomic-bonded hydrogen atom, it cannot be said unconditionally, but usually, for example, the silicon atom of the silicone-based resin contained in the pressure-sensitive adhesive composition constituting the pressure-sensitive adhesive layer 3 is used.
  • the molar ratio of the content (total amount) of the silicon atom-bonded hydrogen atom (SiH group) of the cross-linking agent contained in the pressure-sensitive adhesive composition to the content (total amount) of the bonded alkenyl group is in the range of 2.0 or more and 10.0 or less. Is preferable.
  • the content of organohydrogenpolysiloxane is less than the above lower limit
  • the adhesive tape 1 is irradiated with light such as ultraviolet rays
  • the silicon atom-bonded alkenyl group of the silicone gum and the silicon atom-bonded hydrogen atom of the cross-linking agent are present.
  • the improvement of the cross-linking density by the second-stage cross-linking reaction (addition reaction) with the (SiH group) becomes insufficient, the adhesive is hard to cure, and the cohesive force is hard to be improved.
  • organohydrogenpolysiloxane if the content of organohydrogenpolysiloxane exceeds the above upper limit, unreacted organohydrogenpolysiloxane may contaminate the semiconductor chip. Further, the silicon atom-bonded hydrogen atom (SiH group) in the unreacted organohydrogenpolysiloxane reacts with oxygen and water in the air to change to SiOH, and the adhesive force of the pressure-sensitive adhesive layer 3 to the adherend is large. As a result, the pickability of the individualized semiconductor chip may deteriorate.
  • SiH group silicon atom-bonded hydrogen atom
  • the content of the cross-linking agent in the pressure-sensitive adhesive layer 3 of the present embodiment is the silicon of the entire cross-linking agent with respect to the content (total amount) of the silicon atom-bonded alkenyl groups in the entire silicone-based resin in the pressure-sensitive adhesive layer 3.
  • the molar ratio of the content (total amount) of the atomically bonded hydrogen atom (SiH group) may be adjusted to be within the above range.
  • the content of the cross-linking agent satisfying this range varies depending on the number of silicon atom-bonded hydrogen atoms (SiH groups) contained in the cross-linking agent, but for example, the silicone type contained in the pressure-sensitive adhesive composition constituting the pressure-sensitive adhesive layer 3.
  • the cross-linking agent may be added so that the solid content is in the range of 0.20 parts by mass or more and 20.00 parts by mass or less with respect to 100 parts by mass of the solid content of the entire resin.
  • the pressure-sensitive adhesive layer 3 is irradiated with light such as ultraviolet rays when the semiconductor chip is peeled off from the adhesive tape for dying. Then, the photosensitive platinum (Pt) catalyst in the silicone-based pressure-sensitive adhesive is activated, and the silicon atom-bonded alkenyl group contained in the silicone gum (Galk) in the silicone-based resin and the silicon atom contained in the cross-linking agent for the silicone-based resin.
  • Pt photosensitive platinum
  • the second-stage cross-linking reaction (addition reaction) with the bonded hydrogen atom (SiH group) is promoted, the cross-linking density becomes high, and the cohesive force of the adhesive becomes larger than that before light irradiation such as ultraviolet rays. ..
  • the tacking force of the pressure-sensitive adhesive layer 3 is appropriately reduced, good pick-up performance when peeling the semiconductor chip or the like from the pressure-sensitive adhesive tape 1 can be realized, and adhesive residue on the semiconductor chip or the like can be suppressed.
  • the cross-linking agent is generally used as a cross-linking agent for an addition-reaction type silicone-based pressure-sensitive adhesive, that is, an organopolysiloxane (organo) having at least two silicon atom-bonded hydrogen atoms (SiH groups) in one molecule. It may be (hydrogen polysiloxane), and is not particularly limited. Specific examples thereof include X-92-122 (trade name) manufactured by Shin-Etsu Chemical Co., Ltd. and BY24-741 (trade name) manufactured by Dow Toray Co., Ltd. If the content of the silicon atom-bonded hydrogen atom (SiH group) contained in these cross-linking agents is unknown, the content can be determined by analysis of 1 H-NMR (nuclear magnetic resonance) spectrum measurement described later. it can.
  • organopolysiloxane organo having at least two silicon atom-bonded hydrogen atoms (SiH groups) in one molecule. It may be (hydrogen polysiloxane), and is not particularly limited
  • the photosensitive platinum (Pt) catalyst is used to accelerate curing by an addition reaction (hydrosilylation) between the silicone resin constituting the pressure-sensitive adhesive layer 3 and a cross-linking agent by irradiation with light such as ultraviolet rays.
  • the wavelength of light that can be used to promote curing by the addition reaction between the silicon atom-bonded alkenyl group of the silicone gum (Galk ) in the silicone-based pressure-sensitive adhesive and the silicon atom-bonded hydrogen atom (SiH group) of the cross-linking agent is , 240 nm or more and preferably 400 nm or less.
  • the photosensitive platinum (Pt) catalyst it is preferable to use a photoactive cyclopentadienyl platinum (IV) compound from the viewpoint of good photosensitivity and reaction rate.
  • the photoactive cyclopentadienyl platinum (IV) compound is not particularly limited, but for example, (cyclopentadienyl) dimethyltrimethylsilylmethyl platinum, (cyclopentadienyl) diethyltrimethylsilylmethyl platinum, (cyclo).
  • the cyclopentadienyl ring in the above-mentioned compounds includes methyl, chloro, fluoro, trimethylsilyl, triethylsilyl, dimethylphenylsilyl, methyldiphenylsilyl, triphenylsilyl, phenyl, fluorophenyl, chlorophenyl, methoxy, naphthyl, biphenyl, anthracenyl, and the like.
  • the cyclopentadienyl ring in the above-mentioned compound includes one that is not substituted, one that is substituted with one or more aromatic organic groups, one that is substituted with one or more aliphatic organic groups, and one or more. Those substituted with an aromatic organic group and one or more aliphatic organic groups are preferable. Further, as the organic group substituted with the cyclopentadienyl ring, naphthyl, biphenyl, anthracenyl, phenanthryl and pyrenyl are preferable.
  • the content of the photosensitive platinum (Pt) catalyst in the pressure-sensitive adhesive layer 3 of the present embodiment is the same as that of the silicon atom-bonded alkenyl group contained in the silicone gum (Galk) in the silicone-based pressure-sensitive adhesive by irradiation with light such as ultraviolet rays.
  • the cross-linking agent is not particularly limited as long as it can promote the addition reaction with the silicon atom-bonded hydrogen atom (SiH group).
  • the content of the photosensitive platinum (Pt) catalyst in the pressure-sensitive adhesive layer 3 of the present embodiment is, for example, relative to 100 parts by mass of the solid content of the entire silicone-based resin in the pressure-sensitive adhesive composition constituting the pressure-sensitive adhesive layer 3.
  • the solid content is preferably in the range of 0.10 parts by mass or more and 3.00 parts by mass or less, and more preferably in the range of 0.20 parts by mass to 1.00 parts by mass.
  • the content of the photosensitive platinum (Pt) catalyst is less than 0.10 parts by mass, the silicon atom-bonded alkenyl group contained in the silicone gum and the silicon contained in the cross-linking agent when the adhesive tape 1 is irradiated with light such as ultraviolet rays.
  • the cross-linking reaction (addition reaction) with the atomic-bonded hydrogen atom (SiH group) does not proceed sufficiently, the improvement of the cross-linking density becomes insufficient, the adhesive is hard to cure, and the cohesive force is hard to be improved.
  • the desired reduction in tack force and the breaking mode in the holding force test cannot be obtained, and after the adhesive tape 1 is used for dicing the semiconductor element substrate or the like, when the obtained semiconductor chip or the like is peeled off from the adhesive tape 1. , There is a risk that the pickability of the individualized semiconductor chip will deteriorate, and there is a risk that adhesive residue will easily occur on the semiconductor chip or the like.
  • the content of the photosensitive platinum (Pt) catalyst exceeds 3.00 parts by mass, the above-mentioned cross-linking reaction (addition reaction) proceeds sufficiently. Therefore, for example, even if the content is 10.0 parts by mass, the adhesive tape 1 There is no particular problem with the characteristics of the above, but it is not preferable from the viewpoint of economic efficiency.
  • thermal polymerization initiator As the thermal polymerization initiator in this embodiment, a peroxide, more specifically, an organic peroxide is used.
  • the thermal polymerization initiator in the present embodiment is suitable so that the semiconductor chip or the like, which is a cut piece, does not scatter with respect to the adhesive layer 3 of the adhesive tape 1 before being irradiated with light such as ultraviolet rays. It is used to impart adhesive strength and tack strength. That is, the thermal polymerization initiator in the pressure-sensitive adhesive layer 3 generates radicals due to the heat applied in the heating / drying step when forming the pressure-sensitive adhesive layer 3.
  • the radical mainly attacks a part of the methyl group and the alkenyl group of the silicone gum (G) in the silicone resin to form a methylene chain, and appropriately crosslinks and cures the pressure-sensitive adhesive layer 3.
  • the methyl group and the alkenyl group first react with each other, and at the same time or subsequently, the cross-linking reaction proceeds between the methyl groups or between the cross-linked portion and the methyl group. Be done.
  • an appropriate cohesive force is imparted to the pressure-sensitive adhesive layer 3, and as a result, an appropriate adhesive force and tack force that do not cause scattering of semiconductor chips or the like that are cut pieces during dicing can be stably realized. it can.
  • the peroxide used as the thermal polymerization initiator is not particularly limited as long as it decomposes to generate free oxygen radicals, but for example, dibenzoyl peroxide and 4,4'-dimethyldibenzoyl.
  • Diacyl peroxides having a 1-minute half-life temperature of 85 ° C or higher and 135 ° C or lower, such as oxides and diisonanoyl peroxides; dicumyl peroxide, t-butyl-cumyl peroxide, 2,5-dimethyl-2,5- Di (t-butylperoxy) hexane, 1,1'-di-t-butylper
  • dialkyl peroxides having a 1-minute half-life temperature of 170 ° C. to 200 ° C.
  • Commercially available products include, for example, diacyl peroxides such as NOF BMT-K40 and Nyper BW (both trade names) manufactured by NOF CORPORATION, and dialkyl peroxides such as Perbutyl C manufactured by NOF CORPORATION and Park Mill. Examples thereof include D and perbutyl P (both are trade names).
  • the above peroxide is 1 from the viewpoint of ensuring the deformation temperature (heat resistance) of the base material 2 of the adhesive tape 1 and the residual amount of alkenyl groups of the silicone gum (Galk) in the state before light irradiation such as ultraviolet rays. It is preferable to use diacyl peroxides having a half-life temperature of about 85 ° C. to 135 ° C. per minute. That is, when diacyl peroxides are used as the peroxide, the pressure-sensitive adhesive layer 3 is formed as compared with the case where dialkyl peroxides (with a half-life temperature of about 170 ° C. to 200 ° C. for 1 minute) are used.
  • the base material 2 of the adhesive tape 1 can be decomposed even at a low heating temperature and a short drying time, which are less likely to be thermally deformed.
  • the reaction between the methyl groups of the silicone gum (G) is more likely to proceed preferentially than the reaction between the methyl group and the alkenyl group of the silicone gum (G), and the cross-linking agent has when irradiated with light such as ultraviolet rays.
  • the content of the thermal polymerization initiator in the pressure-sensitive adhesive layer 3 differs depending on the heating temperature / time, the decomposition temperature of the organic peroxide used (1 minute half-life temperature), the mixing ratio of the silicone gum (G), and the like.
  • the solid content may be in the range of 0.10 parts by mass or more and 3.00 parts by mass or less with respect to 100 parts by mass of the solid content of the entire silicone-based resin in the pressure-sensitive adhesive layer 3. It is more preferably in the range of 0.50 parts by mass or more and 2.00 parts by mass or less, and particularly preferably in the range of 0.70 parts by mass or more and 1.80 parts by mass or less.
  • the content of the thermal polymerization initiator in the pressure-sensitive adhesive layer 3 is less than 0.10 parts by mass in terms of solid content with respect to 100 parts by mass in solid content of the entire silicone-based resin in the pressure-sensitive adhesive layer 3, light such as ultraviolet rays is emitted.
  • the cross-linking / curing (first-step cross-linking reaction) of the silicone-based resin by the thermal polymerization initiator of the pressure-sensitive adhesive layer 3 becomes insufficient at the stage before the irradiation.
  • the pressure-sensitive adhesive layer 3 may be softened due to the silicone gum (G) component.
  • the vibration of the dicing is easily transmitted to the pressure-sensitive adhesive layer 3, and the vibration width becomes large.
  • the semiconductor element substrate may deviate from the reference position.
  • the fragmented semiconductor chips may be chipped (chipping), or that the size of each semiconductor chip may deviate.
  • the adhesive force and tack force of the pressure-sensitive adhesive layer 3 may decrease.
  • the adhesive tape 1 is used for dicing the semiconductor element substrate or the like, when the semiconductor element substrate or the like is cut, the semiconductor chip or the like which is a cut piece may be peeled off from the adhesive tape 1 and easily scattered.
  • the silicone-based resin is crosslinked depending on the type of the thermal polymerization initiator and the heating temperature / time before irradiating with light such as ultraviolet rays.
  • the curing first-stage cross-linking reaction
  • the pressure-sensitive adhesive layer 3 may become too hard.
  • the adhesive tape 1 is used for dicing the semiconductor element substrate or the like, when the semiconductor element substrate or the like is cut, the semiconductor chip or the like which is a cut piece may be peeled off from the adhesive tape 1 and easily scattered.
  • the thermal polymerization initiator itself or a component derived from the decomposition product of the thermal polymerization initiator may remain on the adherend and contaminate the adherend.
  • the silicone-based pressure-sensitive adhesive layer of the present embodiment is a silicone-based resin in which silicone gum (G) and silicone resin (R) are mixed as main components, and at least two or more in one molecule as a cross-linking agent for the silicone-based resin.
  • the present invention comprises a pressure-sensitive adhesive composition containing an organopolysiloxane having a silicon atom-bonded hydrogen atom (SiH group), a peroxide as a thermal polymerization initiator, and a photosensitive platinum (Pt) catalyst.
  • Other components may be contained as long as the effect of the above is not impaired. Examples of other components include a cohesive force improving agent, a reinforcing filler, a peeling control agent, and the like.
  • the cohesive force improver is used as necessary to improve the cohesive force of the pressure-sensitive adhesive layer 3.
  • the cohesive force improving agent is not particularly limited, but for example, a polyfunctional thiol is used.
  • Examples of the cohesive force improving agent composed of polyfunctional thiol include Karenz (registered trademark) MT-PE1 and Karenz MT-NR1 manufactured by Showa Denko KK.
  • the silicone-based resin and the polyfunctional thiol are used. It is necessary to use a compatibilizer with.
  • the compatibilizer is not particularly limited, but for example, KBM-802 and KBM-803 (trade names) manufactured by Shin-Etsu Chemical Co., Ltd., which are silane coupling agents having a mercapto group, and Dow Toray. SH6062 (trade name) manufactured by Co., Ltd. and the like can be mentioned.
  • the amount of the cohesive force improving agent added is preferably in the range of 6 parts by mass or less in terms of solid content with respect to 100 parts by mass in solid content of the entire silicone resin.
  • the amount of the cohesive force improver added exceeds 6 parts by mass in terms of solid content with respect to 100 parts by mass of the solid content of the entire silicone resin, the silicone resin and the cohesive force improver are still present even if the compatibilizer is added. There is a risk of phase separation from the polyfunctional thiol.
  • the reinforcing filler is used, if necessary, in order to improve the strength of the pressure-sensitive adhesive layer 3.
  • the reinforcing filler is not particularly limited, but for example, Aerosil (registered trademark) 130, Aerosil 200, Aerosil 300 manufactured by Nippon Aerosil Co., Ltd., Leoloseal (registered trademark) QS-102 manufactured by Tokuyama Corporation, Leolosil QS-30, DSL. Examples thereof include Carplex (registered trademark) 80 manufactured by Japan Co., Ltd. and Hi-Sil (registered trademark) -233-D manufactured by PPG.
  • the peeling control agent is used as necessary in order to further reduce the adhesive force of the pressure-sensitive adhesive layer 3 after irradiation with light such as ultraviolet rays.
  • the peeling control agent is not particularly limited, and examples thereof include a light peeling additive such as silicone oil. However, if the amount of the peeling control agent added is large, the surface of the adherend may be contaminated by bleeding out, so it is preferable to add the peeling control agent within an acceptable range.
  • the thickness of the pressure-sensitive adhesive layer 3 is preferably in the range of 10 ⁇ m or more and 100 ⁇ m or less, and more preferably in the range of 20 ⁇ m or more and 40 ⁇ m or less.
  • the thickness of the pressure-sensitive adhesive layer 3 is less than 10 ⁇ m, the thickness of the silicone-based pressure-sensitive adhesive contained in the pressure-sensitive adhesive layer 3 becomes thin, so that the adhesive strength of the pressure-sensitive adhesive tape 1 tends to decrease.
  • the thickness of the pressure-sensitive adhesive layer 3 is thicker than 100 ⁇ m, cohesive failure of the pressure-sensitive adhesive layer 3 may easily occur.
  • the adhesive tape 1 is used for dicing the semiconductor element substrate or the like, when the obtained semiconductor chip or the like is peeled off from the adhesive tape 1, there is a possibility that adhesive residue is likely to occur on the semiconductor chip or the like.
  • the vibration of the dicing is easily transmitted to the pressure-sensitive adhesive layer 3, and the vibration width becomes large.
  • the semiconductor element substrate may deviate from the reference position.
  • the fragmented semiconductor chips may be chipped (chipping), or that the size of each semiconductor chip may deviate.
  • a base is formed between the base material 2 and the adhesive layer 3 according to the manufacturing conditions of the adhesive tape 1 and the usage conditions of the adhesive tape 1 after production.
  • An anchor coat layer suitable for the type of the material 2 may be provided, or a surface treatment such as a corona treatment may be applied. This makes it possible to improve the adhesion between the base material 2 and the pressure-sensitive adhesive layer 3.
  • the surface of the base material 2 (the surface opposite to the surface facing the pressure-sensitive adhesive layer 3) may be subjected to a surface treatment such as a peelability improving treatment.
  • the treatment agent used for the surface treatment of the base material 2 is not particularly limited, but for example, a long-chain alkyl vinyl monomer polymer, a fluoroalkyl vinyl monomer polymer, a polyvinyl alcohol carbamate, an aminoalkyd resin and the like.
  • Non-silicone-based release treatment agent and the like can be used. Examples of such a non-silicone-based peeling agent include Peroyl (registered trademark) 1050 and Peroyl 1200 manufactured by Lion Specialty Chemicals Co., Ltd.
  • a release liner may be provided on the surface of the pressure-sensitive adhesive layer 3 (the surface opposite to the surface facing the base material 2), if necessary.
  • a film such as paper, polyethylene, polypropylene, polyethylene terephthalate, etc., which has been subjected to a peeling treatment for enhancing the releasability from the silicone-based pressure-sensitive adhesive contained in the pressure-sensitive adhesive layer 3 can be used.
  • the material used for the peeling treatment of the peeling liner is not particularly limited, and for example, a material such as fluoroalkyl-modified silicone, a long-chain alkylvinyl monomer polymer, or an aminoalkyd-based resin can be used.
  • the overall thickness of the adhesive tape 1 having the structure as described above is preferably in the range of 20 ⁇ m or more and 200 ⁇ m or less.
  • the thickness of the adhesive tape 1 is less than 20 ⁇ m, when the adhesive tape 1 is used for dicing a semiconductor element substrate or the like, it may be difficult to peel off the formed semiconductor chip or the like from the adhesive tape 1. ..
  • the thickness of the adhesive tape 1 exceeds 200 ⁇ m, when the adhesive tape 1 is attached to the semiconductor element substrate, it becomes difficult for the adhesive tape 1 to follow the unevenness formed on the attachment surface of the semiconductor element substrate. In this case, the adhesive area between the adhesive tape 1 and the semiconductor element substrate or the like becomes small, and the semiconductor chip or the like may easily scatter during dicing.
  • the adhesive tape 1 When producing the adhesive tape 1, first, components such as the above-mentioned silicone-based pressure-sensitive adhesive, cross-linking agent, and photosensitive platinum (Pt) catalyst are dissolved in a general-purpose organic solvent such as toluene or ethyl acetate to prepare the pressure-sensitive adhesive. Get the solution. Subsequently, this pressure-sensitive adhesive solution is applied to the surface of the base material 2 which has undergone surface treatment or formation of an anchor coat layer, if necessary, so as to have a predetermined thickness using a comma coater or the like. Next, the base material 2 coated with the pressure-sensitive adhesive solution is heated in a drying furnace to dry and cure the pressure-sensitive adhesive solution to form the pressure-sensitive adhesive layer 3.
  • a general-purpose organic solvent such as toluene or ethyl acetate
  • an anchor coat layer if necessary, so as to have a predetermined thickness using a comma coater or the like.
  • the conditions for heating and drying cannot be unconditionally determined because they depend on the half-life temperature of the thermal polymerization initiator, but for example, the conditions disclosed in Japanese Patent Application Laid-Open No. 2012-107125 can be referred to.
  • the temperature is gradually raised at a temperature of 40 to 90 ° C. in the first half zone portion of the drying furnace to perform initial drying.
  • heat drying may be performed for 1 to 5 minutes in a temperature range of 120 to 200 ° C., and the roll-shaped raw material may be wound up, but this is not the case.
  • the adhesive tape 1 in which the adhesive layer 3 is laminated on the base material 2 is obtained.
  • the pressure-sensitive adhesive layer 3 is in a state in which a part of the silicone-based resin is crosslinked and cured (crosslinking reaction in the first step) by the thermal polymerization initiator.
  • the adhesive tape 1 of the present embodiment is used for dicing a semiconductor material that is a source of a semiconductor chip in a process of manufacturing a semiconductor chip having a semiconductor element such as an LED (Light Emitting Diode) or a power semiconductor.
  • a semiconductor element such as an LED (Light Emitting Diode) or a power semiconductor.
  • the adhesive tape 1 is a semiconductor chip formed by dicing a semiconductor element substrate in which a plurality of semiconductor elements such as LED elements and power semiconductor elements are formed on a substrate made of resin, ceramic, or the like. Used to obtain.
  • a seal is used as an example of a coating material so as to cover the semiconductor element.
  • a stop resin may be provided.
  • the adhesive tape 1 of the present embodiment can be preferably used by dicing a semiconductor device substrate provided with a sealing resin.
  • the following method is conventionally known. First, an adhesive tape for dicing is attached from the substrate side of the semiconductor element substrate, and the semiconductor element substrate is cut from the side where the semiconductor element is formed by a dicer or the like. Then, each semiconductor chip formed by cutting is peeled off from the adhesive tape to obtain a plurality of semiconductor chips.
  • epoxy resins having excellent electrical characteristics and heat resistance have been conventionally used, but epoxy resins are used for high-power LEDs and power semiconductors. If this is the case, there is a problem that the color is easily discolored when used for a short-wavelength LED, or depending on the usage environment of the semiconductor chip.
  • silicone resins are often used as sealing resins for semiconductor elements such as LEDs and power semiconductors because discoloration due to heat or light is less likely to occur compared to epoxy resins. More specifically, a silicone resin containing both or one of a methyl group and a phenyl group as a functional group, that is, a silicone resin containing a methyl group, a silicone resin containing a phenyl group, and both a methyl group and a phenyl group. In many cases, the contained silicone resin is used.
  • the sealing resin for the semiconductor element, discoloration of the sealing resin due to heat or light can be suppressed. Further, the silicone resin has a high light transmittance of 88% or more (wavelength 400 to 800 nm), and the refractive index can be adjusted in the range of 1.41 or more and 1.57 or less. Therefore, when the semiconductor element is an LED, the synchrotron radiation from the LED can be efficiently taken out of the package by using a silicone resin having a higher refractive index as the sealing resin.
  • the refractive index of the encapsulant can be made higher than that in the case of using a silicone resin containing a methyl group. The efficiency of emitted light can be improved.
  • the silicone resin containing a methyl group is not particularly limited, but for example, KER-2300, KER-2460, KER-2500N, KER-2600, KER-2700, KER- of Shin-Etsu Chemical Co., Ltd. 2900, X-32-2528 (all trade names), IVS4312, IVS4312, XE14-C2042, IVS4542, IVS4546, IVS4622, IVS4632, IVS4742, IVS4752, IVSG3445, IVSG0810, IVSG5778, XE13 manufactured by Momentive Performance Materials.
  • the silicone resin containing a methyl group and a phenyl group is not particularly limited, and examples thereof include KER-6075, KER-6150, and KER-6020 (trade names) manufactured by Shin-Etsu Chemical Co., Ltd. Can be mentioned.
  • the silicone resin containing a phenyl group is not particularly limited, but for example, KER-6110, KER-6000, KER-6200, ASP-1111, ASP-1060, ASP-1120 manufactured by Shin-Etsu Chemical Co., Ltd.
  • an adhesive tape for dicing used for cutting a semiconductor element for example, an adhesive tape in which the adhesive layer is made of an acrylic resin-based adhesive is used.
  • an adhesive tape in which the adhesive layer is made of an acrylic resin-based adhesive is used.
  • the sealing resin and the adhesive tape are obtained. If the adhesive strength of the semiconductor chip is insufficient, problems such as scattering of semiconductor chips during dicing may occur.
  • the above-mentioned silicone resin has a property of higher releasability as compared with, for example, an epoxy resin conventionally used as a sealing resin. Therefore, for example, when an adhesive tape whose adhesive layer is an acrylic resin-based adhesive is attached to a semiconductor element substrate using a silicone resin as a sealing resin, it adheres to the silicone resin which is the sealing resin. Adhesive strength with the tape tends to be small. As a result, problems such as scattering of semiconductor chips are more likely to occur during dicing of the semiconductor element substrate.
  • the adhesive layer 3 is a mixture of silicone gum (G) and silicone resin (R) in an appropriate ratio, and a predetermined amount of silicon atoms.
  • G silicone gum
  • R silicone resin
  • a part of the silicone-based resin is crosslinked and cured by the thermal polymerization initiator in the pressure-sensitive adhesive layer 3 (1). Since it is in the state of being crosslinked at the stage), the semiconductor element substrate is sealed even when it is used by pasting it from the sealing resin side made of silicone resin when dying the semiconductor element substrate.
  • the pressure-sensitive adhesive composition constituting the pressure-sensitive adhesive layer 3 contains a photosensitive platinum (Pt) catalyst and a cross-linking agent together with the above-mentioned silicone-based resin, so that the silicone-based resin is irradiated with light such as ultraviolet rays.
  • the photosensitive platinum (Pt) catalyst is activated, and the silicon atom-bonded alkenyl group of the silicone gum (Galk ) in the silicone-based resin and the silicon atom-bonded hydrogen atom (SiH group) of the cross-linking agent for the silicone-based resin. Since the second-stage cross-linking reaction (addition reaction) between the two is promoted and the cross-linking density is increased, the cohesive force of the adhesive is further increased as compared with that before light irradiation such as ultraviolet rays. As a result, the tack force of the pressure-sensitive adhesive layer 3 is appropriately reduced, and the fracture mode in the holding force test is "interfacial peeling" or "does not fall” in the holding force test. As a result, it is possible to realize good pick-up performance when peeling the semiconductor chip or the like from the adhesive tape 1, and it is possible to suppress adhesive residue on the semiconductor chip or the like.
  • 2 (a) to 2 (e) are views showing a method of manufacturing a semiconductor chip using the adhesive tape 1 of the present embodiment.
  • a case where a semiconductor chip having an LED element as a semiconductor element is manufactured by using the adhesive tape 1 will be described as an example.
  • the method described below is an example of a method of using the adhesive tape 1 and a method of manufacturing a semiconductor chip using the adhesive tape 1, and is not limited to the following methods.
  • a plurality of semiconductor elements 102 are mounted on a substrate 101 made of, for example, a resin material or ceramic, to manufacture a semiconductor element substrate 100.
  • the semiconductor element 102 is, for example, an LED element, and although not shown, the semiconductor element 102 is configured by stacking a plurality of semiconductor layers including, for example, a light emitting layer that emits light when energized, and an electrode is formed on the upper portion. ..
  • a plurality of semiconductor elements formed on the substrate 101 of the semiconductor element substrate 100 are sealed with a sealing resin 103 made of a silicone-based resin (sealing step).
  • the plurality of semiconductor elements 102 are collectively sealed with the sealing resin 103, but the individual semiconductor elements 102 may be individually sealed with the sealing resin 103.
  • the adhesive tape 1 and the semiconductor element substrate 100 are bonded together so that the adhesive layer 3 of the adhesive tape 1 faces the sealing resin 103 of the semiconductor element substrate 100 ( Pasting process).
  • the semiconductor element substrate 100 is cut by a dicer or the like along the planned cutting line X in a state where the adhesive tape 1 and the semiconductor element substrate 100 are bonded together. (Cutting process).
  • the semiconductor element substrate 100 to which the adhesive tape 1 is attached is cut from the substrate 101 side.
  • a so-called full cut is performed in which the semiconductor element substrate 100 is completely cut in the thickness direction.
  • the adhesive tape 1 attached to the semiconductor element substrate 100 is irradiated with light such as ultraviolet rays from the base material 2 side (irradiation step).
  • the base material 2 is made of a material that transmits light such as ultraviolet rays. Therefore, by irradiating the adhesive tape 1 with light such as ultraviolet rays from the base material 2 side, the pressure-sensitive adhesive layer 3 is irradiated with light such as ultraviolet rays through the base material 2.
  • the pressure-sensitive adhesive layer 3 since the pressure-sensitive adhesive layer 3 has a light-sensitive platinum (Pt) catalyst, the pressure-sensitive adhesive layer 3 is irradiated with light such as ultraviolet rays to obtain a light-sensitive platinum (Pt) catalyst. Is activated, and the second-stage cross-linking reaction (addition reaction) between the silicone-based resin containing the silicon atom-bonded alkenyl group in the pressure-sensitive adhesive layer 3 and the cross-linking agent is promoted. As a result, the crosslink density in the pressure-sensitive adhesive layer 3, that is, the cohesive force is further increased as compared with before irradiation with light such as ultraviolet rays, and the tack force of the pressure-sensitive adhesive layer 3 is reduced.
  • Pt light-sensitive platinum
  • the semiconductor chip 200 formed by cutting the semiconductor element substrate 100 is peeled off (picked up) from the adhesive tape 1, and as shown in FIG. 2E, the semiconductor chip is separated into individual pieces. 200 can be obtained (peeling step).
  • the pressure-sensitive adhesive layer 3 is a mixture of silicone gum (G) and silicone resin (R) in an appropriate ratio, and has a predetermined amount of silicon atom-bonded alkenyl groups. It is composed of a pressure-sensitive adhesive composition containing a silicone-based resin and a thermal polymerization initiator.
  • the adhesive tape 1 of the present embodiment has a good adhesive force and a tack force with respect to the sealing resin 103 made of a silicone resin by having the above-mentioned structure.
  • the adhesive tape 1 of the present embodiment can suppress the scattering of the semiconductor chip 200 when used for dicing the semiconductor element substrate 100.
  • the pressure-sensitive adhesive composition containing the silicone-based resin constituting the pressure-sensitive adhesive layer 3 of the pressure-sensitive adhesive tape 1 of the present embodiment has good adhesive strength with the sealing resin 103 as described above, while being separated. It has a high type property. That is, the adhesive tape 1 of the present embodiment is a photosensitive platinum that promotes an addition reaction between a silicone-based resin containing a silicon atom-bonded alkenyl group in the adhesive layer 3 and a cross-linking agent by irradiation with light such as ultraviolet rays. Contains (Pt) catalyst.
  • the pressure-sensitive adhesive layer 3 is irradiated with light such as ultraviolet rays via the base material 2, so that the light-sensitive platinum (Pt) catalyst is activated and the pressure-sensitive adhesive layer 3 is formed.
  • the cross-linking density in the pressure-sensitive adhesive layer 3 is further increased, that is, the cohesive force is further increased as compared with before irradiation with light such as ultraviolet rays. It can be increased and the tack force of the pressure-sensitive adhesive layer 3 can be reduced.
  • the peeling step when the semiconductor chip 200 obtained by dicing the semiconductor element substrate 100 is peeled (picked up) from the adhesive tape 1, the generation of so-called adhesive residue on the semiconductor chip 200 is suppressed. can do. In addition, good pick-up performance when peeling the semiconductor chip 200 from the adhesive tape 1 can be realized.
  • the method for obtaining an individualized semiconductor chip by attaching an adhesive tape 1 to a semiconductor element substrate on which a plurality of semiconductor elements are formed from the sealing resin side and performing dicing is not limited to this.
  • the adhesive tape 1 of the present embodiment is, for example, in the manufacture of a chip scale package LED, in which a plurality of LED elements are diced from a semiconductor material coated with a phosphor as an example of a coating material, and the chip scale is individualized. It may be used to obtain a package LED.
  • the phosphor is a member in which the fluorescent material is dispersed in a resin material, ceramic, or the like.
  • the chip scale package LEDs that have been separated during dicing tend to scatter easily.
  • the adhesive tape 1 of the present embodiment having the above-described configuration, it is possible to maintain good adhesive force between the phosphor and the adhesive layer 3, and the chip scale package is individualized. It is possible to suppress the scattering of LEDs.
  • the adhesive layer 3 is irradiated with light such as ultraviolet rays to reduce the tacking force, so that the chip scale package LED separated from the adhesive tape 1 can be easily peeled off and the peeled chip scale is peeled off. It is possible to suppress the generation of adhesive residue on the package LED.
  • silicone-based resins (a) to (j) are used as the main components of the pressure-sensitive adhesive composition, and the following silicon atom-bonded hydrogen is used as the cross-linking agent.
  • Organopolysiloxanes (organohydrogenpolysiloxanes) (m) and (n) having an atom (SiH) were used.
  • the silicone-based resins (a) to (d) are all a mixture of a silicone gum (Galk ) containing a silicon atom-bonded alkenyl group and a silicone resin (R), and the mixing ratio thereof and the silicon atom-bonded alkenyl group are contained. The amounts are different from each other.
  • a silicone gum (Galk ) a dimethylvinylsiloxy group-blocking dimethylsiloxane / methylvinylsiloxane copolymer having a weight average molecular weight (Mw) of about 500,000 at both ends of the molecular chain was used, and for the silicone resin (R).
  • Organopolysiloxane (MQ resin) having R 2 3 SiO 0.5 unit (M unit) and SiO 2 unit (Q unit) having a weight average molecular weight (Mw) of about 5,000 was used.
  • the silicone-based resins (e) and (f) are both single products of the silicone gum (Galk ) containing a silicon atom-bonded alkenyl group, and the silicon atom-bonded alkenyl group contents are different from each other.
  • the silicone gum (Galk ) of the silicone-based resin (e) a dimethylsiloxane / methylhexenylsiloxane copolymer having a weight average molecular weight (Mw) of about 300,000 at both ends of the molecular chain and dimethylhexenylsiloxy group-sealed is used, and the silicone-based resin (e) is silicone-based.
  • silicone gum (Galk ) of the resin (f) a dimethylvinylsiloxy group-blocked dimethylsiloxane polymer having a weight average molecular weight (Mw) of about 200,000 at both ends of the molecular chain was used.
  • the silicone-based resins (g) to (i) are all a mixture of a silicone gum (G 0 ) and a silicone resin (R) that do not contain a silicon atom-bonded alkenyl group, and the mixing ratios are different from each other.
  • MQ resin Organopolysiloxane having 0.5 units of SiO (M units) and 2 units of SiO (Q units) was used.
  • the silicone-based resin (j) is a single substance of the silicone resin (R), and the silicone resin (R) has a weight average molecular weight (Mw) of about 5,000 in 0.5 units of R 2 3 SiO (R).
  • Mw weight average molecular weight
  • MQ resin Organopolysiloxane having 2 units of SiO (M unit) and 2 units of SiO (Q unit) was used.
  • the alkenyl group content of the silicone resin used above and the SiH group content of the cross-linking agent were quantified by measuring a 1 H-NMR (nuclear magnetic resonance) spectrum at 500 MHz. Specifically, the non-volatile components of the silicone-based resin, was sufficiently dissolved in deuterated chloroform containing dimethylsulfoxide as the internal standard sample, using a JEOL Ltd. NMR apparatus "JNM ⁇ ECA500" (product name) 1 The H-NMR (Nuclear Magnetic Resonance) spectrum was measured.
  • the resonance signal area (integral value) of the dimethyl sulfoxide of the internal standard sample and the resonance signal area (integral value) of the alkenyl group in the measurement spectrum were obtained, and from the ratio, the alkenyl group per 1 g (solid content) of the silicone resin was used. The content was calculated.
  • the SiH group content of the cross-linking agent the 1 H-NMR spectrum was measured in the same manner, and the resonance signal area (integrated value) of the dimethyl sulfoxide of the internal standard sample and the resonance signal area of the SiH group (integrated value) in the measurement spectrum were measured. The integrated value) was obtained, and the content of SiH groups per 1 g (solid content) of the cross-linking agent was calculated from the ratio.
  • the cross-linking agent is internally added to the silicone resin from the beginning, the contents of the alkenyl group and the SiH group may be calculated at the same time from the 1 H-NMR spectrum.
  • the total mass of the silicone gum (G) is the total amount of the "silicone gum (G alk ) of the silicone resin (e)" and the “silicone gum (G 0 ) of the silicone resin (g)". ..
  • the total mass of the silicone resin (R) is the total amount of the "silicone resin (R) of the silicone resin (g)” and the “silicone resin (R) of the silicone resin (j)".
  • cross-linking agent (C1) obtained by mixing the cross-linking agent (m) and the cross-linking agent (n) so that the mass ratio (m) / (n) is 8.82 / 91.18 is diluted with toluene.
  • the mixture was stirred to prepare a cross-linking agent (C1) solution (solid content concentration: 20% by mass).
  • This cross-linking agent (C1) had a SiH group content of 4.0 ⁇ 10 -3 mol / g.
  • this pressure-sensitive adhesive solution was applied onto a base material 2 made of a polyethylene terephthalate (PET) film having a thickness of 38 ⁇ m. Then, the pressure-sensitive adhesive solution applied on the base material 2 is initially dried stepwise at a temperature of 40 to 90 ° C. in the first half of the drying furnace, and further, the highest heat treatment provided in the second half of the drying furnace.
  • the pressure-sensitive adhesive layer 3 was heated and cured by drying in a zone where the temperature was 160 ° C. for 3 minutes to form a pressure-sensitive adhesive layer 3 having a thickness of 20 ⁇ m after drying.
  • a release liner separated from the fluoroalkyl-modified silicone was attached to the pressure-sensitive adhesive layer 3. As a result, an adhesive tape 1 having a total thickness of 58 ⁇ m after drying was obtained.
  • Example 2 ⁇ Preparation of silicone resin solution>
  • the mass ratio (e) / (h) / (j) of the silicone-based resin (e), the silicone-based resin (h), and the silicone-based resin (j) is 1.19 / 96.99 / 1.82.
  • the silicone-based resin (S2) mixed in the above was diluted with toluene and stirred to prepare a silicone-based resin (S2) solution (solid content concentration: 30% by mass).
  • This silicone-based resin (S2) has a mixing ratio ((G) / (R)) of silicone gum (G) and silicone resin (R) of 40.0 / 60.0, and has an alkenyl group content of 2. It was 4 ⁇ 10 -6 mol / g.
  • the total mass of the silicone gum (G) is the total amount of the “silicone gum (G alk ) of the silicone resin (e)” and the “silicone gum (G 0 ) of the silicone resin (h)". ..
  • the total mass of the silicone resin (R) is the total amount of the “silicone resin (R) of the silicone resin (h)” and the “silicone resin (R) of the silicone resin (j)".
  • cross-linking agent (C2) which is a mixture of the cross-linking agent (m) and the cross-linking agent (n) so that the mass ratio (m) / (n) is 2.83 / 97.17, is diluted with toluene.
  • the mixture was stirred to prepare a cross-linking agent (C2) solution (solid content concentration: 20% by mass).
  • This cross-linking agent (C2) had a SiH group content of 2.9 ⁇ 10 -3 mol / g.
  • this pressure-sensitive adhesive solution was applied onto a base material 2 made of a polyethylene terephthalate (PET) film having a thickness of 12 ⁇ m. Then, the pressure-sensitive adhesive solution applied on the base material 2 is initially dried stepwise at a temperature of 40 to 90 ° C. in the first half of the drying furnace, and further, the highest heat treatment provided in the second half of the drying furnace.
  • the pressure-sensitive adhesive layer 3 was heated and cured by drying in a zone where the temperature was 160 ° C. for 3 minutes to form a pressure-sensitive adhesive layer 3 having a thickness of 10 ⁇ m after drying.
  • a release liner separated from the fluoroalkyl-modified silicone was attached to the pressure-sensitive adhesive layer 3. As a result, an adhesive tape 1 having a total thickness of 22 ⁇ m after drying was obtained.
  • Example 3 ⁇ Preparation of silicone resin solution> The mass ratio (e) / (g) / (j) of the silicone-based resin (e), the silicone-based resin (g), and the silicone-based resin (j) is 2.09 / 87.26 / 10.65.
  • the silicone-based resin (S3) mixed in the above was diluted with toluene and stirred to prepare a silicone-based resin (S3) solution (solid content concentration: 30% by mass).
  • This silicone-based resin (S3) has a mixing ratio ((G) / (R)) of silicone gum (G) and silicone resin (R) of 45.7 / 54.3, and has an alkenyl group content of 4. It was 2 ⁇ 10 -6 mol / g.
  • the total mass of the silicone gum (G) is the total amount of the “silicone gum (G alk ) of the silicone resin (e)” and the “silicone gum (G 0 ) of the silicone resin (g)". ..
  • the total mass of the silicone resin (R) is the total amount of the “silicone resin (R) of the silicone resin (g)” and the “silicone resin (R) of the silicone resin (j)".
  • the cross-linking agent (C3) which is a mixture of the cross-linking agent (m) and the cross-linking agent (n) so that the mass ratio (m) / (n) is 9.63 / 90.37, is diluted with toluene.
  • the mixture was stirred to prepare a cross-linking agent (C3) solution (solid content concentration: 20% by mass).
  • This cross-linking agent (C3) had a SiH group content of 4.1 ⁇ 10 -3 mol / g.
  • this pressure-sensitive adhesive solution was applied onto a base material 2 made of a polyethylene terephthalate (PET) film having a thickness of 50 ⁇ m. Then, the pressure-sensitive adhesive solution applied on the base material 2 is initially dried stepwise at a temperature of 40 to 90 ° C. in the first half of the drying furnace, and further, the highest heat treatment provided in the second half of the drying furnace.
  • the pressure-sensitive adhesive layer 3 was heated and cured by drying in a zone where the temperature was 160 ° C. for 3 minutes to form a pressure-sensitive adhesive layer 3 having a thickness of 40 ⁇ m after drying.
  • a release liner separated from the fluoroalkyl-modified silicone was attached to the pressure-sensitive adhesive layer 3. As a result, an adhesive tape 1 having a total thickness of 90 ⁇ m after drying was obtained.
  • Example 4 ⁇ Preparation of silicone resin solution> The mass ratio (b) / (e) / (g) of the silicone-based resin (b), the silicone-based resin (e), and the silicone-based resin (g) is 49.51 / 0.97 / 49.52.
  • the silicone-based resin (S4) mixed in the above was diluted with toluene and stirred to prepare a silicone-based resin (S4) solution (solid content concentration: 30% by mass).
  • This silicone-based resin (S4) has a mixing ratio ((G) / (R)) of silicone gum (G) and silicone resin (R) of 43.1 / 56.9, and has an alkenyl group content of 2. It was .8 ⁇ 10 -6 mol / g.
  • the total mass of the silicone gum (G) is "silicone gum (G alk ) of the silicone resin (b)", “silicone gum (G alk)” of the silicone resin (e), and “silicone resin (g alk)”. ) Silicone gum (G 0 ) ”.
  • the total mass of the silicone resin (R) is the total amount of the “silicone resin (R) of the silicone resin (b)” and the “silicone resin (R) of the silicone resin (g)”.
  • the cross-linking agent (C4) which is a mixture of the cross-linking agent (m) and the cross-linking agent (n) so that the mass ratio (m) / (n) is 5.50 / 94.50, is diluted with toluene.
  • the mixture was stirred to prepare a cross-linking agent (C4) solution (solid content concentration: 20% by mass).
  • This cross-linking agent (C4) had a SiH group content of 3.4 ⁇ 10 -3 mol / g.
  • this pressure-sensitive adhesive solution was applied onto a base material 2 made of a polyethylene terephthalate (PET) film having a thickness of 125 ⁇ m. Then, the pressure-sensitive adhesive solution applied on the base material 2 is initially dried stepwise at a temperature of 40 to 90 ° C. in the first half of the drying furnace, and further, the highest heat treatment provided in the second half of the drying furnace.
  • the pressure-sensitive adhesive layer 3 was heated and cured by drying in a zone where the temperature was 160 ° C. for 3 minutes to form a pressure-sensitive adhesive layer 3 having a thickness of 20 ⁇ m after drying.
  • a release liner separated from the fluoroalkyl-modified silicone was attached to the pressure-sensitive adhesive layer 3. As a result, an adhesive tape 1 having a total thickness of 145 ⁇ m after drying was obtained.
  • the mass ratio (b) / (e) / (g) of the silicone-based resin (b), the silicone-based resin (e), and the silicone-based resin (g) is 60.37 / 1.18 / 38.45.
  • the silicone-based resin (S5) mixed in the above was diluted with toluene and stirred to prepare a silicone-based resin (S5) solution (solid content concentration: 30% by mass).
  • This silicone-based resin (S5) has a mixing ratio ((G) / (R)) of silicone gum (G) and silicone resin (R) of 41.5 / 58.5, and has an alkenyl group content of 3. It was 4 ⁇ 10 -6 mol / g.
  • the total mass of the silicone gum (G) is "silicone gum (G alk ) of the silicone resin (b)", “silicone gum (G alk ) of the silicone resin (e)", and “silicone resin (G alk)”.
  • g) is the total amount of silicone gum (G 0) ”.
  • the total mass of the silicone resin (R) is the total amount of the “silicone resin (R) of the silicone resin (b)" and the "silicone resin (R) of the silicone resin (g)”.
  • the mass ratio (b) / (e) / (g) of the silicone-based resin (b), the silicone-based resin (e), and the silicone-based resin (g) is 39.69 / 0.78 / 59.53.
  • the silicone-based resin (S6) mixed in the above was diluted with toluene and stirred to prepare a silicone-based resin (S6) solution (solid content concentration: 30% by mass).
  • This silicone-based resin (S6) has a mixing ratio ((G) / (R)) of silicone gum (G) and silicone resin (R) of 44.4 / 55.6, and has an alkenyl group content of 2. It was 3 ⁇ 10 -6 mol / g.
  • the total mass of the silicone gum (G) is "silicone gum (G alk ) of the silicone resin (b)", “silicone gum (G alk ) of the silicone resin (e)", and “silicone resin (G alk)”.
  • g) is the total amount of silicone gum (G 0) ”.
  • the total mass of the silicone resin (R) is the total amount of the “silicone resin (R) of the silicone resin (b)" and the "silicone resin (R) of the silicone resin (g)”.
  • the mass ratio (a) / (e) / (g) of the silicone-based resin (a), the silicone-based resin (e), and the silicone-based resin (g) is 49.51 / 0.98 / 49.51.
  • the silicone-based resin (S7) mixed in the above was diluted with toluene and stirred to prepare a silicone-based resin (S7) solution (solid content concentration: 30% by mass).
  • This silicone-based resin (S7) has a mixing ratio ((G) / (R)) of silicone gum (G) and silicone resin (R) of 45.5 / 54.5, and has an alkenyl group content of 2. It was .9 ⁇ 10 -6 mol / g.
  • the total mass of the silicone gum (G) is "silicone gum (G alk ) of the silicone resin (a)", “silicone gum (G alk ) of the silicone resin (e)", and “silicone resin (G alk)”.
  • Silicone gum (G 0 ) is the total amount.
  • the total mass of the silicone resin (R) is the total amount of the “silicone resin (R) of the silicone resin (a)” and the "silicone resin (R) of the silicone resin (g)”.
  • the mass ratio (c) / (e) / (h) / (j) of the silicone-based resin (c), the silicone-based resin (e), the silicone-based resin (h), and the silicone-based resin (j) is 39.46.
  • the silicone resin (S8) mixed so as to be /0.77 / 59.18 / 0.59 is diluted and stirred with toluene to prepare a silicone resin (S8) solution (solid content concentration: 30% by mass). did.
  • This silicone-based resin (S8) has a mixing ratio ((G) / (R)) of silicone gum (G) and silicone resin (R) of 56.0 / 44.0 and an alkenyl group content of 2.
  • the total mass of the silicone gum (G) is "silicone gum (G alk ) of the silicone resin (c)", “silicone gum (G alk ) of the silicone resin (e)", and “silicone resin (G alk)”.
  • h) is the total amount of silicone gum (G 0) ”.
  • the total mass of the silicone resin (R) is that of "silicone resin (R) of silicone resin (c)", “silicone resin (R) of silicone resin (h)” and “silicone resin (j)”. It is the total amount with "silicone resin (R)".
  • Example 9 ⁇ Preparation of silicone resin solution>
  • the mass ratio (b) / (e) / (g) / (j) of the silicone-based resin (b), the silicone-based resin (e), the silicone-based resin (g), and the silicone-based resin (j) is 33.14.
  • the silicone-based resin (S9) mixed so as to be /0.07 / 66.29 / 0.50 is diluted and stirred with toluene to prepare a silicone-based resin (S9) solution (solid content concentration: 30% by mass). did.
  • This silicone-based resin (S9) has a mixing ratio ((G) / (R)) of silicone gum (G) and silicone resin (R) of 44.8 / 55.2, and has an alkenyl group content of 7.
  • the total mass of the silicone gum (G) is "silicone gum (G alk ) of the silicone resin (b)", “silicone gum (G alk ) of the silicone resin (e)", and “silicone resin (G alk)".
  • g) is the total amount of silicone gum (G 0) ”.
  • the total mass of the silicone resin (R) is that of "silicone resin (R) of silicone resin (b)", “silicone resin (R) of silicone resin (g)” and “silicone resin (j)”. It is the total amount with "silicone resin (R)".
  • cross-linking agent (C5) which is a mixture of the cross-linking agent (m) and the cross-linking agent (n) so that the mass ratio (m) / (n) is 0.58 / 99.42, is diluted with toluene.
  • the mixture was stirred to prepare a cross-linking agent (C5) solution (solid content concentration: 20% by mass).
  • This cross-linking agent (C5) had a SiH group content of 2.5 ⁇ 10 -3 mol / g.
  • this pressure-sensitive adhesive solution was applied onto a base material 2 made of a polyethylene terephthalate (PET) film having a thickness of 38 ⁇ m. Then, the pressure-sensitive adhesive solution applied on the base material 2 is initially dried stepwise at a temperature of 40 to 90 ° C. in the first half of the drying furnace, and further, the highest heat treatment provided in the second half of the drying furnace.
  • the pressure-sensitive adhesive layer 3 was heated and cured by drying in a zone where the temperature was 160 ° C. for 3 minutes to form a pressure-sensitive adhesive layer 3 having a thickness of 25 ⁇ m after drying.
  • a release liner separated from the fluoroalkyl-modified silicone was attached to the pressure-sensitive adhesive layer 3. As a result, an adhesive tape 1 having a total thickness of 63 ⁇ m after drying was obtained.
  • the total mass of the silicone gum (G) is "silicone gum (G alk ) of the silicone resin (c)", “silicone gum (G alk ) of the silicone resin (e)", and “silicone resin (G alk)”.
  • Silicone gum (G 0 ) is the total amount.
  • the total mass of the silicone resin (R) is that of "silicone resin (R) of silicone resin (c)", “silicone resin (R) of silicone resin (g)” and “silicone resin (j)”. It is the total amount with "silicone resin (R)".
  • cross-linking agent (C6) which is a mixture of the cross-linking agent (m) and the cross-linking agent (n) so that the mass ratio (m) / (n) is 8.04 / 91.9, is diluted with toluene.
  • the mixture was stirred to prepare a cross-linking agent (C6) solution (solid content concentration: 20% by mass).
  • This cross-linking agent (C6) had a SiH group content of 3.8 ⁇ 10 -3 mol / g.
  • this pressure-sensitive adhesive solution was applied onto a base material 2 made of a polyethylene terephthalate (PET) film having a thickness of 38 ⁇ m. Then, the pressure-sensitive adhesive solution applied on the base material 2 is initially dried stepwise at a temperature of 40 to 90 ° C. in the first half of the drying furnace, and further, the highest heat treatment provided in the second half of the drying furnace.
  • the pressure-sensitive adhesive layer 3 was heated and cured by drying in a zone where the temperature was 160 ° C. for 3 minutes to form a pressure-sensitive adhesive layer 3 having a thickness of 20 ⁇ m after drying.
  • a release liner separated from the fluoroalkyl-modified silicone was attached to the pressure-sensitive adhesive layer 3. As a result, an adhesive tape 1 having a total thickness of 58 ⁇ m after drying was obtained.
  • the silicone-based resin (S11) solution was prepared as follows, the silicone-based resin (S1) solution was changed to the silicone-based resin (S11) solution, and a cross-linking agent and an organic peroxide were added in the preparation of the pressure-sensitive adhesive solution. Instead, the amount of the solution of the photosensitive platinum (Pt) catalyst was changed to 5.33 parts by mass (0.80 parts by mass in terms of solid content), and the thickness of the pressure-sensitive adhesive layer 3 after drying was changed to 35 ⁇ m. An adhesive tape 1 having a total thickness of 73 ⁇ m after drying was obtained in the same manner as in Example 1.
  • silicone resin (S11) which is a mixture of the silicone resin (a) and the silicone resin (f) so that the mass ratio (a) / (f) is 99.90 / 0.10, is diluted with toluene.
  • the mixture was stirred to prepare a silicone resin (S11) solution (solid content concentration: 30% by mass).
  • This silicone-based resin (S11) has a mixing ratio ((G) / (R)) of silicone gum (G) and silicone resin (R) of 40.1 / 59.9, and has an alkenyl group content of 4. It was 7 ⁇ 10 -6 mol / g.
  • the total mass of the silicone gum (G) is the total amount of the “silicone gum (G alk ) of the silicone resin (a)” and the “silicone gum (G alk ) of the silicone resin (f)". ..
  • the total mass of the silicone resin (R) is the amount of the silicone resin (R) of the silicone resin (a).
  • the total mass of the silicone gum (G) is "silicone gum (G alk ) of the silicone resin (b)", “silicone gum (G alk ) of the silicone resin (e)", and “silicone resin (G alk)”.
  • g) is the total amount of silicone gum (G 0) ”.
  • the total mass of the silicone resin (R) is the total amount of the “silicone resin (R) of the silicone resin (b)" and the "silicone resin (R) of the silicone resin (g)”.
  • this pressure-sensitive adhesive solution was applied onto a base material 2 made of a polyethylene terephthalate (PET) film having a thickness of 38 ⁇ m. Then, the pressure-sensitive adhesive solution applied on the base material 2 is initially dried stepwise at a temperature of 40 to 90 ° C. in the first half of the drying furnace, and further, the highest heat treatment provided in the second half of the drying furnace.
  • the pressure-sensitive adhesive layer 3 was heated and cured by drying in a zone where the temperature was 160 ° C. for 3 minutes to form a pressure-sensitive adhesive layer 3 having a thickness of 20 ⁇ m after drying.
  • a release liner separated from the fluoroalkyl-modified silicone was attached to the pressure-sensitive adhesive layer 3. As a result, an adhesive tape 1 having a total thickness of 58 ⁇ m after drying was obtained.
  • silicone resin (S13) which is a mixture of the silicone resin (e) and the silicone resin (h) so that the mass ratio (e) / (h) is 0.26 / 99.74, is diluted with toluene.
  • the mixture was stirred to prepare a silicone resin (S13) solution (solid content concentration: 30% by mass).
  • This silicone-based resin (S13) has a mixing ratio ((G) / (R)) of silicone gum (G) and silicone resin (R) of 40.2 / 59.8, and has an alkenyl group content of 5. It was 2 ⁇ 10 -7 mol / g.
  • the total mass of the silicone gum (G) is the total amount of the “silicone gum (G alk ) of the silicone resin (e)" and the “silicone gum (G 0 ) of the silicone resin (h)". ..
  • the total mass of the silicone resin (R) is the amount of the silicone resin (R) of the silicone resin (h).
  • the cross-linking agent (C7) which is a mixture of the cross-linking agent (m) and the cross-linking agent (n) so that the mass ratio (m) / (n) is 1.15 / 98.85, is diluted with toluene.
  • the mixture was stirred to prepare a cross-linking agent (C7) solution (solid content concentration: 20% by mass).
  • This cross-linking agent (C7) had a SiH group content of 2.6 ⁇ 10 -3 mol / g.
  • this pressure-sensitive adhesive solution was applied onto a base material 2 made of a polyethylene terephthalate (PET) film having a thickness of 38 ⁇ m. Then, the pressure-sensitive adhesive solution applied on the base material 2 is initially dried stepwise at a temperature of 40 to 90 ° C. in the first half of the drying furnace, and further, the highest heat treatment provided in the second half of the drying furnace.
  • the pressure-sensitive adhesive layer 3 was heated and cured by drying in a zone where the temperature was 160 ° C. for 3 minutes to form a pressure-sensitive adhesive layer 3 having a thickness of 20 ⁇ m after drying.
  • a release liner separated from the fluoroalkyl-modified silicone was attached to the pressure-sensitive adhesive layer 3. As a result, an adhesive tape 1 having a total thickness of 58 ⁇ m after drying was obtained.
  • the total mass of the silicone gum (G) is the total amount of the “silicone gum (G alk ) of the silicone resin (e)” and the “silicone gum (G 0 ) of the silicone resin (i)". ..
  • the total mass of the silicone resin (R) is the total amount of the “silicone resin (R) of the silicone resin (i)” and the “silicone resin (R) of the silicone resin (j)".
  • cross-linking agent (C8) which is a mixture of the cross-linking agent (m) and the cross-linking agent (n) so that the mass ratio (m) / (n) is 14.88 / 85.12, is diluted with toluene.
  • the mixture was stirred to prepare a cross-linking agent (C8) solution (solid content concentration: 20% by mass).
  • This cross-linking agent (C8) had a SiH group content of 5.0 ⁇ 10 -3 mol / g.
  • this pressure-sensitive adhesive solution was applied onto a base material 2 made of a polyethylene terephthalate (PET) film having a thickness of 38 ⁇ m. Then, the pressure-sensitive adhesive solution applied on the base material 2 is initially dried stepwise at a temperature of 40 to 90 ° C. in the first half of the drying furnace, and further, the highest heat treatment provided in the second half of the drying furnace.
  • the pressure-sensitive adhesive layer 3 was heated and cured by drying in a zone where the temperature was 160 ° C. for 3 minutes to form a pressure-sensitive adhesive layer 3 having a thickness of 20 ⁇ m after drying.
  • a release liner separated from the fluoroalkyl-modified silicone was attached to the pressure-sensitive adhesive layer 3. As a result, an adhesive tape 1 having a total thickness of 58 ⁇ m after drying was obtained.
  • the total mass of the silicone gum (G) is "silicone gum (G alk ) of the silicone resin (b)", “silicone gum (G alk ) of the silicone resin (e)", and “silicone resin (G alk)”.
  • h) is the total amount of silicone gum (G 0) ”.
  • the total mass of the silicone resin (R) is that of "silicone resin (R) of silicone resin (b)", “silicone resin (R) of silicone resin (h)” and “silicone resin (j)”. It is the total amount with "silicone resin (R)".
  • cross-linking agent (C9) which is a mixture of the cross-linking agent (m) and the cross-linking agent (n) so that the mass ratio (m) / (n) is 4.19 / 95.81, is diluted with toluene.
  • the mixture was stirred to prepare a cross-linking agent (C9) solution (solid content concentration: 20% by mass).
  • This cross-linking agent (C9) had a SiH group content of 3.1 ⁇ 10 -3 mol / g.
  • this pressure-sensitive adhesive solution was applied onto a base material 2 made of a polyethylene terephthalate (PET) film having a thickness of 38 ⁇ m. Then, the pressure-sensitive adhesive solution applied on the base material 2 is initially dried stepwise at a temperature of 40 to 90 ° C. in the first half of the drying furnace, and further, the highest heat treatment provided in the second half of the drying furnace.
  • the pressure-sensitive adhesive layer 3 was heated and cured by drying in a zone where the temperature was 160 ° C. for 3 minutes to form a pressure-sensitive adhesive layer 3 having a thickness of 30 ⁇ m after drying.
  • a release liner separated from the fluoroalkyl-modified silicone was attached to the pressure-sensitive adhesive layer 3. As a result, an adhesive tape 1 having a total thickness of 68 ⁇ m after drying was obtained.
  • the total mass of the silicone gum (G) is "silicone gum (G alk ) of the silicone resin (d)", “silicone gum (G alk ) of the silicone resin (e)", and “silicone resin (G alk)”.
  • Silicone gum (G 0 ) is the total amount.
  • the total mass of the silicone resin (R) is the total amount of the “silicone resin (R) of the silicone resin (d)” and the “silicone resin (R) of the silicone resin (i)”.
  • this pressure-sensitive adhesive solution was applied onto a base material 2 made of a polyethylene terephthalate (PET) film having a thickness of 38 ⁇ m. Then, the pressure-sensitive adhesive solution applied on the base material 2 is initially dried stepwise at a temperature of 40 to 90 ° C. in the first half of the drying furnace, and further, the highest heat treatment provided in the second half of the drying furnace.
  • the pressure-sensitive adhesive layer 3 was heated and cured by drying in a zone where the temperature was 160 ° C. for 3 minutes to form a pressure-sensitive adhesive layer 3 having a thickness of 20 ⁇ m after drying.
  • a release liner separated from the fluoroalkyl-modified silicone was attached to the pressure-sensitive adhesive layer 3. As a result, an adhesive tape 1 having a total thickness of 58 ⁇ m after drying was obtained.
  • Tables 1 to 3 show the layer structure and the composition of the pressure-sensitive adhesive layer 3 in the pressure-sensitive adhesive tapes 1 produced in Examples 1 to 10 and Comparative Examples 1 to 6.
  • Adhesive strength test (before UV irradiation) Adhesive Tapes 1 produced in Examples 1 to 10 and Comparative Examples 1 to 6 have adhesive strength against BA-SUS in accordance with the method described in the adhesive tape / adhesive sheet test method (JIS Z 0237 (2009)). A test (peeling adhesive strength test) was performed.
  • the adhesive tape 1 from which the release liner has been peeled off is attached to a stainless steel plate (SUS304) having a surface roughness (Ra) of 50 ⁇ 25 nm treated with bright annealing (BA), and a roller having a mass of 2000 g is attached to a roller having a mass of 5 mm / s. It was reciprocated once at a speed and crimped. Then, after leaving it to stand for 20 to 40 minutes, it was peeled off from the stainless steel plate at a speed of 5 mm / s in the 180 ° direction using a tensile tester, and the adhesive strength to the polished SUS plate was measured.
  • SUS304 stainless steel plate having a surface roughness (Ra) of 50 ⁇ 25 nm treated with bright annealing (BA)
  • Ra roller having a mass of 2000 g is attached to a roller having a mass of 5 mm / s. It was reciprocated once at a speed and crimped. Then, after leaving
  • the adhesive strength test was performed on the adhesive tape 1 before it was irradiated with ultraviolet rays (UV). Further, as a result of the adhesive strength test, considering the fixing force when the adhesive tape 1 is used for dicing a semiconductor material, it is preferably 2.4 N / 10 mm or more, and a semiconductor chip or the like individualized by dicing or the like. From the viewpoint of pick-up property, it is preferably 5.5 N / 10 mm or less. More preferably, it is 2.8 N / 10 mm or more and 5.5 N / 10 mm or less.
  • Ball tack test (2-1) Initial (before UV irradiation) Ball tack measurement Adhesive tape / adhesive tape 1 prepared in Examples 1 to 10 and Comparative Examples 1 to 6 before UV irradiation. The ball tack test was performed according to the method described in the sheet test method (JIS Z 0237 (2009)).
  • the UV irradiation was performed by using a high-pressure mercury lamp and adjusting the UV having a wavelength of 365 nm so that the integrated light intensity was 1200 mJ / cm 2. Although was similarly measured for the ball tack when the cumulative amount of light with 3000 mJ / cm 2, the difference between the case where the cumulative amount of light with 1200 mJ / cm 2 was observed, here, the integrated light quantity of 1200 mJ / It was evaluated as cm 2.
  • the ball tack after UV irradiation (ball No.) was compared with the initial (before UV irradiation) ball tack (ball No.).
  • the adhesive tape 1 was held under the condition of 33% RH, and the elapsed time (falling time (minutes)) until the adhesive tape 1 was peeled off from the stainless steel plate and dropped was measured. Further, the fracture mode when the adhesive tape 1 was peeled off from the stainless steel plate (whether the fracture mode between the adhesive layer 3 and the stainless steel plate was interfacial peeling or cohesive fracture) was observed. The drop time in the holding force test was measured up to 2880 minutes. Further, as a result of the holding force test shown in Tables 4 to 6 described later, the drop time (minutes) and the breaking mode of the adhesive tape 1 are shown.
  • FIG. 3 is a schematic view showing the relationship between the crosslink density of the silicone-based resin in the pressure-sensitive adhesive layer 3 and the result (falling time) of the holding force test of the pressure-sensitive adhesive tape 1.
  • the breaking mode of the adhesive tape 1 with respect to the stainless steel plate by the holding force test is changed to [Aggregation of the adhesive layer 3]. It changes in the order of [break (fall)] ⁇ [hold (do not fall)] ⁇ [intersection peeling (fall) between the adhesive layer 3 and the stainless steel plate].
  • the holding force (falling time) of the adhesive tape 1 increases as the cross-linking density of the silicone-based resin in the adhesive layer 3 increases. To rise.
  • the holding force (falling time) of the adhesive tape 1 increases as the cross-linking density of the silicone-based resin in the adhesive layer 3 increases. descend. This is because the cohesive force of the adhesive layer 3 increases as the cross-linking density of the silicone-based resin increases, the adhesive force of the adhesive tape 1 decreases, and as a result, the adhesive tape easily peels off from the stainless steel plate and falls off. It is presumed that this is the reason.
  • At least the destruction mode after UV irradiation is preferably retention or interfacial peeling, and at least the destruction mode after UV irradiation is more preferably interfacial peeling, and the initial (before UV irradiation) and It is more preferable that both destruction modes after UV irradiation are interfacial peeling.
  • the drop time is the initial (before UV irradiation) when the adhesive tape 1 is used for dicing the semiconductor material.
  • the adhesive tape 1 is used for dicing the semiconductor element substrate or the like, when the obtained semiconductor chip or the like is peeled off from the adhesive tape 1, the adhesive tape 1 is irradiated with UV to leave adhesive residue on the semiconductor chip or the like. It is less likely to occur.
  • the adhesive tape 1 produced in Examples 1 to 10 and Comparative Examples 1 to 6 was subjected to an adhesive residue test on a silicone resin.
  • agent A and agent B of a silicone resin containing a methyl group (KER-2500N (trade name) manufactured by Shin-Etsu Chemical Co., Ltd.), which is a silicone resin for LED devices, are mixed at a mixing ratio of 1: 1 to prepare a mixed solution.
  • This mixed solution was applied to a stainless steel plate and heated and cured under the conditions of 100 ° C. ⁇ 1 hour and further 150 ° C. ⁇ 2 hours to prepare a silicone test piece A.
  • the A agent and the B agent of a silicone resin containing a phenyl group (KER-6110 (trade name) manufactured by Shin-Etsu Chemical Co., Ltd.), which is a silicone resin for LED devices, are mixed at a mixing ratio of 3: 7.
  • a mixed solution was prepared. This mixed solution was applied to a stainless steel plate and heated and cured under the conditions of 100 ° C. ⁇ 2 hours and further 150 ° C. ⁇ 5 hours to prepare a silicone test piece B.
  • the release liner of the adhesive tape 1 was peeled off, the adhesive layer 3 was attached to the silicone test pieces A and B, respectively, and a roller having a mass of 2000 g was reciprocated once at a speed of 5 mm / s and crimped.
  • UV is irradiated from the base material 2 side of the adhesive tape 1 in the same manner as described in the measurement of ball tack after UV irradiation, and then left in an environment of a temperature of 40 ° C. and a humidity of 90% RH for 120 hours. did.
  • the adhesive tape 1 was peeled off at a speed of 800 mm / s to 1200 mm / s in the 90 ° direction with respect to the silicone test pieces A and B, and the adhesive residue on the silicone test pieces A and B was visually confirmed. ..
  • Adhesive Residual Test Against Epoxy Resin The adhesive tape 1 produced in Examples 1 to 10 and Comparative Examples 1 to 6 was subjected to an adhesive residue test on an epoxy resin.
  • the agent layer 3 was attached, and a roller having a mass of 2000 g was reciprocated once at a speed of 5 mm / s and pressure-bonded.
  • UV is irradiated from the base material 2 side of the adhesive tape 1 in the same manner as described in the measurement of ball tack after UV irradiation, and then left in an environment of a temperature of 40 ° C. and a humidity of 90% RH for 120 hours. did. Then, at room temperature, the adhesive tape 1 was peeled off from the epoxy test piece in the 90 ° direction at a speed of 800 mm / s to 1200 mm / s, and the adhesive residue on the epoxy test piece was visually confirmed.
  • the anti-silicone resin adhesive residue test and the anti-epoxy resin adhesive residue test were evaluated according to the following criteria.
  • the evaluation of A or B was accepted.
  • Adhesive residue is seen in the range D: Adhesive residue is seen in the range of 5% or more per unit area of the test piece, or glue residue is seen at the edge part of the test piece.
  • the adhesive layer 3 of the adhesive tape 1 from which the release liner was peeled off was attached to the dicing ring, and after cutting off the portion protruding from the ring, a fluorine-based release film (SS1A (trade name) manufactured by Nippa Corporation), It was bonded to a thickness of 75 ⁇ m).
  • a roller having a mass of 2000 g was reciprocated to crimp the adhesive tape 1 and the ring portion.
  • the fluorine-based release film was peeled off, and the dicing test piece was attached to the pressure-sensitive adhesive layer 3 at the center of the ring and pressure-bonded.
  • a dicing test piece was cut into a 10 mm ⁇ 10 mm chip together with the adhesive tape 1 with a dicing blade manufactured by Disco Corporation. .. At this time, the number of scattered chips was measured and the fixing force in the dicing test was evaluated. Subsequently, the adhesive tape 1 attached to the chip pieced into pieces of 10 mm ⁇ 10 mm was irradiated with UV in the same conditions as described in the measurement of ball tack after UV irradiation.
  • the individualized chips were picked up from the adhesive tape 1, and the presence or absence of adhesive residue on the chip was visually confirmed to evaluate the adhesive residue in the dicing test.
  • the number of chips that failed to be picked up was measured to evaluate the pick-up property in the dicing test.
  • the fixing force in the dicing test was evaluated according to the following criteria.
  • the evaluation of A or B was accepted.
  • the adhesive residue in the dicing test was evaluated according to the following criteria. The evaluation of A was passed. A: No adhesive residue is seen on the tip D: Adhesive residue is seen on the tip, or adhesive threading is seen on the side of the tip.
  • the pick-up property in the dicing test was evaluated according to the following criteria. The evaluation of A or B was accepted. A: 0 out of 100 chips failed to pick up B: 1 out of 100 chips failed to pick up C: 2 out of 100 chips failed to pick up D: failed to pick up 3 or more out of 100 chips
  • Test Results Tables 4 to 6 show the evaluation results for the adhesive tape 1 of Examples 1 to 10 and Comparative Examples 1 to 6.
  • the adhesive tape 1 of Examples 1 to 10 is useful as an adhesive tape for dicing of a semiconductor material, more specifically, an adhesive tape for dicing which is attached from the sealing resin side of the semiconductor element substrate and used for dicing. It was confirmed that.
  • Examples 5, 7 and 10 in which the content of the silicon atom-bonded alkenyl group in the entire silicone-based resin is in the range of 2.9 ⁇ 10 -6 mol / g or more and 4.1 ⁇ 10 -6 mol / g or less.
  • the adhesive tape 1 of No. 1 had better evaluation results in all the test items than the adhesive tape 1 of the other examples.
  • the mixing ratio ((G) / (R)) of the silicone gum (G) and the silicone resin (R) of Examples 5, 7 and 10 is 41.5 / 58.5 to 50.4 / 49. It was in the range of 0.6.
  • the adhesive tapes 1 of Comparative Examples 1 to 6 in which the pressure-sensitive adhesive layer 3 does not satisfy the requirements of the present invention are subjected to a silicone resin adhesive residue test, an epoxy resin adhesive residue test, and dicing. In the tests (fixing force, adhesive residue and pick-up property), it was confirmed that any of the test results was inferior to that of Examples 1 to 10.
  • the cross-linking reaction of the silicone-based resin does not occur even if it is heated or UV-irradiated.
  • the cohesive force was insufficient. Therefore, a large amount of adhesive residue was observed in the silicone resin adhesive residue test, the epoxy resin adhesive residue test, and the epoxy resin adhesive residue test for confirming practicality.
  • the dicing test since the increase in the cohesive force after UV irradiation was not observed as described above, the pick-up property of the chip of the dicing test piece was inferior, and adhesive residue was observed on the chip.
  • the cohesive force increases in the initial stage before UV irradiation.
  • the cohesive force did not increase even after UV irradiation, and no change was observed in the results of the ball tack test and the holding force test before and after UV irradiation. Therefore, a large amount of adhesive residue was observed in the silicone resin adhesive residue test and the epoxy resin adhesive residue test.
  • the pick-up property of the chip of the dicing test piece was slightly inferior, and a little adhesive residue was observed on the chip.
  • a ball tack test and a ball tack test are performed before and after UV irradiation. No change was observed in the results of the holding power test, and the effect of increasing the cohesive power of the pressure-sensitive adhesive layer 3 by UV irradiation was insufficient. Therefore, a large amount of adhesive residue was observed in the silicone resin adhesive residue test and the epoxy resin adhesive residue test. Also, in the dicing test, the pick-up property of the chip of the dicing test piece was inferior, and adhesive residue was observed on the chip.
  • the dicing test piece is fixed in the dicing test.
  • the force was low, and many chips were scattered during dicing.
  • This is a step before UV irradiation, that is, a heating / drying step for forming the pressure-sensitive adhesive layer 3 on the base material 2, and a cross-linking reaction of the silicone gum (G) of the silicone-based resin already in the pressure-sensitive adhesive layer 3. It is presumed that this was due to the progress of the thermal polymerization initiator, which was cured and became too hard. No adhesive residue was found in the silicone resin adhesive residue test and the epoxy resin adhesive residue test. Also, in the dicing test, no adhesive residue was found on the chips that did not scatter.
  • the adhesive layer Since there are many silicone resins (R) that hardly contribute to the cross-linking of No. 3, the effect of increasing the cohesive force of the pressure-sensitive adhesive layer 3 by UV irradiation was insufficient. Therefore, in the anti-silicone resin adhesive residue test and the anti-epoxy resin adhesive residue test, a slightly large amount of adhesive residue was observed. Also, in the dicing test, the pick-up property of the chip of the dicing test piece was slightly inferior, and a little adhesive residue was observed on the chip.
  • Adhesive tape 1 ... Adhesive tape, 2 ... Base material, 3 ... Adhesive layer, 100 ... Semiconductor element substrate, 101 ... Substrate, 102 ... Semiconductor element, 103 ... Encapsulating resin, 200 ... Semiconductor chip

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)

Abstract

La présente invention concerne un ruban adhésif pour le découpage en dés qui comprend un matériau de base et une couche adhésive. La couche adhésive comprend une composition adhésive contenant : une résine à base de silicone dans laquelle sont mélangées une gomme de silicone (G) et une résine de silicone (R) ; un organopolysiloxane ayant au moins deux atomes d'hydrogène liés à un atome de silicium par molécule utilisé comme agent de réticulation ; un peroxyde utilisé comme initiateur de polymérisation thermique ; et un catalyseur de platine photosensible (Pt). Le rapport de mélange de la gomme de silicone (G) et de la résine de silicone (R) s'inscrit dans la plage de 40,0/60,0 à 56,0/44,0. La gomme de silicone (G) comprend une gomme de silicone (Galk) comprenant un organopolysiloxane contenant un groupe alcényle lié à un atome de silicium, la teneur en groupes alcényle liés à un atome de silicium s'inscrivant dans la plage de 7,0 × 10-7 à 5,5 × 10-6 mol/g.
PCT/JP2020/041705 2019-12-20 2020-11-09 Ruban adhésif pour le découpage en dés et procédé de production de puce semiconductrice WO2021124724A1 (fr)

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KR1020227020562A KR20220117234A (ko) 2019-12-20 2020-11-09 다이싱용 점착 테이프 및 반도체칩의 제조 방법
JP2021565362A JPWO2021124724A1 (fr) 2019-12-20 2020-11-09
CN202080088643.XA CN114868229A (zh) 2019-12-20 2020-11-09 切割用粘着胶带和半导体芯片的制造方法

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JP2021042332A (ja) * 2019-09-12 2021-03-18 信越化学工業株式会社 付加硬化型シリコーン組成物、その硬化物、光反射材、及び、光半導体装置
WO2023042744A1 (fr) * 2021-09-14 2023-03-23 ダウ・東レ株式会社 Composition d'organopolysiloxane durcissable, couche adhésive d'organopolysiloxane obtenue par durcissement de celle-ci, et stratifié
WO2023042743A1 (fr) * 2021-09-14 2023-03-23 ダウ・東レ株式会社 Composition d'organopolysiloxane thermofusible durcissable, produit durci correspondant et procédé pour produire un film, etc. comprenant ladite composition
EP4144808A4 (fr) * 2020-04-30 2024-06-05 Shinetsu Chemical Co Adhésif temporaire pour le traitement de tranche, stratifié de tranche et procédé de production de tranche mince

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JP2016122812A (ja) * 2014-12-25 2016-07-07 日立マクセル株式会社 ダイシング用粘着テープおよび半導体チップの製造方法
WO2018056298A1 (fr) * 2016-09-26 2018-03-29 東レ・ダウコーニング株式会社 Stratifié, son procédé de fabrication et procédé de fabrication d'un composant électronique
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JP2021042332A (ja) * 2019-09-12 2021-03-18 信越化学工業株式会社 付加硬化型シリコーン組成物、その硬化物、光反射材、及び、光半導体装置
EP4144808A4 (fr) * 2020-04-30 2024-06-05 Shinetsu Chemical Co Adhésif temporaire pour le traitement de tranche, stratifié de tranche et procédé de production de tranche mince
WO2023042744A1 (fr) * 2021-09-14 2023-03-23 ダウ・東レ株式会社 Composition d'organopolysiloxane durcissable, couche adhésive d'organopolysiloxane obtenue par durcissement de celle-ci, et stratifié
WO2023042743A1 (fr) * 2021-09-14 2023-03-23 ダウ・東レ株式会社 Composition d'organopolysiloxane thermofusible durcissable, produit durci correspondant et procédé pour produire un film, etc. comprenant ladite composition

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TW202132525A (zh) 2021-09-01
JPWO2021124724A1 (fr) 2021-06-24

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