WO2021120386A1 - 集成封装显示模组 - Google Patents

集成封装显示模组 Download PDF

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Publication number
WO2021120386A1
WO2021120386A1 PCT/CN2020/076195 CN2020076195W WO2021120386A1 WO 2021120386 A1 WO2021120386 A1 WO 2021120386A1 CN 2020076195 W CN2020076195 W CN 2020076195W WO 2021120386 A1 WO2021120386 A1 WO 2021120386A1
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Prior art keywords
display module
transparent layer
substrate
package display
layer
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PCT/CN2020/076195
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English (en)
French (fr)
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梁文骥
赵春雷
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东莞阿尔泰显示技术有限公司
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Publication of WO2021120386A1 publication Critical patent/WO2021120386A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

Definitions

  • the present invention relates to the field of LED display technology, in particular to an integrated package display module.
  • the screen body of the LED display is formed by splicing multiple display modules.
  • the integrated packaging technology is a product that directly encapsulates the LED chip on the LED driver board, eliminating the need for SMD packaging reflow, and adopts a one-time overall packaging technology to achieve integration. It has the technical characteristics of simple structure, easy realization of high density, high reliability, and low packaging cost.
  • the traditional integrated package display module includes a substrate 1, a driver IC 2, an LED chip 3, and a translucent layer 4 doped with melanin.
  • the driver IC 2 is mounted on the bottom surface of the substrate 1
  • the LED chip 3 is mounted on the bottom surface of the substrate 1.
  • the translucent layer 4 is arranged on the top surface of the substrate 1 and covers the LED chip 3.
  • the materials of the traditional translucent layer are epoxy resin, silicone resin, and silica gel.
  • the technical problem to be solved by the present invention is to propose an integrated package display module based on the above-mentioned shortcomings of the prior art, which solves the problems of easy aging of the translucent layer and low service life of the integrated package display module.
  • the integrated package display module includes a substrate, a driver IC, and an LED chip, a plurality of the driver ICs are mounted on the bottom surface of the substrate, a plurality of the LED chips are mounted on the top surface of the substrate, and also includes a transparent layer And a translucent layer, the transparent layer is arranged on the top surface of the substrate and covers the LED chip, the translucent layer is arranged on the top surface of the transparent layer, and the material of the translucent layer is a fluorine-containing organic substance.
  • the translucent layer is obtained through a spraying process.
  • the thickness of the translucent layer is 1-50um.
  • the translucent layer has a matte effect.
  • the thickness of the transparent layer is higher than the height of the LED chip.
  • the material of the transparent layer is epoxy resin, silicone resin or silica gel.
  • the material of the translucent layer is fluorine-containing organic matter and is located in the outermost layer.
  • the fluorine-containing organic matter has better heat resistance, hydrophobicity and insulation, and can make the integration
  • the packaged display module achieves moisture-proof, dust-proof, and anti-static functions, avoids damage to the integrated packaged display module, and improves the service life of the integrated packaged display module;
  • the semi-transparent layer is obtained through the spraying process, and after the semi-transparent layer is formed There is no stress and deformation, and the yield rate is high, and the thickness of the translucent layer is easy to control;
  • the translucent layer has a certain light transmittance, which can shield the color of the substrate and make the surface color of the packaged display module consistent. The problem of inconsistent ink color on the surface of the packaged display module is solved, and the brightness is also reduced, and the contrast is increased; the matte effect makes the light output in a diffuse reflection state, which increases the light mixing performance and increases the viewing angle.
  • FIG. 1 is a cross-sectional view of a traditional integrated package display module.
  • Figure 2 is a cross-sectional view of the embodiment.
  • the integrated package display module includes a substrate 1, a driver IC 2 and an LED chip 3.
  • a plurality of driver ICs 2 are mounted on the bottom surface of the substrate 1, and a plurality of LED chips 3 Mounted on the top surface of the substrate 1.
  • This embodiment also includes a transparent layer 5 and a translucent layer 4.
  • the transparent layer 5 is arranged on the top surface of the substrate 1 and covers the LED chip 3, and the translucent layer 4 is arranged on the top surface of the transparent layer 5, and the material of the translucent layer 4 is Fluorinated organic matter.
  • the semi-transparent layer 4 is obtained through a sputtering process.
  • the thickness of the translucent layer 4 is 1-50 um, and the preferred thickness of the translucent layer 4 is 25 um in this embodiment.
  • the translucent layer 4 has a matte effect.
  • the thickness of the transparent layer 5 is higher than the height of the LED chip 3 and shields the entire substrate 1.
  • the material of the transparent layer 5 is epoxy resin, silicone resin or silica gel. In this embodiment, the material of the transparent layer 5 is preferably epoxy resin.

Abstract

一种集成封装显示模组，包括有基板（1）、驱动IC（2）以及LED芯片（3），多个驱动IC（2）贴装于基板（1）底面，多个LED芯片（3）贴装于基板（1）顶面，还包括有透明层（5）和半透明层（4），透明层（5）设置于基板（1）顶面并包覆LED芯片（3），半透明层（4）设置于透明层（5）顶面，半透明层（4）的材料为含氟有机物。半透明层（4）的材料为含氟有机物且位于最外层，含氟有机物具有更加优秀的耐热性、疏水性以及绝缘性，能够使集成封装显示模组实现防潮、防尘、防静电功能，避免集成封装显示模组受到破坏，提高集成封装显示模组的使用寿命。

Description

集成封装显示模组 技术领域
本发明涉及LED显示技术领域，特别是指一种集成封装显示模组。
背景技术
LED显示屏的屏体由多个显示模组拼接而成。集成封装技术是将LED芯片直接封装在LED驱动板上，省去了SMD封装回流环节，采用一次整体封装的技术，实现集成化的一种产品。其具有结构简单、易于实现高密度、高可靠性、低封装成本的技术特点。
如图1所示，传统的集成封装显示模组包括有基板1、驱动IC 2、LED芯片3以及掺杂有黑色素的半透明层4，驱动IC 2贴装于基板1底面，LED芯片3贴装于基板1顶面，半透明层4设置于基板1顶面并包覆LED芯片3。传统的半透明层的材料为环氧树脂、硅树脂、硅胶。
这些材料虽然具有一定的耐热性、疏水性以及绝缘性，但由于LED芯片发光时会产生大量的热量，LED芯片的温度很高，LED显示屏长时间使用后，半透明层会容易老化，疏水性和绝缘性变差，LED芯片容易受潮、沾染灰尘以及受到静电破坏，集成封装显示模组的使用寿命低。
技术解决方案
本发明要解决的技术问题是根据上述现有技术的不足，提出一种集成封装显示模组，解决了半透明层容易老化、集成封装显示模组使用寿命低的问题。
本发明的技术方案是这样实现的：
集成封装显示模组，包括有基板、驱动IC以及LED芯片，多个所述驱动IC贴装于所述基板底面，多个所述LED芯片贴装于所述基板顶面，还包括有透明层和半透明层，所述透明层设置于所述基板顶面并包覆所述LED芯片，所述半透明层设置于所述透明层顶面，所述半透明层的材料为含氟有机物。
进一步地，所述半透明层通过喷镀工艺得到。
进一步地，所述半透明层的厚度为1-50um。
进一步地，所述半透明层呈哑光效果。
进一步地，所述透明层厚度高于所述LED芯片高度。
进一步地，所述透明层的材料为环氧树脂、硅树脂或硅胶。
有益效果
采用上述技术方案，本发明的有益效果在于：(1)半透明层的材料为含氟有机物且位于最外层，含氟有机物具有更加优秀的耐热性、疏水性以及绝缘性，能够使集成封装显示模组实现防潮、防尘、防静电功能，避免集成封装显示模组受到破坏，提高集成封装显示模组的使用寿命；(2)半透明层通过喷镀工艺得到，半透明层成型后不产生应力和变形，且良品率高，并且使得半透明层厚度容易控制；(3)半透明层具有一定的透光率，能够遮蔽基板的颜色，使得成封装显示模组表面的颜色一致，解决了封装显示模组表面墨色不一致的问题，同时也降低了亮度，增加了对比度；哑光效果使得灯光成漫反射状态输出，加大了混光性能和增加了观看视角。
附图说明
图1为传统集成封装显示模组的剖面图。
图2为实施例的剖面图。
图中，1-基板，2-驱动IC，3-LED芯片，4-半透明层，5-透明层。
本发明的最佳实施方式
如图2所示，在本发明提供的实施例，集成封装显示模组，包括有基板1、驱动IC 2以及LED芯片3，多个驱动IC 2贴装于基板1底面，多个LED芯片3贴装于基板1顶面。本实施例还包括有透明层5和半透明层4，透明层5设置于基板1顶面并包覆LED芯片3，半透明层4设置于透明层5顶面，半透明层4的材料为含氟有机物。
半透明层4通过喷镀工艺得到。半透明层4的厚度为1-50um，本实施例优选半透明层4的厚度为25um。半透明层4呈哑光效果。
透明层5厚度高于LED芯片3高度，并遮蔽整个基板1。透明层5的材料为环氧树脂、硅树脂或硅胶，本实施例优选透明层5的材料为环氧树脂。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (6)

  1. 集成封装显示模组，包括有基板、驱动IC以及LED芯片，多个所述驱动IC贴装于所述基板底面，多个所述LED芯片贴装于所述基板顶面，其特征在于：还包括有透明层和半透明层，所述透明层设置于所述基板顶面并包覆所述LED芯片，所述半透明层设置于所述透明层顶面，所述半透明层的材料为含氟有机物。
  2. 根据权利要求1所述集成封装显示模组，其特征在于：所述半透明层通过喷镀工艺得到。
  3. 根据权利要求1所述集成封装显示模组，其特征在于：所述半透明层的厚度为1-50um。
  4. 根据权利要求1所述集成封装显示模组，其特征在于：所述半透明层呈哑光效果。
  5. 根据权利要求1所述集成封装显示模组，其特征在于：所述透明层厚度高于所述LED芯片高度。
  6. 根据权利要求1所述集成封装显示模组，其特征在于：所述透明层的材料为环氧树脂、硅树脂或硅胶。
PCT/CN2020/076195 2019-12-20 2020-02-21 集成封装显示模组 WO2021120386A1 (zh)

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Publication number Priority date Publication date Assignee Title
CN212365400U (zh) * 2020-05-13 2021-01-15 深圳市洲明科技股份有限公司 Led显示模组及led显示屏
CN114824035B (zh) * 2021-01-19 2023-09-15 东莞市中麒光电技术有限公司 一种led显示模块及其制作方法
CN113097365B (zh) * 2021-03-23 2022-11-08 深圳市华星光电半导体显示技术有限公司 显示面板及显示面板的制备方法

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CN103514816A (zh) * 2013-09-29 2014-01-15 长春希达电子技术有限公司 Led显示模组拼接单元
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