WO2021118315A1 - Système d'inspection utilisant des ondes térahertz - Google Patents

Système d'inspection utilisant des ondes térahertz Download PDF

Info

Publication number
WO2021118315A1
WO2021118315A1 PCT/KR2020/018209 KR2020018209W WO2021118315A1 WO 2021118315 A1 WO2021118315 A1 WO 2021118315A1 KR 2020018209 W KR2020018209 W KR 2020018209W WO 2021118315 A1 WO2021118315 A1 WO 2021118315A1
Authority
WO
WIPO (PCT)
Prior art keywords
inspection
substrate
board
terahertz
camera
Prior art date
Application number
PCT/KR2020/018209
Other languages
English (en)
Korean (ko)
Inventor
김성훈
Original Assignee
(주)미래컴퍼니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020190164751A external-priority patent/KR20210073932A/ko
Priority claimed from KR1020190164752A external-priority patent/KR20210073933A/ko
Application filed by (주)미래컴퍼니 filed Critical (주)미래컴퍼니
Publication of WO2021118315A1 publication Critical patent/WO2021118315A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
    • G01N21/3581—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light using far infrared light; using Terahertz radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis

Definitions

  • the present invention relates to an inspection system using terahertz waves.
  • a terahertz wave is an electromagnetic wave located in a region between infrared and microwave, and generally has a frequency between 0.1 THz and 10 THz.
  • terahertz waves are, in recent years, search devices in airports and security facilities, quality inspection devices in food and pharmaceutical companies, semiconductor testing devices, dental testing equipment, gas detection devices, explosives testing devices, Lab-on-a-chip Efforts are being made to apply it to various fields such as detectors.
  • object inspection using terahertz waves is performed, and the method is also performed in various forms.
  • various inspection methods using conventional terahertz waves have several problems, such as cost and time-consuming, and difficulty in inspecting a large-area specimen.
  • An object of the present invention is to provide an inspection system using a terahertz wave.
  • An object of the present invention is to provide an inspection system using a terahertz wave to which a handshake correction algorithm is applied so as to obtain a high-resolution image exceeding the fixed limit resolution of the terahertz wave.
  • An object of the present invention is to provide a substrate inspection system using terahertz waves that detects the thickness and defects of a polyimide film for display device substrates using terahertz waves.
  • An object of the present invention is to provide a substrate inspection system using terahertz waves for detecting the thickness and defects of polyimide films for display device substrates using terahertz waves and non-optical systems.
  • An inspection system using terahertz waves for solving the above-described problems is an inspection that generates measurement data by inspecting an inspection object using terahertz waves to determine whether the inspection object is defective or not.
  • the inspection apparatus may generate a shift image having a high-resolution image by analyzing the scan information acquired through a camera in pixel units using a camera shake correction algorithm.
  • the substrate inspection system using terahertz waves inspects the substrate using terahertz waves to generate substrate measurement data obtained by measuring the defect area of the substrate and the thickness of the substrate.
  • an inspection device wherein the substrate inspection device scans the substrate disposed on the inspection stage through an inspection camera to receive scan information, and irradiates a terahertz wave to the substrate to transmit and reflect terahertz waves on the substrate It is possible to receive electromagnetic wave information about the wave at the same time.
  • a high-resolution image exceeding a fixed limit resolution of a terahertz wave can be acquired through an image stabilization algorithm. That is, by acquiring a high-resolution image, it is possible to shorten the examination time for the object to be examined.
  • the present invention by acquiring a high-resolution image, it is possible to more accurately determine a defect with respect to an object to be inspected and prevent the production of defective products.
  • the inspection time can be shortened and the tack time can be improved.
  • the inspection space can be minimized by simultaneously inspecting the thickness and defects of the substrate using the inspection equipment to which the terahertz wave and the non-optical system are simultaneously applied.
  • the present invention by simultaneously inspecting the thickness and defects of the substrate using the inspection equipment to which the terahertz wave and the non-optical system are simultaneously applied, it is possible to prevent the production of defective products due to the defective substrate while increasing the reliability of the operator.
  • FIG. 1 is a block diagram illustrating an inspection system using a terahertz wave according to an embodiment of the present invention.
  • FIG. 2 is a view for explaining the operation of the inspection system using a terahertz wave according to an embodiment of the present invention.
  • FIG. 3 is a diagram for explaining an arrangement of a camera irradiating a terahertz wave shown in FIG. 2 .
  • FIG. 4 is a diagram for explaining a step of generating the shift image shown in FIG. 2 .
  • FIG. 5 is a diagram for explaining a method of generating the shift image shown in FIG. 4 .
  • FIG. 6 is a block diagram illustrating a substrate inspection system using a terahertz wave according to an embodiment of the present invention.
  • FIG. 7A and 7B are views for explaining the substrate inspection apparatus shown in FIG. 6 .
  • FIG. 8 is a diagram for explaining an operation of a substrate inspection system using a terahertz wave according to an embodiment of the present invention.
  • An inspection system using terahertz waves for solving the above-described problems is an inspection that generates measurement data by inspecting an inspection object using terahertz waves to determine whether the inspection object is defective or not.
  • the inspection apparatus may generate a shift image having a high-resolution image by analyzing the scan information acquired through a camera in pixel units using a camera shake correction algorithm.
  • the inspection apparatus may obtain the scan information including a plurality of images of the inspection object at each position by moving the camera from a reference position to a different position by sub-pixels.
  • the apparatus may further include a management server that analyzes the shift image received from the examination apparatus and generates the measurement data of the examination object.
  • the program according to another embodiment of the present invention is stored in a computer-readable recording medium that is combined with a computer, which is hardware, so as to perform an inspection system using terahertz waves performed by the computer.
  • the substrate inspection system using terahertz waves inspects the substrate using terahertz waves to generate substrate measurement data obtained by measuring the defect area of the substrate and the thickness of the substrate.
  • an inspection device wherein the substrate inspection device scans the substrate disposed on the inspection stage through an inspection camera to receive scan information, and irradiates a terahertz wave to the substrate to transmit and reflect terahertz waves on the substrate It is possible to receive electromagnetic wave information about the wave at the same time.
  • the substrate inspection apparatus corresponding to the first to third inspection cameras, respectively, the substrate separated into first to third inspection areas in the x-axis direction and the y-axis direction in a gantry manner You can go and check.
  • it may further include a management server for generating the substrate measurement data of the substrate by analyzing the scan information and the electromagnetic wave information received from the substrate inspection apparatus.
  • a program according to another embodiment of the present invention is stored in a computer-readable recording medium that is combined with a computer, which is hardware, so as to perform a board inspection system using terahertz waves performed by the computer.
  • the term "computer” includes various devices capable of providing a result to a user by performing arithmetic processing.
  • computers include desktop PCs, notebooks (Note Books) as well as smartphones, tablet PCs, cellular phones, PCS phones (Personal Communication Service phones), synchronous/asynchronous IMT A mobile terminal of -2000 (International Mobile Telecommunication-2000), a Palm Personal Computer (PC), a Personal Digital Assistant (PDA), and the like may also be applicable.
  • a head mounted display (HMD) device includes a computing function
  • the HMD device may be a computer.
  • the computer may correspond to a server that receives a request from a client and performs information processing.
  • FIG. 1 is a block diagram illustrating an inspection system using a terahertz wave according to an embodiment of the present invention.
  • an inspection system 1 using terahertz waves may include an inspection device 10 and a management server 20 .
  • the management server 20 may be omitted.
  • the inspection device 10 and the management server 20 may be synchronized in real time using a wireless communication network to transmit and receive data.
  • the wireless communication network may support various long-distance communication methods, for example, wireless LAN (WLAN), DLNA (Digital Living Network Alliance), WiBro (Wireless Broadband: Wibro), and Wimax (World Interoperability for Microwave Access: Wimax).
  • GSM Global System for Mobile communication
  • CDMA Code Division Multi Access
  • CDMA2000 Code Division Multi Access 2000
  • EV-DO Enhanced Voice-Data Optimized or Enhanced Voice-Data Only
  • WCDMA Wideband CDMA
  • HSDPA High Speed Downlink Packet Access
  • HSUPA High Speed Uplink Packet Access
  • LTE Long Term Evolution
  • LTEA Long Term Evolution-Advanced
  • broadband wireless mobile communication service Wireless Mobile
  • Various communication methods such as WMBS), BLE (Bluetooth Low Energy), Zigbee, RF (Radio Frequency), LoRa (Long Range), etc. may be applied, but are not limited thereto, and various well-known wireless or mobile communications method may be applied.
  • the inspection device 10 and the management server 20 may transmit and receive data through a wired communication method.
  • the inspection apparatus 10 may be an apparatus capable of inspecting the object 11 to be inspected using a terahertz wave.
  • the inspection apparatus 10 may photograph the inspection object 11 for various objects or substances, such as food, semiconductor equipment, and manufacturing equipment, and acquire an image for the inspection.
  • the inspection apparatus 10 includes a signal generating unit 100 , an inspection unit 110 , a correction unit 120 , a communication unit 130 , a memory unit 140 , and a device control unit 150 . can do.
  • the inspection device 10 may be located in the chamber in order to minimize the influence of the external environment.
  • the signal generator 100 may generate a terahertz wave.
  • the generated terahertz wave may have an intensity and a pulse width that can be transmitted or reflected by being irradiated to the object 11, but is not limited thereto.
  • the signal generator 100 may generate a terahertz wave composed of electromagnetic waves having a frequency of 0.1 THz to 10 THz.
  • the inspection unit 110 may include a camera 111 for photographing the inspection object 11 .
  • the inspection unit 110 scans the inspection object 11 using the camera 111 through the line scanning system, receives the reflected terahertz wave reflected from the inspection object 11, and sends it to the inspection object 11 .
  • image can be obtained. That is, the inspection unit 110 may acquire scan information by the camera 111 moving in the x-axis direction, the y-axis direction, and the z-axis direction through the line scanning system.
  • the scan information may include a plurality of images obtained by photographing the object 11 at each position by moving the camera 111 from the reference position to a different position by sub-pixels.
  • the object 11 is photographed in units of 4 pixels, and the sub-pixel unit may be 1/2 (0.5) of a pixel, but is not limited thereto. That is, a sub-pixel unit may have a unit of less than one pixel.
  • the inspection unit 110 may acquire an image of the object 11 by moving the camera 111 in different directions by 0.5 pixels from the reference position with respect to the camera 111 . Accordingly, the inspection unit 110 may acquire scan information including a plurality of images acquired at each location. Although it is disclosed that the scan information includes four images of the object 11 in the present embodiment, the present invention is not limited thereto.
  • the camera 111 is described as a line scan camera, but may not be limited thereto.
  • the camera 111 may be a photographing device using a CCD camera, CMOS, or the like.
  • the inspection unit 110 may divide and inspect the scanning area according to the object 11 to be inspected. Accordingly, inspection time can be saved.
  • the inspection unit 110 has a shape of a leg through which a head support passes between two supports on both sides, and may be a gantry system.
  • the gantry system may include a motor (not shown).
  • the corrector 120 may generate a shift image having a high-resolution image by using the obtained scan information using a hand shake correction algorithm.
  • the correction unit 120 may synthesize and correct a plurality of images included in the scan information to generate a high-resolution shift image that is twice the limit resolution.
  • the communication unit 130 may transmit the measurement data to the management server 20 .
  • the communication unit 130 may transmit the scan information and/or the shift image to the management server 20 .
  • the memory unit 140 may store data transmitted and received through the communication unit 130 and data supporting various functions of the test apparatus 10 .
  • the memory unit 130 may store a plurality of application programs (or applications) driven by the test apparatus 10 , data for operation of the test apparatus 10 , and commands. At least some of these application programs may be downloaded from the management server 20 or an external server through wireless communication.
  • the device controller 150 may analyze the shift image to generate measurement data of the object 11 .
  • the device control unit 150 analyzes a plurality of images included in the acquired scan information to determine a defective area suspected of being defective in the inspection object 11 to determine whether the inspection object 11 is defective. Measurement data can be created.
  • the device controller 150 may inspect the object 11 and, if a defect occurs, may perform repair by using a laser or a separate repair means. Accordingly, the process time can be shortened by simultaneously performing the inspection and repair of the object 11 to be inspected.
  • the inspection apparatus 10 having such a structure converts the scan information received from the object 11 using a terahertz wave into a high-resolution image that exceeds the fixed limit resolution of the terahertz wave through a hand shake correction algorithm, It is possible to determine the state of the upper body 11 to generate measurement data corresponding thereto. Accordingly, by acquiring a high-resolution image, it is possible to more accurately determine the defect of the inspection object 11 and prevent the production of defective products.
  • the management server 20 may include a data communication unit 200 , a database unit 210 , a display unit 220 , and a management control unit 230 .
  • the data communication unit 200 may receive the measurement data from the inspection device 10 .
  • the data communication unit 200 may receive scan information and/or a shift image from the inspection apparatus 10 .
  • the database unit 210 may store data transmitted/received to and from the test apparatus 10 through a wired/wireless communication network.
  • the database unit 210 may store data supporting various functions of the management server 20 .
  • the database unit 210 may store a plurality of application programs (application programs or applications) driven in the management server 20 , data for the operation of the management server 20 , and commands. At least some of these applications may be downloaded from an external server through wireless communication.
  • the display unit 220 monitors the operation state of the inspection device 10 by the user operation, the operation state of the management server 20, and data transmitted/received between the inspection apparatus 10 and the management server 20 through the screen. can do. That is, by checking the operating state of the inspection device 10 in real time, when an error or malfunction occurs, the administrator can quickly respond to it, thereby further enhancing user satisfaction.
  • the management control unit 230 may receive the plate measurement data and manage the state of the inspection object 11 to prevent the production of defective products by the defective inspection object 11 .
  • the management control unit 230 may analyze the shift image received from the examination apparatus 10 to generate measurement data of the examination object 11 .
  • the management control unit 230 may generate a high-resolution, high-resolution shift image by correcting the scan information.
  • the management server 20 having such a structure may be a computing device implemented by hardware circuits (eg, CMOS-based logic circuits), firmware, software, or a combination thereof.
  • hardware circuits eg, CMOS-based logic circuits
  • firmware e.g., firmware
  • software e.g., firmware
  • a combination thereof e.g., firmware
  • FIG. 2 is a diagram for explaining an operation of an inspection system using terahertz waves according to an embodiment of the present invention
  • FIG. 3 is a diagram for explaining an arrangement of a camera irradiating terahertz waves shown in FIG. .
  • the inspection system 1 using terahertz waves is described as operating in the inspection apparatus 10 , the present invention is not limited thereto.
  • the examination apparatus 10 may photograph the examination object 11 using at least one camera 111 ( S100 ) to obtain scan information ( S110 ).
  • the camera 111 is a line scan camera.
  • a plurality of cameras 111a and 111b may be arranged in a line form.
  • the inspection apparatus 10 may generate a shift image having a high-resolution image by using the obtained scan information using a hand shake correction algorithm (S120).
  • the inspection apparatus 10 may determine the shift image to determine whether the inspection object 11 is defective (S130), and generate measurement data for the inspection object 11 (S140).
  • the management server 20 may generate measurement data.
  • FIG. 4 is a view for explaining the step of generating the shift image shown in FIG. 2
  • FIG. 5 is a view for explaining a method for generating the shift image shown in FIG. 4
  • FIG. 5 (a) is a reference position It is a view for explaining a basic image obtained by photographing the object 11
  • FIG. 5 (b) is a view for explaining a sub-image obtained by moving the object 11 from the reference position by sub-pixel units.
  • FIG. 5(c) is a diagram for explaining a shift image generated by synthesizing and correcting a basic image and a sub-image.
  • the examination apparatus 10 moves the camera 111 to a reference position in a state in which the examination object 11 is disposed ( S200 ), and may acquire a basic image by photographing the examination object 11 . There is (S210).
  • the original image may be obtained by setting the image of the actual object 11 in units of four pixels.
  • the examination apparatus 10 may move sub-pixels from the reference position to a different position ( S220 ), and acquire a plurality of sub-images obtained by photographing the object 11 at each position ( S230 ).
  • FIG. 5(b) it is assumed that an arbitrary line among the four pixel photographing areas is the reference line (a-a'), and is moved at 0.5 pixel intervals from the reference line (a-a').
  • a sub-image may be obtained by photographing the object 11 based on the sub-line b-b'.
  • the inspection apparatus 10 may generate a high-resolution shift image by synthesizing and correcting the original image and the sub-image (S240).
  • a shift image may be generated by synthesizing and correcting a plurality of images.
  • FIG. 6 is a block diagram illustrating a substrate inspection system using terahertz waves according to an embodiment of the present invention
  • FIGS. 7A and 7B are views for explaining the substrate inspection apparatus shown in FIG. 6
  • FIG. 7A is a view for explaining an example of the substrate inspection apparatus
  • Figure 7b is a view showing the substrate scanning direction of the substrate inspection apparatus.
  • the substrate inspection system 2 using terahertz waves may include a substrate inspection apparatus 30 and a management server 20 .
  • the management server 20 may be omitted.
  • the board inspection apparatus 30 and the management server 20 may be synchronized in real time using a wireless communication network to transmit and receive data.
  • the wireless communication network may support various long-distance communication methods, for example, wireless LAN (WLAN), DLNA (Digital Living Network Alliance), WiBro (Wireless Broadband: Wibro), and Wimax (World Interoperability for Microwave Access: Wimax).
  • GSM Global System for Mobile communication
  • CDMA Code Division Multi Access
  • CDMA2000 Code Division Multi Access 2000
  • EV-DO Enhanced Voice-Data Optimized or Enhanced Voice-Data Only
  • WCDMA Wideband CDMA
  • HSDPA High Speed Downlink Packet Access
  • HSUPA High Speed Uplink Packet Access
  • LTE Long Term Evolution
  • LTEA Long Term Evolution-Advanced
  • broadband wireless mobile communication service Wireless Mobile
  • Various communication methods such as WMBS), BLE (Bluetooth Low Energy), Zigbee, RF (Radio Frequency), LoRa (Long Range), etc. may be applied, but are not limited thereto, and various well-known wireless or mobile communications method may be applied.
  • the board inspection apparatus 30 and the management server 20 may transmit and receive data through a wired communication method.
  • the substrate inspection apparatus 30 may be an apparatus for inspecting the state of the substrate 31 after performing a predetermined process on the substrate 31 .
  • the substrate 31 is a substrate including a polyimide film, and may be a substrate that can be used in various fields such as a display and a solar cell.
  • the substrate 31 may refer to a substrate produced through an array process, a cell process, and a module process, that is, a substrate on which an alignment process is performed during the cell process, that is, a substrate on which a flat layer is formed. , but is not limited thereto.
  • the flat layer has an acrylic resin, an epoxy resin, a phenol resin, a polyamide-based resin, a polyimide-based resin, an unsaturated polyester-based resin, a polyphenylene-based resin, and a polyphenylene sulfide-based resin so that the liquid crystal molecules have uniform orientation. , and benzocyclobutene, but is not limited thereto.
  • the substrate inspection apparatus 30 may inspect the state of the substrate 31 after the incubation process to detect defects in the substrate through this.
  • the substrate inspection apparatus 30 may include a signal generating unit 300 , a substrate inspection unit 310 , a communication unit 320 , a memory unit 330 , and a device control unit 340 . At this time, the substrate inspection apparatus 30 may be located in the chamber in order to minimize the influence of the external environment.
  • the signal generator 300 may generate a terahertz wave.
  • the generated terahertz wave may have an intensity and a pulse width that can be transmitted and reflected by being irradiated to the substrate 31 in a predetermined direction, but is not limited thereto.
  • the signal generator 300 may generate a terahertz wave composed of an electromagnetic wave having a frequency of 0.1 THz to 10 THz.
  • the board inspection unit 310 has a shape of a bridge through which a head support passes between two supports on both sides in this embodiment, and may be a gantry system.
  • the gantry system may include a motor (not shown).
  • the motor is provided outside the inspection stage 312, and may perform a function of controlling the head support or the gantry unit 313 including the head to move at a constant speed.
  • the substrate inspection unit 310 scans the substrate 31 disposed on the inspection stage 312 through the inspection camera 311 to receive scan information, and transmits the terahertz wave to the substrate 31 . It is possible to receive electromagnetic wave information about the terahertz wave transmitted and reflected by the substrate 31 by irradiating it. In this case, the scan information may be image information of the substrate 31 .
  • the substrate inspection unit 310 as shown in Fig. 7 (a), as a gantry system, the inspection target object, for example, to inspect the substrate 31 in order to inspect the inspection stage ( 312), the inspection camera 311 for inspecting the substrate 31 disposed on the inspection stage 312, the gantry unit 313 provided with the inspection camera 311, and the gantry unit 313 in the x-axis direction and the y-axis It may include a substrate transfer unit 314 including a moving rail (not shown) for moving in the direction.
  • the board inspection unit 310 may be operated by positioning the head of the gantry unit 313 at the '0' point of the x-axis of the inspection stage 312 .
  • the inspection camera 311 scans the substrate 31 , irradiates terahertz waves to the substrate 31 , and receives terahertz waves transmitted and reflected from the substrate 31 first to third cameras ( 311a, 311b, 311c) may be included.
  • the inspection camera 311 may be a camera capable of scanning, irradiating, and receiving while moving. Accordingly, the defect of the substrate 31 can be more accurately detected by simultaneously checking the thickness of the substrate 31 and the defective region of the substrate 31 through the inspection camera 311 .
  • the inspection camera 311 includes first to third inspection cameras 311a, 311b, and 311c, so that the inspection area can be divided into a plurality of inspection areas. That is, it is possible to improve the tack time by shortening the inspection time through the plurality of inspection areas.
  • the inspection camera 311 is described as including the first to third inspection cameras 311a, 311b, 311c, it is not limited thereto.
  • each of the first to third cameras 311a , 311b , and 311c may inspect an area of 8m*15m at a time, but is not limited thereto.
  • the inspection area may be divided according to the size of the substrate 31 and the number of inspection cameras 311 .
  • the first to third inspection areas 1a, 1a, 311c, using the first to third inspection cameras 311a, 311b, 311c, the substrate 31 as the inspection object. 1b, 1c) can be divided into tests. That is, the first inspection camera 311a inspects only the first region 1a, the first inspection camera 311b inspects only the second region 1b, and the third inspection camera 311c inspects the third region ( Only 1c) can be inspected.
  • the first inspection camera 311a moves to the end of the substrate 31 in the y-axis direction according to the movement of the gantry unit 313 , and then moves in the x-axis direction by a preset distance to The first area 1a (orange line) may be inspected.
  • the second inspection camera 311b moves to the end of the substrate 31 in the y-axis direction according to the movement of the gantry unit 313 , and then moves in the x-axis direction by a predetermined distance to the second area of the substrate 31 . (1b, blue line) can be inspected.
  • the third inspection camera 311c moves to the end of the substrate 31 in the y-axis direction according to the movement of the gantry unit 313 , and then moves in the x-axis direction by a predetermined distance to the third area of the substrate 31 . (1c, red line) can be inspected.
  • the gantry unit 313 provided with the inspection camera 311 moves in the x-axis direction and the y-axis direction according to the object to inspect the substrate 31, but is not limited thereto.
  • the inspection camera 311 may be disposed on the gantry unit 313 to move in the x-axis direction, the y-axis direction, and the z-axis direction.
  • the inspection stage 312 may be formed in a structure in which the inspection camera 311 scans the surface of the substrate 31 and the terahertz wave transmitted through the substrate 31 can be reflected.
  • the inspection stage 312 may be made of a metal material having a high reflectance of the terahertz wave.
  • the inspection stage 312 may include a reflective lens (not shown) corresponding to the size of the entire surface of the inspection stage 312 on which the substrate 31 is disposed or the substrate 31 .
  • the inspection stage 312 may include a holder (not shown) capable of fixing the substrate 31 .
  • the board inspection unit 310 may include a driving unit (not shown) for moving the gantry unit 313 provided with the inspection camera 311 in the x-axis direction and the y-axis direction.
  • the driving unit may be a linear motor, but is not limited thereto.
  • the communication unit 320 may transmit the substrate measurement data to the management server 20 .
  • the communication unit 320 may transmit scan information and electromagnetic wave information to the management server 20 .
  • the memory unit 330 may store data transmitted and received through the communication unit 320 and data supporting various functions of the substrate inspection apparatus 30 .
  • the memory unit 330 may store a plurality of application programs (or applications) driven by the substrate inspection apparatus 30 , data for operation of the substrate inspection apparatus 30 , and commands. At least some of these application programs may be downloaded from the management server 20 or an external server through wireless communication.
  • the device controller 340 may generate the substrate measurement data of the substrate 31 by analyzing the measured scan information and the electromagnetic wave information.
  • scan information is used to determine a defect region suspected of being defective in the substrate 31 using a preset vision image processing algorithm, and the thickness of the substrate 31 is determined by analyzing electromagnetic wave information to determine the thickness of the substrate 31 .
  • the inspection space can be minimized by simultaneously inspecting the thickness and defects of the substrate using the inspection equipment to which the terahertz wave and the non-optical system are simultaneously applied.
  • the device controller 340 moves the first to third inspection cameras 311a, 311b, and 311c in the x-axis direction and the y-axis direction according to the movement of the gantry part 313 to prevent the A repair may be performed simultaneously with the inspection.
  • a laser or a separate repair means may be provided to perform the repair. Accordingly, by performing inspection and repair of the substrate 31 at the same time, it is possible to shorten the process time.
  • the substrate inspection apparatus 30 having such a structure is a defect including a thickness of the substrate 31 and a stain, a scratch, a step, a size, etc. formed on the substrate 31 through an inspection camera 311 that transmits and receives terahertz waves. can be inspected. That is, the thickness and defects of the substrate 31 may be inspected before a subsequent process including the substrate 31 is performed. Accordingly, the board inspection unit 310 may shorten the inspection time of the board 31 to improve the tack time, thereby preventing the production of defective products due to the defective board.
  • the management server 20 may include a data communication unit 200 , a database unit 210 , a display unit 220 , and a management control unit 230 .
  • the data communication unit 200 may receive the substrate measurement data from the substrate inspection apparatus 30 .
  • the data communication unit 200 may receive scan information and electromagnetic wave information from the substrate inspection apparatus 30 .
  • the database unit 210 may store data transmitted/received to and from the board inspection apparatus 30 through a wired/wireless communication network.
  • the database unit 210 may store data supporting various functions of the management server 20 .
  • the database unit 210 may store a plurality of application programs (application programs or applications) driven in the management server 20 , data for the operation of the management server 20 , and commands. At least some of these applications may be downloaded from an external server through wireless communication.
  • the display unit 220 displays the operation state of the board inspection apparatus 30 by a user operation, the operation state of the management server 20, and data transmitted/received between the board inspection apparatus 30 and the management server 20, etc. can be monitored through That is, by checking the operating state of the board inspection apparatus 30 in real time, when an error or failure occurs, the administrator can quickly respond to it, thereby further enhancing user satisfaction.
  • the management control unit 230 may receive the substrate measurement data and manage the state of the substrate 31 to prevent production of defective products due to defective substrates.
  • the management control unit 230 may generate the substrate measurement data of the substrate 31 by analyzing the scan information and the electromagnetic wave information received from the substrate inspection apparatus 30 .
  • the management control unit 230 determines a defect area suspected of being defective of the substrate 31 using a preset vision image processing algorithm for scan information, and analyzes electromagnetic wave information to analyze the thickness of the substrate 31 . It is possible to generate substrate measurement data capable of determining whether the substrate 31 is defective by judging it.
  • the management server 20 having such a structure may be a computing device implemented by hardware circuits (eg, CMOS-based logic circuits), firmware, software, or a combination thereof.
  • hardware circuits eg, CMOS-based logic circuits
  • firmware e.g., firmware
  • software e.g., firmware
  • a combination thereof e.g., firmware
  • the operation of the substrate inspection system 2 using the terahertz wave having such a configuration is as follows. 8 is a diagram for explaining an operation of a substrate inspection system using a terahertz wave according to an embodiment of the present invention. In the present embodiment, the substrate inspection system 2 using terahertz waves is described as operating in the substrate inspection apparatus 30, but is not limited thereto.
  • the substrate inspection apparatus 30 may place an inspection object, for example, the substrate 31 on the inspection stage 312 .
  • the substrate inspection apparatus 30 scans the substrate 31 using the inspection camera 311 , and simultaneously irradiates a terahertz wave to the substrate 31 , and the irradiated terahertz wave applies the irradiated terahertz wave to the substrate 31 .
  • Transmitted and reflected terahertz waves may be received ( S200 ).
  • the board inspection unit 310 corresponds to the inspection camera 311 in the inspection area of the substrate 31 after the head of the gantry unit 313 is positioned at the '0' point of the x-axis of the inspection stage 312 . It is separated so that the gantry part 313 moves at a constant speed so that the substrate 31 can be inspected.
  • the inspection is started by dividing the substrate 31 into first to third inspection areas 1a, 1b, and 1c using the first to third inspection cameras 311a, 311b, and 311c. do not limit
  • the board inspection apparatus 30 may analyze the scan information and electromagnetic wave information acquired through the inspection camera 311 (S210), and generate board measurement data (S220).
  • the board inspection apparatus 30 determines a defect area suspected of being defective of the substrate 31 using a preset vision image processing algorithm based on the scan information, and analyzes electromagnetic wave information of the substrate 31 .
  • the inspection space can be minimized by simultaneously inspecting the thickness and defects of the substrate using the inspection equipment to which the terahertz wave and the vision optical system are simultaneously applied.
  • a laser or a separate repair means may be provided to simultaneously perform the repair.
  • the management server 20 may analyze the scan information and the electromagnetic wave information to generate the substrate measurement data.
  • a software module may contain random access memory (RAM), read only memory (ROM), erasable programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), flash memory, hard disk, It may reside in any type of computer-readable recording medium well known in the art.
  • the present invention relates to an inspection system, and may be applied to an inspection system that inspects an object to be inspected using terahertz waves.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Toxicology (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

Un système d'inspection utilisant des ondes térahertz est divulgué. Le système d'inspection comprend un appareil d'inspection pour inspecter un objet à inspecter en utilisant les ondes térahertz, déterminer un défaut de l'objet à inspecter et générer des données de mesure, l'appareil d'inspection pouvant générer une image de décalage ayant une image à haute résolution par analyse d'informations de balayage obtenues par l'intermédiaire d'une caméra, en unités de pixels à l'aide d'un algorithme de stabilisation d'image.
PCT/KR2020/018209 2019-12-11 2020-12-11 Système d'inspection utilisant des ondes térahertz WO2021118315A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2019-0164751 2019-12-11
KR1020190164751A KR20210073932A (ko) 2019-12-11 2019-12-11 테라헤르츠파를 이용한 검사 시스템
KR10-2019-0164752 2019-12-11
KR1020190164752A KR20210073933A (ko) 2019-12-11 2019-12-11 테라헤르츠파를 이용한 기판 검사 시스템

Publications (1)

Publication Number Publication Date
WO2021118315A1 true WO2021118315A1 (fr) 2021-06-17

Family

ID=76330226

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2020/018209 WO2021118315A1 (fr) 2019-12-11 2020-12-11 Système d'inspection utilisant des ondes térahertz

Country Status (1)

Country Link
WO (1) WO2021118315A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006177716A (ja) * 2004-12-21 2006-07-06 Tochigi Nikon Corp テラヘルツイメージング装置およびテラヘルツイメージング方法
KR20140025009A (ko) * 2012-08-20 2014-03-04 에스 알 씨 주식회사 근적외선을 이용한 투과성 박막 검사방법 및 검사장치
US20150268030A1 (en) * 2012-10-19 2015-09-24 Jeffrey S. White System for calculation of material properties using reflection terahertz radiation and an external reference structure
KR20170128954A (ko) * 2016-05-16 2017-11-24 주식회사 마인즈아이 기판 검사 장치
KR102045079B1 (ko) * 2019-07-23 2019-11-14 주식회사 모든 테라헤르츠파를 이용한 검사 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006177716A (ja) * 2004-12-21 2006-07-06 Tochigi Nikon Corp テラヘルツイメージング装置およびテラヘルツイメージング方法
KR20140025009A (ko) * 2012-08-20 2014-03-04 에스 알 씨 주식회사 근적외선을 이용한 투과성 박막 검사방법 및 검사장치
US20150268030A1 (en) * 2012-10-19 2015-09-24 Jeffrey S. White System for calculation of material properties using reflection terahertz radiation and an external reference structure
KR20170128954A (ko) * 2016-05-16 2017-11-24 주식회사 마인즈아이 기판 검사 장치
KR102045079B1 (ko) * 2019-07-23 2019-11-14 주식회사 모든 테라헤르츠파를 이용한 검사 장치

Similar Documents

Publication Publication Date Title
US20120038780A1 (en) Apparatus and method for inspecting display device
WO2014163375A1 (fr) Procédé de recherche d'une substance étrangère sur un substrat
WO2019164381A1 (fr) Procédé d'inspection de l'état de montage d'un composant, appareil d'inspection de carte de circuit imprimé et support d'enregistrement lisible par ordinateur
US7330583B2 (en) Integrated visual imaging and electronic sensing inspection systems
WO2021006379A1 (fr) Système et procédé d'inspection automatique de pixels d'affichage
WO2012176563A1 (fr) Dispositif de contrôle de défauts et procédé de contrôle de défauts
WO2017039171A1 (fr) Dispositif de traitement laser et procédé de traitement laser
WO2017204560A1 (fr) Procédé et appareil de détection de particules sur une surface supérieure de verre, et procédé d'exposition à un rayonnement de lumière incidente
WO2021118315A1 (fr) Système d'inspection utilisant des ondes térahertz
CN211061152U (zh) 一种集成视场、调制传递函数和对中测量的镜头检测设备
WO2019199019A1 (fr) Appareil et procédé de mesure de défaut basés sur une onde térahertz
CN112577970A (zh) 一种检测方法、检测设备的对准方法以及检测设备
WO2009119983A2 (fr) Système de vérification d'un substrat fpd et de tranches à semi-conducteurs utilisant des images dupliquées
JP2006245891A (ja) カメラモジュールの画像検査用チャート、この画像検査用チャートを用いたカメラモジュールの画像検査方法および画像検査装置
KR20040035553A (ko) 고장 해석 방법
WO2014192999A1 (fr) Système d'inspection d'un défaut pour inspecter un objet ayant des structures irrégulières
JP4277026B2 (ja) パターン検査装置、及びパターン検査方法
WO2024043403A1 (fr) Dispositif d'inspection de défaut de tranche de semi-conducteur et procédé d'inspection de défaut
KR102676218B1 (ko) 테라헤르츠파를 이용한 검사 시스템
WO2023008637A1 (fr) Dispositif d'inspection de batterie ronde
WO2020022786A1 (fr) Dispositif d'inspection d'échantillon et procédé d'inspection d'échantillon
KR20210073933A (ko) 테라헤르츠파를 이용한 기판 검사 시스템
WO2020263054A1 (fr) Appareil et procédé permettant de déterminer la forme tridimensionnelle d'un objet
KR20210073932A (ko) 테라헤르츠파를 이용한 검사 시스템
JP2000275183A (ja) 画像取込み装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20900223

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20900223

Country of ref document: EP

Kind code of ref document: A1