WO2021114376A1 - 一种服务器液冷散热器 - Google Patents

一种服务器液冷散热器 Download PDF

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Publication number
WO2021114376A1
WO2021114376A1 PCT/CN2019/127026 CN2019127026W WO2021114376A1 WO 2021114376 A1 WO2021114376 A1 WO 2021114376A1 CN 2019127026 W CN2019127026 W CN 2019127026W WO 2021114376 A1 WO2021114376 A1 WO 2021114376A1
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Prior art keywords
liquid
liquid cooling
plate
cooling plate
heat pipe
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PCT/CN2019/127026
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English (en)
French (fr)
Inventor
魏芳伟
凌强威
龙锦华
汪广武
耿曼
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广州高澜节能技术股份有限公司
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Publication of WO2021114376A1 publication Critical patent/WO2021114376A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Definitions

  • the invention relates to the technical field of heat exchangers, in particular to a server liquid cooling radiator.
  • the present invention provides a server liquid cooling radiator, which adopts a full-coverage cooling method, solves the problem of easy leakage caused by too many liquid cooling plate interfaces, and reduces the leakage point to a minimum. Greatly improve the safety factor of the product.
  • the present invention provides a server liquid cooling radiator, including a liquid cooling plate, the liquid cooling plate is provided with a heat pipe, and an aluminum plate and a heat sink are connected to the heat pipe.
  • the liquid cooling plate is provided with a cooling liquid flow channel in the interior, and the cooling liquid flow channel is communicated with an external pipe to form a water circulation, and a spoiler fan is installed at a position of the liquid cooling plate close to the pipe.
  • the liquid cooling plate is composed of an upper plate and a lower plate sealed and installed, the top surface of the upper plate is connected with the heat pipe, and the bottom surface of the upper plate is provided with an annular groove and forms a closed coolant flow channel with the lower plate.
  • the bottom surface of the lower board is coated with thermal conductive paste.
  • the heat pipe is installed on the liquid cold plate by welding or interference fit.
  • the heat pipe includes a first heat pipe and a second heat pipe.
  • the first heat pipe is symmetrically arranged on the top of the liquid cooling plate.
  • One end of the first heat pipe is connected to the liquid cooling plate, and the other end is welded with an aluminum plate.
  • the second heat pipe is arranged on the top of the liquid cooling plate directly opposite to the pipe, one end of which is connected with the liquid cooling plate, and the other end is welded with a heat sink.
  • the liquid-cooling plate is symmetrically provided with a positioning device, the positioning device includes a screw, a spring, and a circlip.
  • the screw penetrates the liquid-cooling plate, and the circlip is sleeved on the part where the screw penetrates and extends out of the liquid-cooling plate.
  • the spring is sleeved on the screw and against the liquid cooling plate.
  • the present invention has the beneficial effects that the liquid-cooled radiator adopts a full-coverage cooling method, can transfer the heat of all components to the liquid-cooled plate through the heat pipe and the spoiler fan, and solves the problem of liquid cooling. Too many cold plate interfaces cause easy leakage problems, which will minimize the leakage point and greatly improve the safety factor of the product.
  • FIG. 1 is a schematic diagram of the axonometric structure of a server liquid cooling radiator according to the present invention
  • FIG. 2 is a schematic diagram of the axonometric structure of a server liquid cooling radiator according to the present invention
  • FIG. 3 is a schematic diagram of the liquid cooling plate structure of a server liquid cooling radiator according to the present invention.
  • Fig. 4 is a partial enlarged schematic diagram of Fig. 2;
  • Fig. 5 is an assembly diagram of a server liquid cooling radiator according to the present invention.
  • Liquid cooling plate 101, upper plate; 102, lower plate; 2. heat pipe; 201, first heat pipe; 202, second heat pipe; 3. aluminum plate; 4. heat sink; 5. cooling liquid flow Road; 6, pipe; 7, spoiler fan; 8, thermal paste; 9, positioning device; 901, screw; 902, spring; 903, circlip.
  • a server liquid cooling radiator shown in Figure 1-5 includes a liquid cooling plate 1, on which a heat pipe 2 is arranged, and the heat pipe 2 is installed by welding or interference fit.
  • the heat pipe 2 is connected with an aluminum plate 3 and a heat sink 4.
  • the liquid-cooling plate 1 is provided with a cooling liquid flow channel 5 which communicates with an external pipe 6 to form a water circulation.
  • a spoiler fan 7 is installed in the cold plate 1 near the duct 6.
  • the liquid-cooled radiator adopts a full-coverage cooling method, which can transfer the heat generated by all components to the liquid cold plate 1 through the heat pipe 2 and the spoiler fan 7.
  • the liquid cooling plate 1 is taken away by the cooling liquid, which solves the problem of easy leakage caused by too many interfaces of the liquid cooling plate 1, minimizes the leakage point, and greatly improves the safety factor of the product.
  • the liquid cooling plate 1 is The upper plate 101 and the lower plate 102 are sealed and installed.
  • the top surface of the upper plate 101 is connected with the heat pipe 2, and the bottom surface of the upper plate 101 is provided with an annular groove, and forms a closed cooling liquid channel 5 with the lower plate, and the cooling liquid channel 5 is covered with Plate 101, to ensure that the largest area of the coolant is in contact with the heat source, and achieve the best heat dissipation efficiency.
  • the bottom surface of the lower plate 102 is coated with a thermal conductive paste 8.
  • the thermal conductive paste 8 is a colloidal substance that can transfer heat and has a high thermal conductivity, and can be filled with liquid cooling.
  • the gap between board 1 and CPU ensures heat dissipation performance.
  • the heat pipe 2 includes a first heat pipe 201 and a second heat pipe 202.
  • the first heat pipe 201 is symmetrically arranged on the top of the liquid cooling plate 1.
  • One end of the first heat pipe 201 is connected to the liquid cooling plate 1, and an aluminum plate 3 is welded to the other end.
  • the thermal pad, the first heat pipe 201 is attached to the product memory module, and the heat generated by the memory module is transferred to the liquid cooling plate 1 through the first heat pipe 201, so as to ensure the heat dissipation efficiency of the memory module, and at the same time, the heat dissipation efficiency of the memory can be improved through the thermal pad.
  • the second heat pipe 202 is arranged on the top of the liquid-cooling plate 1 opposite to the pipe 6, one end of which is connected with the liquid-cooling plate 1, and the other end is welded with a heat sink 4, which is arranged close to the array board, and the heat generated by the array board passes through the first
  • the two heat pipes 202 are transferred to the liquid cooling plate 1, thereby ensuring the heat dissipation efficiency of the array board.
  • the liquid cooling plate 1 is symmetrically provided with a positioning device 9 which includes a screw 901, a spring 902 and a circlip 903.
  • the screw 901 penetrates the liquid cooling plate 1, and the circlip 903 is sleeved on the screw 901 and extends out of the liquid cooling plate.
  • the spring 902 is sleeved on the screw 901 and against the liquid cooling plate 1.
  • the radiator is integrally fixed to the server main board by the screw 901. The deformation produced by the compression of the spring 902 can hold the liquid cooling plate 1 tightly. Closed on the CPU to ensure its contact area and improve the heat dissipation effect.
  • the circlip 903 is used to fix the position of the screw 901 on the liquid cooling plate 1 for easy installation.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种服务器液冷散热器，包括液冷板（1），该液冷板（1）上设有热管（2），所述热管（2）上连接有铝板（3）以及散热片（4），所述液冷板（1）内部设有冷却液流道（5），该冷却液流道（5）与外部的管道（6）连通从而形成水路循环，所述液冷板（1）靠近管道（6）的位置安装有扰流风扇（7）。上述技术方案采用全覆盖冷却方式，解决了因液冷板（1）接口过多而造成容易泄漏的问题，将泄漏点降到最低，提高了产品的安全系数。

Description

一种服务器液冷散热器 技术领域
本发明涉及换热器技术领域，尤其涉及一种服务器液冷散热器。
背景技术
服务器从它的发展趋势来看，由于其功能的集成越来越多，芯片发热功率越来越大，散热问题越来越严峻，传统的风冷已经不能解决现在服务器大功率所产生的热量问题，所以液冷将会是未来解决服务器散热问题的更好途径，而液冷虽然能解决更多的服务器大功率发热问题，但是其安全性却是个问题，因为液冷的导热介质为液体，就涉及到一个液体泄漏问题，现有的液冷散热都是单独为每个元器件散热，每个CPU单独有液冷板，内存也有单独液冷板，液冷板多了，同一个服务器上就会有很多接口，而这些接口都有可能泄漏冷却液，导致产品的使用存在安全隐患。
发明内容
本发明为了克服上述中存在的问题，提供了一种服务器液冷散热器，采用全覆盖冷却方式，解决了因液冷板接口过多而造成容易泄漏的问题，将将泄露点降到最低，大大提高产品的安全系数。
本发明解决其技术问题所采用的技术方案是：本发明提供了一种服务器液冷散热器，包括液冷板，该液冷板上设有热管，所述热管上连接有铝板以及散热片，所述液冷板内部设有冷却液流道，该冷却液流道与外部的管道连通从而形成水路循环，所述液冷板靠近管道的位置安装有扰流风扇。
优选的，所述液冷板由上板以及下板密封安装组成，所述上板顶面与热管连接，其底面设有环形凹槽，并与下板形成封闭的冷却液流道，所述下板底面涂有导热膏。
优选的，所述热管采用焊接或过盈配合方式安装到液冷板上。
优选的，所述热管包括第一热管以及第二热管，所述第一热管对称设于液冷板顶部其一端与液冷板连接，另一端焊接有铝板，该铝板两侧还贴合有导热垫，所述第二热管正对管道设于液冷板顶部其一端与液冷板连接，另一端焊接有散热片。
优选的，所述液冷板上对称设有定位装置，该定位装置包括螺杆、弹簧以及卡簧，所述螺杆贯穿液冷板，该卡簧套设在螺杆贯穿并伸出液冷板的部位，所述弹簧套设在螺杆上并与液冷板相抵。
与现有技术相比，本发明具有的有益效果为：该液冷散热器采用全覆盖冷却方式，能够把所有元器件的发热通过热管和扰流风扇转移到液冷板上，解决了因液冷板接口过多而造成容易泄漏的问题，将将泄露点降到最低，大大提高产品的安全系数。
附图说明
下面结合附图和实施例对本发明进一步说明。
图1是本发明所述的一种服务器液冷散热器的轴测结构示意图；
图2是本发明所述的一种服务器液冷散热器的轴测结构示意图；
图3是本发明所述的一种服务器液冷散热器的液冷板结构示意图；
图4是图2的局部放大示意图；
图5是本发明所述的一种服务器液冷散热器的装配图。
附图说明：1、液冷板；101、上板；102、下板；2、热管；201、第一热管；202、第二热管；3、铝板；4、散热片；5、冷却液流道；6、管道；7、扰流风扇；8、导热膏；9、定位装置；901、螺杆；902、弹簧；903、卡簧。
具体实施方式
现在结合附图对本发明作进一步详细的说明。这些附图均为简化的示意图，仅以示意方式说明本发明的基本结构，因此其仅显示与本发明有关的构成。
本发明在具体实施如下：如图1‐5所示的一种服务器液冷散热器，包括液冷板1，该液冷板1上设有热管2，热管2采用焊接或过盈配合方式安装到液冷板1上，热管2上连接有铝板3以及散热片4，液冷板1内部设有冷却液流道5，该冷却液流道5与外部的管道6连通从而形成水路循环，液冷板1靠近管道6的位置安装有扰流风扇7，该液冷散热器采用全覆盖冷却方式，能够把所有元器件产生的热量通过热管2和扰流风扇7转移到液冷板1上，并通过液冷板1里面的冷却液带走，解决了因液冷板1接口过多而造成容易泄漏的问题，将将泄露点降到最低，大大提高产品的安全系数，液冷板1由上板101以及下板102密封安装组成，上板101顶面与热管2连接，其底面设有环形凹槽，并与下板形成封闭的冷却液流道5，冷却液流道5布满上板101，保证冷却液最大面积接触发热源，起到最佳的散热效率，下 板102底面涂有导热膏8，导热膏8是可以传递热量且导热系数高的胶状物质，可以填充液冷板1和CPU之间的间隙，保证散热性能。
热管2包括第一热管201以及第二热管202，第一热管201对称设于液冷板1顶部其一端与液冷板1连接，另一端焊接有铝板3，该铝板3两侧还贴合有导热垫，第一热管201贴合产品内存条设置，内存条产生的热量通过第一热管201传递给液冷板1，从而保证内存条的散热效率，同时通过导热垫能够提高内存的散热效率，第二热管202正对管道6设于液冷板1顶部其一端与液冷板1连接，另一端焊接有散热片4，散热片4贴紧阵列板卡设置，阵列板卡产生的热量通过第二热管202传递给液冷板1，从而保证阵列板卡的散热效率。
液冷板1上对称设有定位装置9，该定位装置包括螺杆901、弹簧902以及卡簧903，螺杆901贯穿液冷板1，该卡簧903套设在螺杆901贯穿并伸出液冷板1的部位，弹簧902套设在螺杆901上并与液冷板1相抵，通过螺杆901将散热器整体固定到服务器主板上，弹簧902压缩后产生的形变可以把液冷板1紧紧的贴合在CPU上，保证其接触面积，提高散热效果，卡簧903用于固定螺杆901在液冷板1上的位置，方便安装。
以上述依据本发明的理想实施例为启示，通过上述的说明内容，相关工作人员完全可以在不偏离本项发明技术思想的范围内，进行多样的变更以及修改。本项发明的技术性范围并不局限于说明书上的内容，必须要根据权利要求范围来确定其技术性范围。

Claims (5)

  1. 一种服务器液冷散热器，其特征在于：包括液冷板，该液冷板上设有热管，所述热管上连接有铝板以及散热片，所述液冷板内部设有冷却液流道，该冷却液流道与外部的管道连通从而形成水路循环，所述液冷板靠近管道的位置安装有扰流风扇。
  2. 根据权利要求1所述的一种服务器液冷散热器，其特征在于：所述液冷板由上板以及下板密封安装组成，所述上板顶面与热管连接，其底面设有环形凹槽，并与下板形成封闭的冷却液流道，所述下板底面涂有导热膏。
  3. 根据权利要求1所述的一种服务器液冷散热器，其特征在于：所述热管采用焊接或过盈配合方式安装到液冷板上。
  4. 根据权利要求1所述的一种服务器液冷散热器，其特征在于：所述热管包括第一热管以及第二热管，所述第一热管对称设于液冷板顶部其一端与液冷板连接，另一端焊接有铝板，该铝板两侧还贴合有导热垫，所述第二热管正对管道设于液冷板顶部其一端与液冷板连接，另一端焊接有散热片。
  5. 根据权利要求1所述的一种服务器液冷散热器，其特征在于：所述液冷板上对称设有定位装置，该定位装置包括螺杆、弹簧以及卡簧，所述螺杆贯穿液冷板，该卡簧套设在螺杆贯穿并伸出液冷板的部位，所述弹簧套设在螺杆上并与液冷板相抵。
PCT/CN2019/127026 2019-12-13 2019-12-20 一种服务器液冷散热器 WO2021114376A1 (zh)

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CN114690869A (zh) * 2022-03-24 2022-07-01 安徽超清科技股份有限公司 一种传输稳定的大数据服务器终端
CN116033729A (zh) * 2023-03-30 2023-04-28 合肥锐联传热技术有限公司 一种内外双循环系统的液冷机箱

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CN114006246B (zh) * 2021-10-27 2022-07-15 光惠（上海）激光科技有限公司 一种带有高功率多模合束器的激光器

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JPH0697338A (ja) * 1991-12-19 1994-04-08 Hitachi Ltd 電子装置
CN2726113Y (zh) * 2004-09-03 2005-09-14 黄维诚 具热导体的液冷式散热水箱结构
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