WO2018098911A1 - 一种部分浸没式液冷服务器冷却系统 - Google Patents

一种部分浸没式液冷服务器冷却系统 Download PDF

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WO2018098911A1
WO2018098911A1 PCT/CN2017/074712 CN2017074712W WO2018098911A1 WO 2018098911 A1 WO2018098911 A1 WO 2018098911A1 CN 2017074712 W CN2017074712 W CN 2017074712W WO 2018098911 A1 WO2018098911 A1 WO 2018098911A1
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oil
chassis
chip
liquid
cooling system
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PCT/CN2017/074712
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English (en)
French (fr)
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王伟
吕松浩
黎汉华
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广东合一新材料研究院有限公司
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Publication of WO2018098911A1 publication Critical patent/WO2018098911A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • the invention relates to the field of heat dissipation and cooling of electronic devices, and in particular to a partial immersion liquid cooling server cooling system.
  • the heat dissipation of the integrated chip is mainly through providing a heat sink on the upper part of the integrated chip, the heat sink is in contact with the surface of the heat-generating component to absorb heat, and then the air is forced by the fan to convect the air, and the heat is transmitted to the far place through the air to complete the heat dissipation of the server.
  • the current heat dissipation methods have the following disadvantages:
  • the heat generated by the heating element in the server is mainly taken away by air convection.
  • the heat conduction effect of the air is relatively poor.
  • the ambient temperature of the server is required to be around 25 °C; since the electronic device needs insulation protection
  • the humidity of the air needs to be controlled within a suitable range, resulting in high utilization rate of the air conditioner, high energy consumption, and poor energy saving and environmental protection effects.
  • the internal heat sink of the server needs to use a fan to perform forced air convection cooling, which not only increases the power consumption of the fan, but also increases the noise and affects the environment in which the server is used. Since the environment in which the electronic device is used is dust-free, air cooling requires high air cleanliness.
  • the internal heat sink of the server is not in direct contact with the heating element, but is connected by thermal grease or directly suspended, which greatly increases the contact thermal resistance and weakens the heat transfer effect.
  • the object of the present invention is to provide a partial immersion liquid cooling server cooling system, which solves the problems of large energy consumption and poor heat dissipation effect of the existing heat dissipation method.
  • the invention relates to a partial immersion liquid cooling server cooling system, comprising a server chassis, a box cover, a heat dissipation assembly, and a dispersion a heat exchanger, a fuel collecting tank and an oil pump; the cover is closed on the casing to form a closed cavity; a main board to which the chip is connected is disposed in the cavity; and the heat dissipation block is disposed above the chip
  • An oil inlet and an oil outlet connected to the cavity are respectively disposed on two sides of the casing; a liquid separation box is disposed in a side of the casing near the oil inlet; the oil outlet passes through the oil
  • the pipeline is connected to the radiator, the oil collecting tank and the oil pump in sequence, and the other port of the oil pipeline is connected with the oil inlet to form a circulating closed circuit; the casing is filled with a liquid working medium, and the liquid working medium is The main board, the chip and the heat dissipation sheet are immersed; the oil outlet is located below the liquid working liquid level
  • the motherboard is disposed at a bottom of the chassis through a bracket, and has a gap between the bottom of the chassis and the bottom of the chassis.
  • a filter is disposed between the oil collecting tank and the oil pump.
  • connection end of the heat dissipation component is attached to the chip, and the heat dissipation end of the heat dissipation component is a heat dissipation protrusion.
  • the heat dissipation sheet is made of metal.
  • the heat sink is an air cooled heat sink.
  • the heat sink is a water-cooled heat sink.
  • liquid working fluid is an oil liquid.
  • the liquid cooling heat dissipation efficiency is higher than that of the air cooling, and the thermal resistance is almost zero due to the direct contact of the cooling medium with the heating element such as the chip, and the heat transfer efficiency is high.
  • the power consumption of the oil pump and the oil-cooled radiator in the overall system is greatly reduced compared with the air-conditioning energy consumption of the traditional radiator, achieving the effect of energy saving and environmental protection; using the semi-immersion liquid cooling system, on the one hand, cooling the working medium and The heating chip is fully contacted, and can effectively cool the local flow of the heating element such as the chip, and is easy to be evenly temperatureized.
  • the contact time between the cooling medium and the heating chip is prolonged, which is advantageous for the heat generating chip to dissipate heat more effectively, and Compared with the overall immersion type, the amount of cooling medium is significantly reduced, which is beneficial to reduce the overall weight while saving costs.
  • FIG. 1 is a schematic structural view of a partial immersion liquid cooling server cooling system of the present invention
  • FIG. 2 is a schematic diagram of the internal structure of the chassis
  • a partial immersion liquid cooling server cooling system includes a server chassis 1, a cover 101, a heat dissipation assembly 106, a radiator 3, a fuel collection tank 4, and an oil pump 6.
  • the cover 101 covers the chassis 1 to form a closed cavity 7.
  • the main board 104 to which the chip 105 is connected is a heat generating component, and the lower end mounting bracket 9 is fixed to the bottom of the chassis, and has a gap between the bottom of the chassis 1 and the main board 104, so that the heat absorption effect is better.
  • the connecting end of the heat dissipating component 106 is pasted on the chip 105 by a thermal grease, and the heat dissipating end of the heat dissipating component is a protrusion.
  • the material of the heat dissipating component 106 can be metal, and the thermal conductivity is increased.
  • the protrusions are elongated, arranged at equal intervals, and increase the heat dissipation area of the contact with the heat transfer oil; of course, annular protrusions may also be used, which are arranged in the circumferential direction.
  • An oil inlet port 102 and an oil outlet port 107 communicating with the cavity 7 are respectively disposed on two sides of the casing 1 , and a liquid separation box 103 is mounted on a side of the casing 1 near the oil inlet port 102 to The heat transfer oil entering the oil inlet port 102 enters the chassis 1 through the liquid separation of the liquid separation box 103.
  • the liquid working medium 8 used in the embodiment is a heat transfer oil, and the heat transfer oil liquid dissipates the main board 104, the chip 105 and the heat sink.
  • the assembly 106 is submerged, the oil outlet 107 is located below the liquid level of the liquid working medium 8, and the oil outlet 107 is specifically disposed at the non-top end of the side wall of the chassis, and may be an intermediate portion of the side wall of the chassis to ensure heat transfer oil. It will not fill the entire chassis and reduce the amount of heat transfer oil, which will help reduce the overall weight while saving costs.
  • the oil outlet 107 communicates with the radiator 3, the oil collection tank 4, the filter 5 and the oil pump 6 through the oil passage 2, and the other port of the oil passage 2 communicates with the oil inlet 102 to form
  • the circulating closed circuit after the heat transfer oil absorbs heat, flows out from the oil outlet 107, dissipates heat through the radiator 3, and flows into the collecting tank 4, and the oil pump 6 sucks the heat conducting oil through the filter 5 to filter the impurities, and returns to the chassis 1 to continue sucking. Heat to complete a heat cycle.
  • the heat sink 3 in the above embodiment may be an air-cooled heat sink or a water-cooled heat sink.
  • the cooling system of the invention can adopt the light weight and low cost material as the chassis and the cover, and the modification of the server casing is small, so the cabinet assembly also has the advantage of compatibility, and the oil supply system is adopted than the air conditioner (or the cooling unit). Simple, easy to replace and repair.
  • the action process of the present invention is as follows:
  • the heat transfer oil is stored in the oil collecting tank; when the cooling system is started, the heat transfer in the oil collecting tank The oil is pumped through the oil inlet to the liquid separation box through the oil inlet. After passing through the liquid separation box, the heat transfer oil is concentrated and shunted into the chassis until the oil can immerse the heat sink, the motherboard, the chip and the heat sink in the server casing. Other heating elements; in this process, the heat transfer oil exchanges heat with the heating element to complete the heat transfer process, and then the heated heat transfer oil flows into the oil passage through the oil outlet, is cooled by the radiator, and is returned to the oil pipe. Collect the fuel tank and cycle like this.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明公开了一种部分浸没式液冷服务器冷却系统，包括服务器机箱、箱盖、散热组片、散热器、集油箱和油泵；箱盖盖合在机箱上，形成一个封闭的腔体；连接有芯片的主板设置在腔体内；机箱两侧分别开设有与腔体连通的进油口和出油口；机箱内靠近进油口一侧设置有分液盒；出油口通过通油管道依次连通散热器、集油箱和油泵，通油管道的另一个端口与进油口连通，形成循环闭路；机箱内填充有液体工质，液体工质将主板、芯片和散热组片浸没；出油口位于液体工质液面下方。本发明传热效率高，实现节能环保的效果，能够有效的针对芯片等发热元件的局部流动冷却，并且容易均温，有利于发热芯片更加有效地散热，同时节约成本。

Description

一种部分浸没式液冷服务器冷却系统 技术领域
本发明涉及电子器件的散热冷却领域，尤其涉及一种部分浸没式液冷服务器冷却系统。
背景技术
目前服务器部件中大量使用集成电路，众所周知，高温是集成电路的大敌，不但会导致系统运行不稳，使用寿命缩短，甚至有可能使某些部件烧毁。目前集成芯片的散热主要通过在集成芯片上部设置散热器，散热器与发热部件表面接触吸收热量，然后通过风扇强制空气对流，将热量通过空气传递到远处，来完成服务器的散热。目前的散热方法存在以下缺点：
1、服务器中发热元件产生的热量主要通过空气对流带走，空气的导热效果相对较差，要想达到服务器工作的适宜温度，服务器放置的环境温度要求在25℃左右；由于电子器件需要绝缘保护，为了防止电子器件表面结露，空气的湿度需要控制在适宜范围内，从而导致空调的使用率高，能耗大，节能环保效果差。
2、服务器内部散热器需要采用风扇来进行强制空气对流冷却，不仅增加了风扇功耗，并且噪声提高，影响服务器的使用环境。由于电子器件的使用环境要求无尘，采用空气冷却对空气的清洁度要求很高。
3、为了保证电子器件绝缘，服务器内部散热器与发热体之间并非直接接触，而是通过导热硅脂来连接或者直接悬空，这样大大增加了接触热阻，削弱了传热效果。
发明内容
本发明的目的是提供一种部分浸没式液冷服务器冷却系统，解决了现有散热方式能耗大、散热效果不好的问题。
为解决上述技术问题，本发明采用如下技术方案：
本发明一种部分浸没式液冷服务器冷却系统，包括服务器机箱、箱盖、散热组片、散 热器、集油箱和油泵；所述箱盖盖合在所述机箱上，形成一个封闭的腔体；连接有芯片的主板设置在所述腔体内；所述散热组片设置在所述芯片上方；所述机箱两侧分别开设有与所述腔体连通的进油口和出油口；所述机箱内靠近所述进油口一侧设置有分液盒；所述出油口通过通油管道依次连通所述散热器、集油箱和油泵，所述通油管道的另一个端口与所述进油口连通，形成循环闭路；所述机箱内填充有液体工质，所述液体工质将所述主板、芯片和散热组片浸没；所述出油口位于所述液体工质液面下方。
进一步的，所述主板通过支架设置在所述机箱底部，与机箱底部之间具有间隙。
再进一步的，所述集油箱与所述油泵之间设置有过滤器。
再进一步的，所述散热组片的连接端与所述芯片贴合，散热组片的散热端为散热凸起。
再进一步的，所述散热组片的材质为金属。
再进一步的，所述散热器为风冷散热器。
再进一步的，所述散热器为水冷散热器。
再进一步的，所述液体工质为油液。
与现有技术相比，本发明的有益技术效果如下：
本发明的冷却系统，由于冷却工质的比热容比空气的比热容大，液冷散热效率高于风冷，而且基于冷却工质与芯片等发热元件直接接触，热阻几乎趋于零，传热效率高；整体系统中仅有油泵和油冷散热器的功耗，与传统散热器的空调能耗相比大大降低，实现节能环保的效果；采用半浸没式液冷系统，一方面冷却工质与发热芯片充分接触，能够有效的针对芯片等发热元件的局部流动冷却，并且容易均温，与非浸没式相比，冷却工质与发热芯片接触时间延长，有利于发热芯片更加有效地散热，与整体浸没式相比，冷却工质的用量明显减少，有利于降低整体重量，同时节约成本。
附图说明
下面结合附图说明对本发明作进一步说明。
图1为本发明部分浸没式液冷服务器冷却系统结构示意图；
图2为机箱内部结构示意图；
附图标记说明：1、机箱；101、箱盖；102、进油口；103、分液盒；104、主板；105、芯片；106、散热组片；107、出油口；2、通油管道；3、散热器；4、集油箱；5、过滤器；6、油泵；7、腔体；8、液体工质；9、支架。
具体实施方式
如图1-2所示，一种部分浸没式液冷服务器冷却系统，包括服务器机箱1、箱盖101、散热组片106、散热器3、集油箱4和油泵6。所述箱盖101盖合在所述机箱1上，形成一个封闭的腔体7。连接有芯片105的主板104是发热元件，下端安装支架9固定在机箱底部，与机箱1底部之间具有间隙，使芯片105与主板104都被油液包围，吸热效果更好。所述散热组片106的连接端通过导热硅脂贴合在所述芯片105上方，散热组片的散热端为凸起，所述散热组片106的材质可以为金属，增加导热率，本具体实施例中凸起为长条状，等间距排列，增大与导热油液的接触的散热面积；当然也可以采用环形凸起，按周向排列。所述机箱1两侧分别开设有与所述腔体7连通的进油口102和出油口107，所述机箱1内靠近所述进油口102一侧安装有分液盒103，使从进油口102进来的导热油液通过分液盒103的分液进入机箱1内，本实施例所采用的液体工质8为导热油液，导热油液将所述主板104、芯片105和散热组片106浸没，所述出油口107位于所述液体工质8液面下方，出油口107具体设置在机箱侧壁的非顶端，可以是机箱侧壁的中间部位，以保证导热油液不会充满整个机箱，减少导热油液的用量，有利于降低整体重量，同时节约成本。所述出油口107通过通油管道2依次连通所述散热器3、集油箱4、过滤器5和油泵6，所述通油管道2的另一个端口与所述进油口102连通，形成循环闭路，导热油液吸收热量后，从出油口107流出，经散热器3散热，流入集油箱4中，油泵6将导热油液吸过过滤器5过滤杂质，导回机箱1中继续吸热，从而完成一个散热循环。
上述实施例中的所述散热器3可以为风冷散热器，也可以为水冷散热器。
本发明的冷却系统可以采用质量轻、成本低的材质做机箱和箱盖，对服务器外壳部分改动小，所以机柜装配也具有兼容性的优势，采用的油路供给系统比空调(或冷却机组)简单，易于更换和维修。
本发明的动作过程如下：
冷却系统未工作时，导热油液储存在集油箱中；当冷却系统启动后，集油箱中的导热 油液通过油泵的抽吸经进油口输送到分液盒中，经过分液盒后，导热油集聚并分流到机箱中，直至油量能够浸没服务器外壳中的散热组片、主板、芯片以及其他的发热元件；在此过程中，导热油液与发热元件产生热量交换，完成传热过程，随后，加热后的导热油液经出油口流入通油管道，经散热器冷却后重新回流至集油箱，如此循环。
以上所述的实施例仅是对本发明的优选方式进行描述，并非对本发明的范围进行限定，在不脱离本发明设计精神的前提下，本领域普通技术人员对本发明的技术方案做出的各种变形和改进，均应落入本发明权利要求书确定的保护范围内。

Claims (8)

  1. 一种部分浸没式液冷服务器冷却系统，其特征在于：包括服务器机箱(1)、箱盖(101)、散热组片(106)、散热器(3)、集油箱(4)和油泵(6)；所述箱盖(101)盖合在所述机箱(1)上，形成一个封闭的腔体(7)；连接有芯片(105)的主板(104)设置在所述腔体(7)内；所述散热组片(106)设置在所述芯片(105)上方；所述机箱(1)两侧分别开设有与所述腔体(7)连通的进油口(102)和出油口(107)；所述机箱(1)内靠近所述进油口(102)一侧设置有分液盒(103)；所述出油口(107)通过通油管道(2)依次连通所述散热器(3)、集油箱(4)和油泵(6)，所述通油管道(2)的另一个端口与所述进油口(102)连通，形成循环闭路；所述机箱(1)内填充有液体工质(8)，所述液体工质(8)将所述主板(104)、芯片(105)和散热组片(106)浸没；所述出油口(107)位于所述液体工质(8)液面下方。
  2. 根据权利要求1所述的部分浸没式液冷服务器冷却系统，其特征在于：所述主板(104)通过支架(9)设置在所述机箱(1)底部，与机箱(1)底部之间具有间隙。
  3. 根据权利要求1所述的部分浸没式液冷服务器冷却系统，其特征在于：所述集油箱(4)与所述油泵(6)之间设置有过滤器(5)。
  4. 根据权利要求1所述的部分浸没式液冷服务器冷却系统，其特征在于：所述散热组片(106)的连接端与所述芯片(105)贴合，散热组片的散热端为凸起。
  5. 根据权利要求4所述的部分浸没式液冷服务器冷却系统，其特征在于：所述散热组片(106)的材质为金属。
  6. 根据权利要求1-5所述的部分浸没式液冷服务器冷却系统，其特征在于：所述散热器(3)为风冷散热器。
  7. 根据权利要求1-5所述的部分浸没式液冷服务器冷却系统，其特征在于：所述散热器(3)为水冷散热器。
  8. 根据权利要求1-5所述的部分浸没式液冷服务器冷却系统，其特征在于：所述液体工质(8)为油液。
PCT/CN2017/074712 2016-11-29 2017-02-24 一种部分浸没式液冷服务器冷却系统 WO2018098911A1 (zh)

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Application Number Priority Date Filing Date Title
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CN109841918A (zh) * 2019-03-01 2019-06-04 华南理工大学 利用浸没式冷却散热的电动汽车动力电池组散热结构
CN110062297A (zh) * 2019-04-09 2019-07-26 广东合一新材料研究院有限公司 一种5g基站散热系统
CN110891404A (zh) * 2019-11-22 2020-03-17 河南省无线发射传输管理中心 一种新型广播电视大功率数字发射机浸没式高效油冷散热装置
CN112545176A (zh) * 2020-11-28 2021-03-26 西安熊福芳电子科技有限公司 一种科技成果研究用大数据过滤仪
CN112506320A (zh) * 2020-12-10 2021-03-16 浪潮电子信息产业股份有限公司 一种散热膏防冲刷浸没式液冷装置及服务器
CN112764505B (zh) * 2021-01-25 2024-03-26 兰洋(宁波)科技有限公司 一种用于浸没式散热液体的冷却装置及散热控制方法
CN112764505A (zh) * 2021-01-25 2021-05-07 兰洋(宁波)科技有限公司 一种用于浸没式散热液体的冷却装置及散热控制方法
CN113093875A (zh) * 2021-03-31 2021-07-09 深圳市智微智能科技股份有限公司 一种全封闭式服务器水冷结构及方法
CN113075984A (zh) * 2021-04-01 2021-07-06 山东英信计算机技术有限公司 一种浸没式液冷系统
CN113703550A (zh) * 2021-07-23 2021-11-26 苏州浪潮智能科技有限公司 一种混合式液冷装置
CN113849054A (zh) * 2021-08-31 2021-12-28 兰洋(宁波)科技有限公司 一种应用于数据中心的浸没式液冷散热系统
CN113849054B (zh) * 2021-08-31 2024-03-26 兰洋(宁波)科技有限公司 一种应用于数据中心的浸没式液冷散热系统
CN116321934A (zh) * 2022-12-30 2023-06-23 比赫电气（太仓）有限公司 一种5u机架式浸没式液冷系统
CN116321934B (zh) * 2022-12-30 2023-12-22 比赫电气（太仓）有限公司 一种5u机架式浸没式液冷系统

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