WO2021106920A1 - 湿式めっき工程におけるバイオフィルムの抑制方法 - Google Patents

湿式めっき工程におけるバイオフィルムの抑制方法 Download PDF

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Publication number
WO2021106920A1
WO2021106920A1 PCT/JP2020/043777 JP2020043777W WO2021106920A1 WO 2021106920 A1 WO2021106920 A1 WO 2021106920A1 JP 2020043777 W JP2020043777 W JP 2020043777W WO 2021106920 A1 WO2021106920 A1 WO 2021106920A1
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WO
WIPO (PCT)
Prior art keywords
tank
plating
biofilm
khz
ultrasonic waves
Prior art date
Application number
PCT/JP2020/043777
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English (en)
French (fr)
Japanese (ja)
Inventor
義弘 萱沼
大介 吉井
Original Assignee
松田産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松田産業株式会社 filed Critical 松田産業株式会社
Priority to JP2021561446A priority Critical patent/JP7053973B2/ja
Priority to MYPI2022002033A priority patent/MY195172A/en
Publication of WO2021106920A1 publication Critical patent/WO2021106920A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonics, vibrations

Definitions

  • the present invention relates to a method for suppressing a biofilm in a wet plating step.
  • the present invention relates to a method for suppressing a biofilm generated in a plating tank, a recovery tank, a washing tank, etc. used in a wet plating process.
  • the wet plating process usually consists of a plating tank for plating the product, a recovery tank for cleaning and recovering the plating metal remaining without plating, a water washing tank for finally cleaning the plated product, and the like.
  • precious metals such as gold, palladium, silver, platinum, and rhodium
  • concentration is low in the liquid even in the washing tank, since precious metal ions are present, these are also recovered by using a resin or the like.
  • microorganisms contained in pure water or in the environment used for construction baths grow on organic acids such as citric acid added to the plating bath, and like algae in plating tanks, recovery tanks, washing tanks, etc. (Biofilm) may be formed.
  • the plating bath may be heated to a constant temperature in order to adjust the plating conditions, which makes it easy for microorganisms to propagate.
  • anaerobic bacteria adhere to the tank wall and aerobic bacteria gather to form it, so when it reaches a certain size, it peels off and is in the liquid. There is a problem of being dispersed in.
  • Patent Document 1 discloses a technique for suppressing the growth of microorganisms in a piping by installing an electromagnetic device in the circulation piping of a plating-related tank.
  • Patent Document 2 discloses a technique for suppressing the generation of microorganisms in a liquid by using a photocatalytic reaction generated by irradiating ultraviolet rays in a pretreatment for plating.
  • the plating solution may be irradiated with ultraviolet rays, or an ozone sterilizer or the like may be used.
  • the irradiated portion of ultraviolet rays has a bactericidal effect, it is physically difficult to irradiate the entire tank, and the current situation is that it cannot be an effective means.
  • ozone is also a concern about the influence on the plating film, and cannot be an effective means.
  • An object of the present invention is to provide a method for inhibiting the formation of a biofilm in a plating tank, a recovery layer, a washing layer, etc. used in a wet plating step.
  • One aspect of the present invention that can solve the above problems is a method of inhibiting the formation of a biofilm, and has a frequency of 20 kHz in a tank such as a plating tank, a recovery tank, or a washing tank used in a wet plating step. It is characterized by irradiating an ultrasonic wave of about 100 kHz.
  • the formation of a biofilm can be inhibited in a plating tank, a recovery tank, a washing tank, etc. used in a wet plating step.
  • This makes it possible to improve the yield of product defects due to the adhesion of the biofilm.
  • it is possible to reduce the blockage of the ion exchange resin and the piping installed in each tank.
  • it has an excellent effect that the frequency of cleaning the plating tank and the like can be reduced.
  • the wet plating process usually consists of a plating tank for plating the product, a recovery tank for cleaning the plated product and recovering the plating metal remaining without plating, and a water washing tank for finally cleaning the plated product.
  • a plating tank for plating the product
  • a recovery tank for cleaning the plated product and recovering the plating metal remaining without plating
  • a water washing tank for finally cleaning the plated product.
  • precious metals such as gold, palladium, silver, platinum, and rhodium are used as the plating metal, it is important to recover the residual precious metal, and it remains at a low concentration even in the washing tank.
  • the precious metal ions are recovered using a resin or the like.
  • microorganisms contained in pure water or the environment used for the construction bath are the citric acid added to the plating bath. It grows on such organic acids and forms algae-like biofilms.
  • Such a biofilm causes problems such as deterioration of yield due to adhesion to a product (object to be plated), poor recovery due to blockage of ion exchange resin in a recovery tank, and cleaning load due to clogging of water washing tank piping.
  • ozone has been found to have a bactericidal effect, it cannot be an effective means as well as ultraviolet irradiation because there is concern about the effect of ozone on the plating film and its solubility in water is low. Absent. Further, it has been considered to use hypochlorous acid having a high bactericidal effect as a chemical for removing the biofilm, but there is a problem that the plating film is affected and the running cost is high.
  • the biofilm suppression method according to the embodiment of the present invention is characterized in that ultrasonic waves having a frequency of 20 kHz to 100 kHz are irradiated in a tank such as a plating tank, a recovery layer, and a washing tank.
  • a tank such as a plating tank, a recovery layer, and a washing tank.
  • microorganisms In the past, since the emphasis was on killing microorganisms, while it was possible to kill microorganisms, there was a negative aspect that affected the plating film, but in the present invention, microorganisms must form a biofilm. For example, it is a new idea that it is not necessary to kill microorganisms, and this point is particularly important. As a result, the use of ultrasonic waves made it possible to inhibit the formation of biofilms without the use of large-scale ultraviolet or ozone generators or chemicals that affect the plating film. It can be said that this is an advantage over the conventional technology.
  • the water to be treated collected from lakes and marshes is irradiated with ultrasonic waves to remove plankton and purify it.
  • methods of giving physical stimuli such as ultrasonic waves have been avoided for fear of affecting the plating film.
  • ultrasonic waves have not been irradiated in the tank because of the concern that the PVC welding may be peeled off.
  • the present inventors have found that even when ultrasonic waves are irradiated in a tank such as a plating tank, the formation of a biofilm can be inhibited without adversely affecting the plating film by controlling the frequency. ..
  • the plating tank was irradiated with ultrasonic waves of different frequencies, and the growth state of the biofilm with respect to each frequency was observed.
  • the frequency of the ultrasonic wave to be irradiated is 20 kHz or more and 100 kHz or less, it is possible to effectively inhibit the formation of the biofilm without adversely affecting the plating film. It is preferably 50 kHz or less, and more preferably 40 kHz or less. Ultrasonic irradiation is possible even during the formation of the plating film, and can be irradiated continuously or at intervals. In addition, the irradiation time can be appropriately determined while checking the growth state of the biofilm.
  • the ultrasonic device may be installed directly in the plating tank, the recovery tank, or the washing tank, but as shown in Examples described later, the ultrasonic device is installed in the stock tank attached to the recovery tank or the washing tank. Then, after ultrasonic irradiation in the stock tank, the liquid may be refluxed. Further, although not shown in Examples, the liquid is sent to the extra-system stock tank for exchanging the liquid in the recovery tank or the washing tank, and the extra-system stock tank is irradiated with ultrasonic waves to block the extra-system stock tank. Can also be improved. In this case, the liquid does not return to the plating line and is discharged to the outside of the system. In the present disclosure, such stock tanks inside and outside the system are also included in the meaning as a part of the plating tank, the recovery tank, and the washing tank.
  • FIG. 1 shows an example of an overall schematic view of the wet plating process.
  • the plating product 4 is washed in the recovery tank 2.
  • the purpose of the term "recovery tank” is to recover the plated metal (for example, noble metal) that remains without being plated by cleaning.
  • the recovery tank 2 when the concentration of metal ions is high, the residual metal is recovered by using an electrolyzer or the like, and when the concentration is low, it is recovered by using an ion exchange resin or the like. Then, the plating product 4 is washed in the water washing tank 3. At this time, since the plated metal remains in a small amount, the metal can be recovered even in the water washing tank 3.
  • biofilms are formed by pure water used for construction baths or microorganisms contained in the environment, resulting in reduced yield due to adhesion of biofilms, poor recovery due to pipe blockage and ion exchange resin blockage, etc. Wake up.
  • FIG. 2 is a schematic view of a water washing tank 3 used in an example of a wet plating apparatus.
  • the washing water stored in the stock tank 8 is injected into the washing tank 3 by the circulation pump 11 via the filter 10. After being used for cleaning the plated product, it is returned to the stock tank 8 again after undergoing a step of recovering the plated metal in the liquid.
  • An ultrasonic device 9 is installed in the washing water stock tank 8 to irradiate ultrasonic waves. This suppresses the formation of biofilms by microorganisms in the washing water.
  • the biofilm is likely to be formed on the side wall, it is more effective to irradiate the side wall with ultrasonic waves.
  • the ultrasonic device 9 is installed in the stock tank 8 is shown, but the same effect can be obtained by irradiating the ultrasonic wave in the water washing tank 3.
  • the formation of a biofilm can be suppressed by installing an ultrasonic device in each tank or each stock tank and irradiating the ultrasonic waves.
  • the biofilm on the collected test piece was placed in a certain amount of pure water, stirred sufficiently, and then measured with a general viable cell count measurement kit.
  • the weight change the weight of the dried residue after rinsing with pure water, drying, and drying was measured with a precision balance.
  • a test plating substrate A on which a plating film (electroless Ni / Pd / Au plating film) was formed and a test resist substrate B on which a resist film was formed were prepared.
  • the plating substrate A resist substrate B
  • the plating surface resist surface
  • the ultrasonic transducers were installed so as to face each other.
  • ultrasonic waves (frequency band 20 to 40 kHz, output 15 W) are irradiated for 1 minute and 10 minutes, and the plating substrate A (resist substrate B) is pulled up from the water tank at each irradiation time, and the substrate is dried. The state of the plating film (resist film) was evaluated. The plating substrate A and the resist substrate B are tested using separate water tanks.
  • the present invention can suppress the generation of biofilm in a plating tank, a recovery tank, a washing tank, etc. used in a wet plating process without adversely affecting the plating film. This makes it possible to improve the yield of product defects due to the adhesion of the biofilm. In addition, it is possible to reduce the blockage of the ion exchange resin and the piping installed in each tank. In addition, it has an excellent effect that the frequency of cleaning the plating tank and the like can be reduced.
  • the present invention is useful in wet plating steps.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Physical Water Treatments (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Apparatus For Disinfection Or Sterilisation (AREA)
  • Silver Salt Photography Or Processing Solution Therefor (AREA)
PCT/JP2020/043777 2019-11-27 2020-11-25 湿式めっき工程におけるバイオフィルムの抑制方法 WO2021106920A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021561446A JP7053973B2 (ja) 2019-11-27 2020-11-25 湿式めっき工程におけるバイオフィルムの抑制方法
MYPI2022002033A MY195172A (en) 2019-11-27 2020-11-25 Method for Suppressing Biofilm in Wet Plating Process

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019213877 2019-11-27
JP2019-213877 2019-11-27

Publications (1)

Publication Number Publication Date
WO2021106920A1 true WO2021106920A1 (ja) 2021-06-03

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PCT/JP2020/043777 WO2021106920A1 (ja) 2019-11-27 2020-11-25 湿式めっき工程におけるバイオフィルムの抑制方法

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Country Link
JP (1) JP7053973B2 (zh)
MY (1) MY195172A (zh)
TW (1) TWI772983B (zh)
WO (1) WO2021106920A1 (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011052309A (ja) * 2009-09-04 2011-03-17 Ebara-Udylite Co Ltd めっき関連槽中での微生物増殖抑制方法およびこれに用いる微生物の増殖抑制システム
JP2016501099A (ja) * 2012-12-17 2016-01-18 アメリカン イーグル インストラメンツ インコーポレイテッドＡｍｅｒｉｃａｎ Ｅａｇｌｅ Ｉｎｓｔｒｕｍｅｎｔｓ， Ｉｎｃ． 放電洗浄器装置及び方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2441817Y (zh) * 2000-08-31 2001-08-08 湖南省郴州市山河电子设备有限公司 超声波电镀装置
CN208843903U (zh) * 2018-08-07 2019-05-10 浙江海拓环境技术有限公司 一种用于电镀废水深度处理的防结垢生物滤池系统

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011052309A (ja) * 2009-09-04 2011-03-17 Ebara-Udylite Co Ltd めっき関連槽中での微生物増殖抑制方法およびこれに用いる微生物の増殖抑制システム
JP2016501099A (ja) * 2012-12-17 2016-01-18 アメリカン イーグル インストラメンツ インコーポレイテッドＡｍｅｒｉｃａｎ Ｅａｇｌｅ Ｉｎｓｔｒｕｍｅｎｔｓ， Ｉｎｃ． 放電洗浄器装置及び方法

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Publication number Publication date
TWI772983B (zh) 2022-08-01
JPWO2021106920A1 (zh) 2021-06-03
JP7053973B2 (ja) 2022-04-12
TW202129087A (zh) 2021-08-01
MY195172A (en) 2023-01-11

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