MY195172A - Method for Suppressing Biofilm in Wet Plating Process - Google Patents

Method for Suppressing Biofilm in Wet Plating Process

Info

Publication number
MY195172A
MY195172A MYPI2022002033A MYPI2022002033A MY195172A MY 195172 A MY195172 A MY 195172A MY PI2022002033 A MYPI2022002033 A MY PI2022002033A MY PI2022002033 A MYPI2022002033 A MY PI2022002033A MY 195172 A MY195172 A MY 195172A
Authority
MY
Malaysia
Prior art keywords
tank
wet plating
plating process
biofilm
suppressing
Prior art date
Application number
MYPI2022002033A
Other languages
English (en)
Inventor
Yoshihiro Kayanuma
Daisuke Yoshii
Original Assignee
Matsuda Sangyo Company Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsuda Sangyo Company Ltd filed Critical Matsuda Sangyo Company Ltd
Publication of MY195172A publication Critical patent/MY195172A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonics, vibrations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Physical Water Treatments (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Apparatus For Disinfection Or Sterilisation (AREA)
  • Silver Salt Photography Or Processing Solution Therefor (AREA)
MYPI2022002033A 2019-11-27 2020-11-25 Method for Suppressing Biofilm in Wet Plating Process MY195172A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019213877 2019-11-27
PCT/JP2020/043777 WO2021106920A1 (ja) 2019-11-27 2020-11-25 湿式めっき工程におけるバイオフィルムの抑制方法

Publications (1)

Publication Number Publication Date
MY195172A true MY195172A (en) 2023-01-11

Family

ID=76129347

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2022002033A MY195172A (en) 2019-11-27 2020-11-25 Method for Suppressing Biofilm in Wet Plating Process

Country Status (4)

Country Link
JP (1) JP7053973B2 (zh)
MY (1) MY195172A (zh)
TW (1) TWI772983B (zh)
WO (1) WO2021106920A1 (zh)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2441817Y (zh) * 2000-08-31 2001-08-08 湖南省郴州市山河电子设备有限公司 超声波电镀装置
JP2011052309A (ja) * 2009-09-04 2011-03-17 Ebara-Udylite Co Ltd めっき関連槽中での微生物増殖抑制方法およびこれに用いる微生物の増殖抑制システム
JP6096928B2 (ja) * 2012-12-17 2017-03-15 アメリカン イーグル インストラメンツ インコーポレイテッドＡｍｅｒｉｃａｎ Ｅａｇｌｅ Ｉｎｓｔｒｕｍｅｎｔｓ， Ｉｎｃ． 放電洗浄器装置及び方法
CN208843903U (zh) * 2018-08-07 2019-05-10 浙江海拓环境技术有限公司 一种用于电镀废水深度处理的防结垢生物滤池系统

Also Published As

Publication number Publication date
TWI772983B (zh) 2022-08-01
JP7053973B2 (ja) 2022-04-12
JPWO2021106920A1 (zh) 2021-06-03
TW202129087A (zh) 2021-08-01
WO2021106920A1 (ja) 2021-06-03

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