WO2021093719A1 - 建筑部件增加射频信号穿透率的介电体结构及其设置方法 - Google Patents

建筑部件增加射频信号穿透率的介电体结构及其设置方法 Download PDF

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Publication number
WO2021093719A1
WO2021093719A1 PCT/CN2020/127730 CN2020127730W WO2021093719A1 WO 2021093719 A1 WO2021093719 A1 WO 2021093719A1 CN 2020127730 W CN2020127730 W CN 2020127730W WO 2021093719 A1 WO2021093719 A1 WO 2021093719A1
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Prior art keywords
dielectric
material layer
radio frequency
dielectric structure
dielectric material
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PCT/CN2020/127730
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English (en)
French (fr)
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符仙琼
卢明
吴日东
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符仙琼
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Priority to EP20888622.6A priority Critical patent/EP3913738A4/en
Priority to KR1020217030448A priority patent/KR20210127254A/ko
Priority to AU2020384152A priority patent/AU2020384152A1/en
Priority to JP2021531362A priority patent/JP7176117B2/ja
Priority to CA3157753A priority patent/CA3157753A1/en
Priority to CN202080009696.8A priority patent/CN113302795A/zh
Priority to SG11202105940PA priority patent/SG11202105940PA/en
Publication of WO2021093719A1 publication Critical patent/WO2021093719A1/zh
Priority to AU2023201842A priority patent/AU2023201842A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
    • H01Q1/422—Housings not intimately mechanically associated with radiating elements, e.g. radome comprising two or more layers of dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
    • H01Q15/0013—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective

Definitions

  • the invention relates to a dielectric structure and a setting method thereof. After the dielectric structure is joined with a dielectric building component, the penetration of a radio frequency signal of a specific frequency spectrum in the dielectric building component can be improved.
  • the communications industry has gradually adopted high-frequency electromagnetic waves for signal transmission.
  • the used frequency band is upgraded to a high frequency spectrum
  • the influence of building materials and building components on communication transmission is more important.
  • dielectric materials such as glass, cement, wood, ceramics and plastics can be included in this category. Even if some dielectric materials have low dielectric loss parameters, they have extremely low dielectric loss for the electromagnetic wave passing through; but in a specific electromagnetic wave spectrum, reflection loss will still be caused by the mismatch between the dielectric constant of the material itself and the outside world. .
  • the general glass will produce a reflection loss of 2 to 4dB in the use environment of high-frequency communication, which means that 50% of the energy of the electromagnetic wave in the transmission process will be shielded by the glass. It turns into reflection loss.
  • the surface of the dielectric object is used as the antenna substrate, and the transmitting and receiving antenna is prepared through the patterned conductive layer.
  • a related example is the application CN 104685578B.
  • periodic metal structure a periodic metal structure is fabricated on the dielectric body, and the size of the metal structure is adjusted so that the overall structure can selectively penetrate electromagnetic waves of a specific wavelength.
  • the metal structure is therefore called a frequency selective surface, and related examples are the applications JP2004053466, JP2011254482, US4,125,841, US6,730,389, and US2018/0159241.
  • all the solutions mentioned above require a conductive structure to send and receive electromagnetic signals or filter.
  • the technical purpose of the present invention is to solve the problems existing in the existing communication technology, and provide a device that can improve the electromagnetic wave penetration of building parts made of existing dielectric materials and the same Setting method. Since there is no need to make a patterned conductive layer and no power and signal contacts, it has the advantages of easy production, low cost and easy installation.
  • a dielectric structure applied to a building component to increase the transmittance of radio frequency signals.
  • the dielectric structure includes a structure and a positioning component, and the structure includes at least one dielectric material layer,
  • the positioning component joins the structure and the joint (building component), and the dielectric constant of the dielectric material layer is between 1 and 10,000.
  • the positioning component joins the dielectric structure and the building component to the composite structure.
  • the radio frequency signal of the working frequency f 0 passes and the reflection loss is reduced.
  • the minimum equivalent diameter of the projection surface of the dielectric structure on the surface of the joint object on the surface through which the radio frequency signal passes is not less than eight of the working wavelength ⁇ 0 corresponding to the working frequency f 0 One part.
  • the positioning component may further include a dielectric material layer, the dielectric constant of which is between 1 and 10,000.
  • the positioning member may be interposed between the structure and the joint.
  • the dielectric structure may further include a void region.
  • the void area may be interposed between the structure and the joint.
  • the void area may be provided inside the structure without contacting the bonding object.
  • a method for installing a dielectric structure is provided.
  • the dielectric structure can be applied to building components to increase the penetration rate of radio frequency signals.
  • the method includes bonding the structure with positioning components and bonding
  • the structure is composed of at least one dielectric material layer.
  • the positioning component is composed of the dielectric material layer in the area where the radio frequency signal can pass. Based on the admittance compensation technology, the structure and the dielectric material layer of the positioning component
  • the dielectric constant value is between 1 and 10000.
  • the composite structure after the positioning component joins the dielectric structure and the building component can pass the RF signal of the working frequency f 0 and reduce the reflection loss.
  • the dielectric structure is compatible with the RF signal
  • the minimum equivalent diameter of the projected surface of the passing surface on the surface of the joint is not less than one-eighth of the working wavelength ⁇ 0 corresponding to the working frequency f 0.
  • the method may further include providing a void region in the dielectric structure.
  • the dielectric structure and its setting method proposed according to the concept of the present invention have at least the following advantages: (1) It can be made of dielectric materials and has a simple structure and process, so it is conducive to mass production and manufacturing; (2) No need to import external Power and signal are easy to install and use; (3) It can be operated without power, which can save power and operating costs; (4) The dielectric structure is not a signal emission source, and there is no hidden danger of biological safety due to electromagnetic wave radiation.
  • Figure 1 shows an admittance diagram made according to the prior art.
  • FIGS. 2A to 2D respectively show cross-sectional views of a dielectric structure according to an embodiment of the present invention.
  • 3A to 3D respectively show cross-sectional views of a dielectric structure according to an embodiment of the present invention.
  • FIG. 4 shows a schematic diagram of the dielectric structure and the bonding object according to the embodiment of the present invention.
  • 5A and 5B show graphs of reflectance and transmittance when electromagnetic waves from 3 GHz to 5 GHz pass through glass with a thickness of 8 mm and a dielectric constant of 6.
  • 6A and 6B respectively show the reflectance and transmittance of 3GHz ⁇ 5GHz electromagnetic wave penetrating 8mm thick glass with a dielectric constant of 6 and the dielectric structure according to an embodiment of the present invention. .
  • Figures 7A and 7B respectively show the reflectance and transmittance of 3GHz ⁇ 5GHz electromagnetic wave penetrating 8mm thick glass with a dielectric constant of 6 and the dielectric structure according to an embodiment of the present invention. .
  • FIG. 1 it shows an admittance diagram according to the prior art.
  • the admittance value of the composite structure ⁇ s + ⁇ 1 is from the position 103 shown in the figure through the real number axis phase thickness (2*n-1)* ⁇ /2 position 104 and then the real number axis phase thickness n* ⁇ position 105 and then intersect, then t 1 corresponding to the phase thickness n* ⁇ is the optimal thickness of the device, so that the composite structure has improved penetration in the specific electromagnetic wave spectrum, where the value of n in the foregoing two formulas is a non-zero positive integer .
  • the compensation analysis method is the same as the above method.
  • the bandwidth and production process in the actual application state within +/-25% is regarded as the acceptable thickness variation range.
  • FIGS. 2A to 2D show cross-sectional views of dielectric structure examples according to different embodiments of the present invention. .
  • the dielectric structure 200A in FIG. 2A includes a structure composed of at least one first dielectric material layer 201 and a positioning component 220.
  • the structure and the joining object 250 are joined by the positioning member 220.
  • the range of the dielectric constant of the first dielectric material layer 201 is 1 to in the radio frequency signal transmission state where the operating frequency is f 0 and the corresponding wavelength is ⁇ 0 10000, the minimum equivalent diameter of the projection surface of the dielectric structure 200A on the surface through which the radio frequency signal passes on the surface of the joint is not less than ⁇ 0 /8.
  • the dielectric structure 200B in FIG. 2B includes a structure composed of at least one first dielectric material layer 201 and a positioning member 220 composed of a second dielectric material layer.
  • the member 220 joins the structure and the joining object 250.
  • the range of the dielectric constant of the first dielectric material layer is 1 to in the radio frequency signal transmission state where the working frequency is f 0 and the corresponding wavelength is ⁇ 0.
  • the dielectric constant value of the second dielectric material layer ranges from 1 to 10000, and the minimum equivalent diameter of the projection surface of the dielectric structure 200B on the surface through which the radio frequency signal passes on the surface of the bonding object is not less than ⁇ 0 /8.
  • the dielectric structure 200B is different from the dielectric structure 200A in that the positioning member 220 is interposed between the structure and the bonding object 250.
  • the dielectric structure 200C in FIG. 2C includes a structure composed of at least one first dielectric material layer 201 and a second dielectric material layer 202, and a positioning component 220, using the positioning component 220
  • the structure and the bonding object 250 are bonded.
  • the second dielectric material layer 202 may partially cover the first dielectric material layer 201.
  • the composite structure after the dielectric structure 200C and the bonding object 250 are bonded in the radio frequency signal transmission state with the operating frequency f 0 and the corresponding wavelength ⁇ 0 , the first dielectric material layer 201 and the second dielectric material layer 202
  • the range of the dielectric constant value is 1 ⁇ 10000.
  • the minimum equivalent diameter of the dielectric structure 200C on the projection surface of the surface through which the radio frequency signal passes on the surface of the bonding object is not less than ⁇ 0 /8.
  • the dielectric structure 200D in FIG. 2D includes at least one structure composed of a first dielectric material layer 201 and a second dielectric material layer 202 and a third dielectric material layer.
  • the positioning member 220 uses the positioning member 220 to join the structure and the joint 250.
  • the second dielectric material layer may partially cover the first dielectric material layer.
  • the first dielectric material layer 201, the second dielectric material layer 202 and the radio frequency signal transmission state with the operating frequency f 0 and the corresponding wavelength ⁇ 0 The range of the dielectric constant value of the positioning member 220 formed by the third dielectric material layer is 1 to 10,000.
  • the minimum equivalent diameter of the dielectric structure 200D on the projection surface of the surface through which the radio frequency signal passes on the surface of the bonding object is not less than ⁇ 0 /8.
  • FIGS. 3A to 3D respectively show the dielectric structure according to an embodiment of the present invention in cross-sectional views. Different from the embodiment shown in FIGS. 2A to 2D, the dielectric structure of the embodiment shown in FIGS. 3A to 3D includes an empty gap region.
  • the dielectric structure 300A in FIG. 3A includes a structure composed of at least one first dielectric material layer 301, a gap region 320, and a positioning member 330.
  • the positioning member 330 is used to join the structure and the bonding object 350.
  • the range of the dielectric constant value of the first dielectric material layer 301 is 1 in the radio frequency signal transmission state where the working frequency is f 0 and the corresponding wavelength is ⁇ 0 ⁇ 10000
  • the minimum equivalent diameter of the projection surface of the dielectric structure 300A on the surface through which the radio frequency signal passes on the surface of the joint is not less than ⁇ 0 /8.
  • the dielectric structure 300B in FIG. 3B includes a structure composed of at least one first dielectric material layer 301, a gap region 320, and a positioning component 330.
  • the positioning component 330 is used to connect the structure to The bonding object 350 is bonded.
  • the range of the dielectric constant value of the first dielectric material layer 301 is 1 in the radio frequency signal transmission state where the working frequency is f 0 and the corresponding wavelength is ⁇ 0 ⁇ 10000
  • the minimum equivalent diameter of the projection surface of the dielectric structure 300B on the surface of the bonding object through which the radio frequency signal passes is not less than ⁇ 0 /8.
  • the dielectric structure 300C in FIG. 3C includes at least one structure composed of a first dielectric material layer 301, a void region 320, and a positioning member 330 composed of a second dielectric material layer.
  • the positioning member 330 may be a second dielectric material with a dielectric constant in the range of 1 to 10,000, and at least a part of the gap is filled between the structure and the bonding object 350, and the structure and the bonding object 350 are bonded.
  • the range of the dielectric constant value of the first dielectric material layer 301 is 1 in the radio frequency signal transmission state where the operating frequency is f 0 and the corresponding wavelength is ⁇ 0 ⁇ 10000, the minimum equivalent diameter of the projection surface of the dielectric structure 300C on the surface of the bonding object through which the radio frequency signal passes is not less than ⁇ 0 /8.
  • the dielectric structure 300D in FIG. 3D includes a structure composed of at least one first dielectric material layer 301, a gap region 320, and a positioning member 330 composed of a second dielectric material.
  • the positioning member 330 may be a second dielectric material with a dielectric constant in the range of 1 to 10,000 and fills at least a part of the gap between the structure and the bonding object 350 to connect the structure and the bonding object 350.
  • the range of the dielectric constant value of the first dielectric material layer 301 is 1 in the radio frequency signal transmission state where the operating frequency is f 0 and the corresponding wavelength is ⁇ 0 ⁇ 10000, the minimum equivalent diameter of the projection surface of the dielectric structure 300D on the surface of the bonding object through which the radio frequency signal passes is not less than ⁇ 0 /8.
  • FIG. 4 shows a schematic view of the joining state of the joining object 401 through the positioning member 402 joining the structure 403 according to the embodiment of the present invention.
  • the aforementioned bonding object 401 may be a building component such as glass, cement, wood, ceramic, plastic, and other dielectric materials, but the present invention is not limited to this, and the bonding object may be any material that needs to enhance the transmittance of radio frequency signals thereon. Any parts.
  • the dielectric constant changes with the operating frequency
  • the specific material types need to be adjusted according to the dielectric constant value of the bonding object in the operating frequency spectrum.
  • the following are representative materials that can be used and are not limited to these materials. These materials include low dielectric constant materials: PTFE, PE, PC, PVC, Acrylic, PU, Epoxy, Silicone, etc.; medium dielectric constant materials: quartz, glass, oxide Aluminum crystals and ceramics, aluminum nitride crystals and ceramics, magnesium oxide crystals and ceramics, silicon carbide crystals and ceramics, zirconia crystals and ceramics, etc.; high dielectric constant materials: titanium oxide crystals and ceramics, barium titanate polymer composite materials Wait.
  • FIG. 5A and FIG. 5B respectively show the reflectance and transmittance of 3GHz ⁇ 5GHz electromagnetic wave penetrating glass with a thickness of 8mm and a dielectric constant of 6 in graphs.
  • the reflectance at the operating frequency of 3.75GHz is -2.925dB, and the transmittance is reduced by -3.098dB due to reflection.
  • FIGS. 6A and 6B respectively show the reflectance and transmittance of 3GHz ⁇ 5GHz electromagnetic wave penetrating 8mm thick glass with a dielectric constant of 6 and the dielectric structure shown in FIG. 2A. rate.
  • the thickness of the dielectric structure is 8.33 mm, and its dielectric constant is 6.
  • FIGS. 7A and 7B respectively show the reflectance and reflectance of 3GHz ⁇ 5GHz electromagnetic wave penetrating 8mm thick glass with a dielectric constant of 6 and the dielectric structure shown in Figure 3A. Transmittance. Among them, the thickness of the dielectric structure is 6 mm, and its dielectric constant is 6, the thickness of the void area is 2.1 mm, and the medium is air. Through simulation, it is obtained that under the operating frequency of 3.75GHz, the reflectance is -24.04dB, and the transmittance is -0.01716dB. This result shows a significant improvement in penetration.
  • the composite structure produced by joining the dielectric structure and the building components disclosed in this case can adjust the admittance value, thereby improving the working frequency spectrum.
  • the penetration of the signal in this composite structure can be adjusted.

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Abstract

一种应用于建筑部件以增加射频信号的穿透率的介电体结构（200A,200B,200C,200D,300A,300B,300C,300D），该介电体结构（200A,200B,200C,200D,300A,300B,300C,300D）包含结构体（403）以及定位部件（220,330,402），结构体（403）包含至少一介电材料层（201,202,301），且各层的介电常数值介于1～10000之间，定位部件（220,330,402）将结构体（403）与接合物（250,350,401）进行接合，介电体结构（200A,200B,200C,200D,300A,300B,300C,300D）与建筑部件接合后的复合结构可使工作频率f 0的射频信号通过并降低反射损失，介电体结构（200A,200B,200C,200D,300A,300B,300C,300D）于射频信号通过的表面在接合物（250,350,401）表面的投影面的最小等效直径不小于与工作频率f 0对应的工作波长λ 0的八分之一。

Description

建筑部件增加射频信号穿透率的介电体结构及其设置方法 技术领域
本发明涉及一种介电体结构及其设置方法，介电体结构与介电性建筑物部件接合后可提升特定频谱的射频信号于介电性建筑部件的穿透性。
背景技术
因应市场对于信息传输高速化的需求，通信产业逐步采用高频电磁波以进行信号传输。因使用频段提升至高频率频谱，故建筑用材料及其建筑部件对于通信传输的影响更显重要。于众多的建筑材料中，介电材料像是玻璃、水泥、木材、陶瓷及塑料等材料都可纳入此范畴。部分的介电材料即便有较低的介电损失参数，对于通过的电磁波有极低的介电损失；但在特定电磁波频谱中仍会因材料自身与外界介电常数的不匹配而造成反射损失。以没有任何镀膜的玻璃在空气中使用为例，一般玻璃在高频通信的使用环境下会产生2～4dB的反射损失，意即电磁波于传输过程中有50％的能量将会因玻璃的屏蔽而转为反射损失。
为了解决信号通过建筑材料或建筑部件所产生的衰减问题，已研究了若干实例并可归纳为数种方案，其中包含内天线、内外天线含引线、介质天线及周期性导电结构等。设置内天线、内外天线含引线等方案广泛应用于车载通信及建筑环境中，这类方案透过天线接收信号，依其系统设计对接收的信号进行放 大，或是不放大信号，将其以引线或天线传送出去，具体的实例像是专利申请US 6,661,386、US 7,091,915、US 8,009,107及EP 1343221。在介质天线的方案中，介电物体表面用作为天线基板，透过图形化导电层以制备收发天线，相关实例像是申请案CN 104685578B。在周期性金属结构的方案中，则是在介电体上制作周期性金属结构，利用调整金属结构的尺寸以使整体结构对特定波长的电磁波产生选择性穿透的表现，这种周期性的金属结构也因此被称之为频率选择性表面，相关的实例则像是申请案JP2004053466、JP2011254482、US4,125,841、US6,730,389、以及US2018/0159241。然而，以上所述的所有方案，均需要有导电结构以收发电磁波信号或滤波。
发明内容
有鉴于上述现有技术的问题，本发明的技术目的是解决现有通信技术中存在的问题，提供一种可提升既有介电材料所制成的建筑部件的电磁波穿透度的装置及其设置方法。由于不需要制作图形化导电层且不需要电力及信号接点，故具备易于生产、成本低及安装简便等优点。
根据本发明一实施例，提供一种应用于建筑部件以增加射频信号的穿透率的介电体结构，该介电体结构包含结构体以及定位部件，结构体包含至少一个介电材料层，定位部件将结构体与接合物(建筑部件)进行接合，且介电材料层的介电常数值介于1～10000之间，定位部件将介电体结构与建筑部件接合后的复合结构可使工作频率f 0的射频信号通过并降低反射损失，介电体结构于射频信号通过的表面在接合物表面的投影面的最小等效直径不小于与工作频率f 0对应的工作波长λ 0的八分之一。
优选地，定位部件可以进一步包含介电材料层，其介电常数值介于1～10000之间。
优选地，定位部件可以是介于结构体以及接合物之间。
优选地，介电体结构可以进一步包含空间隙区。
优选地，空间隙区可以介于结构体以及接合物之间。
优选地，空间隙区可以设置于结构体内部，而不接触接合物。
根据本发明另一实施例，提供一种介电体结构的设置方法，介电体结构可应用于建筑部件，以增加射频信号的穿透率，该方法包含了以定位部件接合结构体以及接合物，且结构体由至少一个介电材料层所构成，定位部件于射频信号设定可通过的区域由介电材料层所构成，基于导纳补偿技术，结构体与定位部件的介电材料层的介电常数值介于1～10000之间，定位部件将介电体结构与建筑部件接合后的复合结构可使工作频率f 0的射频信号通过并降低反射损失，介电体结构于射频信号通过的表面在接合物表面的投影面的最小等效直径不小于与工作频率f 0对应的工作波长λ 0的八分之一。
优选地，该方法可以进一步包含在介电体结构内设置空间隙区。
根据本发明概念提出的介电体结构及其设置方法至少具有如下的优点：(1)可用介电材料制作，具有简单的结构及工艺，故有利于大量生产制造；(2)不需导入外部电力及信号，安装方便且使用方便；(3)不需要电力即可运作，可节约电力及运营成本；(4)介电体结构不是信号发射源，没有电磁波辐射生物安全的隐患。
附图说明
图1示出了根据现有技术制作的导纳图。
图2A～图2D分别示出了根据本发明实施例的介电体结构的剖面图。
图3A～图3D分别示出了根据本发明实施例的介电体结构的剖面图。
图4示出了根据本发明实施例的介电体结构与接合物接合使用的示意图。
图5A及图5B示出了3GHz～5GHz电磁波穿透8mm厚且介电常数为6的玻璃时的反射度及透射度的曲线图。
图6A及图6B以曲线图分别示出了3GHz～5GHz电磁波穿透8mm厚且介电常数为6的玻璃以及其上接合根据本发明一实施例的介电体结构时的反射度及透射度。
图7A及图7B以曲线图分别示出了3GHz～5GHz电磁波穿透8mm厚且介电常数为6的玻璃以及其上接合根据本发明一实施例的介电体结构时的反射度及透射度。
【附图标记说明】
101,102,103,104,105:位置
200A,200B,200C,200D,300A,300B,300C,300D:介电体结构
201,202,301:介电材料层
220,330,402:定位部件
250,350,401:接合物
320:空间隙区
403:结构体
具体实施方式
为进一步说明本发明的技术特征、内容与优点及其所能达成的功效，兹将本发明配合所附图式，并以实施例的表达形式详细说明如下，而其中所使用的图式，其主旨仅为示意及辅助说明书之用，未必为本发明实施后的真实比例与精准配置，故不应就所附图式的比例与配置关系解读、局限本发明于实际实施上的权利要求，合先叙明。
参照图1，其示出根据现有技术的导纳图。以ε s＝ε r＝6的接合物(以位置101示意)置放于ε r＝1的环境(以位置102示意)中为例，随着接合物厚度由0逐步增加至t s，则导纳值α s会由位置102以顺时钟方向移动至位置103。接下来，选用由介电系数为ε 1＝ε r＝6的第一介电材料所构成的结构体接合上述接合物以形成一复合结构，随着该装置的厚度由0逐步增加至t 1，该复合结构的导纳值α s+α 1由图中所示位置103经过实数轴的相位厚度(2*n-1)*π/2位置104后与实数轴的相位厚度n*π位置105再相交，则对应相位厚度n*π的t 1为该装置的最佳厚度，使得该复合结构于特定电磁波频谱具有提升的穿透度，其中，前述二式的n值为非零正整数。对于多层结构或定位部件为介电体且位于射频信号设定可通过的区域，则其补偿分析方法与上述方法相同。另外，对于实际应用状态下的带宽及生产制程考虑，将+/-25％以内视为可接受的厚度变异范围。
基于图1所示的导纳补偿技术来决定该装置的厚度，接下来请参照图2A～图2D，图2A～图2D以剖面图分别示出根据本发明不同实施例的介电体结构示例。
其中，图2A中的介电体结构200A包括由至少一个第一介电材料层201所构成的结构体以及定位部件220。利用定位部件220将结构体与接合物250进行接合。介电体结构200A与接合物250接合后的复合结构在工作频率为f 0且对应波长为λ 0的射频信号传递状态下，第一介电材料层201的介电常数值的范围是1～10000，介电体结构200A于射频信号通过的表面在接合物表面的投影面的最小等效直径不小于λ 0/8。
根据本发明另一实施例，图2B中的介电体结构200B包括由至少一个第一介电材料层201所构成的结构体以及由第二介电材料层所构成的定位部件220，利用定位部件220将结构体与接合物250进行接合。介电体结构200B与接合物250接合后的复合结构在工作频率为f 0且其对应波长为λ 0的射频信号传递状态下，第一介电材料层的介电常数值的范围是1～10000，第二介电材料层的介电常数值的范围是1～10000，介电体结构200B于射频信号通过的表面在接合物表面的投影面的最小等效直径不小于λ 0/8。介电体结构200B与介电体结构200A不同在于，定位部件220介于结构体以及接合物250之间。
根据本发明另一实施例，图2C中的介电体结构200C包括由至少一个第一介电材料层201及第二介电材料层202所构成的结构体以及定位部件220，利用定位部件220将结构体与接合物250进行接合。第二介电材料层202可部分覆盖第一介电材料层201。介电体结构200C与接合物250接合后的复合结构在工作频率为f 0且其对应波长为λ 0的射频信号传递状态下，第一介电材料层201及第二介电材料层202的介电常数值的范围皆是1～10000。介电体结构200C于射频信号通过的表面在接合物表面的投影面的最小等效直径不小于λ 0/8。
根据本发明另一实施例，图2D中的介电体结构200D包括至少一个第一介电材料层201及第二介电材料层202所构成的结构体以及由第三介电材料层所构成的定位部件220，利用定位部件220将结构体与接合物250进行接合。第二介电材料层可部分覆盖第一介电材料层。介电体结构200D与接合物250接合后的复合结构在工作频率为f 0且其对应波长为λ 0的射频信号传递状态下，第一介电材料层201、第二介电材料层202及由第三介电材料层所构成定位部件220的介电常数值的范围皆是1～10000。介电体结构200D于射频信号通过的表面在接合物表面的投影面的最小等效直径不小于λ 0/8。
接下来请参照图3A～图3D，图3A～图3D以剖面图分别示出根据本发明实施例的介电体结构。不同于图2A～图2D所示实施例，图3A～图3D所示实施例的介电体结构包含了空间隙区。
其中，图3A中的介电体结构300A包括至少一个第一介电材料层301所构成的结构体、空间隙区320及定位部件330，利用定位部件330将结构体与接合物350进行接合。介电体结构300A与接合物350接合后的复合结构在工作频率为f 0且其对应波长为λ 0的射频信号传递状态下，第一介电材料层301的介电常数值的范围是1～10000，介电体结构300A于射频信号通过的表面在接合物表面的投影面的最小等效直径不小于λ 0/8。
根据本发明另一实施例，图3B中的介电体结构300B包括至少一个第一介电材料层301所构成的结构体、空间隙区320及定位部件330，利用定位部件330将结构体与接合物350进行接合。介电体结构300B与接合物350接合后的复合结构在工作频率为f 0且其对应波长为λ 0的射频信号传递状态下，第一介电 材料层301的介电常数值的范围是1～10000，介电体结构300B于射频信号通过的表面在接合物表面的投影面的最小等效直径不小于λ 0/8。
根据本发明另一实施例，图3C中的介电体结构300C包括至少一个第一介电材料层301所构成的结构体、空间隙区320及第二介电材料层所构成的定位部件330，定位部件330可为介电常数值1～10000范围内的第二介电材料且于结构体及接合物350间填充至少一部分空隙，并使结构体与接合物350进行接合。介电体结构300C与接合物350接合后的复合结构在工作频率为f 0且其对应波长为λ 0的射频信号传递状态下，第一介电材料层301的介电常数值的范围是1～10000，介电体结构300C于射频信号通过的表面在接合物表面的投影面的最小等效直径不小于λ 0/8。
根据本发明另一实施例，图3D中的介电体结构300D包括至少一个第一介电材料层301所构成的结构体、空间隙区320及第二介电材料所构成的定位部件330，定位部件330可为介电常数值1～10000范围内的第二介电材料且于结构体及接合物350间填充至少一部分空隙，并使结构体与接合物350进行接合。介电体结构300D与接合物350接合后的复合结构在工作频率为f 0且其对应波长为λ 0的射频信号传递状态下，第一介电材料层301的介电常数值的范围是1～10000，介电体结构300D于射频信号通过的表面在接合物表面的投影面的最小等效直径不小于λ 0/8。
请参照图4，其示出根据本发明实施例的接合物401透过定位部件402接合结构体403的接合状态示意图。上述的接合物401可以是例如玻璃、水泥、木材、陶瓷、塑料以及其他介电材料的建筑部件，但是本发明不限于此，接合物可以是任何需要增强射频信号于其上的穿透率的任何部件。
除此之外，由于介电常数会因工作频率而改变，所以具体的材料种类需要视接合物于工作频谱内的介电常数值进行对应调整。以下为可使用的代表性材料且不仅限于这些材料，这些材料包括低介电常数材料：PTFE、PE、PC、PVC、Acrylic、PU、Epoxy、Silicone等；中介电常数材料：石英、玻璃、氧化铝晶体及陶瓷、氮化铝晶体及陶瓷、氧化镁晶体及陶瓷、碳化硅晶体及陶瓷、氧化锆晶体及陶瓷等；高介电常数材料：氧化钛晶体及陶瓷、钛酸钡高分子复合材料等。
请参照图5A及图5B，其以曲线图分别示出3GHz～5GHz电磁波穿透8mm厚且介电常数为6的玻璃时的反射度及透射度。如图所示，在工作频率3.75GHz处的反射度为-2.925dB，穿透度则因反射而降低-3.098dB。
请参照图6A及图6B，其以曲线图分别示出3GHz～5GHz电磁波穿透8mm厚且介电常数为6的玻璃以及其上接合如图2A所示介电体结构时的反射率及透射率。其中，介电体结构的厚度为8.33mm，且其介电常数为6。透过仿真，得到在工作频率3.75GHz条件下，反射度降为-97.44dB，穿透度则为-7.829e-10dB。此结果显示穿透度有显著的提升。
请参照图7A及图7B，其以曲线图分别示出3GHz～5GHz电磁波穿透8mm厚且介电常数为6的玻璃以及其上接合如第3A图所示介电体结构时的反射率及透射率。其中，介电体结构的厚度为6mm，且其介电常数为6，空间隙区的厚度为2.1mm，且其中的介质为空气。透过仿真，得到在工作频率3.75GHz条件下，反射度为-24.04dB，穿透度则为-0.01716dB。此结果显示穿透度有显著的提升。
可以对介电材料所构成的结构分析其在工作频谱的导纳，本案所揭示的介电体结构与建筑部件接合后所产生的复合结构体可以对导纳值进行调整，从而可以提升工作频谱信号于此复合结构体的穿透性。
以上所述仅为举例性，而非为限制性者。任何未脱离本发明的精神与范畴，而对其进行的等效修改或变更，均应包含于所附的权利要求书中。

Claims (8)

  1. 一种介电体结构，应用于建筑部件，以增加射频信号的穿透率，其特征在于，所述介电体结构包含：
    结构体，包含至少一个介电材料层；以及
    定位部件，设置以将所述结构体与接合物进行接合；
    其中所述结构体包含的所述介电材料层的介电常数值介于1～10000之间，所述定位部件将所述介电体结构与所述接合物接合后的复合结构具有一工作频率，所述介电体结构于射频信号通过的表面在所述接合物表面的投影面的最小等效直径不小于与所述工作频率对应之一工作波长的八分之一。
  2. 根据权利要求1所述的介电体结构，其特征在于，所述定位部件进一步包含介电材料层，所述定位部件的所述介电材料层的介电常数值介于1～10000之间。
  3. 根据权利要求2所述的介电体结构，其特征在于，所述定位部件介于所述结构体及所述接合物之间。
  4. 根据权利要求2或3所述的介电体结构，其特征在于，进一步包含空间隙区。
  5. 根据权利要求4所述的介电体结构，其特征在于，所述空间隙区介于所述结构体及所述接合物之间。
  6. 根据权利要求4所述的介电体结构，其特征在于，所述空间隙区设置于所述结构体内部，而不接触所述接合物。
  7. 一种介电体结构设置方法，所述介电体结构应用于建筑部件，以增加射 频信号的穿透率，其特征在于，所述介电体结构设置方法包含：
    以定位部件接合结构体以及接合物；
    其中所述结构体由至少一个介电材料层所构成，所述定位部件于射频信号设定可通过的区域由介电材料层所构成，基于导纳补偿技术，所述结构体与所述定位部件的所述介电材料层的介电常数值介于1～10000之间，所述定位部件将所述介电体结构与所述接合物接合后的复合结构具有一工作频率，所述介电体结构于射频信号通过的表面在所述接合物表面的投影面的最小等效直径不小于与所述工作频率对应之一工作波长的八分之一。
  8. 根据权利要求7所述的介电体结构设置方法，其特征在于，进一步包含在所述介电体结构内设置空间隙区。
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