WO2021093095A1

WO2021093095A1 - Laser processing device

Info

Publication number: WO2021093095A1
Application number: PCT/CN2019/127291
Authority: WO
Inventors: 岳国汉
Original assignee: 深圳市牧激科技有限公司
Priority date: 2019-11-13
Filing date: 2019-12-23
Publication date: 2021-05-20
Also published as: CN211052843U

Abstract

Provided is a laser processing device, comprising a support (100), a chuck (200), and a laser system (300), wherein the support (100) comprises a base (110) and a mounting table (120); and the laser system (300) comprises a laser head (310), a first laser generator (320), a second laser generator (330) and a movable first reflector (340). The first reflector (340) has a first position and a second position, wherein when the first reflector (340) moves to the first position, a first laser (M) emitted by the first laser generator (320) is transmitted to the laser head (310) via a first laser path so that the first laser (M) is emitted; and when the first reflector (340) moves to the second position, a second laser (N) emitted by the second laser generator (330) is transmitted to the laser head (310) via a second laser path so that the second laser (N) is emitted.

Description

Laser processing equipment

Technical field

This application relates to the field of laser processing technology, and in particular to a laser processing equipment.

Background technique

Micro-precision tools, drills, etc. are all processed by turning after grinding. The process is cumbersome, the work efficiency is low, and limited by materials, the processing of PCD (Polycrystalline Diamond, polycrystalline diamond) and other high-hardness and high-quality materials have low efficiency and large consumption of consumables such as grinding wheels.

At present, in the machining and manufacturing industry, laser processing technology is more and more widely used. However, some of the laser equipment used for processing tools on the market can only be used for the processing of specific tools (formed milling cutters, milling heads, drills, milling cutters and other single types of tools), and some tool laser processing equipment can only be used for cutting tools For rough machining, leave a margin after machining and then finish machining by grinding. There is a problem that laser processing equipment has a single processing purpose and low processing efficiency.

The above content is only used to assist the understanding of the technical solutions of this application, and does not mean that the above content is recognized as prior art.

Technical solutions

The main purpose of this application is to propose a laser processing equipment, which aims to solve the problems of single use of laser processing equipment and low processing efficiency.

In order to achieve the above objectives, the laser processing equipment proposed in this application includes a frame, a chuck, and a laser system; the frame includes a base and a mounting table arranged on the base; the chuck is arranged on the frame The laser system is configured to clamp a workpiece; the laser system includes a laser head, a first laser generator, a second laser generator, and a movable first reflector; the laser head is arranged above the chuck and is configured To process the workpiece; the first laser generator is arranged on the top of the mounting table, and the second laser generator is arranged at an angle with the first laser generator;

The first reflector has a first position and a second position, and can move between the first position and the second position; a first laser generator and the laser head are formed between the first position and the second position. A laser path, a second laser path is formed between the second laser generator, the first mirror group, and the laser head;

The first mirror moves to the first position, the first laser path is turned on, and the first laser light emitted by the first laser generator is configured to be conducted to the laser through the first laser path Head to emit the first laser;

The first mirror moves to the second position, the second laser path is turned on, and the second laser light emitted by the second laser generator is configured to be conducted to the laser through the second laser path Head to emit a second laser.

Optionally, the first laser generator is arranged horizontally on the top of the mounting platform, and the second laser generator is arranged vertically; the first reflecting mirror is arranged below the second laser generator, And can move in the horizontal direction.

Optionally, the laser processing equipment further includes a first horizontal movement mechanism arranged on one side of the installation platform, the first reflecting mirror is arranged on the first horizontal movement mechanism, and the first horizontal movement mechanism The first mirror is driven to move in a horizontal direction, and is configured to conduct the first laser path or the second laser path.

Optionally, the first horizontal movement mechanism includes a sliding rail provided on the mounting platform and a sliding block provided on the sliding rail, the first reflecting mirror is fixedly connected to the sliding block, and the sliding The movement of the block along the sliding rail drives the movement of the first mirror.

Optionally, the laser processing equipment further includes a second reflector, a third reflector, a fourth reflector, and a fifth reflector that are sequentially arranged along the first laser path; the second reflector, the The third reflector and the fourth reflector are both located on the top of the mounting platform, and the fifth reflector is located below the fourth reflector and is fixedly connected to the laser head;

The first mirror moves to the second position, the first mirror is located between the first laser generator and the second mirror, or the first mirror is located at the second position Between the reflection mirror and the third reflection mirror, or the first reflection mirror is located between the third reflection mirror and the fourth reflection mirror, and is configured to cut off the first laser path.

Optionally, the laser processing equipment further includes a sheet metal cover that wraps the first reflector, the second reflector, the third reflector, the fourth reflector, and each The laser path between the mirrors.

Optionally, the laser processing equipment further includes a first organ cover that wraps the fifth mirror and the laser path between the fourth mirror and the fifth mirror.

Optionally, the extension direction of the first organ cover is arranged in a vertical direction.

Optionally, the first laser generator is a picosecond laser generator, and the second laser generator is a nanosecond laser generator.

Optionally, the laser head includes a cutting head or a galvanometer.

Optionally, the laser processing equipment further includes a second horizontal movement mechanism and a third horizontal movement mechanism, the second horizontal movement mechanism is arranged on the third horizontal movement mechanism, and the second horizontal movement mechanism The moving direction and the moving direction of the third horizontal moving mechanism are arranged at an included angle; the second horizontal moving mechanism is provided with a first rotating mechanism, and the chuck is arranged on the first rotating mechanism.

Optionally, the movement direction of the second horizontal movement mechanism is perpendicular to the movement direction of the third horizontal movement mechanism.

Optionally, the laser processing equipment further includes a lifting mechanism, the lifting mechanism is arranged on one side of the installation platform, and the laser head is arranged on the lifting mechanism and can move up and down in a vertical direction.

Optionally, a second organ cover is provided on the second horizontal movement mechanism, and the extension direction of the second organ cover is consistent with the movement direction of the second horizontal movement mechanism.

Optionally, the third horizontal movement mechanism is covered with a third organ cover and a fourth organ cover arranged on the third organ cover, and the second horizontal movement mechanism is located on the third organ cover Above, the fourth organ cover is flush with the second horizontal movement mechanism, and the width dimension of the fourth organ cover is equal to the length dimension of the second horizontal movement mechanism. The end is fixedly connected with the second horizontal moving mechanism; the extension direction of the third organ cover and the extension direction of the fourth organ cover are both consistent with the moving direction of the third horizontal moving mechanism.

Optionally, the first rotation mechanism has a turntable, and the rotation axis of the turntable is consistent with the movement direction of the second horizontal movement mechanism; the laser processing equipment further includes a second rotation mechanism, the second rotation mechanism It is provided on the turntable, and the extension direction of the rotation axis of the second rotating mechanism is arranged at an angle with the extension direction of the rotation axis of the turntable, and the chuck is provided on the second rotating mechanism.

Optionally, the laser processing equipment further includes an image detection system provided on the installation platform, and the image detection system includes a vertical movement mechanism arranged in parallel with the lifting mechanism and a vertical movement mechanism arranged on the vertical movement mechanism. The probe and the image sensor, the vertical movement mechanism drives the probe and the image sensor to move up and down.

Optionally, the image sensor is a CCD visual positioning structure.

Optionally, the laser processing equipment further includes a dust extraction device provided on the side plate, and the dust extraction device includes a dust extraction channel and a dust extraction port, and the dust extraction port is in communication with the dust extraction channel.

Optionally, the dust extraction device further includes an electric cylinder, and the electric cylinder drives the dust extraction port to move along the movement direction of the second horizontal movement mechanism.

Description of the drawings

In order to more clearly describe the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present application. For those of ordinary skill in the art, without creative work, other drawings can be obtained based on the structure shown in these drawings.

Fig. 1 is a schematic structural diagram of an embodiment of a laser processing equipment according to the present application;

2 is a schematic structural diagram of another embodiment of a laser processing equipment according to the present application;

3 is a schematic diagram of the assembly of the first laser generator, the second laser generator, and the first mirror in the embodiment of the application;

4 is a schematic diagram of the structure of a laser path in an embodiment of the application;

5 is a schematic diagram of the assembly of the lifting mechanism and the laser head in the embodiment of the application;

Fig. 6 is a schematic structural diagram of a dust extraction device in an embodiment of the application.

Attached icon number description:

标号 Label	名称 name	标号 Label	名称 name
100 100	机架 frame	110 110	底座 Base
120 120	安装台 Installation table	200 200	夹头 Chuck
300 300	激光系统 Laser system	310 310	激光头 Laser head
320 320	第一激光发生器 First laser generator	330 330	第二激光发生器 Second laser generator
340 340	第一反射镜 First mirror	350 350	第一水平移动机构 The first horizontal movement mechanism
351 351	滑轨 Slide	352 352	滑块 Slider
360 360	第二反射镜 Second mirror	370 370	第三反射镜 Third mirror
380 380	第四反射镜 Fourth mirror	390 390	第五反射镜 Fifth mirror
410 410	钣金罩 Sheet metal cover	420 420	第一风琴罩 First organ cover
500 500	第二水平移动机构 Second horizontal movement mechanism	510 510	第二风琴罩 Second organ cover
600 600	第三水平移动机构 Third horizontal movement mechanism	610 610	第三风琴罩 Third organ cover
620 620	第四风琴罩 Fourth organ cover	700 700	升降机构 Lifting mechanism
800 800	第一旋转机构 First rotating mechanism	810 810	转盘 Turntable
900 900	第二转盘机构 Second turntable	A00 A00	抽尘装置 Dust extraction device
A10 A10	抽尘通道 Dust extraction channel	A20 A20	抽尘口 Dust extraction port
A30 A30	电缸 Electric cylinder	M M	第一激光 First laser
N N	第二激光 Second laser	B00 B00	图像探测系统 Image detection system
B01 B01	竖直移动机构 Vertical movement mechanism	B02 B02	探针 Probe
B03 B03	图像传感器 Image Sensor	To	To

The realization, functional characteristics, and advantages of the purpose of this application will be further described in conjunction with the embodiments and with reference to the accompanying drawings.

Embodiments of the present invention

The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by a person of ordinary skill in the art without creative work shall fall within the protection scope of this application.

It should be noted that if there are directional indications (such as up, down, left, right, front, back...) in the embodiments of this application, the directional indications are only used to explain in a specific posture (as shown in the drawings). Show) the relative positional relationship, movement, etc. between the components below. If the specific posture changes, the directional indication will also change accordingly.

In addition, if there are descriptions related to "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes, and cannot be understood as instructions or implications Its relative importance or implicitly indicates the number of technical features indicated. Therefore, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on what can be achieved by a person of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be achieved, it should be considered that such a combination of technical solutions does not exist. , Is not within the scope of protection required by this application.

This application proposes a laser processing equipment.

In the embodiment of the present application, as shown in FIG. 1 and FIG. 2, the laser processing equipment includes a frame 100, a chuck 200, and a laser system 300; the frame 100 includes a base 110 and an installation table 120 set on the base 110; The chuck 200 is set on the frame 100 for clamping the workpiece; the laser system 300 includes a laser head 310, a first laser generator 320, a second laser generator 330, and a movable first mirror 340; the laser head 310 It is arranged above the chuck 200 to process the workpiece; the first laser generator 320 is arranged on the top of the mounting table 120, and the second laser generator 330 and the first laser generator 320 are arranged at an angle; the first mirror 340 has a first position and a second position, and can move between the first position and the second position; a first laser path is formed between the first laser generator 320 and the laser head 310, the second laser generator 330, the second laser A second laser path is formed between a mirror 340 and the laser head 310; when the first mirror 340 moves to the first position, the first laser path is turned on, so that the first laser light emitted by the first laser generator 320 The first laser path is conducted to the laser head 310 to emit the first laser light M; when the first mirror 340 moves to the second position, the second laser path is turned on, so that the second laser light emitted by the second laser generator 330 The laser light is transmitted to the laser head 310 through the second laser path to emit the second laser light N.

The laser system 300 is mainly used to generate laser light and emit the laser light through the laser head 310 to process the workpiece. The first laser generator 320 is used to generate the first laser light M, and the second laser generator 320 is used to generate the second laser light N. The first laser light M and the second laser light N are different types of laser light. different. The first mirror 340 can move between the first position and the second position to switch the type of laser light reaching the laser head 310:

When the first mirror 340 moves to the first position, the first laser path is turned on at this time, and the first laser light M generated by the first laser generator 320 can be transmitted to the laser head 310 to emit the first laser light M to the workpiece. Machining to realize the function that the workpiece needs to be processed by the first laser M;

When the first reflector 340 moves to the second position, the first reflector 340 is on the second laser path, blocking the first laser path, and can block the second laser light emitted by the second laser generator 330. It is transmitted to the laser head 310 to emit the second laser N to process the workpiece, so as to realize the function of the workpiece requiring the second laser N to be processed.

It is understandable that when the workpiece requires both the first laser M processing and the second laser N processing, there is no need to replace the processing equipment, and only the first mirror 340 can be moved to achieve two types of laser processing to achieve the processing needs of the workpiece. , Improve the processing efficiency.

In the actual application process, the specific positions of the first laser generator 320 and the second laser generator 330 can be determined according to the actual situation, as long as the movement of the first mirror 340 can be realized between the first laser light M and the second laser light N Switch. In an embodiment of the present application, the first laser generator 320 is arranged on the top of the mounting table 120, and the second laser generator 330 and the first laser generator 320 are arranged at an angle. The first laser generator 320 may use a picosecond laser generator, and the second laser generator 330 may use a nanosecond laser generator to realize the switching of finishing or roughing.

In the actual application process, the specific structure of the laser head 310 can also be selected according to the actual situation. For example, when rough processing is required, the laser head 310 can be a cutting head; when finishing processing is required, the laser head 310 can be a galvanometer. .

In the technical solution of the present application, the installation platform 120 is set on the rack 100, and the first laser generator 320 is installed on the top of the installation platform 120. The second laser generator 330 and the first laser generator 320 are arranged at an angle. A first laser path is formed between the laser generator 320 and the laser head 310. The second laser generator 330, the first mirror 340, and the laser head 310 form a second laser path. When the first mirror 340 moves at different positions, the first laser path is One laser path is turned on or the second laser path is turned on, so that through the movement of the first mirror 340, the switching function of the first laser or the second laser is realized, so that a laser device can emit different lasers to process the workpiece Therefore, it is possible to achieve different processing precisions without changing processing equipment, thereby improving processing efficiency.

In an embodiment of the present application, the first laser generator 320 is arranged horizontally on the top of the mounting table 120, and the second laser generator 330 is arranged vertically; the first mirror 340 is arranged below the second laser generator 330, and Can be moved in the horizontal direction. At this time, the movement direction of the first mirror 340 is consistent with the extension direction of the first laser generator 320. When the first mirror 340 is in the first position, it is in a position that does not intersect the vertical projection of the second laser generator 330. The first laser path is turned on, but the second laser path is not turned on; when the first mirror 340 is in the second position, the vertical projections of the first mirror 340 and the second laser generator 330 are overlapped to make the vertical The downward second laser reflects the second laser in the horizontal direction to realize the conduction of the second laser path, and at the same time, the first laser path is not conducted, so as to realize the switching of the two lasers.

Further, the laser processing equipment further includes a first horizontal moving mechanism 350 arranged on the side of the mounting table 120, the first reflecting mirror 340 is arranged on the first horizontal moving mechanism 350, and the first horizontal moving mechanism 350 drives the first reflecting mirror 340. Move in the horizontal direction to turn on the first laser path or the second laser path. The movement of the first mirror 340 is mainly driven by the first horizontal moving mechanism 350. The specific structure of the first horizontal moving mechanism 350 can be determined according to the actual situation. For example, a screw-slider combined drive or a slide rail-slider can be used. Combination drive or cylinder drive, etc. In the embodiment of the present application, considering factors such as cost and compact structure, it is preferable to adopt a slide rail-slider combination, the slide rail 351 is set on the mounting table 120, the slide block 352 is set on the slide rail 351, and the first reflector 340 It is fixedly connected with the sliding block 352, so that when the sliding block 352 moves along the sliding rail 351, the first reflecting mirror 340 can be driven to move. The sliding rail 351 plays a guiding role, so that the first reflector 340 is more stable during the movement.

Further, the laser processing equipment further includes a second reflector 360, a third reflector 370, a fourth reflector 380, and a fifth reflector 390 arranged in sequence along the first laser path; the second reflector 360, the third reflector 370 and the fourth reflector 380 are both located on the top of the mounting table 120, and the fifth reflector 390 is located below the fourth reflector 380 and is fixedly connected to the laser head 310;

When the first mirror 340 moves to the second position, the first mirror 340 is located between the first laser generator 320 and the second mirror 360, or the first mirror 340 is located between the second mirror 360 and the third mirror 360 370, or the first mirror 340 is located between the third mirror 370 and the fourth mirror 380 to cut off the first laser path.

The first laser light emitted by the first laser generator 320 is sequentially reflected by the second mirror 360, the third mirror 370, the fourth mirror 380, and the fifth mirror 390 to reach the laser head 310 to form a first laser path. The second reflecting mirror 360 is arranged at a position corresponding to the emission port of the first laser generator 320, so that the second reflecting mirror 360 smoothly reflects the laser to the third reflecting mirror 370, and the third reflecting mirror 370 reflects the laser to the fourth At the reflector 380, the fourth reflector 380 reflects the laser vertically downwards to the fifth reflector 390 fixedly connected to the laser head 310, and then the fifth reflector 390 reflects the laser in the vertical direction. The laser enters the laser head 310.

It is understandable that the specific position of the first reflecting mirror 340 can be determined according to actual conditions. When the first reflecting mirror 340 is located at the second position, the first laser path is not conductive. Therefore, the first reflecting mirror 340 It may be arranged between the first laser generator 320 and the second reflecting mirror 360, or between the second reflecting mirror 360 and the third reflecting mirror 370, or between the third reflecting mirror 370 and the fourth reflecting mirror 380.

Further, the laser processing equipment further includes a sheet metal cover 410 and a first organ cover 420. The sheet metal cover 410 wraps the first reflector 340, the second reflector 360, the third reflector 370, the fourth reflector 380, and the respective reflectors. The laser path between the mirrors; the first organ cover 420 wraps the fifth reflector 390 and the laser path between the fourth reflector 380 and the fifth reflector 390, and the extension direction of the first organ cover 420 is arranged in a vertical direction. The sheet metal cover 410 and the first organ cover 420 play a role of protecting each mirror and the laser path from dust. The extension direction of the first organ cover 420 is arranged in a vertical direction, so that when the fifth reflector 390 moves up and down along with the laser head 310, the first organ cover 420 can be adjusted along with the up and down movement of the laser head 310.

Further, the laser processing equipment further includes a second horizontal movement mechanism 500, a third horizontal movement mechanism 600, and a lifting mechanism 700. The second horizontal movement mechanism 500 is arranged on the third horizontal movement mechanism 600, and the second horizontal movement mechanism 500 The moving direction is set at an angle with the moving direction of the third horizontal moving mechanism 600; the second horizontal moving mechanism 500 is provided with a first rotating mechanism 800, the chuck 200 is set on the first rotating mechanism 800; the lifting mechanism 700 is set on the mounting platform On one side of 120, the laser head 310 is arranged on the lifting mechanism 700 and can move up and down in the vertical direction.

The second horizontal movement mechanism 500 and the third horizontal movement mechanism 600 correspond to the X axis and the Y axis on the horizontal plane, the lifting mechanism 700 corresponds to the Z axis on the vertical plane, and the first rotation mechanism 800 is arranged on the second horizontal movement mechanism 500, The first rotating mechanism 800 can move in the X-axis and Y-axis directions, and can drive the chuck 200 to rotate, so that the workpiece can be adjusted in position on the horizontal plane.

The laser head 310 is provided in the lifting mechanism 700, and the lifting mechanism 700 can drive the laser head 310 to move up and down when performing a lifting movement in the Z-axis direction, so as to process the workpiece on the chuck 200.

Further, the second horizontal moving mechanism 500 is covered with a second organ cover 510, and the extension direction of the second organ cover 510 is consistent with the moving direction of the second horizontal moving mechanism 500; the third horizontal moving mechanism 600 is covered with a second organ cover 510. The three organ cover 610 and the fourth organ cover 620 arranged on the third organ cover 610, the second horizontal movement mechanism 500 is located above the third organ cover 610, and the fourth organ cover 620 is flush with the second horizontal movement mechanism 500 , And the width dimension of the fourth organ cover 620 is equal to the length dimension of the second horizontal movement mechanism 500, the end of the fourth organ cover 620 is fixedly connected to the second horizontal movement mechanism 500; the extension direction of the third organ cover 610 is The extension direction of the quartet cover 620 is consistent with the moving direction of the third horizontal moving mechanism 600.

The second organ cover 510 is arranged on the second horizontal movement mechanism 500 to protect the second horizontal movement mechanism 500 to ensure the cleanliness of the movement shaft in the second horizontal movement mechanism 500; the third organ cover 610 is arranged on The third horizontal movement mechanism 600 is used to protect the third horizontal movement mechanism 600 to ensure the cleanliness of the movement axis in the third horizontal movement mechanism 600, and a fourth organ cover 610 is also provided outside the third organ cover 610. An organ cover 620, the fourth organ cover 620 is flush with the second horizontal moving mechanism 500, and the width dimension of the fourth organ cover 620 is equal to the length dimension of the second horizontal moving mechanism 500, so that the fourth organ cover 620 can be larger The scope is protected to the horizontal movement system. At the same time, the end of the fourth organ cover 620 is fixedly connected to the second horizontal moving mechanism 500, so that the second organ cover 510 combined with the fourth organ cover 620 can seal the entire processing platform, achieving a better The effect of sealing and cleaning is good.

Further, the first rotation mechanism 800 has a turntable 810, and the rotation axis of the turntable 810 is consistent with the movement direction of the second horizontal movement mechanism 500; the laser processing equipment further includes a second rotation mechanism 900, and the second rotation mechanism 900 is provided on the turntable 810, The extension direction of the rotation axis of the second rotating mechanism 900 is set at an angle with the extension direction of the rotation axis of the turntable 810. The chuck 200 is provided in the second rotating mechanism 900; the first rotating mechanism 800 drives the second rotating mechanism 900 to rotate, and the first rotating mechanism 800 drives the second rotating mechanism 900 to rotate. The second rotating mechanism 900 drives the chuck 200 to rotate, so that the positioning range of the chuck 200 is wider, and the processing of the laser head 310 is more convenient.

Further, the laser processing equipment also includes an image detection system B00 arranged on the installation table 120, and the image detection system B00 includes a vertical movement mechanism B01 arranged in parallel with the lifting mechanism 700, a probe B02 arranged on the vertical movement mechanism, and an image The sensor B03 and the vertical moving mechanism B01 drive the probe B02 and the image sensor B03 to move up and down. In the actual application process, the image sensor B03 adopts a CCD visual positioning structure. The probe B02 and the CCD visual positioning structure follow the vertical movement mechanism B01 to move up and down. It has automatic positioning and automatic detection functions to improve processing efficiency and processing accuracy.

Further, the laser processing equipment further includes a dust extraction device A00 arranged on the installation table 120. The dust extraction device A00 includes a dust extraction channel A10, a dust extraction port A20, and an electric cylinder A30, and the dust extraction port A20 is in communication with the dust extraction channel A10, The electric cylinder A30 drives the dust extraction port A20 to move along the moving direction of the second horizontal moving mechanism 500. During processing, the dust extraction port A20 can be moved to the corresponding processing position through the electric cylinder A30 according to the size of the processing tool, which effectively increases the dust collection effect, ensures the cleanliness of the machine, and prolongs the service life of the machine.

The above are only the preferred embodiments of the application, and do not limit the scope of the patents of the application. All the equivalent structural transformations or direct/indirect applications made by using the contents of the specification and drawings of the application under the inventive concept of the application Other related technical fields are included in the scope of patent protection of this application.

Claims

A laser processing equipment, which includes:

A rack, the rack including a base and an installation table set on the base;

A chuck, the chuck is arranged on the frame and configured to clamp a workpiece; and

A laser system, the laser system includes a laser head, a first laser generator, a second laser generator, and a movable first reflector; the laser head is arranged above the chuck and is configured to process a workpiece The first laser generator is arranged on the top of the installation platform, and the second laser generator is arranged at an angle with the first laser generator;

The first reflector has a first position and a second position, and can move between the first position and the second position; a first laser generator and the laser head are formed between the first position and the second position. A laser path, a second laser path is formed between the second laser generator, the first mirror group, and the laser head;

The first mirror moves to the first position, the first laser path is turned on, and the first laser light emitted by the first laser generator is configured to be conducted to the laser through the first laser path Head to emit the first laser;

The first mirror moves to the second position, the second laser path is turned on, and the second laser light emitted by the second laser generator is configured to be conducted to the laser through the second laser path Head to emit a second laser.
The laser processing equipment according to claim 1, wherein the first laser generator is arranged horizontally on the top of the mounting table, the second laser generator is arranged vertically; and the first reflector is arranged on the top of the mounting platform. The second laser generator can be moved in the horizontal direction.
The laser processing equipment according to claim 2, wherein the laser processing equipment further comprises a first horizontal moving mechanism provided on one side of the mounting table, and the first reflecting mirror is provided on the first horizontal moving mechanism Above, the first horizontal moving mechanism drives the first mirror to move in a horizontal direction, and is configured to conduct the first laser path or the second laser path.
The laser processing equipment according to claim 3, wherein the first horizontal movement mechanism includes a slide rail provided on the mounting table and a slider provided on the slide rail, and the first reflector is connected to the slide rail. The sliding block is fixedly connected, and the sliding block moves along the sliding rail to drive the first reflector to move.
3. The laser processing device according to claim 1, wherein the laser processing device further comprises a second mirror, a third mirror, a fourth mirror, and a fifth mirror that are sequentially arranged along the first laser path; The second reflector, the third reflector, and the fourth reflector are all located on the top of the mounting platform, and the fifth reflector is located below the fourth reflector and interacts with the laser Head fixed connection;

The first mirror moves to the second position, the first mirror is located between the first laser generator and the second mirror, or the first mirror is located at the second position Between the reflection mirror and the third reflection mirror, or the first reflection mirror is located between the third reflection mirror and the fourth reflection mirror, and is configured to cut off the first laser path.
The laser processing equipment according to claim 5, wherein the laser processing equipment further comprises a sheet metal cover that wraps the first mirror, the second mirror, and the third mirror , The fourth mirror and the laser path between the respective mirrors.
The laser processing equipment according to claim 5, wherein the laser processing equipment further comprises a first organ cover, and the first organ cover wraps the fifth mirror and the fourth mirror and the fifth The laser path between the mirrors.
8. The laser processing equipment according to claim 7, wherein the extension direction of the first organ cover is arranged in a vertical direction.
8. The laser processing equipment according to any one of claims 1 to 8, wherein the first laser generator is a picosecond laser generator, and the second laser generator is a nanosecond laser generator.
The laser processing equipment according to any one of claims 1 to 8, wherein the laser head includes a cutting head or a galvanometer.
The laser processing equipment according to any one of claims 1 to 8, wherein the laser processing equipment further comprises a second horizontal movement mechanism and a third horizontal movement mechanism, and the second horizontal movement mechanism is arranged on the third horizontal movement mechanism. On the horizontal moving mechanism, and the moving direction of the second horizontal moving mechanism and the moving direction of the third horizontal moving mechanism are arranged at an angle; the second horizontal moving mechanism is provided with a first rotating mechanism, the clamp The head is arranged on the first rotating mechanism.
11. The laser processing apparatus according to claim 11, wherein the movement direction of the second horizontal movement mechanism is perpendicular to the movement direction of the third horizontal movement mechanism.
The laser processing equipment according to claim 11, wherein a second organ cover is provided on the second horizontal movement mechanism, and the extension direction of the second organ cover is consistent with the movement direction of the second horizontal movement mechanism .
The laser processing equipment according to claim 13, wherein the third horizontal movement mechanism is covered with a third organ cover and a fourth organ cover arranged on the third organ cover, and the second horizontal The moving mechanism is located above the third organ cover, the fourth organ cover is flush with the second horizontal moving mechanism, and the width of the fourth organ cover is the same as the length of the second horizontal moving mechanism Equal, the end of the fourth organ cover is fixedly connected to the second horizontal moving mechanism; the extension direction of the third organ cover and the extension direction of the fourth organ cover are both the same as those of the third horizontal moving mechanism The moving direction is the same.
The laser processing equipment according to claim 11, wherein the first rotation mechanism has a turntable, and the rotation axis of the turntable is consistent with the movement direction of the second horizontal movement mechanism; the laser processing equipment further includes a second A rotating mechanism, the second rotating mechanism is arranged on the turntable, the extension direction of the rotation axis of the second rotating mechanism and the extension direction of the rotating axis of the turntable are arranged at an included angle, and the chuck is arranged on the The second rotating mechanism.
The laser processing equipment according to any one of claims 1 to 8, wherein the laser processing equipment further comprises a lifting mechanism, the lifting mechanism is arranged on one side of the mounting table, and the laser head is arranged on the Lifting mechanism, and can move up and down in the vertical direction.
The laser processing equipment according to claim 16, wherein the laser processing equipment further comprises an image detection system provided on the mounting table, the image detection system comprising a vertical movement mechanism and a vertical movement mechanism arranged in parallel with the lifting mechanism. The probe and the image sensor are arranged on the vertical moving mechanism, and the vertical moving mechanism drives the probe and the image sensor to move up and down.
17. The laser processing equipment according to claim 17, wherein the image sensor is a CCD visual positioning structure.
The laser processing equipment according to claim 11, wherein the laser processing equipment further comprises a dust extraction device provided on the side plate, the dust extraction device comprising a dust extraction channel and a dust extraction port, and the dust extraction device The port is in communication with the dust extraction channel.
The laser processing equipment according to claim 19, wherein the dust extraction device further comprises an electric cylinder, and the electric cylinder drives the dust extraction port to move along the movement direction of the second horizontal moving mechanism.