WO2021092711A1 - 一种电磁屏蔽复合材料及其制备方法 - Google Patents

一种电磁屏蔽复合材料及其制备方法 Download PDF

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Publication number
WO2021092711A1
WO2021092711A1 PCT/CN2019/116953 CN2019116953W WO2021092711A1 WO 2021092711 A1 WO2021092711 A1 WO 2021092711A1 CN 2019116953 W CN2019116953 W CN 2019116953W WO 2021092711 A1 WO2021092711 A1 WO 2021092711A1
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foil layer
metal foil
layer
electromagnetic shielding
composite material
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PCT/CN2019/116953
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English (en)
French (fr)
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陈红辉
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常德鑫睿新材料有限公司
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Priority to PCT/CN2019/116953 priority Critical patent/WO2021092711A1/zh
Publication of WO2021092711A1 publication Critical patent/WO2021092711A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/48—Ion implantation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the invention relates to the technical field of electromagnetic shielding, in particular to an electromagnetic shielding composite material and a preparation method thereof.
  • Electromagnetic shielding is the main technology to suppress electromagnetic interference.
  • the competition in the shielding material market is becoming increasingly fierce.
  • shielding composite materials have received increasing attention from researchers.
  • Many countries have invested a lot of manpower and material resources to conduct in-depth research on electromagnetic shielding materials.
  • the technical problem to be solved by the present invention is to provide an electromagnetic shielding composite material, which has better shielding effectiveness at low frequencies and expands the application range of electromagnetic shielding materials.
  • An electromagnetic shielding composite material comprising a first metal foil layer and a second metal foil layer arranged at intervals, and an amorphous alloy layer arranged between the first metal foil layer and the second metal foil layer, wherein the The first metal foil layer and the second metal foil layer are silver-clad copper layers with a thickness of 1-5 ⁇ m, and the amorphous alloy layer is an iron-based FeSiB amorphous tape layer with a thickness of 50-100 ⁇ m.
  • the thickness of the first metal foil layer and the second metal foil layer are 3-5 ⁇ m, respectively.
  • the thickness of the amorphous alloy layer is 80-100 ⁇ m.
  • the first metal foil layer and the second metal foil layer include a copper foil layer and a silver foil layer wrapped around the copper foil layer, wherein the thickness of the copper foil layer is 0.8-4.5 ⁇ m, and the thickness of the silver foil layer is 0.1-0.3 ⁇ m.
  • the invention also provides a preparation method of the electromagnetic shielding composite material.
  • a preparation method of electromagnetic shielding composite material includes the following steps:
  • Step S1 providing a first metal foil layer and a second metal foil layer
  • Step S2 fixing the first metal foil layer and the second metal foil layer as required, so that the distance between the two meets the design requirements of the thickness of the amorphous alloy layer;
  • Step S3 using a plasma spraying process to spray an amorphous alloy material between the first metal foil layer and the second metal foil layer to form an amorphous alloy layer.
  • the electromagnetic shielding composite material of the present invention adopts a sandwich sandwich design, the center layer adopts iron-based FeSiB amorphous tape, and the outer two layers adopt silver-clad copper materials, which have the advantages of strong conductivity, good flame retardancy, and good shielding effect.
  • the shielding effectiveness reaches 50dB, which expands the application range of electromagnetic shielding materials.
  • An electromagnetic shielding composite material comprising a first metal foil layer and a second metal foil arranged at intervals, and an amorphous alloy layer arranged between the first metal foil layer and the second metal foil layer, wherein the first metal foil layer And the second metal foil layer is a silver-clad copper layer with a thickness of 1-5 ⁇ m, and the amorphous alloy layer is an iron-based FeSiB amorphous ribbon layer with a thickness of 50-100 ⁇ m.
  • the thickness of the first metal foil layer and the second metal foil layer are 3-5 ⁇ m, respectively.
  • the thickness of the amorphous alloy layer is 80-100 ⁇ m.
  • the first metal foil layer and the second metal foil layer include a copper foil layer and a silver foil layer wrapped around the copper foil layer, wherein the thickness of the copper foil layer is 0.8-4.5 ⁇ m, and the thickness of the silver foil layer is 0.1-0.3 ⁇ m.
  • the preparation method of the electromagnetic shielding composite material provided by the present invention includes the following steps:
  • Step S1 providing a first metal foil layer and a second metal foil layer
  • Step S2 fixing the first metal foil layer and the second metal foil layer as required, so that the distance between the two meets the design requirements of the thickness of the amorphous alloy layer;
  • Step S3 using a plasma spraying process to spray an amorphous alloy material between the first metal foil layer and the second metal foil layer to form an amorphous alloy layer.
  • the electromagnetic shielding composite material of the present invention adopts a sandwich type sandwich design, the center layer adopts iron-based FeSiB amorphous tape, and the outer two layers adopt silver-clad copper materials, which have the advantages of strong conductivity, good flame retardancy, and good shielding effect.
  • the shielding effectiveness reaches 50dB, which expands the application range of electromagnetic shielding materials.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

公开了一种电磁屏蔽复合材料，包括间隔设置的第一金属箔层和第二金属箔，以及设于所述第一金属箔层和第二金属箔层之间的非晶合金层，其中所述第一金属箔层和第二金属箔层为银包铜层，其厚度为1-5μm，所述非晶合金层为铁基FeSiB非晶带材层，其厚度为50-100μm。提供的电磁屏蔽复合材料，在低频时具有较好的屏蔽效能，扩展了电磁屏蔽材料的应用范围。还提供一种电磁屏蔽复合材料的制备方法。

Description

一种电磁屏蔽复合材料及其制备方法 技术领域
本发明涉及电磁屏蔽技术领域，特别涉及一种电磁屏蔽复合材料及其制备方法。
背景技术
电磁屏蔽是抑制电磁干扰的主要技术，屏蔽材料市场竞争日趋激烈，屏蔽复合材料作为一种新型屏蔽材料，日益收到研究者们的高度重视。各国均投入了大量的人力和物力对电磁屏蔽材料进行深入研究。
目前的复合材料大多侧重于高频段电磁波的屏蔽，虽然获得了较好的屏蔽效果，但应用在低频时，屏蔽效果较差，不能达到环境要求的屏蔽效能。
鉴于此，有必要提供一种低频电磁屏蔽材料解决上述技术问题。
发明内容
本发明要解决的技术问题是提供一种电磁屏蔽复合材料，其在低频时具有较好的屏蔽效能，扩展了电磁屏蔽材料的应用范围。
为了解决上述问题，本发明的技术方案如下：
一种电磁屏蔽复合材料，包括间隔设置的第一金属箔层和第二金属箔层，以及设于所述第一金属箔层和第二金属箔层之间的非晶合金层，其中所述第一金属箔层和第二金属箔层为银包铜层，其厚度为1-5μm，所述非晶合金层为铁基FeSiB非晶带材层，其厚度为50-100μm。
优选地，所述第一金属箔层和第二金属箔层的厚度分别为3-5μm。
优选地，所述非晶合金层的厚度为80-100μm。
优选地，所述第一金属箔层和第二金属箔层包括铜箔层和包裹于铜箔层外的银箔层，其中铜箔层的厚度为0.8-4.5μm，银箔层的厚度为0.1-0.3μm。
本发明还提供一种电磁屏蔽复合材料的制备方法。
一种电磁屏蔽复合材料的制备方法，包括如下步骤：
步骤S1，提供第一金属箔层和第二金属箔层；
步骤S2，按要求将第一金属箔层和第二金属箔层固定，使两者的间距满足非晶合金层厚度的设计要求；
步骤S3，采用等离子喷涂工艺在第一金属箔层和第二金属箔层之间喷涂非晶合金材料，形成非晶合金层。
本发明提供的电磁屏蔽复合材料及其制备方法，有益效果在于：
本发明的电磁屏蔽复合材料采用三明治型夹层设计，中心层采用铁基FeSiB非晶带材，外侧的两层采用银包铜材料，具有导电性能强、阻燃性能好、屏蔽效果好等优点。对于1-100MHz频率范围内的电磁波，其屏蔽效能达50dB，扩展了电磁屏蔽材料的应用范围。
具体实施方式
为了使本技术领域的人员更好地理解本发明实施例中的技术方案，并使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图对本发明的具体实施方式作进一步的说明。
在此需要说明的是，对于这些实施方式的说明用于帮助理解本发明，但并不构成对本发明的限定。此外，下面所描述的本发明各个实施方式中所涉及的技术特征只要彼此之间未构成冲突就可以相互结合。
一种电磁屏蔽复合材料，包括间隔设置的第一金属箔层和第二金属箔，以及设于第一金属箔层和第二金属箔层之间的非晶合金层，其中第一金属箔层和第二金属箔层为银包铜层，其厚度为1-5μm，非晶合金层为铁基FeSiB非晶带材层，其厚度为50-100μm。
优选地，所述第一金属箔层和第二金属箔层的厚度分别为3-5μm。
优选地，所述非晶合金层的厚度为80-100μm。
优选地，所述第一金属箔层和第二金属箔层包括铜箔层和包裹于铜箔层外的银箔层，其中铜箔层的厚度为0.8-4.5μm，银箔层的厚度为0.1-0.3μm。
本发明提供的电磁屏蔽复合材料的制备方法，包括如下步骤：
步骤S1，提供第一金属箔层和第二金属箔层；
步骤S2，按要求将第一金属箔层和第二金属箔层固定，使两者的间距满足非晶合金层厚度的设计要求；
步骤S3，采用等离子喷涂工艺在第一金属箔层和第二金属箔层之间喷涂非晶合金材料，形成非晶合金层。
本发明的电磁屏蔽复合材料采用三明治型夹层设计，中心层采用铁基FeSiB非晶带材，外侧的两层采用银包铜材料，具有导电性能强、阻燃性能好、屏蔽效果好等优点。对于1-100MHz频率范围内的电磁波，其屏蔽效能达50dB，扩展了电磁屏蔽材料的应用范围。
本说明书中的各个实施例均采用递进的方式描述，各个实施例之间相同相似的部分互相参见即可，每个实施例重点说明的都是与其它实施例的不同之处。
以上结合附图对本发明的实施方式作出详细说明，但本发明不局限于所描述的实施方式。对本领域的技术人员而言，在不脱离本发明的原理和精神的情况下对这些实施例进行的多种变化、修改、替换和变型均仍落入在本发明的保护范围之内。

Claims (5)

  1. 一种电磁屏蔽复合材料，其特征在于，包括间隔设置的第一金属箔层和第二金属箔层，以及设于所述第一金属箔层和第二金属箔层之间的非晶合金层，其中所述第一金属箔层和第二金属箔层为银包铜层，其厚度为1-5μm，所述非晶合金层为铁基FeSiB非晶带材层，其厚度为50-100μm。
  2. 根据权利要求1所述的电磁屏蔽复合材料，其特征在于，所述第一金属箔层和第二金属箔层的厚度分别为3-5μm。
  3. 根据权利要求1所述的电磁屏蔽复合材料，其特征在于，所述非晶合金层的厚度为80-100μm。
  4. 根据权利要求1所述的电磁屏蔽复合材料，其特征在于，所述第一金属箔层和第二金属箔层包括铜箔层和包裹于铜箔层外的银箔层，其中铜箔层的厚度为0.8-4.5μm，银箔层的厚度为0.1-0.3μm。
  5. 一种如权利要求1所述的电磁屏蔽复合材料的制备方法，其特征在于，包括如下步骤：
    步骤S1，提供第一金属箔层和第二金属箔层；
    步骤S2，按要求将第一金属箔层和第二金属箔层固定，使两者的间距满足非晶合金层厚度的设计要求；
    步骤S3，采用等离子喷涂工艺在第一金属箔层和第二金属箔层之间喷涂非晶合金材料，形成非晶合金层。
PCT/CN2019/116953 2019-11-11 2019-11-11 一种电磁屏蔽复合材料及其制备方法 WO2021092711A1 (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4474676A (en) * 1983-02-28 1984-10-02 Tdk Corporation Electromagnetic interference shielding material
CN101441915A (zh) * 2008-09-17 2009-05-27 安泰科技股份有限公司 一种非晶软磁合金涂层及其制备方法
CN102286254A (zh) * 2011-05-06 2011-12-21 广州方邦电子有限公司 具有导通孔的高剥离强度的导电胶膜及其制备方法
CN105714293A (zh) * 2014-12-04 2016-06-29 安泰科技股份有限公司 一种兼具高导磁和高导电的复合材料及其制备方法
CN207105789U (zh) * 2017-03-06 2018-03-16 苏州驭奇材料科技有限公司 一种具有电磁波吸收特性的覆铜板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4474676A (en) * 1983-02-28 1984-10-02 Tdk Corporation Electromagnetic interference shielding material
CN101441915A (zh) * 2008-09-17 2009-05-27 安泰科技股份有限公司 一种非晶软磁合金涂层及其制备方法
CN102286254A (zh) * 2011-05-06 2011-12-21 广州方邦电子有限公司 具有导通孔的高剥离强度的导电胶膜及其制备方法
CN105714293A (zh) * 2014-12-04 2016-06-29 安泰科技股份有限公司 一种兼具高导磁和高导电的复合材料及其制备方法
CN207105789U (zh) * 2017-03-06 2018-03-16 苏州驭奇材料科技有限公司 一种具有电磁波吸收特性的覆铜板

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