WO2021092710A1 - 一种金属系电磁屏蔽复合材料及其制备方法 - Google Patents
一种金属系电磁屏蔽复合材料及其制备方法 Download PDFInfo
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- WO2021092710A1 WO2021092710A1 PCT/CN2019/116948 CN2019116948W WO2021092710A1 WO 2021092710 A1 WO2021092710 A1 WO 2021092710A1 CN 2019116948 W CN2019116948 W CN 2019116948W WO 2021092710 A1 WO2021092710 A1 WO 2021092710A1
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- Prior art keywords
- nickel
- copper foil
- foil layer
- clad copper
- electromagnetic shielding
- Prior art date
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- 239000002131 composite material Substances 0.000 title claims abstract description 22
- 239000002184 metal Substances 0.000 title claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 16
- 238000002360 preparation method Methods 0.000 title abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 66
- 239000011889 copper foil Substances 0.000 claims abstract description 64
- 229910000808 amorphous metal alloy Inorganic materials 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 17
- 239000000843 powder Substances 0.000 claims abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 3
- 238000007750 plasma spraying Methods 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
Definitions
- the invention relates to the technical field of electromagnetic shielding, in particular to a metal-based electromagnetic shielding composite material and a preparation method thereof.
- Electromagnetic shielding is the main technology to suppress electromagnetic interference.
- the competition in the shielding material market is becoming increasingly fierce.
- shielding composite materials have received increasing attention from researchers.
- Many countries have invested a lot of manpower and material resources to conduct in-depth research on electromagnetic shielding materials.
- the technical problem to be solved by the present invention is to provide a metal-based electromagnetic shielding composite material, which has better shielding effectiveness at low frequencies and expands the application range of electromagnetic shielding materials.
- a metal-based electromagnetic shielding composite material includes a first nickel-clad copper foil layer and a second nickel-clad copper foil layer arranged at intervals, and a gap between the first nickel-clad copper foil layer and the second nickel-clad copper foil layer
- the thickness of the first nickel-clad copper foil layer and the second nickel-clad copper foil layer is 2-6 ⁇ m
- the amorphous alloy layer is made of FeCuNbSiB nano-amorphous powder material. It is 30-80 ⁇ m.
- the thickness of the first nickel-clad copper foil layer and the second nickel-clad copper foil layer are 3-5 ⁇ m, respectively.
- the thickness of the amorphous alloy layer is 60-80 ⁇ m.
- first nickel-clad copper foil layer and the second nickel-clad copper foil layer include a copper foil layer and a nickel foil layer wrapped around the copper foil layer, wherein the thickness of the copper foil layer is 1-4 ⁇ m, and the nickel foil layer The thickness is 0.5-1 ⁇ m.
- the invention also provides a preparation method of the electromagnetic shielding composite material.
- a method for preparing a metal-based electromagnetic shielding composite material includes the following steps:
- Step S1 providing a first nickel-clad copper foil layer and a second nickel-clad copper foil layer;
- Step S2 fixing the first nickel-clad copper foil layer and the second nickel-clad copper foil layer as required, so that the distance between the two meets the design requirements for the thickness of the amorphous alloy layer;
- Step S3 using a plasma spraying process to spray an amorphous alloy material between the first nickel-clad copper foil layer and the second nickel-clad copper foil layer to form an amorphous alloy layer.
- the metal electromagnetic shielding composite material of the present invention adopts a sandwich sandwich design, the center layer is made of FeCuNbSiB nano amorphous powder material, and the outer two layers are made of nickel-coated copper material, which has strong electrical conductivity, good flame retardancy, and shielding. Good effect and other advantages.
- the center layer is made of FeCuNbSiB nano amorphous powder material
- the outer two layers are made of nickel-coated copper material, which has strong electrical conductivity, good flame retardancy, and shielding. Good effect and other advantages.
- its shielding effectiveness reaches 60dB, which expands the application range of electromagnetic shielding materials.
- a metal-based electromagnetic shielding composite material includes a first nickel-clad copper foil layer and a second nickel-clad copper foil layer arranged at intervals, and a gap between the first nickel-clad copper foil layer and the second nickel-clad copper foil layer
- the thickness of the first nickel-clad copper foil layer and the second nickel-clad copper foil layer is 2-6 ⁇ m
- the amorphous alloy layer is made of FeCuNbSiB nano-amorphous powder material. It is 30-80 ⁇ m.
- the thickness of the first nickel-clad copper foil layer and the second nickel-clad copper foil layer are 3-5 ⁇ m, respectively.
- the thickness of the amorphous alloy layer is 60-80 ⁇ m.
- first nickel-clad copper foil layer and the second nickel-clad copper foil layer include a copper foil layer and a nickel foil layer wrapped around the copper foil layer, wherein the thickness of the copper foil layer is 1-4 ⁇ m, and the nickel foil layer The thickness is 0.5-1 ⁇ m.
- the invention also provides a preparation method of the electromagnetic shielding composite material.
- a method for preparing a metal-based electromagnetic shielding composite material includes the following steps:
- Step S1 providing a first nickel-clad copper foil layer and a second nickel-clad copper foil layer;
- Step S2 fixing the first nickel-clad copper foil layer and the second nickel-clad copper foil layer as required, so that the distance between the two meets the design requirements for the thickness of the amorphous alloy layer;
- Step S3 using a plasma spraying process to spray an amorphous alloy material between the first nickel-clad copper foil layer and the second nickel-clad copper foil layer to form an amorphous alloy layer.
- the metal electromagnetic shielding composite material of the present invention adopts a sandwich sandwich design, the center layer is made of FeCuNbSiB nano amorphous powder material, and the outer two layers are made of nickel-coated copper material, which has strong electrical conductivity, good flame retardancy, and shielding. Good effect and other advantages.
- the center layer is made of FeCuNbSiB nano amorphous powder material
- the outer two layers are made of nickel-coated copper material, which has strong electrical conductivity, good flame retardancy, and shielding. Good effect and other advantages.
- its shielding effectiveness reaches 60dB, which expands the application range of electromagnetic shielding materials.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
一种金属系电磁屏蔽复合材料，包括间隔设置的第一镍包铜箔层和第二镍包铜箔层、以及设于所述第一镍包铜箔层和第二镍包铜箔层之间的非晶合金层，所述第一镍包铜箔层和第二镍包铜箔层的厚度为2-6μm，所述非晶合金层由FeCuNbSiB纳米非晶粉体材料制备形成，其厚度为30-80μm。所述金属系电磁屏蔽复合材料在低频时具有较好的屏蔽效能，扩展了电磁屏蔽材料的应用范围。还提供一种金属系电磁屏蔽复合材料的制备方法。
Description
本发明涉及电磁屏蔽技术领域，特别涉及一种金属系电磁屏蔽复合材料及其制备方法。
电磁屏蔽是抑制电磁干扰的主要技术，屏蔽材料市场竞争日趋激烈，屏蔽复合材料作为一种新型屏蔽材料，日益收到研究者们的高度重视。各国均投入了大量的人力和物力对电磁屏蔽材料进行深入研究。
目前的复合材料大多侧重于高频段电磁波的屏蔽，虽然获得了较好的屏蔽效果，但应用在低频时，屏蔽效果较差，不能达到环境要求的屏蔽效能。
鉴于此，有必要提供一种低频电磁屏蔽材料解决上述技术问题。
发明内容
本发明要解决的技术问题是提供一种金属系电磁屏蔽复合材料，其在低频时具有较好的屏蔽效能，扩展了电磁屏蔽材料的应用范围。
为了解决上述问题，本发明的技术方案如下：
一种金属系电磁屏蔽复合材料，包括间隔设置的第一镍包铜箔层和第二镍包铜箔层、以及设于所述第一镍包铜箔层和第二镍包铜箔层之间的非晶合金层，所述第一镍包铜箔层和第二镍包铜箔层的厚度为2-6μm，所述非晶合金层由FeCuNbSiB纳米非晶粉体材料制备形成，其厚度为30-80μm。
进一步地，所述第一镍包铜箔层和第二镍包铜箔层的厚度分别为3-5μm。
进一步地，所述非晶合金层的厚度为60-80μm。
进一步地，所述第一镍包铜箔层和第二镍包铜箔层包括铜箔层和包裹于铜箔层外的镍箔层，其中铜箔层的厚度为1-4μm，镍箔层的厚度为0.5-1μm。
本发明还提供一种电磁屏蔽复合材料的制备方法。
一种金属系电磁屏蔽复合材料的制备方法，包括如下步骤：
步骤S1，提供第一镍包铜箔层和第二镍包铜箔层；
步骤S2，按要求将第一镍包铜箔层和第二镍包铜箔层固定，使两者的间距满足非晶合金层厚度的设计要求；
步骤S3，采用等离子喷涂工艺在第一镍包铜箔层和第二镍包铜箔层之间喷涂非晶合金材料，形成非晶合金层。
本发明提供的金属系电磁屏蔽复合材料及其制备方法，有益效果在于：
本发明的金属系电磁屏蔽复合材料采用三明治型夹层设计，中心层采用FeCuNbSiB纳米非晶粉体材料制备姓曾，外侧的两层采用镍包铜材料，具有导电性能强、阻燃性能好、屏蔽效果好等优点。对于1-100MHz频率范围内的电磁波，其屏蔽效能达60dB，扩展了电磁屏蔽材料的应用范围。
为了使本技术领域的人员更好地理解本发明实施例中的技术方案，并使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图对本发明的具体实施方式作进一步的说明。
在此需要说明的是，对于这些实施方式的说明用于帮助理解本发明，但并不构成对本发明的限定。此外，下面所描述的本发明各个实施方式中所涉及的技术特征只要彼此之间未构成冲突就可以相互结合。
一种金属系电磁屏蔽复合材料，包括间隔设置的第一镍包铜箔层和第二镍包铜箔层、以及设于所述第一镍包铜箔层和第二镍包铜箔层之间的非晶合金层，所述第一镍包铜箔层和第二镍包铜箔层的厚度为2-6μm，所述非晶合金层由FeCuNbSiB纳米非晶粉体材料制备形成，其厚度为30-80μm。
进一步地，所述第一镍包铜箔层和第二镍包铜箔层的厚度分别为3-5μm。
进一步地，所述非晶合金层的厚度为60-80μm。
进一步地，所述第一镍包铜箔层和第二镍包铜箔层包括铜箔层和包裹于铜箔层外的镍箔层，其中铜箔层的厚度为1-4μm，镍箔层的厚度为0.5-1μm。
本发明还提供一种电磁屏蔽复合材料的制备方法。
一种金属系电磁屏蔽复合材料的制备方法，包括如下步骤：
步骤S1，提供第一镍包铜箔层和第二镍包铜箔层；
步骤S2，按要求将第一镍包铜箔层和第二镍包铜箔层固定，使两者的间距 满足非晶合金层厚度的设计要求；
步骤S3，采用等离子喷涂工艺在第一镍包铜箔层和第二镍包铜箔层之间喷涂非晶合金材料，形成非晶合金层。
本发明的金属系电磁屏蔽复合材料采用三明治型夹层设计，中心层采用FeCuNbSiB纳米非晶粉体材料制备姓曾，外侧的两层采用镍包铜材料，具有导电性能强、阻燃性能好、屏蔽效果好等优点。对于1-100MHz频率范围内的电磁波，其屏蔽效能达60dB，扩展了电磁屏蔽材料的应用范围。
本说明书中的各个实施例均采用递进的方式描述，各个实施例之间相同相似的部分互相参见即可，每个实施例重点说明的都是与其它实施例的不同之处。
以上结合附图对本发明的实施方式作出详细说明，但本发明不局限于所描述的实施方式。对本领域的技术人员而言，在不脱离本发明的原理和精神的情况下对这些实施例进行的多种变化、修改、替换和变型均仍落入在本发明的保护范围之内。
Claims (5)
- 一种金属系电磁屏蔽复合材料，其特征在于，包括间隔设置的第一镍包铜箔层和第二镍包铜箔层、以及设于所述第一镍包铜箔层和第二镍包铜箔层之间的非晶合金层，所述第一镍包铜箔层和第二镍包铜箔层的厚度为2-6μm，所述非晶合金层由FeCuNbSiB纳米非晶粉体材料制备形成，其厚度为30-80μm。
- 根据权利要求1所述的金属系电磁屏蔽复合材料，其特征在于，所述第一镍包铜箔层和第二镍包铜箔层的厚度分别为3-5μm。
- 根据权利要求1所述的电磁屏蔽复合材料，其特征在于，所述非晶合金层的厚度为60-80μm。
- 根据权利要求1所述的电磁屏蔽复合材料，其特征在于，所述第一镍包铜箔层和第二镍包铜箔层包括铜箔层和包裹于铜箔层外的镍箔层，其中铜箔层的厚度为1-4μm，镍箔层的厚度为0.5-1μm。
- 一种如权利要求1所述的金属系电磁屏蔽复合材料的制备方法，其特征在于，包括如下步骤：步骤S1，提供第一镍包铜箔层和第二镍包铜箔层；步骤S2，按要求将第一镍包铜箔层和第二镍包铜箔层固定，使两者的间距满足非晶合金层厚度的设计要求；步骤S3，采用等离子喷涂工艺在第一镍包铜箔层和第二镍包铜箔层之间喷涂非晶合金材料，形成非晶合金层。
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| JP2006124900A (ja) * | 2004-05-28 | 2006-05-18 | Matsuyama Keori Kk | 導電性織物及び金属製織物 |
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