WO2021082734A1 - 电路板装置及其加工方法和移动终端 - Google Patents

电路板装置及其加工方法和移动终端 Download PDF

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Publication number
WO2021082734A1
WO2021082734A1 PCT/CN2020/113593 CN2020113593W WO2021082734A1 WO 2021082734 A1 WO2021082734 A1 WO 2021082734A1 CN 2020113593 W CN2020113593 W CN 2020113593W WO 2021082734 A1 WO2021082734 A1 WO 2021082734A1
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WIPO (PCT)
Prior art keywords
circuit board
capacitors
capacitor
functional device
electrode plate
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PCT/CN2020/113593
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English (en)
French (fr)
Inventor
梁福有
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维沃移动通信有限公司
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Publication of WO2021082734A1 publication Critical patent/WO2021082734A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor

Definitions

  • the present invention relates to the field of communication technology, in particular to a circuit board device, a processing method thereof, and a mobile terminal.
  • Mobile terminals such as smart phones and tablet computers.
  • Mobile terminals are becoming more and more miniaturized, and their built-in functional devices are becoming smaller and smaller. .
  • the functional device is usually connected to the circuit board.
  • the circuit board In order to reduce the noise of the functional device coupled to the power supply terminal and improve the stability of the power supply of the functional device, it is also necessary to install a capacitor on the circuit board.
  • FIG. 1 there is shown a schematic structural diagram of an existing circuit board device, which may specifically include: a circuit board 10, a functional device 11, and a plurality of capacitors 12; wherein, the functional device 11 is connected to one side of the circuit board 10, A plurality of capacitors 12 are connected to the other side of the circuit board 10.
  • the capacitor 12 is arranged in the projection area of the functional device 11 on the circuit board 10, so that the distance between the capacitor 12 and the functional device 11 is short, and the capacitor 12 can reduce the functional device.
  • the noise coupled to the power supply terminal improves the stability of the functional device 11 when it is connected to the power supply.
  • the area of the projection area of the functional device 11 on the circuit board 10 will become smaller, resulting in a reduction in the number of capacitors 12 that can be arranged in the projection area, thereby reducing the effect of the capacitor 12 on the functional device.
  • 11 is coupled to the power supply terminal to reduce noise, and reduces the stability of the functional device 11 accessing the power supply.
  • the present invention proposes a circuit board device, a processing method thereof, and a mobile terminal.
  • an embodiment of the present invention discloses a circuit board device, including: a circuit board, a functional device, and a plurality of capacitors; wherein,
  • the functional device is connected to the first side of the circuit board
  • a plurality of the capacitors are connected to the second side of the circuit board, the second side is arranged opposite to the first side, and in a direction perpendicular to the circuit board, the capacitors are arranged on the functional device In the projection area on the circuit board, the length direction of the capacitor is perpendicular to the circuit board.
  • the embodiment of the present invention also discloses a processing method of a circuit board device, including:
  • a plurality of capacitors are connected to the second side of the first circuit board to obtain a circuit board device; wherein, the second side is arranged opposite to the first side in a direction perpendicular to the first circuit board Above, the capacitor is arranged in the projection area of the functional device on the first circuit board, and the length direction of the capacitor is perpendicular to the first circuit board.
  • an embodiment of the present invention also discloses an electronic device, including: the above-mentioned circuit board device.
  • the functional device since the functional device is connected to the first side of the circuit board, a plurality of capacitors are connected to the second side of the circuit board opposite to the first side, in a direction perpendicular to the circuit board,
  • the capacitor is arranged in the projection area of the functional device on the circuit board.
  • the length of the capacitor is perpendicular to the circuit board, which can reduce the area of the projection area occupied by the capacitor. Therefore, more capacitors can be set in the projection area of the same size.
  • the volume of the functional device becomes smaller and the projection area of the functional device on the circuit board becomes correspondingly smaller, more capacitors can still be set in the projection area. Therefore, the capacitor can better reduce the function
  • the noise of the device coupled to the power supply terminal improves the stability of the functional device connecting to the power supply.
  • FIG. 1 is a schematic diagram of the structure of a conventional circuit board device
  • FIG. 2 is a schematic diagram of the structure of a circuit board device of the present invention.
  • Fig. 3 is one of the steps of a process flow chart of a circuit board device processing method of the present invention.
  • Figure 4 is the second step flow chart of a circuit board device processing method of the present invention.
  • FIG. 5 is one of the structural schematic diagrams of a first circuit board of the present invention.
  • Fig. 6 is a second schematic diagram of a first circuit board structure of the present invention.
  • a schematic structural diagram of a circuit board device of the present invention which may specifically include: a circuit board 20, a functional device 21, and a plurality of capacitors 22; wherein the functional device 21 is connected to the first side of the circuit board 20 , A plurality of capacitors 22 are connected to the second side of the circuit board 20, and the second side is arranged opposite to the first side.
  • the capacitors 22 are arranged in the projection area of the functional device 21 on the circuit board 20 within, the projection area refers to the projection area of the functional device 21 perpendicular to the circuit board 20.
  • the length direction of the capacitor 22 is perpendicular to the circuit board 20.
  • the circuit board device provided by the embodiment of the present invention can be set more More capacitors 22. In this way, when the volume of the functional device 21 becomes smaller and the projection area of the functional device 21 on the circuit board 20 becomes correspondingly smaller, more capacitors 22 can still be arranged in the projection area. Therefore, the capacitor 22 can better reduce the noise of the functional device 21 coupled to the power supply terminal, and improve the stability of the functional device 21 connecting to the power supply.
  • each functional device 21 is provided with multiple capacitors 22 in the projection area on the circuit board 20.
  • the number of capacitors 22 can be determined according to the number of power terminals of the functional device 21. It is determined that the embodiment of the present invention does not limit this.
  • the capacitances of multiple capacitors 22 can be different.
  • a capacitor 22 with a larger capacitance is used to remove low-frequency noise, and a capacitor 22 with a smaller capacitance is used to remove high-frequency noise.
  • the location of the capacitor 22 with a smaller capacitance can be determined according to the frequency of the noise on the power supply terminal of the functional device 21. For example, a capacitor 22 with a larger capacitance is set close to the low-frequency noise at the power supply terminal, and a capacitor 22 with a smaller capacitance is set close to the high-frequency noise at the power supply terminal.
  • the capacitor 22 with a larger capacitance has a larger volume and a smaller capacitance. The size of the capacitor 22 is small.
  • one end of the capacitor 22 along the length direction is provided with a first electrode plate 221, and the other end of the capacitor 22 along the length direction is provided with a second electrode plate 222.
  • the first electrode plate 221 is connected to the second electrode plate 221 of the circuit board 20.
  • the second electrode plate 222 is away from the second side of the circuit board 20 and is electrically connected to the circuit board 20.
  • the first electrode plate and the second electrode plate of the capacitor 12 are in direct contact with the circuit board 20.
  • the area of the projection area occupied by the capacitor 22 is It is smaller, and more capacitors 22 can be provided for the same size projection area.
  • the capacitor 22 can better reduce the noise of the functional device 21 coupled to the power supply terminal, and improve the stability of the functional device 21 connecting to the power supply.
  • the circuit board device provided by the embodiment of the present invention has the first electrode of the capacitor 22
  • the front surface of the plate 221 is in contact with the circuit board 20, which can increase the contact area between the first electrode plate 221 and the circuit board 20, reduce contact resistance, and save energy.
  • the functional device 21 can be set on the first side of the circuit board 20 to obtain the circuit board 20 provided with the functional device 21, and then the first plate 221 of the capacitor 22 can be connected to the circuit by surface mount technology. In the projection area on the second side of the board 20, a circuit board device is obtained. Wherein, the first plate 221 of the capacitor 22 is connected to the functional device 21 through a connecting wire or a pre-laid conductive medium, and there is a certain gap between the plurality of capacitors 22 to facilitate the electrical connection between the second plate 222 and the circuit board 20. connection.
  • the first electrode plate 221 of the capacitor 22 may be a positive electrode or a negative electrode. Specifically, it may be determined according to the polarity of the functional device 21 close to the capacitor 22. For example, when the polarity of the functional device 21 close to the capacitor 22 is positive, that is, the power terminal, the first plate 221 is positive; when the polarity of the functional device 21 close to the capacitor 22 is negative, that is, the ground terminal, the first plate 221 221 is the negative electrode. In addition, when the first electrode plate 221 is a positive electrode, the second electrode plate 222 is a negative electrode; when the first electrode plate 221 is a negative electrode, the second electrode plate 222 is a positive electrode.
  • the circuit board device may further include: a packaging structure 23, which covers the plurality of capacitors 22 and fills the gaps between the plurality of capacitors 22 And the packaging structure 23 is connected to the second side of the circuit board 20.
  • the packaging structure 23 can further fix the capacitor 22 to the circuit board 20 to prevent the capacitor 22 from falling off under the action of external force.
  • the packaging structure 23 may be covered on the capacitor 22 by a plastic filling method.
  • the material of the packaging structure 23 is an insulating material to prevent electrical conduction between the multiple capacitors 22.
  • the insulating material may be plastic.
  • a conductive structure 25 is provided on the packaging structure 23, and the second electrode plate 222 is connected to the circuit board 20 through the conductive structure 25. To connect the second plate 222 and the circuit board 20.
  • the package structure 23 is provided with a conduction channel 24, and a conductive structure 25 is provided in the conduction channel 24.
  • the conductive structure 25 is respectively connected to the second electrode plate 222 and the circuit board 20, and the conductive structure 25 serves to conduct the second electrode plate 222 and the circuit board 20.
  • the role of the diode 222 and the circuit board 20 the conductive structure 25 can be directly connected to the second side of the circuit board 20, or can be connected to the first side of the circuit board 20.
  • the conductive structure 25 is connected to the first side of the circuit board 20, it can be connected to the first side of the circuit board 20. Wires or pre-laid conductive media are connected to finally realize the electrical connection between the second electrode plate 222 and the functional device 21.
  • the conduction channel 24 can provide space for the electrical connection between the second electrode plate 222 and the circuit board 20, avoid the circuit board device from being too complicated, and achieve the purpose of beauty and cost saving.
  • one pole of the functional device 21 close to the capacitor 22 is connected to the first plate 221 of the capacitor 22 through the conductive medium, and the other pole of the functional device 21 is connected to the second plate 222 of the capacitor 22 through the conductive structure 25 , To form a decoupling loop, which can remove the noise of the functional device 21 coupled to the power supply terminal, and improve the stability of the functional device 21 accessing the power supply.
  • the conductive structure 25 may include: conductive metals such as copper and silver, wires, or conductive plating layer electroplated on the inner wall of the conductive channel 24.
  • conductive metals such as copper and silver, wires, or conductive plating layer electroplated on the inner wall of the conductive channel 24.
  • the conductive structure 25 is a conductive metal
  • the conductive metal can fill the conductive channel 24, and then The cross-sectional area of the conductive structure 25 is increased, the conductive resistance is reduced, and the power is saved.
  • the conductive structure 25 is a wire, the cost can be saved, and at the same time, the conduction channel 24 can be set to be smaller, so as to improve the strength of the packaging structure 23.
  • the conductive structure 25 is a conductive plating layer, it not only plays the role of connecting the second electrode plate 222 and the circuit board 20, but also saves costs.
  • the circuit board 20 may be a printed circuit board (PCB) or a flexible circuit board
  • the functional device 21 may be a central processing unit (CPU), and the central processing unit is welded to the printed circuit board. On the board.
  • circuit board device includes at least the following advantages:
  • the circuit board device includes: a circuit board, a functional device, and a plurality of capacitors.
  • the functional device is connected to a first side of the circuit board, and the plurality of capacitors are connected to a second side of the circuit board opposite to the first side.
  • Multiple capacitors are arranged in the projection area of the functional device on the circuit board.
  • the length of the multiple capacitors is perpendicular to the circuit board, which can reduce the area of the projection area occupied by the capacitors. Therefore, more capacitors can be set in the projection area of the same size. In this way, when the volume of the functional device becomes smaller and the projection area of the functional device on the circuit board becomes smaller, more capacitors can still be set in the projection area. Therefore, the capacitors can be better. Reduce the noise of the functional device coupled to the power supply terminal, and improve the stability of the functional device connected to the power supply.
  • the method may specifically include the following steps:
  • Step 301 Connect the functional device to the first side of the circuit board to obtain the first circuit board provided with the functional device.
  • the functional device can be connected to the first side of the circuit board by welding.
  • the functional device can include multiple power terminals and multiple ground terminals, that is, multiple positive electrodes and multiple negative electrodes.
  • the positive electrode of the functional device is welded to the On the circuit board, the negative pole of the functional device is grounded through the circuit board.
  • multiple functional devices can be connected to the first side of the circuit board.
  • Step 302 Connect a plurality of capacitors to the second side of the first circuit board to obtain a circuit board device, wherein the second side and the first side are arranged opposite to each other, and are positioned perpendicular to the first circuit board. In the direction, the capacitor is arranged in the projection area of the functional device on the first circuit board, and the length direction of the capacitor is perpendicular to the first circuit board.
  • a plurality of capacitors can be welded and connected to the second side of the first circuit board by welding. Specifically, the plurality of capacitors are welded in the projection area of the functional device on the first circuit board. The length direction is perpendicular to the first circuit board, and the polarity of the end of the capacitor close to the circuit board is determined by the polarity of the nearest functional device.
  • the capacitor can also be connected in other ways, as long as the connection firmness and energization of the capacitor on the second side of the first circuit board can be achieved.
  • the capacitor can be fixed on the second side by a solder paste patch.
  • the second side of a circuit board can be connected in other ways, as long as the connection firmness and energization of the capacitor on the second side of the first circuit board can be achieved.
  • the capacitor can be fixed on the second side by a solder paste patch.
  • the second side of a circuit board can be fixed on the second side by a solder paste patch.
  • a plurality of capacitors are connected in the projection area.
  • the area of the projection area occupied by the capacitor can be reduced, and more capacitors can be provided for the projection area of the same size.
  • the capacitors can be better. Reduce the noise of the functional device coupled to the power supply terminal, and improve the stability of the functional device connected to the power supply.
  • each functional device is provided with multiple capacitors in the projection area on the first circuit board.
  • the number of capacitors can be determined according to the number of power terminals of the functional device. The embodiment is no longer limited to this.
  • the capacitance of multiple capacitors can be different.
  • a capacitor with a larger capacitance is used to remove low-frequency noise
  • a capacitor with a smaller capacitance is used to remove high-frequency noise.
  • the larger capacitance and the smaller capacitance The setting position of the capacitance value capacitor can be determined according to the frequency of the power supply noise on the functional device. For example, a larger capacitance value capacitor should be set close to the low frequency noise of the power supply end, and a smaller capacitance value should be set close to the high frequency noise position of the power supply end. capacitance.
  • circuit board device processing method includes at least the following advantages:
  • the functional device since the functional device is connected to the first side of the circuit board, a plurality of capacitors are connected to the second side of the circuit board opposite to the first side, and the plurality of capacitors are arranged on the functional device
  • the length of the multiple capacitors is perpendicular to the circuit board, which can reduce the area of the projection area occupied by the capacitors. Therefore, more capacitors can be set in the projection area of the same size. In this way, the volume of the functional device When the projection area of the functional device on the circuit board becomes smaller, more capacitors can still be set in the projection area. Therefore, the capacitor can better reduce the coupling of the functional device to the power supply terminal. Noise, improve the stability of the functional devices connected to the power supply.
  • the method may specifically include the following steps:
  • Step 401 Connect the functional device to the first side of the circuit board to obtain a first circuit board provided with the functional device.
  • Step 402 Electrically connect the first plates of a plurality of the capacitors to the second side of the first circuit board.
  • FIG. 5 one of the structural schematic diagrams of a first circuit board of the present invention is shown.
  • the capacitor 22 can be connected to the second side of the first circuit board by surface mount technology, where there is a certain gap between the capacitors 22, and the capacitor 22 can be connected to the capacitor 22 through the surface mount technology. Reliability of the first circuit board connection.
  • the polarity of the first plate 221 of the capacitor 22 is determined by the polarity of the functional device 21 close to the capacitor 22. For example, when the polarity of the functional device 21 close to the capacitor 22 is positive, the first plate 221 is the positive; When the polarity near the capacitor 22 is negative, the first electrode plate 221 is negative.
  • Step 403 Electrically connect the second plates of the plurality of capacitors with the first circuit board to obtain the circuit board device, wherein the first plates are arranged on the plurality of capacitors along the length direction. At one end, the second electrode plate is arranged at the other end of the plurality of capacitors along the length direction, and the second electrode plate is away from the second side of the first circuit board.
  • the first plate 221 of the capacitor 22 is electrically connected to the second side of the first circuit board, and the second plate 222 of the capacitor 22 is away from the second side of the first circuit board, which can ensure the length of the capacitor 22
  • the direction is perpendicular to the first circuit board, so that the area of the projection area occupied by the capacitor 22 is small, and a relatively large number of capacitors 22 can be provided in the projection area of the same size. In this way, when the volume of the functional device 21 becomes smaller and the projection area of the functional device 21 on the first circuit board becomes correspondingly smaller, more capacitors 22 can still be arranged in the projection area. Therefore, the The capacitor 22 can better reduce the noise of the functional device 21 coupled to the power supply terminal, and improve the stability of the functional device 21 connecting to the power supply.
  • the contact area between the first electrode plate 221 and the first circuit board can be increased, contact resistance can be reduced, and energy can be saved.
  • the second plate 222 of the capacitor 22 can be electrically connected to the first circuit board in a variety of ways.
  • the second plate 222 of the capacitor 22 can be directly connected to the first circuit board through a wire, or through Other conductive materials are connected, which is not limited in the embodiment of the present invention.
  • step 403 may specifically include the following steps:
  • the second side surface of the first circuit board is molded by plastic molding to obtain a package structure fixed on the second side surface and covering the capacitor.
  • FIG. 6 there is shown the second structural diagram of a first circuit board of the present invention.
  • the packaging structure 23 is obtained by molding the plastic material on the first circuit board.
  • the packaging structure 23 covers the plurality of capacitors 22 and fills the gaps between the plurality of capacitors 22, and the package
  • the structure 23 is connected to the second side surface of the first circuit board, and the packaging structure 23 can further fix the capacitor 22 to the first circuit board to prevent the capacitor 22 from falling off under the action of external force. Since the plastic material is an insulating material, it can prevent electrical conduction between the multiple capacitors 22 from occurring.
  • a conductive structure is provided on the packaging structure to obtain the circuit board device; wherein, the second electrode plate is electrically connected to the first circuit board through the conductive structure.
  • a conductive channel 24 is etched on the packaging structure 23 of the first circuit board.
  • the conductive channel 24 is connected to the second electrode plate 222 and the first circuit board respectively. Connected, the conduction channel 24 can provide space for the electrical connection between the second plate 222 and the circuit board 20, avoid the circuit board device from being too complicated, and achieve the purpose of beauty and cost saving.
  • one end of the conduction channel 24 communicates with the second electrode plate 222, and the other end of the conduction channel 24 communicates with the first circuit board, which can realize the electrical connection between the second electrode plate 222 and the first circuit board.
  • the conductive channel 24 is etched on the package structure by low-cost and high-reliability etching technology.
  • the conductive channel 24 communicates with the second electrode plate 222 and the first circuit board, and the conductive channel 24 is the first circuit board.
  • the electrical connection between the diode 222 and the functional device 21 improves the space support, avoids the circuit board arrangement from being too complicated, and achieves the purpose of beautiful appearance and cost saving.
  • a conductive structure is arranged in the conduction channel to obtain the circuit board device; wherein, the conductive structure is respectively connected to the second electrode plate and the first circuit board.
  • a conductive structure 25 is provided in the conduction channel.
  • the conductive structure 25 is respectively connected to the second electrode plate 222 and the first circuit board.
  • the conductive structure 25 functions to conduct current between the second electrode plate 222 and the first circuit board.
  • the conductive structure 25 can be connected to the second side of the first circuit board, or can be connected to the first side of the first circuit board, wherein, when the conductive structure 25 is connected to the first side of the first circuit board,
  • the electrical connection between the second electrode plate 222 and the functional device 21 is finally realized by connecting with a connecting wire or a pre-laid conductive medium.
  • one pole of the functional device 21 close to the capacitor 22 is connected to the first electrode plate 221 of the capacitor 22 through the conductive medium, and the second electrode plate 222 of the capacitor 22 is connected to the other electrode of the functional device 21 through the conductive structure 25 , Forming a loop, the capacitor 22 can remove the noise of the functional device 21 coupled to the power supply terminal, and improve the stability of the functional device 21 connecting to the power supply.
  • the conductive structure 25 may include: conductive metals such as copper and silver, wires, or conductive plating layer electroplated on the inner wall of the conductive channel.
  • conductive metals such as copper and silver, wires, or conductive plating layer electroplated on the inner wall of the conductive channel.
  • the conductive structure 25 is a conductive metal
  • the conductive metal can fill the conductive channel 24, thereby increasing The cross-sectional area of the large conductive structure 25 reduces the conductive resistance and saves power.
  • the conductive structure 25 is a wire, the cost can be saved, and at the same time, the conduction channel 24 can be set to be smaller, so as to improve the strength of the packaging structure 23.
  • the conductive structure 25 is a conductive plating layer, it not only plays the role of connecting the second electrode plate 222 and the circuit board 20, but also saves costs.
  • circuit board device processing method includes at least the following advantages:
  • the functional device since the functional device is connected to the first side of the circuit board, a plurality of capacitors are connected to the second side of the circuit board opposite to the first side, and the plurality of capacitors are arranged on the functional device
  • the length direction of the multiple capacitors is perpendicular to the second side of the circuit board, which can reduce the area of the projection area occupied by the capacitors. Therefore, more capacitors can be set in the projection area of the same size.
  • the volume of the functional device becomes smaller, and the projection area of the functional device on the circuit board is correspondingly smaller, and more capacitors can still be set in the projection area. Therefore, the capacitor can better reduce the function device.
  • the noise coupled to the power supply terminal improves the stability of the functional device connected to the power supply.
  • the first plate of the capacitor by connecting the first plate of the capacitor to the second side of the first circuit board, while reducing the area of the projection area occupied by the capacitor, the first plate and the first plate can be increased.
  • the contact area between the circuit boards reduces the contact resistance and saves energy.
  • the description is relatively simple, and for related parts, please refer to the part of the description of the method embodiment.
  • circuit board device and its processing method and mobile terminal provided by the present invention are described in detail above. Specific examples are used in this article to explain the principle and implementation of the present invention. The description of the above embodiments is only for To help understand the method and its core idea of the present invention; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation and application scope. It should not be understood as a limitation to the present invention.

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Abstract

本发明实施例提供了一种电路板装置及其加工方法和移动终端，所述电路板装置包括：电路板、功能器件以及多个电容，功能器件连接在电路板的第一侧，多个电容连接于电路板的与第一侧相对的第二侧，多个电容设置于功能器件在电路板的投影区域内，多个电容的长度方向垂直于电路板的第二侧。

Description

电路板装置及其加工方法和移动终端
相关申请的交叉引用
本申请主张在2019年10月28日提交国家知识产权局、申请号为201911032915.X申请名称为“一种电路板装置及其加工方法和移动终端”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及通信技术领域，特别是涉及一种电路板装置及其加工方法和移动终端。
背景技术
随着对于使用体验的极致追求，用户对于智能手机、平板电脑等移动终端的要求也越来越高，移动终端越来越朝着小型化发展，其内置的功能器件也变得越来越小。
现有移动终端中，功能器件通常连接在电路板上，为了降低功能器件耦合到电源端的噪声，提高功能器件的接入电源的稳定性，还需要在电路板上安装电容。
参照图1，示出了现有的一种电路板装置的结构示意图，具体可以包括：电路板10、功能器件11和多个电容12；其中，功能器件11连接在电路板10的一侧，多个电容12连接于电路板10的另一侧，电容12设置于功能器件11在电路板10上的投影区域内，使得电容12与功能器件11的距离较短，电容12可以达到降低功能器件11耦合到电源端的噪声，提高功能器件11接入电源的稳定性。
然而，随着功能器件11的尺寸变小，功能器件11在电路板10上的投影区域的面积会变小，导致可以设置于投影区域内的电容12的数量减少，从而降低电容12对功能器件11耦合到电源端降噪的作用，以及，降低功能器件11接入电源的稳定性。
发明内容
有鉴于此，为了解决现有的移动终端中，功能器件的电容的数量较少，电容对功能器件的降噪作用较差，以及，功能器件接入电源的稳定性较差的问题，本发明实施例提出了一种电路板装置及其加工方法和移动终端。
为了解决上述问题，一方面，本发明实施例公开了一种电路板装置，包括：电路板、功能器件以及多个电容；其中，
所述功能器件连接在所述电路板的第一侧；
多个所述电容连接于所述电路板的第二侧，所述第二侧与所述第一侧相背设置，在垂直所述电路板的方向上，所述电容设置于所述功能器件在所述电路板上的投影区域内，所述电容的长度方向与所述电路板相垂直。
另一方面，本发明实施例还公开了一种电路板装置的加工方法，包括：
将功能器件连接在电路板的第一侧，得到设有所述功能器件的第一电路板；
将多个电容连接于所述第一电路板的第二侧，得到电路板装置；其中，所述第二 侧与所述第一侧相背设置，在垂直于所述第一电路板的方向上，所述电容设置于所述功能器件在所述第一电路板上的投影区域内，所述电容的长度方向与所述第一电路板相垂直。
再一方面，本发明实施例还公开了一种电子设备，包括：上述电路板装置。
本发明实施例包括以下优点：
本发明实施例提供的电路板装置，由于功能器件连接在电路板的第一侧，多个电容连接于电路板的与第一侧相背的第二侧，在垂直于电路板的方向上，电容设置于功能器件在电路板上的投影区域内，电容的长度方向与电路板相垂直，可以减少电容所占投影区域的面积，因此，同样大小的投影区域可以设置更多的电容，这样，在功能器件的体积变小，功能器件在所述电路板上的投影区域相应变小的情况下，所述投影区域内仍然能够设置较多的电容，因此，所述电容能够较好的降低功能器件耦合到电源端的噪声，提高功能器件接入电源的稳定性。
附图说明
图1是现有的一种电路板装置的结构示意图；
图2是本发明的一种电路板装置的结构示意图；
图3是本发明的一种电路板装置加工方法的步骤流程图之一；
图4是本发明的一种电路板装置加工方法的步骤流程图之二；
图5是本发明的一种第一电路板的结构示意图之一；
图6是本发明的一种第一电路板结构示意图之二。
具体实施方式
为使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图和具体实施方式对本发明作进一步详细的说明。
实施例一
参照图2，示出了本发明的一种电路板装置的结构示意图，具体可以包括：电路板20、功能器件21以及多个电容22；其中，功能器件21连接在电路板20的第一侧，多个电容22连接于电路板20的第二侧，第二侧与第一侧相背设置，在垂直电路板20的方向上，电容22设置于功能器件21在电路板20上的投影区域内，其中，投影区域指的是，功能器件21沿垂直于电路板20的投影区域。电容22的长度方向与电路板20相垂直。本发明实施例中，通过使电容22的长度方向与电路板20相垂直，可以减少电容22所占投影区域的面积，同样大小的投影区域，本发明实施例提供的电路板装置，可以设置更多的电容22。这样，在功能器件21的体积变小，功能器件21在所述电路板20上的投影区域相应变小的情况下，所述投影区域内仍然能够设置较多的电容22，因此，所述电容22能够较好的降低功能器件21耦合到电源端的噪声，提高功能器件21接入电源的稳定性。
在实际应用中，功能器件21可以有多个，每个功能器件21在电路板20上的投影区域内均设置有多个电容22，其中，电容22的数量可以根据功能器件21电源端的数 量来确定，本发明实施例对此不做限定。
在实际应用中，多个电容22的容值可以不同，较大容值的电容22用于去除低频的噪声，较小容值的电容22用于去除高频的噪声，其中，较大容值和较小容值的电容22的设置位置可以根据功能器件21上电源端噪声的频率决定。例如，靠近电源端低频噪声的位置设置较大容值的电容22，靠近电源端高频噪声的位置设置较小容值的电容22，较大容值的电容22的体积较大，较小容值的电容22的体积较小。
本发明实施例中，电容22沿长度方向的一端设有第一极板221，电容22沿长度方向的另一端设有第二极板222，第一极板221连接于电路板20的第二侧，第二极板222远离电路板20的第二侧，且与电路板20电连接。与现有的电路板装置中，电容12的第一极板和第二极板均直接与电路板20接触相比，本发明实施例提供的电路板装置中，电容22所占投影区域的面积更小，同样大小的投影区域可以设置更多的电容22。这样，在功能器件21的体积变小，功能器件21在所述电路板20上的投影区域相应变小的情况下，所述投影区域内仍然能够设置较多的电容22，这样，就可以使得电容22能够较好的降低功能器件21耦合到电源端的噪声，提高功能器件21接入电源的稳定性。
另外，与现有的电路板装置中，将电容12的第一极板和第二极板的侧面与电路板接触相比，本发明实施例提供的电路板装置，通过将电容22第一极板221的正面与电路板20接触，可以增大第一极板221与电路板20之间的接触面积，减少接触电阻，节约能源。
在实际应用中，可以先在电路板20的第一侧设置功能器件21，得到设有功能器件21的电路板20，再通过表面贴装技术，将电容22的第一极板221连接于电路板20第二侧的投影区域内，得到电路板装置。其中，电容22的第一极板221通过连接线或预先铺设的导通介质连接至功能器件21，多个电容22之间具有一定的间隙，以便于第二极板222与电路板20进行电连接。
在实际应用中，电容22的第一极板221可以是正极，也可以是负极，具体地，可以根据功能器件21靠近电容22的极性决定。例如，当功能器件21靠近电容22的极性是正极，即电源端时，第一极板221为正极；当功能器件21靠近电容22的极性是负极，即接地端时，第一极板221为负极。另外，当第一极板221为正极时，第二极板222为负极；当第一极板221为负极时，第二极板222为正极。
本发明实施例中，为了提高电容22与电路板20连接的牢固性，电路板装置还可以包括：封装结构23，封装结构23覆盖多个电容22，并填满多个电容22之间的间隙，且封装结构23与电路板20的第二侧连接，封装结构23可以进一步将电容22固定到电路板20上，防止电容22在外力作用下，发生脱落。
在实际应用中，封装结构23可以通过塑封填充的方法覆盖到电容22上。具体地，封装结构23的材料为绝缘材料，以防止多个电容22之间有导电的情况发生，其中，绝缘材料可以是塑胶。
本发明实施例中，为了实现第二极板222与电路板20的电连接，封装结构23上 设置有导电结构25，第二极板222通过导电结构25和电路板20相连，导电结构25起到导通第二极板222和电路板20的作用。
在实际应用中，封装结构23开设有导通通道24，导通通道24内设置有导电结构25，导电结构25分别与第二极板222和电路板20相连，导电结构25起到导通第二极板222与电路板20的作用。具体地，导电结构25可以直接与电路板20的第二侧连接，也可以与电路板20的第一侧连接，其中，当导电结构25与电路板20的第一侧连接时，可以通过连接线或预先铺设的导通介质相连接，最终实现第二极板222与功能器件21的电连接。导通通道24可以为第二极板222和电路板20之间的电连接提供空间，避免电路板装置的线路布置过于复杂，达到美观且节约成本的目的。
在实际应用中，功能器件21靠近电容22的一极通过导通介质与电容22的第一极板221连接，功能器件21的另一极通过导电结构25与电容22的第二极板222连接，以形成去耦回路，所述去耦回路可以去除功能器件21耦合到电源端的噪声，提高功能器件21接入电源的稳定性。
具体地，导电结构25可以包括：铜、银等导电金属、导线或电镀在导通通道24内壁上的导电镀层，当导电结构25为导电金属时，导电金属可以填满导通通道24，进而增大导电结构25的截面积，减小导电电阻，起到节约电源的作用。当导电结构25为导线时，可以节约成本，同时，导通通道24可以设置地较小，以提高封装结构23的强度。当导电结构25为导电镀层时，在起到导通第二极板222和电路板20的作用的同时，节约了成本。
可选地，电路板20可以为印制电路板(printed circuit board，PCB)或者柔性电路板，功能器件21可以为中央处理器(central processing unit，CPU)，且中央处理器焊接在印制电路板上。
综上，本发明实施例所述的电路板装置至少包括以下优点：
本发明实施例中，电路板装置包括：电路板、功能器件以及多个电容，功能器件连接在电路板的第一侧，多个电容连接于电路板的与第一侧相对的第二侧，多个电容设置于功能器件在电路板的投影区域内，多个电容的长度方向垂直于电路板，可以减少电容所占投影区域的面积，因此，同样大小的投影区域可以设置更多的电容，这样，在功能器件的体积变小，功能器件在所述电路板上的投影区域相应变小的情况下，所述投影区域内仍然能够设置较多的电容，因此，所述电容能够较好的降低功能器件耦合到电源端的噪声，提高功能器件接入电源的稳定性。
实施例二
参照图3，示出了本发明的一种电路板装置加工方法的步骤流程图之一，该方法具体可以包括如下步骤：
步骤301：将功能器件连接在电路板的第一侧，得到设有功能器件的第一电路板。
具体地，功能器件可以通过焊接的方式连接在电路板的第一侧，功能器件可以包括多个电源端和多个接地端，即多个正极和多个负极，其中，功能器件的正极焊接在电路板上，功能器件的负极通过电路板接地。
在实际应用中，电路板的第一侧可以连接多个功能器件。
步骤302：将多个电容连接于所述第一电路板的第二侧，得到电路板装置，其中，所述第二侧与所述第一侧相背设置，在垂直于第一电路板的方向上，所述电容设置于所述功能器件在所述第一电路板上的投影区域内，所述电容的长度方向与所述第一电路板相垂直。
本发明实施例中，可以通过焊接的方式将多个电容焊接连接在第一电路板的第二侧，具体地，多个电容焊接在功能器件在第一电路板上的投影区域内，电容的长度方向与第一电路板相垂直，电容靠近电路板的一端的极性由最近的功能器件的极性决定。
在实际应用中，电容还可以通过其它方式连接，只要能够实现电容在第一电路板的第二侧的连接牢固性及通电性即可，例如，电容可以通过锡膏贴片的方式固定在第一电路板的第二侧。
在实际应用中，在将功能器件连接在电路板的第一侧之后，再将多个电容连接于投影区域内。本发明实施例中，通过使电容的长度方向垂直于第一电路板，可以减少电容所占投影区域的面积，同样大小的投影区域，可以设置更多的电容。这样，在功能器件的体积变小，功能器件在第一电路板上的投影区域相应变小的情况下，所述投影区域内仍然能够设置较多的电容，因此，所述电容能够较好的降低功能器件耦合到电源端的噪声，提高功能器件接入电源的稳定性。
在实际应用中，功能器件可以有多个，每个功能器件在第一电路板上的投影区域内均设置有多个电容，其中，电容的数量可以根据功能器件电源端的数量来确定，本发明实施例对此不再限定。
在实际应用中，多个电容的容值可以不同，较大容值的电容用于去除低频的噪声，较小容值的电容用于去除高频的噪声，其中，较大容值和较小容值的电容的设置位置可以根据功能器件上电源端噪声的频率决定，例如，靠近电源端低频噪声的位置设置较大容值的电容，靠近电源端高频噪声的位置设置较小容值的电容。
综上，本发明实施例所述的电路板装置加工方法至少包括以下优点：
本发明实施例所述的电路板装置中，由于功能器件连接在电路板的第一侧，多个电容连接于电路板的与第一侧相背的第二侧，多个电容设置于功能器件在电路板的投影区域内，多个电容的长度方向垂直于电路板，可以减少电容所占投影区域的面积，因此，同样大小的投影区域可以设置更多的电容，这样，在功能器件的体积变小，功能器件在所述电路板上的投影区域相应变小的情况下，所述投影区域内仍然能够设置较多的电容，因此，所述电容能够较好的降低功能器件耦合到电源端的噪声，提高功能器件接入电源的稳定性。
实施例三
参照图4，示出了本发明的一种电路板装置加工方法的步骤流程图之二，该方法具体可以包括如下步骤：
步骤401：将功能器件连接在电路板的第一侧，得到设有所述功能器件的第一电路板。
步骤402：将多个所述电容的第一极板电连接于所述第一电路板的第二侧。
参照图5，示出了本发明的一种第一电路板的结构示意图之一。如图5所示，电容22可以通过表面贴装技术连接于第一电路板的第二侧，其中，电容22之间具有一定的间隙，通过表面贴装技术连接电容22，可以提高电容22与第一电路板连接的可靠性。
电容22第一极板221的极性由功能器件21靠近电容22的极性决定，例如，当功能器件21靠近电容22的极性是正极时，第一极板221为正极；当功能器件21靠近电容22的极性是负极时，第一极板221为负极。
步骤403：将多个所述电容的第二极板与所述第一电路板电连接，得到所述电路板装置，其中，所述第一极板设于多个所述电容沿长度方向的一端，所述第二极板设于多个所述电容沿所述长度方向的另一端，且所述第二极板远离所述第一电路板的第二侧。
本发明实施例中，电容22的第一极板221电连接于第一电路板的第二侧，电容22的第二极板222远离第一电路板的第二侧，可以保证电容22的长度方向垂直于第一电路板，使得电容22占用的投影区域的面积较小，同样大小的投影区域可以设置相对较多的电容22。这样，在功能器件21的体积变小，功能器件21在所述第一电路板上的投影区域相应变小的情况下，所述投影区域内仍然能够设置较多的电容22，因此，所述电容22能够较好的降低功能器件21耦合到电源端的噪声，提高功能器件21接入电源的稳定性。
另外，通过将电容22第一极板221的正面与第一电路板接触，可以增大第一极板221与第一电路板之间的接触面积，减少接触电阻，节约能源。
在实际应用中，电容22的第二极板222可以通过多种方式与第一电路板电连接，例如，电容22的第二极板222可以直接通过导线与第一电路板连接，也可以通过其他的导电材料进行连接，本发明实施例对此不做限定。
可选地，步骤403具体可以包括以下步骤：
首先，通过塑胶对所述第一电路板的所述第二侧面进行塑封成型，得到固定于所述第二侧面且覆盖所述电容的封装结构。
参照图6，示出了本发明的一种第一电路板的结构示意图之二。如图6所示，通过在第一电路板上将塑胶材料进行塑封成型，得到封装结构23，封装结构23覆盖在多个电容22上，并填满多个电容22之间的间隙，且封装结构23与第一电路板的第二侧面连接，封装结构23可以进一步将电容22固定到第一电路板上，防止电容22在外力作用下，发生脱落。由于塑胶材料为绝缘材料，可以防止多个电容22之间有导电的情况发生。
然后，在所述封装结构上设置导电结构，得到所述电路板装置；其中，所述第二极板通过所述导电结构与所述第一电路板电连接。
为了实现第二极板222与第一电路板的电连接，在所述第一电路板的封装结构23上蚀刻导通通道24，导通通道24分别与第二极板222和第一电路板相连，导通通道 24可以为第二极板222和电路板20之间的电连接提供空间，避免电路板装置的线路布置过于复杂，达到美观且节约成本的目的。
在实际应用中，导通通道24的一端与第二极板222连通，导通通道24的另一端与第一电路板连通，可以实现第二极板222与第一电路板的电连接。
本发明实施例中，通过低成本、高可靠性的蚀刻技术，在封装结构上蚀刻出导通通道24，导通通道24连通第二极板222和第一电路板，导通通道24为第二极板222与功能器件21之间的电连接提高空间支持，避免电路板装置的线路布置过于复杂，达到美观且节约成本的目的。
最后，在所述导通通道内设置导电结构，得到所述电路板装置；其中，所述导电结构分别与所述第二极板和所述第一电路板相连。
导通通道内设置有导电结构25，导电结构25分别与第二极板222和第一电路板相连，导电结构25起到导通第二极板222与第一电路板之间电流的作用。具体地，导电结构25可以与第一电路板的第二侧连接，也可以与第一电路板的第一侧连接，其中，当导电结构25与第一电路板的第一侧连接时，可以通过连接线或预先铺设的导通介质相连接，最终实现第二极板222与功能器件21的电连接。
在实际应用中，功能器件21靠近电容22的一极通过导通介质与电容22的第一极板221连通，电容22的第二极板222通过导电结构25与功能器件21的另一极连通，形成回路，电容22可以去除功能器件21耦合到电源端的噪声，提高功能器件21接入电源的稳定性。
具体地，导电结构25可以包括：铜、银等导电金属、导线或电镀在导通通道内壁上的导电镀层，当导电结构25为导电金属时，导电金属可以填满导通通道24，进而增大导电结构25的截面积，减小导电电阻，起到节约电源的作用。当导电结构25为导线时，可以节约成本，同时，导通通道24可以设置地较小，以提高封装结构23的强度。当导电结构25为导电镀层时，在起到导通第二极板222和电路板20的作用的同时，节约了成本。
综上，本发明实施例所述的电路板装置加工方法至少包括以下优点：
本发明实施例所述的电路板装置中，由于功能器件连接在电路板的第一侧，多个电容连接于电路板的与第一侧相背的第二侧，多个电容设置于功能器件在电路板的投影区域内，多个电容的长度方向垂直于电路板的第二侧，可以减少电容所占投影区域的面积，因此，同样大小的投影区域可以设置更多的电容，这样，在功能器件的体积变小，功能器件在所述电路板上的投影区域相应变小的情况下，所述投影区域内仍然能够设置较多的电容，因此，所述电容能够较好的降低功能器件耦合到电源端的噪声，提高功能器件接入电源的稳定性。
而且，本发明实施例中，通过将电容的第一极板连接于第一电路板的第二侧，在减小电容所占投影区域的面积的同时，可以增大第一极板与第一电路板之间的接触面积，减少接触电阻，节约能源。
需要说明的是，对于方法实施例，为了简单描述，故将其都表述为一系列的动作 组合，但是本领域技术人员应该知悉，本发明实施例并不受所描述的动作顺序的限制，因为依据本发明实施例，某些步骤可以采用其他顺序或者同时进行。其次，本领域技术人员也应该知悉，说明书中所描述的实施例均属于优选实施例，所涉及的动作并不一定是本发明实施例所必须的。
对于方法实施例而言，由于其与装置实施例基本相似，所以描述的比较简单，相关之处参见方法实施例的部分说明即可。
本说明书中的各个实施例均采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似的部分互相参见即可。
尽管已描述了本发明实施例的优选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例做出另外的变更和修改。所以，所附权利要求意欲解释为包括优选实施例以及落入本发明实施例范围的所有变更和修改。
最后，还需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者终端设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者终端设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者终端设备中还存在另外的相同要素。
以上对本发明所提供的一种电路板装置及其加工方法和移动终端，进行了详细介绍，本文中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明的方法及其核心思想；同时，对于本领域的一般技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本发明的限制。

Claims (10)

  1. 一种电路板装置，其特征在于，包括：电路板、功能器件以及多个电容；其中，
    所述功能器件连接在所述电路板的第一侧；
    多个所述电容连接于所述电路板的第二侧，所述第二侧与所述第一侧相背设置，在垂直所述电路板的方向上，所述电容设置于所述功能器件在所述电路板上的投影区域内，所述电容的长度方向与所述电路板相垂直。
  2. 根据权利要求1所述的电路板装置，其特征在于，所述电容沿所述长度方向的一端设有第一极板，所述电容沿所述长度方向的另一端设有第二极板；
    所述第一极板连接于所述电路板的第二侧，所述第二极板远离所述电路板的第二侧，且与所述电路板电连接。
  3. 根据权利要求2所述的电路板装置，其特征在于，所述电路板装置还包括：封装结构，所述封装结构覆盖多个所述电容，且与所述电路板的第二侧连接；其中，
    所述封装结构上设置有导电结构，所述第二极板通过所述导电结构与所述电路板相连。
  4. 根据权利要求3所述的电路板装置，其特征在于，所述封装结构开设有导通通道，所述导通通道内设置有所述导电结构。
  5. 根据权利要求4所述的电路板装置，其特征在于，所述导电结构为：导电金属、导线或电镀在所述导通通道内壁上的导电镀层。
  6. 一种电路板装置的加工方法，其特征在于，包括：
    将功能器件连接在电路板的第一侧，得到设有所述功能器件的第一电路板；
    将多个电容连接于所述第一电路板的第二侧，得到电路板装置；其中，所述第二侧与所述第一侧相背设置，在垂直于所述第一电路板的方向上，所述电容设置于所述功能器件在所述第一电路板上的投影区域内，所述电容的长度方向与所述第一电路板相垂直。
  7. 根据权利要求6所述的方法，其特征在于，所述将多个电容连接于所述第一电路板的第二侧，得到电路板装置的步骤，包括：
    将多个所述电容的第一极板电连接于所述第一电路板的第二侧；
    将多个所述电容的第二极板与所述第一电路板电连接，得到所述电路板装置；其中，所述第一极板设于多个所述电容沿长度方向的一端，所述第二极板设于多个所述电容沿所述长度方向的另一端，且所述第二极板远离所述第一电路板的第二侧。
  8. 根据权利要求7所述的方法，其特征在于，所述将多个所述电容的第二极板与所述第一电路板电连接，得到电路板装置的步骤，包括：
    通过塑胶对所述第一电路板的所述第二侧面进行塑封成型，得到固定于所述第二侧面且覆盖所述电容的封装结构；
    在所述封装结构上设置导电结构，得到所述电路板装置；其中，所述第二极板通过所述导电结构与所述第一电路板电连接。
  9. 根据权利要求8所述的方法，其特征在于，包括：
    在所述第一电路板的封装结构上蚀刻导通通道，所述导通通道分别与所述第二极板和所述第一电路板相连接；
    在所述导通通道内设置导电结构，得到所述电路板装置。
  10. 一种电子设备，其特征在于，包括如权利要求1至5任一项所述的电路板装置。
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