WO2021082534A1 - 显示面板及显示装置 - Google Patents

显示面板及显示装置 Download PDF

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Publication number
WO2021082534A1
WO2021082534A1 PCT/CN2020/102697 CN2020102697W WO2021082534A1 WO 2021082534 A1 WO2021082534 A1 WO 2021082534A1 CN 2020102697 W CN2020102697 W CN 2020102697W WO 2021082534 A1 WO2021082534 A1 WO 2021082534A1
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WIPO (PCT)
Prior art keywords
same
pixel group
color pixel
interconnection structure
electrode
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Application number
PCT/CN2020/102697
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English (en)
French (fr)
Inventor
楼均辉
籍亚男
Original Assignee
昆山国显光电有限公司
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Publication date
Application filed by 昆山国显光电有限公司 filed Critical 昆山国显光电有限公司
Priority to JP2021566231A priority Critical patent/JP7280979B2/ja
Priority to KR1020217035806A priority patent/KR20210138780A/ko
Priority to EP20881840.1A priority patent/EP3951882A4/en
Publication of WO2021082534A1 publication Critical patent/WO2021082534A1/zh
Priority to US17/500,132 priority patent/US11645966B2/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/353—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels characterised by the geometrical arrangement of the RGB subpixels
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/2007—Display of intermediate tones
    • G09G3/2074—Display of intermediate tones using sub-pixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/81—Electrodes
    • H10K30/82—Transparent electrodes, e.g. indium tin oxide [ITO] electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1216—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/128—Active-matrix OLED [AMOLED] displays comprising two independent displays, e.g. for emitting information from two major sides of the display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0421—Structural details of the set of electrodes
    • G09G2300/0426—Layout of electrodes and connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • This application relates to the field of display, in particular to a display panel and a display device.
  • Electronic devices such as mobile phones and tablet computers need to integrate front-facing cameras, earpieces, and infrared sensing components.
  • a notch or hole can be formed on the display screen, and external light can enter the photosensitive element located under the screen through the notch or hole on the screen.
  • these electronic devices are not full screens in the true sense, and cannot be displayed in all areas of the entire screen. For example, the corresponding area of the front camera cannot display pictures.
  • a first aspect of the present application provides a display panel having a first display area and a second display area.
  • the first display area includes a central area and an edge area adjacent to the central area.
  • the light transmittance of the first display area is greater than
  • the display panel includes:
  • each repeating unit includes at least two pixels, each pixel includes at least three colors of sub-pixels, and each sub-pixel includes a first electrode, a light-emitting structure, and a second electrode stacked in sequence;
  • the first electrodes of adjacent sub-pixels of the same color in the repeating unit are electrically connected through the interconnection structure to form a pixel group of the same color.
  • the interconnection structure of the pixel group of the same color of at least one color is a transparent conductive structure.
  • the light transmittance of the first display area is greater than the light transmittance of the second display area, so that the display panel can integrate photosensitive components on the back of the first display area, so as to realize the screen of the photosensitive components of the camera.
  • the first display area can display pictures, increase the display area of the display panel, and realize the full-screen design of the display device.
  • the first electrodes of adjacent sub-pixels of the same color in the repeating unit in the first display area are electrically connected through the interconnection structure to form a pixel group of the same color.
  • the multiple pixels included in the repeating unit in the first display area become one pixel, so that the actual pixel density (Pixels Per Inch, PPI) of the first display area can be reduced, wherein only the same color pixel groups in the repeating unit are needed.
  • a plurality of sub-pixels are connected to a pixel circuit, which reduces the number of wires in the first display area and facilitates the improvement of the light transmittance of the first display area.
  • the interconnection structure of at least one color of the same color pixel group is a transparent conductive structure, which can further improve the light transmittance in the central area of the first display area.
  • FIG. 1 shows a schematic top view of a display panel according to an embodiment of the present application
  • Fig. 2 shows a partial enlarged view of area Q in Fig. 1 provided by an example
  • Fig. 3 shows a partial enlarged view of the Q area in Fig. 1 provided by another example
  • Fig. 4 shows a cross-sectional view in the direction B-B in Fig. 2 provided by the first example
  • Fig. 5 shows a cross-sectional view in the direction B-B in Fig. 2 provided by the second example
  • Fig. 6 shows a cross-sectional view in the direction B-B in Fig. 2 provided by the third example
  • Fig. 7 shows a cross-sectional view in the direction B-B in Fig. 2 provided by the fourth example
  • FIG. 8 shows a schematic top view of a display device according to an embodiment of the present application.
  • Fig. 9 shows a cross-sectional view along the line C-C in Fig. 8 provided by an example.
  • a light-transmitting display area may be provided on the above-mentioned electronic device, and the photosensitive component may be arranged on the back of the light-transmitting display area, and a full-screen display of the electronic device can be realized under the condition of ensuring the normal operation of the photosensitive component.
  • the sub-pixel combination in the light-transmitting display area has the problem that the light transmittance of the light-transmitting display area is not high.
  • the embodiments of the present application provide a display panel and a display device.
  • the embodiments of the display panel and the display device will be described below with reference to the accompanying drawings.
  • An embodiment of the application provides a display panel, which may be an organic light emitting diode (OLED) display panel.
  • a display panel which may be an organic light emitting diode (OLED) display panel.
  • FIG. 1 shows a schematic top view of a display panel provided according to an embodiment of the present application
  • FIG. 2 shows a partial enlarged view of the Q area in FIG. 1 provided by an example
  • Fig. 3 shows a partial enlarged view of the Q area in Fig. 1 provided by another example
  • Fig. 4 to Fig. 7 show the cross-sectional views along the B-B direction in Fig. 2 provided by four examples.
  • the display panel 100 has a first display area AA1, a second display area AA2, and a non-display area NA surrounding the first display area AA1 and the second display area AA2.
  • the light transmittance of the first display area AA1 is greater than The light transmittance of the second display area AA2.
  • the light transmittance of the first display area AA1 is greater than or equal to 15%.
  • the light transmittance of each functional film layer of the display panel 100 in this embodiment is greater than 80%. Even at least part of the functional film has a light transmittance greater than 90%.
  • the light transmittance of the first display area AA1 is greater than the light transmittance of the second display area AA2, so that the display panel 100 can integrate photosensitive components on the back of the first display area AA1 to realize, for example, a camera
  • the light-sensitive components are integrated under the screen, and the first display area AA1 can display images, which increases the display area of the display panel 100 and realizes a full-screen design of the display device.
  • the first display area AA1 includes a central area AA11 and an edge area AA12 adjacent to the central area AA11.
  • the back surface of the first display area AA1 integrates photosensitive components, and the light transmittance requirement of the central area AA11 is higher than that of the edge area AA12.
  • the specific position, shape and size of the central area AA11 can be set according to the specific position of the photosensitive component.
  • the display panel 100 includes a plurality of repeating units 10, and the repeating unit 10 includes at least two pixels 110.
  • Each pixel 110 includes at least three colors of sub-pixels 101, 102, 103.
  • Each sub-pixel 101, 102, 103 includes a first electrode 112, a light-emitting structure 111, and a second electrode 113 stacked in sequence.
  • the first electrodes 112 of the adjacent sub-pixels 101, 102, and 103 of the same color in the repeating unit 10 are electrically connected through the interconnection structures 201, 202, and 203 to form the same-color pixel group 01, 02, 03 .
  • FIG. 2 shows that the same-color pixel group 01 includes four first-color sub-pixels 101 and three interconnection structures 201, and the same-color pixel group 02 includes four second-color sub-pixels 102 and three interconnection structures. 202.
  • the pixel group 03 of the same color includes four sub-pixels 103 of the third color and three interconnection structures 203. In this way, the multiple sub-pixels interconnected by the first electrode 112 form a pixel combined structure.
  • Multiple sub-pixels included in a pixel group of the same color of one color can be electrically connected to the same pixel circuit, thereby controlling the display of multiple interconnected sub-pixels through one pixel circuit, further reducing the actual PPI of the first display area AA1 and reducing the first display
  • the drive wiring in area AA1 improves its light transmittance.
  • the interconnection structure of at least one color of the same color pixel group is a transparent conductive structure, which can further improve the light transmittance of the central area AA11.
  • the transparent conductive structure can be made of ITO.
  • the display panel includes a substrate 301, and pixels 110 are disposed on the substrate 301.
  • the pixel 110 includes three color sub-pixels, which are a first color sub-pixel 101, a second color sub-pixel 102, and a third color sub-pixel 103, respectively.
  • the same-color pixel group includes a first same-color pixel group 01 of a first color, a second same-color pixel group 02 of a second color, and a third same-color pixel group 03 of a third color.
  • the orthographic projections of the interconnection structure 201 of the first same-color pixel group 01 and the interconnection structure 202 of the second same-color pixel group 02 on the substrate 301 do not intersect. Further, the interconnection structure of the third same-color pixel group 03 intersects the orthographic projections of the interconnection structure 201 of the first same-color pixel group 01 and the interconnection structure 202 of the second same-color pixel group 02 on the substrate 301. Or, the orthographic projections of the interconnect structure 201 of the first same-color pixel group 01 and the interconnection structure 202 of the second same-color pixel group 02 on the substrate 301 do not intersect.
  • the interconnection structure of the same-color pixel groups of two of the three colors is set such that the orthographic projections on the substrate do not intersect.
  • the interconnection structures of the same-color pixel groups of two colors can be arranged in the same layer, and these interconnection structures can be formed in the same process step, thereby reducing the complexity of the manufacturing process.
  • the interconnection structures whose orthographic projections intersect on the substrate can be arranged in different layers, which can prevent the interconnection structures whose orthographic projections intersect on the substrate are arranged on the same layer from affecting the normal operation of the same color pixel group.
  • the interconnection structure of at least one color of the same color pixel group is a transparent conductive structure
  • the interconnection structure of the central area AA11 and the edge area AA12 may include at least the following settings the way.
  • the interconnection structure of the central area AA11 can be arranged in at least the following two ways.
  • the first setting method :
  • the interconnection structure 201 of the first same-color pixel group 01 and the interconnection structure 202 of the second same-color pixel group 02 are transparent conductive structures arranged in the same layer as the first electrode 112.
  • the interconnection structure 203 of the third same-color pixel group 03 is different from the interconnection structure 201 of the first same-color pixel group 01 and the interconnection structure 202 of the second same-color pixel group 02 in different layers.
  • the interconnection structure 201 of the first same-color pixel group 01 and the interconnection structure 202 of the second same-color pixel group 02 are transparent conductive structures disposed under the first electrode 112, and the interconnection structure of the third same-color pixel group 03
  • the interconnection structure 203 is different from the interconnection structure 201 of the first same-color pixel group 01 and the interconnection structure 202 of the second same-color pixel group 02 in different layers.
  • the interconnection structure 201 of the first same-color pixel group 01 and the interconnection structure 202 of the second same-color pixel group 02 are the same layer or different layers disposed under the first electrode 112.
  • the interconnection structure of the edge area AA12 can be arranged in at least the following two ways.
  • the first setting method :
  • the interconnection structure 201 of the first same-color pixel group 01 and the interconnection structure 202 of the second same-color pixel group 02 are arranged in the same layer as the first electrode 112.
  • the interconnection structure 203 of the third same-color pixel group 03 is arranged in different layers from the interconnection structure 201 of the first same-color pixel group 01 and the interconnection structure 202 of the second same-color pixel group 02.
  • the first same-color pixel group 01 and the interconnection structure 202 of the second same-color pixel group 02 are arranged in the same layer as the first electrode 112, the first same-color pixel group
  • the material of the interconnect structure 201 of 01 and the interconnect structure 202 of the second same-color pixel group 02 may be the same or different from the material of the first electrode 112, and may also be a transparent conductive structure.
  • the interconnection structure 201 of the first same-color pixel group 01 and the interconnection structure 202 of the second same-color pixel group 02 are transparent conductive structures disposed under the first electrode 112.
  • the interconnection structure 203 of the third same-color pixel group 03 is arranged in different layers from the interconnection structure 201 of the first same-color pixel group 01 and the interconnection structure 202 of the second same-color pixel group 02.
  • the interconnection structure 201 of the first same-color pixel group 01 and the interconnection structure 202 of the second same-color pixel group 02 may be the same layer or different layers disposed under the first electrode 112.
  • the pixel groups of the same color in the first display area AA1 are connected to the corresponding pixel circuits through wires.
  • the lead can be a transparent conductive structure, such as ITO (Indium Tin Oxides).
  • ITO Indium Tin Oxides
  • the first same-color pixel group 01 is connected to a corresponding pixel circuit (not shown in the figure) through a lead 2011, the second same-color pixel group 02 is connected to a corresponding pixel circuit through a lead 2021, and the third same-color pixel The group 03 is connected to the corresponding pixel circuit through the lead 2031.
  • the pixel circuit controls the display of each sub-pixel of the same color pixel group through the corresponding lead.
  • the leads 2011, 2021, and 2031 are all transparent conductive structures to improve the light transmittance of the first display area AA1.
  • the two setting methods of AA12 can be combined in any way.
  • the above two setting methods of the central area AA11 and the two setting methods of the edge area AA12 are combined as follows.
  • the pixel density of the first display area AA1 is relatively small, such as 100 PPI or less, and the spacing between the sub-pixels will be relatively large, so that there is enough space for wiring lines.
  • the first setting method of the central area AA11 and the first setting method of the edge area AA12 are adopted.
  • the material of the interconnection structure 201 of the first same-color pixel group 01 and the interconnection structure 202 of the second same-color pixel group 02 may be the same or different from the material of the first electrode 112, or may be a transparent conductive structure.
  • the central area AA11 and the edge area AA12 adopt the same arrangement, that is, the central area AA11 and the edge area AA12 adopt the first combination method, and the first same-color pixel group in the central area AA11 and the edge area AA12 can be combined.
  • the leads 2011 and 2021 corresponding to the second pixel group 02 of the same color are arranged as a transparent conductive structure on the same layer as the first electrode 112.
  • the interconnection structure 201 of the first same-color pixel group 01 and the interconnection structure 202 of the second same-color pixel group 02 in the central area AA11 and the edge area AA12 can be configured as transparent conductive structures.
  • the interconnect structures 201 and 202 and the leads 2011 and 2021 of the entire first display area AA1 can be formed in the same process step, thereby reducing the complexity of the manufacturing process.
  • the light transmittance of the entire first display area AA1 can be improved.
  • the leads 2031 corresponding to the third pixel group 03 of the same color in the central area AA11 and the edge area AA12 may be arranged as a transparent conductive structure in the same layer as the first electrode 112, or the third area of the central area AA11 and the edge area AA12.
  • the leads 2031 corresponding to the same-color pixel group 03 may be set as a transparent conductive structure on the same layer as the interconnection structure 203 of the third same-color pixel group 03.
  • the pixel density of the first display area AA1 is relatively large, for example, greater than 100 PPI, and the spacing between the sub-pixels will be relatively small, so there is not enough space for wiring.
  • the second setting method of the central area AA11 and the first setting method of the edge area AA12 are adopted.
  • the material of the interconnection structure 201 of the first same-color pixel group 01 and the interconnection structure 202 of the second same-color pixel group 02 may be the same or different from the material of the first electrode 112, or may be a transparent conductive structure.
  • the central area AA11 and the edge area AA12 are arranged in different ways.
  • the interconnection structures 201 and 202 of the edge area AA12 are arranged in the same layer as the first electrode 112, which can leave enough space under the first electrode 112 of the edge area AA12 Lay out the leads.
  • the interconnection structure 201 of the first same-color pixel group 01 and the interconnection structure 202 of the second same-color pixel group 02 in the edge area AA12 are both set to the same material as the first electrode 112, and the same process can be used. In the step, the interconnection structures 201 and 202 and the first electrode 112 of the edge area AA12 are formed, thereby reducing the complexity of the manufacturing process.
  • the leads 2011 and 2021 corresponding to the first same-color pixel group 01 and the second same-color pixel group 02 in the central area AA11 are the interconnection structure 201 and the first same-color pixel group 01 in the central area AA11.
  • the interconnection structure 202 of the two-color pixel group 02 is a transparent conductive structure arranged in the same layer. That is, the interconnect structures 201 and 202 of the central area AA11 and the corresponding leads 2011 and 2021 are all arranged in the same layer under the first electrode 112, and they are all transparent conductive structures, and the central area AA11 can be formed in the same process step.
  • the interconnection structures 201 and 202 and the leads 2011 and 2021 can reduce the complexity of the manufacturing process.
  • the pixel density of the first display area AA1 is relatively small, such as 100 PPI or less, and the spacing between the sub-pixels will be relatively large, so that there is enough space for wiring lines.
  • the second setting method of the central area AA11 and the second setting method of the edge area AA12 are adopted.
  • the interconnection structures 201 and 202 of the central area AA11 and the edge area AA12 are both located under the first electrode 112.
  • the interconnection structure 202 of the two-color pixel group 02 is located in the same layer under the first electrode 112.
  • the leads 2011 and 2021 corresponding to the first same-color pixel group 01 and the second same-color pixel group 02 in the central area AA11 are the interconnection structures 201 and the second same-color pixel group 01 in the central area AA11.
  • the interconnection structure 202 of the two-color pixel group 02 is a transparent conductive structure arranged in the same layer.
  • the leads 2011 and 2021 corresponding to the first same-color pixel group 01 and the second same-color pixel group 02 in the edge area AA12 are interconnect structures 201 and the first same-color pixel group 01 in the edge area AA12.
  • the interconnection structure 202 of the two-color pixel group 02 is a transparent conductive structure arranged in the same layer.
  • the interconnection structure 201 of the first same-color pixel group 01, the corresponding lead 2011 and the interconnection structure 202 of the second same-color pixel group 02, and the corresponding lead 2021 in the central area AA11 and the edge area AA12 They are all arranged as transparent conductive structures on the same layer. In this way, the interconnect structures 201 and 202 and the leads 2011 and 2021 of the entire first display area AA1 can be formed in the same process step, thereby reducing the complexity of the manufacturing process. In addition, the light transmittance of the entire first display area AA1 can be improved.
  • the pixel density of the first display area AA1 is relatively large, for example, greater than 100 PPI, and the spacing between the sub-pixels will be relatively small, so there is not enough space for wiring.
  • the first setting method of the central area AA11 and the second setting method of the edge area AA12 are adopted.
  • the central area AA11 and the edge area AA12 are arranged in different ways.
  • the interconnection structures 201 and 202 of the edge area AA12 are arranged below the first electrode 112, which can leave enough space on the layer where the first electrode 112 of the edge area AA12 is located. The space to arrange the leads.
  • interconnection structure 201 of the first same-color pixel group 01 and the interconnection structure 202 of the second same-color pixel group 02 in the edge area AA12 are both configured as transparent conductive structures, thereby improving the light transmittance of the entire first display area AA1 rate.
  • the leads 2011 and 2021 corresponding to the first same-color pixel group 01 and the second same-color pixel group 02 in the central area AA11 are transparent conductive structures arranged on the same layer as the first electrode 112.
  • the interconnection structures 201, 202 and the corresponding leads 2011 and 2021 of the central area AA11 are in the same layer as the first electrode 112, and the interconnection structures 201, 202 and the corresponding leads 2011 and 2021 of the central area AA11 can be formed in the same process step, thereby The complexity of the preparation process can be reduced.
  • the leads 2011 and 2021 corresponding to the first same-color pixel group 01 and the second same-color pixel group 02 in the edge area AA12 are interconnect structures 201 and the second same-color pixel group 01 in the edge area AA12.
  • the interconnection structure 202 of the two-color pixel group 02 is a transparent conductive structure arranged in the same layer. In this way, the interconnect structures 201 and 202 of the edge area AA12 and the corresponding leads 2011 and 2021 can be formed in the same process step, thereby reducing the complexity of the manufacturing process.
  • the display panel includes a substrate 301, a device layer 302, and a pixel definition layer 303.
  • the device layer 302 is located on the substrate 301, and the pixel definition layer 303 is located on the device layer 302.
  • the pixel circuit corresponding to each sub-pixel of the first display area AA1 is located in the device layer 302 of the second display area AA2 (not shown in the figure).
  • the device layer 302 includes a planarization layer 3022 and at least one metal layer 3021, and the metal layer 3021 is located between the planarization layer 3022 and the substrate 301.
  • One metal layer 3021 of the at least one metal layer 3021 is the interconnection structure 203 of the third same-color pixel group 03 in the central area AA11 and the edge area AA12.
  • the interconnection structure 203 of the third same-color pixel group 03 is electrically connected to the corresponding first electrode 112 through a via hole.
  • the metal layer 3021 can be the upper electrode plate of the capacitor, and it is only necessary to form a via structure in the preparation process to connect the corresponding first electrode and the upper electrode plate of the capacitor, thereby forming the interconnection structure 203 of the third same-color pixel group 03, which simplifies Preparation Process.
  • the interconnection structures 201 and 202 in the central area AA11 and/or the edge area AA12 are arranged in the same layer as the first electrode 112, they may be located above the planarization layer 3022.
  • the interconnection structures 201 and 202 of the central area AA11 and/or the edge area AA12 are located under the first electrode 112, they may be located under the planarization layer 3022.
  • the interconnection structures 201 and 202 are located below the first electrode 112, they are electrically connected to the corresponding first electrode 112 through the via hole.
  • the second display area AA2 includes a first sub display area AA21 and a second sub display area AA22 adjacent to the first sub display area AA21 and the first display area AA1.
  • the pixel circuits corresponding to the sub pixels of the first display area AA1 are arranged in the second display area AA1. In the sub-display area AA22. It can be understood that the number of pixel circuits corresponding to the sub-pixels of the first display area AA1 may be multiple, and they are respectively electrically connected to corresponding pixel groups of the same color.
  • the circuit structure of the pixel circuit includes 1 thin film transistor, 2 thin film transistors and 1 capacitor, 3 thin film transistors and 1 capacitor, 6 thin film transistors and 1 capacitor, 6 thin film transistors and 2 capacitors, and 7 thin film transistors. Transistor and 1 capacitor, 7 thin film transistors and 2 capacitors, or 9 thin film transistors and 1 capacitor.
  • the circuit structure of the pixel circuit includes 2 thin film transistors (T) and 1 capacitor (C), which means that the circuit structure of the pixel circuit is "2T1C circuit", other "7T1C circuit”, “7T2C circuit”, “9T1C circuit” "And so on.
  • the pixel circuit for driving the display of each sub-pixel of the same color pixel group is located in the second sub-display area AA22, thereby reducing the wiring structure in the first display area AA1, thereby increasing the first display area The light transmittance of AA1.
  • the at least two pixels 110 included in the repeating unit 10 are alternately distributed in the first direction D1, and the sub-pixels of any two adjacent pixels 110 are arranged along the second direction D2 and are misaligned in the first direction D1.
  • D1 intersects the second direction D2.
  • the first direction D1 is perpendicular to the second direction D2, the first direction D1 may be a row direction or a column direction, and the corresponding second direction D2 may be a column direction or a row direction.
  • the color sequence of the sub-pixels of any two adjacent pixels 110 arranged along the second direction D2 is different.
  • the repeating unit 10 includes four pixels 110, and each pixel 110 includes sub-pixels of three colors.
  • the color sequence of the sub-pixels of the first pixel 110 on the left along the second direction D2 may be red sub-pixels, green sub-pixels, and blue sub-pixels.
  • the color sequence of the sub-pixels of the second pixel 110 on the left that are arranged along the second direction D2 may be blue sub-pixels, red sub-pixels, and green sub-pixels.
  • the color sequence of the sub-pixels of the first pixel 110 on the right along the second direction D2 is the same as that of the second pixel 110 on the left, and the color sequence of the sub-pixels of the second pixel 110 on the right along the second direction D2 is the same as that of the sub-pixels of the second pixel 110 on the right.
  • the order of the first pixel 110 on the left is the same.
  • the colors of the sub-pixels adjacently arranged in the second direction in the first display area AA1 are all different, and the sub-pixels of the same color are distributed more uniformly, which can avoid the occurrence of multiple sub-pixels in a certain area of the first display area AA1.
  • the adjacent sub-pixels of the same color cause uneven color distribution during the display of the first display area AA1, which in turn leads to the problem of single-color bright bars in this area, which can improve the display effect of the first display area AA1.
  • the substrate 301 may be made of light-transmitting materials such as glass and polyimide (PI).
  • the device layer 302 of the second display area AA2 may include a pixel circuit for driving each sub-pixel to display.
  • the pixel definition layer 303 includes a first pixel opening K1 located in the first display area AA1. In some embodiments, the pixel definition layer 303 includes a second pixel opening located in the second display area AA2.
  • Each sub-pixel 101, 102, 103 includes a light emitting structure 111, a first electrode 112, and a second electrode 113.
  • the light emitting structure 111 of the first display area AA1 is located in the first pixel opening K1
  • the first electrode 112 is located on the side of the light emitting structure 111 facing the substrate 301
  • the second electrode 113 is located on the side of the light emitting structure 111 away from the substrate 301 .
  • One of the first electrode 112 and the second electrode 113 is an anode, and the other is a cathode.
  • the first electrode 112 is an anode and the second electrode 113 is a cathode as an example for description.
  • the light emitting structure 111 may include an OLED light emitting layer. According to the design requirements of the light emitting structure 111, it may also include at least one of a hole injection layer, a hole transport layer, an electron injection layer, or an electron transport layer.
  • the first electrode 112 is a light-transmitting electrode.
  • the first electrode 112 includes an indium tin oxide (Indium Tin Oxide, ITO) layer or an indium zinc oxide layer.
  • the first electrode 112 is a reflective electrode, and includes a first light-transmitting conductive layer, a reflective layer on the first light-transmitting conductive layer, and a second light-transmitting conductive layer on the reflective layer.
  • the first light-transmitting conductive layer and the second light-transmitting conductive layer may be ITO, indium zinc oxide, etc.
  • the reflective layer may be a metal layer, for example, made of silver.
  • the second electrode 113 includes a magnesium-silver alloy layer. In some embodiments, the second electrode 113 may be interconnected as a common electrode.
  • the orthographic projection of each light-emitting structure 111 of the first display area AA1 on the substrate 301 is composed of one first graphic unit or a splicing of two or more first graphic units.
  • the first graphic unit includes a circle or an ellipse. At least one selected from the group consisting of, dumbbell, gourd, and rectangle.
  • the orthographic projection of each first electrode 112 of the first display area AA1 on the substrate 301 is composed of a second graphic unit or a splicing of two or more second graphic units.
  • the second graphic unit includes a circle or an ellipse. At least one selected from the group consisting of a shape, a dumbbell, a gourd shape, and a rectangle.
  • the above shape can change the periodic structure produced by diffraction, that is, change the distribution of the diffraction field, thereby reducing the diffraction effect generated when external incident light passes through the first display area AA1, thereby ensuring that the camera set below the first display area AA1 takes pictures.
  • the image has high definition.
  • the display panel 100 may also include an encapsulation layer and a polarizer and a cover plate located above the encapsulation layer.
  • the cover plate may also be directly disposed above the encapsulation layer without a polarizer, or at least in the first display area AA1.
  • a cover plate is directly arranged above the encapsulation layer, and there is no need to provide a polarizer, so as to prevent the polarizer from affecting the light collection amount of the photosensitive element arranged below the first display area AA1.
  • a polarizer can also be arranged above the encapsulation layer of the first display area AA1.
  • the embodiment of the present application also provides a display device, which may include the display panel 100 of any one of the foregoing embodiments.
  • a display device which may include the display panel 100 of any one of the foregoing embodiments.
  • the following will take a display device of an embodiment as an example for description.
  • the display device includes the display panel 100 of the above-mentioned embodiment.
  • FIG. 8 shows a schematic top view of a display device provided according to an embodiment of the present application.
  • Fig. 9 shows a cross-sectional view along the line C-C in Fig. 8 provided by an embodiment.
  • the display panel 100 may be the display panel 100 of one of the foregoing embodiments.
  • the display panel 100 has a first display area AA1 and a second display area AA2, and the light transmittance of the first display area AA1 is greater than the light transmittance of the second display area AA2.
  • the display panel 100 includes a first surface S1 and a second surface S2 opposed to each other.
  • the first surface S1 is the display surface.
  • the display device also includes a photosensitive assembly 200.
  • the photosensitive component 200 is located on the second surface S2 side of the display panel 100, and the photosensitive component 200 corresponds to the position of the first display area AA1.
  • the photosensitive component 200 may be an image capturing device for capturing external image information.
  • the photosensitive component 200 is a complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor, CMOS) image acquisition device.
  • the photosensitive component 200 may also be a charge-coupled device (CCD) Image acquisition devices and other forms of image acquisition devices.
  • the photosensitive component 200 may not be limited to an image acquisition device.
  • the photosensitive component 200 may also be an infrared sensor, a proximity sensor, an infrared lens, a flood light sensor, an ambient light sensor, and a dot-matrix projector.
  • the display device may also integrate other components on the second surface S2 of the display panel 100, such as a receiver, a speaker, and the like.
  • the light transmittance of the first display area AA1 is greater than the light transmittance of the second display area AA2, so that the display panel 100 can integrate the photosensitive component 200 on the back of the first display area AA1.
  • image The photosensitive component 200 of the acquisition device is integrated under the screen, and the first display area AA1 can display images, which increases the display area of the display panel 100 and realizes a full-screen design of the display device.
  • the first electrodes of adjacent sub-pixels of the same color in the repeating unit 10 in the first display area AA1 are electrically connected through an interconnection structure to form a pixel group of the same color.
  • the multiple pixels included in the repeating unit in the first display area become one pixel, so that the actual PPI (Pixel Per Inch) of the first display area AA1 can be reduced.
  • PPI Pixel Per Inch
  • the interconnection structure of at least one color of the same color pixel group is a transparent conductive structure, which can further increase the light transmittance of the central area AA11 of the first display area AA1 and reduce the photographing effect Impact.

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Abstract

本申请公开了一种显示面板及显示装置。该显示面板具有第一显示区以及第二显示区，第一显示区包括中心区域及与中心区域相邻的边缘区域，第一显示区的透光率大于第二显示区的透光率，显示面板包括多个重复单元，各重复单元包括至少两个像素，每个像素至少包括三种颜色的子像素，各子像素包括依次层叠设置的第一电极、发光结构及第二电极；在第一显示区、重复单元中相同颜色的相邻子像素的第一电极通过互连结构电连接，以形成同色像素组；其中，在中心区域中，至少一种颜色的同色像素组的互连结构为透明导电结构。根据本申请实施例提供的显示面板，能够进一步增强中心区域的透光率。

Description

显示面板及显示装置
相关申请的交叉引用
本申请要求享有于2019年10月29日提交的名称为“显示面板及显示装置”的中国专利申请第201911038962.5号的优先权，该申请的全部内容通过引用并入本文中。
技术领域
本申请涉及显示领域，具体涉及一种显示面板及显示装置。
背景技术
随着电子设备的快速发展，用户对屏占比的要求越来越高，使得电子设备的全面屏显示受到业界越来越多的关注。
电子设备如手机、平板电脑等，由于需要集成诸如前置摄像头、听筒以及红外感应元件等。现有技术中，可通过在显示屏上开槽(Notch)或开孔，外界光线可通过屏幕上的开槽或开孔进入位于屏幕下方的感光元件。但是这些电子设备均不是真正意义上的全面屏，并不能在整个屏幕的各个区域均进行显示，例如其前置摄像头对应区域不能显示画面。
发明内容
本申请的第一方面提供一种显示面板，其具有第一显示区以及第二显示区，第一显示区包括中心区域及与中心区域相邻的边缘区域，第一显示区的透光率大于第二显示区的透光率，显示面板包括：
多个重复单元，各重复单元包括至少两个像素，每个像素至少包括三种颜色的子像素，各子像素包括依次层叠设置的第一电极、发光结构及第二电极；
在第一显示区中，重复单元中相同颜色的相邻子像素的第一电极通过互连结构电连接，以形成同色像素组。
根据本申请第一方面的任一实施方式，在中心区域中，至少一种颜色的同色像素组的互连结构为透明导电结构。
根据本申请实施例的显示面板，第一显示区的透光率大于第二显示区的透光率，使得显示面板在第一显示区的背面可以集成感光组件，实现例如摄像头的感光组件的屏下集成，同时第一显示区能够显示画面，提高显示面板的显示面积，实现显示装置的全面屏设计。
根据本申请实施例的显示面板，第一显示区内的重复单元中相同颜色的相邻子像素的第一电极通过互连结构电连接，形成同色像素组。如此，第一显示区内的重复单元包括的多个像素变为一个像素，使得第一显示区的实际像素密度(Pixels Per Inch，PPI)能够降低，其中仅需要将重复单元中的同色像素组的多个子像素与一个像素电路连接，减少了第一显示区中的走线数量，便于提升第一显示区的透光率。
在中心区域中，至少一种颜色的同色像素组的互连结构为透明导电结构，能够进一步提升第一显示区的中心区域内的透光率。
附图说明
通过阅读以下参照附图对非限制性实施例所作的详细描述，本申请的其它特征、目的和优点将会变得更明显，其中，相同或相似的附图标记表示相同或相似的特征，附图并未按照实际的比例绘制。
图1示出根据本申请实施例的显示面板的俯视示意图；
图2示出一种示例提供的图1中Q区域的局部放大图；
图3示出另一种示例提供的图1中Q区域的局部放大图；
图4示出第一种示例提供的图2中B-B向的剖面图；
图5示出第二种示例提供的图2中B-B向的剖面图；
图6示出第三种示例提供的图2中B-B向的剖面图；
图7示出第四种示例提供的图2中B-B向的剖面图；
图8示出根据本申请实施例的显示装置的俯视示意图；
图9示出一种示例提供的图8中C-C向的剖面图。
具体实施方式
下面将详细描述本申请的各个方面的特征和示例性实施例，为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及具体实施例，对本申请进行进一步详细描述。应理解，此处所描述的具体实施例仅意在解释本申请，而不是限定本申请。对于本领域技术人员来说，本申请可以在不需要这些具体细节中的一些细节的情况下实施。下面对实施例的描述仅仅是为了通过示出本申请的示例来提供对本申请更好的理解。
在诸如手机和平板电脑等电子设备上，需要在设置显示面板的一侧集成诸如前置摄像头、红外光传感器、接近光传感器等感光组件。在一些实施例中，可以在上述电子设备上设置透光显示区，将感光组件设置在透光显示区背面，在保证感光组件正常工作的情况下，实现电子设备的全面屏显示。
为提高透光显示区的透光率、便于布置透光显示区内子像素的像素驱动电路，往往需要将透光显示区内的子像素进行合并。但是，透光显示区内的子像素合并方式存在透光显示区的透光率不高的问题。
为解决上述问题，本申请实施例提供了一种显示面板及显示装置，以下将结合附图对显示面板及显示装置的各实施例进行说明。
本申请实施例提供一种显示面板，该显示面板可以是有机发光二极管(Organic Light Emitting Diode，OLED)显示面板。
图1示出根据本申请一种实施例提供的显示面板的俯视示意图，图2示出一种示例提供的图1中Q区域的局部放大图。图3示出另一种示例提供的图1中Q区域的局部放大图。图4至图7示出四种示例提供的图2中B-B向的剖面图。
如图1所示，显示面板100具有第一显示区AA1、第二显示区AA2以及围绕第一显示区AA1、第二显示区AA2的非显示区NA，第一显示区AA1的透光率大于第二显示区AA2的透光率。
本文中，优选第一显示区AA1的透光率大于等于15％。为确保第一显示区AA1的透光率大于15％，甚至大于40％，甚至具有更高的透光率，本实施例中显示面板100的各个功能膜层的透光率均大于80％，甚至至少部 分功能膜层的透光率均大于90％。
根据本申请实施例的显示面板100，第一显示区AA1的透光率大于第二显示区AA2的透光率，使得显示面板100在第一显示区AA1的背面可以集成感光组件，实现例如摄像头的感光组件的屏下集成，同时第一显示区AA1能够显示画面，提高显示面板100的显示面积，实现显示装置的全面屏设计。
第一显示区AA1包括中心区域AA11及与中心区域AA11相邻的边缘区域AA12。第一显示区AA1的背面集成感光组件，对中心区域AA11的透光率的要求要比边缘区域AA12高。中心区域AA11的具体位置、形状及尺寸可以根据感光组件的具体位置设置。
如图2、图4所示，显示面板100包括多个重复单元10，重复单元10包括至少两个像素110。每个像素110至少包括三种颜色的子像素101、102、103。各子像素101、102、103包括依次层叠设置的第一电极112、发光结构111及第二电极113。
在第一显示区AA1、重复单元10中相同颜色的相邻子像素101、102、103的第一电极112通过互连结构201、202、203电连接，以形成同色像素组01、02、03。例如，图2中示出了同色像素组01包括四个第一颜色的子像素101及三个互连结构201，同色像素组02包括四个第二颜色的子像素102及三个互连结构202，同色像素组03包括四个第三颜色的子像素103及三个互连结构203。如此，第一电极112互连的多个子像素形成像素合并结构。一种颜色的同色像素组包括的多个子像素可以电连接至同一像素电路，从而通过一个像素电路控制多个互连的子像素显示，进一步降低第一显示区AA1的实际PPI，减少第一显示区AA1内的驱动布线，提高其透光率。
进一步的，在中心区域AA11中，至少一种颜色的同色像素组的互连结构为透明导电结构，能够进一步提高中心区域AA11的透光率。
透明导电结构可以由ITO制成。
显示面板包括衬底301，像素110设置在衬底301上。像素110包括三种颜色的子像素，分别为第一颜色的子像素101、第二颜色的子像素102及 第三颜色的子像素103。对应的，同色像素组具有第一颜色的第一同色像素组01、第二颜色的第二同色像素组02及第三颜色的第三同色像素组03。
第一同色像素组01的互连结构201及第二同色像素组02的互连结构202在衬底301上的正投影不相交。进一步的，第三同色像素组03的互连结构与第一同色像素组01的互连结构201及第二同色像素组02的互连结构202在衬底301上的正投影均相交。或者，第一同色像素组01的互连结构201及第二同色像素组02的互连结构202在衬底301上的正投影不相交。进一步的，第一同色像素组01的互连结构201和第二同色像素组02的互连结构202中的一者与第三同色像素组03的互连结构在衬底301上的正投影相交(图中未示出)。
将三种颜色中的两种颜色的同色像素组的互连结构设置为在衬底上的正投影不相交。如此，两种颜色的同色像素组的互连结构可设置为同一层，这些互连结构可在同一工艺步骤中形成，从而可降低制备工艺的复杂度。进一步的，在衬底上的正投影相交的互连结构可设置为不同层，可避免在衬底上的正投影相交的互连结构设置在同一层时影响同色像素组的正常工作。
请参阅图2、图4至图7，在中心区域AA11中，至少一种颜色的同色像素组的互连结构为透明导电结构，中心区域AA11及边缘区域AA12的互连结构可以至少包括以下设置方式。
在一些实施例中，至少可以按照如下两种方式设置中心区域AA11的互连结构。
第一种设置方式：
在中心区域AA11中，第一同色像素组01的互连结构201及第二同色像素组02的互连结构202为与第一电极112同层设置的透明导电结构。第三同色像素组03的互连结构203与第一同色像素组01的互连结构201及第二同色像素组02的互连结构202不同层。
第二种设置方式：
在中心区域AA11中，第一同色像素组01的互连结构201及第二同色像素组02的互连结构202为设置在第一电极112下方的透明导电结构，第 三同色像素组03的互连结构203与第一同色像素组01的互连结构201及第二同色像素组02的互连结构202不同层。示例性的，第一同色像素组01的互连结构201及第二同色像素组02的互连结构202为设置在第一电极112下方的同一层或者不同层。
在一些实施例中，至少可以按照如下两种方式设置边缘区域AA12的互连结构。
第一种设置方式：
在边缘区域AA12中，第一同色像素组01的互连结构201及第二同色像素组02的互连结构202与第一电极112同层设置。第三同色像素组03的互连结构203与第一同色像素组01的互连结构201及第二同色像素组02的互连结构202不同层设置。
可选的，在边缘区域AA12中，第一同色像素组01的互连结构201及第二同色像素组02的互连结构202与第一电极112同层设置时，第一同色像素组01的互连结构201及第二同色像素组02的互连结构202的材料可以与第一电极112的材料相同或者不相同，也可以是透明导电结构。
第二种设置方式：
在边缘区域AA12中，第一同色像素组01的互连结构201及第二同色像素组02的互连结构202为设置在第一电极112下方的透明导电结构。第三同色像素组03的互连结构203与第一同色像素组01的互连结构201及第二同色像素组02的互连结构202不同层设置。示例性的，第一同色像素组01的互连结构201及第二同色像素组02的互连结构202可以为设置在第一电极112下方的同一层或者不同层。
在一些实施例中，第一显示区AA1的各同色像素组通过引线连接到对应的像素电路。引线可以为透明导电结构，例如ITO(Indium Tin Oxides)。如图3所示，第一同色像素组01通过引线2011连接到对应的像素电路(图中未示出)，第二同色像素组02通过引线2021连接到对应的像素电路，第三同色像素组03通过引线2031连接到对应的像素电路。像素电路通过对应的引线控制同色像素组的各子像素显示。示例性的，引线2011、2021、2031均为透明导电结构，以提升第一显示区AA1的透光率。
可以选择上述中心区域AA11的两种设置方式中的任意一种，也可以选择上述边缘区域AA12的两种设置方式中的任意一种，也可以将上述中心区域AA11的两种设置方式与边缘区域AA12的两种设置方式进行任意组合。例如，将上述中心区域AA11的两种设置方式与边缘区域AA12的两种设置方式进行如下组合。
第一种组合方式：
在一些实施例中，第一显示区AA1的像素密度比较小，例如100PPI，或者更小，子像素之间的间距会比较大，进而有足够的空间布置引线。如图4所示，采用中心区域AA11的第一种设置方式和边缘区域AA12第一种设置方式。此时，第一同色像素组01的互连结构201及第二同色像素组02的互连结构202的材料可以与第一电极112的材料相同或者不相同，也可以是透明导电结构。
在一些实施例中，中心区域AA11及边缘区域AA12采用相同的设置方式，即中心区域AA11及边缘区域AA12采用第一种组合方式，可以将中心区域AA11及边缘区域AA12的第一同色像素组01、第二同色像素组02对应的引线2011、2021设置为与第一电极112同层的透明导电结构。进一步的，可以将中心区域AA11及边缘区域AA12的第一同色像素组01的互连结构201及第二同色像素组02的互连结构202均设置为透明导电结构。如此，可以在同一工艺步骤中形成整个第一显示区AA1的互连结构201、202及引线2011、2021，从而可降低制备工艺的复杂度。另外，能够提高整个第一显示区AA1的透光率。
在一些实施例中，中心区域AA11及边缘区域AA12的第三同色像素组03对应的引线2031可以设置为与第一电极112同层的透明导电结构，或者中心区域AA11及边缘区域AA12的第三同色像素组03对应的引线2031可以设置为与第三同色像素组03的互连结构203同层透明导电结构。
第二种组合方式：
在一些实施例中，第一显示区AA1的像素密度相对大一些，例如大于100PPI，子像素之间的间距会比较小，进而没有足够的空间布置引线。如图5所示，采用中心区域AA11的第二种设置方式和边缘区域AA12第一 种设置方式。此时，第一同色像素组01的互连结构201及第二同色像素组02的互连结构202的材料可以与第一电极112的材料相同或者不相同，也可以是透明导电结构。
中心区域AA11及边缘区域AA12采用不同的设置方式，边缘区域AA12的互连结构201、202设置为与第一电极112同层，能够在边缘区域AA12的第一电极112的下方留出足够的空间布置引线。
在一些实施例中，将边缘区域AA12的第一同色像素组01的互连结构201及第二同色像素组02的互连结构202均设置为与第一电极112的材料相同，可以同一工艺步骤中形成边缘区域AA12的互连结构201、202及第一电极112，从而可降低制备工艺的复杂度。
在一些实施例中，中心区域AA11的第一同色像素组01、第二同色像素组02对应的引线2011、2021为与中心区域AA11的第一同色像素组01的互连结构201及第二同色像素组02的互连结构202同层设置的透明导电结构。即，将中心区域AA11的互连结构201、202及对应的引线2011、2021均设置为位于第一电极112下方的同一层，且均为透明导电结构，可以同一工艺步骤中形成中心区域AA11的互连结构201、202及引线2011、2021，从而可降低制备工艺的复杂度。
第三种组合方式：
在一些实施例中，第一显示区AA1的像素密度比较小，例如100PPI，或者更小，子像素之间的间距会比较大，进而有足够的空间布置引线。如图6所示，采用中心区域AA11的第二种设置方式和边缘区域AA12的第二种设置方式。
如此，中心区域AA11及边缘区域AA12的互连结构201、202均位于第一电极112的下方。优选的，中心区域AA11的第一同色像素组01的互连结构201及第二同色像素组02的互连结构202与边缘区域AA12的第一同色像素组01的互连结构201及第二同色像素组02的互连结构202位于第一电极112下方的同一层。
在一些实施例中，中心区域AA11的第一同色像素组01、第二同色像素组02对应的引线2011、2021为与中心区域AA11的第一同色像素组01 的互连结构201及第二同色像素组02的互连结构202同层设置的透明导电结构。在一些实施例中，边缘区域AA12的第一同色像素组01、第二同色像素组02对应的引线2011、2021为与边缘区域AA12的第一同色像素组01的互连结构201及第二同色像素组02的互连结构202同层设置的透明导电结构。
在一些实施例中，可以将中心区域AA11及边缘区域AA12的第一同色像素组01的互连结构201、对应的引线2011及第二同色像素组02的互连结构202、对应的引线2021均设置为位于同一层的透明导电结构。如此，可以同一工艺步骤中形成整个第一显示区AA1的互连结构201、202及引线2011、2021，从而可降低制备工艺的复杂度。另外，能够提高整个第一显示区AA1的透光率。
第四种组合方式：
在一些实施例中，第一显示区AA1的像素密度相对大一些，例如大于100PPI，子像素之间的间距会比较小，进而没有足够的空间布置引线。如图7所示，采用中心区域AA11的第一种设置方式和边缘区域AA12第二种设置方式。
中心区域AA11及边缘区域AA12采用不同的设置方式，边缘区域AA12的互连结构201、202设置为位于第一电极112的下方，能够在边缘区域AA12的第一电极112所在的层上留出足够的空间布置引线。
进一步的，将边缘区域AA12的第一同色像素组01的互连结构201及第二同色像素组02的互连结构202均设置为透明导电结构，进而提高整个第一显示区AA1的透光率。
在一些实施例中，中心区域AA11的第一同色像素组01、第二同色像素组02对应的引线2011、2021为与第一电极112同层设置的透明导电结构。中心区域AA11的互连结构201、202及对应的引线2011、2021与第一电极112同层，可以同一工艺步骤中形成中心区域AA11的互连结构201、202及对应的引线2011、2021，从而可降低制备工艺的复杂度。
在一些实施例中，边缘区域AA12的第一同色像素组01、第二同色像素组02对应的引线2011、2021为与边缘区域AA12的第一同色像素组01 的互连结构201及第二同色像素组02的互连结构202同层设置的透明导电结构。如此，可以同一工艺步骤中形成边缘区域AA12的互连结构201、202及对应的引线2011、2021，从而可降低制备工艺的复杂度。
如图4至图7所示，显示面板包括衬底301、器件层302以及像素定义层303。器件层302位于衬底301上，像素定义层303位于器件层302上。第一显示区AA1的各子像素对应的像素电路位于第二显示区AA2的器件层302内(图中未示出)。器件层302包括平坦化层3022及至少一层金属层3021，金属层3021位于平坦化层3022与衬底301之间。
至少一层金属层3021中的一层金属层3021为上述中心区域AA11及边缘区域AA12的第三同色像素组03的互连结构203。第三同色像素组03的互连结构203通过过孔与对应的第一电极112电连接。金属层3021可以为电容的上极板，只需要在制备工艺中形成过孔结构连接对应的第一电极及电容的上极板，从而形成第三同色像素组03的互连结构203，简化了制备工艺。
上述中心区域AA11和/或边缘区域AA12的互连结构201、202与第一电极112同层设置时，可以是位于平坦化层3022的上方。上述中心区域AA11和/或边缘区域AA12的互连结构201、202位于第一电极112的下方时，可以是位于平坦化层3022的下方。互连结构201、202位于第一电极112的下方时，通过过孔与对应的第一电极112电连接。
第二显示区AA2包括第一子显示区AA21以及邻接第一子显示区AA21与第一显示区AA1的第二子显示区AA22，第一显示区AA1的子像素对应的像素电路设置在第二子显示区AA22内。可以理解的是，第一显示区AA1的子像素对应的像素电路的数量可以是多个，并且分别对应电连接至对应的同色像素组。
像素电路的电路结构包括1个薄膜晶体管、2个薄膜晶体管和1个电容、3个薄膜晶体管和1个电容、6个薄膜晶体管和1个电容、6个薄膜晶体管和2个电容、7个薄膜晶体管和1个电容、7个薄膜晶体管和2个电容、或9个薄膜晶体管和1个电容中的任一种。本文中，像素电路的电路结构包括2个薄膜晶体管(T)和1个电容(C)，指像素电路的电路结构是 “2T1C电路”，其它“7T1C电路”、“7T2C电路”、“9T1C电路”等依次类推。
根据本申请实施例的显示面板100，用于驱动同色像素组的各子像素显示的像素电路位于第二子显示区AA22，从而减少第一显示区AA1内的布线结构，进而提高第一显示区AA1的透光率。
重复单元10包括的至少两个像素110在第一方向D1上交替分布，任意相邻的两个像素110的各子像素均沿第二方向D2排列且在第一方向D1上错位，第一方向D1与第二方向D2相交。优选的，第一方向D1与第二方向D2垂直，第一方向D1可以是行方向或列方向，对应的第二方向D2可以是列方向或行方向。
任意相邻的两个像素110的各子像素沿第二方向D2排列的颜色顺序不同。示例性的，如图2所示，重复单元10包括四个像素110，每个像素110包括三种颜色的子像素。以一个重复单元10为例，左边第一个像素110的各子像素沿第二方向D2排列的颜色顺序可以为红色子像素、绿色子像素、蓝色子像素。左边第二个像素110的各子像素沿第二方向D2排列的颜色顺序可以为蓝色子像素、红色子像素、绿色子像素。右边第一个像素110的各子像素沿第二方向D2排列的颜色顺序与左边第二个像素110的顺序相同，右边第二个像素110的各子像素沿第二方向D2排列的颜色顺序与左边第一个像素110的顺序相同。
如此设置，可使得第一显示区AA1中在第二方向上相邻设置的子像素的颜色均不相同，同一颜色的子像素分布更均匀，可避免第一显示区AA1的某一区域内多个同一颜色的子像素相邻而导致第一显示区AA1显示时出现颜色分布不均匀，进而导致该区域出现单一颜色的亮条的问题，可提高第一显示区AA1的显示效果。
衬底301可以采用玻璃、聚酰亚胺(Polyimide，PI)等透光材料制成。第二显示区AA2的器件层302可以包括用于驱动各子像素显示的像素电路。像素定义层303包括位于第一显示区AA1的第一像素开口K1。在一些实施例中，像素定义层303包括位于第二显示区AA2的第二像素开口。
各子像素101、102、103包括发光结构111、第一电极112以及第二电 极113。第一显示区AA1的发光结构111位于第一像素开口K1内，第一电极112位于发光结构111的朝向衬底301的一侧，第二电极113位于发光结构111的背离衬底301的一侧。
第一电极112、第二电极113中的一个为阳极、另一个为阴极。本实施例中，以第一电极112是阳极、第二电极113是阴极为例进行说明。
发光结构111可以包括OLED发光层，根据发光结构111的设计需要，还可以包括空穴注入层、空穴传输层、电子注入层或电子传输层中的至少一种。
第一电极112为透光电极。在一些实施例中，第一电极112包括氧化铟锡(Indium Tin Oxide，ITO)层或氧化铟锌层。在一些实施例中，第一电极112为反射电极，包括第一透光导电层、位于第一透光导电层上的反射层以及位于反射层上的第二透光导电层。其中第一透光导电层、第二透光导电层可以是ITO、氧化铟锌等，反射层可以是金属层，例如是银材质制成。
第二电极113包括镁银合金层。在一些实施例中，第二电极113可以互连为公共电极。
第一显示区AA1的每个发光结构111在衬底301上的正投影由一个第一图形单元组成或由两个以上第一图形单元拼接组成，第一图形单元包括从由圆形、椭圆形、哑铃形、葫芦形、矩形组成的群组中选择的至少一个。
第一显示区AA1的每个第一电极112在衬底301上的正投影由一个第二图形单元组成或由两个以上第二图形单元拼接组成，第二图形单元包括从由圆形、椭圆形、哑铃形、葫芦形、矩形组成的群组中选择的至少一个。
上述形状可改变衍射产生的周期性结构，即改变了衍射场的分布，从而减弱外部入射光通过第一显示区AA1时产生的衍射效应，进而确保第一显示区AA1下方设置的摄像头拍照得到的图像具有较高的清晰度。
示例性地，显示面板100还可以包括封装层和位于封装层上方的偏光片和盖板，也可以直接在封装层上方直接设置盖板，无需设置偏光片，或者至少在第一显示区AA1的封装层上方直接设置盖板，无需设置偏光片，避免偏光片影响对应第一显示区AA1下方设置的感光元件的光线采集量。 当然，第一显示区AA1的封装层上方也可以设置偏光片。
本申请实施例还提供一种显示装置，该显示装置可以包括上述任一实施方式的显示面板100。以下将以一种实施例的显示装置为例进行说明，该实施例中，显示装置包括上述实施例的显示面板100。
图8示出根据本申请一种实施例提供的显示装置的俯视示意图。图9示出一种实施例提供的图8中C-C向的剖面图。本实施例的显示装置中，显示面板100可以是上述其中一个实施例的显示面板100。显示面板100具有第一显示区AA1以及第二显示区AA2，第一显示区AA1的透光率大于第二显示区AA2的透光率。
显示面板100包括相对的第一表面S1和第二表面S2。其中第一表面S1为显示面。显示装置还包括感光组件200。该感光组件200位于显示面板100的第二表面S2侧，感光组件200与第一显示区AA1位置对应。
感光组件200可以是图像采集装置，用于采集外部图像信息。本实施例中，感光组件200为互补金属氧化物半导体(Complementary Metal Oxide Semiconductor，CMOS)图像采集装置，在其它一些实施例中，感光组件200也可以是电荷耦合器件(Charge-coupled Device，CCD)图像采集装置等其它形式的图像采集装置。感光组件200可以不限于是图像采集装置，例如在一些实施例中，感光组件200也可以是红外传感器、接近传感器、红外镜头、泛光感应元件、环境光传感器以及点阵投影器等光传感器。此外，显示装置在显示面板100的第二表面S2还可以集成其它部件，例如是听筒、扬声器等。
根据本申请实施例的显示装置，第一显示区AA1的透光率大于第二显示区AA2的透光率，使得显示面板100在第一显示区AA1的背面可以集成感光组件200.实现例如图像采集装置的感光组件200的屏下集成，同时第一显示区AA1能够显示画面，提高显示面板100的显示面积，实现显示装置的全面屏设计。
根据本申请实施例的显示装置，第一显示区AA1内的重复单元10中相同颜色的相邻子像素的第一电极通过互连结构电连接，形成同色像素组。如此，第一显示区内的重复单元包括的多个像素变为一个像素，使得第一 显示区AA1的实际PPI(Pixel Per Inch)能够降低。其中仅需要将重复单元中的同色像素组的多个子像素与一个像素电路连接，减少了第一显示区中的走线数量，便于提升第一显示区AA1的透光率。
在第一显示区AA1的中心区域AA11中，至少一种颜色的同色像素组的互连结构为透明导电结构，能够进一步提升第一显示区AA1的中心区域AA11的透光率，降低对拍照效果的影响。
依照本申请如上文所述的实施例，这些实施例并没有详尽叙述所有的细节，也不限制本申请仅为所述的具体实施例。显然，根据以上描述，本领域普通技术人员可作很多的修改和变化。本说明书选取并具体描述这些实施例，是为了更好地解释本申请的原理和实际应用，从而使所属技术领域技术人员能很好地利用本申请以及在本申请基础上的修改使用。本申请的范围仅由所附权利要求书限定。

Claims (20)

  1. 一种显示面板，具有第一显示区以及第二显示区，所述第一显示区包括中心区域及与所述中心区域相邻的边缘区域，所述第一显示区的透光率大于所述第二显示区的透光率，所述显示面板包括：
    多个重复单元，各所述重复单元包括至少两个像素，每个所述像素包括至少三种颜色的子像素，各所述子像素包括依次层叠设置的第一电极、发光结构及第二电极；
    在所述第一显示区中，所述重复单元中相同颜色的相邻子像素的第一电极通过互连结构电连接，以形成同色像素组。
  2. 根据权利要求1所述的显示面板，其中，在所述中心区域中，至少一种颜色的所述同色像素组的互连结构为透明导电结构。
  3. 根据权利要求1所述的显示面板，其中，所述多个子像素与所述第一电极互连形成像素合并结构，所述同色像素组的多个子像素电连接至同一像素电路，从而通过一个像素电路控制多个互连的子像素。
  4. 根据权利要求2所述的显示面板，其中，所述显示面板还包括衬底，所述像素设置在所述衬底上；
    所述像素包括三种颜色的子像素，对应的所述同色像素组具有第一颜色的第一同色像素组、第二颜色的第二同色像素组及第三颜色的第三同色像素组，其中，所述第一同色像素组的互连结构与所述第二同色像素组的互连结构在所述衬底上的正投影不相交；
    所述第三同色像素组的互连结构与所述第一同色像素组的互连结构和/或所述第二同色像素组的互连结构在所述衬底上的正投影相交。
  5. 根据权利要4所述的显示面板，其中，
    在所述中心区域中，所述第一同色像素组的互连结构及所述第二同色像素组的互连结构为与所述第一电极同层设置的透明导电结构，所述第三同色像素组的互连结构与所述第一同色像素组的互连结构及所述第二同色像素组的互连结构不同层；
    在所述边缘区域中，所述第一同色像素组的互连结构及所述第二同色 像素组的互连结构与所述第一电极同层设置，所述第三同色像素组的互连结构与所述第一同色像素组的互连结构及所述第二同色像素组的互连结构不同层设置；
    在所述边缘区域中，所述第一同色像素组的互连结构及所述第二同色像素组的互连结构与所述第一电极的材料相同，或者为透明导电结构。
  6. 根据权利要5所述的显示面板，其中，所述中心区域及所述边缘区域的第一同色像素组、第二同色像素组对应的引线为与所述第一电极同层设置的透明导电结构。
  7. 根据权利要4所述的显示面板，其中，
    在所述中心区域中，所述第一同色像素组的互连结构及所述第二同色像素组的互连结构为设置在所述第一电极下方的透明导电结构，所述第三同色像素组的互连结构与所述第一同色像素组的互连结构及所述第二同色像素组的互连结构不同层；
    在所述边缘区域中，所述第一同色像素组的互连结构及所述第二同色像素组的互连结构与所述第一电极同层设置，所述第三同色像素组的互连结构与所述第一同色像素组的互连结构及所述第二同色像素组的互连结构不同层设置；
    在所述边缘区域中，所述第一同色像素组的互连结构及所述第二同色像素组的互连结构与所述第一电极的材料相同，或者为透明导电结构。
  8. 根据权利要7所述的显示面板，其中，所述中心区域的第一同色像素组、第二同色像素组对应的引线为与所述中心区域的第一同色像素组的互连结构及第二同色像素组的互连结构同层设置的透明导电结构。
  9. 根据权利要3所述的显示面板，其中，
    在所述中心区域中，所述第一同色像素组的互连结构及所述第二同色像素组的互连结构为设置在所述第一电极下方的透明导电结构，所述第三同色像素组的互连结构与所述第一同色像素组的互连结构及所述第二同色像素组的互连结构不同层；
    在所述边缘区域中，所述第一同色像素组的互连结构及所述第二同色像素组的互连结构为设置在所述第一电极下方的透明导电结构，所述第三 同色像素组的互连结构与所述第一同色像素组的互连结构及所述第二同色像素组的互连结构不同层设置；
    所述中心区域的所述第一同色像素组的互连结构及所述第二同色像素组的互连结构与所述边缘区域的所述第一同色像素组的互连结构及所述第二同色像素组的互连结构位于同一层。
  10. 根据权利要9所述的显示面板，其中，所述中心区域的第一同色像素组、第二同色像素组对应的引线为与所述中心区域的第一同色像素组的互连结构及第二同色像素组的互连结构同层设置的透明导电结构。
  11. 根据权利要9所述的显示面板，其中，所述边缘区域的第一同色像素组、第二同色像素组对应的引线为与所述边缘区域的第一同色像素组的互连结构及第二同色像素组的互连结构同层设置的透明导电结构。
  12. 根据权利要3所述的显示面板，其中，
    在所述中心区域中，所述第一同色像素组的互连结构及所述第二同色像素组的互连结构为与所述第一电极同层设置的透明导电结构，所述第三同色像素组的互连结构与所述第一同色像素组的互连结构及所述第二同色像素组的互连结构不同层；
    在所述边缘区域中，所述第一同色像素组的互连结构及所述第二同色像素组的互连结构为设置在所述第一电极下方的透明导电结构，所述第三同色像素组的互连结构与所述第一同色像素组的互连结构及所述第二同色像素组的互连结构不同层设置。
  13. 根据权利要12所述的显示面板，其中，所述中心区域的第一同色像素组、第二同色像素组对应的引线为与所述第一电极同层设置的透明导电结构。
  14. 根据权利要12所述的显示面板，其中，所述边缘区域的第一同色像素组、第二同色像素组对应的引线为与所述边缘区域的第一同色像素组的互连结构及第二同色像素组的互连结构同层设置的透明导电结构。
  15. 根据权利要3至14任一项所述的显示面板，其中，所述显示面板还包括：
    器件层，位于所述衬底上，包括平坦化层及至少一层金属层，所述金 属层位于所述衬底与所述平坦化层之间；
    其中，所述至少一层金属层中的一层金属层为所述第三同色像素组的互连结构，所述第三同色像素组的互连结构通过过孔与对应的所述第一电极电连接。
  16. 根据权利要求1所述的显示面板，其中，所述第二显示区包括第一子显示区以及邻接所述第一子显示区与所述第一显示区的第二子显示区，所述第一显示区的子像素对应的像素电路设置在所述第二子显示区内；
    所述第一显示区的子像素对应的像素电路的电路结构包括1个薄膜晶体管、2个薄膜晶体管和1个电容、3个薄膜晶体管和1个电容、6个薄膜晶体管和1个电容、6个薄膜晶体管和2个电容、7个薄膜晶体管和1个电容、7个薄膜晶体管和2个电容、或9个薄膜晶体管和1个电容中的任一种。
  17. 根据权利要求1所述的显示面板，其中，所述显示面板还包括衬底，所述像素设置在所述衬底上；
    所述重复单元的至少两个像素在第一方向上交替分布，任意相邻的两个像素的各子像素均沿第二方向排列且在所述第一方向上错位。
  18. 根据权利要求16所述的显示面板，其中，所述第一显示区的发光结构在所述衬底上的正投影由一个第一图形单元组成或由两个以上第一图形单元拼接组成，所述第一图形单元包括从由圆形、椭圆形、哑铃形、葫芦形、矩形组成的群组中选择的至少一个。
  19. 根据权利要求16所述的显示面板，其中，所述第一显示区的第一电极在所述衬底上的正投影由一个第二图形单元组成或由两个以上第二图形单元拼接组成，所述第二图形单元包括从由圆形、椭圆形、哑铃形、葫芦形、矩形组成的群组中选择的至少一个。
  20. 根据权利要求16所述的显示面板，其中，所述第一显示区的第一电极为透光电极；或者，所述第一显示区的第一电极为反射电极；或者，所述第一显示区的第一电极包括氧化铟锡层或氧化铟锌层，
    和/或，所述第一显示区的第二电极包括镁银合金层。
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Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110783386B (zh) * 2019-10-29 2020-12-25 昆山国显光电有限公司 显示面板及显示装置
CN113325602B (zh) * 2020-02-28 2023-09-26 Oppo广东移动通信有限公司 悬浮显示装置及电子设备
CN111834413A (zh) * 2020-04-17 2020-10-27 昆山国显光电有限公司 显示面板以及显示装置
CN113534492B (zh) * 2020-04-21 2023-08-25 Oppo广东移动通信有限公司 电子设备
WO2021227023A1 (zh) * 2020-05-15 2021-11-18 京东方科技集团股份有限公司 显示面板及其制作方法、显示装置
CN111627960A (zh) * 2020-05-18 2020-09-04 武汉华星光电半导体显示技术有限公司 一种增透膜层组件、增透膜层组件制程方法及显示装置
CN111710708B (zh) * 2020-07-01 2022-09-13 昆山国显光电有限公司 显示面板以及显示装置
CN112002749B (zh) * 2020-09-17 2022-09-23 云谷（固安）科技有限公司 显示面板及显示装置
CN112331703B (zh) * 2020-09-24 2022-09-16 武汉天马微电子有限公司 一种显示面板及显示装置
CN112103329B (zh) * 2020-11-05 2021-02-02 武汉华星光电半导体显示技术有限公司 显示面板及显示装置
KR20230116914A (ko) 2020-12-07 2023-08-04 오티아이 루미오닉스 인크. 핵 생성 억제 코팅 및 하부 금속 코팅을 사용한 전도성 증착 층의 패턴화
CN113053988A (zh) * 2021-03-31 2021-06-29 合肥维信诺科技有限公司 显示面板及显示装置
EP4207294A4 (en) * 2021-04-01 2024-01-03 Boe Technology Group Co Ltd LIGHT EMITTING SUBSTRATE AND DISPLAY DEVICE
CN115768183A (zh) * 2022-10-27 2023-03-07 云谷（固安）科技有限公司 像素排布结构、显示面板及掩膜组件

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4920409A (en) * 1987-06-23 1990-04-24 Casio Computer Co., Ltd. Matrix type color liquid crystal display device
CN109584794A (zh) * 2019-01-25 2019-04-05 京东方科技集团股份有限公司 一种显示面板及显示装置
CN209071333U (zh) * 2018-10-31 2019-07-05 云谷（固安）科技有限公司 显示屏以及显示终端
CN110189639A (zh) * 2019-06-28 2019-08-30 昆山国显光电有限公司 显示基板、显示面板及显示装置
CN110767720A (zh) * 2019-06-05 2020-02-07 昆山国显光电有限公司 显示基板、显示面板及显示装置
CN110783386A (zh) * 2019-10-29 2020-02-11 昆山国显光电有限公司 显示面板及显示装置
CN110890026A (zh) * 2019-12-05 2020-03-17 昆山国显光电有限公司 显示面板及显示装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61236584A (ja) * 1985-04-12 1986-10-21 シャープ株式会社 カラ−デイスプレイ
JPH0521058Y2 (zh) * 1987-06-23 1993-05-31
US8947627B2 (en) * 2011-10-14 2015-02-03 Apple Inc. Electronic devices having displays with openings
TWI521271B (zh) 2014-07-31 2016-02-11 友達光電股份有限公司 畫素陣列
JP2017037274A (ja) 2015-08-14 2017-02-16 株式会社 オルタステクノロジー 液晶表示装置
CN106856204B (zh) * 2016-12-28 2019-12-03 上海天马有机发光显示技术有限公司 一种oled显示面板、显示装置
US11057554B2 (en) * 2017-05-22 2021-07-06 Sharp Kabushiki Kaisha Display device with hollowed part in backlight
CN107479757B (zh) 2017-08-25 2020-07-14 上海天马微电子有限公司 显示面板和显示装置
KR102373443B1 (ko) * 2017-09-14 2022-03-14 삼성디스플레이 주식회사 디스플레이 장치
CN108389879B (zh) 2017-09-30 2021-06-15 云谷（固安）科技有限公司 显示屏以及电子设备
WO2019062221A1 (zh) * 2017-09-30 2019-04-04 云谷（固安）科技有限公司 显示屏及显示装置
JP2019158956A (ja) 2018-03-08 2019-09-19 シャープ株式会社 表示デバイス
US11201307B2 (en) * 2018-04-17 2021-12-14 Samsung Display Co., Ltd. Display panel and electronic apparatus including the same
CN109192076B (zh) * 2018-11-02 2021-01-26 京东方科技集团股份有限公司 一种显示面板和显示装置
CN110288945B (zh) * 2019-06-28 2023-09-29 武汉天马微电子有限公司 显示面板及显示装置
CN110379836B (zh) * 2019-07-19 2022-02-22 云谷（固安）科技有限公司 显示面板及显示装置
CN210516000U (zh) * 2019-09-26 2020-05-12 昆山国显光电有限公司 显示基板及显示装置
CN210516181U (zh) * 2019-09-29 2020-05-12 昆山国显光电有限公司 透明显示基板及显示装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4920409A (en) * 1987-06-23 1990-04-24 Casio Computer Co., Ltd. Matrix type color liquid crystal display device
CN209071333U (zh) * 2018-10-31 2019-07-05 云谷（固安）科技有限公司 显示屏以及显示终端
CN109584794A (zh) * 2019-01-25 2019-04-05 京东方科技集团股份有限公司 一种显示面板及显示装置
CN110767720A (zh) * 2019-06-05 2020-02-07 昆山国显光电有限公司 显示基板、显示面板及显示装置
CN110189639A (zh) * 2019-06-28 2019-08-30 昆山国显光电有限公司 显示基板、显示面板及显示装置
CN110783386A (zh) * 2019-10-29 2020-02-11 昆山国显光电有限公司 显示面板及显示装置
CN110890026A (zh) * 2019-12-05 2020-03-17 昆山国显光电有限公司 显示面板及显示装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3951882A4 *

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KR20210138780A (ko) 2021-11-19
US20220036795A1 (en) 2022-02-03
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CN110783386A (zh) 2020-02-11
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