WO2021077705A1

WO2021077705A1 - Silicon rod grinding machine and silicon rod grinding method

Info

Publication number: WO2021077705A1
Application number: PCT/CN2020/087096
Authority: WO
Inventors: 卢建伟; 苏静洪; 潘雪明; 李鑫; 曹奇峰; 钱春军; 李彬
Original assignee: 天通日进精密技术有限公司
Priority date: 2019-10-24
Filing date: 2020-04-27
Publication date: 2021-04-29
Also published as: EP4049790A4; EP4049790A1

Abstract

Provided in the present application are a silicon rod grinding machine and a silicon rod grinding method. A rough grinding device and a fine grinding device of the silicon rod grinding machine are arranged in a first machining area and a second machining area of a silicon rod machining platform respectively, and are provided with a first transfer device and a second transfer device, which penetrate the first machining area and the second machining area simultaneously; a silicon rod clamp and a driving mechanism are arranged for each of the first transfer device and the second transfer device; and the first transfer device, the second transfer device, the rough grinding device and the fine grinding device are controlled in a coordinated manner, such that the rough grinding device and the fine grinding device of the silicon rod grinding machine are in a working state at the same moment, and on the basis of maintaining the size specification and cost of the silicon rod grinding machine, the grinding machining efficiency is doubled, the grinding operation time is shortened, and the economic benefit is improved.

Description

Silicon rod grinding machine and silicon rod grinding method

Technical field

This application relates to the technical field of silicon workpiece processing, in particular to a silicon rod grinding machine and a silicon rod grinding method.

Background technique

At present, with the society's attention and openness to the use of green and renewable energy, the field of photovoltaic solar power generation has received more and more attention and development. In the field of photovoltaic power generation, the usual crystalline silicon solar cells are made on high-quality silicon wafers, which are cut and processed by a multi-wire saw after pulling or casting a silicon ingot.

The current production process of silicon wafers takes monocrystalline silicon products as an example. Generally, the general operation procedure can include: first use a silicon rod cutting machine to cut the original long silicon rods to form multiple short silicon rods; the cutting is completed Then, use a silicon rod squarer to square the cut short silicon rods to form single-crystal silicon rods; then perform surface grinding and chamfering operations on each silicon rod, so that the surface of the silicon rod can be shaped to the corresponding Flatness and dimensional tolerance requirements; subsequent slicing of the silicon rods to obtain silicon wafers.

Generally, in the process of grinding and chamfering silicon rods, rough grinding and fine grinding must be carried out. A single silicon rod is loaded for rough grinding and fine grinding in turn, then it is transferred and unloaded, and then another silicon rod is loaded and unloaded. Silicon rods are loaded, ground and unloaded. In the usual mass processing, the silicon rod grinder repeats this process. The grinding of the silicon rod grinder has a lot of time to be idle, and the grinding efficiency is low, which affects the economic benefits of silicon rod processing. .

Summary of the invention

In view of the shortcomings of the above-mentioned related technologies, the purpose of this application is to provide a silicon ingot cutting and grinding integrated machine and a silicon ingot cutting and grinding method, which are used to solve the inefficiency between various processes and silicon ingot processing existing in the related art. Problems such as poor job results.

In order to achieve the above and other related purposes, the present application discloses a silicon rod grinder, including: a machine base with a silicon rod processing platform; the silicon rod processing platform is provided with a first processing zone and a second processing zone; first The transfer device includes a first silicon rod clamp that can be raised and lowered, a first transfer guide rail arranged along a first direction, and a silicon rod used for driving the first silicon rod clamp and its clamped silicon rod to move along the first transfer path. A first driving mechanism that transfers between the first processing zone and the second processing zone; the second transfer device includes a liftable second silicon rod clamp, a second transfer rail arranged along the first direction, and a second transfer guide for driving the The second silicon rod clamp and the silicon rod clamped by the second driving mechanism move along the second transfer path and transfer between the first processing zone and the second processing zone; wherein, the second transfer device and the second drive mechanism When a transfer device is in a transfer working state, the silicon rods clamped by the first silicon rod clamp and the silicon rods clamped by the second silicon rod clamp are located at different height positions; the rough grinding device is arranged on the silicon rod processing platform The first processing location is used to perform rough grinding operations on the silicon rods located at the first processing location; and a fine grinding device is located at the second processing location of the silicon rod processing platform and is used to perform rough grinding operations on the silicon rods located at the second processing location. The silicon rods at the location are subjected to fine grinding operations.

In some embodiments of the first aspect of the present application, the first transfer path includes a first transfer section in the lifting direction, a second transfer section in the first direction, and a third transfer section in the lifting direction; The second transfer path includes a one-way transfer section in a first direction; and the one-way transfer section and the second transfer section in the first direction are located at different height positions.

In some embodiments of the first aspect of the present application, the first transfer device and the second transfer device are arranged above the silicon rod processing platform through a mounting frame, and the first transfer device and the second transfer device The two transfer devices are respectively arranged on opposite sides of the installation frame.

In some embodiments of the first aspect of the present application, the first silicon rod clamp includes: a clamp arm mounting seat, which is arranged on the first transfer rail; at least two clamp arms, which face each other in a first direction Is provided for clamping the two end faces of the silicon rod; and a clamping arm driving mechanism for driving at least one clamping arm of the at least two clamping arms to move along the first direction.

In some embodiments of the first aspect of the present application, the clamping arm is a rotating structure; the first silicon rod clamp further includes a clamping arm rotation mechanism for driving the clamping arm to rotate.

In some embodiments of the first aspect of the present application, the second silicon rod clamp includes: a clamping arm mounting seat, which is arranged on the second transfer rail; at least a pair of clamping arms, facing each other in a first direction Is provided for clamping the two end faces of the silicon rod; and a clamping arm driving mechanism for driving at least one clamping arm of the at least two clamping arms to move along the first direction.

In some embodiments of the first aspect of the present application, the first silicon rod clamp clamp arm is a rotating structure; the second silicon rod clamp further includes a clamp arm rotation mechanism for driving the clamp arm to rotate.

In some embodiments of the first aspect of the present application, the first driving mechanism includes: a first moving rack, which is arranged along a first direction; a first driving gear, which is arranged on the first silicon rod holder and is connected to The first moving rack meshes; and a first driving power source for driving the first driving gear.

In some embodiments of the first aspect of the present application, the second driving mechanism includes: a second moving rack, which is arranged along a first direction; and a second driving gear, which is arranged on the second silicon rod holder and is connected with The second moving rack meshes; and a first driving power source for driving the second driving gear.

In some embodiments of the first aspect of the present application, the rough grinding device includes: at least a pair of rough grinding tools, which are disposed oppositely at the first processing position of the silicon rod processing platform; and the rough grinding tools The advance and retreat mechanism is used to drive at least one rough grinding tool of the at least one pair of rough grinding tools to move laterally along a second direction, wherein the second direction is perpendicular to the first direction.

In some embodiments of the first aspect of the present application, the fine grinding device includes: at least a pair of fine grinding tools, which are disposed oppositely at the first processing position of the silicon rod processing platform; and the fine grinding tools The advance and retreat mechanism is used to drive at least one of the at least one pair of fine grinding tools to move laterally in a second direction, wherein the second direction is perpendicular to the first direction.

In some embodiments of the first aspect of the present application, the silicon rod grinder further includes: a silicon rod transfer device, which is arranged adjacent to the first processing position of the silicon rod processing platform, and is used to transfer the silicon rod to be processed The rod is transferred to the first processing location of the silicon rod processing platform or the processed silicon rod on the silicon rod processing platform is transferred from the first processing location.

In some embodiments of the first aspect of the present application, the silicon rod processing platform is further provided with a waiting area, and the silicon rod grinder further includes a silicon rod transfer device adjacent to the waiting area of the silicon rod processing platform. The location is used to transfer the silicon rod to be processed to the waiting area of the silicon rod processing platform or to transfer the processed silicon rod in the waiting area from the silicon rod processing platform.

The second aspect of the present application also provides a silicon rod grinding method, which is applied to a silicon rod grinding machine. The silicon rod grinding machine includes a base with a silicon rod processing platform, and the silicon rod processing platform is provided with a first Processing zone and second processing zone, the silicon rod grinder further includes a first transfer device, a second transfer device, a rough grinding device, and a fine grinding device, wherein the first transfer device includes a first silicon rod holder, A first transfer rail and a first drive mechanism, the second transfer device includes a second silicon rod holder, a second transfer rail, and a second drive mechanism, characterized in that the silicon rod grinding method includes the following steps:

Load the first silicon rod in the first processing station, make the first silicon rod clamp in the first transfer device clamp the first silicon rod, and make the rough grinding device rough-grind the first silicon rod located at the first processing position operation;

Make the first drive mechanism in the first transfer device drive the first silicon rod holder and its clamped first silicon rod to move along the first transfer path, and make the second drive mechanism in the second transfer device drive the second silicon rod holder along the first transfer path Move along the second transfer path. The first transfer path and the second transfer path are on the same straight line parallel to the first direction but are staggered up and down and not on the same horizontal plane, so that the first silicon rod clamp and the first silicon clamped by it are on the same straight line. The rod is transferred from the first processing location to the second processing location, and the second silicon rod fixture is transferred from the second processing location to the first processing location;

Make the fine grinding device perform fine grinding operations on the first silicon rod located at the second processing area; at this stage, load the second silicon rod on the first processing station, and make the second silicon rod clamp in the second transfer device Clamping the second silicon rod, so that the rough grinding device performs a rough grinding operation on the second silicon rod located at the first processing area;

Make the first drive mechanism in the first transfer device drive the first silicon rod holder and the first silicon rod held by it to move along the first transfer path, and make the second drive mechanism in the second transfer device drive the second silicon rod holder and The second silicon rod that it clamps moves along the second transfer path, and the first transfer path and the second transfer path are on the same straight line parallel to the first direction but are staggered up and down and not on the same horizontal plane, so that the first silicon rod The clamp and its clamped first silicon rod are transferred from the second processing position to the first processing position, and the second silicon rod clamp and its clamped second silicon rod are transferred from the first processing position to the second processing position;

Unload the first silicon rod from the first processing area and load the third silicon rod, make the first silicon rod clamp in the first transfer device clamp the third silicon rod, and make the rough grinding device align with the third silicon rod located at the first processing area. The silicon rod is subjected to rough grinding operation; at this stage, the fine grinding device is made to perform the fine grinding operation on the second silicon rod located at the second processing area.

The third aspect of the present application also provides a silicon rod grinding method, which is applied to a silicon rod grinding machine, the silicon rod grinding machine includes a base with a silicon rod processing platform, and the silicon rod processing platform is provided with a waiting area , The first processing location and the second processing location, the silicon rod grinder further includes a first transfer device, a second transfer device, a rough grinding device, and a fine grinding device, wherein the first transfer device includes a first silicon A rod clamp, a first transfer rail, and a first drive mechanism, the second transfer device includes a second silicon rod clamp, a second transfer rail, and a second drive mechanism, characterized in that the silicon rod grinding method includes the following step:

Load the first silicon rod in the waiting area, make the first silicon rod clamp in the first transfer device clamp the first silicon rod, and make the first driving mechanism in the first transfer device drive the first silicon rod clamp and its clamped second silicon rod. A silicon rod moves along the first transfer guide rail to transfer from the waiting area to the first processing area, so that the rough grinding device performs a rough grinding operation on the first silicon rod located at the first processing area;

Make the fine grinding device perform the fine grinding operation on the first silicon rod located at the second processing area; at this stage, load the second silicon rod in the waiting area, and make the second silicon rod clamp in the second transfer device clamp the second silicon rod. The silicon rod, the second driving mechanism in the second transfer device drives the second silicon rod holder and the second silicon rod held by it to move along the second transfer rail to transfer from the waiting area to the first processing area, so that the rough grinding device Rough grinding of the second silicon rod located in the first processing area;

Unload the first silicon rod from the waiting area and load the third silicon rod, so that the first silicon rod holder in the first transfer device clamps the third silicon rod, and the first driving mechanism in the first transfer device drives the first silicon rod holder And the third silicon rod held by it moves along the first transfer rail to transfer from the waiting area to the first processing area, so that the rough grinding device performs rough grinding operation on the third silicon rod located at the first processing area; here At this stage, the fine grinding device is made to perform a fine grinding operation on the second silicon rod located at the second processing area.

As mentioned above, the silicon rod grinding machine and silicon rod grinding method of the present application have the following beneficial effects: the rough grinding device and the fine grinding device of the silicon rod grinding machine are respectively arranged at the first processing position and the second processing position of the silicon rod processing platform. The processing area is provided with a first transfer device and a second transfer device that pass through the first processing location and the second processing location at the same time, and the first and second transfer devices are respectively equipped with a silicon rod fixture and a driving mechanism, and the second transfer device is controlled by coordination. 1. The positions of the first silicon rod holder and the second silicon rod holder on the second transfer device and the transfer path during the transfer, so that the rough grinding device and the fine grinding device of the silicon rod grinder are both in working condition at the same time , On the basis of maintaining the size and cost of the silicon rod grinding machine, the grinding efficiency is doubled, which reduces the time consumption of grinding operations and improves economic benefits.

Description of the drawings

FIG. 1 shows a schematic diagram of a three-dimensional structure of a silicon rod grinder according to an embodiment of the present application.

FIG. 2 shows a simplified schematic diagram of a silicon rod grinder according to an embodiment of the present application.

FIG. 3 shows a schematic diagram of the structure of the first silicon rod holder in an embodiment of the silicon rod grinding machine of the present application.

Fig. 4 is a schematic diagram showing the enlarged structure at A in Fig. 2.

FIG. 5 shows a schematic diagram of the structure of a second silicon rod holder in an embodiment of the silicon rod grinding machine of the present application.

FIG. 6 shows a simplified schematic diagram of a silicon rod grinder according to an embodiment of the present application.

FIG. 7 shows a simplified schematic diagram of the transfer path of the silicon rod transfer in an embodiment of the silicon rod grinder of the present application.

FIG. 8 shows a simplified schematic diagram of the transfer path of the silicon rod transfer in an embodiment of the silicon rod grinder of the present application.

FIG. 9 shows a simplified schematic diagram of a silicon rod grinder according to an embodiment of the present application.

FIG. 10 shows a simplified schematic diagram of a silicon rod grinder according to an embodiment of the present application.

FIG. 11 shows a working schematic diagram of an embodiment of the silicon rod grinding method of this application.

FIG. 12 shows a working schematic diagram of an embodiment of the silicon rod grinding method of this application.

FIG. 13 shows a working schematic diagram of an embodiment of the silicon rod grinding method of the present application.

FIG. 14 shows a schematic diagram of the structure of the silicon rod grinding machine in an embodiment of the present application.

FIG. 15 shows a schematic top view of the silicon rod grinding machine in an embodiment of the present application.

FIG. 16 shows a schematic diagram of the structure of the silicon rod grinding machine in an embodiment of the present application.

FIG. 17 shows a schematic diagram of the structure of the first silicon rod holder of the silicon rod grinder of the present application in an embodiment.

FIG. 18 is a schematic diagram showing the enlarged structure at A in FIG. 16.

FIG. 19 shows a schematic diagram of the structure of the second silicon rod holder of the silicon rod grinder of the present application in an embodiment.

FIG. 20 shows a simplified schematic diagram of the silicon rod grinding machine in an embodiment of the present application.

FIG. 21 shows a simplified schematic diagram of the silicon rod grinding machine in an embodiment of the present application.

FIG. 22 shows a top view of the simplified structure of the silicon rod grinding machine in an embodiment of the present application.

FIG. 23 shows a working schematic diagram of an embodiment of the silicon rod polishing method of the present application.

FIG. 24 shows a working schematic diagram of an embodiment of the silicon rod polishing method of this application.

FIG. 25 shows a working schematic diagram of an embodiment of the silicon rod polishing method of this application.

FIG. 26 shows a working schematic diagram of an embodiment of the silicon rod polishing method of this application.

FIG. 27 shows a working schematic diagram of an embodiment of the silicon rod grinding method of this application.

FIG. 28 shows a working schematic diagram of an embodiment of the silicon rod polishing method of the present application.

Detailed ways

The following specific examples illustrate the implementation of this application. Those familiar with this technology can easily understand the other advantages and effects of this application from the content disclosed in this specification.

In the following description, with reference to the accompanying drawings, the accompanying drawings describe several embodiments of the present application. It should be understood that other embodiments can also be used, and mechanical, structural, electrical, and operational changes can be made without departing from the spirit and scope of the present disclosure. The following detailed description should not be considered restrictive, and the scope of the embodiments of the present application is limited only by the claims of the published patent. The terms used here are only for describing specific embodiments, and are not intended to limit the application. Space-related terms, such as "upper", "lower", "left", "right", "below", "below", "lower", "above", "above", "upper", etc., can be used in the text It is used to explain the relationship between one element or feature shown in the figure and another element or feature.

Although the terms first, second, etc. are used herein to describe various elements or parameters in some examples, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one or parameter from another or parameter. For example, the first direction may be referred to as the second direction, and similarly, the second direction may be referred to as the first direction without departing from the scope of the various described embodiments.

Furthermore, as used herein, the singular forms "a", "an" and "the" are intended to also include the plural forms, unless the context dictates to the contrary. It should be further understood that the terms "comprising" and "including" indicate the presence of the described features, steps, operations, elements, components, items, types, and/or groups, but do not exclude one or more other features, steps, operations, The existence, appearance or addition of elements, components, items, categories, and/or groups. The terms "or" and "and/or" used herein are interpreted as inclusive or mean any one or any combination. Therefore, "A, B or C" or "A, B and/or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C" . An exception to this definition will only occur when the combination of elements, functions, steps, or operations is inherently mutually exclusive in some way.

In the related processing technology for silicon rods, several processes such as square cutting, surface grinding, and chamfering are involved.

In the processing of silicon materials, multiple processes are usually required to obtain silicon wafers for industrial production, which involve several processes such as square cutting, surface grinding, and chamfering. The original silicon material is usually a long silicon rod and has a cylindrical structure. The long silicon rod is cut by a silicon rod cutting machine to obtain multiple short silicon rods; and the silicon rod square machine is used to square the cut silicon rod sections. Single crystal silicon rods are formed, and the cross-section of the obtained single crystal silicon rods is almost rectangular (including square-like); the surface damage of the single crystal silicon rods obtained by square rooting needs to be removed, and the edges and corners must be chamfered to eliminate internal stress. The crystalline silicon rod is ground and chamfered, so that the surface of the silicon rod can be shaped to meet the corresponding flatness and dimensional tolerance requirements before the final slicing can be carried out.

In the process of grinding single crystal silicon rods, it is necessary to perform rough grinding and then fine grinding. The corresponding rough grinding tools and fine grinding tools are used to realize the grinding. In the traditional working method, single crystal silicon rods are subjected to rough grinding. After rough grinding, it is transferred to the fine grinding work area for fine grinding. After the fine grinding is completed, the processed silicon rod is transported out of the work area. This process is repeated in a large amount of grinding work. The grinding sequence of fine grinding and rough grinding makes silicon Rod grinders inevitably have abrasive tools in a waiting state during operation. For example, the fine grinding tools are in the waiting state when the rough grinding tools are roughing, and the rough grinding tools are in the waiting state when the fine grinding tools are performing fine grinding. In the waiting state, the grinding process takes a long time.

In the examples provided in this application, in order to clarify the definition of directions and the way of operation between different structures, a three-dimensional space defined by a first direction, a second direction, and a third direction is defined. The direction and the third direction are both straight and perpendicular to each other. The length extension direction of the silicon rod grinder, that is, the length direction of the single crystal silicon rod to be polished when placed on it, is defined as the first direction, that is, the front and back direction, and the width extension direction of the silicon rod grinder, that is, the left and right direction is defined as In the second direction, the vertical direction, that is, the up, down, or up and down directions, is defined as the third direction.

Please refer to FIG. 1, which shows a schematic diagram of the structure of the silicon rod grinding machine in an embodiment of the present application. As shown in FIG. 1, the silicon rod grinding machine includes a base 1, a first transfer device 2, a second transfer device 3, a rough grinding device 4, and a fine grinding device 5.

The silicon rod grinder of the present application is used to grind single crystal silicon rods, which are obtained by cutting the original silicon rods through the silicon rods, and then performing square extraction through the silicon rod square-out device. The original silicon rod is usually a rod-shaped single crystal silicon grown from the melt by the Czochralski method or the suspension zone melting method.

The machine base 1 has a silicon rod processing platform 11, and the silicon rod processing platform 11 is provided with a first processing location and a second processing location. The silicon rod processing platform 11 is arranged on the upper surface of the machine base 1. In the implementation of the first embodiment, the processing platform is designed to conform to the shape of the machine base 1 and is rectangular, and the first processing area and the second processing area respectively correspond to grinding The rough grinding processing area and the fine grinding processing area are shown in FIG. 1. The first processing area and the second processing area are arranged collinearly at the front and rear ends of the silicon ingot processing platform 11, and can be independently located on the first A processing zone and a second processing zone are correspondingly loaded with single crystal silicon rods.

The supporting structure of the mounting frame 12 is arranged on the upper surface of the base 1. In the illustrated embodiment, the upper surface of the base 1 is rectangular, and the supporting structure of the mounting frame 12 is on the outer edge of the rectangle, so The shape and size of the upper surface of the mounting frame 12 and the upper surface of the base 1 are approximately the same.

The installation frame 12 is erected on the machine base 1 to form a vertical frame structure. The upper surface of the frame is higher than the silicon rod processing platform 11 and carries the first transfer device 2 and the second transfer device 3. As shown in FIG. 1, the first transfer device 2 and the second transfer device 3 are respectively arranged above the first processing location and the second processing location by a mounting frame, the first transfer device 2 and the second transfer device 3 The first direction is parallel, the second direction is reversed or mirrored, and the projections of the loaded silicon rods on the horizontal plane are kept collinear. The first transfer device 2 and the second transfer device 3 are arranged on the first processing zone above the second processing zone by the mounting frame 12, and can be moved and exchanged between the two processing zones to different processing. Location.

Please refer to FIG. 2, which shows a simplified schematic diagram of the silicon rod grinding machine in an embodiment of the present application. Please refer to FIGS. 1 and 2 in combination. As shown in FIGS. 1 and 2, the first transfer device 2 includes a first silicon rod holder 21, a first transfer rail 22, and a first driving mechanism (not shown in the figure) . The first silicon rod holder 21 is carried on the first transfer rail 22; the first transfer rail 22 is arranged on the upper surface of the mounting frame 12 and is arranged along a first direction to limit the first silicon on it. The rod holder 21 moves in a first direction; the first drive mechanism is used to drive the first silicon rod holder 21 and the silicon rods held by it to move along the first transfer rail 22, and make the first silicon rod holder 21 Realize the transfer between the first processing location and the second processing location. The first silicon rod clamp 21 includes a clamping arm mounting seat 211, at least two clamping arms 212 and a clamping arm driving mechanism 213.

Please continue to refer to FIG. 1, the first silicon rod clamp 21 as a whole appears as a clamp arm mounting seat set on the upper side, the part other than the clamp arm mounting seat including the clamp arm is in a downward hanging state, and the silicon rod clamp mounting seat is carried on the mounting On the upper surface of the frame 12, the clamp arm extends downward from the hollow part of the clamp arm mounting seat in the mounting frame 12, so that the silicon rod clamped by the clamp arm is located on the processing surface of the silicon rod processing platform 11 .

The clamp arm mounting seat is arranged on the first transfer rail 22. In an implementation of this embodiment, the bottom of the clamp arm mounting seat is provided with a guide groove structure matching the first transfer rail 22, so The first transfer rail 22 is arranged along the first direction, and the length of the first transfer rail 22 in the first direction at least covers the positions of the first working area and the second working area in the first direction, so as to ensure the The silicon rod clamped by the first silicon rod holder 21 is transferred between the two working areas. In an implementation of this embodiment, the first transfer rail 22 is arranged to span the entire length of the mounting frame in the first direction.

Please refer to FIG. 3, which shows a schematic structural diagram of the first silicon rod holder 21 of this application in an embodiment. As shown in FIG. 3, the clamp arm mounting seat 211 also has a first-direction guide rail 2111. The clamp arm 212 is arranged on the clamp arm mounting seat 211 through the guide rail 2111 and can move in the first direction.

The at least one pair of clamping arms 212 are arranged opposite to each other along the first direction, and are used for clamping the two end faces of the silicon rod. The silicon rod is a slender structure with a square root, and its length direction is placed along the first direction, and the end faces are the cross sections at both ends of the length direction. The clamping arm 212 hangs down from the clamping arm mounting seat 211, and the clamping end of the clamping arm is located below the clamping arm 212 for directly contacting and clamping the silicon rod.

The clamping arm driving mechanism 213 can drive at least one clamping arm of the at least one pair of clamping arms 212 to move along the first direction to adjust the distance between the pair of opposite clamping arms. The clamping ends of the two clamping arms located opposite to each other in the first direction are close to clamping the silicon rods, and the silicon rods are transferred and ground between different working areas while maintaining the clamping state. After the grinding is completed, the silicon rods are transferred to the load-bearing position. Move away from each other to release the silicon rods after processing.

In some implementations of this embodiment, the clamping arm driving mechanism 213 may be configured as a traveling motor to drive the clamping arm 212 to move along the guide rail of the clamping arm mounting seat 211.

In an embodiment of the present application, the clamping arm driving mechanism includes a driving motor, a driving gear, and a pair of racks. The driving motor drives the gear to rotate, and the pair of racks mesh with opposite sides of the gear circumference of the driving gear, that is, the line of the two meshing points corresponding to the two racks meshing with the driving gear passes through all the gears. The center of rotation of the drive gear. When the driving gear rotates, each rack moves under the drive of the gear, and the direction of movement of each rack is the direction in which the corresponding meshing drive gear rotates. Because the two racks are on the circumference of the driving gear respectively The two opposite sides are engaged, and they have the same linear velocity driven by the driving gear, but the direction of movement is opposite. In an implementation of this embodiment, each rack of the pair of racks has a slender structure, and the teeth meshed with the driving gear are arranged in the length direction, and each tooth of the pair of racks One end of the bar is meshed with the drive gear, and the other end is connected with a clamping arm. Driven by the drive gear, the two racks move in the opposite direction, so that the two clamping arms of the pair of clamping arms follow the clamping arm mounting seat guide rail in the first direction. Move closer to or away from each other.

In an embodiment of the present application, the clamping arm has a rotating structure. As shown in FIG. 3, the first silicon rod holder further includes a clamping arm rotation mechanism 214 for driving the clamping arm to rotate. In an implementation of this embodiment, any clamping end of the pair of clamping arms 212 is provided with a rotatable structure. Driven by the clamping arm rotation mechanism 214, the clamping end of the clamping arm is The length direction of the silicon rod, that is, the first direction is the axis rotation, and the clamped silicon rod rotates correspondingly with the first direction as the axis. In actual grinding, the grinding surface and chamfering of silicon rods are on the four sides in the length direction and the edges of the boundaries between the four surfaces. The clamping arm provided by this application can realize different grinding surfaces of silicon rods. And the selection and control of different edges.

In some implementations of this embodiment, the clamping ends of the at least one pair of clamping arms have a contact surface for clamping the silicon rod. When the clamping ends of the silicon rod are two end faces at both ends of the elongated structure, the contact surfaces of the clamping ends of the clamping arms can be set as vertical contact surfaces or vertical contact surfaces. surface. The contact surface is set on a rotatable platform, and the platform can be set as a custom regular geometric figure or an irregular geometric figure.

In an embodiment of the present application, the rotatable platform may be configured as a whole hinged by a hinge device with a locking function, and may rotate along an axis in the first direction. The axis of the rotating shaft is connected to the clamp arm rotating mechanism.

In an embodiment of the present application, the clamping end of the clamping arm can be set as a rotatable circular platform, and the circular plane of the circular platform is in contact with the end surface of the silicon rod, and is kept in contact with the end surface of the silicon rod after being close to the end surface of the silicon rod. The end face is relatively static. The clamping end of the silicon rod also includes a locking structure, and the clamping end of the clamping arm is in a locked state when a certain selected plane is ground. In the switching of different grinding surfaces, the silicon rod clamping end is driven by the clamping arm rotating mechanism to rotate along the center of the truncated cone.

Please refer to FIG. 4, which shows a schematic diagram of the enlarged structure of the silicon rod grinding machine in part A of FIG. 2. As shown in Fig. 4, the clamping end of the clamping arm includes a rotatable round table and a series of protruding contacts arranged on the round table, and each contact has a contact plane. The round table rotates under the drive of the clamping arm rotation mechanism. In an implementation of this embodiment, the protruding length of the contact point, that is, the position in the first direction, can be adjusted, so that the process of clamping the silicon rod Among them, for silicon rods with relatively low end faces, the protruding length of the contacts can be adjusted according to the end faces of the silicon rods, so that each contact surface is in close contact with the end faces of the silicon rods. The protruding length is the length in the first direction from the circular plane of the truncated cone to the contact plane of the contact.

In an embodiment of the present application, the clamping end of the first silicon rod clamp is provided with a pressure sensor to adjust the protruding length of the contact based on the detected pressure state. Generally, in the process of clamping the silicon rod, a pair of clamping arms of the first silicon rod clamp are driven by the clamping arm drive mechanism to approach each other in a first direction, until the contact surface of the clamping end is in contact with the desired one. The end faces of the clamped silicon rods are in contact with each other. When the clamping end is provided with a plurality of contacts and it is detected that the pressure value of the part of the contacts in contact with the end face of the contacted silicon rod is less than a set value or a set area, The degree of clamping can be changed by adjusting the protruding length of the contact (generally toward the direction of approaching the end face of the silicon rod); or, each clamping end of the pair of clamping arms of the first silicon rod clamp is set to one In the process of clamping the silicon rod, the clamping arm drive mechanism drives the end faces of a pair of clamping arms toward the two ends of the silicon rod to approach each other. After the clamping end is in contact with the end face of the silicon rod, The pressure sensor detects the clamping degree of the silicon rod, and when the set pressure range is reached, the clamping arm drive mechanism controls to stop the relative movement of the pair of clamping arms.

The clamping arm rotation mechanism may be arranged on one of the pair of clamping arms to drive the clamping ends of the pair of clamping arms and the clamped silicon rod to rotate; or the clamping arm rotation mechanism may be arranged on On each of the pair of clamping arms, the two clamping ends of the pair of clamping arms are controlled to rotate in the same angle and direction in a coordinated motion. In some implementations, the clamping arm rotation mechanism may be configured as a driving motor.

When the silicon rod grinder is used to grind the different sides of the silicon rod or chamfer the edges, the clamping end of the clamping arm is driven to rotate by the clamping arm rotation mechanism. Generally, for a single crystal silicon rod that has been squared, when grinding different sides, the clamping arm rotation mechanism controls the clamping end of the clamping arm to rotate a certain angle, for example, 90°. When chamfering different edges It can be achieved by controlling the clamping end of the clamp arm to rotate a certain angle, such as 45°, 135°, etc. When the grinding surface provided by the grinding device is flat, when chamfering the silicon rod, the clamping arm rotation mechanism can control the clamping end of the clamping arm to rotate at different angles to the silicon rod it clamps. The secondary chamfering can be realized. For example, after grinding a side surface of a silicon rod, the adjacent edge of the side surface and the opposite edge of the edge can be rotated by a certain angle, such as 40°, 45°, 50° Perform multiple chamfering at equal angles to obtain a silicon rod with a smoother transition at the junction of different sides. The angles are all rotation angles from the initial position of grinding. For the method of realizing chamfering, please refer to patent publications such as CN108942570A. By driving the silicon rod to rotate to a certain angle, the grinding tool cooperates with the lateral feed in the second direction to realize the grinding of the corners.

The first silicon rod holder may be, for example, a lifting type silicon rod holder. In an implementation manner, the clamping arm mounting seat of the first silicon rod clamp is provided with a guide rail in the lifting direction, and the clamping arm of the silicon rod clamp and the guide rail carrying the clamping arm on the clamping arm mounting seat can follow The lifting rail moves in the third direction and can be used to control the vertical relative position of the outer surface of the silicon rod and the grinding surface of the grinding tool, so as to select the grinding surface of the silicon rod and the grinding area of the grinding tool for grinding. In an implementation of this embodiment, the lifting rail is arranged on the vertical surface of the clamping arm mounting seat, and the clamping arm is correspondingly provided with a guide groove that cooperates with the lifting rail and driving the clamping arm A driving mechanism that generates a lifting movement; the driving mechanism includes a traveling screw and a traveling motor, the traveling screw is arranged along the lifting guide rail and connected to the traveling motor, and driven by the traveling motor to drive the clamp arm in the first Movement in three directions.

In an embodiment of the present application, the lifting device of the first silicon rod clamp controls the clamping arm to move between different working positions of the first transfer device, for example, when the first working position is to the second working position. Or when moving from the second working area to the first working area, the clamping arm of the first silicon rod clamp and the silicon rods clamped by it move along the lifting rail under the driving of the lifting motion drive mechanism, for example, along the The lifting rail rises to a certain height, so that the overall height of the clamping arm of the first silicon rod clamp and the clamped silicon rod is above the clamping arm of the second silicon rod clamp and the silicon rod clamped by it. Then, when the first silicon rod clamp moves in the first direction under the drive of the first driving mechanism, and the second silicon rod clamp moves in the first direction under the drive of the second driving mechanism, the first silicon rod The transfer path corresponding to the clamping arm of the clamp and the silicon rod clamped by the clamp arm and the transfer path corresponding to the clamping arm of the second silicon rod clamp and the silicon rod clamped by the second silicon rod clamp are spatially presented as two parallel lines along the first direction, And the two parallel lines are respectively at different heights, and the projections on the horizontal plane are collinear in the top view.

Please continue to refer to FIG. 1, the first driving mechanism includes a first moving rack, a first driving gear, and a first driving power source. The first moving rack is arranged along the first direction and is parallel to the first transfer rail 22. The first movable rack is fixed on the upper surface of the mounting frame, and the length dimension in the first direction is set to be approximately the same as the length dimension of the first transfer rail 22, and is parallel and opposite to the first transfer rail 22. Neighborhood settings.

The first driving gear is disposed on the first silicon rod holder 21 and meshes with the first moving rack, and is used to drive the first silicon rod holder 21 to move along the first transfer rail 22. The first driving power source is used to drive the first driving gear. In an implementation manner of the present application, the first drive gear is arranged on the clamping arm mounting seat of the first silicon rod clamp 21, the first drive gear is driven to rotate by a first drive power source, and the first drive gear is rotated by a first drive power source. The gear teeth of a driving gear mesh with the first moving rack and follow the first moving rack. The first silicon rod holder 21 connected with the first driving gear thus produces a corresponding response on the first transfer rail 22. Mobile.

In the first implementation of this embodiment, the first driving power source may be configured as a driving motor, and the power output shaft of the driving motor is axially connected with the first driving gear to control the movement state of the first driving gear, and then The first driving force source controls the movement of the first silicon rod holder and the silicon rod held by it in a first direction.

In an embodiment of the present application, the first driving mechanism may be arranged on the first silicon rod holder, and includes a traveling motor and a traveling screw, and the traveling screw is arranged and connected along the first transfer guide rail. The traveling motor is driven by the traveling motor to drive the first silicon rod clamp to move along the first transfer rail.

Please continue to refer to FIG. 1, the second transfer device 3 includes a second silicon rod clamp 31, a second transfer rail 32 and a second driving mechanism. The second silicon rod clamp 31 is carried on the second transfer rail 32; the second transfer rail 32 is arranged on the upper surface of the mounting frame 12 and is arranged along the first direction to limit the second silicon on it. The rod clamp 31 moves in the first direction; the second drive mechanism is used to drive the second silicon rod clamp 31 and the silicon rods held by it to move along the second transfer rail 32, and make the second silicon rod clamp 31 realizes the transfer between the first processing location and the second processing location.

Please refer to FIG. 5, which shows a schematic structural view of the second silicon rod holder 31 of the silicon rod grinder of the present application in an embodiment. As shown in FIG. 5, the second silicon rod clamp 31 includes a clamping arm mounting seat 311, at least two clamping arms 312 and a clamping arm driving mechanism 313.

1 and 5 in combination, the second silicon rod clamp 31 is shown as a whole as the clamp arm mounting seat 311 is arranged above, the part of the clamp arm mounting seat 311 including the clamp arm 312 is in a downward hanging state, and the clamp arm mounting seat 311 is carried on the upper surface of the mounting frame 12, and the clamping arm 312 extends downward from the hollow part of the clamping arm mounting seat 311 in the mounting frame 12, so as to realize that the silicon rod clamped by the clamping arm 312 is in the The processing surface of the silicon rod processing platform 11.

The clamp arm mounting seat 311 is provided on the second transfer rail 32. In an implementation of this embodiment, the bottom of the clamp arm mounting seat 311 is provided with a guide groove structure matching the second transfer rail 32 , The second transfer rail 32 is arranged along the first direction, and the length of the second transfer rail 32 in the first direction at least covers the positions of the first working area and the second working area in the first direction to ensure The silicon rods clamped by the second silicon rod clamp 31 are transferred between two working areas. In an implementation of this embodiment, the second transfer rail 32 is arranged to span the entire length of the mounting frame 12 in the first direction.

Please refer to FIG. 1, FIG. 3 and FIG. 5 in combination. As shown in the figure, the second transfer rail 32 and the first transfer rail 22 are arranged in parallel and symmetrically, and the clamping arm of the first silicon rod clamp 21 The mounting seat 211 and the clamping arm mounting seat 311 of the second silicon rod clamp 31 respectively move on a mutually parallel path defined by the first transfer rail 22 and the second transfer rail 32. When the first silicon rod holder 21 and the silicon rods held by it are transferred between different processing locations, the second silicon rod holder 31 and the silicon rods held by it can also be transferred between different processing locations. The movement of the clamping arm mounting seat 211 of the first silicon rod holder 21 and the clamping arm mounting seat 311 of the second silicon rod holder 31 are independent of each other, and the first transfer rail 22 that defines the movement range of the clamping arm mounting seats on the two transfer devices , The second transfer guide rails 32 are respectively arranged in different spatial positions and do not interfere with each other.

In an embodiment of the present application, the clamp arm mounting seat also has a first direction guide rail. Please continue to refer to FIG. 5, the clamping arm 312 is disposed on the clamping arm mounting seat 311 through a horizontal rail 3111 in a first direction and can move in the first direction.

The at least one pair of clamping arms 312 are arranged opposite to each other along the first direction, and are used for clamping the two end faces of the silicon rod. The silicon rod is a slender structure with a square root, and its length direction is placed along the first direction, and the end faces are the cross sections at both ends of the length direction. The clamping arm hangs down from the clamping arm mounting seat, and the clamping end of the clamping arm is located below the clamping arm for directly contacting and clamping the silicon rod.

The clamping arm driving mechanism 313 can drive at least one clamping arm of the at least one pair of clamping arms 312 to move along the first direction to adjust the distance between the pair of opposite clamping arms. The clamping ends of the two clamping arms located opposite to each other in the first direction are close to clamping the silicon rods, and the silicon rods are transferred and ground between different working areas while maintaining the clamping state. After the grinding is completed, the silicon rods are transferred to the load-bearing position. Move away from each other to release the silicon rods after processing. In some implementations of this embodiment, the clamping arm driving mechanism 314 may be configured as a traveling motor to drive the clamping arm 312 to move along the guide rail 3111 of the clamping arm mounting seat 311.

In an embodiment of the present application, the clamping arm driving mechanism includes a driving motor, a driving gear, and a pair of racks. The driving motor drives the driving gear to rotate, and the pair of racks mesh with the opposite sides of the gear circumference of the driving gear, that is, the line of the two meshing points corresponding to the two racks meshing with the driving gear passes through The center of rotation of the drive gear. When the driving gear rotates, each rack moves under the drive of the gear, and the direction of movement of each rack is the direction in which the corresponding meshing drive gear rotates. Because the two racks are on the circumference of the driving gear respectively The two opposite sides are engaged, and they have the same linear velocity driven by the driving gear, but the direction of movement is opposite. In an implementation of this embodiment, each rack of the pair of racks has a slender structure, and the teeth meshed with the driving gear are arranged in the length direction, and each tooth of the pair of racks One end of the bar is meshed with the drive gear, and the other end is connected with a clamping arm. Driven by the drive gear, the two racks move in the opposite direction, so that the two clamping arms of the pair of clamping arms follow the clamping arm mounting seat guide rail in the first direction. Move closer to or away from each other.

In an embodiment of the present application, the clamping arm has a rotating structure. As shown in FIG. 5, the second silicon rod clamp 31 further includes a clamping arm rotation mechanism 314 for driving the clamping arm to rotate. In an implementation of this embodiment, the clamping end of any clamping arm of the pair of clamping arms 312 is provided with a rotatable structure. Driven by the clamping arm rotation mechanism 314, the clamping end of the clamping arm is Taking the length direction of the silicon rod, that is, the first direction as the axis rotation, the clamped silicon rod rotates correspondingly with the first direction as the axis. In actual grinding, the grinding surface and chamfering of silicon rods are on the four sides in the length direction and the edges of the boundaries between the four surfaces. The clamping arm provided by this application can realize different grinding surfaces of silicon rods. And the selection and control of different edges.

In some implementations of this embodiment, the contact surface of the clamping end of the clamp arm may be set as a contact surface in a vertical direction or a contact surface including a plane in the vertical direction. The contact surface is set on a rotatable platform, and the platform can be set as a custom regular geometric figure or an irregular geometric figure.

Please continue to refer to FIG. 4, in an embodiment of the present application, the clamping end of the clamping arm includes a rotatable round table and a series of protruding contacts arranged on the round table, and each contact has a contact flat. The round table rotates under the drive of the clamping arm rotation mechanism. In an implementation of this embodiment, the protruding length of the contact point, that is, the position in the first direction, can be adjusted, so that the process of clamping the silicon rod Among them, for silicon rods with relatively low end faces, the protruding length of the contacts can be adjusted according to the end faces of the silicon rods, so that each contact surface is in close contact with the end faces of the silicon rods. The protruding length is the length in the first direction from the circular plane of the truncated cone to the contact plane of the contact.

In an embodiment of the present application, the clamping end of the silicon rod clamp is provided with a pressure sensor to adjust the protruding length of the contact based on the detected pressure state. Generally, in the process of clamping the silicon rod, a pair of clamping arms of the first silicon rod clamp are driven by the clamping arm drive mechanism to approach each other in a first direction, until the contact surface of the clamping end is in contact with the desired one. The end faces of the clamped silicon rods are in contact with each other. When the clamping end is provided with a plurality of contacts and it is detected that the pressure value of the part of the contacts in contact with the end face of the contacted silicon rod is less than a set value or set area, The degree of clamping can be changed by adjusting the protruding length of the contact (generally toward the direction of approaching the end face of the silicon rod); or, each clamping end of the pair of clamping arms of the first silicon rod clamp is set to A contact surface, in the process of clamping the silicon rod, a pair of clamping arms are driven by the clamping arm drive mechanism to approach the end faces of the two ends of the silicon rod to approach each other. After the clamping end is in contact with the end face of the silicon rod , The pressure sensor detects the clamping degree of the silicon rod, and when the set pressure range is reached, the clamping arm drive mechanism controls to stop the relative movement of the pair of clamping arms.

Please continue to refer to FIG. 5, the clamping arm rotation mechanism 314 can be arranged on one of the pair of clamping arms 312 to drive the clamping ends of the pair of clamping arms and the clamped silicon rod to rotate.

In another embodiment, the clamping arm rotation mechanism is arranged on each clamping arm of a pair of clamping arms, and cooperates to control the two clamping ends of the pair of clamping arms to rotate in the same angle and direction. In some implementations, the clamping arm rotation mechanism may be configured as a driving motor.

When the silicon rod grinder is used to grind the different sides of the silicon rod or chamfer the edges, the clamping end of the clamping arm is driven to rotate by the clamping arm rotation mechanism. Generally, for a single crystal silicon rod that has been squared, when grinding different sides, the clamping arm rotation mechanism controls the clamping end of the clamping arm to rotate a certain angle, for example, 90°. When chamfering different edges It can be achieved by controlling the clamping end of the clamp arm to rotate a certain angle, such as 45°, 135°, etc. When the grinding surface provided by the grinding device is flat, when chamfering the silicon rod, the clamping arm rotation mechanism can control the clamping end of the clamping arm to rotate at different angles to the silicon rod it clamps. The secondary chamfering is realized. For example, after grinding a side surface of the silicon rod, an edge adjacent to the side surface and the edge opposite to the edge can be rotated by a certain angle, such as 40°, 45°, 50° Perform multiple chamfering at equal angles to obtain a silicon rod with a smoother transition at the junction of different sides. The angles are all rotation angles from the initial position of grinding. The method of realizing chamfering can refer to patent publications such as CN108942570A. By driving the silicon rod to rotate to a certain angle, the abrasive tool cooperates with the lateral feed in the second direction to realize the grinding of the corners.

In an embodiment of the present application, as shown in FIG. 5, the second silicon rod clamp 31 is an elevating silicon rod clamp. In an implementation manner, the clamping arm mounting seat 311 of the second silicon rod clamp 31 is provided with a third-direction lifting rail 315, and the clamping arm 312 of the second silicon rod clamp 31 and the clamping arm mounting seat The guide rail 3111 carrying the clamp arm 312 on the 311 can move in the third direction along the lifting guide rail 315, and can be used to control the vertical relative position of the outer surface of the silicon rod and the grinding surface of the grinding tool to select the silicon rod. The grinding surface and grinding tool are used for grinding the grinding area. In an implementation of this embodiment, the lifting rail 315 is arranged on the vertical surface of the clamping arm mounting seat 311, and the clamping arm 312 is correspondingly provided with a guide groove and a drive that cooperate with the lifting rail 315 The driving mechanism for the lifting movement of the clamping arm 312; the driving mechanism includes a traveling screw and a traveling motor, the traveling screw is arranged along the lifting guide rail and connected to the traveling motor, and drives the traveling motor under the driving of the traveling motor. The clamp arm moves in the third direction.

Please continue to refer to FIG. 1, the second driving mechanism (not shown in the figure) includes a second moving rack, a second driving gear, and a second driving power source. The second moving rack is arranged along the first direction and is parallel to the second transfer rail. The second movable rack is fixed on the upper surface of the mounting frame 12, and its length dimension in the first direction is set to be approximately the same length dimension as the second transfer rail 32, and is parallel to the second transfer rail 32 And set up next to each other.

The second driving gear is disposed on the second silicon rod clamp 31 and meshes with the second moving rack, for driving the second silicon rod clamp 31 to move along the second transfer rail 32. The second driving power source is used to drive the second driving gear. In an implementation manner of the present application, the second drive gear is arranged on the clamping arm mounting seat of the second silicon rod clamp 31, the second drive gear is driven to rotate by a second drive power source, and the first The gear teeth of the second drive gear mesh with the second moving rack and follow the second moving rack. The second silicon rod clamp 31 connected with the second drive gear thus produces a corresponding response on the second transfer rail 32. Mobile.

In the first implementation of this embodiment, the second driving power source may be configured as a driving motor, and the power output shaft of the driving motor is axially connected to the second driving gear to control the movement state of the second driving gear, and then The second driving force source controls the movement of the first silicon rod holder and the silicon rod clamped by the first silicon rod holder in the first direction.

In an embodiment of the present application, the second driving mechanism may be arranged on the second silicon rod holder, and includes a traveling motor and a traveling screw, and the traveling screw is arranged and connected along the second transfer guide rail. The traveling motor is driven by the traveling motor to drive the second silicon rod clamp to move along the second transfer rail.

In the actual setting, while maintaining the designed processing efficiency, in order to reduce the size of the silicon rod grinder, the clamping arms of the first silicon rod clamp and the second silicon rod clamp and the silicon rods clamped by them The collinear direction is the first direction on the top-view projection image. The first silicon rod clamp lifting device controls the clamping arm of the first silicon rod clamp and the silicon rod clamped by it to rise to a certain height position, so that the first silicon rod clamping arm that is collinear in the top view projection The clamping arms and the silicon rods held by the second silicon rod clamp and the clamping arms and the silicon rods clamped by the second silicon rod clamp are at different height positions to meet the requirements of the first silicon rod clamp and the clamped silicon rod and the second silicon rod during the transfer process. There is no collision between the two silicon rod clamps and the clamped silicon rods, and the safe transfer of the two silicon rod clamps between different processing locations is realized.

Please refer to FIG. 6, which shows a simplified structural diagram of the silicon rod grinding machine of the present application in an embodiment. Please refer to FIGS. 1 and 6 in combination. As shown in FIGS. 1 and 6, the first transfer device 2 and the second transfer device 3 are respectively erected on the left and right ends of the mounting frame 12. The second transfer device 3 includes a second transfer rail 32, and the second transfer rail 32 and the first transfer rail 31 are arranged in parallel. The first silicon rod clamp 21 and the second silicon rod clamp 31 respectively carried on the first transfer rail 22 and the second transfer rail 32 have the same structure and work independently under the control of the corresponding driving device. Wherein, when the second transfer device and the first transfer device are in a transfer working state, the silicon rods clamped by the first silicon rod clamp and the silicon rods clamped by the second silicon rod clamp are located at different height positions.

The first silicon rod clamp 21 and the second silicon rod clamp 31 have an asymmetric structure in the second direction. The first silicon rod clamp 21 and the second silicon rod clamp 31 are arranged in the second reverse direction, that is, Mirrored arrangement, the first silicon rod clamp 21 and the second silicon rod clamp 31 are in the clamping state or when the rough grinding tool 41 and the fine grinding tool 51 are in the grinding state at the same time. On the same straight line in and the same straight line is a straight line along the first direction. The first silicon rod clamp 21 and the second silicon rod clamp 31 can move along the first transfer rail 22 and the second transfer rail 32 respectively, and have the freedom of movement in the first direction. The silicon rod clamps are both equipped with lifting The guide rail allows the clamped silicon rods to exchange positions through movement in the third direction and the first direction and are in a staggered state of different horizontal planes during movement.

The moving range of the lifting guide rail of the first silicon ingot clamp 21 and the lifting guide rail of the second silicon ingot clamp 31 in the third direction can satisfy that the clamping ends of the clamping arms of the two silicon ingot clamps are between the clamped silicon rods. Are in different height intervals.

The first transfer path, that is, the first silicon rod clamp 21 in the clamping state transfers the clamped silicon rod from the first processing location to the second processing location, or transfers the silicon rod from the second processing location to the second processing location. The first processing location, the transfer path of the clamped silicon rod.

The second transfer path, that is, the second silicon rod clamp 31 in the clamping state transfers the clamped silicon rod from the first processing area to the second processing area, or transfers the silicon rod from the second processing area to The first processing location, the transfer path of the clamped silicon rod.

Please refer to FIGS. 7 and 8, which show the first transfer path corresponding to the silicon rod clamped by the first silicon rod clamp and the second transfer path corresponding to the silicon rod clamped by the second silicon rod clamp in an embodiment. Simplified schematic diagram. As shown in Figure 7, the first transfer path includes a first transfer section S1 in the lifting direction, that is, the third direction, a second transfer section S2 in the first direction, and a third transfer section S3 in the lift direction; The second transfer path includes a one-way transfer section S4 in the first direction.

Specifically, the positions of the first silicon rod clamp and its clamped silicon rod a and the second silicon rod clamp and its clamped silicon rod b are between the first processing zone and the second processing zone. When switching between, the transfer path of the silicon rod a clamped by the first silicon rod clamp may be:

Starting from the initial position shown in FIG. 7, the silicon rod a held by the first silicon rod holder and the silicon rod b held by the second silicon rod holder are respectively on the same horizontal plane or a horizontal plane with a similar height in the two processing locations. Above, the clamping end of the clamping arm of the first silicon rod clamp and the clamped silicon rod a move to a certain height along the lifting rail, that is, the first transfer section S1 in the lifting direction is formed;

Then the first silicon rod clamp and the silicon rod a held by it as a whole move in the first direction along the first transfer rail under the drive of the first driving device, that is, the second transfer section S2 in the first direction is formed. , The two end points of the second transfer section are respectively located at the first processing location and the second processing location;

While the silicon rod a clamped by the first silicon rod clamp is transferred along the first direction to form the second transfer section S2, the second silicon rod clamp and the silicon rod b clamped by the second silicon rod clamp are integrated in the second Driven by the driving device to move in the first direction, that is, the one-way transfer section S4 in the first direction is formed. The two end points of the one-way transfer section are located in the first processing area and the second processing area, for example, when the When the first silicon rod fixture is transferred from the first processing location to the second processing location, the second silicon rod fixture is transferred from the second processing location to the first processing location;

After the second silicon rod clamp and its clamped silicon rod b leave the second processing zone, the clamping end of the clamp arm of the first silicon rod clamp and the clamped silicon rod descend under the control of the lifting device, That is, the third transfer section S3 in the lifting direction is formed.

Please refer to FIGS. 7 and 8 in combination. In the state shown in FIG. 8, the silicon rod a clamped by the first silicon rod clamp and the silicon rod b clamped by the second silicon rod clamp are respectively changed from the initial The processing location is transferred to another processing location, that is, a transfer is completed.

As shown in Figure 8, according to processing needs, when the first silicon rod clamp and its clamped silicon rod a and the second silicon rod clamp and its clamped silicon rod b need to be transferred from one processing location to another again A processing zone can be implemented in a similar manner. For example, the silicon rod a clamped by the first silicon rod clamp rises along the lifting rail to a certain height to form a first transfer section S1 in the lifting direction; and then the first transfer section S1 in the lifting direction is formed. The silicon rod holder and the silicon rod a held by it as a whole move along the first transfer guide rail to form the second transfer section S2 in the first direction. The direction of the second transfer section S2 is controlled by the first drive device. From the first processing area to the second processing area or from the second processing area to the first processing area; at this stage, the second silicon rod holder and the second silicon rod b held by it are driven by the second driving device Move down in the first direction, that is, form the one-way transfer section S4 in the first direction; then the silicon rod a clamped by the first silicon rod clamp descends along its lifting rail to form the third transfer in the lifting direction Section S3.

After the transfer is completed, the first silicon rod clamp and the second silicon rod clamp exchange the processing positions with the silicon rods held by them again. In the process of processing multiple silicon rods, the first processing position and the second processing position The polishing device in the location can perform processing at the same time. After unloading the processed silicon rod, a new silicon rod to be ground is installed, and the above-mentioned silicon rod transfer process is cycled.

The heights of the first transfer section S1 and the third transfer section S3 in the lifting direction in the first transfer path are adjusted by the lifting device of the first silicon rod clamp, and in actual operation, within the lifting range allowed by the lifting rail , The lifting heights corresponding to the first transfer section S1 and the third transfer section S3 can be controlled according to the needs of the transfer; the one-way transfer section S4 in the first direction in the second transfer path and the first transfer path The second transfer section in the first direction is located at different height positions, which means that the first silicon rod clamp clamps silicon rod a and the second silicon rod clamp clamps silicon rod b in different height positions during the transfer. The silicon rods are staggered up and down to achieve safe transfer.

In another embodiment of the present application, the clamping arm of the first silicon rod clamp and the clamping arm of the second silicon rod clamp can both move in the first direction and the third direction in space. That is, the second transfer path corresponding to the silicon rod clamped by the second silicon rod clamp also includes a transfer section in the lifting direction, and the lifting height of the second silicon rod clamp is controlled by the lifting device of the second silicon rod clamp. In the actual transfer, it should be understood that the first transfer path and the second transfer path are not the only fixed path. During the transfer, collisions between the structure of the silicon rod grinder or silicon rods can be avoided. It is sufficient that the transfer sections of the transfer path and the second transfer path in the first direction are at different height positions that satisfy safe transfer.

Please refer to FIG. 9, which shows a simplified structure diagram of the silicon rod grinding machine in an embodiment. As shown in FIG. 9, the first transfer device 2 or/and the second transfer device 3 are in a silicon rod transfer state. Both the first silicon rod clamp 21 and the second silicon rod clamp 31 are provided with lifting rails. Within the movable range defined by the lifting rails, the silicon rod clamped by the first silicon rod clamp 21 and the first silicon rod clamp 21 The height of the silicon rods held by the two silicon rod clamps 31 can be adjusted, and the formed first transfer path and the second transfer path are not unique. In actual adjustment, the two silicon rods and their It is sufficient that the clamps do not overlap in the height range occupied by them. The height range occupied by the silicon rod and the clamp is from the lower surface of the clamped silicon rod or the lower surface of the clamping end of the clamp arm to the upper surface of the horizontal guide rail carrying the clamp arm.

Please continue to refer to FIG. 2, the rough grinding device 4 includes at least a pair of rough grinding tools 41 and a rough grinding tool advance and retreat mechanism 42.

The at least one pair of rough grinding tools 41 are arranged at the first processing location, and the pair of rough grinding tools 41 appear to be oppositely arranged in the second direction. In some implementations, the rough grinding tool 41 includes a grinding wheel and a rotating shaft, the grinding wheel has a certain granularity and roughness, and two opposite grinding wheels are provided for the two symmetrical grinding surfaces of the clamped silicon rods. In some embodiments, the grinding wheel is circular and has a through hole in the middle. The grinding wheel is formed by consolidating abrasive grains and a bonding agent, forming a surface with an abrasive grain portion that contacts and rotates with the surface of the silicon rod to be ground. The rough grinding wheel has a certain size and density of abrasive grains, and at the same time there are pores in the grinding wheel. The abrasive of the grinding wheel can be set as abrasive grains with a hardness greater than that of silicon materials, such as aluminum oxide, silicon carbide, diamond, cubic boron nitride, etc., according to the requirements for grinding silicon rods.

The rough grinding tool advance and retreat mechanism 42 is used to drive at least one rough grinding tool 41 of the at least one pair of rough grinding tools 41 to move laterally in a second direction, the second direction being perpendicular to the first direction The width direction of the defined silicon rod grinder. The rough grinding tool advance and retreat mechanism 42 controls the displacement of at least one rough grinding tool in the pair of rough grinding tools 41 in the second direction, so as to adjust the two rough grinding tools in the pair of rough grinding tools 42 The relative distance between the grinding tools in the second direction, which controls the feed rate during the grinding process, also determines the grinding amount.

In some implementations, each pair of rough grinding tools is equipped with a rough grinding tool advance and retreat mechanism. In the embodiment shown in FIG. 2, the rough grinding tool advance and retreat mechanism includes a sliding guide rail 422, a driving motor 421, and a ball screw (not shown in the figure). The sliding guide rail 422 is arranged along the second direction and is arranged on the first processing area of the machine base. The bottom of the rough grinding tool 41 is provided with a guide groove in the second direction that cooperates with the sliding guide rail 422. The ball screw is arranged along the sliding guide rail 422 and is axially connected to the driving motor 421.

In an embodiment of the present application, one of the at least one pair of rough grinding tools is configured with the drive motor and the ball screw, and one of the pair of grinding tools is moved to Change the relative distance between rough grinding tools.

In an embodiment of the present application, each of the at least one pair of rough grinding tools is equipped with the driving motor and the ball screw, and the driving motor can individually control the corresponding grinding tools in the first The position in the two directions, or based on a certain cooperative relationship, makes the two abrasive tools move away from each other or close to each other at the same linear velocity. For example, during the grinding process, the pair of rough abrasive tools have the same size in the second direction. The speeds are fed in opposite directions, and a pair of rough grinding wheels rotate at the same linear speed for grinding.

In an embodiment of the present application, a pair of rough grinding tools are driven by the same driving motor to move in the second direction at equal and reverse speeds. In the first implementation of this embodiment, the rough grinding tool advance and retreat mechanism includes a driving motor, a driving gear, a pair of racks, and a guide rail. The guide rail is arranged along the second direction and is arranged on the first processing area of the machine base, and the bottom of the rough grinding tool is provided with a guide groove in the second direction that cooperates with the guide rail. The drive motor drives the gear to rotate, and the pair of racks mesh with opposite ends of the drive gear. When the drive gear rotates, the pair of racks are driven by linear velocities at opposite ends of the gear. Shown as being close to each other or far away from each other. In the first implementation of this embodiment, one end of each rack of the pair of racks is meshed with the driving gear, and the other end is connected to a rough grinding tool, so that the pair of rough grinding tools are in the first place. The directions are away from each other or close to each other along the guide rails.

In an embodiment of the present application, the rough grinding device further includes a cooling device to cool the at least one pair of rough grinding tools, reduce the damage of the silicon rod surface layer during the grinding process, and improve the grinding efficiency of the grinding wheel. Service life. In an implementation of this embodiment, the cooling device includes a cooling water pipe, a diversion groove, and a diversion hole. In some embodiments, the outer circumference of the grinding wheel is provided with a protective cover for placing cooling water into the rotary drive motor of the grinding wheel. One end of the cooling water pipe is connected to a cooling water source, and the other end is connected to the surface of the protective cover of the grinding wheel. The diversion groove is provided on the protective cover as a contact point between the protective cover and the cooling water pipe. The diversion hole is provided In the cooling tank. The coolant of the cooling device can be common cooling water, the cooling water pipe is connected to the cooling water source, and the cooling water sucked through the cooling water pipe is directed to the diversion groove and diversion hole on the surface of the grinding wheel, and is directed to the grinding wheel and the silicon rod to be ground The contact surface of the grinding wheel is cooled. During the grinding of the grinding wheel, the cooling water from the rotating orifice of the grinding wheel enters the interior of the grinding wheel by centrifugal action for sufficient cooling.

The at least one pair of rough grinding tools corresponds to the at least one pair of clamping arms. During the grinding process, the silicon rod is clamped by the opposite pair of clamping arms to move in the first direction to control the side surface of the silicon rod and The order of grinding and chamfering the edges and corners can be ensured by reciprocating motion to ensure sufficient grinding in the length direction of the silicon rod. A pair of oppositely arranged rough grinding tools move in the second direction to determine the contact surface between the grinding tool and the silicon rod. The grinding feed rate.

Please continue to refer to FIG. 2, the fine grinding device 5 includes at least a pair of fine grinding tools 51 and a fine grinding tool advance and retreat mechanism 52.

The at least one pair of fine grinding tools 51 are arranged at the first processing location, and the pair of fine grinding tools 51 appear to be oppositely arranged in the second direction. In some implementations, the fine grinding tool 51 includes a grinding wheel and a rotating shaft. The grinding wheel has a certain degree of granularity and roughness. Two opposite grinding wheels are provided for the two symmetrical grinding surfaces of the clamped silicon rods. In some embodiments, the grinding wheel is circular and has a through hole in the middle. The grinding wheel is formed by consolidating abrasive grains and a bonding agent, forming a surface with an abrasive grain portion to contact and rotate with the surface of the silicon rod to be ground. The fine grinding wheel has a certain size and density of abrasive grains, and there are pores in the grinding wheel. In particular, the abrasive grain size of the fine grinding abrasive wheel is smaller than the abrasive grain size of the rough abrasive wheel, so that the ground surface of the silicon rod can form a surface with a higher surface finish during grinding; or The abrasive grain density of the fine abrasive abrasive wheel is greater than the abrasive grain density of the coarse abrasive abrasive wheel, and has a higher smoothness.

The abrasive of the grinding wheel can be set as abrasive grains with a hardness greater than that of silicon materials, such as aluminum oxide, silicon carbide, diamond, cubic boron nitride, etc., according to the requirements for grinding silicon rods.

The fine grinding tool advancing and retreating mechanism 52 is used to drive at least one fine grinding tool of the at least one pair of fine grinding tools 51 to move laterally in a second direction, and the second direction is perpendicular to the first direction. The width direction of the defined silicon rod grinder. The fine grinding tool advance and retreat mechanism 52 controls the movement of at least one of the pair of fine grinding tools 51 in the second direction, so as to control the two grinding tools of the pair of fine grinding tools 51. The relative distance between the tools in the second direction, which in turn controls the amount of feed during the grinding process, also determines the amount of grinding.

In some implementations, each pair of rough grinding tools is equipped with a rough grinding tool advance and retreat mechanism. In the embodiment shown in FIG. 2, the fine grinding tool advance and retreat mechanism includes a sliding guide rail 522, a driving motor 521, and a ball screw. The sliding guide rail 522 is arranged along the second direction and is arranged on the first processing area of the machine base. The bottom of the fine grinding tool 51 is provided with a guide groove in the second direction that cooperates with the sliding guide rail 522. The ball screw is arranged along the sliding guide rail 522 and is axially connected to the driving motor 521.

In an embodiment of the present application, one of the at least one pair of fine grinding tools is equipped with the drive motor and the ball screw, and one of the pair of grinding tools disposed oppositely is moved to Change the relative distance between fine grinding tools.

In an embodiment of the present application, each grinding tool in the at least one pair of fine grinding tools is equipped with the drive motor and the ball screw, and the drive motor can individually control the corresponding grinding tool in the first The position in the two directions, or based on a certain cooperative relationship, makes the two abrasives move away from or close to each other at the same linear velocity. For example, during the grinding process, the pair of fine grinding abrasives have the same size in the second direction. The speeds are fed in opposite directions, and a pair of fine grinding wheels rotate at the same linear speed for grinding.

In an embodiment of the present application, a pair of fine grinding tools are driven by the same drive motor to move in the second direction at equal and reverse speeds. In the first implementation of this embodiment, the fine grinding tool advance and retreat mechanism includes a driving motor, a driving gear, a pair of racks, and a guide rail. The guide rail is arranged along the second direction and is arranged on the first processing area of the machine base, and the bottom of the fine grinding tool is provided with a guide groove along the second direction that cooperates with the guide rail. The drive motor drives the gear to rotate, and the pair of racks mesh with opposite ends of the drive gear. When the drive gear rotates, the pair of racks are driven by linear velocities at opposite ends of the gear. Shown as being close to each other or far away from each other. In the first implementation of this embodiment, one end of each rack of the pair of racks is meshed with the drive gear, and the other end is respectively connected with a fine grinding tool, so that the pair of fine grinding tools are in the first place. The directions are away from each other or close to each other along the guide rails.

In an embodiment of the present application, the fine grinding device further includes a cooling device to cool the at least one pair of fine grinding tools, reduce damage to the silicon rod surface layer during the grinding process, and improve the grinding efficiency of the grinding wheel. Service life. In an implementation of this embodiment, the cooling device includes a cooling water pipe, a diversion groove, and a diversion hole. In some embodiments, the outer periphery of the grinding wheel is provided with a protective cover for placing cooling water into the rotating drive motor of the grinding wheel. One end of the cooling water pipe is connected to a cooling water source, and the other end is connected to the surface of the protective cover of the grinding wheel. The diversion groove is provided on the protective cover as a contact point between the protective cover and the cooling water pipe. The diversion hole is provided In the cooling tank. The coolant of the cooling device can be common cooling water, the cooling water pipe is connected to the cooling water source, and the cooling water sucked through the cooling water pipe is directed to the diversion groove and diversion hole on the surface of the grinding wheel, and is directed to the grinding wheel and the silicon rod to be ground The contact surface of the grinding wheel is cooled. During the grinding of the grinding wheel, the cooling water from the rotating orifice of the grinding wheel enters the interior of the grinding wheel by centrifugal action for sufficient cooling.

The at least one pair of fine grinding tools corresponds to the at least one pair of clamping arms. During the grinding process, a pair of opposed clamping arms clamps the silicon rod to move in the first direction to control the side of the silicon rod. The order of grinding and chamfering the edges and corners can be ensured by reciprocating motion to ensure sufficient grinding in the length direction of the silicon rod. A pair of oppositely arranged fine grinding tools move in the second direction to ensure that the grinding tools are in contact with the silicon rod. The feed rate of face grinding.

In the silicon rod grinder provided by the present application, in actual grinding, the first processing zone and the second processing zone can be in a working state at the same time, and different silicon rods can be rough-grinded and fine-grinded respectively. In an embodiment, a single crystal silicon rod to be ground is transferred to the first processing position, and the silicon rod is ground by a rough grinding device under the clamping of the first silicon rod clamp, and after the rough grinding is finished , The clamp of the first silicon rod clamp is driven by the lifting device to raise the clamp arm and the clamped silicon rod to a certain height, and then the first driving device drives the first silicon rod clamp and the clamped silicon rod along the first A transfer rail moves to transfer the first silicon rod clamp and the clamped silicon rod from the first processing area to the second processing area. At the second processing area, the clamping arm of the first silicon rod clamp descends along its lifting rail to realize the grinding of the fine grinding device and the clamped silicon rod; the silicon rod clamped by the first silicon rod clamp is performed At the same time of fine grinding, a silicon rod is clamped by the second silicon rod holder to coarsely grind the silicon rod in the first processing position. When the rough grinding is completed, the silicon rod in the second processing position is finished; The silicon rods that have been rough-grinded are transferred to the second processing area for fine grinding. The silicon rods clamped by the first transfer device are transferred out of the silicon rod processing platform after being finely ground. During the transfer process, the first silicon rod holder and the second The lifting device of the silicon rod clamp adjusts the height of the clamping arm and the clamped silicon rod respectively, so that during the transfer process, the first transfer path and the second transfer path and the silicon rods and the clamping structure on the transfer path are interlaced; The transfer device then continues to clamp the silicon rod that has not been ground, that is, repeats the above process.

In some embodiments of the present application, the first silicon rod clamp and the second silicon rod clamp include a plurality of pairs of clamping arms disposed opposite to each other in a first direction, and are respectively disposed at the rough grinding device and the fine grinding device. There are many pairs of rough grinding tools and fine grinding tools arranged oppositely. In some implementations, the number of pairs of clamp arms on the first silicon rod clamp, the second silicon rod clamp, the rough grinding device, and the fine grinding device is the same as the number of pairs of grinding tools, and each pair of clamping arms corresponds to each pair of grinding tools. The driving mechanism of the tool is relatively independent, and the transfer and grinding of multiple silicon rods between the first processing location and the second processing location can be performed relatively independently at the same time.

In some embodiments of the present application, the silicon rod grinder further includes a silicon rod transfer device. The silicon rod transfer device is used to transfer the silicon rod to be processed to the first processing position or transfer the silicon rod after grinding out of the silicon rod processing platform.

Please refer to FIG. 10, which shows a simplified schematic diagram of the silicon rod grinding machine in an embodiment of the present application. As shown in FIG. 10, the silicon rod transfer device 6 is adjacent to the first processing position of the silicon rod processing platform 11 and penetrates the first transfer device 2 and the second transfer device 3. In an embodiment of the present application, the silicon rod transfer device 6 may be configured as a conveyor belt mechanism, the transfer direction of which is along the second direction, and the silicon rods located on the transfer device are transported to the first processing location. The end points of the two ends of the conveyor belt can be set on the left and right sides of the machine base, and the transmission distance covers the width of the silicon rod grinder. The silicon rods can be transferred from the feeding position to the first processing position according to the processing needs. A transfer rail or a second transfer rail, or transfer the silicon rods in the first processing zone or the second processing zone out of the silicon ingot processing platform to the unloading position. The loading position and the unloading position may be the same position and set at the same end of the silicon rod transfer device; or may be respectively set at the two ends of the silicon rod transfer device in the second direction, that is, the left and right ends.

In some implementations of the present application, the silicon rod transfer device 6 can also be configured as a chain conveying mechanism or a double-speed chain mechanism to realize the silicon rods in different processing locations and loading positions or unloading positions in the second direction. Transfer between.

In some embodiments of the present application, the silicon rod processing platform 11 is further provided with a waiting area (not shown in the figure), and the silicon rod grinder further includes a silicon rod transfer device 6. The waiting area is arranged on the side of the machine base in the second direction, and can be used as the feeding position of the silicon rod to be processed and the unloading position of the silicon rod after the processing is completed.

The silicon rod transfer device 6 is arranged adjacent to the waiting area of the silicon rod processing platform 11, and is used to transfer the silicon rods to be processed to the waiting area of the silicon rod processing platform 11 or to transfer the waiting area of the silicon rod processing platform 11 to the waiting area. The processed silicon rods are transferred out of the silicon rod processing platform 11. In an implementation manner, the silicon rod transfer device 6 may be configured as a conveyor belt mechanism, the transfer direction of which is along the second direction, and the silicon rods located on the transfer device are transported to the first processing location. The end points of the two ends of the conveyor belt can be set on the left and right sides of the machine base, and the transmission distance covers the width of the silicon rod grinder. The silicon rods can be transferred from the feeding position to the first processing position according to the processing needs. A transfer rail or a second transfer rail, or transfer the silicon rods in the first processing zone or the second processing zone out of the silicon ingot processing platform 11 to the unloading position. The loading position and the unloading position may be the same position and set at the same end of the silicon rod transfer device; or may be respectively set at the two ends of the silicon rod transfer device in the second direction, that is, the left and right ends.

In some implementations of the present application, the silicon rod transfer device can also be configured as a chain conveying mechanism or a double-speed chain mechanism, so as to realize the silicon rod in the second direction between the different processing positions and the loading position or the unloading position. Between transfers.

Through the silicon rod grinder provided in the present application, in the grinding process of silicon rods, the rough grinding device and the fine grinding device at the first working zone and the second working zone can respectively grind silicon rods in different grinding stages , On the basis of maintaining the size and cost of the silicon rod grinding machine, the grinding processing efficiency is increased to twice, which reduces the time consumption of silicon rod processing and improves economic benefits.

In order to realize the use of the silicon rod grinder provided in the present application, the second aspect of the present application also provides a silicon rod grinding method, which can be used in a silicon rod grinder. The silicon rod grinder includes a machine base with a silicon rod processing platform, the silicon rod processing platform is provided with a first processing position and a second processing position; the silicon rod grinder also includes a first transfer device and a second transfer device. Device, rough grinding device, and fine grinding device, wherein the first transfer device includes a liftable first silicon rod holder, a first transfer rail, and a first drive mechanism, and the second transfer device includes a liftable The second silicon rod holder, the second transfer guide rail, and the second driving mechanism.

The fine grinding device and the rough grinding device are respectively located in different processing locations; in the embodiment provided in the present application, the rough grinding device and the fine grinding device are respectively arranged at the first processing location and the second processing location, respectively. The fine grinding device includes at least a pair of fine grinding tools that can simultaneously grind the opposite sides of the silicon rod; the rough grinding device includes at least a pair of rough grinding tools that can simultaneously perform the grinding on the opposite sides of the silicon rod Grind. In some implementations, at least one of the pair of abrasive tools of the rough grinding device has a degree of freedom of movement in the second direction, and at least one of the pair of abrasive tools of the rough grinding device has a first The freedom of movement in two directions can control the grinding amount of the silicon rod during the grinding process of rough grinding operation and fine grinding operation.

The first driving mechanism drives the first silicon rod holder to move along the first transfer rail; the second driving mechanism drives the second silicon rod holder to move along the second transfer rail. The first transfer guide rail and the first transfer guide rail are arranged on the base in parallel, and are arranged along the first direction.

The first direction and the second direction are perpendicular to each other. In the embodiment provided in this application, the first direction is along the length direction of the base, and the second direction is the width direction of the base.

In some embodiments, the silicon rod grinder applicable to the silicon rod grinding method includes the silicon rod grinder of any one of the embodiments shown in FIGS. 1 to 10.

The silicon rod grinding method includes the following steps:

Please refer to FIG. 11, which shows a simplified structural diagram of an embodiment of a silicon rod grinding machine for implementing the silicon rod grinding method of the present application. In the state shown in FIG. 11, the first silicon rod 71 is loaded in the first processing station, the first silicon rod holder 21 in the first transfer device is clamped to the first silicon rod 71, and the rough grinding device 4 The rough grinding operation is performed on the first silicon rod 71 located at the first processing area. In some implementations, the first silicon rod 71 moves in the first direction while being clamped by the first silicon rod holder 21, and is driven by the first silicon rod holder 21 during the rough grinding process and the subsequent fine grinding process. The movement of the first silicon rod 71 causes the contact surface between the first silicon rod 71 and the grinding tool to move from one end of the silicon rod to the other end, that is, the grinding of the two opposite sides is completed; or, the first The silicon rod clamp 21 drives the first silicon rod 71 to move around in the first direction, so that the contact surface of the first silicon rod 71 and the rough grinding tool fully covers the side surface of the first silicon rod 71 during the movement. The first silicon rod holder 21 includes at least a pair of clamping arms, the clamping arms are rotatable, and the first silicon rod 71 can be rotated along the axis of the first direction under the clamping of the clamping arms. , That is, the switching and chamfering of the different sides of the first silicon rod 71 are realized.

Please refer to FIG. 12, which shows a simplified schematic diagram of a silicon rod grinding machine in an embodiment of the silicon rod grinding method of the present application. In the state shown in FIG. 12, after the rough grinding of the first silicon rod 71 in the first processing position is completed, the first driving mechanism in the first transfer device is caused to drive the first silicon rod holder 21 and The clamped first silicon rod 71 moves along the first transfer rail to transfer the first silicon rod 71 from the first processing position to the second processing position, so that the fine grinding device 5 performs the first silicon rod 71 Fine grinding operation; at this stage, the second driving mechanism in the second transfer device is made to drive the second silicon rod fixture to move along the second transfer path, so that the second silicon rod fixture is transferred from the second processing area to the first processing location ; The second silicon rod 72 is loaded in the first processing area, so that the second silicon rod clamp 31 in the second transfer device clamps the second silicon rod 72, so that the rough grinding device 4 is located in the first processing area The second silicon rod 72 is subjected to rough grinding operation. During the transfer process, the lifting device of the first silicon rod holder 21 controls the clamping arm and the clamped first silicon rod 71 to rise to a certain height, so that the first silicon rod 71 and the first silicon rod holder The clamping arm of 21 and the clamping arm of the second silicon rod clamp 31 and the second silicon rod clamped are at different levels, and then the first driving device drives the first silicon rod clamp 21 in the first direction. To move from the first processing location to the second processing location.

In some implementations, the second silicon rod 72 moves in the first direction while being clamped by the second silicon rod clamp 31, and the second silicon rod clamp 31 drives the second silicon rod clamp 31 during the rough grinding process and the subsequent fine grinding process. The second silicon rod 72 moves so that the contact surface between the second silicon rod 72 and the abrasive tool moves from one end of the silicon rod to the other end, that is, the grinding of the two opposite sides is completed; or, the second The silicon rod clamp 31 drives the second silicon rod 72 to move around in the first direction, so that the contact surface between the second silicon rod 72 and the abrasive tool fully covers the side surface of the first silicon rod 71 during the movement. The second silicon rod clamp 31 includes at least a pair of clamping arms, the clamping arms are rotatable, and the second silicon rod 72 can be rotated along the axis of the first direction under the clamping of the clamping arms. , That is, the grinding switching and chamfering of the different sides of the clamped second silicon rod 72 are realized.

Please refer to FIG. 13, which shows a simplified structure diagram of an embodiment of a silicon rod grinding machine for implementing the silicon rod grinding method of the present application. When the fine grinding operation of the first silicon rod 71 located in the second processing area is completed, the rough grinding operation of the second silicon rod 72 located in the first processing area is completed. As shown in FIG. 13, the first driving mechanism in the first transfer device is made to drive the first silicon rod holder 21 and the first silicon rod 71 held by it to move along the first transfer rail to move the first silicon rod 71 is transferred from the second processing area to the first processing area, and then the first silicon rod 71 is unloaded from the first processing area and loaded with the third silicon rod, so that the first silicon rod clamp 21 in the first transfer device clamps the third silicon rod. For silicon rods, the rough grinding device 4 is used to perform rough grinding operations on the third silicon rod located in the first processing area; at this stage, the second driving mechanism in the second transfer device is caused to drive the second silicon rod holder 31 and its clamps. The held second silicon rod 72 moves along the second transfer rail to transfer the second silicon rod 72 from the first processing position to the second processing position, so that the fine grinding device 5 is positioned at the second processing position. The two silicon rods 72 perform fine grinding operations. In the process of transferring the first silicon rod 71 from the second processing location to the first processing location, while transferring the second silicon rod 72 from the first processing location to the second processing location, the first silicon rod The displacements of the rod holder 21 and the second silicon rod holder 31 and the first and second silicon rods held by them respectively include movement along the first direction, so that the first driving mechanism in the first transfer device drives the first silicon rod. The rod clamp 21 and its clamped first silicon rod 71 move along the first transfer path and the second driving mechanism in the second transfer device drives the second silicon rod clamp 31 and its clamped second silicon rod 72 along the The second transfer path moves. The lifting device of the first silicon rod clamp 21 controls the height of the horizontal plane between the clamping arm and the first silicon rod 71, and the lifting device of the second silicon rod clamp 31 controls the clamping arm and the clamped second silicon rod 72. When moving, the first transfer path and the second transfer path are at different heights, that is, they are in a state of interlacing in the third direction in space, which can prevent the two silicon rod clamps from moving along the first The paths overlap and collide in one direction of movement.

When the fine grinding operation of the second silicon rod 72 located in the second processing area is completed, the third silicon rod located in the first processing area completes the rough grinding operation. The second driving mechanism of the second transfer device drives the second silicon rod clamp 31 and the second silicon rod 72 held by it to transfer from the second processing position to the first processing position along the second transfer guide rail, and at the same time The height of the corresponding second transfer path can be adjusted by the lifting device to unload the second silicon rod 72 after grinding and load the new silicon rod to be ground.

The silicon rod grinding method provided by the present application realizes that different silicon rods are respectively coarsely ground and finely ground on the same silicon rod grinding equipment at the same time, which reduces the waiting time for grinding, and repeats the above-mentioned grinding steps, that is, to achieve Grinding and circulation of a large number of silicon rods.

The application also provides a silicon rod grinding method, which can be used in a silicon rod grinding machine.

The silicon rod grinder includes a base with a silicon rod processing platform, the silicon rod processing platform is provided with a first processing location, a second processing location, and a waiting location; the silicon rod grinder also includes a first transfer device, The second transfer device, the rough grinding device, and the fine grinding device; wherein, the first transfer device includes a first silicon rod holder, a first transfer rail, and a first drive mechanism, and the second transfer device includes a second silicon rod holder. The rod clamp, the second transfer rail, and the second drive mechanism.

The waiting area is adjacent to the first processing area, and is used for loading the silicon rods to be polished that need to be transferred into the processing area or for unloading the silicon rods that have been polished.

The fine grinding device and the rough grinding device are respectively located in different processing positions; in the embodiment provided in this application, the rough grinding device and the fine grinding device respectively correspond to the first processing position and the second processing position.

The fine grinding device includes at least a pair of fine grinding tools that can simultaneously grind the opposite sides of the silicon rod; the rough grinding device includes at least a pair of rough grinding tools that can simultaneously perform the grinding on the opposite sides of the silicon rod Grind. In some implementations, the abrasive tools of the rough grinding device and the fine grinding device both have a degree of freedom of movement in the second direction. For the clamped silicon rods in the first processing position, the grinding tools of the rough grinding device At least one of the pair of rough grinding tools can move in the second direction to control the grinding amount of the silicon rods to be ground during the rough grinding operation; for the clamped silicon rods in the second processing zone At least one of the pair of fine grinding tools of the fine grinding device can be moved in the second direction to control the grinding amount of the silicon rod to be ground during the fine grinding operation.

The silicon rod grinding method includes the following steps:

Load the first silicon rod in the waiting area, make the first silicon rod clamp in the first transfer device clamp the first silicon rod, and make the first driving mechanism in the first transfer device drive the first silicon rod clamp and its clamp The held first silicon rod moves along the first transfer rail to transfer the first silicon rod from the waiting area to the first processing area. In the state shown in FIG. 11, the first silicon rod 71 is transferred to the first processing area, and the rough grinding device 4 is caused to perform rough grinding operation on the first silicon rod 71 located at the first processing area; at this stage The second silicon rod 72 is loaded in the waiting area, so that the second silicon rod holder 31 in the second transfer device clamps the second silicon rod 72.

In some implementations, the first silicon rod 71 moves in the first direction while being clamped by the first silicon rod holder 21. During the rough grinding process and the subsequent fine grinding process, the first silicon rod holder 21 Drive the first silicon rod 71 to move from one end to the other end to finish grinding the two opposite sides; or, the first silicon rod clamp 21 drives the first silicon rod 71 to move around in the first direction to make the The contact surface of the first silicon rod 71 and the rough grinding tool fully covers the side surface of the first silicon rod 71 during movement. The first silicon rod holder 21 includes at least a pair of clamping arms, the clamping arms are rotatable, and the first silicon rod 71 can be rotated along the axis of the first direction under the clamping of the clamping arms. , That is, the switching and chamfering of the different sides of the first silicon rod 71 are realized.

After the rough grinding of the first silicon rod 71 in the first processing zone is completed, the first driving mechanism in the first transfer device is caused to drive the first silicon rod holder 21 and the first silicon rod held by it 71 moves along the first transfer rail to transfer the first silicon rod 71 from the first processing position to the second processing position in accordance with the first transfer path, so that the fine grinding device 5 performs a fine grinding operation on the first silicon rod 71; At this stage, the second driving mechanism in the second transfer device is caused to drive the second silicon rod holder 31 to move along the second transfer path, so that the second silicon rod holder 31 is transferred from the second processing area to the waiting area; The second driving mechanism in the second transfer device is made to drive the second silicon rod holder 31 and the second silicon rod 72 held by it to move along the second transfer rail, so as to transfer the second silicon rod 72 from the waiting area to the second In a processing location, the rough grinding device 4 is allowed to perform rough grinding operation on the second silicon rod 72 located at the first processing location. In the state shown in FIG. 12, the first silicon rod 71 is transferred to the second processing location, and the grinding operation is performed on it by a fine grinding tool; the second silicon rod 72 is transferred to the first processing location, The rough grinding tool is used to grind it. The lifting device of the first silicon rod clamp 21 controls the height of the horizontal plane where the clamping arm and the first silicon rod 71 are located, and the lifting device of the second silicon rod clamp 31 controls the height of the horizontal plane where the clamping arm is located. The first transfer path and the second transfer path are on horizontal planes with different heights, that is, they are in a state of interlacing in the third direction in space.

In the process of transferring the first silicon rod 71 from the second processing location to the first processing location, while transferring the second silicon rod 72 from the first processing location to the second processing location, the first silicon rod The rod clamp 21 and the second silicon rod clamp 31 and the first silicon rod 71 and the second silicon rod 72 respectively held by them all move in the first direction, so that the first driving mechanism in the first transfer device drives the first silicon rod clamp 21 and its clamped first silicon rod 71 move along the first transfer path and make the second driving mechanism in the second transfer device drive the second silicon rod holder 31 and its clamped second silicon rod 72 along the second The transfer path moves. The lifting device of the first silicon rod clamp 21 controls the height of the horizontal plane between the clamping arm and the first silicon rod 71, and the lifting device of the second silicon rod clamp 31 controls the clamping arm and the clamped second silicon rod 72. When moving, the first transfer path and the second transfer path are at different heights, that is, they are in a state of interlacing in the third direction in space, which can prevent the two silicon rod clamps from moving along the first The paths overlap and collide in one direction of movement.

When the fine grinding operation of the first silicon rod 71 located in the second processing area is completed, the rough grinding operation of the second silicon rod 72 located in the first processing area is completed. In the state shown in FIG. 13, the first driving mechanism in the first transfer device drives the first silicon rod holder 21 and the first silicon rod 71 held by it to move along the first transfer rail to move the first silicon rod holder 21 A silicon rod 71 is transferred from the second processing area to the waiting area, and then the first silicon rod 71 is unloaded from the waiting area and loaded with the third silicon rod; the first silicon rod holder 21 in the first transfer device is made to clamp the third silicon rod , And the first drive device drives the first silicon rod holder 21 and the third silicon rod held by it to move along the first transfer rail, so that the third silicon rod is transferred from the waiting area to the first processing area, so that the rough grinding device 4 Perform a rough grinding operation on the third silicon rod located at the first processing area; at this stage, the second driving mechanism in the second transfer device drives the second silicon rod holder 31 and the second silicon rod 72 held by it Move along the second transfer rail to transfer the second silicon rod 72 from the first processing position to the second processing position, so that the fine grinding device 5 performs fine grinding on the second silicon rod 72 located at the second processing position operation. When the first silicon rod holder 21 and the clamped first silicon rod 71 are transferred from the second processing area to the first processing area along the first transfer path, at the same time, the second silicon rod located in the second processing area is transferred. When the rod clamp 31 and the second silicon rod 72 held by it are transferred from the first processing position to the first processing position along the second transfer path, the lifting device of the first silicon rod clamp 21 controls the clamping arm and the first silicon rod 72. The height of the horizontal plane where the silicon rod 71 is located, the lifting device of the second silicon rod clamp 31 controls the height of the horizontal plane where the clamping arm and the clamped second silicon rod 72 are located, so that the first transfer path and the second silicon rod 72 are moved during the movement. The two transfer paths are on horizontal planes with different heights, that is, they are in a state of interlacing in the third direction in space, which can prevent the two silicon rod fixtures from overlapping and colliding during the movement in the first direction.

After the first silicon rod holder 21 and the first silicon rod 71 are transferred to the first processing area, they are driven by the first driving device to continue to move in the first direction to transfer to the waiting area for subsequent unloading and the third silicon rod. Loading.

When the fine grinding operation of the second silicon rod 72 located in the second processing area is completed, the third silicon rod 73 located in the first processing area completes the rough grinding operation. The second drive mechanism of the second transfer device drives the second silicon rod holder 31 and the second silicon rod 72 held by it along the second transfer guide rail from the second processing area to the waiting area, which can be used for grinding The completed second silicon rod 72 is unloaded and loaded with a new silicon rod to be ground.

This application also provides a silicon rod grinding machine and a silicon rod grinding method. Compared with the traditional working method, a single single crystal silicon rod is rough-grinded and then transported to the fine grinding work area for fine grinding. After processing, the silicon rods are transported out of the work area, and this process is repeated in a large amount of grinding work, which can reduce the waiting time of silicon rod processing between different procedures and improve the processing efficiency of silicon rods.

Please refer to FIG. 14, which shows a schematic diagram of the structure of the silicon rod grinding machine in an embodiment of the present application. As shown in FIG. 14, the silicon rod grinding machine includes a base 1, a first transfer device 2, a second transfer device 3, a rough grinding device 4, and a fine grinding device 5.

The machine base 1 has a silicon rod processing platform 11, and the silicon rod processing platform 11 is provided with a first processing location and a second processing location. The silicon rod processing platform 11 is arranged on the upper surface of the machine base 1. In the implementation of the first embodiment, the processing platform is designed to conform to the shape of the machine base 1 and is rectangular, and the first processing area and the second processing area respectively correspond to grinding The rough grinding processing area and the fine grinding processing area in FIG. 14, as shown in FIG. 14, the first processing area and the second processing area are relatively symmetrically and parallelly arranged on the front and rear sides of the silicon rod processing platform 11, which can be independent of each other. The correspondingly carried single crystal silicon rods are processed on the first processing area and the second processing area.

The first transfer device 2 and the second transfer device 3 are arranged above the silicon rod processing platform 11 through a mounting frame 12, and the mounting frame 12 is arranged on the machine base 1 to form a vertical frame structure. The upper surface of the body is higher than the silicon rod processing platform 11 and carries the first transfer device 2 and the second transfer device 3. In an embodiment of the present application, as shown in FIG. 14, the first transfer device 2 and the second transfer device 3 are arranged in parallel on the left and right sides of the mounting frame 12. The supporting structure of the mounting frame 12 is arranged on the upper surface of the base 1. In the illustrated embodiment, the upper surface of the base 1 is rectangular, and the supporting structure of the mounting frame 12 is on the outer edge of the rectangle, so The shape and size of the upper surface of the mounting frame 12 and the upper surface of the base 1 are approximately the same.

Please refer to FIG. 15, which shows a top view of the simplified structure of the silicon rod grinding machine in an embodiment of the present application. As shown in FIG. 15, the first transfer device 2 includes a first silicon rod clamp 21, a first transfer rail 22, and a first driving mechanism (not shown in the figure). The first silicon rod clamp 21 is carried on the On the first transfer rail 22; the first transfer rail 22 is set on the upper surface of the mounting frame, is set along the first direction, and restricts the first silicon rod clamp 21 on it from moving in the first direction. The first driving mechanism is used to drive the first silicon rod holder 21 and the silicon rods held by it to move along the first transfer guide rail 22, and enable the first silicon rod holder 21 to move in the first processing position and the second position. 2. Transfer between processing locations.

Please refer to FIG. 16, which shows a simplified schematic diagram of the silicon rod grinding machine in an embodiment of this application. As shown in FIG. 16, the first silicon rod holder 21 includes a clamping arm mounting seat 211 and at least two clamping arms. 212 and the clamping arm drive mechanism 213.

Please continue to refer to FIG. 14, the first silicon rod clamp is shown as a clamp arm mounting seat set up on the whole, the part except the clamp arm mounting seat including the clamp arm is in a downward hanging state, and the silicon rod clamp mounting seat is carried on the mounting frame On the upper surface of the silicon rod, the clamp arm extends from the hollow part of the clamp arm mounting seat in the mounting frame, so as to realize that the silicon rod clamped by the clamp arm is on the processing surface of the silicon rod processing platform.

The clamp arm mounting seat is arranged on the first transfer rail 22. In an implementation of this embodiment, the bottom of the clamp arm mounting seat is provided with a guide groove structure matching the first transfer rail 22, so The first transfer rail 22 is arranged along the first direction, and the length of the first transfer rail 22 in the first direction at least covers the positions of the first working area and the second working area in the first direction, so as to ensure the The silicon rod clamped by the first silicon rod holder is transferred between the two working areas. In an implementation of this embodiment, the first transfer rail 22 is arranged to span the entire length of the mounting frame in the first direction.

Please refer to FIG. 17, which shows a schematic structural diagram of the first silicon rod holder 21 of this application in an embodiment. As shown in FIG. 17, the clamping arm mounting seat 211 also has a first direction guide rail, and the clamping arm 212 is arranged on the clamping arm mounting seat 211 through the guide rail and can move in the first direction.

The clamping arm driving mechanism 213 can drive at least one clamping arm of the at least one pair of clamping arms 212 to move along the first direction to adjust the distance between the pair of opposite clamping arms. The clamping ends of the two clamping arms located opposite to each other in the first direction are close to clamping the silicon rods, and the silicon rods are transferred and ground between different working areas while maintaining the clamping state. After the grinding is completed, the silicon rods are transferred to the load-bearing position. Move away from each other to release the silicon rods after processing. In some implementations of this embodiment, the clamping arm driving mechanism 213 may be configured as a traveling motor to drive the clamping arm 212 to move along the guide rail of the clamping arm mounting seat 211.

In an embodiment of the present application, the clamping arm driving mechanism 213 includes a driving motor, a driving gear, and a pair of racks. The drive motor drives the gear to rotate, and the pair of racks mesh with opposite ends of the drive gear. When the drive gear rotates, the pair of racks are driven by linear velocities at opposite ends of the gear. Shown as being close to each other or far away from each other. In the first implementation of this embodiment, one end of each rack of the pair of racks meshes with the drive gear, and the other end is respectively connected to a clamping arm, so that the pair of clamping arms extend along the clamping arm in the first direction. The mounting seat rails are far away or close to each other.

In an embodiment of the present application, the clamping arm has a rotating structure. In the embodiment shown in FIG. 17, the first silicon rod clamp further includes a clamping arm rotation mechanism 214 for driving the clamping arm 212 Rotate. In an implementation of this embodiment, any one of the clamping ends of the pair of clamping arms 212 or the two clamping ends of the pair of clamping arms 212 are provided with a rotatable structure, and the clamping arm rotation mechanism 214 Driven by, the clamping end of the clamping arm rotates with the length direction of the silicon rod, that is, the first direction as the axis, and the clamped silicon rod rotates correspondingly with the first direction as the axis. In actual grinding, the grinding surface and chamfering of silicon rods are on the four sides in the length direction and the edges of the boundaries between the four surfaces. The clamping arm provided by this application can realize different grinding surfaces of silicon rods. And the selection and control of different edges.

In some implementations of this embodiment, the clamping ends of the at least one pair of clamping arms have contact surfaces for clamping the silicon rod. When the clamping ends of the silicon rod are two end faces at both ends of the elongated structure, the contact surfaces of the clamping ends of the clamping arms can be set as vertical contact surfaces or vertical contact surfaces. surface. The contact surface is arranged on a rotatable platform, and the cross section of the platform can be set as a custom regular geometric figure or an irregular geometric figure.

Please refer to FIG. 18, which shows a schematic diagram of the enlarged structure of the silicon rod grinding machine in part A of FIG. 16. As shown in Fig. 18, the clamping end of the clamping arm includes a rotatable round table and a series of protruding contacts arranged on the round table, and each contact has a contact plane. The round table rotates under the drive of the clamping arm rotation mechanism. In an implementation of this embodiment, the protruding length of the contact point, that is, the position in the first direction, can be adjusted, so that the process of clamping the silicon rod Among them, for silicon rods with relatively low end faces, the protruding length of the contacts can be adjusted according to the end faces of the silicon rods, so that each contact surface is in close contact with the end faces of the silicon rods. The protruding length is the length in the first direction from the circular plane of the truncated cone to the contact plane of the contact.

When the silicon rod grinder is used to grind the different sides of the silicon rod or chamfer the edges, the clamping end of the clamping arm is driven to rotate by the clamping arm rotation mechanism. Generally, for a single crystal silicon rod that has been squared, when grinding different sides, the clamping arm rotation mechanism controls the clamping end of the clamping arm to rotate a certain angle, for example, 90°. When chamfering different edges It can be achieved by controlling the clamping end of the clamp arm to rotate a certain angle, such as 45°, 135°, etc. When the grinding surface provided by the grinding device is flat, when chamfering the silicon rod, the clamping arm rotation mechanism can control the clamping end of the clamping arm to rotate at different angles to the silicon rod it clamps. The secondary chamfering can be realized. For example, after grinding a side surface of a silicon rod, the adjacent edge of the side surface and the opposite edge of the edge can be rotated by a certain angle, such as 40°, 45°, 50° Perform multiple chamfering to obtain a silicon rod with a smoother transition at the junction of different sides. The angles are all rotation angles from the initial position of grinding. The method of realizing chamfering can refer to patent publications such as CN108942570A. By driving the silicon rod to rotate to a certain angle, the abrasive tool cooperates with the lateral feed in the second direction to realize the grinding of the corners.

In an embodiment of the present application, as shown in FIG. 16, the first silicon rod clamp is a lift-type silicon rod clamp. In an implementation manner, the first silicon rod clamp includes a lifting rail and a driving device in the lifting direction, and the clamp arm of the silicon rod clamp and the horizontal guide rail carrying the clamp arm on the silicon rod mounting seat can be along the The lifting rail moves in the third direction, which can be used to control the vertical relative position of the outer surface of the silicon rod and the grinding surface of the grinding tool, so as to select the grinding surface of the silicon rod and the grinding area of the grinding tool for grinding. In an implementation of this embodiment, the lifting rail is arranged on the vertical surface of the silicon rod mounting seat, and the clamping arm is correspondingly provided with a guide groove that cooperates with the lifting rail and driving the clamping arm A driving mechanism that generates a lifting movement; the driving mechanism includes a traveling screw and a traveling motor, the traveling screw is arranged along the lifting guide rail and connected to the traveling motor, and driven by the traveling motor to drive the clamp arm in the first Movement in three directions. In another implementation manner, each cantilever arm of the pair of clamping arms is configured as a telescopic device, which is driven by the telescopic drive mechanism to simultaneously perform lifting movements.

Please continue to refer to FIG. 15, the first driving mechanism includes a first moving rack, a first driving gear, and a first driving power source. The first moving rack is arranged along the first direction and is parallel to the first transfer rail 22. In the embodiment shown in FIG. 15, the first movable rack is fixed on the upper surface of the mounting frame, and is set to have a first direction dimension approximately the same as that of the first transfer rail 22, which is similar to that of the first transfer rail 22. Parallel and adjacent to each other.

Please continue to refer to FIG. 15, the second transfer device 3 includes a second silicon rod clamp 31, a second transfer rail 32 and a second driving mechanism. The second silicon rod clamp 31 is carried on the second transfer guide rail 32; the second transfer guide rail 32 is arranged on the upper surface of the mounting frame, is arranged along the first direction, and restricts the second silicon rod on it The clamp 31 moves in the first direction; the second drive mechanism is used to drive the second silicon rod clamp 31 and the silicon rods held by it to move along the second transfer rail 32, and make the second silicon rod clamp 31 Realize the transfer between the first processing location and the second processing location.

As shown in FIG. 15, the second transfer rail 32 and the first transfer rail 22 are arranged in parallel along the first direction, and the first silicon rod holder 21 of the first transfer device 2 and the second transfer device 2 are parallel to each other. The second silicon rod clamps 31 of the device 3 respectively move on mutually parallel paths defined by the first transfer rail 22 and the second transfer rail 32. When the first silicon rod holder 21 and the silicon rods held by it are transferred between different processing locations, the second silicon rod holder 31 and the silicon rods held by it can also be transferred between different processing locations. The movements of the first silicon rod holder 21 and the second silicon rod holder 31 are independent of each other, and the transfer guide rails that limit the movement range thereof are respectively arranged at different spatial positions without interfering with each other.

In an embodiment of the present application, the top views of the base of the silicon rod grinder and the mounting frame are both shown as regular rectangles, and the first transfer rail and the second transfer rail are both along the first The direction arrangement is a parallel and symmetrical arrangement, and the symmetry line is the central axis of the base in the first direction.

Please continue to refer to FIG. 16. As shown in the figure, the second silicon rod clamp 31 includes a clamping arm mounting seat 311, at least two clamping arms 312 and a clamping arm driving mechanism 313.

Please continue to refer to FIG. 14, the second silicon rod clamp is shown as a clamp arm mounting seat set up on the whole, the part other than the clamp arm mounting seat including the clamp arm is in a downward hanging state, and the silicon rod clamp mounting seat is carried on the mounting frame On the upper surface of the silicon rod, the clamp arm extends from the hollow part of the clamp arm mounting seat in the mounting frame, so as to realize that the silicon rod clamped by the clamp arm is on the processing surface of the silicon rod processing platform.

The clamp arm mounting seat is arranged on the second transfer rail 32. In an implementation of this embodiment, the bottom of the clamp arm mounting seat is provided with a guide groove structure matching the second transfer rail 32, so The second transfer rail 32 is arranged along the first direction, and the length of the second transfer rail 32 in the first direction at least covers the positions of the first working area and the second working area in the first direction to ensure the The silicon rod clamped by the second silicon rod holder is transferred between the two working areas. In an implementation of this embodiment, the second transfer rail 32 is arranged to span the entire length of the mounting frame in the first direction.

In an embodiment of the present application, the clamp arm mounting seat also has a first-direction guide rail. Please refer to FIG. 19, which shows a schematic structural diagram of the second silicon rod clamp of the present application in an embodiment. As shown in FIG. 19, the clamping arm 312 is arranged on the clamping arm mounting seat 311 through the guide rail 3111 and can move in the first direction.

The clamping arm driving mechanism 313 can drive at least one clamping arm of the at least one pair of clamping arms to move along the first direction to adjust the distance between the pair of opposed clamping arms. The clamping ends of the two clamping arms located opposite to each other in the first direction are close to clamping the silicon rods, and the silicon rods are transferred and ground between different working areas while maintaining the clamping state. After the grinding is completed, the silicon rods are transferred to the load-bearing position. Move away from each other to release the silicon rods after processing. In some implementations of this embodiment, the clamping arm driving mechanism may be configured as a traveling motor to drive the clamping arm to move along the guide rail of the clamping arm mounting seat.

In an embodiment of the present application, the clamping arm driving mechanism includes a driving motor, a driving gear, and a pair of racks. The drive motor drives the gear to rotate, and the pair of racks mesh with opposite ends of the drive gear. When the drive gear rotates, the pair of racks are driven by linear velocities at opposite ends of the gear. Shown as being close to each other or far away from each other. In the first implementation of this embodiment, one end of each rack of the pair of racks meshes with the drive gear, and the other end is respectively connected to a clamping arm, so that the pair of clamping arms extend along the clamping arm in the first direction. The mounting seat rails are far away or close to each other.

In an embodiment of the present application, the clamping arm has a rotating structure. In the embodiment shown in FIG. 19, the second silicon rod clamp further includes a clamping arm rotating mechanism 314 for driving the clamping arm 312 Rotate. In an implementation of this embodiment, any one or both of the clamping ends of the pair of clamping arms 312 are provided with a rotatable structure, and the clamping arm is driven by the clamping arm rotation mechanism 314 to make the clamping arm The clamping end of 312 rotates with the length direction of the silicon rod, that is, the first direction as the axis, and the clamped silicon rod rotates correspondingly with the first direction as the axis. In actual grinding, the grinding surface and chamfering of silicon rods are on the four sides in the length direction and the edges of the boundaries between the four surfaces. The clamping arm provided by this application can realize different grinding surfaces of silicon rods. And the selection and control of different edges.

In an embodiment of the present application, the clamping end of the clamping arm can be set as a rotatable circular platform, and the circular plane of the circular platform is in contact with the end surface of the silicon rod, and is kept in contact with the end surface of the silicon rod after being close to the end surface of the silicon rod. The end face is relatively static. The clamping end of the silicon rod also includes a locking structure, and the clamping end of the clamping arm is in a locked state when a certain selected surface is ground. In the switching of different grinding surfaces, the silicon rod clamping end is driven by the clamping arm rotating mechanism to rotate along the center of the truncated cone.

Please continue to refer to FIG. 18, the clamping end of the clamping arm includes a rotatable round table and a series of protruding contacts arranged on the round table, and each contact has a contact plane. The round table rotates under the drive of the clamping arm rotation mechanism. In an implementation of this embodiment, the protruding length of the contact point, that is, the position in the first direction, can be adjusted, so that the process of clamping the silicon rod Among them, for silicon rods with relatively low end faces, the protruding length of the contacts can be adjusted according to the end faces of the silicon rods, so that each contact surface is in close contact with the end faces of the silicon rods. The protruding length is the length in the first direction from the circular plane of the truncated cone to the contact plane of the contact.

In an embodiment of the present application, the clamping end of the silicon rod clamp is provided with a pressure sensor to adjust the protruding length of the contact based on the detected pressure state. Generally, in the process of clamping the silicon rod, a pair of clamping arms of the first silicon rod clamp are driven by the clamping arm drive mechanism to approach each other in a first direction, until the contact surface of the clamping end is in contact with the desired one. The end faces of the clamped silicon rods are in contact with each other. When the clamping end is provided with a plurality of contacts and it is detected that the pressure value of the part of the contacts in contact with the end face of the contacted silicon rod is less than a set value or a set area, The degree of clamping can be changed by adjusting the protruding length of the contact (generally toward the direction of approaching the end face of the silicon rod); or, each clamping end of the pair of clamping arms of the first silicon rod clamp is set to A contact surface, in the process of clamping the silicon rod, a pair of clamping arms are driven by the clamping arm drive mechanism to approach the end faces of the two ends of the silicon rod to approach each other. After the clamping end is in contact with the end face of the silicon rod , The pressure sensor detects the clamping degree of the silicon rod, and when the set pressure range is reached, the clamping arm drive mechanism controls to stop the relative movement of the pair of clamping arms.

In an embodiment of the present application, as shown in FIG. 16, the second silicon rod clamp 31 is an elevating silicon rod clamp. In an implementation manner, the clamping arm mounting seat 311 of the second silicon rod clamp 31 is provided with a guide rail in the lifting direction, and the clamping arm 312 of the second silicon rod clamp 31 is connected to the supporting clamp on the silicon rod mounting seat. The rail of the arm can move in the third direction along the lifting rail, and can be used to control the relative position of the outer surface of the silicon rod and the grinding surface of the grinding tool in the vertical direction, so as to select the ground surface of the silicon rod and the grinding tool for The polishing area where the polishing is performed. In an implementation of this embodiment, the lifting rail is arranged on the vertical surface of the silicon rod mounting seat, and the clamping arm 312 is correspondingly provided with a guide groove that cooperates with the lifting rail and drives the clip. A driving mechanism for raising and lowering the arm; the driving mechanism includes a traveling screw and a traveling motor, the traveling screw is arranged along the lifting guide rail and connected to the traveling motor, and driven by the traveling motor to drive the clamp arm in Movement in the third direction. In another implementation manner, each of the cantilever arms of the pair of clamping arms 312 is configured as a telescopic device, which simultaneously moves up and down under the drive of the telescopic drive mechanism.

Please continue to refer to FIG. 15, the second driving mechanism includes a second moving rack, a second driving gear, and a second driving power source. The second moving rack is arranged along the first direction and is parallel to the second transfer rail. In the embodiment shown in FIG. 15, the second movable rack is fixed on the upper surface of the mounting frame, is set to have a first direction dimension approximately the same as that of the second transfer rail, and is parallel and parallel to the second transfer rail. Adjacent setting.

The second driving gear is disposed on the second silicon rod clamp 31 and meshes with the second moving rack, for driving the second silicon rod clamp 31 to move along the second transfer rail 32. The second driving power source is used to drive the second driving gear. In an implementation manner of the present application, the second drive gear is arranged on the silicon rod mounting seat of the second silicon rod holder 31, the second drive gear is driven to rotate by a second drive power source, and the first The gear teeth of the second drive gear mesh with the second moving rack and follow the second moving rack. The second silicon rod clamp 31 connected with the second drive gear thus produces a corresponding response on the second transfer rail 32. Mobile.

Please refer to FIG. 20, which shows a schematic diagram of the structure of the silicon rod grinding machine in an embodiment of the present application. As shown in FIG. 20, the rough grinding device 4 includes at least a pair of rough grinding tools 41 and a rough grinding tool advance and retreat mechanism 42.

The at least one pair of rough grinding tools 41 are arranged at the first processing location, and the pair of rough grinding tools 41 appear to be oppositely arranged in the second direction. In some implementations, the rough grinding tool 41 includes a grinding wheel and a rotating shaft. The grinding wheel has a certain degree of granularity and roughness. The two oppositely arranged grinding wheels are respectively provided to the two symmetrical grinding surfaces of the clamped silicon rod. In some embodiments, the grinding wheel is circular and has a through hole in the middle. . The grinding wheel is formed by consolidating abrasive grains and a bonding agent, and forms a surface with abrasive grains to rotate in contact with the surface of the silicon rod to be ground. The rough grinding wheel has a certain size and density of abrasive grains, and at the same time there are pores in the grinding wheel. The abrasive of the grinding wheel can be set as abrasive grains with a hardness greater than that of silicon materials, such as aluminum oxide, silicon carbide, diamond, cubic boron nitride, etc., according to the requirements for grinding silicon rods.

The rough grinding tool advance and retreat mechanism 42 is used to drive at least one rough grinding tool 41 of the at least one pair of rough grinding tools 41 to move laterally in a second direction, the second direction being perpendicular to the first direction The width direction of the defined silicon rod grinder. The rough grinding tool advance and retreat mechanism 42 controls the movement of at least one rough grinding tool in the pair of rough grinding tools 41 in the second direction, so as to adjust the two rough grinding tools in the pair of rough grinding tools 42 The relative distance between the tools in the second direction, which in turn controls the amount of feed during the grinding process, also determines the amount of grinding. In the first transfer device and/or the second transfer device, the silicon rods are carried and transferred through the first processing area to move to the second processing area or when the grinding of the silicon rods is completed, the silicon rods are transferred through the first processing area to be transported. When leaving the processing zone, the at least one pair of rough grinding tools 41 move in the second direction under the control of the rough grinding tool advance and retreat mechanism 42 to form a safe transfer path for the silicon rod, that is, the first transfer during the transfer process There is no collision between the device and/or the second transfer device, the silicon rod it carries, and the rough grinding tool 41.

Please refer to FIG. 21, which shows a simplified schematic diagram of the silicon rod grinding machine in an embodiment of the present application. As shown in FIG. 21, in some implementations, each pair of rough grinding tools 41 is equipped with a rough grinding tool advance and retreat mechanism. The rough grinding tool advance and retreat mechanism includes a sliding guide 422, a drive motor 421, and a ball. Lead screw (not shown in the figure). The sliding guide rail 422 is arranged along the second direction and is arranged on the first processing area of the machine base. The bottom of the rough grinding tool 41 is provided with a guide groove in the second direction that cooperates with the sliding guide rail 422. The ball screw is arranged along the sliding guide rail 422 and is axially connected to the driving motor 421.

Please continue to refer to FIG. 20, the fine grinding device 5 includes at least a pair of fine grinding tools 51 and a fine grinding tool advance and retreat mechanism 52.

The at least one pair of fine grinding tools 51 are arranged at the first processing location, and the pair of fine grinding tools 51 appear to be oppositely arranged in the second direction. In some implementations, the fine grinding tool 51 includes a grinding wheel and a rotating shaft. The grinding wheel has a certain degree of granularity and roughness. The two oppositely arranged grinding wheels are respectively provided to the two symmetrical grinding surfaces of the clamped silicon rod. In some embodiments, the grinding wheel is circular and has a through hole in the middle. . The grinding wheel is formed by consolidating abrasive grains and a bonding agent, forming a surface with an abrasive grain portion to contact and rotate with the surface of the silicon rod to be ground. The fine grinding wheel has a certain size and density of abrasive grains, and there are pores in the grinding wheel. In particular, the abrasive grain size of the fine grinding abrasive wheel is smaller than the abrasive grain size of the rough abrasive wheel, so that the ground surface of the silicon rod can form a surface with a higher surface finish during grinding; or The abrasive grain density of the fine abrasive abrasive wheel is greater than the abrasive grain density of the coarse abrasive abrasive wheel, and has a higher smoothness.

The fine grinding tool advancing and retreating mechanism 52 is used to drive at least one fine grinding tool of the at least one pair of fine grinding tools 51 to move laterally in a second direction, and the second direction is perpendicular to the first direction. The width direction of the defined silicon rod grinder. The fine grinding tool advance and retreat mechanism 52 controls the movement of at least one fine grinding tool in the pair of fine grinding tools 51 in the second direction, which can control the two opposite ones of the pair of fine grinding tools 51 The relative distance between the grinding tools in the second direction, which controls the feed rate during the grinding process, also determines the grinding amount. The silicon rods are carried and transferred by the first transfer device and/or the second transfer device through the second processing area to move to the first processing area or when the grinding of the silicon rods is completed, they are transferred to the second processing area for transfer When leaving the processing zone, the at least one pair of fine grinding tools 51 moves in the second direction under the control of the fine grinding tool advance and retreat mechanism 52 to form a safe transfer path for silicon rods, that is, the first transfer during the transfer process There is no collision between the device and/or the second transfer device and the silicon rod it carries and the fine grinding tool 51.

Please continue to refer to FIG. 21. In some implementations, each pair of fine grinding tools 51 is equipped with a fine grinding tool advance and retreat mechanism. The fine grinding tool advance and retreat mechanism includes a sliding guide rail 522, a drive motor 521, and balls. Lead screw (not shown in the figure). The sliding guide rail 522 is arranged along the second direction and is arranged on the first processing area of the machine base. The bottom of the fine grinding tool 51 is provided with a guide groove in the second direction that cooperates with the sliding guide rail 522. The ball screw is arranged along the sliding guide rail 522 and is axially connected to the driving motor 521.

In an embodiment of the present application, the fine grinding device further includes a cooling device to cool the at least one pair of fine grinding tools, reduce damage to the silicon rod surface layer during the grinding process, and improve the grinding efficiency of the grinding wheel. Service life. In an implementation of this embodiment, the cooling device includes a cooling water pipe, a diversion groove, and a diversion hole. In some embodiments, the outer circumference of the grinding wheel is provided with a protective cover for placing cooling water into the rotary drive motor of the grinding wheel. One end of the cooling water pipe is connected to a cooling water source, and the other end is connected to the surface of the protective cover of the grinding wheel. The diversion groove is provided on the protective cover as a contact point between the protective cover and the cooling water pipe. The diversion hole is provided In the cooling tank. The coolant of the cooling device can be common cooling water, the cooling water pipe is connected to the cooling water source, and the cooling water sucked through the cooling water pipe is directed to the diversion groove and diversion hole on the surface of the grinding wheel, and is directed to the grinding wheel and the silicon rod to be ground The contact surface of the grinding wheel is cooled. During the grinding of the grinding wheel, the cooling water from the rotating orifice of the grinding wheel enters the interior of the grinding wheel by centrifugal action for sufficient cooling.

In the silicon rod grinder provided by the present application, in actual grinding, the first processing zone and the second processing zone can be in a working state at the same time, and different silicon rods can be rough-grinded and fine-grinded respectively. In one embodiment, a single crystal silicon rod to be ground is transferred to the first processing position, and a pair of rough grinding tools of the rough grinding device are driven by the rough grinding tool advance and retreat mechanism to move laterally to both sides of the silicon rod. The silicon rods are clamped by the pair of clamping arms of the first transfer device to cooperate with the rough grinding device for grinding; after the rough grinding is finished, the clamping arms of the first transfer device transfer the rough grinding silicon rods along the first direction to the second processing position , The fine grinding tool in the second processing position is driven by the fine grinding tool advance and retreat mechanism to move to both sides of the silicon rod, and then the silicon rod is finely ground by the cooperation of the clamping arm of the first transfer device and the fine grinding tool At the same time, another silicon rod to be ground can be placed on the first processing area, which is clamped by the clamping arm of the second transfer device, and the rough grinding tool moves to the second transfer under the drive of the rough grinding tool advance and retreat mechanism. The two sides of the guide rail, that is, the two sides of the silicon rod to be ground, are rough-grinded. When the rough grinding is completed, the silicon rod in the second processing position is finished. The second transfer device transfers the rough-grinded silicon rod to the second The processing area is subjected to fine grinding, the silicon rods clamped by the first transfer device are finished and transferred out of the silicon rod processing platform, and the first transfer device continues to clamp the silicon rods that have not been ground to repeat the above process.

Please continue to refer to FIG. 14, the silicon rod transfer device 6 is adjacent to the first processing position of the silicon rod processing platform, and penetrates the first transfer device 2 and the second transfer device 3. In an embodiment of the present application, the silicon rod transfer device 6 may be configured as a conveyor belt mechanism, the transfer direction of which is along the second direction, and the silicon rods located on the transfer device are transported to the first processing location. The end points of the two ends of the conveyor belt can be set on the left and right sides of the machine base, and the transmission distance covers the width of the silicon rod grinder. The silicon rods can be transferred from the feeding position to the first processing position according to the processing needs. A transfer rail or a second transfer rail, or transfer the silicon rods in the first processing zone or the second processing zone out of the silicon ingot processing platform to the unloading position. The loading position and the unloading position may be the same position and set at the same end of the silicon rod transfer device; or may be respectively set at the two ends of the silicon rod transfer device in the second direction, that is, the left and right ends.

In some embodiments of the present application, the silicon rod processing platform is further provided with a waiting area, and the silicon rod grinder further includes a silicon rod transfer device.

Please refer to FIG. 22, which shows a schematic diagram of the structure of the silicon rod grinding machine in an embodiment of this application. As shown in FIG. 22, the waiting area 113 is arranged on the side of the machine base in the second direction, and can be used as the feeding position of the silicon rod to be processed and the unloading position of the silicon rod after the processing is completed.

The silicon rod transfer device 6 is located adjacent to the waiting area 113 of the silicon rod processing platform 11, and is used to transfer the silicon rods to be processed to the waiting area 113 of the silicon rod processing platform 11 or to transfer the waiting area 113 The processed silicon rods above are transferred out of the silicon rod processing platform 11. In an implementation manner, the silicon rod transfer device 6 may be configured as a conveyor belt mechanism, the transfer direction of which is along the second direction, and the silicon rods located on the transfer device are transported to the first processing location. The end points of the two ends of the conveyor belt can be set on the left and right sides of the machine base, and the transmission distance covers the width of the silicon rod grinder. The silicon rods can be transferred from the feeding position to the first processing position according to the processing needs. A transfer rail or a second transfer rail, or transfer the silicon rods in the first processing zone or the second processing zone out of the silicon ingot processing platform 11 to the unloading position. The loading position and the unloading position may be the same position and set at the same end of the silicon rod transfer device; or may be respectively set at the two ends of the silicon rod transfer device in the second direction, that is, the left and right ends.

In order to realize the use of the silicon rod grinder provided in the present application, the second aspect of the present application also provides a silicon rod grinding method, which can be used in a silicon rod grinder. The silicon rod grinder includes a machine base with a silicon rod processing platform, the silicon rod processing platform is provided with a first processing position and a second processing position; the silicon rod grinder also includes a first transfer device and a second transfer device. Device, rough grinding device, and fine grinding device, wherein the first transfer device includes a first silicon rod clamp, a first transfer rail, and a first drive mechanism, and the second transfer device includes a second silicon rod clamp, The second transfer rail and the second drive mechanism.

The fine grinding device includes at least a pair of fine grinding tools that can simultaneously grind the opposite sides of the silicon rod; the rough grinding device includes at least a pair of rough grinding tools that can simultaneously perform the grinding on the opposite sides of the silicon rod Grind. In some implementations, at least one of the pair of rough grinding tools of the rough grinding device has a degree of freedom of movement in the second direction, and at least one of the pair of fine grinding tools of the fine grinding tool The fine grinding tool has the freedom to move in the second direction. For the silicon rods clamped on the first transfer rail or the second transfer rail in the first processing zone, the rough grinding device can move to both sides of the silicon rod in the second direction to perform rough grinding operations , And control the grinding amount of the silicon rods to be ground during the rough grinding operation; for the clamped silicon rods on the first transfer rail or the second transfer rail in the second processing position, the fine grinding device The silicon rod can be moved to both sides of the silicon rod in the second direction to perform a fine grinding operation, and the grinding amount of the silicon rod to be ground is controlled during the fine grinding operation.

In some embodiments, the silicon rod grinder applicable to the silicon rod grinding method includes the silicon rod grinder of any one of the embodiments shown in FIGS. 14-22.

The silicon rod grinding method includes the following steps:

Please refer to FIG. 23, which shows a simplified structural diagram of an embodiment of a silicon rod grinding machine for implementing the silicon rod grinding method of the present application. In the state shown in FIG. 23, the first silicon rod 71 is loaded in the first processing station, the first silicon rod holder 21 in the first transfer device is clamped to the first silicon rod 71, and the rough grinding device 4 The rough grinding operation is performed on the first silicon rod 71 located at the first processing area. In some implementations, the first silicon rod 71 moves in the first direction while being clamped by the first silicon rod holder 21, and is driven by the first silicon rod holder 21 during the rough grinding process and the subsequent fine grinding process. The movement of the first silicon rod 71 causes the contact surface between the first silicon rod 71 and the grinding tool to move from one end of the silicon rod to the other end, that is, the grinding of the two opposite sides is completed; or, the first The silicon rod clamp 21 drives the first silicon rod 71 to move around in the first direction, so that the contact surface of the first silicon rod 71 and the rough grinding tool fully covers the side surface of the first silicon rod 71 during the movement. The first silicon rod holder 21 includes at least a pair of clamping arms, the clamping arms are rotatable, and the first silicon rod 71 can be rotated along the axis of the first direction under the clamping of the clamping arms. , That is, the switching and chamfering of the different sides of the first silicon rod 71 are realized.

Please refer to FIG. 24, which shows a simplified structural diagram of an embodiment of a silicon rod grinding machine for implementing the silicon rod grinding method of the present application. In the state shown in FIG. 24, after the rough grinding of the first silicon rod 71 in the first processing zone is completed, the first driving mechanism in the first transfer device is caused to drive the first silicon rod holder 21 and The first silicon rod 71 held by it moves along the first transfer guide 22 to transfer the first silicon rod 71 from the first processing position to the second processing position, so that the fine grinding device 5 pairs the first silicon rod 71 Carry out the fine grinding operation; at this stage, the second silicon rod 72 is loaded in the first processing position, the second silicon rod holder 31 in the second transfer device is clamped to the second silicon rod 72, and the rough grinding device 4 Perform a rough grinding operation on the second silicon rod 72 located in the first processing zone.

Please refer to FIG. 25, which shows a simplified structure diagram of an embodiment of a silicon rod grinding machine for implementing the silicon rod grinding method of the present application. When the fine grinding operation of the first silicon rod 71 located in the second processing area is completed, the rough grinding operation of the second silicon rod 72 located in the first processing area is completed. In the state shown in FIG. 25, the first driving mechanism in the first transfer device is caused to drive the first silicon rod holder 21 and the first silicon rod 71 held by it to move along the first transfer rail 22 to move the The first silicon rod 71 is transferred from the second processing area to the first processing area, and then the first silicon rod 71 is unloaded from the first processing area and the third silicon rod 73 is loaded, so that the first silicon rod holder in the first transfer device 21. Clamp the third silicon rod 73, and make the rough grinding device 4 perform rough grinding operation on the third silicon rod 73 located in the first processing area; at this stage, the second driving mechanism in the second transfer device is caused to drive the second The silicon rod clamp 31 and the second silicon rod 72 held by it move along the second transfer rail 32 to transfer the second silicon rod 72 from the first processing position to the second processing position, so that the fine grinding device 5 is aligned. The second silicon rod 72 located at the second processing area is subjected to a fine grinding operation.

When the fine grinding operation of the second silicon rod 72 located in the second processing area is completed, the third silicon rod 73 located in the first processing area completes the rough grinding operation. The second driving mechanism of the second transfer device drives the second silicon rod holder 31 and the second silicon rod 72 held by it to be transferred from the second processing position to the first processing position along the second transfer guide 32, namely The second silicon rod 72 that has been ground can be unloaded and loaded with a new silicon rod to be ground.

The fine grinding device includes at least a pair of fine grinding tools that can simultaneously grind the opposite sides of the silicon rod; the rough grinding device includes at least a pair of rough grinding tools that can simultaneously perform the grinding on the opposite sides of the silicon rod Grind. In some implementations, at least one of the pair of rough grinding tools of the rough grinding device has a degree of freedom of movement in the second direction, and at least one of the pair of fine grinding tools of the fine grinding tool The fine grinding tool has the freedom to move in the second direction. For the silicon rods clamped on the first transfer rail or the second transfer rail in the first processing zone, the rough grinding device can move to both sides of the silicon rod in the second direction to perform rough grinding operations , And control the grinding amount of the silicon rods to be ground during the rough grinding operation; for the clamped silicon rods on the first transfer rail or the second transfer rail in the second processing position, the fine grinding device It can be moved to both sides of the silicon rod in the second direction to perform a fine grinding operation, and the grinding amount of the silicon rod to be ground is controlled during the fine grinding operation.

The silicon rod grinding method includes the following steps:

Load the first silicon rod in the waiting area, make the first silicon rod clamp in the first transfer device clamp the first silicon rod, and make the first driving mechanism in the first transfer device drive the first silicon rod clamp and its clamp The held first silicon rod moves along the first transfer rail to transfer the first silicon rod from the waiting area to the first processing area. Please refer to FIG. 26, which shows a simplified structural diagram of an embodiment of a silicon rod grinding machine for implementing the silicon rod grinding method of the present application. In the state shown in FIG. 26, the first silicon rod 71 is transferred to the first processing area, and the rough grinding device 4 is caused to perform rough grinding operation on the first silicon rod 71 located at the first processing area; at this stage The second silicon rod 72 is loaded in the waiting area 113, so that the second silicon rod holder 31 in the second transfer device clamps the second silicon rod 72.

After the rough grinding of the first silicon rod 71 in the first processing zone is completed, the first driving mechanism in the first transfer device is caused to drive the first silicon rod holder 21 and the first silicon rod held by it 71 moves along the first transfer rail 22 to transfer the first silicon rod 71 from the first processing position to the second processing position, so that the fine grinding device 5 performs a fine grinding operation on the first silicon rod 71; at this stage, The second driving mechanism in the second transfer device drives the second silicon rod holder 31 and the second silicon rod 72 held by it to move along the second transfer rail 32 to transfer the second silicon rod 72 from the waiting area 113 To the first processing location, the rough grinding device 4 is made to perform rough grinding operation on the second silicon rod 72 located at the first processing location. Please refer to FIG. 27, which shows a simplified structure diagram of an embodiment of a silicon rod grinding machine for implementing the silicon rod grinding method of the present application. In the state shown in FIG. 27, the first silicon rod 71 is transferred to the second processing location, and the grinding operation is performed on it by a fine grinding tool; the second silicon rod 72 is transferred to the first processing location, The rough grinding tool is used to grind it.

Please refer to FIG. 28, which shows a simplified structural diagram of an embodiment of a silicon rod grinding machine for implementing the silicon rod grinding method of the present application. When the fine grinding operation of the first silicon rod 71 located in the second processing area is completed, the rough grinding operation of the second silicon rod 72 located in the first processing area is completed. In the state shown in FIG. 28, the first driving mechanism in the first transfer device drives the first silicon rod holder 21 and the first silicon rod 71 held by it to move along the first transfer rail 22 to move the first silicon rod holder 21 A silicon rod 71 is transferred from the second processing area to the waiting area 113 and then the first silicon rod 71 is unloaded from the waiting area 113 and the third silicon rod 73 is loaded; the first silicon rod holder 21 in the first transfer device is made to clamp the first silicon rod 71 Three silicon rods 73, and the first silicon rod holder 21 and the third silicon rod 73 held by it are driven by the first driving device to move along the first transfer rail 22, so that the third silicon rod 73 is transferred from the waiting area 113 to the second In a processing location, the rough grinding device 4 is allowed to perform rough grinding operation on the third silicon rod 73 located at the first processing location; at this stage, the second driving mechanism in the second transfer device is caused to drive the second silicon rod holder 31 and The second silicon rod 72 clamped by it moves along the second transfer guide 32 to transfer the second silicon rod 72 from the first processing position to the second processing position, so that the fine grinding device 5 is positioned in the second processing position. The second silicon rod 72 at the location performs a fine grinding operation.

When the fine grinding operation of the second silicon rod 72 located in the second processing area is completed, the third silicon rod 73 located in the first processing area completes the rough grinding operation. The second driving mechanism of the second transfer device drives the second silicon rod holder 31 and the second silicon rod 72 held by it to transfer from the second processing area to the waiting area 113 along the second transfer rail 32, that is, The second silicon rod 72 that has been ground is unloaded and loaded with a new silicon rod to be ground.

Based on the above examples, this application provides the following embodiments. In the following description, the various embodiments are represented by serial numbers. For example, the

numbers

1, 2, 3, 4... can represent embodiment 1, embodiment 2, and embodiment respectively. 3. Example 4.... Here, this application provides:

1. A silicon rod grinding machine, characterized in that it comprises:

The machine base has a silicon rod processing platform; the silicon rod processing platform is provided with a first processing location and a second processing location;

The first transfer device includes a first silicon rod clamp, a first transfer rail arranged along a first direction, and a first transfer rail for driving the first silicon rod clamp and the silicon rods held by it to move along the first transfer rail And a first drive mechanism that transfers between the first processing location and the second processing location;

The second transfer device includes a second silicon rod clamp, a second transfer rail arranged along the first direction, and a second transfer rail for driving the second silicon rod clamp and the silicon rods held by it to move along the second transfer rail And a second drive mechanism that transfers between the first processing location and the second processing location;

The rough grinding device is arranged at the first processing location of the silicon rod processing platform, and is used to perform rough grinding operations on the silicon rods located at the first processing location; and

The fine grinding device is arranged at the second processing position of the silicon rod processing platform, and is used for performing fine grinding operations on the silicon rods located at the second processing position.

2. The silicon rod grinder according to embodiment 1, wherein the first transfer device and the second transfer device are arranged above the silicon rod processing platform through a mounting frame.

3. The silicon rod grinder according to embodiment 1, wherein the first silicon rod clamp comprises:

The clamping arm mounting seat is arranged on the first transfer rail;

At least two clamping arms, arranged oppositely along the first direction, for clamping the two end faces of the silicon rod; and

The clamping arm driving mechanism is used to drive at least one clamping arm of the at least two clamping arms to move along the first direction.

4. The silicon rod grinder according to embodiment 3, characterized in that the first silicon rod clamp is an elevating silicon rod clamp.

5. The silicon rod grinder according to embodiment 3, characterized in that the clamping arm has a rotating structure; the first silicon rod clamp further includes a clamping arm rotation mechanism for driving the clamping arm to rotate.

6. The silicon rod grinder according to embodiment 1, wherein the second silicon rod clamp comprises:

The clamping arm mounting seat is arranged on the second transfer rail;

At least a pair of clamping arms, arranged oppositely along the first direction, for clamping the two end faces of the silicon rod; and

7. The silicon rod grinder according to embodiment 6, characterized in that the second silicon rod clamp is an elevating silicon rod clamp.

8. The silicon rod grinder according to embodiment 6, wherein the clamping arm is a rotating structure; the second silicon rod clamping tool further includes a clamping arm rotation mechanism for driving the clamping arm to rotate.

9. The silicon rod grinder according to embodiment 1, wherein the first driving mechanism comprises:

The first moving rack is arranged along the first direction;

A first drive gear, which is provided in the first silicon rod holder and meshes with the first movable rack; and

The first driving power source is used to drive the first driving gear.

10. The silicon rod grinder according to embodiment 1, wherein the second driving mechanism comprises:

The second movable rack is arranged along the first direction;

A second drive gear, which is provided in the second silicon rod holder and meshes with the second movable rack; and

The first driving power source is used to drive the second driving gear.

11. The silicon rod grinding machine according to embodiment 1, wherein the rough grinding device comprises:

At least a pair of rough grinding tools are arranged oppositely at the first processing position of the silicon rod processing platform;

The rough grinding tool advance and retreat mechanism is used to drive at least one rough grinding tool of the at least one pair of rough grinding tools to move laterally in a second direction, wherein the second direction is perpendicular to the first direction.

12. The silicon rod grinder according to embodiment 1, wherein the fine grinding device comprises:

At least one pair of fine grinding tools are arranged oppositely at the first processing position of the silicon rod processing platform;

The fine grinding tool advance and retreat mechanism is used to drive at least one fine grinding tool of the at least one pair of fine grinding tools to move laterally in a second direction, wherein the second direction is perpendicular to the first direction.

13. The silicon rod grinder according to embodiment 1, further comprising: a silicon rod transfer device, which is adjacent to the first processing position of the silicon rod processing platform, and is used to transfer the silicon rods to be processed To the first processing position of the silicon rod processing platform or transfer the processed silicon rods on the silicon rod processing platform from the first processing position.

14. The silicon rod grinder according to embodiment 1, wherein the silicon rod processing platform is further provided with a waiting area, and the silicon rod grinder further includes a silicon rod transfer device, which is adjacent to the silicon rod The waiting area of the processing platform is used to transfer the silicon rods to be processed to the waiting area of the silicon rod processing platform or to transfer the processed silicon rods on the waiting area from the silicon rod processing platform.

15. A silicon rod grinding method, applied to a silicon rod grinding machine, the silicon rod grinding machine includes a base with a silicon rod processing platform, the silicon rod processing platform is provided with a first processing location and a second processing Location, the silicon rod grinder further includes a first transfer device, a second transfer device, a rough grinding device, and a fine grinding device, wherein the first transfer device includes a first silicon rod holder, a first transfer rail, and The first drive mechanism, the second transfer device includes a second silicon rod clamp, a second transfer rail, and a second drive mechanism, characterized in that the silicon rod grinding method includes the following steps:

Make the first drive mechanism in the first transfer device drive the first silicon rod holder and the first silicon rod held by it to move along the first transfer rail to transfer from the first processing area to the second processing area, so that the fine grinding device is aligned The first silicon rod located in the second processing area is subjected to the fine grinding operation. At this stage, the second silicon rod is loaded in the first processing station, and the second silicon rod clamp in the second transfer device is clamped to the second silicon rod , To make the rough grinding device perform rough grinding operation on the second silicon rod located in the first processing area;

The first driving mechanism in the first transfer device drives the first silicon rod holder and the first silicon rod held by it to move along the first transfer guide rail to transfer the first silicon rod from the second processing position to the first processing position. Unload and load the third silicon rod from the first processing area, make the first silicon rod clamp in the first transfer device clamp the third silicon rod, and make the rough grinding device rough-grind the third silicon rod located at the first processing area Work; at this stage, the second drive mechanism in the second transfer device drives the second silicon rod holder and the second silicon rod held by it to move along the second transfer rail to transfer from the first processing area to the second processing area , To make the fine grinding device perform fine grinding operations on the second silicon rod located at the second processing location.

16. A silicon rod grinding method, applied to a silicon rod grinding machine, the silicon rod grinding machine includes a base with a silicon rod processing platform, the silicon rod processing platform is provided with a waiting area, a first processing area and In the second processing position, the silicon rod grinder further includes a first transfer device, a second transfer device, a rough grinding device, and a fine grinding device, wherein the first transfer device includes a first silicon rod holder, a first transfer device A guide rail and a first drive mechanism, the second transfer device includes a second silicon rod clamp, a second transfer guide rail, and a second drive mechanism, characterized in that the silicon rod grinding method includes the following steps:

Make the first silicon rod clamp in the first transfer device clamp the first silicon rod and drive the first silicon rod clamp and the first silicon rod clamped by the first drive mechanism to move along the first transfer rail to the first processing position , Let the rough grinding device perform rough grinding operation on the first silicon rod located in the first processing area; at this stage, load the second silicon rod in the waiting area, and make the second driving mechanism in the second transfer device drive the second silicon rod The rod clamp clamps the second silicon rod;

Make the first drive mechanism in the first transfer device drive the first silicon rod holder and the first silicon rod held by it to move along the first transfer rail to transfer from the first processing area to the second processing area, so that the fine grinding device is aligned The first silicon rod located in the second processing area is subjected to the fine grinding operation; at this stage, the second driving mechanism in the second transfer device is caused to drive the second silicon rod holder and the second silicon rod held by it to be transferred along the second The guide rail moves to transfer from the waiting area to the first processing area, so that the rough grinding device performs rough grinding operation on the second silicon rod located at the first processing area;

Make the first drive mechanism in the first transfer device drive the first silicon rod holder and the first silicon rod held by it to move along the first transfer guide rail to transfer the first silicon rod from the waiting area from the second processing area to the waiting area. Unload and load the third silicon rod in the location, make the first silicon rod clamp in the first transfer device clamp the third silicon rod, and make the first driving mechanism in the first transfer device drive the third silicon rod clamp and the third silicon rod clamped by it. The silicon rod moves along the first transfer rail to transfer from the waiting area to the first processing area, so that the rough grinding device performs a rough grinding operation on the third silicon rod located in the first processing area; at this stage, the second transfer device The second driving mechanism drives the second silicon rod clamp and the second silicon rod held by it to move along the second transfer guide rail to transfer from the first processing area to the second processing area, so that the fine grinding device is positioned at the second processing area The second silicon rod at the location is subjected to fine grinding operations.

The above-mentioned embodiments only exemplarily illustrate the principles and effects of the present application, and are not used to limit the present application. Anyone familiar with this technology can modify or change the above-mentioned embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or changes made by persons with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in this application should still be covered by the claims of this application.

Claims

A silicon rod grinding machine is characterized in that it comprises:

The machine base has a silicon rod processing platform; the silicon rod processing platform is provided with a first processing location and a second processing location;

The first transfer device includes a liftable first silicon rod clamp, a first transfer guide rail arranged along a first direction, and a first transfer path for driving the first silicon rod clamp and the silicon rod clamped by the first silicon rod clamp A first driving mechanism that moves and transfers between the first processing zone and the second processing zone;

The second transfer device includes a liftable second silicon rod clamp, a second transfer guide rail arranged along the first direction, and a second transfer path for driving the second silicon rod clamp and the silicon rod clamped by the second silicon rod clamp A second drive mechanism that moves and transfers between the first processing zone and the second processing zone; wherein, the second transfer device and the first transfer device are in the transfer working state, and the first silicon rod clamp is clamped The silicon rod and the silicon rod clamped by the second silicon rod clamp are located at different height positions;

The rough grinding device is arranged at the first processing location of the silicon rod processing platform, and is used to perform rough grinding operations on the silicon rods located at the first processing location; and

The fine grinding device is arranged at the second processing position of the silicon rod processing platform, and is used for performing fine grinding operations on the silicon rods located at the second processing position.
The silicon rod grinder according to claim 1, wherein the first transfer path includes a first transfer section in the lifting direction, a second transfer section in the first direction, and a third transfer section in the lifting direction; The second transfer path includes a one-way transfer section in a first direction; and the one-way transfer section and the second transfer section in the first direction are located at different height positions.
The silicon rod grinding machine according to claim 1, wherein the first transfer device and the second transfer device are arranged above the silicon rod processing platform through a mounting frame, and the first transfer device and the second transfer device The second transfer devices are respectively arranged on opposite sides of the installation frame.
The silicon rod grinder according to claim 1, wherein the first silicon rod holder comprises:

The clamping arm mounting seat is arranged on the first transfer rail;

At least two clamping arms, arranged oppositely along the first direction, for clamping the two end faces of the silicon rod; and

The clamping arm driving mechanism is used to drive at least one clamping arm of the at least two clamping arms to move along the first direction.
The silicon rod grinder according to claim 4, wherein the clamping arm is a rotating structure; the first silicon rod clamp further comprises a clamping arm rotation mechanism for driving the clamping arm to rotate.
The silicon rod grinding machine according to claim 1, wherein the second silicon rod holder comprises:

The clamping arm mounting seat is arranged on the second transfer rail;

At least a pair of clamping arms, arranged oppositely along the first direction, for clamping the two end faces of the silicon rod; and

The clamping arm driving mechanism is used to drive at least one clamping arm of the at least two clamping arms to move along the first direction.
The silicon rod grinder according to claim 6, wherein the clamping arm is a rotating structure; the second silicon rod clamp further comprises a clamping arm rotation mechanism for driving the clamping arm to rotate.
The silicon rod grinding machine according to claim 1, wherein the first driving mechanism comprises:

The first moving rack is arranged along the first direction;

A first drive gear, which is provided in the first silicon rod holder and meshes with the first movable rack; and

The first driving power source is used to drive the first driving gear.
The silicon rod grinding machine according to claim 1, wherein the second driving mechanism comprises:

The second movable rack is arranged along the first direction;

A second drive gear, which is provided in the second silicon rod holder and meshes with the second movable rack; and

The first driving power source is used to drive the second driving gear.
The silicon rod grinding machine according to claim 1, wherein the rough grinding device comprises:

At least a pair of rough grinding tools are arranged oppositely at the first processing position of the silicon rod processing platform;

The rough grinding tool advance and retreat mechanism is used to drive at least one rough grinding tool of the at least one pair of rough grinding tools to move laterally in a second direction, wherein the second direction is perpendicular to the first direction.
The silicon rod grinding machine according to claim 1, wherein the fine grinding device comprises:

At least one pair of fine grinding tools are arranged oppositely at the first processing position of the silicon rod processing platform;

The fine grinding tool advance and retreat mechanism is used to drive at least one fine grinding tool of the at least one pair of fine grinding tools to move laterally in a second direction, wherein the second direction is perpendicular to the first direction.
The silicon rod grinding machine according to claim 1, further comprising: a silicon rod transfer device, which is adjacent to the first processing position of the silicon rod processing platform, and is used to transfer the silicon rods to be processed to the silicon rod processing platform. The first processing location of the silicon rod processing platform or the processed silicon rods on the silicon rod processing platform are transferred from the first processing location.
The silicon rod grinding machine according to claim 1, wherein the silicon rod processing platform is further provided with a waiting area, and the silicon rod grinding machine further comprises a silicon rod transfer device, which is adjacent to the silicon rod processing platform The waiting area is used to transfer the silicon rods to be processed to the waiting area of the silicon rod processing platform or to transfer the processed silicon rods in the waiting area out of the silicon rod processing platform.
A silicon rod grinding method is applied to a silicon rod grinder. The silicon rod grinder includes a base with a silicon rod processing platform, and the silicon rod processing platform is provided with a first processing zone and a second processing zone, The silicon rod grinding machine further includes a first transfer device, a second transfer device, a rough grinding device, and a fine grinding device, wherein the first transfer device includes a first silicon rod holder, a first transfer rail, and a first transfer device. A driving mechanism, the second transfer device includes a second silicon rod clamp, a second transfer guide rail, and a second driving mechanism, characterized in that the silicon rod grinding method includes the following steps:

Load the first silicon rod in the first processing station, make the first silicon rod clamp in the first transfer device clamp the first silicon rod, and make the rough grinding device rough-grind the first silicon rod located at the first processing position operation;

Make the first drive mechanism in the first transfer device drive the first silicon rod holder and its clamped first silicon rod to move along the first transfer path, and make the second drive mechanism in the second transfer device drive the second silicon rod holder along the first transfer path Move along the second transfer path. The first transfer path and the second transfer path are on the same straight line parallel to the first direction but are staggered up and down and not on the same horizontal plane, so that the first silicon rod clamp and the first silicon clamped by it are on the same straight line. The rod is transferred from the first processing location to the second processing location, and the second silicon rod fixture is transferred from the second processing location to the first processing location;

Make the fine grinding device perform fine grinding operations on the first silicon rod located at the second processing area; at this stage, load the second silicon rod in the first processing station, and make the second silicon rod clamp clamp in the second transfer device Hold the second silicon rod, and make the rough grinding device perform rough grinding operation on the second silicon rod located at the first processing area;

Make the first drive mechanism in the first transfer device drive the first silicon rod holder and the first silicon rod held by it to move along the first transfer path, and make the second drive mechanism in the second transfer device drive the second silicon rod holder and The second silicon rod that it clamps moves along the second transfer path, and the first transfer path and the second transfer path are on the same straight line parallel to the first direction but are staggered up and down and not on the same horizontal plane, so that the first silicon rod The clamp and its clamped first silicon rod are transferred from the second processing position to the first processing position, and the second silicon rod clamp and its clamped second silicon rod are transferred from the first processing position to the second processing position;

Unload the first silicon rod from the first processing area and load the third silicon rod, make the first silicon rod clamp in the first transfer device clamp the third silicon rod, and make the rough grinding device align the third silicon rod at the first processing area The silicon rod is subjected to rough grinding operation; at this stage, the fine grinding device is made to perform the fine grinding operation on the second silicon rod located at the second processing area.
A silicon rod grinding method is applied to a silicon rod grinding machine. The silicon rod grinding machine includes a base with a silicon rod processing platform. The silicon rod processing platform is provided with a waiting area, a first processing area, and a second processing area. In the processing area, the silicon rod grinder further includes a first transfer device, a second transfer device, a rough grinding device, and a fine grinding device, wherein the first transfer device includes a first silicon rod clamp, a first transfer rail, And a first drive mechanism, the second transfer device includes a second silicon rod clamp, a second transfer rail, and a second drive mechanism, characterized in that the silicon rod grinding method includes the following steps:

Load the first silicon rod in the waiting area, make the first silicon rod clamp in the first transfer device clamp the first silicon rod, and make the first driving mechanism in the first transfer device drive the first silicon rod clamp and its clamped second silicon rod. A silicon rod moves along the first transfer guide rail to transfer from the waiting area to the first processing area, so that the rough grinding device performs a rough grinding operation on the first silicon rod located at the first processing area;

Make the first drive mechanism in the first transfer device drive the first silicon rod holder and its clamped first silicon rod to move along the first transfer path, and make the second drive mechanism in the second transfer device drive the second silicon rod holder along the first transfer path Move along the second transfer path. The first transfer path and the second transfer path are on the same straight line parallel to the first direction but are staggered up and down and not on the same horizontal plane, so that the first silicon rod clamp and the first silicon clamped by it are on the same straight line. The rod is transferred from the first processing location to the second processing location, and the second silicon rod fixture is transferred from the second processing location to the first processing location;

Make the fine grinding device perform the fine grinding operation on the first silicon rod located at the second processing area; at this stage, load the second silicon rod in the waiting area, and make the second silicon rod clamp in the second transfer device clamp the second silicon rod. The silicon rod, the second driving mechanism in the second transfer device drives the second silicon rod holder and the second silicon rod held by it to move along the second transfer rail to transfer from the waiting area to the first processing area, so that the rough grinding device Rough grinding of the second silicon rod located in the first processing area;

Make the first drive mechanism in the first transfer device drive the first silicon rod holder and the first silicon rod held by it to move along the first transfer path, and make the second drive mechanism in the second transfer device drive the second silicon rod holder and The second silicon rod that it clamps moves along the second transfer path, and the first transfer path and the second transfer path are on the same straight line parallel to the first direction but are staggered up and down and not on the same horizontal plane, so that the first silicon rod The clamp and its clamped first silicon rod are transferred from the second processing position to the first processing position, and the second silicon rod clamp and its clamped second silicon rod are transferred from the first processing position to the second processing position;

Unload the first silicon rod from the waiting area and load the third silicon rod, so that the first silicon rod holder in the first transfer device clamps the third silicon rod, and the first driving mechanism in the first transfer device drives the first silicon rod holder And the third silicon rod held by it moves along the first transfer rail to transfer from the waiting area to the first processing area, so that the rough grinding device performs rough grinding operation on the third silicon rod located at the first processing area; here At this stage, the fine grinding device is made to perform a fine grinding operation on the second silicon rod located at the second processing area.