WO2021077488A1 - 一种固定装置及显示面板的制作方法 - Google Patents

一种固定装置及显示面板的制作方法 Download PDF

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Publication number
WO2021077488A1
WO2021077488A1 PCT/CN2019/117898 CN2019117898W WO2021077488A1 WO 2021077488 A1 WO2021077488 A1 WO 2021077488A1 CN 2019117898 W CN2019117898 W CN 2019117898W WO 2021077488 A1 WO2021077488 A1 WO 2021077488A1
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WIPO (PCT)
Prior art keywords
movable
fixing device
display panel
area
bars
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Ceased
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PCT/CN2019/117898
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English (en)
French (fr)
Inventor
陈皓
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TCL China Star Optoelectronics Technology Co Ltd
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TCL China Star Optoelectronics Technology Co Ltd
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Priority to US16/619,032 priority Critical patent/US11244843B2/en
Publication of WO2021077488A1 publication Critical patent/WO2021077488A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7422—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H10P72/7442—Separation by peeling

Definitions

  • the present invention relates to the field of display technology, and in particular to a manufacturing method of a fixing device and a display panel.
  • the display panels are diversified. Among them, the resolution and color of Mini LED devices are closer to those of organic light-emitting diodes (Organic Light-Emitting Diode, OLED) displays are superior to liquid crystal displays (Liquid Crystal Display, LCD); and lower power consumption, thinner and lighter.
  • OLED Organic Light-Emitting Diode
  • LCD Liquid Crystal Display
  • the Mini LED device is sliced after cutting. Due to the sharp edges of the slice, there is a risk of fragmentation in the splicing process. Therefore, it is necessary to grind the edge after cutting to increase the strength and reduce the risk of fragmentation.
  • the substrate In order to protect the lines on its surface, the substrate needs to be coated with a protective layer, and the protective layer is removed by a stripper after edge grinding.
  • the existing fixing device includes a substrate 10 and a stop bar 12.
  • the stop bar 12 is attached to the substrate 10, and the stop bar 12 is attached to the substrate through the glue 11.
  • the slices are then placed in the area 101 defined by the stop bar 12, but in this way, slices of different sizes need to be fixed separately, that is, it cannot adapt to slices of different sizes, which reduces production efficiency and flexibility.
  • the purpose of the present invention is to provide a fixing device and a manufacturing method of a display panel, which can improve production efficiency and flexibility.
  • the present invention provides a fixing device, wherein the fixing device is used to fix a display panel and includes:
  • a carrier board is provided with a fixing component, the fixation component includes at least two opening areas, the area of the opening area is adjustable; the opening area is used for accommodating the display panel; the carrier board is provided with Multiple holes
  • the fixed component includes a plurality of first movable bars and a plurality of second movable bars, the first movable bars and the second movable bars are arranged crosswise, the first movable bars and the first movable bars The overlapping parts of the two movable bars are connected by movable connecting pieces.
  • the present invention provides a fixing device, including: the fixing device is used for fixing a display panel, and includes:
  • a carrier board the carrier board is provided with a fixing component, the fixing component includes at least two opening areas, the area of the opening area is adjustable; the opening area is used for accommodating the display panel.
  • the present invention also provides a manufacturing method of a display panel, which includes:
  • the fixing device and the manufacturing method of the display panel of the present invention are provided with a fixing component on the carrier board, the fixing component includes at least two opening areas, the area of the opening area is adjustable; the opening area is used for accommodating the display For the panel, since the area of the opening area is adjustable, panels of various sizes can be conveniently fixed, which improves production efficiency and flexibility.
  • Fig. 1 is a plan view of a conventional fixing device.
  • Figure 2 is a cross-sectional view of a conventional fixing device.
  • Fig. 3 is a top view of the fixing device according to the first embodiment of the present invention.
  • Fig. 4 is a cross-sectional view of the fixing device according to the first embodiment of the present invention.
  • Fig. 5 is a preferred top view of the fixing device according to the first embodiment of the present invention.
  • Fig. 6 is a top view of the fixing device according to the second embodiment of the present invention.
  • Fig. 7 is a cross-sectional view of the fixing device according to the second embodiment of the present invention.
  • FIG. 8 is a schematic structural diagram of the first step of the manufacturing method of the display panel of the present invention.
  • FIG. 9 is a top view of the second step of the manufacturing method of the display panel of the present invention.
  • FIG. 10 is a schematic structural diagram of the third step of the manufacturing method of the display panel of the present invention.
  • FIG. 3 is a top view of the fixing device according to the first embodiment of the present invention.
  • the fixing device of this embodiment is used to fix the display panel, and the fixing device includes a carrier board 20.
  • the carrier board 20 is provided with a fixing member 30, the fixing member 30 includes two opening regions 201, the area of the opening region 201 is adjustable; the opening region 201 is used to accommodate the display panel 40, so that the display panel 40 is defined in the opening area 201. It can be understood that the number of open regions 201 is not limited to two. In one embodiment, the thickness of the carrier board 20 ranges from 1 mm to 2 mm. Of course, the thickness of the carrier board 20 is not limited to this.
  • Fig. 4 is a cross-sectional view in the longitudinal direction in Fig. 3, specifically a cross-sectional view in the direction AA' in Fig. 3.
  • the fixing member 30 includes two first movable bars 31 and three second movable bars 32, and the first movable bars 31 and The second movable barrier bars 32 are arranged crosswise, and the overlapping parts of the first movable barrier bars 31 and the second movable barrier bars 32 are connected by a movable connecting member 33.
  • the second movable stop bar 32 can move back and forth in a first direction
  • the first movable stop bar 31 can move back and forth in a second direction
  • the first direction crosses the second direction.
  • the first movable barrier 31 may be arranged in a horizontal direction
  • the second movable barrier 32 may be arranged in a vertical direction.
  • the first movable barrier 31 can move up and down, and the second movable barrier 32 can move left and right.
  • the width of the opening area can be adjusted.
  • the second movable bar is moved, the length of the opening area can be adjusted.
  • the width of the opening area can be adjusted at the same time. Adjust the length and width of the opening area. It can be understood that the number of the first movable bar 31 and the second movable bar 32 is not limited.
  • the material of the carrier board 20, the material of the first movable bar 31, and the material of the second movable bar 32 are all metal materials (that is, metal materials that can be magnetically adsorbed).
  • Material) the movable connecting member 33 is a magnetic buckle, so that the first movable bar 31 and the second movable bar 32 are both adsorbed on the carrier board 20.
  • the specific process of use for example, when the length of the left opening area (the size in the horizontal direction) needs to be adjusted, remove the two upper and lower magnetic buckles on the leftmost side, and move the first movable bar 31 to the right.
  • the magnetic buckle is buckled at the overlap of the first movable bar 31 and the second movable bar 32.
  • the setting area 301 in the second movable bar 32 is also provided with the movable connecting member 33, and the setting area 301 It is an area located between two adjacent first movable bars 31. Further, the movable connector 33 is provided in the middle position of the setting area 301 in the second movable bar 32. For example, the middle position of the second movable bar 32 is also provided with a magnetic buckle.
  • the specific structure of the fixed component is not limited, and other existing structures can be used, as long as the first movable bar 31 and the second movable bar 32 can be moved.
  • FIG. 6 is a top view of the fixing device according to the second embodiment of the present invention.
  • the difference between the fixing device of this embodiment and the previous embodiment is that a plurality of holes 21 are provided on the carrier board 20 of this embodiment.
  • the hole 21 is a through hole, and the top view shape of the hole 21 is not limited, and may be a circular, triangular, or rectangular shape.
  • the holes 21 can be arranged regularly or randomly.
  • the plurality of holes 21 may be arranged at intervals, or may be arranged overlappingly.
  • the carrier plate 20 is provided with a plurality of holes, it is possible to prevent the liquid medicine from remaining in the subsequent peeling process, and improve the yield of the product.
  • the diameter of the hole 21 ranges from 5 mm to 10 mm.
  • the diameter range of the hole is not limited to this.
  • the present invention also provides a manufacturing method of a display panel, which includes:
  • a protective layer 51 is provided on the display panel 50 to be cut, wherein the thickness of the protective layer 51 may range from 2 to 3 um.
  • the material of the protective layer 51 may be a photoresist material.
  • S102 Divide the to-be-cut display panel into a plurality of target display panels, and perform edging processing on the target display panel;
  • the to-be-cut display panel 50 is divided into at least one target display panel 40, and the target display panel 40 is subjected to edging processing.
  • the area of the target display panel 40 is smaller than the area of the display panel 50 to be cut.
  • the area of the opening area is adjusted, that is, the area of the opening area is adjusted to the required size. Area, and then put the target display panel 40 into the opening area.
  • the protective layer 51 on the target display panel 40 is removed. It can be understood that the target display panel of this embodiment is equivalent to the display panel of the first embodiment.
  • the fixing component includes at least two opening areas, the area of the opening area is adjustable; because the area of the opening area is adjustable, it is convenient to carry out a variety of sizes of panels. Fixed, improves production efficiency and flexibility, and also reduces production costs.
  • the fixing device and the manufacturing method of the display panel of the present invention are provided with a fixing component on the carrier board, the fixing component includes at least two opening areas, the area of the opening area is adjustable; the opening area is used for accommodating the display For the panel, since the area of the opening area is adjustable, panels of various sizes can be conveniently fixed, which improves production efficiency and flexibility, and also reduces production costs.

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Abstract

一种固定装置及显示面板（40）的制作方法，固定装置包括：载板（20），载板（20）上设置有固定部件（30），固定部件（30）包括至少两个开口区域（201），开口区域（201）的面积可调；开口区域（201）用于容纳显示面板（40）。固定装置及显示面板（40）的制作方法，能够提高生产效率和灵活性。

Description

一种固定装置及显示面板的制作方法 技术领域
本发明涉及显示技术领域，特别是涉及一种固定装置及显示面板的制作方法。
 背景技术
目前显示面板呈现多元化，其中Mini LED器件的解析度和色彩度更接近有机发光二极管（Organic Light-Emitting Diode, OLED）显示器，优于液晶显示器（Liquid Crystal Display, LCD）；且功耗较低、更轻薄。但Mini LED器件切割后得到切片，由于切片的边缘锋利，拼接制程存在破片风险。因此需要在切割后进行磨边，来增加强度降低破片风险。
为了对其表面的线路进行保护，基板需涂布保护层，并在磨边后通过剥离设备（Stripper）将保护层进行去除。
 技术问题
然而剥离过程中，需要对切片进行固定，如图1和2所示，现有的固定装置包括基板10和挡条12，挡条12贴附在基板10上，挡条12通过胶体11贴在基板10上，再将切片放入挡条12限定的区域101内，但是这种方式对不同尺寸的切片需要单独固定，也即无法适应不同尺寸的切片，降低了生产效率和灵活性。
因此，有必要提供一种固定装置及显示面板的制作方法，以解决现有技术所存在的问题。
 技术解决方案
本发明的目的在于提供一种固定装置及显示面板的制作方法，能够提高生产效率和灵活性。
为解决上述技术问题，本发明提供一种固定装置，其中所述固定装置用于固定显示面板，包括：
载板，所述载板上设置有固定部件，所述固定部件包括至少两个开口区域，所述开口区域的面积可调；所述开口区域用于容纳显示面板；所述载板上设置有多个孔；
其中所述固定部件包括多个第一活动挡条和多个第二活动挡条，所第一活动挡条与所述第二活动挡条交叉设置，所述第一活动挡条和所述第二活动挡条的交叠处通过活动连接件连接。
本发明提供一种固定的装置，包括：所述固定装置用于固定显示面板，包括：
载板，所述载板上设置有固定部件，所述固定部件包括至少两个开口区域，所述开口区域的面积可调；所述开口区域用于容纳显示面板。
本发明还提供一种显示面板的制作方法，其包括：
在待切割显示面板上设置保护层；
将所述待切割显示面板分割为多个目标显示面板，对所述目标显示面板进行磨边处理；所述目标显示面板的面积小于所述待切割显示面板的面积；
调整固定装置中固定部件的开口区域的大小，以将磨边后的目标显示面板放入对应的开口区域内；
去除所述目标显示面板上的保护层。
 有益效果
本发明的固定装置及显示面板的制作方法，通过在载板上设置有固定部件，所述固定部件包括至少两个开口区域，所述开口区域的面积可调；所述开口区域用于容纳显示面板，由于开口区域的面积可调，因此可以方便地对多种尺寸的面板进行固定，提高了生产效率和灵活性。
 附图说明
图1为现有的固定装置的俯视图。
图2为现有固定装置的剖视图。
图3为本发明实施例一的固定装置的俯视图。
图4为本发明实施例一的固定装置的剖视图。
图5为本发明实施例一的固定装置的优选俯视图。
图6为本发明实施例二的固定装置的俯视图。
图7为本发明实施例二的固定装置的剖视图。
图8为本发明显示面板的制作方法的第一步的结构示意图。
图9为本发明显示面板的制作方法的第二步的俯视图。
图10为本发明显示面板的制作方法的第三步的结构示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是以相同标号表示。
请参照图3至5，图3为本发明实施例一的固定装置的俯视图。
结合图3和4，本实施例的固定装置用于固定显示面板，固定装置包括：载板20。
所述载板20上设置有固定部件30，所述固定部件30包括两个开口区域201，所述开口区域201的面积可调；所述开口区域201用于容纳显示面板40，以将显示面板40限定在所述开口区域201内。可以理解的，开口区域201的数量不限于两个。在一实施方式中，所述载板20的厚度范围为1mm~2mm。当然所述载板20的厚度不限于此。其中图4为图3中纵向方向的剖视图，具体为沿图3中AA’方向的剖视图。
在一实施方式中，为了便于调节开口区域的面积，提高调节效率，所述固定部件30包括两个第一活动挡条31和三个第二活动挡条32，所第一活动挡条31与所述第二活动挡条32交叉设置，所述第一活动挡条31和所述第二活动挡条32的交叠处通过活动连接件33连接。其中，所述第二活动挡条32可沿第一方向往返移动，所述第一活动挡条31可沿第二方向往返移动，所述第一方向与所述第二方向交叉。比如，所述第一活动挡条31可沿水平方向排布，所述第二活动挡条32可沿竖直方向排布。所述第一活动挡条31可上下移动，所述第二活动挡条32可左右移动。当移动第一活动挡条时，可调节开口区域的宽度，当移动第二活动挡条时，可调节开口区域的长度，当同时移动第一活动挡条和第二活动挡条时，可同时对开口区域的长度和宽度进行调节。可以理解的，所第一活动挡条31与所述第二活动挡条32的数量均不限。
为了简化制程工艺，降低生产成本，所述载板20的材料、所述第一活动挡条31的材料以及所述第二活动挡条32的材料均为金属材料（也即为可磁力吸附金属材料），所述活动连接件33为磁力卡扣，从而使得所述第一活动挡条31和第二活动挡条32都吸附在载板20上。在具体使用过程中，比如需要调节左侧的开口区域的长度（水平方向的尺寸）时，取下最左侧上下两个磁力卡扣，向右移动第一活动挡条31，移动完毕时，将磁力卡扣扣在第一活动挡条31和所述第二活动挡条32的交叠处。
如图5所示，为了提高固定部件与载板之间的连接稳定性，所述第二活动挡条32中的设定区域301也设置有所述活动连接件33，所述设定区域301为位于相邻两个所述第一活动挡条31之间的区域。进一步地，所述第二活动挡条32中的设定区域301的中间位置设置有所述活动连接件33。比如所述第二活动挡条32的中间位置也设置有磁力卡扣。
可以理解的，固定部件的具体结构不限，可采用现有的其他结构，只要能够实现移动第一活动挡条31和第二活动挡条32即可。
请参照图6和7，图6为本发明实施例二的固定装置的俯视图。
如图6和7所示，本实施例的固定装置与上一实施例的区别在于：本实施例的载板20上设置有多个孔21。该孔21为通孔，所述孔21的俯视形状不限，可以为圆形、三角形、长方形等待的形状。所述孔21可以规则排布，也可散乱排布。多个孔21之间可以间隔设置，也可交叠设置。
由于载板20设置有多个孔，因此可在后续剥离工艺中，防止药液残留，提高了产品的良率。
为了进一步防止药液残留，所述孔21的直径范围为5mm~10mm。当然孔的直径范围不限于此。
本发明还提供一种显示面板的制作方法，其包括：
S101、在待切割显示面板上设置保护层；
如图8所示，在待切割显示面板50上设置保护层51，其中所述保护层51的厚度范围可为2~3um。所述保护层51的材料可为光阻材料。
S102、将所述待切割显示面板分割为多个目标显示面板，对所述目标显示面板进行磨边处理；
如图9所示，将所述待切割显示面板50分割为至少一个目标显示面板40，并对所述目标显示面板40进行磨边处理。其中所述目标显示面板40的面积小于所述待切割显示面板50的面积。
S103、调整所述固定装置中固定部件的开口区域的大小，以将磨边后的目标显示面板放入对应的开口区域内；
如图10所示，在一实施方式中，通过调整第一活动挡条和第二活动档条中的至少一个，从而调整开口区域的面积大小，也即将开口区域的面积大小调整到所需的面积，然后将目标显示面板40放入开口区域内。
S104、去除所述目标显示面板上的保护层。
返回图3，在一实施方式中，将所述目标显示面板40上的保护层51去除。可以理解的，本实施例的目标显示面板等同于实施例一的显示面板。
可以理解的，该制作方法同样适用于第二实施例，具体制作过程与此相同，在此不再赘述。
由于所述载板上设置有固定部件，所述固定部件包括至少两个开口区域，所述开口区域的面积可调；由于开口区域的面积可调，因此可以方便地对多种尺寸的面板进行固定，提高了生产效率和灵活性，此外还降低了生产成本。
本发明的固定装置及显示面板的制作方法，通过在载板上设置有固定部件，所述固定部件包括至少两个开口区域，所述开口区域的面积可调；所述开口区域用于容纳显示面板，由于开口区域的面积可调，因此可以方便地对多种尺寸的面板进行固定，提高了生产效率和灵活性，此外还降低了生产成本。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (19)

  1. 一种固定装置，其中所述固定装置用于固定显示面板，包括：
    载板，所述载板上设置有固定部件，所述固定部件包括至少两个开口区域，所述开口区域的面积可调；所述开口区域用于容纳显示面板；所述载板上设置有多个孔；
    其中所述固定部件包括多个第一活动挡条和多个第二活动挡条，所第一活动挡条与所述第二活动挡条交叉设置，所述第一活动挡条和所述第二活动挡条的交叠处通过活动连接件连接。
  2. 根据权利要求1所述的固定装置，其中所述载板的材料、所述第一活动挡条的材料以及所述第二活动挡条的材料均为金属材料，所述活动连接件为磁力卡扣。
  3. 根据权利要求2所述的固定装置，其中所述第二活动挡条中的设定区域也设置有所述活动连接件，所述设定区域为位于相邻两个所述第一活动挡条之间的区域。
  4. 根据权利要求1所述的固定装置，其中所述第二活动挡条可沿第一方向往返移动，所述第一活动挡条可沿第二方向往返移动，所述第一方向与所述第二方向交叉。
  5. 根据权利要求1所述的固定装置，其中所述孔的直径范围为5mm~10mm。
  6. 根据权利要求1所述的固定装置，其中所述载板的厚度范围为1mm~2mm。
  7. 根据权利要求1所述的固定装置，其中所述孔的俯视形状包括圆形、三角形以及长方形中的至少一种。
  8. 一种固定装置，其中所述固定装置用于固定显示面板，包括：
    载板，所述载板上设置有固定部件，所述固定部件包括至少两个开口区域，所述开口区域的面积可调；所述开口区域用于容纳显示面板。
  9. 根据权利要求8所述的固定装置，其中所述固定部件包括多个第一活动挡条和多个第二活动挡条，所第一活动挡条与所述第二活动挡条交叉设置，所述第一活动挡条和所述第二活动挡条的交叠处通过活动连接件连接。
  10. 根据权利要求9所述的固定装置，其中所述载板的材料、所述第一活动挡条的材料以及所述第二活动挡条的材料均为金属材料，所述活动连接件为磁力卡扣。
  11. 根据权利要求10所述的固定装置，其中所述第二活动挡条中的设定区域也设置有所述活动连接件，所述设定区域为位于相邻两个所述第一活动挡条之间的区域。
  12. 根据权利要求9所述的固定装置，其中所述第二活动挡条可沿第一方向往返移动，所述第一活动挡条可沿第二方向往返移动，所述第一方向与所述第二方向交叉。
  13. 根据权利要求8所述的固定装置，其中所述载板上设置有多个孔。
  14. 根据权利要求13所述的固定装置，其中所述孔的直径范围为5mm~10mm。
  15. 根据权利要求13所述的固定装置，其中所述孔的俯视形状包括圆形、三角形以及长方形中的至少一种。
  16. 根据权利要求8所述的固定装置，其中所述载板的厚度范围为1mm~2mm。
  17. 一种显示面板的制作方法，其包括：
    在待切割显示面板上设置保护层；
    将所述待切割显示面板分割为多个目标显示面板，对所述目标显示面板进行磨边处理；所述目标显示面板的面积小于所述待切割显示面板的面积；
    调整固定装置中固定部件的开口区域的大小，以将磨边后的目标显示面板放入对应的开口区域内；
    去除所述目标显示面板上的保护层。
  18. 根据权利要求17所述的显示面板的制作方法，其中所述保护层的厚度为2um ~3um。
  19. 根据权利要求17所述的显示面板的制作方法，其中所述保护层的材料为光阻材料。
PCT/CN2019/117898 2019-10-25 2019-11-13 一种固定装置及显示面板的制作方法 Ceased WO2021077488A1 (zh)

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