WO2021073309A1

WO2021073309A1 - Three-dimensional on-line monitoring method and apparatus for warpage deformation and defects of packaging module

Info

Publication number: WO2021073309A1
Application number: PCT/CN2020/113767
Authority: WO
Inventors: 陈志文; 刘胜; 刘俐; 王力成
Original assignee: 武汉大学
Priority date: 2019-10-17
Filing date: 2020-09-07
Publication date: 2021-04-22
Also published as: CN110645903A

Abstract

A three-dimensional on-line monitoring method and apparatus for warpage deformation and defects of a packaging module; first warpage information of a packaging module sample (5) to be tested is obtained by means of a projection moiré module; second warpage information of the packaging module sample (5) to be tested is obtained by means of an ultrasonic module; and monitoring result information is obtained according to the first warpage information and the second warpage information. Thus, the problem in the existing technology in which warpage deformation and defects of a packaging module cannot be monitored on-line is solved, and the failure of packaging modules of electronic devices can be monitored on-line.

Description

Three-dimensional online monitoring method and device for warpage deformation and defect of package module

Technical field

The invention relates to the technical field of package module monitoring, in particular to a method and device for three-dimensional online monitoring of package module warpage and deformation and defects.

Background technique

At present, integrated circuit technology has penetrated into various fields of industry and social life, and the electronics industry has become the largest industry today. The development of the electronics industry and the wide application of its products have had an extremely profound impact on the global economy and culture. Whether from the perspective of technology or economic development, the importance of semiconductors is huge.

Most of today's electronic products, such as computers, mobile phones, or digital tape recorders, have a very close relationship with semiconductors. The packaging technology of electronic devices is one of the key links restricting the development of integrated circuits. In the packaging of electronic devices, due to the differences in the size and material properties of various materials (substrates, adhesive layers, chips and packaging materials), the warpage caused by the large temperature difference has seriously affected the reliability and welding of electronic devices. Performance and yield. Therefore, the warpage problem of electronic devices has become a major obstacle to the further development of electronic packaging technology.

During the semiconductor process, as various material layers and various semiconductor device structures are formed on the surface of the wafer, various stresses are generated on the surface of the wafer, which causes the wafer to warp during the process. In the most ideal state, the wafer should not be warped, even if it cannot be completely flat, in the ideal state, the warpage of the wafer should be the edge that is tilted toward the front of the wafer and about the center axis of the vertical wafer. Symmetrical bowl shape; in reality, due to the asymmetry of the stress on the front side of the wafer, it often causes asymmetrical warpage of the wafer in various forms, which makes the wafer prone to warpage defects, leading to partial chip failure or even occurrence Fragmentation. At the same time, as the area of the current fan-out packaging continues to increase, the warpage deformation during the packaging process has become one of the key indicators that affect the accuracy, reliability, and yield of the fan-out packaging process. It is the industry And the focus of general attention in academia.

In the prior art, it is difficult to realize online monitoring of warpage defects of electronic devices in industrial production. There are many methods for measuring warpage deformation, such as electronic speckle interferometry, shadow moiré, projection moiré, and digital image correlation (DIC). Each of these methods has its specific measurement accuracy and application scenarios, and its measurement area and measurement range are also different. Electronic speckle interferometry technology is not suitable for the measurement and monitoring of large-area warpage deformation such as wafers because of its expensive high-power lasers. Shadow moiré is also not suitable for the measurement and monitoring of large-area warpage due to the problem of its optical path setting. However, the digital image correlation method is not suitable for samples that cannot be pretreated because of the need to spray a layer of speckle with specific grayscale on the surface of the sample. The projection moiré method is a modern optical measurement technology developed in the 1970s. It is mostly used for the detection of in-plane deformation, out-of-plane displacement, and surface topography. With the advantages of non-contact, fast, full-field measurement, high resolution, and high precision, the projection moiré method is widely used in biology, medical testing, product testing, reverse engineering and many other fields. The projection moiré technology currently has mature equipment products at home and abroad, and the measurement accuracy of warpage is high, up to 1.5 microns. However, due to its own principle, the projection moiré technology can only measure the surface of the object. , It basically has no penetrating ability, so the ability to detect internal defects of the product is weak.

In addition, at present, for the warpage and defects of electronic devices, in the industrial production process, it is usually only to perform offline testing after the electronic device fails. This method is not only complicated in process, requires a lot of equipment, but also takes a long time and tests. The effect is not good, and it is not helpful to improve the production process of electronic devices. How to effectively and reliably monitor the warpage state of electronic devices online is a problem that needs to be solved urgently in current industrial production.

Summary of the invention

The embodiments of the present application provide a three-dimensional online monitoring method and device for warpage deformation and defects of a package module, which solves the problem that the warpage deformation and defects of the package module cannot be monitored online in the prior art.

The embodiment of the application provides a three-dimensional online monitoring device for warpage deformation and defects of a package module, which includes: a projection moiré module, an ultrasonic module, and a monitoring analysis module;

The monitoring analysis module is respectively connected to the projection moiré module and the ultrasonic module;

The projection moiré module is used to obtain the first warpage information of the package module sample to be tested;

The ultrasonic module is used to obtain the second warpage information of the package module sample to be tested;

The monitoring analysis module is configured to obtain monitoring result information according to the first warpage information and the second warpage information.

Preferably, the projection moiré module includes: a CCD camera and a grating projector;

The grating projector is used to project the grating to the surface of the package module sample to be tested;

The CCD camera is used to continuously photograph and collect the grating changes on the sample surface of the package module to be tested to obtain the first warpage information.

Preferably, the projection moiré module further includes: a first synchronization trigger;

The CCD camera is a CCD camera array composed of multiple CCD cameras; the CCD camera array is connected to the first synchronization trigger;

The grating projector is a grating projector array composed of multiple grating projectors; the grating projector is connected to the first synchronization trigger.

Preferably, the ultrasonic module includes: an air-coupled ultrasonic probe, an ultrasonic signal transmitter and receiver, and a preamplifier;

The air-coupled ultrasonic probe is connected with the ultrasonic signal transmitting and receiving receiver, the ultrasonic signal transmitting and receiving receiver is connected with the preamplifier, and the preamplifier is connected with the monitoring analysis module.

Preferably, the ultrasonic module further includes: a second synchronization trigger;

The air-coupled ultrasonic probe is an array-type air-coupled ultrasonic probe group composed of a plurality of air-coupled ultrasonic probes; the array-type air-coupled ultrasonic probe group is connected with the second synchronization trigger.

Preferably, the monitoring analysis module includes: a data storage device, a data analysis device, and a monitoring display device;

The data storage device is used to store information from the projection moiré module and the ultrasonic module, and transmit the information to the data analysis device, and the data storage device is connected to the first synchronization trigger and the second synchronization trigger器连接； Connect;

The data analysis device is used for obtaining warpage deformation information according to the first warpage information, used for obtaining warpage defect information according to the second warpage information, and used for obtaining warpage defect information according to the warpage deformation information and the warpage Obtain the monitoring result information from the defect information of the song;

The monitoring display device is used for displaying the monitoring result information.

Preferably, the three-dimensional online monitoring device for warpage, deformation and defects of the package module further includes: an optical three-dimensional measurement calibrator;

The optical three-dimensional measurement calibrator is used to calibrate the camera's internal parameters, external parameters, and height.

Preferably, the three-dimensional online monitoring device for warpage, deformation and defects of the package module further includes: a plane placement table;

The sample of the packaged module to be tested is placed on the flat mounting table.

On the other hand, an embodiment of the present application provides a three-dimensional online monitoring method for warpage and defect of a package module. Using the above-mentioned device, the method includes the following steps:

Obtain the first warpage information of the package module sample to be tested by projecting the moiré module;

Obtain the second warpage information of the package module sample to be tested through the ultrasonic module;

Obtain monitoring result information according to the first warpage information and the second warpage information.

Preferably, through the ultrasonic module, the second warpage information is obtained by using the transmission method, the surface reflection method, the bottom reflection method of the V transmission method, and the bottom reflection method of the surface wave.

One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

In the embodiment of this application, the first warpage information of the package module sample to be tested is obtained by projection moiré, the second warpage information of the package module sample to be tested is obtained by ultrasonic wave, and then according to the first warpage information and the second warpage Combine and analyze the music information to obtain the monitoring result information, and realize the online monitoring of the failure of the packaging module of the electronic device in the actual industrial production process, which has changed the stalemate in the offline detection of failed products in the industry in the past.

Description of the drawings

In order to explain the technical solution in this embodiment more clearly, the following will briefly introduce the drawings needed in the description of the embodiment. Obviously, the drawings in the following description are an embodiment of the present invention. For those of ordinary skill in the art, without creative work, other drawings can be obtained from these drawings.

FIG. 1 is a schematic structural diagram of a three-dimensional online monitoring device for warpage deformation and defects of a package module according to Embodiment 1 of the present invention;

2 is a schematic structural diagram of a three-dimensional online monitoring device for warpage deformation and defects of a package module according to Embodiment 2 of the present invention;

3 is a schematic structural diagram of a three-dimensional online monitoring device for warpage deformation and defects of a package module according to Embodiment 3 of the present invention;

4 is a schematic diagram of the principle of ultrasonic detection in a three-dimensional online monitoring method for warpage deformation and defects of a package module provided by Embodiment 4 of the present invention;

5 is a schematic diagram of the principle of ultrasonic detection in a three-dimensional online monitoring method for warpage deformation and defects of a packaged module provided by Embodiment 5 of the present invention;

6 is a schematic diagram of the principle of ultrasonic detection in a three-dimensional online monitoring method for warpage deformation and defects of a package module according to Embodiment 6 of the present invention;

FIG. 7 is a schematic diagram of the principle of ultrasonic detection in a three-dimensional online monitoring method for warpage deformation and defects of a package module according to Embodiment 7 of the present invention.

Detailed ways

In order to better understand the above technical solutions, the above technical solutions will be described in detail below in conjunction with the accompanying drawings of the specification and specific implementations.

This embodiment provides a three-dimensional online monitoring device for warpage deformation and defects of a package module, which mainly includes: a projection moiré module, an ultrasonic module, and a monitoring and analysis module; the monitoring and analysis module is respectively connected to the projection moiré module and the The ultrasonic module is connected.

The projection moiré module is used to obtain the first warpage information of the package module sample to be tested; the ultrasonic module is used to obtain the second warpage information of the package module sample to be tested; the monitoring and analysis module is used to obtain the The first warpage information and the second warpage information obtain monitoring result information.

The present invention will be further described below in conjunction with specific embodiments.

Example 1:

A three-dimensional online monitoring device for warpage, deformation and defects of a package module provided by Embodiment 1 includes: a projection moiré module, an ultrasonic module, and a monitoring and analysis module; the monitoring and analysis module is respectively connected to the projection moiré module and the ultrasonic module Connected.

Wherein, the projection moiré module includes: a CCD camera, a grating projector; the grating projector is used to project the grating to the sample surface of the package module to be tested; the CCD camera is used to image the surface of the package module sample to be tested The grating changes are continuously photographed and collected, and the first warpage information is obtained.

In a preferred solution, the projection moiré module further includes: a first synchronization trigger; the CCD camera is a CCD camera array composed of multiple CCD cameras; the CCD camera array is connected to the first synchronization trigger; The grating projector is a grating projector array composed of multiple grating projectors; the grating projector is connected to the first synchronization trigger.

The first synchronization trigger and multiple CCD cameras are respectively connected through a data line, and then the first synchronization trigger is connected to a workstation that controls photographing and analysis (that is, a monitoring analysis module). The first synchronization trigger is used to ensure that multiple CCD cameras can trigger the photo at the same time when taking a photo, so as to ensure that the photos taken at the same time can be combined into a whole photo in the workstation.

The use of CCD camera arrays can achieve online monitoring of large-area packaged modules, which can improve the size of the camera's field of view. It is measured by multiple cameras forming an array. For example, the field of view of the 16 CCD camera array is 600*600mm, and the measurement accuracy can reach 4 microns, and the accuracy can reach 1.5 microns under the 240*240mm field of view. Through the use of 64, 100, 200 or even more cameras to form an array in the present invention, it is theoretically possible to measure warpage deformation and defects under an infinite area.

The number of the grating projectors theoretically depends on whether the grating projected by the projector covers the entire surface of the package module sample to be tested. In order to achieve a theoretically infinite measurement area, the purpose of large-area monitoring can be achieved by increasing the number of grating projectors, that is, the array assembly of grating projectors.

Wherein, the ultrasonic module includes: an air-coupled ultrasonic probe, an ultrasonic signal transmitter and receiver, and a preamplifier; the air-coupled ultrasonic probe is connected to the ultrasonic signal transmitter and receiver, and the ultrasonic signal transmitter and receiver are connected to the front The pre-amplifier is connected to the monitoring analysis module.

According to application requirements, the air-coupled ultrasonic probe can be any one of a planar probe, a point focus probe, and a line focus probe. For example, flat probes are suitable for large-area flat detection, and point focus probes are suitable for detection of large objects with a large thickness.

The preamplifier can improve the signal-to-noise ratio of the system, reduce the relative influence of external interference, facilitate reasonable layout, facilitate adjustment and use, and can realize impedance conversion and matching.

In a preferred solution, the ultrasonic module further includes: a second synchronization trigger; the air-coupled ultrasonic probe is an array-type air-coupled ultrasonic probe group composed of a plurality of air-coupled ultrasonic probes; the array-type air-coupled ultrasonic probe group Connected with the second synchronization trigger.

When performing online monitoring of a large-area packaged module, a single ultrasonic probe may not cover the entire area to be inspected. Therefore, the use of an array air-coupled ultrasonic probe set can achieve large-area coverage. The use of the second synchronization trigger can ensure that multiple ultrasonic probes work at the same time.

In addition, a third synchronization trigger can be set between the CCD camera array and the array-type air-coupled ultrasonic probe group to ensure that both work are triggered accurately at the same time.

Wherein, the monitoring and analysis module includes: a data storage device, a data analysis device, and a monitoring display device; the data storage device is used to store information from the projection moiré module and the ultrasonic module, and transmit it to the data An analysis device, the data storage device is connected to the first synchronization trigger and the second synchronization trigger; the data analysis device is used to obtain warpage deformation information according to the first warpage information, and is used to obtain warpage deformation information according to the first warpage information. The second warpage information obtains warpage defect information, and is used to obtain the monitoring result information according to the warpage deformation information and the warpage defect information; the monitoring display device is used to display the monitoring result information.

The judgment process of warpage deformation and defects is combined with analysis. The warpage deformation is completed by the projection moiré module. If the analysis result shows that the warpage deformation of the package module sample to be tested is obviously too large, it will be responsible for the warpage defect monitoring The combined analysis of the ultrasonic module obtained the result. That is, the two need to be analyzed comprehensively to get the process of whether the sample to be tested is invalid.

Because the projection moiré technology has high accuracy for the measurement of product warpage deformation, it can monitor the warpage deformation measurement process of large-area package modules that may have large warpage defects on-line. Because the ultrasonic technology has the characteristics of fast response speed, large detection area, and online monitoring of certain objects that are difficult to contact or forbidden to contact, it has significant advantages in defect characterization, so it can monitor the possibility of large-area package modules online There is a characterization process for large warpage defects. The combination of projection moiré technology and ultrasonic technology can further monitor the warpage defects of electronic devices in industrial production, improve the timeliness of warpage defect monitoring, and discover unqualified and failed devices in time, which is the process of product production. The quality improvement of the process provides an effective dynamic reference, thereby increasing the yield of electronic devices and reducing production costs.

In addition, the three-dimensional online monitoring device for warpage, deformation and defects of the package module further includes: an optical three-dimensional measurement calibrator and a plane placement platform. The optical three-dimensional measurement calibrator is used to calibrate the internal parameters, external parameters, and height of the cameras, and establish the spatial coordinate system between the cameras and between the cameras and the package module sample to be tested. The sample of the packaged module to be tested is placed on the flat mounting table.

Specifically, referring to FIG. 1, the CCD camera 1 is a CCD camera array composed of multiple CCD cameras, and the grating projector 2 is a grating projector array composed of multiple grating projectors. The air-coupled ultrasonic probe is an array-type air-coupled ultrasonic probe group composed of a plurality of air-coupled ultrasonic probes; the array-type air-coupled ultrasonic probe group can be divided into: a transmitting probe 3 and a receiving probe 4. A sample of the packaged module to be tested (such as a wafer or an OLED screen, etc.) 5 is placed on the flat placement table, the transmitting probe 3 is located above the sample 5 of the packaged module to be tested, and the receiving probe 4 is located on the surface. Below the package module sample 5 to be tested, for example, the receiving probe 4 can be arranged inside the flat mounting platform, and the sending probe 3 and the receiving probe 4 are both perpendicular to the package module to be tested. Sample 5.

Example 2:

Embodiment 2 provides a three-dimensional online monitoring device for warpage, deformation and defects of a package module. Referring to FIG. 2, the CCD camera 1 is a CCD camera array composed of multiple CCD cameras, and the grating projector 2 is a multiple grating projection An array of grating projectors composed of the instrument. The air-coupled ultrasonic probe is an array type air-coupled ultrasonic probe group composed of a plurality of air-coupled ultrasonic probes. The difference from Embodiment 1 is that the probe in Embodiment 2 is the sending and receiving probe 3. The packaged module sample 4 to be tested is placed on the flat mounting table, and the sending and receiving probe 3 is located above the packaged module sample 4 to be tested and perpendicular to the packaged module sample 4 to be tested.

Example 3:

Embodiment 3 provides a three-dimensional online monitoring device for warpage, deformation and defects of a package module. Referring to FIG. 3, the CCD camera 1 is a CCD camera array composed of multiple CCD cameras, and the grating projector 2 is a multiple grating projection An array of grating projectors composed of the instrument. The air-coupled ultrasonic probe is an array-type air-coupled ultrasonic probe group composed of a plurality of air-coupled ultrasonic probes; the array-type air-coupled ultrasonic probe group can be divided into: a transmitting probe 3 and a receiving probe 4. The packaged module sample 5 to be tested is placed on the flat mounting platform, the sending probe 3 and the receiving probe 4 are all located above the packaged module sample 5 to be tested, and the sending probe 3, the sending probe 3 and the receiving probe 4 are located above the sample 5 of the packaged module to be tested. The receiving probe 4 is at a certain angle with the package module sample 5 to be tested.

For the device provided in Example 1 to Example 3, a reference parameter is given below: (1) The projected area of the grating fringe that can be emitted is 600mm×600mm, the frequency is 50Hz, and the fringe density is adjustable from 2-50 lines; (2) ) The image resolution is 64 million pixels, the camera frame rate is 75fps, the frame rate is not less than 10fps when the frame rate is 64 million pixels, the field of view is not less than 600mm×600mm, and the warpage deformation measurement resolution is 4 microns (600mm× 600mm).

Using the above device, the present invention provides a three-dimensional online monitoring method for warpage, deformation and defects of a package module, which includes the following steps:

Among them, the monitoring sequence method includes but not limited to the following two:

(1) Simultaneously use ultrasonic and projection moiré functions for online monitoring of warpage defects.

(2) On-line monitoring of warpage defects is carried out alternately or in a specific sequence of repetition using ultrasonic and projection moiré functions.

The description will be given below in conjunction with specific embodiments.

Example 4:

Embodiment 4 provides a three-dimensional online monitoring method for warpage deformation and defects of a package module, using the monitoring device provided in embodiment 1. Embodiment 4 uses the ultrasonic module to obtain the second warpage information using the transmission method. Refer to Figure 4 for the schematic diagram of the transmission method. The ultrasonic transmitting probe sends out the ultrasonic detection signal, and then the ultrasonic receiving probe receives the transmission from the sample to be tested. The transmitted ultrasonic signal is input into the workstation through the preamplifier to analyze and monitor the warpage defects of the sample.

Taking the three-dimensional online monitoring device for warpage, deformation and defects of the package module provided in Example 4 as an example, the corresponding online monitoring method is as follows: In the projection moiré module, the high-speed grating projector projects the grating to the sample surface, and the array CCD camera sets The grating changes on the sample surface are continuously photographed and collected, and the warpage defects of the sample are monitored through projection moiré analysis software; in the ultrasonic module, a workstation is used to control the high-sensitivity array air-coupled ultrasonic transmitter probe set to send out ultrasonic signals, and then the array type The air-coupled ultrasonic receiving probe group receives the ultrasonic wave signal of the sample to be tested for continuous collection, and inputs it into the workstation through the preamplifier to analyze and monitor the warpage defects of the sample. Through this complete set of ultrasonic and projection moiré system, the purpose of online monitoring of warpage deformation and defects of large-area packaged modules is achieved.

Example 5:

Embodiment 5 provides a three-dimensional online monitoring method for warpage, deformation and defects of a package module, using the monitoring device provided in embodiment 2. Embodiment 5 uses the ultrasonic module to obtain the second warpage information by using a surface reflection method. Refer to Figure 5 for the principle diagram of the surface reflection method. The ultrasonic transmitting and receiving probe sends out the ultrasonic detection signal, and then the ultrasonic transmitting and receiving probe receives the ultrasonic signal reflected from the surface of the sample to be tested, and inputs it into the workstation through the preamplifier. The warpage defects are analyzed and monitored.

Example 6:

Embodiment 6 provides a method for three-dimensional online monitoring of warpage deformation and defects of a packaged module, using the monitoring device provided in embodiment 3. Embodiment 6 adopts the bottom surface reflection method (V transmission method) to obtain the second warpage information through the ultrasonic module. Refer to Figure 6 for the schematic diagram of the bottom reflection method (V transmission method). The ultrasonic transmitting probe and the receiving probe are pre-adjusted to a certain angle in the sample area to be tested, so that the reflected ultrasonic signal is collected by the receiving probe smoothly. First, the ultrasonic transmitting probe sends out the ultrasonic detection signal, and then the ultrasonic receiving probe receives the transmitted ultrasonic signal reflected and penetrated from the bottom surface of the sample to be tested, and inputs it into the workstation through the preamplifier to analyze and monitor the warpage defects of the sample.

Example 7:

Embodiment 7 provides a three-dimensional online monitoring method for warpage deformation and defects of a package module, using the monitoring device provided in embodiment 3. Embodiment 7 uses the ultrasonic module to obtain the second warpage information by using the bottom surface reflection method (surface wave). Refer to Figure 7 for the schematic diagram of the bottom reflection method (surface wave). The ultrasonic transmitting probe and the receiving probe are pre-adjusted to a certain angle in the sample area to be measured, so that the reflected ultrasonic signal is collected by the receiving probe smoothly. First, the ultrasonic transmitting probe sends out the ultrasonic detection signal, and then the ultrasonic receiving probe simultaneously receives the transmitted ultrasonic signal reflected and penetrated from the bottom surface of the sample to be tested and the surface wave signal reflected on the surface of the sample, which is input to the workstation through the preamplifier. The warpage defects of the samples are analyzed and monitored.

The three-dimensional online monitoring method and device for warpage deformation and defects of a package module provided by the embodiments of the present invention include at least the following technical effects:

The invention can perform online monitoring of the warpage defects of electronic devices in industrial production, improve the timeliness of warpage defect monitoring, find unqualified and failed devices in time, and provide an effective dynamic reference for the quality improvement of the process flow of product production, Thereby improving the yield rate of electronic devices and reducing production costs.

Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to examples, those of ordinary skill in the art should understand that the technical solutions of the present invention can be implemented Modifications or equivalent replacements without departing from the spirit and scope of the technical solutions of the present invention should be covered by the scope of the claims of the present invention.

Claims

A three-dimensional online monitoring device for warpage, deformation and defects of a packaged module, which is characterized by comprising: a projection moiré module, an ultrasonic module, and a monitoring analysis module;

The monitoring analysis module is respectively connected to the projection moiré module and the ultrasonic module;

The projection moiré module is used to obtain the first warpage information of the package module sample to be tested;

The ultrasonic module is used to obtain the second warpage information of the package module sample to be tested;

The monitoring analysis module is configured to obtain monitoring result information according to the first warpage information and the second warpage information.
The three-dimensional online monitoring device for warpage, deformation and defects of a package module according to claim 1, wherein the projection moiré module comprises: a CCD camera and a grating projector;

The grating projector is used to project the grating to the surface of the package module sample to be tested;

The CCD camera is used to continuously photograph and collect the grating changes on the sample surface of the package module to be tested to obtain the first warpage information.
The three-dimensional online monitoring device for warpage deformation and defects of a package module according to claim 2, wherein the projection moiré module further comprises: a first synchronization trigger;

The CCD camera is a CCD camera array composed of multiple CCD cameras; the CCD camera array is connected to the first synchronization trigger;

The grating projector is a grating projector array composed of multiple grating projectors; the grating projector is connected to the first synchronization trigger.
The three-dimensional online monitoring device for warpage deformation and defects of a package module according to claim 1, wherein the ultrasonic module comprises: an air-coupled ultrasonic probe, an ultrasonic signal transmitter and receiver, and a preamplifier;

The air-coupled ultrasonic probe is connected with the ultrasonic signal transmitting and receiving receiver, the ultrasonic signal transmitting and receiving receiver is connected with the preamplifier, and the preamplifier is connected with the monitoring analysis module.
The three-dimensional online monitoring device for warpage and defect of the package module according to claim 4, wherein the ultrasonic module further comprises: a second synchronization trigger;

The air-coupled ultrasonic probe is an array-type air-coupled ultrasonic probe group composed of a plurality of air-coupled ultrasonic probes; the array-type air-coupled ultrasonic probe group is connected with the second synchronization trigger.
The three-dimensional online monitoring device for warpage, deformation and defects of a package module according to claim 1, wherein the monitoring and analysis module comprises: a data storage device, a data analysis device, and a monitoring display device;

The data storage device is used to store information from the projection moiré module and the ultrasonic module, and transmit the information to the data analysis device, and the data storage device is connected to the first synchronization trigger and the second synchronization trigger器连接； Connect;

The data analysis device is used for obtaining warpage deformation information according to the first warpage information, used for obtaining warpage defect information according to the second warpage information, and used for obtaining warpage defect information according to the warpage deformation information and the warpage Obtain the monitoring result information from the defect information of the song;

The monitoring display device is used for displaying the monitoring result information.
The three-dimensional online monitoring device for warpage, deformation and defects of the package module according to claim 1, further comprising: an optical three-dimensional measurement calibrator;

The optical three-dimensional measurement calibrator is used to calibrate the camera's internal parameters, external parameters, and height.
The three-dimensional online monitoring device for warpage, deformation and defects of the package module according to claim 1, further comprising: a plane placement platform;

The sample of the packaged module to be tested is placed on the flat mounting table.
A three-dimensional online monitoring method for warpage deformation and defects of a package module is characterized in that the three-dimensional online monitoring device for warpage deformation and defects of a package module according to any one of claims 1-8 is adopted, and the method comprises the following steps:

Obtain the first warpage information of the package module sample to be tested by projecting the moiré module;

Obtain the second warpage information of the package module sample to be tested through the ultrasonic module;

Obtain monitoring result information according to the first warpage information and the second warpage information.
The method for three-dimensional online monitoring of warpage deformation and defects of a package module according to claim 9, wherein the ultrasonic module adopts the transmission method, the surface reflection method, the bottom reflection method of the V transmission method, and the bottom reflection method of the surface wave. Method to obtain the second warpage information.