CN110645902A - Online monitoring method and device for warpage deformation and defects of packaging module - Google Patents
Online monitoring method and device for warpage deformation and defects of packaging module Download PDFInfo
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- CN110645902A CN110645902A CN201910985678.2A CN201910985678A CN110645902A CN 110645902 A CN110645902 A CN 110645902A CN 201910985678 A CN201910985678 A CN 201910985678A CN 110645902 A CN110645902 A CN 110645902A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
- G01B11/167—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge by projecting a pattern on the object
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/72—Investigating presence of flaws
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
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Abstract
The invention belongs to the technical field of package module monitoring, and discloses an online monitoring method and device for warpage deformation and defects of a package module, wherein the device comprises a projection moire pattern module, an infrared imaging module and a monitoring analysis module; the method comprises the following steps: obtaining first warping information of a to-be-tested packaging module sample through a projection moire module; obtaining second warping information of a to-be-detected packaging module sample through an infrared imaging module; and obtaining monitoring result information according to the first warping information and the second warping information. The invention solves the problem that the warpage deformation and the defects of the packaging module can not be monitored on line in the prior art, and can monitor the failure condition of the packaging module of the electronic device in the actual industrial production process on line.
Description
Technical Field
The invention relates to the technical field of package module monitoring, in particular to an online monitoring method and device for package module warpage and defects.
Background
Integrated circuit technology has penetrated into various fields of industry and social life, and the electronic industry has become the first major industry today. Since the 70 s of the 20 th century, the global electronic information industry has rapidly developed. The electronic information industry has developed on the basis of the development and application of electronic science and technology. The development of the electronic information industry has led to the development of integrated circuits that are more or less updated every three years due to improvements in production technology and in processing technology; the mass production and use of large-scale integrated circuits and computers, and the rise of optical fiber communication, digital communication and satellite communication technologies make the electronic industry a rapidly growing high-technology industry. The development of the electronic industry and the wide application of products thereof have profound influence on the aspects of global economic culture and the like. The importance of semiconductors is enormous, both from a technological and economic point of view.
Most of today's electronic products, such as computers, mobile phones or digital audio recorders, have a core unit that is very closely related to semiconductors. The packaging technology of electronic devices is one of the key links that restrict the development of integrated circuits. The reliability, the welding performance and the yield of electronic devices are seriously influenced by the warping problem of the electronic devices caused by the difference of the sizes and the material performances of various materials (substrates, bonding layers, chips and packaging materials) under the action of larger temperature difference in the packaging process. Therefore, the problem of warpage of electronic devices has become a significant obstacle to the further development of electronic packaging technology.
In a semiconductor process, various material layers and various semiconductor device structures are formed on a wafer surface, so that various stresses are generated on the wafer surface, and the wafer is warped in the process. Under the optimal state, the wafer should not be warped, and even if the wafer cannot be completely flat, under the ideal state, the warping of the wafer should be a bowl shape with the edge tilted towards the front side of the wafer and symmetrical about the central axis vertical to the wafer; in practical situations, due to asymmetry of stress applied to the front surface of the wafer, asymmetric warpage of various forms of the wafer is often caused, so that warpage defects of the wafer are easily generated, and partial chips are failed or even broken.
In the prior art, the online monitoring of the warpage defect of a packaging module of an electronic device is difficult to realize in industrial production. There are many methods for measuring warping deformation, such as electronic speckle interferometry, shadow moire, projection moire, and Digital Image Correlation (DIC). The methods have specific measurement precision and application scenes, and the measurement areas and the measurement ranges of the methods are different. Electronic speckle interferometry is not suitable for measuring and monitoring large area warp deformations such as wafers because of its expensive high power laser. The shadow moire is not suitable for measuring and monitoring large-area warping deformation due to the problem of light path arrangement. The digital image correlation method is not suitable for the sample piece which can not be subjected to surface pretreatment because a layer of speckles with specific gray scale is required to be sprayed on the surface of the sample piece. The projection moire method is a modern optical measurement technology developed in the 70 s of the 20 th century, and is mainly used for detecting in-plane deformation, out-of-plane displacement and surface morphology. By means of the advantages of non-contact, high speed, full-field measurement, high resolution and high precision, the projection moire method is widely applied to the fields of biology, medical detection, product detection, reverse engineering and the like. The projection moire technology has mature equipment products at home and abroad at present, has higher measurement precision of warpage, and can reach the precision of 1.5 microns, but the projection moire technology can only measure the surface of an object due to the principle of the projection moire technology, and basically has no penetrating power, so the detection capability of the projection moire technology on the internal defects of the product is weaker.
In addition, currently, for warpage deformation and defects of a packaging module of an electronic device, off-line detection is usually performed on the electronic device after the electronic device fails in an industrial production process, and the method has the advantages of complex flow, multiple required devices, long consumed time, poor test effect and low benefit for improving the production process of the electronic device. How to effectively and reliably monitor the warping state of an electronic device on line is a problem to be solved urgently in the current industrial production.
Disclosure of Invention
The embodiment of the application provides an online monitoring method and device for warpage and defects of a packaging module, and solves the problem that warpage and defects of the packaging module cannot be monitored online in the prior art.
The embodiment of the application provides an online monitoring device of packaged module warp deformation and defect, includes: the system comprises a projection moire pattern module, an infrared imaging module and a monitoring analysis module;
the monitoring analysis module is respectively connected with the projection moire pattern module and the infrared imaging module;
the projection moire module is used for obtaining first warping information of a packaging module sample to be tested;
the infrared imaging module is used for obtaining second warping information of a to-be-tested packaging module sample;
the monitoring analysis module is used for obtaining monitoring result information according to the first warping information and the second warping information.
Preferably, the projection moire module comprises: a CCD camera, a grating projector;
the grating projector is used for projecting a grating to the surface of the packaging module sample to be tested;
the CCD camera is used for continuously shooting and collecting the grating change on the surface of the to-be-detected packaging module sample to obtain the first warping information.
Preferably, the projection moire module further comprises: a first synchronization trigger;
the CCD camera is a CCD camera array consisting of a plurality of CCD cameras; the CCD camera array is connected with the first synchronous trigger;
the grating projector is a grating projector array formed by a plurality of grating projectors.
Preferably, the infrared imaging module includes: an infrared camera;
the infrared camera is used for continuously collecting infrared images of the surface of the packaging module sample to be tested to obtain the second warping information.
Preferably, the infrared imaging module includes: thermal shock source, infrared camera;
the thermal shock source is used for carrying out thermal shock on a packaging module sample to be tested;
the infrared camera is used for continuously collecting infrared images of the surface of the to-be-tested packaging module sample after thermal shock, and the second warping information is obtained.
Preferably, the infrared imaging module further includes: a second synchronization flip-flop;
the infrared camera is an infrared camera array formed by a plurality of infrared cameras, and the infrared camera array is connected with the second synchronous trigger.
Preferably, the monitoring and analyzing module comprises: the system comprises a data storage device, a data analysis device and a monitoring display device;
the data storage device is used for storing information from the projection moire pattern module and the infrared imaging module and transmitting the information to the data analysis device;
the data analysis device is used for obtaining warping deformation information according to the first warping information, obtaining warping defect information according to the second warping information, and obtaining the monitoring result information according to the warping deformation information and the warping defect information;
and the monitoring display device is used for displaying the monitoring result information.
Preferably, the device for online monitoring of warpage and defects of the package module further comprises: an optical three-dimensional measurement calibrator;
the optical three-dimensional measurement calibrator is used for calibrating the internal reference, the external reference and the height of the camera.
Preferably, the device for online monitoring of warpage and defects of the package module further comprises: a plane placing table;
the packaging module sample to be tested is placed on the plane mounting table; the thermal shock source is arranged inside or on the side edge of the plane mounting table.
On the other hand, with the above apparatus, an embodiment of the present application provides an online monitoring method for warpage and defects of a package module, including the following steps:
obtaining first warping information of a to-be-tested packaging module sample through a projection moire module;
obtaining second warping information of a to-be-detected packaging module sample through an infrared imaging module;
and obtaining monitoring result information according to the first warping information and the second warping information.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
in the embodiment of the application, the first warping information of the to-be-detected packaging module sample is obtained through the projection moire, the second warping information of the to-be-detected packaging module sample is obtained through the infrared imaging, then the combination analysis is carried out according to the first warping information and the second warping information, the monitoring result information is obtained, the online monitoring on the failure condition of the packaging module of the electronic device in the actual industrial production process is achieved, and the stiff office of the past industry on offline detection of failed products is changed.
Drawings
In order to more clearly illustrate the technical solution in the present embodiment, the drawings needed to be used in the description of the embodiment will be briefly introduced below, and it is obvious that the drawings in the following description are one embodiment of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an online monitoring device for warpage and defects of a package module according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a device for online monitoring warpage and defects of a package module according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a third apparatus for online monitoring warpage and defects of a package module according to an embodiment of the present invention;
fig. 4 is a fourth schematic structural diagram of an online monitoring device for warpage and defects of a package module according to an embodiment of the present invention.
The device comprises a 1-CCD camera, a 2-grating projector, a 3-thermal shock source, a 4-infrared camera and a 5-to-be-detected packaging module sample.
Detailed Description
In order to better understand the technical solution, the technical solution will be described in detail with reference to the drawings and the specific embodiments.
The invention provides an on-line monitoring device for warpage and defects of a packaging module, which mainly comprises: the system comprises a projection moire pattern module, an infrared imaging module and a monitoring analysis module; the monitoring and analyzing module is respectively connected with the projection moire pattern module and the infrared imaging module.
The projection moire module is used for obtaining first warping information of a packaging module sample to be tested; the infrared imaging module is used for obtaining second warping information of a to-be-tested packaging module sample; the monitoring analysis module is used for obtaining monitoring result information according to the first warping information and the second warping information.
The present invention will be further described with reference to specific examples.
Example 1:
the packaging module warpage deformation and defect online monitoring device provided by the embodiment 1 comprises a projection moire pattern module, an infrared imaging module and a monitoring analysis module; the monitoring and analyzing module is respectively connected with the projection moire pattern module and the infrared imaging module.
Wherein, referring to fig. 1-4, the projection moire module comprises: a CCD camera 1, a grating projector 2; the grating projector 2 is used for projecting a grating to the surface of the packaging module sample 5 to be tested; the CCD camera 1 is used for continuously shooting and collecting the grating change on the surface of the to-be-detected packaging module sample 5 to obtain the first warping information.
The infrared imaging module includes: an infrared camera 4; the infrared camera 4 is used for continuously collecting infrared images of the surface of the encapsulation module sample 5 to be tested, and obtaining the second warping information.
The monitoring analysis module comprises: data storage device, data analysis device, monitoring display device. The data storage device is used for storing information from the projection moire pattern module and the infrared imaging module and transmitting the information to the data analysis device; the data analysis device is used for obtaining warping deformation information according to the first warping information, obtaining warping defect information according to the second warping information, and obtaining the monitoring result information according to the warping deformation information and the warping defect information; and the monitoring display device is used for displaying the monitoring result information.
The judgment process of the warping deformation and the defects is combined and analyzed, the warping deformation is completed by the projection moire module, and if the analysis result shows that the warping deformation of the to-be-detected packaging module sample is obviously larger, the warping deformation and the defects are combined and comprehensively analyzed with the infrared imaging module which is responsible for the warping defect monitoring to obtain a result. Namely, the two processes need to be comprehensively analyzed to obtain whether the sample piece to be tested is invalid or not.
The projection moire technology has higher precision for the measurement of the warpage deformation of the product, so that the warpage deformation measurement process of a large-area packaging module which possibly has larger warpage defects can be monitored on line. The infrared imaging technology has the characteristics of high response speed, large detection area, capability of monitoring some objects to be detected which are difficult to contact or forbidden to contact on line and the like, so that the characterization process of the large-area packaging module with the possibility of having a large warping defect can be monitored on line. The projection moire technology is combined with the infrared imaging technology, the warping defect of the electronic device in industrial production can be further monitored on line, the timeliness of warping defect monitoring is improved, unqualified invalid devices are found in time, effective dynamic reference is provided for quality improvement of the process flow of product production, the yield of the electronic device is improved, and production cost is reduced.
Example 2:
the difference between the online monitoring device for warpage and defects of the package module provided in embodiment 2 and embodiment 1 is that the projection moire module further comprises a first synchronous trigger, and the CCD camera 1 is a CCD camera array composed of a plurality of CCD cameras; the CCD camera array is connected with the first synchronous trigger. The grating projector 2 is a grating projector array composed of a plurality of grating projectors.
The first synchronous trigger is connected with the CCD cameras through data lines respectively, and then the first synchronous trigger is connected with a workstation (namely a monitoring analysis module) for controlling photographing and analysis. The first synchronous trigger is adopted to ensure that a plurality of CCD cameras can be triggered to take pictures simultaneously when taking pictures, so as to ensure that pictures taken at the same time can be combined into a whole picture in the workstation.
The CCD camera array can be used for realizing the online monitoring of the large-area packaging module, and the limitation of the camera view field size can be improved. The measurement is carried out by forming an array by a plurality of cameras, for example, the field of view of the array of 16 CCD camera groups is 600 x 600mm, the measurement precision can reach 4 micrometers, and the precision can reach 1.5 micrometers under the field of view of 240 x 240 mm. By adopting 64, 100, 200 or even more cameras to form an array, the warping deformation and the defects under an infinite area can be theoretically measured.
The number of the grating projectors 2 theoretically depends on whether the grating projected by the projectors covers the whole surface of the encapsulation module sample 5 to be tested. In order to realize a theoretically infinite measuring area, the purpose of large-area monitoring can be realized by increasing the number of grating projectors, namely array-type assembly of the grating projectors.
Example 3:
the difference between the online monitoring device for warpage and defects of the package module provided in embodiment 3 and embodiment 1 or embodiment 2 is that the infrared imaging module further includes a second synchronous trigger, the infrared camera 4 is an infrared camera array composed of a plurality of infrared cameras, and the infrared camera array is connected to the second synchronous trigger. Each infrared camera comprises an infrared lens and an infrared detector.
When the large-area packaging module is monitored on line, a single infrared lens may not cover the whole area to be detected, so that the infrared camera array can cover a large area. The second synchronous trigger can ensure that a plurality of infrared cameras can be triggered to take pictures at the same time.
Example 4:
The main purpose of adding the thermal shock source 3 is to enable the infrared imaging module to work better in an industrial production line, because there is no temperature gradient near the temperature detected in the production process, and the infrared imaging module needs a certain temperature gradient in the sample itself for normal operation. After the thermal shock source 3 impacts the sample, because the thermal expansion coefficients of different materials of the sample are different, the temperature raised in the same time is also different, so that a certain temperature gradient is formed.
In addition, in embodiments 1 to 4, an optical three-dimensional measurement calibrator may be further used to calibrate the internal reference, the external reference, and the height of the camera, and place the package module sample 5 to be tested on the planar mounting table. The high-precision three-dimensional calibrator is used for performing internal reference, external reference and height calibration on a plurality of cameras and establishing space coordinate systems among the cameras and between the cameras and the to-be-tested packaging module sample piece 5.
According to different areas to be monitored of the infrared imaging, the installation mode of the specific device can be correspondingly adjusted. As shown in fig. 1-4, the infrared camera 4 may be integrated on a side (e.g., a side wall of a temperature chamber) or a top (e.g., a top of a temperature chamber) of the sample of the package module to be tested 5, and the thermal shock source 3 may be disposed inside or on a side (e.g., a side wall of a temperature chamber) of the planar placement table.
One reference parameter is given below: (1) the projected area of the grating stripe which can be emitted is 600mm multiplied by 600mm, the frequency is 50Hz, and the stripe density is 2-50 lines and is adjustable; (2) the image resolution is 6400 ten thousand pixels, the camera frame rate is 75fps, the frame rate is not less than 10fps under 6400 ten thousand pixels, the field of view is not less than 600mm multiplied by 600mm, and the warping deformation measurement resolution is 4 microns (600mm multiplied by 600 mm).
By using the device for online monitoring of warpage and defects of a package module provided by the above embodiment, the embodiment provides a method for online monitoring of warpage and defects of a package module, comprising the following steps:
obtaining first warping information of a to-be-tested packaging module sample through a projection moire module;
obtaining second warping information of a to-be-detected packaging module sample through an infrared imaging module;
and obtaining monitoring result information according to the first warping information and the second warping information.
The monitoring sequence method includes, but is not limited to, the following two methods:
(1) and simultaneously, carrying out online monitoring on the warping defect in a mode of infrared imaging and a projection moire function.
(2) And the online monitoring of the warping defect is carried out by adopting an infrared imaging and moire pattern projection mode alternately in sequence or in a certain specific sequence.
Taking the on-line monitoring device for warpage and defects of the package module provided in embodiment 4 as an example, the correspondingly adopted on-line monitoring method is as follows: in the projection moire module, a high-speed grating projector projects a grating to the surface of a sample, an array CCD camera group continuously shoots and collects the grating change on the surface of the sample, and the warping defect of the sample is monitored by projection moire analysis software; in the infrared imaging module, a thermal shock source carries out transient and proper thermal shock on a sample, so that the sample generates temperature difference due to different heat conductivity coefficients of materials of the sample, then the array type infrared camera carries out continuous acquisition of infrared images on the surface (such as the side-looking direction of a cross section) of the sample, and the infrared images are input into a computer through an infrared detector to analyze and monitor the warping defect of the sample. The data of the infrared imaging and the projection moire are input into the data storage device through the data line and then output into the data analysis device and the image display device through the data line, and visual online monitoring of the warping defect is achieved. By the whole set of infrared imaging and projection moire system, the purposes of online monitoring of warping deformation and defects of the large-area packaging module are achieved.
The method and the device for online monitoring of warpage and defects of the packaging module, provided by the embodiment of the invention, at least have the following technical effects:
the invention can carry out on-line monitoring on the warping defect of the electronic device in industrial production, improve the timeliness of the warping defect monitoring, find out unqualified invalid devices in time, and provide effective dynamic reference for the quality improvement of the process flow of product production, thereby improving the yield of the electronic device and reducing the production cost.
Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to examples, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the claims of the present invention.
Claims (10)
1. The utility model provides an online monitoring device of encapsulation module warp deformation and defect which characterized in that includes: the system comprises a projection moire pattern module, an infrared imaging module and a monitoring analysis module;
the monitoring analysis module is respectively connected with the projection moire pattern module and the infrared imaging module;
the projection moire module is used for obtaining first warping information of a packaging module sample to be tested;
the infrared imaging module is used for obtaining second warping information of a to-be-tested packaging module sample;
the monitoring analysis module is used for obtaining monitoring result information according to the first warping information and the second warping information.
2. The device for on-line monitoring warpage and defects of packaging module of claim 1, wherein the projection moire module comprises: a CCD camera, a grating projector;
the grating projector is used for projecting a grating to the surface of the packaging module sample to be tested;
the CCD camera is used for continuously shooting and collecting the grating change on the surface of the to-be-detected packaging module sample to obtain the first warping information.
3. The on-line monitoring device for warpage and defects of packaging module according to claim 2, wherein the projected moire module further comprises: a first synchronization trigger;
the CCD camera is a CCD camera array consisting of a plurality of CCD cameras; the CCD camera array is connected with the first synchronous trigger;
the grating projector is a grating projector array formed by a plurality of grating projectors.
4. The on-line package module warpage and defect monitoring device of claim 1, wherein the infrared imaging module comprises: an infrared camera;
the infrared camera is used for continuously collecting infrared images of the surface of the packaging module sample to be tested to obtain the second warping information.
5. The on-line package module warpage and defect monitoring device of claim 1, wherein the infrared imaging module comprises: thermal shock source, infrared camera;
the thermal shock source is used for carrying out thermal shock on a packaging module sample to be tested;
the infrared camera is used for continuously collecting infrared images of the surface of the to-be-tested packaging module sample after thermal shock, and the second warping information is obtained.
6. The on-line monitoring device for warpage and defects of packaging module as claimed in claim 4 or 5, wherein the infrared imaging module further comprises: a second synchronization flip-flop;
the infrared camera is an infrared camera array formed by a plurality of infrared cameras, and the infrared camera array is connected with the second synchronous trigger.
7. The device for on-line monitoring warpage and defects of packaging module of claim 1, wherein the monitoring and analyzing module comprises: the system comprises a data storage device, a data analysis device and a monitoring display device;
the data storage device is used for storing information from the projection moire pattern module and the infrared imaging module and transmitting the information to the data analysis device;
the data analysis device is used for obtaining warping deformation information according to the first warping information, obtaining warping defect information according to the second warping information, and obtaining the monitoring result information according to the warping deformation information and the warping defect information;
and the monitoring display device is used for displaying the monitoring result information.
8. The device for on-line monitoring warpage and defects of packaging module as claimed in claim 2 or 4, further comprising: an optical three-dimensional measurement calibrator;
the optical three-dimensional measurement calibrator is used for calibrating the internal reference, the external reference and the height of the camera.
9. The device for on-line monitoring warpage and defects of packaging module of claim 5, further comprising: a plane placing table;
the packaging module sample to be tested is placed on the plane mounting table; the thermal shock source is arranged inside or on the side edge of the plane mounting table.
10. An on-line monitoring method for warpage and defects of a package module, which is characterized in that the on-line monitoring device for warpage and defects of a package module as claimed in any one of claims 1 to 9 is adopted, and the method comprises the following steps:
obtaining first warping information of a to-be-tested packaging module sample through a projection moire module;
obtaining second warping information of a to-be-detected packaging module sample through an infrared imaging module;
and obtaining monitoring result information according to the first warping information and the second warping information.
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| CN201910985678.2A CN110645902A (en) | 2019-10-17 | 2019-10-17 | Online monitoring method and device for warpage deformation and defects of packaging module |
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| CN201910985678.2A CN110645902A (en) | 2019-10-17 | 2019-10-17 | Online monitoring method and device for warpage deformation and defects of packaging module |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114855226A (en) * | 2022-03-11 | 2022-08-05 | 九江德福科技股份有限公司 | Copper foil warping degree on-line monitoring method |
| CN114855226B (en) * | 2022-03-11 | 2024-05-10 | 九江德福科技股份有限公司 | Copper foil warpage online monitoring method |
-
2019
- 2019-10-17 CN CN201910985678.2A patent/CN110645902A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114855226A (en) * | 2022-03-11 | 2022-08-05 | 九江德福科技股份有限公司 | Copper foil warping degree on-line monitoring method |
| CN114855226B (en) * | 2022-03-11 | 2024-05-10 | 九江德福科技股份有限公司 | Copper foil warpage online monitoring method |
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