WO2021062786A1 - Led mass transfer method and apparatus - Google Patents

Led mass transfer method and apparatus Download PDF

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Publication number
WO2021062786A1
WO2021062786A1 PCT/CN2019/109710 CN2019109710W WO2021062786A1 WO 2021062786 A1 WO2021062786 A1 WO 2021062786A1 CN 2019109710 W CN2019109710 W CN 2019109710W WO 2021062786 A1 WO2021062786 A1 WO 2021062786A1
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Prior art keywords
led
carrier substrate
light modulator
spatial light
position information
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PCT/CN2019/109710
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French (fr)
Chinese (zh)
Inventor
许时渊
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重庆康佳光电技术研究院有限公司
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Priority to CN201980001985.0A priority Critical patent/CN111183511A/en
Priority to PCT/CN2019/109710 priority patent/WO2021062786A1/en
Publication of WO2021062786A1 publication Critical patent/WO2021062786A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages

Definitions

  • the invention belongs to the technical field of semiconductor optoelectronics, and in particular relates to a method and a device for LED mass transfer.
  • Micro-LED technology that is, LED miniaturization and matrix technology, has good stability, longevity, and operating temperature advantages. It also inherits the advantages of LED low power consumption, color saturation, fast response speed, strong contrast, etc. , Micro-LED has higher brightness and lower power consumption, making Micro-LED have great application prospects.
  • the existing method of mass transfer of Micro-LED is to realize the mass transfer of Micro-LED by positioning the LED by laser. This method requires the laser to position and transfer each LED, the transfer speed is slow, the positioning is not accurate, and it is easy to mistransfer. In addition, the maintenance cost of the laser mass transfer device is high, which causes the high cost of the Micro-LED mass transfer process to be difficult for mass production.
  • the purpose of the present invention is to provide a method and device for mass transfer of LEDs, to overcome the slow transfer speed, inaccurate positioning, easy mistransfer and high maintenance cost of the device in the prior art. defect.
  • the first embodiment disclosed in the present invention is a method for LED mass transfer, which includes:
  • the undamaged LED remaining on the carrier substrate after irradiating the light beam is transferred to the target substrate.
  • the step of irradiating the carrier substrate with corresponding light beams according to the position information includes:
  • the adjusted light beam is used to irradiate the carrier substrate accordingly.
  • the spatial light modulator is one of a transmissive spatial light modulator, a reflective spatial light modulator or a digital micro mirror.
  • the transmissive spatial light modulator when the spatial light modulator is a transmissive spatial light modulator, the transmissive spatial light modulator includes a first electrode plate, a liquid crystal, and a second electrode plate;
  • the step of using the spatial light modulator to adjust the irradiation beam according to the position information includes:
  • the arrangement direction and position of the liquid crystal are adjusted according to the voltage, and the irradiation beam is adjusted according to the arrangement direction and position of the liquid crystal.
  • the reflective spatial light modulator when the spatial light modulator is a reflective spatial light modulator, includes a conductive electrode, a liquid crystal, an emitting electrode, and a polarizer;
  • the step of using the spatial light modulator to adjust the irradiation beam according to the position information includes:
  • the polarization direction of the irradiation beam is adjusted according to the arrangement direction and position of the liquid crystal, and the irradiation beam is filtered through the polarizer to filter the irradiation beam whose polarization direction has changed, so as to adjust the irradiation beam.
  • the spatial light modulator is a digital micro mirror
  • the digital micro mirror includes a micro lens corresponding to the position of the LED
  • the step of using the spatial light modulator to adjust the irradiation beam according to the position information includes:
  • the irradiation beam is adjusted according to the inclination angle of the micro lens.
  • the second embodiment disclosed in the present invention is a method for LED mass transfer, which includes: detecting and obtaining
  • the carrier substrate is irradiated with corresponding light beams, so that the irradiated undamaged LED is separated from the carrier substrate and transferred to the target substrate.
  • the step of performing corresponding beam irradiation on the carrier substrate according to the position information includes:
  • the adjusted light beam is used to irradiate the carrier substrate accordingly.
  • the spatial light modulator is one of a transmissive spatial light modulator, a reflective spatial light modulator or a digital micro mirror.
  • the transmissive spatial light modulator when the spatial light modulator is a transmissive spatial light modulator, the transmissive spatial light modulator includes a first electrode plate, a liquid crystal, and a second electrode plate;
  • the step of using the spatial light modulator to adjust the irradiation beam according to the position information includes:
  • the arrangement direction and position of the liquid crystal are adjusted according to the voltage, and the irradiation beam is adjusted according to the arrangement direction and position of the liquid crystal.
  • the reflective spatial light modulator when the spatial light modulator is a reflective spatial light modulator, includes a conductive electrode, a liquid crystal, an emitting electrode, and a polarizer;
  • the step of using the spatial light modulator to adjust the irradiation beam according to the position information includes:
  • the polarization direction of the irradiation beam is adjusted according to the arrangement direction and position of the liquid crystal, and the irradiation beam is filtered through the polarizer to filter the irradiation beam whose polarization direction has changed, so as to adjust the irradiation beam.
  • the spatial light modulator is a digital micro mirror
  • the digital micro mirror includes a micro lens corresponding to the position of the LED
  • the step of using the spatial light modulator to adjust the irradiation beam according to the position information includes:
  • the irradiation beam is adjusted according to the inclination angle of the micro lens.
  • the third embodiment disclosed in the present invention is a device for performing LED mass transfer by the aforementioned LED mass transfer method, wherein the device includes: a light source group, a first lens group, a spatial light modulator, a carrier substrate, The LED group including the damaged LED and the undamaged LED, the first adhesive layer, the second adhesive layer, the target substrate and the control terminal;
  • the first lens group is used to receive the light beam emitted by the light source group, and to collimate and expand the light beam;
  • the spatial light modulator is connected to the control terminal, and is used to receive the collimated and expanded beam, and compare the positions of damaged or undamaged LEDs on the carrier substrate stored in the control terminal.
  • the carrier substrate is irradiated with corresponding light beams;
  • the LED group is connected to the carrier substrate through the first adhesive material layer; the LED group is connected to the target substrate through the second adhesive material layer; when the light beam is irradiated by the spatial light modulator When onto the carrier substrate, the damaged LED or the undamaged LED is separated from the carrier substrate, and the undamaged LED is transferred to the target substrate.
  • the present invention provides a method and device for mass transfer of LEDs.
  • the carrier substrate is irradiated with corresponding beams based on the position information of the damaged or undamaged LEDs on the carrier substrate.
  • the positioning is simple and accurate, and the carrier is irradiated by the beam.
  • the damaged or undamaged LED can be completely separated from the carrier substrate at one time, and the undamaged LED can be transferred to the target substrate at one time, and the transfer efficiency is high.
  • Fig. 1 is a flowchart of a preferred embodiment of a method for LED mass transfer provided in the first embodiment of the present invention
  • FIG. 2 is a flowchart of a preferred embodiment of a method for LED mass transfer provided in the second embodiment of the present invention
  • Fig. 3 is a working principle diagram of the transmissive spatial light modulator provided by the present invention.
  • FIG. 4 is a working principle diagram of the reflective spatial light modulator provided by the present invention.
  • FIG. 5 is a working principle diagram of the digital micro mirror provided by the present invention.
  • FIG. 6 is a schematic diagram of an LED mass transfer device corresponding to a method for LED mass transfer according to the first embodiment of the present invention
  • FIG. 7 is a schematic structural diagram of an LED mass transfer device corresponding to a method for LED mass transfer according to the second embodiment of the present invention.
  • FIG. 1 is a flowchart of a preferred embodiment of a method for LED mass transfer provided in the first embodiment of the present invention.
  • the method for LED mass transfer includes the following steps:
  • S200 Perform corresponding beam irradiation on the carrier substrate according to the position information, so that the irradiated damaged LED is separated from the carrier substrate;
  • the photoluminescence test (PL) or electroluminescence test (EL) can be used to measure whether each LED on the carrier substrate is damaged, and if there is damage, obtain The location information of the damaged LED, because the LED test is for each LED, the location information of all the damaged LEDs can be accurately obtained in the end.
  • a light source group emits a light beam, and after the light beam is adjusted according to the acquired position information of the damaged LED, the light beam is irradiated onto the carrier substrate. Since the position information of the damaged LED is accurately located in advance, the irradiation beams on the carrier substrate and the corresponding positions of the damaged LED and the non-damaged LED can be made different, and the damaged LED can be separated from the carrier substrate. After the damaged LED is separated from the carrier substrate, the remaining LEDs on the carrier substrate are undamaged LEDs. The undamaged LED can be further separated from the carrier substrate by the same method and transferred to the target substrate.
  • the carrier substrate and the LED are connected through a first glue layer, and the step S200 specifically includes:
  • S201 Perform beam irradiation on a position on the carrier substrate corresponding to the damaged LED according to the position information;
  • the carrier substrate and the LED are connected through a first glue layer
  • the first glue layer may be BCB glue, UV light dissolvable glue, IR light dissolvable glue, etc., or Solder such as indium, tin, or indium tin, or the above UV or IR photolytic glue to make a film, etc.
  • the light beam may be other light beams other than visible light, such as UV or IR light.
  • the carrier substrate is made of transparent materials such as glass, quartz or sapphire.
  • the light beam irradiated on the carrier substrate is adjusted according to the position information, so that the position on the carrier substrate corresponding to the damaged LED is illuminated by the beam, while other positions That is, the position on the carrier substrate corresponding to the undamaged LED is not irradiated by the light beam.
  • the carrier substrate is made of transparent material, and the position on the carrier substrate irradiated by the light beam will irradiate the first adhesive layer through the carrier substrate.
  • the first glue layer is irradiated by the light beam and then debonded, so that the LED at the debonding position is separated from the carrier substrate, that is, the damaged LED is separated from the carrier substrate.
  • the present invention performs beam adjustment according to the position information of the damaged LED, and the positioning method is accurate and simple , And can separate all damaged LEDs from the carrier substrate at one time, and the mass transfer of LEDs is fast and efficient.
  • the step S300 specifically includes:
  • S302 irradiate the carrier substrate with light beams, so that the irradiated undamaged LED is separated from the carrier substrate and transferred to the target substrate.
  • the damaged LED is separated from the carrier substrate, and all the LEDs left on the carrier substrate are undamaged LEDs. At this time, it is necessary to further transfer the undamaged LEDs and transfer them to On the target substrate for LED repair.
  • the undamaged LED on the carrier substrate is connected to the target substrate through the second glue layer.
  • the second glue layer can also be BCB glue, UV light resolvable glue, IR light resolvable glue, etc., or It is a solder, such as indium, tin, or indium tin, or the above-mentioned UV or IR photolytic glue is made into an adhesive film, etc., the second adhesive material layer may have the same viscosity as the first adhesive material layer The material may also be a material with a viscosity different from that of the first adhesive layer.
  • the undamaged LED is simultaneously connected to the carrier substrate and the target substrate. In order to transfer the undamaged LED to the target substrate, the carrier substrate needs to be separated from the undamaged LED.
  • the position information of the undamaged LED on the carrier substrate is obtained, and the position on the carrier substrate corresponding to the undamaged LED is irradiated with the beam again according to the position information of the undamaged LED.
  • the first adhesive layer on the corresponding position of the undamaged LED is irradiated by the beam Glue separates the undamaged LED from the carrier substrate, thereby transferring the undamaged LED to the target substrate.
  • the undamaged LED can be transferred in a large amount by two beam irradiations, the transfer speed is fast, and the operation is simple.
  • Obtaining the location information of the undamaged LED is the same as the method for obtaining the location information of the undamaged LED mentioned in the foregoing steps, and will not be repeated here.
  • the remaining LED on the carrier substrate is an undamaged LED, and the light beam may not be adjusted according to the position information of the undamaged LED, but the The entire light beam is directly irradiated on the carrier substrate. Since the carrier substrate is all irradiated by the light beam, the entire first adhesive layer will be debonded due to the light beam irradiation, which can also separate the undamaged LED from the carrier substrate and transfer to the target substrate.
  • the LED mass transfer method mentioned in the foregoing steps is to first separate the damaged LED from the carrier substrate by one beam irradiation, and then transfer the undamaged LED to the target substrate by the second beam irradiation.
  • the present invention can also be directly passed One beam irradiation separates the undamaged LED from the carrier substrate and transfers it to the target substrate. Therefore, the second embodiment of the present invention also provides a method for mass transfer of LEDs.
  • FIG. 2 is a flowchart of a preferred embodiment of a method for LED mass transfer provided in the second embodiment of the present invention.
  • the method for LED mass transfer includes the steps:
  • the LED is connected to the carrier substrate through a first adhesive layer, and the LED is also connected to the target substrate through a second adhesive layer.
  • the viscosity of the first adhesive layer needs to be greater than the viscosity of the second adhesive layer, and the viscosity of the undamaged LED and the carrier substrate before the light beam irradiates the carrier substrate is greater than the viscosity of the undamaged LED and the target substrate.
  • the carrier substrate is irradiated with corresponding beams according to the position information of the undamaged LEDs, and the first adhesive layer at the position of the undamaged LEDs is debonded, so that the viscosity of the undamaged LEDs and the carrier substrate is less than The viscosity of the LED and the target substrate is not damaged, and the first adhesive layer that damages the position of the LED at the same time is not irradiated by the light beam, so that the viscosity of the damaged LED and the carrier substrate is still greater than the viscosity of the damaged LED and the target substrate.
  • the damaged LED still remains in On the carrier substrate, the LED is directly separated from the carrier substrate without damage and transferred to the target substrate.
  • the rapid and massive transfer of the LED is realized through one beam irradiation.
  • the location information of the undamaged LED is the same as the method for obtaining the location information of the damaged LED in the first embodiment.
  • the viscosity of the first adhesive layer 7 in this embodiment can also be less than or equal to the viscosity of the second adhesive layer 9, but at this time, the undamaged LED 51 can only be separated from the carrier substrate after the first beam irradiation. Since the damaged LED 52 is also connected to the second adhesive layer 9, the undamaged LED 51 cannot be directly transferred to the target substrate.
  • the target substrate 8 can be beamed again according to the position information of the damaged LED 52. Irradiate to separate the damaged LED 52 from the target substrate 8. The specific steps have been described in detail in the foregoing, and will not be repeated here.
  • step S200 specifically includes:
  • the first adhesive material layer between the carrier substrate and the undamaged LED is irradiated by the light beam and then released, so that the undamaged LED after the irradiation is separated from the carrier substrate.
  • the carrier substrate and the LED are connected through a first glue layer
  • the first glue layer may be BCB glue, UV light dissolvable glue, IR light dissolvable glue, etc., or Solder such as indium, tin, or indium tin, or the above UV or IR photolytic glue to make a film, etc.
  • the light beam may be other light beams other than visible light, such as UV or IR light.
  • the carrier substrate is made of transparent materials such as glass, quartz or sapphire.
  • the light beam irradiated on the carrier substrate is adjusted according to the position information, so that the position on the carrier substrate corresponding to the undamaged LED is irradiated by the light beam, and The other positions, that is, the positions on the carrier substrate corresponding to the damaged LED, are not illuminated by the light beam.
  • the carrier substrate is made of transparent material, and the position on the carrier substrate irradiated by the light beam will be irradiated onto the glue layer through the carrier substrate.
  • the glue layer is irradiated by the light beam and then debonded, so that the LED at the debonding position is separated from the carrier substrate, that is, the undamaged LED is separated from the carrier substrate and directly transferred to the target substrate.
  • the present invention compares the position information of the undamaged LED The light beam is adjusted, the positioning method is accurate and simple, and all the undamaged LEDs can be transferred to the target substrate through a single beam irradiation, the transfer speed is high and the efficiency is high.
  • the step of performing corresponding beam irradiation on the carrier substrate according to the position information includes:
  • R201 Use a spatial light modulator to adjust the irradiation beam according to the position information
  • R202 Use the adjusted light beam to irradiate the carrier substrate accordingly.
  • a spatial light modulator (SLM) is used to adjust the irradiated beam according to the position information.
  • the light modulator is one of a transmissive spatial light modulator (Transmissive LC SLM), a reflective spatial light modulator (LCos-SLM), or a digital micro mirror (DMD).
  • Transmissive LC SLM Transmissive LC SLM
  • LCos-SLM reflective spatial light modulator
  • DMD digital micro mirror
  • the spatial light modulator when the spatial light modulator is a transmissive spatial light modulator, the working principle diagram of the transmissive spatial light modulator is shown in FIG. 3, and the transmissive spatial light modulator includes The first substrate 31, the first electrode plate 32, the first alignment film 33, the liquid crystal 34 and the second alignment film 35, the second electrode plate 36, and the second substrate 37, the step R201 includes:
  • R201a Adjust the voltage between the first electrode plate and the second electrode plate according to the position information
  • R201b Adjust the arrangement direction and position of the liquid crystal according to the voltage, and adjust the irradiation beam according to the arrangement direction and position of the liquid crystal.
  • the transmissive spatial light modulator includes a first electrode plate 32, a second electrode plate 36, and a liquid crystal 34 located between the first alignment film 33 and the second alignment film 35.
  • the liquid crystal 34 The arrangement direction and position of the s can be adjusted by the voltage applied between the first electrode plate 32 and the second electrode plate 36.
  • the transmissive spatial light modulator is connected to a control terminal. After obtaining the location information of the damaged or undamaged LED, the location information can be saved in the control terminal, and the control terminal will control the application in the second according to the location information of the damaged or undamaged LED.
  • the liquid crystal 34 will undergo changes in the arrangement direction and position under the action of the voltage, and the light beam will pass through the first substrate 31, the first electrode plate 32 and the first alignment film 33. After the liquid crystal 34 passes through the second alignment film 35, the second electrode plate 36 and the second substrate 37 in turn, it is irradiated on the carrier substrate to complete the massive transfer of the LED. Due to the birefringence of the liquid crystal 34, the direction of the liquid crystal 34 changes It will cause the polarization direction of the incident light to change, thereby changing the transmission of the light beam irradiated on the carrier substrate.
  • the adjustment of the light beam by the transmissive spatial light modulator is based on the pixel level, that is, the light beam of each LED position can be adjusted individually, so that the positioning is accurate, for example, when a damaged LED is obtained
  • the voltage applied between the first electrode plate 32 and the second electrode plate 36 is controlled according to the position information of the damaged LED, and the arrangement direction and position of the liquid crystal 34 are changed by the voltage, thereby changing the transmittance of the irradiation beam.
  • the position on the carrier substrate corresponding to the damaged LED is illuminated by the beam, while the position on the carrier substrate corresponding to the undamaged LED is not illuminated by the beam, so that The damaged LED is separated from the carrier substrate.
  • the position on the carrier substrate corresponding to the damaged LED is not irradiated by the light beam, but there is a beam on the carrier substrate corresponding to the undamaged LED. Just irradiate.
  • the spatial light modulator when the spatial light modulator is a reflective spatial light modulator, the working principle diagram of the reflective spatial light modulator is shown in FIG. 4, and the reflective spatial light modulator includes The polarizer 41, the glass substrate 42, the conductive electrode 43, the liquid crystal 44, the reflective electrode 45 and the silicon substrate 46, the step R201 includes:
  • R201a' adjusting the voltage between the conductive electrode and the emitting electrode according to the position information, and adjusting the arrangement direction and position of the liquid crystal according to the voltage;
  • R201b' adjust the polarization direction of the irradiation light beam according to the arrangement direction and position of the liquid crystal, and make the irradiation light beam pass through the polarizer to filter out the irradiation light beam whose polarization direction has changed, thereby adjusting the irradiation light beam.
  • the reflective spatial light modulator includes a polarizer 41, a glass substrate 42, a conductive electrode 43, a liquid crystal 44, a reflective electrode 45, and a silicon substrate 46 in sequence.
  • a polarizer 41 a glass substrate 42, a conductive electrode 43, a liquid crystal 44, a reflective electrode 45, and a silicon substrate 46 in sequence.
  • FIGS. 4, 6 and 7. The light beam emitted by the light source irradiates for the first time It will be completely reflected on the polarizer 41 and enter the reflective spatial light modulator, and then be reflected by the reflective electrode 45 and then pass through the liquid crystal 44 and enter the polarizer 41 again.
  • the direction of the liquid crystal 44 can also be controlled by applying a voltage between the conductive electrode 43 and the reflective electrode 45. Because the liquid crystal 44 has the birefringence property, the direction of the liquid crystal 44 will change. This causes the polarization direction of the incident light to change, and then after the beam enters the polarizer 41 again, the polarizer 41 will block the light beam whose polarization state has been changed, and allow the light beam whose polarization state has not changed to irradiate onto the carrier substrate 4 through the polarizer 41, thereby adjusting The light beam irradiated on the carrier substrate 4.
  • the adjustment of the light beam by the reflective spatial light modulator is based on the pixel level, that is, the light beam of each LED position can be adjusted individually, so that the positioning is accurate, for example, when the damaged LED is obtained
  • the voltage applied between the conductive electrode 43 and the reflective electrode 45 is controlled according to the position information of the damaged LED, so that the liquid crystal corresponding to the position information of the damaged LED turns, and the liquid crystal corresponding to the position information of the undamaged LED does not turn.
  • the light beam that damages the position of the LED is affected by the turning of the liquid crystal molecules and then enters the deflector 41 and is passed away, while the light beam that does not damage the LED position is not affected by the liquid crystal molecules and passes through the deflector 41 and irradiates the carrier substrate 4
  • the first adhesive material layer 7 at the corresponding position of the carrier substrate irradiated by the light beam is debonded, so that the undamaged LED is separated from the carrier substrate 4 and transferred to the target substrate 8.
  • the spatial light modulator is a digital micro-mirror
  • the digital micro-mirror includes a micro-mirror corresponding to the position of the LED
  • the step R201 includes:
  • R201a controlling the inclination angle of the micro lens according to the position information
  • R201b adjust the irradiation beam according to the inclination angle of the micro lens.
  • the digital micro mirror includes a micro mirror corresponding to the position of the LED, that is, the digital micro mirror is provided with a corresponding micro mirror at a position corresponding to each LED, and these micro mirrors are positioned in the digital mirror.
  • the angle can be changed quickly under the driving signal, and the tilt of the micro lens will change the reflection direction of the incident light beam.
  • FIGS. 5, 6 and 7. The light beam emitted by the light source group 1 passes through the first lens group. 2 After collimating and expanding the beam, irradiate the spatial light modulator 3 to the digital micro mirror 3 in this embodiment.
  • the surface of the digital micro mirror 3 is provided with a number of micro mirrors corresponding to the positions of the LEDs, and the micro mirrors are in the open state
  • the incident light can be irradiated onto the carrier substrate 4 through the second lens group 10, and the incident light beam will be absorbed when the micro lens is in the unopened state, so that the incident light beam cannot be irradiated on the carrier substrate.
  • the micro lens corresponding to the position of the damaged LED is controlled to be turned on, and the micro lens corresponding to the position of the undamaged LED is closed, so that the beam can be irradiated after collimating and expanding the beam through the second lens group 10
  • the damaged LED 52 corresponds to the carrier substrate 4, but the carrier substrate 4 corresponding to the undamaged LED 51 is not irradiated with light beams, so that the damaged LED 52 is separated from the carrier substrate 4.
  • a device for LED mass transfer corresponding to the method for LED mass transfer is also provided.
  • the device includes: a light source group 1, a first lens Group 2, spatial light modulator 3, carrier substrate 4, LED group 5 including damaged LED 52 and undamaged LED 51, first glue layer 7, second glue layer 9, target substrate 8 and control terminal 6.
  • the light source group 1 is composed of one or more light sources, and the light beam emitted by the light source group 1 is a light beam other than the visible light waveband, such as UV light or IR light.
  • the first lens group 2 is composed of one or more optical lenses for receiving the light beam emitted by the light source group 1 and collimating and expanding the light beam.
  • the expanded light beam has a larger active area , Can effectively act on the spatial light modulator 3 to perform massive transfer of LEDs.
  • the control terminal 6 stores the position information of the damaged LED 52 or the position information of the undamaged LED 51 obtained in advance, and controls the voltage applied to the spatial light modulator 3 or the spatial light modulator 3 according to the position information The opening and closing of the micro lens.
  • the spatial light modulator 3 is connected to the control terminal 6, and is used to receive the collimated and expanded beam, and according to the damaged LED 52 or undamaged LED on the carrier substrate 4 stored in the control terminal
  • the position information of 51 irradiates the carrier substrate 4 with corresponding beams.
  • the LED group 5 is connected to the carrier substrate 4 through the first adhesive layer 7, and the LED group 5 is also connected to the target substrate 8 through the second adhesive layer 9.
  • the damaged LED 52 or the undamaged LED 51 will be separated from the carrier substrate 4, and the undamaged LED 51 will be transferred to the target substrate 8. on.
  • the device may also be provided with a second lens group 10 between the spatial light modulator 3 and the carrier substrate 4.
  • the second lens group 10 is used to receive the spatial light modulator 3 after adjustment.
  • the beam is collimated and expanded and then irradiated on the carrier substrate 4, thereby increasing the area of the beam irradiated on the carrier substrate 4 and realizing high-efficiency LED mass transfer.
  • the structure of the LED mass transfer device provided by this embodiment It is simple, realizes the massive transfer of LEDs through common light sources, and has low maintenance cost compared with the existing laser transfer device.
  • the LED mass transfer device corresponding to the method for LED mass transfer provided in the first embodiment is shown in FIG. 6, and the LED group 5 only passes through the first adhesive material with the carrier substrate 4 at the beginning.
  • Layer 7 is connected, the light beam emitted by the light source group 1 is collimated and expanded by the first lens group 2 and then irradiated on the spatial light modulator 3.
  • the control terminal 6 controls the spatial light modulator 3 to control the light beam according to the acquired position information of the damaged LED 52
  • the adjusted beam only irradiates the position of the carrier substrate 4 corresponding to the damaged LED 52, and the position of the carrier substrate 4 and the undamaged LED 51 is not illuminated by the beam, so that the damaged LED 52 is separated from the carrier substrate 4.
  • the target substrate 8 is fixed on the LED group 5 through the second adhesive layer 9, and then the light beam emitted from the light source group 1 is irradiated to the carrier substrate 4. At this time, the beam needs to be able to irradiate the carrier substrate 4 to correspond to the undamaged LED 51 In terms of position, the first glue layer 7 is debonded, and the damaged LED 52 is separated from the carrier substrate 4 and transferred to the target substrate 8.
  • the LED mass transfer device corresponding to the method for LED mass transfer provided in the second embodiment is shown in FIG. 7, and the difference from FIG. 6 is that the LED group 5 passes through the first glue.
  • the carrier substrate 4 is irradiated with a light beam, and the viscosity of the first adhesive material layer 7 is greater than that of the second adhesive material layer 9 Viscosity.
  • the light beam emitted by the light source group 1 passes through the first lens group 2 for collimation and beam expansion, and then irradiates the spatial light modulator 3.
  • the control terminal 6 controls the spatial light modulator 3 to adjust the light beam according to the acquired position information of the damaged LED 52.
  • the adjusted light beam only irradiates the position corresponding to the carrier substrate 4 and the undamaged LED 51, while the carrier substrate 4 and the undamaged LED 51 There is no beam irradiation at the corresponding position of the damaged LED 51, so that the undamaged LED 51 is separated from the carrier substrate 4 and directly transferred to the target substrate 8, with fast transfer speed and high efficiency.
  • the viscosity of the first adhesive layer 7 in this embodiment can also be less than or equal to the viscosity of the second adhesive layer 9, but at this time, the undamaged LED 51 can only be separated from the carrier substrate after the first beam irradiation. Since the damaged LED 52 is also connected to the second adhesive layer 9, the undamaged LED 51 cannot be directly transferred to the target substrate.
  • the target substrate 8 can be beamed again according to the position information of the damaged LED 52. Irradiate to separate the damaged LED 52 from the target substrate 8.
  • the present invention provides a method and device for mass transfer of LEDs.
  • the method includes: detecting and obtaining position information of damaged or undamaged LEDs on a carrier substrate; The substrate is irradiated with corresponding beams, so that the irradiated damaged or undamaged LED is separated from the carrier substrate, and the undamaged LED is transferred to the target substrate.
  • This application uses the position information of the damaged or undamaged LEDs on the carrier substrate to irradiate the carrier substrate with corresponding beams. The positioning is simple and accurate. After the carrier substrate is irradiated with the beam, the damaged or undamaged LEDs and the carrier substrate can be completely irradiated at one time. Separate and transfer the undamaged LED to the target substrate at one time, with high transfer efficiency.

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Abstract

An LED mass transfer method and apparatus. The method comprises: detecting and acquiring position information of a damaged LED (52) on a carrier substrate (4) (S100); performing corresponding beam irradiation on the carrier substrate (4) according to the position information, such that the irradiated damaged LED (52) is separated from the carrier substrate (4) (S200); and transferring an undamaged LED (51), which is retained on the carrier substrate (4) after beam irradiation, to a target substrate (8) (S300). By means of performing corresponding beam irradiation on the carrier substrate (4) according to the position information of the damaged LED (52) on the carrier substrate (4), positioning is simple and precise; and after beam irradiation is performed on the carrier substrate (4), the damaged LED (52) can be completely separated from the carrier substrate (4) in one step, and the undamaged LED (51) can be transferred to the target substrate (8) in one step, and thus, the transfer efficiency is high.

Description

一种LED巨量转移的方法及装置Method and device for LED mass transfer 技术领域Technical field
本发明属于半导体光电子技术领域，尤其涉及一种LED巨量转移的方法及装置。The invention belongs to the technical field of semiconductor optoelectronics, and in particular relates to a method and a device for LED mass transfer.
背景技术Background technique
Micro-LED技术，即LED微缩化和矩阵化技术，具有良好的稳定性，寿命，以及运行温度上的优势，同时也承继了LED低功耗、色彩饱和度、反应速度快、对比度强等优点，Micro-LED的亮度更高，且功率消耗量更低，使得Micro-LED具有极大地应用前景。Micro-LED technology, that is, LED miniaturization and matrix technology, has good stability, longevity, and operating temperature advantages. It also inherits the advantages of LED low power consumption, color saturation, fast response speed, strong contrast, etc. , Micro-LED has higher brightness and lower power consumption, making Micro-LED have great application prospects.
Micro-LED显示器上密排了数百万颗LED，难免不会存在有LED损坏的情况，为了避免显示器存在过多的损坏LED，影响Micro-LED显示器的成像质量，常常需要在Micro-LED巨量转移过程中对Micro-LED进行修复。现有的Micro-LED巨量转移方法是通过激光对LED进行定位实现Micro-LED巨量转移，该方法需要激光针对每一颗LED进行定位和转移，转移速度慢，定位不准确容易误转移，且激光巨量转移装置维护成本高，造成Micro-LED巨量转移制程成本高不易量产。There are millions of LEDs densely arranged on the Micro-LED display. It is inevitable that there will be LED damage. In order to avoid excessive damage to the LEDs on the display, which affects the imaging quality of the Micro-LED display, it is often necessary to Repair the Micro-LED during the transfer process. The existing method of mass transfer of Micro-LED is to realize the mass transfer of Micro-LED by positioning the LED by laser. This method requires the laser to position and transfer each LED, the transfer speed is slow, the positioning is not accurate, and it is easy to mistransfer. In addition, the maintenance cost of the laser mass transfer device is high, which causes the high cost of the Micro-LED mass transfer process to be difficult for mass production.
因此，现有技术有待于进一步的改进。Therefore, the existing technology needs to be further improved.
发明内容Summary of the invention
鉴于上述现有技术中的不足之处，本发明的目的在于提供一种LED巨量转移的方法及装置，克服现有技术中存在转移速度慢，定位不准确容易误转移且装置维护成本高的缺陷。In view of the above-mentioned shortcomings in the prior art, the purpose of the present invention is to provide a method and device for mass transfer of LEDs, to overcome the slow transfer speed, inaccurate positioning, easy mistransfer and high maintenance cost of the device in the prior art. defect.
本发明所公开的第一实施例为一种LED巨量转移的方法，其中，包括：The first embodiment disclosed in the present invention is a method for LED mass transfer, which includes:
检测并获取载体基板上损坏LED的位置信息；Detect and obtain the location information of the damaged LED on the carrier substrate;
根据所述位置信息对所述载体基板进行相应的光束照射，使得照射后的所述损坏LED与所述载体基板分离；Performing corresponding beam irradiation on the carrier substrate according to the position information, so that the irradiated damaged LED is separated from the carrier substrate;
将所述光束照射后保留在所述载体基板上的未损坏LED转移至目标基板上。The undamaged LED remaining on the carrier substrate after irradiating the light beam is transferred to the target substrate.
所述的LED巨量转移的方法，其中，所述根据所述位置信息对所述载体基板进行 相应的光束照射的步骤包括：In the method for mass transfer of LEDs, the step of irradiating the carrier substrate with corresponding light beams according to the position information includes:
利用空间光调制器根据所述位置信息对照射光束进行调节；Using a spatial light modulator to adjust the irradiation beam according to the position information;
使用调节后的所述光束对所述载体基板进行相应的照射。The adjusted light beam is used to irradiate the carrier substrate accordingly.
所述的LED巨量转移的方法，其中，所述空间光调制器为透射式空间光调制器、反射式空间光调制器或数字微反射镜中的一种。In the method for LED mass transfer, the spatial light modulator is one of a transmissive spatial light modulator, a reflective spatial light modulator or a digital micro mirror.
所述的LED巨量转移的方法，其中，当所述空间光调制器为透射式空间光调制器时，所述透射式空间光调制器包括第一电极板、液晶以及第二电极板；In the method for LED mass transfer, when the spatial light modulator is a transmissive spatial light modulator, the transmissive spatial light modulator includes a first electrode plate, a liquid crystal, and a second electrode plate;
所述利用空间光调制器根据所述位置信息对照射光束进行调节的步骤包括：The step of using the spatial light modulator to adjust the irradiation beam according to the position information includes:
根据所述位置信息调节所述第一电极板与所述第二电极板之间的电压；Adjusting the voltage between the first electrode plate and the second electrode plate according to the position information;
根据所述电压调节所述液晶的排列方向和位置，并根据所述液晶的排列方向和位置对照射光束进行调节。The arrangement direction and position of the liquid crystal are adjusted according to the voltage, and the irradiation beam is adjusted according to the arrangement direction and position of the liquid crystal.
所述的LED巨量转移的方法，其中，当所述空间光调制器为反射式空间光调制器时，所述反射式空间光调制器包括导电电极、液晶、发射电极以及偏振片；In the method for LED mass transfer, when the spatial light modulator is a reflective spatial light modulator, the reflective spatial light modulator includes a conductive electrode, a liquid crystal, an emitting electrode, and a polarizer;
所述利用空间光调制器根据所述位置信息对照射光束进行调节的步骤包括：The step of using the spatial light modulator to adjust the irradiation beam according to the position information includes:
根据所述位置信息调节所述导电电极与所述发射电极之间的电压，根据所述电压调节所述液晶的排列方向和位置；Adjusting the voltage between the conductive electrode and the emitting electrode according to the position information, and adjusting the arrangement direction and position of the liquid crystal according to the voltage;
根据所述液晶的排列方向和位置调节照射光束的偏振方向，并使所述照射光束通过所述偏振片过滤掉偏振方向发生改变的照射光束，从而对所述照射光束进行调节。The polarization direction of the irradiation beam is adjusted according to the arrangement direction and position of the liquid crystal, and the irradiation beam is filtered through the polarizer to filter the irradiation beam whose polarization direction has changed, so as to adjust the irradiation beam.
所述的LED巨量转移的方法，其中，当所述空间光调制器为数字微反射镜时，所述数字微反射镜包括与所述LED位置对应的微镜片；In the method for LED mass transfer, when the spatial light modulator is a digital micro mirror, the digital micro mirror includes a micro lens corresponding to the position of the LED;
所述利用空间光调制器根据所述位置信息对照射光束进行调节的步骤包括：The step of using the spatial light modulator to adjust the irradiation beam according to the position information includes:
根据所述位置信息控制所述微镜片的倾斜角度；Controlling the tilt angle of the micro lens according to the position information;
根据所述微镜片的倾斜角度对照射光束进行调节。The irradiation beam is adjusted according to the inclination angle of the micro lens.
本发明所公开的第二实施例为一种LED巨量转移的方法，其中，包括：检测并获The second embodiment disclosed in the present invention is a method for LED mass transfer, which includes: detecting and obtaining
取载体基板上未损坏LED的位置信息；Take the position information of the undamaged LED on the carrier substrate;
根据所述位置信息对所述载体基板进行相应的光束照射，使得照射后的所述未损坏LED与所述载体基板分离，并转移至目标基板上。According to the position information, the carrier substrate is irradiated with corresponding light beams, so that the irradiated undamaged LED is separated from the carrier substrate and transferred to the target substrate.
所述的LED巨量转移的方法，其中，所述根据所述位置信息对所述载体基板进行相应的光束照射的步骤包括：In the method for LED mass transfer, the step of performing corresponding beam irradiation on the carrier substrate according to the position information includes:
利用空间光调制器根据所述位置信息对照射光束进行调节；Using a spatial light modulator to adjust the irradiation beam according to the position information;
使用调节后的所述光束对所述载体基板进行相应的照射。The adjusted light beam is used to irradiate the carrier substrate accordingly.
所述的LED巨量转移的方法，其中，所述空间光调制器为透射式空间光调制器、反射式空间光调制器或数字微反射镜中的一种。In the method for LED mass transfer, the spatial light modulator is one of a transmissive spatial light modulator, a reflective spatial light modulator or a digital micro mirror.
所述的LED巨量转移的方法，其中，当所述空间光调制器为透射式空间光调制器时，所述透射式空间光调制器包括第一电极板、液晶以及第二电极板；In the method for LED mass transfer, when the spatial light modulator is a transmissive spatial light modulator, the transmissive spatial light modulator includes a first electrode plate, a liquid crystal, and a second electrode plate;
所述利用空间光调制器根据所述位置信息对照射光束进行调节的步骤包括：The step of using the spatial light modulator to adjust the irradiation beam according to the position information includes:
根据所述位置信息调节所述第一电极板与所述第二电极板之间的电压；Adjusting the voltage between the first electrode plate and the second electrode plate according to the position information;
根据所述电压调节所述液晶的排列方向和位置，并根据所述液晶的排列方向和位置对照射光束进行调节。The arrangement direction and position of the liquid crystal are adjusted according to the voltage, and the irradiation beam is adjusted according to the arrangement direction and position of the liquid crystal.
所述的LED巨量转移的方法，其中，当所述空间光调制器为反射式空间光调制器时，所述反射式空间光调制器包括导电电极、液晶、发射电极以及偏振片；In the method for LED mass transfer, when the spatial light modulator is a reflective spatial light modulator, the reflective spatial light modulator includes a conductive electrode, a liquid crystal, an emitting electrode, and a polarizer;
所述利用空间光调制器根据所述位置信息对照射光束进行调节的步骤包括：The step of using the spatial light modulator to adjust the irradiation beam according to the position information includes:
根据所述位置信息调节所述导电电极与所述发射电极之间的电压，根据所述电压调节所述液晶的排列方向和位置；Adjusting the voltage between the conductive electrode and the emitting electrode according to the position information, and adjusting the arrangement direction and position of the liquid crystal according to the voltage;
根据所述液晶的排列方向和位置调节照射光束的偏振方向，并使所述照射光束通过所述偏振片过滤掉偏振方向发生改变的照射光束，从而对所述照射光束进行调节。The polarization direction of the irradiation beam is adjusted according to the arrangement direction and position of the liquid crystal, and the irradiation beam is filtered through the polarizer to filter the irradiation beam whose polarization direction has changed, so as to adjust the irradiation beam.
所述的LED巨量转移的方法，其中，当所述空间光调制器为数字微反射镜时，所述数字微反射镜包括与所述LED位置对应的微镜片；In the method for LED mass transfer, when the spatial light modulator is a digital micro mirror, the digital micro mirror includes a micro lens corresponding to the position of the LED;
所述利用空间光调制器根据所述位置信息对照射光束进行调节的步骤包括：The step of using the spatial light modulator to adjust the irradiation beam according to the position information includes:
根据所述位置信息控制所述微镜片的倾斜角度；Controlling the tilt angle of the micro lens according to the position information;
根据所述微镜片的倾斜角度对照射光束进行调节。The irradiation beam is adjusted according to the inclination angle of the micro lens.
本发明所公开的第三实施例为上述所述的LED巨量转移方法进行LED巨量转移的装置，其中，所述装置包括：光源组、第一透镜组、空间光调制器、载体基板、包含损坏LED和未损坏LED的LED组、第一胶材层、第二胶材层、目标基板以及控制终端；The third embodiment disclosed in the present invention is a device for performing LED mass transfer by the aforementioned LED mass transfer method, wherein the device includes: a light source group, a first lens group, a spatial light modulator, a carrier substrate, The LED group including the damaged LED and the undamaged LED, the first adhesive layer, the second adhesive layer, the target substrate and the control terminal;
所述第一透镜组，用于接收所述光源组发出的光束，并对所述光束进行准直扩束；The first lens group is used to receive the light beam emitted by the light source group, and to collimate and expand the light beam;
所述空间光调制器与所述控制终端连接，用于接收准直扩束后的所述光束，并根据所述控制终端中存储的所述载体基板上损坏LED或未损坏LED的位置信息对所述载体基板进行相应的光束照射；The spatial light modulator is connected to the control terminal, and is used to receive the collimated and expanded beam, and compare the positions of damaged or undamaged LEDs on the carrier substrate stored in the control terminal. The carrier substrate is irradiated with corresponding light beams;
所述LED组通过所述第一胶材层与所述载体基板连接；所述LED组通过所述第二胶材层与所述目标基板连接；当所述光束通过所述空间光调制器照射到所述载体基板上 时，所述损坏LED或所述未损坏LED与所述载体基板分离，并使所述未损坏LED转移至所述目标基板上。The LED group is connected to the carrier substrate through the first adhesive material layer; the LED group is connected to the target substrate through the second adhesive material layer; when the light beam is irradiated by the spatial light modulator When onto the carrier substrate, the damaged LED or the undamaged LED is separated from the carrier substrate, and the undamaged LED is transferred to the target substrate.
有益效果，本发明提供了一种LED巨量转移的方法及装置，通过载体基板上损坏或未损坏LED的位置信息对所述载体基板进行相应的光束照射，定位简单精确，且通过光束照射载体基板后能使损坏LED或者未损坏LED与载体基板一次性完全分离，并能使未损坏LED一次性转移至目标基板上，转移效率高。Beneficial effects, the present invention provides a method and device for mass transfer of LEDs. The carrier substrate is irradiated with corresponding beams based on the position information of the damaged or undamaged LEDs on the carrier substrate. The positioning is simple and accurate, and the carrier is irradiated by the beam. After the substrate, the damaged or undamaged LED can be completely separated from the carrier substrate at one time, and the undamaged LED can be transferred to the target substrate at one time, and the transfer efficiency is high.
附图说明Description of the drawings
图1是本发明实施例一中提供的一种LED巨量转移的方法的较佳实施例的流程图；Fig. 1 is a flowchart of a preferred embodiment of a method for LED mass transfer provided in the first embodiment of the present invention;
图2是本发明实施例二中提供的一种LED巨量转移的方法的较佳实施例的流程图；2 is a flowchart of a preferred embodiment of a method for LED mass transfer provided in the second embodiment of the present invention;
图3是本发明所提供的透射式空间光调制器的工作原理图；Fig. 3 is a working principle diagram of the transmissive spatial light modulator provided by the present invention;
图4是本发明所提供的反射式空间光调制器的工作原理图；Figure 4 is a working principle diagram of the reflective spatial light modulator provided by the present invention;
图5是本发明所提供的数字微反射镜的工作原理图；Figure 5 is a working principle diagram of the digital micro mirror provided by the present invention;
图6是本发明实施例一提供的一种LED巨量转移的方法对应的LED巨量转移装置的示意图；6 is a schematic diagram of an LED mass transfer device corresponding to a method for LED mass transfer according to the first embodiment of the present invention;
图7是本发明实施例二提供的一种LED巨量转移的方法对应的LED巨量转移装置的结构示意图。FIG. 7 is a schematic structural diagram of an LED mass transfer device corresponding to a method for LED mass transfer according to the second embodiment of the present invention.
具体实施方式Detailed ways
为使本发明的目的、技术方案及优点更加清楚、明确，以下参照附图并举实施例对本发明进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。In order to make the objectives, technical solutions, and advantages of the present invention clearer and clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention.
由于现有技术中的Micro-LED巨量转移方法需要针对每一颗LED进行定位和转移，转移速度慢，定位不准确容易误转移，且巨量转移装置维护成本高，造成Micro-LED巨量转移制程成本高不易量产。为了解决上述问题，本发明实施例一中提供了一种LED巨量转移的方法。Since the conventional Micro-LED mass transfer method requires positioning and transfer for each LED, the transfer speed is slow, the positioning is inaccurate and easy to mistransfer, and the maintenance cost of the mass transfer device is high, resulting in a huge amount of Micro-LED The transfer process cost is high and it is not easy to mass produce. In order to solve the above-mentioned problem, a method for LED mass transfer is provided in the first embodiment of the present invention.
请参照图1，图1是本发明实施例一中提供的一种LED巨量转移的方法的较佳实施例的流程图。Please refer to FIG. 1. FIG. 1 is a flowchart of a preferred embodiment of a method for LED mass transfer provided in the first embodiment of the present invention.
在实施例一中，所述LED巨量转移的方法包括以下步骤：In the first embodiment, the method for LED mass transfer includes the following steps:
S100、检测并获取载体基板上损坏LED的位置信息；S100. Detect and obtain location information of the damaged LED on the carrier substrate;
S200、根据所述位置信息对所述载体基板进行相应的光束照射，使得照射后的所述损坏LED与所述载体基板分离；S200: Perform corresponding beam irradiation on the carrier substrate according to the position information, so that the irradiated damaged LED is separated from the carrier substrate;
S300、将所述光束照射后保留在所述载体基板上的未损坏LED转移至目标基板上。S300: Transfer the undamaged LED remaining on the carrier substrate after the light beam is irradiated to the target substrate.
在一具体实施方式中，当需要对LED进行巨量转移时，可以通过使用光致发光测试(PL)或电致发光测试(EL)测量载体基板上各LED是否有损坏，若有损坏则获取损坏的LED位置信息，由于LED的测试是针对每一颗LED，因此最后可以精确获取所有损坏LED的位置信息。In a specific embodiment, when a large amount of transfer of LEDs is required, the photoluminescence test (PL) or electroluminescence test (EL) can be used to measure whether each LED on the carrier substrate is damaged, and if there is damage, obtain The location information of the damaged LED, because the LED test is for each LED, the location information of all the damaged LEDs can be accurately obtained in the end.
在一具体实施方式中，通过一光源组发出光束，并根据获取到的所述损坏LED的位置信息对所述光束进行调节后，将所述光束照射到所述载体基板上。由于事先精确定位了损坏LED的位置信息，因而可以使得载体基板上与损坏LED与非损坏LED对应位置上的照射光束不同，进而使得损坏LED与所述载体基板分离。将损坏LED从所述载体基板上分离后，所述载体基板上保留的LED为未损坏LED，通过相同的方法可以进一步将未损坏LED与所述载体基板分离，并转移至目标基板上。In a specific embodiment, a light source group emits a light beam, and after the light beam is adjusted according to the acquired position information of the damaged LED, the light beam is irradiated onto the carrier substrate. Since the position information of the damaged LED is accurately located in advance, the irradiation beams on the carrier substrate and the corresponding positions of the damaged LED and the non-damaged LED can be made different, and the damaged LED can be separated from the carrier substrate. After the damaged LED is separated from the carrier substrate, the remaining LEDs on the carrier substrate are undamaged LEDs. The undamaged LED can be further separated from the carrier substrate by the same method and transferred to the target substrate.
在一具体实施方式中，所述载体基板与所述LED通过第一胶材层连接，所述步骤S200具体包括：In a specific embodiment, the carrier substrate and the LED are connected through a first glue layer, and the step S200 specifically includes:
S201、根据所述位置信息对所述载体基板上与所述损坏LED相对应的位置进行光束照射；S201: Perform beam irradiation on a position on the carrier substrate corresponding to the damaged LED according to the position information;
S202、所述载体基板与所述损坏LED之间的第一胶材层受到所述光束照射后解胶，使得照射后的所述损坏LED与所述载体基板分离。S202: The first adhesive material layer between the carrier substrate and the damaged LED is irradiated by the light beam and then released, so that the irradiated damaged LED is separated from the carrier substrate.
在一具体实施方式中，所述载体基板与所述LED通过第一胶材层连接，所述第一胶材层可以是BCB胶、UV光可解胶、IR光可解胶等，或是焊料如铟,锡,或铟锡的合晶,或是将上述UV或IR的光解胶制成胶膜等。所述光束可以为除可见光以外的其它光束如UV或IR光等。所述载体基板为玻璃、石英或蓝宝石等透明材质。获取到载体基板上损坏LED的位置信息后，根据所述位置信息对照射到载体基板上的光束进行调节，使得所述载体基板上与所述损坏LED相对应的位置有光束照射，而其它位置即所述载体基板上与所述未损坏LED相对应的位置没有光束照射。前面提到所述载体基板为透明材质，载体基板上有光束照射到的位置会透过载体基板照射到第一胶材层上。第一胶材层受到所述光束照射后解胶，使得解胶位置的LED与所述载体基板分离，即损坏LED与载体基板分离，本发明根据损坏LED位置信息进行光束调节，定位方法精确简单， 且能够一次性的使所有损坏LED与载体基板分离，LED巨量转移速度快效率高。In a specific embodiment, the carrier substrate and the LED are connected through a first glue layer, and the first glue layer may be BCB glue, UV light dissolvable glue, IR light dissolvable glue, etc., or Solder such as indium, tin, or indium tin, or the above UV or IR photolytic glue to make a film, etc. The light beam may be other light beams other than visible light, such as UV or IR light. The carrier substrate is made of transparent materials such as glass, quartz or sapphire. After obtaining the position information of the damaged LED on the carrier substrate, the light beam irradiated on the carrier substrate is adjusted according to the position information, so that the position on the carrier substrate corresponding to the damaged LED is illuminated by the beam, while other positions That is, the position on the carrier substrate corresponding to the undamaged LED is not irradiated by the light beam. As mentioned above, the carrier substrate is made of transparent material, and the position on the carrier substrate irradiated by the light beam will irradiate the first adhesive layer through the carrier substrate. The first glue layer is irradiated by the light beam and then debonded, so that the LED at the debonding position is separated from the carrier substrate, that is, the damaged LED is separated from the carrier substrate. The present invention performs beam adjustment according to the position information of the damaged LED, and the positioning method is accurate and simple , And can separate all damaged LEDs from the carrier substrate at one time, and the mass transfer of LEDs is fast and efficient.
在一具体实施方式中，所述步骤S300具体包括：In a specific embodiment, the step S300 specifically includes:
S301、将所述光束照射后保留在所述载体基板上的未损坏LED通过第二胶材层与目标基板连接；S301: Connect the undamaged LED remaining on the carrier substrate after the light beam is irradiated to the target substrate through a second adhesive layer;
S302、对所述载体基板进行光束照射，使得照射后的所述未损坏LED与所述载体基板分离，并转移至目标基板上。S302: irradiate the carrier substrate with light beams, so that the irradiated undamaged LED is separated from the carrier substrate and transferred to the target substrate.
具体实施时，根据损坏LED对载体基板进行光束照射后，损坏LED与载体基板分离，留在载体基板上的LED全部为未损坏LED，此时需要进一步对未损坏LED进行转移，将其转移至目标基板上以进行LED修复。本实施例中首先通过第二胶材层使载体基板上未损坏LED与目标基板连接，所述第二胶材层也可以是BCB胶、UV光可解胶、IR光可解胶等，或是焊料如铟,锡,或铟锡的合晶,或是将上述UV或IR的光解胶制成胶膜等，所述第二胶材层可以是与所述第一胶材层黏度相同的材料，也可以是与所述第一胶材层黏度不同的材料。此时未损坏LED与载体基板和目标基板同时相连，为了使未损坏LED转移至目标基板上，需要使载体基板与未损坏LED分离。In specific implementation, after the carrier substrate is irradiated with the beam according to the damaged LED, the damaged LED is separated from the carrier substrate, and all the LEDs left on the carrier substrate are undamaged LEDs. At this time, it is necessary to further transfer the undamaged LEDs and transfer them to On the target substrate for LED repair. In this embodiment, the undamaged LED on the carrier substrate is connected to the target substrate through the second glue layer. The second glue layer can also be BCB glue, UV light resolvable glue, IR light resolvable glue, etc., or It is a solder, such as indium, tin, or indium tin, or the above-mentioned UV or IR photolytic glue is made into an adhesive film, etc., the second adhesive material layer may have the same viscosity as the first adhesive material layer The material may also be a material with a viscosity different from that of the first adhesive layer. At this time, the undamaged LED is simultaneously connected to the carrier substrate and the target substrate. In order to transfer the undamaged LED to the target substrate, the carrier substrate needs to be separated from the undamaged LED.
在一具体实施方式中，为了使未损坏LED与载体基板分离，以使未损坏LED转移至目标基板上，我们可以采用与前述步骤中提到的使损坏LED与载体基板分离的步骤相同。即获取载体基板上未损坏LED的位置信息，根据未损坏LED位置信息对载体基板上与未损坏LED对应位置再次进行光束照射，未损坏LED对应位置上的第一胶材层受到光束照射后解胶，使得未损坏LED从载体基板上分离，从而将未损坏LED转移到目标基板上，本实施例中通过两次光束照射即可以实现未损坏LED巨量转移，转移速度快，操作简单。获取未损坏LED的位置信息与前述步骤中提到获取未损坏LED位置信息的方法相同，在此不再赘述。In a specific embodiment, in order to separate the undamaged LED from the carrier substrate so that the undamaged LED is transferred to the target substrate, we can use the same step as the step of separating the damaged LED from the carrier substrate mentioned in the previous steps. That is, the position information of the undamaged LED on the carrier substrate is obtained, and the position on the carrier substrate corresponding to the undamaged LED is irradiated with the beam again according to the position information of the undamaged LED. The first adhesive layer on the corresponding position of the undamaged LED is irradiated by the beam Glue separates the undamaged LED from the carrier substrate, thereby transferring the undamaged LED to the target substrate. In this embodiment, the undamaged LED can be transferred in a large amount by two beam irradiations, the transfer speed is fast, and the operation is simple. Obtaining the location information of the undamaged LED is the same as the method for obtaining the location information of the undamaged LED mentioned in the foregoing steps, and will not be repeated here.
在本发明另一具体实施例中，由于损坏LED已经从载体基板上分离，所述载体基板上保留的LED为未损坏LED，也可以不根据未损坏LED位置信息对光束进行调节，而是将整个光束直接照射到载体基板上，载体基板由于全部被光束照射，整个第一胶材层会因为光束照射而解胶，同样可以使得未损坏LED与载体基板分离，转移到目标基板上。In another specific embodiment of the present invention, since the damaged LED has been separated from the carrier substrate, the remaining LED on the carrier substrate is an undamaged LED, and the light beam may not be adjusted according to the position information of the undamaged LED, but the The entire light beam is directly irradiated on the carrier substrate. Since the carrier substrate is all irradiated by the light beam, the entire first adhesive layer will be debonded due to the light beam irradiation, which can also separate the undamaged LED from the carrier substrate and transfer to the target substrate.
前述步骤中提到的LED巨量转移方法为首先通过一次光束照射将损坏LED与载体基板分离，然后再通过第二次光束照射将未损坏LED转移到目标基板上，当然本发明也可以直接通过一次光束照射将未损坏LED从载体基板上分离并转移到目标基板上， 因此本发明的实施例二中还提供一种LED巨量转移的方法。The LED mass transfer method mentioned in the foregoing steps is to first separate the damaged LED from the carrier substrate by one beam irradiation, and then transfer the undamaged LED to the target substrate by the second beam irradiation. Of course, the present invention can also be directly passed One beam irradiation separates the undamaged LED from the carrier substrate and transfers it to the target substrate. Therefore, the second embodiment of the present invention also provides a method for mass transfer of LEDs.
请参照图2，图2是本发明实施例二中提供的一种LED巨量转移的方法的较佳实施例的流程图。Please refer to FIG. 2, which is a flowchart of a preferred embodiment of a method for LED mass transfer provided in the second embodiment of the present invention.
在实施例而中，所述LED巨量转移的方法包括步骤：In an embodiment, the method for LED mass transfer includes the steps:
M100、检测并获取载体基板上未损坏LED的位置信息；M100. Detect and obtain the position information of the undamaged LED on the carrier substrate;
M200、根据所述位置信息对所述载体基板进行相应的光束照射，使得照射后的所述未损坏LED与所述载体基板分离，并转移至目标基板上。M200. Perform corresponding beam irradiation on the carrier substrate according to the position information, so that the irradiated undamaged LED is separated from the carrier substrate and transferred to the target substrate.
在一具体实施方式中，所述LED通过第一胶材层与所述载体基板连接，且所述LED还通过第二胶材层与所述目标基板连接。此时所述第一胶材层的黏度需要大于所述第二胶材层的黏度，光束照射载体基板前未损坏LED与载体基板黏度大于未损坏LED与目标基板黏度。当需要对未损坏LED进行巨量转移时，根据未损坏LED位置信息对载体基板进行相应的光束照射后，未损坏LED位置的第一胶材层解胶，使得未损坏LED与载体基板黏度小于未损坏LED与目标基板黏度，而同时损坏LED位置的第一胶材层由于没有收到光束照射，使得损坏LED与载体基板的黏度仍然大于损坏LED与目标基板黏度，此时损坏LED仍然保留在载体基板上，而未损坏LED直接与载体基板分离并转移到目标基板上，通过一次光束照射实现LED快速巨量转移。所述未损坏LED位置信息与实施例一中获取损坏LED位置信息的方法相同。当然，本实施例中第一胶材层7的黏度也可以小于或等于第二胶材层9的黏度，不过此时经过第一次光束照射后只能使未损坏LED 51与载体基板分离，而由于损坏LED 52也与第二胶材层9连接，并不能使得未损坏LED 51直接转移到目标基板上，此时与前述步骤相同，可以再次根据损坏LED 52位置信息对目标基板8进行光束照射，以使得损坏LED 52与目标基板8分离，具体前述步骤中已经详细描述，在此不作赘述。In a specific embodiment, the LED is connected to the carrier substrate through a first adhesive layer, and the LED is also connected to the target substrate through a second adhesive layer. At this time, the viscosity of the first adhesive layer needs to be greater than the viscosity of the second adhesive layer, and the viscosity of the undamaged LED and the carrier substrate before the light beam irradiates the carrier substrate is greater than the viscosity of the undamaged LED and the target substrate. When a massive transfer of undamaged LEDs is required, the carrier substrate is irradiated with corresponding beams according to the position information of the undamaged LEDs, and the first adhesive layer at the position of the undamaged LEDs is debonded, so that the viscosity of the undamaged LEDs and the carrier substrate is less than The viscosity of the LED and the target substrate is not damaged, and the first adhesive layer that damages the position of the LED at the same time is not irradiated by the light beam, so that the viscosity of the damaged LED and the carrier substrate is still greater than the viscosity of the damaged LED and the target substrate. At this time, the damaged LED still remains in On the carrier substrate, the LED is directly separated from the carrier substrate without damage and transferred to the target substrate. The rapid and massive transfer of the LED is realized through one beam irradiation. The location information of the undamaged LED is the same as the method for obtaining the location information of the damaged LED in the first embodiment. Of course, the viscosity of the first adhesive layer 7 in this embodiment can also be less than or equal to the viscosity of the second adhesive layer 9, but at this time, the undamaged LED 51 can only be separated from the carrier substrate after the first beam irradiation. Since the damaged LED 52 is also connected to the second adhesive layer 9, the undamaged LED 51 cannot be directly transferred to the target substrate. At this time, the same as the previous steps, the target substrate 8 can be beamed again according to the position information of the damaged LED 52. Irradiate to separate the damaged LED 52 from the target substrate 8. The specific steps have been described in detail in the foregoing, and will not be repeated here.
在一具体实施方式中，所述步骤S200具体包括：In a specific implementation, the step S200 specifically includes:
M201、根据所述位置信息对所述载体基板上与所述未损坏LED相对应的位置进行光束照射；M201. Perform beam irradiation on a position on the carrier substrate corresponding to the undamaged LED according to the position information;
M202、所述载体基板与所述未损坏LED之间的第一胶材层受到所述光束照射后解胶，使得照射后的所述未损坏LED与所述载体基板分离。M202. The first adhesive material layer between the carrier substrate and the undamaged LED is irradiated by the light beam and then released, so that the undamaged LED after the irradiation is separated from the carrier substrate.
在一具体实施方式中，所述载体基板与所述LED通过第一胶材层连接，所述第一胶材层可以是BCB胶、UV光可解胶、IR光可解胶等，或是焊料如铟,锡,或铟锡的合晶,或是将上述UV或IR的光解胶制成胶膜等。所述光束可以为除可见光以外的其它光 束如UV或IR光等。所述载体基板为玻璃、石英或蓝宝石等透明材质。获取到载体基板上未损坏LED的位置信息后，根据所述位置信息对照射到载体基板上的光束进行调节，使得所述载体基板上与所述未损坏LED相对应的位置有光束照射，而其它位置即所述载体基板上与所述损坏LED相对应的位置没有光束照射。前面提到所述载体基板为透明材质，载体基板上有光束照射的位置会透过载体基板照射到胶材层上。胶材层受到所述光束照射后解胶，使得解胶位置的LED与所述载体基板分离，即未损坏LED与载体基板分离而直接转移到目标基板上，本发明根据未损坏LED位置信息对光束进行调节，定位方法精确简单，且能够通过一次光束照射将所有未损坏LED转移到目标基板上，转移速度快效率高。In a specific embodiment, the carrier substrate and the LED are connected through a first glue layer, and the first glue layer may be BCB glue, UV light dissolvable glue, IR light dissolvable glue, etc., or Solder such as indium, tin, or indium tin, or the above UV or IR photolytic glue to make a film, etc. The light beam may be other light beams other than visible light, such as UV or IR light. The carrier substrate is made of transparent materials such as glass, quartz or sapphire. After obtaining the position information of the undamaged LED on the carrier substrate, the light beam irradiated on the carrier substrate is adjusted according to the position information, so that the position on the carrier substrate corresponding to the undamaged LED is irradiated by the light beam, and The other positions, that is, the positions on the carrier substrate corresponding to the damaged LED, are not illuminated by the light beam. As mentioned above, the carrier substrate is made of transparent material, and the position on the carrier substrate irradiated by the light beam will be irradiated onto the glue layer through the carrier substrate. The glue layer is irradiated by the light beam and then debonded, so that the LED at the debonding position is separated from the carrier substrate, that is, the undamaged LED is separated from the carrier substrate and directly transferred to the target substrate. The present invention compares the position information of the undamaged LED The light beam is adjusted, the positioning method is accurate and simple, and all the undamaged LEDs can be transferred to the target substrate through a single beam irradiation, the transfer speed is high and the efficiency is high.
在一具体实施方式中，前述步骤S200或M200中，所述根据所述位置信息对所述载体基板进行相应的光束照射的步骤包括：In a specific embodiment, in the foregoing step S200 or M200, the step of performing corresponding beam irradiation on the carrier substrate according to the position information includes:
R201、利用空间光调制器根据所述位置信息对照射光束进行调节；R201. Use a spatial light modulator to adjust the irradiation beam according to the position information;
R202、使用调节后的所述光束对所述载体基板进行相应的照射。R202. Use the adjusted light beam to irradiate the carrier substrate accordingly.
在一具体实施方式中，根据损坏LED位置信息或未损坏LED位置信息对载体基板进行相应的光束照射时，具体是利用空间光调制器(SLM)根据位置信息对照射光束进行调节，所述空间光调制器为透射式空间光调制器(Transmissive LC SLM)、反射式空间光调制器(LCos-SLM)或数字微反射镜(DMD)中的一种。使用空间光调制器对光束进行调节后，再使用调节后的光束对载体基板进行相应的照射，以使得损坏LED或未损坏LED与载体基板分离。In a specific embodiment, when the carrier substrate is irradiated with the corresponding beam according to the position information of the damaged LED or the position information of the undamaged LED, a spatial light modulator (SLM) is used to adjust the irradiated beam according to the position information. The light modulator is one of a transmissive spatial light modulator (Transmissive LC SLM), a reflective spatial light modulator (LCos-SLM), or a digital micro mirror (DMD). After the light beam is adjusted by the spatial light modulator, the adjusted light beam is used to irradiate the carrier substrate accordingly, so that the damaged or undamaged LED is separated from the carrier substrate.
在一具体实施方式中，当所述空间光调制器为透射式空间光调制器时，所述透射式空间光调制器的工作原理图如图3所示，所述透射式空间光调制器包括第一基板31、第一电极板32、第一配向膜33、液晶34以及第二配向膜35、第二电极板36、第二基板37，所述步骤R201包括：In a specific embodiment, when the spatial light modulator is a transmissive spatial light modulator, the working principle diagram of the transmissive spatial light modulator is shown in FIG. 3, and the transmissive spatial light modulator includes The first substrate 31, the first electrode plate 32, the first alignment film 33, the liquid crystal 34 and the second alignment film 35, the second electrode plate 36, and the second substrate 37, the step R201 includes:
R201a、根据所述位置信息调节所述第一电极板与所述第二电极板之间的电压；R201a. Adjust the voltage between the first electrode plate and the second electrode plate according to the position information;
R201b、根据所述电压调节所述液晶的排列方向和位置，并根据所述液晶的排列方向和位置对照射光束进行调节。R201b: Adjust the arrangement direction and position of the liquid crystal according to the voltage, and adjust the irradiation beam according to the arrangement direction and position of the liquid crystal.
在一具体实施方式中，所述透射式空间光调制器包括第一电极板32、第二电极板36以及位于第一配向膜33与第二配向膜35之间的液晶34，所述液晶34的排列方向与位置可以通过施加在第一电极板32和第二电极板36之间的电压来调节。透射式空间光调制器与一控制终端连接，获取到损坏或未损坏LED位置信息后，可以将所述位置信 息保存在控制终端中，控制终端会根据损坏或未损坏LED位置信息控制施加在第一电极板32和第二电极板36之间的电压，液晶34受到电压作用会发生排列方向和位置的变化，而光束通过第一基板31、第一电极板32和第一配向膜33后穿过液晶34后再依次经过第二配向膜35、第二电极板36以及第二基板37后照射到载体基板上完成对LED的巨量转移，由于液晶34具有双折射的性质，液晶34方向改变会导致入射光的偏振方向改变，从而使得照射到载体基板上的光束发送变化。In a specific embodiment, the transmissive spatial light modulator includes a first electrode plate 32, a second electrode plate 36, and a liquid crystal 34 located between the first alignment film 33 and the second alignment film 35. The liquid crystal 34 The arrangement direction and position of the s can be adjusted by the voltage applied between the first electrode plate 32 and the second electrode plate 36. The transmissive spatial light modulator is connected to a control terminal. After obtaining the location information of the damaged or undamaged LED, the location information can be saved in the control terminal, and the control terminal will control the application in the second according to the location information of the damaged or undamaged LED. The voltage between the one electrode plate 32 and the second electrode plate 36, the liquid crystal 34 will undergo changes in the arrangement direction and position under the action of the voltage, and the light beam will pass through the first substrate 31, the first electrode plate 32 and the first alignment film 33. After the liquid crystal 34 passes through the second alignment film 35, the second electrode plate 36 and the second substrate 37 in turn, it is irradiated on the carrier substrate to complete the massive transfer of the LED. Due to the birefringence of the liquid crystal 34, the direction of the liquid crystal 34 changes It will cause the polarization direction of the incident light to change, thereby changing the transmission of the light beam irradiated on the carrier substrate.
在本发明一具体实施方式中，所述透射式空间光调制器对光束的调节是基于像素级别的，即可以单独对每一个LED位置的光束进行调节，因而定位准确，例如当获取到损坏LED的位置信息后，根据损坏LED的位置信息控制施加在第一电极板32和第二电极板36之间的电压，通过电压来改变液晶34排列方向和位置，从而改变照射光束的透射率。当需要将损坏LED与载体基板分离时，通过改变液晶34排列方向和位置，使载体基板上与损坏LED对应位置有光束照射，而载体基板上与未损坏LED对应位置处没有光束照射，从而使得损坏LED与载体基板分离。同理，当需要使未损坏LED与载体基板分离时，通过改变液晶34排列方向和位置，使载体基板上与损坏LED对应位置没有光束照射，而载体基板上与未损坏LED对应位置处有光束照射即可。In a specific embodiment of the present invention, the adjustment of the light beam by the transmissive spatial light modulator is based on the pixel level, that is, the light beam of each LED position can be adjusted individually, so that the positioning is accurate, for example, when a damaged LED is obtained After the position information of the damaged LED, the voltage applied between the first electrode plate 32 and the second electrode plate 36 is controlled according to the position information of the damaged LED, and the arrangement direction and position of the liquid crystal 34 are changed by the voltage, thereby changing the transmittance of the irradiation beam. When it is necessary to separate the damaged LED from the carrier substrate, by changing the arrangement direction and position of the liquid crystal 34, the position on the carrier substrate corresponding to the damaged LED is illuminated by the beam, while the position on the carrier substrate corresponding to the undamaged LED is not illuminated by the beam, so that The damaged LED is separated from the carrier substrate. In the same way, when it is necessary to separate the undamaged LED from the carrier substrate, by changing the arrangement direction and position of the liquid crystal 34, the position on the carrier substrate corresponding to the damaged LED is not irradiated by the light beam, but there is a beam on the carrier substrate corresponding to the undamaged LED. Just irradiate.
在一具体实施方式中，当所述空间光调制器为反射式空间光调制器时，所述反射式空间光调制器的工作原理图如图4所示，所述反射式空间光调制器包括偏振片41、玻璃基底42、导电电极43、液晶44、反射电极45以及硅基底46，所述步骤R201包括：In a specific embodiment, when the spatial light modulator is a reflective spatial light modulator, the working principle diagram of the reflective spatial light modulator is shown in FIG. 4, and the reflective spatial light modulator includes The polarizer 41, the glass substrate 42, the conductive electrode 43, the liquid crystal 44, the reflective electrode 45 and the silicon substrate 46, the step R201 includes:
R201a＇、根据所述位置信息调节所述导电电极与所述发射电极之间的电压，根据所述电压调节所述液晶的排列方向和位置；R201a', adjusting the voltage between the conductive electrode and the emitting electrode according to the position information, and adjusting the arrangement direction and position of the liquid crystal according to the voltage;
R201b＇、根据所述液晶的排列方向和位置调节照射光束的偏振方向，并使所述照射光束通过所述偏振片过滤掉偏振方向发生改变的照射光束，从而对所述照射光束进行调节。R201b', adjust the polarization direction of the irradiation light beam according to the arrangement direction and position of the liquid crystal, and make the irradiation light beam pass through the polarizer to filter out the irradiation light beam whose polarization direction has changed, thereby adjusting the irradiation light beam.
在一具体实施方式中，所述反射式空间光调制器依次包括偏振片41、玻璃基底42、导电电极43、液晶44、反射电极45以及硅基底46。为使本领域技术人员更好的理解本发明的技术方案，现在结合图4、图6和图7对本发明反射式空间光调制器的工作原理图进行详细说明，光源发出的光束第一次照射到偏振片41上会被全部反射进入反射式空间光调制器中，然后经过反射电极45反射后穿过液晶44再次进入偏振片41中。与前述步骤中的透射式空间光调制器类似，所述导电电极43与反射电极45之间也可以通过施加电压控制液晶44的转向，由于液晶44具有双折射的性质，液晶44的方向改变 会导致入射光的偏振方向改变，而后光束再次进入偏振片41后，偏振片41会阻挡偏振态被改变的光束，而允许偏振态未改变的光束通过偏振片41照射到载体基板4上，从而调节照射到载体基板4上的光束。In a specific embodiment, the reflective spatial light modulator includes a polarizer 41, a glass substrate 42, a conductive electrode 43, a liquid crystal 44, a reflective electrode 45, and a silicon substrate 46 in sequence. In order to enable those skilled in the art to better understand the technical solution of the present invention, the working principle diagram of the reflective spatial light modulator of the present invention will now be described in detail with reference to FIGS. 4, 6 and 7. The light beam emitted by the light source irradiates for the first time It will be completely reflected on the polarizer 41 and enter the reflective spatial light modulator, and then be reflected by the reflective electrode 45 and then pass through the liquid crystal 44 and enter the polarizer 41 again. Similar to the transmissive spatial light modulator in the previous step, the direction of the liquid crystal 44 can also be controlled by applying a voltage between the conductive electrode 43 and the reflective electrode 45. Because the liquid crystal 44 has the birefringence property, the direction of the liquid crystal 44 will change. This causes the polarization direction of the incident light to change, and then after the beam enters the polarizer 41 again, the polarizer 41 will block the light beam whose polarization state has been changed, and allow the light beam whose polarization state has not changed to irradiate onto the carrier substrate 4 through the polarizer 41, thereby adjusting The light beam irradiated on the carrier substrate 4.
在本发明一具体实施方式中，所述反射式空间光调制器对光束的调节是基于像素级别的，即可以单独对每一个LED位置的光束进行调节，因而定位准确，例如当获取到损坏LED的位置信息后，根据损坏LED的位置信息控制施加在导电电极43与反射电极45之间电压，使得与损坏LED位置信息对应的液晶发生转向，而未损坏LED位置信息对应的液晶不发生转向，则光束经过液晶分子后，损坏LED位置的光束受到液晶分子转向影响再次进入偏转片41后被过来掉，而未损坏LED位置的光束未受到液晶分子影响穿过偏转片41后照射到载体基板4上，使得光束照射到的载体基板对应位置的第一胶材层7解胶，而使得未损坏LED与载体基板4分离并转移到目标基板8上。当然，我们也可以控制与损坏LED位置信息对应的液晶不发生转向，而未损坏LED位置信息对应的液晶发生转向，从而使得损坏LED与载体基板4分离。In a specific embodiment of the present invention, the adjustment of the light beam by the reflective spatial light modulator is based on the pixel level, that is, the light beam of each LED position can be adjusted individually, so that the positioning is accurate, for example, when the damaged LED is obtained After the position information of the damaged LED, the voltage applied between the conductive electrode 43 and the reflective electrode 45 is controlled according to the position information of the damaged LED, so that the liquid crystal corresponding to the position information of the damaged LED turns, and the liquid crystal corresponding to the position information of the undamaged LED does not turn. After the light beam passes through the liquid crystal molecules, the light beam that damages the position of the LED is affected by the turning of the liquid crystal molecules and then enters the deflector 41 and is passed away, while the light beam that does not damage the LED position is not affected by the liquid crystal molecules and passes through the deflector 41 and irradiates the carrier substrate 4 On the upper side, the first adhesive material layer 7 at the corresponding position of the carrier substrate irradiated by the light beam is debonded, so that the undamaged LED is separated from the carrier substrate 4 and transferred to the target substrate 8. Of course, we can also control the liquid crystal corresponding to the position information of the damaged LED not to turn, and the liquid crystal corresponding to the position information of the undamaged LED does not turn, so that the damaged LED is separated from the carrier substrate 4.
在一具体实施方式中，所述空间光调制器为数字微反射镜，所述数字微反射镜包括与所述LED位置对应的微镜片，所述步骤R201包括：In a specific embodiment, the spatial light modulator is a digital micro-mirror, and the digital micro-mirror includes a micro-mirror corresponding to the position of the LED, and the step R201 includes:
R201a＂、根据所述位置信息控制所述微镜片的倾斜角度；R201a", controlling the inclination angle of the micro lens according to the position information;
R201b＂、根据所述微镜片的倾斜角度对照射光束进行调节。R201b", adjust the irradiation beam according to the inclination angle of the micro lens.
在一具体实施方式中，所述数字微反射镜包括与所述LED位置对应的微镜片即所述数字微反射镜上与每个LED对应位置上设置有对应的微镜片，这些微镜片在数字驱动讯号下能够迅速改变角度，微镜片的倾斜会使得入射光束的反射方向改变。为了使本领域技术人员更好的理解本发明的技术方案，现在结合图5、图6和图7对数字微反射镜的工作原理图进行详细说明，光源组1发出的光束经过第一透镜组2准直扩束后照射到空间光调制器3在本实施例中即为数字微反射镜3上，数字微反射镜3表面设置有若干与LED位置对应的微镜片，微镜片处于打开状态下可以将入射光通过第二透镜组10照射到载体基板4上，而微镜片处于未打开状态下入射光束会被吸收而造成入射光束不能照射到载体基板上。当获取到损坏LED的位置信息后，通过控制与损坏LED位置对应的微镜片打开，而未损坏LED位置对应的微镜片关闭，使得光束经过第二透镜组10进行准直扩束后可以照射到损坏LED 52对应的载体基板4上，而未损坏LED 51对应的载体基板4上没有光束照射，从而使得损坏LED 52与载体基板4分离。当然我们也可以通过控制与损坏LED 52位置对应的微镜片关闭，而未损坏LED 51位置对应的微 镜片打开，从而控制未损坏LED 51与载体基板4分离，并转移至目标基板8上。In a specific embodiment, the digital micro mirror includes a micro mirror corresponding to the position of the LED, that is, the digital micro mirror is provided with a corresponding micro mirror at a position corresponding to each LED, and these micro mirrors are positioned in the digital mirror. The angle can be changed quickly under the driving signal, and the tilt of the micro lens will change the reflection direction of the incident light beam. In order to enable those skilled in the art to better understand the technical solution of the present invention, the working principle diagrams of the digital micro-mirror will now be described in detail with reference to FIGS. 5, 6 and 7. The light beam emitted by the light source group 1 passes through the first lens group. 2 After collimating and expanding the beam, irradiate the spatial light modulator 3 to the digital micro mirror 3 in this embodiment. The surface of the digital micro mirror 3 is provided with a number of micro mirrors corresponding to the positions of the LEDs, and the micro mirrors are in the open state The incident light can be irradiated onto the carrier substrate 4 through the second lens group 10, and the incident light beam will be absorbed when the micro lens is in the unopened state, so that the incident light beam cannot be irradiated on the carrier substrate. When the position information of the damaged LED is obtained, the micro lens corresponding to the position of the damaged LED is controlled to be turned on, and the micro lens corresponding to the position of the undamaged LED is closed, so that the beam can be irradiated after collimating and expanding the beam through the second lens group 10 The damaged LED 52 corresponds to the carrier substrate 4, but the carrier substrate 4 corresponding to the undamaged LED 51 is not irradiated with light beams, so that the damaged LED 52 is separated from the carrier substrate 4. Of course, we can also control the micro lens corresponding to the position of the damaged LED 52 to turn off, and the micro lens corresponding to the position of the undamaged LED 51 to turn on, so as to control the undamaged LED 51 to separate from the carrier substrate 4 and transfer to the target substrate 8.
在本发明一具体实施方式中，还提供上述所述LED巨量转移的方法对应的LED巨量转移的装置，如图6和图7所示，所示装置包括：光源组1、第一透镜组2、空间光调制器3、载体基板4、包含损坏LED 52和未损坏LED 51的LED组5、第一胶材层7、第二胶材层9、目标基板8以及控制终端6。所述光源组1由一个或多个光源组成，所述光源组1发出的光束为除可见光波段以外的光束，如UV光或IR光。所述第一透镜组2由一个或多个光学透镜组成，用于接收所述光源组1发出的光束，并对所述光束进行准直扩束，扩束后的光束具有较大的作用面积，能够有效的作用于空间光调制器3上以进行LED的巨量转移。所述控制终端6中存储有预先获取的损坏LED 52的位置信息或者未损坏LED 51的位置信息，并根据所述位置信息控制施加在空间光调制器3上的电压或者空间光调制器3上微镜片的开闭。所述空间光调制器3与所述控制终端6连接，用于接收准直扩束后的所述光束，并根据所述控制终端中存储的所述载体基板4上损坏LED 52或未损坏LED 51的位置信息对所述载体基板4进行相应的光束照射。所述LED组5通过所述第一胶材层7与所述载体基板4连接，所述LED组5还通过所述第二胶材层9与所述目标基板8连接，当所述光束通过所述空间光调制3照射到所述载体基板4上时，所述损坏LED 52或所述未损坏LED 51会与所述载体基板4分离，并使所述未损坏LED 51转移至目标基板8上。当然如前述图4和图5所示，所述装置在空间光调制器3与载体基板4之间还可以设置第二透镜组10，第二透镜组10用于接收空间光调制器3调节后的光束，并对光束进行准直扩束后照射到载体基板4上，从而增加照射到载体基板4上的光束面积，实现高效率LED巨量转移，本实施例提供的LED巨量转移装置结构简单，通过常见光源实现LED巨量转移，相较于现有激光转移装置维护成本低。In a specific embodiment of the present invention, a device for LED mass transfer corresponding to the method for LED mass transfer is also provided. As shown in FIG. 6 and FIG. 7, the device includes: a light source group 1, a first lens Group 2, spatial light modulator 3, carrier substrate 4, LED group 5 including damaged LED 52 and undamaged LED 51, first glue layer 7, second glue layer 9, target substrate 8 and control terminal 6. The light source group 1 is composed of one or more light sources, and the light beam emitted by the light source group 1 is a light beam other than the visible light waveband, such as UV light or IR light. The first lens group 2 is composed of one or more optical lenses for receiving the light beam emitted by the light source group 1 and collimating and expanding the light beam. The expanded light beam has a larger active area , Can effectively act on the spatial light modulator 3 to perform massive transfer of LEDs. The control terminal 6 stores the position information of the damaged LED 52 or the position information of the undamaged LED 51 obtained in advance, and controls the voltage applied to the spatial light modulator 3 or the spatial light modulator 3 according to the position information The opening and closing of the micro lens. The spatial light modulator 3 is connected to the control terminal 6, and is used to receive the collimated and expanded beam, and according to the damaged LED 52 or undamaged LED on the carrier substrate 4 stored in the control terminal The position information of 51 irradiates the carrier substrate 4 with corresponding beams. The LED group 5 is connected to the carrier substrate 4 through the first adhesive layer 7, and the LED group 5 is also connected to the target substrate 8 through the second adhesive layer 9. When the light beam passes When the spatial light modulation 3 irradiates the carrier substrate 4, the damaged LED 52 or the undamaged LED 51 will be separated from the carrier substrate 4, and the undamaged LED 51 will be transferred to the target substrate 8. on. Of course, as shown in the aforementioned Figures 4 and 5, the device may also be provided with a second lens group 10 between the spatial light modulator 3 and the carrier substrate 4. The second lens group 10 is used to receive the spatial light modulator 3 after adjustment. The beam is collimated and expanded and then irradiated on the carrier substrate 4, thereby increasing the area of the beam irradiated on the carrier substrate 4 and realizing high-efficiency LED mass transfer. The structure of the LED mass transfer device provided by this embodiment It is simple, realizes the massive transfer of LEDs through common light sources, and has low maintenance cost compared with the existing laser transfer device.
在一具体实施方式中，与上述实施例一提供的一种LED巨量转移的方法对应的LED巨量转移的装置如图6所示，LED组5开始只与载体基板4通过第一胶材层7连接，光源组1发出的光束经过第一透镜组2准直扩束后照射到空间光调制器3上，控制终端6根据获取到的损坏LED 52位置信息控制空间光调制器3对光束进行调节，调节后的光束只照射到载体基板4与损坏LED 52对应的位置上，而载体基板4与未损坏LED51对应位置上没有光束照射，从而使得损坏LED 52与载体基板4分离。然后再通过第二胶材层9将目标基板8固定在LED组5上，然后继续通过光源组1发出光束照射到载体基板4，此时需要光束能够照射到载体基板4与未损坏LED 51对应位置上，使得 第一胶材层7解胶，损坏LED 52与载体基板4分离并转移到目标基板8上。In a specific embodiment, the LED mass transfer device corresponding to the method for LED mass transfer provided in the first embodiment is shown in FIG. 6, and the LED group 5 only passes through the first adhesive material with the carrier substrate 4 at the beginning. Layer 7 is connected, the light beam emitted by the light source group 1 is collimated and expanded by the first lens group 2 and then irradiated on the spatial light modulator 3. The control terminal 6 controls the spatial light modulator 3 to control the light beam according to the acquired position information of the damaged LED 52 After adjustment, the adjusted beam only irradiates the position of the carrier substrate 4 corresponding to the damaged LED 52, and the position of the carrier substrate 4 and the undamaged LED 51 is not illuminated by the beam, so that the damaged LED 52 is separated from the carrier substrate 4. Then the target substrate 8 is fixed on the LED group 5 through the second adhesive layer 9, and then the light beam emitted from the light source group 1 is irradiated to the carrier substrate 4. At this time, the beam needs to be able to irradiate the carrier substrate 4 to correspond to the undamaged LED 51 In terms of position, the first glue layer 7 is debonded, and the damaged LED 52 is separated from the carrier substrate 4 and transferred to the target substrate 8.
在另一具体实施方式中，与上述实施例二提供的一种LED巨量转移的方法对应的LED巨量转移的装置如图7所示，与图6不同的是LED组5通过第一胶材层7与载体基板4连接，并通过第二胶材层9与目标基板8连接后，再使用光束照射载体基板4，且第一胶材层7的黏度要大于第二胶材层9的黏度。同样，光源组1发出的光束经过第一透镜组2进行准直扩束后，照射到空间光调制器3上。控制终端6根据获取到的损坏LED 52的位置信息控制空间光调制器3对光束进行调节，调节后的光束只照射到载体基板4与未损坏LED 51对应的位置上，而载体基板4与未损坏LED 51对应位置上没有光束照射，从而使得未损坏LED 51与载体基板4分离并直接转移到目标基板8上，转移速度快效率高。当然，本实施例中第一胶材层7的黏度也可以小于或等于第二胶材层9的黏度，不过此时经过第一次光束照射后只能使未损坏LED 51与载体基板分离，而由于损坏LED 52也与第二胶材层9连接，并不能使得未损坏LED 51直接转移到目标基板上，此时与前述步骤相同，可以再次根据损坏LED 52位置信息对目标基板8进行光束照射，以使得损坏LED 52与目标基板8分离，具体前述步骤中已经详细描述，在此不作赘述。In another specific embodiment, the LED mass transfer device corresponding to the method for LED mass transfer provided in the second embodiment is shown in FIG. 7, and the difference from FIG. 6 is that the LED group 5 passes through the first glue. After the material layer 7 is connected to the carrier substrate 4 and connected to the target substrate 8 through the second adhesive material layer 9, the carrier substrate 4 is irradiated with a light beam, and the viscosity of the first adhesive material layer 7 is greater than that of the second adhesive material layer 9 Viscosity. Similarly, the light beam emitted by the light source group 1 passes through the first lens group 2 for collimation and beam expansion, and then irradiates the spatial light modulator 3. The control terminal 6 controls the spatial light modulator 3 to adjust the light beam according to the acquired position information of the damaged LED 52. The adjusted light beam only irradiates the position corresponding to the carrier substrate 4 and the undamaged LED 51, while the carrier substrate 4 and the undamaged LED 51 There is no beam irradiation at the corresponding position of the damaged LED 51, so that the undamaged LED 51 is separated from the carrier substrate 4 and directly transferred to the target substrate 8, with fast transfer speed and high efficiency. Of course, the viscosity of the first adhesive layer 7 in this embodiment can also be less than or equal to the viscosity of the second adhesive layer 9, but at this time, the undamaged LED 51 can only be separated from the carrier substrate after the first beam irradiation. Since the damaged LED 52 is also connected to the second adhesive layer 9, the undamaged LED 51 cannot be directly transferred to the target substrate. At this time, the same as the previous steps, the target substrate 8 can be beamed again according to the position information of the damaged LED 52. Irradiate to separate the damaged LED 52 from the target substrate 8. The specific steps have been described in detail in the foregoing, and will not be repeated here.
综上所述，本发明提供了一种LED巨量转移的方法及装置，所述方法包括：检测并获取载体基板上损坏LED或未损坏LED的位置信息；根据所述位置信息对所述载体基板进行相应的光束照射，使得照射后的所述损坏LED或者未损坏LED与所述载体基板分离，并将所述未损坏LED转移至目标基板上。本申请通过载体基板上损坏或未损坏LED的位置信息对所述载体基板进行相应的光束照射，定位简单精确，且通过光束照射载体基板后能使损坏LED或者未损坏LED与载体基板一次性完全分离，并使未损坏LED一次性转移至目标基板上，转移效率高。In summary, the present invention provides a method and device for mass transfer of LEDs. The method includes: detecting and obtaining position information of damaged or undamaged LEDs on a carrier substrate; The substrate is irradiated with corresponding beams, so that the irradiated damaged or undamaged LED is separated from the carrier substrate, and the undamaged LED is transferred to the target substrate. This application uses the position information of the damaged or undamaged LEDs on the carrier substrate to irradiate the carrier substrate with corresponding beams. The positioning is simple and accurate. After the carrier substrate is irradiated with the beam, the damaged or undamaged LEDs and the carrier substrate can be completely irradiated at one time. Separate and transfer the undamaged LED to the target substrate at one time, with high transfer efficiency.
应当理解的是，本发明的系统应用不限于上述的举例，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，所有这些改进和变换都应属于本发明所附权利要求的保护范围。It should be understood that the system application of the present invention is not limited to the above examples. For those of ordinary skill in the art, improvements or changes can be made based on the above descriptions. All these improvements and changes should fall within the protection scope of the appended claims of the present invention. .

Claims (13)

  1. 一种LED巨量转移的方法，其特征在于，包括：A method for LED mass transfer, which is characterized in that it includes:
    检测并获取载体基板上损坏LED的位置信息；Detect and obtain location information of damaged LEDs on the carrier substrate;
    根据所述位置信息对所述载体基板进行相应的光束照射，使得照射后的所述损坏LED与所述载体基板分离；Performing corresponding beam irradiation on the carrier substrate according to the position information, so that the irradiated damaged LED is separated from the carrier substrate;
    将所述光束照射后保留在所述载体基板上的未损坏LED转移至目标基板上。The undamaged LED remaining on the carrier substrate after irradiating the light beam is transferred to the target substrate.
  2. 根据权利要求1所述的LED巨量转移的方法，其特征在于，所述根据所述位置信息对所述载体基板进行相应的光束照射的步骤包括：The method for LED mass transfer according to claim 1, wherein the step of performing corresponding beam irradiation on the carrier substrate according to the position information comprises:
    利用空间光调制器根据所述位置信息对照射光束进行调节；Using a spatial light modulator to adjust the irradiation beam according to the position information;
    使用调节后的所述光束对所述载体基板进行相应的照射。The adjusted light beam is used to irradiate the carrier substrate accordingly.
  3. 根据权利要求2所述的LED巨量转移的方法，其特征在于，所述空间光调制器为透射式空间光调制器、反射式空间光调制器或数字微反射镜中的一种。The method for LED mass transfer according to claim 2, wherein the spatial light modulator is one of a transmissive spatial light modulator, a reflective spatial light modulator, or a digital micro-mirror.
  4. 根据权利要求3所述的LED巨量转移的方法，其特征在于，当所述空间光调制器为透射式空间光调制器时，所述透射式空间光调制器包括第一电极板、液晶以及第二电极板；The method for LED mass transfer according to claim 3, wherein when the spatial light modulator is a transmissive spatial light modulator, the transmissive spatial light modulator includes a first electrode plate, liquid crystal, and Second electrode plate;
    所述利用空间光调制器根据所述位置信息对照射光束进行调节的步骤包括：The step of using the spatial light modulator to adjust the irradiation beam according to the position information includes:
    根据所述位置信息调节所述第一电极板与所述第二电极板之间的电压；Adjusting the voltage between the first electrode plate and the second electrode plate according to the position information;
    根据所述电压调节所述液晶的排列方向和位置，并根据所述液晶的排列方向和位置对照射光束进行调节。The arrangement direction and position of the liquid crystal are adjusted according to the voltage, and the irradiation beam is adjusted according to the arrangement direction and position of the liquid crystal.
  5. 根据权利要求3所述的LED巨量转移的方法，其特征在于，当所述空间光调制器为反射式空间光调制器时，所述反射式空间光调制器包括导电电极、液晶、发射电极以及偏振片；The method for LED mass transfer according to claim 3, wherein when the spatial light modulator is a reflective spatial light modulator, the reflective spatial light modulator includes conductive electrodes, liquid crystals, and emission electrodes And polarizer;
    所述利用空间光调制器根据所述位置信息对照射光束进行调节的步骤包括：The step of using the spatial light modulator to adjust the irradiation beam according to the position information includes:
    根据所述位置信息调节所述导电电极与所述发射电极之间的电压，根据所述电压调节所述液晶的排列方向和位置；Adjusting the voltage between the conductive electrode and the emitting electrode according to the position information, and adjusting the arrangement direction and position of the liquid crystal according to the voltage;
    根据所述液晶的排列方向和位置调节照射光束的偏振方向，并使所述照射光束通过所述偏振片过滤掉偏振方向发生改变的照射光束，从而对所述照射光束进行调节。The polarization direction of the irradiation beam is adjusted according to the arrangement direction and position of the liquid crystal, and the irradiation beam is filtered through the polarizer to filter the irradiation beam whose polarization direction has changed, so as to adjust the irradiation beam.
  6. 根据权利要求3所述的LED巨量转移的方法，其特征在于，当所述空间光调制器为数字微反射镜时，所述数字微反射镜包括与所述LED位置对应的微镜片；The method for LED mass transfer according to claim 3, wherein when the spatial light modulator is a digital micro mirror, the digital micro mirror includes a micro mirror corresponding to the position of the LED;
    所述利用空间光调制器根据所述位置信息对照射光束进行调节的步骤包括：The step of using the spatial light modulator to adjust the irradiation beam according to the position information includes:
    根据所述位置信息控制所述微镜片的倾斜角度；Controlling the tilt angle of the micro lens according to the position information;
    根据所述微镜片的倾斜角度对照射光束进行调节。The irradiation beam is adjusted according to the inclination angle of the micro lens.
  7. 一种LED巨量转移的方法，其特征在于，包括：A method for LED mass transfer, which is characterized in that it includes:
    检测并获取载体基板上未损坏LED的位置信息；Detect and obtain the position information of the undamaged LED on the carrier substrate;
    根据所述位置信息对所述载体基板进行相应的光束照射，使得照射后的所述未损坏LED与所述载体基板分离，并转移至目标基板上。According to the position information, the carrier substrate is irradiated with corresponding light beams, so that the irradiated undamaged LED is separated from the carrier substrate and transferred to the target substrate.
  8. 根据权利要求7所述的LED巨量转移的方法，其特征在于，所述根据所述位置信息对所述载体基板进行相应的光束照射的步骤包括：7. The method for LED mass transfer according to claim 7, wherein the step of irradiating the carrier substrate with corresponding light beams according to the position information comprises:
    利用空间光调制器根据所述位置信息对照射光束进行调节；Using a spatial light modulator to adjust the irradiation beam according to the position information;
    使用调节后的所述光束对所述载体基板进行相应的照射。The adjusted light beam is used to irradiate the carrier substrate accordingly.
  9. 根据权利要求8所述的LED巨量转移的方法，其特征在于，所述空间光调制器为透射式空间光调制器、反射式空间光调制器或数字微反射镜中的一种。The method for LED mass transfer according to claim 8, wherein the spatial light modulator is one of a transmissive spatial light modulator, a reflective spatial light modulator, or a digital micro mirror.
  10. 根据权利要求8所述的LED巨量转移的方法，其特征在于，当所述空间光调制器为透射式空间光调制器时，所述透射式空间光调制器包括第一电极板、液晶以及第二电极板；The method for LED mass transfer according to claim 8, wherein when the spatial light modulator is a transmissive spatial light modulator, the transmissive spatial light modulator includes a first electrode plate, liquid crystal, and Second electrode plate;
    所述利用空间光调制器根据所述位置信息对照射光束进行调节的步骤包括：The step of using the spatial light modulator to adjust the irradiation beam according to the position information includes:
    根据所述位置信息调节所述第一电极板与所述第二电极板之间的电压；Adjusting the voltage between the first electrode plate and the second electrode plate according to the position information;
    根据所述电压调节所述液晶的排列方向和位置，并根据所述液晶的排列方向和位置对照射光束进行调节。The arrangement direction and position of the liquid crystal are adjusted according to the voltage, and the irradiation beam is adjusted according to the arrangement direction and position of the liquid crystal.
  11. 根据权利要求8所述的LED巨量转移的方法，其特征在于，当所述空间光调制器为反射式空间光调制器时，所述反射式空间光调制器包括导电电极、液晶、发射电极以及偏振片；The method for LED mass transfer according to claim 8, wherein when the spatial light modulator is a reflective spatial light modulator, the reflective spatial light modulator includes conductive electrodes, liquid crystals, and emission electrodes And polarizer;
    所述利用空间光调制器根据所述位置信息对照射光束进行调节的步骤包括：The step of using the spatial light modulator to adjust the irradiation beam according to the position information includes:
    根据所述位置信息调节所述导电电极与所述发射电极之间的电压，根据所述电压调节所述液晶的排列方向和位置；Adjusting the voltage between the conductive electrode and the emitting electrode according to the position information, and adjusting the arrangement direction and position of the liquid crystal according to the voltage;
    根据所述液晶的排列方向和位置调节照射光束的偏振方向，并使所述照射光束通过所述偏振片过滤掉偏振方向发生改变的照射光束，从而对所述照射光束进行调节。The polarization direction of the irradiation beam is adjusted according to the arrangement direction and position of the liquid crystal, and the irradiation beam is filtered through the polarizer to filter the irradiation beam whose polarization direction has changed, so as to adjust the irradiation beam.
  12. 根据权利要求8所述的LED巨量转移的方法，其特征在于，当所述空间光调制器为数字微反射镜时，所述数字微反射镜包括与所述LED位置对应的微镜片；The method for LED mass transfer according to claim 8, wherein when the spatial light modulator is a digital micro mirror, the digital micro mirror includes a micro mirror corresponding to the position of the LED;
    所述利用空间光调制器根据所述位置信息对照射光束进行调节的步骤包括：The step of using the spatial light modulator to adjust the irradiation beam according to the position information includes:
    根据所述位置信息控制所述微镜片的倾斜角度；Controlling the tilt angle of the micro lens according to the position information;
    根据所述微镜片的倾斜角度对照射光束进行调节。The irradiation beam is adjusted according to the inclination angle of the micro lens.
  13. 一种利用如权利要求1或7所述的LED巨量转移方法进行LED巨量转移的装置，其特征在于，所述装置包括：光源组、第一透镜组、空间光调制器、载体基板、包含损坏LED和未损坏LED的LED组、第一胶材层、第二胶材层、目标基板以及控制终端；A device for performing LED mass transfer using the LED mass transfer method according to claim 1 or 7, wherein the device comprises: a light source group, a first lens group, a spatial light modulator, a carrier substrate, The LED group including the damaged LED and the undamaged LED, the first adhesive layer, the second adhesive layer, the target substrate and the control terminal;
    所述第一透镜组，用于接收所述光源组发出的光束，并对所述光束进行准直扩束；The first lens group is used to receive the light beam emitted by the light source group, and to collimate and expand the light beam;
    所述空间光调制器与所述控制终端连接，用于接收准直扩束后的所述光束，并根据所述控制终端中存储的所述载体基板上损坏LED或未损坏LED的位置信息对所述载体基板进行相应的光束照射；The spatial light modulator is connected to the control terminal, and is used to receive the collimated and expanded beam, and compare the positions of damaged or undamaged LEDs on the carrier substrate stored in the control terminal. The carrier substrate is irradiated with corresponding light beams;
    所述LED组通过所述第一胶材层与所述载体基板连接；所述LED组通过所述第二胶材层与所述目标基板连接；当所述光束通过所述空间光调制器照射到所述载体基板上时，所述损坏LED或所述未损坏LED与所述载体基板分离，并使所述未损坏LED转移至所述目标基板上。The LED group is connected to the carrier substrate through the first adhesive material layer; the LED group is connected to the target substrate through the second adhesive material layer; when the light beam is irradiated by the spatial light modulator When onto the carrier substrate, the damaged LED or the undamaged LED is separated from the carrier substrate, and the undamaged LED is transferred to the target substrate.
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