WO2021057095A1 - 透明显示基板、透明显示面板及显示装置 - Google Patents

透明显示基板、透明显示面板及显示装置 Download PDF

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Publication number
WO2021057095A1
WO2021057095A1 PCT/CN2020/095455 CN2020095455W WO2021057095A1 WO 2021057095 A1 WO2021057095 A1 WO 2021057095A1 CN 2020095455 W CN2020095455 W CN 2020095455W WO 2021057095 A1 WO2021057095 A1 WO 2021057095A1
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sub
color
pixel
electrode
pixels
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PCT/CN2020/095455
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English (en)
French (fr)
Inventor
许传志
张露
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昆山国显光电有限公司
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Application filed by 昆山国显光电有限公司 filed Critical 昆山国显光电有限公司
Priority to JP2021562048A priority Critical patent/JP7213371B2/ja
Priority to EP20868987.7A priority patent/EP4036979A4/en
Priority to KR1020217033614A priority patent/KR20210133303A/ko
Publication of WO2021057095A1 publication Critical patent/WO2021057095A1/zh
Priority to US17/495,152 priority patent/US20220028900A1/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/351—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels comprising more than three subpixels, e.g. red-green-blue-white [RGBW]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H01L31/125—Composite devices with photosensitive elements and electroluminescent elements within one single body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/353—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels characterised by the geometrical arrangement of the RGB subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate

Definitions

  • This application relates to the field of display technology, and in particular to a transparent display substrate, a transparent display panel, and a display device.
  • a transparent display substrate including a plurality of pixel units, the pixel units including at least three sub-pixel groups with different light-emitting colors, and each sub-pixel group includes at least two sub-pixels;
  • the sub-pixel includes a first electrode, a light-emitting structure block on the first electrode, and a second electrode on the light-emitting structure block; at least one of the at least three sub-pixel groups is adjacent to each other.
  • the first electrodes of the two sub-pixels are electrically connected through the first connecting portion, and the first electrodes of the two sub-pixels that are not adjacent to each other in the at least one sub-pixel group are passed around the side of the sub-pixels of other sub-pixel groups in the pixel unit.
  • the second connecting portion is electrically connected; the first connecting portion and the second connecting portion are located on the same layer.
  • a transparent display panel includes the transparent display substrate as described above and an encapsulation layer provided on the transparent display substrate.
  • a display device including a first display area and a second display area.
  • the first display area is a transparent display area, and a photosensitive device is arranged under the first display area.
  • the second display area is a transparent display area or a non-transparent display area.
  • the first display area and the second display area are provided with the transparent display substrate as described above.
  • the transparent display substrate, the transparent display panel, and the display device provided by the embodiments of the present application there is at least one sub-pixel group in the pixel unit of the transparent display substrate.
  • the first electrodes of two adjacent sub-pixels are electrically connected through the first connecting portion
  • the first electrodes of the two sub-pixels in the at least one sub-pixel group are electrically connected through the second connection portion
  • the second connection portion surrounds the side portions of the sub-pixels of the other sub-pixel groups in the pixel unit, so that the first connection portion and the The second connecting portion intersects, for example, to avoid crossing the connecting portions of other sub-pixel groups, and to electrically connect each sub-pixel in the sub-pixel group, so each sub-pixel in the sub-pixel group can be driven by one pixel circuit It can reduce the number of pixel circuits in the transparent display substrate, effectively improve the diffraction and superimposition phenomenon when light is transmitted through the transparent display substrate, thereby improving the image quality of the camera set on the backlight surface of the transparent display substrate, and avoiding
  • FIG. 1 is a partial schematic diagram of the arrangement of sub-pixel groups of a transparent display substrate provided by an embodiment of the present application;
  • FIG. 2 is a partial schematic diagram of another sub-pixel group arrangement of a transparent display substrate provided by an embodiment of the present application;
  • FIG. 3 is a partial schematic diagram of another sub-pixel group arrangement of a transparent display substrate provided by an embodiment of the present application.
  • FIG. 4 is a partial schematic diagram of another sub-pixel group arrangement of a transparent display substrate provided by an embodiment of the present application.
  • FIG. 5 is a partial schematic diagram of another sub-pixel group arrangement of a transparent display substrate provided by an embodiment of the present application.
  • FIG. 6 is a cross-sectional view of a transparent display substrate provided by an embodiment of the present application.
  • FIG. 7 is a cross-sectional view of another transparent display substrate provided by an embodiment of the present application, in which the first connection portion and the second connection portion are located below the first electrode, and the first connection portion and the second connection portion are both connected to the The first electrode is in direct contact;
  • FIG. 8 is a cross-sectional view of still another transparent display substrate provided by an embodiment of the present application, in which a first connection portion and a second connection portion are located under the first electrode, and between the first connection portion and the first electrode An insulating layer is provided, and the first electrode is electrically connected to the first connecting portion and the second connecting portion through a through hole on the insulating layer;
  • FIG. 9 is a top view of a display device provided by an embodiment of the present application.
  • a transparent display area is generally set on the above-mentioned electronic devices to realize the full-screen display of the electronic devices .
  • the quality of the light collected by the camera through the transparent display area is poor, and even image distortion defects may occur during the image collection process.
  • the inventor has discovered through research that the reason for this problem is that the structure of the transparent display area of the electronic device is relatively complicated, and the external light will cause a more complicated diffraction intensity distribution when passing through the transparent display area, resulting in diffraction fringes, which affects the performance of the photosensitive device. normal work.
  • the sub-pixels in the transparent display area are actively driven, and each sub-pixel corresponds to a pixel circuit, resulting in a complicated structure in the transparent display area.
  • the boundary between the devices in different pixel circuits will occur. More obvious diffraction, which causes distortion of the picture captured by the camera.
  • embodiments of the present application provide a transparent display substrate, a transparent display panel, and a display device.
  • the transparent display substrate provided by the embodiments of the present application includes a plurality of pixel units 10, and the pixel units 10 include at least three sub-pixel groups with different light-emitting colors, and each sub-pixel group includes at least two sub-pixels.
  • the sub-pixel includes a first electrode, a light-emitting structure block on the first electrode, and a second electrode on the light-emitting structure block.
  • the first electrodes of two adjacent sub-pixels in at least one sub-pixel group in the pixel unit 10 are electrically connected through the first connecting portion 101, and the at least one sub-pixel
  • the first electrodes of the two sub-pixels in the group are electrically connected through the second connecting portion 102 surrounding the side of the sub-pixels of the other sub-pixel groups in the pixel unit 10.
  • the first connecting portion 101 and the second connecting portion 102 are located on the same layer.
  • the second connecting portion for connecting two sub-pixels surrounds the side of the sub-pixel of other sub-pixel groups, the two first electrodes electrically connected through the second connecting portion 102 may be different.
  • the first electrodes of two adjacent sub-pixels for example, the first electrodes of two sub-pixels located in different rows.
  • the first connecting portion can be avoided Crossing the second connecting portion, for example, can avoid crossing the connecting portions of other sub-pixel groups, and can make the first electrodes of each sub-pixel in the sub-pixel group be electrically connected.
  • each pixel unit 10 includes four sub-pixels 111, four sub-pixels 121, and four sub-pixels 131.
  • the four sub-pixels 111 form a sub-pixel group, and the four sub-pixels 121 form a sub-pixel group.
  • four sub-pixels 131 form one sub-pixel group.
  • each pixel unit 10 includes six sub-pixels 111, six sub-pixels 121, and six sub-pixels 131.
  • the six sub-pixels 111 form a sub-pixel group, and the six sub-pixels 121 form a sub-pixel group.
  • each pixel unit 10 includes ten sub-pixels 111, ten sub-pixels 121, and ten sub-pixels 131.
  • the ten sub-pixels 111 form a sub-pixel group, and the ten sub-pixels 121 form a sub-pixel.
  • Group, ten sub-pixels 131 form a sub-pixel group.
  • two adjacent sub-pixels 111 are electrically connected through the first connection portion 101, and two adjacent sub-pixels 121 are electrically connected through the first connection portion 101, and adjacent The two sub-pixels 131 are electrically connected through the first connection part 101.
  • the second connecting portion 102 connecting the two sub-pixels 111 surrounds the side portions of the sub-pixel 121 and the sub-pixel 131.
  • the display substrate shown in FIGS. 1 to 5 in the same sub-pixel group, two adjacent sub-pixels 111 are electrically connected through the first connection portion 101, and two adjacent sub-pixels 121 are electrically connected through the first connection portion 101, and adjacent The two sub-pixels 131 are electrically connected through the first connection part 101.
  • the second connecting portion 102 connecting the two sub-pixels 111 surrounds the side portions of the sub-pixel 121 and the sub-pixel 131.
  • the second connecting portion 102 connecting the two sub-pixels 111 surrounds the side of the sub-pixel 121 and the sub-pixel 131
  • the second connecting portion 102 connecting the two sub-pixels 121 surrounds the sub-pixel 111 and the sub-pixel.
  • the second connecting portion 102 connecting the two sub-pixels 131 surrounds the side of the sub-pixel 111 and the sub-pixel 121.
  • the first electrodes of two adjacent sub-pixels in at least one sub-pixel group in the pixel unit 10 are electrically connected through the first connecting portion 101, and the two sub-pixels in the at least one sub-pixel group
  • the first electrode of the pixel unit 10 is electrically connected to the second connecting portion 102 on the side of the sub-pixels of the other sub-pixel groups in the pixel unit 10, so that the first connecting portion 101 and the second connecting portion 102 can be prevented from intersecting, for example, it can avoid intersecting with other sub-pixels.
  • the connecting parts of the sub-pixel group intersect, and each sub-pixel in the sub-pixel group can be electrically connected.
  • each sub-pixel in the sub-pixel group can be driven by one pixel circuit, which can reduce the cost of the pixel circuit in the transparent display substrate. It can effectively improve the diffraction and superposition phenomenon when light is transmitted through the transparent display substrate, improve the image quality taken by the camera set on the backlight surface of the transparent display substrate, and avoid image distortion defects. Since the first connection portion 101 and the second connection portion 102 of the same sub-pixel group are arranged on the same layer, the first connection portion 101 and the second connection portion 102 can be formed in the same process step, which is beneficial to reduce the complexity of the manufacturing process .
  • the first connecting portion 101 and the second connecting portion 102 are located on the same layer. It can be understood that, in order to enable the sub-pixels to work normally, the first connecting portion 101 and the second connecting portion 102 do not intersect, for example, the first connecting portion of other sub-pixel groups does not intersect the second connecting portion of the sub-pixel group. .
  • At least one sub-pixel group includes at least two sub-groups arranged along a first direction, and each of the sub-groups includes at least two sub-pixel groups arranged along a second direction.
  • the first direction intersects the second direction.
  • Sub-groups of other sub-pixel groups are provided between two adjacent sub-groups of the same sub-pixel group. Two adjacent sub-pixels in the same sub-group are electrically connected through the first connecting portion 101.
  • a first electrode of one sub-group is connected to a first electrode of the other sub-group through the second connection portion 102, and the second connection portion 102 Surround the side of the sub-group of the other sub-pixel group.
  • two sub-groups of the same sub-pixel group are arranged along the first direction, which means that the two sub-groups are arranged substantially along the first direction as a whole.
  • At least two sub-pixels in the same sub-group are arranged at intervals along the second direction, which means that at least two sub-pixels of the sub-group are arranged substantially along the second direction, and the central axes of the at least two sub-pixels in the second direction may overlap, It can also be separated by a certain distance.
  • the first electrodes of two adjacent sub-pixels in the same sub-group are electrically connected through the first connecting portion, and in at least two sub-groups of the same sub-pixel group, the first electrodes of the sub-pixels of two adjacent sub-groups pass through the second
  • the electrical connection of the connecting portion can make the first electrodes of all the sub-pixels of each sub-pixel group in the pixel unit 10 be electrically connected, and the positions of the first connecting portion and the second connecting portion are reasonable, and the two do not intersect.
  • the sub-pixel group composed of sub-pixels 111 includes two sub-groups 11, and each sub-group 11 includes two sub-pixels 111.
  • the sub-pixel group formed by the sub-pixels 121 includes one sub-group 12, and the sub-group 12 includes four sub-pixels 121.
  • the sub-pixel group formed by the sub-pixels 131 includes one sub-group 13, and the sub-group 13 includes four sub-pixels 131.
  • the subgroup 12 and the subgroup 13 are located between the two subgroups 11. In the same sub-group 11, 12, and 13, the first electrodes of two adjacent sub-pixels 111, 121, and 131 are electrically connected by the first connecting portion 101.
  • a first electrode of one sub-group 11 is electrically connected to a first electrode of the other sub-group 11 through a second connection portion 102, and the second connection portion 102 surrounds the sub-group 12 and the sub-group 11 The side of 13.
  • the sub-pixel group composed of sub-pixels 111 includes two sub-groups 11, and the sub-pixel group composed of sub-pixels 121 includes two sub-groups 12, and the sub-pixels 131 are composed of The sub-pixel group includes two sub-groups 13.
  • a sub-group 12 and a sub-group 13 are provided between the two sub-groups 11, and a first electrode of one sub-group 11 is electrically connected to a first electrode of the other sub-group 11 through the second connecting portion 102, and the The second connecting portion 102 surrounds the side portions of the sub-group 12 and the sub-group 13.
  • a sub-group 11 and a sub-group 13 are arranged between the two sub-groups 12, and a first electrode of one sub-group 12 is electrically connected to a first electrode of the other sub-group 12 through the second connecting portion 102, and the The second connecting portion 102 surrounds the sides of the sub-group 11 and the sub-group 13.
  • a sub-group 11 and a sub-group 12 are provided between the two sub-groups 13, wherein a first electrode of one sub-group 13 is electrically connected to a first electrode of the other sub-group 13 through the second connecting portion 102, and the The second connecting portion 102 surrounds the sides of the sub-group 11 and the sub-group 12.
  • the first pixel unit 10 includes three sub-pixel groups with different light-emitting colors, which are a first-color sub-pixel group, a second-color sub-pixel group, and a third-color sub-pixel group, respectively.
  • the sub-pixel group of the first color includes at least two sub-pixels 121 of the first color
  • the sub-pixel group of the second color includes at least two sub-pixels 131 of the second color
  • the sub-pixel group of the third color includes at least two sub-pixels.
  • Three-color sub-pixel 111 Three-color sub-pixel 111.
  • the arrangement of the sub-pixels in the three sub-pixel groups with different light-emitting colors and the arrangement of the second connecting portion may have the following situations. The details will be described below.
  • the first-color sub-pixel group includes a first-color sub-group 12, and the second-color sub-pixel group includes a second-color sub-pixel group.
  • Group 13 the sub-pixel group of the third color includes two sub-groups 11 of the third color.
  • the first color subgroup 12 and the second color subgroup 13 are arranged between the two third color subgroups 11.
  • the pixel unit 10 includes a first side 103 and a second side 104 opposite to the first side 103.
  • the first side 103 is opposite to the second side 104 or the first side along the second direction.
  • 103 and the second side 104 are two sides of the pixel unit 10 parallel to the first direction.
  • the arrangement of the second connecting portion 102 may include the following two types.
  • the first electrode in one subgroup 11 adjacent to the first side 103 and the other subgroup 11 adjacent to the first side is electrically connected by one of the second connecting portions 102; or, the first electrode of one of the subgroups 11 adjacent to the second side 104 and the other of the subgroup 11 adjacent to the second side 104
  • the first electrode is electrically connected through one of the second connecting portions 102.
  • the distance between the first electrode adjacent to the first side 103 and the first side 103 in the same subgroup is smaller than the distance between the other first electrodes in the subgroup and the first side 103, and the distance between the first electrode adjacent to the first side 103 in the same subgroup is adjacent to the second side 104
  • the distance between the first electrode and the second side 104 is smaller than the distance between the other first electrodes in the subgroup and the second side 104.
  • the first electrode adjacent to the second side 104 in one subgroup 11 and the second electrode adjacent to the second subgroup 11 in the other subgroup 11 The first electrode of the side 104 is electrically connected through one of the second connecting portions 102.
  • the first electrode adjacent to the first side 103 in one subgroup 11 and the first electrode adjacent to the first side 103 in the other subgroup 11 may pass through one of the second connecting portions 102. Electric connection.
  • the connection can make the length of the second connecting portion 102 shorter. Therefore, the above-mentioned arrangement of the second connecting portion helps to improve the transparency of the transparent display substrate, reduces the structural complexity of the transparent display substrate, and further helps to reduce the diffraction and superimposition phenomenon when external light passes through the transparent display panel.
  • the first electrode in one subgroup 11 is adjacent to the first side 103, and the first electrode in the other subgroup 11 is adjacent to the first side
  • the first electrode of 103 is electrically connected by one of the second connecting portions 102; and, the first electrode of one of the subgroups 11 adjacent to the second side 104 and the other of the subgroup 11 adjacent to the second side 104
  • the first electrode is electrically connected through one of the second connecting portions 102.
  • the first electrode adjacent to the first side 103 in one subgroup 11 and the first electrode adjacent to the first side 103 in the other subgroup 11 The first electrode is electrically connected by one of the second connecting portions 102; and, the first electrode adjacent to the second side 104 in one subgroup 11 and the first electrode adjacent to the second side 104 in the other subgroup 11
  • the first electrode is electrically connected through one of the second connecting portions 102.
  • the first connection portion 101, the second connection portion 102, and the first electrode of the two subgroups 11 are connected to form a closed loop, and the pixel circuit corresponding to the subpixel group to which the two subgroups 11 belong is connected to the first connection portion, Either the second connecting portion or the first electrode is electrically connected, so that the pixel circuit can drive the sub-pixel group, so that the connection between the sub-pixel group and the corresponding pixel circuit is more flexible.
  • the sub-pixel group of the first color includes two sub-groups 12 of the first color
  • the sub-pixel group of the second color includes two sub-groups 13 of the second color
  • the sub-pixel group of the third color includes Two subgroups of the third color 11.
  • Two subgroups of the same color are provided with the other two color subgroups, that is, the first color subgroup 12 and the second color subgroup 13 are provided between the two third color subgroups 11
  • the pixel unit 10 includes a first side 103 and a second side 104 opposite to the first side 103, and the first side 103 is parallel to the second side 104 along the first direction.
  • the first electrode 104 is electrically connected through the second connection part 102.
  • the first electrode adjacent to the first side 103 in one of the subgroups 13 passes through the first electrode adjacent to the first side 103 in the other subgroup 13
  • the second connecting portion 102 is electrically connected.
  • one of the subgroups 11 is adjacent to the first electrode on the first side 103, and the other subgroup 11 is adjacent to the first electrode on the second side 104 through the
  • the second connecting portion 102 is electrically connected, and the second connecting portion 102 passes through the area between the sub-group 11 and the adjacent sub-group 13 of the sub-group 11.
  • the first electrodes of the two sub-groups included in the sub-pixel group of each color can be electrically connected through the corresponding second connecting portions, respectively, so as to avoid crossing between the second connecting portions.
  • the pixel unit 10 includes a sub-pixel group of a first color, a sub-pixel group of a second color, and a sub-pixel group of a third color.
  • the sub-pixel group of the first color It includes more than two sub-pixels 121 of the first color
  • the sub-pixel group of the second color includes more than two sub-pixels 131 of the second color
  • the sub-pixel group of the third color includes more than two sub-pixels of the third color.
  • the pixel unit 10 includes a plurality of sub-pixel units 20.
  • the sub-pixel units 20 include sub-pixels 121 of a first color, sub-pixels 131 of a second color, and sub-pixels 111 of a third color that are adjacently arranged.
  • the three sub-pixels 111, 121, and 131 in the pixel unit 20 are arranged in a magenta shape.
  • the sub-pixel unit 20 includes a first area 21, a second area 22, and a third area 23.
  • the first area 21 and the second area 22 are arranged in the first direction, and the third area 23 and the third area 23 are arranged in the first direction.
  • the first areas 21 are arranged in the second direction, and the central axis of the first area 21 and the second area 22 as a whole in the second direction substantially coincide with the central axis of the third area 23 in the second direction.
  • the central axis of the first area 21 and the second area 22 as a whole in the second direction refers to that the two sides of the first area 21 and the second area 22 farthest in the first direction are along the second direction. Midline.
  • the sub-pixel 121 of the first color is located in the first area 21, the sub-pixel 131 of the second color is located in the second area 22, and the sub-pixel 111 of the third color is located in the third area 23 .
  • the third area 22 of one sub-pixel unit 20 is located on the third side of the first area 21, and the third area 22 of the other sub-pixel unit 20 is located on the third side of the first area 21.
  • the third area 23 is located on the fourth side of the first area 21, and the third side is opposite to the fourth side in the second direction; a plurality of sub-pixel units arranged at intervals in the second direction
  • the third area 23 of 20 is located on the same side of the first area 21.
  • the sub-pixels 121 of the first color, the sub-pixels 131 of the second color, and the sub-pixels 111 of the third color are uniformly distributed, which can avoid a certain area of the transparent display substrate.
  • Multiple sub-pixels of the same color are adjacent to each other to cause uneven color distribution during display, which in turn leads to the problem of single color bright bars in the area, which can improve the display effect.
  • the distribution of the sub-pixels of the same color is relatively uniform, so that the mask openings used in the light-emitting structure of the sub-pixels are arranged regularly, which can reduce the wrinkles of the mask.
  • the three light-emitting colors may be red, green, and blue, respectively.
  • the first color, the second color, and the third color are respectively one of the above three colors.
  • the first color is red, the second color is green, and the third color is blue; or, the first color is red, the second color is blue, and the third color is green.
  • the pixel unit may include sub-pixel groups of more than three light-emitting colors.
  • a plurality of sub-pixels in some sub-groups are arranged in a staggered arrangement in the second direction, for example Two adjacent sub-pixels in the sub-group 12 and the sub-group 13 are arranged in a staggered arrangement in the second direction, that is, the central axes of the two adjacent sub-pixels in the second direction do not overlap.
  • the sub-pixel group of the first color includes two sub-groups 12, and a plurality of sub-pixels 121 of the first color included in each sub-group 12 are arranged side by side in the second direction.
  • the sub-pixel group of the second color includes two sub-groups 13, and each sub-group 13 includes a plurality of sub-pixels 131 of the second color arranged side by side in the second direction, that is, the central axis in the second direction is approximately coincide.
  • the sub-pixel group of the third color includes two sub-groups 11, and the plurality of sub-pixels 111 of the third color included in each sub-group 11 are arranged side by side in the second direction, that is, the central axis in the second direction is approximately coincide.
  • the arrangement of the sub-pixels in each sub-pixel group and the arrangement of the second connecting portion may be different from those shown in FIGS. 1 to 5.
  • first direction and the second direction may be perpendicular to each other.
  • first direction may be a row direction
  • second direction may be a column direction.
  • first direction may be a column direction
  • second direction may be a row direction.
  • first direction is the column direction and the second direction is the row direction as an example for description, and other cases are not shown in the figure.
  • the transparent display substrate includes a substrate 41, and a plurality of sub-pixels 111, 121, and 131 of the pixel unit 10 are located on the substrate 41.
  • the first electrode 31 of the plurality of sub-pixels 111, 121, and 131 may be an anode
  • the second electrode may be a cathode
  • the cathode may be a connected surface electrode.
  • the first connecting portion 101, the second connecting portion 102 and the first electrode 31 can be arranged in the following ways.
  • the first connecting portion 101, the second connecting portion 102 of the pixel unit 10 and the first electrodes 31 of the sub-pixels 111, 121, and 131 are located in the same layer.
  • the size of the first connecting portion 101 and the second connecting portion 102 perpendicular to the extending direction thereof may be greater than 3 ⁇ m and less than half of the maximum size of the first electrode 31.
  • the size of the first connecting portion perpendicular to its extension direction is the size on a plane extending along the first direction and the second direction; the size of the second connecting portion perpendicular to its extension direction is the size along the first Direction and the dimension on the plane extending in the second direction.
  • the resistance of the first connection portion 101 and the second connection portion 102 can be made smaller; by setting the first connection portion 101 and the second connection portion 102
  • the size of the second connecting portion 102 is less than one-half of the maximum size of the first electrode 31, and the arrangement of the first connecting portion 101 and the second connecting portion 102 has a small effect on the size of the first electrode 31, avoiding the first connection
  • the larger size of the portion 101 and the second connecting portion 102 leads to a reduction in the size of the first electrode 31, which in turn leads to a reduction in the effective light-emitting area of the transparent display substrate.
  • the first connection portion 101, the second connection portion 102 and the first electrode 31 are made of the same material, then the first connection portion 101, the second connection portion 102 and the first electrode 31 are made of the same material. 31 can be formed in the same process step, which can simplify the preparation process.
  • first connecting portion 101 and the second connecting portion 102 are made of the same material, then the first connecting portion 101 and the second connecting portion 102 can be formed in the same process step; The materials of the first connecting portion 101 and the first electrode 31 are different, and the first connecting portion 101 and the first electrode 31 can be formed in different process steps.
  • the first connection portion 101 and the second connection portion 102 are located below the first electrode 31, and the first connection portion 101 and the second connection portion The portions 102 are in direct contact with the first electrodes 31 respectively.
  • the first connecting portion 101 includes a contact portion 1012 located under the first electrode 31 and a wire 1011 for connecting two adjacent contact portions 1012.
  • both the first connection portion 101 and the second connection portion 102 are located on different layers from the first electrode 31, and the arrangement of the first connection portion 101 and the second connection portion 102 is not affected by the first electrode 31, and the wiring
  • the method is more flexible; and the size of the first electrode 31 can not be affected by the first connecting portion 101 and the second connecting portion 102, so that the size of the first electrode 31 can be made larger, thereby making the effective light-emitting area of the transparent display substrate Larger.
  • the first connection portion 101 and the second connection portion 102 are in direct contact with the first electrode 31, and the first connection portion 101 and the second connection portion 102 are directly electrically connected to the first electrode 31, and the structure is simpler.
  • the first connection portion 101 and the second connection portion 102 are located below the first electrode 31, and the first connection portion 101 and the first electrode
  • An insulating layer 42 is provided between the insulating layer 42, and the first electrode 31 is connected to the first connecting portion 101 and the second connecting portion 102 through the through hole 51 on the insulating layer 42.
  • the through hole 51 of the insulating layer 42 is filled with a conductive material, and the conductive material can be formed at the same time as the first electrode 31.
  • the first electrode 31 is electrically connected to its corresponding first connection portion 101 or second connection portion 102 through the conductive material in the through hole 51 below it.
  • both the first connection portion 101 and the second connection portion 102 are located on different layers from the first electrode 31, and the arrangement of the first connection portion 101 and the second connection portion 102 is not affected by the first electrode 31, and the wiring The way is more flexible.
  • the size of the first electrode 31 may not be affected by the first connecting portion 101 and the second connecting portion 102, so that the size of the first electrode 31 can be made larger, thereby making the effective light-emitting area of the transparent display substrate larger.
  • the projection of the first electrode 31 on the substrate may include one first graphic unit or a plurality of connected first graphic units.
  • the first graphic unit includes a circle, an oval, a dumbbell, a gourd or a rectangle.
  • the dumbbell shape refers to the shape of a pattern formed by connecting two circles with two parallel lines between the two circles and the distance between the two circles is smaller than the diameter of the two circles
  • the gourd shape refers to the direct connection of two circles. The shape of the pattern.
  • the above-mentioned shape can change the periodic structure generated by diffraction, that is, change the distribution of the diffraction field, thereby reducing the incidence of external light passing through the transparent display substrate.
  • the diffraction effect of the transparent display substrate further ensures that the image obtained by the camera provided under the transparent display substrate has high definition.
  • the projection of the light-emitting structure block provided on the first electrode 31 in the transparent display substrate on the substrate may include a second graphic unit or a plurality of connected second graphic units, and the second graphic The unit and the first graphic unit may be the same or different.
  • the projection of the light-emitting structure block corresponding to the first electrode 31 on the substrate is different from the projection of the first electrode 31 on the substrate, so as to further reduce the light generated when the light passes through the transparent display substrate. Diffraction effect.
  • the second graphic unit may include a circle, an oval, a dumbbell, a gourd, or a rectangle.
  • the above-mentioned shape can change the periodic structure generated by diffraction, that is, change the distribution of the diffraction field, thereby further reducing when external incident light passes through the transparent display substrate.
  • the resulting diffraction effect further ensures that the image captured by the camera provided under the transparent display substrate has high definition.
  • transparent materials can be used for each layer of the transparent display substrate. In this way, the lighting effect of the photosensitive device, such as a camera, arranged under the transparent display substrate can be improved.
  • the materials of the first electrode and/or the second electrode are both transparent materials.
  • the light transmittance of the transparent material for preparing the first electrode and/or the second electrode is greater than or equal to 70%.
  • the light transmittance of the transparent material is greater than or equal to 90%, for example, the light transmittance of the transparent material may be 90%, 95%, or the like.
  • Such an arrangement can make the light transmittance of the transparent display substrate larger, so that the light transmittance of the transparent display substrate meets the lighting requirements of the photosensitive devices arranged below it.
  • the transparent material for preparing the first electrode and/or the second electrode includes at least one of indium tin oxide, indium zinc oxide, silver-doped indium tin oxide, or silver-doped indium zinc oxide.
  • the transparent material for preparing the first electrode and/or the second electrode is silver-doped indium tin oxide or silver-doped indium zinc oxide, so as to ensure the high light transmittance of the transparent display substrate. Above, the resistance of the first electrode and/or the second electrode is reduced.
  • the light transmittance of the first connecting portion 101 and/or the second connecting portion 102 is greater than 70%.
  • the light transmittance of the first connecting portion 101 and/or the second connecting portion 102 is greater than or equal to 90%, for example, the light transmittance of the transparent material may be 90%, 95%, or the like. Such an arrangement can make the light transmittance of the transparent display substrate larger.
  • the material of the first connecting portion 101 and/or the second connecting portion 102 includes at least one of indium tin oxide, indium zinc oxide, silver-doped indium tin oxide, or silver-doped indium zinc oxidekind.
  • the transparent material for preparing the first connecting portion 101 and/or the second connecting portion 102 is silver-doped indium tin oxide or silver-doped indium zinc oxide to ensure high light transmittance of the transparent display substrate. Based on this, the resistance of the first connecting portion 101 and/or the second connecting portion 102 is reduced.
  • the embodiments of the present application also provide a transparent display panel.
  • the transparent display panel includes the above-mentioned transparent display substrate and an encapsulation layer disposed on the transparent display substrate.
  • the encapsulation layer is disposed on the side of the transparent display substrate away from the substrate.
  • the encapsulation layer may be a thin film encapsulation structure, and the thin film encapsulation structure may include a stack of organic material layers and inorganic material layers alternately superimposed, wherein the organic material layer and the inorganic material layer are both transparent materials, and the material of the inorganic material layer may be, for example, SiO 2. SiNx and Al 2 O 3, etc.
  • the material of the organic material layer can be, for example, PI, PET, etc.
  • the packaging layer can also be a glass cover plate or a glass powder packaging structure.
  • the display device 100 includes a first display area 110 and a second display area 120.
  • the first display area 110 and the second display area 120 are provided with The above-mentioned transparent display substrate.
  • the first display area 110 is a transparent display area.
  • the second display area 120 is a transparent display area or a non-transparent display area, the light transmittance of the first display area 110 is greater than that of the second display area 120, and a photosensitive device may be disposed under the first display area 110.
  • a pixel circuit for driving the sub-pixel group of the transparent display substrate is arranged in the second display area. This arrangement helps to increase the light transmittance of the first display area, reduce the structural complexity of the first display area, and thereby reduce the diffraction effect generated when external light passes through the first display area.
  • the display device may include an encapsulation layer covering at least the second display area 120.
  • the encapsulation layer may cover the first display area 110 and the second display area 120, or the encapsulation layer may cover the second display area 120 but not the first display area 110.
  • the packaging layer can be a thin film packaging structure, a glass cover plate or a glass powder packaging structure.
  • the display device may further include a device body.
  • the device body has a device area, the device area is located below the first display area, and a photosensitive device that collects light passing through the first display area is arranged in the device area.
  • the photosensitive device may include a camera and/or a light sensor.
  • Devices other than photosensitive devices such as gyroscopes or earpieces, can also be arranged in the device area.
  • the device area may be a slotted area, and the first display area may be arranged in close contact with the slotted area, so that the photosensitive device can emit or collect light passing through the first display area.

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Abstract

一种透明显示基板、透明显示面板及显示装置。该透明显示基板包括多个像素单元（10），像素单元（10）包括发光颜色不同的至少三个子像素组，每一子像素组包括至少两个子像素。该子像素包括第一电极、位于第一电极上的发光结构块及位于发光结构块上的第二电极。至少一个子像素组中相邻两个子像素的第一电极通过第一连接部（101）电连接、以及至少一个子像素组中不相邻的两个子像素的第一电极通过环绕该像素单元（10）中其他子像素组的子像素侧部的第二连接部（102）电连接；该第一连接部（101）与该第二连接部（102）位于同一层。

Description

透明显示基板、透明显示面板及显示装置 技术领域
本申请涉及显示技术领域，尤其涉及一种透明显示基板、透明显示面板及显示装置。
背景技术
随着电子设备的快速发展，用户对屏占比的要求越来越高，使得电子设备的全面屏显示受到业界越来越多的关注。传统的电子设备如手机、平板电脑等，由于需要集成诸如前置摄像头、听筒以及红外感应元件等，故而可通过在显示屏上开槽(Notch)，在开槽区域设置摄像头、听筒以及红外感应元件等。但开槽区域并不能用来显示画面，如刘海屏。或者采用在屏幕上开孔的方式来设置摄像头等，这样对于实现摄像功能的电子设备来说，外界光线可通过屏幕上的开孔处进入位于屏幕下方的感光元件。但是这些电子设备均不是真正意义上的全面屏，并不能在整个屏幕的各个区域均进行显示，如在摄像头区域不能显示画面。
发明内容
根据本申请实施例的第一方面，提供了一种透明显示基板，包括多个像素单元，所述像素单元包括发光颜色不同的至少三个子像素组，每一子像素组包括至少两个子像素；所述子像素包括第一电极、位于所述第一电极上的发光结构块及位于所述发光结构块上的第二电极；所述至少三个子像素组中的至少一个子像素组中相邻两个子像素的第一电极通过第一连接部电连接，且所述至少一个子像素组中不相邻两个子像素的第一电极通过环绕该像素单元中其他子像素组的子像素侧部的第二连接部电连接；所述第一连接部与所述第二连接部位于同一层。
根据本申请实施例的第二方面，提供了一种透明显示面板。所述透明显示面板包括如上所述的透明显示基板以及设置在透明显示基板上的封装层。
根据本申请实施例的第三方面，提供了一种显示装置，所述显示装置包括第一显示区及第二显示区。所述第一显示区为透明显示区，且所述第一显示区下方设置感光器件。所述第二显示区为透明显示区或非透明显示区。所述第一显示区和所述第二显示区内设置有如上所述的透明显示基板。
本申请实施例提供的透明显示基板、透明显示面板及显示装置中，透明显示基板的像素单元中至少存在一个子像素组相邻两个子像素的第一电极通过第一连接部电连接，以及所述至少一个子像素组中两个子像素的第一电极通过第二连接部电连接，第二连接部环绕该像素单元中其他子像素组的子像素的侧部，则可避免第一连接部与第二连接部相交，例如，可避免与其他子像素组的连接部交叉，且可使得该子像素组中的各子像素电连接，因此该子像素组中各子像素可由一个像素电路进行驱动，可减小透明显示基板中像素电路的数量，有效改善光线透射透明显示基板时的衍射叠加现象，进而提升设置在该透明显示基板的背光面的摄像头拍摄的图像质量，避免出现图像失真缺陷。由于同一子像素组中的第一连接部与第二连接部设置在同一层，则第一连接部与第二连接部可在同一工艺步骤中形成，有利于降低制备工艺的复杂度。
附图说明
图1是本申请实施例提供的一种透明显示基板的子像素组排布的局部示意图；
图2是本申请实施例提供的一种透明显示基板的另一种子像素组排布的局部示意图；
图3是本申请实施例提供的一种透明显示基板的又一种子像素组排布的局部示意图；
图4是本申请实施例提供的一种透明显示基板的又一种子像素组排布的局部示意图；
图5是本申请实施例提供的一种透明显示基板的又一种子像素组排布的局部示意图；
图6是本申请实施例提供的一种透明显示基板的剖视图；
图7是本申请实施例提供的另一种透明显示基板的剖视图，其中第一连接部与第二连接部位于第一电极下方，所述第一连接部及所述第二连接部均与所述第一电极直接接触；
图8是本申请实施例提供的再一种透明显示基板的剖视图，其中第一连接部与第二连接部位于所述第一电极下方，所述第一连接部与所述第一电极之间设置有绝缘层，所述第一电极通过所述绝缘层上的通孔与所述第一连接部及所述第二连接部电连接；
图9是本申请实施例提供的一种显示装置的俯视图。
具体实施方式
这里将详细地对示例性实施例进行说明，其示例表示在附图中。下面的描述涉及附 图时，除非另有表示，不同附图中的相同数字表示相同或相似的要素。以下示例性实施例中所描述的实施方式并不代表与本申请相一致的所有实施方式。相反，它们仅是与如所附权利要求书中所详述的、本申请的一些方面相一致的装置的例子。
在诸如手机和平板电脑等智能电子设备上，由于需要集成诸如前置摄像头、光线感应器等感光器件，一般是通过在上述电子设备上设置透明显示区的方式，来实现电子设备的全面屏显示。
但是，摄像头采集透过该透明显示区的光线的质量较差，甚至在图像采集过程中会出现图像失真缺陷。发明人研究发现，出现这种问题的原因在于，电子设备的透明显示区的结构比较复杂，外部光线经过透明显示区时会造成较为复杂的衍射强度分布，从而出现衍射条纹，进而影响感光器件的正常工作。例如，透明显示区的子像素为主动驱动，每一子像素对应一个像素电路，导致透明显示区的结构比较复杂，外部光线经过显示屏时，不同像素电路中各器件之间的边界处会发生较为明显的衍射，从而使得摄像头拍摄到的画面出现失真的问题。
为解决上述问题，本申请实施例提供了一种透明显示基板、透明显示面板及显示装置。
下面结合附图，对本申请实施例中的透明显示基板、透明显示面板及显示装置，进行详细说明。在不冲突的情况下，下述的实施例及实施方式中的特征可以相互补充或相互组合。
参见图1至图5，本申请实施例提供的透明显示基板包括多个像素单元10，所述像素单元10包括发光颜色不同的至少三个子像素组，每一子像素组包括至少两个子像素。所述子像素包括第一电极、位于所述第一电极上的发光结构块及位于所述发光结构块上的第二电极。
所述像素单元10中至少一个子像素组中相邻两个子像素(例如，同一行的相邻两个子像素111)的第一电极通过第一连接部101电连接、以及所述至少一个子像素组中两个子像素的第一电极通过环绕该像素单元10中其他子像素组的子像素侧部的第二连接部102电连接。所述第一连接部101与所述第二连接部102位于同一层。
由于像素单元10的子像素组中，用于连接两个子像素的第二连接部环绕其他子像素组的子像素侧部，因此通过第二连接部102电连接的两个第一电极可以是不相邻的两个子像素的第一电极，例如，位于不同行的两个子像素的第一电极。由于所述子像素组中， 相邻两个子像素的第一电极通过第一连接部电连接，不相邻的两个子像素的第一电极通过第二连接部电连接，可避免第一连接部与第二连接部交叉，例如，可避免与其他子像素组的连接部交叉，且可使得该子像素组中各个子像素的第一电极均电连接。
图1至图2所示的透明显示基板中，每一像素单元10包括四个子像素111、四个子像素121和四个子像素131，其中四个子像素111组成一个子像素组，四个子像素121组成一个子像素组，四个子像素131组成一个子像素组。图3和图4所示的透明显示基板中，每一像素单元10包括六个子像素111、六个子像素121和六个子像素131，其中六个子像素111组成一个子像素组，六个子像素121组成一个子像素组，六个子像素131组成一个子像素组。图5所示的透明显示基板中，每一像素单元10包括十个子像素111、十个子像素121和十个子像素131，其中十个子像素111组成一个子像素组，十个子像素121组成一个子像素组，十个子像素131组成一个子像素组。
图1至图5所示的显示基板中，同一子像素组中，相邻两个子像素111通过第一连接部101电连接，相邻两个子像素121通过第一连接部101电连接，相邻两个子像素131通过第一连接部101电连接。图1、图2和图3所示的透明显示基板中，连接两个子像素111的第二连接部102环绕子像素121和子像素131的侧部。图4和图5所示的显示基板中，连接两个子像素111的第二连接部102环绕子像素121和子像素131的侧部，连接两个子像素121的第二连接部102环绕子像素111和子像素131的侧部，连接两个子像素131的第二连接部102环绕子像素111和子像素121的侧部。
本申请实施例提供的透明显示基板中，像素单元10中至少一个子像素组相邻两个子像素的第一电极通过第一连接部101电连接，以及所述至少一个子像素组中两个子像素的第一电极通过环绕该像素单元10中其他子像素组的子像素侧部的第二连接部102电连接，可避免第一连接部101与第二连接部102相交，例如，可避免与其他子像素组的连接部相交，且可使得该子像素组中的各子像素电连接，因此该子像素组中的各子像素可由一个像素电路进行驱动，可减小透明显示基板中像素电路的数量，有效改善光线透射透明显示基板时的衍射叠加现象，提升设置在该透明显示基板的背光面的摄像头拍摄的图像质量，避免出现图像失真缺陷。由于同一子像素组的第一连接部101与第二连接部102设置在同一层，则第一连接部101与第二连接部102可在同一工艺步骤中形成，有利于降低制备工艺的复杂度。
所述第一连接部101与所述第二连接部102位于同一层。可以理解的是，为了使子像素能够正常工作，第一连接部101与第二连接部102不相交，例如，其他子像素组的 第一连接部与该子像素组的第二连接部不相交。
可选地，参见图1至图5，所述像素单元10中，至少一个子像素组包括沿第一方向排布的至少两个子组，每一所述子组包括至少两个沿第二方向间隔排布的子像素，第一方向与第二方向相交。同一所述子像素组的相邻两个子组之间设有其他子像素组的子组。同一所述子组中相邻两个所述子像素通过所述第一连接部101电连接。同一所述子像素组的相邻两个子组中，其中一个子组的一个第一电极与另一个子组的一个第一电极通过所述第二连接部102连接，所述第二连接部102环绕所述其他子像素组的子组的侧部。
本申请实施例中，同一子像素组的两个子组沿第一方向排布，指的是两个子组整体上大致沿第一方向排布。同一子组中至少两个子像素沿第二方向间隔排布，指的是子组的至少两个子像素大致沿第二方向排布，该至少两个子像素在第二方向上的中轴线可重合，也可以间隔一定的距离。
如此设置，同一子组中相邻两个子像素的第一电极通过第一连接部电连接，同一子像素组的至少两个子组中，相邻两个子组的子像素的第一电极通过第二连接部电连接，可使得像素单元10中每一子像素组的所有子像素的第一电极之间电性连接，且第一连接部与第二连接部位置合理，二者不会相交。
图1和图2所示的透明显示基板的像素单元10，子像素111组成的子像素组包括两个子组11，每一子组11包括两个子像素111。子像素121组成的子像素组包括一个子组12，子组12包括四个子像素121。子像素131组成的子像素组包括一个子组13，子组13包括四个子像素131。子组12和子组13位于两个子组11之间。同一子组11、12、13中，相邻两个子像素111、121、131的第一电极通过第一连接部101电连接。两个子组11中，其中一个子组11的一个第一电极通过第二连接部102与另一子组11的一个第一电极电连接，且该第二连接部102环绕子组12与子组13的侧部。
图4和图5所示的透明显示基板的像素单元10中，子像素111组成的子像素组包括两个子组11，子像素121组成的子像素组包括两个子组12，子像素131组成的子像素组包括两个子组13。两个子组11之间设有一个子组12和一个子组13，其中一个子组11的一个第一电极通过第二连接部102与另一子组11的一个第一电极电连接，且该第二连接部102环绕子组12与子组13的侧部。两个子组12之间设有一个子组11和一个子组13，其中一个子组12的一个第一电极通过第二连接部102与另一子组12的一个第一电极电连接，且该第二连接部102环绕子组11与子组13的侧部。两个子组13之间设有一个子组11和一个子组12，其中一个子组13的一个第一电极通过第二连接部102 与另一子组13的一个第一电极电连接，且该第二连接部102环绕子组11与子组12的侧部。
可选地，第一像素单元10包括三个发光颜色不同的子像素组，分别为第一颜色的子像素组、第二颜色的子像素组和第三颜色的子像素组。第一颜色的子像素组包括至少两个第一颜色的子像素121，第二颜色的子像素组包括至少两个第二颜色的子像素131，第三颜色的子像素组包括至少两个第三颜色的子像素111。
三个发光颜色不同的子像素组中子像素的排布及第二连接部的设置方式可有如下几种情况。下面将进行详细介绍。
第一种情况中，三个发光颜色不同的子像素组中，第一颜色的子像素组包括一个第一颜色的子组12，所述第二颜色的子像素组包括一个第二颜色的子组13，所述第三颜色的子像素组包括两个第三颜色的子组11。两个第三颜色的子组11之间设有所述第一颜色的子组12和所述第二颜色的子组13。所述像素单元10包括第一侧103及与所述第一侧103相对的第二侧104，所述第一侧103沿所述第二方向相对于所述第二侧104，或第一侧103和第二侧104为像素单元10的在平行于第一方向上的两个侧部。该情况下，第二连接部102的设置方式可包括如下两种。
第一种方式中，两个所述第三颜色的子组11中，其中一个子组11中邻近所述第一侧103的第一电极、与另一个子组11中邻近所述第一侧103的第一电极通过一个所述第二连接部102电连接；或者，其中一个子组11中邻近所述第二侧104的第一电极与另一个子组11中邻近所述第二侧104的第一电极通过一个所述第二连接部102电连接。同一子组中邻近第一侧103的第一电极与第一侧103之间的距离小于该子组中其他第一电极与第一侧103之间的距离，同一子组中邻近第二侧104的第一电极与第二侧104之间的距离小于该子组中其他第一电极与第二侧104之间的距离。
图2所示的像素单元10中，两个第三颜色的子组11中，其中一个子组11中邻近所述第二侧104的第一电极与另一个子组11中邻近所述第二侧104的第一电极通过一个所述第二连接部102电连接。当然，在其他实施例中，也可以是一个子组11中邻近第一侧103的第一电极与另一子组11中邻近第一侧103的第一电极通过一个所述第二连接部102电连接。
如此，同一子像素组中，相邻两个子组的第一电极通过一个第二连接部102电连接，则第二连接部102的数量最少；且两个子组中位于同一侧的第一电极电连接，可使得第 二连接部102的长度较短。因此，上述第二连接部的设置方式有助于提升透明显示基板的透明度，降低透明显示基板的结构复杂度，进而有助于降低外部光线透射透明显示面板时的衍射叠加现象。
第二种方式中，两个所述第三颜色的子组11中，其中一个子组11中邻近所述第一侧103的第一电极、与另一个子组11中邻近所述第一侧103的第一电极通过一个所述第二连接部102电连接；并且，其中一个子组11中邻近所述第二侧104的第一电极与另一个子组11中邻近所述第二侧104的第一电极通过一个所述第二连接部102电连接。
图1和图3所示的像素单元10中，两个第三颜色的子组11中，一个子组11中邻近第一侧103的第一电极与另一子组11中邻近第一侧103的第一电极通过一个所述第二连接部102电连接；并且，其中一个子组11中邻近所述第二侧104的第一电极与另一个子组11中邻近所述第二侧104的第一电极通过一个所述第二连接部102电连接。
如此，两个子组11的第一连接部101、第二连接部102及第一电极连接形成一个闭合的环，则该两个子组11所属的子像素组对应的像素电路与第一连接部、第二连接部或第一电极中的任一个电连接，都可以实现像素电路驱动该子像素组，使得子像素组与对应的像素电路的连接更灵活。
第二种情况中，第一颜色的子像素组包括两个第一颜色的子组12、第二颜色的子像素组包括两个第二颜色的子组13，第三颜色的子像素组包括两个第三颜色的子组11。相同颜色的两个子组之间设有其他两个颜色的子组，也即是，两个第三颜色的子组11之间设有第一颜色的子组12和第二颜色的子组13，两个第二颜色的子组13之间设有第一颜色的子组12和第三颜色的子组11，两个第一颜色的子组12之间设有第二颜色的子组13和第三颜色的子组11。像素单元10包括第一侧103及与所述第一侧103相对的第二侧104，所述第一侧103沿所述第一方向平行于所述第二侧104。
参见图4和图5，两个所述第一颜色的子组12中，其中一个子组12邻近所述第二侧104的第一电极、与另一个子组12中邻近所述第二侧104的第一电极通过第二连接部102电连接。两个所述第二颜色的子组13中，其中一个子组13中邻近所述第一侧103的第一电极、与另一子组13中邻近所述第一侧103的第一电极通过所述第二连接部102电连接。两个所述第三颜色的子组11中，其中一个子组11邻近所述第一侧103的第一电极、与另外一个子组11邻近所述第二侧104的第一电极通过所述第二连接部102电连接，且该第二连接部102穿过该子组11与该子组11相邻的子组13之间的区域。
如此设置，每一种颜色的子像素组包括的两个子组的第一电极可分别通过对应的第二连接部电连接，避免第二连接部之间的交叉。
可选地，参见图1至图4，所述像素单元10包括第一颜色的子像素组、第二颜色的子像素组和第三颜色的子像素组，所述第一颜色的子像素组包括两个以上第一颜色的子像素121，所述第二颜色的子像素组包括两个以上第二颜色的子像素131，所述第三颜色的子像素组包括两个以上第三颜色的子像素111。所述像素单元10包括多个子像素单元20，所述子像素单元20包括相邻设置的第一颜色的子像素121、第二颜色的子像素131与第三颜色的子像素111，所述子像素单元20中三个子像素111、121、131呈品字型排列。
所述子像素单元20包括第一区域21、第二区域22和第三区域23，所述第一区域21与第二区域22在所述第一方向上排列，所述第三区域23与所述第一区域21在所述第二方向上排列，第一区域21与第二区域22作为一个整体在第二方向上的中轴线与第三区域23在第二方向上的中轴线基本重合。其中，第一区域21与第二区域22作为一个整体在第二方向上的中轴线指的是，第一区域21与第二区域22在第一方向上距离最远的两侧沿第二方向的中线。
所述第一颜色的子像素121位于所述第一区域21，所述第二颜色的子像素131位于所述第二区域22，所述第三颜色的子像素111位于所述第三区域23。在所述第一方向上相邻的两个子像素单元20中，其中一个子像素单元20的所述第三区域22位于所述第一区域21的第三侧，另一个子像素单元20的所述第三区域23位于所述第一区域21的第四侧，所述第三侧与所述第四侧在第二方向上相对；在所述第二方向上间隔排布的多个子像素单元20的第三区域23位于第一区域21的同一侧。
如此设置，在第一方向或者第二方向上，第一颜色的子像素121、第二颜色的子像素131及第三颜色的子像素111呈均匀分布，可避免透明显示基板的某一区域内多个相同颜色的子像素相邻而使得显示时出现颜色分布不均匀，进而导致该区域出现单一颜色亮条的问题，可改善显示效果。并且，相同颜色的子像素分布比较均匀，从而制备子像素的发光结构采用的掩膜板开口排布比较规则，可减小掩膜板张网褶皱。
可选地，像素单元包括三种发光颜色不同的子像素组时，三种发光颜色可分别为红色、绿色和蓝色。第一颜色、第二颜色及第三颜色分别为上述三种颜色中的一种。例如，第一颜色为红色，第二颜色为绿色，第三颜色为蓝色；或者，第一颜色为红色，第二颜色为蓝色，第三颜色为绿色等。在其他实施例中，像素单元包括三种发光颜色的子像素 组时，三种颜色可以是其他颜色。在一些实施例中，像素单元可包括三种以上发光颜色的子像素组。
图1至图4所示的实施例中，为了使相邻的三种发光颜色不同的子像素呈品字形或三角形排列，一些子组中多个子像素在第二方向上呈错位排布，例如子组12和子组13中的相邻两个子像素在第二方向上呈错位排布，也即是相邻两个子像素在第二方向上的中轴线不重合。
在另一个实施例中，同一所述第一像素单元10中的多个子像素组包括的子组中，各子组中的至少两个子像素在第二方向上并列排布，也即是在第二方向上的中轴线大致重合。参见图5，第一像素单元10中，第一颜色的子像素组包括两个子组12，每一子组12包括的多个第一颜色的子像素121在第二方向上并列排布。第二颜色的子像素组包括两个子组13，每一子组13包括的多个第二颜色的子像素131在第二方向上并列排布，也即是在第二方向上的中轴线大致重合。第三颜色的子像素组包括两个子组11，每一子组11包括的多个第三颜色的子像素111在第二方向上并列排布，也即是在第二方向上的中轴线大致重合。在其他实施例中，各子像素组中子像素的排布方式及第二连接部的设置方式可不同于图1至图5所示的方式。
可选地，第一方向与第二方向可互相垂直。其中，第一方向可为行方向，第二方向可为列方向。或者，第一方向可为列方向，第二方向可为行方向。图中仅以第一方向为列方向，第二方向为行方向为例进行说明，其他情况不再进行图示。
可选地，参见图6至图8，透明显示基板包括衬底41，像素单元10的多个子像素111、121、131位于衬底41上。多个子像素111、121、131的第一电极31可为阳极，第二电极可为阴极，阴极可为连成一片的面电极。第一连接部101、第二连接部102与第一电极31的设置方式可有如下几种。
第一个实施例中，如图6所示，像素单元10的所述第一连接部101、所述第二连接部102及子像素111、121、131的第一电极31位于同一层。
进一步地，第一连接部101与第二连接部102在垂直于其延伸方向上的尺寸可大于3μm，且小于第一电极31的最大尺寸的二分之一。例如，第一连接部在垂直于其延伸方向上的尺寸为在沿第一方向和第二方向延伸的平面上的尺寸；第二连接部在垂直于其延伸方向上的尺寸为在沿第一方向和第二方向延伸的平面上的尺寸。通过设置第一连接部101与第二连接部102在垂直于其延伸方向的尺寸大于3μm，可使得第一连接部101 与第二连接部102的电阻较小；通过设置第一连接部101与第二连接部102的尺寸小于第一电极31的最大尺寸的二分之一，则第一连接部101与第二连接部102的设置对第一电极31的尺寸影响较小，避免第一连接部101与第二连接部102的尺寸较大导致第一电极31的尺寸减小，进而导致透明显示基板的有效发光面积减小。
在一个示例性实施例中，所述第一连接部101、所述第二连接部102与所述第一电极31的材料相同，则第一连接部101、第二连接部102与第一电极31可在同一工艺步骤中形成，可简化制备工艺。
在另一个示例性实施例中，所述第一连接部101与所述第二连接部102的材料相同，则第一连接部101与第二连接部102可在同一工艺步骤中形成；所述第一连接部101与所述第一电极31的材料不同，则第一连接部101与第一电极31可在不同工艺步骤中形成。
第二个实施例中，如图7所示，所述第一连接部101与所述第二连接部102位于所述第一电极31下方，所述第一连接部101及所述第二连接部102分别与所述第一电极31直接接触。第一连接部101包括位于第一电极31下方的接触部1012及用于连接相邻两个接触部1012之间的走线1011。如此设置，第一连接部101和第二连接部102两者与第一电极31位于不同层，则第一连接部101与第二连接部102的设置不受第一电极31的影响，走线方式更灵活；并且第一电极31的尺寸可不受第一连接部101与第二连接部102的影响，从而可将第一电极31的尺寸做得较大，进而使透明显示基板的有效发光面积较大。第一连接部101及第二连接部102与第一电极31直接接触，则第一连接部101及第二连接部102与第一电极31直接电连接，结构更简单。
第三个实施例中，如图8所示，所述第一连接部101与所述第二连接部102位于所述第一电极31下方，所述第一连接部101与所述第一电极31之间设置有绝缘层42，所述第一电极31通过所述绝缘层42上的通孔51与所述第一连接部101及所述第二连接部102连接。绝缘层42的通孔51内填充有导电材料，该导电材料可与第一电极31同时形成。第一电极31通过其下方的通孔51内的导电材料与其对应的第一连接部101或第二连接部102电连接。如此设置，第一连接部101和第二连接部102两者与第一电极31位于不同层，则第一连接部101与第二连接部102的设置不受第一电极31的影响，走线方式更灵活。并且第一电极31的尺寸可不受第一连接部101与第二连接部102的影响，从而可将第一电极31的尺寸做得较大，进而使透明显示基板的有效发光面积较大。
可选地，所述第一电极31在衬底上的投影可包括一个第一图形单元或者多个相连的第一图形单元。其中，所述第一图形单元包括圆形、椭圆形、哑铃形、葫芦形或矩形。其中，哑铃形指的是两个圆与在两个圆之间的、间距小于所述两个圆直径的两条平行直线连接形成的图案的形状，葫芦形指的是两个圆直接连接形成的图案的形状。所述第一图形单元为圆形、椭圆形、哑铃形及葫芦形时，上述形状可改变衍射产生的周期性结构，即改变了衍射场的分布，从而减弱外部入射光通过透明显示基板时产生的衍射效应，进而确保透明显示基板下方设置的摄像头拍照得到的图像具有较高的清晰度。
可选地，透明显示基板中设置在第一电极31上的发光结构块在所述衬底上的投影可包括一个第二图形单元或者多个相连的第二图形单元组成，所述第二图形单元与所述第一图形单元可相同或不同。优选的，所述第一电极31上对应设置的发光结构块在所述衬底上的投影与第一电极31在所述衬底上的投影不同，以进一步减弱光线通过透明显示基板时产生的衍射效应。
可选地，所述第二图形单元可包括圆形、椭圆形、哑铃形、葫芦形或矩形。所述第二图形单元为圆形、椭圆形、哑铃形及葫芦形时，上述形状可改变衍射产生的周期性结构，即改变了衍射场的分布，从而进一步减弱外部入射光通过透明显示基板时产生的衍射效应，进一步确保透明显示基板下方设置的摄像头拍照得到的图像具有较高的清晰度。
为了提高透明显示基板的光透过率，透明显示基板的各层材料均可采用透明材料。如此可提高透明显示基板下方设置的感光器件例如摄像头的采光效果。
可选地，所述第一电极和/或所述第二电极的材料均为透明材料。
进一步地，制备所述第一电极和/或所述第二电极的透明材料的透光率大于或等于70％。优选的，该透明材料的透光率大于或等于90％，例如该透明材料的透光率可以为90％、95％等。如此设置可使得透明显示基板的透光率较大，进而使得透明显示基板的透光率满足其下方设置的感光器件的采光需求。
进一步地，制备所述第一电极和/或所述第二电极的透明材料包括氧化铟锡、氧化铟锌、掺杂银的氧化铟锡或者掺杂银的氧化铟锌中的至少一种。优选的，制备所述第一电极和/或所述第二电极的透明材料采用掺杂银的氧化铟锡或者掺杂银的氧化铟锌，以在保证透明显示基板的高透光率的基础上，减小第一电极和/或所述第二电极的电阻。
可选地，所述第一连接部101和/或所述第二连接部102的透光率大于70％。优选的，第一连接部101和/或第二连接部102的透光率大于或等于90％，例如该透明材料的透 光率可以为90％、95％等。如此设置可使得透明显示基板的透光率较大。
进一步地，所述第一连接部101和/或所述第二连接部102的材料包括氧化铟锡、氧化铟锌、掺杂银的氧化铟锡或者掺杂银的氧化铟锌中的至少一种。优选的，制备所述第一连接部101和/或第二连接部102的透明材料采用掺杂银的氧化铟锡或者掺杂银的氧化铟锌，以在保证透明显示基板的高透光率的基础上，减小第一连接部101和/或第二连接部102的电阻。
本申请实施例还提供了一种透明显示面板，所述透明显示面板包括上述的透明显示基板及设置在透明显示基板上的封装层，封装层设置在透明显示基板的背离衬底的一侧。
其中，封装层可以是薄膜封装结构，薄膜封装结构可包括有机材料层和无机材料层交替叠加的叠层，其中有机材料层和无机材料层均为透明材料，无机材料层的材料例如可以是SiO 2、SiNx以及Al 2O 3等，有机材料层的材料例如可以是PI、PET等。封装层也可以是玻璃盖板或者是玻璃粉封装结构。
本申请实施例还提供了一种显示装置，参见图9，所述显示装置100包括第一显示区110及第二显示区120，所述第一显示区110和第二显示区120内设置有上述的透明显示基板。第一显示区110为透明显示区。所述第二显示区120为透明显示区或非透明显示区，第一显示区110的透光率大于第二显示区120的透光率，所述第一显示区110下方可设置感光器件。
可选地，用于驱动透明显示基板的子像素组的像素电路设置在第二显示区。如此设置，有助于提升第一显示区的透光率，降低第一显示区的结构复杂度，进而降低外部光线通过第一显示区时产生的衍射效应。
所述显示装置可包括至少覆盖所述第二显示区120的封装层。封装层可覆盖第一显示区110和第二显示区120，或者封装层覆盖第二显示区120，未覆盖第一显示区110。封装层可以是薄膜封装结构，也可以是玻璃盖板或者是玻璃粉封装结构。
所述显示装置还可包括设备本体。设备本体具有器件区，所述器件区位于第一显示区下方，且所述器件区中设置有采集透过所述第一显示区的光线的感光器件。
其中，所述感光器件可包括摄像头和/或光线感应器。器件区中还可设置除感光器件的其他器件，例如陀螺仪或听筒等器件。器件区可以是开槽区，第一显示区可对应于开槽区贴合设置，以使得感光器件能够发射或者采集透过该第一显示区的光线。
本申请并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其 范围进行各种修改和改变。本申请的范围仅由所附的权利要求来限制。

Claims (14)

  1. 一种透明显示基板，包括：
    多个像素单元，每个所述像素单元包括发光颜色不同的至少三个子像素组，每一子像素组包括至少两个子像素，每个所述子像素包括：
    第一电极；
    发光结构块，位于所述第一电极上；以及
    第二电极，位于所述发光结构块上；
    其中所述至少三个子像素组中的至少一个子像素组中相邻两个子像素的第一电极通过第一连接部电连接，且所述至少一个子像素组中不相邻两个子像素的第一电极通过环绕该像素单元中其他子像素组的子像素侧部的第二连接部电连接，所述第一连接部与所述第二连接部位于同一层。
  2. 根据权利要求1所述的透明显示基板，其中，所述第一连接部、所述第二连接部及所述第一电极位于同一层，
    所述第一连接部、所述第二连接部与所述第一电极的材料相同；或者
    所述第一连接部与所述第二连接部的材料相同，所述第一连接部与所述第一电极的材料不同。
  3. 根据权利要求2所述的透明显示基板，其中，所述第一连接部在垂直于所述第一连接部的延伸方向上的尺寸、以及所述第二连接部在垂直于所述第二连接部的延伸方向上的尺寸大于3μm，且小于所述第一电极的最大尺寸的二分之一。
  4. 根据权利要求1所述的透明显示基板，其中，所述第一连接部与所述第二连接部位于所述第一电极下方，所述第一连接部及所述第二连接部均与所述第一电极直接接触。
  5. 根据权利要求1所述的透明显示基板，其中，所述第一连接部与所述第二连接部位于所述第一电极下方，所述第一连接部与所述第一电极之间设置有绝缘层，所述第一电极通过所述绝缘层上的通孔与所述第一连接部及所述第二连接部电连接。
  6. 根据权利要求1所述的透明显示基板，其中，所述第一连接部和/或所述第二连接部的透光率大于70％。
  7. 根据权利要求6所述的透明显示基板，其中，所述第一连接部和/或所述第二连接部的材料包括氧化铟锡、氧化铟锌、掺杂银的氧化铟锡或者掺杂银的氧化铟锌中的至少一种。
  8. 根据权利要求1所述的透明显示基板，其中，每个所述像素单元中，所述至少 一个子像素组包括沿第一方向排布的至少两个子组，每一所述子组包括至少两个沿第二方向间隔排布的子像素，同一所述子像素组的相邻两个子组之间设有其他子像素组的子组，所述第一方向与所述第二方向相交；
    同一所述子组中相邻两个所述子像素通过所述第一连接部电连接，同一所述子像素组的相邻两个子组中，其中一个子组的一个第一电极与另一个子组的一个第一电极通过所述第二连接部连接，所述第二连接部环绕所述其他子像素组的子组的侧部。
  9. 根据权利要求8所述的透明显示基板，其中，每个所述像素单元包括发光颜色为第一颜色的子像素组、发光颜色为第二颜色的子像素组和发光颜色为第三颜色的子像素组，所述第一颜色的子像素组包括一个第一颜色的子组，所述第二颜色的子像素组包括一个第二颜色的子组，所述第三颜色的子像素组包括两个第三颜色的子组，所述两个第三颜色的子组之间设有所述第一颜色的子组和所述第二颜色的子组，每个所述像素单元包括第一侧及与所述第一侧相对的第二侧，所述第一侧沿所述第一方向平行于所述第二侧；
    所述两个第三颜色的子组中，其中一个子组中邻近所述第一侧的所述子像素的第一电极、与另一个子组中邻近所述第一侧的所述子像素的第一电极通过一个所述第二连接部电连接；和/或，其中一个子组中邻近所述第二侧的所述子像素的第一电极与另一个子组中邻近所述第二侧的所述子像素的第一电极通过一个所述第二连接部电连接。
  10. 根据权利要求8所述的透明显示基板，其中，每个所述像素单元包括发光颜色为第一颜色的子像素组、发光颜色为第二颜色的子像素组和发光颜色为第三颜色的子像素组，所述第一颜色的子像素组包括两个第一颜色的子组，所述第二颜色的子像素组包括两个第二颜色的子组，所述第三颜色的子像素组包括两个第三颜色的子组，相同颜色的两个子组之间设有其他两个颜色的子组，每个所述像素单元包括第一侧及与所述第一侧相对的第二侧，所述第一侧沿所述第一方向平行于所述第二侧；
    所述两个第一颜色的子组中，其中一个子组中邻近所述第二侧的所述子像素的第一电极、与另一个子组中邻近所述第二侧的所述子像素的第一电极通过所述第二连接部电连接，所述两个第二颜色的子组中，其中一个子组中邻近所述第一侧的所述子像素的第一电极、与另一子组中邻近所述第一侧的所述子像素的第一电极通过所述第二连接部电连接，所述两个第三颜色的子组中，其中一个子组邻近所述第一侧的所述子像素的第一电极、与另外一个子组邻近所述第二侧的所述子像素的第一电极通过所述第二连接部电连接。
  11. 根据权利要求8所述的透明显示基板，其中，每个所述像素单元包括发光颜色 为第一颜色的子像素组、发光颜色为第二颜色的子像素组和发光颜色为第三颜色的子像素组，所述第一颜色的子像素组包括两个以上第一颜色的子像素，所述第二颜色的子像素组包括两个以上第二颜色的子像素，所述第三颜色的子像素组包括两个以上第三颜色的子像素，每个所述像素单元包括多个子像素单元，每个所述子像素单元包括相邻设置的第一颜色的子像素、第二颜色的子像素与第三颜色的子像素，每个所述子像素单元中所述第一颜色的子像素、所述第二颜色的子像素和所述第三颜色的子像素呈品字型排列；
    每个所述子像素单元包括第一区域、第二区域和第三区域，所述第一区域与第二区域在所述第一方向上排列，所述第三区域与所述第一区域在所述第二方向上排列，所述第一区域与所述第二区域作为一个整体在所述第二方向上的中轴线与所述第三区域在所述第二方向上的中轴线基本重合，所述第一颜色的子像素位于所述第一区域，所述第二颜色的子像素位于所述第二区域，所述第三颜色的子像素位于所述第三区域；
    在所述第一方向上相邻的两个子像素单元中，其中一个子像素单元的所述第三区域位于所述第一区域的第三侧，另一个子像素单元的所述第三区域位于所述第一区域的第四侧，所述第三侧与所述第四侧在所述第一方向上相对，在所述第二方向上间隔排布的多个子像素单元的第三区域位于第一区域的同一侧。
  12. 一种透明显示面板，包括：
    如权利要求1-11任一项所述的透明显示基板；以及
    封装层，设置在所述透明显示基板上。
  13. 一种显示装置，包括：
    第一显示区，所述第一显示区为透明显示区，且所述第一显示区下方设置感光器件；以及
    第二显示区，所述第二显示区为透明显示区或非透明显示区；
    其中所述第一显示区和所述第二显示区内设置有权利要求1-11任一项所述的透明显示基板。
  14. 根据权利要求13所述的显示装置，其中，所述透明显示基板的子像素组的像素电路设置在所述第二显示区。
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CN110783386B (zh) * 2019-10-29 2020-12-25 昆山国显光电有限公司 显示面板及显示装置
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