WO2021057052A1 - 一种电子组件及终端设备 - Google Patents

一种电子组件及终端设备 Download PDF

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Publication number
WO2021057052A1
WO2021057052A1 PCT/CN2020/091730 CN2020091730W WO2021057052A1 WO 2021057052 A1 WO2021057052 A1 WO 2021057052A1 CN 2020091730 W CN2020091730 W CN 2020091730W WO 2021057052 A1 WO2021057052 A1 WO 2021057052A1
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WIPO (PCT)
Prior art keywords
housing
electronic component
hole
electromagnetic module
component according
Prior art date
Application number
PCT/CN2020/091730
Other languages
English (en)
French (fr)
Inventor
黄竹邻
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Priority to EP20868063.7A priority Critical patent/EP3986102B1/en
Priority to JP2021574992A priority patent/JP7319398B2/ja
Priority to US17/626,856 priority patent/US20220295664A1/en
Publication of WO2021057052A1 publication Critical patent/WO2021057052A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W4/00—Services specially adapted for wireless communication networks; Facilities therefor
    • H04W4/80—Services using short range communication, e.g. near-field communication [NFC], radio-frequency identification [RFID] or low energy communication
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0086—Casings, cabinets or drawers for electric apparatus portable, e.g. battery operated apparatus
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
    • H04B5/70—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes
    • H04B5/72—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes for local intradevice communication
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/04—Details of telephonic subscriber devices including near field communication means, e.g. RFID

Definitions

  • the embodiments of the present application relate to the technical field of electronic devices, and in particular to an electronic component and a terminal device having the electronic component.
  • NFC near field communication
  • the power consumption of the terminal equipment is also increasing.
  • the temperature of the local position of the housing of the terminal equipment is often too high, which affects the user experience.
  • thermal conductive materials such as graphite sheets and copper foil are usually attached to the shell, and the good thermal conductivity of the thermal conductive material is used to disperse the heat from the higher temperature position on the shell to other areas of the shell. Achieve uniform temperature effect.
  • materials such as graphite sheet and copper foil can conduct heat well, they have a shielding effect on the electromagnetic transmission of NFC communication modules. Therefore, the design of terminal equipment cannot take into account both temperature uniformity and electromagnetic transmission performance, which has become a major problem in the development of electronic technology.
  • the purpose of the embodiments of the present application is to provide an electronic component and a terminal device.
  • the embodiment of the present application provides an electronic component, which includes an electromagnetic module, a housing provided on one side of the electromagnetic module, and also includes a heat conductive sheet provided on the housing, and the heat conductive sheet is provided with a corresponding
  • the through hole of the electromagnetic module penetrates the heat conduction sheet in the thickness direction and connects the through hole and the slot on the edge of the heat conduction sheet.
  • the embodiment of the present application also provides a terminal device, including a battery and the aforementioned electronic components, the battery is electrically connected to the electromagnetic module, and the casing is arranged above the battery.
  • Fig. 1 is a schematic diagram of a three-dimensional structure of an electronic component according to a first embodiment of the present application
  • FIG. 2 is a schematic diagram of the structure of a thermal conductive sheet of an electronic component according to the first embodiment of the present application
  • Fig. 3 is a schematic diagram showing that the coil shown in Fig. 1 is completely covered by a heat conducting sheet without a through hole;
  • FIG. 4 is a schematic diagram of the coil shown in FIG. 1 being completely covered by a heat conducting sheet with through holes;
  • Fig. 5 is a schematic diagram showing that the coil shown in Fig. 1 is completely covered by a heat conducting sheet with a through hole;
  • FIG. 6 is a schematic diagram of a three-dimensional structure of an electronic component according to a second embodiment of the present application.
  • FIG. 7 is a schematic diagram of a three-dimensional structure of an electronic component according to a third embodiment of the present application.
  • Fig. 8 is a structural composition block diagram of a terminal device according to the fourth embodiment of the present application.
  • the first embodiment of the present application relates to an electronic component 10, as shown in FIG. 1.
  • the core of this embodiment is that the electronic component 10 includes an electromagnetic module 11, a housing 12 arranged on one side of the electromagnetic module 11, and also includes a heat conductive sheet 13 arranged on the housing 12, and the heat conductive sheet 13 A through hole 130 corresponding to the electromagnetic module 11 is provided, and a slot 131 that penetrates the heat conduction sheet 13 in the thickness direction of the heat conduction sheet 13 and connects the through hole 130 and the edge of the heat conduction sheet 13.
  • the heat conductive sheet 13 provided on the housing 12 has a front surface adjacent to the housing 12 and a back surface facing the front surface and relatively away from the housing 12, and the so-called "pass through in the thickness direction of the heat conductive sheet 13
  • the heat-conducting sheet 13" means that the slot 131 connects the front and back surfaces of the heat-conducting sheet 13.
  • This kind of electronic component is provided with through holes corresponding to the electromagnetic module on the heat conduction sheet, and slots connecting the through holes and the edge of the heat conduction sheet, destroying the integrity of the heat conduction sheet, so that the electromagnetic energy generated by the electromagnetic module can follow the through hole and the slot
  • the edges are gathered to form a strong electromagnetic effect to ensure electromagnetic transmission performance; in addition, the heat conduction sheet after opening the through hole and the slot can still cover a large area of the shell, thereby dispersing the heat from the higher temperature position on the shell to In most areas of the shell, a better temperature uniformity effect is achieved, so that both temperature uniformity and electromagnetic transmission performance are taken into consideration.
  • the electronic component 10 in this embodiment includes an electromagnetic module 11, a housing 12, and a heat conductive sheet 13 arranged on a frame 14.
  • the frame 14 is usually the middle frame of electronic equipment (such as mobile phones, computers, tablets, etc.).
  • the frame 14 is provided with processors, controllers, circuit boards and other devices.
  • the electronic modules 11 located on the frame 14 can pass through the circuit boards. Connect with controller, processor, etc.
  • the electromagnetic module 11 is used to emit electromagnetic energy, so as to realize the non-contact radio frequency identification function of the electronic component 10.
  • the electromagnetic module 11 includes a loop coil 110 for generating an electromagnetic field to realize near field communication, that is, an NFC coil.
  • NFC coils have different shapes and specifications. The shape can be round, rectangular, etc., and the enclosed area is usually 400 square millimeters to 1000 square millimeters. In the actual production process, it can be designed according to different structures and parameters. The shape and specifications of the coil 110 need to be flexibly selected without any specific restrictions.
  • the coil 110 shown in FIG. 1 is rectangular.
  • the housing 12 covers and protects the electromagnetic module 11, and the material of the housing 12 can be plastic, resin, metal, or the like.
  • the casing 12 is a metal casing.
  • the housing 12 has an inner surface 120 facing the electromagnetic module 11 and an outer surface 121 facing away from the electromagnetic module 11 and opposite to the inner surface 120.
  • the thermal conductive sheet 13 is arranged on the inner surface 120 of the casing 12. Since in the general electronic component structure, the inner surface 120 of the casing 12 is adjacent to heating units such as batteries and electronic components. Such arrangement makes the thermal conductive sheet 13 closer to the heat source. , It is beneficial to receive heat more directly and quickly disperse it to various positions of the housing 12. It should be noted that the heat conducting sheet 13 can be arranged on the housing 12 in a variety of ways, for example: attached to the inner surface 120, or fixed on the inner surface 120 by a buckle structure, etc., as long as the heat conducting sheet 13 can be fixed. On the housing 12, it does not fall off easily.
  • the heat conductive sheet 13 may be graphite sheet or copper foil, etc., which has good thermal conductivity. In this way, it can receive heat and quickly conduct the received heat to various positions of the housing 12 to achieve a temperature equalization effect.
  • the thermal conductive sheet 13 is provided with a through hole 130 corresponding to the electromagnetic module 11 and a slot 131 connecting the through hole 130 and the edge of the thermal conductive sheet 13, and the slot 131 penetrates the thermal conductive sheet 13 in the thickness direction.
  • the through hole 130 and the slot 131 destroy the integrity of the heat conducting sheet 13
  • the electromagnetic energy generated by the coil 110 can be gathered along the edges of the through hole 130 and the slot 131 to form a strong electromagnetic effect, thereby ensuring the electromagnetic transmission performance Not affected.
  • the heat conduction sheet 13 after opening the through hole 130 and the slot 131 can still cover a larger area of the housing 12, thereby dispersing the heat from the higher temperature position on the housing 12 to most other areas of the housing 12 to achieve Better temperature uniformity effect, taking into account both temperature uniformity and electromagnetic transmission performance.
  • the shape of the through hole 130 may be square, round, oval, and so on.
  • the through hole 130 is circular. Compared with through holes of elliptical, polygonal or other shapes, cutting a circular through hole on the thermal conductive sheet 13 can avoid the conductive sheet from breaking due to excessive stress. Improve the life and reliability of the conductive sheet. It should be noted that the larger the size of the through hole 130, the better the electromagnetic transmission performance, but the temperature uniformity effect will be correspondingly worse. Therefore, the size of the through hole 130 can be based on the size of the electronic component 10, the requirements of electromagnetic transmission performance, And the requirements of the uniform temperature effect are set appropriately. In one embodiment, the diameter of the through hole 130 is 15 mm-25 mm. In one embodiment, the diameter of the through hole is 20 mm.
  • the geometric center of the through hole 130 and the geometric center of the coil 110 are directly opposite to each other, that is, the orthographic projection of the geometric center of the through hole 130 on the housing 12 and the geometric center of the coil 110 are on the housing 12
  • the orthographic projections on are coincident with each other.
  • the through hole 130 can face the center of the electromagnetic field generated by the coil 110, so that the intensity of the electromagnetic field gathered at the edge of the through hole 130 is more uniform, and the electromagnetic transmission performance is improved.
  • the coil 110 has an outer edge 1101 and an inner edge 1102.
  • the orthographic projection of the through hole 130 on the housing 12 falls within the orthographic projection of the inner edge 1101 of the coil 110 on the housing 12, for example, as shown in FIG.
  • This arrangement can ensure that the size (area) of the through hole 130 is smaller than the size of the coil 110 (the area enclosed by the outer edge of the coil). Under the premise of ensuring that the electromagnetic transmission performance is not greatly affected, the thermal conductive sheet 13 is retained as much as possible. (The smaller the through hole 130 is, the larger the area of the heat conducting sheet 13), which will achieve a better temperature uniformity effect.
  • the coil 110 has an outer edge 1101 and an inner edge 1102.
  • the orthographic projection of the inner edge 1102 of the coil 110 on the housing 12 is tangent to the orthographic projection of the edge of the through hole 130 on the housing, that is, the inner edge 1102 of the coil 110 is on the housing 12
  • the orthographic projection on 12 and the orthographic projection of the edge of the through hole 130 on the housing 12 are inscribed, for example, as shown in FIG. 5. In the case of internal cutting of the two, the balance between electromagnetic transmission performance and temperature equalization effect can be better considered.
  • the area of the thermal conductive sheet 13 is large enough to cover the entire coil 110, that is, the orthographic projection of the outer edge 1101 of the coil 110 on the housing 12 falls into the thermal conductive sheet 13 on the housing 12 Within the orthographic projection, such as shown in Figure 4 or Figure 5.
  • the housing 12 covers the electromagnetic module 11 with the coil 110, the heat conducting sheet 13 provided on the inner surface 120 of the housing 12 will also cover the coil 110.
  • the attenuation of the NFC electromagnetic field signal generated by the coil 110 is related to the size of the area covered by the coil 110 by the thermal conductive sheet 13: when the thermal conductive sheet 13 covering the entire coil 110 without the through hole 130 as shown in FIG. 3 is used, The performance index of NFC has basically dropped to 0; after adopting the thermal conductive sheet 13 that covers the entire coil 110 and has a through hole 130 as shown in FIG. 4 or FIG.
  • the existence of the through hole 130 can allow electromagnetic energy to pass through, so that the NFC
  • the electromagnetic field energy of the electromagnetic field and the electromagnetic field coupling capability of the external NFC device are instantly enhanced, and the working state of the NFC is equivalent to that before the thermal conductive sheet 13 is not present.
  • the second embodiment of the present application relates to another electronic component 20.
  • the electronic component 20 provided by the second embodiment is substantially the same as the electronic component 10 provided by the first embodiment.
  • the electronic component 20 provided by the second embodiment is substantially the same as the electronic component 10 provided by the first embodiment. It also includes an electromagnetic module 11, a housing 12, and a heat conductive sheet 13. The difference is that the heat conducting sheet 13 (shown in dashed lines) of the second embodiment is embedded in the housing 12 and located between the inner surface 120 and the outer surface 121.
  • the embedded heat conducting sheet 13 can increase the strength of the casing 12, improve the compression resistance and bending resistance of the casing 12, and thereby increase the service life.
  • the third embodiment of the present application relates to another electronic component 30.
  • the electronic component 30 provided by the third embodiment is substantially the same as the electronic component 10 provided by the first embodiment.
  • the electronic component 30 provided by the third embodiment is substantially the same as the electronic component 10 provided by the first embodiment. It also includes an electromagnetic module 11, a housing 12, and a heat conductive sheet 13. The difference is that a part of the heat conductive sheet 13 of the third embodiment is embedded in the housing 12 and is located between the inner surface 120 and the outer surface 121, and another part of the heat conductive sheet 13 leaks out of the inner surface 120 and is located in the electromagnetic module. 11 and the inner surface 120.
  • the embedded heat conducting sheet 13 can increase the strength of the casing 12, improve the compression resistance and bending resistance of the casing 12, and thereby increase the service life.
  • the fourth embodiment of the present application also relates to a terminal device 40 as shown in FIG. 8, which includes a battery 41 and an electronic component 10 as described in the foregoing first embodiment or an electronic component as described in the foregoing second embodiment.
  • the component 20 or the electronic component 30 as described in the foregoing third embodiment, the battery 41 is electrically connected to the electromagnetic module 11, and the electronic component 10 or the electronic component 20 or the electronic component 30 is a housing cover It is arranged above the battery 31.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Signal Processing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Near-Field Transmission Systems (AREA)
  • Telephone Set Structure (AREA)

Abstract

本申请实施例涉及电子设备技术领域，公开了一种电子组件(10)，包括电磁模块(11)、设置在所述电磁模块(11)一侧的壳体(12)，还包括设置在所述壳体(12)上的热传导片(13)，所述热传导片(13)上开设有对应所述电磁模块(11)的通孔(130)、在厚度方向上贯穿所述热传导片(13)并连通所述通孔(130)与所述热传导片(13)边缘的开槽(131)。本申请还提供一种具有前述电子组件的终端设备。

Description

一种电子组件及终端设备
交叉引用
本申请引用于2019年09月25日递交的名称为“一种电子组件及终端设备”的第201910910791.4号中国专利申请，其通过引用被全部并入本申请。
技术领域
本申请实施例涉及电子设备技术领域，特别涉及一种电子组件以及具有该种电子组件的终端设备。
背景技术
随着电子技术的不断发展，各种终端设备集成的功能越来越多，作为无线通信的常用技术，近场通信(NFC)逐渐普及在市场上的各类终端设备中，集成在终端设备中的NFC通信模块，通过电磁场耦合实现电子设备之间的非接触式点对点数据传输。
然而，随着各种技术及功能的应用，终端设备的功耗也越来越大，在使用过程中，经常会出现终端设备壳体的局部位置温度过高，从而影响用户的使用体验。为了避免终端设备壳体的局部过热，通常在壳体上贴附石墨片、铜箔等热传导材料，利用热传导材料的良好导热性能将壳体上温度较高位置的热量分散到壳体其他区域，达到均温效果。虽然石墨片、铜箔等材料能够良好导热，但其对NFC通信模块的电磁传输有屏蔽作用，如此以来，终端设备的设计无法 兼顾均温与电磁传输性能，成为电子技术发展的一大难题。
发明内容
本申请实施方式的目的在于提供一种电子组件及终端设备。
本申请的实施方式提供了一种电子组件，包括电磁模块、设置在所述电磁模块一侧的壳体，还包括设置在所述壳体上的热传导片，所述热传导片上开设有对应所述电磁模块的通孔、在厚度方向上贯穿所述热传导片并连通所述通孔与所述热传导片边缘的开槽。
本申请的实施方式还提供了一种终端设备，包括电池、以及前述电子组件，所述电池与所述电磁模块电连接，所述壳体罩设在所述电池上方。
附图说明
一个或多个实施例通过与之对应的附图中的图片进行示例性说明，这些示例性说明并不构成对实施例的限定，附图中具有相同参考数字标号的元件表示为类似的元件，除非有特别申明，附图中的图不构成比例限制。
图1是根据本申请第一实施方式的电子组件的立体结构示意图；
图2是根据本申请第一实施方式的电子组件的热传导片结构示意图；
图3是图1所示线圈被没有通孔的热传导片全部覆盖的示意图；
图4是图1所示线圈被具有通孔的热传导片全部覆盖的示意图；
图5是图1所示线圈被具有通孔的热传导片全部覆盖的示意图；
图6是根据本申请第二实施方式的电子组件的立体结构示意图；
图7是根据本申请第三实施方式的电子组件的立体结构示意图；
图8根据本申请第四实施方式的终端设备的结构组成框图。
具体实施方式
为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合附图对本申请的各实施方式进行详细的阐述。然而，本领域的普通技术人员可以理解，在本申请各实施方式中，为了使读者更好地理解本申请而提出了许多技术细节。但是，即使没有这些技术细节和基于以下各实施方式的种种变化和修改，也可以实现本申请所要求保护的技术方案。
本申请的第一实施方式涉及一种电子组件10，如图1所示。本实施方式的核心在于，电子组件10包括电磁模块11、设置在所述电磁模块11一侧的壳体12，还包括设置在所述壳体12上的热传导片13，所述热传导片13上开设有对应所述电磁模块11的通孔130、在所述热传导片13的厚度方向上贯穿所述热传导片13并连通所述通孔130与所述热传导片13边缘的开槽131。在此，设置在壳体12上的热传导片13具有邻近壳体12的正面和与该正面正对、并相对远离壳体12的背面，而所谓“在所述热传导片13的厚度方向上贯穿所述热传导片13”是指所述开槽131连通热传导片13的正面和背面。
该种电子组件在热传导片上设置对应电磁模块的通孔、以及连通通孔与热传导片边缘的开槽，破坏热传导片的整体性，使得电磁模块产生的电磁能量能够沿着通孔及开槽的边缘聚集、形成较强的电磁效应，确保电磁传输性能；另外，开设通孔及开槽后的热传导片仍能覆盖壳体的较大面积，从而将壳体上温度较高位置的热量分散到壳体的大部分区域，达到较好的均温效果，从而兼顾均温与电磁传输性能。
下面对本实施方式的非接触式检测装置的实现细节进行具体的说明，以下内容仅为方便理解提供的实现细节，并非实施本方案的必须。
参见图1，本实施方式中的电子组件10，包括设置在框体14上的电磁模块11、壳体12、热传导片13。框体14通常为电子设备(如手机、电脑、平板等)的中框，框体14上设置有处理器、控制器、电路板等器件，位于框体14上的电子模块11可以通过电路板与控制器、处理器等相连。
所述电磁模块11用于发出电磁能量，从而实现电子组件10的非接触式射频识别功能。本实施方式中，所述电磁模块11包括用于产生电磁场、以实现近场通信的环形线圈110，也即NFC线圈。通常，NFC线圈具有不同的形状和规格，其形状可以为圆形、矩形等，其围成的面积通常为400平方毫米～1000平方毫米，在实际生产过程中，可以依照不同的结构和参数设计需求灵活选择所述线圈110的形状和规格，而不做具体限制。在本实施方式中，图1所示的所述线圈110为矩形。
所述壳体12罩设并保护所述电磁模块11，所述壳体12的材质可以为塑料、树脂或金属等。为了保证局部的热量能够快速扩散、达到均温效果，本实施方式中，所述壳体12为金属壳体。所述壳体12具有朝向所述电磁模块11的内表面120、背离所述电磁模块11并与内表面120相对设置的外表面121。
热传导片13设置在壳体12的内表面120上，由于在通常的电子组件结构中，壳体12的内表面120邻近电池、电子元器件等发热单元，如此设置，使得热传导片13更加贴近热源，有利于更加直接地接收热量、并快速的分散至壳体12的各个位置。需要说明的是，热传导片13可以通过多种方式设置在壳体12上，例如：贴附在内表面120上、或通过卡扣结构固定在内表面120上等，只 要保证热传导片13能够固定在壳体12上、而不会轻易脱落即可。
热传导片13可以是石墨片或铜箔等，其具有良好的导热性能，如此以来，其能够接收热量、并将接收到的热量快速的传导至壳体12的各个位置，达到均温效果。请一并参见图2，热传导片13上开设有对应电磁模块11的通孔130、以及连通通孔130与热传导片13边缘的开槽131，开槽131在厚度方向上贯穿热传导片13。
由于通孔130与开槽131破坏热传导片13的整体性，使得线圈110产生的电磁能量能够沿着通孔130及开槽131的边缘聚集、形成较强的电磁效应，从而可以确保电磁传输性能不受影响。另外，开设通孔130及开槽131后的热传导片13仍能覆盖壳体12的较大面积，从而将壳体12上温度较高位置的热量分散到壳体12的其他大部分区域，达到较好的均温效果，兼顾均温与电磁传输性能。
值得一提的是，通孔130的形状可以是方形、圆形、椭圆形等等。在一实施方式中，通孔130为圆形，相较于椭圆形、多边形或其他形状的通孔，在热传导片13上切割出圆形通孔能够避免应力过大而导致的传导片断裂，提高传导片的寿命和可靠性。需要说明的是，通孔130的尺寸越大，电磁传输性能越好，但均温效果相应的变差，因此，通孔130的尺寸可以依据电子组件10的尺寸大小、电磁传输性能的要求、以及均温效果的要求适当设置。在一实施方式中，通孔130的直径为15毫米～25毫米。在一实施方式中，通孔的直径为20毫米。
在一实施方式中，通孔130的几何中心与线圈110的几何中心相互正对，也就是说，通孔130的几何中心在壳体12上的正投影与线圈110的几何中心在壳体12上的正投影相互重合。如此设置，使得通孔130能够正对线圈110产生 的电磁场的中心，使得聚集在通孔130边缘的电磁场强度更加均匀，提升电磁传输性能。如图1所示，线圈110具有外边缘1101以及内边缘1102。在一实施方式中，通孔130在壳体12上的正投影落在线圈110的内边缘1101在壳体12上的正投影之内，例如图4所示出的。如此设置，可以确保通孔130的尺寸(面积)小于线圈110的尺寸(线圈外边缘围成的面积)，在确保电磁传输性能不受较大影响的前提下，尽可能多的保留热传导片13的面积(通孔130越小，热传导片13的面积越大)，获得较佳的均温效果。
如图1所示，线圈110具有外边缘1101以及内边缘1102。在一实施方式中，线圈110的内边缘1102在壳体12上的正投影与通孔130的边缘在所述壳体上的正投影相切，也就是说，线圈110内边缘1102在壳体12上的正投影与通孔130边缘在壳体12上的正投影内切，例如图5所示出的。二者内切的情形下，能够较佳的兼顾电磁传输性能和均温效果之间的平衡。
在一实施方式中，热传导片13的面积足够大，大到覆盖整个线圈110，也即是说，线圈110的外边缘1101在壳体12上的正投影落入热传导片13在壳体12上的正投影之内，例如图4或图5所示出的。
由于壳体12罩设具有线圈110的电磁模块11，因此设置在壳体12内表面120上的热传导片13也会覆盖在线圈110上方。需要说明的是，线圈110产生的NFC电磁场信号衰减程度和热传导片13覆盖线圈110的面积大小相关：采用了如图3所示的、覆盖整个线圈110且没有通孔130的热传导片13时，NFC的性能指标基本下降到0；采用了如图4或图5所示的、覆盖整个线圈110且具有通孔130的热传导片13之后，通孔130的存在能够允许电磁能量通过，使得NFC的电磁场能量与外部的NFC装置的电磁场耦合能力瞬间增强，NFC的 工作状态和没有热传导片13前相当。
本申请的第二实施方式涉及另一种电子组件20，参见图6，第二实施方式提供的电子组件20与第一实施方式提供的电子组件10大体相同，第二实施方式提供的电子组件20同样包括电磁模块11、壳体12、热传导片13。不同之处在于，第二实施方式的热传导片13(虚线所示)嵌设在所述壳体12内、并位于所述内表面120和所述外表面121之间。
如此以来，热传导片13与壳体12成为一个整体，外观整体性佳。并且，内嵌的热传导片13能够提升壳体12的强度，提高壳体12抗压、抗弯折能力，进而提高寿命。
需要说明的是，本申请第一实施方式提供的各个部件的结构、材质等设计方案同样可以应用于第二实施方式提供的电子组件20中，在此不再赘述。
本申请的第三实施方式涉及另一种电子组件30，参见图7，第三实施方式提供的电子组件30与第一实施方式提供的电子组件10大体相同，第三实施方式提供的电子组件30同样包括电磁模块11、壳体12、热传导片13。不同之处在于，，第三实施方式的热传导片13的一部分嵌入壳体12内、并位于内表面120和外表面121之间，热传导片13的另一部分则漏出内表面120、并位于电磁模块11与内表面120之间。
如此以来，热传导片13与壳体12成为一个整体，外观整体性佳。并且，内嵌的热传导片13能够提升壳体12的强度，提高壳体12抗压、抗弯折能力，进而提高寿命。
需要说明的是，本申请第一实施方式提供的各个部件的结构、材质等设计方案同样可以应用于第三实施方式提供的电子组件30中，在此不再赘述。
本申请的第四实施方式还涉及一种如图8所示的终端设备40，其包括电池41、以及如前述第一实施方式所述的电子组件10或如前述第二实施方式所述的电子组件20或如前述第三实施方式所述的电子组件30，所述电池41与所述电磁模块11电连接，所述电子组件10或所述电子组件20或所述电子组件30的壳体罩设在所述电池31上方。
本领域的普通技术人员可以理解，上述各实施方式是实现本申请的具体实施例，而在实际应用中，可以在形式上和细节上对其作各种改变，而不偏离本申请的精神和范围。

Claims (12)

  1. 一种电子组件，包括电磁模块、设置在所述电磁模块一侧的壳体，其中，还包括设置在所述壳体上的热传导片，所述热传导片上开设有对应所述电磁模块的通孔、在所述热传导片的厚度方向上贯穿所述热传导片并连通所述通孔与所述热传导片边缘的开槽。
  2. 根据权利要求1所述的电子组件，其中，所述电磁模块包括用于产生电磁场的环形线圈，所述线圈的几何中心正对所述通孔的几何中心。
  3. 根据权利要求2所述的电子组件，其中，所述通孔在所述壳体上的正投影落在所述线圈的内边缘在所述壳体上的正投影之内。
  4. 根据权利要求3所述的电子组件，其中，所述线圈的内边缘在所述壳体上的正投影与所述通孔的边缘在所述壳体上的正投影相切。
  5. 根据权利要求2所述的电子组件，其中，所述线圈的外边缘在所述壳体上的正投影落入所述热传导片在所述壳体上的正投影之内。
  6. 根据权利要求1所述的电子组件，其中，所述通孔的形状为圆形。
  7. 根据权利要求6所述的电子组件，其中，所述通孔的直径范围为15毫米～25毫米。
  8. 根据权利要求7所述的电子组件，其中，所述通孔的直径为20毫米。
  9. 根据权利要求1所述的电子组件，其中，所述壳体包括朝向所述电磁模块的内表面、背离所述电磁模块并与所述内表面相对设置的外表面，所述热传导片设置在所述内表面上。
  10. 根据权利要求1所述的电子组件，其中，所述壳体包括朝向所述电磁模块的内表面、背离所述电磁模块并与所述内表面相对设置的外表面，所述热传导片嵌设在所述壳体内、并位于所述内表面和所述外表面之间。
  11. 根据权利要求1所述的电子组件，其中，所述壳体包括朝向所述电磁模块的内表面、背离所述电磁模块并与所述内表面相对设置的外表面，所述热传导片的一部分嵌设在所述壳体内、并位于所述内表面和所述外表面之间，所述热传导片的另一部分位于所述内表面和所述电磁模块之间。
  12. 一种终端设备，包括电池、以及如权利要求1-11任一项所述的电子组件，所述电池与所述电磁模块电连接，所述壳体罩设在所述电池上方。
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