WO2021049650A1 - Push switch and method for manufacturing same - Google Patents

Abstract

This push switch comprises: a substrate having a first surface with a first fixed contact and a second fixed contact disposed thereon, the second fixed contact being disposed around the first fixed contact, the substrate also having a second surface located on a side opposite the first surface, a third surface extending from the second surface to a corner section in the direction orthogonal to the first surface, and a fourth surface extending parallel to the first surface from the corner section; and an electroconductive movable contact disposed so that a peripheral section thereof is in contact with the second fixed contact and, when pressed, a central section thereof comes into contact with the first fixed contact. On the fourth surface, a pair of electroconductive sections are disposed in the vicinity of the end sections of a pair of sides of the third surface that extend in a direction orthogonal to the first surface.

Description

Push switch and its manufacturing method

This disclosure relates to a push switch and its manufacturing method.

Various technologies are known to reduce the mounting space in the height direction of the mounting board by attaching a push switch used as an operation button of an electronic device to the end of a mounting board such as a circuit board.

For example, in Japanese Patent Application Laid-Open No. 2019-106371 (hereinafter referred to as Patent Document 1), a step is formed on a substrate on which a fixed contact of a push switch is arranged, and the step formed on the substrate is formed on the upper surface of the mounting substrate. A push switch that is mounted on the edge of the mounting board by mounting so as to hit is described.

In the push switch described in Patent Document 1, a groove is formed in a corner portion where a pair of surfaces forming a step are in contact with each other, so that the corner portion has an R shape, so that the push switch is lifted from the mounting substrate. Can be prevented.

However, in the push switch described in Patent Document 1, in order to bond the push switch and the mounting substrate, an adhesive material is arranged between the step formed on the substrate of the push switch and the mounting substrate. When mounted, it may lift off the mounting board.

An object of the present disclosure is to provide a push switch having a low risk of being lifted from a mounting board when mounted on a mounting board.

The push switch according to the present disclosure has a first surface on which a first fixed contact and a second fixed contact arranged around the first fixed contact are arranged, and a second surface located on the opposite side of the first surface. A substrate having a third surface extending from the second surface to the corner portion in a direction orthogonal to the first surface, a fourth surface extending parallel to the first surface from the corner portion, and a peripheral portion fixed to the second surface. It is provided with a conductive movable contact that is in contact with the contact and is arranged so that the central portion is in contact with the first fixed contact when pressed, and the fourth surface is in a direction orthogonal to the first surface of the third surface. A pair of conductive portions are arranged in the vicinity of the ends of the pair of sides extending to.

Further, in the push switch according to the present disclosure, it is preferable that each of the pair of conductive portions is arranged in a pair of recesses formed in the vicinity of the ends of the pair of sides.

Further, in the push switch according to the present disclosure, it is preferable that each of the pair of conductive portions extends to the first surface.

Further, in the push switch according to the present disclosure, it is preferable that each of the pair of recesses is filled with a conductive member.

Further, in the push switch according to the present disclosure, it is preferable that each of the pair of recesses is further extended to a pair of sides extending in a direction orthogonal to the first surface of the third surface.

Further, in the push switch according to the present disclosure, it is preferable that each of the pair of recesses is continuously formed between the second surface and the fourth surface.

Further, in the push switch according to the present disclosure, it is preferable that each of the pair of conductive members is further arranged in a recess formed continuously between the second surface and the fourth surface.

Further, in the push switch according to the present disclosure, it is preferable that each of the pair of conductive members is further arranged on the second surface.

Further, in the push switch according to the present disclosure, it is preferable that the substrate further has a convex portion extending parallel to the third surface from the opposite end portion of the end portion in contact with the third surface of the fourth surface.

Further, it is preferable that the push switch according to the present disclosure further has a pair of conductive members arranged so as to be in contact with each of the pair of conductive members.

Further, in the push switch according to the present disclosure, the substrate is positioned on the fifth and sixth surfaces orthogonal to any of the first, second, third and fourth surfaces, and opposite to the third surface. It is preferable that at least one of the fifth surface and the sixth surface is provided with a side pattern extending from the third surface to the seventh surface.

Further, in the method for manufacturing a push switch according to the present disclosure, the first fixed contact and the second fixed contact arranged around the first fixed contact are arranged on the first surface and the opposite side of the first surface. A substrate having a second surface located, a third surface extending from the second surface to a corner in a direction orthogonal to the first surface, and a fourth surface extending parallel to the first surface from the corner, and a peripheral edge. It is provided with a conductive movable contact whose central portion is in contact with the second fixed contact and whose central portion is in contact with the first fixed contact when pressed, and the second surface is the first surface of the third surface. A method for manufacturing a push switch in which a pair of recesses filled with a conductive member are formed in the vicinity of the ends of a pair of sides extending in a direction orthogonal to a surface, and the first fixed contact and the second fixed. It includes a base material preparation step of preparing a base material having components corresponding to contacts and movable contacts on one surface, and a push switch forming step of molding the base material to form a push switch.

Further, in the push switch manufacturing method according to the present disclosure, it is preferable that the plurality of conductive members are inserted from the front surface on which the components are arranged to the back surface opposite to the front surface.

Further, in the push switch manufacturing method according to the present disclosure, it is preferable that the plurality of conductive members are inserted from the front surface on which the components are arranged to a predetermined position between the front surface and the back surface opposite to the front surface.

Further, in the method for manufacturing a push switch according to the present disclosure, in the base material preparation step, the assembly substrate into which a plurality of columnar conductive members extending in the height direction are inserted, and the assembly substrate are arranged on the surface of the assembly substrate. A step of preparing a base material having components corresponding to one fixed contact, a second fixed contact, and a movable contact is included, and a push switch forming step is performed on a third surface so as to include a part of a plurality of conductive members. The first cutting step of cutting the assembly substrate from the back surface at the first depth in the parallel direction to form a plurality of first cutting grooves, and the first depth alternately between the plurality of first cutting grooves. Between the second cutting step of forming a plurality of second cutting grooves and the plurality of second cutting grooves by cutting from the back surface in a direction parallel to the third surface at a shallower second depth. It is preferable to include a third cutting step of cutting in an array in a direction parallel to the third surface and a direction parallel to the normal line of the third surface and separating the pieces into a plurality of push switches.

The push switch according to the present disclosure can reduce the risk of floating from the mounting board when mounted on the mounting board.

(A) is a perspective view (No. 1) of the push switch according to the first embodiment, and (b) is a perspective view (No. 2) of the push switch according to the first embodiment. It is an exploded perspective view of the push switch shown in FIG. (A) is a front view of the push switch shown in FIG. 1, (b) is a side view of the push switch shown in FIG. 1, and (c) is a bottom view of the push switch shown in FIG. It is a cross-sectional view (No. 1) along the line AA shown in FIG. 1, and (b) is a cross-sectional view (No. 2) along the line AA shown in FIG. (A) is a perspective view of the push switch shown in FIG. 1 mounted on the mounting board, and (b) is a partial cross-sectional view of an electrical connection portion of the push switch shown in FIG. 1 mounted on the mounting board. It is a perspective view of the assembly board used for manufacturing the push switch shown in FIG. It is a figure which shows the manufacturing process of the push switch shown in FIG. 1, (a) shows the base material preparation process, (b) shows the 1st cutting process, (c) shows the 2nd cutting process, (d). ) Indicates the third cutting process. (A) is a perspective view (No. 1) of the push switch according to the second embodiment, and (b) is a perspective view (No. 2) of the push switch according to the second embodiment. It is an exploded perspective view of the push switch shown in FIG. (A) is a cross-sectional view taken along line BB shown in FIG. 8 (No. 1), and FIG. 8B is a cross-sectional view taken along line BB shown in FIG. 8 (No. 2). It is a figure which shows the method of embedding the 1st fixed contact and the 2nd fixed contact in a substrate, (a) shows the 1st step, (b) shows the 2nd step, (c) shows the 3rd step. Shown, (d) is a cross-sectional view taken along the line CC of (a), (e) is a cross-sectional view taken along the line DD of (b), and (f) is a cross-sectional view taken along the line DD of (c). It is a cross-sectional view along line E, and (g) is a cross-sectional view showing a fourth step. (A) is a perspective view (No. 1) of the push switch according to the third embodiment, and (b) is a perspective view (No. 2) of the push switch according to the third embodiment. It is an exploded perspective view of the push switch shown in FIG. It is a figure which shows the manufacturing process of the push switch shown in FIG. 12, (a) shows the 1st process, (b) shows the 2nd process, (c) shows the 3rd process. (A) is a perspective view (No. 1) of the push switch according to the fourth embodiment, and (b) is a perspective view (No. 2) of the push switch according to the fourth embodiment. It is an exploded perspective view of the push switch shown in FIG. (A) is a perspective view (No. 1) of the push switch according to the fifth embodiment, and (b) is a perspective view (No. 2) of the push switch according to the fifth embodiment. (A) is a side view (No. 1) of the push switch shown in FIG. 17 mounted on the mounting board, and (b) is a side view (No. 2) of the push switch shown in FIG. 17 mounted on the mounting board. is there. (A) is a perspective view (No. 1) of the push switch according to the sixth embodiment, and (b) is a perspective view (No. 2) of the push switch according to the sixth embodiment. It is a side view of the push switch shown in FIG. 19 mounted on a mounting board. (A) is a perspective view (No. 1) of the push switch according to the seventh embodiment, (b) is a perspective view (No. 2) of the push switch according to the seventh embodiment, and (c) is the seventh. It is a front view of the push switch which concerns on embodiment, and (d) is a rear view of the push switch which concerns on 7th Embodiment. (A) is a perspective view (No. 1) of the push switch according to the eighth embodiment, and (b) is a perspective view (No. 2) of the push switch according to the eighth embodiment. (A) is a perspective view (No. 1) of the push switch according to the ninth embodiment, and (b) is a perspective view (No. 2) of the push switch according to the ninth embodiment. It is a figure which shows the 1st modification of the manufacturing method of a push switch, (a) shows the base material preparation process, (b) shows the 1st cutting process, (c) shows the 2nd cutting process. It is a figure which shows the 2nd modification of the manufacturing method of a push switch, (a) shows the base material preparation process, (b) shows the 1st cutting process, (c) shows the 2nd cutting process. It is a figure which shows the 3rd modification of the manufacturing method of a push switch, (a) shows the 1st base material preparation process, (b) shows the 2nd base material preparation process, (c) shows the joining process. .. It is a figure which shows the 4th modification of the manufacturing method of a push switch, (a) shows a base material preparation process, (b) shows a joining process, and (c) shows a cutting process. It is a figure which shows the 5th modification of the manufacturing method of a push switch, (a) shows a base material preparation process, (b) shows a joining process, and (c) shows a cutting process.

Hereinafter, the push switch and the manufacturing method of the push switch according to one aspect of the present disclosure will be described with reference to the drawings. However, it should be noted that the technical scope of the present disclosure is not limited to those embodiments, but extends to the inventions described in the claims and their equivalents.

(Configuration and function of push switch according to the first embodiment)
FIG. 1 (a) is a perspective view (No. 1) of the push switch according to the first embodiment, and FIG. 1 (b) is a perspective view (No. 2) of the push switch according to the first embodiment. FIG. 2 is an exploded perspective view of the push switch shown in FIG. 3 (a) is a front view of the push switch shown in FIG. 1, FIG. 3 (b) is a side view of the push switch shown in FIG. 1, and FIG. 3 (c) is a bottom view of the push switch shown in FIG. It is a figure. 3 (b) is a side view seen from the arrow C of FIG. 3 (a), and FIG. 3 (c) is a bottom view seen from the arrow B of FIG. 3 (a). FIG. 4A is a cross-sectional view taken along the line AA shown in FIG. 1 (No. 1), and FIG. 4B is a cross-sectional view taken along the line AA shown in FIG. 1 (No. 2).

The push switch 1 presses the substrate 10, the first conductive member 11, the second conductive member 12, the first fixed contact 13, the second fixed contact 14, the movable contact 15, the case member 16, and the like. It has a member 17 and a protective cover 18.

The substrate 10 is made of a resin material such as glass epoxy, and has a first surface 21, a second surface 22, a third surface 23, a fourth surface 24, a fifth surface 25, and a sixth surface 26. It has a seventh surface 27 and. The first surface 21 is a substantially rectangular plane in which a semicircular notch is formed in the center of a pair of short sides, and the first fixed contact 13 and the second fixed contact 14 are arranged. The second surface 22 is located on the opposite side of the first surface 21 and has a substantially rectangular planar shape with two corners notched. The third surface 23 is a rectangular plane extending from the second surface 22 to the corner 28 in the direction orthogonal to the first surface 21. The fourth surface 24 is a plane extending parallel to the first surface 21 from the corner portion 28. The fourth surface 24 has a substantially rectangular planar shape with two corners notched. The area of the second surface 22 and the area of the fourth surface 24 are substantially the same, and are approximately half the area of the first plane. At this time, the planar shape of the second surface 22 and the planar shape of the fourth surface 24 are point-symmetrical with respect to the central portion of the first contact portion 43, and are located at the central portion of the pair of short sides of the first surface 21. It is line symmetric with respect to a straight line connecting a semicircular notch. Further, the third surface 23 and the fourth surface 24 form a step that abuts on the mounting board when the push switch 1 is mounted on the mounting board.

The fifth surface 25 is a substantially L-shaped plane orthogonal to any of the first surface 21 to the fourth surface 24. The sixth surface 26 is a substantially L-shaped plane located on the opposite side of the fifth surface 25. The seventh surface 27 is a rectangular plane located opposite to the third surface 23 and surrounded by the first surface 21, the second surface 22, the fifth surface 25, and the sixth surface 26.

The corner portion 28 is formed with a groove portion 30 recessed with respect to the fourth surface 24. The groove 30 is formed as a recess having a substantially semicircular cross section from the end on the fifth surface 25 side of the long side of the fourth surface 24 to the end on the sixth surface 26 side. The groove portion 30 may have a U-shape, but the sharper the corners of the U-shape, the easier it is to crack due to stress concentration. Therefore, the groove portion 30 is preferably R-shaped.

A pair of recesses, a first recess 31 and a second recess 32, are formed on a pair of sides extending in a direction orthogonal to the first surface 21 of the third surface 23. The first recess 31 has a fan-shaped cross section and is continuously formed between the second surface 22 and the fourth surface 24 so as to cut out a side where the third surface 23 and the fifth surface 25 are in contact with each other. Will be done. The first recess 31 further extends from the second surface 22 to the first surface 21. The first recess 31 has a semicircular cross section between the fourth surface 24 and the first surface 21.

Like the first recess 31, the second recess 32 has a fan-shaped cross section, and the second surface 22 and the fourth surface 24 are cut out so as to cut out the side where the third surface 23 and the sixth surface 26 are in contact with each other. It is formed continuously between and. The second recess 32 further extends from the second surface 22 to the first surface 21. The second recess 32 has a semicircular cross section between the fourth surface 24 and the first surface 21.

The first conductive member 11 is, for example, a conductive member formed by a resin paste containing a metal such as copper and silver and metal plating such as tin, and is arranged along the long side of the third surface 23. It has a first longitudinal portion 33 and a first head 34 arranged between the first surface 21 and the fourth surface 24. The first conductive member 11 may be formed by plating a metal such as tin on the surface of a resin paste containing a metal such as copper and silver. The first conductive member 11 has a shape fitted in the first recess 31. That is, the first longitudinal portion 33 has a fan-shaped cross section so as to complement the sides where the third surface 23 and the fifth surface 25 meet, and has a length substantially the same as the length of the long side of the third surface 23. Have. Further, the first head 34 has a semicircular cross section so as to complement the semicircular notch formed on one of the pair of short sides of the first surface 21, and the first surface 21 and the fourth surface 21 have a semicircular cross section. It is arranged between the surface 24 and the surface 24. The first conductive member 11 is preferably melted when the push switch is mounted on the mounting substrate by reflow or the like.

Like the first conductive member 11, the second conductive member 12 is a conductive member formed by resin paste and metal plating, and is a second longitudinal portion arranged along the long side of the third surface 23. It has a 35 and a second head 36 arranged between the first surface 21 and the fourth surface 24. The second conductive member 12 may be formed by plating a metal such as tin on the surface of a resin paste containing a metal such as copper and silver. The second conductive member 12 has a shape fitted in the second recess 32. That is, the second longitudinal portion 35 has a fan-shaped cross section so as to complement the sides where the third surface 23 and the sixth surface 26 meet, and has a length substantially the same as the length of the long side of the third surface 23. Have. Further, the second head 36 has a semicircular cross section so as to complement the semicircular notch formed on the other side of the pair of short sides of the first surface 21, and the first surface 21 and the fourth surface 21 have a semicircular cross section. It is arranged between the surface 24 and the surface 24.

The first fixed contact 13 is a conductive thin film made of a metal such as copper, and has a first conductive portion 41, a first connecting portion 42, and a first contact portion 43. The first conductive portion 41 is arranged so as to surround a semicircular notch formed in the central portion of the short side of the first surface 21 on the fifth surface 25 side, and is the first head of the first conductive member 11. It is electrically connected to the unit 34. The first conductive portion 41 may be arranged on a surface orthogonal to the first surface 21 of the semicircular notch formed in the central portion of the short side of the first surface 21 on the fifth surface 25 side. The first connection portion 42 extends substantially parallel to the long side of the first surface 21, one end of which is connected to the first conduction portion 41, and the other end of which is connected to the first contact portion 43. The first contact portion 43 has a substantially circular shape and is arranged at the central portion of the first surface 21. The first contact portion 43 is electrically connected to the first conductive member 11 via the first conductive portion 41 and the first connecting portion 42.

The second fixed contact 14 is a conductive thin film made of a metal such as copper, and has a second conductive portion 44, a second connecting portion 45, and a second contact portion 46. The second conductive portion 44 is arranged so as to surround the semicircular notch formed in the central portion of the short side of the first surface 21 on the sixth surface 26 side, and is the second head of the second conductive member 12. It is electrically connected to the unit 36. The second conductive portion 44 may be arranged on a surface orthogonal to the first surface 21 of the semicircular notch formed in the central portion of the short side of the first surface 21 on the sixth surface 26 side. The second connecting portion 45 extends substantially parallel to the long side of the first surface 21, one end of which is connected to the second conductive portion 44, and the other end of which is connected to the second contact portion 46. The second contact portion 46 has a substantially frame-like shape and is arranged around the first contact portion 43 of the first fixed contact 13. The second contact portion 46 is electrically connected to the second conductive member 12 via the second conductive portion 44 and the second connecting portion 45.

The movable contact 15 is formed of a thin, dome-shaped conductive member having elasticity such as stainless steel and brass. The movable contact 15 is formed by cutting, for example, a convex dome-shaped leaf spring member. Further, the movable contact 15 may have another shape such as a dome-shaped circular shape or a bale-shaped shape having opposite sides.

The movable contact 15 has a peripheral portion 51 and a central portion 52. At least a part of the peripheral edge portion 51 of the movable contact 15 is in contact with the second contact portion 46 of the second fixed contact 14 without being in contact with the first fixed contact 13. As shown in FIG. 4A, the central portion 52 of the movable contact 15 is arranged at a position separated from the first fixed contact 13 when the pressing member 17 is not pressed. When the pressing member 17 is not pressed, the first fixed contact 13 and the movable contact 15 are separated from each other, so that the first conductive member 11 connected to the first fixed contact 13 and the second fixed contact 14 are connected to each other. There is no conduction with the second conductive member 12, and the push switch 1 is turned off.

As shown in FIG. 4B, the central portion 52 of the movable contact 15 reverses while moving in the direction of the first surface 21 together with the pressing member 17 in response to the pressing member 17 being pressed. It contacts the first contact portion 43 of the first fixed contact 13. When the central portion 52 of the movable contact 15 reverses and comes into contact with the first contact portion 43 of the first fixed contact 13, the first conductive member 11 connected to the first fixed contact 13 and the second fixed contact 14 It conducts with the second conductive member 12 connected to the push switch 1, and the push switch 1 is turned on. When the pressing member 17 is no longer pressed, the movable contact 15 is elastically restored to its original shape, and the central portion 52 of the movable contact 15 moves in a direction away from the first surface 21 to be the first of the first fixed contacts 13. Apart from the contact portion 43, the push switch 1 is turned off.

The case member 16 is made of a resin material such as a frame-shaped polyimide having a hole in which the movable contact 15 can be arranged in the central region. By arranging the case member 16 on the substrate 10, a storage portion for accommodating the first fixed contact 13, the second fixed contact 14, the movable contact 15, and the pressing member 17 is formed together with the substrate 10. The shape of the outer frame of the case member 16 is substantially the same as the outer circumference of the first surface 21 of the substrate 10. The back surface of the case member 16 may be fixed by being adhered to the substrate 10 via, for example, an adhesive layer (not shown).

The pressing member 17 is formed of a cylindrical resin material such as polyimide, and is arranged above the central portion 52 of the movable contact 15. By arranging the pressing member 17, the operability of the pressing operation of the push switch 1 is improved. In the push switch according to the embodiment, the pressing member 17 may have a shape other than a cylindrical shape such as a rectangular parallelepiped shape. Further, in the push switch according to the embodiment, the pressing member 17 may be omitted.

The protective cover 18 is a sheet material made of a flexible synthetic resin such as polyimide, and is adhered to the surface of the case member 16 so as to cover the storage portion formed by the substrate 10 and the case member 16.

FIG. 5A is a perspective view of the push switch 1 mounted on the mounting board, and FIG. 5B is a partial cross-sectional view of the electrical connection portion of the push switch 1 mounted on the mounting board.

The first wiring pattern 101 and the second wiring pattern 102 are arranged on the surface of the mounting board 100 on which the push switch 1 is mounted. The first wiring pattern 101 and the second wiring pattern 102 are solder patterns, and the push switch 1 is fixed to the mounting board 100 by reflow.

The first wiring pattern 101 of the mounting board 100 on which the push switch 1 is mounted is electrically connected to the first fixed contact 13 via the first conductive member 11 of the push switch 1. The second wiring pattern 102 is electrically connected to the second fixed contact 14 via the second conductive member 12 of the push switch 1.

When the conductive patterns forming the first conductive member 11 and the second conductive member 12 are reflowed, they are melted together with the solder forming the first wiring pattern 101 and the second wiring pattern 102 to form the fillet 103. Form.

FIG. 6 is a perspective view of an assembly substrate used for manufacturing the push switch 1. FIG. 7 is a diagram showing a manufacturing process of the push switch 1, FIG. 7 (a) shows a base material preparation process, FIG. 7 (b) shows a first cutting process, and FIG. 7 (c) shows a second cutting. The process is shown, and FIG. 7 (d) shows the third cutting process. In FIGS. 7 (a) to 7 (c), the hatched portion indicates a portion that is cut and deleted when the push switch 1 is manufactured.

The base material 200 used for manufacturing the push switch 1 has a structure in which structures corresponding to a plurality of push switches 1 arranged in an array are connected via a resin material forming a substrate 10 of the push switch 1. Have. The base material 200 includes a substrate 10, a first conductive member 11, a second conductive member 12, a first fixed contact 13, a second fixed contact 14, a movable contact 15, a case member 16, a pressing member 17, and a protective cover 18. The components corresponding to each of are included.

In the base material 200, the components corresponding to each of the substrate 10 to the protective cover 18 included in the push switch 1 are arranged at positions corresponding to the positional relationship of the respective components included in the push switch 1. For example, in the base material 200, a plurality of columnar conductive members 201 extending in the height direction are inserted. Each of the plurality of conductive members 201 is a base material of the first conductive member 11 and the second conductive member 12. Since the base material 200 is arranged at a position corresponding to the positional relationship of each component included in the push switch 1, the push switch 1 can be manufactured by cutting out the configuration corresponding to the push switch 1 from the base material 200. Is.

In the manufacturing process of the push switch 1, first, in the base material preparation step shown in FIG. 7A, the base material 200 is prepared in an inverted state. Next, a dicing saw (not shown) cuts the assembly substrate from the back surface at a first depth in a direction parallel to the third surface of the manufactured push switch 1 so as to include a part of the plurality of conductive members 201. Then, the first cutting step of forming the plurality of first cutting grooves 211 is executed. Each corner 28 of the plurality of first cutting grooves 211 corresponds to the groove 30 of the push switch 1.

The dicing saw then alternates between the plurality of first cutting grooves 211 at a second depth that is shallower than the first depth, which is the depth of the first cutting grooves 211, in a direction parallel to the third surface. A second cutting step of forming a plurality of second cutting grooves 212 by cutting from the back surface toward the surface is executed. Each of the plurality of second cutting grooves 212 corresponds to the third surface 23 of the push switch 1. The third surface 23 formed by executing the second cutting step is arranged so as to face each other in pairs.

Then, by cutting means such as a dicing saw, a blade, a water jet, and a laser, an array is formed between the second cutting grooves 212 in a direction parallel to the third surface and a direction parallel to the normal line of the third surface. A third cutting step of cutting and separating into a plurality of push switches 1 is executed. Each of the plurality of push switches 1 formed by executing the third cutting step is arranged so as to face each other for each pair of push switches 1.

(Action and effect of the push switch according to the first embodiment)
In the push switch 1, the solder arranged on the first wiring pattern 101 of the mounting board 100, the solder arranged on the second wiring pattern 102, and the first conductive member 11 and the second conductive member 12 are melted together. It can be mounted on the mounting substrate 100 with high accuracy due to the self-alignment effect.

Further, in the push switch 1, since each of the first conductive member 11 and the second conductive member 12 is continuously formed between the second surface 22 and the fourth surface 24, the mounting substrate on which the push switch 1 is mounted is mounted. The degree of freedom in arranging the wiring pattern can be increased.

Further, in the push switch 1, since each of the first conductive member 11 and the second conductive member 12 extends to the first surface 21, each of the first conductive member 11 and the second conductive member 12 is first. It can be connected to the fixed contact 13 and the second fixed contact 14.

In the push switch 1, since the first conductive member 11 and the second conductive member 12 use a material containing a resin paste or a metal material such as tin having a low melting temperature, burrs are formed in the manufacturing process. Even in this case, the burr melts when it is connected to the mounting substrate by heating such as soldering, so that there is a low possibility that problems such as poor connection will occur.

Further, the first conductive member 11 and the second conductive member 12 improve the adhesiveness of the push switch 1 to the mounting substrate by increasing the viscosity of the resin paste contained therein, and when soldered. The gap between the push switch 1 and the mounting board can be minimized.

Further, in the push switch 1, each of the first conductive member 11 and the second conductive member 12 containing the resin paste is installed in the first recess 31 and the second recess 32 to ensure conductivity. On a fan-shaped arc surface of the cross section of the first recess 31 and the second recess 32, which are continuously formed between the second surface 22 and the fourth surface 24 of the first recess 31 and the second recess 32, for example. , It is not necessary to dispose a metal such as copper, and it is possible to reduce the possibility that burrs such as metal are generated in the cutting process of cutting the collective substrate of the base material 200 in the manufacturing process.

Further, in the manufacturing process of the push switch 1, in the second cutting step of forming the plurality of second cutting grooves 212, the steps of the two push switches 1 arranged so as to face each other can be formed together. The manufacturing efficiency can be increased.

(Configuration and function of push switch according to the second embodiment)
FIG. 8A is a perspective view of the push switch according to the second embodiment (No. 1), and FIG. 8B is a perspective view of the push switch according to the second embodiment (No. 2). FIG. 9 is an exploded perspective view of the push switch shown in FIG. FIG. 10A is a cross-sectional view taken along line BB shown in FIG. 8 (No. 1), and FIG. 10B is a cross-sectional view taken along line BB shown in FIG. 8 (No. 2).

The push switch 2 differs from the push switch 1 in that the board 70, the first fixed contact 73, and the second fixed contact 74 are provided in place of the board 10, the first fixed contact 13, and the second fixed contact 14. The components of the push switch 2 other than the substrate 70, the first fixed contact 73, and the second fixed contact 74 have the same components and functions as those of the push switch 1 having the same reference numerals. A detailed description will be omitted.

The substrate 70 is different from the substrate 10 in that the first fixed contact 73 and the second fixed contact 74 are embedded in the first surface 21. The components and functions of the board 70 other than the first fixed contact 73 and the second fixed contact 74 being embedded in the first surface 21 are the components and functions of the board 10 having the same reference numerals. Since it is the same as the above, detailed description thereof will be omitted here.

Like the first fixed contact 13, the first fixed contact 73 is a conductive thin film formed of a metal such as copper, and includes the first conductive portion 81, the first connecting portion 82, and the first contact portion 83. Has. The configurations and functions of the first conductive portion 81, the first connecting portion 82, and the first contact portion 83 are the first conductive portion 41, the first connecting portion 42, and the first, except that they are embedded in the first surface 21. The configuration and function of the contact portion 43 are the same. The first conductive portion 81 and the first contact portion 83 form the same surface as the first surface 21 which is the surface of the substrate 70. The first connection portion 82 is embedded in the first surface 21.

Like the second fixed contact 14, the second fixed contact 74 is a conductive thin film formed of a metal such as copper, and includes the second conductive portion 84, the second connecting portion 85, and the second contact portion 86. Has. The configurations and functions of the second conductive portion 84, the second connecting portion 85, and the second contact portion 86 are the second conductive portion 44, the second connecting portion 45, and the second, except that they are embedded in the first surface 21. The configuration and function of the contact portion 46 are the same. The second conductive portion 84 and the second contact portion 86 form the same surface as the first surface 21 which is the surface of the substrate 70. The second connection portion 85 is embedded in the first surface 21.

FIG. 11 is a diagram showing a method of embedding the first fixed contact 73 and the second fixed contact 74 in the substrate 70. 11 (a) is a diagram showing a first step, FIG. 11 (b) is a diagram showing a second step, and FIG. 11 (c) is a diagram showing a third step. 11 (d) is a cross-sectional view taken along the line CC of FIG. 11 (a), FIG. 11 (e) is a cross-sectional view taken along the line DD of FIG. 11 (b), and FIG. 11 (f) ) Is a cross-sectional view taken along the line EE of FIG. 11 (c), and FIG. 11 (g) is a cross-sectional view showing the fourth step.

First, in the first step, the first fixed contact 73 and the second fixed contact 74 are formed on the first surface 21 of the substrate 70. The first fixed contact 73 and the second fixed contact 74 are formed by depositing a metal such as copper on the first surface 21 and then etching the first fixed contact 73.

Then, in the second step, the first connection portion 82 and the second connection portion 85 are etched. The depth at which the first connecting portion 82 and the second connecting portion 85 are etched is, for example, 25 μm.

Next, in the third step, a resist, which is an insulating resin, is patterned on the first surface 21 of the substrate 70 excluding the first conductive portion 81, the first contact portion 83, the second conductive portion 84, and the second contact portion 86. .. In the third step, the first connection portion 82 and the second connection portion 85 are embedded in the first surface 21 by patterning the resist on the first surface 21.

Then, in the fourth step, the first conductive portion 81, the first contact portion 83, the second conductive portion 84 and the second contact portion 86, and the resist patterned in the third step are polished to form the first fixed contact 73 and the first fixed contact 73. The process of forming the second fixed contact 74 on the same surface and embedding the substrate 70 is completed.

(Action and effect of the push switch according to the second embodiment)
In the push switch 2, since the first conductive portion 81 and the first contact portion 83 and the second conductive portion 84 and the second contact portion 86 form the same surface as the first surface 21 of the substrate 70, the case member 16 and the first The airtightness between the surface 21 and the surface 21 can be improved. If the same surface of the first surface 21 has substantially the same shape as the planar shape facing the first surface 21 of the case member 16, the same airtightness can be obtained, but the first surface as in the present embodiment can be obtained. If the same surface of the surface 21 is large, the airtightness does not change even if there is a misalignment when arranging the case member 16, which is preferable. On the other hand, since the surfaces of the first connection portion 82 and the second connection portion 85 are covered with the resist, when the push switch 2 is soldered, the solder is first conductive due to the property of being easily transmitted through the metal surface of the solder. Even if the solder is transmitted from the sex member 11 and the second conductive member 12 to each of the first conductive portion 81 and the second conductive portion 84, the resist can prevent the solder from entering the inside of the push switch 2.

(Configuration and function of push switch according to the third embodiment)
FIG. 12 (a) is a perspective view (No. 1) of the push switch according to the third embodiment, and FIG. 12 (b) is a perspective view (No. 2) of the push switch according to the third embodiment. FIG. 13 is an exploded perspective view of the push switch shown in FIG.

The push switch 3 differs from the push switch 1 in that the substrate 10a, the first conductive member 11a, and the second conductive member 12a are provided in place of the substrate 10, the first conductive member 11, and the second conductive member 12. .. Since the configurations and functions of the components of the push switch 3 other than the substrate 10a, the first conductive member 11a, and the second conductive member 12a are the same as the configurations and functions of the components of the push switch 1 having the same reference numerals. A detailed description will be omitted here.

The substrate 10a may have a second surface 22a, a third surface 23a, a fifth surface 25a, and a sixth surface 26a in place of the second surface 22, the third surface 23, the fifth surface 25, and the sixth surface 26. Different from 10. Since the configurations and functions of the components of the substrate 10a other than the second surface 22a, the third surface 23a, the fifth surface 25a, and the sixth surface 26a are the same as the configurations and functions of the components of the substrate 10 having the same reference numerals. , Detailed description is omitted here. The first surface 22a, the third surface 23a, the fifth surface 25a, and the sixth surface 26a are not formed with the first recess 31 and the second recess 32, respectively. It is different from 25 and the sixth surface 26.

The first conductive member 11a does not have a configuration corresponding to the first longitudinal portion 33, but has a structure corresponding to the first head 34. The second conductive member 12a does not have a configuration corresponding to the second longitudinal portion 35, but has a structure corresponding to the second head portion 36. The first conductive member 11a and the second conductive member 12a are filled in a pair of recesses extending from the fourth surface 24 to the first surface 21.

14A and 14B are views showing a manufacturing process of the push switch 3, FIG. 14A shows a first step, FIG. 14B shows a second step, and FIG. 14C shows a third step. ..

First, in the first step, the base material 300 used for manufacturing the push switch 3 is prepared. Similar to the base material 200, the base material 300 has a structure in which structures corresponding to a plurality of push switches 3 arranged in an array are connected via a resin material forming the substrate 10 of the push switches 1. Next, in the second step, the recess 301 filled with the first conductive member 11a and the second conductive member 12a is formed by cutting from the first surface 21 side of the substrate 10a with a laser or the like. Next, in the third step, the first conductive member 11a and the second conductive member 12a are formed by filling the recess 301 formed by cutting with a laser or the like with the resin paste 302. After that, the push switch 3 is manufactured by executing the same process as the manufacturing step of the push switch 1 shown in FIG. 7. Here, the step shown in FIG. 14 was executed before the manufacturing process of the push switch 1 shown in FIG. 7 was executed. However, in the manufacturing process of the push switch 3 according to the embodiment, the push switch 1 shown in FIG. 7 was executed. The process shown in FIG. 14 may be executed after the manufacturing process is executed. Further, in the manufacturing process of the push switch 3 according to the embodiment, the process shown in FIG. 14 may be executed before the case member 16 is arranged on the first surface 21.

The push switch 3 is soldered at the end of the mounting board on which the push switch 3 is mounted by arranging the first conductive member 11a and the second conductive member 12a in a plane shape of the fourth surface 24. Therefore, electrical connection is easily realized.

Further, in the push switch 3, since the first conductive member 11a and the second conductive member 12a are arranged in a plane shape of the fourth surface 24, the push switch 3 is mounted on a mounting substrate, and when the solder melts, the solder is pulled. Due to the force, the fourth surface 24 and the side surface of the mounting board are easily brought into close contact with each other. Further, since the groove 30 is filled with the solder used when mounting on the mounting board, there is no excess solder between the fourth surface 24 and the side surface of the mounting board, so that the solder is mounted in a tighter contact state. It can be mounted on a board.

Further, since the push switch 3 is not filled with solder between the third surface 23a and the mounting board when mounted on the mounting board, the adhesion between the third surface 23a and the mounting board can be improved. it can.

(Configuration and function of push switch according to the fourth embodiment)
FIG. 15 (a) is a perspective view (No. 1) of the push switch according to the fourth embodiment, and FIG. 15 (b) is a perspective view (No. 2) of the push switch according to the fourth embodiment. FIG. 16 is an exploded perspective view of the push switch shown in FIG.

The push switch 4 differs from the push switch 1 in that the substrate 10b, the first conductive member 11b, and the second conductive member 12b are provided in place of the substrate 10, the first conductive member 11, and the second conductive member 12. .. Since the configurations and functions of the components of the push switch 4 other than the substrate 10b, the first conductive member 11b, and the second conductive member 12b are the same as the configurations and functions of the components of the push switch 1 having the same reference numerals. A detailed description will be omitted here.

The substrate 10b is different from the substrate 10 in that it has a second surface 22b instead of the second surface 22. Since the configurations and functions of the components of the substrate 10b other than the second surface 22b are the same as the configurations and functions of the components of the substrate 10 having the same reference numerals, detailed description thereof will be omitted here. The second surface 22b is different from the second surface 22 in that a rectangular recess is formed. The method of manufacturing the second surface 22b is the same as that of the first surface 21 of the push switch 2.

The first conductive member 11b has a first electrode pattern 37 in addition to the first longitudinal portion 33 and the first head 34. The first electrode pattern 37 has a rectangular planar shape and is electrically connected to the first longitudinal portion 33. The second conductive member 12b has a second electrode pattern 38 in addition to the second longitudinal portion 35 and the second head 36. The second electrode pattern 38 has a rectangular planar shape and is electrically connected to the second longitudinal portion 35. Each of the first electrode pattern 37 and the second electrode pattern 38 is electrically connected to the wiring pattern formed on the substrate on which the push switch 4 is arranged by soldering.

In the push switch 4, the first conductive member 11b and the second conductive member 12b are parallel to the first head 34 and the second head 36 and the second surface 22b rather than the first longitudinal portion 33 and the second longitudinal portion 35. Since it has a first electrode pattern 37 and a second electrode pattern 38 having a large cross-sectional area, electrical connection is easy. Further, the first electrode pattern 37 and the second electrode pattern 38 are joined to the second surface 22b, and the first head 34 and the second head 36 extend in the short side direction of the second surface 22b. On the other hand, the first electrode pattern 37 and the second electrode pattern 38 extend in the long side direction of the second surface 22b. Since the first conductive member 11b and the second conductive member 12b are stretched in different directions with respect to the first longitudinal portion 33 and the second longitudinal portion 35, the first conductive member 11b and the second conductive member 12b are prevented from being peeled off from the first recess 31 and the second recess 32. Can be prevented.

Further, in the push switch 4, when the first electrode pattern 37 and the second electrode pattern 38 and the mounting board are connected by soldering, a force is generated to bring the second surface 22 into close contact with the side surface of the mounting board. , The adhesion between the mounting substrate and the mounting substrate can be further improved.

Further, since the first electrode pattern 37 and the second electrode pattern 38 arranged in the direction orthogonal to the direction in which the pressing member 17 is pressed are soldered to the push switch 4, the push switch 4 is mounted by repeatedly pressing the pressing member 17. It is possible to suppress peeling from the substrate.

(Configuration and function of push switch according to the fifth embodiment)
FIG. 17 (a) is a perspective view (No. 1) of the push switch according to the fifth embodiment, and FIG. 17 (b) is a perspective view (No. 2) of the push switch according to the fifth embodiment.

The push switch 5 differs from the push switch 3 in that the substrate 10c is provided in place of the substrate 10a. The push switch 5 differs from the push switch 3 in that it has a first side surface pattern 47 and a second side surface pattern 48. The components of the push switch 5 other than the substrate 10c, the first side surface pattern 47, and the second side surface pattern 48 have the same components and functions as those of the push switch 3 having the same reference numerals. A detailed description will be omitted.

The substrate 10c may have a third surface 23c, a fifth surface 25c, a sixth surface 26c, and a seventh surface 27c in place of the third surface 23a, the fifth surface 25a, the sixth surface 26a, and the seventh surface 27a. It is different from 10a. Since the components of the substrate 10c other than the third surface 23c, the fifth surface 25c, the sixth surface 26c, and the seventh surface 27c are the same as the components of the substrate 10a with the same reference numerals. , Detailed description is omitted here. In the third surface 23c, the fifth surface 25c, the sixth surface 26c, and the seventh surface 27c, a pair of recesses in which the first side surface pattern 47 and the second side surface pattern 48 are arranged are the first conductive member 11a and the second conductive member 11a. It is formed so as to be in contact with each of the sex members 12a.

The first side surface pattern 47 and the second side surface pattern 48 are formed by, for example, a metal-containing resin paste and metal plating, and the fifth surface 25c and the second surface pattern 48 extend from the third surface 23c toward the seventh surface 27c. It is arranged in a pair of recesses formed on each of the six surfaces 26c. The first side surface pattern 47 and the second side surface pattern 48 are arranged so as to face each other via the third surface 23c and the seventh surface 27c.

FIG. 18 (a) is a side view (No. 1) of the push switch 5 mounted on the mounting board, and FIG. 18 (b) is a side view (No. 2) of the push switch 5 mounted on the mounting board.

The first wiring pattern 111 and the second wiring pattern 112 are arranged on the surface of the mounting board 110 on which the push switch 5 is mounted. The first wiring pattern 111 and the second wiring pattern 112 are formed of a conductor such as copper, and are connected to each of the first side surface pattern 47 and the second side surface pattern 48 by soldering. The first wiring pattern 111 is electrically connected to the first fixed contact 13 via the first conductive member 11a, and the second wiring pattern 112 is electrically connected to the second fixed contact 14 via the second conductive member 12a. Connected to.

In the embodiment described with reference to FIG. 18, the first side surface pattern 47 and the second side surface pattern 48 of the push switch 5 have the first wiring pattern 111 and the second side surface pattern 48 on the end surface of the substrate 10c facing the third surface 23c. It is soldered to the wiring pattern 112. However, the push switch 5 may be electrically connected to the wiring pattern of the mounting board by soldering the end faces of the board 10c facing the fifth surface 25c and the sixth surface 26c. Further, the first side surface pattern 47 and the second side surface pattern 48 extend from the third surface 23c to the seventh surface 27c, but do not have to reach the seventh surface 27c. Further, the push switch according to the embodiment includes a first electrode pattern 37 and a second electrode pattern 38 arranged on the fifth and sixth surfaces, respectively, in addition to the first electrode pattern 37 and the second electrode pattern 38. It may have a third electrode pattern and a fourth electrode pattern having the same shape. In the push switch according to the embodiment, the adhesion strength with the soldered mounting substrate can be improved by forming the third electrode pattern and the fourth electrode pattern.

Since the first electrode pattern 37 and the second electrode pattern 38 are arranged on the second surface 24d of the push switch 5, electrical connection is easy. Further, in the push switch 5, when each of the first side surface pattern 47 and the second side surface pattern 48 is soldered, a solder fillet is formed in the vicinity of the seventh surface 27c, so that the solder crawling state can be visually recognized. Easy to do.

(Configuration and function of push switch according to the sixth embodiment)
FIG. 19 (a) is a perspective view (No. 1) of the push switch according to the sixth embodiment, and FIG. 19 (b) is a perspective view (No. 2) of the push switch according to the sixth embodiment.

The push switch 6 is different from the push switch 4 in that the substrate 10d is provided in place of the substrate 10b. Since the components and functions of the push switch 6 other than the substrate 10d are the same as the components and functions of the push switch 4 having the same reference numerals, detailed description thereof will be omitted here.

The substrate 10d is different from the substrate 10b in that it has a convex portion 29. Since the configurations and functions of the components of the substrate 10d other than the convex portion 29 are the same as the configurations and functions of the components of the substrate 10b with the same reference numerals, detailed description thereof will be omitted here. The convex portion 29 is a rectangular parallelepiped-shaped protrusion extending parallel to the third surface 23 from the opposite end of the end portion of the fourth surface 24 in contact with the third surface 23. The convex portion 29 can be formed, for example, by dicing the fourth surface 24 in the direction of the first surface 21. The convex portion 29 may be formed by being adhered to the end portion of the fourth surface 24, and is formed by bending the end portion of the fourth surface 24 in a direction orthogonal to the extending direction of the fourth surface 24. May be good.

FIG. 20 is a side view of the push switch 6 mounted on the mounting board.

A wiring pattern 121 formed of a conductor such as copper is arranged on the surface of the mounting board 120 on which the push switch 6 is mounted. The wiring pattern 121 is electrically connected to the second conductive member 12b by the solder 122. The first conductive member 11b (not shown) is also electrically connected in the same manner. The convex portion 29 is arranged so as to be in contact with the back surface of the mounting substrate 120.

In the push switch 6, since the convex portion 29 is in contact with the back surface of the mounting board 120, the solder 122 contracts when the wiring pattern 121 is connected by the solder 122, and the end portion of the push switch 6 on the first surface 21 side rises. Can be prevented. The fourth surface 24 may be in contact with the side surface of the mounting board 120.

(Configuration and function of push switch according to the seventh embodiment)
21 (a) is a perspective view (No. 1) of the push switch according to the seventh embodiment, and FIG. 21 (b) is a perspective view (No. 2) of the push switch according to the seventh embodiment. 21 (c) is a front view of the push switch according to the seventh embodiment, and FIG. 21 (d) is a rear view of the push switch according to the seventh embodiment.

The push switch 7 is different from the push switch 1 in that it has a pair of metal plates 19a. Since the components and functions of the push switch 7 other than the pair of metal plates 19a are the same as the components and functions of the push switch 1 having the same reference numerals, detailed description thereof will be omitted here.

The pair of metal plates 19a is a conductor formed of a metal such as copper, which is also called a lead frame, and is the first head of the first conductive member 11 and the second conductive member 12, which are a pair of conductive members. It is arranged so as to be in contact with each of the portion 34 and the second head 36.

(Configuration and function of push switch according to the eighth embodiment)
FIG. 22 (a) is a perspective view (No. 1) of the push switch according to the eighth embodiment, and FIG. 22 (b) is a perspective view (No. 2) of the push switch according to the eighth embodiment.

The push switch 8 differs from the push switch 7 in that it has a pair of metal plates 19b instead of the pair of metal plates 19a. Since the components and functions of the push switch 8 other than the pair of metal plates 19b are the same as the components and functions of the push switch 7 having the same reference numerals, detailed description thereof will be omitted here.

Like the pair of metal plates 19a, the pair of metal plates 19b is a conductor formed of a metal such as copper, and the pair of conductive members, the first conductive member 11 and the second conductive member 12, It is arranged so as to be in contact with each side surface of the first longitudinal portion 33 and the second longitudinal portion 35.

(Configuration and function of push switch according to the ninth embodiment)
FIG. 23 (a) is a perspective view (No. 1) of the push switch according to the ninth embodiment, and FIG. 23 (b) is a perspective view (No. 2) of the push switch according to the ninth embodiment.

The push switch 9 differs from the push switch 7 in that it has a pair of metal plates 19c instead of the pair of metal plates 19a. Since the components and functions of the push switch 9 other than the pair of metal plates 19c are the same as the components and functions of the push switch 7 having the same reference numerals, detailed description thereof will be omitted here.

Like the pair of metal plates 19a, the pair of metal plates 19c is a conductor formed of a metal such as copper, and the pair of conductive members, the first conductive member 11 and the second conductive member 12, It is arranged so as to be in contact with the bottom surface of each of the first longitudinal portion 33 and the second longitudinal portion 35.

The push switches 7 to 9 connect the first conductive member 11 and the second conductive member 12 to the wiring pattern of the mounting substrate via the pair of metal plates 19a to 19c, thereby connecting the first conductive member 11 and the second conductive member 12 to the wiring pattern of the mounting substrate. The connection area between the second conductive member 12 and the wiring pattern of the mounting board can be increased.

In the push switches 7 to 9, a pair of metal plates are arranged so as to be in contact with the first conductive member 11 and the second conductive member 12, but the push switch according to the embodiment is instead of arranging the metal plates. The first and second conductive members may be projected.

(Modified example of push switch according to the embodiment)
In the push switches 1, 2 and 4 to 9, the first recess 31 and the second recess 32 extend to the first surface 21, but in the push switch according to the embodiment, the first recess and the second recess are first. It does not have to extend to the surface 21, and a pair of conductive portions may be arranged on the fourth surface. When the first recess 31 and the second recess 32 do not extend to the first surface 21, the pair of conductive portions are electrically connected to the first fixed contact 13 and the second fixed contact 14 via an appropriate path such as an outer edge. Connected to.

Further, in the push switches 1 to 9, the first concave portion 31 and the second concave portion 32 are filled with the first conductive member 11 and the second conductive member 12, but in the push switch according to the embodiment, the first concave portion 31 is filled. And the second recess 32 may be filled with an insulating paste. Further, in the push switch according to the embodiment, none of the members may be filled in the first recess 31 and the second recess 32.

When none of the members is filled in the first recess 31 and the second recess 32, the push switch according to the embodiment is mounted on the mounting board by filling the first recess 31 and the second recess 32 with solder. Therefore, it is prevented from being lifted from the mounting board.

Further, in the push switch according to the embodiment, the solder mounting area can be increased by filling the first recess 31 and the second recess 32 with solder and mounting the switch on the mounting board.

Further, the push switches 1 to 9 may be surrounded by a metal frame and mounted on a mounting board. By surrounding the push switches 1 to 9 with a metal frame, it is possible to securely fix the push switches 1 to 9 by the mounting substrate and prevent members such as the movable contact 15 and the pressing member 17 from falling off.

Further, the push switches 1 to 9 are formed as a pair of push switches having L-shaped side surfaces by the first cutting step to the third cutting step as described with reference to FIG. The push switch according to the form may be manufactured by another method.

FIG. 24 is a diagram showing a first modification of the manufacturing method of the push switch 1, FIG. 24 (a) shows a base material preparation step, FIG. 24 (b) shows a first cutting step, and FIG. 24 (c) shows. ) Is a diagram showing a second cutting process. In FIGS. 24 (a) to 24 (c), the hatched portion indicates a portion that is cut and deleted when the push switch 1 is manufactured.

In the first modification of the method for manufacturing the push switch 1, first, in the base material preparation step shown in FIG. 24 (a), the base material 200 is inverted as in the base material preparation step shown in FIG. 7 (a). Prepared at.

Next, in the first cutting step shown in FIG. 24B, the base material 200 used for manufacturing the push switch 1 is cut by a dicing saw (not shown) so that a recess corresponding to the groove 30 is formed. A plurality of second cutting grooves 212 are formed. In the first cutting step shown in FIG. 24 (b), the first cutting step and the second cutting step shown in FIGS. 7 (b) and 7 (c) are realized by a single cutting step.

Then, in the second cutting step shown in FIG. 24 (c), the dicing saw is used to move between the plurality of second cutting grooves 212 in a direction parallel to the third surface and a direction parallel to the normal of the third surface. A plurality of push switches 1 are formed by cutting in an array shape.

FIG. 25 is a diagram showing a second modification of the manufacturing method of the push switch 1, FIG. 25 (a) shows a base material preparation step, FIG. 25 (b) shows a first cutting step, and FIG. 25 (c). ) Indicates the second cutting process. In FIGS. 25 (a) to 25 (c), the hatched portion indicates a portion that is cut and deleted when the push switch 1 is manufactured.

In the second modification of the method for manufacturing the push switch 1, first, in the base material preparation step shown in FIG. 25 (a), the base material 400 is prepared in an inverted state. In the base material 400, one component corresponding to each of the substrate 10 to the protective cover 18 included in the push switch 1 is arranged at a position corresponding to the positional relationship of each component included in the push switch 1. ..

Next, in the first cutting step shown in FIG. 25 (b), the base material 400 is cut by a dicing saw (not shown), and a plurality of second cutting grooves 412 are formed so that recesses corresponding to the grooves 30 are formed. Will be done.

Then, in the second cutting step shown in FIG. 25 (c), the base material 400 is cut by a dicing saw in the direction orthogonal to the cutting direction of the first cutting step to form a single push switch 1.

FIG. 26 is a diagram showing a third modification of the manufacturing method of the push switch 1, FIG. 26A shows a first base material preparation step, and FIG. 26B shows a second base material preparation step. FIG. 26 (c) shows the joining process. In FIGS. 26 (a) to 26 (c), the hatched portions indicate the conductive members corresponding to the first conductive member 11 and the second conductive member 12.

In the third modification of the method for manufacturing the push switch 1, first, in the first base material preparation step shown in FIG. 26 (a), the first base material 501 is prepared in an inverted state. The first base material 501 is a part of the substrate 10 including the first surface 21 and the fourth surface 24, the first head 34 and the second head 36 of the first conductive member 11 and the second conductive member 12, and the second head 36. A member corresponding to each of the first fixed contact 13 to the protective cover 18 is included.

Next, in the second base material preparation step shown in FIG. 26 (b), the second base material 502 is prepared. The second base material 502 includes a part of the substrate 10 including the second surface 22, the third surface 23, and the seventh surface 27, and the first longitudinal portion 33 and the first longitudinal portion 33 of the first conductive member 11 and the second conductive member 12. A member corresponding to each of the second longitudinal portions 35 is included.

Then, in the joining step shown in FIG. 26 (c), the first base material 501 and the second base material 502 are bonded to form a single push switch 1.

27 is a diagram showing a fourth modification of the manufacturing method of the push switch 1, FIG. 27 (a) shows a base material preparation step, FIG. 27 (b) shows a joining step, and FIG. 27 (c) shows a joining step. The cutting process is shown. In FIGS. 27 (a) to 27 (c), the hatched portions indicate the conductive members corresponding to the first conductive member 11 and the second conductive member 12.

In the fourth modification of the method for manufacturing the push switch 1, first, in the base material preparation step shown in FIG. 27 (a), the first base material 511 is prepared in an inverted state, and a pair of second base materials 502. Is prepared. The first base material 511 is a member in which the base materials corresponding to the first base material 501 are joined so as to be line-symmetrical.

Next, in the joining step shown in FIG. 27 (b), a pair of second base materials 502 are joined to the first base material 511 so that their third surfaces 23 face each other.

Then, in the cutting step shown in FIG. 27 (c), the central portion of the first base material 511 is cut to form a pair of push switches 1.

FIG. 28 is a diagram showing a fifth modification of the manufacturing method of the push switch 1, FIG. 28A shows a base material preparation step, FIG. 28B shows a joining step, and FIG. 28C shows a joining step. The cutting process is shown. In FIGS. 28 (a) to 28 (c), the hatched portions indicate the conductive members corresponding to the first conductive member 11 and the second conductive member 12.

In the fifth modification of the method for manufacturing the push switch 1, first, in the base material preparation step shown in FIG. 28 (a), the first base material 521 is prepared in an inverted state, and the pair of second base materials 502 Is prepared. The first base material 521 is a member in which the base materials corresponding to the first base material 501 are joined so as to face in the same direction.

Next, in the joining step shown in FIG. 28B, a pair of second base materials 502 are joined to the first base material 521 so that their third surfaces 23 face the same direction.

Then, in the cutting step shown in FIG. 28 (c), the central portion of the first base material 521 is cut to form a pair of push switches 1.

Claims (15)

1. A first surface on which a first fixed contact and a second fixed contact arranged around the first fixed contact are arranged, a second surface located on the opposite side of the first surface, and the second surface. A substrate having a third surface extending from the corner to a corner in a direction orthogonal to the first surface, and a fourth surface extending parallel to the first surface from the corner.
   A conductive movable contact is provided so that the peripheral portion is in contact with the second fixed contact and the central portion is in contact with the first fixed contact when pressed.
   In the fourth surface, a pair of conductive portions are arranged in the vicinity of the ends of the pair of sides extending in the direction orthogonal to the first surface of the third surface.
   A push switch that features that.
2. The push switch according to claim 1, wherein each of the pair of conductive portions is arranged in a pair of recesses formed in the vicinity of the ends of the pair of sides.
3. The push switch according to claim 2, wherein each of the pair of conductive portions extends to the first surface.
4. The push switch according to claim 3, wherein each of the pair of recesses is filled with a conductive member.
5. The push switch according to claim 4, wherein each of the pair of recesses is further extended to a pair of sides extending in a direction orthogonal to the first surface of the third surface.
6. The push switch according to claim 5, wherein each of the pair of recesses is continuously formed between the second surface and the fourth surface.
7. The push switch according to claim 6, wherein each of the pair of conductive members is further arranged in the recess formed continuously between the second surface and the fourth surface.
8. The push switch according to claim 7, wherein each of the pair of conductive members is further arranged on the second surface.
9. The push switch according to claim 8, wherein the substrate further has a convex portion extending in parallel with the third surface from an end opposite to the end portion of the fourth surface in contact with the third surface.
10. The push switch according to any one of claims 1 to 7, further comprising a pair of conductive members arranged so as to come into contact with each of the pair of conductive members.
11. The substrate has a fifth surface and a sixth surface orthogonal to any of the first surface, the second surface, the third surface, and the fourth surface, and a seventh surface located opposite to the third surface. With more
    The push switch according to claim 7, wherein at least one of the fifth surface and the sixth surface is arranged with a side surface pattern extending from the third surface toward the seventh surface.
12. A first surface on which a first fixed contact and a second fixed contact arranged around the first fixed contact are arranged, a second surface located on the opposite side of the first surface, and the second surface. A substrate having a third surface extending from the corner to a corner in a direction orthogonal to the first surface, and a fourth surface extending parallel to the first surface from the corner.
    A conductive movable contact is provided so that the peripheral portion is in contact with the second fixed contact and the central portion is in contact with the first fixed contact when pressed.
    The second surface is a push switch in which a pair of recesses filled with a conductive member are formed in the vicinity of the ends of a pair of sides extending in a direction orthogonal to the first surface of the third surface. It ’s a manufacturing method,
    A base material preparation step of preparing a base material having components corresponding to the first fixed contact, the second fixed contact, and the movable contact on one surface, and
    A push switch forming step of molding the base material to form the push switch,
    A method of manufacturing a push switch, which comprises.
13. The method for manufacturing a push switch according to claim 12, wherein the conductive member is inserted from the front surface on which the component is arranged to the back surface opposite to the front surface.
14. The method for manufacturing a push switch according to claim 13, wherein the conductive member is inserted from a surface on which the component is arranged to a predetermined position between the front surface and the back surface opposite to the front surface.
15. In the base material preparation step, a collective substrate into which a plurality of columnar conductive members extending in the height direction are inserted, and the first fixed contact, the second fixed contact, and the second fixed contact arranged on the surface of the collective substrate. Including the step of preparing a base material having a component corresponding to the movable contact.
    The push switch forming step is
    A first cutting groove is formed by cutting the collective substrate from the back surface at a first depth in a direction parallel to the third surface so as to include a part of the plurality of conductive members. Cutting process and
    A plurality of second cutting grooves are alternately cut between the plurality of first cutting grooves from the back surface in a direction parallel to the third surface at a second depth shallower than the first depth. The second cutting process to form
    A third that cuts between the plurality of second cutting grooves in an array in a direction parallel to the third surface and a direction parallel to the normal of the third surface to separate the plurality of push switches. Cutting process and
    12. The method of manufacturing a push switch according to claim 12.

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