WO2021047409A1 - 终端设备及其制造方法 - Google Patents

终端设备及其制造方法 Download PDF

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Publication number
WO2021047409A1
WO2021047409A1 PCT/CN2020/112522 CN2020112522W WO2021047409A1 WO 2021047409 A1 WO2021047409 A1 WO 2021047409A1 CN 2020112522 W CN2020112522 W CN 2020112522W WO 2021047409 A1 WO2021047409 A1 WO 2021047409A1
Authority
WO
WIPO (PCT)
Prior art keywords
cavity
sim card
circuit board
board
elevated
Prior art date
Application number
PCT/CN2020/112522
Other languages
English (en)
French (fr)
Inventor
张诗豪
雷高兵
苏天杰
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2021047409A1 publication Critical patent/WO2021047409A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3816—Mechanical arrangements for accommodating identification devices, e.g. cards or chips; with connectors for programming identification devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3816—Mechanical arrangements for accommodating identification devices, e.g. cards or chips; with connectors for programming identification devices
    • H04B1/3818—Arrangements for facilitating insertion or removal of identification devices

Definitions

  • This application relates to the field of communications, and in particular to a terminal device and a manufacturing method thereof.
  • SIM subscriber identity module
  • the SIM card holder assembly with the above structure occupies more layout area of the circuit board, which is not conducive to the full use of the internal space of the mobile phone, and has become a key obstacle restricting the further development of terminal devices.
  • the present application provides a terminal device and a manufacturing method thereof.
  • the traditional card holder is raised through an elevated board, and a first cavity is formed between the elevated board and the circuit board, so that the current SIM card holder assembly occupies a large area of the circuit board.
  • more devices are placed in the first cavity to make full use of the space occupied by the SIM card socket assembly.
  • the space saved by the elevated board is extremely important for the terminal equipment.
  • the thickness of the terminal device can be reduced, and the miniaturization and ultra-thinness of the terminal device can be realized.
  • a terminal device including: a circuit board, a housing and an elevated board, the housing and the elevated board are both fixed on the circuit board, the elevated board is located between the housing and the circuit board, the elevated board and the circuit A first cavity is formed between the boards, the first cavity is a semi-closed structure or a fully enclosed structure, and a second cavity is formed between the elevated board and the housing, and the second cavity is used for placing the SIM card.
  • a first cavity can be formed between the circuit board and the elevated board.
  • the circuit occupied by the SIM card socket assembly can be reduced.
  • the space of the board is fully utilized, freeing the SIM card socket assembly to occupy part of the space inside the terminal device.
  • the terminal device further includes a card holder and a metal dome, the card holder and the metal dome are located in the second cavity, the metal dome is fixed on the card seat, and the metal dome is It is directly or indirectly electrically connected with the circuit board, and the card holder and the metal spring are used to fix the SIM card.
  • the card holder and the metal shrapnel are arranged in the second cavity, it is possible to provide better stability and better electrical connection for the externally inserted SIM card.
  • the terminal device further includes a card socket, the card socket is located in the second cavity, the card socket is provided with at least one metal contact point, at least one metal contact point and the circuit board Directly or indirectly electrically connected.
  • the metal shrapnel structure is reduced, which can further simplify the structure of the SIM card while providing good stability and electrical connection.
  • the clamp is fixed on the surface of the elevated plate in the second cavity, or the clamp is fixed on the surface of the housing opposite to the surface of the elevated plate. In this way, the position of the card holder can be flexibly set according to the design and actual needs.
  • the elevated board includes three sides or four sides, and the three sides or four sides are fixed on the circuit board.
  • the structure of the first cavity can be changed according to the design and actual needs to make it a fully enclosed structure or a semi-enclosed structure.
  • the material of the elevated board is metal.
  • the elevated board is made of metal materials, and when the electronic devices are arranged in the first cavity, the electromagnetic interference of the external electrical signals to the devices in the first cavity can be effectively reduced.
  • an electronic device is provided in the first cavity, and the electronic device is directly or indirectly electrically connected to the circuit board.
  • electronic devices can be arranged in the first cavity, which effectively utilizes the space of the circuit board occupied by the SIM card socket assembly, and releases a part of the space occupied by the SIM card socket assembly inside the terminal device.
  • the electronic device is at least one of a capacitor, an inductor, or a resistor.
  • the electronic devices can also be switches, duplexers, etc. for radio frequency circuits. Or a decoding chip for baseband circuits, etc.
  • an embedded SIM card is disposed in the first cavity, and the embedded SIM card is directly or indirectly electrically connected to the circuit board.
  • an embedded SIM card can be arranged in the first cavity, which effectively utilizes the space of the circuit board occupied by the SIM card socket assembly, releases part of the space occupied by the SIM card socket assembly inside the terminal device, and saves more space for the circuit board.
  • the SIM card is a third-generation SIM card or a fourth-generation SIM card.
  • the terminal device can support different types of SIM cards, and at the same time, the used SIM card can be a third-generation SIM card or a fourth-generation SIM card, which occupies a small area and can save more space for the circuit board.
  • a method for manufacturing a terminal device can manufacture any of the above-mentioned terminal devices in the first aspect.
  • the manufacturing method includes: fixing an elevated board on a circuit board, and between the elevated board and the circuit board.
  • a first cavity is formed between the first cavity.
  • the first cavity is a semi-enclosed structure or a fully enclosed structure.
  • the housing is fixed on the circuit board on the same side as the elevated board.
  • the housing is located above the elevated board and forms between the elevated board and the housing.
  • the second cavity, the second cavity is used to place the SIM card.
  • a first cavity can be formed between the circuit board and the elevated board.
  • the circuit occupied by the SIM card socket assembly can be reduced.
  • the space of the board is fully utilized, freeing the SIM card socket assembly to occupy part of the space inside the terminal device.
  • the manufacturing method further includes fixing the holder and the metal spring in the second cavity, and the metal spring is fixed on the holder and directly or indirectly electrically connected to the circuit board. Connection, card holder and metal shrapnel are used to fix the SIM card. In this way, by arranging the card holder and the metal shrapnel in the second cavity, it is possible to provide better stability and better electrical connection for the externally inserted SIM card.
  • the manufacturing method further includes fixing the card holder in the second cavity, the card holder is provided with at least one metal contact point, and the at least one metal contact point is directly connected to the circuit board. Or indirectly electrically connected. In this way, the metal shrapnel structure is reduced, which can further simplify the structure of the SIM card while providing good stability and electrical connection.
  • the clamp is fixed on the surface of the elevated plate in the second cavity, or the clamp is fixed on the surface of the housing opposite to the surface of the elevated plate. In this way, the position of the card holder can be flexibly set according to the design and actual needs.
  • the elevated board includes three sides or four sides, and the three sides or four sides are fixed on the circuit board.
  • the structure of the first cavity can be changed according to the design and actual needs to make it a fully enclosed structure or a semi-enclosed structure.
  • the material of the elevated board is metal.
  • the elevated board is made of metal materials, and when the electronic devices are arranged in the first cavity, the electromagnetic interference of the external electrical signals to the devices in the first cavity can be effectively reduced.
  • an electronic device is provided in the first cavity, and the electronic device is directly or indirectly electrically connected to the circuit board.
  • electronic devices can be arranged in the first cavity, which effectively utilizes the space of the circuit board occupied by the SIM card socket assembly, and releases a part of the space occupied by the SIM card socket assembly inside the terminal device.
  • the electronic device is at least one of a capacitor, an inductor, or a resistor.
  • the electronic devices can also be switches, duplexers, etc. for radio frequency circuits. Or a decoding chip for baseband circuits, etc.
  • an embedded SIM card is provided in the first cavity, and the embedded SIM card is directly or indirectly electrically connected to the circuit board.
  • an embedded SIM card can be arranged in the first cavity, which effectively utilizes the space of the circuit board occupied by the SIM card socket assembly, releases part of the space occupied by the SIM card socket assembly inside the terminal device, and saves more space for the circuit board.
  • the SIM card is a third-generation SIM card or a fourth-generation SIM card.
  • the terminal device can support different types of SIM cards, and at the same time, the used SIM card can be a third-generation SIM card or a fourth-generation SIM card, which occupies a small area and can save more space for the circuit board.
  • a SIM card holder assembly for terminal equipment, including: a housing and an elevated board, the housing and the elevated board are both fixed on the circuit board of the terminal device, and the elevated board is located between the housing and the circuit board. Between the elevated board and the circuit board, a first cavity is formed. The first cavity is a semi-enclosed structure or a fully enclosed structure. A second cavity is formed between the elevated board and the housing. The second cavity is used to place the SIM. card.
  • a first cavity can be formed between the circuit board and the elevated board.
  • the circuit occupied by the SIM card socket assembly can be reduced.
  • the space of the board is fully utilized, freeing the SIM card socket assembly to occupy part of the space inside the terminal device.
  • the SIM card socket assembly further includes a card socket and a metal spring, the card socket and the metal spring are located in the second cavity, and the metal spring is fixed on the card socket and is connected to the circuit
  • the board is directly or indirectly electrically connected, and the card holder and the metal shrapnel are used to fix the SIM card.
  • the card holder and the metal shrapnel are used to fix the SIM card.
  • the SIM card socket assembly further includes a card socket, the card socket is located in the second cavity, the card socket is provided with at least one metal contact point, and at least one metal contact point is connected to the The circuit board is directly or indirectly electrically connected.
  • the metal shrapnel structure is reduced, which can further simplify the structure of the SIM card while providing good stability and electrical connection.
  • the clamp is fixed on the surface of the elevated plate in the second cavity, or the clamp is fixed on the surface of the housing opposite to the surface of the elevated plate. In this way, the position of the card holder can be flexibly set according to the design and actual needs.
  • the elevated board includes three sides or four sides, and the three sides or four sides are fixed on the circuit board.
  • the structure of the first cavity can be changed according to the design and actual needs to make it a fully enclosed structure or a semi-enclosed structure.
  • the material of the elevated board is metal.
  • the elevated board is made of metal materials, and when the electronic devices are arranged in the first cavity, the electromagnetic interference of the external electrical signals to the devices in the first cavity can be effectively reduced.
  • an electronic device is provided in the first cavity, and the electronic device is directly or indirectly electrically connected to the circuit board.
  • electronic devices can be arranged in the first cavity, which effectively utilizes the space of the circuit board occupied by the SIM card socket assembly, and releases a part of the space occupied by the SIM card socket assembly inside the terminal device.
  • the electronic device is at least one of a capacitor, an inductor, or a resistor.
  • the electronic devices can also be switches, duplexers, etc. for radio frequency circuits. Or a decoding chip for baseband circuits, etc.
  • an embedded SIM card is disposed in the first cavity, and the embedded SIM card is directly or indirectly electrically connected to the circuit board.
  • an embedded SIM card can be arranged in the first cavity, which effectively utilizes the space of the circuit board occupied by the SIM card socket assembly, releases part of the space occupied by the SIM card socket assembly inside the terminal device, and saves more space for the circuit board.
  • the SIM card is a third-generation SIM card or a fourth-generation SIM card.
  • the terminal device can support different types of SIM cards, and at the same time, the used SIM card can be a third-generation SIM card or a fourth-generation SIM card, which occupies a small area and can save more space for the circuit board.
  • the traditional card holder can be raised by the elevated board, the first cavity formed between the elevated board and the circuit board, and the electronic device or eSIM card can be set in the first cavity, and the SIM card holder can be
  • the space of the circuit board occupied by the component is fully utilized, freeing up part of the space inside the terminal device occupied by the SIM card socket component, and can also reduce the thickness of the terminal device, and realize the miniaturization and ultra-thinness of the terminal device.
  • Fig. 1 is a schematic diagram of a terminal device provided by an embodiment of the present application.
  • Fig. 2 is a schematic structural diagram of a SIM card holder assembly provided by an embodiment of the present application.
  • Fig. 3 is a side sectional view of Fig. 2 along the direction of inserting the SIM card.
  • Fig. 4 is an enlarged schematic view of the detail of Fig. 3.
  • Fig. 5 is a schematic structural diagram of another SIM card holder assembly provided by an embodiment of the present application.
  • Fig. 6 is a side sectional view of Fig. 5 along the direction of inserting the SIM card.
  • Fig. 7 is an enlarged schematic view of the detail of Fig. 6.
  • FIG. 8 is a schematic structural diagram of a terminal device provided by an embodiment of the present application.
  • the terminal device in the embodiment of the present application may be a mobile phone, a tablet computer, a notebook computer, a smart bracelet, a smart watch, a smart helmet, a smart glasses, and other terminal devices that need to insert a SIM card for communication.
  • the terminal equipment can also be a cellular phone, a cordless phone, a session initiation protocol (SIP) phone, a wireless local loop (WLL) station, a personal digital assistant (PDA), with wireless communication Functional handheld devices, computing devices, or other processing devices connected to wireless modems, vehicle-mounted devices, terminal devices in 5G networks, or terminal devices in public land mobile networks (PLMN) that will evolve in the future.
  • SIP session initiation protocol
  • WLL wireless local loop
  • PDA personal digital assistant
  • the application embodiment does not limit this.
  • FIG. 1 is a schematic diagram of a terminal device 100.
  • the terminal device 100 is used as a mobile phone for description.
  • the terminal device 100 may include a housing and a display screen, and the display screen is installed on the housing.
  • the terminal device 100 also includes electronic components (not shown in the figure) arranged inside the casing.
  • the electronic components include a processor, a camera, a flashlight, a microphone, a battery, etc., but are not limited thereto.
  • the shell may be a metal shell, such as magnesium alloy, stainless steel and other metals.
  • it may also be a plastic shell, a glass shell, a ceramic shell, etc., but it is not limited thereto.
  • the terminal device may also include a SIM card interface, and the SIM card interface is used to connect to the SIM card.
  • the SIM card can be connected to and separated from the terminal device by inserting it into the SIM card interface or pulling it out from the SIM card interface.
  • the terminal device can support 1 or N SIM card interfaces, and N is a positive integer greater than 1.
  • the SIM card interface can support third-generation SIM cards (micro-SIM) or fourth-generation SIM cards (nano-SIM), etc.
  • the same SIM card interface can insert multiple cards at the same time. The types of multiple cards can be the same or different.
  • the SIM card interface can also be compatible with different types of SIM cards.
  • the SIM card interface can also be compatible with external memory cards.
  • the terminal equipment interacts with the network through the SIM card to realize functions such as call and data communication.
  • the terminal device adopts an embedded-SIM (eSIM) card.
  • eSIM embedded-SIM
  • the eSIM card can be embedded in the terminal device and cannot be separated from the terminal device.
  • the terminal device 100 may also include a SIM card holder assembly 110.
  • the SIM card may be a Nano SIM card, a Micro SIM card, a SIM card, or an eSIM card. It may also be a card with a user identification module that implements the same function in the future application, and this application does not limit the type of the SIM card.
  • the SIM card holder assembly 110 may be fixed on the circuit board of the terminal device 100, and the card insertion port of the SIM card holder assembly may be provided on the housing of the terminal device 100 to facilitate the insertion and removal of the SIM card.
  • the card slot of the SIM card socket assembly 110 of the terminal device can be set at any position of the housing according to the design or actual needs, and the SIM card can be inserted by the card.
  • the port is inserted into the terminal device.
  • FIG. 2 and 3 are schematic diagrams of the structure of a SIM card holder assembly, in which, FIG. 3 is a cross-sectional view of FIG. 2 along the direction of inserting the SIM card.
  • the SIM card holder assembly may include a housing 140 and an elevated plate 150.
  • the housing 140 and the elevated board 150 can both be fixed on the circuit board of the terminal device, and the fixing method can be welding, gluing or snapping.
  • the elevated board 150 can be located between the housing 140 and the circuit board.
  • the bottom of the 150 can be fixed on the circuit board, the first cavity 160 can be formed between the elevated plate 150 and the circuit board, the second cavity 170 can be formed between the elevated plate 150 and the housing 140, and the second cavity 170 is used for When the SIM card is placed, the second cavity 170 may have a card slot for inserting the SIM card.
  • the SIM card holder assembly may further include a holder 120, which can be fixed in the second cavity 170, and the material of the holder 120 may be plastic.
  • At least one metal contact point may be provided on the card socket 120, and the at least one metal contact point is directly or indirectly electrically connected to the circuit board.
  • the card socket 120 can clamp the inserted SIM card with other components in the SIM card socket assembly, For fixing, for example, the other component may be the housing 140 or the elevated plate 150.
  • the other component may be the housing 140 or the elevated plate 150.
  • at least one metal contact point on the card holder 120 can be in contact with multiple contacts of the SIM card. The contact is directly or indirectly electrically connected to the circuit board. Due to the design of the card holder 120, better stability can be provided for the SIM card.
  • the SIM card socket assembly may further include a metal elastic sheet 130, which may be fixed on the card socket 120 and electrically connected with the circuit board directly or indirectly.
  • the holder 120 can be fixed on the surface of the elevated plate 150 in the second cavity 170 by welding, gluing or snapping.
  • One end of the metal spring 130 can be fixed on the holder 120 and connected to the circuit board. Directly or indirectly electrically connected, the other end of the metal spring 130 can be tilted upwards to clamp the SIM card together with the card holder 120 and the housing 140. Due to this design, it can provide better stability for the SIM and prevent the SIM from being damaged by the terminal. A situation where the device is shaken and comes out.
  • the plurality of metal domes 130 may respectively contact a plurality of contacts on the SIM card. Due to the design of the plurality of metal domes 130, a better electrical connection can be provided for the SIM card.
  • the housing 140 can be made of a metal material, which can reduce the interference of external electrical signals on the devices in the first cavity and the second cavity.
  • the metal material can be iron, copper, aluminum, aluminum alloy, or magnesium. Alloy, stainless steel, etc. Since the housing 140 made of metal material is selected, the interference of external electrical signals on the devices in the first cavity and the second cavity can be avoided.
  • the bottom of the housing 140 and the elevated board 150 can be fixed on the circuit board by welding, which can improve the overall stability of the SIM card socket assembly.
  • the shape of the elevated board 150 can be designed according to the design It needs to be determined that the internal structure of the first cavity 160 can be determined according to the shape of the elevated plate 150.
  • the elevated board 150 may have four sides, the bottom of the four sides may be fixed on the circuit board, and the first cavity 160 that is a fully enclosed rectangular cavity is formed between the elevated board 150 and the circuit board. Due to the fully enclosed design of the first cavity 160, a better shielding environment can be provided for the devices disposed therein.
  • the elevated board 150 may have three sides, and the bottom of the three sides may be fixed on the circuit board, and a semi-closed rectangular cavity-like first cavity 160 is formed between the elevated board 150 and the circuit board. Due to the semi-closed design of the first cavity 160, a larger placement space can be provided for the devices arranged in the first cavity. Some of the devices can be partially arranged in the first cavity and the other part can be arranged outside the first cavity.
  • the elevated plate 150 may be made of metal materials or designed as a shielding cover. Due to the metal design, the influence of electrical signals on the interior of the first cavity 160 can be reduced.
  • electronic devices can be arranged inside the first cavity 160 and electrically connected to the circuit board of the terminal device to make full use of the area of the circuit board.
  • the electronic devices arranged in the first cavity are exposed to the metal elevated plate 150.
  • the protection can make the work more stable.
  • electronic devices can be capacitors, inductors, or resistors, one or a combination of several, switches, duplexers, etc. used in radio frequency circuits, or decoding chips used in baseband circuits, etc. This application is not restricted here.
  • an eSIM card can be arranged inside the first cavity 160 to be electrically connected to the circuit board of the terminal device to make full use of the area of the circuit board.
  • the electronic devices arranged in the first cavity are affected by the metal elevated board. Protection can work more stably.
  • the design of the first cavity can be formed between the elevated board and the circuit board, and the first cavity can be used to set up electronic devices or eSIM cards, etc., which can make the SIM card holder
  • the space of the circuit board occupied by the component is fully utilized, freeing up part of the space inside the terminal device occupied by the SIM card socket component, and can also reduce the thickness of the terminal device, and realize the miniaturization and ultra-thinness of the terminal device.
  • FIG. 5 and 6 are structural schematic diagrams of another SIM card holder assembly, among which, FIG. 6 is a cross-sectional view of FIG. 5 along the direction of inserting the SIM card.
  • both the housing 140 and the elevated board 150 can be fixed on the circuit board of the terminal device.
  • the fixing method can be welding, gluing or snapping.
  • the elevated board 150 can be located between the housing 140 and the circuit board. Between the boards, the bottom of the elevated board 150 can be fixed on the circuit board, a first cavity 160 can be formed between the elevated board 150 and the circuit board, and a second cavity 170 can be formed between the elevated board 150 and the housing 140.
  • the second cavity 170 is used for placing a SIM card, and the second cavity 170 may have a card insertion port for inserting the SIM card.
  • the SIM card holder assembly may further include a holder 120, which can be fixed in the second cavity 170, and the material of the holder 120 may be plastic.
  • At least one metal contact point may be provided on the card socket 120, and the at least one metal contact point is directly or indirectly electrically connected to the circuit board.
  • the card socket 120 can clamp the inserted SIM card with other components in the SIM card socket assembly, For fixing, for example, other components can be the housing 140 or the elevated plate 150.
  • at least one metal contact point on the card holder 120 can contact multiple contacts of the SIM card, and the multiple contacts of the SIM card can be contacted.
  • the point is directly or indirectly electrically connected to the circuit board. Due to the design of the card holder 120, better stability can be provided for the SIM card.
  • the SIM card socket assembly may further include a metal elastic sheet 130, which may be fixed on the card socket 120 and electrically connected with the circuit board directly or indirectly.
  • the holder 120 can be fixed on the surface of the housing 140 in the second cavity 170 opposite to the surface of the elevated plate 150 by welding, gluing, or snapping.
  • One end of the metal elastic sheet 130 can be fixed on the holder. 120 and electrically connected to the circuit board directly or indirectly, the other end of the metal spring 130 can be tilted upwards, in a bow shape, and clamp the SIM card together with the card holder 120 and the elevated plate 150. Due to this design, it can be The SIM provides better stability and prevents the SIM from coming out due to shaking of the terminal device.
  • the housing 140 can be made of a metal material, which can reduce the interference of external electrical signals on the devices in the first cavity and the second cavity.
  • the metal material can be iron, copper, aluminum, aluminum alloy, or magnesium. Alloy, stainless steel, etc. Since the housing 140 made of metal material is selected, the interference of external electrical signals on the devices in the first cavity and the second cavity can be avoided.
  • the bottom of the housing 140 and the elevated board 150 can be fixed on the circuit board by welding, which can improve the overall stability of the SIM card socket assembly.
  • the shape of the elevated board 150 can be designed according to the design It needs to be determined that the internal structure of the first cavity 160 can be determined according to the shape of the elevated plate 150.
  • the elevated board 150 may have four sides, the bottom of the four sides may be fixed on the circuit board, and the first cavity 160 that is a fully enclosed rectangular cavity is formed between the elevated board 150 and the circuit board. Due to the fully enclosed design of the first cavity 160, a better shielding environment can be provided for the devices disposed therein.
  • the elevated board 150 may have three sides, and the bottom of the three sides may be fixed on the circuit board, and a semi-closed rectangular cavity-like first cavity 160 is formed between the elevated board 150 and the circuit board. Due to the semi-closed design of the first cavity 160, a larger placement space can be provided for the devices arranged in the first cavity. Some of the devices can be partially arranged in the first cavity and the other part can be arranged outside the first cavity.
  • the elevated plate 150 may be made of a metal material, or designed as a shielding cover. Due to the metal design, the influence of the electrical signal on the inside of the first cavity 160 can be reduced.
  • electronic devices can be arranged inside the first cavity 160 and electrically connected to the circuit board of the terminal device to make full use of the area of the circuit board.
  • the electronic devices arranged in the first cavity are exposed to the metal elevated plate 150.
  • the protection can make the work more stable.
  • electronic devices can be capacitors, inductors, or resistors, one or a combination of several, switches, duplexers, etc. used in radio frequency circuits, or decoding chips used in baseband circuits, etc. This application is not restricted here.
  • an eSIM card can be provided in the first cavity 160, and the eSIM card is electrically connected to the circuit board of the terminal device, so as to make full use of the area of the circuit board.
  • the electronic devices arranged in the first cavity are elevated by metal. The protection of the board can work more stably.
  • the SIM card holder assembly in the embodiment provided in this application can be applied to a third-generation SIM card (micro-SIM) or a fourth-generation SIM card (nano-SIM), and the third-generation SIM card can be called Small card, the fourth generation SIM card can be called the fourth form element integrated circuit board.
  • the size of the third-generation SIM card may be 12 mm ⁇ 15 mm, and the size of the fourth-generation SIM card may be 12 mm ⁇ 9 mm.
  • the design of the first cavity can be formed between the elevated board and the circuit board, and the first cavity can be used to set up electronic devices or eSIM cards, etc., which can make the SIM card holder
  • the space of the circuit board occupied by the component is fully utilized, freeing up part of the space inside the terminal device occupied by the SIM card socket component, and can also reduce the thickness of the terminal device, and realize the miniaturization and ultra-thinness of the terminal device.
  • the fixing method of the card holder can be selected according to the design needs, providing a variety of options.
  • the traditional card holder is raised through the elevated board, and the electronic device or eSIM card is arranged in the first cavity formed between the elevated board and the circuit board, which can be carried out according to the requirements.
  • the electronic device or eSIM card is arranged in the first cavity formed between the elevated board and the circuit board, which can be carried out according to the requirements.
  • Fig. 8 is a schematic diagram of a terminal device.
  • the terminal device may further include a circuit board 180, and the SIM card holder assembly may be fixed on the circuit board 180 by welding, snapping, riveting, or gluing.
  • FIG. 8 is only for schematic reference, the circuit board 180 may be located below the SIM card holder assembly, and the circuit board 180 may also be located above the SIM card holder assembly, which is not limited herein.
  • a first cavity 160 may be formed between the elevated board 150 and the circuit board 180
  • a second cavity 170 may be formed between the elevated board 150 and the housing 140
  • the second cavity 170 may have an insert for SIM card insertion.
  • the bayonet can be arranged on the left side of the second cavity 170
  • the holder 120 can be fixed in the second cavity 170
  • the metal spring 130 can be fixed on the holder 120 and electrically connected to the circuit board
  • the metal spring There may be a plurality of 130, and a plurality of metal springs may respectively contact a plurality of contacts on the SIM card.
  • the elevated plate 150 may be made of a metal material, which can reduce the influence of electrical signals on the interior of the first cavity 160.
  • a first electronic device 1601, a second electronic device 1602, and a third electronic device 1603 may be disposed inside the first cavity 160, wherein the first electronic device 1601, the second electronic device 1602, and the third electronic device 1603 It can be the same kind of electronic devices or different kinds of electronic devices.
  • the first electronic device 1601, the second electronic device 1602, and the third electronic device 1603 may be one or more of capacitors, resistors, and inductors, and may also be switches, duplexers, etc., used in radio frequency circuits. Or a decoding chip used in a baseband circuit, etc., which are not limited in this application, and can be selected according to specific design requirements.
  • the first electronic device 1601, the second electronic device 1602, and the third electronic device 1603 are only examples of the embodiment of the present application, and the embodiment of the present application does not limit the type or quantity of specific electronic devices.
  • the first electronic device 1601, the second electronic device 1602, and the third electronic device 1603 can be welded on the circuit board 180 first, and then the SIM card holder assembly can be welded, so that the elevated board 150 can shield the first cavity Electronic signals in the body reduce the influence of external electrical signals on it.
  • an eSIM card can also be provided inside the first cavity 160, and at the same time, eSIM-related electronic devices can also be provided therein.
  • the eSIM card and its related devices can be soldered on the circuit board 180 first, and then the SIM card The base assembly is welded so that the elevated board 150 can wrap the eSIM card and its related devices, reducing the influence of external electrical signals on it.
  • the present application also provides a terminal device.
  • the terminal device includes the SIM card holder assembly of any structure described above.
  • the SIM card socket assembly of the terminal device of the present application passes through the second cavity formed between the housing and the elevated board, and the first cavity between the elevated board and the circuit board can be provided with a card socket and metal in the second cavity.
  • the shrapnel is provided with an electronic device or an eSIM card in the first cavity, which can make full use of the space occupied by the circuit board by the SIM card socket assembly.
  • the disclosed system, device, and method may be implemented in other ways.
  • the device embodiments described above are merely illustrative, for example, the division of the units is only a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components may be combined or It can be integrated into another system, or some features can be ignored or not implemented.
  • the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may be in electrical or other forms.

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Abstract

本申请提供了一种终端设备及其制造方法，终端设备包括：电路板，外壳和架高板；所述外壳与所述架高板均固定在所述电路板上，所述架高板位于所述外壳与所述电路板之间，所述架高板与所述电路板之间形成第一腔体，所述第一腔体为半封闭结构或全封闭结构，所述架高板与所述外壳之间形成第二腔体，所述第二腔体用于放置SIM卡。在本申请中终端设备中的SIM卡座组件所占空间可以充分利用，释放SIM卡座组件占据终端设备内部的部分空间。

Description

终端设备及其制造方法
本申请要求于2019年9月11日提交中国专利局、申请号为201910858542.5、申请名称为“终端设备及其制造方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及通信领域，尤其涉及一种终端设备及其制造方法。
背景技术
如今，终端设备作为一种方便人们通信的工具，已成为日常生活中不可或缺的必需品，随着消费者生活水平的提高，对终端设备的要求从性能到外观的要求都越来越高，在这种情况下轻薄的终端设备大行其道，在同样的硬件配置的情况下哪种终端设备外观漂亮，体积小便越能得到消费者的青睐。作为机卡分离的终端设备中的重要器件-用户识别模块(subscriber identity module，SIM)卡座组件的固定结构也是很多研发人员关注的地方。
由于终端设备向轻、薄、小巧的趋势发展，上述结构的SIM卡座组件占据电路板较多的布局面积，不利于手机内部空间的充分利用，已经成为制约终端设备进一步做小的关键障碍。
发明内容
本申请提供一种终端设备及其制造方法，通过架高板将传统的卡座抬高，架高板与电路板之间形成第一腔体，这样在目前SIM卡座组件所占电路板的面积不变的基础上，在第一腔体中放入更多器件，使SIM卡座组件所占空间得到充分利用，通过架高板节省出的空间，对于终端设备来说是弥足重要，可以降低终端设备的厚度，实现终端设备小型化和超薄化。
第一方面，提供了一种终端设备，包括：电路板，外壳和架高板，外壳与架高板均固定在电路板上，架高板位于外壳与电路板之间，架高板与电路板之间形成第一腔体，第一腔体为半封闭结构或全封闭结构，架高板与外壳之间形成第二腔体，第二腔体用于放置SIM卡。
这样，通过在电路板与外壳之间设置架高板，可以在电路板与架高板之间形成第一腔体，通过在第一腔体内布置器件，可以将SIM卡座组件所占的电路板的空间充分利用，释放SIM卡座组件占据终端设备内部的部分空间。
结合第一方面，在第一方面的某些实现方式中，终端设备还包括卡座和金属弹片，卡座和金属弹片位于第二腔体中，金属弹片固定在卡座上，所述金属弹片与电路板直接地或间接地电连接，卡座和金属弹片用于固定SIM卡。这样，通过在第二腔体中设置卡座与金属弹片，可以为外部插入的SIM卡提供更好的稳定性与更好的电连接。
结合第一方面，在第一方面的某些实现方式中，终端设备还包括卡座，卡座位于第二腔体中，卡座设置有至少一个金属接触点，至少一个金属接触点与电路板直接地或间接地电连接。这样，减少了金属弹片结构，可以在为SIM卡提供良好的稳定性与电连接的同时进一步简化其结构。
结合第一方面，在第一方面的某些实现方式中，卡座固定在第二腔体内架高板的表面，或者所述卡座固定在与架高板的表面相对的外壳的表面。这样，可以根据设计及实际需要灵活设置卡座位置。
结合第一方面，在第一方面的某些实现方式中，架高板包括三条侧边或四条侧边，三条侧边或四条侧边固定在电路板上。这样，可以根据设计及实际需要改变第一腔体的结构，使其呈全封闭结构或半封闭结构。
结合第一方面，在第一方面的某些实现方式中，架高板的材料为金属。这样，架高板采用金属材料制造，在第一腔体内设置电子器件时，可以有效减小外部电信号对第一腔体内的器件的电磁干扰。
结合第一方面，在第一方面的某些实现方式中，第一腔体内设置有电子器件，电子器件与电路板直接地或间接地电连接。这样，可以在第一腔体内设置电子器件，有效利用SIM卡座组件所占电路板的空间，释放SIM卡座组件占据终端设备内部的部分空间。
结合第一方面，在第一方面的某些实现方式中，电子器件为电容、电感或电阻中的至少一种。这样，可以释放SIM卡座组件占据终端设备内部的部分空间，可以在释放的空间内放置电子器件，节省电路板的布局空间，电子器件还可以是用于射频电路的开关、双工器等，或是用于基带电路的解码芯片等。
结合第一方面，在第一方面的某些实现方式中，第一腔体内设置有嵌入式SIM卡，嵌入式SIM卡与电路板直接地或间接地电连接。这样，可以在第一腔体内设置嵌入式SIM卡，有效利用SIM卡座组件所占电路板的空间，释放SIM卡座组件占据终端设备内部的部分空间，为电路板节省更多空间。
结合第一方面，在第一方面的某些实现方式中，SIM卡为第三代SIM卡或第四代SIM卡。这样，终端设备可以支持不同类型的SIM卡，同时，所使用的SIM卡可以是第三代SIM卡或第四代SIM卡，其所占面积较小，可以为电路板节省更多空间。
第二方面，提供了一种终端设备的制造方法，制造方法可以制造上述第一方面中的任一种终端设备，制造方法包括：架高板固定在电路板上，架高板与电路板之间形成第一腔体，第一腔体为半封闭结构或全封闭结构，将外壳固定在与架高板同侧的电路板上，外壳位于架高板上方，架高板与外壳之间形成第二腔体，第二腔体用于放置SIM卡。
这样，通过在电路板与外壳之间设置架高板，可以在电路板与架高板之间形成第一腔体，通过在第一腔体内布置器件，可以将SIM卡座组件所占的电路板的空间充分利用，释放SIM卡座组件占据终端设备内部的部分空间。
结合第二方面，在第二方面的某些实现方式中，制造方法还包括将卡座和金属弹片固定在第二腔体内，金属弹片固定在卡座上并与电路板直接地或间接地电连接，卡座和金属弹片用于固定SIM卡。这样，通过在第二腔体中设置卡座与金属弹片，可以为外部插入的SIM卡提供更好的稳定性与更好的电连接。
结合第二方面，在第二方面的某些实现方式中，制造方法还包括将卡座固定在第二腔体内，卡座设置有至少一个金属接触点，至少一个金属接触点与电路板直接地或间接地电 连接。这样，减少了金属弹片结构，可以在为SIM卡提供良好的稳定性与电连接的同时进一步简化其结构。
结合第二方面，在第二方面的某些实现方式中，卡座固定在第二腔体内架高板的表面，或者所述卡座固定在与架高板的表面相对的外壳的表面。这样，可以根据设计及实际需要灵活设置卡座位置。
结合第二方面，在第二方面的某些实现方式中，架高板包括三条侧边或四条侧边，三条侧边或四条侧边固定在电路板上。这样，可以根据设计及实际需要改变第一腔体的结构，使其呈全封闭结构或半封闭结构。
结合第二方面，在第二方面的某些实现方式中，架高板的材料为金属。这样，架高板采用金属材料制造，在第一腔体内设置电子器件时，可以有效减小外部电信号对第一腔体内的器件的电磁干扰。
结合第二方面，在第二方面的某些实现方式中，第一腔体内设置有电子器件，电子器件与电路板直接地或间接地电连接。这样，可以在第一腔体内设置电子器件，有效利用SIM卡座组件所占电路板的空间，释放SIM卡座组件占据终端设备内部的部分空间。
结合第二方面，在第二方面的某些实现方式中，电子器件为电容、电感或电阻中的至少一种。这样，可以释放SIM卡座组件占据终端设备内部的部分空间，可以在释放的空间内放置电子器件，节省电路板的布局空间，电子器件还可以是用于射频电路的开关、双工器等，或是用于基带电路的解码芯片等。
结合第二方面，在第二方面的某些实现方式中，第一腔体内设置有嵌入式SIM卡，嵌入式SIM卡与电路板直接地或间接地电连接。这样，可以在第一腔体内设置嵌入式SIM卡，有效利用SIM卡座组件所占电路板的空间，释放SIM卡座组件占据终端设备内部的部分空间，为电路板节省更多空间。
结合第二方面，在第二方面的某些实现方式中，SIM卡为第三代SIM卡或第四代SIM卡。这样，终端设备可以支持不同类型的SIM卡，同时，所使用的SIM卡可以是第三代SIM卡或第四代SIM卡，其所占面积较小，可以为电路板节省更多空间。
第三方面，提供了一种SIM卡座组件，用于终端设备，包括：外壳和架高板，外壳与架高板均固定在终端设备的电路板上，架高板位于外壳与电路板之间，架高板与电路板之间形成第一腔体，第一腔体为半封闭结构或全封闭结构，架高板与外壳之间形成第二腔体，第二腔体用于放置SIM卡。
这样，通过在电路板与外壳之间设置架高板，可以在电路板与架高板之间形成第一腔体，通过在第一腔体内布置器件，可以将SIM卡座组件所占的电路板的空间充分利用，释放SIM卡座组件占据终端设备内部的部分空间。
结合第三方面，在第三方面的某些实现方式中，SIM卡座组件还包括卡座和金属弹片，卡座和金属弹片位于第二腔体中，金属弹片固定在卡座上并与电路板直接地或间接地电连接，卡座和金属弹片用于固定SIM卡。这样，通过在第二腔体中设置卡座与金属弹片，可以为外部插入的SIM卡提供更好的稳定性与更好的电连接。
结合第三方面，在第三方面的某些实现方式中，SIM卡座组件还包括卡座，卡座位于第二腔体中，卡座设置有至少一个金属接触点，至少一个金属接触点与电路板直接地或间接地电连接。这样，减少了金属弹片结构，可以在为SIM卡提供良好的稳定性与电连接的同时进一步简化其结构。
结合第三方面，在第三方面的某些实现方式中，卡座固定在第二腔体内架高板的表面，或者所述卡座固定在与架高板的表面相对的外壳的表面。这样，可以根据设计及实际需要灵活设置卡座位置。
结合第三方面，在第三方面的某些实现方式中，架高板包括三条侧边或四条侧边，三条侧边或四条侧边固定在电路板上。这样，可以根据设计及实际需要改变第一腔体的结构，使其呈全封闭结构或半封闭结构。
结合第三方面，在第三方面的某些实现方式中，架高板的材料为金属。这样，架高板采用金属材料制造，在第一腔体内设置电子器件时，可以有效减小外部电信号对第一腔体内的器件的电磁干扰。
结合第三方面，在第三方面的某些实现方式中，第一腔体内设置有电子器件，电子器件与电路板直接地或间接地电连接。这样，可以在第一腔体内设置电子器件，有效利用SIM卡座组件所占电路板的空间，释放SIM卡座组件占据终端设备内部的部分空间。
结合第三方面，在第三方面的某些实现方式中，电子器件为电容、电感或电阻中的至少一种。这样，可以释放SIM卡座组件占据终端设备内部的部分空间，可以在释放的空间内放置电子器件，节省电路板的布局空间，电子器件还可以是用于射频电路的开关、双工器等，或是用于基带电路的解码芯片等。
结合第三方面，在第三方面的某些实现方式中，第一腔体内设置有嵌入式SIM卡，嵌入式SIM卡与电路板直接地或间接地电连接。这样，可以在第一腔体内设置嵌入式SIM卡，有效利用SIM卡座组件所占电路板的空间，释放SIM卡座组件占据终端设备内部的部分空间，为电路板节省更多空间。
结合第三方面，在第三方面的某些实现方式中，SIM卡为第三代SIM卡或第四代SIM卡。这样，终端设备可以支持不同类型的SIM卡，同时，所使用的SIM卡可以是第三代SIM卡或第四代SIM卡，其所占面积较小，可以为电路板节省更多空间。
这样，可以通过架高板将传统的卡座抬高，架高板与电路板之间形成的第一腔体，并在第一腔体中设置电子器件或eSIM卡等，可以将SIM卡座组件所占的电路板的空间充分利用，释放SIM卡座组件占据终端设备内部的部分空间，也可以降低终端设备的厚度，实现终端设备小型化和超薄化。
附图说明
图1是本申请实施例提供的一种终端设备的示意图。
图2是本申请实施例提供的一种SIM卡座组件的结构示意图。
图3是图2的沿插入SIM卡方向的侧剖图。
图4是图3的细节放大的示意图。
图5是本申请实施例提供的另一种SIM卡座组件的结构示意图。
图6是图5的沿插入SIM卡方向的侧剖图。
图7是图6的细节放大的示意图。
图8是本申请实施例提供的一种终端设备的结构示意图。
具体实施方式
下面将结合附图，对本申请中的技术方案进行描述。
本申请实施例中的终端设备可以是手机、平板电脑、笔记本电脑、智能手环、智能手表、智能头盔、智能眼镜等需要插SIM卡进行通信的终端设备。终端设备还可以是蜂窝电话、无绳电话、会话启动协议(session initiation protocol，SIP)电话、无线本地环路(wireless local loop，WLL)站、个人数字助手(personal digital assistant，PDA)、具有无线通信功能的手持设备、计算设备或连接到无线调制解调器的其它处理设备、车载设备，5G网络中的终端设备或者未来演进的公用陆地移动通信网络(public land mobile network，PLMN)中的终端设备等，本申请实施例对此并不限定。
图1是终端设备100的示意图，在此，以终端设备100为手机进行说明。
如图1所示，终端设备100可以包括壳体和显示屏，显示屏安装在壳体上。终端设备100还包括设置于壳体内部的电子元件(图中未示出)，电子元件包括处理器、摄像头、闪光灯、麦克风、电池等，但不限于此。
壳体可以是为金属壳体，比如镁合金、不锈钢等金属。此外，还可以是塑胶壳体、玻璃壳体、陶瓷壳体等，但不限于此。
同时，为保证终端设备100可以接入蜂窝网，终端设备还可以包括SIM卡接口，SIM卡接口用于连接SIM卡。SIM卡可以通过插入SIM卡接口，或从SIM卡接口拔出，实现和终端设备的接触和分离。终端设备可以支持1个或N个SIM卡接口，N为大于1的正整数。SIM卡接口可以支持第三代SIM卡(micro-SIM)或第四代SIM卡(nano-SIM)等。同一个SIM卡接口可以同时插入多张卡。多张卡的类型可以相同，也可以不同。SIM卡接口也可以兼容不同类型的SIM卡。SIM卡接口也可以兼容外部存储卡。终端设备通过SIM卡和网络交互，实现通话以及数据通信等功能。在一些实施例中，终端设备采用嵌入式SIM(embedded-SIM，eSIM)卡。eSIM卡可以嵌在终端设备中，不能和终端设备分离。
在一些实施例中，为了实现用于放置SIM卡，终端设备100还可以包括SIM卡座组件110，本申请中SIM卡可以是Nano SIM卡，Micro SIM卡，SIM卡，也可以是eSIM卡，也可以是未来应用的实现相同功能的带有用户标识模块的卡，本申请对该SIM卡的类型不作限制。
可选地，SIM卡座组件110可以固定在终端设备100的电路板上，为方便SIM卡的插拔可以将SIM卡座组件的插卡口设置在终端设备100的壳体上。
应理解，由于不同终端设备的不同外形设计及用户的使用需要，其终端设备的SIM卡座组件110的插卡口可以根据设计或实际需求设置在壳体的任意位置，SIM卡可以由插卡口插入终端设备中。
图2和图3是一种SIM卡座组件的结构示意图，其中，图3是图2沿插入SIM卡方向的剖面图。
如图2和图3所示，SIM卡座组件可以包括外壳140和架高板150。
其中，外壳140和架高板150均可以固定在终端设备的电路板上，其固定方式可以是焊接、胶合或卡扣等，架高板150可以位于外壳140与电路板之间，架高板150的底部可以固定在电路板上，架高板150与电路板之间可以形成第一腔体160，架高板150与外壳140之间形成第二腔体170，第二腔体170用于放置SIM卡，第二腔体170可以具有可供SIM卡插入的插卡口。
可选地，SIM卡座组件还可以包括卡座120，卡座120可以固定在第二腔体170内，其材料可以是塑胶。卡座120上可以设置有至少一个金属接触点，至少一个金属接触点与 电路板直接地或间接地电连接，卡座120可以与SIM卡座组件中的其他部件将插入的SIM卡夹持，进行固定，例如，其他部件可以是外壳140或架高板150，，SIM卡固定后，卡座120上的至少一个金属接触点可以与SIM卡的多个触点接触，将SIM卡的多个触点与电路板直接地或间接地电连接。由于卡座120的设计，可以为SIM卡提供更好的稳定性。
可选地，SIM卡座组件还可以包括金属弹片130，金属弹片130可以固定在卡座120上并与电路板直接地或间接地电连接。
如图4所示，卡座120可以通过焊接、胶合或卡扣等方式固定在第二腔体170中架高板150的表面，金属弹片130的一端可以固定在卡座120上并与电路板直接或间接地电连接，金属弹片130的另一端可以向上翘起，与卡座120和外壳140共同夹持SIM卡，由于这样的设计，可以为SIM提供更好的稳定性，防止SIM由于终端设备晃动而脱出的情况。
可选地，金属弹片130可以具有多个，多个金属弹片130可以分别与SIM卡上的多个触点接触，由于多个金属弹片130的设计，可以为SIM卡提供更好的电连接。
可选地，外壳140可以是由金属材料制造的，可以减少外部电信号对第一腔体及第二腔体内的器件的干扰，例如，金属材料可以是铁、铜、铝、铝合金、镁合金、不锈钢等。由于选取金属材料制造的外壳140，可以避免外部电信号对第一腔体及第二腔体内的器件的干扰。
可选地，外壳140和架高板150可以通过焊接的方式将其底部固定在电路板上，可以提升SIM卡座组件整体的稳定性。
可选地，由于第一腔体160是架高板150与电路板之间形成的腔体，而本申请对架高板150的形状并不做限定，因此架高板150的形状可以根据设计需要确定，第一腔体160的内部结构可以根据架高板150的形状确定。
可选地，架高板150可以具有四条侧边，四条侧边的底部可以固定在电路板上，架高板150与电路板之间形成全封闭的类矩形腔体的第一腔体160，由于第一腔体160的全封闭设计，可以为其中设置的器件提供更好的屏蔽环境。
可选地，架高板150可以具有三条侧边，三条侧边的底部可以固定在电路板上，架高板150与电路板之间形成半封闭的类矩形腔体的第一腔体160，由于第一腔体160的半封闭设计，可以为第一腔体内设置的器件提供更大的放置空间，其中部分器件可以部分设置在第一腔体中，另一部分设置在第一腔体外。
可选地，架高板150可以是由金属材料制造的，或者设计为屏蔽罩，由于采用金属的设计，可以减小电信号对第一腔体160内部的影响。
可选地，可以在第一腔体160内部设置电子器件，与终端设备的电路板电连接，充分利用电路板的面积，同时，设置于第一腔体内的电子器件受到金属的架高板150的保护，可以更稳定的工作。例如，电子器件可以是电容、电感或电阻，可以是其中的一种或几种的组合，也可以是用于射频电路的开关、双工器等，或是用于基带电路的解码芯片等，本申请在此并不做限制。
可选地，可以在第一腔体160内部设置eSIM卡，与终端设备的电路板电连接，充分利用电路板的面积，同时，设置于第一腔体内的电子器件受到金属的架高板的保护，可以更稳定的工作。
由于采用架高板将传统的卡座抬高，可以在架高板与电路板之间形成第一腔体的设 计，可以利用第一腔体设置电子器件或eSIM卡等，可以使SIM卡座组件所占的电路板的空间充分利用，释放SIM卡座组件占据终端设备内部的部分空间，也可以降低终端设备的厚度，实现终端设备小型化和超薄化。
图5和图6是另一种SIM卡座组件的结构示意图，其中，图6是图5沿插入SIM卡方向的剖面图。
如图5和图6所示，外壳140和架高板150均可以固定在终端设备的电路板上，其固定方式可以是焊接、胶合或卡扣等，架高板150可以位于外壳140与电路板之间，架高板150的底部可以固定在电路板上，架高板150与电路板之间可以形成第一腔体160，架高板150与外壳140之间形成第二腔体170，第二腔体170用于放置SIM卡，第二腔体170可以具有可供SIM卡插入的插卡口。
可选地，SIM卡座组件还可以包括卡座120，卡座120可以固定在第二腔体170内，其材料可以是塑胶。卡座120上可以设置有至少一个金属接触点，至少一个金属接触点与电路板直接地或间接地电连接，卡座120可以与SIM卡座组件中的其他部件将插入的SIM卡夹持，进行固定，例如，其他部件可以是外壳140或架高板150，SIM卡固定后，卡座120上的至少一个金属接触点可以与SIM卡的多个触点接触，将SIM卡的多个触点与电路板直接地或间接地电连接。由于卡座120的设计，可以为SIM卡提供更好的稳定性。
可选地，SIM卡座组件还可以包括金属弹片130，金属弹片130可以固定在卡座120上并与电路板直接地或间接地电连接。
如图7所示，卡座120可以通过焊接、胶合或卡扣等方式固定在第二腔体170中与架高板150表面相对的外壳140的表面，金属弹片130的一端可以固定在卡座120上并与电路板直接或间接地电连接，金属弹片130的另一端可以向翘起，呈弓型，与卡座120和架高板150共同夹持SIM卡，由于这样的设计，可以为SIM提供更好的稳定性，防止SIM由于终端设备晃动而脱出的情况。
可选地，金属弹片130可以具有多个，多个金属弹片可以分别与SIM卡上的多个触点接触。
可选地，外壳140可以是由金属材料制造的，可以减少外部电信号对第一腔体及第二腔体内的器件的干扰，例如，金属材料可以是铁、铜、铝、铝合金、镁合金、不锈钢等。由于选取金属材料制造的外壳140，可以避免外部电信号对第一腔体及第二腔体内的器件的干扰。
可选地，外壳140和架高板150可以通过焊接的方式将其底部固定在电路板上，可以提升SIM卡座组件整体的稳定性。
可选地，由于第一腔体160是架高板150与电路板之间形成的腔体，而本申请对架高板150的形状并不做限定，因此架高板150的形状可以根据设计需要确定，第一腔体160的内部结构可以根据架高板150的形状确定。
可选地，架高板150可以具有四条侧边，四条侧边的底部可以固定在电路板上，架高板150与电路板之间形成全封闭的类矩形腔体的第一腔体160，由于第一腔体160的全封闭设计，可以为其中设置的器件提供更好的屏蔽环境。
可选地，架高板150可以具有三条侧边，三条侧边的底部可以固定在电路板上，架高板150与电路板之间形成半封闭的类矩形腔体的第一腔体160，由于第一腔体160的半封闭设计，可以为第一腔体内设置的器件提供更大的放置空间，其中部分器件可以部分设置 在第一腔体中，另一部分设置在第一腔体外。
可选地，架高板150可以是由金属材料制造的，或者设计成屏蔽罩，由于采用金属的设计可以减小电信号对第一腔体160内部的影响。
可选地，可以在第一腔体160内部设置电子器件，与终端设备的电路板电连接，充分利用电路板的面积，同时，设置于第一腔体内的电子器件受到金属的架高板150的保护，可以更稳定的工作。例如，电子器件可以是电容、电感或电阻，可以是其中的一种或几种的组合，也可以是用于射频电路的开关、双工器等，或是用于基带电路的解码芯片等，本申请在此并不做限制。
可选地，可以在第一腔体160内部设置eSIM卡，eSIM卡与终端设备的电路板电连接，充分利用电路板的面积，同时，设置于第一腔体内的电子器件受到金属的架高板的保护，可以更稳定的工作。
可选地，本申请提供的实施例中的SIM卡座组件可以应用于第三代SIM卡(micro-SIM)或第四代SIM卡(nano-SIM)，第三代SIM卡可以被称作小卡，第四代SIM卡可以被称作第四形式要素集成电路板。第三代SIM卡大小尺寸可以是12毫米×15毫米，第四代SIM卡大小尺寸可以是12毫米×9毫米。
由于采用架高板将传统的卡座抬高，可以在架高板与电路板之间形成第一腔体的设计，可以利用第一腔体设置电子器件或eSIM卡等，可以使SIM卡座组件所占的电路板的空间充分利用，释放SIM卡座组件占据终端设备内部的部分空间，也可以降低终端设备的厚度，实现终端设备小型化和超薄化。同时，可以根据设计需要，选择其卡座的固定方式，提供了多种选择。
根据本申请实施例提供的技术设计，通过架高板将传统的卡座抬高，在架高板与电路板之间形成的第一腔体中设置电子器件或eSIM卡等，根据需求可以进行设定，这样在目前SIM卡座组件所占电路板的面积不变的基础上，在第一腔体中放入更多器件，使SIM卡座组件所占空间得到充分利用，通过架高板节省出的空间，对于终端设备来说是弥足重要，可以降低终端设备的厚度，实现终端设备小型化和超薄化。
图8是一种终端设备的示意图。
如图8所示，终端设备还可以包括电路板180，SIM卡座组件可以通过焊接、卡扣、铆接或胶合等方式固定在电路板180上。
应理解，图8仅作为示意性参考，电路板180可以位于SIM卡座组件下方，电路板180也可以位于SIM卡座组件上方，在此并不做限定。
其中，架高板150与电路板180之间可以形成第一腔体160，架高板150与外壳140之间形成第二腔体170，第二腔体170可以具有可供SIM卡插入的插卡口，插卡口可以设置在第二腔体170的左侧，卡座120可以固定在第二腔体170内，金属弹片130可以固定在卡座120上并与电路板电连接，金属弹片130可以具有多个，多个金属弹片可以分别与SIM卡上的多个触点接触。
可选地，架高板150可以是由金属材料制造的，可以减小电信号对第一腔体160内部的影响。
可选地，可以在第一腔体160内部设置第一电子器件1601、第二电子器件1602和第三电子器件1603，其中，第一电子器件1601、第二电子器件1602和第三电子器件1603可以是种类相同的电子器件，也可以是不同种类的电子器件。
应理解，第一电子器件1601、第二电子器件1602和第三电子器件1603可以是电容、电阻和电感其中的一种或几种，也可以是用于射频电路的开关、双工器等，或是用于基带电路的解码芯片等，本申请在此并不做限制，可以根据具体的设计需要进行选择。第一电子器件1601、第二电子器件1602和第三电子器件1603仅是本申请实施例的举例说明，本申请实施例并不对具体的电子器件类型或者数量进行限定。
可选地，可以先将第一电子器件1601、第二电子器件1602和第三电子器件1603焊接在电路板180上，再对SIM卡座组件进行焊接，使架高板150可以屏蔽第一腔体内的电子信号，减少外部电信号对其的影响。
可选地，也可以在第一腔体160内部设置eSIM卡，同时，也可以在其中设置eSIM相关的电子器件，可以先将eSIM卡及其相关器件焊接在电路板180上，再对SIM卡座组件进行焊接，使架高板150可以将eSIM卡及其相关器件包裹，减少外部电信号对其的影响。
本申请还提供一种终端设备，终端设备包括上述任意结构的SIM卡座组件。
本申请的终端设备的SIM卡座组件通过外壳与架高板之间形成的第二腔体，架高板与电路板之间的第一腔体，可以在第二腔体内设置卡座和金属弹片，在第一腔体内设置电子器件或eSIM卡，可以充分利用SIM卡座组件占用电路板的空间。
本领域技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能，但是这种实现不应认为超出本申请的范围。
所属领域的技术人员可以清楚地了解到，为描述的方便和简洁，上述描述的系统、装置和单元的具体工作过程，可以参考前述方法实施例中的对应过程，在此不再赘述。
在本申请所提供的几个实施例中，应该理解到，所揭露的系统、装置和方法，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另一点，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，装置或单元的间接耦合或通信连接，可以是电性或其它的形式。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (11)

  1. 一种终端设备，其特征在于，包括：
    电路板，外壳和架高板；
    所述外壳与所述架高板均固定在所述电路板上，所述架高板位于所述外壳与所述电路板之间，所述架高板与所述电路板之间形成第一腔体，所述第一腔体为半封闭结构或全封闭结构，所述架高板与所述外壳之间形成第二腔体，所述第二腔体用于放置SIM卡。
  2. 根据权利要求1所述的终端设备，其特征在于，所述终端设备还包括卡座和金属弹片，所述卡座和所述金属弹片位于所述第二腔体中，所述金属弹片固定在所述卡座上，所述金属弹片与所述电路板直接地或间接地电连接，所述卡座和所述金属弹片用于固定所述SIM卡。
  3. 根据权利要求1所述的终端设备，其特征在于，所述终端设备还包括卡座，所述卡座位于所述第二腔体中，所述卡座设置有至少一个金属接触点，所述至少一个金属接触点与所述电路板直接地或间接地电连接。
  4. 根据权利要求2或3所述的终端设备，其特征在于，所述卡座固定在所述第二腔体内所述架高板的表面，或者所述卡座固定在与所述架高板的表面相对的外壳的表面。
  5. 根据权利要求1至4任一项所述的终端设备，其特征在于，所述架高板包括三条侧边或四条侧边，所述三条侧边或所述四条侧边固定在所述电路板上。
  6. 根据权利要求1至5任一项所述的终端设备，其特征在于，所述架高板的材料为金属。
  7. 根据权利要求6所述的终端设备，其特征在于，所述第一腔体内设置有至少一个电子器件，所述至少一个电子器件与所述电路板直接地或间接地电连接。
  8. 根据权利要求7所述的终端设备，其特征在于，所述电子器件为电容、电感或电阻中的至少一种。
  9. 根据权利要求6所述的终端设备，其特征在于，所述第一腔体内设置有嵌入式SIM卡，所述嵌入式SIM卡与所述电路板直接地或间接地电连接。
  10. 根据权利要求1至9任一项所述的终端设备，其特征在于，所述SIM卡为第三代SIM卡或第四代SIM卡。
  11. 一种终端设备的制造方法，其特征在于，所述制造方法用于制造如权利要求1至10任一项所述的终端设备，所述制造方法包括：架高板固定在电路板上，所述架高板与电路板之间形成第一腔体，所述第一腔体为半封闭结构或全封闭结构，将外壳固定在与所述架高板同侧的所述电路板上，所述外壳位于所述架高板上方，所述架高板与所述外壳之间形成第二腔体，所述第二腔体用于放置SIM卡。
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