WO2021027848A1 - 一种印制电路板、支架和通流装置 - Google Patents
一种印制电路板、支架和通流装置 Download PDFInfo
- Publication number
- WO2021027848A1 WO2021027848A1 PCT/CN2020/108700 CN2020108700W WO2021027848A1 WO 2021027848 A1 WO2021027848 A1 WO 2021027848A1 CN 2020108700 W CN2020108700 W CN 2020108700W WO 2021027848 A1 WO2021027848 A1 WO 2021027848A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pcb
- conductive
- bracket
- fluid
- power
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Definitions
- the embodiment of the present invention relates to but not limited to the field of printed circuit board (PCB: Printed Circuit Board) and structural component design flow, more specifically, to a printed circuit board (PCB: Printed Circuit Board), bracket and communication Flow device.
- PCB printed circuit board
- PCB Printed Circuit Board
- the embodiment of the present invention provides a PCB, the PCB is provided with at least two multi-function vias, each of the multi-function vias includes a first via and a second via made on the same board via, The first via hole and the second via hole are separated up and down in the board through hole.
- the embodiment of the present invention also provides a stent, including a diversion structure, the diversion structure includes a tubular metal shell, at least one fluid guide arranged in the metal shell, and at least two electrical ports arranged at intervals , wherein: the electrical interface includes a first conductive column and a second conductive column passing through the first conductive column, a first end of the first conductive column is connected to the fluid conductor, and a second end is located at Outside the metal shell, the first end of the second conductive column is connected to the metal shell, and the second end protrudes beyond the second end of the first conductive column; the fluid conducting and the first The conductive pillar forms a first signal path, the metal shell and the second conductive pillar form a second signal path, and the two signal paths are electrically insulated.
- the embodiment of the present invention also provides a flow-through device, including the bracket according to the embodiment of the present invention, the printed circuit board PCB according to the embodiment of the present invention, and a mounting member configured to install equipment on the bracket
- At least two electrical interfaces of a diversion structure on the bracket are connected to at least two multifunctional vias on the PCB, wherein: the first conductive posts of the two electrical interfaces penetrate the corresponding multifunctional vias
- the via hole is in contact with the first via hole of the two via holes included in the multi-function via to form the power signal output by the power module on the PCB to flow out from one electrical interface, and then from the other through the fluid diversion of the bracket.
- the electrical interface flows back to the transmission path of the load module on the PCB; the second conductive posts of the two electrical interfaces pass through the corresponding multi-function vias and are connected to the mounting member, and the mounting member is connected to the multi-function via
- the second via of the two vias included in the hole is in contact to realize the connection between the mounting member, the ground property network of the bracket, and the ground property network of the PCB.
- FIG. 1A is a schematic diagram of the structure of a multifunctional via on a PCB according to an exemplary embodiment of the present invention.
- Figure 1B is a cross-sectional view of the multifunctional via in Figure 1A;
- Fig. 2 is a top view of a radiator bracket of an exemplary embodiment of the present invention.
- FIG. 3 is a front view of the radiator bracket of Figure 2;
- Fig. 4 is a schematic structural diagram of the electrical interface part of the radiator bracket of Fig. 2.
- Figure 5 is a cross-sectional view of the electrical interface portion of the radiator bracket of Figure 2.
- Figure 6 is a top view of the electrical interface portion of the radiator bracket of Figure 2;
- 7A, 7B, and 7C are respectively 3 types of cross-sectional views of 3 examples of the body of the radiator bracket of FIG. 2.
- Fig. 8 is a schematic diagram of installation of a flow passage device of an exemplary embodiment of the present invention.
- Fig. 9 is a top view of the flow through device in Fig. 8.
- Fig. 10 is a schematic diagram of the connection between the electrical interface of the flow device in Fig. 8 and the mounting member.
- Fig. 11 is a side view of the connection of the electrical interface of the current flow device, the PCB and the mounting parts in Fig. 8.
- Fig. 12 is a schematic diagram of the installation of a current flow device in another exemplary embodiment of the present invention. Two electrical interfaces are used as a set as the flow outlet or flow back of the PCB power signal.
- Fig. 13 is a top view of the flow device in Fig. 12.
- FIG. 14 is a schematic diagram of the installation of the current flow device in another exemplary embodiment of the present invention.
- the bracket adds a reinforcing section and an electrical interface near the source end of the power module.
- Fig. 15 is a top view of the flow-through device in Fig. 14.
- Fig. 16 is a schematic diagram of the installation of a flow device according to another exemplary embodiment of the present invention.
- the bracket is divided into two mutually insulated flow guiding structures.
- Fig. 17 is a top view of the flow-through device in Fig. 16.
- An exemplary embodiment of the present invention takes a scenario where a heat sink bracket (also called a heat sink base), a PCB and a heat sink are connected in sequence as an example, by designing a sandwich heat sink bracket and a corresponding PCB via structure to increase Current channel.
- the radiator bracket is composed of a metal material that fixes the radiator.
- it is combined with the PCB for an improved fit to provide a design device that can not only satisfy the fixed support function but also allow flow.
- the radiator bracket of this embodiment adopts a sandwich biscuit structure, that is, a fluid conduction is arranged in the metal shell, and a multi-functional via is used in the fixed contact with the PCB to simultaneously realize the contact between the power supply and the ground and realize the effective isolation between the power supply and the ground. It retains the function of grounding and fixed support of the radiator, and can carry a certain current.
- An exemplary embodiment of the present invention provides a PCB provided with at least two multi-function vias.
- Each of the multifunctional vias includes two vias made on the same board via: a first via and a second via, the first via and the second via are in the board via Separate up and down.
- the first via hole connects the first inner layer and the first outer layer of the PCB
- the second via hole connects the second inner layer and the second outer layer of the PCB.
- the two outer layers of the PCB are the two outermost layers of the PCB, and these two layers can also be called the bottom layer and the surface layer, respectively.
- the structure of the multifunctional via in this embodiment fully excavates and utilizes PCB design and structural space resources, saving the utilization space and design cost of the PCB.
- the first via is a power attribute via, that is, a via configured to transmit a power signal, and the power attribute via connects the power plane of the first inner layer of the PCB to The first outer layer;
- the second via is a ground via hole that is set as a via for transmitting ground signals, and the ground via hole connects the ground plane of the second inner layer of the PCB to the The second outer layer.
- the power supply attribute via includes a metal plating layer on the sidewall of the board through hole, an outer layer pad provided on the first outer layer, and an outer layer pad provided on the first inner layer and connected to the first inner layer.
- the ground attribute via includes a metal plating layer on the sidewall of the board through hole, an outer layer pad arranged on the second outer layer and The second inner layer and an inner layer pad connected to the ground plane of the second inner layer.
- the above-mentioned multi-function vias are not limited to include power attribute vias and ground attribute vias, and may also include vias with other attributes connected to other layers of the PCB, such as signal layers.
- the above-mentioned power plane and ground plane can be realized by, for example, the copper skin of the power plane and the ground plane.
- Figures 1A and 1B show the structure of a multi-function via on the PCB.
- the multi-function via includes a ground attribute via 302 and a power attribute via 303 that are made up and down based on a board through hole 304.
- the upper and lower separation means that the two vias are separated in the axial direction of the board through hole 304.
- the ground attribute via 302 includes a first metal plating layer 316 on the sidewall of the board through hole 304, a first pad 305 provided on the surface layer 309 of the PCB, and a second pad 306 provided on the first inner layer 311 of the PCB.
- the second pad 306 is connected to the ground plane of the first inner layer 311.
- the first pad 305 may also be connected to the ground plane of the PCB surface layer 309, and the surface layer 309 may or may not be provided with a ground plane.
- the first dielectric layer 310 Between the surface layer 309 and the first inner layer 311 is the first dielectric layer 310,
- the power attribute via 303 includes a second metal plating layer 317 on the sidewall of the board through hole 304, a third pad 308 provided on the bottom layer 315 of the PCB, and a fourth pad 307 provided on the second inner layer 313 of the PCB.
- the fourth pad is connected to the power plane of the second inner layer 313 of the PCB, and the third pad 308 may also be connected to the power plane of the bottom layer 315 of the PCB.
- the bottom layer 315 may or may not be provided with a power plane.
- the first dielectric layer 310, the second dielectric layer 314, and the third dielectric layer 312 may include one or more layers physically, and may transmit power signals, ground signals, or other signals.
- the diameter of the power attribute via and the ground attribute via can be designed according to the flow capacity, for example, it can be greater than or equal to 3mm.
- the first metal plating layer 316 and the second metal plating layer 317 may be copper plating layers on the sidewalls of the board through holes 304, and the copper thickness may be more than 18um.
- the thickness of the pad is about 1.8 ⁇ 2.3 mils around 1.5OZ.
- the multi-function vias in the embodiments of the present application make two vias with different attributes in the same board vias, and are set to transmit two signals such as power signal and ground signal respectively, which can greatly reduce the number of vias on the PCB and increase the PCB Board space utilization and performance.
- the PCB of the embodiment of the present invention can be used not only in the scenario where the heat sink bracket, the PCB and the heat sink are connected in sequence, but also in other scenarios where two signal transmissions need to be implemented in one board through hole.
- a stent including a diversion structure, the diversion structure includes a tubular metal casing, at least one diversion fluid arranged in the metal casing, and at least Two electrical interfaces, wherein: the electrical interface includes a first conductive column and a second conductive column passing through the first conductive column, the first end of the first conductive column is connected with the fluid conductor, the second The first end of the second conductive pillar is connected to the metal housing, and the second end is protruded beyond the second end of the first conductive pillar; the fluid conducting and The first conductive pillar forms a first signal path, the metal shell and the second conductive pillar form a second signal path, and the two signal paths are electrically insulated.
- the above-mentioned diversion structure can realize the transmission of two different signals on one bracket, and can realize the connection of two different signals on one electrical interface, so that the bracket has a variety of signal transmission capabilities.
- the above-mentioned bracket is connected to the PCB (such as When the PCB in the above-mentioned embodiment of the present invention is matched with the installed equipment bracket, not only can the metal shell be used to transmit the ground signal, but also the conductive fluid can be used to transmit the power signal, which provides a new diversion path for the power signal of the PCB. It can be used to meet the high current transmission requirements of PCB.
- the metal housing has an upper wall, and the outer surface of the upper wall is a flat surface;
- the first conductive pillar includes a hollow pillar portion and a ring extending from the pillar portion to the periphery.
- the outer surface of the ring-shaped portion is flush with the outer surface of the upper wall and is electrically insulated from the metal shell, which can be achieved by means of isolation rings or gaps.
- the columnar portion protrudes outside the housing. However, it can also be flush with the outer surface of the upper wall.
- the above-mentioned ring-shaped part can form a power plane, which is a component of the power supply attribute network of the bracket, and can contact the power plane at the corresponding position on the outer layer of the PCB to realize the transmission of power signals.
- the second end of the second conductive column is provided with a thread, and is configured to be screwed to an external device to achieve fixation between the two.
- the metal housing further has a lower wall, and the first end of the second conductive column is connected to the lower wall; the conductive fluid is provided on a position corresponding to the second conductive column.
- the second conductive column passes through the through hole and the first conductive column, and the electrical insulation between the second conductive column and the conductive fluid can be achieved through an insulating sleeve or a gap.
- This structure cleverly realizes the interleaving between the two signals, so that the signal transmitted by the internal conductive fluid (such as the power signal) is transmitted to the external device through the first conductive column sleeved outside the second conductive column, and passes through the metal shell.
- the transmitted signal is transmitted to the external device through the second conductive column sleeved in the first conductive column, which meets the fixing requirements and signal transmission requirements when the bracket of the external device, the PCB and the external device are connected in sequence.
- the guide fluid extends in the axial direction of the metal shell, and the guide fluid passes through an insulating support between the metal shells or is wrapped by an insulating body outside the guide fluid. Layer to achieve electrical insulation.
- the cross-section of the metal shell is rectangular.
- the cross-section of the fluid guide can be made into a square, a "cross" shape, or a non-square rectangle.
- the cross-sections of the metal casing and the conductive fluid involved in the embodiments of the present invention may also have other shapes, and signal transmission may also be realized.
- the diversion structure includes more than 4 electrical interfaces; the diversion structure includes one diversion fluid, and the diversion fluid is connected to all electrical connections in the diversion structure.
- the first conductive pillar of the interface is electrically connected.
- the guide fluid can be designed as a closed structure, such as a rectangular structure as a whole, which is more convenient in processing.
- the diversion structure includes a plurality of diversion fluids, and each diversion fluid electrically connects the first conductive posts of at least two electrical interfaces in the diversion structure. In this example, the diversion fluid is divided into multiple sections, which can save material.
- the metal shell includes a plurality of linear segments connected in sequence, and the diversion structure includes M'respectively arranged at M connection points (connection points between the linear segments). Electrical interface, M ⁇ M' ⁇ 2.
- M connection points between the linear segments.
- Electrical interface M ⁇ M' ⁇ 2.
- the metal casing is rectangular and includes 4 straight sections, 4 electrical ports can be provided on the 4 corners of the rectangle, of course, 2 electrical ports can be provided on only two corners, or three There are 3 electrical interfaces on each corner. However, the electrical interface does not have to be located under the connection point, and can also be located in the middle of the straight line.
- the metal shell includes a plurality of straight sections and at least one extension section connected in sequence, and one extension section is connected to only one connection point (the connection point between the straight sections), so
- the diversion structure includes M'electrical interfaces respectively arranged at M connection points, and N'electrical interfaces respectively arranged on N extension sections, M ⁇ M' ⁇ 2, N ⁇ N' ⁇ 1.
- M ⁇ M' ⁇ 2, N ⁇ N' ⁇ 1 M ⁇ M' ⁇ 2, N ⁇ N' ⁇ 1.
- extension section can increase the number of vias and improve the flow capacity.
- extension section shown in the figure is directly extended from a straight line section, this is not required in the embodiment of the present invention.
- the extension section may also form an angle with the original straight line section.
- the metal shell includes a plurality of linear segments and at least one reinforcement segment connected in sequence, and the reinforcement segment is connected to the middle of a linear segment (not required to be in the middle),
- the diversion structure includes M'electrical interfaces respectively arranged at M connection points, and N'electrical interfaces respectively arranged on N strengthening sections, M ⁇ M' ⁇ 2, N ⁇ N' ⁇ 1 .
- a reinforced section is vertically extended from the middle of a section of the metal shell (multiple reinforced sections can also be extended from the middle of a section), and 4 electrical interfaces are arranged on 4 corners.
- An electrical interface is set on the segment.
- the support includes a plurality of the diversion structures, and the plurality of diversion structures are electrically insulated by insulating members or gaps. Multiple diversion structures can be set to divide the signal into multiple channels and transmit them separately.
- the bracket of the above-mentioned embodiment of the present invention adopts a sandwich structure, can transmit two kinds of signals, and is connected to the outside through an electrical interface, thereby realizing the multi-signal flow and input and output capabilities of the bracket.
- the bracket of the embodiment of the present invention can be used not only in scenarios where the radiator bracket, PCB, and radiator are connected in sequence, but also in other scenarios where the bracket needs to be used to improve the flow capacity.
- a radiator bracket installed in cooperation with a printed circuit board is taken as an example to describe the bracket with current flow capability in the embodiment of the present invention.
- Fig. 2 is a plan view of the radiator bracket
- Fig. 3 is a front view of the radiator bracket.
- the stent body 401 has a frame-shaped tubular structure, and four electrical ports 410 are provided on the four corners of the stent body 401.
- FIG. 7A shows a cross-sectional view of this example stent body 401 taken along the vertical direction of the extension direction of the stent.
- the stent body 401 includes a metal shell 404, a fluid guide 409 arranged in the metal shell 407, and a metal shell 407 and a guide.
- the metal shell 407 has a ground attribute and is set to transmit ground signals.
- the diversion fluid 409 has power properties and is set to transmit power signals.
- the isolation ring 408 is made of insulating material to ensure that the metal casing 407 and the conductive fluid 409 are electrically insulated.
- the outer contour of the cross section of the metal shell 407 is rectangular, the cross section of the guide fluid 409 is square (a special rectangle), and the isolation ring 408 wraps the guide fluid 409 entirely.
- the embodiment of the present invention is not limited to this.
- the cross section of the guide fluid 409' is rectangular, the cross section of the guide fluid 409" is cross-shaped, and so on. The application does not limit this.
- the outer contours of the cross-sections of the metal casings 407' and 407" in Figure 7B and 7C are still rectangular, and the inner surfaces of the cross-sections of the metal casings 407' and 407" and the cross-sections of the isolation rings 408', 408" It can be changed correspondingly based on the cross-sectional changes of the guide fluid 409', 409".
- the metal shell, isolation ring and guide fluid shown in FIGS. 7A, 7B and 7C are in contact with each other, in other examples, There may be gaps between the metal shell and the isolation ring, as well as between the isolation ring and the guiding fluid. In this case, the mutual fixation can be achieved by partially setting the support.
- the metal shell and the guide fluid are both closed structures, but the embodiment of the present invention is not limited to this.
- a stent can also include an open structure of the metal shell and the guide fluid, and the guide fluid can also be divided into Several sections, one section can be connected to more than two electrical ports, and the fluid conducting fluid is not required to be a whole.
- the electrical insulation between the metal shell and the conductive fluid does not necessarily need to be wrapped by an isolation ring, and several insulating supports can also be arranged to fix the conductive fluid on the metal shell without contacting the metal shell.
- Figures 4, 5 and 6 show the structure of an exemplary electrical interface 410.
- Figure 4 shows the structure of the corner of the bracket where the electrical interface is located, and the remaining parts are omitted.
- Fig. 5 is a cross-sectional view taken perpendicularly to the corner of the bracket along the axis of the first conductive column
- Fig. 6 is a top view of the corner of the bracket.
- the first conductive pillar included in the electrical interface 410 is a power conductive pillar 402
- the second conductive pillar is a ground conductive pillar 404.
- the conductive column 420 for power supply includes a hollow columnar part and an annular part extending from the columnar part to the periphery.
- the annular part is embedded in the metal shell 401, and the outward surface of the annular part is flush with the upper surface of the metal shell 401.
- the insulation ring 403 is used to achieve electrical insulation from the metal shell 401, but a gap can also be provided to achieve electrical insulation.
- the columnar part protrudes outside the metal casing 401. It can be inserted into the via hole of the PCB.
- the electrical connection between the power conductive column 420 and the conductive fluid 406, for example, one or several pillars 406a extend from the conductive fluid 406 to connect to the lower surface of the conductive column 420 of the power attribute.
- the solid 406a can be integrally formed with the conductive fluid 406, It can also be a separate connector.
- the pillars can also be replaced by wires or other methods, as long as the electrical connection between the conductive flow 406 and the conductive pillar 402 of the power source property is realized.
- the ground attribute conductive pillar 404 passes through the hollow columnar portion of the power attribute conductive pillar 420.
- the ground attribute conductive pillar 404 and the power attribute conductive pillar 420 may be electrically insulated by a gap, or an insulating sleeve may be used.
- the ground-based conductive pillar 404 includes a pillar-shaped portion, and the pillar-shaped portion may be hollow or solid.
- the conductive fluid 406 has a through hole at the position corresponding to the ground-based conductive post 404, and the lower end of the ground-based conductive post 404 passes through the through hole on the conductive fluid 406, and the metal shell 401
- the bottom wall of the power supply is connected to form the ground property network of the bracket together with the metal shell 401.
- the upper end of the ground property conductive pillar 404 penetrates the columnar part of the power property conductive pillar 420.
- the upper end of the ground-based conductive column 404 may be provided with threads to facilitate screw connection and fixation with external equipment.
- the ground-based conductive pillar 404 and the conductive fluid 406 can be electrically insulated by an isolation sleeve 405b or a gap.
- the diversion fluid 406 and the power attribute conductive column 420 constitute the power signal channel of the stent, which is a component of the power attribute network of the stent.
- the power signal can flow out from the power attribute conductive column 420 of an electrical interface and flow through the diversion fluid 406 Then, it flows back from the conductive column 420 of the power source of another electrical interface.
- the metal casing 401 and the ground-based conductive pillar 404 constitute a component of the ground-attribute network of the support, and the external device can be grounded through the ground-based conductive pillar 404 of each electrical interface.
- the diversion fluid 406 in the above example is a closed structure as a whole, so a hole is opened on the diversion fluid 406 to allow the ground attribute conductive pillars 404 to pass. If the diversion fluid 406 is designed as a segmented structure, the corresponding ground attribute The position of the conductive pillar 404 does not block the ground-based conductive pillar 404 and the lower wall of the metal shell 401, so there is no need to make a hole in the conductive fluid 406, and the ground-based conductive pillar 404 does not need to pass through the conductive fluid 406.
- An exemplary embodiment of the present invention provides a flow-passing device, including the bracket according to any embodiment of the present invention, the PCB according to any embodiment of the present invention, and is configured to install equipment on the bracket
- At least two electrical interfaces of a diversion structure on the bracket are correspondingly connected to at least two multi-function vias on the PCB, wherein: the first conductive posts of the two electrical interfaces penetrate The corresponding multi-function via and contact with the first of the two vias included in the multi-function via to form the power signal output by the power module on the PCB to flow out from an electrical interface and pass through the diversion fluid of the bracket Then flow back from another electrical interface to the transmission path of the load module on the PCB; the second conductive posts of the two electrical interfaces pass through the corresponding multi-function vias and then connect to the mounting member, and the mounting member is connected to the mounting member.
- the second via of the two vias included in the multifunctional via is in contact with each other to realize the connection between the mounting member, the ground property network of the
- the power attribute network of the PCB is composed of various parts that transmit power signals on the PCB, including the first via in the multi-function via (ie, the power attribute via).
- the ground attribute network of the PCB is composed of various parts that transmit the ground signal on the PCB. , Including the second via in the multi-function via (that is, the ground attribute via).
- the power attribute network of the stent consists of the parts that transmit power signals on the stent, including the first conductive pillars of the fluid and each electrical interface (ie, the power attribute conductive pillars); the ground attribute network of the stent consists of the parts that transmit ground signals on the stent
- the composition includes a metal shell and a second conductive pillar (ie, a ground conductive pillar) of each electrical interface.
- the mounting member includes a fastener (such as a screw) and a connector
- the first via hole and the second via hole include pads provided on two outer layers of the PCB
- the first via hole includes a pad on an outer layer
- the second via hole includes a pad on another outer layer
- the first conductive pillar includes an annular portion that is flush with the outer surface of the bracket; the fastening After passing through the connecting piece, the connecting piece is fixedly connected with the second conductive column, such as a screw connection, to connect the connecting piece with the ground property network of the bracket.
- the mounting part, the PCB and the bracket After screwing, not only can the mounting part, the PCB and the bracket be relatively fixed, but also the connection part and the PCB facing the ground property network on an outer layer of the mounting part (such as the outer layer of the second via Pad) to connect the connector to the ground property network of the PCB; at the same time, the PCB faces the power property network on the other outer layer of the bracket (such as the outer pad of the first via ) Is in contact with the ring-shaped part of the first conductive pillar to realize the flow out or flow back of the power supply signal, that is, flow out from the PCB to the bracket or flow back from the bracket to the PCB.
- an outer layer of the mounting part such as the outer layer of the second via Pad
- each set of electrical interfaces includes one electrical interface or two or more electrical interfaces close to each other; the four sets of electrical interfaces are connected to all electrical interfaces.
- the corresponding multi-function vias on the PCB are respectively connected to form at least two independent power signal transmission paths, and each of the transmission paths uses two sets of electrical interfaces as the outflow and return ports of the PCB power signal, Flow out from one set of electrical ports and flow back from another set of electrical ports. Because electrical interfaces need to use vias for current flow, when a group of electrical interfaces includes more than two electrical interfaces, there will be multiple parallel vias for current flow, which can increase the power signal inlet or outlet. Flow capacity.
- the diversion structure can also form at least one additional transmission path for the power signal.
- the additional transmission path uses a set of electrical interfaces as the outlet for the PCB power signal, and the power signal is transmitted through the corresponding diversion fluid. Other transmission paths transmitted to the power signal flow back to the PCB through the other transmission paths.
- the set of electrical interfaces used as outflow ports on the additional transmission path is closer to the source end of the power module on the PCB than electrical interfaces used as outflow ports on other types of transmission paths.
- the additional transmission path also has the function of increasing the flow capacity.
- the support includes at least two sections of diversion structures insulated from each other, and at least one transmission path of the power signal is formed on each diversion structure to transmit different power signals .
- the current flow device proposed in the above embodiment of the present invention uses multi-function vias on the PCB, fully exploits the PCB design and structural space resources, and increases the current channel by borrowing the sandwich bracket, without the need for dedicated current bars and additional
- the fixed point can effectively improve the power supply performance of the PCB, such as the voltage drop and temperature rise of the PCB, which is beneficial to the high-speed signal design and the reduction of the number of PCB layers.
- the excessive power layer copper can be effectively reduced and the PCB space is saved. Reduce the difficulty of PCB design.
- FIG. 8 is an exploded view of the radiator bracket, PCB and mounting parts of the radiator before installation
- Fig. 9 is a top view of the radiator bracket, PCB and mounting parts of the radiator after installation.
- the radiator bracket adopts the radiator bracket in FIG. 2, and includes a frame-shaped metal shell 401 and four electrical interfaces 410 arranged on four corners.
- the PCB301 also includes a high-current load chip 501 and a power output module 601.
- the mounting part includes a fixing ear 102 and a screw 201 of the heat sink, and is configured to fix the heat sink on the heat sink bracket via the PCB.
- the fixed ear 101 is a part of an L-shaped metal sheet, and a side plate of the L-shaped metal sheet is provided with a through hole to allow a screw to pass through and be connected to the second conductive post 404.
- the fixed ear 101 can also be provided with other through holes to pass screws to fix the radiator.
- the screw 201 in this example is a hollow screw with threads on the inner surface of the lower end.
- the fixed ear here is only an example of the mounting member, and the structure of the mounting member can be completely different from this.
- the corresponding type of PCB vias can be designed for the connection of the power supply and the ground network.
- the guide fluid 406 in the sandwich support of the flow device uses copper as a material, and its cross-sectional area can be estimated according to the following formula:
- Width calculation formula Width[mils] Area[mils ⁇ 2]/(Thickness[oz]*1.378[mils/oz])
- Area is the cross-sectional area
- Current[Amps] is the amount of current that needs to pass, in amperes.
- Temp_Rise[deg.C] is the temperature rise in degrees Celsius.
- the screw 201 is sleeved outside the second conductive post 404 to achieve screw connection, but in other examples, the thread of the screw 201 can also be provided on the outer surface of the lower end, and the second conductive
- the post 404 is designed as a hollow cylinder with threads on the inner surface, and the screw connection is realized by screwing the screw 201 into the second conductive post 404.
- the screw 201 is locked to the second conductive post 404, and after the second conductive post 404 is screwed and fastened, the bracket, the PCB 301 and the fixed ear 101 can be fixed together.
- the second conductive post 404 as a component of the ground property network of the bracket is in contact with the screw 201, and the screw 201 is in contact with the fixed ear 101.
- the lower surface of the fixed ear 101 is opposite to the PCB 301 facing an outer layer of the mounting member. Ground property network contact.
- the ground property network of the outer layer on the PCB 301 that is in contact with the fixed ear 101 may include a pad 305 with a ground property via 302 located on the outer layer, and may also include other ground property copper sheets on the outer layer, etc. .
- the ground attribute network of the PCB 301, the ground attribute network of the bracket and the fixed ear 101 are connected. After the radiator is installed through the fixed ear 101, the radiator can be reliably grounded. After the screw connection is fastened, the power attribute network of the other outer layer of the PCB 301 facing the bracket will also contact the ring-shaped part of the first conductive pillar 402.
- the power supply property network of the other outer layer of the PCB 301 that is in contact with the ring portion includes a power property via 303 located on the pad 308 of the other outer layer, and may also include other power property copper sheets on the other outer layer. In this way, a path for the power signal of the PCB to flow out of the bracket and the conductive fluid and then flow back to the PCB from the bracket is realized.
- the columnar part of the first conductive column 402 can prevent movement, and can also be partly in contact with the power attribute via.
- the main contact function is the ring part 402. After the screw 201 is locked, the ring part naturally faces the PCB301 toward the bracket. The power attribute network of the other outer layer is completely in contact.
- the arrow in area B shows the conventional flow path.
- the power signal (or current) is output from the power supply module 601, and is transmitted to the load module on the PCB (such as a power chip) through the power layer in the PCB 301 501 places.
- the arrows in the A and C areas indicate the flow enhancement part of the embodiment of the present invention.
- the power signal is output from the power supply module 601 and is divided into two paths through the inner layer of the PCB 301 to the first multi-function via 30B and the second multi-function via 30D ,
- the diversion fluid that enters the bracket through the corresponding electrical interface is transmitted from the first multi-function via 30B to the third multi-function via 30G, and the other is transmitted from the second multi-function via 30D to the fourth multi-function via 30E, and then flow back to the power layer in the PCB through the corresponding electrical interface, and then transmit to the load module 501.
- the current flow device of the above embodiment of the present invention increases the current channel by borrowing the sandwich bracket, does not require a dedicated flow bar and additional fixing points, and can effectively improve the power supply performance such as the PCB flow voltage drop and temperature rise. It is also conducive to high-speed signal design and reduction of the number of PCB layers, which can effectively reduce excessive power layer copper, save PCB space and reduce the difficulty of PCB design.
- a reinforced flow device is provided, as shown in Figs. 12 and 13.
- the bracket in this embodiment is roughly frame-shaped, but is extended by a small section at four corners, which are called extension sections.
- four electrical interfaces 410 on the four corners four electrical interfaces 410 are set on the four extension sections respectively.
- a total of eight electrical interfaces can be divided into four groups, and each group includes two adjacent ones. Electrical interface.
- 8 multi-function vias are also provided at the corresponding positions of the PCB301.
- the power signal of each transmission path Both the outflow port and the outflow port are implemented with two electrical interfaces of the same group.
- the power signal is transmitted from the power module 601 to the two electrical interfaces of the same group through the copper layer of the power supply layer in the PCB, and then flows out from the two electrical interfaces to the diversion fluid 406 in the stent. It is transmitted to another set of two electrical interfaces, and flows back to the load module 501 of the PCB 301 from the other set of two electrical interfaces.
- the electrical interface provided on the extension section of this embodiment can only be used for the transmission of power signals and does not need to participate in the grounding. Therefore, it does not need to be locked with the mounting part.
- the electrical interface and screws on the four corners are used. After being locked, a reliable power connection can be ensured between the power-on interface of the extension section and the PCB.
- the four electrical interfaces of the extension section may also be provided with only the first conductive pillars, which corresponds to the extension
- the vias of the segment electrical interface can also be set to include only power attribute vias, and do not need to be designed as multifunctional vias.
- FIG. 14 and FIG. 15 another reinforced flow device is provided, as shown in FIG. 14 and FIG. 15.
- the bracket of this embodiment is roughly frame-shaped, but a reinforcing section extends from one of the straight sections (the upper section shown in the figure), except for the four corners.
- one electrical interface 410 is set on the reinforced section, for a total of five electrical interfaces.
- the electrical interface 410 on the reinforced section is closer to the source end of the power module on the PCB than other electrical interfaces.
- 5 multi-function vias are also provided at the corresponding position of PCB301.
- the added transmission path of the power signal flowing through the bracket still includes the two paths in the embodiment shown in FIG. 10 and FIG. 11. The difference is that an additional transmission path is added. .
- the flow direction of the additional transmission path is: the power signal is transmitted from the power module 601 to the electrical interface of the reinforced section through the copper skin of the power layer in the PCB, and flows out from the electrical interface to the diversion fluid 406 in the stent, and the diversion fluid 406 merges from both sides respectively Enter the original two-way transmission path, and flow back to the PCB through the two-way transmission path.
- the added auxiliary transmission path can improve the flow capacity of the flow device and reduce the pressure drop.
- the electrical interface provided on the enhanced section in this embodiment is used for power signal transmission and may or may not participate in grounding.
- the corresponding PCB vias are multi-function vias, which need to be locked with screws during installation. When it is not involved in grounding, it does not need to be locked with the mounting parts. After the electrical ports on the four corners are locked with screws, a reliable power connection between the power-on ports of the enhanced section and the PCB can be ensured.
- the electrical interface of the enhanced section does not participate in grounding.
- the electrical interface of the enhanced section can also be provided with only one conductive post , And the vias corresponding to the electrical interface of the enhanced section can also be set to include only the power attribute vias, and do not need to be designed as multifunctional vias.
- FIG. 16 and FIG. 17 another current flow device capable of transmitting different power signals is provided, as shown in FIG. 16 and FIG. 17.
- the bracket of this embodiment is roughly frame-shaped, but is divided into two mutually insulated diversion structures, namely the diversion structure on the left and the diversion structure on the right.
- the two flow guiding structures are electrically insulated by two intermediate insulators 401a and 401b.
- Each diversion structure includes two electrical interfaces respectively arranged at two corners, which can increase a transmission path of a power signal flowing through the bracket. Therefore, the power signal transmission path through the bracket added in this embodiment is similar to the embodiment shown in FIG. 10 and FIG. 11, except that the two transmission paths can transmit two different types of power signals output from the power module 601 to achieve dual Power supply for each channel is enhanced.
- connection can be a fixed connection, a detachable connection, or an integral Connection; it can be directly connected or indirectly connected through an intermediary.
- connection can be a fixed connection, a detachable connection, or an integral Connection; it can be directly connected or indirectly connected through an intermediary.
- the description of the terms “one embodiment”, “some embodiments”, “specific embodiments”, etc. means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in the present disclosure In at least one embodiment or example.
- the schematic representations of the above-mentioned terms do not necessarily refer to the same embodiment or example.
- the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
Claims (18)
- 一种印制电路板PCB,所述PCB设置有至少两个多功能过孔,每一所述多功能过孔包括基于同一板通孔上制作的第一过孔和第二过孔,所述第一过孔和第二过孔在所述板通孔内上下分离。
- 如权利要求1所述的印制电路板,其中:所述第一个过孔将所述PCB的第一内层与第一外层连通,所述第二过孔将所述PCB的第二内层与第二外层连通。
- 如权利要求1所述的印制电路板,其中:所述第一过孔为电源属性过孔,所述电源属性过孔将所述PCB的第一内层的电源平面连通到所述第一外层;所述第二过孔为地属性过孔,所述地属性过孔将所述PCB的第二内层的地平面连通到所述第二外层。
- 一种支架,包括导流结构,所述导流结构包括一管状的金属外壳,设置在所述金属外壳内的至少一导流体,及间隔设置的至少两个电接口,其中:所述电接口包括第一导电柱和从所述第一导电柱中穿过的第二导电柱,所述第一导电柱的第一端与所述导流体连接,第二端位于所述金属外壳外部,所述第二导电柱的第一端与所述金属外壳连接,第二端突出于所述第一导电柱的第二端之外;所述导流体和所述第一导电柱构成第一信号通路,所述金属外壳和所述第二导电柱构成第二信号通路,两个信号通路之间电气绝缘。
- 如权利要求4所述的支架,其中:所述金属外壳具有一上壁,所述上壁的外表面为平面;所述第一导电柱包括中空的柱状部分和从所述柱状部分向周围延伸的环状部分,所述环状部分向外的表面与所述上壁的外表面平齐且与所述金属外壳之间电气绝缘,所述柱状部分突出于所述外壳之外。
- 如权利要求4所述的支架,其中:所述第二导电柱的第二端带有螺纹。
- 如权利要求4所述的支架,其中:所述金属外壳还具有一下壁,所述第二导电柱的第一端与所述下壁连接;所述导流体对应所述第二导电柱的位置上设有通孔,所述第二导电柱穿过所述通孔和第一导电柱,所述第二导电柱和导流体之间电气绝缘。
- 如权利要求4所述的支架,其中:所述导流体在所述金属外壳的轴向上延伸,所述导流体在所述金属外壳之间通过绝缘支座或者包裹在所述导流体之外的绝缘层实现电气绝缘。
- 如权利要求8所述的支架,其中:所述金属外壳的截面为矩形,所述导流体的截面为矩形或“十字”形。
- 如权利要求4所述的支架,其中:所述导流结构包括4个以上的所述电接口;所述导流结构中包括一个所述导流体,所述导流体将所述导流结构中所有电接口的第一导电柱电连接;或者,所述导流结构中包括多个导流体,每一所述导流体将所述导流结构中的至少两个电接口的第一导电柱电连接。
- 如权利要求4所述的支架,其中:所述金属外壳包括依次连接的多个直线段,所述导流结构包括在M个连接点处分别设置的M’个电接口,其中,M≥M’≥2;或者所述金属外壳包括依次连接的多个直线段和至少一延长段,一所述延长段只连接到一个连接点,所述导流结构包括在M个连接点处分别设置的M’个电接口,及在N个延长段上分别设置的N’个电接口,其中,M≥M’≥2,N≥N’≥1;或者所述金属外壳包括依次连接的多个直线段和至少一加强段,一所述加强段连接到一所述直线段的中部,所述导流结构包括在M个连接点处分别设置的M’个电接口,及在N个加强段上分别设置的N’个电接口,其中,M≥M’≥2,N≥N’≥1。
- 如权利要求4所述的支架,其中:所述支架包括多个所述导流结构,所述多个导流结构之间通过绝缘件或空 隙实现电气绝缘。
- 如权利要求4至12中任一所述的支架,其中:所述支架为与印制电路板配合安装的设备支架,所述第一信号通路为电源信号通路,所述第二信号通路为地信号通路。
- 一种通流装置,包括:如权利要求4至13中任一所述的支架,如权利要求1至3中任一所述的印制电路板PCB,以及设置为将设备安装在所述支架上的安装件,所述支架上一个导流结构的至少两个电接口与所述PCB上的至少两个多功能过孔对应连接,其中:两个所述电接口的第一导电柱穿入对应的多功能过孔且与所述多功能过孔包含的两个过孔中的第一过孔接触,形成PCB上电源模块输出的电源信号从一个电接口流出,经所述支架的导流体后从另一电接口流回到PCB上负载模块的传输路径;两个所述电接口的第二导电柱穿过对应的多功能过孔后与所述安装件连接,所述安装件与所述多功能过孔包含的两个过孔中的第二过孔接触,实现所述安装件、所述支架的地属性网络及PCB的地属性网络间的连接。
- 如权利要求14所述的通流装置,其中:所述安装件包括紧固件和连接件,所述第一过孔和第二过孔包括设置在所述PCB两个外层的焊盘,所述第一导电柱包括与所述支架外表面平齐的环状部分;所述紧固件穿过所述连接件后与所述第二导电柱固定连接,使所述连接件与所述PCB朝向所述安装件的一外层上的地属性网络接触,使所述PCB朝向所述支架的另一外层上的电源属性网络与所述第一导电柱的环状部分接触。
- 如权利要求14或15所述的通流装置,其中:所述导流结构上设置至少四组电接口,每一组电接口包括一个电接口或相互靠近的两个以上的电接口;所述四组电接口与所述PCB上对应的多功能过孔分别连接,形成至少两条独立的电源信号的所述传输路径,每一所述传输路径以两组电接口分别作为PCB电源信号的流出口和流回口。
- 如权利要求16所述的通流装置,其中:所述导流结构上还形成至少一条电源信号的附加传输路径,所述附加传输路径以一组电接口为PCB电源信号的流出口,并通过相应的导流体将电源信号传输到电源信号的其他传输路径,通过所述其他传输路径流回所述PCB,所述附加传输路径作为流出口的该组电接口比其他类型传输路径上作为流出口的电接口更接近于所述PCB上电源模块的源端。
- 如权利要求14或15所述的通流装置,其中:所述支架包括至少两段相互绝缘的导流结构,每一所述导流结构上形成至少一条电源信号的所述传输路径,以用于传输不同的电源信号。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910740819.4 | 2019-08-12 | ||
CN201910740819.4A CN112399708A (zh) | 2019-08-12 | 2019-08-12 | 一种印制电路板、支架和通流装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2021027848A1 true WO2021027848A1 (zh) | 2021-02-18 |
Family
ID=74570526
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2020/108700 WO2021027848A1 (zh) | 2019-08-12 | 2020-08-12 | 一种印制电路板、支架和通流装置 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN112399708A (zh) |
WO (1) | WO2021027848A1 (zh) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2482232Y (zh) * | 2001-06-12 | 2002-03-13 | 陈俊平 | 一种电源插头插座组件 |
EP1624531A1 (de) * | 2004-08-07 | 2006-02-08 | ELCO Europe GmbH | Einpressverbinder |
CN101133478A (zh) * | 2005-03-04 | 2008-02-27 | 三米拉-惜爱公司 | 利用电镀保护层同时并选择性分割通孔结构 |
CN101911390A (zh) * | 2008-01-08 | 2010-12-08 | Fci公司 | 带有反钻式过孔的共孔正交管脚图 |
US20120234587A1 (en) * | 2011-03-15 | 2012-09-20 | Fujitsu Limited | Printed wiring board, printed circuit board unit, electronic apparatus and method for manufacturing printed wiring board |
CN203242799U (zh) * | 2013-05-17 | 2013-10-16 | 莫列斯公司 | 插头、插座及其组合 |
CN104782238A (zh) * | 2013-06-05 | 2015-07-15 | 瑞典爱立信有限公司 | 印刷电路板中通孔结构的选择性分割 |
CN110140430A (zh) * | 2016-04-29 | 2019-08-16 | 阿瑞斯塔网络公司 | 用于印刷电路板的连接器 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2743762B2 (ja) * | 1992-09-30 | 1998-04-22 | 三菱電機株式会社 | 大電流回路基板 |
JP3010285B2 (ja) * | 1998-01-09 | 2000-02-21 | モルデック株式会社 | 大電流用配線基板およびその製造方法 |
JP3405249B2 (ja) * | 1999-02-01 | 2003-05-12 | 住友電装株式会社 | 電気接続箱 |
US7830225B2 (en) * | 2005-06-13 | 2010-11-09 | Gale Robert D | Electric signal splitters |
CN101719605A (zh) * | 2010-02-01 | 2010-06-02 | 曙光信息产业(北京)有限公司 | 基于多块电路板间大电流传输的连接器 |
CN107770949B (zh) * | 2017-09-30 | 2020-06-09 | 苏州达方电子有限公司 | 大电流印刷电路板 |
-
2019
- 2019-08-12 CN CN201910740819.4A patent/CN112399708A/zh active Pending
-
2020
- 2020-08-12 WO PCT/CN2020/108700 patent/WO2021027848A1/zh active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2482232Y (zh) * | 2001-06-12 | 2002-03-13 | 陈俊平 | 一种电源插头插座组件 |
EP1624531A1 (de) * | 2004-08-07 | 2006-02-08 | ELCO Europe GmbH | Einpressverbinder |
CN101133478A (zh) * | 2005-03-04 | 2008-02-27 | 三米拉-惜爱公司 | 利用电镀保护层同时并选择性分割通孔结构 |
CN101911390A (zh) * | 2008-01-08 | 2010-12-08 | Fci公司 | 带有反钻式过孔的共孔正交管脚图 |
US20120234587A1 (en) * | 2011-03-15 | 2012-09-20 | Fujitsu Limited | Printed wiring board, printed circuit board unit, electronic apparatus and method for manufacturing printed wiring board |
CN203242799U (zh) * | 2013-05-17 | 2013-10-16 | 莫列斯公司 | 插头、插座及其组合 |
CN104782238A (zh) * | 2013-06-05 | 2015-07-15 | 瑞典爱立信有限公司 | 印刷电路板中通孔结构的选择性分割 |
CN110140430A (zh) * | 2016-04-29 | 2019-08-16 | 阿瑞斯塔网络公司 | 用于印刷电路板的连接器 |
Also Published As
Publication number | Publication date |
---|---|
CN112399708A (zh) | 2021-02-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102474187B (zh) | 线圈一体型开关电源模块 | |
US4631573A (en) | Cooled stack of electrically isolated semiconductors | |
CN108767404B (zh) | 一种低温耦合器及其使用方法 | |
CN109997223A (zh) | 功率半导体模块 | |
US20230180430A1 (en) | Liquid cooling plate radiator and computing device | |
WO2021027848A1 (zh) | 一种印制电路板、支架和通流装置 | |
US10389266B2 (en) | Rectification module | |
US9397042B2 (en) | Integrated helical multi-layer inductor structures | |
TWM425379U (en) | Integrated magnetic assembly | |
CN204131832U (zh) | 一种印刷电路板、变压器及模块电源 | |
CN110197742A (zh) | 一种均布电流的母排结构 | |
CN212433719U (zh) | 一种液冷板散热器和计算设备 | |
CN110291850A (zh) | 多层电路板以及具有此多层电路板的电子设备 | |
CN206059583U (zh) | 电池模组 | |
CN107643510A (zh) | 一种三明治结构雷达综合信号转接板 | |
CN112066114A (zh) | 一种管件转接头、液冷板散热器和计算设备 | |
CN210224340U (zh) | 一种电源连接器及pcb | |
CN112888144A (zh) | 通流条组件以及通流装置 | |
CN107113962A (zh) | 电子控制装置 | |
US11277912B2 (en) | System of providing power | |
CN206059610U (zh) | 一种新型高功率低互调负载 | |
CN106158520B (zh) | 一种专用于双电源自动转换开关的断路器结构 | |
CN212691143U (zh) | 一种管件转接头、液冷板散热器和计算设备 | |
CN102122879B (zh) | 一种叠层电源及叠层电源互联方法 | |
CN210224344U (zh) | 转换器连接件及转换器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 20852645 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 20852645 Country of ref document: EP Kind code of ref document: A1 |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 20852645 Country of ref document: EP Kind code of ref document: A1 |
|
32PN | Ep: public notification in the ep bulletin as address of the adressee cannot be established |
Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 27/09/2022) |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 20852645 Country of ref document: EP Kind code of ref document: A1 |