WO2021027445A1 - 感光组件、摄像模组及其制作方法 - Google Patents

感光组件、摄像模组及其制作方法 Download PDF

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Publication number
WO2021027445A1
WO2021027445A1 PCT/CN2020/100862 CN2020100862W WO2021027445A1 WO 2021027445 A1 WO2021027445 A1 WO 2021027445A1 CN 2020100862 W CN2020100862 W CN 2020100862W WO 2021027445 A1 WO2021027445 A1 WO 2021027445A1
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WO
WIPO (PCT)
Prior art keywords
photosensitive
circuit board
chip
photosensitive chip
adhesive
Prior art date
Application number
PCT/CN2020/100862
Other languages
English (en)
French (fr)
Inventor
栾仲禹
黄桢
刘丽
干洪锋
李婷花
孙鑫翔
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Priority to EP20853455.2A priority Critical patent/EP4016983A4/en
Priority to US17/635,121 priority patent/US20220303436A1/en
Publication of WO2021027445A1 publication Critical patent/WO2021027445A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Definitions

  • the present invention relates to the technical field of camera modules. Specifically, the present invention relates to a camera module, a photosensitive component for the camera module, and a manufacturing method thereof.
  • the camera module may include a photosensitive component and a lens component, and the lens group of the lens component and other optical components are arranged on the photosensitive path of the photosensitive component (usually a photosensitive chip) of the photosensitive component.
  • the color filter can be directly mounted on the photosensitive component to form part of the photosensitive component, but in other solutions, the photosensitive component may not contain the color filter, but the color filter is made into an independent
  • the color filter assembly or other forms are installed on the light transmission path. Therefore, sometimes the lens assembly can also be understood as a combination of light-transmitting elements such as lens groups, color filters, and supporting structures. This combination can sometimes be called a light-transmitting component.
  • the photosensitive component may include a circuit board and a molded body integrally molded on the circuit board.
  • the photosensitive element is pre-attached to the circuit board, and then a mold is formed on the circuit board through a molding process.
  • Plastic body, the molded body can wrap part of the non-photosensitive area of the photosensitive element.
  • the combination of the circuit board and the molded body and the combination of the molded body and the photosensitive chip are all rigid combinations. The combination is very strong and often requires destructive methods to be removed.
  • the circuit board and the photosensitive chip are combined by glue, which is a relatively flexible combination.
  • the coefficient of thermal expansion (CTE) of the circuit board, the molded body, and the photosensitive chip are different.
  • the environmental temperature changes greatly during the manufacturing process (for example, the molding material needs to be formed at a temperature above 150 degrees Celsius).
  • the ambient temperature may also change many times
  • the expansion degree of the circuit board and the molded body are different, and the circuit board, the molded body, and the expansion speed are also different.
  • the degree of shrinkage of the photosensitive chip is often the smallest, but because the combination of the circuit board and the molded body is a rigid combination, the circuit board and the molded body will generate stress, which will cause the circuit board and the molded body to bend, which will drive The photosensitive chip is deformed.
  • Figure 18 shows a schematic diagram of the principle of deformation of the photosensitive chip due to bending of the circuit board and the molded body. It should be noted that, for ease of understanding, the figure shown in Figure 18 is exaggerated. In fact, the amount of bending may only be more than ten to twenty microns, but this degree of bending is enough to affect the image quality. For example, this kind of bending may cause the field curvature of the camera module to be too large. At this time, the image obtained by the camera module appears to have a normal center effect but poor surrounding effects.
  • the purpose of the present invention is to overcome the shortcomings of the prior art and provide a solution for the photosensitive component and the camera module.
  • the present invention provides a photosensitive assembly, which includes: a circuit board having a first surface for attaching a photosensitive chip and a second surface opposite to the first surface, the first The surface has a raised structure, and the raised structure is distributed in the chip attaching area of the circuit board; the photosensitive chip is attached to the first surface through an adhesive glue, and the adhesive glue is at least arranged on the Between the top surface of the protruding structure and the bottom surface of the photosensitive chip; and a metal wire, which electrically connects the photosensitive chip and the circuit board by wire bonding.
  • the adhesive glue covers the chip attachment area, and the top surface of the protruding structure is flat.
  • the adhesive fills the gap between the bottom surface of the photosensitive chip and the chip attachment area, and the thickness of the adhesive is greater than the protrusion height of the protrusion structure.
  • the protruding structure is a plurality of pillars distributed in the chip attaching area.
  • the convex structure is one or more strip dams.
  • the strip-shaped dam body is a linear dam body, or an annular dam body, or a tortuous dam body formed by zigzag extension within the range of the chip attachment area.
  • the protrusion height of the protrusion structure is 5 ⁇ m-40 ⁇ m.
  • the protrusion height of the protrusion structure is 10 ⁇ m-40 ⁇ m.
  • the circuit board is a PCB board.
  • the photosensitive component further includes a molding part formed on the first surface and surrounding the photosensitive chip.
  • the molding part extends to and contacts the photosensitive chip, and the molding part covers the metal wire.
  • the root of the raised structure is located inside the circuit board, and the raised structure is grown based on the seed layer inside the circuit board.
  • the root of the protruding structure extends toward the second surface and penetrates the circuit board.
  • the protruding structure is attached to the first surface of the circuit board.
  • the protruding structure is attached to the first surface of the circuit board through an SMT process.
  • the raised structure is a metal column or a metal dam.
  • the convex structure includes a first annular dam body on the outside and a second annular dam body on the inside, wherein the height of the protrusion of the first annular dam is greater than the height of the protrusion of the second annular dam.
  • the protruding structure is an annular dam with at least one opening
  • the adhesive is arranged between the top surface of the protruding structure and the bottom surface of the photosensitive chip, and after the adhesive is cured Supporting the photosensitive chip;
  • the protrusion height of the protrusion structure is 10 ⁇ m-30 ⁇ m.
  • a method for manufacturing a photosensitive component which includes: 1) preparing a circuit board, the circuit board has a first surface for attaching a photosensitive chip and a surface opposite to the first surface. The second surface of the first surface, the first surface has a raised structure, and the raised structure is distributed in the chip attaching area of the circuit board; 2) Place the first surface upward, Adhesive glue is arranged on the chip attachment area on the surface, and the adhesive glue is arranged at least on the top surface of the protruding structure; 3) the bottom surface of the photosensitive chip is brought into contact with the adhesive glue, and then the glue The glue is cured to bond the photosensitive chip and the circuit board together; and 4) Based on a wire bonding method, the photosensitive chip and the circuit board are electrically connected by a metal wire.
  • the method for manufacturing the photosensitive component further includes: 5) forming a molding part on the first surface of the circuit board, the molding part surrounding the photosensitive chip; wherein, the molding part and There is a gap between the photosensitive chips, or the molding part extends toward the photosensitive chip and contacts the photosensitive chip.
  • the protruding structure is a plurality of pillars distributed in the chip attaching area, or one or more bar-shaped dams; in the step 2), The adhesive is coated on the chip attaching area of the circuit board; in step 3), the bottom surface of the photosensitive chip is brought into contact with the adhesive, and then the photosensitive chip is continuously pressed to squeeze The adhesive glue is pressed so that the adhesive glue fills the gap between the bottom surface of the photosensitive chip and the chip attaching area.
  • the step 1) includes the following sub-steps: 11) preparing a circuit board blank, the circuit board blank having a through hole or a slot, and the through hole or the slot has a metal seed layer; and 12) in A metal layer is planted on the metal seed layer, so that the metal layer grows and exceeds the first surface to form the convex structure.
  • the step 12) includes the following sub-steps: 121) covering a mask on the upper surface of the circuit board blank, the mask having an opening, the longitudinal section of the opening has a first width, and the The longitudinal section of the through hole or the slot has a second width, and the difference between the first width and the second width is less than 15% of the second width; 122) electroplating, deposition or sputtering method is used in the through Growing metal pillars or metal dams on the seed layer in the hole or slot to form a raised structure beyond the first surface; and 123) removing the mask.
  • the step 1) further includes: attaching the electronic element and the protruding structure to the circuit board in the same process step based on the SMT process.
  • a camera module which includes: a lens assembly; and any of the aforementioned photosensitive assemblies.
  • the photosensitive component and camera module of the present application can avoid or suppress the deformation of the photosensitive chip with a small space size penalty.
  • the photosensitive component and camera module of the present application can improve the structural strength of the circuit board.
  • the photosensitive component and camera module of the present application can improve the heat dissipation efficiency of the photosensitive chip.
  • the photosensitive component and camera module of the present application can ensure the imaging quality of the camera module with a small space size penalty.
  • the photosensitive component and camera module of the present application are particularly suitable for camera modules with high pixels and high frame rate.
  • the photosensitive components and camera modules of this application are particularly suitable for combining with MOC and MOB technologies.
  • the photosensitive component and camera module of the present application have high production efficiency.
  • the photosensitive component of the present application can inhibit the bending of the photosensitive chip by avoiding the effects of excessive heat accumulation and increasing the structural strength. Therefore, the thickness of the package part and the heat dissipation rib on the back of the circuit board can be relatively reduced. In other words, this The application can achieve the effect of suppressing the bending of the photosensitive chip at the cost of a smaller thickness.
  • FIG. 1 shows a schematic cross-sectional view of a photosensitive component 1000 in an embodiment of the present application
  • FIG. 2 shows a three-dimensional schematic diagram of a circuit board 10 having a first surface with a column array in an embodiment of the present application
  • FIG. 3 shows a schematic top view of a circuit board 10 according to another embodiment of the present application.
  • FIG. 4 shows a three-dimensional schematic diagram of a circuit board 10 according to another embodiment of the present application.
  • FIG. 5 shows a schematic cross-sectional view of a photosensitive component 1000 in another embodiment of the present application
  • FIG. 6 shows a schematic cross-sectional view of a photosensitive component 1000 in a modified embodiment of the present application
  • FIG. 7 shows a schematic cross-sectional view of a photosensitive component 1000 according to another embodiment of the present application.
  • FIG. 8 shows a schematic top view of the circuit board 10 in the embodiment of FIG. 7;
  • FIG. 9 shows a circuit board blank 10a in an embodiment of the present application.
  • Figure 10 shows a circuit board blank 10b in another embodiment of the present application
  • FIG. 11 shows a schematic diagram of covering a mask 15 on the upper surface of the circuit board blank 10a in an embodiment of the present application
  • Figure 12 shows a schematic diagram of growing metal pillars or metal dams on a seed layer in an embodiment of the present application
  • FIG. 13 shows a schematic diagram after removing the mask plate in an embodiment of the present application
  • FIG. 14 shows a schematic cross-sectional view of a camera module according to an embodiment of the present application.
  • FIG. 15 shows a schematic cross-sectional view of a camera module according to another embodiment of the present application.
  • FIG. 16 shows a schematic cross-sectional view of a camera module according to another embodiment of the present application.
  • FIG. 17 shows a schematic cross-sectional view of a camera module according to another embodiment of the present application.
  • Figure 18 shows a schematic diagram of the principle of deformation of the photosensitive chip caused by bending of the circuit board and the molded body
  • FIG. 19 shows a schematic cross-sectional view of a circuit board 10 with a "back"-shaped dam in an embodiment of the present application
  • FIG. 20 shows a schematic top view of a circuit board 10 having a "m"-shaped protrusion structure 11 in an embodiment.
  • the heat generated by the photosensitive chip is increasing.
  • the inventor of the present case found that the superposition of factors such as heat accumulation and increase in the size of the photosensitive chip (high pixels leads to an increase in the size of the photosensitive chip) makes the photosensitive chip prone to deformation, and the deformation is sufficient to cause the imaging quality of the camera module to decrease.
  • the photosensitive chip itself is large in area, high in power, and generates more heat; second, the photosensitive chip is large in area and small in thickness.
  • FIG. 1 shows a schematic cross-sectional view of a photosensitive component 1000 in an embodiment of the present application.
  • the photosensitive assembly 1000 includes a circuit board 10, a photosensitive chip 20, a metal wire 30 and an electronic component 40.
  • the circuit board 10 has a first surface 12 for attaching a photosensitive chip and a second surface 13 opposite to the first surface 12, the first surface has raised structures 11, and the raised structures 11 are distributed In the chip attaching area 14 of the circuit board 10.
  • the photosensitive chip 20 is attached to the first surface 12 through an adhesive 21, wherein the adhesive 21 covers the entire chip attaching area 14.
  • the top surface of the protruding structure 11 may be a flat surface, so as to arrange glue on the top surface and to enhance the firmness of the bonding between the back of the photosensitive chip and the first surface of the circuit board.
  • the top surface of the protruding structure 11 may be flat, and the height of all protruding structures is substantially equal, so that the uniformity of the thickness of the glue (ie, the adhesive 21) can be ensured, and the flatness of chip mounting can be increased.
  • the raised structure 11 may be copper pillars made by electroplating or deposition; in another example, the raised structure may be soldered to the circuit using SMT (Surface Mount Technology).
  • the protruding structure can be attached to the circuit board based on the SMT process in the same process step as the electronic components.
  • the metal wire 30 electrically connects the photosensitive chip 20 and the circuit board 10 by wire bonding.
  • One end of the metal wire 30 can be led out from the top surface of the photosensitive chip 20, and the other end can be connected to the non-chip attachment area of the first surface 12 of the circuit board 10.
  • the non-chip attaching area refers to the area outside the chip attaching area 14. Generally speaking, the non-chip attaching area is located around the chip attaching area 14.
  • Wire bonding is a process for electrically connecting the photosensitive chip 20 and the circuit board 10, and its English name is wire bonding, which can also be called “bonding", “bonding” or “wire bonding.”
  • the pad of the photosensitive chip can be electrically connected to the pad of the circuit board.
  • the pad here can be regarded as a port for chip data input and output.
  • the pad of the circuit board can be formed by removing the ink layer to expose the copper layer of the circuit board. In this case, the pad is recessed downward.
  • the pad of the circuit board can also be made by, for example, tin screen printing. In this case, the pad can be raised upward, but the pad is different from the bump structure 11 described in this embodiment.
  • metal pillars such as copper pillars grown by electroplating or deposition help to form a flat top surface.
  • BGA ball grid array
  • the chip and the circuit board are generally electrically connected by soldering tin balls on the back of the chip.
  • the connection method may cause the adhesive material on the back of the chip to be difficult to coat evenly, or the adhesive material may contaminate the solder joints and cause reliability problems.
  • the wire bonding process in this embodiment can avoid the above problems.
  • the pads on the photosensitive chip are located on the front of the photosensitive chip, and the pads on the corresponding circuit board are far away from the photosensitive chip mounting area, and the glue on the back of the chip is not easy. Contaminate the pad.
  • the electronic component 40 can be mounted on the non-chip attachment area of the first surface 12 of the circuit board 10. Specifically, the electronic component 40 may be located outside the metal wire 30.
  • the adhesive 21 fills the gap between the bottom surface of the photosensitive chip 20 and the chip attaching area 14, and the thickness of the adhesive 21 is greater than that of the convex structure 11 Up height.
  • the protruding structure 11 can increase the contact area of the adhesive 21, so that the stress per unit area of the chip attaching area 14 of the circuit board 10 is reduced, thereby causing the stress on the photosensitive chip per unit area of the chip attaching area 14 Reduce, thereby reducing the bending of the photosensitive chip 20.
  • the protrusion height of the protrusion structure 11 is 5-40 micrometers, and the protrusion structure 11 has a larger surface area, can absorb more heat, and increase the heat dissipation efficiency. It should be noted that the protrusion height in this embodiment refers to the height from the first surface 12 to the top surface of the protrusion structure 11.
  • the protrusion height of the protrusion structure 14 may preferably be 10 ⁇ m-40 ⁇ m. This protrusion height range can further increase the thickness and structural strength of the photosensitive chip mounting area, enhance the ability of this part to resist stress, and reduce the bending of this part of the circuit board 10.
  • the material of the protruding structure can choose a coefficient of thermal expansion (CTE) of 10*10-6 to 25*10-6/°C, so as to be close to the coefficient of thermal expansion of materials such as circuit boards.
  • CTE coefficient of thermal expansion
  • the protrusion structure 11 may be a plurality of pillars distributed in the chip attachment area 14 in a hash. Specifically, the protruding structure 11 may be an N*M column array (N and M are both integers).
  • FIG. 2 shows a three-dimensional schematic diagram of a circuit board 10 with a column array on a first surface in an embodiment of the present application. Referring to FIG. 2, the first surface 12 of the circuit board 10 has a rectangular column array.
  • the circuit board 10 may include a circuit board main body 19, a flexible connection band 18 and a connector 17.
  • the circuit board main body 19 may be a PCB board, also called a hard board.
  • the main body 19 of the circuit board is involved in this article. For the convenience of description, the circuit board is sometimes directly used as the main body of the circuit board in this article.
  • FIG. 3 shows a schematic top view of a circuit board 10 according to another embodiment of the present application.
  • a plurality of pillars are irregularly distributed in the chip attachment area 14 of the first surface 12.
  • FIG. 4 shows a three-dimensional schematic diagram of a circuit board 10 according to another embodiment of the present application.
  • the raised structure 11 is a "back" shaped dam.
  • the "back"-shaped dam body can be composed of two ring-shaped dam bodies, one of which is a large ring and the other is a small ring, and the two ring-shaped dams are in the state of a large ring and a small ring.
  • the protruding structure 11 may also be other deformed structures, for example, it may be one or more strip-shaped dams.
  • the strip-shaped dam body can be a linear dam body, it can also be a ring-shaped dam body (which can be regarded as a ring formed by the zigzag extension of the strip), or it can be zigzag in the range of the chip attaching area Other types of tortuous dams formed by extension.
  • the flexible connecting band 18 and the connector 17 are also shown.
  • the two ring shapes of the "Hui" shape can be rectangular similar to the shape of the photosensitive chip, and the matching of the shapes can make the stress generated by the chip evenly distributed on the "Hui" shape dam and conduct out through the dam.
  • FIG. 19 shows a schematic cross-sectional view of a circuit board 10 having a "back"-shaped dam in an embodiment of the present application.
  • the "back"-shaped dam body may include an outer ring dam body 11a and an inner ring dam body 12b, and the height of the outer ring dam body 11a may be higher than the height of the inner ring dam body 11b.
  • the outer ring dam 11a carries at least three sides (or three strip-shaped edge areas) of the photosensitive chip 20, so the flatness of the photosensitive chip 20 can be guaranteed.
  • the inner ring The height of the dam body 11b is lower than that of the outer ring dam body 11a.
  • the inner ring dam body 11b contains more glue than the outer ring dam body 11a.
  • the imaging surface of the lens is also similar to "bowl-shaped”
  • the curved surface that is, the field curvature, which makes the photosensitive surface of the photosensitive chip and the imaging surface of the lens close in shape, reduces the field curvature of the camera module, and improves the imaging quality of the camera module.
  • the dam-type raised structure is not limited to the "back" shape.
  • the protruding structure can also be similar to a "cross” shape or a "m” shape ( Figure 20 shows a circuit with a "m” shape protruding structure 11 in one embodiment).
  • the photosensitive component may further include a molding part formed on the first surface and surrounding the photosensitive chip.
  • the molded part may have a top surface suitable for mounting the lens assembly.
  • the molding part extends to the photosensitive chip and contacts the photosensitive chip, and the molding part covers the metal wire, that is, the MOC solution.
  • FIG. 5 shows a schematic cross-sectional view of a photosensitive component 1000 in another embodiment of the present application.
  • the root 16 of the protruding structure 11 is located inside the circuit board 10.
  • the root 16 of the protruding structure 11 extends toward the second surface 13 and penetrates the circuit board 10.
  • the raised structure 11 since the raised structure 11 penetrates the circuit board 10, it is beneficial to conduct heat to the bottom surface of the circuit board and has a better heat dissipation effect.
  • the raised structure extends to the inside of the circuit board, which can strengthen the attachment of the photosensitive component to the chip.
  • the structural strength of the area reduces the influence of the bending of the circuit board on the photosensitive components in the area.
  • FIG. 6 shows a schematic cross-sectional view of a photosensitive component 1000 in a modified embodiment of the present application.
  • the root 16 of the raised structure 11 of the photosensitive component 1000 is located inside the circuit board 10, but the raised structure 11 does not penetrate the circuit board 10. That is, the end surface of the root 16 of the protruding structure 11 is higher than the second surface 13 (ie, the bottom surface) of the circuit board.
  • the protruding structure 11 of the photosensitive element is attached to the first surface 12 of the circuit board 10.
  • the attachment can be welding or gluing.
  • the protruding structure may be a metal pillar or a metal dam.
  • the metal pillars or metal dams can be obtained by setting a seed layer inside the circuit board and then planting a metal layer.
  • the method of planting the metal layer includes methods such as electroplating, deposition or sputtering.
  • FIG. 7 shows a schematic cross-sectional view of a photosensitive component 1000 according to another embodiment of the present application.
  • FIG. 8 shows a schematic top view of the circuit board 10 in the embodiment of FIG. 7.
  • the photosensitive element 1000 has a raised structure 11 and a bonding method that are different from those in the previous embodiment.
  • the photosensitive component 1000 includes a circuit board 10, a photosensitive chip 20, a metal wire 30 and an electronic component 40.
  • the circuit board 10 has a first surface 12 for attaching the photosensitive chip 20 and a second surface 13 opposite to the first surface 12.
  • the first surface 12 has a protruding structure 11, and the protruding structure is distributed in the chip attaching area of the circuit board, and the top surface of the protruding structure is flat. It should be noted that there is a gap between the first surface and the photosensitive chip in this embodiment, and the two are only bonded at the raised structure 11.
  • the raised structure is an unclosed ring-shaped dam, that is, the raised structure is an unclosed ring when viewed from the top.
  • the photosensitive chip 20 is attached to the first surface through an adhesive 21, wherein the adhesive 21 is arranged between the top surface of the protruding structure 11 and the bottom surface of the photosensitive chip 20, and the adhesive The glue 21 supports the photosensitive chip 20 after curing.
  • the protrusion height of the protrusion structure 11 is 10 ⁇ m-30 ⁇ m.
  • the metal wire 30 electrically connects the photosensitive chip 20 and the circuit board 10 by wire bonding.
  • the electronic component 40 is mounted on the first surface 12. Specifically, the electronic component 40 may be installed on the outside of the metal wire 30. This structure makes a cavity between the photosensitive chip and the circuit board, reduces the intermediate medium between the photosensitive chip and the circuit board, and reduces the transmission of the circuit board stress to the photosensitive chip.
  • a method for manufacturing a photosensitive component which includes the following steps S10-S40.
  • Step S10 prepare the circuit board.
  • the circuit board has a first surface for attaching a photosensitive chip and a second surface opposite to the first surface, the first surface has a raised structure, and the raised structure is distributed on the circuit board The chip attach area.
  • the top surface of the protruding structure may be flat.
  • copper pillars may be formed on the surface of the circuit board by plating or deposition.
  • the protrusion structure may also be a column of other metal material formed on the first surface by electroplating or deposition.
  • the circuit board can be made by yourself, or you can buy a circuit board embryonic board on the market for modification (note that there is no such product on the market at present, in other words, the circuit board 10 described in this step is not an existing product. There is technology).
  • Step S20 placing the first surface facing upward, and disposing an adhesive glue on the chip attaching area of the first surface, the adhesive glue being arranged on at least the top surface of the protruding structure.
  • the adhesive is coated on the entire chip attaching area of the circuit board.
  • step S30 the bottom surface of the photosensitive chip is brought into contact with the adhesive, and then the adhesive is cured, thereby bonding the photosensitive chip and the circuit board together.
  • Step S40 based on wire bonding, electrically connect the photosensitive chip and the circuit board through a metal wire.
  • This step may further include mounting electronic components on the surface of the circuit board.
  • the method for manufacturing the photosensitive component may further include step S50.
  • Step S50 forming a molding part on the first surface of the circuit board, the molding part surrounding the photosensitive chip; wherein there is a space between the molding part and the photosensitive chip, or The molding part extends toward the photosensitive chip and contacts the photosensitive chip.
  • a molded part can be made on the first surface of the circuit board by a molding process (the molded part can cover the electronic components and/or metal wires), and the molded part can be used as The lens holder is used to install the lens assembly.
  • the upper mold and the lower mold can be used to close the mold to form a forming cavity between the upper mold and the first surface of the circuit board, and then the liquid molding material is injected into the forming cavity. Molding to obtain a photosensitive component having a molded part of the desired shape.
  • step S50 can be replaced by a step of installing a molded lens holder. That is, the molded lens holder (ie, lens holder) can be installed on the circuit board, and the lens holder can be used to install lens components.
  • the molded lens holder ie, lens holder
  • the lens holder can be used to install lens components.
  • the protruding structure is a plurality of pillars distributed in the chip attachment area, or one or more strip dams .
  • the adhesive glue is coated on the chip attaching area of the circuit board.
  • the bottom surface of the photosensitive chip is brought into contact with the adhesive, and then the photosensitive chip is continuously pressed to squeeze the adhesive so that the adhesive fills the bottom surface of the photosensitive chip and The gap between the chip attaching areas.
  • the top surface of the adhesive of the photosensitive component produced is flat and uniformly arranged in the chip attaching area, which can enhance the firmness and reliability of the bonding between the bottom surface of the photosensitive chip and the circuit board.
  • the step S10 may include the following sub-steps S11 and S12.
  • Step S11 preparing a circuit board blank 10a, the circuit board blank 10a has a through hole or a slot, and the through hole or the slot has a metal seed layer 11a.
  • Fig. 9 shows a circuit board blank 10a in an embodiment of the present application.
  • the embryonic plate 10a has a metal seed layer 11a. In this embodiment, the metal seed layer 11a penetrates the embryonic plate 10a.
  • Fig. 10 shows a circuit board blank 10b in another embodiment of the present application.
  • the embryonic plate 10b has a metal seed layer 10b, but the metal seed layer 10b does not penetrate the embryonic plate 10b, but is only made in one layer of the embryonic plate 10b.
  • the blank 10b may be a multi-layer board in which lines can be arranged at each level.
  • the metal seed layer is made on the bottom layer of the embryonic plate 10b.
  • the level with the metal seed layer may not be used for wiring, that is, the level where the metal seed layer is located does not belong to a part of the functional circuit in the circuit board. In this way, this level can specifically play a role of structural support to strengthen the structural strength and improve the heat dissipation effect.
  • Step S12 planting a metal layer on the metal seed layer, so that the metal layer grows and exceeds the first surface to form the convex structure.
  • the step S12 may further include the following sub-steps.
  • Step 121 cover the upper surface of the circuit board blank with a mask, the mask has an opening, the longitudinal section of the opening has a first width, and the longitudinal section of the through hole or the slot has a second Width, the difference between the first width and the second width is less than 15% of the second width.
  • FIG. 11 shows a schematic diagram of covering the upper surface of the circuit board blank 10a with a mask 15 in an embodiment of the present application.
  • Step 122 using electroplating, deposition, or sputtering methods to grow metal pillars or metal dams on the seed layer in the through hole or slot to form a convex structure beyond the first surface.
  • FIG. 12 shows a schematic diagram of growing metal pillars or metal dams on the seed layer in an embodiment of the present application.
  • FIG. 12 shows a raised structure 11 obtained by growing a metal pillar or a metal dam on the seed layer.
  • step 123 the mask is removed to obtain the required circuit board.
  • FIG. 13 shows a schematic diagram after removing the mask in an embodiment of the present application. As shown in FIG. 13, after removing the mask, the circuit board 10 with the required protrusion structure 11 can be obtained.
  • the protruding structure in the step S10, may be attached to the surface of the circuit board based on the SMT process (here, the circuit board can be understood as a circuit board blank). Further, step S10 may also include attaching electronic components to the first surface of the circuit board based on the SMT process. In this way, the protruding structure and the electronic component can be completed in the same process step, so as to improve production efficiency.
  • FIG. 14 shows a schematic cross-sectional view of a camera module according to an embodiment of the present application. It can be seen that the camera module includes a photosensitive assembly 1000 and a lens assembly 2000.
  • the photosensitive assembly 1000 adds a lens holder 1001 and a color filter 1002 on the basis of the embodiment in FIG. 1.
  • the lens holder 1001 is installed on the first surface 12 of the circuit board 10.
  • the lens holder 1001 has a light window.
  • the color filter is mounted on the lens holder 1001.
  • the lens assembly 2000 includes a motor 2001, a lens barrel 2002, and a lens group 2003.
  • the lens group 2003 is installed on the inner side of the lens barrel 2002.
  • the outer surface of the lens barrel 2002 is mounted on the motor (usually mounted on the motor carrier).
  • the motor carrier can move relative to the housing of the motor, thereby driving the lens to move relative to the photosensitive assembly.
  • This lens assembly with a motor can be used for autofocus camera modules, zoom camera modules, periscope camera modules, etc.
  • the motor 2001 can also be replaced by a lens carrier.
  • the lens carrier can be directly fixed on the top surface of the photosensitive component, and the inner side surface of the lens carrier and the outer side surface of the lens barrel can be threadedly connected. This lens assembly without a motor can be used for fixed-focus camera modules.
  • FIG. 15 shows a schematic cross-sectional view of a camera module according to another embodiment of the present application.
  • the camera module includes a photosensitive assembly 1000 and a lens assembly 2000.
  • the lens assembly 2000 may be the same as the lens assembly 2000 shown in FIG. 14, and will not be repeated here.
  • the photosensitive component 1000 is added with a front molding part 1003, and the front molding part 1003 can be formed on the first surface 12 of the circuit board 10 through a molding process.
  • the front molding part 1003 may cover electronic components.
  • the front molding part 1003 surrounds the outer side of the lens holder 1001, and the top surface of the front molding part 1003 is a flat surface, which is used for mounting the lens assembly 2000.
  • FIG. 16 shows a schematic cross-sectional view of a camera module according to another embodiment of the present application.
  • the camera module includes a photosensitive assembly 1000 and a lens assembly 2000.
  • the lens assembly 2000 may be the same as the lens assembly 2000 shown in FIG. 14, and will not be repeated here.
  • the difference between the photosensitive assembly 1000 and FIG. 15 lies in the installation position of the lens holder 1001.
  • the lens holder 1001 is installed on the top surface of the front molding part 1003.
  • the lens assembly 2000 is installed on the top surface of the lens holder 1001.
  • FIG. 17 shows a schematic cross-sectional view of a camera module according to another embodiment of the present application.
  • the camera module includes a photosensitive component 1000 and a lens component 2000.
  • the lens assembly 2000 may be the same as the lens assembly 2000 shown in FIG. 14, and will not be repeated here.
  • the difference between the photosensitive element 1000 and FIG. 16 lies in the solution of the front molding part 1003.
  • the front molding part 1003 adopts the MOC scheme, that is, the front molding part 1003 is formed on the first surface 12 of the circuit board 10 through a molding process, and the front molding part 1003 extends toward the photosensitive chip and covers the photosensitive chip. Edge area.
  • the front molding part 1003 not only covers the electronic components, but also covers the metal wires (metal wires of the leader wire bonding process).
  • the front molding part 1003 adopts the MOB scheme.
  • MOB scheme there is a space between the front molding part 1003 and the photosensitive chip.
  • the lens holder 1001 is installed on the top surface of the front molding part 1003.
  • the lens assembly 2000 is installed on the top surface of the lens holder 1001.

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Abstract

本申请涉及一种感光组件，包括线路板、感光芯片和金属线。线路板的第一表面具有凸起结构和芯片贴附区，且凸起结构分布于芯片贴附区。感光芯片通过粘合胶贴附于第一表面，粘合胶至少布置在所述凸起结构的顶面与所述感光芯片的底面之间。金属线通过引线结合的方式将所述感光芯片和所述线路板电连接。本申请还提供了相应的摄像模组和感光组件制作方法。本申请可以用一个较小的空间尺寸代价来避免或抑制感光芯片形变。本申请的感光组件和摄像模组可以提高线路板的结构强度。本申请的感光组件和摄像模组可以提高感光芯片的散热效率。

Description

感光组件、摄像模组及其制作方法
相关申请
本申请要求名称为“感光组件、摄像模组及其制作方法”、于2019年8月15日提交的中国专利申请号为201910753723.1的优先权，并在此通过引用包括上述申请的全部内容。
技术领域
本发明涉及摄像模组技术领域，具体地说，本发明涉及摄像模组、用于摄像模组的感光组件及其制作方法。
背景技术
随着移动电子设备的普及，被应用于移动电子设备的用于帮助使用者获取影像(例如视频或者图像)的摄像模组的相关技术得到了迅猛的发展和进步，并且在近年来，摄像模组在诸如医疗、安防、工业生产等诸多的领域都得到了广泛的应用。
为了满足越来越广泛的市场需求，高像素、小尺寸、大光圈是现有摄像模组不可逆转的发展趋势。然而，要在同一摄像模塑实现高像素、小尺寸、大光圈三个方面的需求是有很大难度的。例如，手机的紧凑型发展和手机屏占比的增加，让手机内部能够用于前置摄像模组的空间越来越小；后置摄像模组的数量越来越多，占据的面积也越来越大，导致手机其他配置诸如电池尺寸、主板尺寸相应缩小，为了避免其他配置的牺牲，市场希望后置摄像模组体积能缩小。而另一方面，市场也对摄像模组的成像质量又提出了越来越高的需求。
在紧凑型摄像模组(例如用于手机的摄像模组)领域，为了减少摄像模组尺寸，提高制造效率，采取了模塑工艺来在线路板上直接形成镜头组件或其它部件的支架(例如MOB或MOC等等工艺方案)。具体来说，摄像模组可以包括感光组件和镜头组件，镜头组件的透镜组及其它光学元件被设置于感光组件的感光元件(通常是感光芯片)的感光路径上。需注意，在一些方案中，滤色片可以直接安装于感光组件构成感光组件的一部分，但在另一些方案中，感光组件中可以不包含滤色片，而是将滤色片制作成独立的滤色片组件或者以其它形式安装在透光路径上。因此，有时也可以将镜头组件理解为透镜组、滤色片等透光元件及其支 撑结构件的组合，这一组合有时也可以被称为透光组件。
进一步地，感光组件可以包括线路板以及一体模塑形成于线路板的模塑体，在MOC封装工艺中，感光元件被预先贴附于线路板，再将通过模塑工艺在线路板上形成模塑体，模塑体可以包裹部分感光元件的非感光区域。在摄像模组中线路板与模塑体的结合、模塑体与感光芯片的结合都属于刚性结合，该结合非常牢固，往往需要通过破坏性方法才能拆除。而与此同时，线路板与感光芯片通过胶水结合，属于相对柔性的结合。另外，线路板、模塑体、感光芯片三者的热膨胀系数(CTE)不同，当在制造过程中环境温度变化较大时(例如模塑材料成型需要将温度提高至150摄氏度以上，在生产摄像模组的后续制造过程中，环境温度还可能会发生多次变化)，线路板、模塑体的膨胀程度是不同的，线路板、模塑体、膨胀速度也是不一样的。其中，感光芯片收缩程度往往最小，然而由于线路板与模塑体的结合属于刚性结合，那线路板与模塑体就会产生应力，使得线路板和模塑体产生弯曲，这种弯曲将带动感光芯片产生形变。图18示出了线路板和模塑体产生弯曲导致感光芯片形变的原理示意图。需注意，为便于理解，图18所示较为夸大，实际上弯曲量可能只有十几到二十几微米，但是这种程度的弯曲足以对成像质量产生影响。例如，这种弯曲可能导致摄像模组的场曲过大，此时该摄像模组成像得到的图像呈现为中心效果正常、但周围效果很差。
进一步地，在当前器件小型化的趋势下，目前主流的紧凑型摄像模组(例如用于手机的摄像模组)中，线路板上大都倾向于不额外增加散热构件，以避免增大摄像模组的尺寸。然而，另一方面，当前高端摄像模组已经发展到了4800万像素，以后还会出现更加高像素、高帧率的摄像模组，相应的感光芯片功率大大提高。本案发明人研究发现，随着感光芯片工作时产生的热量越来越大，这种热量积累导致感光芯片发生形变，是导致成像品质下降的重要因素之一。具体来说，工作状态下，随着摄像模组内部温度的升高，线路板、感光芯片会产生弯曲，从而降低成像质量。换句话说，对于高像素、高帧率的感光芯片，即使不用模塑的方式封装，也会受到温度的影响而产生弯曲。即无论模塑还是非模塑封装，都无法解决高像素、大芯片的弯曲问题。
因此，当前迫切需要一种可以用一个较小的空间尺寸代价来避免或抑制感光芯片形变的解决方案，以及迫切需要一种可以用一个较小的空间尺寸代价来确保摄像模组的成像品质(尤其是在长时间工作状态下的成像品质)的解决方案。
发明内容
本发明的目的在于，克服现有技术的不足，提供一种感光组件和摄像模组的解决方案。
为解决上述技术问题，本发明提供了一种感光组件，其包括：线路板，其具有用于贴附感光芯片的第一表面和与所述第一表面相反的第二表面，所述第一表面具有凸起结构，并且所述凸起结构分布于所述线路板的芯片贴附区；感光芯片，其通过粘合胶贴附于所述第一表面，所述粘合胶至少布置在所述凸起结构的顶面与所述感光芯片的底面之间；以及金属线，其通过引线结合的方式将所述感光芯片和所述线路板电连接。
其中，所述粘合胶覆盖所述芯片贴附区，所述凸起结构的顶面为平面。
其中，所述粘合胶填充满所述感光芯片底面与所述芯片贴附区之间的间隙，并且所述粘合胶的厚度大于所述凸起结构的凸起高度。
其中，所述凸起结构为散列分布于所述芯片贴附区的多个柱体。
其中，所述凸起结构为一个或多个条形坝体。
其中，所述的条形坝体为直线形坝体、或者环形坝体、或者在所述芯片贴附区范围内曲折延伸而形成的曲折坝体。
其中，所述凸起结构的凸起高度为5微米-40微米。
其中，所述凸起结构的凸起高度为10微米-40微米。
其中，所述线路板为PCB板。
其中，所述感光组件还包括形成在所述第一表面并围绕所述感光芯片的模塑部。
其中，所述模塑部与所述感光芯片之间具有间隔。
其中，所述模塑部向所述感光芯片延伸并接触所述感光芯片，并且所述模塑部覆盖所述金属线。
其中，所述凸起结构的根部位于所述线路板内部，所述凸起结构基于所述线路板内部的种子层生长而成。
其中，所述凸起结构的根部向所述第二表面延伸并贯通所述线路板。
其中，所述凸起结构附接于所述线路板的所述第一表面。
其中，所述凸起结构通过SMT工艺附接于所述线路板的所述第一表面。
其中，所述凸起结构为金属柱或金属坝体。
其中，所述凸起结构包括处于外侧的第一环形坝体和处于内侧的第二环形坝 体，其中所述第一环形坝体的凸起高度大于所述第二环形坝体的凸起高度。
其中，所述凸起结构为具有至少一个开口的环形坝体，所述粘合胶布置在所述凸起结构的顶面与所述感光芯片的底面之间，并且所述粘合胶固化后支撑感光芯片；所述凸起结构的凸起高度为10微米-30微米。
根据本申请的另一方面，还提供了一种感光组件制作方法，其包括：1)准备线路板，所述线路板具有用于贴附感光芯片的第一表面和与所述第一表面相反的第二表面，所述第一表面具有凸起结构，并且所述凸起结构分布于所述线路板的芯片贴附区；2)将所述第一表面朝上放置，在所述第一表面的所述芯片贴附区布置粘合胶，所述粘合胶至少布置于所述凸起结构的顶面；3)使感光芯片的底面接触所述粘合胶，然后使所述粘合胶固化，从而将所述感光芯片与所述线路板粘合在一起；以及4)基于引线结合的方式，将所述感光芯片与所述线路板通过金属线电连接。
其中，所述感光组件制作方法还包括：5)在所述线路板的所述第一表面形成模塑部，所述模塑部围绕在所述感光芯片周围；其中，所述模塑部与所述感光芯片之间具有间隔，或者所述模塑部向所述感光芯片延伸并接触所述感光芯片。
其中，所述步骤1)中，所述凸起结构为散列分布于所述芯片贴附区的多个柱体，或者为一个或多个条形坝体；所述步骤2)中，所述粘合胶涂覆在所述线路板的所述芯片贴附区；所述步骤3)中，使所述感光芯片的底面接触所述粘合胶，然后继续下压所述感光芯片以挤压所述粘合胶，使得所述粘合胶充满所述感光芯片底面与所述芯片贴附区之间的间隙。
其中，所述步骤1)包括下列子步骤：11)准备线路板胚板，所述线路板胚板具有通孔或开槽，所述通孔或开槽中具有金属种子层；以及12)在所述金属种子层上植金属层，使得所述金属层生长并超出所述第一表面，形成所述凸起结构。
其中，所述步骤12)包括下列子步骤：121)在所述线路板胚板的上表面覆盖掩膜，所述掩膜具有开孔，所述开孔的纵剖面具有第一宽度，所述通孔或开槽的纵剖面具有第二宽度，所述第一宽度与所述第二宽度之差小于所述第二宽度的15％；122)采用电镀、沉积或溅射方法在所述通孔或开槽中的种子层上生长金属柱或金属坝体，形成超出所述第一表面的凸起结构；以及123)移除所述掩膜板。
其中，所述步骤1)还包括：基于SMT工艺将电子元件和所述凸起结构在同一工艺步骤中附接于所述线路板。
根据本申请的又一方面，还提供了一种摄像模组，其包括：镜头组件；和前述任一感光组件。
与现有技术相比，本申请具有下列至少一个技术效果：
1.本申请的感光组件和摄像模组可以用一个较小的空间尺寸代价来避免或抑制感光芯片形变。
2.本申请的感光组件和摄像模组可以提高线路板的结构强度。
3.本申请的感光组件和摄像模组可以提高感光芯片的散热效率。
4.本申请的感光组件和摄像模组可以用一个较小的空间尺寸代价来确保摄像模组的成像品质。
5.本申请的感光组件和摄像模组特别适合高像素、高帧率的摄像模组。
6.本申请的感光组件和摄像模组特别适合与MOC、MOB技术相结合。
7.本申请的感光组件和摄像模组具有较高的生产效率。
8.本申请的感光组件可以通过避免热量积累过快和增加结构强度两方面的作用来抑制感光芯片弯曲，因此线路板背面的封装部和散热筋的厚度可以相对减小，换句话说，本申请可以以更小的厚度代价来实现抑制感光芯片弯曲的效果。
附图说明
图1示出了本申请一个实施例中的感光组件1000的剖面示意图；
图2示出了本申请一个实施例中的具有第一表面具有柱体阵列的线路板10的立体示意图；
图3示出了本申请另一个实施例的线路板10的俯视示意图；
图4示出了本申请又一个实施例的线路板10的立体示意图；
图5示出了本申请另一个实施例中的感光组件1000的剖面示意图；
图6示出了本申请一个变形的实施例中的感光组件1000的剖面示意图；
图7示出了本申请的另一个实施例的感光组件1000的剖面示意图；
图8示出了图7实施例中的线路板10的俯视示意图；
图9示出本申请一个实施例中的线路板胚板10a；
图10示出了本申请另一个实施例中的线路板胚板10b；
图11示出了本申请一个实施例中的在所述线路板胚板10a的上表面覆盖掩膜15的示意图；
图12示出了本申请一个实施例中的在种子层上生长金属柱或金属坝体的示 意图；
图13示出了本申请一个实施例中的移除所述掩膜板后的示意图；
图14示出了本申请一个实施例的摄像模组的剖面示意图；
图15示出了本申请另一实施例的摄像模组的剖面示意图；
图16示出了本申请又一实施例的摄像模组的剖面示意图；
图17示出了本申请再一实施例的摄像模组的剖面示意图；
图18示出了线路板和模塑体产生弯曲导致感光芯片形变的原理示意图；
图19示出了本申请一个实施例中具有“回”字形坝体的线路板10的剖面示意图；
图20示出了一个实施例中的具有“米”字型凸起结构11的线路板10的俯视示意图。
具体实施方式
为了更好地理解本申请，将参考附图对本申请的各个方面做出更详细的说明。应理解，这些详细说明只是对本申请的示例性实施方式的描述，而非以任何方式限制本申请的范围。在说明书全文中，相同的附图标号指代相同的元件。表述“和/或”包括相关联的所列项目中的一个或多个的任何和全部组合。
应注意，在本说明书中，第一、第二等的表述仅用于将一个特征与另一个特征区分开来，而不表示对特征的任何限制。因此，在不背离本申请的教导的情况下，下文中讨论的第一主体也可被称作第二主体。
在附图中，为了便于说明，已稍微夸大了物体的厚度、尺寸和形状。附图仅为示例而并非严格按比例绘制。
还应理解的是，用语“包括”、“包括有”、“具有”、“包含”和/或“包含有”，当在本说明书中使用时表示存在所陈述的特征、整体、步骤、操作、元件和/或部件，但不排除存在或附加有一个或多个其它特征、整体、步骤、操作、元件、部件和/或它们的组合。此外，当诸如“...中的至少一个”的表述出现在所列特征的列表之后时，修饰整个所列特征，而不是修饰列表中的单独元件。此外，当描述本申请的实施方式时，使用“可以”表示“本申请的一个或多个实施方式”。并且，用语“示例性的”旨在指代示例或举例说明。
如在本文中使用的，用语“基本上”、“大约”以及类似的用语用作表近似的用语，而不用作表程度的用语，并且旨在说明将由本领域普通技术人员认识到 的、测量值或计算值中的固有偏差。
除非另外限定，否则本文中使用的所有用语(包括技术用语和科学用语)均具有与本申请所属领域普通技术人员的通常理解相同的含义。还应理解的是，用语(例如在常用词典中定义的用语)应被解释为具有与它们在相关技术的上下文中的含义一致的含义，并且将不被以理想化或过度正式意义解释，除非本文中明确如此限定。
需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。下面将参考附图并结合实施例来详细说明本申请。
如前文所述，随着手机摄像模组向高像素、高帧率发展，感光芯片工作时产生的热量越来越大。本案发明人研究发现，热量积累和感光芯片的尺寸增加(高像素导致感光芯片的尺寸增加)等因素的叠加，使得感光芯片易于发生形变，且该形变足以导致摄像模组的成像品质下降。具体来说，当前的手机市场(手机摄像模组市场)的发展趋势下，一是感光芯片本身面积大、功率高，产生热量较大；二感光芯片面积大、厚度小，这个比例导致芯片本身容易受到外物影响；三是感光芯片受到外物例如线路板、模塑形变产生的力的影响，使感光芯片更易于发生形变。基于此，申请人提出了一种可以抑制上述形变的复合基板，以及基于该复合基板的感光组件和摄像模组。下面将参考附图并结合实施例来详细说明本申请。
图1示出了本申请一个实施例中的感光组件1000的剖面示意图。参考图1，本实施例中，感光组件1000包括线路板10、感光芯片20、金属线30和电子元件40。其中线路板10具有用于贴附感光芯片的第一表面12和与所述第一表面12相反的第二表面13，所述第一表面具有凸起结构11，并且所述凸起结构11分布于所述线路板10的芯片贴附区14。感光芯片20通过粘合胶21贴附于所述第一表面12，其中所述粘合胶21覆盖整个所述芯片贴附区14。本实施例中所述凸起结构11的顶面可以为平面，以便在该顶面布置胶材，以及增强感光芯片背面与线路板的第一表面粘结的牢固性。本实施例中，凸起结构11的顶面可以为平面，且所有凸起结构的高度基本相等，这样可以保证胶水(即粘合胶21)厚度的均匀性，可以增加芯片安装的平整性。在一个例子中，所述凸起结构11可以是用电镀或者沉积的方式制作铜柱；在另一个例子中，所述凸起结构可以采用SMT(Surface Mount Technology)表面贴装技术被焊接至线路板，进一步的，考虑到生产效率，所述凸起结构可以与电子元器件在同一工艺步骤中，基于SMT工艺附接至线路板。本实施例中，金 属线30通过引线结合的方式将所述感光芯片20和所述线路板10电连接。该金属线30的一端可以从感光芯片20的顶面引出，其另一端可以连接至线路板10的第一表面12的非芯片贴附区。非芯片贴附区指所述芯片贴附区14以外的区域，通常来说，非芯片贴附区位于芯片贴附区14的周围。引线结合是感光芯片20与线路板10实现电连接的一种工艺，其英文名称为wire bonding，也可以被称为“绑定”、“邦定”或“打线”。利用引线结合工艺，可将感光芯片的焊盘与线路板的焊盘电连接。这里的焊盘可视为芯片数据输入输出的端口，其中，线路板的焊盘例如可以通过除去油墨层暴露出线路板铜层而形成，这种情形下，焊盘处是向下凹陷的。线路板的焊盘例如还可以通过锡网印刷的方式制作，这种情形下，焊盘处可以向上凸起，但该焊盘不同本实施例中所述的凸起结构11。通常来说，通过电镀或者沉积生长而成的金属柱(例如铜柱)有助于形成平整的顶面。现有技术中，还存在一种BGA工艺，即焊球阵列(Ball Grid Array)封装工艺，该工艺下，一般通过在芯片背部焊接锡球的方式将芯片与线路板电连接，然而这种电连接方式可能导致芯片背部的胶材难以涂覆均匀，或者胶材污染焊接点导致可靠性问题。而本实施例中的引线结合工艺可以避免上述问题，在一些实施例中感光芯片上的焊盘位于感光芯片正面，对应的线路板上的焊盘远离感光芯片安装区，芯片背部的胶水不容易污染焊盘。本实施例中，电子元件40可以安装在线路板10的第一表面12的非芯片贴附区。具体地，电子元件40可以位于金属线30的外侧。本实施例中，所述粘合胶21填充满所述感光芯片20底面与所述芯片贴附区14之间的间隙，并且所述粘合胶21的厚度大于所述凸起结构11的凸起高度。该凸起结构11可以增加粘合胶21的接触面积，使得线路板10的芯片贴附区14的单位面积的应力减小，进而使得芯片贴附区14的单位面积作用在感光芯片上的应力减少，从而减少感光芯片20的弯曲。进一步地，本实施例中，所述凸起结构11的凸起高度为5微米-40微米，该凸起结构11具有较大的表面积，能吸收更多的热量，增加散热效率。需注意，本实施例中的凸起高度是指第一表面12到所述凸起结构11顶面的高度。进一步地，在本申请的一个实施例中，所述凸起结构14的凸起高度可以优选为10微米-40微米。这个凸起高度范围能够进一步地增加感光芯片安装区的厚度以及结构强度，增强该部分能够抵抗应力的能力，使得该部分线路板10的弯曲减少。
可选的，凸起结构的材料可选择热膨胀系数(CTE)为10*10-6～25*10-6/℃，以便与线路板等材料的热膨胀系数相接近。
进一步地，在本申请的一个实施例中，所述凸起结构11可以为散列分布于所 述芯片贴附区14的多个柱体。具体来说，所述凸起结构11可以是N*M柱体阵列(N和M均为整数)。图2示出了本申请一个实施例中的具有第一表面具有柱体阵列的线路板10的立体示意图。参考图2，该线路板10的第一表面12具有呈矩形的柱体阵列。该线路板10可以包括线路板主体19、柔性连接带18和连接器17。线路板主体19可以是PCB板，又称为硬板。本文中主要涉及的是线路板主体19，为便于描述，本文中有时直接用线路板来代称线路板主体。
进一步地，图3示出了本申请另一个实施例的线路板10的俯视示意图。参考图3，本实施例中，多个柱体不规则地分布在所述第一表面12的芯片贴附区14内。
进一步地，图4示出了本申请又一个实施例的线路板10的立体示意图。参考图4，本实施例中，所述凸起结构11为“回”字形坝体。具体来说，该“回”字形坝体可以由两个环形坝体构成，两个环形坝体一个为大环，一个为小环，并且呈现大环套小环的状态。在本申请的其它实施例中，所述凸起结构11还可以是其它变形的结构，例如可以是为一个或多个条形坝体。其中，所述的条形坝体可以是直线形坝体，也可以是环形坝体(可视为由条形曲折延伸而形成的环形)，还可以是在所述芯片贴附区范围内曲折延伸而形成的其它类型的曲折坝体。需注意，图4中除了示出线路板主体19外，还示出了柔性连接带18和连接器17。“回”字形的两个环形形状可以与感光芯片的形状为相似矩形，形状上的匹配能够使得芯片产生的应力均匀的分布在“回”字形坝体上，并且通过坝体传导出去。
进一步地，图19示出了本申请一个实施例中具有“回”字形坝体的线路板10的剖面示意图。参考图19，所述“回”字形坝体可以包括外环坝体11a和内环坝体12b，外环坝体11a的高度可以高于内环坝体11b的高度。在此实施例中，外环坝体11a承载了感光芯片20至少三个边(或者说三个条状的边缘区域)，因此可以保证感光芯片20安装的平整度，在此基础上，内环坝体11b高度低于外环坝体11a可以通过这两个坝体构成一个“曲面安装面”，以及内环坝体11b处容纳的胶水多于外环坝体11a处容纳的胶水，胶水越多胶水的收缩量越大，这使得感光芯片的内环区域能够被胶水拉动而向线路板弯曲，形成一个类似“碗状”的感光面，一般来说镜头的成像面也是类似“碗状”的曲面(即场曲)，这是使得感光芯片的感光面与镜头成像面形状可以相接近，减小摄像模组的场曲，提升摄像模组的成像质量。
另外，坝体式的所述凸起结构不限于“回”字形。在其它实施例中，所述凸起结构还可以是类似于“十”字型、“米”字型(图20示出了一个实施例中的具 有“米”字型凸起结构11的线路板10的俯视示意图)、“X”字型等形状，以加强线路板和感光芯片在多个方向诸如X方向、Y方向(X方向、Y方向可以是沿着感光芯片长边、短边的方向)以及感光芯片对角线方向上的强度。
进一步地，在本申请的一个实施例中，所述感光组件还可以包括形成在所述第一表面并围绕所述感光芯片的模塑部。该模塑部可以具有适于安装镜头组件的顶面。在一个实施例中，所述模塑部与所述感光芯片之间具有间隔，即MOB方案。在另一个实施例中，所述模塑部向所述感光芯片延伸并接触所述感光芯片，并且所述模塑部覆盖所述金属线，即MOC方案。
进一步地，图5示出了本申请另一个实施例中的感光组件1000的剖面示意图。参考图5，本实施例中，所述凸起结构11的根部16位于所述线路板10的内部。所述凸起结构11的根部16向所述第二表面13延伸并贯通所述线路板10。本实施例中，由于凸起结构11贯通线路板10，有利于将热量传导至线路板的底面，具有更好的散热效果，凸起结构延伸至线路板内部，能够加强感光组件在芯片贴附区域的结构强度，降低线路板弯曲对该区域的感光组件的影响。
图6示出了本申请一个变形的实施例中的感光组件1000的剖面示意图。在该变形的实施例中，感光组件1000的凸起结构11的根部16位于所述线路板10内部，但该凸起结构11不贯通所述线路板10。即凸起结构11的根部16的端面高于线路板的第二表面13(即底面)。
进一步地，仍然参考图1，在本申请的又一个实施例中，感光组件的凸起结构11附接于所述线路板10的所述第一表面12。附接可以是焊接也可以是粘合。
进一步地，在本申请的又一个实施例中，所述凸起结构可以为金属柱或金属坝体。该金属柱或金属坝体可以通过在线路板内部设种子层然后植金属层的方式获得。植金属层的方式包括电镀、沉积或溅射等方法。
进一步地，图7示出了本申请的另一个实施例的感光组件1000的剖面示意图。图8示出了图7实施例中的线路板10的俯视示意图。结合参考图7和图8，本实施例中，感光组件1000具有与前述实施例不同的凸起结构11及粘结方式。该感光组件1000包括线路板10、感光芯片20、金属线30和电子元件40。其中线路板10具有用于贴附感光芯片20的第一表面12和与所述第一表面12相反的第二表面13。所述第一表面12具有凸起结构11，并且所述凸起结构分布于所述线路板的芯片贴附区，所述凸起结构的顶面为平面。需注意，本实施例中第一表面和感光芯片之间具有空隙，二者仅在凸起结构11处粘合。本实施例中，所述凸起结构为不封闭环形坝 体，即该凸起结构在俯视角度下呈不封闭环形。感光芯片20通过粘合胶21贴附于所述第一表面，其中所述粘合胶21布置在所述凸起结构11的顶面与所述感光芯片20的底面之间，并且所述粘合胶21固化后支撑感光芯片20。所述凸起结构11的凸起高度为10微米-30微米。金属线30通过引线结合的方式将所述感光芯片20和所述线路板10电连接。电子元件40安装在所述第一表面12。具体来说，电子元件40可以安装在金属线30的外侧。该结构使得感光芯片与线路板之间为空腔，减少了感光芯片与线路板之间的中间介质，减少了线路板应力向感光芯片的传输
进一步地，根据本申请的另一实施例，还提供了一种感光组件制作方法，其包括下述步骤S10-S40。
步骤S10，准备线路板。所述线路板具有用于贴附感光芯片的第一表面和与所述第一表面相反的第二表面，所述第一表面具有凸起结构，并且所述凸起结构分布于所述线路板的芯片贴附区。本实施例中，所述凸起结构的顶面可以为平面，在一个例子中，可以通过电镀或者沉积的方式在线路板的表面制作铜柱。当然，在别的例子中，凸起结构也可以是通过电镀或者沉积的方式形成在所述第一表面的其它金属材质的柱体。本步骤中，可以自行制作所述线路板，也可以在市场上购买线路板胚板加以改造(需注意，目前市场上没有此类产品，换句话说，本步骤所述的线路板10并非现有技术)。
步骤S20，将所述第一表面朝上放置，在所述第一表面的所述芯片贴附区布置粘合胶，所述粘合胶至少布置于所述凸起结构的顶面。本实施例中，所述粘合胶涂覆在所述线路板的整个芯片贴附区。
步骤S30，使感光芯片的底面接触所述粘合胶，然后使所述粘合胶固化，从而将所述感光芯片与所述线路板粘合在一起。
步骤S40，基于引线结合的方式，将所述感光芯片与所述线路板通过金属线电连接。本步骤还可以进一步包括在线路板表面安装电子元件。
更进一步地，在本申请的另一个实施例中，所述感光组件制作方法还可以包括步骤S50。
步骤S50，在所述线路板的所述第一表面形成模塑部，所述模塑部围绕在所述感光芯片周围；其中，所述模塑部与所述感光芯片之间具有间隔，或者所述模塑部向所述感光芯片延伸并接触所述感光芯片。具体来说，本步骤中，可以在线路板的第一表面上通过模塑工艺制作模塑部(该模塑部可以覆盖所述电子元件和/或金属线)，所述模塑部可以作为镜座用于安装镜头组件。模塑工艺中，可以 利用上模具和下模具合模，在上模具和线路板的第一表面之间构成成形腔，然后再成型腔中注入液体模塑材料，待模塑材料固化成型后脱模，得到具有所需形状的模塑部的感光组件。
需注意，在本申请的又一个实施例中，步骤S50可以被安装已成型的镜头支架的步骤代替。即可以在线路板上安装已成型的镜头支架(即镜座)，该镜座可以用于安装镜头组件。
进一步地，在本申请的一个实施例中，所述步骤S10中，所述凸起结构为散列分布于所述芯片贴附区的多个柱体，或者为一个或多个条形坝体。所述步骤S20中，所述粘合胶涂覆在所述线路板的所述芯片贴附区。所述步骤S30中，使所述感光芯片的底面接触所述粘合胶，然后继续下压所述感光芯片以挤压所述粘合胶，使得所述粘合胶充满所述感光芯片底面与所述芯片贴附区之间的间隙。本实施例中，所制作的感光组件的粘合胶顶面平整且在芯片贴附区内布置均匀，可以增强感光芯片的底面与线路板粘结的牢固性和可靠性。
进一步地，在本申请的一个实施例中，所述步骤S10可以包括下列子步骤S11和S12。
步骤S11,准备线路板胚板10a，所述线路板胚板10a具有通孔或开槽，所述通孔或开槽中具有金属种子层11a。图9示出本申请一个实施例中的线路板胚板10a。该胚板10a中具有金属种子层11a，本实施例中，该金属种子层11a贯通该胚板10a。图10示出了本申请另一个实施例中的线路板胚板10b。该胚板10b中具有金属种子层10b，但金属种子层10b并未贯通胚板10b，而是仅制作在胚板10b中的一层中。这里，胚板10b可以是多层板，其中每个层次均可布置线路。图10中，金属种子层制作在胚板10b的最底层。特别地，在另一个实施例中，具有金属种子层的层次可以不用于布线，即该金属种子层所在的层次不属于线路板中的功能电路的一部分。这样，该层次可以专门起到结构支撑作用，以加强结构强度，同时提升散热效果。
步骤S12,在所述金属种子层上植金属层，使得所述金属层生长并超出所述第一表面，形成所述凸起结构。
更进一步地，在本申请的一个实施例中，所述步骤S12还可以包括下列子步骤。
步骤121，在所述线路板胚板的上表面覆盖掩膜，所述掩膜具有开孔，所述开孔的纵剖面具有第一宽度，所述通孔或开槽的纵剖面具有第二宽度，所述第一 宽度与所述第二宽度之差小于所述第二宽度的15％。图11示出了本申请一个实施例中的在所述线路板胚板10a的上表面覆盖掩膜15的示意图。
步骤122，采用电镀、沉积或溅射方法在所述通孔或开槽中的种子层上生长金属柱或金属坝体，形成超出所述第一表面的凸起结构。图12示出了本申请一个实施例中的在种子层上生长金属柱或金属坝体的示意图。该图12中示出了示出了在种子层上生长金属柱或金属坝体而得到的凸起结构11。
步骤123，移除所述掩膜板，进而得到所需的线路板。图13示出了本申请一个实施例中的移除所述掩膜板后的示意图。如图13所示，移除所述掩膜板后，即可得到具有所需凸起结构11的线路板10。
进一步地，在本申请的另一个实施例中，所述步骤S10中，所述凸起结构可以基于SMT工艺附接至线路板的表面(这里线路板可以理解为线路板胚板)。进一步地，步骤S10还可以包括在线路板的第一表面基于SMT工艺附接电子元件。这样，所述凸起结构和所述电子元件可以在同一工艺步骤中完成，以便提升生产效率。
进一步地，根据本申请的一个实施例，还提供了一种摄像模组，该摄像模组包括感光组件和镜头组件。其中感光组件可以是前述任意一个实施例所述的感光组件。镜头组件可以带有马达，也可以是不带有马达的。图14示出了本申请一个实施例的摄像模组的剖面示意图。可以看出，该摄像模组包括感光组件1000和镜头组件2000。本实施例中，感光组件1000在图1实施例的基础上增加了镜座1001和滤色片1002。其中镜座1001安装于线路板10的第一表面12。镜座1001具有光窗。滤色片安装于所述镜座1001。镜座1001的顶面承靠镜头组件2000的底面。本实施例中，镜头组件2000包括马达2001、镜筒2002和透镜组2003。透镜组2003安装于镜筒2002的内侧面。镜筒2002的外侧面安装于马达(通常安装于马达载体)。马达载体可以相对马达的壳体运动，从而带动镜头相对于感光组件运动。这带有马达的镜头组件可以用于自动对焦摄像模组、变焦摄像模组、潜望式摄像模组等。马达2001也可以被镜头载体替代。该镜头载体可以直接固定在感光组件顶面，镜头载体的内侧面与镜筒的外侧面可以螺纹连接。这种不带马达的镜头组件可以用于定焦摄像模组。
进一步地，图15示出了本申请另一实施例的摄像模组的剖面示意图。参考图15，本实施例中，摄像模组包括感光组件1000和镜头组件2000。镜头组件2000可以与图14所示的镜头组件2000一致，不再赘述。本实施例中，感光组件1000 增加了一正面模塑部1003，该正面模塑部1003可以通过模塑工艺形成在线路板10的第一表面12。正面模塑部1003可以覆盖电子元件。本实施例中，正面模塑部1003围绕在镜座1001的外侧，正面模塑部1003的顶面为一平整面，其用于安装镜头组件2000。
进一步地，图16示出了本申请又一实施例的摄像模组的剖面示意图。参考图16，本实施例中，摄像模组包括感光组件1000和镜头组件2000。镜头组件2000可以与图14所示的镜头组件2000一致，不再赘述。本实施例中，感光组件1000与图15的区别在于镜座1001的安装位置。本实施例中，镜座1001安装于所述正面模塑部1003的顶面。镜头组件2000安装于镜座1001的顶面。
进一步地，图17示出了本申请再一实施例的摄像模组的剖面示意图。参考图17，本实施例中，摄像模组包括感光组件1000和镜头组件2000。镜头组件2000可以与图14所示的镜头组件2000一致，不再赘述。本实施例中，感光组件1000与图16的区别在于正面模塑部1003的方案。本实施例中正面模塑部1003采用了MOC方案，即正面模塑部1003通过模塑工艺形成于线路板10的第一表面12，并且正面模塑部1003向感光芯片延伸并覆盖感光芯片的边缘区域。本实施例中，正面模塑部1003不仅覆盖电子元件，还覆盖金属线(指引线结合工艺的金属线)。而图16的实施例中，正面模塑部1003采用的是MOB方案，MOB方案中，正面模塑部1003与感光芯片之间具有间隔。本实施例中，镜座1001安装于所述正面模塑部1003的顶面。镜头组件2000安装于镜座1001的顶面。
以上描述仅为本申请的较佳实施方式以及对所运用技术原理的说明。本领域技术人员应当理解，本申请中所涉及的发明范围，并不限于上述技术特征的特定组合而成的技术方案，同时也应涵盖在不脱离所述发明构思的情况下，由上述技术特征或其等同特征进行任意组合而形成的其它技术方案。例如上述特征与本申请中公开的(但不限于)具有类似功能的技术特征进行互相替换而形成的技术方案。

Claims (26)

  1. 一种感光组件，其特征在于，包括：
    线路板，其具有用于贴附感光芯片的第一表面和与所述第一表面相反的第二表面，所述第一表面具有凸起结构，并且所述凸起结构分布于所述线路板的芯片贴附区；
    感光芯片，其通过粘合胶贴附于所述第一表面，所述粘合胶至少布置在所述凸起结构的顶面与所述感光芯片的底面之间；以及
    金属线，其通过引线结合的方式将所述感光芯片和所述线路板电连接。
  2. 根据权利要求1所述的感光组件，其特征在于，所述粘合胶覆盖所述芯片贴附区，所述凸起结构的顶面为平面。
  3. 根据权利要求2所述的感光组件，其特征在于，所述粘合胶填充满所述感光芯片底面与所述芯片贴附区之间的间隙，并且所述粘合胶的厚度大于所述凸起结构的凸起高度。
  4. 根据权利要求3所述的感光组件，其特征在于，所述凸起结构为散列分布于所述芯片贴附区的多个柱体。
  5. 根据权利要求3所述的感光组件，其特征在于，所述凸起结构为一个或多个条形坝体。
  6. 根据权利要求5所述的感光组件，其特征在于，所述的条形坝体为直线形坝体、或者环形坝体、或者在所述芯片贴附区范围内曲折延伸而形成的曲折坝体。
  7. 根据权利要求1所述的感光组件，其特征在于，所述凸起结构的凸起高度为5微米-40微米。
  8. 根据权利要求7所述的感光组件，其特征在于，所述凸起结构的凸起 高度为10微米-40微米。
  9. 根据权利要求1所述的感光组件，其特征在于，所述线路板为PCB板。
  10. 根据权利要求1所述的感光组件，其特征在于，所述感光组件还包括形成在所述第一表面并围绕所述感光芯片的模塑部。
  11. 根据权利要求10所述的感光组件，其特征在于，所述模塑部与所述感光芯片之间具有间隔。
  12. 根据权利要求11所述的感光组件，其特征在于，所述模塑部向所述感光芯片延伸并接触所述感光芯片，并且所述模塑部覆盖所述金属线。
  13. 根据权利要求1所述的感光组件，其特征在于，所述凸起结构的根部位于所述线路板内部，所述凸起结构基于所述线路板内部的种子层生长而成。
  14. 根据权利要求13所述的感光组件，其特征在于，所述凸起结构的根部向所述第二表面延伸并贯通所述线路板。
  15. 根据权利要求1所述的感光组件，其特征在于，所述凸起结构附接于所述线路板的所述第一表面。
  16. 根据权利要求15所述的感光组件，其特征在于，所述凸起结构通过SMT工艺附接于所述线路板的所述第一表面。
  17. 根据权利要求1所述的感光组件，其特征在于，所述凸起结构为金属柱或金属坝体。
  18. 根据权利要求1所述的感光组件，其特征在于，所述凸起结构包括处于外侧的第一环形坝体和处于内侧的第二环形坝体，其中所述第一环形坝 体的凸起高度大于所述第二环形坝体的凸起高度。
  19. 根据权利要求1所述的感光组件，其特征在于，所述凸起结构为具有至少一个开口的环形坝体，所述粘合胶布置在所述凸起结构的顶面与所述感光芯片的底面之间，并且所述粘合胶固化后支撑感光芯片；所述凸起结构的凸起高度为10微米-30微米。
  20. 一种感光组件制作方法，其特征在于，包括：
    1)准备线路板，所述线路板具有用于贴附感光芯片的第一表面和与所述第一表面相反的第二表面，所述第一表面具有凸起结构，并且所述凸起结构分布于所述线路板的芯片贴附区；
    2)将所述第一表面朝上放置，在所述第一表面的所述芯片贴附区布置粘合胶，所述粘合胶至少布置于所述凸起结构的顶面；
    3)使感光芯片的底面接触所述粘合胶，然后使所述粘合胶固化，从而将所述感光芯片与所述线路板粘合在一起；以及
    4)基于引线结合的方式，将所述感光芯片与所述线路板通过金属线电连接。
  21. 根据权利要求20所述的感光组件制作方法，其特征在于，所述感光组件制作方法还包括：
    5)在所述线路板的所述第一表面形成模塑部，所述模塑部围绕在所述感光芯片周围；其中，所述模塑部与所述感光芯片之间具有间隔，或者所述模塑部向所述感光芯片延伸并接触所述感光芯片。
  22. 根据权利要求20所述的感光组件制作方法，其特征在于，所述步骤1)中，所述凸起结构为散列分布于所述芯片贴附区的多个柱体，或者为一个或多个条形坝体；
    所述步骤2)中，所述粘合胶涂覆在所述线路板的所述芯片贴附区；
    所述步骤3)中，使所述感光芯片的底面接触所述粘合胶，然后继续下压所述感光芯片以挤压所述粘合胶，使得所述粘合胶充满所述感光芯片底面与所述芯片贴附区之间的间隙。
  23. 根据权利要求20所述的感光组件制作方法，其特征在于，所述步骤1)包括下列子步骤：
    11)准备线路板胚板，所述线路板胚板具有通孔或开槽，所述通孔或开槽中具有金属种子层；以及
    12)在所述金属种子层上植金属层，使得所述金属层生长并超出所述第一表面，形成所述凸起结构。
  24. 根据权利要求23所述的感光组件制作方法，其特征在于，所述步骤12)包括下列子步骤：
    121)在所述线路板胚板的上表面覆盖掩膜，所述掩膜具有开孔，所述开孔的纵剖面具有第一宽度，所述通孔或开槽的纵剖面具有第二宽度，所述第一宽度与所述第二宽度之差小于所述第二宽度的15％；
    122)采用电镀、沉积或溅射方法在所述通孔或开槽中的种子层上生长金属柱或金属坝体，形成超出所述第一表面的凸起结构；以及
    123)移除所述掩膜板。
  25. 根据权利要求24所述的感光组件制作方法，其特征在于，所述步骤1)还包括：基于SMT工艺将电子元件和所述凸起结构在同一工艺步骤中附接于所述线路板。
  26. 一种摄像模组，其特征在于，包括：
    镜头组件；和
    权利要求1-19中任意一项所述的感光组件。
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