WO2021024718A1 - 測温モジュール及び蓄電モジュール - Google Patents

測温モジュール及び蓄電モジュール Download PDF

Info

Publication number
WO2021024718A1
WO2021024718A1 PCT/JP2020/027441 JP2020027441W WO2021024718A1 WO 2021024718 A1 WO2021024718 A1 WO 2021024718A1 JP 2020027441 W JP2020027441 W JP 2020027441W WO 2021024718 A1 WO2021024718 A1 WO 2021024718A1
Authority
WO
WIPO (PCT)
Prior art keywords
temperature
temperature sensor
terminals
temperature measurement
reinforcing plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/027441
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
雪清 董
平光　宏臣
悠人 佐藤
正人 筒木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd filed Critical Sumitomo Wiring Systems Ltd
Priority to US17/632,068 priority Critical patent/US12249697B2/en
Priority to CN202080051356.1A priority patent/CN114128009A/zh
Publication of WO2021024718A1 publication Critical patent/WO2021024718A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
    • H01M10/482—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte for several batteries or cells simultaneously or sequentially
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/4285—Testing apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
    • H01M10/486—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte for measuring temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/653—Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/655—Solid structures for heat exchange or heat conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • This specification discloses technologies related to temperature measurement modules and power storage modules.
  • the temperature sensor of JP-A-2018-124125 is provided with a pattern wiring and a thermistor element on the surface of an insulating film to which a crimp terminal is adhered.
  • This thermistor element is covered with a first sealing resin layer, and a second sealing resin layer made of a material having a lower thermal conductivity than the first sealing resin layer is laminated on the first sealing resin layer.
  • the crimp terminal has a U-shaped wall portion in a plan view, and the wall portion is filled with the first sealing resin layer and the second sealing resin layer.
  • the temperature measuring module described in the present specification is a temperature measuring module for measuring the temperature of a temperature measuring object, and is a flexible print having an insulating sheet member and a circuit pattern wired to the sheet member.
  • the sheet member includes a substrate, a temperature sensor attached to the flexible printed substrate, and a heat transfer material thermally fixed to the temperature sensor, and the sheet member penetrates outside the region where the temperature sensor overlaps.
  • the hole is formed, and the heat transfer material has a heat receiving portion arranged in the through hole and receiving the heat of the temperature measurement object.
  • FIG. 1 is a plan view showing the power storage module of the first embodiment.
  • FIG. 2 is an enlarged perspective view of the vicinity of the temperature sensor and the heat transfer material in the power storage module.
  • FIG. 3 is a cross-sectional view taken along the line AA of FIG.
  • FIG. 4 is an enlarged perspective view of the vicinity of the temperature sensor and the heat transfer material in the power storage module of the second embodiment.
  • FIG. 5 is an enlarged perspective view of the vicinity of the temperature sensor and the heat transfer material in the power storage module of the third embodiment.
  • FIG. 6 is an enlarged perspective view of the vicinity of the temperature sensor and the heat transfer material in the power storage module of the fourth embodiment.
  • FIG. 7 is an enlarged perspective view of the vicinity of the temperature sensor and the heat transfer material in the power storage module of the fifth embodiment.
  • the temperature measuring module of the present disclosure is a temperature measuring module for measuring the temperature of a temperature measuring object, and is a flexible printed substrate having an insulating sheet member and a circuit pattern wired to the sheet member.
  • the sheet member includes a temperature sensor attached to the flexible printed substrate and a heat transfer material thermally fixed to the temperature sensor, and the sheet member has a through hole outside the region where the temperature sensor overlaps. Is formed, and the heat transfer material has a heat receiving portion arranged in the through hole and receiving the heat of the temperature measurement object.
  • the heat of the temperature-measured object is transferred to the heat receiving portion of the heat transfer material in the through hole of the flexible printed substrate, and the heat is transferred to the temperature sensor through the heat transfer material.
  • heat is easily transferred from the temperature measurement object to the temperature sensor, so that it is possible to suppress a decrease in the accuracy of temperature measurement by the temperature sensor.
  • the through holes are arranged on both sides of the temperature sensor in the seat member. In this way, the heat of the temperature measurement object can be transferred to the temperature sensor through the through holes on both sides of the temperature sensor, so that the heat can be more easily transferred from the temperature measurement object to the temperature sensor, and the temperature. It becomes possible to improve the accuracy of measurement.
  • the temperature sensor includes a plurality of terminals
  • the flexible printed circuit board includes a plurality of the circuit patterns connected to the plurality of terminals
  • the plurality of the circuit patterns include a first circuit pattern and the said circuit pattern.
  • a second circuit pattern extending to the opposite side of the first circuit pattern with respect to the temperature sensor is provided. In this way, the circuit pattern can be efficiently wired, so that the wiring density of the flexible printed circuit board can be increased.
  • the temperature sensor includes a plurality of terminals, and the circuit pattern extends along a direction orthogonal to the arrangement direction of the plurality of terminals. In this way, the circuit pattern can be efficiently wired, so that the wiring density of the flexible printed circuit board can be increased.
  • the flexible printed circuit board is provided with a reinforcing plate to be overlapped on the temperature measurement target side, the reinforcing plate is provided with a reinforcing plate through hole connected to the through hole, and the heat receiving portion is provided with the reinforcing plate through hole. It is arranged inside. In this way, the reinforcing plate can suppress the bending of the flexible printed circuit board. Further, the heat of the temperature measurement object can be transferred to the temperature sensor through the heat transfer material in the through hole of the reinforcing plate.
  • a storage device including a plurality of power storage elements having positive and negative electrode terminals, a bus bar as a temperature measurement object for connecting between adjacent electrode terminals of the plurality of power storage elements, and the temperature measurement module. Make it a module. In this way, the temperature of the bus bar connecting the electrode terminals of the power storage element can be measured.
  • the first embodiment will be described with reference to FIGS. 1 to 3.
  • the temperature measurement module 20 of the present embodiment is provided in the power storage module 10 mounted on a vehicle such as an automobile, and measures the temperature of the bus bar 15 as a temperature measurement object.
  • the X direction in FIG. 1 will be described as forward, the Y direction as left, and the Z direction in FIG. 2 as upward.
  • the power storage module 10 measures the temperatures of the plurality of power storage elements 11, the plurality of bus bars 15 connecting the adjacent electrode terminals 12A and 12B of the plurality of power storage elements 11, and the temperature of each bus bar 15.
  • a temperature measuring module 20 for this purpose is provided.
  • the plurality of power storage elements 11 are arranged in a row to form a power storage element group.
  • Each power storage element 11 has positive electrode and negative electrode terminals 12A and 12B (shown as 12A for the positive electrode and 12B for the negative electrode in FIG. 1) on the upper surface of a flat rectangular parallelepiped main body in which a storage element (not shown) is housed. Have.
  • the plurality of power storage elements 11 are arranged so that the polarities of the adjacent electrode terminals 12A and 12B are opposite to each other.
  • the electrode terminals 12A and 12B at the ends of the power storage element group connected in series are connected to an external ECU (Electronic Control Unit) or the like via an electric wire or the like.
  • the ECU is equipped with a microcomputer, elements, etc., and has a function for detecting the voltage, current, temperature, etc. of each power storage element 11 and performing charge / discharge control control of each power storage element 11. It has a well-known configuration.
  • Busbar 15 Each bus bar 15 is made of a metal plate material such as copper, copper alloy, aluminum, or aluminum alloy, and projects from a rectangular bus bar body 15A connecting adjacent electrode terminals 12A and 12B and a side edge portion of the bus bar body 15A.
  • a temperature-measured unit 16 is provided.
  • the bus bar main body 15A can be connected to the electrode terminals 12A and 12B by known connecting means such as welding and bolt fastening.
  • a voltage detection terminal 33 for detecting the voltage of the bus bar 15 (and the power storage element 11) is connected to the bus bar body 15A by a known connection means such as welding or crimping. As shown in FIGS.
  • the temperature-measured portion 16 is a projecting piece protruding from the long side (one side) of the bus bar main body 15A on the same plane as the bus bar main body 15A, and is covered by the temperature sensor 30 described later. The temperature of the temperature measuring unit 16 is detected.
  • the temperature measuring module 20 includes a flexible printed circuit board 21 (hereinafter referred to as FPC 21) and a temperature sensor 30. And the heat transfer material 35.
  • the FPC 21 has a band shape extending in the front-rear direction, and includes a sheet member 22 containing an insulating synthetic resin, and circuit patterns 27A and 27B wired to the sheet member 22.
  • the sheet member 22 is flexible and deformable, and is made of an insulating synthetic resin.
  • the base film 23 is arranged under the circuit patterns 27A and 27B, and the upper surfaces of the circuit patterns 27A and 27B. It has an insulating layer 24 made of an insulating overlay film, a coating film, or the like that covers the surface.
  • the insulating layer 24 is not formed on the base film 23 in a rectangular region on which the temperature sensor 30 overlaps, but is formed with an opening 24A that exposes the base film 23 and the lands 28 of the circuit patterns 27A and 27B.
  • the sheet member 22 is formed with a plurality of through holes 25 and 26 that penetrate the base film 23 and the insulating layer 24.
  • the plurality of through holes 25 and 26 are both rectangular (belt-shaped) long in the left-right direction, and are arranged on both sides of the temperature sensor 30 (and the lands 28 of the circuit patterns 27A and 27B) in the seat member 22.
  • any synthetic resin such as a thermosetting resin, a thermoplastic resin, and a liquid crystal polymer (LCP) can be used as needed.
  • thermosetting resin any thermosetting resin such as an epoxy resin can be used if necessary.
  • thermosetting resin it is preferable to use a thermosetting resin because it is excellent in heat resistance (heat resistance that does not melt by soldering) and dimensional stability.
  • thermoplastic resin examples include polypropylene (PP), polyethylene (PE), polyphenylene sulfide (PPS), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyimide (PI), and any other thermoplastic resin as required. Can be used. It is preferable to use a thermoplastic resin because the molding cost can be reduced.
  • a reinforcing plate 29 is laminated under the base film 23.
  • the reinforcing plate 29 is made of a metal such as aluminum or an aluminum alloy or a flat plate-like member such as a synthetic resin, and is fixed to the lower surface of the base film 23 with an adhesive or the like.
  • a pair of reinforcing plate through holes 29A are formed through the reinforcing plate 29 at positions connected below the through holes 25 and 26.
  • the pair of reinforcing plate through holes 29A have the same shape as the through holes 25 and 26.
  • circuit patterns 27A, 27B are made of metal foils (conductive paths) such as copper, copper alloy, aluminum, and aluminum alloy, and are formed by a known printed wiring technique using printing, etching, plating, or the like.
  • a land 28 having an increased width is formed at the end of the 27B.
  • the thermistor terminals 31A and 31B as the temperature sensor 30 are soldered to the land 28.
  • the circuit patterns 27A and 27B are wired by a first circuit pattern 27A wired by an L-shaped curved path and an L-shaped curved path along the first circuit pattern 27A.
  • the second circuit pattern 27B is provided. As shown in FIG. 2, both the first circuit pattern 27A and the second circuit pattern 27B extend side by side on one side in the left-right direction.
  • the temperature sensor 30 is, for example, a chip type NTC thermistor.
  • the NTC thermistor is a thermistor whose resistance decreases with increasing temperature, and is a pair of terminals 31A covered with metal plating made of Pb or the like at both ends in the longitudinal direction of a rectangular parallelepiped thermistor base having internal electrodes. , 31B are formed.
  • the arrangement direction (front-back direction) of the pair of terminals 31A and 31B of the temperature sensor 30 is orthogonal to the longitudinal direction (left-right direction) of the through holes 25 and 26 of the FPC 21.
  • Heat transfer material 35 As shown in FIG. 3, the heat transfer material 35 is stacked on the upper surface of the FPC 21 and bulges in a chevron shape, and the heat transfer main body 36 in which the temperature sensor 30 is embedded, and the pair of through holes 25 and 26 and the pair of reinforcing plates penetrate. A pair of heat receiving portions 37, which are arranged in the hole 29A and receive the heat of the bus bar 15, are provided.
  • the heat transfer body 36 is in close contact with almost the entire outer surface of the temperature sensor 30, and is arranged in a circular region including an opening 24A on the upper surface of the FPC 21 and a pair of through holes 25 and 26 (and a reinforcing plate through hole 29A). There is.
  • the entire temperature sensor 30 is embedded inside the heat transfer main body 36.
  • the heat receiving portion 37 is filled so as to fill the space in the pair of through holes 25 and 26 of the bus bar 15 and the reinforcing plate through hole 29A of the reinforcing plate 29, and the lower end 37A of the heat receiving portion 37 is the reinforcing plate 29. It is formed at a position along the lower surface of the.
  • the heat transfer material 35 can be, for example, thermal paste, gel, adhesive, synthetic resin, or the like.
  • thermal paste for example, a material having high thermal conductivity and insulating properties such as silicone grease can be used.
  • the heat transfer material 35 may have viscosity, but may be a non-viscous and solidified member.
  • a room temperature curing type that cures at room temperature after assembly or a heat transfer type that cures by heating after assembly may be used.
  • the assembly of the temperature measuring module 20 will be described.
  • a pair of terminals 31A and 31B of each temperature sensor 30 are mounted on a pair of lands 28 exposed from the opening 24A of the insulating layer 24 of the FPC 21 by reflow soldering or the like.
  • the heat transfer material 35 in the molten state is applied onto each temperature sensor 30 (and FPC 21).
  • the portions filled in the pair of through holes 25 and 26 are solidified, and the heat transfer material 35 covering each temperature sensor 30 is solidified above the FPC 21.
  • the temperature measurement module 20 is formed.
  • each bus bar 15 is connected to the adjacent electrode terminals 12A and 12B of the plurality of power storage elements 11 by welding or the like.
  • each reinforcing plate 29 of the FPC 21 is in a state of being overlapped on the temperature measured portion 16 of each bus bar 15.
  • the circuit pattern for voltage detection of the FPC 21 and the bus bar 15 are connected by a plurality of voltage detection terminals 33 (FIG. 1). As a result, the power storage module 10 is formed.
  • An FPC 21 (flexible printed substrate) which is a temperature measuring module 20 for measuring the temperature of a bus bar 15 (temperature measuring object) and has an insulating sheet member 22 and circuit patterns 27A and 27B wired to the sheet member 22. ), A temperature sensor 30 attached to the FPC 21, and a heat transfer material 35 thermally fixed to the temperature sensor 30, and the sheet member 22 has a through hole outside the region where the temperature sensor 30 overlaps. 25 and 26 are formed, and the heat transfer material 35 has a heat receiving portion 37 arranged in the through holes 25 and 26 to receive the heat of the bus bar 15.
  • the heat of the bus bar 15 is transferred to the heat receiving portion 37 of the heat transfer material 35 in the through holes 25 and 26 of the FPC 21, and the heat is transferred to the temperature sensor 30 via the heat transfer material 35.
  • heat is easily transferred from the bus bar 15 to the temperature sensor 30, so that it is possible to suppress a decrease in the accuracy of temperature measurement by the temperature sensor 30.
  • the through holes 25 and 26 are arranged on both sides of the temperature sensor 30 in the seat member 22. In this way, the heat of the bus bar 15 can be transferred to the temperature sensor 30 through the through holes 25 and 26 on both sides of the temperature sensor 30, so that the heat can be more easily transferred from the bus bar 15 to the temperature sensor 30. , It becomes possible to improve the accuracy of temperature measurement.
  • the heat transfer material 35 is filled in the through holes 25 and 26. In this way, the thermal conductivity in the through holes 25 and 26 can be improved.
  • the temperature sensor 30 includes a plurality of terminals 31A and 31B, and the circuit patterns 27A and 27B extend in a direction orthogonal to the arrangement direction of the plurality of terminals 31A and 31B. By doing so, the circuit patterns 27A and 27B can be efficiently wired, so that the wiring density of the FPC 21 can be increased.
  • a reinforcing plate 29 stacked on the bus bar 15 side of the FPC 21 is provided, the reinforcing plate 29 is provided with a reinforcing plate through hole 29A connected to the through holes 25 and 26, and the heat transfer material 35 is arranged in the reinforcing plate through hole 29A.
  • the reinforcing plate 29 can suppress the bending of the FPC 21.
  • the heat of the bus bar 15 can be transferred to the temperature sensor 30 via the heat transfer material 35 in the reinforcing plate through hole 29A.
  • the power storage module 10 is a bus bar 15 as a temperature measuring object that connects a plurality of power storage elements 11 having positive and negative electrode terminals 12A and 12B and adjacent electrode terminals 12A and 12B of the plurality of power storage elements 11. And a temperature measuring module 20. In this way, the temperature of the bus bar 15 connecting the electrode terminals 12A and 12B of the power storage element 11 can be measured.
  • the temperature measurement module 40 of the second embodiment has a different orientation of the temperature sensor 30 and a path of the circuit patterns 47A and 47B from the first embodiment. Since the other configurations are the same as those in the first embodiment, the same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted below.
  • the temperature measurement module 40 includes an FPC 41, a temperature sensor 30, and a heat transfer material 35.
  • the FPC 41 includes a first circuit pattern 47A and a second circuit pattern 47B that are wired to the seat member 22.
  • the first circuit pattern 47A and the second circuit pattern 47B extend in opposite directions in the left-right direction with respect to the pair of left and right lands 48, and then bend and extend side by side toward the end side of the FPC 41.
  • the arrangement direction of the pair of terminals 31A and 31B of the temperature sensor 30 is the direction along the longitudinal direction of the through holes 25 and 26 of the FPC 41 (the direction along the long side).
  • the first circuit pattern 47A and the second circuit pattern 47B extending to the opposite side of the first circuit pattern 47A with respect to the temperature sensor 30 are provided.
  • the circuit patterns 47A and 47B can be efficiently wired, so that the wiring density of the FPC 41 can be increased.
  • the third embodiment will be described with reference to FIG.
  • the arrangement direction of the terminals 31A and 31B of the temperature sensor 30 and the longitudinal direction (long side direction) of the through holes 51 and 52 are in the front-rear direction (the extending direction of the FPC 50A). Is. Since the other configurations are the same as those in the above embodiment, the same configurations as those in the above embodiment are designated by the same reference numerals and the description thereof will be omitted.
  • Each of the through holes 51 and 52 penetrating the sheet member 22 of the FPC 50A has a rectangular shape that is long in the front-rear direction.
  • a pair of reinforcing plate through holes 55A are formed through the reinforcing plate 55 at positions connected below the through holes 51 and 52.
  • the pair of reinforcing plate through holes 55A have the same shape as the through holes 51 and 52.
  • the FPC 50A includes circuit patterns 53A and 53B wired to the seat member 22.
  • a pair of front and rear lands 54 are provided in a rectangular opening 24A that is long in the front-rear direction and is formed through the insulating layer 24.
  • the first circuit pattern 53A and the second circuit pattern 53B extend in opposite directions in the front-rear direction with respect to the pair of front-rear lands 54, and then bend and extend side by side toward the end side of the FPC 41.
  • the arrangement direction of the pair of terminals 31A and 31B of the temperature sensor 30 is the longitudinal direction (long side direction) of the through holes 51 and 52 of the FPC 50A and the direction along the extending direction of the FPC 50A.
  • the temperature measuring module 60 of the fourth embodiment has a U-shaped through hole 61. Since the other configurations are the same as those in the above embodiment, the same configurations as those in the above embodiment are designated by the same reference numerals and the description thereof will be omitted.
  • the FPC 60A of the temperature measuring module 60 includes a first circuit pattern 67A and a second circuit pattern 67B wired to the seat member 22. In the first circuit pattern 67A and the second circuit pattern 67B, a pair of front and rear lands 54 are provided in an opening 24A formed through the insulating layer 24.
  • the seat member 22 of the FPC 60A is formed with a U-shaped through hole 61 having an open front (one in the front-rear direction).
  • the pair of circuit patterns 67A and 67B connected to the pair of front and rear lands 54 by the through hole 61 extend side by side toward the front (the open side of the through hole 61).
  • a pair of reinforcing plate through holes 68A are formed through the reinforcing plate 68 at positions connected below the through holes 61.
  • the pair of reinforcing plate through holes 68A have the same shape as the through holes 61.
  • the temperature measuring module 70 of the fifth embodiment is obtained by changing the shapes of the through holes 71 and 72 with respect to the first embodiment. Since the other configurations are the same as those in the above embodiment, the same configurations as those in the above embodiment are designated by the same reference numerals and the description thereof will be omitted.
  • Through holes 71 and 72 penetrating the sheet member 22 are formed in the FPC 70A of the temperature measuring module 70.
  • the through holes 71 and 72 have a substantially rectangular shape, and a bulging portion 73 bulging in an arc shape is formed at the edge portion on the side far from the temperature sensor 30.
  • the bulging portion 73 is curved along the shape (outer peripheral shape) of the edge portion of the heat transfer material 35.
  • a pair of reinforcing plate through holes 74A are formed through the reinforcing plate 74 at positions connected below the through holes 71 and 72.
  • the pair of reinforcing plate through holes 74A have the same shape as the through holes 71 and 72.
  • the area of the through holes 71 and 72 can be increased without increasing the outer diameter of the heat transfer material 35, so that the heat transfer property of the heat transfer material 35 in the through holes 71 and 72 can be improved. Can be improved.
  • the temperature sensor 30 is an NTC thermistor, it may be another thermistor such as a PTC thermistor or a thermoelectric pair other than the thermistor.
  • Power storage module 11 Power storage element 12A, 12B: Electrode terminal 15: Bus bar 15A: Bus bar body 16: Temperature-measured part 20, 40, 50, 60, 70: Temperature measurement module 21, 41, 50A, 60A, 70A: FPC (Flexible Printed Circuit Board) 22: Sheet member 23: Base film 24: Insulation layer 24A: Openings 25, 26, 51, 52, 61, 71, 72: Through holes 27A, 47A, 53A, 67A: First circuit pattern 27B, 47B, 53B, 67B : Second circuit pattern 28,48,54: Land 29,55,68,74: Reinforcing plate 29A, 55A, 68A, 74A: Reinforcing plate through hole 30: Temperature sensor 31A, 31B: Terminal 33: Voltage detection terminal 35: Heat transfer material 36: Heat transfer body 37: Heat receiving part 37A: Lower end 73: Swelling part

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Secondary Cells (AREA)
  • Battery Mounting, Suspending (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Structure Of Printed Boards (AREA)
PCT/JP2020/027441 2019-08-02 2020-07-15 測温モジュール及び蓄電モジュール Ceased WO2021024718A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US17/632,068 US12249697B2 (en) 2019-08-02 2020-07-15 Temperature measurement module and power storage module
CN202080051356.1A CN114128009A (zh) 2019-08-02 2020-07-15 测温模块和蓄电模块

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019142753A JP7226176B2 (ja) 2019-08-02 2019-08-02 測温モジュール及び蓄電モジュール
JP2019-142753 2019-08-02

Publications (1)

Publication Number Publication Date
WO2021024718A1 true WO2021024718A1 (ja) 2021-02-11

Family

ID=74502481

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/027441 Ceased WO2021024718A1 (ja) 2019-08-02 2020-07-15 測温モジュール及び蓄電モジュール

Country Status (4)

Country Link
US (1) US12249697B2 (https=)
JP (1) JP7226176B2 (https=)
CN (1) CN114128009A (https=)
WO (1) WO2021024718A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023127107A (ja) * 2022-03-01 2023-09-13 矢崎総業株式会社 温度センサ
JP2024001000A (ja) * 2022-06-21 2024-01-09 三星エスディアイ株式会社 バッテリーパック
US20240063445A1 (en) * 2022-08-17 2024-02-22 Te Connectivity Germany Gmbh Cell Contacting System, Method for Producing a Cell Contacting System and Battery Module

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023184107A (ja) * 2022-06-17 2023-12-28 ニデックインスツルメンツ株式会社 ロボットコントローラの冷却装置
JP7844657B2 (ja) * 2022-12-23 2026-04-13 エルジー エナジー ソリューション リミテッド バッテリーモジュール
CN120814097A (zh) * 2023-10-24 2025-10-17 日本汽车能源株式会社 电池组
DE102023133152A1 (de) 2023-11-28 2025-05-28 Audi Aktiengesellschaft Batteriemodul und Kraftfahrzeug mit einer Sensorik zum Erfassen eines thermischen Durchgehens
CN120261779A (zh) * 2024-01-02 2025-07-04 宁德时代新能源科技股份有限公司 温度采样组件、电池及用电装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04122341U (ja) * 1991-04-22 1992-11-02 石塚電子株式会社 非接触形温度検出器
JP2013251294A (ja) * 2012-05-30 2013-12-12 Auto Network Gijutsu Kenkyusho:Kk 温度センサ及び配線モジュール
JP2018059902A (ja) * 2016-07-29 2018-04-12 タイコ エレクトロニクス （シャンハイ） カンパニー リミテッド 温度測定アセンブリ、電気的なデバイスアセンブリ、アセンブリに接続されるバッテリーパック、およびバッテリーパック

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04122341A (ja) 1990-09-14 1992-04-22 Matsushita Electric Ind Co Ltd 電気掃除機
JP2012247372A (ja) * 2011-05-30 2012-12-13 Nippon Mektron Ltd 圧力センサ及びその製造方法並びに圧力検出モジュール
JP6012575B2 (ja) * 2012-12-19 2016-10-25 三菱重工業株式会社 電池状態監視装置及びこれを備えた電池モジュール
KR102357835B1 (ko) * 2017-01-26 2022-02-04 삼성에스디아이 주식회사 배터리 팩
JP6880484B2 (ja) 2017-01-31 2021-06-02 三菱マテリアル株式会社 温度センサ
CN113811748A (zh) * 2019-03-18 2021-12-17 第一传感器移动有限公司 具有温度传感器元件的传感器装置和其制造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04122341U (ja) * 1991-04-22 1992-11-02 石塚電子株式会社 非接触形温度検出器
JP2013251294A (ja) * 2012-05-30 2013-12-12 Auto Network Gijutsu Kenkyusho:Kk 温度センサ及び配線モジュール
JP2018059902A (ja) * 2016-07-29 2018-04-12 タイコ エレクトロニクス （シャンハイ） カンパニー リミテッド 温度測定アセンブリ、電気的なデバイスアセンブリ、アセンブリに接続されるバッテリーパック、およびバッテリーパック

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023127107A (ja) * 2022-03-01 2023-09-13 矢崎総業株式会社 温度センサ
JP7578639B2 (ja) 2022-03-01 2024-11-06 矢崎総業株式会社 温度センサ
JP2024001000A (ja) * 2022-06-21 2024-01-09 三星エスディアイ株式会社 バッテリーパック
JP7640615B2 (ja) 2022-06-21 2025-03-05 三星エスディアイ株式会社 バッテリーパック
JP2025068094A (ja) * 2022-06-21 2025-04-24 三星エスディアイ株式会社 バッテリーパック
JP7755763B2 (ja) 2022-06-21 2025-10-16 三星エスディアイ株式会社 バッテリーパック
US20240063445A1 (en) * 2022-08-17 2024-02-22 Te Connectivity Germany Gmbh Cell Contacting System, Method for Producing a Cell Contacting System and Battery Module
JP2024028186A (ja) * 2022-08-17 2024-03-01 ティーイー コネクティビティ ジャーマニー ゲゼルシャフト ミット ベシュレンクテル ハフツンク セル接触システム、セル接触システムを製造するための方法、およびバッテリモジュール
JP7827241B2 (ja) 2022-08-17 2026-03-10 ティーイー コネクティビティ ジャーマニー ゲゼルシャフト ミット ベシュレンクテル ハフツンク セル接触システム、セル接触システムを製造するための方法、およびバッテリモジュール

Also Published As

Publication number Publication date
CN114128009A (zh) 2022-03-01
US20220255154A1 (en) 2022-08-11
JP7226176B2 (ja) 2023-02-21
US12249697B2 (en) 2025-03-11
JP2021025846A (ja) 2021-02-22

Similar Documents

Publication Publication Date Title
JP7226176B2 (ja) 測温モジュール及び蓄電モジュール
US10847776B2 (en) Conductive module and battery pack
JP7004231B2 (ja) 配線モジュール
US20210092828A1 (en) Circuit unit, electrical junction box, and production method of circuit unit
US12101888B2 (en) Flexible printed circuit board, wiring module, flexible printed circuit board including terminal, and power storage module
US12114429B2 (en) Flexible printed circuit board including terminal, wiring module, and power storage module
US11349233B2 (en) Connection structure including circuit body and conductive body
CN114556685B (zh) 布线模块
US11166382B2 (en) Connection structure including circuit body and conductive body
US11898915B2 (en) Circuit assembly
US12125612B2 (en) Wire harness for power storage module, and method of producing wire harness
WO2022044645A1 (ja) 車載用配線モジュール
JP2025112757A (ja) ヒータ
JP2024092370A (ja) 電線と回路基板との接続構造、及び測温ユニット
JP2005181119A (ja) 電流センサ及び同センサを備えた回路構成体
JP2020060464A (ja) 赤外線センサ及びその製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20848938

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20848938

Country of ref document: EP

Kind code of ref document: A1

WWG Wipo information: grant in national office

Ref document number: 17632068

Country of ref document: US