WO2021024564A1 - Condensateur à film - Google Patents

Condensateur à film Download PDF

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Publication number
WO2021024564A1
WO2021024564A1 PCT/JP2020/018695 JP2020018695W WO2021024564A1 WO 2021024564 A1 WO2021024564 A1 WO 2021024564A1 JP 2020018695 W JP2020018695 W JP 2020018695W WO 2021024564 A1 WO2021024564 A1 WO 2021024564A1
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Prior art keywords
dielectric film
main surface
film
electrode
electrode layer
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PCT/JP2020/018695
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English (en)
Japanese (ja)
Inventor
亮 真島
拓也 阪本
Original Assignee
株式会社村田製作所
株式会社指月電機製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 株式会社村田製作所, 株式会社指月電機製作所 filed Critical 株式会社村田製作所
Priority to JP2021537583A priority Critical patent/JP7301974B2/ja
Priority to CN202090000734.9U priority patent/CN217157969U/zh
Publication of WO2021024564A1 publication Critical patent/WO2021024564A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors

Definitions

  • the present invention relates to a film capacitor.
  • a film capacitor having a structure in which a first counter electrode and a second counter electrode facing each other with the resin film sandwiched therein are arranged while using a flexible resin film as a dielectric (for example, Patent Document). See 1-4).
  • a film capacitor having a structure in which a first counter electrode and a second counter electrode facing each other with the resin film sandwiched therein are arranged while using a flexible resin film as a dielectric.
  • Patent Document 1 two sheets of a double-sided metallized polypropylene film in which metal vapor deposition electrodes are formed on both sides of a polypropylene film and a non-metallized polypropylene film in which metal vapor deposition electrodes are not formed on the polypropylene film are laminated to form a pair.
  • the thickness of the polypropylene film constituting the double-sided metallized polypropylene film which is composed of the wound material obtained by winding the wound material and the metallikon electrodes formed on the two side surfaces of the wound material, is the non-metallized polypropylene film.
  • a film capacitor is disclosed, which is characterized in that it is thicker than the polypropylene film constituting the above.
  • Patent Document 2 describes an element in which a pair of metallized films having metal vapor deposition electrodes formed on a dielectric film are laminated and wound so that the metal vapor deposition electrodes face each other via the dielectric film, and the element.
  • a metallized film capacitor composed of a pair of metallicon electrodes formed by metal spraying on both end faces of the above, as the metallized film, an insulating margin composed of a non-metal vapor deposition portion is provided in the longitudinal direction on one end side in the width direction of the dielectric film.
  • a plurality of divided electrodes are formed by providing a lateral margin composed of a non-metal vapor deposition portion from the insulating margin toward the other end side while being continuously provided, and the non-metal vapor deposition extends in the longitudinal direction of the dielectric film.
  • a vertical margin consisting of parts is provided, and at least one of the vertical margin and the horizontal margin is inclined with respect to a straight line in the longitudinal direction of the metallized film or a straight line orthogonal to the straight line in the longitudinal direction.
  • Patent Document 3 describes a metallized film multilayer body in which a metallized film having a metal vapor deposition electrode formed on the surface of a dielectric film is wound or laminated to form a flat body having a flatness of 0.7 or more, and the metal.
  • the metallized film has electrode drawing portions connected to both axial end surfaces of the metallized film multilayer body, and the vapor deposition portion on the surface of the metallized film has a safety mechanism including a plurality of divided electrodes and a fuse portion.
  • the surface has a vapor deposition area including the divided electrode group partitioned by an insulating slit developed in a separated state and the fuse portion group formed between the adjacent insulating slits, and a non-vapor deposition area including the insulating slit group. Further, the capacitor element in which the ratio of the total area of the non-deposited area to the total area of the vapor-deposited area is set to 0.09 or less is disclosed.
  • Patent Document 4 a metal in which a first dielectric film, a first vapor-deposited electrode made of a vapor-deposited metal film, a second dielectric film, and a second vapor-deposited electrode made of a vapor-deposited metal film are sequentially stacked and wound.
  • the chemical film capacitor is characterized in that at least one of the first and second vapor deposition electrodes is a split electrode, and at least one of the first and second dielectric films is a polyphenylene sulfide film.
  • the metallized film capacitor to be used is disclosed.
  • a vapor deposition pattern in which metal vapor deposition electrodes divided by non-deposited metal portions are connected via a fuse portion may be used for the counter electrode constituting the film capacitor.
  • the fuse part evaporates and cuts off a minute area including the part where dielectric breakdown occurred from the circuit, so that dielectric breakdown can be recovered and high safety is maintained. be able to.
  • the thin-film deposition pattern is formed by applying masking oil from a plate roll to a portion to be a non-deposited metal portion by transfer or the like, and then performing vapor deposition.
  • masking oil from a plate roll to a portion to be a non-deposited metal portion by transfer or the like, and then performing vapor deposition.
  • the present invention has been made to solve the above problems, and is a film capable of suppressing the generation of wrinkles during winding, the deterioration of the flattening workability of the wound body, and the deterioration of the withstand voltage.
  • the purpose is to provide a capacitor.
  • the film capacitor of the present invention has a first main surface and a second main surface, and is provided on a first dielectric film made of resin and a first main surface of the first dielectric film.
  • a film capacitor having a third main surface and a fourth main surface, and a second dielectric film made of a resin, which is laminated through the above-mentioned first electrode layer is partitioned by a slit.
  • the first region formed has a first electrode pattern connected to each other via a fuse portion, and the second electrode layer has a second region having a larger area than the first region. , Characterized by.
  • the present invention it is possible to provide a film capacitor capable of preventing wrinkles during winding, deterioration of flattening workability of the wound body, and deterioration of withstand voltage resistance.
  • FIG. 1 is a cross-sectional view schematically showing an example of the film capacitor of the present invention.
  • FIG. 2 is a perspective view schematically showing an example of a method for obtaining a wound body constituting the film capacitor shown in FIG. 1.
  • FIG. 3 is a perspective view of the winding body constituting the film capacitor shown in FIG.
  • FIG. 4A is a top view schematically showing an example of the first main surface of the first dielectric film
  • FIG. 4B is a top view schematically showing an example of the second main surface of the first dielectric film. It is a figure.
  • FIG. 5 is a top view schematically showing a state in which the winding body constituting the film capacitor of the present invention is viewed from the outside.
  • FIG. 6A and 6B are perspective views schematically showing an example of how to use the film capacitor shown in FIG. 1.
  • FIG. 7 is a cross-sectional view schematically showing an example of the first embodiment of the film capacitor of the present invention.
  • FIG. 8 is a cross-sectional view schematically showing an example of the second embodiment of the film capacitor of the present invention.
  • FIG. 9 is a cross-sectional view schematically showing an example of the third embodiment of the film capacitor of the present invention.
  • FIG. 10 is a cross-sectional view schematically showing an example of a fourth embodiment of the film capacitor of the present invention.
  • the film capacitor of the present invention will be described.
  • the present invention is not limited to the following configurations, and can be appropriately modified and applied without changing the gist of the present invention.
  • a combination of two or more of the individual preferred configurations of the invention described below is also the invention.
  • the film capacitor of the present invention has a first main surface and a second main surface, and is provided on a first dielectric film made of resin and a first main surface of the first dielectric film.
  • a film capacitor having a third main surface and a fourth main surface, and a second dielectric film made of a resin, which is laminated through the above-mentioned first electrode layer is partitioned by a slit.
  • the first region formed has a first electrode pattern connected to each other via a fuse portion, and the second electrode layer has a second region having a larger area than the first region. , Characterized by.
  • the first electrode pattern has a first electrode pattern on one main surface of the first dielectric film, in which first regions partitioned by slits are connected to each other via a fuse portion.
  • a second electrode layer having a second region having an area larger than that of the first region is formed on the other main surface.
  • the second region may be a region partitioned by slits or may not be partitioned by slits.
  • the second electrode layer has a second region partitioned by slits, the area of the second region is larger than that of the first region. Therefore, if the slit widths are about the same, the second electrode layer can be used.
  • the area ratio of the slit to occupy is smaller than the area ratio of the slit to occupy the first electrode pattern. Further, when the second electrode layer has a second region not partitioned by the slits, the second electrode layer does not have a slit for partitioning the second region. Therefore, the amount of masking oil remaining on the main surface on which the second electrode layer is formed is smaller than the amount of masking oil remaining on the main surface on which the first electrode layer is formed. Therefore, the amount of residual masking oil on the main surface on which the second electrode layer is formed can be reduced, wrinkles are generated during winding due to the residual masking oil, the flattenability of the wound body is lowered, and the withstand voltage is reduced. Deterioration of sex can be suppressed.
  • the first dielectric film and the second dielectric film may be wound in a laminated state, and the first dielectric film and the second dielectric film may be wound together. It may be laminated repeatedly.
  • a wound film capacitor will be described as an example.
  • FIG. 1 is a cross-sectional view schematically showing an example of the film capacitor of the present invention
  • FIG. 2 is a perspective view schematically showing an example of a method of obtaining a winding body constituting the film capacitor shown in FIG. Yes
  • FIG. 3 is a perspective view of the winding body constituting the film capacitor shown in FIG.
  • the film capacitor 1 shown in FIG. 1 is wound in a state in which a first dielectric film 10, a second dielectric film 20, a first electrode layer 30, and a second electrode layer 40 are laminated.
  • the winding body 51 is provided. In the winding body 51, the second dielectric film 20 is wound outside the first dielectric film 10.
  • the width W 2 of the second dielectric film 20 is smaller than the width W 1 of the first dielectric film 10, and one end portion 10a and the other end portion 10b of the first dielectric film are formed.
  • a second dielectric film 20 is arranged between the two.
  • a first external electrode 61 and a second external electrode 62 are connected to both ends of the winding body 51.
  • the first electrode layer 30 is provided on the first main surface 11 of the first dielectric film 10.
  • the second electrode layer 40 is provided on the second main surface 12 of the first dielectric film 20.
  • the thickness of the first electrode layer 30 is larger than the thickness of the second electrode layer 40.
  • a first external electrode 61 is formed at one end of the winding body 51, and the first external electrode 61 is electrically connected to the first electrode layer 30.
  • the first external electrode 61 is an external electrode on the anode side.
  • a second external electrode 62 is formed at the other end of the winding body 51, and the second external electrode 62 is electrically connected to the second electrode layer 40.
  • the second external electrode 62 is an external electrode on the cathode side.
  • a first lead terminal 71 is connected to the first external electrode 61, and a second lead terminal 72 is connected to the second external electrode 62. Since the length of the first lead terminal 71 is longer than the length of the second lead terminal 72, the first lead terminal 71 and the second lead terminal 72 can be distinguished from each other when the film capacitor 1 is viewed from the outside. It is in a state of being.
  • the second dielectric film 20 is wound outward from the first dielectric film 10.
  • the winding body 51 shown in FIGS. 1 and 3 can be obtained.
  • the surface roughness of the first main surface is smaller than the surface roughness of the second main surface.
  • the surface of the dielectric film is uneven, the surface of the first electrode layer having the first electrode pattern in which the first regions partitioned by the slits are connected to each other via the fuse portion is oxidatively deteriorated. Defects that serve as starting points are likely to be formed. Therefore, by providing the first electrode layer on the first main surface having a smaller surface roughness, oxidative deterioration of the first electrode layer can be suppressed.
  • the surface roughness of the first main surface 11 is smaller than the surface roughness of the second main surface 12.
  • the surface 12) is represented by a wavy line
  • the main surface (first main surface 11) having a relatively small surface roughness is represented by a straight line.
  • the surface roughness of the fourth main surface is larger than the surface roughness of the third main surface, and the fourth main surface is laminated so as to face the first electrode layer. It is preferable that it is.
  • the fuse portion operates and evaporates between the first electrode layer and the fourth main surface. It becomes easier to secure a space for the fuse, and the fuse operability is improved.
  • the surface roughness of the fourth main surface 22 is larger than the surface roughness of the third main surface 21, and the fourth main surface 22 is laminated so as to face the first electrode layer 30. ing.
  • FIG. 1 the surface roughness of the fourth main surface 22 is larger than the surface roughness of the third main surface, and the fourth main surface 22 is laminated so as to face the first electrode layer 30. ing.
  • the main surface (fourth main surface) having a relatively large surface roughness is represented by a wavy line
  • the main surface (third main surface 21) having a relatively small surface roughness is represented by a straight line.
  • the surface roughness of the first main surface is preferably 1 ⁇ m or more and 10 ⁇ m or less, and more preferably 1 ⁇ m or more and less than 10 ⁇ m.
  • the surface roughness of the second main surface is preferably 10 ⁇ m or more and 100 ⁇ m or less.
  • the surface roughness of the third main surface is preferably 1 ⁇ m or more and 10 ⁇ m or less, and more preferably 1 ⁇ m or more and less than 10 ⁇ m.
  • the surface roughness of the fourth main surface is preferably 10 ⁇ m or more and 100 ⁇ m or less.
  • the surface roughness of the first main surface, the second main surface, the third main surface, and the fourth main surface means the arithmetic mean roughness Ra defined in JIS B 0601: 2013.
  • the surface roughness Ra can be measured using a non-contact laser surface roughness meter (for example, VK-X210 manufactured by KEYENCE CORPORATION).
  • the first electrode layer has a first electrode pattern in which first regions partitioned by slits are connected to each other via a fuse portion.
  • the first electrode layer preferably further has an effective electrode portion facing the second electrode layer and an electrode lead-out portion provided in a band shape along one side end of the first dielectric film.
  • the effective electrode portion and the electrode extraction portion are separated by an electrode separation slit arranged in parallel with the electrode extraction portion and connected by a fuse portion that partially crosses the electrode separation slit.
  • the first main surface is provided in a band shape along the side end opposite to the side end on which the electrode lead-out portion is provided, and a portion not provided with the first electrode layer (hereinafter, the first margin). Also called a department).
  • FIG. 4A is a top view schematically showing an example of the first main surface of the first dielectric film.
  • the first main surface 11 is provided with the first electrode layer 30.
  • the first electrode layer 30 has an effective electrode portion 32 facing the second electrode layer, and an electrode lead-out portion 31 provided in a band shape along one end portion 10a of the first dielectric film 10.
  • the effective electrode portion 32 and the electrode pull-out portion 31 are separated by an electrode separation slit 33 arranged in parallel with the electrode pull-out portion 31, and are connected by a fuse portion 34 that partially crosses the electrode separation slit 33.
  • the effective electrode portion 32 has a first electrode pattern in which a first region 35 partitioned by an electrode separation slit 33 and a partition slit 36 (collectively referred to as a slit) is connected to each other via a fuse portion 34. Further, on the first main surface 11, the other end portion 10b of the first dielectric film 10 has a first margin portion 11a to which the first electrode layer 30 is not provided.
  • the second electrode layer has a second region having a larger area than the first region.
  • the second electrode layer has an effective electrode portion facing the first electrode layer and the other side end of the first dielectric film (the side end provided with the electrode lead-out portion of the first electrode layer). It is preferable to further have an electrode lead-out portion provided in a band shape along the opposite side end).
  • FIG. 4B is a top view schematically showing an example of the second main surface of the first dielectric film.
  • a second electrode layer 40 is provided on the second main surface 12.
  • the second electrode layer 40 includes an electrode lead-out portion 41 provided in a band shape along the other end portion 10b of the first dielectric film, and an effective electrode portion 42 facing the first electrode layer 30. To do. No slit or the like is provided between the electrode pull-out portion 41 and the effective electrode portion 42. Since the second electrode layer 40 is not provided with a slit or the like, it can be said that the second electrode layer 40 has a second region having a larger area than the first region. Further, on the second main surface 12, one end portion 10a of the first dielectric film 10 has a second margin portion 12a in which the second electrode layer 40 is not provided.
  • FIG. 4B describes an example of a second electrode layer having a second region not partitioned by slits, but the second electrode layer has a second region partitioned by slits. May be good. However, the area of the second region is larger than the area of the first region.
  • the second regions partitioned by the slits may be interconnected via a fuse section.
  • the average area of the first area is used for comparison with the area of the second area.
  • a region larger than the average area of the first region existing in the second electrode layer is the second region.
  • the second electrode layer may have an area smaller than the area of the first region as a region other than the second region.
  • the ratio of the area of the second region to the area of the first region is preferably 150% or more, and more preferably 200% or more.
  • the ratio of the area that does not contribute to the capacitor capacity is preferably 5% or more and 10% or less. Further, in the effective electrode portion of the second electrode layer, the ratio of the area that does not contribute to the capacitor capacity is preferably 0% or more and less than 5%. When the ratio of the area that does not contribute to the capacitor capacity is 0%, it is a so-called solid pattern.
  • the wound body is pressed into a flat shape such as an ellipse or an oval to have a more compact shape.
  • the flatness of the wound body in the cross-sectional shape is preferably less than 0.7. If the flatness of the wound body in the cross-sectional shape is 0.7 or more, the vibration and growl of the film capacitor may become loud.
  • the winding body may include a cylindrical winding shaft.
  • the winding shaft is arranged on the central axis of the first dielectric film and the second dielectric film in the wound state, and winds the first dielectric film and the second dielectric film. It serves as a winding axis when doing so.
  • the film capacitor of the present invention further includes a first external electrode electrically connected to the first electrode layer and a second external electrode electrically connected to the second electrode layer. Is preferable.
  • the film capacitor 1 shown in FIG. 1 includes a first external electrode 61 electrically connected to the first electrode layer 30 and a second external electrode 62 electrically connected to the second electrode layer 40. ing.
  • terminal conductors and lead terminals may be connected to the first external electrode and the second external electrode, respectively.
  • the film capacitor 1 shown in FIG. 1 includes a first lead terminal 71 connected to the first external electrode 61 and a second lead terminal 72 connected to the second external electrode 62.
  • the film capacitor of the present invention also includes a second terminal conductor.
  • the first dielectric film and the second dielectric film are wound in a laminated state, and in the first dielectric film and the second dielectric film, any of them Also, it is preferable that the surface roughness of the main surface located on the winding core side is larger than the surface roughness of the main surface located on the opposite side of the winding core. If the surface roughness of the main surface located on the winding core side is larger than the surface roughness of the main surface located on the opposite side of the winding core, the first dielectric film and the second dielectric film are laminated and wound. When turning, an air layer is less likely to be formed between the take-up roll used for winding and the main surface of the laminate on the winding core side, and the film is less likely to meander. Therefore, the adhesion between the first dielectric film and the second dielectric film at the time of winding becomes high, and the film capacitor has high heat shock resistance and current resistance.
  • the second dielectric film is wound outside the first dielectric film, and the width of the second dielectric film in the cross section along the direction of the winding core. Is smaller than the width of the first dielectric film, and the second dielectric film is preferably arranged between one end and the other end of the first dielectric film.
  • the second dielectric film is wound outside the first dielectric film, the width of the second dielectric film is smaller than the width of the first dielectric film, and the width of the first dielectric film is smaller than that of the first dielectric film.
  • both one end and the other end of the first dielectric film are Since it projects outward from the second dielectric film (both ends of the winding shaft), the electrode layers (first electrode layer and second electrode layer) formed on the surface of the first dielectric film.
  • the area where the electrode layer) comes into contact with the external electrode is increased, and the contactability between the electrode layer and the external electrode is improved.
  • the second dielectric film when the second dielectric film is wound outside the first dielectric film, the first dielectric film and the second dielectric film are laminated. In this state, it is preferable that one end of the second dielectric film is arranged at a position where it overlaps with the electrode lead-out portion of the first electrode layer. Since the second dielectric film has light transmission in the visible region to the infrared region, it is difficult to recognize its outline by image recognition or the like. However, an electrode lead-out portion (a part of the first electrode layer) is arranged on the back side (inside) of one end (a part of the contour) of the second dielectric film wound outward.
  • the contour of the second dielectric film can be easily recognized by image recognition or the like, with the electrode extraction portion having low light transmission in the visible region to the infrared region as the background. Therefore, it becomes easy to control the shift width of the film by image recognition or the like, and it is possible to suppress a decrease in heat shock resistance and current resistance due to the shift of the film during winding.
  • FIG. 5 is a top view schematically showing a state in which the winding body constituting the film capacitor of the present invention is viewed from the outside.
  • the second dielectric film 20 is arranged on the front side of the paper surface
  • the first dielectric film 10 is arranged on the back side of the paper surface
  • one end 20a of the second dielectric film 20 is the first. It overlaps with the electrode lead-out portion 31 which is a part of the first electrode layer on the first main surface 11 of the dielectric film 10 of the above.
  • the film capacitor of the present invention preferably has a specified polarity. Specifically, it is preferable that the first external electrode is the external electrode on the anode side and the second external electrode is the external electrode on the cathode side.
  • the method for distinguishing the polarity is not particularly limited, but the length of the lead terminal connected to the anode side and the length of the lead terminal connected to the cathode side are changed (for example, the length of the lead terminal connected to the anode side is changed. (Longer than the length of the lead terminal connected to the cathode side), or a method of designing the surface of the film capacitor so that the polarities can be distinguished can be mentioned. In the film capacitor 1 shown in FIG.
  • the length of the first lead terminal 71 connected to the first external electrode 61 which is the external electrode on the anode side is the length of the second external electrode 62 which is the external electrode on the cathode side. It is longer than the length of the second lead terminal 72 connected to.
  • the first external electrode is the external electrode on the anode side
  • the second electrode layer is the external electrode on the cathode side
  • the thickness of the first electrode layer is the second electrode layer. It is preferably larger than the thickness of.
  • the thickness of the second electrode layer is smaller than the thickness of the first electrode layer, the film resistance of the second electrode layer is increased, and the self-healing property can be enhanced.
  • the thickness of the first electrode layer 30 is larger than the thickness of the second electrode layer 40. Therefore, when the first external electrode 61 is used as the external electrode on the anode side and the second external electrode 62 is used as the external electrode on the cathode side, the decrease in capacitance due to the short circuit failure is suppressed and the self-healing property is improved. ..
  • the first lead terminal 71 connected to the first external electrode 61 and the second lead terminal 72 connected to the second external terminal 62 have different lengths, from the outside of the film capacitor 1 Anode and cathode can be distinguished.
  • the film capacitor of the present invention may be surrounded by an exterior resin, or may be housed in an exterior case, and the exterior case may be filled with a filling resin.
  • a thermosetting resin such as an epoxy resin, a silicone resin, or a urethane resin is used.
  • an amine curing agent or an imidazole curing agent may be used.
  • the exterior resin or the filling resin only the resin may be used, but a reinforcing agent may be added for the purpose of improving the strength.
  • the reinforcing agent silica, alumina or the like can be used.
  • a resin such as polyphenylene sulfide (PPS) or liquid crystal polymer (LCP) is used.
  • FIGS. 6A and 6B are perspective views schematically showing an example of how to use the film capacitor shown in FIG. 1.
  • the film capacitor 1 is housed in the outer case 80.
  • the filling resin 90 is filled inside the outer case 80 to cover the periphery of the film capacitor 1 with the filling resin 90 and seal the opening of the outer case 80. With such a usage method, the moisture resistance of the film capacitor is improved.
  • the first dielectric film and the second dielectric film preferably contain a curable resin as a main component.
  • the "main component” means a component having the largest abundance ratio (% by weight), and preferably means a component having an abundance ratio of more than 50% by weight. Therefore, the dielectric resin film may contain, for example, an additive such as a silicone resin and an uncured portion of a starting material such as a first organic material and a second organic material, which will be described later, as a component other than the main component.
  • the curable resin may be a thermosetting resin or a photocurable resin.
  • the thermosetting resin means a resin that can be cured by heat, and does not limit the curing method. Therefore, as long as the resin can be cured by heat, the thermosetting resin also includes a resin cured by a method other than heat (for example, light, electron beam, etc.). Further, depending on the material, the reaction may be started depending on the reactivity of the material itself, and a thermosetting resin is also used if the curing proceeds without necessarily applying heat or light from the outside. The same applies to the photocurable resin, and the curing method is not limited.
  • the curable resin may or may not have at least one of a urethane bond and a urea bond.
  • the presence of urethane bond and / or yuria bond can be confirmed by using a Fourier transform infrared spectrophotometer (FT-IR).
  • FT-IR Fourier transform infrared spectrophotometer
  • the dielectric resin film is preferably composed of a cured product of the first organic material and the second organic material.
  • a cured product obtained by reacting a hydroxyl group (OH group) of the first organic material with an isocyanate group (NCO group) of the second organic material can be mentioned.
  • the uncured portion of the starting material may remain in the film.
  • the dielectric resin film may contain at least one of an isocyanate group (NCO group) and a hydroxyl group (OH group).
  • the dielectric resin film may contain either an isocyanate group or a hydroxyl group, or may contain both an isocyanate group and a hydroxyl group.
  • FT-IR Fourier transform infrared spectrophotometer
  • the first organic material is preferably a polyol having a plurality of hydroxyl groups (OH groups) in the molecule.
  • the polyol include polyvinyl acetal such as polyvinyl acetal acetal, polyether polyol such as phenoxy resin, polyester polyol and the like.
  • the first organic material two or more kinds of organic materials may be used in combination.
  • the second organic material is preferably an isocyanate compound, an epoxy resin or a melamine resin having a plurality of functional groups in the molecule.
  • the second organic material two or more kinds of organic materials may be used in combination.
  • isocyanate compound examples include aromatic polyisocyanates such as diphenylmethane diisocyanate (MDI) and tolylene diisocyanate (TDI), and aliphatic polyisocyanates such as hexamethylene diisocyanate (HDI).
  • aromatic polyisocyanates such as diphenylmethane diisocyanate (MDI) and tolylene diisocyanate (TDI)
  • aliphatic polyisocyanates such as hexamethylene diisocyanate (HDI).
  • a modified product of these polyisocyanates for example, a modified product having carbodiimide, urethane, or the like may be used.
  • the epoxy resin is not particularly limited as long as it has an epoxy ring, and examples thereof include a bisphenol A type epoxy resin, a biphenyl skeleton epoxy resin, a cyclopentadiene skeleton epoxy resin, and a naphthalene skeleton epoxy resin.
  • the melamine resin is not particularly limited as long as it is an organic nitrogen compound having a triazine ring at the center of the structure and three amino groups around it, and examples thereof include alkylated melamine resins. In addition, it may be a denatured form of melamine.
  • the first dielectric film and the second dielectric film are preferably formed into a film of a resin solution containing the first organic material and the second organic material, and then heat-treated. Obtained by curing.
  • the first dielectric film and the second dielectric film can also contain additives for adding other functions.
  • smoothness can be imparted by adding a leveling agent.
  • the additive is a material that has a functional group that reacts with a hydroxyl group and / or an isocyanate group and forms a part of the crosslinked structure of the cured product. Examples of such a material include a resin having at least one functional group selected from the group consisting of an epoxy group, a silanol group and a carboxyl group.
  • the first dielectric film and the second dielectric film may contain a vapor-deposited polymer film as a main component.
  • the thin-film polymerization film refers to a film formed by a thin-film polymerization method, and is basically included in a curable resin.
  • the resin constituting the first dielectric film and the resin constituting the second dielectric film are both thermosetting resins.
  • the thicknesses of the first dielectric film and the second dielectric film are not particularly limited, but are preferably 0.5 ⁇ m or more and 5 ⁇ m or less, respectively. Further, it is preferable that the thickness of the first dielectric film and the thickness of the second dielectric film are the same. The thickness of the first dielectric film and the second dielectric film can be measured by using an optical film thickness meter.
  • the first dielectric film and the second dielectric film are made of the same material.
  • the fact that the first dielectric film and the second dielectric film are made of the same material means that the types of resins constituting the first dielectric film and the second dielectric film are the same.
  • the types and contents of other components are the same.
  • the type of metal contained in the first electrode layer and the second electrode layer (hereinafter collectively referred to as the electrode layer) is not particularly limited, but the electrode layers are aluminum (Al) and titanium. It is preferable to contain any one selected from the group consisting of (Ti), zinc (Zn), magnesium (Mg), tin (Sn) and nickel (Ni).
  • the thickness of the electrode layer is not particularly limited, but the thickness of the electrode layer is preferably 5 nm or more and 40 nm or less from the viewpoint of suppressing damage to the electrode layer.
  • the thickness of the electrode layer shall be specified by observing a cross section of the first dielectric film cut in the thickness direction using an electron microscope such as a field emission scanning electron microscope (FE-SEM). Can be done.
  • first embodiment, a second embodiment, a third embodiment, and a fourth embodiment which are preferable embodiments of the film capacitor of the present invention.
  • the first embodiment, the second embodiment, the third embodiment, and the fourth embodiment are all one of the preferred embodiments of the film capacitor of the present invention, and the film of the present invention described above for each embodiment.
  • An appropriate combination of preferred embodiments of the capacitor is also one of the preferred embodiments of the film capacitor of the present invention.
  • the surface roughness of the first main surface of the first dielectric film is smaller than the surface roughness of the second main surface.
  • a first electrode pattern in which first regions defined by slits are connected to each other via a fuse portion is formed on a first main surface having a smaller surface roughness. Since it is provided, it is possible to suppress oxidative deterioration of the first electrode layer.
  • FIG. 7 is a cross-sectional view schematically showing an example of the first embodiment of the film capacitor of the present invention.
  • the film capacitor 2 shown in FIG. 7 is wound in a state where the first dielectric film 10, the second dielectric film 20, the first electrode layer 30, and the second electrode layer 40 are laminated. It has a wound winding body 52.
  • the first electrode layer 30 is provided on the first main surface 11 of the first dielectric film 10.
  • the second electrode layer 40 is provided on the second main surface 12 of the first dielectric film 10.
  • the surface roughness of the first main surface 11 is smaller than the surface roughness of the second main surface 12.
  • the main surface (second main surface) having a relatively large surface roughness is used.
  • the surface 12) is represented by a wavy line
  • the main surface (first main surface 11) having a relatively small surface roughness is represented by a straight line.
  • the surface roughness of the fourth main surface is larger than the surface roughness of the third main surface, and the fourth main surface is the first electrode layer. It is preferable that they are laminated so as to face each other.
  • the fuse portion operates and evaporates between the first electrode layer and the fourth main surface. It becomes easier to secure a space for the fuse, and the fuse operability is improved.
  • the surface roughness of the fourth main surface 22 is larger than the surface roughness of the third main surface 21, and the fourth main surface 22 is laminated so as to face the first electrode layer 30. ing.
  • the main surface (fourth main surface) having a relatively large surface roughness is represented by a wavy line
  • the main surface (third main surface 21) having a relatively small surface roughness is represented by a straight line.
  • the second dielectric film is wound outside the first dielectric film, and the second dielectric is formed in a cross section along the direction of the winding core.
  • the width of the body film is smaller than the width of the first dielectric film, and the second dielectric film is arranged between one end and the other end of the first dielectric film. Is preferable.
  • the second dielectric film when the second dielectric film is wound outside the first dielectric film, the first dielectric film and the second dielectric film are wound. It is preferable that one end of the second dielectric film is arranged at a position where it overlaps with the electrode lead-out portion of the first electrode layer in a state where the film is laminated.
  • the first dielectric film and the second dielectric film are wound in a laminated state, and the first dielectric film and the second dielectric film are wound.
  • the surface roughness of the main surface located on the winding core side is larger than the surface roughness of the main surface located on the opposite side of the winding core.
  • the first external electrode is the external electrode on the anode side
  • the second external electrode is the external electrode on the cathode side
  • the thickness of the first electrode layer is , It is preferable that the thickness is larger than the thickness of the second electrode layer.
  • the first dielectric film and the second dielectric film are wound in a laminated state, and the first dielectric film and the first dielectric film are wound.
  • the surface roughness of the main surface located on the winding core side is larger than the surface roughness of the main surface located on the opposite side of the winding core.
  • the first dielectric film and the second dielectric film are wound in a laminated state, and the first dielectric film and the second dielectric film are wound.
  • the surface roughness of the main surface located on the winding core side is larger than the surface roughness of the main surface located on the opposite side of the winding core, so that the first dielectric film and the second
  • an air layer is less likely to be formed between the take-up roll used for winding and the main surface of the laminate on the winding core side, and the film is less likely to meander. ..
  • the adhesion between the first dielectric film and the second dielectric film at the time of winding becomes high, and the film capacitor has high heat shock resistance and current resistance.
  • FIG. 8 is a cross-sectional view schematically showing an example of the second embodiment of the film capacitor of the present invention.
  • the film capacitor 3 includes a winding body 53 in which the first dielectric film 10 and the second dielectric film 20 are wound in a laminated state.
  • the main surfaces located on the winding core side are located.
  • the surface roughness of the fourth main surface 22) is the main surface (the first main surface 11 of the first dielectric film 10 and the third main surface 21 of the second dielectric film) located on the opposite side of the winding core. ) Is larger than the surface roughness.
  • the main surface (second main surface) having a relatively large surface roughness is used.
  • the surface 12) is represented by a wavy line, and the main surface (first main surface 11) having a relatively small surface roughness is represented by a straight line.
  • the main surface having a relatively large surface roughness (fourth main surface 22) is used.
  • the wavy line represents the main surface (third main surface 21) having a relatively small surface roughness as a straight line.
  • the surface roughness of the first main surface is smaller than the surface roughness of the second main surface, and in the second dielectric film, the first It is preferable that the surface roughness of the four main surfaces is larger than the surface roughness of the third main surface, and the fourth main surface is laminated so as to face the first electrode layer.
  • the second dielectric film is wound outside the first dielectric film, and the second dielectric is formed in a cross section along the direction of the winding core.
  • the width of the body film is smaller than the width of the first dielectric film, and the second dielectric film is arranged between one end and the other end of the first dielectric film. Is preferable.
  • the first dielectric film and the second dielectric film are wound. It is preferable that one end of the second dielectric film is arranged at a position where it overlaps with the electrode lead-out portion of the first electrode layer in a state where the film is laminated.
  • the first external electrode is the external electrode on the anode side
  • the second external electrode is the external electrode on the cathode side
  • the thickness of the first electrode layer is high. It is preferable that the thickness is larger than the thickness of the second electrode layer.
  • the first dielectric film and the second dielectric film may be wound in a laminated state, and the first dielectric film and the second dielectric film may be wound.
  • the dielectric film may be repeatedly laminated.
  • a wound film capacitor will be described as an example.
  • the third embodiment of the film capacitor of the present invention is provided by electrically connecting the first external electrode provided by being electrically connected to the first electrode layer and the second electrode layer.
  • the first external electrode is an external electrode on the anode side
  • the second external electrode is an external electrode on the cathode side
  • the first electrode layer is further provided with a second external electrode. Is larger than the thickness of the second electrode layer.
  • the thickness of the first electrode layer electrically connected to the external electrode on the anode side is the thickness of the second electrode layer connected to the external electrode on the cathode side. Since it is larger than that, the anodic oxidation of the first electrode layer does not easily proceed. Therefore, a short-circuit failure is unlikely to occur, and a decrease in capacitance due to the short-circuit failure can be suppressed. Further, since the thickness of the second electrode layer is smaller than the thickness of the first electrode layer, the film resistance of the second electrode layer is increased, and the self-healing property can be enhanced.
  • the polarity of the film capacitor is specified.
  • the first external electrode is an anode-side external electrode
  • the second external electrode is a cathode-side external electrode.
  • the polarity connect the first lead terminal and the second lead terminal to the first external electrode and the second external electrode, respectively, and set the polarity of the lead terminal from the outside of the film capacitor. It is preferable to devise a way to distinguish them. Examples of the above-mentioned device include a method of making the lead terminal on the anode side longer than the lead terminal on the cathode side, a method of applying a design showing polarity to the surface of the outer case, and the like.
  • FIG. 9 is a cross-sectional view schematically showing an example of the third embodiment of the film capacitor of the present invention.
  • the film capacitor 4 shown in FIG. 9 is wound in a state where the first dielectric film 10, the second dielectric film 20, the first electrode layer 30, and the second electrode layer 40 are laminated. It is provided with a wound winding body 54.
  • the first electrode layer 30 is provided by being electrically connected to the first external electrode 61 which is an external electrode on the anode side
  • the second electrode layer 40 is a second external electrode which is an external electrode on the cathode side. It is electrically connected to the electrode 61.
  • a relatively long lead terminal 71 is connected to the first external electrode 61, which is an external electrode on the anode side, and a relatively short lead terminal 72 is connected to the second external electrode 62, which is an external electrode on the cathode side. Is connected, and the first lead terminal 71 having a long lead terminal is distinguished from the anode side, and the second lead terminal 72 having a short lead terminal is distinguished from the cathode side.
  • the thickness of the first electrode layer 30 is larger than the thickness of the second electrode layer 40.
  • the surface roughness of the first main surface of the first dielectric film is smaller than the surface roughness of the second main surface.
  • the surface roughness of the fourth main surface is larger than the surface roughness of the third main surface, and the fourth main surface is the first electrode layer. It is preferable that they are laminated so as to face each other.
  • the second dielectric film is wound outside the first dielectric film, and the second dielectric is formed in a cross section along the direction of the winding core.
  • the width of the body film is smaller than the width of the first dielectric film, and the second dielectric film is arranged between one end and the other end of the first dielectric film. Is preferable.
  • the second dielectric film when the second dielectric film is wound outside the first dielectric film, the first dielectric film and the second dielectric film are wound. It is preferable that one end of the second dielectric film is arranged at a position where it overlaps with the electrode lead-out portion of the first electrode layer in a state where the film is laminated.
  • the first dielectric film and the second dielectric film are wound in a laminated state, and the first dielectric film and the second dielectric film are wound.
  • the surface roughness of the main surface located on the winding core side is larger than the surface roughness of the main surface located on the opposite side of the winding core.
  • the first dielectric film and the second dielectric film are wound in a laminated state, and the second dielectric film is the above-mentioned second dielectric film. It is wound outward from the first dielectric film, and the width of the second dielectric film is smaller than the width of the first dielectric film in a cross section along the direction of the core. , The second dielectric film is arranged between one end and the other end of the first dielectric film.
  • the second dielectric film is wound outside the first dielectric film, and the second dielectric is formed in a cross section along the direction of the winding core.
  • the width of the body film is smaller than the width of the first dielectric film, and the second dielectric film is arranged between one end and the other end of the first dielectric film. There is. Therefore, both ends of the first dielectric film provided with the first electrode layer and the second electrode layer project outward from the second dielectric film to improve the contact property between the electrode layer and the external electrode. Can be improved.
  • FIG. 10 is a cross-sectional view schematically showing an example of a fourth embodiment of the film capacitor of the present invention.
  • the film capacitor 5 shown in FIG. 10 is wound in a state where the first dielectric film 10, the second dielectric film 20, the first electrode layer 30, and the second electrode layer 40 are laminated. It is provided with a wound winding body 55.
  • the second dielectric film 20 is wound outside the first dielectric film 10.
  • the width W 2 of the second dielectric film 20 is smaller than the width W 1 of the first dielectric film 10, and one end portion 10a and the other end portion 10b of the first dielectric film are formed.
  • a second dielectric film 20 is arranged between the two.
  • a first external electrode 61 and a second external electrode 62 are connected to both ends of the winding body 55.
  • one end of the second dielectric film is the first electrode. It is preferable that the film is arranged at a position overlapping the electrode lead-out portion of the layer.
  • the surface roughness of the first main surface of the first dielectric film is smaller than the surface roughness of the second main surface.
  • the surface roughness of the fourth main surface is larger than the surface roughness of the third main surface, and the fourth main surface is the first electrode layer. It is preferable that they are laminated so as to face each other.
  • the first dielectric film and the second dielectric film are wound in a laminated state, and the first dielectric film and the second dielectric film are wound.
  • the surface roughness of the main surface located on the winding core side is larger than the surface roughness of the main surface located on the opposite side of the winding core.
  • the first external electrode is the external electrode on the anode side
  • the second external electrode is the external electrode on the cathode side
  • the thickness of the first electrode layer is high. It is preferable that the thickness is larger than the thickness of the second electrode layer.
  • the film capacitor of the present invention has, for example, a first dielectric film having a first electrode layer formed on a first main surface and a second electrode layer formed on a second main surface, and a third main surface and a first surface. 4 After laminating a second dielectric film on which no electrode layer is formed on the main surface, a winding body is obtained, and the first external electrode and the second outer electrode and the second winding body are attached to both ends of the winding body, respectively. Obtained by forming an external electrode, connecting the first lead terminal and the second lead terminal to the first external electrode and the second external electrode, respectively, accommodating them in an outer case, and sealing them with a filling resin. be able to.
  • the surface roughness may be adjusted by roughening each main surface of the first dielectric film and the second dielectric film.
  • the winding body may be sandwiched from a direction perpendicular to the width direction and pressed into an elliptical cylinder shape. Subsequently, by forming an external electrode on the end face of the wound body and connecting the lead terminal, a film capacitor as shown in FIG. 1 can be obtained. As a method of forming an external electrode on the end face of the wound body, thermal spraying can be mentioned.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

La présente invention concerne un condensateur à film (1) qui comprend : un premier film diélectrique (10) constitué d'une résine et ayant une première surface principale (11) et une deuxième surface principale (12) ; une première couche d'électrode (30) disposée sur la première surface principale (11) du premier film diélectrique (10) ; une seconde couche d'électrode (40) disposée sur la deuxième surface principale (12) du premier film diélectrique (10) ; et un second film diélectrique (20) constitué d'une résine et stratifié sur le premier film diélectrique (10) avec la première couche d'électrode (30) ou la seconde couche d'électrode (40) intercalée entre ces derniers, le second film diélectrique ayant une troisième surface principale (21) et une quatrième surface principale (22). Le condensateur à film (1) est caractérisé en ce que la première couche d'électrode (30) présente un premier motif d'électrode dans lequel des premières régions (35) délimitées par des fentes (33, 36) sont connectées l'une à l'autre par l'intermédiaire d'une partie fusible (34), et en ce que la seconde couche d'électrode (40) présente une seconde région (42) ayant une surface supérieure à la première région (35).
PCT/JP2020/018695 2019-08-08 2020-05-08 Condensateur à film WO2021024564A1 (fr)

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JP2021537583A JP7301974B2 (ja) 2019-08-08 2020-05-08 フィルムコンデンサ
CN202090000734.9U CN217157969U (zh) 2019-08-08 2020-05-08 薄膜电容器

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Application Number Priority Date Filing Date Title
JP2019146344 2019-08-08
JP2019-146344 2019-08-08

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WO2021024564A1 true WO2021024564A1 (fr) 2021-02-11

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004095604A (ja) * 2002-08-29 2004-03-25 Matsushita Electric Ind Co Ltd 金属化フィルムコンデンサ
JP2010165775A (ja) * 2009-01-14 2010-07-29 Daikin Ind Ltd フィルムコンデンサ
JP2017191823A (ja) * 2016-04-12 2017-10-19 ニチコン株式会社 金属化フィルムコンデンサ
WO2019142561A1 (fr) * 2018-01-18 2019-07-25 パナソニックＩｐマネジメント株式会社 Condensateur à film

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004095604A (ja) * 2002-08-29 2004-03-25 Matsushita Electric Ind Co Ltd 金属化フィルムコンデンサ
JP2010165775A (ja) * 2009-01-14 2010-07-29 Daikin Ind Ltd フィルムコンデンサ
JP2017191823A (ja) * 2016-04-12 2017-10-19 ニチコン株式会社 金属化フィルムコンデンサ
WO2019142561A1 (fr) * 2018-01-18 2019-07-25 パナソニックＩｐマネジメント株式会社 Condensateur à film

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JP7301974B2 (ja) 2023-07-03
JPWO2021024564A1 (fr) 2021-02-11

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