WO2021018071A1 - Liaison souple conductrice et son procédé de fabrication - Google Patents

Liaison souple conductrice et son procédé de fabrication Download PDF

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Publication number
WO2021018071A1
WO2021018071A1 PCT/CN2020/104703 CN2020104703W WO2021018071A1 WO 2021018071 A1 WO2021018071 A1 WO 2021018071A1 CN 2020104703 W CN2020104703 W CN 2020104703W WO 2021018071 A1 WO2021018071 A1 WO 2021018071A1
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WO
WIPO (PCT)
Prior art keywords
straps
flexible link
conductive flexible
substrates
manufacturing
Prior art date
Application number
PCT/CN2020/104703
Other languages
English (en)
Inventor
Kui YANG
Original Assignee
Shanghai Yizhao Pharmaceutical Science & Technology Co. Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Yizhao Pharmaceutical Science & Technology Co. Ltd. filed Critical Shanghai Yizhao Pharmaceutical Science & Technology Co. Ltd.
Publication of WO2021018071A1 publication Critical patent/WO2021018071A1/fr

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals

Definitions

  • the invention flexible conductive link, mainly employed as heat or electricity transfer route which is intended to achieve a thermal or electricity coupling and structural decoupling between energy origin and destination.
  • a new conductive flexible link comprising metallic substrates 1, normally made of coppor, aluminum or other metal alloy; advanced material straps 2, normally made of pyrolytic graphite or other advanced materials, including but not limited to special alloy, ceramic, nano composites.
  • Graphite flexible straps 2 with inherent high thermal and electricity conductivity are penetrated at its inserting ends with various shapes of one or multiple holes 3, including but not limited to, rectangular, trapezoid, star, ellipse... etc. Both ends of penetrated flexible straps 2 are inserted intermittently into metallic substrates 1 which in turn clamped the straps 2 vertically. Finally the accumulative such sandwich structures are welded to form an integral structure on both ends of flexible conductive link.
  • the metallic endings serve as fixture to other component and straps 2 serve as efficient route transferring heat or electricity.
  • Current connection applied in flexible link between advanced materials and metallic endings are complicated and expensive. Introduction of adhesive generated high resistance in low temperature and possibly caused outgassing concern. Other mechanic solutions potentially generate void volume which further lower transferring efficiency. In both case the manufacturing cost is inevitably high.
  • a stack of substrates 1 constitute metallic panel and clamp the straps 2 by welding process.
  • the holes which have close perimeter independent of outer perimeter of the strap 2 are referred as close hole.
  • One or multiple closed holes as buffer compensating dimension expansion and shrinkage during temperature fluctuations are pre punched at ends of flexible straps 2, illustrated by Fig. 3 and Fig. 5.
  • holes with notches 6 by which perimeter of the hole constitute a section of outer perimeter of the strap 2 itself referred as open holes.
  • These notches 6 partially connected to the outer perimeter of straps 2 and apparently formed zigzag edge serving as gas or liquid passage during further processing period, illustrated by Fig. 4 and Fig. 6.
  • the holes 3 result in straps 2 embedding into the panel as original empty holes 3 are refilled and occupied by upper and lower substrates material merged during welding process, which therefore reinforced the whole structure.
  • straps end are at minimal 3 mm less than substrate edge in other dimensions excepting in its inserting direction. If heat electron beam solution is selected, straps end can be larger, more close to the edge of substrates. Take rectangle substrates 1 and straps 2 as example, periphery areas in top substrates 1 left by undersized straps ends are merged vertically with corresponding periphery area in below substrates 1; Similarly blank area in top substrates 1 intentionally uncovered by holes 3 are merged vertically with corresponding blank area in below substrates 1. Hence the whole stack of substrates 1 and straps 2 are build into one integral panel during welding. The part in the panel 4 formed by periphery and blank area is amenable to mechanic processing such as trilling and digging.
  • the number, location and intervals of substrates 1 and straps 2 intertwined can be arranged case by case and varied in one unit with regard to energy transfer requirement.
  • additional binding materials 7 as welding assistance including alloy foil, welding paste and powder, pre coated alloy layer are positioned between substrate 1 and strap 2.
  • Thickness of the substrates 1 foils varied with respect to distribution of straps 2 in one unit.
  • the accumulative thickness of the substrates 1 spacing the straps 2 is no less than two times of the thickness of the straps 2 accommodated.
  • single strap thickness is 0.05 mm
  • substrate thickness is 0.05 mm as well.
  • One insertion take two straps and every insertion (two straps) should be separated by 4 substrate foils at minimum.
  • Substrates 1 and pressing mold are rounded at edge 8 corresponding to strap insertion section to avoid flexible strap damage caused by substrate edge 8.
  • One or multiple straps 2 intermittently insert into substrates 1 with proper intervals to achieve accumulative sandwich structure. Limited pressure imposed normally less than 1 MPa to clamp the stack during deoxygenization by vacuum or inert gas to facilitate residue air escaping and inert gas entry into holes 3.
  • the low clamping pressure normally less than 1 MPa maintained, marginally secure the strap and substrate in proper position, during the whole pre heating period when temperature gradually elevated.
  • Moderate clamping pressure normally less than 2 MPa imposed on stack in presence of binding material 7 after reaching welding temperature.
  • Electron Beam Welding with moderate clamping pressure, normally less than 2 MPa rather than high pressure pressing is undertaken along with circumference of substrates 1 excepting straps 2 insertion section.
  • This invention provide a simple but effective solution on connection between metallic endings and flexible straps without any organic materials involvement.
  • Fig. 1 is schematic overall diagram illustrating welded apparatus.
  • Fig. 2 is side view illustrating single sandwich structure with binding material.
  • Fig. 3 is perspective view of single sandwich structure, closed hole.
  • Fig. 4 is perspective view of single sandwich structure open hole.
  • Fig. 5 is perspective view of single sandwich structure with binding material, closed hole.
  • Fig. 6 is perspective view of single sandwich structure with binding material, open hole.
  • Substrates 1 merged with assistance of binding material which is melted and penetrated into crevice including the holes 3 under welding condition such as temperature and pressure.
  • the pressure required in this embodiment is lower than that in first embodiment.
  • same principle of low pressure in deoxygenization and pre heating phase still applied.
  • the invention applies in any working condition which require energy coupling and structure decoupling, for instance the connection between cryocooler and precision instrument, electricity supply in various vibration condition...

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

L'invention concerne une liaison souple conductrice et son procédé de fabrication. La liaison souple conductrice comprend des substrats (1). Les substrats (1) sont construits en un panneau (4) et des sangles (2) qui sont intégrées dans le panneau (4). Le procédé de fabrication comprend les étapes de prétraitement sur des extrémités de bandes,l'insertion intermittente de bandes (2) dans des substrats (1), la désoxygénation par le vide ou un gaz inerte sous faible pression de serrage, le préchauffage sous basse pression de serrage sur l'empilement, le soudage sous une température et une pression cibles, et le refroidissement dans un environnement non oxygéné.
PCT/CN2020/104703 2019-07-27 2020-07-26 Liaison souple conductrice et son procédé de fabrication WO2021018071A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201921194026.9U CN211234067U (zh) 2019-07-27 2019-07-27 柔性传热导电装置
CN201921194026.9 2019-07-27

Publications (1)

Publication Number Publication Date
WO2021018071A1 true WO2021018071A1 (fr) 2021-02-04

Family

ID=71924098

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/104703 WO2021018071A1 (fr) 2019-07-27 2020-07-26 Liaison souple conductrice et son procédé de fabrication

Country Status (2)

Country Link
CN (1) CN211234067U (fr)
WO (1) WO2021018071A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5343940A (en) * 1992-10-29 1994-09-06 Amigo Jean Flexible heat transfer device
US5485671A (en) * 1993-09-10 1996-01-23 Aavid Laboratories, Inc. Method of making a two-phase thermal bag component cooler
EP1020912A1 (fr) * 1991-05-31 2000-07-19 Minnesota Mining And Manufacturing Company Dispositifs semi-rigides de transmission de chaleur
LU100895B1 (fr) * 2016-12-08 2018-12-18 Patrick Joseph Glynn Appareils et procédés d'accumulation et de récupération d'énergie
CN109475425A (zh) * 2016-03-28 2019-03-15 加利福尼亚大学董事会 热交换模块，系统和方法
CN208936834U (zh) * 2018-09-06 2019-06-04 广州大学 一种柔性平板热管结构

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1020912A1 (fr) * 1991-05-31 2000-07-19 Minnesota Mining And Manufacturing Company Dispositifs semi-rigides de transmission de chaleur
US5343940A (en) * 1992-10-29 1994-09-06 Amigo Jean Flexible heat transfer device
US5485671A (en) * 1993-09-10 1996-01-23 Aavid Laboratories, Inc. Method of making a two-phase thermal bag component cooler
CN109475425A (zh) * 2016-03-28 2019-03-15 加利福尼亚大学董事会 热交换模块，系统和方法
LU100895B1 (fr) * 2016-12-08 2018-12-18 Patrick Joseph Glynn Appareils et procédés d'accumulation et de récupération d'énergie
CN208936834U (zh) * 2018-09-06 2019-06-04 广州大学 一种柔性平板热管结构

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CN211234067U (zh) 2020-08-11

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