WO2021017357A1 - 一种led的系统级封装、心率传感器及可穿戴设备 - Google Patents

一种led的系统级封装、心率传感器及可穿戴设备 Download PDF

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Publication number
WO2021017357A1
WO2021017357A1 PCT/CN2019/123549 CN2019123549W WO2021017357A1 WO 2021017357 A1 WO2021017357 A1 WO 2021017357A1 CN 2019123549 W CN2019123549 W CN 2019123549W WO 2021017357 A1 WO2021017357 A1 WO 2021017357A1
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WIPO (PCT)
Prior art keywords
package
led
substrate
heart rate
rate sensor
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PCT/CN2019/123549
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English (en)
French (fr)
Inventor
王文涛
方华斌
王德信
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歌尔微电子有限公司
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Publication of WO2021017357A1 publication Critical patent/WO2021017357A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Definitions

  • the present invention relates to the field of packaging, in particular to system-in-package. More specifically, the present invention relates to a system-in-package of LED; the present invention also relates to a heart rate sensor and a wearable device.
  • the LED is an important part of the heart rate sensor.
  • the current heart rate modules on the market have very high requirements for the light output of the LED. This is because the heart rate module is very sensitive to the requirements of the light signal.
  • the light output requirements of Yuanyuan are very high. In the case of the same power consumption LED specifications, the higher the light output and condensing effect of the light source, the more advantageous the heart rate data collection.
  • SIP package System In a Package integrates multiple functional chips, including processors, memory and other functional chips in a package, so as to achieve a basic and complete function.
  • the LED chip in the module is SIP encapsulated, the light output effect will be greatly reduced, and the light gathering performance will not be achieved.
  • An object of the present invention is to provide a system-in-package of LED.
  • a system-in-package package for LEDs which includes a substrate and a opaque side wall, the substrate and the side wall enclose a cavity with an opening at one end;
  • the LED wafer die mounted on the substrate, and the condenser lens provided on the substrate and covering the LED wafer die; the upper end position of the inner wall of the side wall is provided with a chamfer, and the chamfer is provided with Reflective layer.
  • the side wall portion is black.
  • the condenser lens is formed by injection molding.
  • the reflective layer is a coating.
  • the coating film is made of aluminum.
  • the substrate is a circuit board.
  • a wearable device including the above-mentioned system-in-package.
  • a heart rate sensor including the above-mentioned system-in-package.
  • a wearable device including the above-mentioned heart rate sensor.
  • a condenser lens and a reflective layer are added to improve the light-emitting performance of the LED wafer die; the light-emitting performance of the LED can be optimized by making the LED light source twice a light-collecting design.
  • Figure 1 is a schematic diagram of the structure of the system-in-package of the present invention.
  • the present invention provides a system-in-package for LEDs, which includes a substrate 1 and a side wall portion 2 that does not transmit light.
  • the substrate 1 and the side wall portion 2 enclose a cavity 3 with an opening at one end.
  • the substrate 1 of the present invention is preferably a circuit board, so that the LED can be conducted through the circuit board.
  • the side wall part 2 is made of opaque material, such as LCP+30% GF material, which can withstand a high temperature of 260°, which can meet the subsequent requirements of customers for reflow of the whole machine.
  • the side wall 2 is selected as black, which can be used to isolate the crosstalk of the LED light path to other photosensitive devices.
  • the side wall portion 2 is cylindrical, and after one end of the side wall portion 2 is fixed to the base plate 1, the two surround a cavity 3 with one end open.
  • the side wall portion 2 and the base plate 1 may be welded together or bonded together, which will not be described in detail here.
  • the system-in-package of the present invention further includes an LED wafer die 4 located in the cavity 3.
  • the LED wafer die 4 is mounted on the substrate 1 and can be connected to the circuit layout in the substrate 1.
  • a condenser lens 5 covering the LED wafer die 4 is provided on the substrate 1.
  • the condenser lens 5 can be formed by injection molding.
  • the condenser lens 5 can be directly formed by injection molding on the substrate, and the LED wafer die 4 is packaged.
  • the condenser lens 5 is added to the LED wafer die 4, which can control the light-emitting PN junction on the LED wafer die 4.
  • the emitted scattered light achieves a condensing effect at a time.
  • Different lens designs have different condensing and collection angles.
  • the upper end of the inner wall of the side wall portion 2 is provided with a chamfer, and a reflective layer 6 is provided on the chamfer.
  • the chamfer surrounds a circumference of the upper end of the inner wall of the side wall 2 and can also be regarded as an inclined surface extending from the inner wall of the side wall 2 to the open end thereof, so that the open end of the cavity 3 constitutes a flaring structure.
  • the light-reflecting layer 6 is a plating film, for example, a high-brightness plating film. In a specific embodiment of the present invention, it may be made of bright aluminum. Of course, for those skilled in the art, other high-brightness reflective materials can also be selected.
  • the light transmitted through the condensing lens 5 is reflected out through the reflective layer 6 and can again have a condensing effect, thereby preventing the side wall from absorbing or being penetrated to reduce the light intensity.
  • a condenser lens and a reflective layer are added to improve the light-emitting performance of the LED wafer die; the light-emitting performance of the LED can be optimized by making the LED light source twice a light-collecting design.
  • the system in package of the present invention can be applied to a heart rate sensor, and a heart rate sensor including the above system in package is provided herein.
  • the heart rate sensor of the present invention can be applied to a wearable device.
  • a wearable device using the above heart rate sensor is provided here, which can be a smart watch, a smart bracelet, smart glasses, etc., which will not be described in detail here.
  • system-in-package of the present invention can be directly applied to a wearable device, and a wearable device is provided here, which includes the above-mentioned system-in-package.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)

Abstract

一种LED的系统级封装、心率传感器及可穿戴设备，包括基板（1）、不透光的侧壁部（2），所述基板（1）与侧壁部（2）围成了具有一端开口的腔体（3）；还包括位于腔体（3）内且安装在基板（1）上的LED晶圆裸片（4），以及设置在基板（1）上并将LED晶圆裸片（4）覆盖起来的聚光透镜（5）；所述侧壁部（2）内壁的上端位置设置有倒角，在倒角上设置有反光层（6）。上述系统级封装，增加聚光透镜（5）和反光层（6）来提高LED晶圆裸片（4）的出光性能；通过对LED的光源做了两次聚光设计，可以使LED的出光性能达到最佳。

Description

一种LED的系统级封装、心率传感器及可穿戴设备 技术领域
本发明涉及封装领域，尤其涉及系统级封装，更具体地，本发明涉及LED的系统级封装；本发明还涉及一种心率传感器及可穿戴设备。
背景技术
LED是心率传感器的重要部件，目前市面上的心率模组对LED的出光要求非常高，这是由于心率模组对光信号的要求非常敏感，一是不能有光路的串扰，二是对LED晶元的出光要求非常高，在同等功耗LED规格的情况下，光源的出光和聚光效果越高对心率数据采集越有利。
SIP封装(System In a Package系统级封装)是将多种功能芯片，包括处理器、存储器等功能芯片集成在一个封装内，从而实现一个基本完整的功能。当模组中的LED晶元被SIP封装后，出光效果会大打折扣，也达不到聚光的性能。
发明内容
本发明的一个目的是提供了一种LED的系统级封装。
根据本发明的一个方面，提供一种LED的系统级封装，包括基板、不透光的侧壁部，所述基板与侧壁部围成了具有一端开口的腔体；还包括位于腔体内且安装在基板上的LED晶圆裸片，以及设置在基板上并将LED晶圆裸片覆盖起来的聚光透镜；所述侧壁部内壁的上端位置设置有倒角，在倒角上设置有反光层。
可选地，所述侧壁部为黑色。
可选地，所述聚光透镜通过注塑的方式形成。
可选地，所述反光层为镀膜。
可选地，所述镀膜选用铝材质。
可选地，所述基板为电路板。
根据本发明的第二方面，还提供了一种可穿戴设备，包括上述的系统级封装。
根据本发明的第三方面，还提供了一种心率传感器，包括上述的系统级封装。
根据本发明的第四方面，还提供了一种可穿戴设备，包括上述的心率传感器。
本发明的系统级封装，增加聚光透镜和反光层来提高LED晶圆裸片的出光性能；通过对LED的光源做了两次聚光设计，可以使LED的出光性能达到最佳。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
构成说明书的一部分的附图描述了本发明的实施例，并且连同说明书一起用于解释本发明的原理。
图1是本发明系统级封装的结构示意图。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术和设备可能不作详细讨论，但在适当情况下，所述技术和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
参考图1，本发明提供了一种LED的系统级封装，其包括基板1、不透光的侧壁部2，基板1与侧壁部2围成了具有一端开口的腔体3。
本发明的基板1优先选用电路板，使得LED可以通过该电路板导通。侧壁部2选用不透光的材质，例如选用LCP+30％GF的材质，能耐高温260°，可满足后续客户整机回流的需求。在本发明一个优选的实施方式中，侧壁部2选用黑色，由此可以用来隔绝LED光路对其他光敏器件的串扰。
侧壁部2呈筒状，侧壁部2的一端与基板1固定在一起后，二者围成了具有一端开口的腔体3。侧壁部2与基板1可以是焊接在一起，也可以是粘接在一起，在此不再具体说明。
本发明的系统级封装，还包括位于腔体3内的LED晶圆裸片4，LED晶圆裸片4贴装在基板1上，并可以与基板1内的电路布图导通。
在基板1上设置有将LED晶圆裸片4覆盖起来的聚光透镜5。聚光透镜5可以采用注塑的方式形成。
聚光透镜5可以直接在基板上注塑形成，并将LED晶圆裸片4封装起来，在LED晶圆裸片4上增加聚光透镜5，可对LED晶圆裸片4上的发光PN结发出的散射的光达到一次聚光的效果，透镜的设计不同，达到的聚光收光角度也会有不同。
侧壁部2内壁的上端位置设置有倒角，在倒角上设置有反光层6。该倒角环绕侧壁部2内壁上端的一周，也可以看成从侧壁部2内壁延伸至其开口端的倾斜面，使得腔体3的开口端构成了扩口结构。
反光层6为镀膜，例如可以为高亮镀膜。在本发明一个具体的实施例中，可以是高亮的铝材质。当然，对于本领域的技术人员而言，也可选用其它的高亮反光材质。通过聚光透镜5传播过来的光线，经过反光层6反射出去，可以再次起到聚光的效果，从而可以杜绝侧壁部对光的吸收或被穿透而消耗减弱出光强度。
本发明的系统级封装，增加聚光透镜和反光层来提高LED晶圆裸片的 出光性能；通过对LED的光源做了两次聚光设计，可以使LED的出光性能达到最佳。
本发明的系统级封装可以应用到心率传感器中，在此提供一种包括上述系统级封装的心率传感器。
本发明的心率传感器可以应用到可穿戴设备中，在此提供一种应用上述心率传感器的可穿戴设备，其可以是智能手表、智能手环、智能眼镜等，在此不再具体说明。
当然，对于本领域的技术人员而言，本发明的系统级封装可以直接应用可穿戴设备中，在此提供一种可穿戴设备，其包括上述的系统级封装。
虽然已经通过示例对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上示例仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (9)

  1. 一种LED的系统级封装，其特征在于：包括基板、不透光的侧壁部，所述基板与侧壁部围成了具有一端开口的腔体；还包括位于腔体内且安装在基板上的LED晶圆裸片，以及设置在基板上并将LED晶圆裸片覆盖起来的聚光透镜；所述侧壁部内壁的上端位置设置有倒角，在倒角上设置有反光层。
  2. 根据权利要求1所述的系统级封装，其特征在于：所述侧壁部为黑色。
  3. 根据权利要求1所述的系统级封装，其特征在于：所述聚光透镜通过注塑的方式形成。
  4. 根据权利要求1所述的系统级封装，其特征在于：所述反光层为镀膜。
  5. 根据权利要求4所述的系统级封装，其特征在于：所述镀膜选用铝材质。
  6. 根据权利要求1所述的系统级封装，其特征在于：所述基板为电路板。
  7. 一种可穿戴设备，其特征在于，包括根据权利要求1-6任一项所述的系统级封装。
  8. 一种心率传感器，其特征在于，包括根据权利要求1-6任一项所述的系统级封装。
  9. 一种可穿戴设备，其特征在于，包括根据权利要求8所述的心率传感器。
PCT/CN2019/123549 2019-07-31 2019-12-06 一种led的系统级封装、心率传感器及可穿戴设备 WO2021017357A1 (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110114979A1 (en) * 2009-11-17 2011-05-19 Jang Ji Won Light emitting device package and lighting system
CN206007242U (zh) * 2016-05-13 2017-03-15 赵伟 一种可穿戴心脏节律监测装置
CN206836879U (zh) * 2016-11-17 2018-01-05 歌尔科技有限公司 一种可穿戴设备
CN109585632A (zh) * 2019-02-14 2019-04-05 旭宇光电（深圳）股份有限公司 大功率远程荧光粉型白光led散热封装
CN109920903A (zh) * 2019-03-08 2019-06-21 佛山市国星光电股份有限公司 一种led器件及背光模组

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110114979A1 (en) * 2009-11-17 2011-05-19 Jang Ji Won Light emitting device package and lighting system
CN206007242U (zh) * 2016-05-13 2017-03-15 赵伟 一种可穿戴心脏节律监测装置
CN206836879U (zh) * 2016-11-17 2018-01-05 歌尔科技有限公司 一种可穿戴设备
CN109585632A (zh) * 2019-02-14 2019-04-05 旭宇光电（深圳）股份有限公司 大功率远程荧光粉型白光led散热封装
CN109920903A (zh) * 2019-03-08 2019-06-21 佛山市国星光电股份有限公司 一种led器件及背光模组

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