WO2021016848A1 - 显示装置及显示模组 - Google Patents

显示装置及显示模组 Download PDF

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Publication number
WO2021016848A1
WO2021016848A1 PCT/CN2019/098337 CN2019098337W WO2021016848A1 WO 2021016848 A1 WO2021016848 A1 WO 2021016848A1 CN 2019098337 W CN2019098337 W CN 2019098337W WO 2021016848 A1 WO2021016848 A1 WO 2021016848A1
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WO
WIPO (PCT)
Prior art keywords
antenna
panel
display module
display
layer
Prior art date
Application number
PCT/CN2019/098337
Other languages
English (en)
French (fr)
Inventor
罗永辉
冯彬峰
王佳祥
陈禹鹏
王超
李飞
张子杰
冉海龙
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to PCT/CN2019/098337 priority Critical patent/WO2021016848A1/zh
Priority to CN201980001186.3A priority patent/CN112585760B/zh
Priority to US16/771,252 priority patent/US11270635B2/en
Priority to EP19933240.4A priority patent/EP4006984B1/en
Publication of WO2021016848A1 publication Critical patent/WO2021016848A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G06F1/1658—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to the mounting of internal components, e.g. disc drive or any other functional module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1698—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0421—Structural details of the set of electrodes
    • G09G2300/0426—Layout of electrodes and connections
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2310/00—Command of the display device
    • G09G2310/02—Addressing, scanning or driving the display screen or processing steps related thereto
    • G09G2310/0264—Details of driving circuits
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2310/00—Command of the display device
    • G09G2310/02—Addressing, scanning or driving the display screen or processing steps related thereto
    • G09G2310/0264—Details of driving circuits
    • G09G2310/0297—Special arrangements with multiplexing or demultiplexing of display data in the drivers for data electrodes, in a pre-processing circuitry delivering display data to said drivers or in the matrix panel, e.g. multiplexing plural data signals to one D/A converter or demultiplexing the D/A converter output to multiple columns
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
    • G09G2330/04—Display protection
    • G09G2330/045—Protection against panel overheating
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
    • G09G2330/06—Handling electromagnetic interferences [EMI], covering emitted as well as received electromagnetic radiation
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a display device and a display module.
  • the full-screen display device has a compact structure, a high screen ratio, and a narrow frame.
  • a data selector (English: Multiplexer; abbreviation: MUX) is usually used to connect the display integrated circuit (English: Integrated Circuit; abbreviation: IC) of the display panel with the signal line in the display panel. Connect to reduce the area of the wiring area of the display panel, and realize the high screen-to-body ratio and narrow frame of the display device.
  • MUX Multiplexer
  • IC Integrated Circuit
  • the embodiments of the present disclosure provide a display device and a display module.
  • the technical solutions are as follows:
  • a display device including:
  • the display module includes:
  • a display panel comprising a first panel part, a second panel part, and a bent panel part connecting the first panel part and the second panel part, the second panel part being located on the back of the first panel part;
  • the wave absorbing layer is located between the first panel part and the second panel part, and the minimum distance between the boundary of the wave absorbing layer and the middle frame antenna is greater than or equal to 8 mm;
  • the driving circuit is located on a side of the second panel portion away from the first panel portion and is electrically connected to the display panel;
  • the flexible circuit board is located on the back of the first panel part and is electrically connected to the end of the second panel part away from the bent panel part;
  • orthographic projection of the drive circuit on the first panel portion the orthographic projection of the flexible circuit board on the first panel portion, and the wave-absorbing layer on the first panel portion There is no overlap of orthographic projections.
  • the driving circuit includes: a data selector and a display integrated circuit, and both the data selector and the display integrated circuit are located on a side of the second panel part away from the first panel part, and the The display integrated circuit is electrically connected with the display panel through the data selector.
  • the display module further includes: a shielding film located on a side of the driving circuit away from the first panel part, and the orthographic projection of the shielding film on the first panel part covers the driving The orthographic projection of the circuit on the first panel portion and the orthographic projection of the flexible circuit board on the first panel portion, the orthographic projection of the shielding film on the first panel portion and the wave absorption The orthographic projections of the layers on the first panel portion do not overlap.
  • the shielding film includes a glue layer and a shielding layer that are laminated, and the shielding film is pasted on a side of the driving circuit away from the first panel portion through the glue layer.
  • the shielding layer includes one or more of conductive cloth, copper foil and aluminum foil.
  • the display module further includes: a heat dissipation film located between the first panel portion and the second panel portion, and between the first panel portion and the flexible circuit board, and partially The heat dissipation film is in contact with the second panel part and the flexible circuit board.
  • the material of the heat dissipation film is metal.
  • the heat dissipation film is copper foil.
  • one end of the flexible circuit board is electrically connected to an end of the second panel part away from the bent panel part, and the other end is configured to be electrically connected to a client mainboard, and the flexible circuit board includes a laminated arrangement
  • the conductive layer and the insulating layer of, the insulating layer has an opening, and part of the conductive layer is exposed through the opening;
  • the adhesive layer includes a first conductive part, a second conductive part, and an insulating part other than the first conductive part and the second conductive part.
  • the second conductive portion is electrically connected, the orthographic projection of the first conductive portion on the first panel portion overlaps with the orthographic projection of the opening on the first panel portion, and the second conductive portion is The orthographic projection on the first panel part overlaps with the part of the heat dissipation film that is not in contact with the flexible circuit board and the second panel part;
  • the shielding film is electrically connected to the flexible circuit board through the first conductive part, the shielding film is electrically connected to the heat dissipation film through the second conductive part, and the shielding film is grounded.
  • the display module further includes: a buffer layer, located between the heat dissipation film and the first panel portion, and distributed in the same layer as the wave absorbing layer.
  • the buffer layer is a foam layer.
  • the minimum distance between the boundary of the wave absorbing layer and the middle frame antenna is greater than or equal to 10 mm.
  • the material of the wave absorbing layer includes one or more of ferrite, magnet iron nanomaterial, silicon carbide, and graphene polymer.
  • the minimum distance between the end point of the middle frame antenna and the end point of the wave absorbing layer is greater than or equal to 10 mm.
  • the distance between the middle frame antenna and the edge of the display module is about 0.5 mm.
  • the middle frame antenna includes an upper antenna, a lower antenna, and a side antenna, and the structure of the upper antenna is the same as that of the lower antenna;
  • the upper antenna has a U-shaped structure and includes a bottom side and two side sides located at two ends of the bottom side;
  • the upper antenna is located at the top of the display module, the bottom edge of the upper antenna extends along the top edge of the display module, and the two side edges of the upper antenna extend along the two sides of the display module ;
  • the lower antenna is located at the bottom of the display module, the bottom edge of the lower antenna extends along the bottom edge of the display module, and the two side edges of the lower antenna extend along the two sides of the display module ;
  • the side antenna has a linear structure, the side antenna extends along the side of the display module, and the side antenna is located between the upper antenna and the lower antenna;
  • the minimum distance between the boundary of the absorbing layer and the upper antenna and the minimum distance between the boundary of the absorbing layer and the side antenna are both greater than or equal to 8 mm, and the boundary of the absorbing layer is The minimum distance between the lower antennas is greater than 8 mm.
  • the minimum distance between the boundary of the wave absorbing layer and the upper antenna is equal to the minimum distance between the boundary of the wave absorbing layer and the side antenna.
  • the middle frame antenna includes an upper antenna and a lower antenna
  • the upper antenna has an L-shaped structure and includes a first side and a second side, and the length of the first side is greater than the length of the second side;
  • the lower antenna has a U-shaped structure and includes a bottom side and two side sides located at both ends of the bottom side;
  • the upper antenna is located on the top of the display module, the first edge extends along the top edge of the display module, and the second edge extends along one side edge of the display module;
  • the lower antenna is located at the bottom of the display module, the bottom edge of the lower antenna extends along the bottom edge of the display module, and the two side edges of the lower antenna extend along the two sides of the display module ;
  • the wave absorbing layer is L-shaped, the minimum distance between the boundary of the wave absorbing layer and the upper antenna is greater than or equal to 8 mm, and the minimum distance between the boundary of the wave absorbing layer and the lower antenna is greater than 8 mm.
  • the middle frame antenna includes a lower antenna and two upper antennas
  • the upper antenna has a linear structure
  • the lower antenna has a U-shaped structure, and includes two sides with a bottom at both ends of the bottom;
  • the two upper antennas are located on the top of the display module, and respectively extend along two sides of the display module;
  • the lower antenna is located at the bottom of the display module, the bottom edge of the lower antenna extends along the bottom edge of the display module, and the two side edges of the lower antenna extend along the two sides of the display module ;
  • the wave absorbing layer is T-shaped, the minimum distance between the boundary of the wave absorbing layer and the upper antenna is greater than or equal to 8 mm, and the minimum distance between the boundary of the wave absorbing layer and the lower antenna is greater than 8 mm.
  • the display device is a mobile terminal.
  • a display module including:
  • a display panel comprising a first panel part, a second panel part, and a bent panel part connecting the first panel part and the second panel part, the second panel part being located on the back of the first panel part;
  • the driving circuit includes a data selector and a display integrated circuit. Both the data selector and the display integrated circuit are located on the side of the second panel part away from the first panel part.
  • the display integrated circuit passes through the The data selector is electrically connected to the display panel;
  • the flexible circuit board is located on the back of the first panel part. One end of the flexible circuit board is electrically connected to the end of the second panel part away from the bent panel part, and the other end is configured to be electrically connected to the client main board. connection;
  • the shielding film includes an adhesive layer and a shielding layer that are laminated, and the shielding film is pasted on the side of the drive circuit away from the first panel part through the adhesive layer, and the shielding film is on the first panel part.
  • the orthographic projection on the upper cover covers the orthographic projection of the drive circuit on the first panel portion and the orthographic projection of the flexible circuit board on the first panel portion;
  • the flexible circuit board includes a conductive layer and an insulating layer that are stacked, the insulating layer has an opening, and part of the conductive layer is exposed through the opening, and the adhesive layer includes a conductive part and an insulating part.
  • the orthographic projection on the first panel portion overlaps with the orthographic projection of the opening on the first panel portion, and the shielding film is grounded.
  • FIG. 1 is a schematic front view of a structure of a display device provided by an embodiment of the present disclosure
  • FIG. 2 is a schematic cross-sectional structure diagram of a display module provided by an embodiment of the present disclosure
  • FIG. 3 is a schematic diagram of an interference signal transmitted along a display panel provided by an embodiment of the present disclosure
  • FIG. 4 is a schematic diagram of the connection between a MUX and a display IC provided by an embodiment of the present disclosure
  • Figure 5 is a schematic diagram of a MUX routing provided by an embodiment of the present disclosure.
  • Figure 6 is a schematic diagram of another MUX routing provided by an embodiment of the present disclosure.
  • FIG. 7 is a schematic front view structural diagram of another display device provided by an embodiment of the present disclosure.
  • FIG. 8 is a schematic front view of another display device provided by an embodiment of the present disclosure.
  • FIG. 9 is a schematic cross-sectional structure diagram of a display module provided by an embodiment of the present disclosure.
  • FIG. 10 is a method flowchart of a method for manufacturing a display device according to an embodiment of the present disclosure.
  • FIG. 1 is a front view structural diagram of a display device 0 provided by an embodiment of the present disclosure.
  • the display device 0 includes a display module 01 and a middle frame antenna 02, and the middle frame antenna 02 is located around the display module 01.
  • the display module 01 includes a display panel 011, a wave absorbing layer 012, a driving circuit 013, and a flexible circuit board 014.
  • the display panel 011 includes a first panel portion 0111, a second panel portion 0112, and a connection between the first panel portion 0111 and the second panel portion 0111.
  • the bent panel part 0113 of the panel part 0112, and the second panel part 0112 is located on the back of the first panel part 0111.
  • the absorbing layer 012 is located between the first panel portion 0111 and the second panel portion 0112, and the minimum distance between the boundary of the absorbing layer 012 and the middle frame antenna 02 is greater than or equal to 8 mm.
  • the driving circuit 013 is located on a side of the second panel portion 0112 away from the first panel portion 0111, and the driving circuit 013 is electrically connected to the display panel 011.
  • the flexible circuit board 014 is located on the back of the first panel portion 0111, and the flexible circuit board 014 is electrically connected to an end of the second panel portion 0112 away from the bent panel portion 0113. As shown in FIG. 2, the orthographic projection of the drive circuit 013 on the first panel portion 0111, the orthographic projection of the flexible circuit board 014 on the first panel portion 0111, and the orthographic projection of the absorbing layer 012 on the first panel portion 0111 The projections do not overlap.
  • first panel portion 0111 and the second panel portion 0112 may be parallel, or the first panel portion 0111 and the second panel portion 0112 are substantially parallel, for example, the first panel portion 0111 and the second panel portion 0112
  • the included angle is less than 5 degrees.
  • the back of the first panel portion 0111 may be a side of the first panel portion 0111 close to the second panel portion 0112.
  • the minimum distance between the boundary of the absorbing layer 012 and the middle frame antenna 02 is greater than or equal to 8 mm.
  • the minimum distance between the boundary of the absorbing layer 012 and the middle frame antenna 02 is greater than Or equal to 10 mm
  • the material of the wave absorbing layer 012 may be one or more of ferrite, magnet iron nanomaterial, silicon carbide, and graphene polymer. It is easy for those skilled in the art to understand that the driving circuit 013 will generate an interference signal during its operation, and the interference signal will be transmitted along the display panel 011.
  • the wave absorbing layer 012 can convert the interference signal into heat dissipation, so as to absorb the interference signal, so it can prevent the interference signal from being transmitted to the middle frame antenna 02 to affect the signal of the middle frame antenna 02.
  • FIG. 3 shows a schematic diagram of an interference signal transmitted along the display panel 011 according to an embodiment of the present disclosure.
  • the drive circuit 013 includes: a data selector (English: Multiplexer; abbreviation: MUX) 0131 and a display integrated circuit (English: Integrated Circuit; abbreviation: IC) 0132, MUX 0131 and The display ICs 0132 are all located on the side of the second panel portion 0112 away from the first panel portion 0111, and the display ICs 0132 are electrically connected to the display panel 011 through the MUX 0131.
  • MUX 0131 may be a 1:n MUX, that is, each input port in MUX 0131 corresponds to n output ports, n>1, and n is an integer.
  • Each input port of the MUX 0131 can be connected to an output port of the display IC 0132, and each output port of the MUX 0131 can be connected to a signal trace (such as a data line) of the display panel 011, so that for the same display integrated circuit,
  • the use of MUX can enable the display IC to be connected with more signal traces. Therefore, the use of MUX can make the area of the fan-out area (that is, the wiring area) of the display module smaller.
  • FIG. 4 shows a schematic diagram of the connection between a MUX 0131 and a display IC 0132 provided by an embodiment of the present disclosure.
  • This FIG. 4 shows the IC 0132 and two MUX 0131 (including MUX 0131a and MUX 0131b). Connect, and take each MUX 1:2 as an example for description. As shown in Figure 4, it shows the two output ports of IC 0132 (not shown in Figure 4) and the two MUX input ports ( Figure 4).
  • each input port of MUX 0131a corresponds to two output ports
  • the two output ports of MUX 0131a are connected to signal trace D1 and signal trace D2 in a one-to-one correspondence
  • each of MUX 0131b The input port corresponds to two output ports
  • the two output ports of the MUX 0131b are connected in a one-to-one correspondence with the signal trace D3 and the signal trace D4.
  • each output port of the MUX has a switch unit (not shown in FIG. 4), and the MUX implements data routing through the switch unit.
  • FIG. 5 shows a schematic diagram of the routing of a MUX 0131a shown in FIG. 4.
  • the MUX 0131a makes the display IC 0132 and the signal line D1 On, the display IC 0132 is disconnected from the signal trace D2, so MUX 0131a selects the signal trace D1 for the display IC 0132.
  • FIG. 6, shows another schematic diagram of the routing of the MUX 0131a shown in FIG. 4.
  • the MUX 0131a makes the display IC 0132 and the signal go Line D2 is turned on, indicating that IC 0132 is disconnected from signal line D1, so MUX 0131a selects the signal line D2 for display IC 0132.
  • the display module 01 also includes a shielding film 015, the shielding film 015 is located on the side of the driving circuit 013 away from the first panel portion 0111, and the shielding film 015 is located on the first panel portion 0111.
  • the orthographic projection on the first panel portion 0111 does not overlap.
  • the shielding film 015 can shield the interference signal generated by the driving circuit 013 to prevent the interference signal from being transmitted to the middle frame antenna 02 and affecting the signal of the middle frame antenna 02.
  • the shielding film 015 may include an adhesive layer 0151 and a shielding layer 0152 which are laminated, and the shielding film 015 is pasted on the side of the driving circuit 013 away from the first panel portion 0111 through the adhesive layer 0151.
  • the adhesive layer 0151 may include a first conductive portion a, a second conductive portion b, and an insulating portion c except the first conductive portion a and the second conductive portion b.
  • the shielding layer 0152 may include one or more of conductive cloth, copper foil and aluminum foil, for example, the shielding layer 0152 is a conductive cloth.
  • the display module 01 further includes a heat dissipation film 016 located between the first panel portion 0111 and the second panel portion 0112, and the first panel portion 0111 and the flexible circuit board 014, and part of the heat dissipation film 016 is in contact with the second panel portion 0112 and the flexible circuit board 014.
  • the material of the heat dissipation film 016 may be metal, for example, the heat dissipation film 016 is copper foil.
  • the driving circuit 013 and the flexible circuit board 014 easily generate heat, and the heat dissipation film 016 is in contact with the second panel portion 0112, so that the heat generated by the driving circuit 013 can be conducted to the heat dissipation through the second panel portion 0112
  • the film 016 is used to dissipate the heat from the display module 01 by the heat dissipation film 016, and the heat generated by the flexible circuit board 014 can be directly transferred to the heat dissipation film 016, so that the heat dissipation film 016 dissipates the heat from the display module 01, so
  • the heat dissipation film 016 can effectively dissipate the heat generated by the display module 01.
  • the display module 01 further includes a buffer layer 017, the buffer layer 017 is located between the heat dissipation film 016 and the first panel portion 0111, and the buffer layer 017 and the wave absorbing layer 012 are distributed in the same layer.
  • the buffer layer 017 may be a foam layer, and the buffer layer 017 may buffer the structure such as the heat dissipation film 016 and reduce the stress of the structure such as the heat dissipation film 016.
  • the flexible circuit board 014 may have two ends, and one end of the flexible circuit board 014 (neither shown in FIGS. 1 and 2) and the second panel portion 0112 are away from the bent panel portion 0113. One end is electrically connected, and the other end E (as shown in FIG. 1, not shown in FIG. 2) is configured to be electrically connected to the client mainboard (neither FIG. 1 nor FIG. 2), as shown in FIG. 2, the flexible circuit
  • the board 014 includes a conductive layer 0141 and an insulating layer 0142 that are stacked.
  • the conductive layer 0141 may be a copper layer.
  • the insulating layer 0142 has an opening (not shown in FIGS. 1 and 2) through which part of the conductive layer 0142 is exposed.
  • the adhesive layer 0151 includes a first conductive portion a, a second conductive portion b, and an insulating portion c except the first conductive portion a and the second conductive portion b.
  • the first conductive portion a and the second conductive portion b Part b is electrically connected (not shown in Figure 2), the orthographic projection of the first conductive part a on the first panel part 0111 overlaps with the orthographic projection of the opening of the flexible circuit board 014 on the first panel part 0111, and the second The orthographic projection of the conductive part b on the first panel part 0111 overlaps with the part of the heat dissipation film 016 that is not in contact with the flexible circuit board 014 and the second panel part 0112; the shielding film 015 overlaps the flexible circuit board 014 through the first conductive part a
  • the shielding film 015 is electrically connected to the heat dissipation film 016 through the second conductive portion b, and the shielding film 015 is grounded.
  • the orthographic projection of the first conductive portion a on the first panel portion 0111 can cover the orthographic projection of the opening of the flexible circuit board 014 on the first panel portion 0111, so as to facilitate the first conductive
  • the portion a is in full contact with the conductive layer 0141, thereby ensuring effective connection between the shielding film 016 and the flexible circuit board 014.
  • the middle frame antenna 02 can be used to transmit electromagnetic wave signals and receive electromagnetic wave signals, and the middle frame antenna 02 can have different forms.
  • the embodiment of the present disclosure takes three different forms of middle frame antenna 02 as examples for description.
  • the middle frame antenna 02 includes an upper antenna 021, a lower antenna 022 and a side antenna 023.
  • the structure of the upper antenna 021 and the structure of the lower antenna 022 may be the same.
  • the upper antenna 021 may have a U-shaped structure.
  • the upper antenna 021 includes a bottom side 0211 and two side sides 0212 at both ends of the bottom side 0211.
  • the upper antenna 021 is located on the top of the display module 01, and the bottom of the upper antenna 021
  • the edge 0211 extends along the top edge (not marked in FIG. 1) of the display module 01, and the two side edges 0212 of the upper antenna 021 extend along the two sides (not marked in FIG. 1) of the display module 01.
  • the lower antenna 022 may have a U-shaped structure.
  • the lower antenna 022 includes a bottom edge 0221 and two side edges 0222 at both ends of the bottom edge 0221.
  • the lower antenna 022 is located at the bottom of the display module 01, and the bottom of the lower antenna 022
  • the edge 0221 extends along the bottom edge (not marked in FIG. 1) of the display module 01, and the two side edges 0222 of the lower antenna 022 extend along the two side edges (not marked in FIG. 1) of the display module 01.
  • the side antenna 023 may have a linear structure, the side antenna 023 extends along the side of the display module 01, and the side antenna 023 is located between the upper antenna 021 and the lower antenna 022.
  • the minimum distance d1 between the boundary of the absorbing layer 012 and the upper antenna 021, and the minimum distance d3 between the boundary of the absorbing layer 012 and the side antenna 023 can be greater than or equal to 8 mm
  • the minimum distance d1 between the boundary and the upper antenna 012 is equal to the minimum distance d3 between the boundary of the wave absorbing layer 012 and the side antenna 023
  • the minimum distance d2 between the boundary of the wave absorbing layer 012 and the lower antenna 022 may be greater than 8 mm.
  • FIG. 7 shows a schematic front view structure diagram of another display device 0 provided by an embodiment of the present disclosure.
  • the middle frame antenna 02 can It includes an upper antenna 021 and a lower antenna 022.
  • the upper antenna 021 may have an L-shaped structure, and the upper antenna 021 includes a first side 0211 and a second side 0212.
  • the length of the first side 0211 is greater than the length of the second side 0212.
  • the upper antenna 021 is located at the top of the display module 01, the first side 0212 extends along the top side of the display module 01 (not marked in Figure 7), and the second side 0212 extends along a side of the display module 01 ( Figure 7 Not shown) extension.
  • the lower antenna 022 may have a U-shaped structure, and the lower antenna 022 includes a bottom edge 0221 and two side edges 0222 at both ends of the bottom edge 0221.
  • the lower antenna 022 is located at the bottom of the display module 01, and the lower antenna 022
  • the bottom edge 0221 extends along the bottom edge of the display module 01 (not marked in FIG. 7), and the two side edges 0222 of the lower antenna 022 extend along the two side edges of the display module 01 (not marked in FIG. 7) .
  • the absorbing layer 012 may be L-shaped, the minimum distance d1 between the boundary of the absorbing layer 012 and the upper antenna 021 may be greater than or equal to 8 mm, and the minimum distance d2 between the boundary of the absorbing layer 012 and the lower antenna 022 Can be larger than 8 mm.
  • FIG. 8 shows a schematic front view structure diagram of another display device 0 provided by an embodiment of the present disclosure.
  • the middle frame antenna 02 can It includes two upper antennas 021 and a lower antenna 022.
  • the upper antenna 021 may have a linear structure.
  • the two upper antennas 021 are located on the top of the display module 01, and the two upper antennas 021 are respectively along two sides of the display module 01
  • the edges (not shown in Figure 8) extend.
  • the lower antenna 022 may have a U-shaped structure.
  • the lower antenna 022 includes a bottom edge 0221 and two side edges 0222 located at both ends of the bottom edge 0221.
  • the lower antenna 022 is located at the bottom of the display module 01, and the bottom of the lower antenna 022
  • the side 0221 extends along the bottom edge (not marked in FIG. 8) of the display module 01, and the two side edges 0222 of the lower antenna 022 extend along the two side edges (not marked in FIG. 8) of the display module 01.
  • the absorbing layer 012 may be T-shaped, the minimum distance d1 between the boundary of the absorbing layer 012 and the upper antenna 021 may be greater than or equal to 8 mm, and the minimum distance d2 between the boundary of the absorbing layer 012 and the lower antenna 022 Can be larger than 8 mm.
  • the three forms of the middle frame antenna 02 described in the embodiments of the present disclosure are only exemplary, and those skilled in the art can easily understand that the form of the middle frame antenna is not limited to the above three forms.
  • the shape of the antenna can be adjusted and changed according to actual needs, which is not limited in the embodiment of the present disclosure.
  • the minimum distance between the end point of the middle frame antenna 02 and the end point of the wave absorbing layer 012 may be greater than or equal to 10 mm.
  • the shape of the wave absorbing layer 012 may be a polygon, and the end point of the wave absorbing layer 012 may be the point where the corner of the wave absorbing layer 012 is located, which is not limited in the embodiment of the present disclosure.
  • the distance between the middle frame antenna 02 and the edge of the display module 01 is about 0.5 mm.
  • the distance g1 between the upper antenna 021 and the edge of the display module 01, and the distance g2 between the lower antenna 022 and the edge of the display module 01 are about 0.5 mm.
  • the distance g3 between the side antenna 023 and the edge of the display module 01 is about 0.5 mm.
  • the distance between the middle frame antenna 02 and the edge of the display module 01 is about 0.5 mm, and the difference between the distance between the middle frame antenna 02 and the edge of the display module 01 and 0.5 mm is less than the preset threshold.
  • the preset threshold value is for example 0.2 mm, 0.1 mm, etc., for example, the distance between the middle frame antenna 02 and the edge of the display module 01 is 0.51 mm, 0.52 mm, 0.49 mm, 0.48 mm, etc. This is not limited.
  • the display device 0 may be a mobile terminal.
  • the display device 0 may be a mobile terminal such as a smart phone or a tablet computer.
  • Figure 1 and Figure 8 are drawn in dotted lines except for the structure (such as the structure of the wave-absorbing layer) located below the uppermost layer (such as the shielding layer).
  • Figures 7 and 8 do not represent the actual hierarchical relationship of each structure in the display module.
  • the actual hierarchical relationship of each structure in the display module should be based on the hierarchical relationship in the cross-sectional view (for example, Figure 3). This will not be repeated here.
  • the display device includes a display module and a mid-frame antenna.
  • the display module includes a wave absorbing layer and a drive circuit.
  • the wave absorbing layer can absorb interference signals generated by the drive circuit. Therefore, the influence of interference signals on the display signal of the display device can be reduced; in addition, the minimum distance between the boundary of the absorbing layer and the middle frame antenna is greater than or equal to 8 mm, so it can avoid the influence of the absorbing layer on the signal of the middle frame antenna. interference.
  • the display module further includes a shielding film, which can shield the interference signal generated by the driving circuit, and reduce the influence of the interference signal on the display signal of the display module.
  • FIG. 9 shows a schematic cross-sectional structure diagram of a display module 11 provided by an embodiment of the present disclosure.
  • the display module 11 includes a display panel 111, a driving circuit 112, a flexible circuit board 113, and Shielding film 114.
  • the display panel 111 includes a first panel portion 1111, a second panel portion 1112, and a bent panel portion 1113 connecting the first panel portion 1111 and the second panel portion 1112.
  • the second panel portion 1112 is located on the back of the first panel portion 1111.
  • the one panel portion 1111 and the second panel portion 1112 may be parallel, or the first panel portion 1111 and the second panel portion 1112 are substantially parallel, for example, the angle between the first panel portion 1111 and the second panel portion 1112 is less than 5 degrees,
  • the back surface of the one panel portion 1111 may be a surface of the first panel portion 1111 close to the second panel portion 1112.
  • the driving circuit 112 is located on a side of the second panel portion 1112 away from the first panel portion 1111, and the driving circuit 112 is electrically connected to the display panel 111.
  • the flexible circuit board 113 is located on the back of the first panel portion 1111, and the flexible circuit board 113 is electrically connected to an end of the second panel portion 1112 away from the bent panel portion 1113.
  • the shielding film 114 is located on the side of the driving circuit 112 away from the first panel portion 1111.
  • the orthographic projection of the shielding film 114 on the first panel portion 1111 covers the orthographic projection of the driving circuit 112 on the first panel portion 1111 and the flexible circuit board 113. Orthographic projection on the first panel portion 1111.
  • the driving circuit 112 includes a MUX 1121 and a display IC 1122. Both the MUX 1121 and the display IC 1122 are located on the side of the second panel portion 1112 away from the first panel portion 1111.
  • the display IC 1122 passes through the MUX 1121 and the display panel 111. Electric connection.
  • the connection relationship between the MUX 1121 and the display IC 1122 and the routing principle of the MUX 1121 can refer to the foregoing display device embodiments, and the details of the embodiments of the present disclosure are not repeated here.
  • the flexible circuit board 113 may have two ends. One end of the flexible circuit board 113 (not marked in FIG. 9) is electrically connected to the end of the second panel portion 1112 away from the bent panel portion 1113, and the other end E( 9) is configured to be electrically connected to the client main board (not shown in FIG. 9).
  • the flexible circuit board 113 includes a conductive layer 1131 and an insulating layer 1132 that are stacked. 1131 may be a copper layer, and the insulating layer 1132 has an opening (not shown in FIG. 9) through which part of the conductive layer 1131 is exposed.
  • the shielding film 114 may include a laminated glue layer 1141 and a shielding layer 1142.
  • the shielding film 114 is pasted on the side of the driving circuit 112 away from the first panel portion 1111 through the glue layer 1141.
  • the shielding layer 1142 includes conductive cloth, copper foil, and aluminum foil.
  • One or more of the adhesive layer 1141 includes a first conductive portion x and an insulating portion y, the orthographic projection of the first conductive portion x on the first panel portion 1111 and the opening of the flexible circuit board 113 on the first panel portion 1111 There is overlap in the orthographic projection of, and the shielding film 114 is grounded.
  • the orthographic projection of the first conductive portion x on the first panel portion 1111 can cover the orthographic projection of the opening of the flexible circuit board 113 on the first panel portion 1111, so as to facilitate the first conductive
  • the portion x is in full contact with the conductive layer 1131, so as to ensure an effective connection between the shielding film 114 and the flexible circuit board 113.
  • the display module 11 further includes a heat dissipation film 115, the heat dissipation film 115 is located between the first panel portion 1111 and the second panel portion 0112, and the first panel portion 1111 and the flexible circuit board 113, and part of the heat dissipation film 115 is in contact with the second panel portion 0112 and the flexible circuit board 113.
  • the adhesive layer 1141 further includes a second conductive portion z, the first conductive portion x is electrically connected to the second conductive portion z (not shown in FIG.
  • the second conductive portion z is in the first panel portion 1111
  • the above orthographic projection overlaps with the part of the heat dissipation film 115 that is not in contact with the flexible circuit board 113 and the second panel portion 1112, and the shielding film 114 is electrically connected to the heat dissipation film 115 through the second conductive portion z.
  • the material of the heat dissipation film 115 may be metal, for example, the heat dissipation film 115 is copper foil.
  • the driving circuit 112 and the flexible circuit board 113 are prone to generate heat, and the heat dissipation film 115 is in contact with the second panel portion 1112, so that the heat generated by the driving circuit 113 can be conducted to the heat dissipation through the second panel portion 1112
  • the film 115 is used to dissipate heat from the display module 11 by the heat dissipation film 115, and the heat generated by the flexible circuit board 113 can be directly transferred to the heat dissipation film 115, so that the heat dissipation film 115 dissipates the heat from the display module 11, so
  • the heat dissipation film 115 can effectively dissipate the heat generated by the display module 11.
  • the display module 11 further includes a buffer layer 116, the buffer layer 116 is located between the heat dissipation film 115 and the first panel portion 1111, the buffer layer 116 may be a foam layer, and the buffer layer 116 may The structure such as the heat dissipation film 115 is buffered to reduce the stress of the structure such as the heat dissipation film 115.
  • the display module includes a shielding film and a drive circuit.
  • the shielding film can shield the interference signal generated by the drive circuit, and therefore can reduce the display signal of the interference signal to the display module. Impact.
  • FIG. 10 shows a method flowchart of a method for manufacturing a display device provided by the present disclosure.
  • the method for manufacturing a display device can be used to manufacture the display device 0 shown in FIG. 1, FIG. 7 or FIG. 8.
  • the method includes the following steps:
  • step 101 a middle frame antenna is manufactured.
  • the middle frame antenna may have different forms.
  • the middle frame antenna 02 includes an upper antenna 021, a lower antenna 022, and a side antenna 023.
  • the upper antenna 021 has a U-shaped structure.
  • the upper antenna 021 includes a bottom side 0211 and two sides at both ends of the bottom side.
  • the lower antenna 022 has a U-shaped structure.
  • the lower antenna 022 includes a bottom side 0221 and two side sides 0222 at both ends of the bottom side 0221.
  • the side antenna 023 has a linear structure.
  • the middle frame antenna 02 includes an upper antenna 021 and a lower antenna 022.
  • the upper antenna 021 has an L-shaped structure, and the upper antenna 021 includes a first side 0211 and a second side 0212. The length is greater than the length of the second side 0212, the lower antenna 022 has a U-shaped structure, and the lower antenna 022 includes a bottom side 0221 and two side sides 0222 located at both ends of the bottom side.
  • the middle frame antenna 02 includes two upper antennas 021 and a lower antenna 022.
  • the upper antenna 021 has a linear structure, and the lower antenna 022 has a U-shaped structure.
  • the lower antenna 022 includes a bottom edge 0221 and a bottom antenna 022. Two sides 0222 at both ends of side 0221.
  • the material of the middle frame antenna may be a metal material or an alloy material, for example, the material of the middle frame antenna may be an aluminum alloy material.
  • the middle frame antenna can be manufactured through a metal forming process.
  • the middle frame antenna 02 shown in FIG. 1, FIG. 7 or FIG. 8 can be manufactured through a metal forming process.
  • a display panel is manufactured.
  • the display panel includes a first panel part, a second panel part, and a connecting panel part connecting the first panel part and the second panel part.
  • the display panel may be a flexible display panel, so that the display panel can be bent along the connecting panel part so that the second panel part is located on the back of the first panel part.
  • the display panel may be an organic light emitting diode (English: Organic Light-Emitting Diode; abbreviation: OLED) display panel or a quantum dot light-emitting diode (English: Quantum Dot Light Emitting Diodes; abbreviation: QLED) display panel.
  • OLED Organic Light-Emitting Diode
  • QLED Quantum Dot Light Emitting Diodes
  • a driving circuit is manufactured.
  • the driving circuit includes a data selector and a display integrated circuit.
  • the data selector can be a 1:n MUX, that is, each input port in the MUX corresponds to n output ports, n>1, and n is an integer, for example, the data selector can be a 1:2 MUX .
  • the display integrated circuit may be a display integrated IC.
  • the data selector and the display integrated circuit can be manufactured through a circuit manufacturing process, thereby manufacturing a driving circuit.
  • a flexible circuit board is manufactured.
  • the flexible circuit board includes a conductive layer and an insulating layer that are stacked, the insulating layer has an opening, and a part of the conductive layer is exposed through the opening.
  • the material of the conductive layer may be a metal material or an alloy material.
  • the material of the conductive layer may be one of copper, aluminum or molybdenum, or the material of the conductive layer may also be at least two of copper, aluminum or molybdenum.
  • the material of the insulating layer can be SiO 2 (Chinese: silicon dioxide), SiOx (Chinese: silicon oxide), SiNx (Chinese: silicon nitride), Al 2 O 3 (Chinese: alumina) or SiOxNx (Chinese: oxynitride) Silicon) one or a combination of more.
  • the metal copper material layer can be formed by any one of sputtering or thermal evaporation processes, and the metal copper material layer can be formed by one patterning process.
  • step 105 a buffer layer is manufactured.
  • the buffer layer may be a foam layer.
  • step 106 a heat dissipation film is manufactured.
  • the material of the heat dissipation film may be metal, for example, the heat dissipation film may be copper foil.
  • metal copper can be used as a material to manufacture the heat dissipation film through a film forming process.
  • a shielding film is manufactured.
  • the shielding film includes a laminated glue layer and a shielding layer.
  • the glue layer includes a first conductive part, a second conductive part, and an insulating part other than the first conductive part and the second conductive part.
  • the first conductive part is electrically connected to the second conductive part.
  • the shielding layer may include one or more of conductive cloth, copper foil, and aluminum foil.
  • the shielding layer is conductive cloth
  • the adhesive layer includes a first conductive part, a second conductive part, and the first conductive part and the second conductive part.
  • the insulating part other than the conductive part is electrically connected to the first conductive part and the second conductive part.
  • first, conductive glue may be used to form the first conductive portion and the second conductive portion on the base substrate
  • the insulating glue may be used to form the insulating portion on the base substrate, so that the first conductive portion and the second conductive portion are electrically connected.
  • Connect to obtain an adhesive layer and then form one or more of conductive cloth, copper foil and aluminum foil on the adhesive layer to obtain a shielding layer, and finally peel off the base substrate to obtain a shielding film.
  • step 108 a wave absorbing layer is formed on the back of the first panel portion.
  • the shape of the wave absorbing layer may be different according to the shape of the middle frame antenna.
  • the wave absorbing layer 012 is an irregular polygon.
  • the wave absorbing layer 012 is L-shaped.
  • the wave absorbing layer 012 is T-shaped.
  • the material of the wave absorbing layer may include one or more of ferrite, magnet iron nanomaterial, silicon carbide, and graphene polymer.
  • a ferrite material layer can be formed on the back of the first panel part by any of the processes of deposition, coating, or sputtering, and the ferrite material layer can be processed through a patterning process to obtain the wave absorbing layer .
  • the ferrite material layer is processed through a patterning process to obtain the wave absorbing layer 012 shown in FIG. 1, FIG. 7 or FIG.
  • the buffer layer is arranged on the back surface of the first panel portion, so that the buffer layer and the wave absorbing layer are distributed in the same layer.
  • the buffer layer can be pasted on the back of the first panel part with optical glue, so that the buffer layer and the wave absorbing layer are distributed in the same layer.
  • step 110 the heat dissipation film is disposed on the side of the buffer layer and the wave absorbing layer away from the first panel portion.
  • the heat dissipation film can be pasted on the side of the buffer layer and the wave absorbing layer away from the first panel part by using optical glue, and the orthographic projection of the heat dissipation film on the first panel part covers the front of the buffer layer on the first panel part.
  • step 111 the driving circuit is arranged on the side of the second panel part away from the back surface of the first panel part, and the display integrated circuit is electrically connected to the display panel through the data selector.
  • the MUX can be electrically connected to the display panel, and the display IC and the MUX can be electrically connected, and then the display IC and the MUX can be pasted on the back side of the second panel part away from the first panel part.
  • the connection relationship between the MUX and the display panel and the connection relationship between the display IC and the MUX please refer to FIG. 4 to FIG. 6, and the details of the embodiment of the present disclosure are not repeated here.
  • one end of the flexible circuit board is electrically connected to the end of the second panel part away from the first panel part, so that the conductive layer of the flexible circuit board is close to the back of the first panel part.
  • both one end of the flexible circuit board and the end of the second panel part away from the first panel part may be provided with golden fingers, and one end of the flexible circuit board and the end of the second panel part away from the first panel part are bound by golden fingers. , Making one end of the flexible circuit board and the end of the second panel part away from the first panel part electrically connected, and making the conductive layer of the flexible circuit board close to the back of the first panel part.
  • step 113 the second panel part is bent to the back of the first panel part along the connecting panel part.
  • the second panel part can be bent to the back of the first panel part along the connecting panel part, so that the driving circuit is located on the side of the second panel part away from the first panel part, and the flexible circuit board is located on the side of the first panel part.
  • the absorbing layer and the buffer layer are located between the first panel part and the second panel part, and the heat dissipation film is located between the first panel part and the second panel part, and between the first panel part and the flexible circuit board, partially dissipating heat
  • the film is in contact with the second panel part and the flexible circuit board, the orthographic projection of the drive circuit on the first panel part, the orthographic projection of the flexible circuit board on the first panel part, and the orthographic projection of the wave-absorbing layer on the first panel part.
  • the projections do not overlap.
  • step 114 the shielding film is arranged on the side of the driving circuit away from the first panel portion to obtain a display module.
  • a pasting process can be used to paste the shielding film on the side of the drive circuit away from the first panel part through the adhesive layer of the shielding film, so that the first conductive part in the adhesive layer of the shielding film is on the first panel part.
  • the shielding film is electrically connected to the flexible circuit board through the first conductive part
  • the shielding film is electrically connected to the heat dissipation film through the second conductive part
  • the shielding film is grounded
  • the orthographic projection of the shielding film on the first panel part covers the driving circuit in the second
  • the middle frame antenna is arranged around the display module so that the minimum distance between the boundary of the wave absorbing layer and the middle frame antenna is greater than or equal to 8 mm.
  • the middle frame antenna 02 can be arranged around the display module 01 so that
  • the upper antenna 021 is located at the top of the display module 01, and the bottom side 0211 of the upper antenna 021 extends along the top side of the display module 02, and the two sides 0212 of the upper antenna 021 extend along the two sides of the display module 01
  • the lower antenna 022 is located at the bottom of the display module 01, the bottom edge 0221 of the lower antenna 022 extends along the bottom edge of the display module 01, and the two sides 0222 of the lower antenna 022 extend along the two sides of the display module 01 Extension, the side antenna 023 extends along the side of the display module 01, and the side antenna 023 is located between the upper antenna 021 and the lower antenna 022, and the minimum distance d1 between the boundary of the absorbing layer 012 and the upper antenna 021, and the The minimum distance d3 between the boundary of the wave layer 012 and the side antenna 023 can be greater than or equal to 8 mm, and the minimum distance d1 between the boundary of the absorbing layer 012 and the upper antenna 012 is equal to the boundary of the absorbing layer 01
  • the middle frame antenna 02 can be arranged around the display module 01, so that the upper antenna 021 is located on the top of the display module 01, and the first side 0212 of the upper antenna 021 is along the edge of the display module 01.
  • the top edge extends
  • the second edge 0212 extends along a side edge of the display module 01
  • the lower antenna 022 is located at the bottom of the display module 01
  • the bottom edge 0221 of the lower antenna 022 extends along the bottom edge of the display module 01.
  • the two sides 0222 of the lower antenna 022 extend along the two sides of the display module 01, and the minimum distance d1 between the boundary of the absorbing layer 012 and the upper antenna 021 can be greater than or equal to 8 mm.
  • the minimum distance d2 between the boundary and the lower antenna 022 may be greater than 8 mm.
  • the middle frame antenna 02 can be arranged around the display module 01, so that the two upper antennas 021 are located on the top of the display module 01, and the two upper antennas 021 are respectively along the display module.
  • 01 extends two sides
  • the lower antenna 022 is located at the bottom of the display module 01
  • the bottom 0221 of the lower antenna 022 extends along the bottom of the display module 01
  • the two sides 0222 of the lower antenna 022 extend along the
  • the two sides of the display module 01 extend, and the minimum distance d1 between the boundary of the absorbing layer 012 and the upper antenna 021 can be greater than or equal to 8 mm, and the minimum distance between the boundary of the absorbing layer 012 and the lower antenna 022 d2 can be greater than 8 mm.
  • the distance between the middle frame antenna and the edge of the display module can be about 0.5 mm.
  • the distance between the middle frame antenna and the edge of the display module is 0.51 mm, 0.52 mm, 0.49 mm, 0.48 mm, etc., which is not limited in the embodiment of the present disclosure.
  • the manufacturing method of the display device includes a display module and a middle frame antenna, and the display module includes a wave absorbing layer and a driving circuit, The layer can absorb the interference signal generated by the driving circuit, so the influence of the interference signal on the display signal of the display device can be reduced; in addition, the minimum distance between the boundary of the absorbing layer and the middle frame antenna is greater than or equal to 8 mm, so Avoid interference from the absorbing layer to the signal of the middle frame antenna. Further, the display module further includes a shielding film, which can shield the interference signal generated by the driving circuit, and reduce the influence of the interference signal on the display signal of the display module.
  • the one patterning process involved includes photoresist coating, exposure, development, etching and photoresist stripping, and the material layer (such as metal copper material Layer) processing includes: first, coating a layer of photoresist on the material layer (such as a metal copper material layer) to form a photoresist layer, and then using a mask to expose the photoresist layer to make the photoresist The layer forms a fully exposed area and a non-exposed area. Then, a development process is used to completely remove the photoresist in the fully exposed area and all the photoresist in the non-exposed area is retained.
  • the material layer such as metal copper material Layer
  • the material layer for example, The area corresponding to the fully exposed area on the metal copper material layer is etched, and finally, the photoresist in the non-exposed area is stripped to obtain a corresponding structure (for example, a conductive layer).
  • the photoresist is a positive photoresist as an example.
  • the process of one patterning process can refer to the description in this paragraph, and the embodiments of the present disclosure will not be omitted here. Repeat.

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Abstract

本公开实施例提供一种显示装置及显示模组，属于显示技术领域。该显示装置包括显示模组和中框天线，该显示模组包括显示面板、吸波层、驱动电路和柔性电路板，其中，驱动电路在第一面板部上的正投影，柔性电路板在第一面板部上的正投影，以及，吸波层在第一面板部上的正投影不存在重叠。本公开可以降低干扰信号对显示装置的显示信号的影响。

Description

显示装置及显示模组 技术领域
本公开涉及显示技术领域，特别涉及一种显示装置及显示模组。
背景技术
随着显示技术的发展，手机等显示装置逐渐朝全面屏的方向发展。全面屏显示装置的结构紧凑、屏幕占比高、边框窄。
发明人所知，在全面屏显示装置中，通常使用数据选择器(英文：Multiplexer；简称：MUX)将显示面板的显示集成电路(英文：Integrated Circuit；简称：IC)与显示面板中的信号线连接，以减小显示面板的走线区的面积，实现显示装置的高屏占比和窄边框化。
发明内容
本公开实施例提供了一种显示装置及显示模组。技术方案如下：
一方面，提供一种显示装置，包括：
显示模组和中框天线，所述中框天线位于所述显示模组的周围；
所述显示模组包括：
显示面板，包括第一面板部、第二面板部以及连接所述第一面板部和所述第二面板部的弯折面板部，所述第二面板部位于所述第一面板部的背面；
吸波层，位于所述第一面板部与所述第二面板部之间，所述吸波层的边界与所述中框天线之间的最小距离大于或等于8毫米；
驱动电路，位于所述第二面板部远离所述第一面板部的一侧，且与所述显示面板电连接；
柔性电路板，位于所述第一面板部的背面，且与所述第二面板部远离所述弯折面板部的一端电连接；
其中，所述驱动电路在所述第一面板部上的正投影，所述柔性电路板在所述第一面板部上的正投影，以及，所述吸波层在所述第一面板部上的正投影不存在重叠。
可选地，所述驱动电路包括：数据选择器和显示集成电路，所述数据选择器和所述显示集成电路均位于所述第二面板部远离所述第一面板部的一面上，所述显示集成电路通过所述数据选择器与所述显示面板电连接。
可选地，所述显示模组还包括：屏蔽膜，位于所述驱动电路远离所述第一面板部的一侧，所述屏蔽膜在所述第一面板部上的正投影覆盖所述驱动电路在所述第一面板部上的正投影以及所述柔性电路板在所述第一面板部上的正投影，所述屏蔽膜在所述第一面板部上的正投影与所述吸波层在所述第一面板部上的正投影不存在重叠。
可选地，所述屏蔽膜包括层叠设置的胶层和屏蔽层，所述屏蔽膜通过所述胶层粘贴在所述驱动电路远离所述第一面板部的一侧。
可选地，所述屏蔽层包括导电布、铜箔和铝箔中的一种或多种。
可选地，所述显示模组还包括：散热膜，位于所述第一面板部与所述第二面板部之间，以及所述第一面板部与所述柔性电路板之间，且部分所述散热膜与所述第二面板部和所述柔性电路板接触。
可选地，所述散热膜的材料为金属。
可选地，所述散热膜为铜箔。
可选地，所述柔性电路板的一端与所述第二面板部远离所述弯折面板部的一端电连接，另一端被配置为与客户端主板电连接，所述柔性电路板包括层叠设置的导电层和绝缘层，所述绝缘层具有开口，部分所述导电层通过所述开口露出；
在所述屏蔽膜中，所述胶层包括第一导电部、第二导电部以及除所述第一导电部和所述第二导电部之外的绝缘部，所述第一导电部与所述第二导电部电连接，所述第一导电部在所述第一面板部上的正投影与所述开口在所述第一面板部上的正投影存在重叠，所述第二导电部在所述第一面板部上的正投影与所述散热膜中未与所述柔性电路板和所述第二面板部接触的部分存在重叠；
所述屏蔽膜通过所述第一导电部与所述柔性电路板电连接，所述屏蔽膜通过所述第二导电部与所述散热膜电连接，所述屏蔽膜接地。
可选地，所述显示模组还包括：缓冲层，位于所述散热膜与所述第一面板部之间，且与所述吸波层同层分布。
可选地，所述缓冲层为泡棉层。
可选地，所述吸波层的边界与所述中框天线之间的最小距离大于或等于10毫米。
可选地，所述吸波层的材料包括：铁氧体、磁铁铁纳米材料、碳化硅和石墨烯聚合物中的一种或多种。
可选地，所述中框天线的端点与所述吸波层的端点之间的最小距离大于或等于10毫米。
可选地，所述中框天线与所述显示模组的边缘之间的距离约为0.5毫米。
可选地，所述中框天线包括上天线、下天线和侧天线，所述上天线的结构与所述下天线的结构相同；
所述上天线呈U形结构，包括底边和位于所述底边两端的两个侧边；
所述上天线位于所述显示模组的顶部，所述上天线的底边沿所述显示模组的顶边延伸，所述上天线的两个侧边沿所述显示模组的两个侧边延伸；
所述下天线位于所述显示模组的底部，所述下天线的底边沿所述显示模组的底边延伸，所述下天线的两个侧边沿所述显示模组的两个侧边延伸；
所述侧天线呈直线形结构，所述侧天线沿所述显示模组的侧边延伸，且所述侧天线位于所述上天线与所述下天线之间；
所述吸波层的边界与所述上天线之间的最小距离以及所述吸波层的边界与所述侧天线之间的最小距离均大于或等于8毫米，所述吸波层的边界与所述下天线之间的最小距离大于8毫米。
可选地，所述吸波层的边界与所述上天线之间的最小距离等于所述吸波层的边界与所述侧天线之间的最小距离。
可选地，所述中框天线包括上天线和下天线；
所述上天线呈L形结构，包括第一边和第二边，所述第一边的长度大于所述第二边的长度；
所述下天线呈U形结构，包括底边和位于所述底边两端的两个侧边；
所述上天线位于所述显示模组的顶部，所述第一边沿所述显示模组的顶边延伸，所述第二边沿所述显示模组的一个侧边延伸；
所述下天线位于所述显示模组的底部，所述下天线的底边沿所述显示模组的底边延伸，所述下天线的两个侧边沿所述显示模组的两个侧边延伸；
所述吸波层呈L形，所述吸波层的边界与所述上天线之间的最小距离大于或等于8毫米，所述吸波层的边界与所述下天线之间的最小距离大于8毫米。
可选地，所述中框天线包括下天线和两个上天线；
所述上天线呈直线形结构；
所述下天线呈U形结构，包括底边位于所述底边的两端的两个侧边；
所述两个上天线位于所述显示模组的顶部，分别沿所述显示模组的两个侧边延伸；
所述下天线位于所述显示模组的底部，所述下天线的底边沿所述显示模组的底边延伸，所述下天线的两个侧边沿所述显示模组的两个侧边延伸；
所述吸波层呈T形，所述吸波层的边界与所述上天线之间的最小距离大于或等于8毫米，所述吸波层的边界与所述下天线之间的最小距离大于8毫米。
可选地，所述显示装置为移动终端。
另一方面，提供一种显示模组，包括：
显示面板，包括第一面板部、第二面板部以及连接所述第一面板部和所述第二面板部的弯折面板部，所述第二面板部位于所述第一面板部的背面；
驱动电路，包括数据选择器和显示集成电路，所述数据选择器和所述显示集成电路均位于所述第二面板部远离所述第一面板部的一面上，所述显示集成电路通过所述数据选择器与所述显示面板电连接；
柔性电路板，位于所述第一面板部的背面，所述柔性电路板的一端与所述第二面板部远离所述弯折面板部的一端电连接，另一端被配置为与客户端主板电连接；
屏蔽膜，包括层叠设置的胶层和屏蔽层，所述屏蔽膜通过所述胶层粘贴在所述驱动电路远离所述第一面板部的一侧，所述屏蔽膜在所述第一面板部上的正投影覆盖所述驱动电路在所述第一面板部上的正投影以及所述柔性电路板在所述第一面板部上的正投影；
其中，所述柔性电路板包括层叠设置的导电层和绝缘层，所述绝缘层具有开口，部分所述导电层通过所述开口露出，所述胶层包括导电部和绝缘部，所述导电部在所述第一面板部上的正投影与所述开口在所述第一面板部上的正投影存在重叠，所述屏蔽膜接地。
附图说明
为了更清楚地说明本公开实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本公开实施例提供的一种显示装置的正视结构示意图；
图2是本公开实施例提供的一种显示模组的剖视结构示意图；
图3是本公开实施例提供的一种干扰信号沿显示面板传输的示意图；
图4是本公开实施例提供的一种MUX和显示IC的连接示意图；
图5是本公开实施例提供的一种MUX的选路示意图；
图6是本公开实施例提供的另一种MUX的选路示意图；
图7是本公开实施例提供的另一种显示装置的正视结构示意图；
图8是本公开实施例提供的再一种显示装置的正视结构示意图；
图9是本公开实施例提供的一种显示模组的剖视结构示意图；
图10是本公开实施例提供的一种显示装置的制造方法的方法流程图。
具体实施方式
为了使本公开的目的、技术方案和优点更加清楚，下面将结合附图对本公开作进一步地详细描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本公开保护的范围。
图1是本公开实施例提供的一种显示装置0的正视结构示意图，参见图1，该显示装置0包括显示模组01和中框天线02，中框天线02位于显示模组01的周围。该显示模组01包括显示面板011、吸波层012、驱动电路013和柔性电路板014。
图2是本公开实施例提供的一种显示模组01的剖视结构示意图，参见图2，显示面板011包括第一面板部0111、第二面板部0112以及连接第一面板部0111和第二面板部0112的弯折面板部0113，第二面板部0112位于第一面板部0111的背面。吸波层012位于第一面板部0111与第二面板部0112之间，且吸波层 012的边界与中框天线02之间的最小距离大于或等于8毫米。驱动电路013位于第二面板部0112远离第一面板部0111的一侧，且驱动电路013与显示面板011电连接。柔性电路板014位于第一面板部0111的背面，且柔性电路板014与第二面板部0112远离弯折面板部0113的一端电连接。如图2所示，驱动电路013在第一面板部0111上的正投影，柔性电路板014在第一面板部0111上的正投影，以及，吸波层012在第一面板部0111上的正投影不存在重叠。
在本公开实施例中，第一面板部0111与第二面板部0112可以平行，或者，第一面板部0111与第二面板部0112大致平行，例如，第一面板部0111与第二面板部0112的夹角小于5度。第一面板部0111的背面可以是第一面板部0111上靠近第二面板部0112的一面。
在本公开实施例中，吸波层012的边界与中框天线02之间的最小距离大于或等于8毫米，可选地，吸波层012的边界与中框天线02之间的最小距离大于或等于10毫米，吸波层012的材料可以是铁氧体、磁铁铁纳米材料、碳化硅和石墨烯聚合物中的一种或多种。本领域技术人员容易理解，驱动电路013在工作的过程中会产生干扰信号，该干扰信号会沿显示面板011传输，在本公开实施例中，当干扰信号传输至吸波层012所在位置时，吸波层012可以将干扰信号转换成热量发散，以将干扰信号吸收，因此可以避免干扰信号传输至中框天线02影响中框天线02的信号。示例地，请参考图3，其示出了本公开实施例提供的一种干扰信号沿显示面板011传输的示意图，干扰信号在沿显示面板011传输至吸波层012所在位置时，被吸波层012吸收从而无法继续传输。
可选地，请继续参考图1和图2，驱动电路013包括：数据选择器(英文：Multiplexer；简称：MUX)0131和显示集成电路(英文：Integrated Circuit；简称：IC)0132，MUX 0131和显示IC 0132均位于第二面板部0112远离第一面板部0111的一面上，显示IC 0132通过MUX 0131与显示面板011电连接。在本公开实施例中，MUX 0131可以是1：n的MUX，也即是MUX 0131中的每个输入端口对应n个输出端口，n＞1，且n为整数。MUX 0131的每个输入端口可以与显示IC 0132的一个输出端口连接，MUX 0131的每个输出端口可以与显示面板011的一条信号走线(例如数据线)连接，从而，对于同一显示集成电路，MUX的使用可以使该显示IC能够与更多的信号走线连接，因此，MUX的使用可以使显示模组的扇出区(也即是走线区)的面积更小。
示例地，请参考图4，其示出了本公开实施例提供的一种MUX 0131和显示IC 0132的连接示意图，该图4以显示IC 0132与两个MUX 0131(包括MUX 0131a和MUX 0131b)连接，且以每个MUX是1：2的MUX为例进行说明，如图4所示，显示IC 0132的两个输出端口(图4中未标出)与两个MUX的输入端口(图4中未标出)一一对应连接，MUX 0131a的每个输入端口对应两个输出端口，MUX 0131a的两个输出端口与信号走线D1和信号走线D2一一对应连接，MUX 0131b的每个输入端口对应两个输出端口，MUX 0131b的两个输出端口与信号走线D3和信号走线D4一一对应连接。其中，MUX的每个输出端口具有一个开关单元(图4中未示出)，MUX通过开关单元实现数据的选路。示例地，请参考图5，其示出了图4所示的一种MUX 0131a的选路示意图，当开关单元S1闭合，开关单元S2断开时，MUX 0131a使得显示IC 0132与信号走线D1导通，显示IC 0132与信号走线D2断开，因此MUX 0131a为显示IC 0132选路为信号走线D1。再示例地，请参考图6，其示出了图4所示的另一种MUX 0131a的选路示意图，当开关单元S1断开，开关单元S2闭合时，MUX 0131a使得显示IC 0132与信号走线D2导通，显示IC 0132与信号走线D1断开，因此MUX 0131a为显示IC 0132选路为信号走线D2。本领域技术人员容易理解，本公开实施例是以MUX 0131a选路为例进行说明的，MUX 0131b以及显示模组中的其余MUX的选路原理与此类似，本公开实施例在此不再赘述。
可选地，请继续参考图2，该显示模组01还包括屏蔽膜015，屏蔽膜015位于驱动电路013远离第一面板部0111的一侧，屏蔽膜015在第一面板部0111上的正投影覆盖驱动电路013在第一面板部0111上的正投影以及柔性电路板014在第一面板部0111上的正投影，屏蔽膜015在第一面板部0111上的正投影与吸波层012在第一面板部0111上的正投影不存在重叠。其中，屏蔽膜015可以对驱动电路013产生的干扰信号进行屏蔽，避免干扰信号传输至中框天线02影响中框天线02的信号。如图2所示，屏蔽膜015可以包括层叠设置的胶层0151和屏蔽层0152，屏蔽膜015通过胶层0151粘贴在驱动电路013远离第一面板部0111的一侧。可选地，胶层0151可以包括第一导电部a、第二导电部b以及除第一导电部a和第二导电部b之外的绝缘部c，第一导电部a与第二导电部b电连接(图2中未示出)，屏蔽层0152可以包括导电布、铜箔和铝箔中的一种或多种，例如，屏蔽层0152为导电布。
可选地，请继续参考图2，该显示模组01还包括散热膜016，该散热膜016位于第一面板部0111与第二面板部0112之间，以及第一面板部0111与柔性电路板014之间，且部分散热膜016与第二面板部0112和柔性电路板014接触。其中，散热膜016的材料可以为金属，例如，散热膜016为铜箔。在显示模组01工作的过程中，驱动电路013和柔性电路板014容易产生热量，散热膜016与第二面板部0112接触，可以使驱动电路013产生的热量通过第二面板部0112传导至散热膜016，以由散热膜016将热量从显示模组01散出，而柔性电路板014产生的热量可以直接传导至散热膜016，以由散热膜016将热量从显示模组01散出，因此散热膜016可以有效对显示模组01产生的热量进行散热。
可选地，请继续参考图2，该显示模组01还包括缓冲层017，缓冲层017位于散热膜016与第一面板部0111之间，且缓冲层017与吸波层012同层分布。缓冲层017可以为泡棉层，缓冲层017可以对散热膜016等结构进行缓冲，降低散热膜016等结构的应力。
可选地，在本公开实施例中，柔性电路板014可以具有两端，柔性电路板014的一端(图1和图2均未标出)与第二面板部0112远离弯折面板部0113的一端电连接，另一端E(如图1所示，图2中未示出)被配置为与客户端主板(图1和图2均未示出)电连接，如图2所示，柔性电路板014包括层叠设置的导电层0141和绝缘层0142，导电层0141可以为铜层，绝缘层0142具有开口(图1和图2中均未标出)，部分导电层0142通过该开口露出。在屏蔽膜015中，胶层0151包括第一导电部a、第二导电部b以及除第一导电部a和第二导电部b之外的绝缘部c，第一导电部a与第二导电部b电连接(图2中未示出)，第一导电部a在第一面板部0111上的正投影与柔性电路板014的开口在第一面板部0111上的正投影存在重叠，第二导电部b在第一面板部0111上的正投影与散热膜016中未与柔性电路板014和第二面板部0112接触的部分存在重叠；屏蔽膜015通过第一导电部a与柔性电路板014电连接，屏蔽膜015通过第二导电部b与散热膜016电连接，且屏蔽膜015接地。在本公开实施例中，第一导电部a在第一面板部0111上的正投影可以覆盖柔性电路板014的开口在第一面板部0111上的正投影，这样一来，可以便于第一导电部a与导电层0141充分接触，从而保证屏蔽膜016与柔性电路板014的有效连接。
在本公开实施例中，中框天线02可以用于发射电磁波信号以及接收电磁波 信号，且中框天线02可以具有不同的形态。本公开实施例以三种不同形态的中框天线02为例进行说明。
第一种形态的中框天线：示例地，请参考图1，中框天线02包括上天线021、下天线022和侧天线023，上天线021的结构与下天线022的结构可以相同。该上天线021可以呈U形结构，该上天线021包括底边0211和位于底边0211两端的两个侧边0212，该上天线021位于显示模组01的顶部，且该上天线021的底边0211沿显示模组01的顶边(图1中未标出)延伸，该上天线021的两个侧边0212沿显示模组01的两个侧边(图1中未标出)延伸。该下天线022可以呈U形结构，该下天线022包括底边0221和位于底边0221两端的两个侧边0222，该下天线022位于显示模组01的底部，且该下天线022的底边0221沿显示模组01的底边(图1中未标出)延伸，该下天线022的两个侧边0222沿显示模组01的两个侧边(图1中未标出)延伸。侧天线023可以呈直线形结构，该侧天线023沿显示模组01的侧边延伸，且该侧天线023位于上天线021与下天线022之间。其中，吸波层012的边界与上天线021之间的最小距离d1，以及吸波层012的边界与侧天线023之间的最小距离d3均可以大于或等于8毫米，且吸波层012的边界与上天线012之间的最小距离d1等于吸波层012的边界与侧天线023之间的最小距离d3，吸波层012的边界与下天线022之间的最小距离d2可以大于8毫米。
第二种形态的中框天线：示例地，请参考图7，图7示出了本公开实施例提供的另一种显示装置0的正视结构示意图，如图7所示，中框天线02可以包括上天线021和下天线022，该上天线021可以呈L形结构，且该上天线021包括第一边0211和第二边0212，第一边0211的长度大于第二边0212的长度，该上天线021位于显示模组01的顶部，第一边0212沿显示模组01的顶边(图7中未标出)延伸，第二边0212沿显示模组01的一个侧边(图7中未标出)延伸。该下天线022可以呈U形结构，且该下天线022包括底边0221和位于底边0221两端的两个侧边0222，该下天线022位于显示模组01的底部，且该下天线022的底边0221沿显示模组01的底边(图7中未标出)延伸，该下天线022的两个侧边0222沿显示模组01的两个侧边(图7中未标出)延伸。其中，吸波层012可以呈L形，吸波层012的边界与上天线021之间的最小距离d1可以大于或等于8毫米，吸波层012的边界与下天线022之间的最小距离d2可以大于8 毫米。
第三种形态的中框天线：示例地，请参考图8，图8示出了本公开实施例提供的再一种显示装置0的正视结构示意图，如图8所示，中框天线02可以包括两个上天线021和下天线022，上天线021可以呈直线形结构，两个上天线021位于显示模组01的顶部，且该两个上天线021分别沿显示模组01的两个侧边(图8中未标出)延伸。下天线022可以呈U形结构，该下天线022包括底边0221和位于底边0221的两端的两个侧边0222，该下天线022位于显示模组01的底部，且该下天线022的底边0221沿显示模组01的底边(图8中未标出)延伸，该下天线022的两个侧边0222沿显示模组01的两个侧边(图8中未标出)延伸。其中，吸波层012可以呈T形，吸波层012的边界与上天线021之间的最小距离d1可以大于或等于8毫米，吸波层012的边界与下天线022之间的最小距离d2可以大于8毫米。
值得说明的是，本公开实施例所描述的上述三种形态的中框天线02仅仅是示例性的，本领域技术人员容易理解，中框天线的形态并不局限于上述三种形态，中框天线的形态可以根据实际需求进行调整和改变，本公开实施例对此不作限定。
可选地，在本公开实施例中，中框天线02的端点与吸波层012的端点之间的最小距离可以大于或等于10毫米。其中，吸波层012的形状可以是多边形，吸波层012的端点可以是吸波层012的角所在点，本公开实施例对此不作限定。
可选地，在本公开实施例中，中框天线02与显示模组01的边缘之间的距离约为0.5毫米。例如，如图1、图7和图8所示，上天线021与显示模组01的边缘之间的距离g1，下天线022与显示模组01的边缘之间的距离g2均约为0.5毫米，如图1所示，侧天线023与显示模组01的边缘之间的距离g3约为0.5毫米。其中，中框天线02与显示模组01的边缘之间的距离约为0.5毫米可以是中框天线02与显示模组01的边缘之间的距离与0.5毫米的差值小于预设阈值，该预设阈值例如0.2毫米，0.1毫米等等，示例地，中框天线02与显示模组01的边缘之间的距离为0.51毫米、0.52毫米、0.49毫米、0.48毫米等等，本公开实施例对此不作限定。
可选地，在本公开实施例中，该显示装置0可以是移动终端。例如该显示装置0可以是智能手机、平板电脑等移动终端。
本领域技术人员容易理解，为了便于读者观看，图1、图7和图8以虚线的方式绘制除了位于最上层(例如屏蔽层)下方的结构(例如，吸波层等结构)，该图1、图7和图8并不能代表显示模组中各个结构的实际层级关系，显示模组中各个结构的实际层级关系应以剖视图(例如图3)中的层级关系为准，本公开实施例在此不再赘述。
综上所述，本公开实施例提供的显示装置，该显示装置包括显示模组和中框天线，显示模组包括吸波层和驱动电路，吸波层可以对驱动电路产生的干扰信号进行吸收，因此可以降低干扰信号对显示装置的显示信号的影响；此外，吸波层的边界与中框天线之间的最小距离大于或等于8毫米，因此可以避免吸波层对中框天线的信号的干扰。进一步地，显示模组还包括屏蔽膜，屏蔽膜可以对驱动电路产生的干扰信号进行屏蔽，降低干扰信号对显示模组的显示信号的影响。
请参考图9，其示出了本公开实施例提供的一种显示模组11的剖视结构示意图，参见图9，该显示模组11包括显示面板111、驱动电路112、柔性电路板113和屏蔽膜114。显示面板111包括第一面板部1111、第二面板部1112以及连接第一面板部1111和第二面板部1112的弯折面板部1113，第二面板部1112位于第一面板部1111的背面，第一面板部1111与第二面板部1112可以平行，或者，第一面板部1111与第二面板部1112大致平行，例如，第一面板部1111与第二面板部1112的夹角小于5度，第一面板部1111的背面可以是第一面板部1111上靠近第二面板部1112的一面。驱动电路112位于第二面板部1112远离第一面板部1111的一侧，且驱动电路112与显示面板111电连接。柔性电路板113位于第一面板部1111的背面，且柔性电路板113与第二面板部1112远离弯折面板部1113的一端电连接。屏蔽膜114位于驱动电路112远离第一面板部1111的一侧，屏蔽膜114在第一面板部1111上的正投影覆盖驱动电路112在第一面板部1111上的正投影以及柔性电路板113在第一面板部1111上的正投影。
如图9所示，驱动电路112包括MUX 1121和显示IC 1122，MUX 1121和显示IC 1122均位于第二面板部1112远离第一面板部1111的一面上，显示IC 1122通过MUX 1121与显示面板111电连接。其中，MUX 1121和显示IC 1122的连接关系以及MUX 1121的选路原理可以参考上述显示装置实施例，本公开 实施例在此不再赘述。
如图9所示，柔性电路板113可以具有两端，柔性电路板113的一端(图9中未标出)与第二面板部1112远离弯折面板部1113的一端电连接，另一端E(图9中未示出)被配置为与客户端主板(图9中未示出)电连接，如图9所示，该柔性电路板113包括层叠设置的导电层1131和绝缘层1132，导电层1131可以为铜层，绝缘层1132具有开口(图9中未标出)，部分导电层1131通过该开口露出。屏蔽膜114可以包括层叠设置的胶层1141和屏蔽层1142，屏蔽膜114通过胶层1141粘贴在驱动电路112远离第一面板部1111的一侧，屏蔽层1142包括导电布、铜箔和铝箔中的一种或多种，胶层1141包括第一导电部x和绝缘部y，第一导电部x在第一面板部1111上的正投影与柔性电路板113的开口在第一面板部1111上的正投影存在重叠，且屏蔽膜114接地。在本公开实施例中，第一导电部x在第一面板部1111上的正投影可以覆盖柔性电路板113的开口在第一面板部1111上的正投影，这样一来，可以便于第一导电部x与导电层1131充分接触，从而保证屏蔽膜114与柔性电路板113的有效连接。
可选地，请继续参考图9，该显示模组11还包括散热膜115，该散热膜115位于第一面板部1111与第二面板部0112之间，以及第一面板部1111与柔性电路板113之间，且部分散热膜115与第二面板部0112和柔性电路板113接触。在屏蔽膜114中，胶层1141还包括第二导电部z，第一导电部x与第二导电部z电连接(图9中未示出)，第二导电部z在第一面板部1111上的正投影与散热膜115中未与柔性电路板113和第二面板部1112接触的部分存在重叠，屏蔽膜114通过第二导电部z与散热膜115电连接。其中，散热膜115的材料可以为金属，例如，散热膜115为铜箔。在显示模组11工作的过程中，驱动电路112和柔性电路板113容易产生热量，散热膜115与第二面板部1112接触，可以使驱动电路113产生的热量通过第二面板部1112传导至散热膜115，以由散热膜115将热量从显示模组11散出，而柔性电路板113产生的热量可以直接传导至散热膜115，以由散热膜115将热量从显示模组11散出，因此散热膜115可以有效对显示模组11产生的热量进行散热。
可选地，请继续参考图9，该显示模组11还包括缓冲层116，缓冲层116位于散热膜115与第一面板部1111之间，缓冲层116可以为泡棉层，缓冲层116可以对散热膜115等结构进行缓冲，降低散热膜115等结构的应力。
综上所述，本公开实施例提供的显示模组，显示模组包括屏蔽膜和驱动电路，屏蔽膜可以对驱动电路产生的干扰信号进行屏蔽，因此可以降低干扰信号对显示模组的显示信号的影响。
请参考图10，其示出了本公开提供的一种显示装置的制造方法的方法流程图，该显示装置的制造方法可以用于制造图1、图7或图8所示的显示装置0，参见图10，该方法包括以下几个步骤：
在步骤101中，制造中框天线。
在本公开实施例中，中框天线可以具有不同的形态。例如，如图1所示，中框天线02包括上天线021、下天线022和侧天线023，该上天线021呈U形结构，该上天线021包括底边0211和位于底边两端的两个侧边0212，下天线022呈U形结构，该下天线022包括底边0221和位于底边0221两端的两个侧边0222，该侧天线023呈直线结构。或者，如图7所示，中框天线02包括上天线021和下天线022，上天线021呈L形结构，且该上天线021包括第一边0211和第二边0212，第一边0211的长度大于第二边0212的长度，下天线022呈U形结构，且该下天线022包括底边0221和位于底边两端的两个侧边0222。或者，如图8所示，中框天线02包括两个上天线021和下天线022，上天线021呈直线形结构，下天线022呈U形结构，该下天线022包括底边0221和位于底边0221的两端的两个侧边0222。
其中，中框天线的材料可以是金属材料或者合金材料，例如，中框天线的材料可以是铝合金材料。可选地，可以通过金属成型工艺制造中框天线。示例地，可以通过金属成型工艺制造图1、图7或图8所示的中框天线02。
在步骤102中，制造显示面板，显示面板包括第一面板部、第二面板部以及连接第一面板部和第二面板部的连接面板部。
其中，显示面板可以为柔性显示面板，以便可以沿着连接面板部将显示面板弯折，使第二面板部位于第一面板部的背面。
可选地，显示面板可以为有机发光二极管(英文：Organic Light-Emitting Diode；简称：OLED)显示面板或量子点发光二极管(英文：Quantum Dot Light Emitting Diodes；简称：QLED)显示面板。
在步骤103中，制造驱动电路，驱动电路包括数据选择器和显示集成电路。
其中，数据选择器可以是1：n的MUX，也即是MUX中的每个输入端口对应n个输出端口，n＞1，且n为整数，例如，数据选择器可以是1：2的MUX。
显示集成电路可以是显示集成IC。在本公开实施例中，可以通过电路制备工艺制造数据选择器和显示集成电路，从而制造驱动电路。
在步骤104中，制造柔性电路板，柔性电路板包括层叠设置的导电层和绝缘层，绝缘层具有开口，部分导电层通过开口露出。
其中，导电层的材料可以是金属材料或者合金材料，例如，导电层的材料可以是铜、铝或钼中的一种，或者，导电层的材料也可以是铜、铝或钼中的至少两者的合金材料。绝缘层的材料可以为SiO 2(中文：二氧化硅)、SiOx(中文：氧化硅)、SiNx(中文：氮化硅)、Al 2O 3(中文：氧化铝)或SiOxNx(中文：氮氧化硅)中的一种或者多种的组合。
示例地，以导电层的材料为铜，绝缘层的材料为SiO 2为例，可以通过溅射或热蒸发等工艺中的任一种形成金属铜材质层，通过一次构图工艺对金属铜材质层进行处理，得到导电层，接着以SiO 2为材料，通过沉积、涂敷或溅射等工艺中的任一种在导电层上形成SiO 2材质层，对SiO 2材质层进行处理得到具有开口的绝缘层，从而得到柔性电路板。
在步骤105中，制造缓冲层。
可选地，缓冲层可以为泡棉层。
在步骤106中，制造散热膜。
其中，散热膜的材料可以为金属，例如，散热膜可以为铜箔。
可选地，可以以金属铜为材料，通过成膜工艺制造散热膜。
在步骤107中，制造屏蔽膜，屏蔽膜包括层叠设置的胶层和屏蔽层，胶层包括第一导电部、第二导电部以及除第一导电部和第二导电部之外的绝缘部，第一导电部与第二导电部电连接。
其中，屏蔽层可以包括导电布、铜箔和铝箔中的一种或多种，例如，屏蔽层为导电布，胶层包括第一导电部、第二导电部以及除第一导电部和第二导电部之外的绝缘部，第一导电部与第二导电部电连接。
可选地，首先，可以使用导电胶在衬底基板上形成第一导电部和第二导电部，并使用绝缘胶在衬底基板上形成绝缘部，使第一导电部和第二导电部电连接，从而得到胶层，然后，在胶层上形成导电布、铜箔和铝箔中的一种或多种， 得到屏蔽层，最后剥离衬底基板，得到屏蔽膜。
在步骤108中，在第一面板部的背面形成吸波层。
在本公开实施例中，根据中框天线的形态的不同，吸波层的形状也可以不同。例如，如图1所示，吸波层012呈不规则多边形。或者，如图7所示，吸波层012呈L形。或者，如图8所示，吸波层012呈T形。
其中，吸波层的材料可以包括：铁氧体、磁铁铁纳米材料、碳化硅和石墨烯聚合物中的一种或多种。
可选地，可以通过沉积、涂敷或溅射等工艺中的任一种在第一面板部的背面形成铁氧体材质层，通过一次构图工艺对铁氧体材质层进行处理得到吸波层。示例地，通过一次构图工艺对铁氧体材质层进行处理得到图1、图7或图8所示的吸波层012。
在步骤109中，将缓冲层设置在第一面板部的背面，使缓冲层与吸波层同层分布。
可选地，可以采用光学胶将缓冲层粘贴在第一面板部的背面，使得缓冲层与吸波层同层分布。
在步骤110中，将散热膜设置在缓冲层和吸波层远离第一面板部的一侧。
可选地，可以采用光学胶将散热膜粘贴在缓冲层和吸波层远离第一面板部的一侧，散热膜在第一面板部上的正投影覆盖缓冲层在第一面板部上的正投影和吸波层在第一面板部上的正投影。
在步骤111中，将驱动电路设置在第二面板部远离第一面板部的背面的一面上，使显示集成电路通过数据选择器与显示面板电连接。
可选地，可以将MUX与显示面板电连接，并将显示IC与MUX电连接，然后将显示IC与MUX粘贴在第二面板部远离第一面板部的背面的一面上。其中，MUX与显示面板的连接关系以及显示IC与MUX的连接关系可以参考图4至图6，本公开实施例在此不再赘述。
在步骤112中，将柔性电路板的一端与第二面板部远离第一面板部的一端电连接，使柔性电路板的导电层靠近第一面板部的背面。
可选地，柔性电路板的一端和第二面板部远离第一面板部的一端均可以设置有金手指，柔性电路板的一端与第二面板部远离第一面板部的一端通过金手指绑定，使得柔性电路板的一端与第二面板部远离第一面板部的一端电连接， 且使柔性电路板的导电层靠近第一面板部的背面。
在步骤113中，沿连接面板部将第二面板部折弯至第一面板部的背面。
可选地，可以沿连接面板部将第二面板部折弯至第一面板部的背面，使驱动电路位于第二面板部远离第一面板部的一侧，柔性电路板位于第一面板部的背面，吸波层和缓冲层位于第一面板部和第二面板部之间，散热膜位于第一面板部与第二面板部之间，以及第一面板部与柔性电路板之间，部分散热膜与第二面板部和柔性电路板接触，驱动电路在第一面板部上的正投影，柔性电路板在第一面板部上的正投影，以及，吸波层在第一面板部上的正投影不存在重叠。
在步骤114中，将屏蔽膜设置在驱动电路远离第一面板部的一侧，得到显示模组。
可选地，可以采用粘贴工艺，通过屏蔽膜的胶层将屏蔽膜粘贴在驱动电路远离第一面板部的一侧，使屏蔽膜的胶层中的第一导电部在第一面板部上的正投影与柔性电路板的开口在第一面板部上的正投影存在重叠，第二导电部在第一面板部上的正投影与散热膜中未与柔性电路板和第二面板部接触的部分存在重叠，屏蔽膜通过第一导电部与柔性电路板电连接，屏蔽膜通过第二导电部与散热膜电连接，屏蔽膜接地，屏蔽膜在第一面板部上的正投影覆盖驱动电路在第一面板部上的正投影以及柔性电路板在第一面板部上的正投影，屏蔽膜在第一面板部上的正投影与吸波层在第一面板部上的正投影不存在重叠。
在步骤115中，将中框天线设置在显示模组的周围，使吸波层的边界与中框天线之间的最小距离大于或等于8毫米。
示例地，如图1所示，可以将中框天线02设置在显示模组01的周围，使
上天线021位于显示模组01的顶部，且该上天线021的底边0211沿显示模组02的顶边延伸，上天线021的两个侧边0212沿显示模组01的两个侧边延伸，该下天线022位于显示模组01的底部，下天线022的底边0221沿显示模组01的底边延伸，该下天线022的两个侧边0222沿显示模组01的两个侧边延伸，侧天线023沿显示模组01的侧边延伸，且侧天线023位于上天线021与下天线022之间，且吸波层012的边界与上天线021之间的最小距离d1，以及吸波层012的边界与侧天线023之间的最小距离d3均可以大于或等于8毫米，且吸波层012的边界与上天线012之间的最小距离d1等于吸波层012的边界与侧天线023之间的最小距离d3，吸波层012的边界与下天线022之间的最小距离 d2可以大于8毫米。
示例地，如图7所示，可以将中框天线02设置在显示模组01的周围，使上天线021位于显示模组01的顶部，上天线021的第一边0212沿显示模组01的顶边延伸，第二边0212沿显示模组01的一个侧边延伸，下天线022位于显示模组01的底部，且该下天线022的底边0221沿显示模组01的底边延伸，该下天线022的两个侧边0222沿显示模组01的两个侧边延伸，且吸波层012的边界与上天线021之间的最小距离d1可以大于或等于8毫米，吸波层012的边界与下天线022之间的最小距离d2可以大于8毫米。
示例地，如图8所示，可以将中框天线02设置在显示模组01的周围，使两个上天线021位于显示模组01的顶部，且该两个上天线021分别沿显示模组01的两个侧边延伸，该下天线022位于显示模组01的底部，且该下天线022的底边0221沿显示模组01的底边延伸，该下天线022的两个侧边0222沿显示模组01的两个侧边延伸，且吸波层012的边界与上天线021之间的最小距离d1可以大于或等于8毫米，吸波层012的边界与下天线022之间的最小距离d2可以大于8毫米。
值得说明的是，在上述设置中框天线的过程中，可以使中框天线与显示模组的边缘之间的距离约为0.5毫米。例如，使中框天线与显示模组的边缘之间的距离为0.51毫米、0.52毫米、0.49毫米、0.48毫米等等，本公开实施例对此不作限定。
综上所述，本公开实施例提供的显示装置的制造方法，使用该显示装置的制造方法制造的显示装置包括显示模组和中框天线，显示模组包括吸波层和驱动电路，吸波层可以对驱动电路产生的干扰信号进行吸收，因此可以降低干扰信号对显示装置的显示信号的影响；此外，吸波层的边界与中框天线之间的最小距离大于或等于8毫米，因此可以避免吸波层对中框天线的信号的干扰。进一步地，显示模组还包括屏蔽膜，屏蔽膜可以对驱动电路产生的干扰信号进行屏蔽，降低干扰信号对显示模组的显示信号的影响。
本公开实施例提供的显示基板的制造方法中，所涉及的一次构图工艺包括光刻胶涂覆、曝光、显影、刻蚀和光刻胶剥离，通过一次构图工艺对材质层(例如金属铜材质层)进行处理包括：首先，在材质层(例如金属铜材质层)上涂 覆一层光刻胶形成光刻胶层，接着，采用掩膜版对光刻胶层进行曝光，使得光刻胶层形成完全曝光区和非曝光区，然后，采用显影工艺处理，使完全曝光区的光刻胶被完全去除，非曝光区的光刻胶全部保留，之后，采用刻蚀工艺对材质层(例如金属铜材质层)上完全曝光区对应的区域进行刻蚀，最后，剥离非曝光区的光刻胶得到相应的结构(例如导电层)。这里是以光刻胶为正性光刻胶为例进行说明的，当光刻胶为负性光刻胶时，一次构图工艺的过程可以参考本段的描述，本公开实施例在此不再赘述。
以上所述仅为本公开的可选实施例，并不用以限制本公开，凡在本公开的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本公开的保护范围之内。

Claims (21)

  1. 一种显示装置，包括：
    显示模组和中框天线，所述中框天线位于所述显示模组的周围；
    所述显示模组包括：
    显示面板，包括第一面板部、第二面板部以及连接所述第一面板部和所述第二面板部的弯折面板部，所述第二面板部位于所述第一面板部的背面；
    吸波层，位于所述第一面板部与所述第二面板部之间，所述吸波层的边界与所述中框天线之间的最小距离大于或等于8毫米；
    驱动电路，位于所述第二面板部远离所述第一面板部的一侧，且与所述显示面板电连接；
    柔性电路板，位于所述第一面板部的背面，且与所述第二面板部远离所述弯折面板部的一端电连接；
    其中，所述驱动电路在所述第一面板部上的正投影，所述柔性电路板在所述第一面板部上的正投影，以及，所述吸波层在所述第一面板部上的正投影不存在重叠。
  2. 根据权利要求1所述的显示装置，其中，
    所述驱动电路包括：数据选择器和显示集成电路，所述数据选择器和所述显示集成电路均位于所述第二面板部远离所述第一面板部的一面上，所述显示集成电路通过所述数据选择器与所述显示面板电连接。
  3. 根据权利要求1或2所述的显示装置，其中，
    所述显示模组还包括：屏蔽膜，位于所述驱动电路远离所述第一面板部的一侧，所述屏蔽膜在所述第一面板部上的正投影覆盖所述驱动电路在所述第一面板部上的正投影以及所述柔性电路板在所述第一面板部上的正投影，所述屏蔽膜在所述第一面板部上的正投影与所述吸波层在所述第一面板部上的正投影不存在重叠。
  4. 根据权利要求3所述的显示装置，其中，
    所述屏蔽膜包括层叠设置的胶层和屏蔽层，所述屏蔽膜通过所述胶层粘贴 在所述驱动电路远离所述第一面板部的一侧。
  5. 根据权利要求4所述的显示装置，其中，
    所述屏蔽层包括导电布、铜箔和铝箔中的一种或多种。
  6. 根据权利要求4或5所述的显示装置，其中，
    所述显示模组还包括：散热膜，位于所述第一面板部与所述第二面板部之间，以及所述第一面板部与所述柔性电路板之间，且部分所述散热膜与所述第二面板部和所述柔性电路板接触。
  7. 根据权利要求6所述的显示装置，其中，
    所述散热膜的材料为金属。
  8. 根据权利要求7所述的显示装置，其中，
    所述散热膜为铜箔。
  9. 根据权利要求6至8任一所述的显示装置，其中，
    所述柔性电路板的一端与所述第二面板部远离所述弯折面板部的一端电连接，另一端被配置为与客户端主板电连接，所述柔性电路板包括层叠设置的导电层和绝缘层，所述绝缘层具有开口，部分所述导电层通过所述开口露出；
    在所述屏蔽膜中，所述胶层包括第一导电部、第二导电部以及除所述第一导电部和所述第二导电部之外的绝缘部，所述第一导电部与所述第二导电部电连接，所述第一导电部在所述第一面板部上的正投影与所述开口在所述第一面板部上的正投影存在重叠，所述第二导电部在所述第一面板部上的正投影与所述散热膜中未与所述柔性电路板和所述第二面板部接触的部分存在重叠；
    所述屏蔽膜通过所述第一导电部与所述柔性电路板电连接，所述屏蔽膜通过所述第二导电部与所述散热膜电连接，所述屏蔽膜接地。
  10. 根据权利要求6至9任一所述的显示装置，其中，
    所述显示模组还包括：缓冲层，位于所述散热膜与所述第一面板部之间， 且与所述吸波层同层分布。
  11. 根据权利要求10所述的显示装置，其中，
    所述缓冲层为泡棉层。
  12. 根据权利要求1至11任一所述的显示装置，其中，
    所述吸波层的边界与所述中框天线之间的最小距离大于或等于10毫米。
  13. 根据权利要求1至12任一所述的显示装置，其中，
    所述吸波层的材料包括：铁氧体、磁铁铁纳米材料、碳化硅和石墨烯聚合物中的一种或多种。
  14. 根据权利要求1至13任一所述的显示装置，其中，
    所述中框天线的端点与所述吸波层的端点之间的最小距离大于或等于10毫米。
  15. 根据权利要求1至14任一所述的显示装置，其中，
    所述中框天线与所述显示模组的边缘之间的距离约为0.5毫米。
  16. 根据权利要求1至15任一所述的显示装置，其中，
    所述中框天线包括上天线、下天线和侧天线，所述上天线的结构与所述下天线的结构相同；
    所述上天线呈U形结构，包括底边和位于所述底边两端的两个侧边；
    所述上天线位于所述显示模组的顶部，所述上天线的底边沿所述显示模组的顶边延伸，所述上天线的两个侧边沿所述显示模组的两个侧边延伸；
    所述下天线位于所述显示模组的底部，所述下天线的底边沿所述显示模组的底边延伸，所述下天线的两个侧边沿所述显示模组的两个侧边延伸；
    所述侧天线呈直线形结构，所述侧天线沿所述显示模组的侧边延伸，且所述侧天线位于所述上天线与所述下天线之间；
    所述吸波层的边界与所述上天线之间的最小距离以及所述吸波层的边界与 所述侧天线之间的最小距离均大于或等于8毫米，所述吸波层的边界与所述下天线之间的最小距离大于8毫米。
  17. 根据权利要求16所述的显示装置，其中，
    所述吸波层的边界与所述上天线之间的最小距离等于所述吸波层的边界与所述侧天线之间的最小距离。
  18. 根据权利要求1至15任一所述的显示装置，其中，
    所述中框天线包括上天线和下天线；
    所述上天线呈L形结构，包括第一边和第二边，所述第一边的长度大于所述第二边的长度；
    所述下天线呈U形结构，包括底边和位于所述底边两端的两个侧边；
    所述上天线位于所述显示模组的顶部，所述第一边沿所述显示模组的顶边延伸，所述第二边沿所述显示模组的一个侧边延伸；
    所述下天线位于所述显示模组的底部，所述下天线的底边沿所述显示模组的底边延伸，所述下天线的两个侧边沿所述显示模组的两个侧边延伸；
    所述吸波层呈L形，所述吸波层的边界与所述上天线之间的最小距离大于或等于8毫米，所述吸波层的边界与所述下天线之间的最小距离大于8毫米。
  19. 根据权利要求1至15任一所述的显示装置，其中，
    所述中框天线包括下天线和两个上天线；
    所述上天线呈直线形结构；
    所述下天线呈U形结构，包括底边位于所述底边的两端的两个侧边；
    所述两个上天线位于所述显示模组的顶部，分别沿所述显示模组的两个侧边延伸；
    所述下天线位于所述显示模组的底部，所述下天线的底边沿所述显示模组的底边延伸，所述下天线的两个侧边沿所述显示模组的两个侧边延伸；
    所述吸波层呈T形，所述吸波层的边界与所述上天线之间的最小距离大于或等于8毫米，所述吸波层的边界与所述下天线之间的最小距离大于8毫米。
  20. 根据权利要求1至19任一所述的显示装置，其中，所述显示装置为移动终端。
  21. 一种显示模组，包括：
    显示面板，包括第一面板部、第二面板部以及连接所述第一面板部和所述第二面板部的弯折面板部，所述第二面板部位于所述第一面板部的背面；
    驱动电路，包括数据选择器和显示集成电路，所述数据选择器和所述显示集成电路均位于所述第二面板部远离所述第一面板部的一面上，所述显示集成电路通过所述数据选择器与所述显示面板电连接；
    柔性电路板，位于所述第一面板部的背面，所述柔性电路板的一端与所述第二面板部远离所述弯折面板部的一端电连接，另一端被配置为与客户端主板电连接；
    屏蔽膜，包括层叠设置的胶层和屏蔽层，所述屏蔽膜通过所述胶层粘贴在所述驱动电路远离所述第一面板部的一侧，所述屏蔽膜在所述第一面板部上的正投影覆盖所述驱动电路在所述第一面板部上的正投影以及所述柔性电路板在所述第一面板部上的正投影；
    其中，所述柔性电路板包括层叠设置的导电层和绝缘层，所述绝缘层具有开口，部分所述导电层通过所述开口露出，所述胶层包括导电部和绝缘部，所述导电部在所述第一面板部上的正投影与所述开口在所述第一面板部上的正投影存在重叠，所述屏蔽膜接地。
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