WO2021014681A1

WO2021014681A1 - Electronic circuit module

Info

Publication number: WO2021014681A1
Application number: PCT/JP2020/011502
Authority: WO
Inventors: 佐藤　弘幸
Original assignee: アルプスアルパイン株式会社
Priority date: 2019-07-22
Filing date: 2020-03-16
Publication date: 2021-01-28
Also published as: JP2022133484A

Abstract

An electronic circuit module according to the present invention is provided with a circuit board having a mounting surface on which an electronic component is mounted and a rear surface on which an external connection terminal is provided. The circuit board has: a front-layer ground electrode that is provided on the mounting surface and that has a plurality of front-layer ground patterns; a rear-surface ground electrode that is provided on the rear surface and that has a plurality of rear-surface ground patterns; and a plurality of heat-dissipating vias for connecting the front-layer ground electrode and the rear-surface ground electrode. In a prescribed region of the circuit board in which the front-layer ground electrode and the rear-surface ground electrode overlap each other, each of the plurality of front-layer ground patterns and each of the plurality of rear-surface ground patterns are disposed at mutually overlapping positions. Each of the plurality of heat-dissipating vias is disposed at a position avoiding the front-layer ground patterns and the rear-surface ground patterns.

Description

Electronic circuit module

The present invention relates to an electronic circuit module.

Conventionally, in an electronic circuit module used for a communication device or the like, heat is dissipated from a surface grounding electrode provided on a mounting surface of a circuit board and a back grounding electrode provided on the back surface (a surface facing the mounting surface) of the circuit board. A technique has been devised in which heat generated from an electronic component can be dissipated to the back side of a circuit board by connecting with a via (for example, see Patent Documents 1 and 2 below).

Japanese Unexamined Patent Publication No. 2005-210044 Japanese Unexamined Patent Publication No. 2010-021456

However, when the surface grounding electrode is provided with the surface grounding pattern (land for soldering) and the back grounding electrode is provided with the back grounding pattern (land for soldering), the position where the surface grounding pattern and the back grounding pattern overlap. If a heat radiating via is provided on the ground, voids may occur due to the outflow of gas from the heat radiating via during soldering. Therefore, a method of suppressing the generation of voids can be considered by forming a heat dissipation via at a position avoiding the surface grounding pattern and the back grounding pattern. However, conventionally, since the surface ground pattern and the back ground pattern are arranged independently of each other, the area where the heat dissipation via can be arranged (that is, the area where the surface ground pattern and the back ground pattern are avoided) is relatively small. The heat dissipation via cannot be arranged efficiently.

Therefore, the inventors of the present invention have found the need for a technique capable of efficiently arranging heat dissipation vias while suppressing the generation of voids.

The electronic circuit module of one embodiment is an electronic circuit module including a circuit board having a mounting surface on which electronic components are mounted and a back surface provided with external connection terminals, and the circuit board is provided on the mounting surface. , A surface ground electrode having a plurality of surface ground patterns, a back ground electrode provided on the back surface having a plurality of back ground patterns, and a plurality of heat dissipation vias connecting the surface ground electrode and the back ground electrode. However, in a predetermined region where the surface ground electrode and the back ground electrode of the circuit board overlap, each of the plurality of surface ground patterns and each of the plurality of back ground patterns are arranged at positions where they overlap each other, and a plurality of them. Each of the heat radiating vias is arranged at a position avoiding the surface grounding pattern and the back grounding pattern.

According to one embodiment, heat dissipation vias can be efficiently arranged while suppressing the generation of voids.

External perspective view of the electronic circuit module according to one embodiment External perspective view of the electronic circuit module according to one embodiment The figure which shows the structure of the IC provided in the electronic circuit module which concerns on one Embodiment. Top view of the electronic circuit module according to one embodiment AA sectional view of the electronic circuit module shown in FIG. Top view of the circuit board (state in which the heat dissipation via is not formed) included in the electronic circuit module according to the embodiment. Bottom view of the circuit board (state in which heat dissipation vias are not formed) included in the electronic circuit module according to the embodiment. Top view of the circuit board (state in which the heat dissipation via is not formed) included in the electronic circuit module according to the embodiment. Top view of the circuit board (state in which heat dissipation vias are formed) included in the electronic circuit module according to the embodiment. A plan view showing a modification of the circuit board included in the electronic circuit module according to the embodiment.

[One Embodiment]
Hereinafter, one embodiment will be described with reference to the drawings. In the following description, in order to explain the features of the present invention in an easy-to-understand manner, the description will proceed with the side with the mounting surface of the circuit board as the upper side and the side with the back surface as the lower side for convenience. The direction in which the circuit module is used is not limited, and the circuit module may be used upside down, sideways, or tilted at an angle. Further, in the following description, "the two parts overlap in a plan view from above" may be simply referred to as "the two parts overlap".

(Rough configuration of electronic circuit module 100)
1 and 2 are external perspective views of the electronic circuit module 100 according to the embodiment. The electronic circuit module 100 shown in FIGS. 1 and 2 can be mounted on various electric products to have a specific function (for example, LTE (Long Term Evolution) (registered trademark)) by the electronic circuit included in the electronic circuit module 100. , Bluetooth (registered trademark), Wi-Fi (registered trademark), and other wireless communication functions).

As shown in FIGS. 1 and 2, the electronic circuit module 100 has a thin rectangular parallelepiped shape as a whole. The electronic circuit module 100 includes a circuit board 110, an IC (Integrated Circuit) 120, and a metal cover 130. FIG. 1 shows an electronic circuit module 100 with a metal cover 130 attached to a circuit board 110. FIG. 2 shows an electronic circuit module 100 in a state where the metal cover 130 is not attached to the circuit board 110.

The circuit board 110 is a flat plate-shaped and rectangular member. The surface of the circuit board 110 is a mounting surface 110A on which various electronic components are mounted. As the circuit board 110, for example, a PWB (Printed Wiring Board) is used.

In the present embodiment, the IC 120 is used as an example of the electronic components mounted on the mounting surface 110A, but the present invention is not limited to this, and other electronic components, wiring patterns, and the like can be mounted on the mounting surface 110A.

As shown in FIG. 2, the outer surface layer ground electrode 115 is provided on the mounting surface 110A. The outer surface layer ground electrode 115 is a thin-film electrode formed in an annular shape along the outer peripheral portion of the mounting surface 110A. A metal cover 130 is fixed to the outer surface ground electrode 115 by soldering. For example, the outer surface layer ground electrode 115 is formed by using various conductive films (for example, a copper film).

The IC 120 is a main component included in the electronic circuit of the electronic circuit module 100. The IC 120 is mounted near the center of the mounting surface 110A of the circuit board 110, for example. The IC 120 is configured to include a processor, a memory, and the like. For example, the IC 120 realizes various functions of the electronic circuit module 100 by executing a program stored in a memory by a processor.

The metal cover 130 is a metal member that covers the mounting surface 110A of the circuit board 110. The metal cover 130 has a rectangular top plate portion 130A and four side plate portions 130B vertically hung downward from each of the four sides of the top plate portion 130A. The metal cover 130 has a thin rectangular parallelepiped shape with an open bottom. In the metal cover 130, each of the four side plate portions 130B is fixed and ground-connected to the outer surface ground electrode 115 by soldering over the entire circumference of the outer surface ground electrode 115. By covering the mounting surface 110A of the circuit board 110, the metal cover 130 protects the IC 120, which is a part of the electronic circuit, from external impacts and the like, and at the same time, leaks electromagnetic noise from the IC 120 and invades the IC 120. Is suppressed to improve the shielding property against electromagnetic noise.

(Configuration of IC120)
FIG. 3 is a diagram showing a configuration of an IC 120 included in the electronic circuit module 100 according to the embodiment. FIG. 3A is a side view of the IC 120. FIG. 3B is a bottom view of the IC 120. As shown in FIG. 3B, a rectangular grounding terminal 121 is provided at the center of the bottom surface of the IC 120. Further, as shown in FIGS. 3A and 3B, a plurality of electrical signal terminals 122 are provided side by side on the outer peripheral portion of the IC 120.

(Configuration of Electronic Circuit Module 100)
FIG. 4 is a plan view of the electronic circuit module 100 according to the embodiment. FIG. 5 is a sectional view taken along the line AA of the electronic circuit module 100 shown in FIG.

As shown in FIGS. 4 and 5, the circuit board 110 has a mounting surface 110A and a back surface 110B (a surface facing the mounting surface 110A). A surface grounding electrode 111 having a plurality of surface grounding patterns 111A is provided on the mounting surface 110A of the circuit board 110. The plurality of surface layer grounding patterns 111A are provided in the mounting area 110A1 (area in which the IC 120 is mounted) set near the central portion of the mounting surface 110A. In the example shown in FIG. 4, each of the plurality of surface layer grounding patterns 111A has a rectangular shape.

Further, as shown in FIGS. 4 and 5, IC 120s are arranged on the plurality of surface layer grounding patterns 111A. The grounding terminal 121 provided on the bottom surface of the IC 120 is connected to each of the plurality of surface grounding patterns 111A by soldering.

Further, as shown in FIG. 5, a back ground electrode 112 having a plurality of back ground patterns 112A is provided on the back 110B of the circuit board 110. The plurality of back ground contact patterns 112A are provided in the inner region 110B1 (the region overlapping the mounting region 110A1 of the mounting surface 110A in a plan view from above) set near the central portion of the back surface 110B. Further, as shown in FIG. 5, each of the plurality of back surface grounding patterns 112A is provided at a position overlapping each of the plurality of surface layer grounding patterns 111A in a plan view from above. Each of the plurality of back ground patterns 112A is soldered to a corresponding electrode provided on an external substrate (not shown).

Further, as shown in FIG. 5, a plurality of external connection terminals 114 are provided in the outer region 110B2 (the region surrounding the inner region 110B1) set on the outer peripheral portion of the back surface 110B. Each of the plurality of external connection terminals 114 is soldered to a corresponding electrode provided on an external substrate (not shown).

Further, as shown in FIGS. 4 and 5, a plurality of heat dissipation vias 113 are formed around each of the plurality of surface grounding patterns 111A on the circuit board 110. The heat radiating via 113 has a through-hole shape that penetrates the circuit board 110 in the vertical direction, and an electrode is formed on the inner wall. Further, usually, the inside of the heat radiating via 113 may be filled with a substance such as resin or metal. The heat radiating via 113 connects the surface ground electrode 111 (see FIG. 6) provided on the mounting surface 110A of the circuit board 110 and the back ground electrode 112 (see FIG. 7) provided on the back surface 110B of the circuit board 110. To do. The heat radiating via 113 releases the heat generated from the IC 120, which is an electronic component, from the back surface 110B of the circuit board 110 to the outside (for example, the motherboard) (hereinafter, the heat generated from the IC 120 is released to the back side of the circuit board 110). It is also provided to dissipate heat.

Further, as shown in FIG. 5, the outer surface ground electrode 115 is formed separately from the surface ground electrode 111 on the mounting surface 110A of the circuit board 110. The surface grounding electrode 111 and the outer surface grounding electrode 115 are respectively provided on the inner layer grounding layer between the mounting surface 110A and the back surface 110B via the grounding via 117 extending downward from the mounting surface 110A. It is connected to the electrode 116.

As a result, electromagnetic noise transmitted from the outside to the metal cover 130 (hereinafter, also referred to as external noise) can be released to the inner layer grounding electrode 116 via the outer surface layer grounding electrode 115 and the grounding via 117. Further, by making the grounding via 117 function as an inductor element, it is possible to suppress the transmission of external noise, which is also a high frequency signal, from the outer surface grounding electrode 115 to the surface grounding electrode 111 via the grounding via 117. .. As a result, it is possible to suppress the intrusion of electromagnetic noise from the outside into the IC 120. Similarly, leakage of electromagnetic noise from the IC 120 to the outside can be suppressed.

Further, since the outer surface ground electrode 115 is separated from the surface ground electrode 111, the IC 120 is arranged to dissipate the heat applied from the soldering device when the metal cover 130 is soldered to the outer surface ground electrode 115. It makes it difficult to join the central part of the mounting surface 110A, and prevents the solder 118 from flowing into the central part of the mounting surface 110A when the metal cover 130 is soldered to the outer surface ground electrode 115. be able to.

Further, by separating the outer surface ground electrode 115 from the surface ground electrode 111, the area of the outer surface ground electrode 115 can be reduced. Therefore, when the metal cover 130 is soldered to the outer surface ground electrode 115, the soldering device is used. It is possible to prevent the applied heat from being excessively dissipated from the outer surface layer ground electrode 115.

As described above, the electronic circuit module 100 of the present embodiment can suppress defects associated with soldering of the metal cover while improving the shielding property against electromagnetic noise. It should be noted that such an effect can be obtained even when the surface ground electrode 111 and the outer surface ground electrode 115 are connected to the back ground electrode 112 via the ground via 117. That is, the surface grounding electrode 111 and the outer surface grounding electrode 115 are provided on the layer on the back surface 110B side of the mounting surface 110A via the grounding via 117 (inner layer grounding electrode 116 or back grounding electrode 112). ) Should be connected.

Next, with reference to FIGS. 6 to 9, the arrangement positions of the surface grounding pattern 111A, the rear grounding pattern 112A, and the heat dissipation via 113 will be described.

FIG. 6 is a plan view of the circuit board 110 (state in which the heat dissipation via 113 is not formed) included in the electronic circuit module 100 according to the embodiment. As shown in FIG. 6, a plurality of rectangular surface grounding patterns 111A are arranged in a matrix in the mounting area 110A1 of the mounting surface 110A of the circuit board 110. In the plurality of surface grounding patterns 111A, the resist 111B is applied to one rectangular surface grounding electrode 111 provided on the mounting surface 110A around the region where the plurality of surface grounding patterns 111A are formed. It is an exposed part (so-called land for soldering) formed by. As described above, the electronic circuit module 100 of the present embodiment divides a predetermined region of the surface ground electrode 111 into a plurality of surface ground patterns 111A, so that voids can be easily released when the surface ground electrode 111 is soldered. It is possible to do.

FIG. 7 is a bottom view of the circuit board 110 (state in which the heat dissipation via 113 is not formed) included in the electronic circuit module 100 according to the embodiment. As shown in FIG. 7, a plurality of circular back grounding patterns 112A are arranged in a matrix in the inner region 110B1 of the back surface 110B of the circuit board 110. The plurality of back grounding patterns 112A are formed by applying a resist 112B to a single rectangular back grounding electrode 112 provided on the back surface 110B around the region where the plurality of back grounding patterns 112A are formed. It is an exposed part (so-called land for soldering) to be formed. Here, the center spacing D2 of the two adjacent back grounding patterns 112A is the same as the center spacing D1 (see FIG. 6) of the two adjacent surface grounding patterns 111A. As described above, in the electronic circuit module 100 of the present embodiment, by dividing the predetermined region of the back ground electrode 112 into a plurality of back ground patterns 112A, the voids can be easily released when the back ground electrode 112 is soldered. It is possible to do.

FIG. 8 is a plan view of the circuit board 110 (state in which the heat dissipation via 113 is not formed) included in the electronic circuit module 100 according to the embodiment. In FIG. 8, a plurality of back grounding patterns 112A provided on the back surface 110B of the circuit board 110 are superimposed on the plan view of the circuit board 110.

As shown in FIG. 8, the plurality of back grounding patterns 112A are arranged in the same layout (3 × 3 matrix shape) as the plurality of surface grounding patterns 111A. Further, the center spacing D2 of the two adjacent back grounding patterns 112A is the same as the center spacing D1 of the two adjacent surface grounding patterns 111A. Therefore, as shown in FIG. 8, each of the plurality of back ground contact patterns 112A is arranged at a position overlapping each of the plurality of surface layer ground contact patterns 111A in a plan view from above.

Further, the external dimensions (diameter) of each back surface grounding pattern 112A are the same as the external dimensions (length of one side) of each surface layer grounding pattern 111A, but the center position of each back surface grounding pattern 112A and each surface layer grounding pattern 111A. Since the center position is the same as that of the surface grounding pattern 112A, each back grounding pattern 112A is arranged so as not to protrude outward from the outer peripheral portion of the surface grounding pattern 111A.

FIG. 9 is a plan view of the circuit board 110 (state in which the heat dissipation via 113 is formed) included in the electronic circuit module 100 according to the embodiment. As shown in FIG. 9, a plurality of heat radiating vias 113 penetrating the circuit board 110 in the vertical direction are formed around each of the plurality of surface grounding patterns 111A.

Here, in the circuit board 110 of the present embodiment, since each of the plurality of back grounding patterns 112A is arranged so as to overlap each of the plurality of surface grounding patterns 111A, as shown in FIG. 9, the heat dissipation via is provided. A large number of heat dissipation vias 113 can be formed around the surface grounding pattern 111A and the back grounding pattern 112A without the 113 overlapping the surface grounding pattern 111A and the back grounding pattern 112A.

That is, the electronic circuit module 100 of the present embodiment can efficiently form a larger number of heat radiating vias 113 around the surface grounding pattern 111A and the back grounding pattern 112A, and a plurality of heat radiating vias 113. Each of these can be formed at a position that does not overlap the surface grounding pattern 111A and the back grounding pattern 112A (a position that avoids the surface grounding pattern 111A and the back grounding pattern 112A).

Therefore, the electronic circuit module 100 of the present embodiment can further enhance the heat dissipation effect of the heat generated from the IC 120. Further, the electronic circuit module 100 of the present embodiment can suppress the generation of voids due to the outflow of gas from the heat radiating via 113 at the time of soldering.

In the present embodiment, the shape of the surface grounding pattern 111A is rectangular and the shape of the back grounding pattern 112A is circular, but the shapes of the surface grounding pattern 111A and the back grounding pattern 112A are not limited to this. .. The shapes of the surface grounding pattern 111A and the back grounding pattern 112A may both be circular or both may be rectangular, and one of the surface grounding pattern 111A and the back grounding pattern 112A may be other than circular or rectangular. The shape of (regular polygon, etc.) may be used.

(Modification example of circuit board 110)
FIG. 10 is a plan view showing a modified example of the circuit board 110 included in the electronic circuit module 100 according to the embodiment.

In the example shown in FIG. 10, 25 surface grounding patterns 111A arranged in a 5 × 5 matrix are provided at the center of the mounting surface 110A of the circuit board 110. On the other hand, in the example shown in FIG. 10, nine surface grounding patterns 111A arranged in a 3 × 3 matrix are provided at the center of the back surface 110B of the circuit board 110.

Here, the external dimensions (diameter) of each back surface grounding pattern 112A are the same as the external dimensions (one side length) of each surface layer grounding pattern 111A. Further, the center spacing D3 of the two adjacent back ground contact patterns 112A is twice the center spacing D1 (see FIG. 6) of the two adjacent surface ground contact patterns 111A.

Therefore, as shown in FIG. 10, each back grounding pattern 112A is arranged at a position overlapping the surface grounding pattern 111A so as not to protrude outward from the outer peripheral portion of the surface grounding pattern 111A.

As a result, in the circuit board 110 of this modification, as shown in FIG. 10, the heat dissipation via 113 does not overlap with the surface grounding pattern 111A and the back grounding pattern 112A, and the surface grounding pattern 111A and the back grounding pattern 112A are formed. A large number of heat dissipation vias 113 can be formed around the periphery.

The center spacing of the two adjacent back grounding patterns 112A may be an integral multiple of three times or more the center spacing of the two adjacent surface grounding patterns 111A. Further, the center spacing of the two adjacent surface grounding patterns 111A may be an integral multiple of the center spacing of the two adjacent back grounding patterns 112A.

As described above, the electronic circuit module 100 according to the embodiment of the present invention is an electronic circuit including a circuit board 110 having a mounting surface 110A on which the IC 120 is mounted and a back surface 110B provided with an external connection terminal 114. In the module 100, the circuit board 110 is provided on the mounting surface 110A and has a surface grounding electrode 111 having a plurality of surface grounding patterns 111A, and a back grounding electrode 112 provided on the back surface 110B and having a plurality of back grounding patterns 112A. A predetermined region (mounting region 110A1) having a plurality of heat-dissipating vias 113 connecting the surface ground electrode 111 and the back ground electrode 112, and the surface ground electrode 111 and the back ground electrode 112 of the circuit board 110 overlapping. And the inner region 110B1), each of the plurality of surface grounding patterns 111A and each of the plurality of back grounding patterns 112A are arranged at positions where they overlap each other, and each of the plurality of heat dissipation vias 113 is arranged on the surface layer. It is arranged at a position that does not overlap with the grounding pattern 111A and the back grounding pattern 112A (a position avoiding the surface grounding pattern 111A and the back grounding pattern 112A).

As a result, the electronic circuit module 100 according to the embodiment of the present invention can efficiently form a larger number of heat dissipation vias 113 around the surface grounding pattern 111A and the back grounding pattern 112A, and a plurality of them. Each of the heat radiating vias 113 can be formed at a position that does not overlap with the surface grounding pattern 111A and the back grounding pattern 112A.

Therefore, according to the electronic circuit module 100 according to the embodiment of the present invention, the heat dissipation via 113 can be efficiently arranged while suppressing the generation of voids. Then, by efficiently arranging the heat radiating via 113, the heat generated from the IC 120 can be efficiently radiated to the back side of the circuit board 110.

Further, in the electronic circuit module 100 according to the embodiment of the present invention, a plurality of surface grounding patterns 111A and a plurality of backside grounding patterns 112A are arranged in a matrix on the circuit board 110.

Thereby, the electronic circuit module 100 according to the embodiment of the present invention can more easily arrange the plurality of heat radiating vias 113.

Further, in the electronic circuit module 100 according to the embodiment of the present invention, the external dimensions and the installation interval of the surface grounding pattern 111A and the external dimensions and the installation interval of the rear grounding pattern 112A are the same in the circuit board 110.

Further, in the electronic circuit module 100 according to the embodiment of the present invention, the external dimensions of the surface grounding pattern 111A and the external dimensions of the rear grounding pattern 112A are the same on the circuit board 110, and the installation intervals of the surface grounding pattern 111A are the same. And the installation interval of the back grounding pattern 112A, one installation interval is an integral multiple of the other installation interval.

Further, in the electronic circuit module 100 according to the embodiment of the present invention, the surface grounding pattern 111A and the back grounding pattern 112A are around the surface grounding pattern 111A and the back grounding pattern 112A with respect to the surface grounding electrode 111 and the back grounding electrode 112. Is formed by applying a resist to the surface.

Thereby, the electronic circuit module 100 according to the embodiment of the present invention can easily form the surface grounding pattern 111A and the back grounding pattern 112A.

Further, the electronic circuit module 100 according to the embodiment of the present invention hangs down from each of the rectangular top plate portion 130A facing the mounting surface 110A and each of the four sides of the top plate portion 130A toward the mounting surface 110A. It has a side plate portion 130B provided, and further includes a metal cover 130 provided so as to cover the mounting surface 110A.

By covering the mounting surface 110A of the circuit board 110 with the metal cover 130 in this way, the electronic circuit module 100 according to the embodiment of the present invention can enhance the shielding property against electromagnetic noise.

Further, in the electronic circuit module 100 according to the embodiment of the present invention, the circuit board 110 has an outer surface layer ground electrode 115 formed in an annular shape along the outer peripheral portion of the mounting surface 110A on the mounting surface 110A. In the metal cover 130, the side plate portion 130B is soldered to the outer surface ground electrode 115 over the entire circumference of the outer surface ground electrode 115.

In this way, the electronic circuit module 100 according to the embodiment of the present invention can be obtained by soldering the side plate portion 130B of the metal cover 130 to the outer surface ground electrode 115 over the entire circumference of the outer surface ground electrode 115. The shielding property against electromagnetic noise can be further improved.

Further, in the electronic circuit module 100 according to the embodiment of the present invention, the outer surface ground electrode 115 is formed separately from the surface ground electrode 111 on the mounting surface 110A of the circuit board 110. The surface grounding electrode 111 and the outer surface grounding electrode 115 are each provided on a layer on the back surface 110B side of the mounting surface 110A via a grounding via 117 extending downward from the mounting surface 110A. It is connected to (inner layer ground electrode 116 or back ground electrode 112).

As a result, the electronic circuit module 100 according to the embodiment of the present invention can further enhance the shielding property against electromagnetic noise and suppress defects due to soldering of the metal cover. On the other hand, since such a structure is a structure in which it is difficult to dissipate the heat generated from the electronic component to the outer peripheral side, the heat generated from the electronic component can be efficiently dissipated to the back side of the circuit board 110. The features of the invention are particularly effective in such structures.

Although one embodiment of the present invention has been described in detail above, the present invention is not limited to these embodiments, and various modifications or modifications are made within the scope of the gist of the present invention described in the claims. It can be changed.

For example, the present invention is also applicable to an electronic circuit module having no metal cover (for example, an electronic circuit module in which electronic components are resin-sealed).

This international application claims priority based on Japanese Patent Application No. 2019-134877 filed on July 22, 2019, and the entire contents of the application will be incorporated into this international application.

100 Electronic circuit module 110 Circuit board 110A Mounting surface 110A1 Mounting area 110B Back surface 110B1 Inner area 110B2 Outer area 111 Surface grounding electrode 111A Surface grounding pattern 111B Resist 112 Back grounding electrode 112A Back grounding pattern 112B Resist 113 External connection terminal 115 Outer surface grounding electrode 116 Inner layer grounding electrode 117 Grounding via 120 IC (electronic component)
121 Grounding terminal 122 Electrical signal terminal 130 Metal cover 130A Top plate 130B Side plate

Claims

An electronic circuit module having a circuit board having a mounting surface on which electronic components are mounted and a back surface on which external connection terminals are provided.
The circuit board
A surface ground electrode provided on the mounting surface and having a plurality of surface ground patterns,
A back ground electrode provided on the back surface and having a plurality of back ground patterns,
A plurality of heat dissipation vias connecting the surface ground electrode and the back ground electrode,
Have,
In a predetermined region where the surface ground electrode and the back ground electrode of the circuit board overlap.
Each of the plurality of surface grounding patterns and each of the plurality of back grounding patterns are arranged at positions where they overlap each other.
An electronic circuit module characterized in that each of the plurality of heat radiating vias is arranged at a position avoiding the surface grounding pattern and the back grounding pattern.
In the predetermined area of the circuit board
The electronic circuit module according to claim 1, wherein the plurality of surface grounding patterns and the plurality of backside grounding patterns are arranged in a matrix.
In the predetermined area of the circuit board
The electronic circuit module according to claim 2, wherein the external dimensions and the installation interval of the surface grounding pattern are the same as the external dimensions and the installation interval of the back surface grounding pattern.
In the predetermined area of the circuit board
The outer dimensions of the surface grounding pattern and the outer dimensions of the back grounding pattern are the same, and one of the installation intervals of the surface grounding pattern and the backing grounding pattern is the installation interval of the other. The electronic circuit module according to claim 2, wherein the electronic circuit module is an integral multiple.
A claim characterized in that the surface grounding pattern and the back grounding pattern are formed by applying a resist to the surface grounding electrode and the back grounding electrode around the surface grounding pattern and the back grounding pattern. Item 4. The electronic circuit module according to any one of Items 1 to 4.
It has a rectangular top plate portion facing the mounting surface and side plate portions vertically hung from each of the four sides of the top plate portion toward the mounting surface side so as to cover the mounting surface. The electronic circuit module according to any one of claims 1 to 5, further comprising a metal cover provided.
The circuit board
The mounting surface has an outer surface ground electrode formed in an annular shape along the outer peripheral portion of the mounting surface.
The metal cover is
The electronic circuit module according to claim 6, wherein the side plate portion is soldered to the outer surface ground electrode over the entire circumference of the outer surface ground electrode.
The circuit board has a lower layer grounding electrode provided on a layer on the back surface side of the mounting surface, and a grounding via extending from the mounting surface to the back surface side.
The outer surface ground electrode is formed separately from the surface ground electrode on the mounting surface.
The electronic circuit module according to claim 7, wherein the surface ground electrode and the outer surface ground electrode are each connected to the lower ground electrode via the ground via.