JP2021176180A - Electronic circuit module - Google Patents

Abstract

To improve heat radiation performance of heat emitted from an electronic component in an electronic circuit module with a relatively simple structure.SOLUTION: An electronic circuit module includes: an electronic component; a circuit board having a mounting surface on which the electronic component is mounted; a metal cover which has a top plate part facing the mounting surface and is attached to the circuit board so as to cover the electronic component; and a heat conduction member which fills a space between an area, facing the electronic component, of the top plate part and the electronic component and which has fluidity. The metal cover has a rib protruding to the electronic component in the area, facing the electronic component, of the top plate part.SELECTED DRAWING: Figure 3

Description

The present invention relates to an electronic circuit module.

In recent years, with the increasing functionality of devices, heat generation of electronic components such as communication ICs has become a problem, and higher heat dissipation is required for devices. As a heat dissipation measure for such a device, the following Patent Document 1 describes a metal element between a semiconductor element mounted on a printed circuit board and a heat radiating plate covering the printed circuit board, and between a top plate portion of a metal cover. The technique of interposing the leaf spring of the above is disclosed. Further, Patent Document 2 below discloses a technique of providing grease or the like between a semiconductor element mounted on an insulating substrate and a lid covering the insulating substrate.

Japanese Unexamined Patent Publication No. 11-068360 Japanese Unexamined Patent Publication No. 2003-1000924

However, the technique of Patent Document 1 has problems such as an increase in the number of parts due to the addition of a leaf spring and a displacement of parts during assembly due to the elasticity of the leaf spring, and the processing tends to be complicated. Further, in the technique of Patent Document 2, when the device is mounted on a vehicle, grease or the like may flow out from between the semiconductor element and the lid due to vibration of the vehicle or the like, and the heat dissipation effect may be deteriorated. ..

The electronic circuit module according to one embodiment has an electronic component, a circuit board having a mounting surface on which the electronic component is mounted, and a top plate portion facing the mounting surface, and is mounted on the circuit board so as to cover the electronic component. The metal cover is provided with a fluid heat conductive member filled between a region facing the electronic component in the top plate portion and the electronic component, and the metal cover faces the electronic component in the top plate portion. It has ribs protruding toward the electronic component in the area to be processed.

According to one embodiment, the heat dissipation of heat generated from an electronic component in an electronic circuit module can be enhanced by a relatively simple configuration.

External perspective view of the electronic circuit module according to one embodiment External perspective view of the electronic circuit module according to one embodiment Sectional drawing of the electronic circuit module which concerns on one Embodiment Cross-sectional view of the electronic circuit module according to the first modification Cross-sectional view of the electronic circuit module according to the second modification Cross-sectional view of the electronic circuit module according to the third modification Cross-sectional view of the electronic circuit module according to the fourth modification Cross-sectional view of the electronic circuit module according to the fifth modification External perspective view of the electronic circuit module according to the sixth modification The figure which shows an example of the shape of the rib which the electronic circuit module which concerns on one Embodiment has. The figure which shows an example of the shape of the rib which the electronic circuit module which concerns on one Embodiment has. The figure which shows an example of the shape of the rib which the electronic circuit module which concerns on one Embodiment has.

Hereinafter, one embodiment will be described with reference to the drawings. In the following description, in order to explain the features of the present invention in an easy-to-understand manner, the description will proceed with the side with the mounting surface of the circuit board as the upper side and the side with the back surface as the lower side for convenience. The direction in which the circuit module is used is not limited, and the circuit module may be used upside down, sideways, or tilted at an angle.

1 and 2 are external perspective views of the electronic circuit module 100 according to the embodiment. The electronic circuit module 100 shown in FIGS. 1 and 2 can be mounted on various electric products to have a specific function (for example, LTE (Long Term Evolution) (registered trademark)) by the electronic circuit included in the electronic circuit module 100. , Bluetooth (registered trademark), Wi-Fi (registered trademark) and other wireless communication functions).

As shown in FIGS. 1 and 2, the electronic circuit module 100 has a thin rectangular parallelepiped shape as a whole. The electronic circuit module 100 includes a circuit board 110, an IC (Integrated Circuit) 120, and a metal cover 130. FIG. 1 shows an electronic circuit module 100 with a metal cover 130 attached to a circuit board 110. FIG. 2 shows an electronic circuit module 100 in a state where the metal cover 130 is not attached to the circuit board 110.

The circuit board 110 is a flat plate-shaped and rectangular member. The surface of the circuit board 110 is a mounting surface 110A on which various electronic components are mounted. As the circuit board 110, for example, a PWB (Printed Wiring Board) is used. For example, the circuit board 110 is formed by using an insulating resin on the flat plate-shaped base material.

As shown in FIG. 2, the mounting surface 110A is provided with an inner surface layer ground electrode 111 and an outer surface ground electrode 112. The inner surface layer ground electrode 111 is a rectangular and thin film-shaped electrode provided on the central portion side of the mounting surface 110A. The IC 120 is arranged on the inner surface layer grounding electrode 111, and the grounding terminal (not shown) of the IC 120 is connected.

The outer surface ground electrode 112 is a thin-film electrode formed on the outer peripheral side of the mounting surface 110A in a rectangular ring shape so as to surround the inner surface ground electrode 111 and separated from the inner surface ground electrode 111. The lower edge of the metal cover 130 is fixed to the outer surface ground electrode 112 by soldering. For example, the inner surface ground electrode 111 and the outer surface ground electrode 112 are formed by using various conductive films (for example, a copper film).

The IC 120 is an example of an “electronic component” and is a main component included in the electronic circuit of the electronic circuit module 100. The IC 120 is mounted on the mounting surface 110A of the circuit board 110. Specifically, the IC 120 is arranged on the inner surface layer ground electrode 111 provided on the mounting surface 110A. Then, the grounding terminal (not shown) provided on the bottom surface of the IC 120 is connected to the inner surface layer grounding electrode 111. The IC 120 is configured to include a communication circuit, a processor, a memory, and the like. For example, the IC 120 realizes various functions of the electronic circuit module 100 by executing a program stored in a memory by a processor. In this embodiment, as the IC 120, a communication IC in which integrated circuit elements are sealed with an insulating resin is used. Further, the IC 120 is a heat generating component in the electronic circuit module 100, and in particular, the internal processor circuit and the like are likely to generate heat.

In the present embodiment, the IC 120 is used as an example of the electronic components mounted on the mounting surface 110A, but the present invention is not limited to this, and other electronic components (for example, resistors, inductors, capacitors) are used on the mounting surface 110A. (Passive components such as) and members for wiring can also be mounted.

The metal cover 130 is a metal member that covers the mounting surface 110A of the circuit board 110. The metal cover 130 includes a rectangular top plate portion 130A facing the mounting surface 110A of the circuit board 110, and four side plate portions 130B vertically hung downward (on the mounting surface 110A side) from each of the four sides of the top plate portion 130A. And have. The metal cover 130 has a thin rectangular parallelepiped shape with an open bottom. In the metal cover 130, the lower edges of the four side plate portions 130B are fixed and ground-connected to the outer surface ground electrode 112 by soldering over the entire circumference of the outer surface ground electrode 112. By covering the mounting surface 110A of the circuit board 110, the metal cover 130 protects the IC 120 from external impacts and the like, and suppresses leakage of electromagnetic noise from the IC 120 and intrusion of electromagnetic noise into the IC 120. The metal cover 130 is formed by pressing a metal plate such as iron.

As shown in FIG. 1, the metal cover 130 has a rib 132 protruding toward the IC 120 in a region 130C of the top plate portion 130A facing the IC 120. In particular, in the example shown in FIG. 1, the metal cover 130 has three annular ribs 132 arranged concentrically with respect to the center of the region 130C in the region 130C.

FIG. 3 is a cross-sectional view of the electronic circuit module 100 according to the embodiment.

As shown in FIG. 3, the circuit board 110 is a so-called multilayer board, and the first conductive layer Ly1 (mounting surface 110A), the second conductive layer Ly2, the third conductive layer Ly3, and the fourth conductive layer Ly3 are in this order from the mounting surface 110A side. It has a conductive layer Ly4 and a fifth conductive layer Ly5. For example, each conductive layer Ly1 to Ly5 is formed by using various conductive films (for example, a copper film).

As shown in FIG. 3, the mounting surface 110A (first conductive layer Ly1) of the circuit board 110 is provided with an inner surface layer ground electrode 111 and an outer surface layer ground electrode 112. Further, an IC 120 is provided at the center of the mounting surface 110A (first conductive layer Ly1) (that is, the center of the inner surface layer ground electrode 111). Further, the back ground electrode 113 (an example of the "lower layer ground electrode") is provided on the fifth conductive layer Ly5 (back surface 110B) of the circuit board 110.

Further, as shown in FIG. 3, the circuit board 110 has a first via 114A and a second via 114B that penetrate the circuit board 110 in the vertical direction. The first via 114A and the second via 114B have a through-hole shape that penetrates the circuit board 110 in the vertical direction, and an electrode is formed on the inner wall.

One end of the first via 114A is connected to the inner surface ground electrode 111, and the other end is connected to the back ground electrode 113. That is, the inner surface ground electrode 111 is physically and electrically connected to the back ground electrode 113 via the first via 114A. The first via 114A has a function of releasing heat generated from the IC 120, which is an electronic component, from the back surface 110B of the circuit board 110 to the outside (for example, a motherboard).

One end of the second via 114B is connected to the outer surface ground electrode 112, and the other end is connected to the back ground electrode 113. That is, the outer surface ground electrode 112 is physically and electrically connected to the back ground electrode 113 via the second via 114B. The second via 114B has a function of releasing electromagnetic noise transmitted from the outside to the metal cover 130 to the back ground electrode 113. As a result, the electronic circuit module 100 according to the embodiment can suppress the intrusion of electromagnetic noise from the outside into the IC 120.

As shown in FIG. 3, the mounting surface 110A of the circuit board 110 is covered with the metal cover 130. The metal cover 130 has a top plate portion 130A facing the mounting surface 110A and a side plate portion 130B provided so as to hang down from the outer peripheral edge portion of the top plate portion 130A. The metal cover 130 is fixed to the outer surface layer ground electrode 112 by soldering with solder 115 over the entire circumference of the lower edge portion of the rectangular annular side plate portion 130B. As a result, in the electronic circuit module 100 according to one embodiment, the mounting surface 110A on which the IC 120 is mounted is substantially completely covered by the metal cover 130, so that the electromagnetic noise leaks from the IC 120 and the electromagnetic noise enters the IC 120. Can be suppressed. Further, since the electronic circuit module 100 according to the embodiment can realize a high shielding property, the heat dissipation effect of the heat generated by the IC 120 by the metal cover 130 becomes more useful.

Further, as shown in FIG. 3, the top plate portion 130A of the metal cover 130 has a region 130C facing the IC 120. Then, the gap A between the region 130C in the top plate portion 130A (back surface 130Ab) and the upper surface 120A of the IC 120 is filled with grease 140. The grease 140 is an example of a “fluid heat conductive member”. The grease 140 is in close contact with the region 130C in the top plate portion 130A (back surface 130Ab) and the upper surface 120A of the IC 120, and the heat of the IC 120 can be released to the top plate portion 130A. In this embodiment, silicon grease is used as the grease 140.

Further, as shown in FIG. 3, a plurality of annular ribs 132 protruding toward the IC 120 are provided in the region 130C in the top plate portion 130A (back surface 130Ab). As shown in FIG. 3, the rib 132 has a semicircular cross-sectional shape. However, the present invention is not limited to this, and the rib 132 may have other cross-sectional shapes (for example, triangular shape, rectangular shape, etc.). In the present embodiment, the vertical width of the gap A is 0.7 mm, and the height dimension of the rib 132 is 0.5 mm.

As a result, in the electronic circuit module 100 according to one embodiment, the grease 140 filled in the gap A between the region 130C in the top plate portion 130A (back surface 130Ab) and the upper surface 120A of the IC 120 by the rib 132 is filled in the gap A. It is possible to prevent the outflow to the outside of the. That is, since the electronic circuit module 100 according to the embodiment is provided with the rib 132, it is possible to suppress a decrease in the heat dissipation effect due to the outflow of the grease 140. Further, in the electronic circuit module 100 according to one embodiment, by providing the rib 132, the contact area between the top plate portion 130A and the grease 140 can be expanded, and thus the heat dissipation effect of the grease 140 can be enhanced. can.

In particular, in the present embodiment, as shown in FIG. 1, the region 130C of the top plate portion 130A has three ribs 132 arranged concentrically with respect to the center of the region 130C.

As a result, the electronic circuit module 100 according to the embodiment can suppress the outflow of the grease 140 from the gap A in all directions, and further expands the contact area between the top plate portion 130A and the grease 140. be able to. Therefore, the electronic circuit module 100 according to the embodiment can further suppress the decrease in the heat dissipation effect due to the outflow of the grease 140, and can further enhance the heat dissipation effect due to the grease 140.

Further, the rib 132 is integrally formed with the top plate portion 130A. For example, the rib 132 is formed by applying pressure from the surface 130Aa side of the top plate portion 130A using a mold. As a result, as shown in FIG. 3, the rib 132 becomes convex with respect to the back surface 130Ab on the IC120 side of the top plate portion 130A (an example of the "first surface"), and is different from the back surface 130Ab in the top plate portion 130A. A concave groove 133 is formed with respect to the opposite surface 130Aa (an example of a "second surface").

As a result, the electronic circuit module 100 according to the embodiment can be provided with the rib 132 without increasing the number of parts. Therefore, the electronic circuit module 100 according to the embodiment can improve the heat dissipation of the heat generated from the IC 120 in the electronic circuit module 100 by a relatively simple configuration.

Further, the electronic circuit module 100 according to the embodiment can expand the contact area between the top plate portion 130A and the outside air by having the groove portion 133 on the surface 130Aa of the top plate portion 130A, and thus grease from the IC 120. The heat dissipation effect of the heat transferred to the top plate portion 130A via the 140 can be enhanced.

Further, in the electronic circuit module 100 according to the embodiment, when the metal cover 130 is formed into a rectangular parallelepiped shape by press working using a mold, the rib 132 can be formed at the same time by the press working. Therefore, the electronic circuit module 100 according to the embodiment can form the metal cover 130 having the rib 132 relatively easily.

[Modification example]
Hereinafter, various modifications of the electronic circuit module 100 according to the embodiment will be described. In each modification, the changes from the electronic circuit module 100 described with reference to FIGS. 1 to 3 will be mainly described. That is, the electronic circuit modules 100A to 100F described in each modification have the same configuration as the electronic circuit module 100 described with reference to FIGS. 1 to 7 except for the changes described in the modification.

(First modification)
First, a first modification of the electronic circuit module 100 according to the embodiment will be described with reference to FIG. FIG. 4 is a cross-sectional view of the electronic circuit module 100A according to the first modification.

As shown in FIG. 4, the electronic circuit module 100A according to the first modification is different from the electronic circuit module 100 in that the grease 140A is provided instead of the grease 140. The grease 140A is a silicon grease containing fine particles 141 made of a material having high thermal conductivity, high dielectric constant, and insulating property (for example, resin, ceramic, etc.).

As a result, in the electronic circuit module 100A according to the first modification, since the grease 140A contains the fine particles 141, it becomes more difficult for the grease 140A to flow out from the gap A, and thus the heat dissipation effect due to the outflow of the grease 140A is reduced. It can be further suppressed.

Further, in the electronic circuit module 100A according to the first modification, since the fine particles 141 have an insulating property, even if the grease 140A flows down to the mounting surface 110A, the fine particles 141 are electrically connected to the electronic circuit. The influence (for example, short circuit, etc.) can be suppressed.

In addition, the electronic circuit module 100A according to the first modification also has an effect of suppressing interference between circuits (between the IC 120 and the wiring pattern, etc.) due to scattering of electromagnetic wave noise utilizing the reflection of electromagnetic waves at the interface between the grease 140A and the fine particles 141. You can expect it. It is more preferable that the size of the fine particles 141 is larger than the gap between the lower end of the rib 132 and the upper surface 120A of the IC 120.

Further, as shown in FIG. 4, in the electronic circuit module 100A according to the first modification, a plurality of heat dissipation vias 116 are further formed at positions overlapping the IC 120 in a plan view on the circuit board 110. The heat radiating via 116 has a through-hole shape that penetrates the circuit board 110 in the vertical direction, and an electrode is formed on the inner wall. One end of the heat dissipation via 116 is connected to the inner surface ground electrode 111, and the other end is connected to the back ground electrode 113. The heat radiating via 116 has a function of discharging heat generated from the IC 120, which is an electronic component, from the back surface 110B of the circuit board 110 to the outside (for example, a motherboard) directly under the IC 120 (bottom side of the IC 120). As a result, the electronic circuit module 100A according to the first modification can further enhance the heat dissipation of the heat generated from the IC 120.

(Second modification)
Next, a second modification of the electronic circuit module 100 according to the embodiment will be described with reference to FIG. FIG. 5 is a cross-sectional view of the electronic circuit module 100B according to the second modification.

As shown in FIG. 5, in the electronic circuit module 100B according to the second modification, a plurality of convex portions 121 are further provided on the upper surface 120A of the IC 120. For example, the convex portion 121 is formed on the upper surface 120A of the IC 120 by resin printing or the like. As a result, in the electronic circuit module 100B according to the second modification, the grease 140A is less likely to flow out from the gap A, and thus the deterioration of the heat dissipation effect due to the outflow of the grease 140A can be further suppressed.

In particular, the electronic circuit module 100B according to the second modification has a convex portion 121 provided at a position (between two adjacent ribs 132) on the upper surface 120A of the IC 120 so as to avoid the rib 132. The 121 does not interfere with the rib 132. Further, in the electronic circuit module 100B according to the second modification, the ribs 132 and the convex portions 121 are alternately arranged in the gap A, so that the amount of grease 140 applied can be optimized.

(Third modification example)
Next, a third modification of the electronic circuit module 100 according to the embodiment will be described with reference to FIG. FIG. 6 is a cross-sectional view of the electronic circuit module 100C according to the third modification.

As shown in FIG. 6, in the electronic circuit module 100C according to the third modification, a peelable film 150 is attached to the surface 130Aa of the top plate portion 130A. As a result, in the electronic circuit module 100C according to the third modification, the surface 130Aa becomes flat, so that the surface 130Aa can be adsorbed and the transportation during assembly becomes easy. Then, in the electronic circuit module 100C according to the third modification, the groove portion 133 is exposed by peeling the film 150 after assembly, so that the heat dissipation effect of the groove portion 133 can be obtained.

(Fourth modification)
Next, a fourth modification of the electronic circuit module 100 according to the embodiment will be described with reference to FIG. 7. FIG. 7 is a cross-sectional view of the electronic circuit module 100D according to the fourth modification.

As shown in FIG. 7, in the electronic circuit module 100D according to the fourth modification, a pair of openings 130D are provided in a region other than the region 130C in the top plate portion 130A with the region 130C sandwiched between them. There is. In particular, each of the pair of openings 130D is provided at a position facing the inner surface layer ground electrode 111 in the top plate portion 130A.

As a result, the electronic circuit module 100D according to the fourth modification can grip the top plate portion 130A in the pair of openings 130D, and can be easily transported at the time of assembly. Further, in the electronic circuit module 100D according to the fourth modification, the pair of openings 130D are provided at positions facing the inner surface grounding electrode 111, so that the shielding property is lowered due to the pair of openings 130D. Can be suppressed.

(Fifth modification)
Next, a fifth modification of the electronic circuit module 100 according to the embodiment will be described with reference to FIG. FIG. 8 is a cross-sectional view of the electronic circuit module 100E according to the fifth modification.

As shown in FIG. 8, in the electronic circuit module 100E according to the fifth modification, heat radiation fins 160 are provided on the surface 130Aa of the top plate portion 130A of the metal cover 130 via grease 170. The heat radiation fin 160 is formed by using a metal material. The heat radiating fin 160 is configured to have a flat plate-shaped base portion 161 and a plurality of fins 162 erected perpendicularly to the base portion 161.

As a result, the electronic circuit module 100E according to the fifth modification can further enhance the heat dissipation property of the heat generated from the IC 120 by providing the heat dissipation fins 160.

(6th modification)
Next, a sixth modification of the electronic circuit module 100 according to the embodiment will be described with reference to FIG. FIG. 9 is an external perspective view of the electronic circuit module 100F according to the sixth modification.

As shown in FIG. 9, in the electronic circuit module 100F according to the sixth modification, the top plate portion 130A has a flat portion 130E in the center and is around the flat portion 130E (near the corner portion of the top plate portion 130A). ) Has a region 130C facing the IC 120.

As a result, the electronic circuit module 100F according to the sixth modification can attract the flat portion 130E, which facilitates transportation during assembly. Further, in the electronic circuit module 100F according to the sixth modification, since the top plate portion 130A and the side plate portion 130B can dissipate heat, the heat dissipation effect of the metal cover 130 can be further enhanced.

10 to 12 are views showing an example of the shape of the rib 132 included in the electronic circuit module 100 according to the embodiment. In the example shown in FIG. 1, the shape of the rib 132 included in the electronic circuit module 100 is an annular shape, but the shape is not limited to this. The rib 132 may have any shape as long as it can suppress the outflow of 140 grease from the gap A at least.

For example, the rib 132 may be an annular shape other than an annular shape (for example, an elliptical ring road, a rectangular ring road, a polygonal ring road, etc.). Further, the rib 132 may have a shape in which a part of the ring is interrupted (substantially ring). In these cases, it is preferable that a plurality of annular (or substantially annular) ribs 132 are provided in a plurality of manners, as in the case of the plurality of annular ribs 132 shown in FIG.

Further, for example, the region 130C of the top plate portion 130A may have a plurality of ribs 132 having multiple shapes other than the annular shape. For example, as shown in FIG. 10, the top plate portion 130A may have a spiral rib 132 having a shape in which one rib 132 is wound in multiple directions.

Further, for example, the region 130C of the top plate portion 130A may have an annular rib 132 and a rib 132 having a shape other than the annular shape provided inside the annular rib 132.

For example, as shown in FIG. 11, the region 130C of the top plate portion 130A may have an annular rib 132a and a plurality of point-shaped ribs 132b provided inside the annular rib 132.

Further, for example, as shown in FIG. 12, the region 130C of the top plate portion 130A is a lattice-like structure composed of an annular rib 132c and a plurality of linear ribs 132d provided inside the annular rib 132. It may have a rib 132.

Although one embodiment of the present invention has been described in detail above, the present invention is not limited to these embodiments, and various modifications or modifications are made within the scope of the gist of the present invention described in the claims. It can be changed.

For example, in one embodiment, silicon grease is used as the "heat conductive member having fluidity", but the present invention is not limited to this. That is, as the "heat conductive member having fluidity", other grease having fluidity or a heat conductive member other than the grease having fluidity may be used.

100, 100A, 100B, 100C, 100D, 100E, 100F Electronic circuit module 110 Circuit board 110A Mounting surface 110B Back side 111 Inner surface grounding electrode 112 Outer surface grounding electrode 113 Backing grounding electrode (Lower layer grounding electrode)
114A 1st via 114B 2nd via 120 IC (electronic component)
120A Top surface 121 Convex part 130 Metal cover 130A Top plate part 130Aa Surface (second surface)
130Ab back side (first front side)
130B Side plate part 130C area 130D Opening part 130E Flat part 132 Rib 133 Groove part 140, 140A Grease (heat conductive member)
141 Fine Particles 150 Film 160 Heat Dissipating Fins 161 Base 162 Fins 170 Grease

Claims (13)

With electronic components
A circuit board having a mounting surface on which the electronic components are mounted, and
A metal cover having a top plate portion facing the mounting surface and attached to the circuit board so as to cover the electronic components.
A fluid heat conductive member filled between a region of the top plate portion facing the electronic component and the electronic component is provided.
The metal cover is
An electronic circuit module characterized by having ribs protruding toward the electronic component in a region of the top plate portion facing the electronic component. The metal cover is
The electronic circuit module according to claim 1, wherein a plurality of annular ribs are provided in a region of the top plate portion facing the electronic component. The metal cover is
The electronic circuit module according to claim 2, wherein a plurality of annular ribs arranged concentrically with respect to the center of the region are provided in a region of the top plate portion facing the electronic component. .. The rib
The top plate portion is convex with respect to the first surface on the electronic component side, and a concave groove portion is formed with respect to the second surface on the top plate portion opposite to the first surface. The electronic circuit module according to any one of claims 1 to 3. The circuit board
An inner surface grounding electrode provided on the central side of the mounting surface and
An annular outer surface ground electrode provided apart from the inner surface ground electrode so as to surround the inner surface ground electrode on the mounting surface.
The inner surface ground electrode and the lower ground electrode provided below the outer surface ground electrode,
It has a first via that connects the inner surface ground electrode and the lower ground electrode, and a second via that connects the outer surface ground electrode and the lower ground electrode.
The metal cover is
It has a side plate portion that is provided so as to hang down along the outer peripheral edge portion of the top plate portion, and is soldered to the outer surface layer ground electrode over the entire circumference of the ring formed by the side plate portion.
The electronic circuit module according to any one of claims 1 to 4, wherein the electronic circuit module is characterized in that. The electronic circuit according to any one of claims 1 to 5, wherein the heat conductive member is silicon grease containing fine particles made of a material having high heat conductivity, high dielectric constant, and insulating property. module. The electronic circuit module according to any one of claims 1 to 6, further comprising a convex portion on the upper surface of the electronic component at a position avoiding the rib. Any one of claims 1 to 7, wherein a peelable film is attached to a second surface of the top plate portion opposite to the first surface facing the electronic component. The electronic circuit module described in. The circuit board
It has a surface ground electrode provided on the mounting surface.
The metal cover is
The invention according to any one of claims 1 to 8, wherein the top plate portion has a pair of openings facing the surface ground electrode in a region other than the region facing the electronic component. Electronic circuit module. The top plate is
Has a flat part in the center
The electronic circuit module according to any one of claims 1 to 9, wherein a region facing the electronic component is provided around the flat portion. The metal cover is
The electronic circuit module according to claim 1, wherein the top plate portion has the spiral rib in a region facing the electronic component. The metal cover is
The electronic circuit module according to claim 1, wherein a plurality of point-shaped ribs are provided in a region of the top plate portion facing the electronic component. The metal cover is
The electronic circuit module according to claim 1, wherein the top plate portion has the ribs in a grid pattern in a region facing the electronic component.

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