JP4249772B2 - Electronic circuit unit - Google Patents

Electronic circuit unit Download PDF

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JP4249772B2
JP4249772B2 JP2006273982A JP2006273982A JP4249772B2 JP 4249772 B2 JP4249772 B2 JP 4249772B2 JP 2006273982 A JP2006273982 A JP 2006273982A JP 2006273982 A JP2006273982 A JP 2006273982A JP 4249772 B2 JP4249772 B2 JP 4249772B2
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insulating substrate
circuit unit
electronic circuit
reinforcing
land
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JP2008091832A (en
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僚 岩崎
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Description

本発明は、携帯電話機に使用される送受信ユニット等に適用して好適な電子回路ユニットに関するものである。   The present invention relates to an electronic circuit unit suitable for application to a transmission / reception unit or the like used in a mobile phone.

従来の電子回路ユニットに係る図面を説明すると、図４は従来の電子回路ユニットの側面図、図５は従来の電子回路ユニットに使用される絶縁基板の下面図、図６は従来の電子回路ユニットに使用される絶縁基板の下面図、図７は従来の電子回路ユニットに使用される絶縁基板の下面図である。   FIG. 4 is a side view of a conventional electronic circuit unit, FIG. 5 is a bottom view of an insulating substrate used in the conventional electronic circuit unit, and FIG. 6 is a conventional electronic circuit unit. FIG. 7 is a bottom view of an insulating substrate used in a conventional electronic circuit unit.

次に、従来の電子回路ユニットの構成を図４，図５に基づいて説明すると、四角形状をなす絶縁基板５１の上面には、配線パターン（図示せず）と、この配線パターンに接続された電子部品５２とが設けられ、また、絶縁基板５１の下面には、配線パターンに接続された複数個の接続ランド部５３と、絶縁基板５１のそれぞれの角部に対して４５度の位置で対向した状態で、中央部側寄りに配置された４個の補強ランド部５４とが設けられると共に、この補強ランド部５４は、絶縁基板５１の各角部に対して１個ずつ配置されて、従来の電子回路ユニットが形成されている（例えば、特許文献１参照）。   Next, the configuration of the conventional electronic circuit unit will be described with reference to FIGS. 4 and 5. A wiring pattern (not shown) is connected to the upper surface of the rectangular insulating substrate 51 and connected to the wiring pattern. The electronic component 52 is provided, and a plurality of connection land portions 53 connected to the wiring pattern are opposed to the lower surface of the insulating substrate 51 at positions of 45 degrees with respect to the respective corner portions of the insulating substrate 51. In this state, four reinforcing land portions 54 disposed closer to the center portion side are provided, and one reinforcing land portion 54 is disposed for each corner portion of the insulating substrate 51. The electronic circuit unit is formed (for example, see Patent Document 1).

一般に、高周波の電子回路ユニットを形成する場合、ここでは図示しないが、金属板製のカバーによって電子部品５２を覆い、カバーの脚部（図示せず）が絶縁基板５１に設けた貫通孔５１ａに挿入して取り付けられるようになっているが、このような場合、図６に示すように、貫通孔５１ａが補強ランド部５４に位置したもの、或いは図７に示すように、貫通孔５１ａが補強ランド部５４から角部側に離間して設けられるものがある。   In general, when forming a high-frequency electronic circuit unit, although not shown here, the electronic component 52 is covered with a cover made of a metal plate, and a leg portion (not shown) of the cover is formed in the through hole 51 a provided in the insulating substrate 51. In such a case, as shown in FIG. 6, the through hole 51a is located in the reinforcing land portion 54, or as shown in FIG. 7, the through hole 51a is reinforced. Some are provided to be separated from the land portion 54 toward the corner portion side.

このような構成を有する従来の電子回路ユニットは、ここでは図示しないが、絶縁基板５１の下面が電子機器のマザー基板上に載置されて、接続ランド部５３と補強ランド部５４がマザー基板側のランド部に半田等によってフリップチップ実装されるようになっている。   Although the conventional electronic circuit unit having such a configuration is not shown here, the lower surface of the insulating substrate 51 is placed on the mother substrate of the electronic device, and the connection land portion 53 and the reinforcing land portion 54 are on the mother substrate side. The lands are flip-chip mounted with solder or the like.

そして、携帯電話機等の電子機器が落下した際、絶縁基板５１の中央部において応力（曲げ荷重）がかかった場合には、絶縁基板５１の側辺部で最大となるが、この落下時、補強ランド部５４によって補強し、マザー基板からの補強ランド部５４、接続ランド部５３、及び絶縁基板５１の剥がれを防ぐようになっている。
特許第２８５９１４３号公報 When an electronic device such as a cellular phone is dropped, if stress (bending load) is applied at the central portion of the insulating substrate 51, the maximum occurs at the side of the insulating substrate 51. The land 54 is reinforced to prevent the reinforcing land 54, the connecting land 53, and the insulating substrate 51 from being peeled off from the mother board.
Japanese Patent No. 2859143

しかし、従来の電子回路ユニットにおいて、１個の補強ランド部５４が絶縁基板５１の各角部に対して４５度の中央部側寄りに配置され、貫通孔５１ａが補強ランド部５４に位置したもの（図６参照）にあっては、マザー基板に絶縁基板５１を取り付けた際、補強ランド部５４に位置する半田が貫通孔５１ａ内に逃げて、半田量が少なくなって、落下時、補強ランド部５４，接続ランド部５３、及び絶縁基板５１の剥がれを起こすという問題がある。   However, in the conventional electronic circuit unit, one reinforcing land portion 54 is arranged closer to the central portion side of 45 degrees with respect to each corner portion of the insulating substrate 51, and the through hole 51 a is located in the reinforcing land portion 54. (See FIG. 6), when the insulating substrate 51 is attached to the mother substrate, the solder located in the reinforcing land portion 54 escapes into the through hole 51a, and the amount of solder is reduced. There is a problem that the portion 54, the connection land portion 53, and the insulating substrate 51 are peeled off.

また、貫通孔５１ａが補強ランド部５４から角部側に離間して設けられたもの（図７参照）にあっては、補強ランド部５４が更に中央部側寄りとなって、補強ランド部５４が絶縁基板５１の側辺部から大きく離れ、絶縁基板５１の側辺部の支持が不十分となって、落下時、補強ランド部５４，接続ランド部５３、及び絶縁基板５１の剥がれを起こすという問題がある。   Further, in the case where the through-hole 51a is provided apart from the reinforcing land portion 54 toward the corner portion (see FIG. 7), the reinforcing land portion 54 is further closer to the center portion side so that the reinforcing land portion 54 is located. Is far away from the side portion of the insulating substrate 51, and the support of the side portion of the insulating substrate 51 becomes insufficient, causing the reinforcing land portion 54, the connection land portion 53, and the insulating substrate 51 to peel off when dropped. There's a problem.

本発明は、このような従来技術の実情に鑑みてなされたもので、その目的は、落下時における絶縁基板の剥がれの無い電子回路ユニットを提供することにある。   The present invention has been made in view of such a state of the art, and an object thereof is to provide an electronic circuit unit in which an insulating substrate does not peel off when dropped.

上記の目的を達成するために、本発明の電子回路ユニットは、配線パターンが上面に設けられ、配線パターンに接続された複数個の接続ランド部が下面に設けられた四角形状の絶縁基板と、配線パターンに接続された電子部品と、この電子部品を覆った状態で、絶縁基板の上面に取り付けられたカバーとを備え、絶縁基板の角部近傍には、貫通孔が設けられ、この貫通孔にカバーの脚部が挿入されて取り付けられると共に、絶縁基板の下面には、貫通孔から離間した状態で、絶縁基板の角部近傍における直角をなしたそれぞれの側辺に近接して配置された複数の補強ランド部が設けられ、複数の前記補強ランド部は、前記貫通孔を含む前記絶縁基板の角部近傍を囲むように配置されたことを特徴としている。 In order to achieve the above object, an electronic circuit unit of the present invention includes a rectangular insulating substrate in which a wiring pattern is provided on the upper surface, and a plurality of connection land portions connected to the wiring pattern are provided on the lower surface, An electronic component connected to the wiring pattern and a cover attached to the upper surface of the insulating substrate in a state of covering the electronic component. A through hole is provided near a corner of the insulating substrate. The cover legs are inserted and attached to the bottom surface of the insulating substrate, and are arranged close to the respective sides that form a right angle in the vicinity of the corner portion of the insulating substrate on the lower surface of the insulating substrate in a state of being separated from the through holes. A plurality of reinforcing land portions are provided, and the plurality of reinforcing land portions are arranged so as to surround the vicinity of corner portions of the insulating substrate including the through holes .

このように構成した本発明は、複数の補強ランド部が貫通孔から離間し、絶縁基板の角部近傍の側辺に近接して配置されたため、補強ランド部に位置した半田が貫通孔内に逃げて半田量が少なくなることがない上に、絶縁基板の側辺部に近い位置に補強ランド部を分散でき、補強ランド部によって絶縁基板の側辺部の支持が確実にできて、落下時、補強ランド部，接続ランド部、及び絶縁基板の剥がれの無いものが得られる。   In the present invention configured as described above, since the plurality of reinforcing land portions are separated from the through holes and are arranged close to the side sides in the vicinity of the corner portions of the insulating substrate, the solder located on the reinforcing land portions is placed in the through holes. In addition to avoiding runaway soldering and reducing the amount of solder, the reinforcing land can be dispersed near the side of the insulating board, and the side of the insulating board can be reliably supported by the reinforcing land, so that when dropped Thus, the reinforcing land portion, the connecting land portion, and the insulating substrate without peeling off can be obtained.

また、このように構成した本発明は、補強ランド部が絶縁基板の角部近傍を囲むように配置されたため、補強ランド部による絶縁基板の角部の支持が一層確実にできて、落下時、補強ランド部，接続ランド部、及び絶縁基板の剥がれの無いものが得られる。 In addition, the present invention configured as described above is arranged so that the reinforcing land portion surrounds the vicinity of the corner portion of the insulating substrate, so that the corner portion of the insulating substrate can be more reliably supported by the reinforcing land portion, and when dropped, A reinforcing land portion, a connection land portion, and an insulating substrate with no peeling are obtained.

また、本発明の電子回路ユニットは、上記発明において、接続ランド部は、絶縁基板の側辺に沿って近接して並設され、補強ランド部が接続ランド部の列の延長線上に配置されたことを特徴としている。   Further, in the electronic circuit unit of the present invention, in the above invention, the connection land portions are arranged side by side along the side of the insulating substrate, and the reinforcement land portions are arranged on the extension lines of the rows of the connection land portions. It is characterized by that.

このように構成した本発明は、補強ランド部と接続ランド部が絶縁基板の側辺に沿って近接して配置されたため、接続ランド部のスペースファクタが良い上に、接続ランド部による絶縁基板の側辺での支持が良好となり、接続ランド部による落下時の補強支援が大きくできて、落下時、補強ランド部，接続ランド部、及び絶縁基板の剥がれの無いものが得られる。   In the present invention configured as described above, since the reinforcing land portion and the connection land portion are arranged close to each other along the side of the insulating substrate, the space factor of the connection land portion is good and the insulating land of the insulating land by the connection land portion is good. The support on the side becomes good, and the reinforcement support at the time of dropping by the connecting land portion can be increased, and when the falling, the reinforcing land portion, the connecting land portion, and the insulating substrate are not peeled off.

本発明の電子回路ユニットは、複数の補強ランド部が貫通孔から離間し、絶縁基板の角部近傍の側辺に近接して配置されたため、補強ランド部に位置した半田が貫通孔内に逃げることが無い上に、絶縁基板の側辺部に近い位置に補強ランド部を分散でき、補強ランド部によって絶縁基板の側辺部の支持が確実にできて、落下時、補強ランド部，接続ランド部、及び絶縁基板の剥がれの無いものが得られる。さらに、補強ランド部が絶縁基板の角部近傍を囲むように配置されたため、補強ランド部による絶縁基板の角部の支持が一層確実にできて、落下時、補強ランド部，接続ランド部、及び絶縁基板の剥がれの無いものが得られる。 In the electronic circuit unit of the present invention, the plurality of reinforcing land portions are separated from the through holes and are disposed close to the side sides near the corners of the insulating substrate, so that the solder located in the reinforcing land portions escapes into the through holes. In addition, the reinforcing land can be dispersed near the side of the insulating board, and the side of the insulating board can be reliably supported by the reinforcing land. A part and a thing without exfoliation of an insulating substrate are obtained. Further, since the reinforcing land portion is disposed so as to surround the vicinity of the corner portion of the insulating substrate, the reinforcing land portion can more reliably support the corner portion of the insulating substrate, and when dropped, the reinforcing land portion, the connection land portion, and An insulating substrate without peeling can be obtained.

発明の実施の形態について図面を参照して説明すると、図１は本発明の電子回路ユニットの要部断面図、図２は本発明の電子回路ユニットに使用される絶縁基板の下面図、図３は本発明の他の実施形態に係る電子回路ユニットに使用される絶縁基板の要部拡大下面図である。   An embodiment of the invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view of an essential part of the electronic circuit unit of the present invention, FIG. 2 is a bottom view of an insulating substrate used in the electronic circuit unit of the present invention, and FIG. These are the principal part expanded bottom views of the insulated substrate used for the electronic circuit unit which concerns on other embodiment of this invention.

次に、本発明の電子回路ユニットに係る一実施形態の構成を図１、図２に基づいて説明すると、四角形状をなす絶縁基板１の上面には、配線パターン２と、この配線パターン２に接続された電子部品３とが設けられ、また、絶縁基板１の下面には、配線パターン２に接続された複数個の接続ランド部４と、絶縁基板１の角部近傍に設けられた貫通孔１ａから離間した状態で、貫通孔１ａを含む絶縁基板１の角部近傍を囲むように配置された複数の補強ランド部５とが設けられている。   Next, the configuration of an embodiment of the electronic circuit unit according to the present invention will be described with reference to FIGS. 1 and 2. On the upper surface of the rectangular insulating substrate 1, a wiring pattern 2 and a wiring pattern 2 are formed. Connected electronic components 3 are provided, and a plurality of connection land portions 4 connected to the wiring pattern 2 and through holes provided near corners of the insulating substrate 1 are provided on the lower surface of the insulating substrate 1. A plurality of reinforcing land portions 5 are provided so as to surround the vicinity of the corner portion of the insulating substrate 1 including the through hole 1a in a state of being separated from 1a.

この実施形態では、補強ランド部５がそれぞれの角部近傍に二つずつ配置され、補強ランド部５の一つは、絶縁基板１の角部近傍における直角をなした一方の側辺に近接して配置され、補強ランド部５のもう一つは、絶縁基板１の角部近傍における直角をなした他方の側辺に近接して配置されている。   In this embodiment, two reinforcing land portions 5 are arranged in the vicinity of each corner portion, and one of the reinforcing land portions 5 is adjacent to one side that forms a right angle in the vicinity of the corner portion of the insulating substrate 1. The other of the reinforcing land portions 5 is disposed close to the other side that forms a right angle in the vicinity of the corner portion of the insulating substrate 1.

また、接続ランド部４は、絶縁基板１の側辺に近接した状態で、絶縁基板１の各側辺に沿って並設されると共に、補強ランド部５が接続ランド部４の列の延長線上に配置されている。   Further, the connection land portions 4 are juxtaposed along the respective side edges of the insulating substrate 1 in a state of being close to the side edges of the insulating substrate 1, and the reinforcing land portions 5 are on the extended lines of the rows of the connection land portions 4. Is arranged.

なお、この接続ランド部４は、各角部に設けられた補強ランド部５で囲まれた絶縁基板１の下面中央部側に設けても良く、また、接続ランド部４は、下面中央部側と絶縁基板１の側辺近傍の双方に設けても良い。   In addition, this connection land part 4 may be provided in the lower surface center part side of the insulated substrate 1 enclosed by the reinforcement land part 5 provided in each corner | angular part, and the connection land part 4 is the lower surface center part side. And in the vicinity of the side of the insulating substrate 1.

カバー６は、箱形をなした金属板で形成され、電子部品３を覆う覆い部６ａと、この覆い部６ａから下方に延びる脚部６ｂを有し、このカバー６は、覆い部６ａによって電子部品３を覆った状態で、脚部６ｂが貫通孔１ａに挿入され、この脚部６ｂが配線パターン２の一部である接地パターンに半田付けされて取り付けられて、本発明の高周波の電子回路ユニットが形成されている。   The cover 6 is formed of a box-shaped metal plate, and includes a cover portion 6a that covers the electronic component 3, and a leg portion 6b that extends downward from the cover portion 6a. The cover 6 is electronically separated by the cover portion 6a. The leg portion 6b is inserted into the through hole 1a in a state of covering the component 3, and the leg portion 6b is soldered and attached to the ground pattern which is a part of the wiring pattern 2, so that the high-frequency electronic circuit of the present invention is installed. A unit is formed.

このような構成を有する本発明の電子回路ユニットは、ここでは図示しないが、絶縁基板１の下面が電子機器のマザー基板上に載置されて、接続ランド部４と補強ランド部５がマザー基板側のランド部に半田等によってフリップチップ実装されるようになっている。   Although the electronic circuit unit of the present invention having such a configuration is not shown here, the lower surface of the insulating substrate 1 is placed on the mother substrate of the electronic device, and the connection land portion 4 and the reinforcing land portion 5 are the mother substrate. Flip chip mounting is performed by solder or the like on the side land portion.

そして、携帯電話機等の電子機器が落下した際、絶縁基板１の中央部において応力（曲げ荷重）がかかった場合には、絶縁基板１の側辺部で最大となるが、この落下時、補強ランド部５によって補強し、マザー基板からの補強ランド部５、接続ランド部５、及び絶縁基板１の剥がれを防ぐようになっている。   When a stress (bending load) is applied to the central portion of the insulating substrate 1 when an electronic device such as a cellular phone is dropped, the maximum is given to the side portion of the insulating substrate 1. Reinforcement is performed by the land portion 5, and the reinforcement land portion 5, the connection land portion 5, and the insulating substrate 1 are prevented from peeling off from the mother substrate.

即ち、本発明の電子回路ユニットにおいては、絶縁基板１の側辺部に近い位置に分散した複数の補強ランド部５によって、落下時における絶縁基板１の側辺部の支持が確実にできて、また、接続ランド部４を絶縁基板１の側辺に近接して配置することによって、落下時における接続ランド部４による絶縁基板１の側辺での支持が良好で、落下時の補強支援を大きくできる。   That is, in the electronic circuit unit of the present invention, the plurality of reinforcing land portions 5 dispersed at positions close to the side portions of the insulating substrate 1 can reliably support the side portions of the insulating substrate 1 when dropped. Further, by arranging the connection land portion 4 close to the side of the insulating substrate 1, the connection land portion 4 is well supported on the side of the insulating substrate 1 at the time of dropping, and the reinforcement support at the time of dropping is greatly increased. it can.

また、図３は本発明の他の実施形態に係る電子回路ユニットを示し、この実施形態は、絶縁基板１の各角部近傍が三個の補強ランド部５によって囲まれるようにしたものであり、その他の構成は、上記実施形態と同様の構成を有し、同一部品に同一番号を付し、ここではその説明を省略する。   FIG. 3 shows an electronic circuit unit according to another embodiment of the present invention. In this embodiment, the vicinity of each corner of the insulating substrate 1 is surrounded by three reinforcing land portions 5. Other configurations have the same configurations as those of the above-described embodiment, and the same parts are denoted by the same reference numerals, and the description thereof is omitted here.

なお、補強ランド部５は、４個以上設けて、絶縁基板１の角部近傍を囲むようにしても良い。   Note that four or more reinforcing land portions 5 may be provided so as to surround the vicinity of the corner portion of the insulating substrate 1.

本発明の電子回路ユニットの要部断面図である。It is principal part sectional drawing of the electronic circuit unit of this invention. 本発明の電子回路ユニットに使用される絶縁基板の下面図である。It is a bottom view of the insulated substrate used for the electronic circuit unit of this invention. 本発明の他の実施形態に係る電子回路ユニットに使用される絶縁基板の要部拡大下面図である。It is a principal part expanded bottom view of the insulated substrate used for the electronic circuit unit which concerns on other embodiment of this invention. 従来の電子回路ユニットの側面図である。It is a side view of the conventional electronic circuit unit. 従来の電子回路ユニットに使用される絶縁基板の下面図である。It is a bottom view of the insulated substrate used for the conventional electronic circuit unit. 従来の電子回路ユニットに使用される絶縁基板の下面図である。It is a bottom view of the insulated substrate used for the conventional electronic circuit unit. 従来の電子回路ユニットに使用される絶縁基板の下面図である。It is a bottom view of the insulated substrate used for the conventional electronic circuit unit.

符号の説明Explanation of symbols

１ 絶縁基板
１ａ 貫通孔
２ 配線パターン
３ 電子部品
４ 接続ランド部
５ 補強ランド部
６ カバー
６ａ 覆い部
６ｂ 脚部 DESCRIPTION OF SYMBOLS 1 Insulation board 1a Through-hole 2 Wiring pattern 3 Electronic component 4 Connection land part 5 Reinforcement land part 6 Cover 6a Cover part 6b Leg part

Claims (2)

配線パターンが上面に設けられ、前記配線パターンに接続された複数個の接続ランド部が下面に設けられた四角形状の絶縁基板と、前記配線パターンに接続された電子部品と、この電子部品を覆った状態で、前記絶縁基板の上面に取り付けられたカバーとを備え、前記絶縁基板の角部近傍には、貫通孔が設けられ、この貫通孔に前記カバーの脚部が挿入されて取り付けられると共に、前記絶縁基板の下面には、前記貫通孔から離間した状態で、前記絶縁基板の角部近傍における直角をなしたそれぞれの側辺に近接して配置された複数の補強ランド部が設けられ、
複数の前記補強ランド部は、前記貫通孔を含む前記絶縁基板の角部近傍を囲むように配置されたことを特徴とする電子回路ユニット。 A rectangular insulating substrate having a wiring pattern provided on the upper surface and a plurality of connection land portions connected to the wiring pattern provided on the lower surface, an electronic component connected to the wiring pattern, and covering the electronic component And a cover attached to the upper surface of the insulating substrate. A through hole is provided in the vicinity of the corner of the insulating substrate, and a leg portion of the cover is inserted and attached to the through hole. The lower surface of the insulating substrate is provided with a plurality of reinforcing land portions arranged close to the respective sides forming a right angle in the vicinity of the corner portion of the insulating substrate in a state of being separated from the through hole ,
The electronic circuit unit , wherein the plurality of reinforcing land portions are arranged so as to surround a vicinity of a corner portion of the insulating substrate including the through hole . 前記接続ランド部は、前記絶縁基板の側辺に沿って近接して並設され、前記補強ランド部が前記接続ランド部の列の延長線上に配置されたことを特徴とする請求項１記載の電子回路ユニット。 The connecting land portion, the juxtaposed adjacent along the sides of the insulating substrate, the reinforcing land portion according to claim 1, characterized in that arranged on the extension of the column of the connecting land portion Electronic circuit unit.
JP2006273982A 2006-10-05 2006-10-05 Electronic circuit unit Active JP4249772B2 (en)

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JP2006273982A JP4249772B2 (en) 2006-10-05 2006-10-05 Electronic circuit unit
TW096137131A TW200828534A (en) 2006-10-05 2007-10-03 Electronic circuit unit

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Application Number Priority Date Filing Date Title
JP2006273982A JP4249772B2 (en) 2006-10-05 2006-10-05 Electronic circuit unit

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JP4249772B2 true JP4249772B2 (en) 2009-04-08

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TWI348751B (en) 2011-09-11
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