WO2021012319A1 - 封装薄膜及其制备方法、有机发光显示面板及其制备方法 - Google Patents

封装薄膜及其制备方法、有机发光显示面板及其制备方法 Download PDF

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Publication number
WO2021012319A1
WO2021012319A1 PCT/CN2019/099712 CN2019099712W WO2021012319A1 WO 2021012319 A1 WO2021012319 A1 WO 2021012319A1 CN 2019099712 W CN2019099712 W CN 2019099712W WO 2021012319 A1 WO2021012319 A1 WO 2021012319A1
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Prior art keywords
organic
layer
inorganic
moisture
absorbing material
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PCT/CN2019/099712
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English (en)
French (fr)
Inventor
赵振宇
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武汉华星光电半导体显示技术有限公司
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Priority to US16/616,085 priority Critical patent/US20210328180A1/en
Publication of WO2021012319A1 publication Critical patent/WO2021012319A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present invention relates to the technical field of film packaging and display, in particular to a packaging film and a preparation method thereof, an organic light emitting display panel and a preparation method thereof.
  • Organic Light-Emitting Diode also known as Organic Light-Emitting Diode
  • OLED Organic Light-Emitting Diode
  • LCD liquid crystal display
  • Organic light-emitting devices are an important part of organic light-emitting display panels. Water and oxygen have a great impact on their lifespan. One is easy to react with the conductive material of the cathode of the organic light-emitting device; the other is easy to interact with organic light-emitting devices. The hole transport layer, electron transport layer, and light-emitting layer undergo a chemical reaction, which causes the organic light-emitting device to fail.
  • organic light emitting display panels in the prior art usually adopt thin film packaging (Thin Film Encapsulation, TFE) method for packaging organic light-emitting devices.
  • the packaging film used in the TFE method includes an inorganic layer and an organic layer that are overlapped to prevent water and oxygen from entering the organic light-emitting device.
  • the existing packaging film can only passively block water and oxygen. This is helpless for the water and oxygen mixed in during the production process of the packaging film and the water and oxygen that invades into the packaging film along the packaging defects, thereby threatening the normal service life of the organic light-emitting device.
  • the existing packaging film is unable to block the water and oxygen that penetrates into the packaging film during the manufacturing process and along the packaging defects.
  • the invention provides a packaging film.
  • the encapsulation film includes an inorganic substance layer and an organic substance layer alternately stacked, and the organic substance layer includes an organic substance matrix and a moisture-absorbing material distributed in the organic substance matrix.
  • the present invention also provides an organic light emitting display panel.
  • the organic light emitting display panel includes an organic light emitting device, and the above-mentioned packaging film, and an inorganic layer of the packaging film covers the surface of the organic light emitting device.
  • the invention also provides a method for preparing the packaging film.
  • the method includes:
  • An organic substance layer is formed on the inorganic substance layer, or an organic substance layer and an inorganic substance layer are alternately stacked in sequence, wherein the organic substance layer includes an organic substance matrix and a moisture-absorbing material distributed in the organic substance matrix.
  • the moisture-absorbing material in the organic layer, even if water and oxygen are mixed in the packaging film and intrude into the packaging film along the packaging defects, the moisture-absorbing material can absorb it and prevent the water and oxygen from continuing to invade the organic light-emitting device. Therefore, the water and oxygen barrier capability of the organic light emitting device is ensured, which is beneficial to guarantee the normal use of the organic light emitting device.
  • FIG. 1 is a schematic structural diagram of an embodiment of the packaging film of the present invention
  • FIG. 2 is a schematic structural diagram of an embodiment of an organic light emitting display panel of the present invention.
  • FIG. 3 is a schematic flow chart of an embodiment of the method for preparing the packaging film of the present invention.
  • FIG. 4 is a schematic flowchart of an embodiment of the method for preparing an organic layer of the present invention.
  • FIG. 5 is a schematic flowchart of an embodiment of a method for manufacturing an organic light emitting display panel of the present invention
  • FIG. 6 is a schematic flowchart of an embodiment of a method for preparing an organic layer in an organic light emitting display panel of the present invention.
  • the packaging technology for OLED devices usually includes glass cover packaging technology and TFE film packaging technology. Because TFE film packaging technology does not require a rigid glass cover, it can adapt OLED devices to the flexible function of bending and folding, so it has become the current mainstream packaging trend.
  • TFE film encapsulation can only passively isolate water and oxygen, that is, isolate the external water and oxygen after completing the form of the encapsulation layer.
  • the water and oxygen mixed in during the manufacturing process of the packaging layer and the water and oxygen entering the packaging layer along the packaging defects (such as gaps) cannot play a blocking role, thereby affecting the overall long-term isolation effect of the packaging layer. Therefore, the present invention provides an improved packaging film to improve the water and oxygen isolation capability of the packaging film.
  • the packaging film of an embodiment of the present invention includes alternately stacked inorganic layers and organic layers.
  • the organic layer includes an organic substrate and a moisture-absorbing material distributed in the organic substrate.
  • FIG. 1 is a schematic structural diagram of an embodiment of the packaging film 10 of the present invention.
  • the packaging film 10 includes three levels, including a first inorganic layer 11, an organic layer 12, and a second inorganic layer 13 alternately stacked.
  • the organic layer 12 includes an organic substrate 121 and a moisture absorbing material 122 distributed in the organic substrate 121. Due to the uneven nature of the two inorganic layers, an organic layer 12 needs to be inserted between the two to help stabilize the OLED organic light-emitting device.
  • the first inorganic layer 11 and the second inorganic layer 13 have insulating properties, and the material can be one of SiOx, SiNx, or SiONx, which are formed by spraying.
  • the materials of the first inorganic layer 11 and the second inorganic layer 13 may be the same or different. In this embodiment, the materials of the first inorganic layer 11 and the second inorganic layer 13 are the same. Because the first inorganic layer 11 and the second inorganic layer 13 have stable chemical properties, they do not react with water and oxygen, and have a strong water and oxygen isolation capability.
  • the organic layer 12 has strong stress characteristics and is used to alleviate the diffusion of water and oxygen.
  • the organic layer 12 includes an organic substrate 121 and a moisture absorbing material 122 distributed in the organic substrate 121.
  • the main component of the organic matrix 121 is a liquid polymethyl methacrylate organic solvent, and the other components can also be materials such as epoxy resin and acrylate.
  • the moisture absorbing material 122 is added to the organic solvent, and the organic layer 12 is formed by spraying and forming a film in a nitrogen atmosphere.
  • the material composition of the hygroscopic material 122 includes one or more of calcium oxide, magnesium sulfate, calcium sulfate, aluminum oxide, and barium oxide.
  • the material of the moisture absorbing material 122 is preferably calcium oxide.
  • Calcium oxide is a white powder, which is very sensitive to moisture and easily absorbs moisture. It can achieve the effect of actively absorbing the water vapor mixed in the packaging layer production process and the water vapor entering the packaging layer along the packaging defects (voids), and effectively reduce the risk of OLED device failure due to water vapor erosion.
  • part of the oxygen dissolved in the water will not be easy to move, which reduces the rate of oxygen movement and further achieves the effect of oxygen isolation.
  • anhydrous magnesium sulfate, calcium sulfate, aluminum oxide and barium oxide are also commonly used chemical drying reagents.
  • the color is white. After moisture absorption, the color, particle size and material properties after absorption will not have a major impact on the packaging structure. All can be used . Therefore, in other embodiments, a combination of multiple moisture absorbent particles can be used to make the moisture absorbent particles with slightly different moisture absorption properties complementary to each other, so that the moisture absorption effect is more perfect.
  • the hygroscopic material 122 is distributed in the organic matrix 121 in a granular form.
  • the particle size is nanometer level, that is, the particle size of calcium oxide is nanometer level, ranging from a few nanometers to a few hundred nanometers.
  • the particle size range of calcium oxide is between 2 nm and 600 nm.
  • the particle size of calcium oxide may be 2 nm, 50 nm, 110 nm, 120 nm, 130 nm, 400 nm, and 600 nm.
  • the ratio of the particle size of the moisture absorbent particles 122 to the thickness of the organic layer 12 is between 1/10000 and 1/100, so as to ensure that the properties of the moisture absorbent particles change after absorbing water without affecting the use effect of the entire packaging film 110.
  • the ratio of the particle size of the moisture absorbent particles 122 to the thickness of the organic layer 12 may be 1/10000, 1/5000, 1/1000, and 1/100.
  • the thickness of the packaging film 110 can be adjusted according to the needs of the final prepared display panel, display device or OLED device.
  • the concentration of the hygroscopic material 122 increases in sequence along the direction from the second inorganic layer 13 to the first inorganic layer 11 to increase the toughness of the entire packaging film 10, that is, On the side close to the organic light emitting device, the concentration of the moisture absorbing material 122 is the highest.
  • the hygroscopic material 122 can be distributed in the organic matrix 121 in a disorderly manner without concentration gradients, and at the same time can achieve a moisture absorption effect, but the toughness of the entire packaging film will be lower.
  • the particle size of the moisture absorbing material 122 may also change, such as a gradient change.
  • the particle size of the moisture absorbing material 122 along the direction in which the second inorganic layer 13 points to the first inorganic layer 11 can be arranged in such a way that the particle size of each level gradually increases or decreases.
  • the particle size of the moisture absorbent particles 122 along the direction in which the second inorganic layer 13 points to the first inorganic layer 11 also gradually increases in a gradient form, which can fully relieve the organic layer 12 and the first inorganic layer 11.
  • the concentrated stress between the inorganic layer 11 can also fully relieve the concentrated stress between the organic layer 12 and the first inorganic layer 13, so as to effectively improve the toughness of the entire packaging film 10.
  • the above-mentioned encapsulation film 10 by adding moisture absorbing material to the organic layer alternately laminated with the inorganic layer, the moisture absorbing material is distributed in the organic substrate, so that it can invade the OLED device during the packaging process and in the packaging defects along the packaging film 10
  • the water vapor is effectively absorbed, and the movement rate of oxygen dissolved in the water is also reduced, effectively isolating the water and oxygen from the OLED device, and avoiding the risk of failure of the OLED device due to water and oxygen erosion.
  • FIG. 2 is a schematic structural diagram of an embodiment of an organic light emitting display panel 100 of the present invention, which includes an organic light emitting device 20 and any one of the encapsulation films 10 described above.
  • the encapsulation film 10 has an inorganic layer covering the organic light emitting device. On the surface of the device 20, the encapsulating film 10 protects the organic light emitting device 20 from water and oxygen.
  • the organic light emitting device 20 in the organic light emitting display panel is an OLED light emitting device.
  • the specific structure includes an anode, a hole transport layer, an organic light emitting layer, an electron transport layer, and a cathode.
  • the entire structure is similar to a sandwich structure.
  • the anode is made of transparent material, which eliminates electrons when current flows through the device and increases electron holes.
  • the hole transport layer is composed of organic material molecules that transport "holes" from the anode.
  • Light-emitting layer It is composed of organic material molecules. The light-emitting process of the entire light-emitting panel is carried out on this layer.
  • Electron transport layer It is composed of organic material molecules that transport "electrons" from the cathode.
  • the cathode can be transparent or opaque. When there is current flowing in the device, the cathode will inject electrons into the circuit. Driven by an external voltage, electrons injected from the cathode and holes injected from the anode recombine in the light-emitting layer to form electron-hole pairs at bound energy levels, namely excitons. The excitons are de-excited to emit photons to produce visible light.
  • the above-mentioned packaging film 10 is used to package and protect the organic light emitting device. Specifically, during packaging protection, one of the inorganic layers 11 of the packaging film 10 covers the surface of the above-mentioned organic light emitting device 20.
  • the above-mentioned organic light-emitting display panel by covering the organic light-emitting device 20 with the packaging film 10, the organic light-emitting layer material and the cathode material that are easily corroded by water and oxygen are well isolated and protected, so that the organic light-emitting display panel can have a better use experience , At the same time, the organic light emitting display panel has a longer service life.
  • a display device may also be provided, including the above-mentioned organic light emitting display panel.
  • the above-mentioned display device may be a smart terminal, such as a tablet computer, a desktop computer, a notebook computer, or a mobile phone mobile terminal, and may also be a TV, a smart interactive terminal, and the like.
  • FIG. 3 is a schematic flow chart of an embodiment of the method for preparing the packaging film of the present invention, including step S31 to step S33.
  • the material of the inorganic layer can be one of SiOx, SiNx or SiONx.
  • SiOx, SiNx or SiONx is chemically stable, will not chemically react with moisture and oxygen, and has excellent isolation ability to both water and oxygen, so Used in OLED light-emitting devices, film-forming coverage, used to isolate water and oxygen.
  • an organic layer is formed on the inorganic layer, wherein the organic layer includes an organic substrate and a moisture-absorbing material distributed in the organic substrate.
  • the concentration of the moisture absorbing material in the organic matrix is along the direction of the inorganic layer pointing to the organic layer, and the concentration of the moisture absorbing material increases sequentially.
  • the inorganic layer is on the bottom, the organic layer is on the top, and the inorganic layer points to the direction of the organic layer, and the concentration of the hygroscopic material increases in sequence.
  • the first inorganic layer, the organic layer, and the second inorganic layer may be the second inorganic layer pointing in the direction of the first inorganic layer.
  • the concentration increases sequentially. This helps to make the outer layer of the OLED display panel close to the display substrate have sufficient tensile deformation.
  • the concentration of the moisture absorbent particles in the organic matrix can also show a gradient toward the direction of the inorganic layer.
  • the particle size becomes larger or smaller, so that the packaging film is suitable for different displays.
  • the step of forming an organic layer includes:
  • the organic solution is a polymethyl methacrylate organic solvent whose main component is liquid, and other components can also be materials such as epoxy resin and acrylate.
  • a hygroscopic material is added to the organic solution, and the material composition of the hygroscopic material includes one or more of calcium oxide, magnesium sulfate, calcium sulfate, aluminum oxide, and barium oxide.
  • the material component of the hygroscopic material is calcium oxide
  • the calcium oxide is distributed in the organic matrix in the form of particles.
  • the mass ratio of organic liquid mass to calcium oxide mass ratio is between 10000:1 and 100:5.
  • the particle size of calcium oxide ranges from a few nanometers to a few hundred nanometers.
  • the nanometer-scale calcium oxide size is only one ten thousandth to one hundredth of the thickness of the organic layer.
  • an inert gas N2 is used to form an organic solution mixed with a moisture-absorbing material on the above-mentioned inorganic substance using inkjet printing technology.
  • an inert gas atmosphere it will not affect the properties of the hygroscopic material (such as calcium oxide), that is, it will not affect its moisture absorption performance.
  • the liquid organic solution needs to be converted into a solid state, which can be cured by heating and air drying, or by natural air drying.
  • the organic substance solution changes from a liquid state to a solid state, the organic substance solution is in a film shape and is the aforementioned organic substance matrix, and the moisture-absorbing material is distributed in the organic substance matrix.
  • the inorganic layer has good insulation performance against water and oxygen, but its toughness is poor, and the organic layer is easy to form a uniform film, and the surface is dense, the combination of the organic layer and the inorganic layer not only realizes the perfect isolation of water and oxygen , which further improves the ductility and toughness of the packaging film.
  • the above-mentioned preparation method of the encapsulation film by adding a moisture absorbing material to the organic substrate, the organic substrate is distributed with the moisture absorbing material, so that the organic light emitting semiconductor device is absorbed along the defects of the encapsulation film or the water vapor mixed in the encapsulation process during the packaging process Material absorption enables the organic light emitting semiconductor device to be isolated from water for a long time and has a longer service life.
  • FIG. 5 is a schematic flowchart of an embodiment of a method for manufacturing an organic light emitting display panel of the present invention, including steps S41-S44.
  • Step S41 providing a display substrate on which an organic light emitting device is arranged.
  • the display substrate is a glass substrate, and the organic light-emitting device is the aforementioned OLED light-emitting device.
  • Step S42 forming an inorganic layer on the surface of the organic light-emitting device.
  • the material of the inorganic layer can be one of SiOx, SiNx or SiONx.
  • SiOx, SiNx or SiONx is chemically stable, will not chemically react with moisture and oxygen, and has excellent isolation ability to both water and oxygen, so Used in OLED light-emitting devices, film-forming coverage, used to isolate water and oxygen.
  • Step S43 forming an organic layer on the inorganic layer, or forming an organic layer and an inorganic layer alternately stacked in sequence, the organic layer including an organic substrate and a moisture-absorbing material distributed in the organic substrate.
  • the main component of the organic matrix is a liquid polymethyl methacrylate organic solvent, and other components can also be materials such as epoxy resin and acrylate.
  • a moisture-absorbing material is added to the organic solvent and the organic layer is formed by spraying and forming a film in a nitrogen atmosphere.
  • the hygroscopic material component includes one or more of calcium oxide, magnesium sulfate, calcium sulfate, aluminum oxide, and barium oxide.
  • the moisture-absorbing material component is calcium oxide, which is distributed in the organic matrix in the form of particles.
  • the step of forming an organic substance layer on the inorganic substance layer, the organic substance layer including an organic substance matrix and a hygroscopic material distributed in the organic substance matrix includes:
  • Step S431 mixing the hygroscopic material into the organic solution.
  • the organic solution is a polymethyl methacrylate organic solvent whose main component is liquid, and other components can also be materials such as epoxy resin and acrylate.
  • a hygroscopic material is added to the organic solution, and the material composition of the hygroscopic material includes one or more of calcium oxide, magnesium sulfate, calcium sulfate, aluminum oxide, and barium oxide.
  • the material component of the hygroscopic material is calcium oxide, and the calcium oxide is distributed in the organic matrix in the form of particles.
  • step S432 in a nitrogen atmosphere, an organic solution mixed with a moisture-absorbing material is formed on the inorganic substance layer using an inkjet printing technology.
  • an inert gas N2 is used to form an organic solution mixed with a moisture-absorbing material on the above-mentioned inorganic substance using inkjet printing technology.
  • an inert gas atmosphere it will not affect the properties of the hygroscopic material (such as calcium oxide), that is, it will not affect its moisture absorption performance.
  • Step S433 curing the organic solution mixed with the moisture absorbing material, the organic solution is formed into a film into an organic substrate, and the moisture absorbing material is distributed in the organic substrate.
  • the liquid organic solution needs to be converted into a solid state, which can be cured by heating and air drying, or by natural air drying.
  • the organic substance solution changes from a liquid state to a solid state, the organic substance solution is in a film shape and is the aforementioned organic substance matrix, and the moisture-absorbing material is distributed in the organic substance matrix.
  • the manufacturing method of the above organic light emitting display panel is by covering an encapsulating film on the organic light emitting device of the display substrate, and the encapsulating film includes an inorganic layer and an organic layer alternately stacked.
  • the organic layer includes an organic substrate and an organic substrate distributed in the organic substrate.
  • Moisture-absorbing material that is, adding moisture-absorbing material in the organic layer, so that the organic light-emitting semiconductor device is absorbed by the moisture-absorbing material along the defects of the packaging film during the packaging process or the water vapor mixed in the packaging process, so that the organic light-emitting semiconductor device can be isolated from water and oxygen for a long time .
  • the use effect of the whole organic light emitting display panel is more perfect, and the service life of the whole organic light emitting display panel is prolonged.

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Abstract

本发明公开一种封装薄膜及其制备方法、有机发光显示面板及其制备方法。本发明通过在有机物层中增设吸湿材料，即使水氧在封装薄膜制作过程中混入以及沿封装缺陷侵入至封装薄膜，该吸湿材料也可以将其吸收，并避免水氧继续侵入至显示屏的有机发光器件，从而确保对有机发光器件的水氧阻隔能力，有利于保障有机发光器件的正常使用。

Description

封装薄膜及其制备方法、有机发光显示面板及其制备方法 技术领域
本发明涉及薄膜封装及显示技术领域，具体而言涉及一种封装薄膜及其制备方法、有机发光显示面板及其制备方法。
 背景技术
有机发光（Organic Light-Emitting Diode, OLED，又称有机发光二极管）显示面板具有成本低、视角宽、对比度高、以及可弯折等优点，目前在小尺寸和大尺寸等方面的应用均取得显著成效，在不断侵占液晶显示器（Liquid Crystal Display，LCD）的市场份额。
有机发光器件（即OLED器件）作为有机发光显示面板的重要组成部分，水氧对其寿命存在较大影响，一是容易与有机发光器件的阴极的导电材料发生反应；二是容易与有机发光器件的空穴传输层、电子传输层以及发光层发生化学反应，进而引起有机发光器件失效。为了解决这个问题，现有技术的有机发光显示面板通常采用薄膜封装（Thin Film Encapsulation, TFE）方式对有机发光器件进行封装。TFE方式所采用的封装薄膜包括交叠设置的无机物层和有机物层，用以防止水氧入侵至有机发光器件。
现有的封装薄膜只能够被动的阻隔水氧。这对于封装薄膜制作过程中混入的水氧，以及沿封装缺陷侵入至封装薄膜的水氧则束手无策，从而威胁有机发光器件的正常的使用寿命。
 技术问题
由于现有的封装薄膜无法对制作过程中以及沿封装缺陷侵入至封装薄膜内的水氧进行阻隔的问题。
 技术解决方案
本发明提供一种封装薄膜。所述封装薄膜包括交替层叠的无机物层及有机物层，所述有机物层包括有机物基体及分布于所述有机物基体内的吸湿材料。
本发明另外提供一种有机发光显示面板。所述有机发光显示面板包括有机发光器件，以及上述封装薄膜，所述封装薄膜的一无机物层覆盖于所述有机发光器件的表面。
本发明还提供一种封装薄膜的制备方法。所述方法包括：
形成无机物层；
在所述无机物层上形成有机物层，或者依次交替层叠的有机物层及无机物层，其中所述有机物层包括有机物基体及分布于所述有机物基体内的吸湿材料。
 有益效果
本发明通过在有机物层中增设吸湿材料，即使水氧在封装薄膜制作过程中混入以及沿封装缺陷侵入至封装薄膜，该吸湿材料也可以将其吸收，并避免水氧继续侵入至有机发光器件，从而确保对有机发光器件的水氧阻隔能力，有利于保障有机发光器件的正常使用。
 附图说明
图1是本发明的封装薄膜一实施例的结构示意图；
图2是本发明的有机发光显示面板一实施例的结构示意图；
图3是本发明的封装薄膜的制备方法一实施例的流程示意图；
图4是本发明的有机物层的制备方法一实施例的流程示意图；
图5是本发明的有机发光显示面板的制备方法一实施例的流程示意图；
图6是本发明的有机发光显示面板中的有机物层的制备方法一实施例的流程示意图。
 本发明的实施方式
下面将结合本发明实施例中的附图，对本发明所提供的各个示例性的实施例的技术方案进行清楚、完整地描述。在不冲突的情况下，下述各个实施例及其技术特征可以相互组合。
本发明提到的方向用语，例如上、下、顶、底、前、后、左、右、内、外、侧、周围、中央、水平、横向、垂直、纵向、轴向、径向、最上层或最下层等，仅是参考附图的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
在现有技术当中，对OLED器件的封装技术通常包括玻璃盖板封装技术以及TFE薄膜封装技术。因TFE薄膜封装技术不需要刚性的玻璃盖板，可使OLED器件适应弯曲折叠的柔性功能，因此成为当前的主流封装趋势。然而TFE薄膜封装只能够被动的隔离水氧，即完成封装层的形态之后对外界水氧的隔离。然而对于封装层制作过程中混入的水氧以及沿封装缺陷（如缝隙）侵入封装层的水氧并不能起到阻隔作用，从而影响封装层的整体长期的隔离作用。因此本发明提供一种改良后的封装薄膜，以完善封装薄膜的隔离水氧能力。
本发明一实施例的封装薄膜包括交替层叠的无机物层及有机物层，其中有机物层包括有机物基体及分布于有机物基体内的吸湿材料。
具体地，请参阅图1，为本发明封装薄膜10一实施例的结构示意图。在本实施例中，封装薄膜10包括3个层级，包括交替层叠的第一无机物层11、有机物层12及第二无机物层13。有机物层12包括有机物基体121及分布于有机物基体121内的吸湿材料122。因两个无机物层的性质不均匀，因此需要在两者之间插入有机物层12，有助于稳定OLED有机发光器件。
进一步地，第一无机物层11及第二无机物层13具有绝缘特性，材料可为SiOx、SiNx或SiONx中的一种，进行喷涂形成。同时第一无机物层11及第二无机物层13的材料可相同也可不相同。在本实施例中，第一无机物层11及第二无机物层13的材料相同。因第一无机物层11及第二无机物层13具有稳定的化学性质，不与水氧发生反应，具有较强的水氧隔离能力。
有机物层12具有强的应力特性，用于缓解水氧扩散。有机物层12包括有机物基体121及分布于所述有机物基体121内的吸湿材料122。
其中有机物基体121主要成分为液态的聚甲基丙烯酸甲酯有机溶剂，其他成分还可以为环氧树脂及丙烯酸脂等材料。在有机溶剂中加入吸湿材料122，在氮气气氛下以喷涂成膜的方式生成有机物层12。
具体地，吸湿材料122的材料成分包括氧化钙、硫酸镁、硫酸钙、氧化铝及氧化钡中的一种或多种。在本实施例中，吸湿材料122的材料优选为氧化钙。氧化钙为白色粉末，对湿很敏感，极易吸收水分。能够达到主动吸收封装层制作过程中混入的水汽以及沿封装缺陷（空隙）侵入封装层的水汽的效果，有效降低因水汽侵蚀造成OLED器件失效的风险。同时，氧化钙在对水分进行吸收后，水中溶解的部分氧气将不便于移动，降低了氧气的运动速率，进一步达到了隔离氧气的效果。同时无水硫酸镁、硫酸钙、氧化铝及氧化钡也是常用的化学干燥试剂，颜色为白色，吸湿后颜色、粒径及吸收后材料性质也不会对封装结构产生较大影响，均可以使用。因此在其他实施例中，可使用多种吸湿剂颗粒的配合，以使吸湿性质有稍微差异的吸湿剂颗粒相互互补，使吸湿效果更完善。
进一步地，吸湿材料122以颗粒状分布于有机物基体121内。其粒径为纳米级别，也即氧化钙的粒径为纳米级别，范围从几纳米到几百纳米。具体地，在本实施例中，氧化钙的粒径范围介于2nm～600nm之间。在一个具体的实施例中，氧化钙的粒径可以为2nm、50nm、110nm、120nm、130nm、400nm、及600nm。同时，吸湿剂颗粒122的粒径与有机物层12的厚度之比介于1/10000～1/100之间，以保证吸湿剂颗粒吸水后性质变化但不影响整个封装薄膜110的使用效果。在具体的一个实施例中，吸湿剂颗粒122的粒径与有机物层12的厚度之比可以为1/10000、1/5000、1/1000及1/100。封装薄膜110的厚度可以根据最终制备的显示面板、显示装置或者OLED器件的需要进行调整。
具体地，请参阅图1，在本实施例中，吸湿材料122的浓度沿第二无机物层13指向第一无机物层11的方向依次递增，以增加整个封装薄膜10的韧性，也即在靠近有机发光器件的一侧，吸湿材料122的浓度最高。在其他实施例中，吸湿材料122可以杂乱无序不分浓度梯度的方式分布于有机物基体121内，同时能达到吸湿效果，但是整个封装薄膜的自身韧性会较低。
进一步地，在浓度沿第二无机物层13指向第一无机物层11的方向依次递增的同时，吸湿材料122的粒径也可发生变化，如呈梯度的变化。如沿第二无机物层13指向第一无机物层11的方向吸湿材料122的粒径可为每一层级的粒径逐渐增大或减小的方式进行排布。在一个具体的实施例中，如沿第二无机物层13指向第一无机物层11的方向吸湿剂颗粒122的粒径同时也呈梯度形式逐渐增大，可以充分缓解有机物层12和第一无机物层11的之间的集中应力，也可以充分缓解有机物层12和第一无机物层13的之间的集中应力，以有效的提高所述封装薄膜整体10的韧性。
上述封装薄膜10，通过在与无机物层交替层叠的有机物层中加入了吸湿材料，吸湿材料分布于有机物基体内，从而可以对OLED器件在封装过程中以及在沿封装薄膜10的封装缺陷中侵入的水汽进行有效吸收，同时也降低了水中溶解的氧气的运动速率，有效的使水氧与OLED器件隔离，避免了OLED器件受到水氧侵蚀导致失效的风险。
请参阅图2，为本发明的有机发光显示面板100一实施例的结构示意图，包括有机发光器件20和上述任一项所述的封装薄膜10，封装薄膜10的其中无机物层覆盖于有机发光器件20的表面，封装薄膜10对有机发光器件20进行隔离水氧保护。
有机发光显示面板中的有机发光器件20为OLED发光器件，具体结构包括阳极、空穴传输层、有机发光层、电子传输层以及阴极，整个结构类似于如三明治的结构。阳极为透明材质，在电流流过设备时消除电子，增加电子的空穴。空穴传输层由有机材料分子构成，这些分子传输由阳极而来的“空穴”。发光层：由有机材料分子构成，整个发光面板的发光过程在这一层进行。电子传输层：由有机材料分子构成，这些分子传输由阴极而来的“电子”。阴极可以是透明的，也可以不透明，当设备内有电流流通时，阴极会将电子注入电路。在外界电压的驱动下，由阴极注入的电子和阳极注入的空穴在发光层中复合形成处于束缚能级的电子空穴对，即激子，激子辐射退激发发出光子，产生可见光。
因有机发光层和阴极对水和氧气非常敏感，为防止水氧入侵腐蚀有机发光层非常重要。因此采用上述所述封装薄膜10对有机发光器件进行封装保护。具体地，在进行封装保护时，封装薄膜10的其中一无机物层11覆盖于上述的有机发光器件20表面。
上述有机发光显示面板，通过在有机发光器件20上覆盖封装薄膜10，使易受水氧腐蚀的有机发光层材料和阴极材料受到良好的隔离保护，使有机发光显示面板能够有更好的使用体验，同时使有机发光显示面板有更长的使用寿命。
在其他实施例中，还可以提供一种显示装置，包括上述的有机发光显示面板。上述的显示装置可以为智能终端，如平板电脑、台式电脑、笔记本电脑、或者手机移动终端，还可以为电视、智能交互终端等。
请参阅图3，为本发明的封装薄膜的制备方法一实施例的流程示意图，包括步骤S31至步骤S33。
S31，形成无机物层。
其中，无机物层的材料可为SiOx、SiNx或SiONx中的一种，SiOx、SiNx或SiONx化学性质稳定，不会与水分及氧气发生化学反应，对水和氧气均具有优异的隔离能力，因此用于OLED发光器件中，成膜覆盖，用于隔离水氧。
S32，在所述无机物层上形成有机物层，或者形成依次交替层叠的有机物层及无机物层，所述有机物层包括有机物基体及分布于所述有机物基体内的吸湿材料。
在上一步骤完成后，因无机物层的成膜性质不均匀，因此需要在无机物层上插入有机物层，有助于稳定无机膜。
在本步骤中，在无机物层上形成有机物层，其中有机物层包括有机物基体及分布于所述有机物基体内的吸湿材料。具体的，吸湿材料在有机物基体内的浓度沿所述无机物层指向有机物层的方向，吸湿材料的浓度依次递增。例如当封装薄膜为两个层级时，无机物层在下，有机物层在上，无机物层指向有机物层的方向，吸湿材料的浓度依次递增。或者例如当封装薄膜为三个层级时，从下至上依次为第一无机物层、有机物层及第二无机物层，可以为第二无机物层指向第一无机物层的方向，吸湿材料的浓度依次递增。从而有助于使OLED显示面板靠近显示基板的外层具有足够的拉伸形变量。
同时，吸湿剂颗粒在有机物基体内的浓度往靠近无机物层的方向粒径也可呈梯度变化趋势，如粒径逐渐变大，或粒径逐渐变小，以使封装薄膜适用于不同的显示面板的使用。
进一步地，请参阅图4，形成有机物层的步骤，包括：
S321，将所述吸湿材料掺入到有机物溶液中。
其中，有机物溶液为主要成分为液态的聚甲基丙烯酸甲酯有机溶剂，其他成分还可以为环氧树脂及丙烯酸脂等材料。在有机物溶液中加入吸湿材料，吸湿材料的材料成分包括氧化钙、硫酸镁、硫酸钙、氧化铝及氧化钡中的一种或多种。在本实施例中，吸湿材料的材料成分为氧化钙，且氧化钙以颗粒状分布于所述有机物基体内。同时有机物液体的质量与氧化钙的质量比介于10000:1~100:5之间。同时，氧化钙的粒径范围介于几纳米至几百纳米之间，纳米级氧化钙尺度相对有机物层厚度仅为万分之一到百分之一，当所有氧化钙吸收水汽产生反应时，不会对封装结构产生较大影响。
S322，在氮气氛围中，将掺入有吸湿材料的有机物溶液形成在所述无机物层上。
在本步骤中，使用惰性气体N2的条件下采用喷墨打印技术将掺入有吸湿材料的有机物溶液形成在上述的无机物上。在惰性气体的氛围下，不会影响吸湿材料（如氧化钙）的自身的性质，即不会影响其吸湿性能。
S323，固化掺入吸湿材料的有机物溶液，所述有机物溶液成膜为有机物基体，所述吸湿材料分布于所述有机物基体内。
在上一步骤完成后，液态的有机物溶液需转化为固态，可以加热风干的方式，或者自然风干的方式使其固化。当有机物溶液由液态变为固态后，有机物溶液呈膜状，并且为上述的有机物基体，吸湿材料分布于所述有机物基体内。
因无机物层对水和氧气的隔绝性能好，但是韧性较差，而有机物层易均匀成膜，并且表面致密性好，有机物层与无机物层的结合，不仅实现了对水氧的完美隔绝，还进一步提升了封装薄膜的延展特性和韧性。
上述封装薄膜的制备方法，通过在有机物基体内加入了吸湿材料的方式，使有机物基体内分布吸湿材料，使有机发光半导体器件在封装过程沿封装薄膜的缺陷或者封装过程中的混入的水汽被吸湿材料吸收，使有机发光半导体器件能长期与水隔离，并具有更长的使用寿命。
请参阅图5，为本发明的有机发光显示面板的制备方法的一实施例的流程示意图，包括步骤S41-S44。
步骤S41，提供一显示基板，所述显示基板上设置有有机发光器件。
其中显示基板为玻璃基板，有机发光器件为上述的OLED发光器件。
步骤S42，在所述有机发光器件表面形成无机物层。
其中，无机物层的材料可为SiOx、SiNx或SiONx中的一种，SiOx、SiNx或SiONx化学性质稳定，不会与水分及氧气发生化学反应，对水和氧气均具有优异的隔离能力，因此用于OLED发光器件中，成膜覆盖，用于隔离水氧。
步骤S43，在所述无机物层上形成有机物层，或者形成依次交替层叠的有机物层及无机物层，所述有机物层包括有机物基体及分布于所述有机物基体内的吸湿材料。
有机物基体主要成分为液态的聚甲基丙烯酸甲酯有机溶剂，其他成分还可以为环氧树脂及丙烯酸脂等材料。在有机物基体呈液态时，在有机溶剂中加入吸湿材料并在氮气气氛下以喷涂成膜的方式生成有机物层。
具体地，吸湿材料成分包括氧化钙、硫酸镁、硫酸钙、氧化铝及氧化钡中的一种或多种。在本实施例中，吸湿材料成分为氧化钙，且以颗粒的形式分布于有机物基体内。
进一步地，请参阅图6，在所述无机物层上形成有机物层，所述有机物层包括有机物基体及分布于所述有机物基体内的吸湿材料这一步骤，包括：
步骤S431，将所述吸湿材料掺入到有机物溶液中。
其中，有机物溶液为主要成分为液态的聚甲基丙烯酸甲酯有机溶剂，其他成分还可以为环氧树脂及丙烯酸脂等材料。在有机物溶液中加入吸湿材料，吸湿材料的材料成分包括氧化钙、硫酸镁、硫酸钙、氧化铝及氧化钡中的一种或多种。在本实施例中，吸湿材料的材料成分为氧化钙，且氧化钙以颗粒状分布于所述有机物基体内。
步骤S432，在氮气氛围中，采用喷墨打印技术将掺入有吸湿材料的有机物溶液形成在所述无机物层上。
在本步骤中，使用惰性气体N2的条件下采用喷墨打印技术将掺入有吸湿材料的有机物溶液形成在上述的无机物上。在惰性气体的氛围下，不会影响吸湿材料（如氧化钙）的自身的性质，即不会影响其吸湿性能。
步骤S433，固化掺入吸湿材料的有机物溶液，所述有机物溶液成膜为有机物基体，所述吸湿材料分布于所述有机物基体内。
在上一步骤完成后，液态的有机物溶液需转化为固态，可以加热风干的方式，或者自然风干的方式使其固化。当有机物溶液由液态变为固态后，有机物溶液呈膜状，并且为上述的有机物基体，吸湿材料分布于所述有机物基体内。
上述有机发光显示面板的制备方法，通过在显示基板的有机发光器件上覆盖封装薄膜，并且封装薄膜包括交替层叠的无机物层和有机物层，有机物层包括有机物基体及分布于所述有机物基体内的吸湿材料，即在有机物层里面加入了吸湿材料，使有机发光半导体器件在封装过程沿封装薄膜的缺陷或者封装过程中的混入的水汽被吸湿材料吸收，使有机发光半导体器件能长期与水氧隔离，使整个有机发光显示面板使用效果更完美，并且整个有机发光显示面板的使用寿命得到了延长。
尽管已经相对于一个或多个实现方式示出并描述了本发明，但是本领域技术人员基于对本说明书和附图的阅读和理解将会想到等价变型和修改。本发明包括所有这样的修改和变型，并且仅由所附权利要求的范围限制。特别地关于由上述组件执行的各种功能，用于描述这样的组件的术语旨在对应于执行所述组件的指定功能（例如其在功能上是等价的）的任意组件（除非另外指示），即使在结构上与执行本文所示的本说明书的示范性实现方式中的功能的公开结构不等同。此外，尽管本说明书的特定特征已经相对于若干实现方式中的仅一个被公开，但是这种特征可以与如可以对给定或特定应用而言是期望和有利的其他实现方式的一个或多个其他特征组合。而且，就术语“包括”、“具有”、“含有”或其变形被用在具体实施方式或权利要求中而言，这样的术语旨在以与术语“包含”相似的方式包括。进一步地，应当理解的是，在本文中提及的“多个”是指两个或两个以上。对于本文中提及的步骤，其通过数字后缀仅仅是为了清晰表述实施例，便于理解，并不完全代表步骤执行的先后顺序，应当以逻辑关系的先后设定为思考。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，例如各实施例之间技术特征的相互结合，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (15)

  1. 一种封装薄膜，包括交替层叠的无机物层及有机物层，其中，所述有机物层包括有机物基体及分布于所述有机物基体内的吸湿材料。
  2. 根据权利要求1所述的封装薄膜，其中，所述吸湿材料包括氧化钙、硫酸镁、硫酸钙、氧化铝及氧化钡中的一种或多种。
  3. 根据权利要求1所述的封装薄膜，其中，沿所述无机物层指向有机物层的方向，所述吸湿材料的浓度依次递增。
  4. 根据权利要求1所述的封装薄膜，其中，所述吸湿材料以颗粒状分布于所述有机物基体内，所述吸湿材料的颗粒粒径与所述有机物层的厚度之比介于1/10000～1/100之间。
  5. 根据权利要求4所述的封装薄膜，其中，所述封装薄膜包括多层所述无机物层，沿其中一所述无机物层指向另一所述无机物层的方向，所述吸湿材料的颗粒粒径逐渐递增大。
  6. 一种有机发光显示面板，包括有机发光器件，其中，所述有机发光显示面板还包括封装薄膜，所述封装薄膜包括交替层叠的无机物层及有机物层，所述有机物层包括有机物基体及分布于所述有机物基体内的吸湿材料，所述封装薄膜的一无机物层覆盖于所述有机发光器件的表面。
  7. 根据权利要求6所述的有机发光显示面板，其中，所述吸湿材料包括氧化钙、硫酸镁、硫酸钙、氧化铝及氧化钡中的一种或多种。
  8. 根据权利要求6所述的有机发光显示面板，其中，沿所述无机物层指向有机物层的方向，所述吸湿材料的浓度依次递增。
  9. 根据权利要求6所述的有机发光显示面板，其中，所述吸湿材料以颗粒状分布于所述有机物基体内，所述吸湿材料的颗粒粒径与所述有机物层的厚度之比介于1/10000～1/100之间。
  10. 根据权利要求9所述的有机发光显示面板，其中，所述封装薄膜包括多层所述无机物层，沿其中一所述无机物层指向另一所述无机物层的方向，所述吸湿材料的颗粒粒径逐渐递增大。
  11. 一种封装薄膜的制备方法，其中，包括：
    形成无机物层；
    在所述无机物层上形成有机物层，或者形成依次交替层叠的有机物层及无机物层，其中所述有机物层包括有机物基体及分布于所述有机物基体内的吸湿材料。
  12. 根据权利要求11所述的封装薄膜的制备方法，其中，形成有机物层的步骤，包括：
    将所述吸湿材料掺入到有机物溶液中；
    在氮气氛围中，采用喷墨打印技术将掺入有吸湿材料的有机物溶液形成在所述无机物层上；
    固化掺入吸湿材料的有机物溶液，所述有机物溶液成膜为有机物基体，所述吸湿材料分布于所述有机物基体内。
  13. 根据权利要求11所述的封装薄膜的制备方法，其中，沿无机物层指向有机物层的方向，所述吸湿材料的浓度依次递增。
  14. 根据权利要求11所述的封装薄膜的制备方法，其中，所述吸湿材料以颗粒状分布于所述有机物基体内，所述吸湿材料的颗粒粒径与所述有机物层的厚度之比介于1/10000～1/100之间。
  15. 根据权利要求14所述的封装薄膜的制备方法，其中，所述封装薄膜包括多层所述无机物层，沿其中一所述无机物层指向另一所述无机物层的方向，所述吸湿材料的颗粒粒径逐渐递增大。
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