WO2021012209A1 - 终端设备 - Google Patents

终端设备 Download PDF

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Publication number
WO2021012209A1
WO2021012209A1 PCT/CN2019/097468 CN2019097468W WO2021012209A1 WO 2021012209 A1 WO2021012209 A1 WO 2021012209A1 CN 2019097468 W CN2019097468 W CN 2019097468W WO 2021012209 A1 WO2021012209 A1 WO 2021012209A1
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WO
WIPO (PCT)
Prior art keywords
light
circuit board
terminal device
display panel
area
Prior art date
Application number
PCT/CN2019/097468
Other languages
English (en)
French (fr)
Inventor
李凡
刘练彬
龚兵
孟欢
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/768,915 priority Critical patent/US11825729B2/en
Priority to PCT/CN2019/097468 priority patent/WO2021012209A1/zh
Priority to CN201980001119.1A priority patent/CN112639956A/zh
Publication of WO2021012209A1 publication Critical patent/WO2021012209A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • G09G3/3225—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0421—Structural details of the set of electrodes
    • G09G2300/0426—Layout of electrodes and connections
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2380/00—Specific applications
    • G09G2380/02—Flexible displays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present disclosure relates to the field of terminal technology, and in particular to a terminal device.
  • Photosensitive components are important sensor components in mobile phones, such as infrared sensors, fingerprint sensors, and cameras.
  • the photosensitive element In a full-screen mobile phone, the photosensitive element is usually placed at the bottom of the screen, corresponding to the middle or top of the screen.
  • the embodiment of the present disclosure provides a terminal device.
  • the technical solution is as follows:
  • At least one embodiment of the present disclosure provides a terminal device, including:
  • the display panel has a light-transmitting area, and the light-transmitting area is an area through which light can pass through the display panel;
  • the circuit board is located at least partially between the display panel and the photosensitive element, and covers the light-transmitting area, the circuit board has a light-transmitting hole; In the direction, the light transmission hole is located between the photosensitive element and the light transmission area of the display panel.
  • the photosensitive element includes a photosensitive portion and an edge portion surrounding the photosensitive portion, and the photosensitive portion is configured to receive light passing through the light-transmitting hole;
  • the orthographic projection of the photosensitive portion on the display panel is within the orthographic projection of the light transmission hole on the display panel.
  • the circuit board is a chip on glass circuit board, a chip on film circuit board, a chip on flexible material circuit board or a flexible circuit board.
  • the chip-on-film circuit board includes a thin-film circuit board body, and a first inner pin, a driving integrated circuit, and a first outer pin on the thin-film circuit board body.
  • the driving integrated circuit is arranged between the first inner pin and the first outer pin.
  • the light transmission hole is located between the driving integrated circuit and the first inner pin.
  • the first inner pin of the chip on film circuit board is electrically connected to the flexible circuit board, and the first outer pin of the chip on film circuit board is electrically connected to the display panel.
  • the flexible circuit board includes a flexible circuit board body, and a second inner pin, a device area, a touch binding area, and a second outer pin located on the flexible circuit board body.
  • the hole, the device area and the touch binding area are arranged between the second inner pin and the second outer pin.
  • the second inner pin of the flexible circuit board is electrically connected to the flip chip film circuit board, and the second outer pin of the flexible circuit board is electrically connected to the main board of the terminal device.
  • the photosensitive element is a fingerprint sensor, an infrared sensor or a camera.
  • the photosensitive element is a fingerprint sensor or a camera
  • the light-transmitting area is a light-transmitting area through which visible light passes
  • the photosensitive element is an infrared sensor
  • the light-transmitting area is a light-transmitting area through which infrared light passes.
  • the light-transmitting area is located in the bottom area of the display panel, and one side of the bottom area is the bottom side of the display panel.
  • the bottom area is located in the display area of the display panel.
  • the terminal device further includes a support member located between the circuit board and the photosensitive element, the support member having a first through hole communicating with the light transmission hole.
  • the material of the support member is foam.
  • the photosensitive element includes a base and a photosensitive module
  • the base is fixed on the rear shell of the terminal device
  • the photosensitive module is fixed on the base
  • the The support is arranged on the base
  • the photosensitive module is arranged in the first through hole of the support.
  • the terminal device further includes a protective film located between the display panel and the circuit board, the protective film having a second through hole communicating with the light-transmitting hole .
  • the protective film includes foam and copper foil, the foam is disposed between the copper foil and the display panel, and the copper foil is disposed between the foam and the circuit board .
  • the area of the first through hole is larger than the area of the light transmission hole, and the area of the light transmission hole is larger than the area of the second through hole.
  • the shape of the light transmission hole is a circle or a rectangle.
  • the shape of the light-transmitting hole is a circle, and the diameter of the circle is about 6-8 mm; or,
  • the shape of the light-transmitting hole is a rectangle, and the side length of the rectangle is about 6-8 mm.
  • the light-transmitting hole is made by punching or laser cutting.
  • the display panel is an organic light emitting diode display panel.
  • Figure 1 is a schematic structural diagram of a terminal device provided by an embodiment of the present disclosure
  • Figure 2 shows a schematic structural diagram of a COF provided by an embodiment of the present disclosure
  • FIG. 3 shows a schematic structural diagram of an FPC provided by an embodiment of the present disclosure
  • FIG. 4 shows a schematic diagram of the internal structure of a terminal device provided by an embodiment of the present disclosure
  • FIG. 5 shows a schematic diagram of binding between a display panel and a COF provided by an embodiment of the present disclosure
  • FIG. 6 shows a schematic structural diagram of a display panel provided by an embodiment of the present disclosure
  • FIG. 7 shows a schematic diagram of the internal structure of a terminal device provided by an embodiment of the present disclosure
  • FIG. 8 shows a schematic structural diagram of a protective film provided by an embodiment of the present disclosure.
  • Fig. 1 is a schematic structural diagram of a terminal device provided by an embodiment of the present disclosure.
  • the terminal device includes a photosensitive element 100, a display panel 200 and a circuit board 300.
  • the circuit board 300 is at least partially located between the display panel 200 and the photosensitive element 100 and covers a light-transmitting area 201.
  • the display panel 200 has a light-transmitting area 201, and the circuit board 300 has a light-transmitting hole 301.
  • the light-transmitting hole 301 is located between the photosensitive element 100 and Between the transparent regions 201 of the display panel 200.
  • the light-transmitting area 201 is an area where light can pass through the display panel 200.
  • the light-emitting surface of the display panel 200 is the surface from which light exits in the display panel, and the user can view the picture displayed on the display panel through the surface.
  • the photosensitive element is arranged under the display panel.
  • a light-transmitting hole is opened on the circuit board for the photosensitive element to receive and emit signals, so that the photosensitive element can be installed in the terminal device.
  • the area of the board for example, corresponds to the bottom of the screen of the terminal device, to avoid the inconvenience caused by arranging the photosensitive element (such as a fingerprint sensor) in the middle or top of the corresponding screen.
  • the photosensitive element is located below the screen, and there is no need to make holes on the screen, which increases the screen-to-body ratio and reduces the frame.
  • the light-transmitting area 201 refers to a portion of the display panel 200 that can transmit light.
  • the light-transmitting area 201 can be a part of the display area, which can be used for display and can also let light pass through; the light-transmitting area 201 can also be non-transmissive. A part of the display area only needs to transmit light.
  • the area of the light-transmitting area 201 can be larger than the area of the light-transmitting hole 301, which can ensure that the light signal of the photosensitive element 100 can pass through smoothly, and at the same time facilitate the alignment of the light-transmitting hole 301 and the light-transmitting area 201. assembly.
  • the terminal device referred to in the embodiments of the present disclosure may be the aforementioned mobile phone.
  • the terminal device may also be other types of terminal devices such as a tablet computer and a smart watch.
  • the terminal device has a panel display panel, a circuit board, and a photosensitive element, the solution used in the present disclosure can be used.
  • the photosensitive element 100 may be a fingerprint sensor (Fingerprint Sensor, FPS), an infrared sensor or a camera. Since the circuit board is usually located near the lower end of the screen of the terminal device, the photosensitive element here is usually a fingerprint sensor, which facilitates the touch operation of the user. Of course, the photosensitive element can also be an infrared sensor or a camera.
  • FPS Fingerprint Sensor
  • the photosensitive element can also be an infrared sensor or a camera.
  • fingerprint sensors include optical fingerprint sensors, ultrasonic fingerprint sensors, and capacitive fingerprint sensors, and other types, ultrasonic fingerprint sensors and capacitive fingerprint sensors do not use optical principles, so they can work even if they are installed under the screen without a light-transmitting hole.
  • the fingerprint sensor referred to in the publication is an optical fingerprint sensor.
  • the light to be transmitted by the light-transmitting area 201 on the display panel 200 is also different.
  • the light-transmitting area 201 is a light-transmitting area through which visible light passes, and the light-transmitting area 201 needs to have the ability to transmit visible light, so as to ensure the normal operation of the fingerprint sensor and the camera;
  • the photosensitive element 100 is an infrared sensor
  • the light-transmitting area 201 is a light-transmitting area through which infrared light passes, and the light-transmitting area 201 only needs to have the ability to transmit infrared light.
  • the display panel may be an Organic Light-Emitting Diode (OLED) display panel. Since the OLED display panel is easy to make into a light-transmitting display panel, the use of the OLED display panel facilitates the design of the aforementioned light-transmitting area 201.
  • the display panel can also be other types of display panels such as a liquid crystal display panel, a micro light emitting diode display panel, and the like.
  • OLED display panels include active drive OLED (Active matrix OLED, AMOLED) and passive drive OLED (Passive matrix OLED, PMOLED). Because the drive circuit in AMOLED is more complex, the area of the circuit board is larger, so this solution is more suitable Used in AMOLED display panels.
  • the display panel 200, the rear case 400 and the frame 500 form a closed space, and the aforementioned photosensitive element 100 and the circuit board 300 are all arranged in the closed space.
  • the photosensitive element 100 may be directly mounted on the rear housing 400, for example, installed on the rear housing 400 by fasteners such as bolts, or adhered to the rear housing 400 by glue or the like.
  • the circuit board 300 is adhered to the display panel 200 by adhesive.
  • the circuit board 300 may be a chip on glass (COG), a chip on film (COF), a chip on flexible material circuit board (Chip On Pi, COP), or a flexible Circuit boards (Flexible Printed Circuit, FPC), these types are common circuit boards in mobile phones and other terminal devices. By opening holes on these circuit boards, the normal transmission of the optical signal of the photosensitive element can be realized.
  • COG chip on glass
  • COF chip on film
  • COF chip on flexible material circuit board
  • COP Chip On Pi
  • FPC Flexible Printed Circuit
  • COG, COF and COP are three circuit packaging methods, and one of them is usually used in terminal equipment to bind with the display panel and bind with the FPC.
  • the circuit structures of the three circuit packaging methods are different, the positions, shapes, and sizes of the light-transmitting holes can be the same design.
  • COF is taken as an example in the following description.
  • Fig. 2 shows a schematic structural diagram of a COF provided by an embodiment of the present disclosure.
  • the COF includes a film circuit board body 310, that is, a COF film (Film), and a light-transmitting hole 301 is opened in the middle of the COF film.
  • a film circuit board body 310 that is, a COF film (Film)
  • a light-transmitting hole 301 is opened in the middle of the COF film.
  • the COF also includes a first inner lead (ILB) 311, a driver integrated circuit (D IC) 312, and a first outer lead (Outer Lead Bonding, OLB) on the thin film circuit board body 310. ) 313, the light-transmitting hole 301 and the driving integrated circuit 312 are arranged between the first inner pin 311 and the first outer pin 313.
  • the first inner pin 311 is used for electrical connection with the FPC, and the first outer pin 313 is used for electrical connection with the circuit binding area of the display panel 200.
  • the light transmission hole 301 is located between the driving integrated circuit 312 and the first inner pin 311.
  • Fig. 3 shows a schematic structural diagram of an FPC provided by an embodiment of the present disclosure.
  • the FPC here is described by taking a main FPC (Main FPC, MFPC) as an example.
  • the FPC includes a flexible circuit board body 320, that is, an FPC film.
  • a light-transmitting hole 301 is opened in the middle of the FPC film.
  • the FPC also includes a second inner pin 321, a device area 322, a touch binding area 323 and a second outer pin 324 on the flexible circuit board body 320.
  • the light-transmitting hole 301, the device area 322 and the touch binding area 323 are arranged between the second inner pin 321 and the second outer pin 324.
  • the second inner pin 321 is used for electrical connection with the COF
  • the second outer pin 324 is used for electrical connection with the main board of the terminal device.
  • the device area 322 is also a component area, which integrates components such as capacitors and storage.
  • the touch binding area 323 is used for binding with the touch circuit of the display panel.
  • the light-transmitting hole 301 in FIGS. 2 and 3 can be made by punching or laser cutting.
  • a region for opening a light-transmitting hole is reserved, and this area is not wired.
  • the above-mentioned process is used to make the light-transmitting hole. By using these two processes, it is easy to make light-transmitting holes on the circuit board.
  • the shape of the light transmission hole 301 is usually a circle or a rectangle.
  • the light-transmitting hole is designed into a conventional shape, which is convenient for design and production.
  • the light-transmitting hole 301 in FIGS. 2 and 3 is square (with rounded corners).
  • the light transmission hole 301 may also adopt other regular or irregular shapes.
  • the shape of the light-transmitting hole 301 is a circle, and the diameter of the circle is about 6-8 mm; or, the shape of the light-transmitting hole 301 is a rectangle, and the side length of the rectangle is about 6-8. Mm.
  • the light-transmitting hole of this size can meet the light-transmitting requirements of common photosensitive elements in terminal equipment.
  • the diameter of the circle or the side length of the rectangle may be 6 mm.
  • the light transmission hole designed according to the above-mentioned size can meet the light transmission requirement of a photosensitive element.
  • only one light-transmitting hole is designed on the circuit board of the terminal device, and the light-transmitting hole is on the COF or FPC, so as to prevent the wiring from being affected by opening too many through holes on the circuit board.
  • FIG. 4 shows a schematic diagram of the internal structure of a terminal device provided by an embodiment of the present disclosure.
  • the first outer pin 313 of the COF is bound to the display panel 200, and the first inner pin 311 of the COF is bound to the second inner pin 321 of the FPC.
  • the light-transmitting hole 301 is provided on the COF. Since the COF is closer to the lower frame of the terminal device, the light-transmitting hole 301 is provided on the COF. If a photosensitive element such as a fingerprint sensor is provided, it is more convenient for the user to touch.
  • FIG. 5 shows a schematic diagram of binding between the display panel 200 and the COF provided by an embodiment of the present disclosure.
  • the COF (only the film circuit board body 310 of the COF is shown in the figure) and the display panel 200 are bound in the binding area of the display panel 200, and the binding area is located at the edge of the display panel 200.
  • the COF is bound to the display panel 200, it can be in line with the display panel.
  • the FPC only the FPC flexible circuit board is shown in the figure).
  • the COF and FPC can be glued to the display panel 200 with glue to realize the fixation of the COF and FPC.
  • the number of light-transmitting holes 301 can be designed according to needs. For example, according to the number of photosensitive elements, each photosensitive element is correspondingly arranged with a light-transmitting hole. For another example, the number of light-transmitting holes is less than the number of photosensitive elements. There are two or more photosensitive elements sharing a light-transmitting hole, and the size of the common light-transmitting hole must be able to meet the light transmission requirements of the photosensitive elements sharing the light-transmitting hole.
  • FIG. 6 shows a schematic structural diagram of a display panel provided by an embodiment of the present disclosure.
  • the light-transmitting area 201 is located in the bottom area 210 of the display panel 200, and one side of the bottom area 210 is the bottom edge 220 of the display panel 200 .
  • a light-transmitting hole 301 is provided at the position of the circuit board 300 close to the bottom edge of the display panel 200 to facilitate the arrangement of photosensitive elements such as fingerprint sensors.
  • the bottom side 220 of the display panel may be a side close to the last scanned row of pixels in the scanning direction of the display panel.
  • the bottom edge is close to the lower frame of the terminal device on the terminal device.
  • the bottom area 210 may be located in the display area of the display panel 200.
  • the entire screen is a display area. In this case, it is enough to design the display area as a transparent display area.
  • the bottom area may also be a non-display area, such as a frame area. In this case, a light-transmitting area needs to be provided on the non-display area to transmit light required by the photosensitive element 100 to pass.
  • FIG. 7 shows a schematic diagram of the internal structure of a terminal device provided by an embodiment of the present disclosure.
  • the terminal device further includes a supporting member 600 located between the circuit board 300 and the photosensitive element 100.
  • the supporting member 300 has a transparent hole 301 is connected to the first through hole 601.
  • the support 600 By providing the support 600, on the one hand, it can further fix the photosensitive element 100 and the circuit board 300, and on the other hand, it can block the light entering the photosensitive element 100 from the side to ensure that the light signal is emitted from the light-transmitting hole 301. To avoid signal interference.
  • the material of the support 600 may be foam.
  • Foam has good shading properties; at the same time, due to its certain elasticity, it can also play a shock-absorbing effect in the event of a collision.
  • the photosensitive element 100 has a base 101 and a photosensitive module 102.
  • the base 101 is fixed on the rear housing 400
  • the photosensitive module 102 is fixed on the base 101
  • the support 600 is arranged on the base 101
  • the photosensitive mold The group 102 can be arranged in the first through hole 601 of the support 600, so that it can be ensured that the light signals of the photosensitive module 102 are all transmitted through the light transmission hole 301.
  • the photosensitive element 100 includes a photosensitive portion 110 and an edge portion 120 surrounding the photosensitive portion 110.
  • the photosensitive portion 110 is used to receive light passing through the light-transmitting hole 301, such as the lens of a camera; the photosensitive portion 110 is on the display panel 200
  • the orthographic projection of the above is within the orthographic projection of the light transmission hole 301 on the display panel 200.
  • the orthographic projection of the photosensitive portion on the display panel 200 is within the orthographic projection of the light-transmitting hole 301 on the display panel 200, which can be that the two projections completely overlap, or the orthographic projection of the photosensitive portion on the display panel 200 is covered by the light-transmitting hole. 301 is wrapped by the orthographic projection on the display panel 200.
  • the photosensitive part 110 is located on the photosensitive module 102 of the photosensitive element 100, and is the light-transmitting part between the photosensitive module 100 (the dashed frame part in FIG. 6), the housing of the photosensitive module 102 and the photosensitive mold
  • the base 102 of the group 102 surrounds the edge 120 of the photosensitive part 110.
  • the terminal device further includes a protective film 700 located between the display panel 200 and the circuit board 300, and the protective film 700 has a second transparent hole 301 connected to it. Through hole 701. By opening a through hole in the protective film 700, the passage of the light signal of the photosensitive element 100 is ensured.
  • the protective film 700 functions to buffer and dissipate heat.
  • the protective film 700 is disposed between the display panel 200 and the circuit board 300, and can also play a buffering role in the event of a collision; , The edge of the protective film 700 is connected to the frame 500, which can conduct heat generated by the display panel 200 and the circuit board 300 to realize heat dissipation.
  • FIG. 8 shows a schematic structural diagram of a protective film provided by an embodiment of the present disclosure.
  • the protective film 700 may include foam 710 and copper foil 720, the foam 710 is located between the copper foil 720 and the display panel 200, and the copper foil 720 is located between the foam 710 and the circuit board 300.
  • the foam 710 and the display panel 200 are stuck together, the foam 710 and the copper foil 720 are stuck together, and the copper foil 720 and the circuit board 300 are stuck together.
  • the foam 710 and the display panel 200, the foam 710 and the copper foil 720, and the copper foil 720 and the circuit board 300 may be glued together.
  • both the foam 710 and the copper foil 720 have the aforementioned second through holes 701.
  • the circuit board 300 is actually glued to the protective film 700 by glue.
  • the circuit board 300 is glued to the copper foil by glue.
  • the area of the light transmission hole 301 may be larger than the area of the second through hole 701. In this way, when the circuit board 300 is installed, it is convenient to align the light transmission hole 301 with the second through hole 701 because the complete second through hole 701 can be seen from the light transmission hole 301. Similarly, the area of the first through hole 601 may be larger than the area of the light transmission hole 301.
  • the area of the light-transmitting hole 301 and the area of the second through hole 701 may be the same, or the area of the light-transmitting hole 301 is smaller than the area of the second through hole 701. It is only necessary that the size of the light-transmitting hole and the second through hole can meet the optical signal transmission requirements of the photosensitive element.
  • the terminal device further includes a transparent cover 800, and the transparent cover 800 is attached to the light-emitting surface of the display panel 200 to protect the display panel 200.
  • the transparent cover 800 is usually a glass cover.

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Abstract

提供一种终端设备。该终端设备包括：感光元件；显示面板，具有一透光区域，所述透光区域为光能够穿过所述显示面板的区域；位于所述感光元件和所述显示面板间的电路板，所述电路板具有透光孔；在垂直于所述显示面板的出光面的方向上，所述透光孔位于所述感光元件和所述显示面板的透光区域之间。将感光元件设置在显示面板下方，在这种情况下，在电路板上开设透光孔来供感光元件收发光信号，使得感光元件可以设置在终端设备具有电路板的区域，例如对应终端设备的屏幕底部，避免将感光元件(如指纹传感器)设置在对应屏幕的中部或顶部造成的不便。同时，感光元件位于屏幕以下，无需在屏幕上开孔，提高了屏占比，减小了边框。

Description

终端设备 技术领域
本公开涉及终端技术领域，特别涉及一种终端设备。
背景技术
感光元件是手机中的重要传感器件，例如红外传感器、指纹传感器、摄像头等。在全面屏手机中，感光元件通常设置在屏幕下方，对应屏幕的中部或顶部。
发明内容
本公开实施例提供了一种终端设备。所述技术方案如下：
本公开至少一实施例提供一种终端设备，包括：
感光元件；
显示面板，具有一透光区域，所述透光区域为光能够穿过所述显示面板的区域；
电路板，所述电路板至少部分位于所述显示面板和所述感光元件之间，且覆盖所述透光区域，所述电路板具有透光孔；在垂直于所述显示面板的出光面的方向上，所述透光孔位于所述感光元件和所述显示面板的透光区域之间。
作为本公开实施例的一种实现方式，所述感光元件包括感光部和围绕所述感光部的边缘部，所述感光部用于接收穿过所述透光孔的光；
所述感光部在所述显示面板上的正投影在所述透光孔在所述显示面板上的正投影内。
示例性地，所述电路板为覆晶玻璃电路板、覆晶薄膜电路板、覆晶柔性材料电路板或者柔性电路板。
示例性地，所述覆晶薄膜电路板包括薄膜电路板本体、以及位于所述薄膜电路板本体上的第一内引脚、驱动集成电路和第一外引脚，所述透光孔和所述驱动集成电路布置在所述第一内引脚和所述第一外引脚之间。
示例性地，所述透光孔位于所述驱动集成电路和所述第一内引脚之间。
示例性地，所述覆晶薄膜电路板的第一内引脚与柔性电路板电连接，所述覆晶薄膜电路板的第一外引脚与所述显示面板电连接。
示例性地，所述柔性电路板包括柔性电路板本体、以及位于所述柔性电路板本体上的第二内引脚、器件区、触控绑定区和第二外引脚，所述透光孔、器件区和触控绑定区布置在所述第二内引脚和所述第二外引脚之间。
示例性地，所述柔性电路板的第二内引脚与覆晶薄膜电路板电连接，所述柔性电路板的第二外引脚与所述终端设备的主板电连接。
示例性地，所述感光元件为指纹传感器、红外传感器或摄像头。
作为本公开实施例的一种实现方式，所述感光元件为指纹传感器或摄像头，所述透光区域为供可见光穿过的透光区域；
或者，所述感光元件为红外传感器，所述透光区域为供红外光穿过的透光区域。
作为本公开实施例的一种实现方式，所述透光区域位于所述显示面板的底部区域内，所述底部区域的一侧边为所述显示面板的底边。
作为本公开实施例的一种实现方式，所述底部区域位于所述显示面板的显示区域内。
作为本公开实施例的一种实现方式，所述终端设备还包括位于所述电路板和感光元件之间的支撑件，所述支撑件具有与所述透光孔连通的第一通孔。
示例性地，所述支撑件的材料为泡棉。
作为本公开实施例的一种实现方式，所述感光元件包括底座和感光模组，所述底座固定在所述终端设备的后壳上，所述感光模组固定在所述底座上，所述支撑件设置在所述底座上，且所述感光模组设置在支撑件的第一通孔内。
作为本公开实施例的一种实现方式，所述终端设备还包括位于所述显示面板和所述电路板之间的保护膜，所述保护膜具有与所述透光孔连通的第二通孔。
示例性地，所述保护膜包括泡棉和铜箔，所述泡棉设置在所述铜箔和所述显示面板之间，所述铜箔设置在所述泡棉和所述电路板之间。
作为本公开实施例的一种实现方式，所述第一通孔的面积大于所述透光孔的面积，所述透光孔的面积大于所述第二通孔的面积。
示例性地，所述透光孔的形状为圆形或矩形。
作为本公开实施例的一种实现方式，所述透光孔的形状为圆形，所述圆形的直径范围为约6-8毫米；或者，
所述透光孔的形状为矩形，所述矩形的边长范围为约6-8毫米。
作为本公开实施例的一种实现方式，所述透光孔通过冲切或激光切割制成。
示例性地，所述显示面板为有机发光二极管显示面板。
附图说明
图1是本公开实施例提供的一种终端设备的结构示意图；
图2示出了本公开实施例提供的一种COF的结构示意图；
图3示出了本公开实施例提供的一种FPC的结构示意图；
图4示出了本公开实施例提供的一种终端设备的内部结构示意图；
图5示出了本公开实施例提供的显示面板和COF的绑定示意图；
图6示出了本公开实施例提供的显示面板的结构示意图；
图7示出了本公开实施例提供的终端设备的内部结构示意图；
图8示出了本公开实施例提供的保护膜的结构示意图。
具体实施方式
为了使本公开的目的、技术方案和优点更加清楚，下面将结合附图对本公开作进一步地详细描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本公开保护的范围。
通常，在全面屏手机中，由于屏幕底部有电路板，所以没法设置感光元件。而有些感光元件，例如指纹传感器又需要做在底部，如果做在屏幕的中部或顶部不方便用户的指纹触摸操作。
图1是本公开实施例提供的一种终端设备的结构示意图。参见图1，该终端设备包括：感光元件100、显示面板200和电路板300，电路板300至少部分位于显示面板200和感光元件100之间，且覆盖透光区域201。
如图1所示，该显示面板200具有一透光区域201，该电路板300具有透光孔301，在垂直于显示面板200的出光面的方向A上，透光孔301位于感光元件100和显示面板200的透光区域201之间。
这里，透光区域201为光能够穿过显示面板200的区域。显示面板200的出光面为显示面板中光射出的表面，用户可以通过该表面观看到显示面板显示 的画面。
在终端设备，如全面屏手机中，感光元件设置在显示面板下方，在这种情况下，在电路板上开设透光孔来供感光元件收发光信号，使得感光元件可以设置在终端设备具有电路板的区域，例如对应终端设备的屏幕底部，避免将感光元件(如指纹传感器)设置在对应屏幕的中部或顶部造成的不便。同时，感光元件位于屏幕以下，无需在屏幕上开孔，提高了屏占比，减小了边框。
透光区域201是指显示面板200的一个能够透光的部分，例如透光区域201可以是显示区域的一部分，这部分即可用来显示，同时也能够让光线通过；透光区域201也可以是非显示区域的一部分，只要够透光即可。
如图1所示，透光区域201的面积可以大于透光孔301的面积，这样能够保证感光元件100的光信号可以顺利穿过，同时便于透光孔301和透光区域201的对位及装配。
本公开实施例所指的终端设备，可以为前述手机，除此外，该终端设备同样可以是平板电脑、智能手表等其他类型的终端设备。只要该终端设备具有面板显示面板、电路板以及感光元件，均可以使用本公开所使用的方案。
示例性地，感光元件100可以为指纹传感器(Fingerprint Sensor，FPS)、红外传感器或摄像头。由于电路板通常位于终端设备屏幕的靠近下端的位置，所以这里的感光元件通常为指纹传感器，方便了用户的触摸操作。当然，该感光元件也可以为红外传感器或摄像头。
由于指纹传感器包括光学指纹传感器、超声波指纹传感器和电容指纹传感器等多种类型，超声波指纹传感器和电容指纹传感器并不是利用光学原理，所以即使设置在屏幕下方不开设透光孔也可工作，因此本公开所指的指纹传感器为光学指纹传感器。
在本公开实施例中，对于不同的感光元件100，显示面板200上的透光区域201所要透过的光也不同。例如，当感光元件100为指纹传感器和摄像头时，透光区域201为供可见光穿过的透光区域，透光区域201需要具备透过可见光的能力，这样才能保证指纹传感器和摄像头的正常工作；而当感光元件100为红外传感器时，透光区域201为供红外光穿过的透光区域，透光区域201只需要具备透过红外光的能力即可。
示例性地，显示面板可以为有机发光二极管(Organic Light-Emitting Diode,OLED)显示面板，由于OLED显示面板容易制作成透光显示面板，因此，采用 OLED显示面板便于前述透光区域201的设计。当然，该显示面板也可以为液晶显示面板、微型发光二极管显示面板等其他类型的显示面板。
OLED显示面板包括有源驱动OLED(Active matrix OLED，AMOLED)和无源驱动OLED(Passive matrix OLED，PMOLED)，由于AMOLED中驱动电路更为复杂，因此电路板的面积更大，所以本方案更适用于AMOLED显示面板。
参见图1，在终端设备中，显示面板200、后壳400和边框500形成一个密闭空间，前述感光元件100和电路板300均设置在该密闭空间内。示例性地，该感光元件100可以直接安装在后壳400上，例如通过螺栓等紧固件安装在后壳400上，或者通过粘胶等粘在后壳400上。而电路板300则通过粘胶粘在显示面板200上。
示例性地，电路板300可以为覆晶玻璃电路板(Chip On Glass，COG)、覆晶薄膜电路板(Chip On Film，COF)、覆晶柔性材料电路板(Chip On Pi，COP)或者柔性电路板(Flexible Printed Circuit，FPC)，这几种都是手机等终端设备中常见的电路板，通过在这些电路板上开孔，从而能够实现感光元件的光信号的正常传输。
这里，COG、COF和COP是三种电路封装方式，通常在终端设备中会采用其中一种来与显示面板绑定以及与FPC绑定。三种电路封装方式，虽然电路结构不同，但是在其上开设透光孔的位置、形状、大小等可以采用相同的设计。为了便于理解，后文以COF为例进行说明。
下面结合附图对开设有透光孔的COF以及FPC的结构进行说明。
图2示出了本公开实施例提供的一种COF的结构示意图。参见图2，该COF包括薄膜电路板本体310，也即COF薄膜(Film)，COF薄膜的中部开设有透光孔301。
该COF还包括位于薄膜电路板本体310上的第一内引脚(Inner Lead Bonding，ILB)311、驱动集成电路(Driver Integrated Circuit，D IC)312和第一外引脚(Outer Lead Bonding，OLB)313，透光孔301和驱动集成电路312布置在第一内引脚311和第一外引脚313之间。第一内引脚311用于与FPC电连接，第一外引脚313用于与显示面板200的电路绑定区域电连接。
示例性地，透光孔301位于驱动集成电路312和第一内引脚311之间。
图3示出了本公开实施例提供的一种FPC的结构示意图。参见图3，这里的FPC是以主FPC(Main FPC，MFPC)为例进行说明的，该FPC包括柔性电 路板本体320，也即FPC薄膜，FPC薄膜的中部开设有透光孔301。
该FPC还包括位于柔性电路板本体320上的第二内引脚321、器件区322、触控绑定区323和第二外引脚324。透光孔301、器件区322和触控绑定区323布置在第二内引脚321和第二外引脚324之间。第二内引脚321用于与COF电连接，第二外引脚324用于与终端设备的主板电连接。器件区322也即元器件区，集成有电容、存储等元器件。触控绑定区323用于与显示面板的触控电路进行绑定。
图2和图3中的透光孔301可以通过冲切或激光切割制成。示例性地，在设计COF或者FPC电路板时，预留开设透光孔的区域，该区域不走线，在电路板制作完成后，采用上述工艺制作透光孔。采用这两种工艺，容易实现在电路板上制作透光孔。
示例性地，透光孔301的形状通常为圆形或矩形。将透光孔设计成常规形状，便于设计及制作。例如，图2和图3中的透光孔301即为正方形(带圆角)。在其他实施例中，透光孔301也可以采用其他规则或不规则形状。
在本公开实施例中，透光孔301的形状为圆形，圆形的直径范围为约6-8毫米；或者，透光孔301的形状为矩形，矩形的边长范围为约6-8毫米。该尺寸的透光孔能够满足终端设备中常见感光元件的透光需求。示例性地，圆形的直径或矩形的边长可以为6毫米。
按照上述尺寸设计的透光孔能够满足一个感光元件的透光需求。并且，通常情况下，终端设备的电路板上只会设计一个透光孔，这个透光孔在COF上或者FPC上，这样能够避免在电路板开设过多通孔造成走线受到影响。
图4示出了本公开实施例提供的一种终端设备的内部结构示意图。参见图4，COF的第一外引脚313绑定在显示面板200上，COF的第一内引脚311与FPC的第二内引脚321绑定在一起。透光孔301开设在COF上，由于COF更靠近终端设备的下边框，透光孔301设在COF上，如果设置指纹传感器等感光元件能够更方便用户触摸。
这里COF和显示面板200的绑定区域绑定，COF与显示面板200绑定后反折回显示面板200的下方。图5示出了本公开实施例提供的显示面板200和COF的绑定示意图。如图5所示，COF(图中仅示出了COF的薄膜电路板本体310)和显示面板200在显示面板200的绑定区域绑定，绑定区域位于显示面板200的边缘。COF在与显示面板200绑定时可以与显示面板呈一字型，绑定完成后 弯折，使COF折回到显示面板200的下方，然后和FPC(图中仅示出了FPC的柔性电路板本体320)绑定。在完成后图5所示的反折和绑定后，可以采用粘胶将COF以及FPC均粘到显示面板200上，实现对COF以及FPC的固定。
但是，如果要在电路板对应的区域设置2个及以上的感光元件。此时，透光孔301的个数可以根据需要设计，例如，根据感光元件的数量设计，每个感光元件对应布置一个透光孔，再例如，透光孔的数量少于感光元件的数量，其中存在2个及以上感光元件共用一个透光孔，共用的透光孔的尺寸要能够满足共用该透光孔的感光元件的透光需求。
图6示出了本公开实施例提供的显示面板的结构示意图，参见图6，透光区域201位于显示面板200的底部区域210内，底部区域210的一侧边为显示面板200的底边220。在电路板300靠近显示面板200的底边的位置开设透光孔301，便于指纹传感器等感光元件的布置。
这里，显示面板的底边220可以是在显示面板扫描方向上，靠近最后扫描的一行像素的边。该底边在终端设备上靠近终端设备的下边框。
示例性地，底部区域210可以位于显示面板200的显示区域内。对于全面屏终端设备而言，整个屏幕都是显示区域，这种情况下，只要将显示区域设计成透明显示区域即可。而对于非全面屏终端设备而言，底部区域也可以为非显示区域，例如边框区域，此时需要在非显示区域上设置一个透光区域，来透光感光元件100所需的光通过。
图7示出了本公开实施例提供的终端设备的内部结构示意图，参见图7，该终端设备还包括位于电路板300和感光元件100之间的支撑件600，支撑件300具有与透光孔301连通的第一通孔601。通过设置支撑件600，一方面可以起到进一步固定感光元件100和电路板300的作用，另一方面，可以遮挡从侧边射入感光元件100的光，保证光信号是从透光孔301射入的，避免产生信号干扰。
示例性地，支撑件600的材料可以为泡棉。泡棉具有良好的遮光性；同时由于具有一定的弹性，在发生碰撞时还能够起到减震作用。
如图7所示，感光元件100具有底座101和感光模组102，底座101固定在后壳400上，感光模组102固定在底座101上，支撑件600设置在底座101上，且该感光模组102可以设置在支撑件600的第一通孔601内，这样，可以保证感光模组102的光信号均是通过透光孔301传输的。
如图7所示，感光元件100包括感光部110和围绕感光部110的边缘部120， 感光部110用于接收穿过透光孔301的光，例如摄像头的镜头；感光部110在显示面板200上的正投影在透光孔301在显示面板200上的正投影内。这里，感光部在显示面板200上的正投影在透光孔301在显示面板200上的正投影内，可以为二者投影完全重合，或者感光部在显示面板200上的正投影被透光孔301在显示面板200上的正投影所包裹。
通过上述对于投影面积的限定，可以保证感光元件100射出的光或者接收的光可以顺利穿过透光孔301。
如图7所示，该感光部110位于感光元件100的感光模组102上，是感光模组100上之间透光的部分(图6虚线框部分)，感光模组102的外壳以及感光模组102的底座102为围绕该感光部110的边缘部120。
作为本公开实施例的一种实现方式，参见图4和图6，终端设备还包括位于显示面板200和电路板300之间的保护膜700，保护膜700具有与透光孔301连通的第二通孔701。通过在保护膜700上也开设通孔，保证感光元件100的光信号的通过。
在本公开实施例中，保护膜700的作用为缓冲和散热，一方面，保护膜700设置在显示面板200和电路板300之间，可以在发生碰撞时还能够起到缓冲作用；另一方面，保护膜700的边缘与边框500相连，可以将显示面板200和电路板300产生的热量传导出去，实现散热。
图8示出了本公开实施例提供的保护膜的结构示意图。参见图8，保护膜700可以包括泡棉710和铜箔720，泡棉710位于铜箔720和显示面板之间200，铜箔720位于泡棉710和电路板300之间。
例如，泡棉710与显示面板200粘在一起，泡棉710与铜箔720粘在一起，铜箔720与电路板300粘在一起。
示例性地，泡棉710与显示面板200、泡棉710与铜箔720之间、以及铜箔720与电路板300之间可以采用胶水粘在一起。
在该保护膜700中，泡棉710和铜箔720上都具有前述第二通孔701。
由于保护膜700的存在，电路板300实际是通过胶水粘在保护膜700上，示例性地，电路板300通过胶水粘在铜箔上。
如图7所示，透光孔301的面积可以大于第二通孔701的面积。这样在安装电路板300时，方便将透光孔301与第二通孔701对准，因为从透光孔301中可以看到完整的第二通孔701。同样的，第一通孔601的面积可以大于透光孔 301的面积。
在其他实施方式中，透光孔301的面积和第二通孔701的面积大小可以相等，或者透光孔301的面积小于第二通孔701的面积。只需透光孔和第二通孔的大小均能满足感光元件的光信号传输需求即可。
再次参见图6，该终端设备还包括透明盖板800，透明盖板800贴合在显示面板200的出光面上，用于对显示面板200进行保护。该透明盖板800通常为玻璃盖板。
本领域技术人员在考虑说明书及实践这里公开的公开后，将容易想到本公开的其它实施方案。本申请旨在涵盖本公开的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由权利要求指出。
应当理解的是，本公开并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其范围进行各种修改和改变。本公开的范围仅由所附的权利要求来限制。

Claims (20)

  1. 一种终端设备，包括：
    感光元件；
    显示面板，具有一透光区域，所述透光区域为光能够穿过所述显示面板的区域；
    电路板，所述电路板至少部分位于所述显示面板和所述感光元件之间，所述电路板具有透光孔；
    其中，在垂直于所述显示面板的出光面的方向上，所述透光孔位于所述感光元件和所述显示面板的透光区域之间。
  2. 根据权利要求1所述的终端设备，其中，所述感光元件包括感光部和围绕所述感光部的边缘部，所述感光部用于接收穿过所述透光孔的光；
    所述感光部在所述显示面板上的正投影在所述透光孔在所述显示面板上的正投影内。
  3. 根据权利要求1或2所述的终端设备，其中，所述电路板为覆晶玻璃电路板、覆晶薄膜电路板、覆晶柔性材料电路板或者柔性电路板。
  4. 根据权利要求3所述的终端设备，其中，所述覆晶薄膜电路板包括薄膜电路板本体、以及位于所述薄膜电路板本体上的第一内引脚、驱动集成电路和第一外引脚，所述透光孔和所述驱动集成电路布置在所述第一内引脚和所述第一外引脚之间。
  5. 根据权利要求4所述的终端设备，其中，所述透光孔位于所述驱动集成电路和所述第一内引脚之间。
  6. 根据权利要求4所述的终端设备，其中，所述覆晶薄膜电路板的第一内引脚与柔性电路板电连接，所述覆晶薄膜电路板的第一外引脚与所述显示面板电连接。
  7. 根据权利要求3所述的终端设备，其中，所述柔性电路板包括柔性电路板本体、以及位于所述柔性电路板本体上的第二内引脚、器件区、触控绑定区和第二外引脚，所述透光孔、所述器件区和所述触控绑定区布置在所述第二内引脚和所述第二外引脚之间。
  8. 根据权利要求7所述的终端设备，其中，所述柔性电路板的第二内引脚与覆晶薄膜电路板电连接，所述柔性电路板的第二外引脚与所述终端设备的主 板电连接。
  9. 根据权利要求1至8任一项所述的终端设备，其中，所述感光元件为指纹传感器、红外传感器或摄像头。
  10. 根据权利要求9所述的终端设备，其中，所述感光元件为指纹传感器或摄像头，所述透光区域为供可见光穿过的透光区域；
    或者，所述感光元件为红外传感器，所述透光区域为供红外光穿过的透光区域。
  11. 根据权利要求1至10任一项所述的终端设备，其中，所述透光区域位于所述显示面板的底部区域内，所述底部区域的一侧边为所述显示面板的底边。
  12. 根据权利要求11所述的终端设备，其中，所述底部区域位于所述显示面板的显示区域内。
  13. 根据权利要求1至12任一项所述的终端设备，其中，所述终端设备还包括位于所述电路板和感光元件之间的支撑件，所述支撑件具有与所述透光孔连通的第一通孔。
  14. 根据权利要求13所述的终端设备，其中，所述支撑件的材料为泡棉。
  15. 根据权利要求13所述的终端设备，其中，所述感光元件包括底座和感光模组，所述底座固定在所述终端设备的后壳上，所述感光模组固定在所述底座上，所述支撑件设置在所述底座上，且所述感光模组设置在所述支撑件的第一通孔内。
  16. 根据权利要求13至15任一项所述的终端设备，其中，所述终端设备还包括位于所述显示面板和所述电路板之间的保护膜，所述保护膜具有与所述透光孔连通的第二通孔。
  17. 根据权利要求16所述的终端设备，其中，所述保护膜包括泡棉和铜箔，所述泡棉设置在所述铜箔和所述显示面板之间，所述铜箔设置在所述泡棉和所述电路板之间。
  18. 根据权利要求16所述的终端设备，其中，所述第一通孔的面积大于所述透光孔的面积，所述透光孔的面积大于所述第二通孔的面积。
  19. 根据权利要求1至18任一项所述的终端设备，其中，所述透光孔的形状为圆形或矩形。
  20. 根据权利要求1至19任一项所述的终端设备，其中，所述显示面板为 有机发光二极管显示面板。
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