WO2021008637A9 - 一种层叠型屏蔽电感 - Google Patents

一种层叠型屏蔽电感 Download PDF

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WO2021008637A9
WO2021008637A9 PCT/CN2020/120448 CN2020120448W WO2021008637A9 WO 2021008637 A9 WO2021008637 A9 WO 2021008637A9 CN 2020120448 W CN2020120448 W CN 2020120448W WO 2021008637 A9 WO2021008637 A9 WO 2021008637A9
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WIPO (PCT)
Prior art keywords
external electrode
conductor
shielding
conductive
laminated
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PCT/CN2020/120448
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English (en)
French (fr)
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WO2021008637A3 (zh
WO2021008637A2 (zh
Inventor
杨翌华
陈先仁
吴中东
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深圳顺络电子股份有限公司
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Application filed by 深圳顺络电子股份有限公司 filed Critical 深圳顺络电子股份有限公司
Priority to PCT/CN2020/120448 priority Critical patent/WO2021008637A2/zh
Priority to KR1020237013393A priority patent/KR20230091900A/ko
Priority to CN202080002272.9A priority patent/CN112400210A/zh
Priority to DE112020007677.6T priority patent/DE112020007677T5/de
Publication of WO2021008637A2 publication Critical patent/WO2021008637A2/zh
Publication of WO2021008637A3 publication Critical patent/WO2021008637A3/zh
Priority to US17/472,720 priority patent/US20220115178A1/en
Publication of WO2021008637A9 publication Critical patent/WO2021008637A9/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/288—Shielding
    • H01F27/2885—Shielding with shields or electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H01F27/324—Insulation between coil and core, between different winding sections, around the coil; Other insulation structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/008—Electric or magnetic shielding of printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2809—Printed windings on stacked layers

Definitions

  • the invention relates to a laminated electronic device, in particular to a laminated shielded inductor.
  • the main purpose of the present invention is to overcome the defects of the above-mentioned background technology and provide a laminated shielded inductor to effectively prevent or reduce the external radiation of the laminated chip inductor, thereby improving the reliability of the circuit system.
  • a laminated shielding inductor includes a laminated body, an internal coil, a first external electrode, a second external electrode, a third external electrode, and a shielding cover.
  • the laminated body includes a plurality of insulator layers laminated and arranged, and the laminated body has Multilayer coil conductors stacked between the plurality of insulator layers, the plurality of insulator layers are provided with conductive through holes, and the coil conductors of different layers are electrically connected through the conductive through holes to form an interior Coils, the plurality of insulator layers are provided with shielding conductor through slots located at the periphery of the inner coil, each of the shielding conductor through slots is provided with a shielding conductor, and the shields in the plurality of shielding conductor through slots The conductors are electrically connected to form a shielded conductor laminated layer surrounding the outer side of the inner coil.
  • a shielded conductor upper layer and a shielded conductor lower layer are respectively provided above and below the inner coil.
  • the shielded conductor laminated layer and the shield The upper layer of the conductor and the lower layer of the shielded conductor are closed to form the shielding case enclosing the inner coil, and the first outer electrode, the second outer electrode, and the third outer electrode are provided on the surface of the laminate Above, the first external electrode and the second external electrode are electrically connected to both ends of the internal coil, respectively, and the third external electrode is electrically connected to the shielding cover.
  • the upper layer of the shielding conductor and the lower layer of the shielding conductor are located inside the laminate, the upper layer of the shielding conductor and the lower layer of the shielding conductor are respectively provided with the insulator layer, and the insulator layer is provided with a conductive layer.
  • the through hole is used to electrically connect the upper layer of the shield conductor or the lower layer of the shield conductor to the third external electrode.
  • each of the first external electrode, the second external electrode and the third external electrode is located on the same surface of the laminated body, and the insulator layer is provided with first to third conductive Through holes, the shielding cover is provided with fourth to fifth conductive through holes, the first conductive through holes are electrically connected to the fourth conductive through holes, and the second conductive through holes are electrically connected to the fifth conductive through holes.
  • the first external electrode is electrically connected to one end of the internal coil through the first conductive through hole and the fourth conductive through hole, and the second external electrode is electrically connected through the second conductive through hole.
  • the other end of the inner coil is electrically connected to the fifth conductive through hole, and the third external electrode is electrically connected to the shielding cover through the third conductive through hole.
  • each of the first external electrode, the second external electrode, and the third external electrode is located on the same surface of the laminate, and the same surface is the direction of the laminate with the laminate That is, the axial direction of the inner coil is perpendicular to the surface.
  • the laminated body has a rectangular parallelepiped structure, and has two opposite end faces, two side faces, and upper and lower surfaces respectively, and the same surface is the lower surface of the laminated body.
  • the shielded conductor laminated layer has a rectangular cylindrical structure.
  • the lower surface of the laminated body is a mounting surface of the laminated shielded inductor.
  • the conductive through holes connected to the first external electrode and the second external electrode are formed perpendicular to the mounting surface where the first external electrode and the second external electrode are located and parallel to the internal coil. Axial first and second connecting conductors.
  • the insulation distance between the inner coil and the shielding cover is greater than 30 ⁇ m; the insulation distance between the first and second connecting conductors and the shielding cover is greater than 30 ⁇ m; The distance between the outside of the laminated shielded inductor is greater than 15 ⁇ m.
  • first connecting conductor and the second connecting conductor respectively pass through the through holes on the lower layer of the shield conductor or the upper layer of the shield conductor and are electrically connected to the first external electrode and the second external electrode ,
  • the first connecting conductor and the second connecting conductor and the lower layer of the shielding conductor or the upper layer of the shielding conductor are insulated by a ceramic material.
  • the laminated body of the laminated shielded inductor of the present invention includes a plurality of insulator layers stacked on each other.
  • the plurality of insulator layers are provided with shielding conductor through slots located at the periphery of the inner coil, and each of the shielding conductor through slots is provided with a shield.
  • the conductors are electrically connected to each other to form a shielded conductor laminate layer surrounding the inner coil.
  • a shield conductor upper layer and a shield conductor lower layer are respectively provided above and below the inner coil.
  • the shield conductor laminate layer, The upper layer of the shielding conductor and the lower layer of the shielding conductor are closed to form a shielding case enclosing the inner coil, and the shielding case is connected to a third external electrode provided on the surface of the laminated body, whereby the laminated shield of the present invention
  • the inductance encloses the positively-charged coil conductor through a complete internal conductive shield (such as a metal shield), and the same amount of negative charge as the charged coil conductor will be induced on the inside of the shield, and it will appear and be charged on the outside of the shield.
  • the positive charge of the coil conductor is equal.
  • the shield When the shield is grounded through the third external electrode, the positive charge on the outside will flow into the ground, and there will be no electric field on the outside, that is, the electric field of the positively charged coil conductor is shielded on the shield. Inside. When the shielding inductance is working in the circuit, ensure that the shielding layer is well grounded, so that the coupling interference voltage of the alternating electric field to the sensitive circuit can be reduced.
  • the invention can achieve a high shielding effect for laminated chip inductors and realize a laminated coil component with a high Q value.
  • the invention can effectively reduce the external radiation of the laminated chip inductors, thereby improving the reliability of the circuit system.
  • FIG. 1A is a three-dimensional perspective view of a laminated shielded inductor according to an embodiment of the present invention.
  • FIG. 1B is a side perspective view of the laminated shielded inductor shown in FIG. 1A.
  • Fig. 1C is a bottom perspective view of the laminated shielded inductor shown in Fig. 1A.
  • Fig. 2A is a side view of the laminated shielded inductor shown in Fig. 1A.
  • Fig. 2B is an end view of the laminated shielded inductor shown in Fig. 1A.
  • Fig. 2C is a bottom view of the laminated shielded inductor shown in Fig. 1A.
  • FIG. 3 is an exploded view of an example of the laminated body of the laminated shielded inductor shown in FIG. 1A.
  • connection can be used for fixing or for coupling or connecting.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features.
  • a plurality of means two or more than two, unless otherwise specifically defined.
  • the embodiment of the present invention provides a laminated shielded inductor, including a laminated body 1, an internal coil 6, a first external electrode 21, a second external electrode 22, a third external electrode 23 and a shielding cover 3.
  • the laminated body 1 includes a plurality of insulator layers laminated and arranged, the laminated body 1 has a multilayer coil conductor 60 laminated and arranged between the plurality of insulator layers, and conductive vias are provided on the plurality of insulator layers. 61.
  • the coil conductors 60 of different layers are electrically connected through the conductive through holes 61 to form the inner coil 6, and the plurality of insulator layers are provided with shield conductor through slots 32 located on the periphery of the inner coil 6,
  • a shield conductor 31 is provided in each shield conductor slot 32, and the shield conductors 31 in a plurality of shield conductor slots 32 are electrically connected to form a shield conductor stack surrounding the inner coil 6 together.
  • Layer, above and below the inner coil 6 are respectively provided with a shield conductor upper layer 31b and a shield conductor lower layer 31a, the shield conductor laminate layer, the shield conductor upper layer 31b and the shield conductor lower layer 31a are closed to form the inner coil 6 the shielding case 3 enclosed therein, the first external electrode 21, the second external electrode 22, and the third external electrode 23 are provided on the surface of the laminated body 1, and the first external The electrode 21 and the second external electrode 22 are respectively electrically connected to both ends of the internal coil 6, and the third external electrode 23 is electrically connected to the shielding cover 3.
  • the upper shield conductor layer 31b and the lower shield conductor layer 31a are located inside the laminate 1, and the outer shield conductor upper layer 31b and the shield conductor lower layer 31a are respectively provided with the insulator layer .
  • the insulator layer is provided with conductive through holes 65 a and 66 a to electrically connect the shield conductor upper layer 31 b or the shield conductor lower layer 31 a to the third external electrode 23.
  • each of the first external electrode 21, the second external electrode 22, and the third external electrode 23 is located on the same surface of the laminated body 1 (such as the first main surface 13 ), the insulator layer is provided with a first conductive through hole 61a, a second conductive through hole 62a, one or more third conductive through holes 65a, 66a, the shielding cover 3 is provided with a fourth conductive through hole 61b, a fifth conductive via 62b, the first conductive via 61a is electrically connected to the fourth conductive via 61b, the second conductive via 62a is electrically connected to the fifth conductive via 62b, so
  • the first external electrode 21 is electrically connected to one end of the internal coil 6 through the first conductive through hole 61a and the fourth conductive through hole 61b, and the second external electrode 22 is through the second conductive through hole 62a.
  • the other end of the inner coil 6 is electrically connected to the fifth conductive through hole 62b, and the third external electrode
  • each of the first external electrode 21, the second external electrode 22, and the third external electrode 23 is located on the same surface of the laminated body 1, and the same surface is A plane perpendicular to the stacking direction of the laminated body 1, that is, the axial direction of the internal coil 6.
  • the laminated body 1 is a rectangular parallelepiped structure with two opposite end faces, two side faces, and upper and lower surfaces respectively, and the same surface is the lower surface of the laminated body 1.
  • the shielded conductor laminated layer has a rectangular cylindrical structure.
  • the lower surface of the laminated body 1 is the mounting surface of the laminated shielded inductor.
  • the conductive vias connected to the first external electrode 21 and the second external electrode 22 are formed perpendicular to the mounting surface where the first external electrode 21 and the second external electrode 22 are located. And the first connecting conductor 51 and the second connecting conductor 52 parallel to the axial direction of the inner coil 6.
  • the insulation distance between the inner coil 6 and the shielding case 3 is greater than 30 ⁇ m; the insulation distance between the first connecting conductor 51 and the second connecting conductor 52 and the shielding case 3 It is greater than 30 ⁇ m; the distance between the shielding cover 3 and the outside of the laminated shielding inductor is greater than 15 ⁇ m.
  • first connecting conductor 51 and the second connecting conductor 52 respectively pass through the through holes on the lower layer of the shielding conductor or the upper layer of the shielding conductor, and the first external electrode 21 and the The second external electrode 22 is electrically connected, and the first connecting conductor 51 and the second connecting conductor 52 are insulated from the lower layer of the shield conductor or the upper layer of the shield conductor by a ceramic material.
  • the laminated shielded inductor includes a laminated body 1, a first external electrode 21, a second external electrode 22, and a third external electrode 23.
  • the laminated body 1 has a rectangular parallelepiped shape with 6 faces.
  • the laminated body 1 is formed by laminating multiple insulators, a shielding layer, and an internal coil 6.
  • the first external electrode 21 and the second external electrode 22 are respectively connected to the terminals of the internal coil 6, and the third external electrode 23 is connected to the shielding layer 3.
  • the width direction, the length direction, and the height direction are respectively defined as the X direction, the Y direction, and the Z direction, and the X direction and the Y and Z directions are orthogonal to each other.
  • the laminated shielded inductor has: a first end surface 11 and a second end surface 12 opposed to each other in the length direction (Y direction); The first main surface 13 and the second main surface 14; and the first side surface 15 and the second side surface 16 opposed to each other in the width direction (X direction) orthogonal to the length and height directions.
  • the laminated shielded inductor has a first external electrode 21, a second external electrode 22, and a third external electrode 23 on the first main surface 13, wherein the first external electrode 21 partially covers the first external electrode 21.
  • the end surface 11 and the second external electrode 22 partially cover the second end surface 12.
  • the distance between the first external electrode 21, the second external electrode 22 and the third external electrode 23 on the first main surface 13 is not less than 0.15mm , And does not extend to the first side 15 and the second side 16 in the X direction, and the distance from the first side 15 and the second side 16 is not less than 0.03 mm.
  • Figure 3 shows the three-dimensional structure details of a specific embodiment.
  • the inductance value is 6.0nH below.
  • the above-mentioned printed ceramic paste is coated on a carrier using a doctor blade method to prepare a substrate, a conductive paste is printed on the substrate, a conductive coil and a shielding layer are prepared by exposure and development, and a layer of printed ceramic paste is printed on the conductive coil
  • the material is exposed and developed to make through holes. As shown in Figure 3, after copying to a specified number of layers, it is cut with a cutter and singulated to obtain a laminated shielded inductor shape.
  • the laminated body is placed in a sintering furnace, and the binder is removed at a temperature of 465°C in an air environment, and then sintered at 900°C to obtain a laminated shielded inductor with electrical characteristics.
  • Ni plating layer and Sn plating layer are sequentially formed on the base electrode to obtain the final external electrode.
  • the laminated shielded inductor of the embodiment of the present invention is tested and compared with the common inductor of the same size and the same inductance value.
  • the radiation voltage results of the two products measured at the same distance are shown in Table 1-1. It can be seen that The shielding effectiveness of the laminated shielded inductors prepared by the above method under different shields are all> 20dB.
  • the background part of the present invention may contain background information about the problem or environment of the present invention, and does not necessarily describe the prior art. Therefore, the content contained in the background technology part is not the applicant's recognition of the prior art.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

一种层叠型屏蔽电感，包括层叠体、内部线圈、第一外部电极、第二外部电极、第三外部电极和屏蔽罩，层叠体包括层叠设置的多个绝缘体层，所述多个绝缘体层上开设有位于内部线圈外围的屏蔽导体通槽，每个所述屏蔽导体通槽内设置有屏蔽导体且相互电连接，共同形成围在所述内部线圈的外侧的屏蔽导体层叠层，在所述内部线圈的上方和下方分别设置有屏蔽导体上层和屏蔽导体下层，所述屏蔽导体层叠层、所述屏蔽导体上层和屏蔽导体下层闭合形成将所述内部线圈包围在内的屏蔽罩，屏蔽罩与设置在所述层叠体的表面上的第三外部电极连接，由此，本发明能够实现层叠型贴片电感的高屏蔽效果，有效地减少层叠型贴片电感的对外辐射，从而提高电路系统的可靠性。

Description

一种层叠型屏蔽电感 技术领域
本发明涉及层叠型电子器件，特别是涉及一种层叠型屏蔽电感。
背景技术
随着WiFi6、5G等通信技术的发展，应用频率越来越高，信道越来越窄，电感器件作为一个辐射源，应用过程中需要考虑EMI，电感器件的对外辐射容易引起对电路系统尤其是其中的敏感电路的干扰，影响电路系统工作的可靠性。
以上背景技术内容的公开仅用于辅助理解本发明的发明构思及技术方案，其并不必然属于本专利申请的现有技术，在没有明确的证据表明上述内容在本专利申请的申请日已经公开的情况下，上述背景技术不应当用于评价本申请的新颖性和创造性。
发明内容
本发明的主要目的在于克服上述背景技术的缺陷，提供一种层叠型屏蔽电感，以有效地防止或减少层叠型贴片电感的对外辐射，从而提高电路系统的可靠性。
为实现上述目的，本发明采用以下技术方案：
一种层叠型屏蔽电感，包括层叠体、内部线圈、第一外部电极、第二外部电极、第三外部电极和屏蔽罩，所述层叠体包括层叠设置的多个绝缘体层，所述层叠体具有层叠设置于所述多个绝缘体层之间的多层线圈导体，所述多个绝缘体层上设置有导电通孔，不同层的所述线圈导体之间通过所述导电通孔电连接而构成内部线圈，所述多个绝缘体层上开设有位于所述内部线圈外围的屏蔽导体通槽，每个所述屏蔽导体通槽内设置有屏蔽导体，多个所述屏蔽导体通槽内的所述屏蔽导体电连接，共同形成围在所述内部线圈的外侧的屏蔽导体层叠层，在所述内部线圈的上方和下方分别设置有屏蔽导体上层和屏蔽导体下层，所述屏蔽导体层叠层、所述屏蔽导体上层和屏蔽导体下层闭合形成将所述内部线圈包围在内的所述屏蔽罩，所述第一外部电极、所述第二外部电极和所述第三外部电极设置在所述层叠体的表面上，所述第一外部电极和所述第二外部电极分别电连接所述内部线圈 的两端，所述第三外部电极电连接所述屏蔽罩。
进一步地，所述屏蔽导体上层和所述屏蔽导体下层位于所述层叠体内部，所述屏蔽导体上层和所述屏蔽导体下层的外侧分别设有所述绝缘体层，所述绝缘体层上设置有导电通孔以将所述屏蔽导体上层或所述屏蔽导体下层电连接所述第三外部电极。
进一步地，所述第一外部电极、所述第二外部电极和所述第三外部电极各自的至少一部分位于所述层叠体的同一面上，所述绝缘体层上设置有第一至第三导电通孔，所述屏蔽罩上设置有第四至第五导电通孔，所述第一导电通孔与所述第四导电通孔电连接，所述第二导电通孔与所述第五导电通孔电连接，所述第一外部电极通过所述第一导电通孔与所述第四导电通孔电连接所述内部线圈的一端，所述第二外部电极通过所述第二导电通孔与所述第五导电通孔电连接所述内部线圈的另一端，所述第三外部电极通过所述第三导电通孔电连接所述屏蔽罩。
进一步地，所述第一外部电极、所述第二外部电极和所述第三外部电极各自的至少一部分位于所述层叠体的同一面上，所述同一面为与所述层叠体的层叠方向即所述内部线圈的轴向相垂直的面。
进一步地，所述层叠体为长方体结构，具有分别相对的两个端面、两个侧面和上下表面，所述同一面为所述层叠体的下表面。
进一步地，所述屏蔽导体层叠层成长方形筒式结构。
进一步地，所述层叠体的下表面为所述层叠型屏蔽电感的安装面。
进一步地，与所述第一外部电极和所述第二外部电极相连的导电通孔形成垂直于所述第一外部电极和所述第二外部电极所在的安装面和平行于所述内部线圈的轴向的第一连接导体和第二连接导体。
进一步地，所述内部线圈与所述屏蔽罩之间的绝缘距离大于30μm；所述第一连接导体和第二连接导体与所述屏蔽罩之间的绝缘距离大于30μm；所述屏蔽罩到所述层叠屏蔽电感外部之间的距离大于15μm。
进一步地，所述第一连接导体和所述第二连接导体分别穿过所述屏蔽导体下层或所述屏蔽导体上层上的通孔与所述第一外部电极和所述第二外部电极电连接，所述第一连接导体和所述第二连接导体与所述屏蔽导体下层或所述屏蔽导体上层之间由陶瓷材料绝缘。
本发明具有如下有益效果：
本发明的层叠型屏蔽电感的层叠体包括层叠设置的多个绝缘体层，所 述多个绝缘体层上开设有位于内部线圈外围的屏蔽导体通槽，每个所述屏蔽导体通槽内设置有屏蔽导体且相互电连接，共同形成围在所述内部线圈的外侧的屏蔽导体层叠层，在所述内部线圈的上方和下方分别设置有屏蔽导体上层和屏蔽导体下层，所述屏蔽导体层叠层、所述屏蔽导体上层和屏蔽导体下层闭合形成将所述内部线圈包围在内的屏蔽罩，屏蔽罩与设置在所述层叠体的表面上的第三外部电极连接，由此，本发明的层叠型屏蔽电感通过内部完整的导电屏蔽罩(如金属屏蔽罩)将带正电的线圈导体包围起来，在屏蔽罩的内侧将感应出与带电线圈导体等量的负电荷，在屏蔽罩的外侧出现与带电线圈导体等量的正电荷，将屏蔽罩通过第三外部电极接地时，则外侧的正电荷将流入大地，外侧将不会有电场存在，即带正电的线圈导体的电场被屏蔽在屏蔽罩内。屏蔽电感在电路中工作时，确保屏蔽层接地良好，就能使交变电场对敏感电路的耦合干扰电压变得很小。
本发明能够对层叠型贴片电感实现高屏蔽效果，实现高Q值的层叠型线圈元件。本发明能有效地减少层叠型贴片电感的对外辐射，从而提高电路系统的可靠性。
附图说明
图1A为本发明一种实施例的层叠型屏蔽电感的立体透视图。
图1B为图1A所示的层叠型屏蔽电感的侧视透视图。
图1C为图1A所示的层叠型屏蔽电感的仰视透视图。
图2A为图1A所示的层叠型屏蔽电感的侧视图。
图2B为图1A所示的层叠型屏蔽电感的端面视图。
图2C为图1A所示的层叠型屏蔽电感的仰视图。
图3为图1A所示的层叠型屏蔽电感的层叠体的一个示例的爆炸图。
具体实施方式
以下对本发明的实施方式做详细说明。应该强调的是，下述说明仅仅是示例性的，而不是为了限制本发明的范围及其应用。
需要说明的是，当元件被称为“固定于”或“设置于”另一个元件，它可以直接在另一个元件上或者间接在该另一个元件上。当一个元件被称为是“连接于”另一个元件，它可以是直接连接到另一个元件或间接连接至该另一个元件上。另外，连接既可以是用于固定作用也可以是用于耦合或连通作用。
需要理解的是，术语“长度”、“宽度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、 “外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明实施例和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多该特征。在本发明实施例的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
参阅图1A至图3，本发明实施例提供一种层叠型屏蔽电感，包括层叠体1、内部线圈6、第一外部电极21、第二外部电极22、第三外部电极23和屏蔽罩3，所述层叠体1包括层叠设置的多个绝缘体层，所述层叠体1具有层叠设置于所述多个绝缘体层之间的多层线圈导体60，所述多个绝缘体层上设置有导电通孔61，不同层的所述线圈导体60之间通过所述导电通孔61电连接而构成内部线圈6，所述多个绝缘体层上开设有位于所述内部线圈6外围的屏蔽导体通槽32，每个所述屏蔽导体通槽32内设置有屏蔽导体31，多个所述屏蔽导体通槽32内的所述屏蔽导体31电连接，共同形成围在所述内部线圈6的外侧的屏蔽导体层叠层，在所述内部线圈6的上方和下方分别设置有屏蔽导体上层31b和屏蔽导体下层31a，所述屏蔽导体层叠层、所述屏蔽导体上层31b和屏蔽导体下层31a闭合形成将所述内部线圈6包围在内的所述屏蔽罩3，所述第一外部电极21、所述第二外部电极22和所述第三外部电极23设置在所述层叠体1的表面上，所述第一外部电极21和所述第二外部电极22分别电连接所述内部线圈6的两端，所述第三外部电极23电连接所述屏蔽罩3。
在优选的实施例中，所述屏蔽导体上层31b和所述屏蔽导体下层31a位于所述层叠体1内部，所述屏蔽导体上层31b和所述屏蔽导体下层31a的外侧分别设有所述绝缘体层。所述绝缘体层上设置有导电通孔65a、66a以将所述屏蔽导体上层31b或所述屏蔽导体下层31a电连接所述第三外部电极23。
在优选的实施例中，所述第一外部电极21、所述第二外部电极22和所述第三外部电极23各自的至少一部分位于所述层叠体1的同一面(如第一主面13)上，所述绝缘体层上设置有第一导电通孔61a、第二导电通孔 62a、一个或多个第三导电通孔65a、66a，所述屏蔽罩3上设置有第四导电通孔61b、第五导电通孔62b，所述第一导电通孔61a与所述第四导电通孔61b电连接，所述第二导电通孔62a与所述第五导电通孔62b电连接，所述第一外部电极21通过所述第一导电通孔61a与所述第四导电通孔61b电连接所述内部线圈6的一端，所述第二外部电极22通过所述第二导电通孔62a与所述第五导电通孔62b电连接所述内部线圈6的另一端，所述第三外部电极23通过所述第三导电通孔65a、66a电连接所述屏蔽罩3。
在优选的实施例中，所述第一外部电极21、所述第二外部电极22和所述第三外部电极23各自的至少一部分位于所述层叠体1的同一面上，所述同一面为与所述层叠体1的层叠方向即所述内部线圈6的轴向相垂直的面。
在优选的实施例中，所述层叠体1为长方体结构，具有分别相对的两个端面、两个侧面和上下表面，所述同一面为所述层叠体1的下表面。
在优选的实施例中，所述屏蔽导体层叠层成长方形筒式结构。
在优选的实施例中，所述层叠体1的下表面为所述层叠型屏蔽电感的安装面。
在优选的实施例中，与所述第一外部电极21和所述第二外部电极22相连的导电通孔形成垂直于所述第一外部电极21和所述第二外部电极22所在的安装面和平行于所述内部线圈6的轴向的第一连接导体51和第二连接导体52。
在优选的实施例中，所述内部线圈6与所述屏蔽罩3之间的绝缘距离大于30μm；所述第一连接导体51和第二连接导体52与所述屏蔽罩3之间的绝缘距离大于30μm；所述屏蔽罩3到所述层叠屏蔽电感外部之间的距离大于15μm。
在优选的实施例中，所述第一连接导体51和所述第二连接导体52分别穿过所述屏蔽导体下层或所述屏蔽导体上层上的通孔与所述第一外部电极21和所述第二外部电极22电连接，所述第一连接导体51和所述第二连接导体52与所述屏蔽导体下层或所述屏蔽导体上层之间由陶瓷材料绝缘。
以下结合附图进一步描述本发明具体实施例。
如图1A至图3所示，层叠型屏蔽电感具备层叠体1，第一外部电极21、第二外部电极22、第三外部电极23。层叠体1是具有6个面的长方体 形状。层叠体1由多层绝缘体、屏蔽层和内部线圈6层叠而成，第一外部电极21和第二外部电极22分别与内部线圈6的端子相连，第三外部电极23与屏蔽层3相连。
对于实施例的长方体形状层叠屏蔽电感，将宽度方向、长度方向、高度方向分别定义为X方向、Y方向、Z方向，X方向与Y和Z方向彼此两两正交。
如图1A至图3所示，层叠型屏蔽电感具有：在长度方向(Y方向)上相对的第一端面11和第二端面12；在长度方向上正交的高度方向(Z方向)上的第一主面13和第二主面14；以及在长度和高度方向上正交的宽度方向(X方向)上相对的第一侧面15和第二侧面16。
如图1A至图3所示，层叠型屏蔽电感具有位于第一主面13上的第一外部电极21、第二外部电极22、第三外部电极23，其中第一外部电极21部分覆盖第一端面11，第二外部电极22部分覆盖第二端面12。
叠层型屏蔽电感的尺寸为1.0*0.5*0.5mm的情况下，位于第一主面13的第一外部电极21、第二外部电极22和第三外部电极23之间间隔距离不小于0.15mm，且在X方向上不延伸至第一侧面15和第二侧面16，与第一侧面15和第二侧面16间距不小于0.03mm。
图3示出了一个具体实施例的立体结构细节。
制作例
以下制作为电感值6.0nH。
准备具有规定组成的陶瓷原材料。
在上述预烧粉末加入粘合剂(50％-55％)、有机溶剂(20％-30％)、光引发剂(5％-15％)一起放入轧磨机，制得印刷陶瓷浆料。
准备含有Ag粉末和有机载体的内部导体用的导电性浆料，银含量60％～80％。
将上述印刷陶瓷浆料使用刮刀方式涂布在载板上制得基板，在基板上印刷导电性浆料，通过曝光和显影制得导电线圈和屏蔽层，在导电线圈上印刷一层印刷陶瓷浆料，通过曝光和显影制得通孔，如图3所示，往复制作到规定层数后，用切割器切断并单片化，并由此得到层叠型屏蔽电感的形体。
将层叠形体放入烧制炉，在大气环境下，以465℃温度进行脱粘合剂 处理，以900℃进行烧结，由此得到具有电气特性的层叠型屏蔽电感。使用千分尺测出所得到的叠层型屏蔽电感50个尺寸并求出平均值，为L＝1.0mm，W＝0.50mm，T＝0.50mm。
通过电镀，在基底电极上依次形成Ni镀层和Sn镀层，得到最终的外部电极。
测试
将本发明实施例的叠层型屏蔽电感与相同尺寸、相同电感值的普通电感进行测试对比，在相同的距离上测得两个产品的辐射电压结果如表1-1所示，可看出通过上述方法制得的层叠型屏蔽电感在不同屏蔽下的屏蔽效能均＞20dB。
表1-1
频率点 实例场强(V/m) 比较例场强(V/m) 屏蔽效能/dB
915MHz 11.6 1013.4 38.8
1800MHz 9.5 1108.8 41
2400MHz 21.3 1183 34
3000MHz 51.4 1137.1 26
3400MHz 77.44 1156.43 23
3900MHz 102.99 1147.17 21
本发明的背景部分可以包含关于本发明的问题或环境的背景信息，而不一定是描述现有技术。因此，在背景技术部分中包含的内容并不是申请人对现有技术的承认。
以上内容是结合具体/优选的实施方式对本发明所作的进一步详细说明，不能认定本发明的具体实施只局限于这些说明。对于本发明所属技术领域的普通技术人员来说，在不脱离本发明构思的前提下，其还可以对这些已描述的实施方式做出若干替代或变型，而这些替代或变型方式都应当视为属于本发明的保护范围。在本说明书的描述中，参考术语“一种实施例”、“一些实施例”、“优选实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、 材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。尽管已经详细描述了本发明的实施例及其优点，但应当理解，在不脱离专利申请的保护范围的情况下，可以在本文中进行各种改变、替换和变更。

Claims (10)

  1. 一种层叠型屏蔽电感，其特征在于，包括层叠体、内部线圈、第一外部电极、第二外部电极、第三外部电极和屏蔽罩，所述层叠体包括层叠设置的多个绝缘体层，所述层叠体具有层叠设置于所述多个绝缘体层之间的多层线圈导体，所述多个绝缘体层上设置有导电通孔，不同层的所述线圈导体之间通过所述导电通孔电连接而构成内部线圈，所述多个绝缘体层上开设有位于所述内部线圈外围的屏蔽导体通槽，每个所述屏蔽导体通槽内设置有屏蔽导体，多个所述屏蔽导体通槽内的所述屏蔽导体电连接，共同形成围在所述内部线圈的外侧的屏蔽导体层叠层，在所述内部线圈的上方和下方分别设置有屏蔽导体上层和屏蔽导体下层，所述屏蔽导体层叠层、所述屏蔽导体上层和屏蔽导体下层闭合形成将所述内部线圈包围在内的所述屏蔽罩，所述第一外部电极、所述第二外部电极和所述第三外部电极设置在所述层叠体的表面上，所述第一外部电极和所述第二外部电极分别电连接所述内部线圈的两端，所述第三外部电极电连接所述屏蔽罩。
  2. 如权利要求1所述的层叠型屏蔽电感，其特征在于，所述屏蔽导体上层和所述屏蔽导体下层位于所述层叠体内部，所述屏蔽导体上层和所述屏蔽导体下层的外侧分别设有所述绝缘体层，所述绝缘体层上设置有导电通孔以将所述屏蔽导体上层或所述屏蔽导体下层电连接所述第三外部电极。
  3. 如权利要求2所述的层叠型屏蔽电感，其特征在于，所述第一外部电极、所述第二外部电极和所述第三外部电极各自的至少一部分位于所述层叠体的同一面上，所述绝缘体层上设置有第一至第三导电通孔，所述屏蔽罩上设置有第四至第五导电通孔，所述第一导电通孔与所述第四导电通孔电连接，所述第二导电通孔与所述第五导电通孔电连接，所述第一外部电极通过所述第一导电通孔与所述第四导电通孔电连接所述内部线圈的一端，所述第二外部电极通过所述第二导电通孔与所述第五导电通孔电连接所述内部线圈的另一端，所述第三外部电极通过所述第三导电通孔电连接所述屏蔽罩。
  4. 如权利要求1至3任一项所述的层叠型屏蔽电感，其特征在于，所述第一外部电极、所述第二外部电极和所述第三外部电极各自的至少一部分位于所述层叠体的同一面上，所述同一面为与所述层叠体的层叠方向即所述内部线圈的轴向相垂直的面。
  5. 如权利要求4所述的层叠型屏蔽电感，其特征在于，所述层叠体为长方体结构，具有分别相对的两个端面、两个侧面和上下表面，所述同一面为所述层叠体的下表面。
  6. 如权利要求5所述的层叠型屏蔽电感，其特征在于，所述屏蔽导体层叠层成长方形筒式结构。
  7. 如权利要求5所述的层叠型屏蔽电感，其特征在于，所述层叠体的下表面为所述层叠型屏蔽电感的安装面。
  8. 如权利要求1至7任一项所述的层叠型屏蔽电感，其特征在于，与所述第一外部电极和所述第二外部电极相连的导电通孔形成垂直于所述第一外部电极和所述第二外部电极所在的安装面和平行于所述内部线圈的轴向的第一连接导体和第二连接导体。
  9. 如权利要求8所述的层叠型屏蔽电感，其特征在于，所述内部线圈与所述屏蔽罩之间的绝缘距离大于30μm；所述第一连接导体和第二连接导体与所述屏蔽罩之间的绝缘距离大于30μm；所述屏蔽罩到所述层叠屏蔽电感外部之间的距离大于15μm。
  10. 如权利要求8所述的层叠型屏蔽电感，其特征在于，所述第一连接导体和所述第二连接导体分别穿过所述屏蔽导体下层或所述屏蔽导体上层上的通孔与所述第一外部电极和所述第二外部电极电连接，所述第一连接导体和所述第二连接导体与所述屏蔽导体下层或所述屏蔽导体上层之间由陶瓷材料绝缘。
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