WO2021004470A1 - 一种感光组件的制备方法、感光组件、以及摄像模组 - Google Patents

一种感光组件的制备方法、感光组件、以及摄像模组 Download PDF

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Publication number
WO2021004470A1
WO2021004470A1 PCT/CN2020/100787 CN2020100787W WO2021004470A1 WO 2021004470 A1 WO2021004470 A1 WO 2021004470A1 CN 2020100787 W CN2020100787 W CN 2020100787W WO 2021004470 A1 WO2021004470 A1 WO 2021004470A1
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Prior art keywords
photosensitive
compensation part
channel
photosensitive element
preparation
Prior art date
Application number
PCT/CN2020/100787
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English (en)
French (fr)
Inventor
黄桢
刘丽
许晨祥
陈佳炜
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201921073442.3U external-priority patent/CN209913929U/zh
Priority claimed from CN201910619763.7A external-priority patent/CN112217963A/zh
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Publication of WO2021004470A1 publication Critical patent/WO2021004470A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof

Definitions

  • the invention relates to the field of electronic technology, in particular to a method for preparing a photosensitive component, a photosensitive component and a camera module.
  • the traditional modules adopt a method of attaching a photosensitive element to a circuit board, and then fixing a lens holder to the circuit board, and then fixing a The optical lens and a color filter element are on the photosensitive path of the photosensitive element.
  • the module includes a photosensitive component and a light-transmitting component, and the light-transmitting component is disposed on the photosensitive element of the photosensitive component.
  • the photosensitive component includes a circuit board and a molded body integrally molded on the circuit board.
  • the photosensitive element is pre-attached to the circuit board, Then, the molded body is formed on the circuit board through a molding process, and the molded body wraps at least part of the non-photosensitive area of the photosensitive element.
  • the thermal expansion coefficients of the circuit board and the molded body in the camera module are different, when the camera module is installed in different environments, the expansion degree of each component is different, and stress is generated.
  • the stress acting on the photosensitive element will cause a certain degree of deformation or displacement of the photosensitive element, resulting in deterioration of the imaging effect.
  • the present invention provides a method for preparing a photosensitive component, a photosensitive component, and a camera module.
  • the photosensitive component can be applied to different environments, and the molded body will not cause stress to the photosensitive element during reuse. Longer component life.
  • a method for manufacturing a photosensitive component is provided.
  • the invention relates to a method for preparing a photosensitive component, the method comprising:
  • the molding process includes forming a molded body outside the compensation part.
  • the compensation part is at least partially covered by the molded body.
  • the compensation part is at least partially communicated with the outside.
  • the compensation part is a continuous whole.
  • the compensation part includes a plurality of discrete parts, and each discrete part is at least partially covered by the molded body.
  • the compensation part includes a plurality of discrete parts, and each discrete part is at least partially connected to the outside.
  • the compensation part is solid or gel-like.
  • the compensation part adopts a high-temperature melting material with a melting temperature of 175-240° C.
  • the step of removing the compensation part includes increasing the temperature to melt the compensation part.
  • the compensation part uses a high-temperature gasification material, and the gasification temperature is 175-240°C, and the step of removing the compensation part includes increasing the temperature to vaporize the compensation part.
  • the compensation part adopts a material soluble in organic solvent or water
  • the step of removing the compensation part includes dissolving the compensation part with an organic solvent or water.
  • the substrate is cut to form a plurality of photosensitive components.
  • an isolation channel is formed, the isolation channel includes a surrounding channel and a communication channel, the isolation channel surrounds the photosensitive element, and the communication channel is based on the surrounding channel.
  • a channel whose starting point extends in a direction away from the photosensitive element, and the surrounding channel passes through the communication channel.
  • the end of the communication channel away from the surrounding channel is sealed with a filling material.
  • a method for manufacturing a photosensitive component is provided.
  • the invention relates to a method for preparing a photosensitive component, the method comprising:
  • a step is provided on the photosensitive element
  • the photosensitive element includes a photosensitive area and a non-sensitive area, the non-sensitive area is located at the edge of the photosensitive area and arranged around the photosensitive area, and the step portion is located in the non-sensitive area , And the step portion is arranged around the photosensitive area.
  • the molding process includes forming a molded body outside the compensation part.
  • the compensation part is at least partially covered by the molded body.
  • the compensation part is at least partially communicated with the outside.
  • the compensation part is a continuous whole.
  • the compensation part includes a plurality of discrete parts, and each discrete part is at least partially covered by the molded body.
  • the compensation part includes a plurality of discrete parts, and each discrete part is at least partially connected to the outside.
  • the compensation part is solid or gel-like.
  • the compensation part adopts a high-temperature melting material with a melting temperature of 175-240° C.
  • the step of removing the compensation part includes increasing the temperature to melt the compensation part.
  • the compensation part uses a high-temperature gasification material, and the gasification temperature is 175-240°C, and the step of removing the compensation part includes increasing the temperature to vaporize the compensation part.
  • the compensation part adopts a material soluble in organic solvent or water
  • the step of removing the compensation part includes dissolving the compensation part with an organic solvent or water.
  • the substrate is cut to form a plurality of photosensitive components.
  • an isolation channel is formed, the isolation channel includes a surrounding channel and a communication channel, the isolation channel surrounds the photosensitive element, and the communication channel is based on the surrounding channel.
  • a channel whose starting point extends in a direction away from the photosensitive element, and the surrounding channel passes through the communication channel.
  • the end of the communication channel away from the surrounding channel is sealed with a filling material.
  • a photosensitive assembly is provided.
  • the invention relates to a photosensitive component, wherein the photosensitive component is a photosensitive component prepared by the manufacturing method.
  • a photosensitive assembly is provided.
  • the present invention relates to a photosensitive component, comprising a substrate, a photosensitive element, and a molded body integrally combined with the substrate.
  • the photosensitive element is disposed on the substrate, and the molded body covers at least part of the top of the photosensitive element. surface;
  • An isolation channel is provided on the substrate along the edge of the photosensitive element, and the edge of the photosensitive element and the molded body surround the isolation channel to form the isolation channel.
  • an isolation channel is provided between the edge of the photosensitive element and the molded body on the substrate.
  • the isolation channel includes a surrounding channel and a communication channel, and at least one communication channel is provided on the surrounding channel.
  • the surrounding channel is a closed channel arranged around the photosensitive element
  • the communicating channel is a channel extending in a direction away from the photosensitive element starting from the surrounding channel, and the surrounding The channel passes through the communication channel.
  • the photosensitive element includes a photosensitive area and a non-sensitive area, the non-sensitive area is located at the edge of the photosensitive area and is arranged around the photosensitive area, and the molded body covers at least part of the photosensitive area. Non-sensitive area.
  • the surrounding channel surrounds the edge of the non-photosensitive area.
  • electronic components are provided on the substrate, and the electronic components are located outside the surrounding channel.
  • a step portion is provided on the upper surface of the non-photosensitive area, the step portion is arranged around the photosensitive area, and the step portion is arranged higher than the photosensitive element.
  • the molded body covers at least part of the stepped portion, and the covered stepped portion is away from the photosensitive area.
  • an imposition is provided.
  • the imposition of the present invention includes a plurality of photosensitive components arranged at intervals.
  • a camera module is provided.
  • the invention relates to a camera module, which comprises the photosensitive component and a light-transmitting component, and the light-transmitting component is arranged on a photosensitive path of the photosensitive component.
  • a method for manufacturing a camera module is provided.
  • the invention relates to a method for preparing a camera module, including the following steps:
  • the light-transmitting component is placed on the photosensitive component.
  • the light-transmitting element is arranged on the photosensitive path of the photosensitive component.
  • the compensation portion is located on the side surface and/or the top surface of the photosensitive element, which can prevent the photosensitive element from being impacted by external force during the molding process and deformed or broken.
  • the filling material in the surrounding channel is discharged through the communicating channel, and when the filling material in the surrounding channel is exhausted, the outlet of the communicating channel is sealed again
  • the material is sealed (that is, the communicating channel is away from one end of the surrounding channel) to prevent dust and other contaminants from entering the photosensitive component through the communicating channel.
  • the photosensitive component has the isolation channel that separates the molded body from the side surface of the photosensitive element, so that the molded body and the photosensitive element The side surfaces of the element are not in contact, so that stress transmission from the molded body to the photosensitive element can be suppressed, thereby preventing or reducing deformation or/displacement of the photosensitive element, thereby protecting the photosensitive element.
  • the step portion surrounds the photosensitive area on the upper surface of the photosensitive element, so that the molding material can be better prevented from flowing into the photosensitive area of the photosensitive element during the molding process. Area.
  • the step portion surrounds the upper surface of the photosensitive element, and the upper mold presses the step portion during the molding process to prevent the upper mold from pressing the photosensitive element and prevent damage to the photosensitive element.
  • the isolation passage includes a surrounding passage and a communication passage, the surrounding passage is used to isolate the photosensitive element and the molded body, and the communication passage allows the surrounding passage to communicate with the outside .
  • Figure 1 is one of the structural schematic diagrams of the photosensitive component according to the present invention.
  • Figure 2 is one of the structural schematic diagrams of the photosensitive component according to the present invention.
  • Fig. 3 is one of the structural schematic diagrams of the camera module according to the present invention.
  • Figure 4 is one of the schematic structural diagrams of the camera module according to the present invention.
  • Fig. 5 is one of the structural schematic diagrams of the camera module according to the present invention.
  • Fig. 6 is one of the structural schematic diagrams of the camera module according to the present invention.
  • FIG. 7 including FIGS. 7A-7G is a flowchart of a method for manufacturing a photosensitive component according to the present invention.
  • Figure 8 including Figures 8A-8I is a flow chart of a method for manufacturing a photosensitive component according to the present invention.
  • Figure 9 is a schematic view of the structure of the photosensitive component placed in a mold according to the present invention.
  • Fig. 10 is a schematic view showing the structure of the photosensitive component according to the present invention placed in a mold.
  • the present invention relates to a method for manufacturing a photosensitive component, the method includes:
  • Step 1 Set the photosensitive element 6 on the substrate 5;
  • the substrate 5 is a circuit board, and one or more photosensitive elements 6 may be provided on the substrate 5.
  • the photosensitive element 6 is attached to the substrate 5.
  • Step 2 Set up a compensation part 17 on all or part of the surface of the photosensitive element 6;
  • the compensation portion 17 may be provided on the side surface of the photosensitive element 6, or may be provided on the top surface of the photosensitive element 6.
  • the compensation portion 17 is arranged around the side surface of the photosensitive element 6.
  • the compensation portion 17 is arranged around the top surface of the photosensitive element 6 near the edge.
  • the compensation portion 17 surrounds the side surface of the photosensitive element 6, and the compensation portion 17 surrounds the top surface of the closer edge of the photosensitive element 6.
  • Step 3 Molding the photosensitive element 6 provided with the compensation portion 17 on the substrate 5 to form a molded body 9;
  • the mold includes an upper mold 10 and a lower mold 12. At least one of the upper mold 10 and the lower mold 12 can be operated, and the substrate 5 is placed on On the lower mold 12, the upper mold 10 is buckled on the upper mold 10.
  • the upper mold 10 is provided with a molding space 11, and the position of the molding space 11 is determined according to the size of the substrate 5.
  • the molding material is filled into the molding space 11 for molding.
  • the upper mold 10 The mold is drawn with the lower mold 12, and the molding process ends after the mold is drawn.
  • the type of the molding material is not limited in the present invention.
  • the molding material may be any material that can flow, such as liquid, solid particles, or a mixture of liquid and solid particles, and the molding material is After being added to the mold, it can be cured by heating, pressurizing, cooling, radiation and the like.
  • Step 4 Remove the compensation part 17 to obtain the photosensitive element 6.
  • the compensation portion 17 is physically and/or chemically used to remove the compensation portion 17 without damaging other components.
  • the molding process includes forming a molded body 9 outside the compensation portion 17.
  • the compensation portion 17 is at least partially not covered by the molded body 9.
  • the top of the compensation part 17 has a molded body 9.
  • the compensation part 17 has a molded body 9 on the side away from the photosensitive element 6.
  • the top of the compensation portion 17 and the side away from the photosensitive element 6 both have a molded body 9.
  • the compensation part 17 is a continuous whole.
  • the continuous compensation portion 17 can prevent the photosensitive element 6 from being impacted by external force and deformed or broken during the molding process.
  • the compensation part 17 includes a plurality of discrete parts (the number of discrete parts can be 1, 2, 3, and multiple, etc.), and each of the discrete parts is at least partially free from the molded body 9 cover.
  • the ends of the discrete parts are not covered by the molded body 9.
  • the top of the discrete part is not covered by the molded body 9.
  • the sides of the discrete part are not covered by the molded body 9.
  • neither the top nor the end of the discrete part is covered by the molded body 9.
  • the compensation part 17 is solid or gel-like.
  • the isolation channel includes a surrounding channel 1 and a communication channel 2 (that is, the communication channel 2 is formed after the filling material is removed from the discrete part), and the isolation channel surrounds the photosensitive Element 6, the communication channel 2 is a channel extending in a direction away from the photosensitive element 6 starting from the surrounding channel 1, and the surrounding channel 1 and the communication channel 2 pass through.
  • the compensation part 17 adopts a high-temperature melting material, and the melting temperature is 175-240° C.
  • the step of removing the compensation part 17 includes increasing the temperature to melt the compensation part 17.
  • the high-temperature melting material used in the compensation part 17 may be silica gel or the like.
  • the compensation part 17 uses a high-temperature gasification material, and the gasification temperature is 175-240° C.
  • the step of removing the compensation part 17 includes raising the temperature to vaporize the compensation part 17.
  • the compensation part 17 is made of a material soluble in an organic solvent, and the step of removing the compensation part 17 includes dissolving the compensation part 17 with an organic solvent.
  • the filling material used in the compensation part 17 is hydrophobic epoxy resin or the like.
  • the filling material used in the compensation part 17 is easily soluble or reacts with water.
  • step 4 the substrate 5 after the molding process is put into water, since the filling material is soluble The water or react with water to remove the compensation part 17, the filling material in the surrounding channel 1 is discharged through the communication channel 2, and the residual moisture in the isolation channel is removed by baking or the like.
  • the outlet of the communication channel 2 is sealed (that is, the end of the communication channel 2 away from the surrounding channel 1 is sealed) to prevent dust and other pollutants from passing through the communication channel 2 Enter the photosensitive assembly.
  • the sealing material may be glue.
  • the filling material used in the compensation part 17 is easily soluble in or reacts with organic reagents.
  • the substrate 5 after the molding process is put into the organic reagent.
  • the filling material dissolves in the organic reagent or reacts with the organic reagent to remove the compensation part 17.
  • the filling material in the surrounding channel 1 is discharged through the communication channel 2.
  • Sealing the outlet of the communicating channel 2 that is, the end of the communicating channel 2 away from the surrounding channel 1 is sealed) to prevent dust and other contaminants from entering the photosensitive assembly through the communicating channel 2,
  • the sealing material may be glue.
  • the filling material used in the compensation part 17 is easy to liquefy or vaporize.
  • the molded substrate 5 is placed in a heating device for heat treatment, because the filling material is easy to liquefy. Or vaporize, so that the compensation portion 17 can be removed by heating, the filling material after liquefaction or gasification is discharged through the communication channel 2, and when the filling material in the surrounding channel 1 is exhausted, the The outlet of the communicating channel 2 is sealed (that is, the end of the communicating channel 2 away from the surrounding channel 1 is sealed) to prevent dust and other contaminants from entering the photosensitive component through the communicating channel 2, and the sealing material Can be glue.
  • photosensitive elements 6 There are two or more photosensitive elements 6 arranged on the substrate 5, and after removing the compensation portion 17, the substrate 5 is cut to form a plurality of photosensitive components.
  • the number of the photosensitive elements 6 may be 2, 3, 4, 5, 6, 7, 8, or more.
  • the present invention relates to another method of manufacturing a photosensitive component, the method comprising:
  • Step 1 Set the photosensitive element 6 on the substrate 5;
  • the substrate 5 is a circuit board, and one or more photosensitive elements 6 may be provided on the substrate 5.
  • the photosensitive element 6 is attached to the substrate 5.
  • Step 2 Set up a compensation part 17 on all or part of the surface of the photosensitive element 6;
  • the compensation portion 17 may be provided on the side surface of the photosensitive element 6 or on the top surface of the photosensitive element 6.
  • the compensation portion 17 is arranged around the side surface of the photosensitive element 6.
  • the compensation portion 17 is arranged around the top surface of the photosensitive element 6 near the edge.
  • the compensation portion 17 surrounds the side surface of the photosensitive element 6, and the compensation portion 17 surrounds the top surface of the closer edge of the photosensitive element 6.
  • Step 3 A step 3 is provided on the photosensitive element 6;
  • the stepped portion 3 has a certain height, which is higher than the photosensitive element 6. Therefore, the stepped portion 3 can prevent the molding material from flowing into the photosensitive area and damage the photosensitive element 6 during the subsequent molding process.
  • Step 4 Molding the photosensitive element 6 provided with the stepped portion 3 on the substrate 5;
  • the mold includes an upper mold 10 and a lower mold 12. At least one of the upper mold 10 and the lower mold 12 can be operated, and the substrate 5 is placed on On the lower mold 12, the upper mold 10 is buckled on the upper mold 10.
  • the upper mold 10 is provided with a molding space 11, and the position of the molding space 11 is determined according to the size of the substrate 5.
  • the molding material is filled into the molding space 11 for molding.
  • the upper mold 10 The mold is drawn with the lower mold 12, and the molding process ends after the mold is drawn.
  • the type of the molding material is not limited in the present invention.
  • the molding material may be any material that can flow, such as liquid, solid particles, or a mixture of liquid and solid particles, and the molding material is After being added to the mold, it can be cured by heating, pressurizing, cooling, radiation and the like.
  • Step 5 Remove the compensation part 17 to obtain the photosensitive element 6.
  • the compensation portion 17 is physically and/or chemically used to remove the compensation portion 17 without damaging other components.
  • the photosensitive element 6 includes a photosensitive area and a non-sensitive area.
  • the non-sensitive area is located at the edge of the photosensitive area and is arranged around the photosensitive area.
  • the step portion 3 is located in the non-sensitive area, and the step The part 3 is arranged around the photosensitive area.
  • the stepped portion 3 surrounds the upper surface of the photosensitive element 6, the upper mold 10 is pressed against the stepped portion 3 during the molding process to prevent the upper mold 10 from pressing against the photosensitive element 6 and prevent The photosensitive element 6 is damaged.
  • the stepped portion 3 also prevents the molding material located in the non-photosensitive area from flowing into the photosensitive area, thereby protecting the photosensitive area from damage.
  • the molding process includes forming a molded body 9 outside the compensation portion 17.
  • the compensation portion 17 is at least partially not covered by the molded body 9.
  • the top of the compensation part 17 has a molded body 9.
  • the side of the compensation part 17 away from the photosensitive element 6 has a molded body 9.
  • the top of the compensation portion 17 and the side away from the photosensitive element 6 both have a molded body 9.
  • the compensation part 17 is a continuous whole.
  • the continuous compensation portion 17 can prevent the photosensitive element 6 from being impacted by external force and deformed or broken during the molding process.
  • the compensation part 17 includes a plurality of discrete parts (the number of discrete parts can be 1, 2, 3, and multiple, etc.), and each of the discrete parts is at least partially free from the molded body 9 cover.
  • the ends of the discrete parts are not covered by the molded body 9.
  • the top of the discrete part is not covered by the molded body 9.
  • the sides of the discrete part are not covered by the molded body 9.
  • neither the top nor the end of the discrete part is covered by the molded body 9.
  • the compensation part 17 is solid or gel-like.
  • the isolation channel includes a surrounding channel 1 and a communication channel 2 (that is, the communication channel 2 is formed after the filling material is removed from the discrete part), and the isolation channel surrounds the photosensitive Element 6, the communication channel 2 is a channel extending in a direction away from the photosensitive element 6 starting from the surrounding channel 1, and the surrounding channel 1 and the communication channel 2 pass through.
  • the compensation part 17 adopts a high-temperature melting material with a melting temperature of 175-240° C.
  • the step of removing the compensation part 17 includes increasing the temperature to melt the compensation part 17.
  • the high-temperature melting material used in the compensation part 17 may be silica gel or the like.
  • the compensation part 17 adopts a high-temperature gasification material, and the gasification temperature is 175-240° C.
  • the step of removing the compensation part 17 includes increasing the temperature to vaporize the compensation part 17.
  • the compensation part 17 is made of a material soluble in an organic solvent, and the step of removing the compensation part 17 includes dissolving the compensation part 17 with an organic solvent.
  • the filling material used in the compensation part 17 is hydrophobic epoxy resin or the like.
  • the filling material used in the compensation part 17 is easily soluble in water or reacts with water.
  • step 5 the molded substrate 5 is put into water, because the filling material is soluble in water.
  • the water or react with water to remove the compensation part 17, the filling material in the surrounding channel 1 is discharged through the communication channel 2, and the residual moisture in the isolation channel is removed by baking or the like.
  • the outlet of the communication channel 2 is sealed (that is, the end of the communication channel 2 away from the surrounding channel 1 is sealed) to prevent dust and other pollutants from passing through the communication channel 2 Enter the photosensitive assembly.
  • the sealing material may be glue.
  • the filling material used in the compensation part 17 is easily soluble in or reacts with organic reagents.
  • step 5 the molded substrate 5 is put into the organic reagent.
  • the filling material dissolves in the organic reagent or reacts with the organic reagent to remove the compensation part 17.
  • the filling material in the surrounding channel 1 is discharged through the communication channel 2.
  • Sealing the outlet of the communicating channel 2 that is, the end of the communicating channel 2 away from the surrounding channel 1 is sealed) to prevent dust and other contaminants from entering the photosensitive assembly through the communicating channel 2,
  • the sealing material may be glue.
  • the filling material used in the compensation part 17 is easy to liquefy or vaporize.
  • the molded substrate 5 is placed in a heating device for heat treatment, because the filling material is easy to liquefy. Or vaporize, so that the compensation portion 17 can be removed by heating, the filling material after liquefaction or gasification is discharged through the communication channel 2, and when the filling material in the surrounding channel 1 is exhausted, the The outlet of the communicating channel 2 is sealed (that is, the end of the communicating channel 2 away from the surrounding channel 1 is sealed) to prevent dust and other contaminants from entering the photosensitive component through the communicating channel 2, and the sealing material Can be glue.
  • photosensitive elements 6 There are two or more photosensitive elements 6 arranged on the substrate 5, and after removing the compensation portion 17, the substrate 5 is cut to form a plurality of photosensitive components.
  • the number of the photosensitive elements 6 may be 2, 3, 4, 5, 6, 7, 8, or more.
  • the present invention relates to a photosensitive component, wherein the photosensitive component is a photosensitive component prepared by the manufacturing method.
  • the present invention relates to a photosensitive component, including a substrate 5, a photosensitive element 6 and a molded body 9 integrally combined with the substrate 5, the photosensitive element 6 is disposed on the substrate 5, so The molded body 9 covers at least part of the top surface of the photosensitive element 6;
  • the stress acts on the photosensitive element 6, which will cause the photosensitive element 6 to produce a certain degree of deformation or displacement;
  • the molded body 9 can be separated from the photosensitive element 6 through the isolation channel, so that the molded body 9 does not contact the isolation channel, thereby preventing stress from the molded body 9 to
  • the transmission of the photosensitive element 6 prevents or reduces the deformation or/displacement of the photosensitive element 6, thereby protecting the photosensitive element 6.
  • the isolation channel includes a surrounding channel 1 and a communication channel 2. At least one communication channel 2 is provided on the surrounding channel 1. The number and position of the communication channel 2 can be determined according to actual applications.
  • the communication channel 2 The number can be 1, 2, 3, and more.
  • the surrounding channel 1 is a closed channel arranged around the photosensitive element 6, and the communicating channel 2 is a channel extending away from the photosensitive element 6 starting from the surrounding channel 1, and the surrounding channel 1 It passes through the communication channel 2.
  • the surrounding channel 1 is a closed annular structure.
  • the cross-sectional shape of the surrounding channel 1 is not limited, and can be rectangular, arc, polygonal, etc., and a plurality of the communicating channels 2 start from the surrounding channel 1, respectively It diverges to the edge of the substrate 5.
  • the shape of the communication channel 2 can be a straight channel or an arc channel.
  • the photosensitive element 6 includes a photosensitive area and a non-sensitive area.
  • the non-sensitive area is located at the edge of the photosensitive area and is arranged around the photosensitive area.
  • the molded body 9 covers at least a part of the non-sensitive area.
  • the molded body 9 covers the edge of the non-photosensitive area.
  • the molded body 9 covers the non-photosensitive area.
  • the surrounding channel 1 surrounds the edge of the non-photosensitive area, and the surrounding channel 1 does not contain the molded body 9, so the molded body 9 and the non-photosensitive area can be separated by the surrounding channel 1 The side surface.
  • An electronic component 4 is provided on the substrate 5, and the electronic component 4 is located outside the surrounding channel 1.
  • the electronic component 4 is located on at least one side of the photosensitive element 6, and the side where the communication channel 2 is located does not contain the electronic component 4.
  • the electronic component 4 is covered by a molded body 9.
  • the substrate 5 is provided with one communication channel 2 on one side of the photosensitive element 6, and on the substrate 5, the other three sides of the photosensitive element 6 are provided with The electronic components 4.
  • the substrate 5 is provided with one communication channel 2 on one side of the photosensitive element 6, and on the substrate 5, any one of the other three sides of the photosensitive element 6
  • the electronic components 4 are arranged on the side.
  • the substrate 5 is provided with one communication channel 2 on one side of the photosensitive element 6, and on the substrate 5, any two of the other three sides of the photosensitive element 6
  • the electronic components 4 are arranged on the side.
  • the substrate 5 is provided with two communication channels 2 on one side of the photosensitive element 6, and on the substrate 5, the other three sides of the photosensitive element 6 are provided There are the electronic components4.
  • the substrate 5 is provided with two communicating channels 2 on one side of the photosensitive element 6, and on the substrate 5, any of the other three sides of the photosensitive element 6
  • the electronic components 4 are arranged on both sides.
  • the substrate 5 is provided with two communication channels 2 on one side of the photosensitive element 6, and any one of the other three sides of the photosensitive element 6 on the substrate 5
  • the electronic components 4 are arranged on the side.
  • two communication channels 2 are provided on the substrate 5, and the two communication channels 2 are respectively on any two sides of the photosensitive element 6, and the substrate 5 is
  • the electronic component 4 is provided on any one of the other two sides of the photosensitive element 6.
  • two communication channels 2 are provided on the substrate 5, and the two communication channels 2 are respectively on any two sides of the photosensitive element 6, and the substrate 5 is The electronic components 4 are arranged on the other two sides of the photosensitive element 6.
  • a step portion 3 is provided on the upper surface of the non-photosensitive area, the step portion 3 is arranged around the photosensitive area, and the step portion 3 is set higher than the photosensitive element 6, and the step portion 3 is a closed ring Structure, during the molding process, the stepped portion 3 can better prevent the molding material from flowing into the photosensitive area of the photosensitive element 6.
  • the molded body 9 covers at least a part of the stepped portion 3, and the covered stepped portion 3 is away from the photosensitive area.
  • the invention relates to an imposition comprising a plurality of said photosensitive components arranged at intervals.
  • the photosensitive components manufactured by imposition have higher consistency and cost saving.
  • the imposition is cut into a plurality of the photosensitive components by cutting.
  • the mold when the photosensitive component is manufactured by imposition, a plurality of the photosensitive components are arranged on the mosaic plate, and when the photosensitive component is molded, the mold includes the upper The mold 10 and the lower mold 12, wherein any one of the upper mold 10 and the lower mold 12 can be operated so that the mold is subjected to mold clamping and mold drawing operations.
  • At least one molding space 11 can be formed between the upper mold 10 and the lower mold 12 of the mold, wherein the imposition is placed in When between the upper mold 10 and the lower mold 12 of the mold, the compensation portion 17 is located in the molding space 11.
  • At least one connection may be formed between the upper mold 10 and the lower mold 12
  • the channel 16 is used to communicate with the adjacent molding spaces 11.
  • the upper mold 10 includes a molding guide portion 14 and at least one window molding portion 13, wherein each of the window molding portions 13 integrally extends to the molding guide portion 14 so as to be located at each A forming guide groove 15 is formed between the window forming part 13 and the forming guide part 14, or the forming guide groove 15 is formed between adjacent window forming parts 13.
  • each of the molding spaces 11 and the upper mold 10 and the lower mold are formed at the positions corresponding to each of the molding guide grooves 15 respectively.
  • Each of the connecting channels 16 is formed between the molds 12 to communicate with the adjacent molding spaces 11.
  • the present invention relates to a camera module, the light-sensitive component and the light-transmitting component, the light-transmitting element is arranged on the photosensitive path of the photosensitive component, and external light passes through the The light-transmitting component reaches the photosensitive element 6.
  • the light-transmitting component includes a lens component and a filter component.
  • the lens component includes a lens 7 and a filter component includes a filter element 8 which is sequentially located on the photosensitive path of the photosensitive element 6, that is, the filter element 8 is located at the The photosensitive element 6 is directly above, and the lens 7 is located directly above the filter element 8.
  • the external light sequentially passes through the lens 7 and the filter element 8 to reach the photosensitive element 6 for imaging.
  • the filter assembly includes a lens holder and a filter element mounted on the lens holder.
  • the lens assembly includes a lens carrier and a lens mounted on the lens carrier.
  • the lens assembly includes a motor and a lens, the lens is installed in the motor, and the motor drives the lens to move or tilt to realize the function of auto focus or optical image stabilization.
  • the lens holder is installed on the molded body 9, the filter element is installed at the center of the lens holder, and the filter element is arranged opposite to the photosensitive element, and the lens carrier is installed on the lens carrier.
  • the lens is located in the lens carrier, and the lens is located directly above the filter element.
  • the molded body 9 is located at the edge of the photosensitive element, and the surrounding channel 1 is arranged around the photosensitive element 6.
  • the photosensitive element 6 is provided with a step portion 3 surrounding the photosensitive area, and the molded body 9 is located on the side of the step portion 3 away from the photosensitive area.
  • the surrounding channel 1 is arranged around the photosensitive element 6.
  • the molded body 9 is located at the edge of the photosensitive element 6, and the surrounding channel 1 covers the side surface and part of the upper surface of the photosensitive element 6.
  • the invention also relates to a method for preparing a camera module, including the following steps:
  • the light-transmitting component is placed on the photosensitive component.
  • the light-transmitting element is arranged on the photosensitive path of the photosensitive component.
  • the outlet of the communication channel 2 (that is, the end of the connection channel away from the surrounding channel 1) can be sealed with a sealing material in the last step, that is, when the photosensitive component After the light-transmitting component is installed, the outlet of the connecting channel is sealed with the sealing material, and the sealing material may be glue.

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Abstract

本发明公开了一种感光组件的制备方法，所述方法包括：将感光元件设置于基板上；在所述感光元件的全部或部分表面设置补偿部；在所述基板上对设置有所述补偿部的感光元件进行模塑处理；除去所述补偿部。本发明还涉及一种感光组件、一种拼版以及一种摄像模组。本发明所述的感光组件，所述感光组件具有隔离通道，所述隔离通道将模塑体与所述感光元件的侧表面隔离开，使得所述模塑体与所述隔离通道不接触，从而可预防应力从所述模塑体向所述感光元件传递，进而预防或降低所述感光元件发生形变或位移，从而保护所述感光元件。

Description

一种感光组件的制备方法、感光组件、以及摄像模组 技术领域
本发明涉及电子技术领域，具体涉及一种感光组件的制备方法、感光组件以及摄像模组。
背景技术
现有手机应用的摄像模组，存在多种结构及对应组装方法，传统的模组采取将一感光元件通过贴附于一线路板，再将一镜座固定于所述线路板，然后固定一光学镜头和一滤色元件在所述感光元件的感光路径上。
为了减少模组尺寸，提高效率，目前采用了MOB/MOC方式去组装，所述模组包括一感光组件和一透光组件，所述透光组件被设置于所述感光组件的所述感光元件的感光路径上，所述感光组件包括一线路板以及一体模塑形成于所述线路板的一模塑体，例如在MOC封装工艺中，所述感光元件被预先贴附于所述线路板，再将通过模塑工艺在所述线路板上形成所述模塑体，所述模塑体包裹至少部分所述感光元件的非感光区域。
但是，由于在所述摄像模组中所述线路板、所述模塑体的热膨胀系数不同，当所述摄像模组被设置于不同环境时，由于各个部件膨胀程度不一样，产生应力，该应力作用于所述感光元件上，会导致所述感光元件产生一定程度的形变或者位移，从而导致成像效果变差。
因此设计一种能够适用于不同环境，而且再使用过程中模塑体不会对感光元件产生应力，同时成像效果好的感光组件以及摄像模组是该领域亟待解决的问题之一。
发明内容
有鉴于此，本发明提供一种感光组件的制备方法、感光组件以及摄像模组，该感光组件可以适用于不同环境，而且再使用过程中所述模塑体不会对感光元件产生应力，感光元件寿命较长。
为实现上述目的，根据本发明的一个方面，提供了一种感光组件的制备 方法。
本发明涉及一种感光组件的制备方法，所述方法包括：
将感光元件设置于基板上；
在所述感光元件的全部或部分表面设置补偿部；
在所述基板上对设置有所述补偿部的感光元件进行模塑处理；
除去所述补偿部。
在一个具体实施方式中，所述模塑处理包括在所述补偿部外侧形成模塑体。
在一个具体实施方式中，所述补偿部至少部分被所述模塑体覆盖。
在一个具体实施方式中，所述补偿部至少部分与外界连通。
在一个具体实施方式中，所述补偿部为连续的整体。
在一个具体实施方式中，所述补偿部包括多个离散部，所述每个离散部均至少部分被所述模塑体覆盖。
在一个具体实施方式中，所述补偿部包括多个离散部，所述每个离散部均至少部分与外界连通。
在一个具体实施方式中，所述补偿部为固体或凝胶状。
在一个具体实施方式中，所述补偿部采用高温熔融材料，熔融温度为175～240℃，除去补偿部的步骤包括升高温度使所述补偿部熔融。
在一个具体实施方式中，所述补偿部采用高温气化材料，气化温度为175～240℃，除去补偿部的步骤包括升高温度使所述补偿部气化。
在一个具体实施方式中，所述补偿部采用溶于有机溶剂或水的材料，除去补偿部的步骤包括采用有机溶剂或水使所述补偿部溶解。
在一个具体实施方式中，设置于所述基板上的感光元件有两个或更多个，在除去所述补偿部之后，切割所述基板形成多个感光组件。
在一个具体实施方式中，所述补偿部除去后，形成隔离通道，所述隔离通道包括环绕通道和连通通道，所述隔离通道环绕所述感光元件，所述连通通道是以所述环绕通道为起点向远离所述感光元件的方向延伸的通道，且所述环绕通道与所述连通通道贯通。
在一个具体实施方式中，当所述补偿部除去之后，将所述连通通道远离所述环绕通道的一端使用填充材料封上。
为实现上述目的，根据本发明的一个方面，提供了一种感光组件的制备 方法。
本发明涉及一种感光组件的制备方法，所述方法包括：
将感光元件设置于基板上；
在所述感光元件的全部或部分表面设置补偿部；
在所述感光元件的上设置有台阶部；
在所述基板上对设置有所述台阶部的感光元件进行模塑处理；
除去所述补偿部。
在一个具体实施方式中，所述感光元件包括感光区和非感光区，所述非感光区位于所述感光区的边缘，且环绕所述感光区设置，所述台阶部位于所述非感光区，且所述台阶部环绕所述感光区设置。
在一个具体实施方式中，所述模塑处理包括在所述补偿部外侧形成模塑体。
在一个具体实施方式中，所述补偿部至少部分被所述模塑体覆盖。
在一个具体实施方式中，所述补偿部至少部分与外界连通。
在一个具体实施方式中，所述补偿部为连续的整体。
在一个具体实施方式中，所述补偿部包括多个离散部，所述每个离散部均至少部分被所述模塑体覆盖。
在一个具体实施方式中，所述补偿部包括多个离散部，所述每个离散部均至少部分与外界连通。
在一个具体实施方式中，所述补偿部为固体或凝胶状。
在一个具体实施方式中，所述补偿部采用高温熔融材料，熔融温度为175～240℃，除去补偿部的步骤包括升高温度使所述补偿部熔融。
在一个具体实施方式中，所述补偿部采用高温气化材料，气化温度为175～240℃，除去补偿部的步骤包括升高温度使所述补偿部气化。
在一个具体实施方式中，所述补偿部采用溶于有机溶剂或水的材料，除去补偿部的步骤包括采用有机溶剂或水使所述补偿部溶解。
在一个具体实施方式中，设置于所述基板上的感光元件有两个或更多个，在除去所述补偿部之后，切割所述基板形成多个感光组件。
在一个具体实施方式中，所述补偿部除去后，形成隔离通道，所述隔离通道包括环绕通道和连通通道，所述隔离通道环绕所述感光元件，所述连通通道是以所述环绕通道为起点向远离所述感光元件的方向延伸的通道，且所 述环绕通道与所述连通通道贯通。
在一个具体实施方式中，当所述补偿部除去之后，将所述连通通道远离所述环绕通道的一端使用填充材料封上。
为实现上述目的，根据本发明的一个方面，提供了一种感光组件。
本发明涉及的一种感光组件，其中，所述感光组件为所述的制备方法所制备的感光组件。
为实现上述目的，根据本发明的一个方面，提供了一种感光组件。
本发明涉及一种感光组件，包括基板、感光元件以及一体结合于所述基板的模塑体，所述感光元件设置于所述基板上，所述模塑体至少覆盖部分所述感光元件的顶表面；
在所述基板上沿所述感光元件的边缘具有隔离通道，所述感光元件的边缘与所述模塑体包围形成所述隔离通道。
在一个具体实施方式中，在所述基板上沿所述感光元件的边缘与所述模塑体之间具有隔离通道。
在一个具体实施方式中，所述隔离通道包括环绕通道和连通通道，所述环绕通道上设置有至少一个所述连通通道。
在一个具体实施方式中，所述环绕通道为环绕所述感光元件设置的闭合通道，所述连通通道是以所述环绕通道为起点向远离所述感光元件的方向延伸的通道，且所述环绕通道与所述连通通道贯通。
在一个具体实施方式中，所述感光元件包括感光区和非感光区，所述非感光区位于所述感光区的边缘，且环绕所述感光区设置，所述模塑体至少覆盖部分所述非感光区。
在一个具体实施方式中，所述环绕通道环绕所述非感光区的边缘。
在一个具体实施方式中，在所述基板上设置有电子元器件，且所述电子元器件位于所述环绕通道的外侧。
在一个具体实施方式中，在所述非感光区上表面设置有台阶部，所述台阶部环绕所述感光区设置，且所述台阶部高于所述感光元件设置。
在一个具体实施方式中，所述模塑体至少覆盖部分所述台阶部，且被覆盖的所述台阶部远离所述感光区。
为实现上述目的，根据本发明的一个方面，提供了一种拼版。
本发明涉及的一种拼版，包括多个间隔设置的感光组件。
为实现上述目的，根据本发明的一个方面，提供了一种摄像模组。
本发明涉及一种摄像模组，包括所述感光组件和透光组件，所述透光元件设置于所述感光组件的感光路径上。
为实现上述目的，根据本发明的一个方面，提供了一种摄像模组的制备方法。
本发明涉及一种摄像模组的制备方法，包括以下步骤：
提供所述的感光组件和透光组件；
将所述透光组件安置与所述感光组件上。
在一个具体实施方式中，所述透光元件设置于所述感光组件的感光路径上。
根据本发明所述的感光组件的制备方法，所述补偿部位于所述感光元件侧表面和/或顶表面，可预防模塑过程中所述感光元件受到外力冲击，发生形变或碎裂。
根据本发明所述的感光组件的制备方法，所述环绕通道内的填充材料通过所述连通通道排出，当所述环绕通道内的填充材料排尽时，将所述连通通道的出口重新用封口材料封上(即将所述连通通道远离所述环绕通道的一端)，以避免灰尘等污染物通过所述连通通道进入所述感光组件中。
根据本发明所述的感光组件，所述感光组件具有所述隔离通道，所述隔离通道将所述模塑体与所述感光元件的侧表面隔离开，使得所述模塑体与所述感光元件侧面不接触，从而可抑制应力从所述模塑体向所述感光元件传递，进而预防或降低所述感光元件发生形变或/位移，从而保护所述感光元件。
根据本发明所述的感光组件，所述台阶部环绕所述感光元件的上表面的所述感光区，从而在模塑过程中可以更好的预防所述模塑材料流入所述感光元件的感光区内。
根据本发明所述的感光组件，所述台阶部环绕所述感光元件的上表面，在模塑的过程中上模具压合台阶部从而避免上模具压合感光元件，防止感光元件损坏。
根据本发明所述的感光组件，所述隔离通道包括环绕通道和连通通道，所述环绕通道用以隔离所述感光元件和所述模塑体，所述连通通道使得所述环绕通道与外界连通。
附图说明
附图用于更好地理解本发明，不构成对本发明的不当限定。其中：
图1是根据本发明的感光组件的结构示意图之一；
图2是根据本发明的感光组件的结构示意图之一；
图3是根据本发明的摄像模组的结构示意图之一；
图4是根据本发明的摄像模组的结构示意图之一；
图5是根据本发明的摄像模组的结构示意图之一；
图6是根据本发明的摄像模组的结构示意图之一；
图7包括图7A-图7G是根据本发明的感光组件制备方法流程图；
图8包括图8A-图8I是根据本发明的感光组件制备方法流程图；
图9是根据本发明的感光组件放置于模具中的结构示意图；
图10是根据本发明的感光组件放置于模具中的结构示意图。
附图标记列表
1-环绕通道，2-连通通道，3-台阶部，4-电子元器件，5-基板，6-感光元件，7-镜头，8-滤光元件，9-模塑体，10-上模具，11-成型空间，12-下模具，13-开窗成型部，14-成型引导部，15-成型引导槽，16-连接通道，17-补偿部。
发明的具体实施方式
以下结合附图对本发明的示范性实施例做出说明，其中包括本发明实施例的各种细节以助于理解，应当将它们认为仅仅是示范性的。因此，本领域普通技术人员应当认识到，可以对这里描述的实施例做出各种改变和修改，而不会背离本发明的范围和精神。同样，为了清楚和简明，以下的描述中省略了对公知功能和结构的描述。
参考图7A-图7G，本发明涉及一种感光组件的制备方法，所述方法包括：
步骤一：将感光元件6设置于基板5上；
所述基板5为电路板，所述基板5上可以设置一个或多个感光元件6。所述感光元件6贴附于所述基板5上。
步骤二：在所述感光元件6的全部或部分表面设置补偿部17；
所述补偿部17可设置于所述感光元件6的侧表面，也可以设置于所述 感光元件6的顶表面。
在一个具体实施方式中，所述补偿部17环绕所述感光元件6的侧表面设置。
在一个具体实施方式中，所述补偿部17环绕所述感光元件6较近边缘的顶表面设置。
在一个具体实施方式中，所述补偿部17环绕所述感光元件6的侧表面，同时所述补偿部17环绕所述感光元件6较近边缘的顶表面。
步骤三：在所述基板5上对设置有所述补偿部17的感光元件6进行模塑处理，形成模塑体9；
在所述模塑处理中，需要用到模具，所述模具包括上模具10和下模具12，所述上模具10和所述下模具12至少一个模具可被操作，将所述基板5放置于所述下模具12上，将所述上模具10扣合在所述上模具10上，所述上模具10上设置有成型空间11，所述成型空间11的位置根据所述基板5的尺寸来设置，当所述上模具10和所述下模具12扣合后，将所述模塑材料填充到所述成型空间11内进行模塑，当所述模塑材料固化后，所述上模具10和所述下模具12进行拔模，拔模后所述模塑处理结束。
所述模塑材料的类型在本发明中不受限制，例如所述模塑材料可以是液体、固体颗粒、或者液体和固体颗粒的混合物等任何能够流动的材料，并且所述模塑材料在被加入到所述模具中后，能够通过加热、加压、降温、辐射等方式固化。
步骤四：除去所述补偿部17，得到所述感光元件6。
模塑处理后，将所述补偿部17采用物理和/或化学的方法，在不损坏其他部件的条件下将所述补偿部17去掉。
所述模塑处理包括在所述补偿部17外侧形成模塑体9。
所述补偿部17至少部分未被所述模塑体9覆盖。
在一个具体实施方式中，模塑处理后，所述补偿部17的顶部具有模塑体9。
在一个具体实施方式中，模塑处理后，所述补偿部17远离所述感光元件6的侧边具有模塑体9。
在一个具体实施方式中，模塑处理后，所述补偿部17顶部和远离所述感光元件6的侧边均具有模塑体9。
所述补偿部17为连续的整体。连续设置的补偿部17可预防模塑过程中所述感光元件6受到外力冲击，发生形变或碎裂。
所述补偿部17包括多个离散部(所述离散部的数量可以为1个、2个、3个以及多个等)，所述每个离散部均至少部分未被所述模塑体9覆盖。
在一个具体实施方式中，所述离散部的末端未被模塑体9覆盖。
在一个具体实施方式中，所述离散部的顶部未被模塑体9覆盖。
在一个具体实施方式中，所述离散部的侧边未被模塑体9覆盖。
在一个具体实施方式中，所述离散部的顶部和末端均未被模塑体9覆盖。
所述补偿部17为固体或凝胶状。
所述补偿部17除去后，形成隔离通道，所述隔离通道包括环绕通道1和连通通道2(即所述离散部除去填充材料后形成所述连通通道2)，所述隔离通道环绕所述感光元件6，所述连通通道2是以所述环绕通道1为起点向远离所述感光元件6的方向延伸的通道，且所述环绕通道1与所述连通通道2贯通。
在一个具体实施方式中，所述补偿部17采用高温熔融材料，熔融温度为175～240℃，除去补偿部17的步骤包括升高温度使所述补偿部17熔融。所述补偿部17所采用的所述高温熔融材料可以为硅胶等。
在一个具体实施方式中，所述补偿部17采用高温气化材料，气化温度为175～240℃，除去补偿部17的步骤包括升高温度使所述补偿部17气化。在一个具体实施方式中，所述补偿部17采用溶于有机溶剂的材料，除去补偿部17的步骤包括采用有机溶剂使所述补偿部17溶解。所述补偿部17所采用的填充材料为疏水性的环氧树脂等。
在一个具体实施方式中，所述补偿部17所采用的填充材料易溶于水或与水反应，在步骤四中，模塑处理后的的基板5放入水中，由于所述填充材料溶于水或与水反应，从而除去所述补偿部17，所述环绕通道1内的填充材料通过所述连通通道2排出，通过烘烤等方式将隔离通道内残留的水分除去，当所述环绕通道1内的填充材料排尽时，将所述连通通道2的出口封上(即所述连通通道2远离所述环绕通道1的一端被封上)，以避免灰尘等污染物通过所述连通通道2进入所述感光组件中。所述封口材料可以为胶水。
在一个具体实施方式中，所述补偿部17所采用的填充材料易溶于有机试剂或与有机试剂反应，在步骤四中，模塑处理后的的基板5放入有机试剂 中，由于所述填充材料溶于有机试剂或与有机试剂反应，从而除去所述补偿部17，所述环绕通道1内的填充材料通过所述连通通道2排出，当所述环绕通道1内的填充材料排尽后，将所述连通通道2的出口封上(即所述连通通道2远离所述环绕通道1的一端被封上)，以避免灰尘等污染物通过所述连通通道2进入所述感光组件中，所述封口材料可以为胶水。
在一个具体实施方式中，所述补偿部17所采用的填充材料易于液化或者汽化，在步骤四中，将模塑处理后的基板5放置于加热装置中加热处理，由于所述填充材料易于液化或者汽化，从而通过加热可以除去所述补偿部17，经过液化或气化后的所述填充材料通过所述连通通道2排出，当所述环绕通道1内的填充材料排尽后，将所述连通通道2的出口封上(即所述连通通道2远离所述环绕通道1的一端被封上)，以避免灰尘等污染物通过所述连通通道2进入所述感光组件中，所述封口材料可以为胶水。
设置于所述基板5上的感光元件6有两个或更多个，在除去所述补偿部17之后，切割所述基板5形成多个感光组件。
所述感光元件6的数量可以为2个、3个、4个、5个、6个、7个、8个以及多个等。
参考图8A-图8I，本发明涉及另一种感光组件的制备方法，所述方法包括：
步骤一：将感光元件6设置于基板5上；
所述基板5为电路板，所述基板5上可以设置一个或多个感光元件6。所述感光元件6贴附于所述基板5上。
步骤二：在所述感光元件6的全部或部分表面设置补偿部17；
所述补偿部17可设置于所述感光元件6的侧表面，也可以设置于所述感光元件6的顶表面。
在一个具体实施方式中，所述补偿部17环绕所述感光元件6的侧表面设置。
在一个具体实施方式中，所述补偿部17环绕所述感光元件6较近边缘的顶表面设置。
在一个具体实施方式中，所述补偿部17环绕所述感光元件6的侧表面，同时所述补偿部17环绕所述感光元件6较近边缘的顶表面。
步骤三：在所述感光元件6的上设置有台阶部3；
所述台阶部3具有一定的高度，高出所述感光元件6，因此所述台阶部3可以防止在后续模塑过程中，模塑材料流入感光区，损坏所述感光元件6。
步骤四：在所述基板5上对设置有所述台阶部3的感光元件6进行模塑处理；
在所述模塑处理中，需要用到模具，所述模具包括上模具10和下模具12，所述上模具10和所述下模具12至少一个模具可被操作，将所述基板5放置于所述下模具12上，将所述上模具10扣合在所述上模具10上，所述上模具10上设置有成型空间11，所述成型空间11的位置根据所述基板5的尺寸来设置，当所述上模具10和所述下模具12扣合后，将所述模塑材料填充到所述成型空间11内进行模塑，当所述模塑材料固化后，所述上模具10和所述下模具12进行拔模，拔模后所述模塑处理结束。
所述模塑材料的类型在本发明中不受限制，例如所述模塑材料可以是液体、固体颗粒、或者液体和固体颗粒的混合物等任何能够流动的材料，并且所述模塑材料在被加入到所述模具中后，能够通过加热、加压、降温、辐射等方式固化。
步骤五：除去所述补偿部17，得到所述感光元件6。
模塑处理后，将所述补偿部17采用物理和/或化学的方法，在不损坏其他部件的条件下将所述补偿部17去掉。
所述感光元件6包括感光区和非感光区，所述非感光区位于所述感光区的边缘，且环绕所述感光区设置，所述台阶部3位于所述非感光区，且所述台阶部3环绕所述感光区设置。
由于所述台阶部3环绕所述感光元件6的上表面，在模塑的过程中所述上模具10压合所述台阶部3从而避免所述上模具10压合所述感光元件6，防止所述感光元件6损坏。同时在模塑过程中，所述台阶部3也阻止了位于所述非感光区内的模塑材料流入所述感光区内，进而保护所述感光区不被损坏。
所述模塑处理包括在所述补偿部17外侧形成模塑体9。
所述补偿部17至少部分未被所述模塑体9覆盖。
在一个具体实施方式中，模塑处理后，所述补偿部17的顶部具有模塑体9。
在一个具体实施方式中，模塑处理后，所述补偿部17远离所述感光元 件6的侧边具有模塑体9。
在一个具体实施方式中，模塑处理后，所述补偿部17顶部和远离所述感光元件6的侧边均具有模塑体9。
所述补偿部17为连续的整体。连续设置的补偿部17可预防模塑过程中所述感光元件6受到外力冲击，发生形变或碎裂。
所述补偿部17包括多个离散部(所述离散部的数量可以为1个、2个、3个以及多个等)，所述每个离散部均至少部分未被所述模塑体9覆盖。
在一个具体实施方式中，所述离散部的末端未被模塑体9覆盖。
在一个具体实施方式中，所述离散部的顶部未被模塑体9覆盖。
在一个具体实施方式中，所述离散部的侧边未被模塑体9覆盖。
在一个具体实施方式中，所述离散部的顶部和末端均未被模塑体9覆盖。
所述补偿部17为固体或凝胶状。
所述补偿部17除去后，形成隔离通道，所述隔离通道包括环绕通道1和连通通道2(即所述离散部除去填充材料后形成所述连通通道2)，所述隔离通道环绕所述感光元件6，所述连通通道2是以所述环绕通道1为起点向远离所述感光元件6的方向延伸的通道，且所述环绕通道1与所述连通通道2贯通。
在一个具体实施方式中，所述补偿部17采用高温熔融材料，熔融温度为175-240℃，除去补偿部17的步骤包括升高温度使所述补偿部17熔融。所述补偿部17所采用的所述高温熔融材料可以为硅胶等。
在一个具体实施方式中，所述补偿部17采用高温气化材料，气化温度为175-240℃，除去补偿部17的步骤包括升高温度使所述补偿部17气化。
在一个具体实施方式中，所述补偿部17采用溶于有机溶剂的材料，除去补偿部17的步骤包括采用有机溶剂使所述补偿部17溶解。所述补偿部17所采用的填充材料为疏水性的环氧树脂等。
在一个具体实施方式中，所述补偿部17所采用的填充材料易溶于水或与水反应，在步骤五中，模塑处理后的的基板5放入水中，由于所述填充材料溶于水或与水反应，从而除去所述补偿部17，所述环绕通道1内的填充材料通过所述连通通道2排出，通过烘烤等方式将隔离通道内残留的水分除去，当所述环绕通道1内的填充材料排尽时，将所述连通通道2的出口封上(即所述连通通道2远离所述环绕通道1的一端被封上)，以避免灰尘等污染物 通过所述连通通道2进入所述感光组件中。所述封口材料可以为胶水。
在一个具体实施方式中，所述补偿部17所采用的填充材料易溶于有机试剂或与有机试剂反应，在步骤五中，模塑处理后的的基板5放入有机试剂中，由于所述填充材料溶于有机试剂或与有机试剂反应，从而除去所述补偿部17，所述环绕通道1内的填充材料通过所述连通通道2排出，当所述环绕通道1内的填充材料排尽后，将所述连通通道2的出口封上(即所述连通通道2远离所述环绕通道1的一端被封上)，以避免灰尘等污染物通过所述连通通道2进入所述感光组件中，所述封口材料可以为胶水。
在一个具体实施方式中，所述补偿部17所采用的填充材料易于液化或者汽化，在步骤五中，将模塑处理后的基板5放置于加热装置中加热处理，由于所述填充材料易于液化或者汽化，从而通过加热可以除去所述补偿部17，经过液化或气化后的所述填充材料通过所述连通通道2排出，当所述环绕通道1内的填充材料排尽后，将所述连通通道2的出口封上(即所述连通通道2远离所述环绕通道1的一端被封上)，以避免灰尘等污染物通过所述连通通道2进入所述感光组件中，所述封口材料可以为胶水。
设置于所述基板5上的感光元件6有两个或更多个，在除去所述补偿部17之后，切割所述基板5形成多个感光组件。
所述感光元件6的数量可以为2个、3个、4个、5个、6个、7个、8个以及多个等。
参考图1以及图2，本发明涉及的一种感光组件，其中，所述感光组件为所述的制备方法所制备的感光组件。
参考图1以及图2，本发明涉及一种感光组件，包括基板5、感光元件6以及一体结合于所述基板5的模塑体9，所述感光元件6设置于所述基板5上，所述模塑体9至少覆盖部分所述感光元件6的顶表面；
在所述基板5上沿所述感光元件6的边缘具有隔离通道，所述感光元件6的边缘与所述模塑体9包围形成所述隔离通道，即在所述基板5上沿所述感光元件6的边缘与所述模塑体9之间具有隔离通道。当所述感光组件被设置于不同环境时，由于各个部件膨胀程度不一样，从而产生应力，该应力作用于所述感光元件6上，会导致所述感光元件6产生一定程度的形变或者位移；通过所述隔离通道可以将所述模塑体9与所述感光元件6的隔离开，使得所述模塑体9与所述隔离通道不接触，从而可预防应力从所述模塑体9向 所述感光元件6传递，进而预防或降低所述感光元件6发生形变或/位移，从而保护所述感光元件6。
所述隔离通道包括环绕通道1和连通通道2，所述环绕通道1上设置有至少一个所述连通通道2，所述连通通道2的数量以及位置可根据实际应用来确定，所述连通通道2的数量可以为1个、2个、3个以及多个等。
所述环绕通道1为环绕所述感光元件6设置的闭合通道，所述连通通道2是以所述环绕通道1为起点向远离所述感光元件6的方向延伸的通道，且所述环绕通道1与所述连通通道2贯通。所述环绕通道1为闭合的环形结构，所述环绕通道1的横截面形状不限，可以是矩形、弧形、多边形等等，且多个所述连通通道2以环绕通道1为起点，分别向所述基板5的边缘发散。所述连通通道2的形状可以是直线通道、也可以是弧形通道。
所述感光元件6包括感光区和非感光区，所述非感光区位于所述感光区的边缘，且环绕所述感光区设置，所述模塑体9至少覆盖部分所述非感光区。
在一个具体实施方式中，所述模塑体9覆盖所述非感光区的边缘。
在一个具体实施方式中，所述模塑体9覆盖所述非感光区。
所述环绕通道1环绕所述非感光区的边缘，所述环绕通道1内不含有所述模塑体9，因此通过所述环绕通道1可以隔离所述模塑体9与所述非感光区的侧表面。
在所述基板5上设置有电子元器件4，且所述电子元器件4位于所述环绕通道1的外侧。在所述基板5上，所述电子元器件4位于所述感光元件6的至少一侧，且所述连通通道2所在的一侧不含有所述电子元器件4。所述电子元器件4被模塑体9包覆。
在一个具体实施实施方式中，所述基板5上位于所述感光元件6的一侧设置有一个所述连通通道2，在所述基板5上，所述感光元件6的其它三侧均设置有所述电子元器件4。
在一个具体实施方式中，所述基板5上位于所述感光元件6的一侧设置有一个所述连通通道2，在所述基板5上，所述感光元件6的其他三侧中的任意一侧设置有所述电子元器件4。
在一个具体实施方式中，所述基板5上位于所述感光元件6的一侧设置有一个所述连通通道2，在所述基板5上，所述感光元件6的其他三侧中的任意两侧设置有所述电子元器件4。
在一个具体实施方式中，所述基板5上位于所述感光元件6的一侧设置有两个所述连通通道2，在所述基板5上，所述感光元件6的其他三侧中均设置有所述电子元器件4。
在一个具体实施方式中，所述基板5上位于所述感光元件6的一侧设置有两个所述连通通道2，在所述基板5上，所述感光元件6的其他三侧中的任意两侧设置有所述电子元器件4。
在一个具体实施方式中，所述基板5上位于所述感光元件6的一侧设置有两个所述连通通道2，在所述基板5上所述感光元件6的其他三侧中的任意一侧设置有所述电子元器件4。
在一个具体实施方式中，所述基板5上设置有两个所述连通通道2，且两个所述连通通道2分别在所述感光元件6的任意两侧上，在所述基板5上所述感光元件6的其它两侧中的任意一侧设置有所述电子元器件4。
在一个具体实施方式中，所述基板5上设置有两个所述连通通道2，且两个所述连通通道2分别在所述感光元件6的任意两侧上，在所述基板5上所述感光元件6的其它两侧中均设置有所述电子元器件4。
在所述非感光区上表面设置有台阶部3，所述台阶部3环绕所述感光区设置，且所述台阶部3高于所述感光元件6设置，所述台阶部3为闭合环状结构，在模塑过程中，通过所述台阶部3可以更好的预防所述模塑材料流入所述感光元件6的感光区内。
所述模塑体9至少覆盖部分所述台阶部3，且被覆盖的所述台阶部3远离所述感光区。
本发明涉及一种拼版，包括多个间隔设置的所述感光组件。采用拼版制造出来的感光组件一致性较高，而且节约成本。
当采用所述拼版制备所述感光组件时，当感光组件制造完毕后，通过切割的方式将所述拼版切割为多个所述感光组件。
如图9和图10所示，采用拼版制造所述感光组件时，所述拼板上设置多个间隔设置的所述感光组件，且所述感光组件在模塑处理时，所述模具包括上模具10和下模具12，其中所述上模具10和所述下模具12中的任何一个模具能够被操作，以使所述模具被进行合模和拔模操作。
在一个具体实施方式中，当所述模具被合模时，在所述模具的所述上模具10和所述下模具12之间能够形成至少一个成型空间11，其中在所述拼版 被放置于所述模具的所述上模具10和所述下模具12之间时，所述补偿部17位于所述成型空间11内。
当在所述上模具10和所述下模具12之间形成两个或者两个以上的所述成型空间11时，在所述上模具10和所述下模具12之间还可以形成至少一个连接通道16，以用于连通相邻所述成型空间11。
进一步地，所述上模具10包括一成型引导部14和至少一开窗成型部13，其中每个所述开窗成型部13一体地延伸于所述成型引导部14，以分别在每个所述开窗成型部13和所述成型引导部14之间形成一成型引导槽15，或者在相邻所述开窗成型部13之间形成所述成型引导槽15。当所述上模具10和所述下模具12被执行合模时，在每个所述成型引导槽15对应的位置分别形成每个所述成型空间11和在所述上模具10和所述下模具12之间形成每个所述连接通道16，以供连通相邻所述成型空间11。
如图3-图6所示，本发明涉及一种摄像模组，所述的感光组件和透光组件，所述透光元件设置于所述感光组件的感光路径上，外部光线透过所述透光组件到达所述感光元件6。
所述透光组件包括镜头组件和滤光组件，所述镜头组件包括镜头7和滤光组件包括滤光元件8依次位于所述感光元件6的感光路径上，即所述滤光元件8位于所述感光元件6的正上方，且所述镜头7位于所述滤光元件8的正上方。外部光线依次通过所述镜头7和所述滤光元件8到达所述感光元件6后进行成像。
在一个具体实施方式中，所述滤光组件包括镜座以及安装于所述镜座上的滤光元件。
在一个具体实施方式中，所述镜头组件包括镜头载体以及安装于所述镜头载体上的镜头。
在一个具体实施方式，所述镜头组件包括马达和镜头，所述镜头安装于所述马达内，所述马达驱动所述镜头移动或者倾斜，实现自动对焦或者光学防抖的功能。
所述镜座安装于所述模塑体9上，所述滤光元件安装于所述镜座的中心位置，且所述滤光元件与所述感光元件相对设置，所述镜头载体安装于所述镜座上，且所述镜头位于所述镜头载体内，所述镜头位于所述滤光元件的正上方。
在图3-图4中，所述模塑体9位于所述感光元件的边缘，且所述环绕通道1环绕所述感光元件6设置。
在图5中，所述感光元件6上设置有环绕所述感光区的台阶部3，所述模塑体9位于所述台阶部3远离所述感光区的一侧。所述环绕通道1环绕所述感光元件6设置。
在图6中，所述模塑体9位于所述感光元件6的边缘，且所述环绕通道1包覆所述感光元件6的侧面以及部分上表面。
本发明还涉及一种摄像模组的制备方法，包括以下步骤：
提供所述的感光组件和透光组件；
将所述透光组件安置与所述感光组件上。
所述透光元件设置于所述感光组件的感光路径上。
另外在本发明摄像模组的制备方法中，所述连通通道2的出口(即所述连接通道远离所述环绕通道1的一端)可以在最后一步使用封口材料封上，即当所述感光组件和透光组件安装好之后，使用所述封口材料将所述连接通道的出口封上，所述封口材料可以为胶水。
尽管以上结合附图对本发明的实施方案进行了描述，但本发明并不局限于上述的具体实施方案和应用领域，上述的具体实施方案仅仅是示意性的、指导性的，而不是限制性的。本领域的普通技术人员在本说明书的启示下和在不脱离本发明权利要求所保护的范围的情况下，还可以做出很多种的形式，这些均属于本发明保护之列。

Claims (42)

  1. 一种感光组件的制备方法，其特征在于，所述方法包括：
    将感光元件设置于基板上；
    在所述感光元件的全部或部分表面设置补偿部；
    在所述基板上对设置有所述补偿部的感光元件进行模塑处理；
    除去所述补偿部。
  2. 根据权利要求1所述的制备方法，其特征在于，所述模塑处理包括在所述补偿部外侧形成模塑体。
  3. 根据权利要求2所述的制备方法，其特征在于，所述补偿部至少部分被所述模塑体覆盖。
  4. 根据权利要求2所述的制备方法，其特征在于，所述补偿部至少部分与外界连通。
  5. 根据权利要求2所述的制备方法，其特征在于，所述补偿部为连续的整体。
  6. 根据权利要求2所述的制备方法，其特征在于，所述补偿部包括多个离散部，所述每个离散部均至少部分被所述模塑体覆盖。
  7. 根据权利要求2所述的制备方法，其特征在于，所述补偿部包括多个离散部，所述每个离散部均至少部分与外界连通。
  8. 根据权利要求1所述的制备方法，其特征在于，所述补偿部为固体或凝胶状。
  9. 根据权利要求1所述的制备方法，其特征在于，所述补偿部采用高温熔融材料，熔融温度为175～240℃，除去补偿部的步骤包括升高温度使所述补偿部熔融。
  10. 根据权利要求1所述的制备方法，其特征在于，所述补偿部采用高温气化材料，气化温度为175～240℃，除去补偿部的步骤包括升高温度使所述补偿部气化。
  11. 根据权利要求1所述的制备方法，其特征在于，所述补偿部采用溶于有机溶剂或水的材料，除去补偿部的步骤包括采用有机溶剂或水使所述补偿部溶解。
  12. 根据权利要求1-11中任一项所述的制备方法，其特征在于，设置于所述基板上的感光元件有两个或更多个，在除去所述补偿部之后，切割所述 基板形成多个感光组件。
  13. 根据权利要求1所述的制备方法，其特征在于，所述补偿部除去后，形成隔离通道，所述隔离通道包括环绕通道和连通通道，所述隔离通道环绕所述感光元件，所述连通通道是以所述环绕通道为起点向远离所述感光元件的方向延伸的通道，且所述环绕通道与所述连通通道贯通。
  14. 根据权利要求13所述的制备方法，其特征在于，当所述补偿部除去之后，将所述连通通道远离所述环绕通道的一端使用封口材料封上。
  15. 一种感光组件的制备方法，其特征在于，所述方法包括：
    将感光元件设置于基板上；
    在所述感光元件的全部或部分表面设置补偿部；
    在所述感光元件的上设置有台阶部；
    在所述基板上对设置有所述台阶部的感光元件进行模塑处理；
    除去所述补偿部。
  16. 根据权利要求15所述的制备方法，其特征在于，所述感光元件包括感光区和非感光区，所述非感光区位于所述感光区的边缘，且环绕所述感光区设置，所述台阶部位于所述非感光区，且所述台阶部环绕所述感光区设置。
  17. 根据权利要求15所述的制备方法，其特征在于，所述模塑处理包括在所述补偿部外侧形成模塑体。
  18. 根据权利要求17所述的制备方法，其特征在于，所述补偿部至少部分被所述模塑体覆盖。
  19. 根据权利要求17所述的制备方法，其特征在于，所述补偿部至少部分与外界连通。
  20. 根据权利要求17所述的制备方法，其特征在于，所述补偿部为连续的整体。
  21. 根据权利要求17所述的制备方法，其特征在于，所述补偿部包括多个离散部，所述每个离散部均至少部分被所述模塑体覆盖。
  22. 根据权利要求17所述的制备方法，其特征在于，所述补偿部包括多个离散部，所述每个离散部均至少部分与外界连通。
  23. 根据权利要求15所述的制备方法，其特征在于，所述补偿部为固体或凝胶状。
  24. 根据权利要求15所述的制备方法，其特征在于，所述补偿部采用高温熔融材料，熔融温度为175～240℃，除去补偿部的步骤包括升高温度使所述补偿部熔融。
  25. 根据权利要求15所述的制备方法，其特征在于，所述补偿部采用高温气化材料，气化温度为175～240℃，除去补偿部的步骤包括升高温度使所述补偿部气化。
  26. 根据权利要求15所述的制备方法，其特征在于，所述补偿部采用溶于有机溶剂或水的材料，除去补偿部的步骤包括采用有机溶剂或水使所述补偿部溶解。
  27. 根据权利要求15-26中任一项所述的制备方法，其特征在于，设置于所述基板上的感光元件有两个或更多个，在除去所述补偿部之后，切割所述基板形成多个感光组件。
  28. 根据权利要求15所述的制备方法，其特征在于，所述补偿部除去后，形成隔离通道，所述隔离通道包括环绕通道和连通通道，所述隔离通道环绕所述感光元件，所述连通通道是以所述环绕通道为起点向远离所述感光元件的方向延伸的通道，且所述环绕通道与所述连通通道贯通。
  29. 根据权利要求28所述的制备方法，其特征在于，当所述补偿部除去之后，将所述连通通道远离所述环绕通道的一端使用封口材料封上。
  30. 一种感光组件，其中，所述感光组件为权利要求1-29中任一项所述的制备方法所制备的感光组件。
  31. 一种感光组件，其特征在于，包括基板、感光元件以及一体结合于所述基板的模塑体，所述感光元件设置于所述基板上，所述模塑体至少覆盖部分所述感光元件的顶表面；
    在所述基板上沿且所述感光元件的边缘具有隔离通道，所述感光元件的边缘与所述模塑体包围形成所述隔离通道。
  32. 根据权利要求31所述的感光组件，其特征在于，所述隔离通道包括环绕通道和连通通道，所述环绕通道上设置有至少一个所述连通通道。
  33. 根据权利要求32所述的感光组件，其特征在于，所述环绕通道为环绕所述感光元件设置的闭合通道，所述连通通道是以所述环绕通道为起点向远离所述感光元件的方向延伸的通道，且所述环绕通道与所述连通通道贯通。
  34. 根据权利要求31-33中任一项所述的感光组件，其特征在于，所述感光元件包括感光区和非感光区，所述非感光区位于所述感光区的边缘，且环绕所述感光区设置，所述模塑体至少覆盖部分所述非感光区。
  35. 根据权利要求34所述的感光组件，其特征在于，所述环绕通道环绕所述非感光区的边缘。
  36. 根据权利要求35所述的感光组件，其特征在于，在所述基板上设置有电子元器件，且所述电子元器件位于所述环绕通道的外侧。
  37. 根据权利要求31所述的感光组件，其特征在于，在所述非感光区上表面设置有台阶部，所述台阶部环绕所述感光区设置，且所述台阶部高于所述感光元件设置。
  38. 根据权利要求37所述的感光组件，其特征在于，所述模塑体至少覆盖部分所述台阶部，且被覆盖的所述台阶部远离所述感光区。
  39. 一种拼版，其特征在于，包括多个间隔设置的权利要求31-38中任一项所述的感光组件。
  40. 一种摄像模组，其特征在于，包括权利要求31-38中任一项所述的感光组件和透光组件，所述透光元件设置于所述感光组件的感光路径上。
  41. 一种摄像模组的制备方法，其特征在于，包括以下步骤：
    提供权利要求31-38中任一项所述的感光组件和透光组件；
    将所述透光组件安置与所述感光组件上。
  42. 根据权利要求41所述的摄像模组的制备方法，其特征在于，所述透光元件设置于所述感光组件的感光路径上。
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