WO2021001001A1 - Dispositif de refroidissement - Google Patents

Dispositif de refroidissement Download PDF

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Publication number
WO2021001001A1
WO2021001001A1 PCT/DE2020/200045 DE2020200045W WO2021001001A1 WO 2021001001 A1 WO2021001001 A1 WO 2021001001A1 DE 2020200045 W DE2020200045 W DE 2020200045W WO 2021001001 A1 WO2021001001 A1 WO 2021001001A1
Authority
WO
WIPO (PCT)
Prior art keywords
cooling
capillary
medium
heat sink
housing
Prior art date
Application number
PCT/DE2020/200045
Other languages
German (de)
English (en)
Inventor
Andreas - c/o Conti Temic microelectronic GmbH HEISE
Original Assignee
Continental Automotive Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive Gmbh filed Critical Continental Automotive Gmbh
Priority to CN202080047913.2A priority Critical patent/CN114175235A/zh
Priority to EP20740517.6A priority patent/EP3994724A1/fr
Publication of WO2021001001A1 publication Critical patent/WO2021001001A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids

Definitions

  • the present invention relates to a cooling arrangement, a method for producing a cooling arrangement according to the invention and the use of paraffin oil, in particular white oil, and / or Vaseline as the basis for a capillary-filling medium for use in a cooling arrangement according to the invention or a method according to the invention.
  • Modern means of transport such as motor vehicles or motorcycles are increasingly being equipped with driver assistance systems that use sensor systems to detect the environment, recognize the traffic situation and support the driver, e.g. B. by braking or steering intervention or by the output of a visual or acoustic warning.
  • Ultrasonic sensors, camera sensors, surround view cameras, radar sensors, lidar sensors or the like are regularly used as sen sorsysteme for detecting the surroundings.
  • the sensor data determined by the sensors can then be used to draw conclusions about the environment, which can be used to implement assistance functions for driver support during parking and / or driving maneuvers.
  • the control of such sensors and the further processing of the sensor data generated is nowadays carried out by means of complex electronic control devices.
  • the dissipated heat of the electronic control unit can be through a thermally highly conductive housing, for. B. metal housing, the control unit can be brought to the outside.
  • a thermally highly conductive housing for. B. metal housing
  • the control unit can be brought to the outside.
  • On the surface or at least on z. B. one side of the housing is now at high loss performance Ver the challenge of dissipating the heat as well as possible so that the components in the Ge housing to protect from overheating.
  • z. B. an air cooler with cooling fins or a closed coolant circuit to the housing of the control unit to be closed.
  • the cooling circuit must be interrupted when installing and removing the device and has shorter maintenance intervals (topping up and refilling of coolant).
  • the production of a flow-through heat sink as a Ge housing part for. B. basic housing of a control unit very complex.
  • a design which consists of a housing area consisting of metal, at least in the area of the main cooling zones, to which a thermal paste (or thermal adhesive) or a thermal pad (or thermal foil or thermal mat) is preferably attached Heat sink is flanged on.
  • thermal pastes and pads can be made on the basis of so-called thermal interface materials (TIM).
  • TIM thermal interface materials
  • the heat conduction pad or the heat conduction paste are inserted between the heat sink and the housing as free of air bubbles as possible in order to achieve a good thermal bond.
  • TIM thermal interface materials
  • thermal pads are often z. B. one to several mm thick and usually have to be compressed to ensure a useful thermal conductivity. Furthermore, the thermal paste must be distributed very precisely over the surface in order not to create any air inclusions.
  • heat-conducting pads and also the heat-conducting pastes thin, as these generally have a much poorer thermal conductivity than metals (such as aluminum or copper).
  • metals such as aluminum or copper
  • thermal pastes or thermal pads are generally acceptable.
  • the heat sinks can also be designed to be elastic so that they “cling to” a housing.
  • thermochromic color components thermochromic color components and a matrix material.
  • the matrix material in which one or more thermally conductive fillers are embedded it can be, for example, oils, resins or fats, or pastes based on them with at least z.
  • thermally conductive filler for. B.
  • Powder with one or more of the following materials can be used: diamond, copper, aluminum, silver, zinc oxide, beryllium oxide, boron nitride, Al nitride, Si nitride, Al oxide.
  • the thermal paste is used to compensate for unavoidable unevenness of the contact surfaces involved in the power semiconductor module and the heat sink and, after a possible failure of the power semiconductor module, to determine whether its prescribed upper temperature limits have been observed. This is determined by the thermochromic color components, the color of which changes with the temperature of the thermal paste, continuously or suddenly at a certain transition temperature.
  • the object of the present invention is now to provide a cooling arrangement and Ver drive, with which a good heat transfer between the heat sink and housing is sufficient and the disadvantages resulting from the prior art are overcome in a simple and inexpensive manner.
  • the cooling arrangement comprises a heat sink with a cooling surface and a component to be cooled (e.g. a control unit, a component, a housing or the like) with a cooling surface, the cooling surface of the cooling body and the cooling surface of the component to be cooled being arranged next to one another .
  • a capillary-filling medium is provided which, in particular, automatically decays the capillary gap (e.g. by “creeping”).
  • Such a capillary-filling medium can particularly easily be processed or attached, applied or introduced during initial assembly and / or repair / maintenance, i.e. H. it is easy to apply.
  • unevenness in the surfaces of the cooling surfaces located between the heat sink and the housing or the gaps between the heat sink and the housing due to foreign particles can be compensated / filled so that a good heat transfer between the heat sink and the housing can be created.
  • such an arrangement requires very little space and is particularly cost-effective to implement and retrofit.
  • the fact that the cooling surfaces can be arranged against one another in a simple manner and without significant mechanical contact pressure, as is required in particular when using heat-conducting pads, reduces the risk of component damage to a particular degree.
  • the corrosion protection in the capillary gap can be significantly improved by the introduced medium and the associated air conclusion, z. This also applies, for example, to particles that cause corrosion due to the electrochemical voltage series (e.g. copper particles in aluminum housings / heat sinks), as the capillary filling makes the penetration of corrosive liquids, moisture, particles, air or substances particularly difficult or impossible.
  • particles that cause corrosion due to the electrochemical voltage series e.g. copper particles in aluminum housings / heat sinks
  • the capillary-filling medium is preferably arranged between the cooling surfaces (ie in the region of the capillary gap that occurs later), within a reservoir of the cooling body and / or within a reservoir of the component to be cooled during installation, installation, maintenance or manufacture.
  • a reservoir production-related cutouts or explicitly made recesses in the housing and / or heat sink can be provided.
  • the housing and / or heat sink can also have edge-side reservoir areas which, for. B. can be easily filled from the outside and such are arranged so that they contact the capillary gap that occurs later or are open to this or are fluidly connected to it.
  • a maintenance-free service life of the thermal connection can be created by providing one or more reservoirs, provided that the control unit and / or the heat sink is not dismantled, e.g. B. a service life that corresponds to or exceeds the vehicle service life.
  • a particularly definable operating temperature of the component to be cooled is provided, for. B. can be provided as a component to be cooled a control unit (z. B. Electronic Control Unit ECU or Automated Driving Control Unit ADCU of a vehicle) and the operating temperature, the lower, average or maximum permissible operating temperature of the control unit.
  • the capillary-filling medium can be designed in such a way that it fills the capillary gap at the specified operating temperature by having the most favorable properties for the capillary effect at this operating temperature.
  • the capillary-filling medium is liquid at operating temperature, i. H. it can also exist in a different physical state outside of the operating temperature.
  • the capillary-filling medium can be easily attached and removed like the at room temperature. This creates a long-lasting thermal connection, which z. B. can still be solved well even after years.
  • the capillary-filling medium is selected or modified in such a way that it always remains (significantly) below the boiling point of the medium at the maximum operating temperature of the control unit / aggregate and thus also of the heat sink.
  • a capillary-filling medium is understood to mean a medium which fills the capillary gap due to capillarity and / or a capillary effect. This takes place in that the respective medium is liquid at operating temperature and when it comes into contact with a capillary or the capillary gap due to the surface tension of the liquid itself and the interfacial tension between the liquid or medium and the solid surface of the capillary gap (ie the "vessel wall", such as e.g. B. the metal of the housing or the cooling body) fills the capillary gap or has a capillary effect.
  • the respective medium is liquid at operating temperature and when it comes into contact with a capillary or the capillary gap due to the surface tension of the liquid itself and the interfacial tension between the liquid or medium and the solid surface of the capillary gap (ie the "vessel wall", such as e.g. B. the metal of the housing or the cooling body) fills the capillary gap or has a capillary effect.
  • paraffin or paraffin oils such as. B. white oil
  • white oils up to medical quality can be used, the z. B. in the pharmaceutical or cosmetics industry use and can therefore meet very high demands on purity and compatibility.
  • Such medicinal white oils are often colorless, odorless and tasteless and are purified in such a way that they usually contain no further additives such as aromatics or sulfur compounds.
  • Generic white oils are characterized by their harmlessness for humans, so that they can also be used in the food industry.
  • vaseline or vaseline or similar substances can also be provided as the capillary-filling medium.
  • Vaseline is also characterized by very good human and environmental compatibility, so that the use according to the invention makes installation or the medium particularly easy.
  • the capillary-filling medium can expediently comprise corrosion-inhibiting substances (for example finely divided chromates) and / or substances which promote the displacement of liquids or water.
  • corrosion-inhibiting substances for example finely divided chromates
  • the corrosion protection can thereby be improved even further.
  • Paraffins or paraffin oils and Vaseline are already characterized by their water-repellent properties and therefore already offer good corrosion protection.
  • a pressure equalization channel can be provided which preferably has a larger dimension (e.g. larger diameter) than the capillary gap and is connected to this or is connected to a recess / recess connected to the capillary gap in order to undertake pressure equalization.
  • the connection security can be additionally increased and / or an escape of the medium during the filling phase or operation (e.g. at operating temperature) can be prevented / reduced by the pressure equalization channel suppressing / reducing suction processes and acting as a sink for excess medium .
  • the present invention also comprises a method for the manufacture of a cooling arrangement, in which a cooling surface of a cooling body and a cooling surface of a component to be cooled are arranged next to one another, with at least one (usually unavoidable) capillary gap between the cooling surfaces the cooling surfaces is formed.
  • the capillary-filling medium can be arranged between the cooling surfaces, within a reservoir of the cooling body and / or within a reservoir of the component to be cooled in order to reduce the capillary gap e.g. B. to be filled in the operating state (during operation of the component, e.g. at operating temperature).
  • the present invention claims the use of paraffin oil, in particular special white oil, and / or Vaseline as the basis for a capillary-filling medium, which is used in a generic cooling arrangement, in particular a cooling arrangement according to the invention or a method according to the invention.
  • FIG. 1 shows a simplified sectional illustration of a first embodiment of a cooling arrangement according to the invention in the dismantled state
  • FIG. 2 shows a simplified sectional illustration of an embodiment of a coolant cooling body of a cooling arrangement according to the invention
  • FIG. 3 shows a simplified sectional illustration of a further embodiment of a cooling arrangement according to the invention.
  • FIG. 4 shows a simplified representation of an embodiment of a housing as (part of a) component to be cooled of a cooling arrangement according to the invention, in plan view (below) and an associated sectional illustration (above) along the section line A-A of the housing.
  • Reference number 1 in Fig. 1 denotes a heat sink for air cooling with a plurality of cooling fins 2 and a flange surface or cooling surface 3 arranged opposite the cooling fins 2.
  • the heat sink 1 serves to cool a control unit 4 or its components by removing the heat sink 1 is arranged with the cooling surface 3 on a cooling surface 5 of a housing 6 of the control device 4, operating heat being given off to the environment.
  • the heat sink 1 can also be attached to the housing 6 (glued, genie tet, screwed, clamped or the like).
  • the control device 4 can include a housing cover 7 in order to get access to the interior of the housing 6 and thus to the electronic components in a simple manner.
  • a circuit carrier or a printed circuit board 8 As electronic components, for example, a circuit carrier or a printed circuit board 8, electronic components 9a, 9b that are thermally connected to the cooled outer surface (e.g., power electronics or the like), or electronic components 10 that are not connected to the cooled outer surface thermal are connected, be provided.
  • the method according to the invention is based on the components (heat sink 1 and housing 6) which are arranged over a large area against each other by introducing a well-creeping, capillary-filling medium (not shown in the figures for the sake of clarity), the medium being water-repellent and is designed in such a way that it fills the (unavoidable) gap, ie completely or largely displaces air in the air gap or capillary gap and thus compensates for unevenness.
  • a further embodiment of a heat sink is shown, wherein the heat sink 11 has a coolant cooling system with a plurality of cooling channels 12 through which a coolant can flow men.
  • the heat sink 11 can cool a control device 4 by arranging it with a flange surface or cooling surface 13 on the cooling surface 5 of the control device 4.
  • the heat sink 1 and the housing 6 are now brought together directly, as shown in Fig. 3, so no thermal pads or thermal paste are attached there between, there can be direct metallic contact at one or mostly more points.
  • the metal surfaces or cooling surfaces 3, 5 are spaced apart by a thousandth or hundredth, possibly a few tenths of a millimeter, as shown in the enlarged view in FIG. This creates a gap (Kapil larspalt 14) or several gaps, which is / are easily filled by the medium due to the capillary.
  • the capillary filling medium fills the capillary gap 14 completely or partially during operation (z. B. at operating temperature).
  • the medium can have much poorer thermal conductivity than conventional thermal pads or thermal pastes, since it is only a fraction of their thickness and can also be partially in direct metal contact between the cooling surfaces 3, 5.
  • cavities or recesses 15 must be provided in a housing part of the actually flat housing bottom to which the heat sink is attached in order to avoid material accumulations (e.g. in the case of aluminum die-cast housings) in an area, in which the inner bottom of the housing has to be partially lifted in order to be guided within the housing 6 close to a component to be cooled (e.g. housing aluminum parts which are to dissipate the heat internally).
  • material accumulations e.g. in the case of aluminum die-cast housings
  • a component to be cooled e.g. housing aluminum parts which are to dissipate the heat internally.
  • Such air inclusions would, if they are in the middle of the entire cooling surface, which is closed by the medium in the gap between the heat sink and housing, develop a blow-out or suction effect when expanding or contracting, ie when heating or cooling.
  • a Pressure equalization channel 16 may be provided, as shown in FIG. 4.
  • the pressure equalization channel 16 has a significantly thicker (capillary) gap than the capillary gap 14 between the housing 6 and the heat sink 1. This means that air or medium can be delivered or released with less resistance (ie pressure equalization is carried out to reduce the suction or discharge To reduce or prevent the blowing effect).
  • the capillary-filling medium can be applied or introduced in liquid or solid form, e.g. B. by spraying (aerosols, spray or the like), vapor deposition, dispensing or the application of liquid or pasty media (for example by means of a brush or a dab).
  • a solid medium at room / processing temperature can also be applied or introduced in order to prevent the control device from heating up (e.g. from the normal state at room temperature to the operating state of the control device at an operating temperature of, for example, 30 ° C, 40 ° C, 50 ° C or the like ) to melt and then to act capillary filling.
  • the medium is such that in the hottest (permissible) state of the control device 4 (use as well as standby or switched off), no or no significant evaporation of the medium takes place.
  • the recesses 15 or the pressure equalization channel 16 could be filled with the medium in normal operation and / or partially serve as a reservoir for the medium. It is provided that the recesses 15 and / or the pressure equalization channel 16 take up the medium from the capillary gap 14 in order to prevent the medium from leaking out or loosening or weakening the connection between the cooling surfaces 3, 5.
  • the capillary-filling medium is applied or introduced in a practical manner onto one or both contact surfaces of housing 6 and heat sink 1, i.e. H. in the area of the cooling surfaces 3, 5 or by introducing the liquid, pasty or solid medium at the processing temperature into a recess 15 on the housing 6 and / or heat sink 1, which preferably has access to the capillary gap 14.
  • a capillary filling medium for. B. paraffin oils or white oils or petroleum jelly can be provided, which can also be used in skin protection agents or medical products and therefore pose no risk to humans.
  • the use z. B. in the motor vehicle interior is not critical, so that even in the case of service, the medium applied is harmless to people and the environment.
  • the medium does not have to be used as a pure substance. Rather, substances can be admixed which are conducive to corrosion protection or, for example, to water displacement. Alternatively, waxes such as. B. candle waxes are used.
  • the medium should be far from the boiling point, so that no or only low evaporation takes place.
  • a change in the aggregate state of the medium from liquid to solid in the operating temperature range of the control device 4 is not critical if the flowability is restored at higher temperatures. Because the medium is or must be liquid at least in the warm or hot operating state of the control device 4 in order to permanently fill the capillary gap 4, additional reservoirs or reservoir areas 17a, 17b can or should be present, including larger ones Can absorb or release quantities of the medium.
  • the Re reservoir areas 17a, 17b can, for. B. be attached at points between the housing 6 and heat sink 1, where less cooling (less good heat transfer) is required and z. B.
  • the reservoir areas 17a, 17b provided at the edge or at the edge can be used to apply or introduce the capillary-filling medium in the region of the cooling surfaces 3, 5 (similar to the introduction by means of the recesses 15), with the medium penetrating into the capillary gap 14 preferably takes place when the control device 4 or the heat sink 1, 11 is heated during the production or test process.
  • the invention also expressly includes temperature-regulating (ie either cooling or warming) arrangements and methods in which instead of a cooling component (heat sink 1, 11) z. B. a heating component such. B. a heater is provided.
  • the invention also includes combinations of individual features and subclaims (secondary or sub-combinations) that are not expressly mentioned.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Dispositif de refroidissement, comprenant un dissipateur de chaleur (1, 11) comprenant une surface de refroidissement (3), un composant à refroidir comprenant une surface de refroidissement (5), la surface de refroidissement (3) du dissipateur de chaleur (1, 11) et la surface de refroidissement (5) du composant à refroidir étant disposée l'une contre l'autre, au moins une fente capillaire (14) étant formée entre les surfaces de refroidissement (3, 5) par la disposition des surfaces de refroidissement (3, 5), et un milieu de remplissage de capillaire étant prévu, lequel rempli la fente capillaire (14).
PCT/DE2020/200045 2019-07-02 2020-06-09 Dispositif de refroidissement WO2021001001A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202080047913.2A CN114175235A (zh) 2019-07-02 2020-06-09 冷却装置
EP20740517.6A EP3994724A1 (fr) 2019-07-02 2020-06-09 Dispositif de refroidissement

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102019209657.3 2019-07-02
DE102019209657.3A DE102019209657A1 (de) 2019-07-02 2019-07-02 Kühlanordnung

Publications (1)

Publication Number Publication Date
WO2021001001A1 true WO2021001001A1 (fr) 2021-01-07

Family

ID=71620112

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2020/200045 WO2021001001A1 (fr) 2019-07-02 2020-06-09 Dispositif de refroidissement

Country Status (4)

Country Link
EP (1) EP3994724A1 (fr)
CN (1) CN114175235A (fr)
DE (1) DE102019209657A1 (fr)
WO (1) WO2021001001A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112867359A (zh) * 2021-01-20 2021-05-28 北京空间机电研究所 一种氮化硅毛细芯矩形平板毛细泵

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* Cited by examiner, † Cited by third party
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DE102021209446A1 (de) * 2021-08-27 2023-03-02 Continental Automotive Technologies GmbH Kühlanordnung, Steuereinrichtung sowie Verfahren zur Herstellung einer Kühlanordnung

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US20030183909A1 (en) * 2002-03-27 2003-10-02 Chia-Pin Chiu Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device
US20060014323A1 (en) * 2004-07-02 2006-01-19 Hon Hai Precision Industry Co., Ltd. Thermal interface material with fluid
US20080017975A1 (en) * 2006-06-30 2008-01-24 Carl Deppisch Capillary underflow integral heat spreader
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Publication number Priority date Publication date Assignee Title
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Also Published As

Publication number Publication date
EP3994724A1 (fr) 2022-05-11
DE102019209657A1 (de) 2021-01-07
CN114175235A (zh) 2022-03-11

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