WO2021000913A1 - 一种高抗压均匀加热的csp荧光膜片模压装备及模压方法 - Google Patents

一种高抗压均匀加热的csp荧光膜片模压装备及模压方法 Download PDF

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WO2021000913A1
WO2021000913A1 PCT/CN2020/099924 CN2020099924W WO2021000913A1 WO 2021000913 A1 WO2021000913 A1 WO 2021000913A1 CN 2020099924 W CN2020099924 W CN 2020099924W WO 2021000913 A1 WO2021000913 A1 WO 2021000913A1
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mold
csp
pressing plate
fluorescent film
partition
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PCT/CN2020/099924
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English (en)
French (fr)
Inventor
李宗涛
丁鑫锐
赵启良
汤勇
杜学威
于佳栋
李家声
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华南理工大学
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/52—Heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5808—Measuring, controlling or regulating pressure or compressing force
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5816—Measuring, controlling or regulating temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Definitions

  • the invention relates to the technical field of LED packaging, in particular to a high-pressure-resistant and uniformly heated CSP fluorescent film molding equipment and molding method.
  • the package volume of LED devices is getting smaller and smaller, and the power density continues to increase.
  • Traditional packages are stuck in technical bottlenecks.
  • the CSP device eliminates the gold wire, the substrate is extremely small or even does not require a substrate, which greatly reduces the volume of the device while reducing the packaging cost by up to 20%.
  • the thermal resistance of the device is also reduced, the luminous density of the CSP is improved, and the CSP
  • the small, thin, and light characteristics greatly improve the flexibility of its design and application.
  • CSP packaging is not only widely used in the field of traditional lighting, but is especially favored by backlight products such as TVs, displays, and mobile phones. The market demand is showing rapid growth. .
  • CSP devices have the characteristics of multi-faceted light emission and small size, subtle differences in the concentration and thickness of the fluorescent coating will have a great impact on the uniformity of the light color spatial distribution of the device.
  • the current domestic traditional LED molding and plastic packaging equipment is low in automation, and manual operation will cause problems such as low production efficiency and poor product consistency, and the reliability and accuracy of the equipment cannot meet the production standards of CSP devices and cannot meet its production requirements.
  • the automatic molding and plastic packaging equipment used in large packaging companies needs to rely on imports, and the equipment is facing traditional LEDs, and has not been optimized for CSP, and cannot fully meet the production requirements of CSP.
  • the purpose of the present invention is to overcome the shortcomings of the above prior art, and provide a high pressure and uniform heating CSP fluorescent film molding equipment.
  • the present invention can solve the problem of poor pressure resistance, uneven heating, and manual operation of the pressure plate of the molding equipment. The long time consuming leads to the problem of premature melting of the diaphragm.
  • the present invention also provides a molding method for CSP fluorescent film molding equipment with high compression resistance and uniform heating;
  • a CSP fluorescent film molding equipment with high pressure resistance and uniform heating is installed on a molding machine for use, and includes an upper pressing plate, a lower pressing plate, a heating module, a mold positioning module, a partition, a CSP device substrate, a fluorescent film,
  • the upper mold and the lower mold, the upper pressing plate and the lower pressing plate are made of microcrystalline stone, the upper pressing plate and the lower pressing plate are respectively installed on the guide posts of the molding press, the heating module is installed on the upper pressing plate, and the lower pressing plate
  • the mold is mounted on the upper end of the lower platen through the mold positioning module, the partition is mounted on the lower mold, the fluorescent die is mounted in the groove of the partition, the CSP device substrate is placed on the partition, and the upper The mold is installed on the upper end of the lower mold.
  • the upper and lower pressing plates are made of crystallite formed by sintering and crystallization at high temperature similar to the formation conditions of granite, which have good compression resistance, bending resistance, abrasion resistance, and impact resistance. They are controlled by the feed device of the molding press The pressure plate moves on the guide post to achieve precise positioning or separation; when the mold is not closed, the upper pressure plate and the lower pressure plate are in a separated state.
  • the heating module is a heating coil
  • the heating coil is installed on the upper end of the upper pressing plate
  • the upper mold and the lower mold are both made of mold steel
  • the heating coil is energized with alternating current to generate a magnetic field whose direction changes continuously. Electromagnetic induction of the mold generates eddy current in the mold, so that the mold is uniformly heated.
  • the mold positioning module includes at least one set of mold positioning unit, the mold positioning unit is installed in the mounting groove of the lower platen, and the top end of the mold positioning unit is connected with the lower mold.
  • the mold positioning unit includes a spring and a metal boss, one end of the spring is fixed to the mounting groove, the other end of the spring is connected to the bottom of the metal boss, and the boss of the metal boss is connected to The positioning hole at the bottom of the lower mold is connected, and the protrusion is spherical, which is convenient for matching with the positioning hole at the bottom of the mold for positioning.
  • thermocouple for measuring temperature is fixed at the lower end of the metal boss to monitor the mold temperature in real time.
  • the metal boss is made of a metal material with a thermal conductivity greater than (230) W/(m ⁇ K).
  • the stiffness of the spring perpendicular to the molding direction is greater than 1000 N/cm, the stiffness along the molding direction is 10-25 N/cm, and the stiffness of the two directions varies from 0 to 5% when the temperature change range is less than 120°C. Ensure that the mold will not shake easily during work.
  • the partition is made of die steel.
  • the fluorescent film is installed in the groove of the partition, which can prevent the fluorescent film from melting and flowing prematurely and causing its consistency to deteriorate.
  • a molding method for CSP fluorescent film molding equipment with high pressure resistance and uniform heating including the following steps:
  • the lower platen is controlled to move upward by the mould press, and the heating coil is activated at the same time, electromagnetic induction occurs with the upper mold and the lower mold to generate heat to preheat the mold to 78-82°C and maintain it;
  • the lower platen continues to move upward under the control of the die press, so that the upper platen begins to squeeze the upper die, and the heating device continues to heat the die to raise the temperature to 118 ⁇ 122°C.
  • the pressure plate continues to pressurize the mold to 1000 ⁇ 2000pa, and keep the pressure and heat preservation of the mold for 2 ⁇ 3min;
  • the upper pressing plate and the lower pressing plate are controlled to separate by the molding press. After the upper mold is removed, the molded CSP chip is removed to complete the molding.
  • the present invention has the following advantages and beneficial effects:
  • the upper and lower pressing plates of the present invention are made of microcrystalline stones formed by sintering and crystallization at high temperatures similar to the formation conditions of granite, and have good compression resistance, bending resistance, abrasion resistance and impact resistance.
  • the present invention uses heating coil electromagnetic induction to heat the mold, and there is a thermocouple to detect the mold temperature in real time, so that the mold is heated more uniformly, and the yield of the molding process is improved.
  • the fluorescent diaphragm is limited by the mold steel partition, which can prevent the fluorescent diaphragm from melting and flowing prematurely and causing its consistency to deteriorate.
  • the mold is positioned by the mold positioning module, which can not only improve the molding accuracy, but also has simple assembly and can improve work efficiency.
  • Figure 1 is a schematic structural view of a CSP fluorescent film molding equipment with high pressure resistance and uniform heating according to the present invention
  • Figure 2 is a schematic diagram of the installation of the upper and lower molds of the present invention.
  • 1 is the lower pressing plate
  • 2 is the spring
  • 3 is the metal boss
  • 4 is the lower mold
  • 5 is the spacer
  • 6 is the fluorescent film
  • 7 is the CSP device substrate
  • 8 is the upper mold
  • 9 is the guide post
  • 10 It is the upper plate
  • 11 is the heating coil
  • 12 is the thermocouple.
  • a high-pressure-resistant and uniformly heated CSP fluorescent film molding equipment which is installed on a molding machine for use, includes an upper platen 10, a lower platen 1, a heating module, a mold positioning module, The partition 5, the CSP device substrate 7, the fluorescent film 6, the upper mold 8 and the lower mold 4, the upper pressing plate 10 and the lower pressing plate 1 are made of microcrystalline stone, and the upper pressing plate 10 and the lower pressing plate 1 are installed separately
  • the heating module is installed on the upper platen 10
  • the lower mold 4 is installed on the upper end of the lower platen 1 through the mold positioning module
  • the partition plate 5 is installed on the lower mold 4
  • the fluorescent mold The sheet 6 is installed in the groove of the partition board 5, the CSP device substrate 7 is placed on the partition board 5, the upper mold is installed at the upper end of the lower mold, and the lower mold 4 has positioning posts and an upper mold 8.
  • the positioning holes are matched to enable accurate mold clamping.
  • the upper and lower pressing plates are made of crystallite formed by sintering and crystallization at high temperature similar to the formation conditions of granite, which have good compression resistance, bending resistance, abrasion resistance, and impact resistance. They are controlled by the feed device of the molding press The pressure plate moves on the guide post to achieve precise positioning or separation; when the mold is not closed, the upper pressure plate and the lower pressure plate are in a separated state.
  • the heating module includes a heating coil 11, the heating coil 11 is installed on the upper end of the upper pressing plate 10, the upper mold 8 and the lower mold 4 are made of mold steel, the heating coil 11 is energized with alternating current to produce a continuous change of direction
  • the magnetic field generates electromagnetic induction with the mold to generate an eddy current in the mold, so that the mold is uniformly heated.
  • the mold positioning module includes two sets of mold positioning units, the mold positioning units are installed in the mounting grooves of the lower platen 1, and the top end of the mold positioning unit is connected with the lower mold 4.
  • the mold positioning unit includes a spring 2 and a metal boss 3.
  • One end of the spring 2 is fixed to the mounting groove, the other end of the spring 2 is connected to the bottom of the metal boss 3, and the boss of the metal boss 3
  • the raised portion is connected with the positioning hole at the bottom of the lower mold 4, and the protrusion is spherical, which is convenient for matching with the positioning hole at the bottom of the lower mold 4 for positioning.
  • thermocouple 12 for measuring temperature is glued on the lower end of the metal boss 3 through AB glue to monitor the mold temperature in real time.
  • the metal boss 3 is made of an aluminum alloy material with a thermal conductivity greater than 230 W/(m ⁇ K).
  • the stiffness of the spring 2 perpendicular to the molding direction is greater than 1000 N/cm, and the stiffness along the molding direction is 10-25 N/cm, and the stiffness of the two directions varies from 0 to 5% when the temperature change range is less than 120°C. Ensure that the mold will not shake easily during work.
  • the partition 5 is made of die steel.
  • the fluorescent film 6 is installed in the groove of the partition board 5, which can prevent the fluorescent film from melting and flowing prematurely and causing its consistency to deteriorate.
  • a molding method for CSP fluorescent film molding equipment with high compression resistance and uniform heating including the following steps:
  • the lower platen 1 is controlled to move upwards by the molding press, and the heating coil 11 is activated at the same time, and the upper mold 8 and the lower mold 4 are preheated to 78-82°C and maintained by electromagnetic induction;
  • thermocouple 12 After the mold reaches the preheating temperature measured by thermocouple 12, the mold press controls the lower platen 1 to continue to move upwards, so that the upper platen 10 starts to press the upper mold 8, and the heating device continues to heat the mold to 118-122°C.
  • the thermocouple 12 performs real-time detection of the mold temperature, and the upper pressing plate 10 continues to pressurize the mold to 1000-2000pa, and keep the mold temperature and pressure for 2 to 3 minutes;
  • the upper pressing plate 10 and the lower pressing plate 1 are controlled to separate by a molding press. After the upper mold 8 is removed, the molded CSP chip is removed to complete the molding.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

一种高抗压均匀加热的CSP荧光膜片模压装备，所述模压装备安装在模压机上使用，包括上压板、下压板、加热模块、模具定位模块、隔板、CSP器件基板、荧光膜片、上模具和下模具，所述上压板和下压板均采用微晶石支撑，所述上压板和下压板分别安装于模压机的导柱上，所述加热模块安装于上压板，所述下模具通过模具定位模块安装于下压板上端，所述隔板安装于下模具，所述荧光模片安装于隔板的凹槽内，所述CSP器件基板放置于所述隔板上面，所述上模具安装于所述下模具上端。上、下压板由使用与花岗岩形成条件类似的高温下烧结晶化形成微晶石制成，具有较好的抗压、抗弯、耐磨、耐冲击性。

Description

一种高抗压均匀加热的CSP荧光膜片模压装备及模压方法 技术领域
本发明涉及LED封装技术领域，尤其涉及一种高抗压均匀加热的CSP荧光膜片模压装备及模压方法。
背景技术
随着LED技术发展与成本压缩，LED器件的封装体积越来越小，功率密度不断提高，传统封装受困于技术瓶颈。由于CSP器件免去了金线，基板极小甚至不需要基板，从而极大减小器件体积的同时降低封装成本高达20％，此外器件热阻也有所降低，CSP的发光密度得到提高，且CSP小、薄、轻的特点使得其设计应用的灵活性大大提高，目前CSP封装不但在传统照明领域得到广泛应用，尤其受到电视、显示屏和手机等背光源产品的青睐，市场需求正出现快速增长。
由于CSP器件具有多面发光、体积微小的特点，荧光涂层浓度、厚度的细微差异就会对器件光色空间分布的一致性造成很大的影响。而目前国内传统LED的模压塑封设备自动化程度较低，而且人工操作会造成生产效率低下、产品一致性较差等问题，而且设备可靠性及精度无法达到CSP器件的生产标准，无法满足其生产要求。而大型封装企业中使用的自动模压塑封设备需要依赖进口，并且设备是面对传统LED的，没有针对CSP进行相应的优化，不能完全满足CSP的生产要求。
发明内容
本发明的目的是为了克服以上现有技术存在的不足，提供了一种高抗压均匀加热的CSP荧光膜片模压装备，本发明可以解决模压设备压板抗压性能差、加热不均匀、人工操作时间耗费较长导致膜片提前融化的问题。
同时本发明还提供了一种高抗压均匀加热的CSP荧光膜片模压装备的模压方法；
本发明的目的可以通过如下技术方案实现：
一种高抗压均匀加热的CSP荧光膜片模压装备，所述模压装备安装在模压机上使用，包括上压板、下压板、加热模块、模具定位模块、隔板、 CSP器件基板、荧光膜片、上模具和下模具，所述上压板和下压板均采用微晶石制成，所述上压板和下压板分别安装于模压机的导柱上，所述加热模块安装于上压板，所述下模具通过模具定位模块安装于下压板上端，所述隔板安装于下模具，所述荧光模片安装于隔板的凹槽内，所述CSP器件基板放置于所述隔板上面，所述上模具安装于所述下模具上端。上、下压板由使用与花岗岩形成条件类似的高温下烧结晶化形成微晶石制成，具有较好的抗压、抗弯、耐磨、耐冲击性，通过模压机的进给装置控制下压板在导柱上运动并实现精准定位或分离；未合模时，上压板和下压板处于分离状态。
优选的，所述加热模块为加热线圈，所述加热线圈安装于所述上压板上端，所述上模具和下模具均采用模具钢制成，加热线圈通交流电，产生方向不断改变的磁场，与模具发生电磁感应而在模具内产生涡流电流，使模具内均匀加热。
优选的，所述模具定位模块包括至少1组模具定位单元，所述模具定位单元安装于所述下压板的安装槽，所述模具定位单元的顶端与所述下模具连接。
优选的，所述模具定位单元包括弹簧和金属凸台，所述弹簧的一端固定于所述安装槽，所述弹簧的另一端与金属凸台底部连接，所述金属凸台的凸起部与所述下模具底部的定位孔连接，所述凸起部为球状，便于与模具底部的定位孔相配合进行定位。
优选的，所述金属凸台下端固定有测量温度的热电偶，对模具温度进行实时监测。
优选的，所述金属凸台由热导系数大于(230)W/(m·K)的金属材料制成。
优选的，所述弹簧垂直于模压方向的刚度大于1000N/cm，沿模压方向刚度为10～25N/cm，两个方向的刚度在温度变化范围小于120℃时的变化值为0～5％。保证模具在工作时不会轻易晃动。
优选的，所述隔板由模具钢制成。所述荧光模片安装于隔板的凹槽内，可以避免荧光膜片过早融化流动而造成其一致性变差。
一种高抗压均匀加热的CSP荧光膜片模压装备的模压方法，包括以 下步骤：
1)将上压板和下压板分别安装于模压机的导柱上；
2)使下模具底部的定位孔对准金属凸台的凸起部，将下模具安装于下隔板上；
3)将荧光膜片安装于隔板的凹槽内，将CSP器件基板倒置与隔板上，使CSP器件基板中CSP芯片一侧与荧光膜片接触。
4)通过模压机控制下压板向上运动，同时启动加热线圈，与所述上模具和下模具发生电磁感应产生热量给模具预热至78～82℃并维持；
5)通过热电偶测量出模具到达预热温度后，模压机控制下压板继续向上运动，使上压板开始挤压上模具，加热装置继续加热使模具升温至118～122℃，热电偶对模具温度进行实时检测，压板继续对模具加压至1000～2000pa，并对模具保温保压2～3min；
6)通过模压机控制上压板和下压板分离，取走上模具后，取下模压好的CSP芯片，完成模压。
本发明与现有技术相比，具有如下优点和有益效果：
1、本发明的上、下压板使用与花岗岩形成条件类似的高温下烧结晶化形成的微晶石制成，具有较好的抗压、抗弯、耐磨、耐冲击性。
2、本发明使用加热线圈电磁感应对模具进行加热，并且有热电偶对模具温度进行实时检测，使模具加热更加均匀，提高模压工艺的良品率。
3、本发明通过模具钢隔板对荧光膜片进行限位，可以避免荧光膜片过早融化流动而造成其一致性变差。
4、本发明通过模具定位模块对模具进行定位，不仅可以提高模压精度，而且装配简单，可以提高工作效率。
附图说明
图1是本发明的一种高抗压均匀加热的CSP荧光膜片模压装备的结构示意图；
图2是本发明上、下模具的安装示意图；
其中，1为下压板，2为弹簧，3为金属凸台，4为下模具，5为隔板，6为荧光膜片，7为CSP器件基板，8为上模具，9为导柱，10为上压板，11为加热线圈，12为热电偶。
具体实施方式
下面结合实施例及附图对本发明作进一步详细的描述，但本发明的实施方式不限于此。
如图1、图2所示，一种高抗压均匀加热的CSP荧光膜片模压装备，所述模压装备安装在模压机上使用，包括上压板10、下压板1、加热模块、模具定位模块、隔板5、CSP器件基板7、荧光膜片6、上模具8和下模具4，所述上压板10和下压板1均采用微晶石制成，所述上压板10和下压板1分别安装于模压机的导柱9上，所述加热模块安装于上压板10，所述下模具4通过模具定位模块安装于下压板1上端，所述隔板5安装于下模具4，所述荧光模片6安装于隔板5的凹槽内，所述CSP器件基板7放置于所述隔板5上面，所述上模具安装于所述下模具上端，下模具4有定位柱与上模具8的定位孔相配合，使模具能进行准确合模。上、下压板由使用与花岗岩形成条件类似的高温下烧结晶化形成微晶石制成，具有较好的抗压、抗弯、耐磨、耐冲击性，通过模压机的进给装置控制下压板在导柱上运动并实现精准定位或分离；未合模时，上压板和下压板处于分离状态。
所述加热模块包括加热线圈11，所述加热线圈11安装于所述上压板10上端，所述上模具8和下模具4均采用模具钢制成，加热线圈11通交流电，产生方向不断改变的磁场，与模具发生电磁感应而在模具内产生涡流电流，使模具内均匀加热。
所述模具定位模块包括2组模具定位单元，所述模具定位单元安装于所述下压板1的安装槽内，所述模具定位单元的顶端与所述下模具4连接。
所述模具定位单元包括弹簧2和金属凸台3，所述弹簧2的一端固定于所述安装槽，所述弹簧2的另一端与金属凸台3底部连接，所述金属凸台3的凸起部与所述下模具4底部的定位孔连接，所述凸起部为球状，便于与下模具4底部的定位孔相配合进行定位。
所述金属凸台3下端通过AB胶粘上测量温度的热电偶12，对模具温度进行实时监测。
所述金属凸台3由热导系数大于230W/(m·K)的铝合金材料制成。
所述弹簧2垂直于模压方向的刚度大于1000N/cm，沿模压方向刚度 为10～25N/cm，两个方向的刚度在温度变化范围小于120℃时的变化值为0～5％。保证模具在工作时不会轻易晃动。
所述隔板5由模具钢制成。所述荧光模片6安装于隔板5的凹槽内，可以避免荧光膜片过早融化流动而造成其一致性变差。
一种高抗压均匀加热的CSP荧光膜片模压装备的模压方法，包括以下步骤：
1)将上压板10和下压板1分别安装于模压机的导柱6上；
2)使下模具4底部的定位孔对准金属凸台3的凸起部，将下模具4安装于下隔板上；
3)将荧光膜片6安装于隔板5的凹槽内，将CSP器件基板7倒置于隔板上，使CSP器件基板7中CSP芯片一侧与荧光膜片6接触。
4)通过模压机控制下压板1向上运动，同时启动加热线圈11，与所述上模具8和下模具4发生电磁感应预热至78～82℃并维持；
5)通过热电偶测12量出模具到达预热温度后，模压机控制下压板1继续向上运动，使上压板10开始挤压上模具8，加热装置继续加热使模具升温至118～122℃，热电偶12对模具温度进行实时检测，上压板10继续对模具加压至1000～2000pa，并对模具保温保压2～3min；
6)通过模压机控制上压板10和下压板1分离，取走上模具8后，取下模压好的CSP芯片，完成模压。
上述具体实施方式为本发明的优选实施例，并不能对本发明进行限定，其他的任何未背离本发明的技术方案而所做的改变或其它等效的置换方式，都包含在本发明的保护范围之内。

Claims (9)

  1. 一种高抗压均匀加热的CSP荧光膜片模压装备，所述模压装备安装在模压机上使用，其特征在于，包括上压板、下压板、加热模块、模具定位模块、隔板、CSP器件基板、荧光膜片、上模具和下模具，所述上压板和下压板均采用微晶石制成，所述上压板和下压板分别安装于模压机的导柱上，所述加热模块安装于上压板，所述下模具通过模具定位模块安装于下压板上端，所述隔板安装于下模具，所述荧光模片安装于隔板，所述CSP器件基板放置于所述隔板上面，所述上模具安装于所述下模具上端。
  2. 根据权利要求1所述的一种高抗压均匀加热的CSP荧光膜片模压装备，其特征在于，所述加热模块包括加热线圈，所述加热线圈安装于所述上压板上端，所述上模具和下模具均采用模具钢制成，所述加热线圈产生方向不断改变的磁场，磁场与所述上模具和下模具发生电磁感应产生热量。
  3. 根据权利要求1所述的一种高抗压均匀加热的CSP荧光膜片模压装备，其特征在于，所述模具定位模块包括至少1组模具定位单元，所述模具定位单元安装于所述下压板的安装槽，所述模具定位单元的顶端与所述下模具连接。
  4. 根据权利要求3所述的一种高抗压均匀加热的CSP荧光膜片模压装备，其特征在于，所述模具定位单元包括弹簧和金属凸台，所述弹簧的一端固定于所述安装槽，所述弹簧的另一端与金属凸台底部连接，所述金属凸台的凸起部与所述下模具底部的定位孔连接。
  5. 根据权利要求4所述的一种高抗压均匀加热的CSP荧光膜片模压装备，其特征在于，所述金属凸台下端固定有测量温度的热电偶。
  6. 根据权利要求4所述的一种高抗压均匀加热的CSP荧光膜片模压装备，其特征在于，所述金属凸台由热导系数大于230W/(m·K)的金属材料制成。
  7. 根据权利要求4所述的一种高抗压均匀加热的CSP荧光膜片模压装备，其特征在于，所述弹簧垂直于模压方向的刚度大于1000N/cm，沿模压方向刚度为10～25N/cm，两个方向的刚度在温度变化范围小于120℃ 时的变化值为0～5％。
  8. 根据权利要1所述的一种高抗压均匀加热的CSP荧光膜片模压装备，其特征在于，所述隔板由模具钢制成，所述荧光模片安装于隔板的凹槽内。
  9. 一种高抗压均匀加热的CSP荧光膜片模压装备的模压方法，其特征在于，包括以下步骤：
    1)将上压板和下压板分别安装于模压机的导柱上；
    2)使下模具底部的定位孔对准金属凸台的凸起部，将下模具安装于下隔板上；
    3)将荧光膜片安装于隔板的凹槽内，将CSP器件基板倒置与隔板上，使CSP器件基板中CSP芯片一侧与荧光膜片接触。
    4)通过模压机控制下压板向上运动，同时启动加热线圈，与所述上模具和下模具发生电磁感应产生热量给模具预热至78～82℃并维持；
    5)通过热电偶测量出模具到达预热温度后，模压机控制下压板继续向上运动，使上压板开始挤压上模具，加热装置继续加热使模具升温至118～122℃，热电偶对模具温度进行实时检测，压板继续对模具加压至1000～2000pa，并对模具保温保压2～3min；
    6)通过模压机控制上压板和下压板分离，取走上模具后，取下模压好的CSP芯片，完成模压。
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016051731A (ja) * 2014-08-28 2016-04-11 日亜化学工業株式会社 発光装置の製造方法
CN106449513A (zh) * 2016-11-11 2017-02-22 华南理工大学 一种防过热csp荧光膜片模压装置及方法
CN206312933U (zh) * 2016-12-19 2017-07-07 佛山市多谱光电科技有限公司 一种csp荧光膜片模压塑封机
CN110246950A (zh) * 2019-07-03 2019-09-17 华南理工大学 一种高抗压均匀加热的csp荧光膜片模压装备及模压方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
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JPH05251488A (ja) * 1992-03-09 1993-09-28 Mitsubishi Electric Corp 半導体装置の樹脂封止方法および樹脂封止装置
JPH06155510A (ja) * 1992-11-26 1994-06-03 Toshiba Corp 樹脂封止装置
JP5608523B2 (ja) * 2010-11-26 2014-10-15 アピックヤマダ株式会社 樹脂封止装置
CN204955387U (zh) * 2015-09-28 2016-01-13 深圳市锦兆天电子科技有限公司 一种薄膜材料热压成型加工系统
CN107123724B (zh) * 2017-03-29 2023-05-23 华南理工大学 一种电控变曲面荧光膜片模压方法及装置
CN210092118U (zh) * 2019-07-03 2020-02-18 华南理工大学 一种高抗压均匀加热的csp荧光膜片模压装备

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016051731A (ja) * 2014-08-28 2016-04-11 日亜化学工業株式会社 発光装置の製造方法
CN106449513A (zh) * 2016-11-11 2017-02-22 华南理工大学 一种防过热csp荧光膜片模压装置及方法
CN206312933U (zh) * 2016-12-19 2017-07-07 佛山市多谱光电科技有限公司 一种csp荧光膜片模压塑封机
CN110246950A (zh) * 2019-07-03 2019-09-17 华南理工大学 一种高抗压均匀加热的csp荧光膜片模压装备及模压方法

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